A heat dissipation system of a cabinet power amplifier

Abstract

A kind of heat dissipation system of cabinet power amplifier, it includes equipment shell, heat dissipation area, air-cooled flow channel, fan assembly.The equipment shell includes bottom plate, back plate, panel.The back plate is provided with a plurality of heat dissipation air outlet holes.The panel is provided with a plurality of heat dissipation air inlet holes.The fan assembly includes fixed plate, heat dissipation fan.Compared with prior art, the utility model is provided with the fan assembly, the fixed plate is connected with the air duct baffle and is buckled, forms continuous air duct, reduces the air volume loss of the heat dissipation fan in work, guarantees the air cooling effect of the heat generating device in the heat dissipation area, and due to the shielding of equipment shell, in combination with the heat dissipation fan using PWM fan, so that equipment has more excellent noise reduction function.Setting the fan assembly, realize the forced air cooling of the heat dissipation area, compared with negative pressure heat dissipation structure efficiency is higher, and positive pressure forced air cooling makes fan always inhale cold air, it is favorable to the extension of fan life.

Description

Technical Field

[0001] This utility model relates to the field of audio equipment technology, and in particular to a heat dissipation system for a cabinet power amplifier. Background Technology

[0002] A power amplifier is a basic device in an audio system, commonly known as a "loudspeaker". Its task is to amplify the weak electrical signal from the signal source (or mixing console in a professional audio system) to drive the speakers to produce sound.

[0003] Heat is generated during equipment operation. If the heat cannot be dissipated in time, the temperature of the components will rise, affecting the normal use of the equipment and shortening its service life. Therefore, a heat dissipation structure is needed to dissipate heat.

[0004] Most existing power amplifiers employ a negative pressure cooling structure. Its core principle is to accelerate heat flow using air pressure differences. Specific implementation methods include using aluminum fin structures, reducing thermal resistance by increasing surface area and optimizing airflow direction (e.g., vertical fins facilitate natural convection), and creating localized negative pressure zones through fans or airflow channels to force heat out. However, this negative pressure cooling structure has several drawbacks. First, it often lacks airflow optimization for the heat source; the air drawn out by the negative pressure doesn't entirely originate from the heatsink, leading to reduced convection efficiency. Furthermore, the rear-mounted fan, close to the outside of the device, generates more noise. Second, the negative pressure cooling method reduces fan lifespan due to the fan constantly drawing in hot air. Summary of the Invention

[0005] In view of this, the present invention provides a heat dissipation system for a rack-mounted power amplifier to solve the above-mentioned technical problems.

[0006] A cooling system for a rack-mounted power amplifier includes a housing, a cooling zone within the housing, multiple air-cooling channels within the housing, and multiple fan assemblies within the housing. The housing includes a base plate, a back plate, and a panel parallel to and spaced apart from the back plate. The back plate has multiple exhaust vents. The panel has multiple intake vents. The cooling zone is located on the base plate. The air-cooling channels are separated by multiple duct partitions. Each partition is a plate-like structure extending from the panel to the back plate, located around the heat-generating elements in the cooling zone, and streamlined by bending. Each fan assembly includes a mounting plate on the base plate and multiple cooling fans mounted on the mounting plate. The mounting plate is vertically fixed to the base plate by fasteners, located between the intake vents and the cooling zone, and vertically snapped into the duct partitions. Each cooling fan is fixed to the mounting plate by fasteners and located on the side of the mounting plate closest to the cooling zone.

[0007] Furthermore, the device housing also includes a top plate that is parallel to and spaced apart from the bottom plate, and two side plates disposed on both sides of the bottom plate and the top plate.

[0008] Furthermore, the bottom plate, top plate, side plate, back plate, and front plate are all rectangular plates, which are connected by fasteners and enclosed to form a rectangular box-shaped structure.

[0009] Furthermore, the heat dissipation area consists of a first power amplifier channel, a second power amplifier channel, and a power supply assembly consisting of an SMPS transformer and a 12V auxiliary power supply, from left to right.

[0010] Furthermore, the air duct baffle is divided into three air-cooling channels.

[0011] Furthermore, a wind tunnel is provided at the mounting position of the cooling fan on the fixed plate.

