Electric control box and air conditioner

Abstract

The utility model provides a kind of electric control box, comprising: box body, with bottom wall and the side wall of being surrounded in bottom wall, and the sealed connection between bottom wall and side wall;Box cover, cover is set in the open of being surrounded formed by side wall;Mainboard is set in box body, and mainboard is connected with radiator, wherein, bottom wall is equipped with opening, and radiator exposes in box body via opening, and side wall is equipped with wire hole, and wire hole is sealedly connected with wire rubber ring, and external wiring harness enters box body via wire rubber ring, and wire rubber ring is equipped with the collection piece, and collection piece is configured to be tightened after wiring harness enters box body via wire rubber ring.The electric control box has good airtightness, can effectively prevent high temperature and high humidity gas into box body inside, and then can effectively prevent condensation in electric control box inside while being cooled by radiator.At the same time, fan drive module is integrally arranged in mainboard, and rectifier bridge and fan drive module are cooled by the same radiator, effectively simplify layout, improve production efficiency.

Description

Technical Field

[0001] This application relates to the field of air conditioning, specifically to an electrical control box and an air conditioner. Background Technology

[0002] Electrical control boxes, as devices for the centralized installation, protection, and control of electrical or electronic components, are widely used in industrial and various electrical machinery systems.

[0003] In related technologies, heat sinks are typically used to dissipate heat from electronic components in order to reduce their temperature. However, when the temperature of the heat sink and electronic components is low after heat dissipation, the high-temperature and high-humidity gas entering the control box is prone to condensation on the surface of the heat sink and electronic components, which can easily lead to short circuits or damage to the electronic components, and even create safety hazards.

[0004] In addition, in the electrical control boxes of related technologies, the fan drive module and the main board are mostly designed separately, and the fan drive module is equipped with an independent heat sink for heat dissipation. This not only increases the number of components, but also complicates the assembly process and affects production efficiency.

[0005] Air conditioners, as widely used temperature and humidity control devices, typically include components such as compressors, evaporators, condensers, and fans. Air conditioners also have electrical control boxes, which also suffer from the same problems mentioned above.

[0006] Application content

[0007] This application aims to provide an electrical control box and an air conditioner to at least solve or alleviate some of the problems existing in the prior art.

[0008] This application provides an electronic control box, including:

[0009] The box has a bottom wall and side walls surrounding the bottom wall, and the bottom wall and side walls are sealed together.

[0010] A lid that covers the opening formed by the side walls;

[0011] The motherboard is housed inside the enclosure and is connected to a heatsink. An opening is provided on the bottom wall, through which the heatsink protrudes from the enclosure. Cable guide holes are provided on the side walls, and cable guide rings are sealed to the cable guide holes. External cables enter the enclosure through the cable guide rings. A tightening fastener is fitted onto the cable guide rings, which is configured to tighten the cables after they enter the enclosure through the cable guide rings.

[0012] Optionally, the bottom wall and the side walls are fully welded and sealed together, and the lid and the body are sealed together.

[0013] Optionally, the wire guide ring is cylindrical and fitted with a tightenable nylon cable tie, which is configured to tighten the wire harness after it passes through the wire guide ring and enters the housing.

[0014] Optionally, the heat sink includes a base plate and heat sink fins. The base plate is disposed inside the housing and connected to the main board. The heat sink fins are exposed outside the housing through an opening, and a sealing element is provided at the opening. The heat sink fins are exposed outside the housing through the sealing element.

[0015] Optionally, the substrate and the motherboard are connected by copper pillars and are spaced apart. The side of the motherboard facing the substrate is provided with power devices, which include at least a rectifier bridge and a fan drive module.

[0016] Optionally, the substrate has a power device mounting hole corresponding to the power device, the power device is located in the power device mounting hole, and the surface of the power device is attached to the substrate through a heat-conducting component. The substrate has a clearance groove corresponding to the pin of the power device.

[0017] Optionally, the cable hole includes at least a high-voltage cable hole and a low-voltage cable hole disposed in one side wall, and a power cable hole and a signal cable hole disposed in another adjacent side wall.

