Heat dissipation structure and electronic device

Abstract

The present disclosure provides a heat dissipation structure and an electronic device, which can include: a heat dissipation module for covering a first electronic device, a part of the heat dissipation module extending in a direction away from the heat dissipation module to form an extension part for covering a second electronic device; and an air outlet assembly provided with an air inlet, a first air outlet, and an air outlet element between the air inlet and the first air outlet, the first air outlet being opposite to the heat dissipation module, and a target part of the air outlet assembly having a heat conduction property and being stacked on a side of the extension part away from the second electronic device.

Description

Technical Field

[0001] This disclosure relates to the field of electronic equipment technology, and in particular to a heat dissipation structure and electronic equipment. Background Technology

[0002] In electronic devices, heat dissipation modules cool core components, enabling compact design of electronic devices.

[0003] However, non-core components also generate heat during operation. Adding separate heat dissipation modules to these non-core components would increase the system size and complexity of electronic devices, thus violating the concept of compact design. Utility Model Content

[0004] This disclosure provides a heat dissipation structure and an electronic device, the technical solution of which is as follows:

[0005] In a first aspect, this disclosure provides a heat dissipation structure, which may include: a heat dissipation module and an air outlet assembly. The heat dissipation module is used to cover a first electronic device, and a portion of the heat dissipation module extends away from the heat dissipation module to form an extension portion, which is used to cover a second electronic device. The air outlet assembly is provided with an air inlet, a first air outlet, and an air outlet component located between the air inlet and the first air outlet. The first air outlet is opposite to the heat dissipation module, and the target portion of the air outlet assembly has thermal conductivity and is stacked on the side of the extension portion facing away from the second electronic device.

[0006] In some embodiments, the air outlet assembly is further provided with a second air outlet, and the outer casing of the air outlet assembly adjacent to the second air outlet is made of metal to form the target portion.

[0007] In some embodiments, the heat dissipation structure may further include: a first heat-conducting element, which is made of a flexible material and sandwiched between the second electronic device and the extension, wherein the first heat-conducting element is capable of heat exchange with the second electronic device.

[0008] In some embodiments, the heat dissipation structure may further include: a second heat-conducting element, which is made of a flexible material and sandwiched between the extension and the target portion, and the second heat-conducting element is capable of heat exchange with the extension.

[0009] In some embodiments, the first heat-conducting element, the extension, and the second heat-conducting element are all plate-shaped and stacked sequentially.

[0010] In some embodiments, the extension portion is provided with a plurality of protrusions on the surface of the second heat-conducting element, and the height of the plurality of protrusions satisfies the condition of consistency.

[0011] In some embodiments, the protrusions are strip-shaped, and the plurality of protrusions are evenly distributed and parallel to each other.

[0012] In some embodiments, the outer surface of the air outlet assembly extends with a first limiting portion; the extension portion is partially exposed and provided with a second limiting portion, the second limiting portion engaging with the first limiting portion.

[0013] In some embodiments, the thickness of the heat dissipation module and the thickness of the air outlet assembly are consistent.

[0014] In a second aspect, this disclosure provides an electronic device, which may include: a housing and a heat dissipation structure, wherein a first electronic device and a second electronic device are disposed inside the housing; the heat dissipation structure may include: a heat dissipation module and an air outlet assembly, wherein the heat dissipation module is used to cover the first electronic device, and at least a portion of the heat dissipation module extends in a direction away from the heat dissipation module to form an extension portion, the extension portion being used to cover the second electronic device; the air outlet assembly is provided with an air inlet, a first air outlet, and an air outlet component located between the air inlet and the first air outlet, wherein the first air outlet is opposite to the heat dissipation module, and a target portion of the air outlet assembly has thermal conductivity and is stacked on the side of the extension portion facing away from the second electronic device.

[0015] The above description is only an overview of the technical solution disclosed herein. In order to better understand the technical means of this disclosure and to implement it in accordance with the contents of the specification, the preferred embodiments of this disclosure are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in this disclosure or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 A partial structural diagram of the electronic device provided in this disclosure Figure 1 ;

[0018] Figure 2 This is a partial exploded view of the electronic device provided in this disclosure;

[0019] Figure 3 A partial structural diagram of the electronic device provided in this disclosure Figure 2 ;

[0020] Figure 4This is a partial cross-sectional structural diagram of the electronic device provided in this disclosure.

