Modular replaceable heater assembly for semiconductor equipment

Through modular design and mechanical structure coordination, the semiconductor equipment heater can be quickly disassembled and replaced, solving the problem of difficult disassembly in existing technologies and improving maintenance efficiency.

CN224567787UActive Publication Date: 2026-07-28JIANGSU SHENZHONG INTELLIGENT MFG CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
JIANGSU SHENZHONG INTELLIGENT MFG CO LTD
Filing Date
2025-08-11
Publication Date
2026-07-28

AI Technical Summary

Technical Problem

In existing semiconductor equipment, heating devices are fixedly installed, making disassembly and replacement difficult and affecting maintenance efficiency.

Method used

The modular, replaceable heater assembly utilizes servo motors, rotary disks, actuating columns, sliding columns, moving plates, and snap-fit ​​structures to enable rapid disassembly and replacement of the heater body.

Benefits of technology

It improves the efficiency of heater disassembly and replacement, simplifies the maintenance process, and increases the operational efficiency of staff.

✦ Generated by Eureka AI based on patent content.

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Abstract

This utility model discloses a modular, replaceable heater assembly for semiconductor equipment, including a drying chamber. A sliding groove is provided on one side of the drying chamber, and a placement frame is slidably connected within the sliding groove. A sealing frame is fixedly connected to the upper surface of the drying chamber, and a sealing groove is provided on the upper surface of the sealing frame. A sealing ring is fixedly connected within the sealing groove. A gantry frame is fixedly connected to the upper surface of the drying chamber. This utility model, by incorporating a servo motor, a rotating disk, a toggle column, a sliding column, a moving column, a moving plate, a connecting frame, and a heater body, allows the servo motor to drive the rotating disk via a shaft. The rotating disk drives the toggle column to rotate, and the toggle column moves the moving column upwards via the moving groove. The moving column moves the moving plate upwards via two sliding columns, and the moving plate moves the heater body upwards via the connecting frame. This allows the heater body to detach from the interior of the drying chamber, facilitating disassembly by workers and improving work efficiency.
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Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment technology, and in particular to a modular replaceable heater assembly for semiconductor equipment. Background Technology

[0002] Semiconductor equipment is a precision instrument and device used to manufacture, process and test semiconductor devices. It is the core support of the semiconductor industry. In the semiconductor manufacturing process, materials need to be heated and dried.

[0003] However, in existing equipment, most heating devices are fixed inside the drying oven, where internal space is limited. If the heating device is damaged and needs to be replaced, it is difficult for maintenance personnel to disassemble it, which affects disassembly efficiency. Therefore, a modular replaceable heater assembly for semiconductor equipment is proposed. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a modular, replaceable heater assembly for semiconductor devices.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a modular replaceable heater assembly for semiconductor equipment, including a drying chamber, a sliding groove on one side of the drying chamber, a placement frame slidably connected in the sliding groove, a sealing frame fixedly connected to the upper surface of the drying chamber, a sealing groove on the upper surface of the sealing frame, a sealing ring fixedly connected in the sealing groove, a gantry frame fixedly connected to the upper surface of the drying chamber, two fixing components provided below the gantry frame, an L-shaped fixing plate fixedly connected to one side of the gantry frame, and a movable structure provided on the L-shaped fixing plate;

[0006] The movable structure includes a rotating shaft rotatably connected to one side of an L-shaped fixed plate, a rotating disk fixedly connected to one end of the rotating shaft, and a toggle post fixedly connected to one side of the rotating disk.

[0007] As a further description of the above technical solution:

[0008] A servo motor is fixedly connected to the other side of the L-shaped fixing plate, and the output shaft of the servo motor is fixedly connected to the other end of the rotating shaft.

[0009] As a further description of the above technical solution:

[0010] The upper surface of the gantry is slidably connected to two sliding columns, and the upper surfaces of the two sliding columns are fixedly connected to a movable column. A movable groove is provided on one side of the movable column, and the actuating column is slidably connected in the movable groove.

[0011] As a further description of the above technical solution:

[0012] The bottom of the two sliding columns is fixedly connected to a movable plate, the bottom of the movable plate is fixedly connected to a connecting frame, and the heater body is slidably connected inside the connecting frame. The heater body has snap-fit ​​holes on the opposite sides.

[0013] As a further description of the above technical solution:

[0014] The fixing component includes a fixing frame fixedly connected to one side of the connecting frame. A sliding rod is slidably connected through one side of the fixing frame. A fork is rotatably connected to one end of the sliding rod. One side of the fork is in contact with the outer side of the fixing frame.

[0015] As a further description of the above technical solution:

[0016] The other end of the sliding rod is fixedly connected to a snap-fit ​​post, which slides through and is connected to one side of the connecting frame and is adapted to the corresponding snap-fit ​​hole.

[0017] As a further description of the above technical solution:

[0018] A spring is fitted onto the sliding rod. One end of the spring is fixedly connected to the inside side of the fixed frame, and the other end is fixedly connected to one side of the snap-fit ​​post.