[0018] Optionally, the box body is also provided with wiring terminals, which are located adjacent to the wire passage holes.

[0019] Optionally, the wire guide ring is also covered with a protective box.

[0020] This application also provides an air conditioner having the aforementioned electrical control box. Attached Figure Description

[0021] Figure 1 This is an exploded view of the overall structure of the electrical control box in the embodiments of this application;

[0022] Figure 2 This is a schematic diagram of the box structure in an embodiment of this application;

[0023] Figure 3 This is a schematic diagram of the heat sink and motherboard in the embodiments of this application;

[0024] Figure 4 This is a front view of the side of the box with an opening, as described in the embodiment of this application.

[0025] Figure 5 This is a schematic diagram of the structure after the heat sink is connected to the motherboard in the embodiment of this application;

[0026] Figure 6 This is a front view of the box body with its opening side in the embodiment of this application;

[0027] Figure 7 This is a front view of the electrical control box in the embodiment of this application.

[0028] Reference numerals: Electrical control box 100, box body 10, bottom wall 11, opening 111, sealing element 112, side wall 12, wire hole 13, high-voltage wire hole 131, low-voltage wire hole 132, power cord hole 133, signal wire hole 134, wire guide ring 14, nylon cable tie 15 (tightening element 15), box cover connector 16, box cover 20, main board 30, heat sink 40, substrate 41, heat sink fins 42, copper pillar 43, power device mounting hole 50, rectifier bridge mounting hole 51, fan drive mounting hole 52, clearance slot 60, rectifier bridge pin clearance slot 61, fan drive module pin clearance slot 62, terminal block 70, protective box 80. Detailed Implementation

[0029] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0030] Furthermore, for any single technical feature described or implied in the embodiments mentioned herein, or any single technical feature shown or implied in the various figures, this application still allows for any combination or deletion of these technical features (or their equivalents) without any technical obstacle, thereby obtaining more other embodiments of this application that may not be directly mentioned herein.

[0031] refer to Figure 1 An electrical control box 100 according to this embodiment includes a box body 10, a box cover 20, and a main board 30.

[0032] refer to Figure 2 The box body 10 has a bottom wall 11 and side walls 12 surrounding the bottom wall 11, and the bottom wall 11 and the side walls 12 are sealed together. In one or more embodiments, the bottom wall 11 and the side walls 12 of the box body 10 are fully welded and sealed together, which effectively ensures the airtightness of the box body 10.

[0033] The lid 20 covers the opening formed by the side wall 12. In one or more embodiments, the lid 20 and the box body 10 are sealed together. Specifically, sealing components such as sealing strips or sealing rings can be provided between the lid 20 and the box body 10. After the lid 20 is placed on the box body 10, the assembly gap between the lid 20 and the box body 10 can be sealed, preventing high-temperature and high-humidity gases from entering the box body 10 from the assembly gap between the lid 20 and the box body 10, thus further ensuring the airtightness of the electrical control box 100.

[0034] refer to Figure 2 In one or more embodiments, the four ends of the open portion of the box body 10 are provided with lid connecting seats 16, and the lid 20 is provided with corresponding connecting holes (not shown). The lid 20 can be detachably and sealed onto the box body 10 through the connecting holes and the lid connecting seats 16, using screws or other fasteners, facilitating inspection and maintenance. It is understood that the installation and fixing structure of the lid connecting seats 16 and the connecting holes is only one example. While ensuring that the lid 20 can be detachably and sealed onto the box body 10, the positions of the lid connecting seats 16 and the connecting holes can be varied according to actual needs, or the installation and fixing structure of the lid 20 can also be varied according to actual installation needs; no specific limitations are made here.

[0035] like Figure 1 and Figure 2 As shown, the motherboard 30 is installed inside the box 10. The motherboard 30 is connected to the heat sink 40. An opening 111 is provided on the bottom wall 11, through which the heat sink 40 is exposed to the box 10.

