Backlight module and display device

Abstract

The application provides a backlight module and a display device. The backlight module comprises a back plate, a lamp plate, a reflecting component and a diffusion plate. The lamp plate is arranged on the back plate. The lamp plate comprises a substrate and a light source arranged on the substrate. The diffusion plate covers the lamp plate and is fixed on the back plate and arranged in a spaced manner with the lamp plate. The upper surface of the substrate is flush with the bottom surface of the back plate. Specifically, the upper surface of the substrate is flush with the part of the bottom surface of the back plate which is not covered by the lamp plate. The upper surface of the substrate and the bottom surface of the back plate are provided with the reflecting component. After the lamp plate is arranged in the back plate, the bottom surface of the back plate and the upper surface of the substrate are the same plane. When the influence of the reflecting component is not considered, the actual height of the cavity of the backlight module is equal to the OD value. The height of the cavity of the backlight module no longer includes the thickness of the substrate. Thus, the thickness of one substrate can be saved, and the thickness of the backlight module can be reduced without changing the OD value.

Description

Technical Field

[0001] This application relates to the field of MiniLED (Mini Light-Emitting Diode) technology, and in particular to a backlight module and display device. Background Technology

[0002] MiniLED display products include a backlight module and a display module located above the backlight module. To meet image quality requirements, the backlight module needs a sufficiently large OD (Optical Distance) value, i.e., a light mixing distance, to provide sufficient distance for the LEDs (Light-Emitting Diodes) to mix the light, making the image quality on the screen more uniform. Due to the requirement of light mixing distance, the OD value cannot be reduced, which restricts the thickness of the entire backlight module and prevents it from being made thinner. Utility Model Content

[0003] The purpose of this application is to provide a backlight module and a display device to reduce the thickness of the backlight module. The specific technical solution is as follows:

[0004] The first aspect of this application provides a backlight module, comprising: a back plate; a lamp plate disposed on the back plate, the lamp plate including a substrate and a light source disposed on the substrate; a reflective component disposed on the upper surface of the substrate and the bottom surface of the back plate; a diffuser plate covering the lamp plate and fixed on the back plate and spaced apart from the lamp plate; the upper surface of the lamp plate substrate is flush with the bottom surface of the inner side of the back plate.

[0005] In some embodiments, the substrate is comb-shaped, including a plurality of parallel spaced strips and a connecting portion connecting the strips. A plurality of light sources are spaced on the strips and the light sources extend to the connecting portion. At least one end of the back plate is provided with a first recess, and the remaining part of the back plate is provided with a concave support portion communicating with the first recess. The first recess and the concave support portion are used to support the lamp plate.

[0006] In some embodiments, the concave support portion is a second recessed groove, the bottom of which is used to support the strip-shaped portion; or, a strip-shaped hollow portion is provided in the middle of the back plate, the hollow portion corresponding to the guide rail groove on the side wall of the back plate, the concave support portion being the hollow portion and the guide rail groove, and the strip-shaped portion of the substrate being embedded in the hollow portion and inserted into the guide rail groove.

[0007] In some embodiments, the backlight module includes two comb-shaped lamp panels, which are arranged in a mirror image along the centerline of the long side of the back plate. The first recessed groove is provided at both ends of the long side of the back plate or at one end of the short side of the back plate.

[0008] In some embodiments, the bottom portion of the second settling tank is hollowed out; or, the bottom of the second settling tank includes two support platforms connected to the tank wall, the extending direction of the support platforms being consistent with the length direction of the strip-shaped portion, and the two support platforms being hollowed out.

[0009] In some embodiments, the width of the support platform is greater than or equal to 0.5 mm.

[0010] In some embodiments, the portion of the back plate located between the adjacent first sink and the adjacent second sink is a horizontal portion, and the connection between the horizontal portion and the first sink and the second sink is chamfered, and the substrate is chamfered at the position corresponding to its assembly.

[0011] In some embodiments, the depth of the guide rail groove is 0.1mm-0.3mm.

[0012] In some embodiments, the width of the strip portion and the width of the interval between the strip portions satisfy the following relationship: m = 2a + b, where a is the width of the strip portion in mm, b is a constant greater than 0, and m is the width of the interval.

[0013] In some embodiments, the thickness of the substrate is 0.6 to 1.0 mm, and the thickness of the backplate is 0.6 mm to 1.0 mm.

[0014] In some embodiments, the substrate includes a metal base layer, an insulating layer, and a copper layer disposed sequentially from bottom to top; or,

[0015] The substrate of the lamp panel includes, from bottom to top, a metal base layer (served by the back plate), an insulating layer, and a copper layer.