[0012] Furthermore, three cooling fans are provided, each located at one end of one of the three air-cooling channels.

[0013] Furthermore, the cooling fan adopts a 4-pin PWM fan, which increases the number of pins of the cooling fan to 4 and adds a PWM data line.

[0014] Compared with existing technologies, the cooling system of the rack-mounted amplifier provided by this utility model, by setting up the fan assembly, connects and snaps the fixing plate to the air duct partition to form a continuous air duct, reducing the airflow loss of the cooling fan during operation and ensuring the air cooling effect on the heat-generating components in the heat dissipation area. Simultaneously, placing the cooling fan inside the device, due to the shielding of the device casing, not only improves the cooling effect but also increases the noise transmission distance during fan rotation, making the noise of the device less noticeable during use. Furthermore, the cooling fan uses a PWM fan; PWM modulation allows the fan to operate stably in a lower speed range, significantly reducing standby noise, thus giving the device superior noise reduction capabilities. By setting up the heat dissipation inlet and outlet vents, airflow between the inside and outside of the device casing is ensured, allowing hot and cold air to circulate at opposite ends without interference. By setting up the fan assembly, forced air cooling of the heat dissipation area is achieved. The positive pressure forced air cooling method draws in strong cold air through the fan and directly dissipates heat to the heat-generating components through the air cooling channel. Compared with the negative pressure heat dissipation structure, it is more efficient and can blow cold air directly to the heat source. At the same time, the positive pressure forced air cooling ensures that the fan always draws in cold air, which is beneficial to extending the life of the fan. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the heat dissipation system of a rack-mounted power amplifier provided by this utility model.

[0016] Figure 2 for Figure 1 A schematic diagram of the internal structure of the cooling system of the rack-mounted power amplifier.

[0017] Figure 3 for Figure 2 A magnified schematic diagram of the cooling system of the rack-mounted power amplifier at point A. Detailed Implementation

[0018] The specific embodiments of this utility model are described in further detail below. It should be understood that the description of the embodiments of this utility model herein is not intended to limit the scope of protection of this utility model.

[0019] like Figures 1 to 3 The diagram shows a structural schematic of the heat dissipation system for the rack-mounted power amplifier provided by this utility model. The heat dissipation system includes a housing 10, a heat dissipation zone 20 disposed within the housing 10, multiple air-cooling channels 30 disposed within the housing 10, and multiple fan assemblies 40 disposed within the housing 10. It is conceivable that the heat dissipation system also includes other functional modules such as circuit structures, voice coil assemblies, etc., which are technologies well known to those skilled in the art and will not be described in detail here.

[0020] The device housing 10 includes a base plate 11, a top plate 12 parallel to and spaced apart from the base plate 11, two side plates 13 disposed on both sides of the base plate 11 and the top plate 12, a back plate 14 connecting the two side plates 13, and a front panel 15 parallel to and spaced apart from the back plate 14.

[0021] The base plate 11, top plate 12, side plate 13, back plate 14, and front panel 15 are all rectangular plates, connected by fasteners to form a rectangular box-like structure, housing the amplifier's sound unit and circuit boards, thus forming the amplifier's outer casing. Furthermore, the device housing 10 includes, but is not limited to, the feet on the base plate 11, the operation buttons on the front panel 15, and the fasteners connecting the various plates. These are all existing technologies widely used in industrial production and are well-known to those skilled in the art; therefore, they will not be described in detail here.

[0022] The bottom plate 11 and the top plate 12 are the largest plates. The bottom plate 11 is used to set and fix the sound-generating unit and circuit board of the cabinet power amplifier, and serves as the substrate for setting the heat dissipation area 20, the air cooling channel 30 and the fan assembly 40.

[0023] The side plate 13 is used to connect the bottom plate 11, top plate 12, back plate 14 and front plate 15. Multiple heat dissipation holes can be opened on the side plate 13 to enhance the gas flow rate.

[0024] The backplate 14 is provided with multiple heat dissipation vents 141 and multiple plug holes for inserting power cords and data cables. The heat dissipation vents 141 are multiple through holes in a regular array, evenly distributed in front of the heat dissipation area 20, and connected to the air cooling channel 30 to allow hot air to be blown out. This will be described in detail below with reference to the specific structure.