[0021] Explanation of reference numerals in the attached figures:

[0022] 10. Heat dissipation structure; 11. Heat dissipation module; 111. Extension; 1111. Protrusion; 1112. Second limiting part; 112. First housing; 113. Heat dissipation fins; 12. Air outlet assembly; 121. Target part; 122. Air inlet; 123. First air outlet; 124. Second housing; 125. Second air outlet; 126. First limiting part; 13. First heat conduction component; 14. Second heat conduction component; 20. First electronic device; 30. Second electronic device; 40. Support plate; 100. Electronic device. Detailed Implementation

[0023] The embodiments of this disclosure will be further described in detail below with reference to the accompanying drawings and examples. The detailed description of the embodiments and the accompanying drawings are used to illustrate the principles of this disclosure by way of example, but should not be used to limit the scope of this disclosure. This disclosure can be implemented in many different forms and is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0024] These embodiments are provided to make the disclosure thorough and complete, and to fully express the scope of the disclosure to those skilled in the art. It should be noted that, unless otherwise specifically stated, the relative arrangement of components and steps, material composition, numerical expressions, and values ​​set forth in these embodiments should be interpreted as exemplary only and not as limiting.

[0025] It should be noted that, in the description of this disclosure, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientation or positional relationship, are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0026] Furthermore, the terms "first," "second," and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different parts. "Vertical" is not strictly vertical, but within the permissible margin of error. "Parallel" is not strictly parallel, but within the permissible margin of error. Terms such as "including" or "contains" mean that the element preceding the word encompasses the element listed after the word, and do not exclude the possibility of encompassing other elements as well.

[0027] It should also be noted that, in the description of this disclosure, unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this disclosure depending on the specific circumstances. When a particular device is described as being located between a first device and a second device, an intermediary device may or may not be present between the particular device and the first or second device.

[0028] All terms used in this disclosure have the same meaning as understood by one of ordinary skill in the art to which this disclosure pertains, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant art, and not as idealized or highly formalized, unless expressly defined herein.

[0029] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, they should be considered part of the specification.

[0030] In electronic devices, heat dissipation modules cool core components, enabling compact design of electronic devices.

[0031] However, non-core components also generate heat during operation. Adding separate heat dissipation modules to these non-core components would increase the system size and complexity of electronic devices, thus violating the concept of compact design.

[0032] The inventors of this disclosure have discovered that a heat dissipation structure can be designed, which may include: a heat dissipation module and an air outlet assembly. The heat dissipation module can cover a first electronic device (such as a core component) with a large unit heat dissipation, so as to conduct the heat of the first electronic device to the heat dissipation module itself and dissipate it. The heat dissipation module also extends to an extension portion, which can cover a second electronic device (such as a non-core component) with a smaller unit heat dissipation than the first electronic device, so as to conduct the heat of the second electronic device to the extension portion itself and dissipate it. The air outlet assembly can deliver airflow to the heat dissipation module to accelerate the heat dissipation efficiency of the heat dissipation module. The air outlet assembly has local thermal conductivity and is arranged opposite to the extension portion so as to conduct the heat on the extension portion to the air outlet assembly itself and dissipate it quickly with the flow of gas inside the air outlet assembly, so as to further accelerate the heat dissipation efficiency of the extension portion. In this way, the heat dissipation module and its extended portion can work with the air outlet assembly to efficiently dissipate heat from both core and non-core components. Furthermore, this design extends the local heat dissipation module to form an extension portion and works with the local air outlet assembly to have thermal conductivity, eliminating the need for an additional independent heat dissipation module. This reduces the size and complexity of the electronic equipment assembled with the heat dissipation structure.

[0033] First aspect

[0034] This disclosure provides a heat dissipation structure 10, see [link]. Figures 1 to 4 The heat dissipation structure 10 may include a heat dissipation module 11 and an air outlet assembly 12. The heat dissipation module 11 is used to cover the first electronic device 20. A portion of the heat dissipation module 11 extends away from the heat dissipation module 11 to form an extension 111, which is used to cover the second electronic device 30. The air outlet assembly 12 is provided with an air inlet 122, a first air outlet 123, and an air outlet component located between the air inlet 122 and the first air outlet 123. The first air outlet 123 is opposite to the heat dissipation module 11, and the target portion 121 of the air outlet assembly 12 has thermal conductivity and is stacked on the side of the extension 111 facing away from the second electronic device 30.

[0035] The heat dissipation structure 10 is installed inside electronic devices 100 such as laptops, mainframes, and servers.