[0016] In some embodiments, the reflective component is a reflective layer coated on the bottom surface of the back plate and the upper surface of the substrate; or, the reflective component is a reflective sheet disposed on the bottom surface of the back plate and the upper surface of the substrate.

[0017] In some embodiments, the back plate is provided with a protruding structure, which is staggered from the light source and is used to support the diffuser plate.

[0018] A second aspect of this application provides a display device including the backlight module described above.

[0019] Beneficial effects of the embodiments in this application:

[0020] The backlight module and display device provided in this application embodiment have a lamp board placed inside a back plate. The bottom surface of the back plate and the upper surface of the substrate are on the same plane. Without considering the influence of the reflective component, the actual height of the cavity of the backlight module is equal to the OD value. The height of the cavity of the backlight module no longer includes the thickness of the substrate. This can save the thickness of one substrate and reduce the thickness of the backlight module without changing the OD value.

[0021] Of course, implementing any product or method of this application does not necessarily require achieving all of the advantages described above at the same time. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other embodiments can be obtained based on these drawings.

[0023] Figure 1 A schematic diagram of the structure of the backlight module provided in one embodiment of this application;

[0024] Figure 2a A schematic diagram of the structure of the backplate provided in one embodiment of this application;

[0025] Figure 2b This is a schematic diagram of the structure of the light panel provided in one embodiment of the present application;

[0026] Figure 2c for Figure 2a mid back panel and Figure 2b A schematic diagram of the assembly structure of the central lamp panel in one embodiment;

[0027] Figure 2d for Figure 2a The right view;

[0028] Figure 2e for Figure 2c The right view;

[0029] Figure 3a A schematic diagram of the structure of the backplate provided in one embodiment of this application in another embodiment;

[0030] Figure 3b This is a schematic diagram of the structure of the lamp panel provided in one embodiment of the present application in another embodiment;

[0031] Figure 3c for Figure 3a mid back panel and Figure 3bA schematic diagram of the assembly structure of the central lamp panel in one embodiment;

[0032] Figure 4a A schematic diagram of the structure of the backplate provided in one embodiment of this application in yet another embodiment;

[0033] Figure 4b A schematic diagram of the structure of the lamp panel provided in another embodiment of this application;

[0034] Figure 4c for Figure 4a mid back panel and Figure 4b A schematic diagram of the assembly structure of the central lamp panel in one embodiment;

[0035] Figure 5 for Figure 2b Central light panel and Figure 3a A schematic diagram of the structure of the backplate in one embodiment;

[0036] Figure 6a A partial structural schematic diagram of the backplate provided in another embodiment of this application;

[0037] Figure 6b for Figure 6a A magnified view of a portion of the backplate;

[0038] Figure 6c for Figure 6a A partially enlarged schematic diagram of the assembled back panel and light panel;

[0039] Figure 7a A partial structural schematic diagram of the backplate provided in an embodiment of this application in another embodiment;

[0040] Figure 7b for Figure 7a A partially enlarged schematic diagram of the assembled back panel and light panel;

[0041] Figure 7c for Figure 7b Front view;

[0042] Figure 7d In order to be in Figure 7a A schematic diagram of the added protruding structure based on the embodiment;

[0043] Figure 8 This is a schematic diagram of the structure of the lamp panel integrated into the bottom of the back panel according to an embodiment of this application;

[0044] Figure 9 for Figure 8 A schematic diagram of the layer structure of the central lamp panel in one embodiment;

[0045] Figure 10 for Figure 8A schematic diagram of a partial layer structure of the central lamp panel in another embodiment.

[0046] The attached figures are labeled as follows:

[0047] Back plate 1; bottom surface 1a; first recessed groove 11; second recessed groove 12; groove wall 121; groove bottom 122; support platform 1221; hollow part 13; horizontal part 14; guide rail groove 15; raised structure 16; edge recessed groove 17; lamp plate 2; substrate 21; upper surface 21a; metal base layer 211; insulating layer 212; copper layer 213; light source 22; strip-shaped part 23; connecting part 24; diffuser plate 3. Detailed Implementation

[0048] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art based on this application are within the scope of protection of this application.

