Light emitting assembly and electronic device

Abstract

The application provides a light-emitting assembly and an electronic device, and relates to the technical field of terminals, wherein the light-emitting assembly can comprise a light-emitting module and a driving chip; the light-emitting module can comprise a flash lamp and an infrared lamp; the driving chip can comprise a first output end and a second output end; the first output end is electrically connected with a first pole of the flash lamp and is used for outputting a flash lamp driving signal to the flash lamp; the second output end is electrically connected with a first pole of the infrared lamp and is used for outputting an infrared lamp driving signal to the infrared lamp; the first pole of the flash lamp has the same polarity as the first pole of the infrared lamp. The technical scheme provided by the application can save device space and reduce cost.

Description

Technical Field

[0001] This application relates to the field of terminal technology, and in particular to a light-emitting component and an electronic device. Background Technology

[0002] To better meet user needs, most portable electronic devices, such as mobile phones, are equipped with infrared lights to support infrared (IR) remote control functions. For example, users can use their mobile phones' infrared remote control function to control air conditioners, televisions, and other devices.

[0003] Current infrared solutions typically involve placing infrared lights in the decoration (DECO) area where the camera is located, while simultaneously placing infrared light driver chips on the circuit board, and connecting the infrared lights and infrared light driver chips via a flexible printed circuit (FPC).

[0004] However, this solution requires a significant amount of space in the entire machine and is relatively expensive. Utility Model Content

[0005] This application provides a light-emitting component and an electronic device for saving device space and reducing costs.

[0006] In a first aspect, a light-emitting component is provided, which can be applied to an electronic device. The light-emitting component may include: a light-emitting module and a driver chip; wherein, the light-emitting module may include a flash lamp and an infrared lamp; the driver chip may include a first output terminal and a second output terminal; the first output terminal is electrically connected to a first electrode of the flash lamp and is used to output a flash lamp driving signal to the flash lamp; the second output terminal is electrically connected to a first electrode of the infrared lamp and is used to output an infrared lamp driving signal to the infrared lamp; the first electrode of the flash lamp and the first electrode of the infrared lamp have the same polarity.

[0007] In the above solution, the driver chips for the flash and infrared lamp are integrated, and both are driven by the same driver chip. This reduces the number of driver chips and the number of FPCs required, thus saving equipment space and reducing costs. In addition, the flash and infrared lamp use the same polarity driving method, which reduces the circuit complexity of the driver chip, thereby further reducing costs.

[0008] In one possible implementation of the first aspect, the first electrode is the anode, and the cathodes of the flash lamp and infrared lamp are grounded.

[0009] Based on the above solution, static electricity from the flash and infrared lamps can be directly discharged to the ground through the cathode, thereby reducing the impact of static electricity on the light-emitting components and improving the stability of the light-emitting components.

[0010] In one possible implementation of the first aspect, the light-emitting module is a packaged module integrating a flash lamp and an infrared lamp.

[0011] Based on the above solution, equipment space can be further saved and costs reduced.

[0012] In one possible implementation of the first aspect, a Zener diode is also integrated into the package module, which is connected in parallel with the flash lamp and the infrared lamp, respectively.

[0013] In the above scheme, by setting a Zener diode, voltage stabilization and overvoltage protection can be achieved, thereby improving the safety of the flash and infrared lamp operation.

[0014] In one possible implementation of the first aspect, the flash, infrared lamp, and Zener diode are all diode chips.

[0015] Based on the above solutions, integration can be improved and the lifespan of devices can be extended.

[0016] In one possible implementation of the first aspect, the back of the packaging module is provided with multiple pads, the anode and cathode of the flash lamp are respectively connected to the multiple pads, and the anode and cathode of the infrared lamp are respectively connected to one pad.

[0017] Based on the above solution, the heat dissipation and current flow capacity of the flash lamp can be improved during operation.

[0018] In one possible implementation of the first aspect, the light-emitting module includes a plurality of flash lamps, and the driver chip includes a plurality of first output terminals, with each flash lamp correspondingly connected to a first output terminal.

[0019] Based on the above solution, integration can be further improved, equipment space can be saved, and costs can be reduced.