[0019] This utility model has the following beneficial effects:

[0020] 1. Compared with existing technologies, this modular replaceable heater assembly for semiconductor equipment, by setting up a servo motor, a rotating disk, a toggle column, a sliding column, a moving column, a moving plate, a connecting frame, and a heater body, etc., the servo motor drives the rotating disk to rotate via a rotating shaft, the rotating disk drives the toggle column to rotate, the toggle column drives the moving column to move upward via a moving slot, the moving column drives the moving plate to move via two sliding columns, and the moving plate drives the heater body to move upward via the connecting frame, so that the heater body is detached from the inside of the drying chamber, which is convenient for workers to disassemble and improves work efficiency.

[0021] 2. Compared with existing technologies, this modular replaceable heater assembly for semiconductor equipment, by setting a fixed frame, sliding rod, snap-fit ​​post, fork, and spring, etc., the fork is moved, the sliding rod moves, the sliding rod moves, the snap-fit ​​post moves, so that the snap-fit ​​post disengages from the snap-fit ​​hole and compresses the spring, which makes it convenient for workers to quickly remove the damaged heater body for replacement, thus improving replacement efficiency. Attached Figure Description

[0022] Figure 1 This is a three-dimensional structural diagram of the modular replaceable heater assembly for semiconductor equipment proposed in this utility model;

[0023] Figure 2 This is a three-dimensional structural diagram of the heater body detached from the interior of the drying oven in the modular replaceable heater assembly for semiconductor equipment proposed in this utility model.

[0024] Figure 3 This is a cross-sectional view of the drying oven for the modular replaceable heater assembly for semiconductor equipment proposed in this utility model.

[0025] Figure 4 Exploded view of the sealing frame and sealing ring of the modular replaceable heater assembly for semiconductor equipment proposed in this utility model;

[0026] Figure 5 This is a schematic diagram of the connection frame of the modular replaceable heater assembly for semiconductor equipment proposed in this utility model.

[0027] Figure 6 This invention provides an exploded view of the connection frame and heater body of a modular replaceable heater assembly for semiconductor equipment.

[0028] Figure 7 This is a schematic diagram of the fixing component of the modular replaceable heater assembly for semiconductor equipment proposed in this utility model;

[0029] Figure 8 This is an exploded view of the fixed component of the modular replaceable heater assembly for semiconductor equipment proposed in this utility model;

[0030] Figure 9 This is a schematic diagram of the movable structure of the modular replaceable heater assembly for semiconductor equipment proposed in this utility model;

[0031] Figure 10 This is an exploded view of the movable structure of the modular replaceable heater assembly for semiconductor devices proposed in this utility model.

[0032] Legend:

[0033] 1. Drying oven; 2. Sealing frame; 3. Sealing ring; 4. Gantry frame; 5. L-shaped fixing plate; 6. Moving structure; 601. Servo motor; 602. Rotary disk; 603. Actuating column; 604. Sliding column; 605. Moving column; 606. Moving plate; 607. Connecting frame; 608. Heater body; 7. Fixing components; 701. Fixing frame; 702. Sliding rod; 703. Snap-fit ​​column; 704. Fork; 705. Spring; 8. Placement frame. Detailed Implementation

[0034] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0035] Reference Figures 1 to 10 The modular replaceable heater assembly for semiconductor equipment provided by this utility model includes a drying chamber 1. A sliding groove is provided on one side of the drying chamber 1, and a placement frame 8 is slidably connected in the sliding groove. A sealing frame 2 is fixedly connected to the upper surface of the drying chamber 1. A sealing groove is provided on the upper surface of the sealing frame 2, and a sealing ring 3 is fixedly connected in the sealing groove. When the moving plate 606 is in contact with the sealing frame 2, the sealing of the sealing ring 3 helps to improve the heat preservation of the drying chamber 1. A gantry frame 4 is fixedly connected to the upper surface of the drying chamber 1. A PLC control module is fixedly installed on one side of the gantry frame 4. The PLC control module is electrically connected to the servo motor 601 to facilitate the control of the operation of the servo motor 601. Two fixing components 7 are provided below the gantry frame 4. An L-shaped fixing plate 5 is fixedly connected to one side of the gantry frame 4. A moving structure 6 is provided on the L-shaped fixing plate 5.

[0036] To achieve the purpose of movement, the moving structure 6 includes a rotating shaft rotatably connected to one side of the L-shaped fixed plate 5, a servo motor 601 fixedly connected to the other side of the L-shaped fixed plate 5, an output shaft of the servo motor 601 fixedly connected to the other end of the rotating shaft, a rotating disk 602 fixedly connected to one end of the rotating shaft, a toggle post 603 fixedly connected to one side of the rotating disk 602, two sliding posts 604 slidably connected through the upper surface of the gantry frame 4, a moving post 605 fixedly connected to the upper surface of the two sliding posts 604, a moving groove provided on one side of the moving post 605, the toggle post 603 slidably connected in the moving groove, and a moving plate 606 fixedly connected to the bottom of the two sliding posts 604. A connecting frame 607 is fixedly connected to the bottom of the movable plate 606. A heater body 608 is slidably connected inside the connecting frame 607. The heater body 608 has snap-fit ​​holes on the opposite sides. The servo motor 601 drives the rotating disk 602 to rotate through the rotating shaft. The rotating disk 602 drives the actuating column 603 to rotate. The actuating column 603 drives the moving column 605 to move upward through the moving groove. The moving column 605 drives the movable plate 606 to move through two sliding columns 604. The movable plate 606 drives the heater body 608 to move upward through the connecting frame 607, so that the heater body 608 is removed from the inside of the drying box 1, which is convenient for the staff to disassemble and improves work efficiency.

