A high-precision multi-axis alignment type chip coupling device based on a multi-vision module

Abstract

The utility model discloses a high accuracy multi -axis alignment formula chip coupling device based on multi -vision module, include: material fixed module, first vision module, second vision module, chip loading module and chip limiting module, first vision module is set up above corresponding material fixed module, and chip loading module and chip limiting module are set up respectively corresponding two sides of material fixed module, and second vision module corresponds the side position of material fixed module, material fixed module fixes the chip of waiting for processing, and first vision module and second vision module support the visual positioning in coupling process, and chip loading module absorbs and transports chip sub -component, and chip limiting module positions and limits the chip of waiting for processing, the utility model discloses support to carry out the steady limit of multi -angle to chip, and carry out the high accuracy suction placement to chip element, can cooperate coupling process and complete high quality and high stability alignment control, has stronger automatic performance and intelligent working ability.

Description

Technical Field

[0001] This utility model relates to the field of chip coupling equipment, and in particular to a high-precision multi-axis alignment chip coupling device based on a multi-vision module. Background Technology

[0002] In cutting-edge fields such as optoelectronic device packaging, advanced silicon photonics chip integration, 3D stacked packaging, and MEMS sensor assembly, chip coupling devices are core equipment for achieving high-precision alignment of multiple chips / devices. The performance of their motion control modules directly determines coupling efficiency, yield, and production cost.

[0003] Traditional chip-coupled motion control modules generally adopt a discrete architecture of "single rigid mechanical transmission + single-function actuator," where servo motors, ball screws, linear guides, and limit switches achieve displacement output through multi-stage coupling. While this structure can meet basic positioning requirements, it cannot meet the needs of high-precision fine-tuning or handle real-time compensation for sub-micron level deviations. In such cases, manual fine-tuning by operators is necessary, reducing the equipment's accuracy and work efficiency.

[0004] Furthermore, traditional chip coupling devices mostly rely on single-axis or dual-axis vision sensors to acquire position images of a single plane, which can only achieve two-dimensional coarse positioning and cannot acquire multi-directional visual information. In complex coupling scenarios (such as multi-chip stacking and heterogeneous material interface coupling), two-dimensional positioning cannot cover multi-degree-of-freedom deviations in three-dimensional space, ultimately leading to a decrease in coupling efficiency. Utility Model Content

[0005] The main objective of this invention is to provide a high-precision multi-axis alignment chip coupling device based on a multi-vision module, thereby addressing all or one of the aforementioned problems in the prior art.

[0006] To solve the above-mentioned technical problems, the present invention provides a high-precision multi-axis alignment chip coupling device based on a multi-vision module, comprising: The workbench includes a material fixing module, a first vision module, a second vision module, a chip loading module, and a chip limiting module. The material fixing module is set at the center of the workbench, the first vision module is set above the material fixing module, the chip feeding module and the chip limiting module are set at the two sides of the material fixing module respectively, and the second vision module is set at one side of the material fixing module and between the chip feeding module and the chip limiting module. The material fixing module is used to fix the chip to be processed. The first vision module and the second vision module are used for visual positioning support during the coupling process. The chip loading module is used for adsorption and transportation of chip sub-components before coupling. The chip limiting module is used to position and limit the chip to be processed on the material fixing module.

[0007] As an improved solution, the material fixing module includes: a turntable and a first multi-angle slide group; The turntable is horizontally positioned at the center of the upper surface of the worktable, and the central axis of the turntable is vertically positioned. The first multi-angle slide group is vertically positioned on the turntable, and a chip holder is installed on the top of the first multi-angle slide group. The chip holder is used to place the chip to be processed. The turntable is used to control the first multi-angle slide group to rotate horizontally with the central axis of the turntable as the rotation axis; the first multi-angle slide group is used to control the chip holder to shift angles in the X-axis and Y-axis directions.

[0008] As an improved solution, the first multi-angle slide group includes: an X-direction arc-shaped electrically controlled slide and a Y-direction arc-shaped electrically controlled slide. Both the X-direction arc-shaped electrically controlled slide and the Y-direction arc-shaped electrically controlled slide are coaxially arranged with the turntable. The X-direction arc-shaped electrically controlled slide is horizontally mounted on the upper surface of the turntable, and the Y-direction arc-shaped electrically controlled slide is horizontally mounted on the slider of the X-direction arc-shaped electrically controlled slide. The chip holder is mounted on the slider of the Y-direction arc-shaped electrically controlled slide. The X-direction arc-shaped electrically controlled slide is used to control the Y-direction arc-shaped electrically controlled slide to move in an arc along the X-axis direction; the Y-direction arc-shaped electrically controlled slide is used to control the chip holder to move in an arc along the Y-axis direction.