[0020] In one possible implementation of the first aspect, the light-emitting component further includes: a flash control module and an infrared control module; wherein the flash control module is electrically connected to the driver chip and is used to output a flash control signal to the driver chip; the infrared control module is electrically connected to the driver chip and is used to output an infrared control signal to the driver chip; the driver chip is used to output a flash drive signal through a first output terminal according to the flash control signal, and to output an infrared drive signal through a second output terminal according to the infrared control signal.

[0021] In one possible implementation of the first aspect, the light-emitting module emits light towards the back of the electronic device.

[0022] Based on the above solution, when the user is facing the screen of the electronic device, the light emitted by the light-emitting module can be directly aimed at the object being illuminated or the remotely controlled device. In this way, the user can operate the device while facing the screen, making the operation more convenient and improving the user experience.

[0023] In a second aspect, an electronic device is provided, comprising: a light-emitting component as described in the first aspect or any embodiment thereof.

[0024] It is understandable that the beneficial effects of the second aspect can be found in the relevant descriptions in the first aspect above, and will not be repeated here. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of a common layout for flashlights and infrared lights.

[0026] Figure 2 A schematic diagram illustrating the layout of light-emitting components in an electronic device provided in this application embodiment;

[0027] Figure 3 This is a schematic diagram of a light-emitting component provided in an embodiment of this application;

[0028] Figure 4 A schematic diagram of the component layout of the light-emitting module provided in an embodiment of this application;

[0029] Figure 5 This is a schematic diagram of the packaging module provided in an embodiment of this application;

[0030] Figure 6 This is another schematic diagram of the packaging module provided in the embodiments of this application;

[0031] Figure 7 This is another structural schematic diagram of the light-emitting component provided in an embodiment of this application.

[0032] Explanation of reference numerals in the attached figures:

[0033] 1-Light-emitting component; 2-Camera;

[0034] 10-Light-emitting module;

[0035] 101 - Flash unit; 102 - Infrared light;

[0036] 103 - Pad;

[0037] 20 - Driver chip; 30 - Flash control module;

[0038] 40 - Infrared lamp control module. Detailed Implementation

[0039] The embodiments of this application are described below with reference to the accompanying drawings. The terminology used in the implementation section of this application is only for explaining specific embodiments and is not intended to limit the application. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments.

[0040] Portable electronic devices, such as mobile phones, are usually equipped with a flash to assist the camera in capturing images or to perform other functions such as a flashlight. In addition, to better meet user needs, most mobile phones also have infrared lights to support functions such as infrared remote control.

[0041] See Figure 1 This is a schematic diagram of a common layout for flashlights and infrared lights, such as... Figure 1 As shown, the flash and infrared LED are respectively located in the DECO area on the back of the phone. The flash uses an anode drive method and is connected to the flash anode drive chip on the phone's motherboard via an FPC. The infrared LED uses a cathode drive method and is connected to the infrared LED cathode drive chip on the phone's motherboard via an FPC.

[0042] In this layout, the flash driver chip and the infrared driver chip are set up independently. The flash and the infrared lamp are each connected to the corresponding driver chip through an FPC. On the one hand, this requires more space, and on the other hand, it requires more components, resulting in higher costs.

[0043] In addition to accommodating flash and infrared lights, the DECO area typically also needs to house laser lights, flicker sensors, and multiple cameras, making space extremely limited. Infrared lights and flashes, placed independently within the DECO area, require a significant amount of space.

[0044] Based on this, embodiments of this application provide a light-emitting component that saves device space and reduces costs through integrated design.

[0045] The light-emitting component provided in this application can be applied to portable electronic devices such as mobile phones and tablets. For ease of explanation, the technical solution of this application will be illustrated below using a mobile phone as an example.

[0046] Figure 2 This is a schematic diagram of the layout of the light-emitting components in the electronic device provided in the embodiments of this application, such as... Figure 2 As shown, the electronic device may include: a light-emitting component 1 and a camera 2.