[0025] The panel 15 is provided with multiple heat dissipation air intake holes 151, as well as a display screen and operation buttons. The heat dissipation air intake holes 151 are multiple through holes arranged in a regular array, evenly distributed in front of the fan assembly 40, and corresponding to the positions of the heat dissipation air outlet holes 141, so as to allow cool air to enter.

[0026] The heat dissipation area 20 is disposed on the base plate 11 and is used to house the amplifier module and power supply module of the cabinet power amplifier. At the same time, the air cooling channel 30 is disposed on the heat dissipation area 20 and located around the heat-generating unit, and the fan assembly 40 is disposed on one side of the heat dissipation area 20 to perform air cooling for the heat-generating unit in the heat dissipation area 20.

[0027] In this embodiment, the heat dissipation area 20 consists of a first power amplifier channel, a second power amplifier channel, and a power supply assembly consisting of an SMPS transformer and a 12V auxiliary power supply, from left to right.

[0028] The air-cooled channel 30 is divided by multiple air duct baffles 31. The air duct baffles 31 are plate-shaped structures made of high-temperature resistant materials and are fixedly connected to the fan mounting plate 41 by plugging in. The air duct baffles 31 extend from the front panel 15 to the back panel 14 and are located around the heat-generating elements in the heat dissipation area 20. They are also streamlined by bending to guide strong cold airflow directly to the heat-generating components, ensuring that the heat on the heat-generating elements located in the middle of the air-cooled channel 30 is carried away by the airflow, thereby improving heat dissipation efficiency.

[0029] In this embodiment, the air duct baffle 31 is made of Mylar material. Mylar is a polyester film made of PET material, which has excellent heat resistance (temperature range -70℃ to 150℃), high surface smoothness, strong light transmittance, and good mechanical flexibility. This material is widely used in the manufacture of audio diaphragms to improve acoustic performance by enhancing high-frequency resolution; it is also used as a substrate material to support the development of flexible screens in the field of flexible display technology; and it covers multiple industrial scenarios such as electronic component insulation, aerospace equipment coating, and packaging films, so it is only briefly described here. In addition, the air duct baffle 31 is divided into three air-cooling channels 30, which correspond to the three blocks of the heat dissipation area 20 respectively.

[0030] The fan assembly 40 includes a fixing plate 41 disposed on the base plate 11, and a plurality of cooling fans 42 disposed on the fixing plate 41.

[0031] The fixing plate 41 is vertically fixed to the base plate 11 by fasteners, located between the heat dissipation air inlet 151 and the heat dissipation area 20, and is vertically snapped to the air duct partition 31 to ensure that the heat dissipation fan 42 installed on the fixing plate 41 is located at one end of the air cooling channel 30. When performing air cooling operation, the airflow directly enters the air cooling channel 30 without overflowing and causing air volume loss, thereby ensuring the efficiency of air cooling.

[0032] The cooling fan 42 is fixed to the mounting plate 41 by fasteners and is located on the side of the mounting plate 41 closer to the heat dissipation area 20. Correspondingly, a wind tunnel is provided at the mounting position of the cooling fan 42 on the mounting plate 41. By placing the cooling fan 42 inside the device housing 10, it is closer to the heat-generating device, which can prevent airflow loss. On the other hand, it increases the distance between the fan and the device housing 10, making the noise transmission from the fan less noticeable.

[0033] In one embodiment of this application, three cooling fans 42 are provided, each located at one end of one of the three air-cooling channels 30, thereby providing air cooling for the three blocks of the heat dissipation area 20. Furthermore, the cooling fans 42 are 4-pin PWM fans, increasing the number of pins to four and adding a PWM data line. This added PWM line utilizes PWM technology to adjust the fan speed, while the fan voltage remains constant, thus avoiding the problems associated with speed regulation via voltage control. PWM fan speed adjustment is more precise and can reliably operate at 10% of full speed to ensure quiet operation in standby mode. This is existing technology in the field of cooling fans and is known to those skilled in the art; therefore, it is only briefly described here. It should be noted that the fan speed in this embodiment is automatically adjusted by control logic in the firmware. These rules involve temperature, output power, and time parameters, which are control chip technologies and will not be described in detail here.