[0009] As an improved solution, the chip limiting module includes: a first three-way control module, a second multi-angle fine-tuning module, a first cylinder, and a limiting gripper; The first three-way control module is set on the workbench on one side of the turntable, the second multi-angle fine-tuning module is set on the movable end of the first three-way control module, and the first cylinder is installed at an angle from top to bottom on the movable end of the second multi-angle fine-tuning module and is higher than the position of the chip fixing seat. The limiting gripper is installed on the telescopic end of the first cylinder and is arranged along the telescopic direction of the first cylinder. The limiting gripper is arranged corresponding to the chip fixing seat. The first cylinder is used to control the limiting gripper to move closer to or further away from the chip to be processed. The first three-axis control module is used to control the displacement of the second multi-angle fine-tuning module in the X-axis, Y-axis and Z-axis directions; the second multi-angle fine-tuning module is used to control the vertical angle fine-tuning and horizontal direction fine-tuning of the first cylinder.

[0010] As an improved solution, the second multi-angle fine-tuning module includes: a first horizontal electrically controlled slide table arranged parallel to the Y-axis direction on the first three-way control module and a first Z-direction arc-shaped electrically controlled slide table arranged parallel to the Z-axis direction on the slider of the first horizontal electrically controlled slide table; An inclined extension plate is installed on the upper end of the slider of the first Z-direction arc-shaped electrically controlled slide, which is arranged from top to bottom, and the first cylinder is arranged on the inclined extension plate along the length direction of the inclined extension plate; The first horizontal electrically controlled slide is used to control the first Z-direction arc-shaped electrically controlled slide to shift angle along the Y-axis; the first Z-direction arc-shaped electrically controlled slide is used to control the inclined extension plate to shift angle along the Z-axis.

[0011] As an improved solution, the first three-way control module includes: a first Y-axis linear module horizontally disposed on the worktable, a first X-axis linear module horizontally mounted on the slider of the first Y-axis linear module, and a first Z-axis linear module mounted on the slider of the first X-axis linear module. The first horizontal electrically controlled slide is mounted on the slider of the first Z-axis linear module; the first Y-axis linear module is set corresponding to the turntable, and the first Z-axis linear module is set corresponding to the chip mounting base; The first Y-axis linear module is arranged along the Y-axis direction, and the first Y-axis linear module is used to control the horizontal displacement of the first X-axis linear module along the Y-axis direction; the first X-axis linear module is used to control the horizontal displacement of the first Z-axis linear module in the X-axis direction; the first Z-axis linear module is used to control the vertical displacement of the first horizontal electrically controlled slide in the Z-axis direction.

[0012] As an improved solution, the chip loading module includes: a second three-way control module, a third multi-angle fine-tuning module, and an adsorption gun; The second three-way control module is disposed on the other side of the turntable relative to the first three-way control module. The third multi-angle fine-tuning module is disposed on the movable end of the first three-way control module and close to the chip mounting base. A horizontal extension plate is connected to the movable end of the third multi-angle fine-tuning module facing the chip mounting base. The horizontal extension plate has a fixing hole at the left end corresponding to the position of the chip fixing seat, and the adsorption gun is vertically installed in the fixing hole. The adsorption gun is used to adsorb the sub-components required by the chip during the coupling process; the third multi-angle fine-tuning module is used to control the adsorption gun to fine-tune in the vertical angle and the horizontal direction; the second three-axis control module is used to control the three-axis displacement of the third multi-angle fine-tuning module in the X-axis direction, Y-axis direction and Z-axis direction.

[0013] As an improved solution, the second three-axis control module includes: a second X-axis linear module horizontally disposed on the worktable, a second Y-axis linear module horizontally disposed on the slider of the second X-axis linear module, and a second Z-axis linear module vertically disposed on the slider of the second Y-axis linear module; the third multi-angle fine-tuning module is mounted on the slider of the second Z-axis linear module; the second X-axis linear module is disposed corresponding to the turntable, and the second Z-axis linear module is disposed corresponding to the chip mounting base; the second X-axis linear module is used to control the displacement of the second Y-axis linear module along the X-axis direction; the second Y-axis linear module is used to control the displacement of the second Z-axis linear module along the Y-axis direction; the second Z-axis linear module is used to control the displacement of the third multi-angle fine-tuning module along the Z-axis direction; The third multi-angle fine-tuning module includes: a second horizontal electrically controlled slide and a second Z-direction arc-shaped electrically controlled slide; the second horizontal electrically controlled slide is mounted parallel to the Y-axis direction on the slider of the second Z-axis linear module and corresponds to the position of the chip holder; the second Z-direction arc-shaped electrically controlled slide is mounted parallel to the Z-axis direction on the slider of the second horizontal electrically controlled slide; the horizontal extension plate is mounted on the front surface of the second Z-direction arc-shaped electrically controlled slide and corresponds to the position of the chip holder; the second horizontal electrically controlled slide is used to control the second Z-direction arc-shaped electrically controlled slide to perform horizontal displacement along the Y-axis direction; the second Z-direction arc-shaped electrically controlled slide is used to control the horizontal extension plate to perform angular offset along the Z-axis direction.