[0047] It is understood that electronic devices may also include other components, such as a motherboard, and various other components mounted on the motherboard, including a processor, memory, camera 2, speaker, receiver, microphone, indicator, and sensor. This application does not impose any particular limitation on the specific structure of the electronic device.

[0048] Camera 2 is used to capture still images or videos, and it can be positioned in the DECO area on the back of the electronic device. It is understood that the DECO area can be as follows: Figure 3 As shown, the DECO area is located near the left side of the electronic device, but it can also be located in other positions, such as the middle of the upper half of the back of the electronic device. This application embodiment does not specifically limit the location of the DECO area.

[0049] In some implementations, the electronic device may include one or more cameras 2.

[0050] Figure 3 This is a schematic diagram of the structure of the light-emitting component provided in the embodiments of this application, such as... Figure 2 and Figure 3 As shown, in this embodiment, the light-emitting component 1 may include a light-emitting module 10 and a driver chip 20. The light-emitting module 10 may include a flash lamp 101 and an infrared lamp 102. The driver chip 20 may include a first output terminal D1 and a second output terminal D2. The first output terminal D1 is electrically connected to the first pole of the flash lamp 101 and is used to output a flash lamp driving signal to the flash lamp 101. The second output terminal D2 is electrically connected to the first pole of the infrared lamp 102 and is used to output an infrared lamp driving signal to the infrared lamp 102. The first pole of the flash lamp 101 and the first pole of the infrared lamp 102 have the same polarity, that is, the flash lamp 101 and the infrared lamp 102 adopt the same polarity driving method.

[0051] The light-emitting module 10 can be arranged in the DECO area on the back of the electronic device, and it can be located on either side of the camera 2.

[0052] In the light-emitting module 10, the flash 101 can emit visible light. In some examples, the flash 101 can be used in conjunction with the camera 2. For example, when the electronic device is in a low-light environment, the flash 101 can be turned on to provide illumination for the camera 2, thereby improving the quality of the image captured by the camera 2. In other examples, the flash 101 can also be used to support other functions of the electronic device, such as a flashlight function.

[0053] Infrared lamp 102 emits infrared light. In some examples, infrared lamp 102 can be used to realize infrared remote control function, enabling electronic devices to control devices such as televisions and air conditioners via infrared remote control. In other examples, infrared lamp 102 can also be used to realize other functions, such as infrared ranging function.

[0054] The light-emitting module 10 has a light-emitting direction that the flash lamp 101 and infrared lamp 102 can face the back of the electronic device. In this way, when the user is facing the screen of the electronic device, the light-emitting module 10 can directly aim at the object being illuminated or the remotely controlled device. The user can then operate the device while facing the screen, making the operation more convenient and improving the user experience.

[0055] The light-emitting module 10 can be connected to the driver chip 20 via an FPC. That is, one end of the FPC can be connected to the first output terminal D1 and the second output terminal D2 of the driver chip 20, respectively, and the other end can be connected to the flash lamp 101 and the infrared lamp 102 in the light-emitting module 10, respectively.

[0056] In some embodiments, the flash lamp 101 and the infrared lamp 102 in the light-emitting module 10 are both independent packaged structures, and the two can be set close together to facilitate circuit connection.

[0057] In other embodiments, the light-emitting module 10 can be a packaged module integrating a flash lamp 101 and an infrared lamp 102, that is, the flash lamp 101 and the infrared lamp 102 are integrated in a single packaged structure. This can save space more effectively.

[0058] Both the flash lamp 101 and the infrared lamp 102 can be light-emitting diode (LED) chips to improve integration and extend service life.

[0059] Figure 4 This is a schematic diagram of the component layout of the light-emitting module provided in the embodiments of this application, as shown below. Figure 4 As shown, the packaged module corresponding to the light-emitting module 10 may include: a flash chip (i.e., the LED chip corresponding to the flash 101) and an IR chip (i.e., the LED chip corresponding to the infrared lamp 102).

[0060] The positional relationship between the flash chip and the IR chip can be set as needed. Here, for example, the IR chip is located to the right of the flash chip.