[0049] The first aspect of this application provides a backlight module, such as... Figure 1 As shown, the backlight module can be an LED backlight module or a MiniLED backlight module, and the corresponding light source 22 can be an LED, MiniLED, or MicroLED. For example... Figure 2a , Figure 2b and Figure 2c As shown, the backlight module includes a backplate 1, a lamp plate 2, a reflective component, and a diffuser plate 3. The lamp plate 2 is disposed on the backplate 1 and includes a substrate 21 and a light source 22 disposed on the substrate 21. The diffuser plate 3 covers the lamp plate 2, is fixed on the backplate 1, and is spaced apart from the lamp plate 2. The upper surface 21a of the substrate 21 is flush with the bottom surface 1a of the backplate 1. Specifically, the substrate 21 and the backplate 1 can be integrated into one piece, or the substrate 21 can be placed on the backplate 1, with the uncovered portion of the bottom surface 1a of the backplate 1 flush with the substrate 21 (see reference). Figure 6c The upper surface 21a of the substrate 21 and the bottom surface 1a of the back plate 1 are provided with reflective components. Here, "flush" means basically flush, and the height difference between the two is within the range of process error.

[0050] After the lamp panel 2 is placed inside the back plate 1, the bottom surface 1a of the back plate 1 and the upper surface 21a of the substrate 21 are on the same plane. Without considering the influence of the reflective components, the actual height of the backlight module cavity is equal to the OD value. The height of the backlight module cavity no longer includes the thickness of the substrate 21, thus saving approximately 0.8-1.0 mm of thickness. In other words, compared to existing technologies, the actual height of the backlight module cavity is reduced by the thickness of the substrate 21, and the thickness of the backlight module can be reduced without changing the OD value.

[0051] The OD value refers to the distance from the reflective surface of the reflective component to the diffuser plate 3. The reflective component is generally set on the upper surface of the back plate 1 at the position not covered by the lamp plate 2 and on the upper surface of the lamp plate 2 at the position not covered by the light source, in order to reflect the light from the light source 22 and increase the light emitted from one side of the diffuser plate 3.

[0052] Taking OD=5 as an example, in the prior art, the height of the backlight module cavity = OD (5mm) + thickness of lamp board 2 (0.8mm / 1mm) + thickness of reflector (about 0.2mm) ≈ 6mm / 6.2mm. However, in this embodiment, after the lamp board 2 and the back plate 1 are assembled, the upper surface 21a of the substrate 21 and the bottom surface 1a of the back plate 1 are on the same plane, which can save about 0.8-1.0mm (the thickness of the lamp board 2 is about 0.8mm / 1mm), so that the actual height of the backlight module cavity is equal to the OD value, which is 5mm.

[0053] If the reflective component is made of highly reflective ink, since the coating thickness of highly reflective ink is at the micron level, the actual thickness that the backlight module can save is about 1.0-1.2mm (0.8mm / 1mm thickness of lamp board 2 + 0.2mm thickness of reflective sheet) compared with the existing technology of attaching reflective sheets.

[0054] In one feasible solution, the substrate 21 is disposed on the back plate 1, and the two are independent structures. In this embodiment, the substrate 21 includes a metal base layer 211, an insulating layer 212 and a copper layer 213 arranged sequentially from bottom to top. During installation, the metal base layer 211 is mounted on the back plate 1.

[0055] like Figure 2a , Figure 2b and Figure 2c As shown, the substrate 21 is comb-shaped, that is, the lamp panel is a comb-shaped lamp panel 2, which can also be called a harpoon plate. The substrate 21 includes a plurality of parallel and spaced strip-shaped portions 23 and connecting portions 24 connecting the strip-shaped portions 23. A plurality of light sources 22 are spaced on the strip-shaped portions 23. The light sources 22 are arranged sequentially and spaced along the extension direction of the strip-shaped portions 23 and extend to the connecting portions 24. That is to say, the light sources 22 on the connecting portions 24 are arranged in the same way as the light sources 22 on the strip-shaped portions 23. The arrangement includes the arrangement direction and the arrangement interval, both of which are the same. At least one end of the back plate 1 is provided with a first recess 11 to accommodate the connecting portion 24. The remaining part of the back plate 1 is provided with a concave support portion communicating with the first recess 11. The first recess 11 and the concave support portion are used to support the lamp panel 2.

[0056] By providing a first recessed groove 11 at the position corresponding to the connecting part 24 on the back plate 1, and providing a concave support part communicating with the first recessed groove 11 at the position corresponding to the strip part 23, after the lamp plate 2 and the back plate 1 are assembled, the upper surface 21a of the substrate 21 and the bottom surface 1a of the back plate 1 are on the same plane. The actual height of the backlight module cavity no longer needs to include the thickness of the substrate 21. Therefore, the thickness of the backlight module can be reduced by the thickness of the substrate 21.