[0034] Compared with existing technologies, the heat dissipation system of the rack-mounted power amplifier provided by this utility model, through the setting of the fan assembly 40, connects and snaps the fixing plate 41 to the air duct partition 31 to form a continuous air duct, reducing the airflow loss of the cooling fan 42 during operation, ensuring the air cooling effect on the heat-generating components in the heat dissipation area 20. Simultaneously, placing the cooling fan 42 inside the device, due to the shielding of the device casing, not only improves the cooling effect of the device but also increases the noise transmission distance when the fan rotates, making the noise of the device less noticeable during use. Furthermore, the cooling fan 42 uses a PWM fan; the PWM modulation method allows the fan to operate stably in a lower speed range, significantly reducing standby noise, thus giving the device superior noise reduction capabilities. By setting the heat dissipation inlet 151 and heat dissipation outlet 141, air circulation between the inside and outside of the device casing is ensured, allowing hot and cold air to circulate at opposite ends without interference. By setting the fan assembly 40, forced air cooling of the heat dissipation area 20 is achieved. The positive pressure forced air cooling method draws in strong cold air through the fan and directly dissipates heat to the heat-generating components through the air cooling channel 30. Compared with the negative pressure heat dissipation structure, it is more efficient and can blow cold air directly to the heat source. At the same time, the positive pressure forced air cooling ensures that the fan always draws in cold air, which is beneficial to extending the life of the fan.

[0035] The above are merely preferred embodiments of the present utility model and are not intended to limit the scope of protection of the present utility model. Any modifications, equivalent substitutions or improvements within the spirit of the present utility model are covered within the scope of the claims of the present utility model.

Claims

1. A heat dissipation system for a rack-mounted power amplifier, characterized in that: The cooling system of the rack-mounted amplifier includes a housing, a cooling zone within the housing, multiple air-cooling channels within the housing, and multiple fan assemblies within the housing. The housing includes a base plate, a back plate, and a panel parallel to and spaced apart from the back plate. The back plate has multiple exhaust vents, and the panel has multiple intake vents. The cooling zone is located on the base plate. The air-cooling channels are separated by multiple duct partitions. The duct partitions are plate-shaped structures extending from the panel to the back plate and located around the heat-generating elements in the cooling zone, and are streamlined by bending. The fan assemblies include a mounting plate on the base plate and multiple cooling fans mounted on the mounting plate. The mounting plate is vertically fixed to the base plate by fasteners, located between the intake vents and the cooling zone, and is vertically snapped to the duct partitions. The cooling fans are fixed to the mounting plate by fasteners and located on the side of the mounting plate closest to the cooling zone.

2. The heat dissipation system for the rack-mounted power amplifier as described in claim 1, characterized in that: The equipment housing also includes a top plate that is parallel to and spaced apart from the bottom plate, and two side plates disposed on both sides of the bottom plate and the top plate.

3. The heat dissipation system for the rack-mounted power amplifier as described in claim 2, characterized in that: The bottom plate, top plate, side plate, back plate, and front plate are all rectangular plates, which are connected by fasteners and enclosed to form a rectangular box-shaped structure.

4. The heat dissipation system for the rack-mounted power amplifier as described in claim 1, characterized in that: The heat dissipation area consists of a first power amplifier channel, a second power amplifier channel, an SMPS transformer, and a power supply assembly consisting of a 12V auxiliary power supply, from left to right.

5. The heat dissipation system for the rack-mounted power amplifier as described in claim 1, characterized in that: The air duct partition divides the air cooling channels into three air cooling channels.

6. The heat dissipation system of the rack-mounted power amplifier as described in claim 1, characterized in that: A wind tunnel is provided at the mounting position of the cooling fan on the fixed plate.

7. The heat dissipation system for the rack-mounted power amplifier as described in claim 5, characterized in that: The cooling fan is provided in three parts, each located at one end of one of the three air-cooling channels.

8. The heat dissipation system for the rack-mounted power amplifier as described in claim 1, characterized in that: The cooling fan is a 4-pin PWM fan, which means that the number of pins of the cooling fan has been increased to 4, and a new PWM data line has been added.

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