[0061] To improve safety, in some embodiments, a Zener diode can also be integrated into the package module. The Zener diode is connected in parallel with the flash lamp 101 and the infrared lamp 102 to play a role in voltage regulation and overvoltage protection, thereby improving the safety of the operation of the flash lamp 101 and the infrared lamp 102.

[0062] Zener diodes can also be used in chip form to improve integration. For example... Figure 4 As shown, the packaging module may also include a Zener chip (i.e., a Zener diode chip).

[0063] The positional relationship of the Zener chip, flash chip, and IR chip can be set according to the chip size to better save space. For example, here both the IR chip and the Zener chip are located to the right of the flash chip, with the Zener chip below the IR chip.

[0064] Figure 5 (a) in the middle is Figure 4 A rear view diagram of a mid-mounted module. Figure 5 (b) in the diagram is an equivalent circuit diagram of the packaged module. For example... Figure 5 As shown, the back of the package module may include multiple pads 103. The anode FL+ and cathode FL- of the flash chip (i.e., flash 101) and the anode IR+ and cathode IR- of the infrared chip (i.e., infrared lamp 102) can be connected to the pads 103 respectively, and then connected to the FPC through the pads 103, and then connected to the driver chip 20.

[0065] Understandably, when the packaged module includes a Zener diode, Figure 5 The circuit shown in (b) may include a Zener diode, which may be connected in parallel across the two ends of the flash lamp 101 and the two ends of the infrared lamp 102.

[0066] In some embodiments, the anode and cathode of the flash lamp 101 and the infrared lamp 102 can be respectively connected to a pad 103.

[0067] Considering that the operating current of the flash lamp 101 is relatively large, in some embodiments, the anode and cathode of the flash lamp 101 can be connected to multiple pads 103 respectively to improve heat dissipation and current carrying capacity.

[0068] For example, such as Figure 5 As shown in (a), the anode FL+ and cathode FL- of the flash lamp 101 are connected to two pads 103 respectively, and the anode IR+ and cathode IR- of the infrared lamp 102 are connected to one pad 103 respectively.

[0069] As mentioned above, the flash lamp 101 and the infrared lamp 102 are driven by the same polarity. Taking the example that both the flash lamp 101 and the infrared lamp 102 are driven by the anode, the cathodes of both the flash lamp 101 and the infrared lamp 102 are grounded. In this case, the cathodes of the flash lamp 101 and the infrared lamp 102 can also be connected to the same pad 103 (referred to as the common pad) and grounded through the pad 103.

[0070] For example, Figure 6 (a) in the middle is Figure 4 Another rear view diagram of the in-package module. Figure 6 (b) in the diagram is another equivalent circuit diagram of the packaged module. For example... Figure 6 As shown, the anode FL+ of flash lamp 101 and the anode IR+ of infrared lamp 102 are connected to different pads 103, respectively. The cathode FL- of flash lamp 101 and the cathode IR- of infrared lamp 102 are connected to a common pad 103, through which they are grounded. See also Figure 6 In (b), it is equivalent to connecting the cathode IR- of the infrared lamp 102 to the cathode FL- of the flash lamp 101.

[0071] The common pad 103 connected to the flash lamp 101 and the infrared lamp 102 can be one or more, such as Figure 6 As shown, here for example, there are 3 common pads 103.

[0072] In other examples, both the flash lamp 101 and the infrared lamp 102 can be cathode driven. Correspondingly, the anodes of the flash lamp 101 and the infrared lamp 102 can be connected to the same pad 103, through which the power supply is connected.

[0073] See also Figure 3 The driver chip 20 can output a flash drive signal to the flash 101 through the first output terminal D1 to control the working state of the flash 101. For example, it can control the flash 101 to turn on or off, or control the brightness and working mode (such as constant light mode, flashing mode) of the flash 101.

[0074] The driver chip 20 can output an infrared lamp drive signal to the infrared lamp 102 through the second output terminal D2 to control the working state of the infrared lamp 102. For example, it can control the infrared lamp 102 to turn on or off, or control the infrared lamp 102 to emit a specific encoded infrared signal, etc.