[0057] The backlight module may include a comb-shaped lamp panel 2, such as Figure 3a , Figure 3b and Figure 3c As shown, the connecting part 24 of the comb-shaped lamp panel 2 is located at one end of the short side of the back plate 1, that is, the comb teeth of the comb-shaped lamp panel 2 are arranged longitudinally, as shown. Figure 4a , Figure 4b and Figure 4c As shown, the connecting part 24 of the comb-shaped lamp panel 2 is located at one end of the long side of the back plate 1, that is, the comb teeth of the comb-shaped lamp panel 2 are arranged horizontally.

[0058] The backlight module may also include two comb-shaped lamp panels 2, which are arranged in a mirror image along the centerline of the long side of the back panel 1, such as... Figure 2a , Figure 2b and Figure 2c As shown, the connecting parts 24 of the two comb-shaped lamp panels 2 are located at both ends of the long side of the back plate 1, and at this time, both ends of the long side of the back plate 1 are provided with a first recess 11, and the comb teeth of the two comb-shaped lamp panels 2 are arranged laterally; as Figure 5 As shown, or the connecting part 24 of the two comb-shaped lamp panels 2 is located at the same end of the short side of the back plate 1. At this time, one end of the short side of the back plate 1 is provided with a first recessed groove 11, and the comb teeth of the two comb-shaped lamp panels 2 are arranged horizontally and vertically.

[0059] The comb-shaped light panels 2 are spliced ​​to cover the bottom surface of the back panel 1. Each comb-shaped light panel 2 can be used as a standard part. When the size of the back panel 1 changes, the required size of the light panel can be obtained by splicing the comb-shaped light panels 2, thereby reducing manufacturing costs.

[0060] Of course, as the size of the back panel 1 changes, the number of comb-shaped light panels 2 used for splicing also varies. There can be two or more comb-shaped light panels 2. When the number of comb-shaped light panels 2 is odd, the back panel 1 is generally long and narrow, and the connecting part 24 of the comb-shaped light panels 2 used for splicing is preferably located at one end of the short side of the back panel 1. When the number of comb-shaped light panels 2 is even, depending on the shape of the back panel 1, the comb-shaped light panels 2 can be arranged longitudinally in one or two rows. When arranged in two rows, the two rows are mirror-symmetrical about the splicing line, and the connecting part 24 is located at one end of the short side. Alternatively, they can be arranged transversely in one or two rows. When arranged in two rows, the two rows are mirror-symmetrical about the splicing line, and the connecting part 24 is located at one end of the long side.

[0061] The strips 23 of the comb-shaped light board 2 are arranged in parallel intervals. The intervals can save some PCB material, so compared with the light board 2 designed on the whole surface, the cost of the light board 2 can be saved.

[0062] To intuitively understand the cost savings of the lamp panel 2, a 34-inch display product is used as an example. The outer contour of the lamp panel 2 is 800mm × 340mm, with 2304 LEDs distributed in a 72×32 pattern. This means the x-pitch (length) is 11.1mm and the y-pitch is 10.5mm. The x-pitch is the spacing between the LEDs along the extension direction of the strip 23, and the y-pitch is... The pitch refers to the spacing between LED beads between adjacent strip sections 23. The width of strip section 23 is 3mm, and the width of the cutout section 13 of the lamp board 2 is 7.5mm. A 100mm margin is reserved at the top of the comb-shaped lamp board 2 for arranging electronic components. If arranged horizontally, i.e., the extension direction of strip section 23 is consistent with the long side direction of back plate 1, the PCB board area can be saved by 51.3%, calculated as: 7.5 × 31 × 600 / (800 × 340) ≈ 51.3%. If arranged vertically, i.e., the extension direction of strip section 23 is consistent with the short side direction of back plate 1, the PCB board area can be saved by 46.98%, calculated as: 71 × 7.5 × 240 / (800 × 340) ≈ 46.98%. This is an example; the percentage of PCB board area saved varies depending on the actual design.

[0063] By improving lamp board 2 and adopting a comb-shaped lamp board, the cost of the backlight module can be reduced, thereby lowering the cost of MiniLED products. This is of great significance for the popularization of MiniLED products. MiniLED technology, with its high resolution, precise light control, and rich color performance, is being widely used in many fields. However, the complex manufacturing process of MiniLEDs, especially the need for a large number of LED chips and precise backlight control, has historically resulted in high manufacturing costs and relatively expensive final products, affecting its market penetration rate.

[0064] In one embodiment, the concave support portion is a second sink 12 that communicates with the first sink 11, and the bottom of the second sink 12 is used to support the strip portion 23.

[0065] for Figures 2a-5 In the illustrated embodiment, the bottom 122 of the second recessed groove 12 of the back plate 1 can be a groove bottom 122 without any perforations, or a groove bottom 122 with partial perforations, or the second recessed groove 12 can be replaced by a perforated portion 13, such as... Figure 7a , Figure 7b , Figure 7c As shown in the image.