[0036] The heat dissipation module 11 covers the first electronic device 20 (such as a central processing unit, motherboard, or other core components) to facilitate heat exchange with it. A portion of the module extends away from the heat dissipation module 11 to form an extension 111, which covers the second electronic device 30 (such as a memory card or other non-core components) to facilitate heat exchange. Thus, the heat dissipation module 11 and the extension 111 can simultaneously exchange heat with both the first and second electronic devices 20. The heat dissipation module 11 covering the first electronic device 20 can be either attached to one side of the device or have a first gap between it and the device. A small first gap does not affect the heat exchange efficiency between the heat dissipation module 11 and the first electronic device 20. A portion of the heat dissipation module 11 can extend away from the heat dissipation module 11 by splicing, bonding, or integral molding, forming an extension portion 111. The extension portion 111 covers the second electronic device 30, and can be attached to one side of the second electronic device 30, or it can have a second gap with the second electronic device 30. The second gap is small and does not affect the heat exchange efficiency between the extension portion 111 and the second electronic device 30. The heat dissipation module 11 may include a first housing 112 and multiple heat dissipation fins 113. The multiple heat dissipation fins 113 are arranged parallel to each other in the first housing 112 and maintain a certain distance from each other to increase the contact area between the heat dissipation module 11 and the air, thereby improving the heat dissipation efficiency of the heat dissipation module 11. The extension portion 111 can be in the form of a heat spreader, heat pipe, etc.

[0037] The air outlet assembly 12 has a first air outlet 123 that is opposite to one end of one of the multiple heat dissipation fins 113 of the heat dissipation module 11. This allows the accelerated airflow from the air outlet component to be transported through the first air outlet 123 to one end of the multiple heat dissipation fins 113, thereby quickly dissipating the heat from the multiple heat dissipation fins 113 to the other end, thus accelerating the reduction of the temperature of the heat dissipation fins 113 and further improving the heat exchange efficiency between the heat dissipation module 11 and the first electronic device 20. The air outlet component can be a fan blade that can rotate and generate airflow, or other structures that can move and generate airflow. The air outlet assembly 12 can be a second housing 124, and the air outlet component can be disposed inside the second housing 124. The second housing 124 can have an air inlet 122 and a first air outlet 123 that are interconnected. When the air outlet component delivers airflow into the second housing 124, the gas entering the second housing 124 through the air inlet 122 can be accelerated and discharged through the first air outlet 123 under the action of the airflow delivered by the air outlet component.

[0038] In one example, a laptop computer has a heat dissipation structure 10, see [reference needed]. Figures 1 to 4The heat dissipation structure 10 may include a heat dissipation module 11 and an air outlet assembly 12. The heat dissipation module 11 is used to attach to a first electronic device 20 to cover the first electronic device 20 (such as a central processing unit, motherboard, or other core components). A portion of the heat dissipation module 11 extends away from the heat dissipation module 11 and forms a plate-shaped extension 111. The extension 111 is used to attach to a second electronic device 30 to cover the second electronic device 30 (such as a memory card or other non-core components). The surface of the heat dissipation module 11 covering the first electronic device 20 and the surface of the extension 111 covering the second electronic device 30 are on the same plane. The air outlet assembly 12 is provided with an air inlet 122, a first air outlet 123, and an air outlet component located between the air inlet 122 and the first air outlet 123. The first air outlet 123 is opposite to the heat dissipation module 11. The air outlet component is a fan blade that can rotate to output airflow. The target portion 121 of the air outlet assembly 12 has thermal conductivity and is stacked on the side of the extension 111 facing away from the second electronic device 30.