[0014] As an improved solution, the second vision module comprises: a first horizontal slide, a support stage, a second horizontal slide, and a second vision camera; The first horizontal slide is horizontally disposed on the rear side of the turntable along the X-axis and corresponds to the position between the chip loading module and the chip limiting module. The support platform is vertically disposed on the top of the first horizontal slide, and the top of the support platform extends vertically upward to a position higher than the chip fixing seat; The second horizontal slide is horizontally disposed along the Y-axis on the upper end of the support platform corresponding to the chip mounting base, and a camera mounting base is provided on one side of the second horizontal slide. The second vision camera is mounted on the camera mount parallel to the second horizontal slide, and the second vision camera is positioned horizontally toward the chip mount; the second vision camera is used for visual positioning of the chip; The first horizontal slide is used to control the displacement of the support platform in the X-axis direction, and the second horizontal slide is used to control the displacement of the second vision camera in the Y-axis direction. Two vertical support frames are respectively provided on the worktable at the positions corresponding to the two sides of the second vision module. The two vertical support frames are arranged corresponding to each other, and the tops of the two vertical support frames are connected by a horizontal support frame parallel to the X-axis direction. A linear module along the length of the horizontal support frame is installed on the horizontal support frame near the chip mounting base.

[0015] As an improved solution, the first vision module includes: a first vision camera, a first vertical slide, a third vision camera, and a second vertical slide; The first vertical slide is mounted on the slider of the linear module along the Z-axis and corresponds to the position of the chip holder. The first vision camera is vertically disposed on the slider of the first vertical slide and is vertically disposed towards the chip holder. The lower end of the slider of the linear module is equipped with a first vertical extension plate parallel to the Z-axis direction, and the bottom of the first vertical extension plate is connected to a second horizontal extension plate parallel to the Y-axis direction at a position corresponding to one side of the first vision camera. The second horizontal extension plate has a slide mounting plate at its rear end, and the second vertical slide is installed on the slide mounting plate at an angle from top to bottom and corresponds to the position of the chip fixing seat; The third vision camera is mounted on the second vertical slide via a camera mounting bracket and is positioned parallel to the second vertical slide, with the third vision camera facing the chip mounting bracket. The linear module is used to control the displacement of the first vision camera and the third vision camera in the X-axis direction; the first vertical slide is used to control the displacement of the first vision camera in the vertical direction; the second vertical slide is used to control the displacement of the third vision camera along the length direction of the second vertical slide. Both the second and third visual cameras are used for the visual positioning of the chip.

[0016] The beneficial effects of this utility model are as follows: Based on the integrated design of the material fixing module, the first vision module, the second vision module, the chip loading module, and the chip limiting module, this utility model can realize a high-precision and highly flexible chip coupling device, which supports multi-angle stable limiting of chips and high-precision pick-up and placement of chip components. It can cooperate with the coupling process to complete high-quality and high-stability alignment control, improve the reliability and efficiency of chip production, and has strong automation performance and intelligent working capabilities. It makes up for the defects of the prior art and has high application value. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural schematic diagram of a high-precision multi-axis alignment chip coupling device based on a multi-vision module according to an embodiment of this utility model; Figure 2 yes Figure 1 Enlarged structural diagram at point A; Figure 3 yes Figure 1 Enlarged structural diagram at point B; Figure 4 This is a three-dimensional structural diagram of a high-precision multi-axis alignment chip coupling device based on a multi-vision module from another perspective in an embodiment of this utility model. Figure 5 yes Figure 4 Enlarged structural diagram at point C; Figure 6 This is a three-dimensional structural diagram of a high-precision multi-axis alignment chip coupling device based on a multi-vision module from another perspective in an embodiment of this utility model. Figure 7 yes Figure 6 Enlarged structural diagram at point D; The components in the attached diagram are labeled as follows: 1. Workbench; 2. Material fixing module; 3. First vision module; 4. Second vision module; 5. Chip loading module; 6. Chip limiting module; 7. Turntable; 8. Chip fixing seat; 9. X-direction arc-shaped electrically controlled slide; 10. Y-direction arc-shaped electrically controlled slide; 11. First cylinder; 12. Limiting gripper; 13. First horizontal electrically controlled slide; 14. First Z-direction arc-shaped electrically controlled slide; 15. Inclined extension plate; 16. First Y-axis linear module; 17. First X-axis linear module; 18. First Z-axis linear module; 19. Adsorption gun; 20. Horizontal extension plate; 21. Second X-axis linear module; 22. Second Y-axis linear module; 23. Second Z-axis linear module; 24. Second horizontal electrically controlled slide; 25. Second Z-direction arc-shaped electrically controlled slide; 26. First horizontal slide; 27. Support platform; 28. Second horizontal slide; 29. ​​Second vision camera; 30. Camera mount; 31. Vertical support frame; 32. Horizontal support frame; 33. Linear module; 34. First vision camera; 35. First vertical slide; 36. Third vision camera; 37. Second vertical slide; 38. First vertical extension plate; 39. Second horizontal extension plate; 40. Slide mounting plate; 41. Camera mounting base; 42. Camera field of view trajectory. Detailed Implementation