[0036] refer to Figure 3 In one or more embodiments, the heat sink 40 includes a substrate 41 and heat dissipation fins 42. The substrate 41 is disposed inside the housing 10 and connected to the main board 30. The heat dissipation fins 42 are exposed outside the housing 10 through an opening 111. Specifically, the bottom wall 11 and the substrate 41 are respectively provided with corresponding matching mounting holes. With the help of screws or other fasteners, the substrate 41 can be fixedly mounted on the bottom wall 11 and located inside the housing 10. The heat dissipation fins 42 connected to the substrate 41 are exposed outside the housing 10 through the opening 111 to exchange heat with the outside.

[0037] Further, refer to Figure 2 and Figure 6 The side wall 12 has a wire-passing hole 13, which is sealed with a wire-passing rubber ring 14. The external wire harness enters the box 10 through the wire-passing rubber ring 14. The wire-passing rubber ring 14 is fitted with a tightenable fastening member 15 (nylon cable tie 15). The fastening member 15 is configured to tighten the wire harness after it enters the box 10 through the wire-passing rubber ring 14. Figure 2 The image shows a junction element 15 as an example.

[0038] In one or more embodiments, the wire guide ring 14 is cylindrical, with one end being an inlet end located outside the housing 10, and the other end passing through the side wall 12 and sealingly entering the housing 10. The cylindrical shape facilitates the entry of the wire harness and allows it to deform accordingly with the tightening action of the coiling member 15 to tighten the entered wire harness.

[0039] Specifically, the wire guide ring 14 is made of a waterproof elastic material. While preventing moisture from entering the wire guide ring 14 itself, it also has a certain deformation capability. After the wire harness passes through the wire guide ring 14 into the box 10 and connects with the main board 30, it is tightened by the tightening member 15. This allows the wire guide ring 14 to deform and tighten the wire harness, thereby sealing the gap between the inlet end of the wire guide ring 14 located outside the box 10 and the wire harness. This effectively prevents high-temperature and high-humidity gases from entering the box 10 through the gap between the inlet end of the wire guide ring 14 and the wire harness, further ensuring the airtightness of the electrical control box 100.

[0040] refer to Figure 2 In one or more embodiments, the gathering member 15 is a nylon cable tie, which is correspondingly sleeved near the inlet end of the wire guide ring 14. It is understood that the gathering member 15 only needs to satisfy the requirement of being able to deform the wire guide ring 14 by tightening to clamp the wire harness. The nylon cable tie sleeved on the wire guide ring 14 is only one form of the gathering member 15 and is not limited to it. For example, the gathering member 15 can also be set in the form of a tightenable elastic gathering ring, a snap-fit ​​fastener, etc.

[0041] In addition, the gathering member 15 can also be integrally set at the inlet end of the wire guide ring 14. For example, the drawstring (not shown) can be embedded in the inlet end of the wire guide ring 14, and the inlet end can be quickly closed by pulling the drawstring. Alternatively, the gathering member 15 can also be set as a bag body that is sealed and added to the inlet end. The bag body is made of a highly waterproof and airtight material and has a certain degree of flexibility. It is equipped with a drawstring for tightening the bag opening. By tightening the drawstring, the bag opening can be quickly tightened and the wire harness can be tightened accordingly. The gathering and tightening action can be completed more quickly and conveniently, preventing high temperature and high humidity gas from entering the box body 10 through the wire guide ring 14.

[0042] Therefore, the specific form of the gathering member 15 in the embodiments of this application is not particularly limited. Any technical means that can seal and isolate the inner and outer parts of the box 10 corresponding to the wire guide ring 14 from each other after the wire harness enters the box 10 through the wire guide ring 14, that is, seal the gap between the inner wall of the wire guide ring 14 and the wire harness, are all within the protection scope of this application.

[0043] Preferably, the exposed length of the guide ring 14 can be set to 60mm.