[0066] For the comb-shaped lamp panel 2, the width of the strip portion 23 and the width of the interval between the strip portions 23 can satisfy the following relationship: m = 2a + b, where a is the width of the strip portion 23 in mm, b is a constant greater than 0, and m is the width of the interval. For example, the width of the strip portion 23 can be 3 mm, and the width of the interval can be 7.5 mm. The width of the strip portion 23 and the width of the interval between the strip portions 23 are related to the size of the substrate 21 and the number of light sources 22.

[0067] As a specific embodiment, such as Figure 2a , Figure 3a and Figure 4a As shown, the portions for accommodating the connecting portion 24 and the portions for accommodating the strip-shaped portion 23 are respectively the first recess 11 and the second recess 12, and the depths of the first recess 11 and the second recess 12 are equal to the thickness of the substrate 21. In this way, after assembling the lamp plate 2 and the back plate 1, the bottom surface 1a of the back plate 1 and the upper surface of the lamp plate 2 are on the same plane, and the actual height of the cavity of the backlight module is reduced by the thickness of the substrate 21. Under the condition of a certain OD value, the thickness of the backlight module can be reduced.

[0068] Furthermore, the first sink 11 and the second sink 12 can be formed by stamping, which increases the overall strength of the back plate 1. Due to the increased overall strength of the back plate 1, the thickness of the back plate 1 can be further reduced. For example, the thickness of the back plate 1 can be reduced from the original 1mm to 0.6mm or even lower, and the thickness of the substrate 21 can be reduced to 0.6mm.

[0069] Optionally, the thickness of the substrate 21 is 0.6 to 1.0 mm, and the thickness of the back plate 1 is 0.6 mm to 1.0 mm.

[0070] In addition, such as Figure 2d and Figure 2e As shown, the bottom periphery of the back plate 1 is provided with an edge groove 17. The depth of the edge groove 17 is greater than that of the first groove 11 and the second groove 12. The edge groove 17 is provided on the basis of the first groove 11 and the second groove 12, which can further improve the strength of the back plate 1.

[0071] Therefore, by forming the groove through stamping, the thickness of the back plate 1 can be reduced, and the cost of the back plate 1 can also be reduced. Furthermore, the design of the groove increases the heat dissipation area of ​​the back plate 1, which is beneficial to the heat dissipation of the lamp board 2.

[0072] In this embodiment, the thickness of one substrate 21 is saved on the one hand, and the thickness of the back plate 1 is further reduced on the other hand. Combined, the overall backlight module can be thinned by about 1.4 to 1.6 mm, which plays an important role in the thinning design of the backlight module. Especially for MiniLED backlight modules, it greatly improves the competitiveness of the product in the market and solves the heat dissipation problem that has always plagued MiniLEDs.

[0073] Furthermore, to reduce the thickness of the backlight module, a reflective layer can be coated on the bottom surface 1a of the backplate 1 and the upper surface 21a of the substrate 21 as a reflective component. For example, highly reflective ink can be directly coated on the bottom surface 1a of the backplate 1 and the upper surface 21a of the substrate 21 to reduce light loss and improve image quality. This eliminates the need for a reflective sheet, and the thickness of the coated highly reflective ink can be significantly thinner than the reflective sheet, essentially negligible. Since the reflective sheet is approximately 0.2 mm thick, coating with highly reflective ink can reduce the thickness by about 0.2 mm. In addition, coating with highly reflective ink saves on the cost of the lamp board 2 compared to attaching a reflective sheet. Because the highly reflective ink is thinner and has better thermal conductivity, it also facilitates heat dissipation for the lamp board 2.

[0074] The portion of the backplate 1 located between the adjacent first recess 11 and the adjacent second recess 12 is a horizontal portion 14. The connection between the horizontal portion 14 and the first recess 11 and the second recess 12 is chamfered. The substrate 21 is chamfered at the position corresponding to its assembly. For details, please refer to [reference needed]. Figure 6a , Figure 6b As shown.

[0075] The chamfer can be a right angle or a rounded corner. Through the chamfer, the lamp panel 2 and the back panel 1 can be seamlessly connected, which makes it easy to brush high-reflective ink on the assembled back panel 1 and lamp panel 2 to replace the reflector sheet and further reduce the cost of the entire module; at the same time, it reduces the OD value of the entire module.

[0076] As another specific embodiment, such as Figure 6a , Figure 6b and Figure 6c As shown, the first sink 11 is used to accommodate the connecting part 24, and the second sink 12 is used to accommodate the strip-shaped part 23. The bottom 122 of the second sink 12 is partially hollowed out.