[0039] In this embodiment, the heat dissipation structure 10 may include a heat dissipation module 11 and an air outlet assembly 12. The heat dissipation module 11 and an extension 111 extending from the heat dissipation module 11 may respectively cover the first electronic device 20 and the second electronic device 30. The first air outlet 123 of the air outlet assembly 12 is opposite to the heat dissipation module 11, and a portion of the air outlet assembly 12 has thermal conductivity and is stacked with the extension 111. During operation, the heat generated by the first electronic device 20 can be conducted to the heat dissipation module 11, and the heat generated by the second electronic device 30 can be conducted to the extension 111. The airflow generated by the air outlet assembly 12 is delivered to the first air outlet 123. The heat dissipation module 11 drives the heat dissipation module 11 to dissipate heat quickly, thereby improving the heat exchange efficiency between the heat dissipation module 11 and the first electronic device 20, and thus improving the heat dissipation efficiency of the first electronic device 20. At the same time, the target portion 121 of the air outlet assembly 12 has thermal conductivity and is stacked with the extension portion 111 on the side opposite to the second electronic device 30 so that it can exchange heat with the second electronic device 30. Under the action of the airflow generated by the air outlet assembly 12, the heat conducted from the extension portion 111 to the target portion 121 can be quickly dissipated, thereby improving the heat exchange efficiency between the second electronic device 30 and the extension portion 111, and thus improving the heat dissipation efficiency of the second electronic device 30. Thus, the heat dissipation module 11 and its extended portion 111 can work with the air outlet assembly 12 to efficiently dissipate heat from both core components (such as the first electronic device 20) and non-core components (such as the second electronic device 30). This design extends the local heat dissipation module 11 to form an extension and works with the local air outlet assembly 12 to have thermal conductivity, so that there is no need to add an additional independent heat dissipation module 11, thereby reducing the size and complexity of the electronic device 100 assembled in the heat dissipation structure 10.

[0040] In some embodiments, see Figure 1 and Figure 2 The air outlet assembly 12 is also provided with a second air outlet 125, and the outer shell of the air outlet assembly 12 adjacent to the second air outlet 125 is made of metal to form the target part 121.

[0041] The airflow generated by the air outlet component of the air outlet assembly 12 can be sent to the heat dissipation module 11 through the first air outlet 123, and can also be sent out through the second air outlet 125. The outer shell of the air outlet assembly 12 corresponding to the channel of the second air outlet 125 can be made of a material with thermal conductivity such as metal, and form a target part 121. When the heat of the second electronic device 30 is conducted to the target part 121 through the extension 111, the gas flow in the target part 121 can accelerate the dissipation of heat on the target part 121, so as to accelerate the heat exchange efficiency between the extension 111 and the target part 121, thereby improving the heat dissipation efficiency of the second electronic device 30.

[0042] Among them, the second air outlet 125 can be like Figure 1 and Figure 2 The exhaust assembly 12 shown is opposite to the heat dissipation module 11, but it can also be offset from the heat dissipation module 11; this is not a limitation here. The exhaust assembly 12 can be made entirely of a material with thermal conductivity.

[0043] In some embodiments, see Figure 4 The heat dissipation structure 10 may further include: a first heat-conducting element 13, which is made of a flexible material and sandwiched between the second electronic device 30 and the extension 111. The first heat-conducting element 13 can exchange heat with the second electronic device 30.

[0044] In other words, a first heat-conducting element 13 can be sandwiched between the second electronic device 30 and the extension 111. The first heat-conducting element 13 has thermal conductivity, enabling rapid transfer of heat from the second electronic device 30 to the extension 111, thereby accelerating the heat dissipation efficiency of the second electronic device 30. Furthermore, the first heat-conducting element 13 is made of a flexible material, allowing it to adapt to the contours of the opposing surfaces of the second electronic device 30 and the extension 111 when sandwiched between them, thus fixing the second electronic device 30 and the extension 111 relatively and ensuring stable heat conduction efficiency. The first heat-conducting element 13 can be made of materials such as silicone or polyurethane.

[0045] In some embodiments, see Figure 4The heat dissipation structure 10 may further include a second heat-conducting element 14, which is made of a flexible material and sandwiched between the extension 111 and the target portion 121. The second heat-conducting element 14 is capable of heat exchange with the extension 111.

[0046] In other words, a second heat-conducting element 14 can be sandwiched between the extension 111 and the target portion 121. The second heat-conducting element 14 has thermal conductivity, enabling it to quickly conduct heat from the extension 111 to the target portion 121, thereby accelerating the heat dissipation efficiency of the extension 111. Furthermore, the second heat-conducting element 14 is made of a flexible material, allowing it to deform according to the contours of the opposing surfaces when sandwiched between the extension 111 and the target portion 121, thus fixing the extension 111 and the target portion 121 relatively and ensuring stable heat transfer efficiency. The material of the second heat-conducting element 14 can be the same as or different from that of the first heat-conducting element 13; the thickness of the second heat-conducting element 14 can also be the same as or different from that of the first heat-conducting element 13.