[0044] In this embodiment of the electrical control box 100, the bottom wall 11 and side walls 12 of the box body 10 are fully welded and sealed together, effectively ensuring the airtightness of the box body 10. Simultaneously, the box cover 20 is sealed to the box body 10, further ensuring the airtightness of the electrical control box 100. Furthermore, the wire guide ring 14 is sealed to the box body 10, and after the wire harness passes through the wire guide ring 14 and enters the box body 10 to connect with the main board 30, it is tightened by the tightening member 15, thus sealing the gap between the wire guide ring 14 and the incoming wire harness, further improving the airtightness of the electrical control box 100. Through the above-mentioned sealing design structure, while satisfying the heat dissipation through the heat sink 40, it effectively prevents external high-temperature and high-humidity gases from entering the interior of the box body 10, thereby avoiding condensation inside the box body 10.

[0045] Further, refer to Figure 1 and Figure 4 A sealing element 112 is provided around the opening 111. When the heat dissipation fins 42 are exposed to the box body 10 through the opening 111, the sealing element 112 can seal the gap between the opening 111 and the heat dissipation fins 42.

[0046] Specifically, refer to Figure 4 The opening 111 is rectangular, and the heat dissipation fins 42 are matched with the shape and size of the opening 111 and are inserted into the opening 111 accordingly, so as to minimize the assembly gap between the heat dissipation fins 42 and the opening 111.

[0047] In one or more embodiments, the sealing element 112 is a sealing sponge or other elastic sealing element 112. The sealing element 112 is correspondingly disposed on the outside of the box body 10 and tightly fitted to the heat dissipation fins 42, and is also disposed in contact with the edge of the opening 111. The elastic sealing element 112 can fill the assembly gap between the opening 111 and the heat dissipation fins 42, effectively preventing high temperature and high humidity gas from entering the box body 10 through the assembly gap between the opening 111 and the heat dissipation fins 42, further ensuring the airtightness of the box body 10. Even under harsh condensation conditions of high temperature and high humidity, the condensation inside the electrical control box 100 can be significantly reduced, effectively ensuring electrical safety and reliable operation.

[0048] refer to Figure 3 In one or more embodiments, the substrate 41 and the main board 30 are connected by copper pillars 43 and the substrate 41 and the main board 30 are spaced apart. The side of the main board 30 facing the substrate 41 is provided with power devices (not shown). The power devices include at least a rectifier bridge (not shown) and a fan drive module (not shown).

[0049] Specifically, refer to Figure 3 and Figure 5The substrate 41 and the motherboard 30 are fixedly connected by copper pillars 43, which support and limit the motherboard 30 and leave a gap between the substrate 41 and the motherboard 30. The power devices with high heat generation in the motherboard 30, such as rectifier bridges and fan drive modules, can be set so that the side of the motherboard 30 faces the substrate 41 to facilitate heat dissipation through the substrate 41.

[0050] Further, refer to Figure 3 The substrate 41 is provided with a power device fixing hole 50 corresponding to the power device. The power device is located in the power device fixing hole 50, and the surface of the power device is attached to the substrate 41 through a heat-conducting component. The substrate 41 is provided with a clearance groove 60 corresponding to the pin of the power device.

[0051] refer to Figure 3 In one or more embodiments, the substrate 41 of the heat sink 40 is provided with rectifier bridge fixing holes 51 and fan drive module fixing holes 52 corresponding to the rectifier bridge and fan drive module, respectively. The pins of the rectifier bridge and the fan drive module are connected to the motherboard 30, and the rectifier bridge and the fan drive module can be placed in the rectifier bridge fixing holes 51 and the fan drive module fixing holes 52 to maintain a stable position, so that the surface of the power device maintains stable contact with the substrate 41, so as to stably exchange heat with the substrate 41 when heat is generated.

[0052] In one or more embodiments, the surface of the power device is bonded to the substrate 41 via a thermally conductive element. The heat generated by the power device during operation is conducted to the substrate 41 via the thermally conductive element. The substrate 41 then transfers the heat to the heat sink fins 42, which exchange heat with the cold air flowing outside the housing 10. The thermally conductive element, filled between the surface of the substrate 41 and the surface of the power device, accelerates heat conduction and improves heat dissipation efficiency. Specifically, the thermally conductive element is thermal paste, but it can also be a flexible thermally conductive material such as thermal grease or thermal silicone, which can improve heat conduction efficiency while providing a buffer to prevent direct hard contact between the power device and the heat sink 40, thus avoiding easy damage.