[0018] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the scope of protection of the present invention.

[0019] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0020] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0021] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0022] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0023] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only embodiments.

[0024] In this utility model, it should be noted that the non-arc-shaped electrically controlled slides are all micro electric fine-tuning slides driven by motors, and the arc-shaped electrically controlled slides are all two-dimensional electric arc swing tables driven by motors.

[0025] Please see Figures 1-7 The embodiments of this utility model include: A high-precision multi-axis alignment chip coupling device based on multiple vision modules includes: a worktable 1, and a material fixing module 2, a first vision module 3, a second vision module 4, a chip loading module 5, and a chip limiting module 6 disposed on the worktable 1. The material fixing module 2 is positioned at the center of the worktable 1, the first vision module 3 is positioned above the material fixing module 2, the chip loading module 5 and the chip limiting module 6 are positioned on opposite sides of the material fixing module 2, and the second vision module 4 is positioned on one side of the material fixing module 2 and between the chip loading module 5 and the chip limiting module 6. The material fixing module 2 is used to fix the chip to be processed, the first vision module 3 and the second vision module 4 are used for visual positioning support during the coupling process, the chip loading module 5 is used for adsorption and transportation of chip sub-components before coupling, and the chip limiting module 6 is used for positioning and limiting the chip to be processed on the material fixing module 2.

[0026] In one embodiment of this utility model, the material fixing module 2 consists of a turntable 7 and a first multi-angle slide group. The turntable 7 is horizontally positioned at the center of the upper surface of the worktable 1, and the central axis of the turntable 7 is vertically positioned. The first multi-angle slide group is vertically positioned on the turntable 7, and a chip fixing seat 8 is installed on the top of the first multi-angle slide group. The chip fixing seat 8 is used to place the chip to be processed. The turntable 7 can control the rotation of the first multi-angle slide group in the horizontal direction, and the rotation axis is the central axis of the turntable 7. The first multi-angle slide group can control the chip fixing seat 8 to shift at a certain angle in the X horizontal direction and the Y horizontal direction, that is, to make a slight rotation movement with the position of the chip fixing seat 8 as the horizontal central axis. Optionally, since the chip coupling process requires high-precision positioning, each module in this device is equipped with a corresponding fine-tuning component, such as the first multi-angle slide group mentioned above, which consists of an X-direction arc-shaped electrically controlled slide 9 and a Y-direction arc-shaped electrically controlled slide 10. Both slides are coaxially set with the turntable 7. The X-direction arc-shaped electrically controlled slide 9 is horizontally mounted on the upper surface of the turntable 7, and the Y-direction arc-shaped electrically controlled slide 10 is horizontally mounted on the slider of the X-direction arc-shaped electrically controlled slide 9. The chip fixing seat 8 is mounted on the slider of the Y-direction arc-shaped electrically controlled slide 10.