[0037] To achieve rapid assembly and disassembly, the fixing component 7 includes a fixing frame 701 fixedly connected to one side of the connecting frame 607. A sliding rod 702 is slidably connected through one side of the fixing frame 701. One end of the sliding rod 702 is rotatably connected to a fork 704. One side of the fork 704 fits against the outer side of the fixing frame 701. The other end of the sliding rod 702 is fixedly connected to a locking post 703. A spring 705 is sleeved on the sliding rod 702. One end of the spring 705 is fixedly connected to the inner side of the fixing frame 701, and the other end is fixedly connected to one side of the locking post 703. The locking post 703 is slidably connected through one side of the connecting frame 607 and is adapted to a corresponding locking hole. Moving the fork 704 causes the sliding rod 702 to move, which in turn causes the locking post 703 to move, disengaging the locking post 703 from the locking hole and compressing the spring 705. This allows workers to quickly remove the damaged heater body 608 for replacement, improving replacement efficiency.

[0038] Working principle: The servo motor 601 drives the rotating disk 602 to rotate via the rotating shaft. The rotating disk 602 drives the actuating column 603 to rotate. The actuating column 603 drives the moving column 605 to move upward via the moving slot. The moving column 605 drives the moving plate 606 to move via two sliding columns 604. The moving plate 606 drives the heater body 608 to move upward via the connecting frame 607, so that the heater body 608 is detached from the inside of the drying chamber 1, making it easier for the staff to disassemble and improving work efficiency. Then, the actuating fork 704 drives the sliding rod 702 to move. The sliding rod 702 drives the locking column 703 to move, so that the locking column 703 is disengaged from the locking hole and the spring 705 is compressed, making it easier for the staff to quickly remove the damaged heater body 608 for replacement and improving replacement efficiency.

[0039] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A modular, replaceable heater assembly for semiconductor devices, including a drying chamber (1), characterized in that: A sliding groove is provided on one side of the drying box (1), and a placement frame (8) is slidably connected in the sliding groove. A sealing frame (2) is fixedly connected to the upper surface of the drying box (1). A sealing groove is provided on the upper surface of the sealing frame (2), and a sealing ring (3) is fixedly connected in the sealing groove. A gantry frame (4) is fixedly connected to the upper surface of the drying box (1). Two fixing components (7) are provided below the gantry frame (4). An L-shaped fixing plate (5) is fixedly connected to one side of the gantry frame (4), and a moving structure (6) is provided on the L-shaped fixing plate (5). The movable structure (6) includes a rotating shaft rotatably connected to one side of the L-shaped fixed plate (5), one end of the rotating shaft is fixedly connected to a rotating disk (602), and one side of the rotating disk (602) is fixedly connected to a toggle post (603).

2. The modular, replaceable heater assembly for semiconductor devices according to claim 1, characterized in that: A servo motor (601) is fixedly connected to the other side of the L-shaped fixing plate (5), and the output shaft of the servo motor (601) is fixedly connected to the other end of the rotating shaft.

3. The modular, replaceable heater assembly for semiconductor devices according to claim 1, characterized in that: The upper surface of the gantry (4) is slidably connected to two sliding columns (604), and the upper surfaces of the two sliding columns (604) are fixedly connected to a moving column (605). A moving groove is provided on one side of the moving column (605), and the actuating column (603) is slidably connected in the moving groove.

4. The modular, replaceable heater assembly for semiconductor devices according to claim 3, characterized in that: The bottom of the two sliding columns (604) is fixedly connected to a moving plate (606), the bottom of the moving plate (606) is fixedly connected to a connecting frame (607), the heater body (608) is slidably connected inside the connecting frame (607), and the heater body (608) is provided with snap-fit ​​holes on the opposite sides.

5. The modular, replaceable heater assembly for semiconductor devices according to claim 4, characterized in that: The fixing component (7) includes a fixing frame (701) fixedly connected to one side of the connecting frame (607). A sliding rod (702) is slidably connected through one side of the fixing frame (701). A fork (704) is rotatably connected to one end of the sliding rod (702). One side of the fork (704) is in contact with the outer side of the fixing frame (701).

6. The modular, replaceable heater assembly for semiconductor devices according to claim 5, characterized in that: The other end of the sliding rod (702) is fixedly connected to a snap-fit ​​post (703), which is slidably connected through the connecting frame (607) on one side and is adapted to the corresponding snap-fit ​​hole.

7. The modular, replaceable heater assembly for semiconductor devices according to claim 6, characterized in that: A spring (705) is fitted on the sliding rod (702). One end of the spring (705) is fixedly connected to one side of the inside of the fixed frame (701), and the other end is fixedly connected to one side of the snap-fit ​​post (703).