[0053] refer to Figure 3 In one or more embodiments, the substrate 41 has clearance slots 60 corresponding to the pins of the power devices. The clearance slots 60 include rectifier bridge pin clearance slots 60 corresponding to the rectifier bridge pin positions, and fan drive module pin clearance slots 60 corresponding to the fan drive module pin positions. Specifically, the heat sink 40 is a heat sink made of a metal material with high thermal conductivity, such as an aluminum heat sink.

[0054] When the pins of the power device are too close to the surface of the substrate 41, discharge is likely to occur. By creating recessed clearance grooves 60 in the substrate 41 corresponding to the pins of the power device, a physical isolation distance can be effectively provided to prevent the pins of the power device from being too close to the surface of the substrate 41, thereby ensuring electrical safety and reliable operation.

[0055] In the electrical control box 100 of this embodiment, the fan drive module is integrated into the motherboard 30. The heat sink 40 can simultaneously dissipate heat from the main heat-generating electrical components, such as power devices including the fan drive module and the rectifier bridge. While ensuring the heat dissipation effect, it effectively simplifies the structural layout and improves production efficiency.

[0056] Understandably, the power devices located on the side of the motherboard 30 facing the substrate 41 are not limited to the rectifier bridge and the fan drive module. Other power devices with high heat generation can also be located between the motherboard 30 and the substrate 41 for rapid heat dissipation. Corresponding power device mounting holes 50 and clearance slots 60 can be opened in the substrate 41 according to the number and structure of the power devices.

[0057] In one or more embodiments, the surface of the substrate 41 is further provided with a flocked cloth layer (not shown) to prevent condensation. Specifically, by providing the flocked cloth layer, a physical barrier can be formed between the surface of the substrate 41 and the ambient air, preventing the high-temperature and high-humidity air entering the housing 10 from contacting the low-temperature surface of the substrate 41, thereby preventing moisture in the air from condensing on the surface of the substrate 41 to form condensation; at the same time, the flocked cloth layer has good hygroscopicity and can effectively absorb moisture in the air, thereby preventing water molecules from condensing and directly adhering to the surface of the substrate 41. Furthermore, at the location of the power device mounting hole 50, that is, the contact position between the surface of the substrate 41 and the surface of the power device, the flocked cloth layer may not be provided to ensure the thermal conductivity between the power device and the heat sink 40.

[0058] refer to Figure 2 and Figure 6 In one or more embodiments, the cable passage 13 includes at least a high-voltage cable passage 131 and a low-voltage cable passage 132 disposed in one sidewall 12, and a power cable passage 133 and a signal cable passage 134 disposed in another adjacent sidewall 12. By separating the high-voltage and low-voltage cable bundles for isolation, signal interference can be avoided, and the arrangement of multiple cable passages 13 facilitates wiring and assembly. Specifically, the cable passage 13 is an opening disposed in the sidewall 12, and the cable passage rubber ring 14 is correspondingly sealed and installed in the cable passage 13. Figure 2 and Figure 6 The image shows the state in which the high-voltage wire hole 131, low-voltage wire hole 132, power cord hole 133, and signal wire hole 134 are all sealed with wire-passing rubber rings 14.

[0059] refer to Figure 6 In one or more embodiments, the housing 10 is further provided with a terminal block 70, which is located adjacent to the wire hole 13. The terminal block 70 is correspondingly located between the side wall 12 where the power wire hole 133 and the signal wire hole 134 are located and the main board 30, which facilitates wiring and assembly.