[0077] By partially hollowing out the bottom 122 of the second sink 12, the material used for the back plate 1 can be saved, reducing costs and also reducing weight. The specific shape of the hollowing out is not limited, and the remaining non-hollowed-out portion can be used to support the strip-shaped part 23.

[0078] Furthermore, such as Figure 6a , Figure 6b and Figure 6cAs shown, the bottom of the trough 122 includes two support platforms 1221 connected to the trough wall 121. The extension direction of the support platforms 1221 is consistent with the length direction of the strip-shaped portion 23, and there is a hollow space between the two support platforms 1221.

[0079] Two support platforms 1221 connected to the tank wall 121 are provided at the bottom 122 of the tank to support the strip-shaped part 23. The part between the support platforms 1221 is designed to be hollow to save the material of the back plate 1, reduce the cost, and also reduce the weight.

[0080] The width of the support platform 1221 can be greater than or equal to 0.5mm, for example, the width of the support platform 1221 can be 0.5mm, 0.6mm, 0.7mm, etc. The width of the support platform 1221 is greater than or equal to 0.5mm, which can increase the contact area with the lamp panel 2 and play a role in stable support.

[0081] In order to save on the material used for the back panel 1, the width of the support platform 1221 can be controlled to be less than 1mm. Under the premise of ensuring stable support, the area of ​​the cutout should be increased as much as possible to save on the material used for the back panel 1.

[0082] Taking a 34-inch display product as an example, the outer contour of the lamp board 2 is 800×340mm, with 2304 LEDs distributed in a 72*32 pattern, i.e., x-pitch = 11.1mm and y-pitch = 10.5mm. The width of the strip-shaped section 23 is 3mm, and the width of the interval between the strip-shaped sections 23 is 7.5mm, arranged horizontally. The width of the support platform 1221 supporting the comb-shaped lamp board 2 is 0.5mm, i.e., the width of the cutout section 13 is 2mm. A 100mm margin is reserved at the top of the comb-shaped board for arranging electronic components. After conversion, the PCB board area can be saved by 51.3%, and the area saved at the corresponding cutout position of the back plate 1 is 13.7%. The calculation formula is 2×31×600 / (800×340)≈13.7%. This is an example for illustration; the ratio of PCB board material and back plate 1 material area saved will vary depending on the actual design.

[0083] In this embodiment, to further reduce the thickness of the backlight module, a reflective layer, such as a highly reflective ink, can be coated on the bottom surface 1a of the backplate 1 and the upper surface 21a of the substrate 21 as a reflective layer to reduce light loss and improve image quality. This eliminates the need for a reflective sheet, as the thickness of the coated highly reflective ink is significantly thinner than the reflective sheet, essentially negligible. The reflective sheet is approximately 0.2 mm thick, thus reducing the thickness by about 0.2 mm. Furthermore, coating with highly reflective ink saves on the cost of the lamp board 2 compared to attaching a reflective sheet. The thinner thickness and better thermal conductivity of the highly reflective ink also facilitate heat dissipation from the lamp board 2.

[0084] In another embodiment, a strip-shaped perforated portion 13 is provided in the middle of the back plate 1, and the perforated portion 13 corresponds to the guide rail groove 15 on the side wall of the back plate 1; the concave support portion consists of the strip-shaped perforated portion 13 and the guide rail groove 15. Figure 7a , Figure 7b and Figure 7c As shown, the first recess 11 is used to accommodate the connecting part 24, and the hollow part 13 and the guide rail groove 15 are used to accommodate the strip-shaped part 23. The strip-shaped part of the substrate 21 is embedded in the hollow part 13 and inserted into the guide rail groove 15.

[0085] In this embodiment, during assembly, the front end of the strip-shaped part 23 is first embedded into the guide rail groove 15, and then slid along the guide rail groove 15 to complete the assembly of the strip-shaped part 23 and the back plate 1. The guide rail groove 15 can play a guiding role during installation, and after assembly, it can support the strip-shaped part 23 and limit the strip-shaped part 23 along the thickness direction to ensure the connection stability between the lamp plate 2 and the back plate 1.

[0086] Furthermore, since both sides of the strip-shaped portion 23 are embedded in the guide rail groove 15, after the comb-shaped lamp plate 2 is installed, there is no need to apply glue for fixation or attach adhesive backing, which can prevent the plate from warping and affecting image quality. At the same time, it can also save material and labor costs. The assembly diagram is as follows. Figure 7b , Figure 7c There is a slight difference between the upper surface of the lamp panel 2 and the back panel 1. A reflective sheet can be attached to the upper surface to compensate for this difference. The reflective sheet can recycle light, thereby improving image quality. The bottom surface 1a of the back panel 1 can be coated with a reflective layer, such as a highly reflective ink. By attaching a reflective sheet to the upper surface of the substrate 21 and coating the surface of the back panel 1 with a reflective layer, the upper surface of the lamp panel 2 and the bottom surface 1a of the back panel 1 can be kept flush, which helps to reduce the thickness of the backlight module.