[0027] In one embodiment of this utility model, the chip positioning module 6 comprises a first three-way control module, a second multi-angle fine-tuning module, a first cylinder 11, and a positioning gripper 12. The first three-way control module is mounted on the worktable 1 to the left of the turntable 7. The second multi-angle fine-tuning module is mounted on one side of the movable end of the first three-way control module. The first cylinder 11 is mounted obliquely from top to bottom on the movable end of the second multi-angle fine-tuning module and is positioned higher than the chip mounting base 8. The positioning gripper 12 is mounted on the telescopic end of the first cylinder 11. The limiting gripper 12 is positioned along the extension and retraction direction of the first cylinder 11 and is positioned opposite the chip holder 8. When a chip to be processed is installed on the chip holder 8, the limiting gripper 12 extends to the wiring point of the chip to be processed under the control of the first cylinder 11 to limit its movement. The first three-axis control module is responsible for controlling the three-axis displacement of the second multi-angle fine-tuning module in the X horizontal direction, Y horizontal direction, and Z vertical direction. The second multi-angle fine-tuning module is responsible for controlling the vertical angle fine-tuning and horizontal direction fine-tuning of the first cylinder 11. Optionally, the second multi-angle fine-tuning module consists of a first horizontal electrically controlled slide 13 arranged parallel to the Y-axis direction on the first three-way control module and a first Z-direction arc-shaped electrically controlled slide 14 arranged parallel to the Z-axis direction on the slider of the first horizontal electrically controlled slide 13. An inclined extension plate 15 arranged from top to bottom is installed on one side of the upper end of the slider of the first Z-direction arc-shaped electrically controlled slide 14, and the first cylinder 11 is arranged on the inclined extension plate 15 along the length direction of the inclined extension plate 15. Optionally, the first three-axis control module consists of a first Y-axis linear module 16 horizontally mounted on the worktable 1, a first X-axis linear module 17 horizontally mounted on the slider of the first Y-axis linear module 16, and a first Z-axis linear module 18 mounted on the slider of the first X-axis linear module 17. The aforementioned first horizontal electrically controlled slide 13 is mounted on the slider of the first Z-axis linear module 18. The first Y-axis linear module 16 is positioned corresponding to the turntable 7, and the first Z-axis linear module 18 is positioned corresponding to the chip mounting base 8. Each of the above linear modules can control the components on its slider to move along its corresponding axis direction. As one embodiment of this utility model, the chip loading module 5 is composed of a second three-way control module, a third multi-angle fine-tuning module, and an adsorption gun 19. The second three-way control module is located on the other side of the turntable 7 relative to the first three-way control module. The third multi-angle fine-tuning module is located on the movable end of the first three-way control module and close to the chip fixing seat 8. A horizontal extension plate 20 is connected to the movable end of the third multi-angle fine-tuning module facing the chip fixing seat 8. A fixing hole is opened at the left end of the horizontal extension plate 20 corresponding to the position of the chip fixing seat 8. The adsorption gun 19 is vertically installed in the fixing hole. The adsorption gun 19 is used to adsorb the sub-components required by the chip during the coupling process. The third multi-angle fine-tuning module is used to control the adsorption gun 19 to make fine adjustments in the vertical angle and horizontal direction. The second three-way control module is used to control the three-axis displacement of the third multi-angle fine-tuning module in the X horizontal direction, Y horizontal direction, and Z vertical direction. Optionally, the second three-axis control module has a similar structure to the first three-axis control module, consisting of a second X-axis linear module horizontally mounted on the worktable 1, a second Y-axis linear module 22 horizontally mounted on the slider of the second X-axis linear module, and a second Z-axis linear module 23 vertically mounted on the slider of the second Y-axis linear module 22; the third multi-angle fine-tuning module is installed on the slider of the second Z-axis linear module 23; similarly, each of the above linear modules can control the components on its slider to move along its corresponding axis direction; the second X-axis linear module is set to the turntable 7, and the second Z-axis linear module 23 is set to the chip mounting base 8; Optionally, also to support high-precision fine-tuning, the third multi-angle fine-tuning module consists of a second horizontal electrically controlled slide 24 and a second Z-direction arc-shaped electrically controlled slide 25. The second horizontal electrically controlled slide 24 is mounted parallel to the Y-axis direction on the slider of the second Z-axis linear module 23, corresponding to the position of the chip holder 8. The second Z-direction arc-shaped electrically controlled slide 25 is mounted parallel to the Z-axis direction on the slider of the second horizontal electrically controlled slide 24. The aforementioned horizontal extension plate 20 is mounted on the front surface of the second Z-direction arc-shaped electrically controlled slide 25, corresponding to the position of the chip holder 8. In one embodiment of this utility model, the second vision module 4 comprises a first horizontal slide 26, a support platform 27, a second horizontal slide 28, and a second vision camera 29. The first horizontal slide 26 is positioned behind the turntable 7 along the length of the worktable 1 and corresponds to the position between the chip loading module 5 and the chip limiting module 6. The support platform 27 is vertically positioned on top of the first horizontal slide 26, with its top extending vertically upwards to a position higher than the chip mounting base 8. The second horizontal slide 28 is horizontally positioned above the chip mounting base 8 along the width of the worktable 1. A camera mounting base 30 is provided on one side of the second horizontal slide 28, and the second vision camera 29 is mounted on the camera mounting base 30 parallel to the second horizontal slide 28, with the second vision camera 29 horizontally facing the chip mounting base 8. The first horizontal slide 26 controls the displacement of the support platform 27 in the X horizontal direction, and the second horizontal slide 28 controls the displacement of the second vision camera 29 in the Y horizontal direction. As one embodiment of this utility model, two vertical support frames 31 are respectively provided on the worktables 1 on both sides of the second vision module 4. The two vertical support frames 31 are arranged corresponding to each other, and the tops of the two vertical support frames 31 are connected by a horizontal support frame 32 parallel to the X horizontal direction. A linear module 33 along the length direction of the horizontal support frame 32 is installed on the horizontal support frame 32 near the chip mounting base. In one embodiment of this utility model, the first vision module 3 comprises a first vision camera 34, a first vertical slide 35, a third vision camera 36, ​​and a second vertical slide 37. The first vertical slide 35 is mounted on the slider of the linear module 33 along the Z-axis vertical direction, corresponding to the position of the chip mounting base 8. The first vision camera 34 is vertically positioned downwards on the slider of the first vertical slide 35, and the first vision camera 34 is vertically facing the chip mounting base 8. A first vertical extension plate 38 parallel to the Z-axis direction is mounted on the lower end of the slider of the linear module 33. A second horizontal extension plate 39 parallel to the Y-axis direction is connected to the bottom of the first vertical extension plate 38 at the position corresponding to the other side of the first vision camera 34. A slide mounting plate is provided at the rear end of the second horizontal extension plate 39. 40. The second vertical slide 37 is installed at an angle from top to bottom on the slide mounting plate 40, corresponding to the position of the chip fixing seat 8. The third vision camera 36 is installed on the second vertical slide 37 through the camera mounting seat 41 and is set parallel to the second vertical slide 37. The third vision camera 36 is also set facing the chip fixing seat 8. Under the action of the linear module 33, the displacement of the first vision camera 34 and the third vision camera 36 in the X-axis direction can be controlled. The first vision camera 34 can achieve vertical displacement under the action of the first vertical slide 35, and the third vision camera 36 can achieve displacement in an inclined trajectory with a vertical deviation of about 45 degrees under the action of the second vertical slide 37. All the above displacement control is used to adapt to the corresponding visual positioning.