[0060] refer to Figure 7 In one or more embodiments, a protective box 80 is further provided over the outside of the wire guide ring 14. Specifically, the protective box 80 can correspondingly cover the wire guide ring 14 and the external wire harness located outside the box body 10, effectively preventing the wire guide ring 14 and the external wire harness from being chewed by animals such as rodents. (Reference) Figure 1 and Figure 7 The protective box 80 can be configured as a rectangular box, with one side in contact with the side wall 12 and the bottom surface corresponding to the bottom wall 11 being configured as open surfaces, so that the protective box 80 can cover the outside of the wire guide ring 14 and fit against the side wall 12, while also facilitating the wire harness to enter the wire guide ring 14 through the open bottom surface of the protective box 80. Figure 7 The image shows a protective box 80 as an example. The protective box 80 covers the locations of the high-voltage wire hole 131 and the low-voltage wire hole 132 to protect the sealed connection of the wire guide ring 14 and the high-voltage wire bundle and low-voltage wire bundle located outside the wire guide ring 14.

[0061] Furthermore, the protective box 80 can be separately fixed on the outer side of the side wall 12 where the wire guide ring 14 is provided; or, the protective box 80 can be provided on the side of the box cover 20 and configured such that after the box cover 20 is installed on the box body 10, the protective box 80 is correspondingly installed on the outside of the wire guide ring 14.

[0062] This embodiment also provides an air conditioner equipped with an electrical control box 100 according to one or more embodiments. Specifically, the fan drive modules of the evaporator fan and / or condenser fan are integrated into the main board 30 in the electrical control box 100, and the rectifier bridge and fan drive modules are cooled by the same heat sink 40, which ensures heat dissipation while effectively simplifying the layout and improving production efficiency. At the same time, the electrical control box 100 has good airtightness, which can effectively prevent external gas from entering the box body 10. Even under harsh condensation conditions of long-term high temperature and high humidity, condensation can be effectively avoided inside the electrical control box 100, thereby effectively ensuring electrical safety and operational reliability.

[0063] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An electrical control box, characterized in that, include: The box has a bottom wall and side walls surrounding the bottom wall, and the bottom wall and the side walls are sealed together. A lid is provided to cover the opening formed by the side wall; The motherboard is housed within the enclosure, and a heatsink is connected to the motherboard. The bottom wall has an opening through which the heat sink protrudes from the housing. The side wall has a wire passage hole, and the wire passage hole is sealed with a wire passage rubber ring. The external wire harness enters the box through the wire passage rubber ring. The wire passage rubber ring is fitted with a tightenable gathering member, which is configured to tighten the wire harness after it enters the box through the wire passage rubber ring.

2. The electrical control box according to claim 1, characterized in that, The bottom wall and the side wall are fully welded and sealed together, and the lid and the box body are sealed together.

3. The electrical control box according to claim 1, characterized in that, The wire guide ring is cylindrical and is fitted with a tightenable nylon cable tie, which is configured to tighten the wire harness after it passes through the wire guide ring and enters the housing.

4. The electrical control box according to claim 1, characterized in that, The heat sink includes a base plate and heat dissipation fins. The base plate is disposed inside the housing and connected to the main board. The heat dissipation fins are exposed outside the housing through the opening, and a sealing element is provided at the opening position, through which the heat dissipation fins are exposed outside the housing.

5. The electrical control box according to claim 4, characterized in that, The substrate and the motherboard are connected by copper pillars and are spaced apart. The motherboard has power devices on the side facing the substrate, and the power devices include at least a rectifier bridge and a fan drive module.

6. The electrical control box according to claim 5, characterized in that, The substrate has a corresponding power device mounting hole, the power device is located in the power device mounting hole, and the surface of the power device is attached to the substrate through a heat-conducting component. The substrate has a clearance groove corresponding to the pin of the power device.

7. The electrical control box according to claim 1, characterized in that, The cable holes include at least a high-voltage cable hole and a low-voltage cable hole disposed in one of the side walls, and a power cable hole and a signal cable hole disposed in another adjacent side wall.

8. The electrical control box according to claim 1, characterized in that, The box body is also provided with wiring terminals, which are located adjacent to the wire hole.

9. The electrical control box according to claim 1, characterized in that, The outer surface of the wire guide ring is also covered with a protective box.

10. An air conditioner, characterized in that, It has an electrical control box as described in any one of claims 1 to 9.

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