[0087] The depth of the guide rail groove 15 can be set to 0.1mm-0.3mm, which can further increase the hollow area of ​​the back plate 1 and reduce costs.

[0088] For the design with a hollowed-out section 13 and a guide rail groove 15, such as Figure 7d As shown, a protruding structure 16 can be provided near the hollowed-out part 13, and the protruding structure 16 is used to support the diffuser plate 3.

[0089] The presence of the cutout 13 on the back plate 1 facilitates the creation of a raised structure 16 on the back plate 1. This raised structure 16 can replace the support pins required for assembling the backlight module. There are no restrictions on the shape of the raised structure 16; any structure that is wider at the bottom and narrower at the top is acceptable. Furthermore, this raised structure 16 eliminates the need for the original support pins, allows for unlimited quantity, and does not increase costs, significantly reducing the material cost of the backlight module and enhancing the product's market competitiveness.

[0090] It is understandable that, in the embodiment of setting the second sink 12, a protruding structure 16 can also be set on the back plate 1. The protruding structure 16 can be set at the position corresponding to the interval between the back plate 1 and the two adjacent strips 23, that is, on the horizontal part 14 between the adjacent second sink 12.

[0091] In another feasible solution, such as Figure 8 As shown, the substrate 21 includes a metal base layer 211 (served by a backplate 1), an insulating layer 212, and a copper layer 213, arranged sequentially from bottom to top. In this embodiment, the metal base layer 211 of the substrate 21 is replaced by the backplate 1. Compared to a scheme where the substrate 21 and the backplate 1 exist independently, this is equivalent to saving one layer of metal base layer 211, which is beneficial for reducing the thickness of the backlight module. Furthermore, the integration of the substrate 21 and the backplate 1 into one unit also helps to reduce costs.

[0092] Currently, the material of the backplate 1 is generally SECC (Steel Electrolytic Cold Commercial), SGCC (Hot Dip Galvanized Steel), SGLC (Hot Dip Galvanized Aluminum Alloy), or aluminum backplate 1, all of which are conductive. Therefore, other layers of the substrate 21 can be fabricated on the basis of the backplate 1, thereby integrating the substrate 21 and the backplate 1 into one.

[0093] The substrate 21 can be fabricated according to the structure of the aluminum substrate 21, such as... Figure 9 As shown, the backplate 1 serves as a metal base layer 211. A thermally conductive insulating layer 212 is pressed onto the inner surface of the backplate 1. A copper layer 213 is then covered on top of this insulating layer 212. This copper layer 213 forms a printed circuit and connects the various components.

[0094] Alternatively, it can be manufactured according to the FR-4 structure, such as Figure 10 As shown, the backplate 1 serves as a metal base layer 211. First, a copper layer 213 is applied to the backplate 1, followed by a layer of glass cloth as an insulating layer 212, and finally, another copper layer 213 is applied to the top layer. Classified by substrate type, FR-4 belongs to the flame-retardant copper-clad laminate modified epoxy glass fiber cloth laminate category. It is a type of substrate 21 that uses epoxy resin as an adhesive and electronic-grade glass fiber cloth as a reinforcing material. Its adhesive sheet and inner core thin copper-clad laminate are important substrates for manufacturing multilayer printed circuit boards.

[0095] The above two schemes are only illustrated with substrate 21 as a single-layer board. Substrate 21 can be a multi-layer board. A multi-layer board is based on a single layer, that is, on top of the current copper layer 213, an insulating layer 212 and another copper layer 213 are added. Each additional insulating layer 212 and copper layer adds another layer, and so on. Whether it is aluminum substrate 21 or FR-4, the final circuit is made according to the conventional lamp board 2, using the pattern transfer principle to create the inner layer circuit. The process is as follows: material cutting, pretreatment → lamination → exposure → development → etching → film removal → punching. After the circuit is cleaned, the back plate 1 is stamped and formed, and finally, white ink or high-reflective ink is applied.

[0096] For this solution, the back plate 1 can also be provided with a raised structure 16 between two adjacent columns of light sources 22, and the diffuser plate 3 is supported by the raised structure 16. It should be noted that the two columns refer to the two columns in the direction where the distance between the light sources 22 is larger.