[0028] In one embodiment of this utility model, before operation, each displacement control component controls the components around the chip holder 8 to move away from the chip holder 8. Then, the chip to be processed is placed on the chip holder 8. The components of the chip holder 8 controlled by the displacement control components move closer to the chip holder 8. The limiting gripper 12 controls the chip on the chip holder 8 to be positioned. The first vision camera 34, the second vision camera 29 and the third vision camera 36 are controlled to align the chip to be processed. Finally, the adsorption gun 19 is controlled to adsorb the chip sub-components and place them on the chip to be processed with high precision. The chip coupling process is then carried out.

[0029] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structure made using the contents of this utility model specification and drawings, or directly or indirectly applied to other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A high-precision multi-axis alignment chip coupling device based on multiple vision modules, characterized in that, include: Workbench (1), material fixing module (2), first vision module (3), second vision module (4), chip loading module (5) and chip limiting module (6) are set on the workbench (1); The material fixing module (2) is set at the center of the workbench (1), the first vision module (3) is set above the material fixing module (2), the chip loading module (5) and the chip limiting module (6) are set at the two sides of the material fixing module (2) respectively, and the second vision module (4) is set at one side of the material fixing module (2) and between the chip loading module (5) and the chip limiting module (6). The material fixing module (2) is used to fix the chip to be processed. The first vision module (3) and the second vision module (4) are used for visual positioning support during the coupling process. The chip loading module (5) is used for adsorption and transportation of chip sub-components before coupling. The chip limiting module (6) is used to position and limit the chip to be processed on the material fixing module (2).

2. The high-precision multi-axis alignment chip coupling device based on multiple vision modules according to claim 1, characterized in that: The material fixing module (2) includes: a turntable (7) and a first multi-angle slide group; The turntable (7) is horizontally positioned at the center of the upper surface of the worktable (1). The central axis of the turntable (7) is vertically positioned. The first multi-angle slide group is vertically positioned on the turntable (7). A chip holder (8) is installed on the top of the first multi-angle slide group. The chip holder (8) is used to place the chip to be processed. The turntable (7) is used to control the first multi-angle slide group to rotate horizontally with the central axis of the turntable (7) as the rotation axis; the first multi-angle slide group is used to control the chip holder (8) to shift angles in the X-axis and Y-axis directions.

3. The high-precision multi-axis alignment chip coupling device based on multiple vision modules according to claim 2, characterized in that: The first multi-angle slide group includes: an X-direction arc-shaped electrically controlled slide (9) and a Y-direction arc-shaped electrically controlled slide (10). The X-direction arc-shaped electrically controlled slide (9) and the Y-direction arc-shaped electrically controlled slide (10) are both coaxially arranged with the turntable (7). The X-direction arc-shaped electrically controlled slide (9) is horizontally installed on the upper surface of the turntable (7). The Y-direction arc-shaped electrically controlled slide (10) is horizontally installed on the slider of the X-direction arc-shaped electrically controlled slide (9). The chip holder (8) is installed on the slider of the Y-direction arc-shaped electrically controlled slide (10). The X-direction arc-shaped electrically controlled slide (9) is used to control the Y-direction arc-shaped electrically controlled slide (10) to perform arc-shaped offset along the X-axis direction; the Y-direction arc-shaped electrically controlled slide (10) is used to control the chip holder (8) to perform arc-shaped offset along the Y-axis direction.