[0047] In some embodiments, see Figure 4 The first heat-conducting element 13, the extension 111, and the second heat-conducting element 14 are all plate-shaped and stacked sequentially. This plate-shaped, stacked arrangement results in a large contact area between the first heat-conducting element 13 and the extension 111, and between the extension 111 and the second heat-conducting element 14. A large contact area improves the heat conduction efficiency per unit time, thereby further enhancing the heat dissipation efficiency of the second electronic device 30. The thickness of the first heat-conducting element 13 and the second heat-conducting element 14 can be less than the thickness of the extension 111, enabling a thinner and lighter design for the electronic device 100.

[0048] In some embodiments, see Figures 1 to 3 The extension 111 has multiple protrusions 1111 on the surface corresponding to the second heat conductor 14, and the heights of the multiple protrusions 1111 are consistent. The multiple protrusions 1111 increase the heat dissipation area of ​​the extension 111 to the second heat conductor 14, thereby improving the heat dissipation efficiency of the extension 111 and consequently improving the heat dissipation efficiency of the second electronic device 30. Furthermore, the consistent heights of the multiple protrusions 1111 ensure stable support of the target portion 121 when connected to it via the second heat conductor 14. Here, the protrusions 1111 can be cylindrical, frustum-shaped, prismatic, or other shapes.

[0049] In some embodiments, see Figures 1 to 3The protrusions 1111 are strip-shaped, and multiple protrusions 1111 are evenly distributed and parallel to each other. The evenly distributed multiple protrusions 1111 can conduct heat uniformly, thereby reducing the generation of heat accumulation.

[0050] In some embodiments, see Figures 1 to 4 The outer surface of the air outlet assembly 12 extends with a first limiting portion 126; a second limiting portion 1112 is partially exposed and provided thereon, and the second limiting portion 1112 and the first limiting portion 126 are in concave-convex fit.

[0051] In other words, of the first limiting part 126 and the second limiting part 1112, one is provided with a groove and the other is provided with a limiting post. The limiting post can be inserted into the groove and abut against the inner wall and bottom wall of the groove, so that the first limiting part 126 and the second limiting part 1112 are relatively fixed, thereby fixing the air outlet assembly 12 where the first limiting part 126 is located and the extension 111 where the second limiting part 1112 is located. In this way, the probability of the air outlet assembly 12 and the extension 111 shaking during the shaking of the electronic device 100 can be reduced, thereby maintaining stable heat dissipation efficiency.

[0052] In some embodiments, see Figure 1 As shown, the thickness of the heat dissipation module 11 and the thickness of the air outlet assembly 12 meet the same condition. In this way, the sides of the heat dissipation module 11 and the air outlet assembly 12 facing away from the first electronic device 20 and the second electronic device 30 can be on the same plane, so as to support other structures or provide a flat mounting surface for other structures.

[0053] For example, a laptop computer has a display end and a system end that is rotatably connected to the display end. The heat dissipation structure 10 is set inside the system end. The inner surface of the shell of the system end is attached to the side of the heat dissipation module 11 and the air exhaust component 12 that is away from the first electronic device 20 and the second electronic device 30. Since the side of the heat dissipation module 11 and the air exhaust component 12 that is away from the first electronic device 20 and the second electronic device 30 can be on the same plane, the contact area between the shell of the system end and the heat dissipation module 11 and the air exhaust component 12 is large and the contact is more stable.

[0054] Second aspect

[0055] This disclosure provides an electronic device 100, see [link to previous document]. Figures 1 to 4The electronic device 100 may include: a housing and a heat dissipation structure 10, wherein a first electronic device 20 and a second electronic device 30 are disposed inside the housing; the heat dissipation structure 10 may include: a heat dissipation module 11 and an air outlet assembly 12, wherein the heat dissipation module 11 is used to cover the first electronic device 20, and at least a portion of the heat dissipation module 11 extends away from the heat dissipation module 11 to form an extension 111, the extension 111 being used to cover the second electronic device 30; the air outlet assembly 12 is provided with an air inlet 122, a first air outlet 123 and an air outlet component located between the air inlet 122 and the first air outlet 123, the first air outlet 123 being opposite to the heat dissipation module 11, and the target portion 121 of the air outlet assembly 12 having thermal conductivity and being stacked on the side of the extension 111 facing away from the second electronic device 30.

[0056] Electronic device 100 can be a laptop, host, server, etc.; the first electronic device 20 can be a core component such as a central processing unit or motherboard, and the second electronic device 30 can be a non-core component such as a memory card; electronic device 100 may also have a carrier board for support.