[0097] It should be noted that in the above embodiments, the reflective component may also be a reflective sheet disposed on the bottom surface 1a of the back plate 1 and the upper surface 21a of the substrate 21. The reflective sheet may be bonded to the bottom surface 1a of the back plate 1 and the upper surface 21a of the substrate 21.

[0098] A second aspect of this application provides a display device including the backlight module described above. In the backlight module of the display device, after the lamp plate 2 is placed inside the back plate 1, the upper surface of the lamp plate 2 and the bottom surface 1a of the back plate 1 are on the same plane. Without considering the influence of the reflective sheet, the actual height of the cavity of the backlight module is equal to the OD value, and the height of the cavity no longer includes the thickness of the substrate 21, thus saving approximately 1-1.2 mm of thickness. In other words, compared with the prior art, the actual height of the cavity of the backlight module is reduced by the thickness of the substrate 21, and the thickness of the backlight module can be reduced without changing the OD value.

[0099] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0100] The various embodiments in this specification are described in a related manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.

[0101] The above description is merely a preferred embodiment of this application and is not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application are included within the scope of protection of this application.

Claims

1. A backlight module, characterized in that, include: Back panel; A light panel is disposed on the back plate, the light panel including a substrate and a light source disposed on the substrate; A reflective component is disposed on the upper surface of the substrate and the bottom surface of the back plate; A diffuser plate covers the lamp panel and is fixed to the back plate and spaced apart from the lamp panel; The upper surface of the lamp board substrate is flush with the bottom surface of the inner side of the back plate.

2. The backlight module according to claim 1, characterized in that, The substrate is comb-shaped, including multiple parallel spaced strips and connecting portions connecting the strips. Multiple light sources are spaced on the strips and extend to the connecting portions. At least one end of the back plate is provided with a first recessed groove, and the remaining part of the back plate is provided with a concave support portion communicating with the first recessed groove. The first recessed groove and the concave support portion are used to support the lamp plate.

3. The backlight module according to claim 2, characterized in that, The concave support portion is a second sink groove, and the bottom of the second sink groove is used to support the strip-shaped portion; or, The back plate has a strip-shaped cutout in the middle, which corresponds to the guide rail groove on the side wall of the back plate. The concave support part is the cutout and the guide rail groove. The strip-shaped part of the substrate is embedded in the cutout and inserted into the guide rail groove.

4. The backlight module according to claim 2, characterized in that, The backlight module includes two comb-shaped light panels, which are arranged in a mirror image along the center line of the long side of the back plate. The first recessed groove is provided at both ends of the long side of the back plate or at one end of the short side of the back plate.

5. The backlight module according to claim 3, characterized in that, The bottom of the second settling tank is hollowed out; or, The bottom of the second settling tank includes two support platforms connected to the tank wall. The extension direction of the support platforms is consistent with the length direction of the strip-shaped portion, and there is a hollow space between the two support platforms.

6. The backlight module according to claim 5, characterized in that, The width of the support platform is greater than or equal to 0.5 mm.

7. The backlight module according to claim 3, characterized in that, The portion of the back plate located between the adjacent first sink and the adjacent second sink is a horizontal portion. The connection between the horizontal portion and the first sink and the second sink is chamfered. The substrate is chamfered at the position corresponding to its assembly.

8. The backlight module according to claim 3, characterized in that, The depth of the guide rail groove is 0.1mm-0.3mm.

9. The backlight module according to claim 2, characterized in that, The width of the strip portion and the width of the interval between the strip portions satisfy the following relationship: m = 2a + b, where a is the width of the strip portion in mm, b is a constant greater than 0, and m is the width of the interval.

10. The backlight module according to any one of claims 2-9, characterized in that, The thickness of the substrate is 0.6 to 1.0 mm, and the thickness of the back plate is 0.6 to 1.0 mm.

11. The backlight module according to any one of claims 1-9, characterized in that, The substrate comprises a metal base layer, an insulating layer, and a copper layer arranged sequentially from bottom to top; or, The substrate of the lamp panel includes, from bottom to top, a metal base layer (served by the back plate), an insulating layer, and a copper layer.

12. The backlight module according to any one of claims 1-9, characterized in that, The reflective component is a reflective layer coated on the bottom surface of the back plate and the upper surface of the substrate; or, The reflective component is a reflective sheet disposed on the bottom surface of the back plate and the upper surface of the substrate.

13. The backlight module according to any one of claims 1-9, characterized in that, The back plate is provided with a raised structure, which is staggered from the light source and is used to support the diffuser plate.

14. A display device, characterized in that, Includes the backlight module according to any one of claims 1-13.

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