4. The high-precision multi-axis alignment chip coupling device based on multiple vision modules according to claim 3, characterized in that: The chip limiting module (6) includes: a first three-way control module, a second multi-angle fine-tuning module, a first cylinder (11) and a limiting gripper (12). The first three-way control module is set on the workbench (1) on one side of the turntable (7), the second multi-angle fine adjustment module is set on the movable end of the first three-way control module, and the first cylinder (11) is installed at an angle from top to bottom on the movable end of the second multi-angle fine adjustment module and is higher than the chip fixing seat (8). The limiting gripper (12) is installed on the telescopic end of the first cylinder (11) and is set along the telescopic direction of the first cylinder (11). The limiting gripper (12) is set corresponding to the chip fixing seat (8). The first cylinder (11) is used to control the limiting gripper (12) to move closer to or further away from the chip to be processed. The first three-axis control module is used to control the displacement of the second multi-angle fine-tuning module in the X-axis direction, Y-axis direction and Z-axis direction; the second multi-angle fine-tuning module is used to control the vertical angle fine-tuning and horizontal direction fine-tuning of the first cylinder (11).

5. The high-precision multi-axis alignment chip coupling device based on multiple vision modules according to claim 4, characterized in that: The second multi-angle fine-tuning module includes: a first horizontal electrically controlled slide (13) arranged parallel to the Y-axis direction on the first three-way control module and a first Z-direction arc-shaped electrically controlled slide (14) arranged parallel to the Z-axis direction on the slider of the first horizontal electrically controlled slide (13). The upper end of the slider of the first Z-direction arc-shaped electrically controlled slide (14) is equipped with an inclined extension plate (15) arranged from top to bottom, and the first cylinder (11) is arranged on the inclined extension plate (15) along the length direction of the inclined extension plate (15); The first horizontal electrically controlled slide (13) is used to control the first Z-direction arc-shaped electrically controlled slide (14) to deflect at an angle along the Y-axis; the first Z-direction arc-shaped electrically controlled slide (14) is used to control the inclined extension plate (15) to deflect at an angle along the Z-axis.

6. The high-precision multi-axis alignment chip coupling device based on multiple vision modules according to claim 5, characterized in that: The first three-way control module includes: a first Y-axis linear module (16) horizontally disposed on the worktable (1), a first X-axis linear module (17) horizontally mounted on the slider of the first Y-axis linear module (16), and a first Z-axis linear module (18) mounted on the slider of the first X-axis linear module (17). The first horizontal electrically controlled slide (13) is mounted on the slider of the first Z-axis linear module (18); the first Y-axis linear module (16) is set corresponding to the turntable (7), and the first Z-axis linear module (18) is set corresponding to the chip holder (8). The first Y-axis linear module (16) is set along the Y-axis direction, and the first Y-axis linear module (16) is used to control the first X-axis linear module (17) to move horizontally along the Y-axis direction; the first X-axis linear module (17) is used to control the first Z-axis linear module (18) to move horizontally in the X-axis direction; the first Z-axis linear module (18) is used to control the first horizontal electrically controlled slide (13) to move vertically in the Z-axis direction.

7. The high-precision multi-axis alignment chip coupling device based on multiple vision modules according to claim 6, characterized in that: The chip loading module (5) includes: a second three-way control module, a third multi-angle fine-tuning module and an adsorption gun (19). The second three-way control module is located on the other side of the turntable (7) relative to the first three-way control module. The third multi-angle fine-tuning module is located on the movable end of the first three-way control module and close to the chip mounting base (8). A horizontal extension plate (20) is connected to the movable end of the third multi-angle fine-tuning module facing the chip mounting base (8). The horizontal extension plate (20) has a fixing hole at the left end corresponding to the position of the chip fixing seat (8), and the adsorption gun (19) is vertically installed in the fixing hole; The adsorption gun (19) is used to adsorb the sub-components required by the chip during the coupling process; the third multi-angle fine-tuning module is used to control the adsorption gun (19) in vertical angle fine-tuning and horizontal fine-tuning; the second three-axis control module is used to control the three-axis displacement of the third multi-angle fine-tuning module in the X-axis direction, Y-axis direction and Z-axis direction.