[0057] In this embodiment, a heat dissipation structure 10 is disposed within an electronic device 100. The heat dissipation structure 10 may include a heat dissipation module 11 and an air outlet assembly 12. The heat dissipation module 11 and an extension 111 extending from the heat dissipation module 11 may respectively cover the first electronic device 20 and the second electronic device 30. The first air outlet 123 of the air outlet assembly 12 is opposite to the heat dissipation module 11, and a portion of the air outlet assembly 12 has thermal conductivity and is stacked with the extension 111. The heat dissipation module 11 and its extension 111 can cooperate with the air outlet assembly 12 to efficiently dissipate heat from the first electronic device 20 and the second electronic device 30 simultaneously. This design extends the local heat dissipation module 11 to form an extension and cooperates with the local air outlet assembly 12 to have thermal conductivity, so that there is no need to add an additional independent heat dissipation module 11, thereby reducing the size and complexity of the electronic device 100 assembled with the heat dissipation structure 10.

[0058] It should be noted that the heat dissipation structure in the electronic device provided in this disclosure is similar to the heat dissipation structure embodiments described above, and has similar beneficial effects. For technical details not disclosed in the embodiments of the electronic device in this disclosure, please refer to the description of the heat dissipation structure embodiments in this disclosure for understanding; further details will not be repeated here.

[0059] The embodiments of this disclosure have now been described in detail. To avoid obscuring the concept of this disclosure, some details known in the art have not been described. Those skilled in the art can fully understand how to implement the technical solutions disclosed herein based on the above description.

[0060] While specific embodiments of this disclosure have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of this disclosure. Those skilled in the art should understand that modifications can be made to the above embodiments or equivalent substitutions can be made to some technical features without departing from the scope and spirit of this disclosure. In particular, as long as there is no structural conflict, the technical features mentioned in the various embodiments can be combined in any manner.

Claims

1. A heat dissipation structure, characterized in that, include: A heat dissipation module is used to cover a first electronic device, and a portion of the heat dissipation module extends in a direction away from the heat dissipation module to form an extension, the extension being used to cover a second electronic device. An air outlet assembly is provided with an air inlet, a first air outlet, and an air outlet component located between the air inlet and the first air outlet. The first air outlet is opposite to the heat dissipation module, and the target portion of the air outlet assembly has thermal conductivity and is stacked on the side of the extension facing away from the second electronic device.

2. The heat dissipation structure according to claim 1, characterized in that, The air outlet assembly is also provided with a second air outlet, and the outer shell of the air outlet assembly adjacent to the second air outlet is made of metal to form the target part.

3. The heat dissipation structure according to claim 1 or 2, characterized in that, Also includes: The first heat-conducting element is made of a flexible material and is sandwiched between the second electronic device and the extension. The first heat-conducting element is capable of exchanging heat with the second electronic device.

4. The heat dissipation structure according to claim 3, characterized in that, Also includes: The second heat-conducting element is made of a flexible material and is sandwiched between the extension and the target portion. The second heat-conducting element is capable of heat exchange with the extension.

5. The heat dissipation structure according to claim 4, characterized in that, The first heat-conducting component, the extension, and the second heat-conducting component are all plate-shaped and are stacked sequentially.

6. The heat dissipation structure according to claim 5, characterized in that, The extension portion has multiple protrusions on the surface of the second heat-conducting element, and the height of the multiple protrusions is consistent.

7. The heat dissipation structure according to claim 6, characterized in that, The protrusions are strip-shaped, and the plurality of protrusions are evenly distributed and parallel to each other.

8. The heat dissipation structure according to claim 1, characterized in that, The outer surface of the air outlet component extends with a first limiting portion; The extension is partially exposed and has a second limiting part, which is in concave-convex fit with the first limiting part.

9. The heat dissipation structure according to claim 1, characterized in that, The thickness of the heat dissipation module and the thickness of the air outlet component are consistent.

10. An electronic device, characterized in that, include: The outer casing contains a first electronic component and a second electronic component. The heat dissipation structure includes: A heat dissipation module is used to cover the first electronic device, and at least a portion of the heat dissipation module extends in a direction away from the heat dissipation module to form an extension, the extension being used to cover the second electronic device; An air outlet assembly is provided with an air inlet, a first air outlet, and an air outlet component located between the air inlet and the first air outlet. The first air outlet is opposite to the heat dissipation module, and the target portion of the air outlet assembly has thermal conductivity and is stacked on the side of the extension facing away from the second electronic device.

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