[0075] As mentioned earlier, the first output terminal D1 is electrically connected to the first pole of the flash lamp 101, and the second output terminal D2 is electrically connected to the first pole of the infrared lamp 102. The first poles of the flash lamp 101 and the infrared lamp 102 have the same polarity; that is, the flash lamp 101 and the infrared lamp 102 use a same-polarity driving method. This improves integration while reducing circuit complexity and saving costs.

[0076] In some implementations, see Figure 7 The first electrode can be the anode, that is, the flash lamp 101 and the infrared lamp 102 adopt the anode driving method, and correspondingly, the cathodes of the flash lamp 101 and the infrared lamp 102 can be grounded. In this way, the static electricity outside the flash lamp 101 and the infrared lamp 102 can be directly discharged to the ground through the cathode, thereby reducing the impact of static electricity on the light-emitting component 1 and improving the stability of the light-emitting component 1.

[0077] Correspondingly, the driver chip 20 can provide driving voltage to the flash lamp 101 and the infrared lamp 102 through the first output terminal D1 and the second output terminal D2, wherein the driving voltage of the flash lamp 101 and the infrared lamp 102 can be different.

[0078] When the cathodes of the flash lamp 101 and the infrared lamp 102 are grounded, they can be connected to the reference ground (GND) of the electronic device motherboard through FPC or other means.

[0079] In some embodiments, the first electrode can also be a cathode, that is, the flash lamp 101 and the infrared lamp 102 can also be driven by a cathode, and correspondingly, the anode of the flash lamp 101 and the infrared lamp 102 can be connected to a power supply.

[0080] In some embodiments, see Figure 7 The light-emitting component 1 may further include: a flash control module 30 and an infrared lamp control module 40; the flash control module 30 is electrically connected to the driver chip 20 and is used to output a flash control signal to the driver chip 20; the infrared lamp control module 40 is electrically connected to the driver chip 20 and is used to output an infrared lamp control signal to the driver chip 20; the driver chip 20 is used to output a flash drive signal through the first output terminal D1 according to the flash control signal 101, and to output an infrared lamp drive signal through the second output terminal D2 according to the infrared lamp control signal 102.

[0081] Specifically, the driver chip 20 can integrate a flash drive channel and an infrared lamp drive channel. The flash control module 30 can be connected to the first control terminal G1 of the driver chip 20. The first control terminal G1 outputs a flash control signal in the form of a level or pulse to the driver chip 20 to control the flash drive channel in the driver chip 20 to work and generate the corresponding flash drive signal.

[0082] The infrared lamp control module 40 can be connected to the second control terminal G2 of the driver chip 20. It outputs an infrared control signal in the form of level or pulse to the driver chip 20 through the first control terminal G2 to control the infrared lamp driving channel in the driver chip 20 to work and generate the corresponding infrared lamp driving signal.

[0083] Optionally, both the flash control module 30 and the infrared lamp control module 40 can be in chip form to further save space. The flash control module 30 and the infrared lamp control module 40 can be independent chips or integrated into the same chip.

[0084] The above description primarily uses the example of a single flash lamp 101 included in the light-emitting module 10. In other embodiments, the light-emitting module 10 may also include multiple flash lamps 101. Correspondingly, the driver chip 20 may include multiple first output terminals D1, and each flash lamp 101 may be connected to one first output terminal D1. The driver chip 20 can output a driving signal to the corresponding flash lamp 101 through the first output terminal D1.

[0085] Accordingly, each flash unit 101 can correspond to a flash control module 30, or the flash control modules 30 of each flash unit 101 can be integrated together. The specific implementation can be chosen according to needs, and this embodiment does not impose any particular limitation on this.

[0086] It is understandable that the light-emitting component may also include other components, such as the driver chip 20, the flash control module 30, and the peripheral circuits of the infrared control module 40.

[0087] The light-emitting components provided in this application embodiment have an integrated design for the driver chips of the flash lamp and the infrared lamp. Both are driven by the same driver chip, which can reduce the number of driver chips and the number of FPCs required at the same time, thus saving equipment space and reducing costs. In addition, the flash lamp and the infrared lamp adopt the same polarity driving method, which can reduce the circuit complexity of the driver chip, thereby further reducing costs.