8. The high-precision multi-axis alignment chip coupling device based on multiple vision modules according to claim 7, characterized in that: The second three-axis control module includes: a second X-axis linear module (21) horizontally disposed on the worktable (1), a second Y-axis linear module (22) horizontally disposed on the slider of the second X-axis linear module (21), and a second Z-axis linear module (23) vertically disposed on the slider of the second Y-axis linear module (22); the third multi-angle fine-tuning module is mounted on the slider of the second Z-axis linear module (23); the second X-axis linear module (21) is disposed corresponding to the turntable (7), and the second Z-axis linear module (23) is disposed corresponding to the chip mounting base (8); the second X-axis linear module (21) is used to control the displacement of the second Y-axis linear module (22) along the X-axis direction; the second Y-axis linear module (22) is used to control the displacement of the second Z-axis linear module (23) along the Y-axis direction; the second Z-axis linear module (23) is used to control the displacement of the third multi-angle fine-tuning module along the Z-axis direction; The third multi-angle fine-tuning module includes: a second horizontal electrically controlled slide (24) and a second Z-direction arc-shaped electrically controlled slide (25); the second horizontal electrically controlled slide (24) is mounted parallel to the Y-axis direction on the slider of the second Z-axis linear module (23) and corresponds to the position of the chip holder (8); the second Z-direction arc-shaped electrically controlled slide (25) is mounted parallel to the Z-axis direction on the slider of the second horizontal electrically controlled slide (24); the horizontal extension plate (20) is mounted on the front surface of the second Z-direction arc-shaped electrically controlled slide (25) and corresponds to the position of the chip holder (8); the second horizontal electrically controlled slide (24) is used to control the second Z-direction arc-shaped electrically controlled slide (25) to perform horizontal displacement along the Y-axis direction; the second Z-direction arc-shaped electrically controlled slide (25) is used to control the horizontal extension plate (20) to perform angular offset along the Z-axis direction.

9. The high-precision multi-axis alignment chip coupling device based on multiple vision modules according to claim 8, characterized in that: The second vision module (4) comprises: a first horizontal slide (26), a support platform (27), a second horizontal slide (28), and a second vision camera (29); The first horizontal slide (26) is horizontally arranged along the X-axis on the rear side of the turntable (7) and corresponds to the position between the chip loading module (5) and the chip limiting module (6); The support platform (27) is vertically disposed on the top of the first horizontal slide (26), and the top of the support platform (27) extends vertically upward to a position higher than the chip fixing seat (8); The second horizontal slide (28) is horizontally arranged along the Y-axis at the upper end of the support platform (27) corresponding to the chip fixing seat (8), and a camera fixing seat (30) is provided on one side of the second horizontal slide (28). The second vision camera (29) is mounted on the camera mount (30) parallel to the second horizontal slide (28), and the second vision camera (29) is positioned horizontally toward the chip mount (8); the second vision camera (29) is used for visual positioning of the chip; The first horizontal slide (26) is used to control the displacement of the support platform (27) in the X-axis direction, and the second horizontal slide (28) is used to control the displacement of the second vision camera (29) in the Y-axis direction; Two vertical support frames (31) are respectively provided on the workbench (1) at the positions corresponding to the two sides of the second vision module (4). The two vertical support frames (31) are arranged in a corresponding manner, and the tops of the two vertical support frames (31) are connected by a horizontal support frame (32) parallel to the X-axis direction. A linear module (33) along the length of the horizontal support frame (32) is installed on the horizontal support frame (32) near the chip mounting base.

10. The high-precision multi-axis alignment chip coupling device based on multiple vision modules according to claim 9, characterized in that: The first vision module (3) includes: a first vision camera (34), a first vertical slide (35), a third vision camera (36), and a second vertical slide (37); The first vertical slide (35) is mounted on the slider of the linear module (33) along the Z-axis and corresponds to the position of the chip holder (8). The first vision camera (34) is vertically downward on the slider of the first vertical slide (35) and is vertically facing the chip holder (8). The lower end of the slider of the linear module (33) is equipped with a first vertical extension plate (38) parallel to the Z-axis direction, and the bottom of the first vertical extension plate (38) is connected to a second horizontal extension plate (39) parallel to the Y-axis direction at a position corresponding to the side of the first vision camera (34). The second horizontal extension plate (39) has a slide mounting plate (40) at its rear end. The second vertical slide (37) is installed on the slide mounting plate (40) from top to bottom and corresponds to the position of the chip fixing seat (8). The third vision camera (36) is mounted on the second vertical slide (37) via a camera mounting base (41) and is positioned parallel to the second vertical slide (37). The third vision camera (36) is positioned facing the chip mounting base (8). The linear module (33) is used to control the displacement of the first vision camera (34) and the third vision camera (36) in the X-axis direction; the first vertical slide (35) is used to control the displacement of the first vision camera (34) in the vertical direction; the second vertical slide (37) is used to control the displacement of the third vision camera (36) along the length direction of the second vertical slide (37); The second visual camera (29) and the third visual camera (36) are both used for the visual positioning of the chip.

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