[0088] Furthermore, the flash and infrared lights can be integrated into the same package module, which can further save equipment space and reduce costs.

[0089] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0090] It should be understood that in the description of this application and the appended claims, the terms "comprising," "including," "having," and any variations thereof are intended to cover non-exclusive inclusion and mean "including but not limited to," unless otherwise specifically emphasized.

[0091] In the description of this application, unless otherwise stated, " / " indicates that the objects before and after are in an "or" relationship. For example, A / B can mean A or B. "And / or" in this application is used to describe the relationship between the related objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. A and B can be singular or plural.

[0092] Furthermore, in the description of this application, unless otherwise stated, "multiple" means two or more. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can mean: a, b, c, ab, ac, bc, or abc, where a, b, and c can be single or multiple.

[0093] Furthermore, it should be understood in the description of this application that the terms "center," "length," "width," "thickness," "longitudinal," "horizontal," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "vertical," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0094] In this application, unless otherwise expressly specified and limited, the terms "installation", "connection", "linking", "fixing", etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components or the interaction between two components. Unless otherwise expressly limited, those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0095] Furthermore, in the description of this application and the appended claims, the terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence, nor should they be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. It should be understood that such data can be interchanged where appropriate so that the embodiments described herein can be implemented in a sequence other than that illustrated or described herein; features defined as "first" or "second" may explicitly or implicitly include at least one of those features.

[0096] In the embodiments of this application, the words "exemplarily" or "for example" are used to indicate examples, illustrations, or explanations. Any embodiment or design described as "exemplarily" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design solutions. Specifically, the use of the words "exemplarily" or "for example" is intended to present the relevant concepts in a specific manner.

[0097] References to "one embodiment" or "some embodiments" in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized.

[0098] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A light-emitting component, characterized in that, The light-emitting component, used in electronic devices, includes: a light-emitting module and a driver chip; The light-emitting module includes a flash lamp and an infrared lamp; The driver chip includes a first output terminal and a second output terminal; The first output terminal is electrically connected to the first pole of the flash lamp and is used to output a flash lamp drive signal to the flash lamp. The second output terminal is electrically connected to the first pole of the infrared lamp and is used to output an infrared lamp driving signal to the infrared lamp; The first electrode of the flash lamp has the same polarity as the first electrode of the infrared lamp.

2. The light-emitting component according to claim 1, characterized in that, The first electrode is the anode, and the cathodes of the flash lamp and the infrared lamp are grounded.

3. The light-emitting component according to claim 1 or 2, characterized in that, The light-emitting module is a packaged module that integrates the flash lamp and the infrared lamp.

4. The light-emitting component according to claim 3, characterized in that, The packaging module also integrates a Zener diode, which is connected in parallel with the flash lamp and the infrared lamp.

5. The light-emitting component according to claim 4, characterized in that, The flash, the infrared lamp, and the Zener diode are all diode chips.

6. The light-emitting component according to any one of claims 3-5, characterized in that, The back of the packaging module is provided with multiple pads, the anode and cathode of the flash lamp are respectively connected to multiple pads, and the anode and cathode of the infrared lamp are respectively connected to one pad.

7. The light-emitting component according to any one of claims 1-6, characterized in that, The light-emitting module includes multiple flash lamps, and the driving chip includes multiple first output terminals, with each flash lamp connected to a corresponding first output terminal.

8. The light-emitting component according to any one of claims 1-7, characterized in that, The light-emitting component also includes: a flash control module and an infrared light control module; The flash control module is electrically connected to the driver chip and is used to output flash control signals to the driver chip; The infrared lamp control module is electrically connected to the driver chip and is used to output infrared lamp control signals to the driver chip; The driver chip is used to: output a flash drive signal through the first output terminal according to the flash control signal; and output an infrared drive signal through the second output terminal according to the infrared control signal.

9. The light-emitting component according to any one of claims 1-8, characterized in that, The light-emitting module emits light towards the back of the electronic device.

10. An electronic device, characterized in that, include: The light-emitting component as described in any one of claims 1-9.

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