A multi-range MEMS device, sensor and smart wearable

Abstract

The application relates to the technical field of wearable devices, and discloses a multi-range MEMS device, a sensor and a smart wearable device. The multi-range MEMS device comprises a substrate, the substrate comprises at least two grooves; a diaphragm is arranged in each groove and forms a collection area at a corresponding position on the side away from each groove; and a collection element is arranged in each collection area and used for detecting the current deformation amplitude of the diaphragm in the collection area and outputting a corresponding MEMS signal. The deformation amplitude ranges of the diaphragms in the collection areas are inconsistent. Since the deformation amplitude ranges of the diaphragms on the collection areas are set to be inconsistent, different collection ranges can be supported by different collection areas in actual use, the current deformation amplitudes of the corresponding diaphragms are detected by the corresponding collection elements, and the corresponding MEMS signals are output, so that multi-range collection is realized.

Description

Technical Field

[0001] This application relates to the field of wearable device technology, and in particular to a multi-range MEMS device, sensor and smart wearable device. Background Technology

[0002] With the development of technology, smart wearable devices (such as smart bracelets and smart glasses) are rapidly integrating into daily life. From health monitoring to information acquisition, from fitness tracking to social interaction, smart wearable devices are changing the way people interact in their daily lives.

[0003] Currently, smart wearable devices generally incorporate Micro-Electro-Mechanical Systems (MEMS) sensors. These MEMS sensors acquire pressure data through their MEMS components and output MEMS signals to an Application-Specific Integrated Circuit (ASIC) chip. The ASIC chip then converts these MEMS signals into electrical signals for output. With increasing functional diversity, smart wearable devices increasingly require measurement across different ranges. For example, a larger measurement range corresponds to a wider measurement range, while a smaller range requires higher measurement accuracy. However, a single MEMS sensor typically only supports one measurement range. Therefore, enabling a single MEMS sensor to handle multiple measurement ranges is a pressing technical challenge. Utility Model Content

[0004] The main purpose of this application is to provide a multi-range MEMS device, sensor and smart wearable device, which aims to solve the technical problem that existing MEMS sensors only support the acquisition of one range.

[0005] To achieve the above objectives, this application provides a multi-range MEMS device, the multi-range MEMS device comprising:

[0006] A substrate, the substrate comprising at least two grooves;

[0007] A diaphragm is placed over each of the grooves, and a collection area is formed at a corresponding position on the side opposite to each of the grooves;

[0008] The acquisition elements are respectively located in each acquisition area, and are used to detect the current deformation amplitude of the diaphragm in the acquisition area and output the corresponding MEMS signal;

[0009] The deformation range of the membrane in each of the aforementioned collection areas is inconsistent.

[0010] In one embodiment, the size and / or thickness of the membrane in each of the collection areas are different.

[0011] In one embodiment, the multi-range MEMS device further includes: pads and metal traces;

[0012] The pad is located on the side of the diaphragm opposite to the substrate;

[0013] The metal trace is electrically connected between the acquisition element and the pad.

[0014] In one embodiment, the diaphragm includes: an insulating layer and a silicon layer;

[0015] The insulating layer is provided over each of the grooves;

[0016] The silicon layer is disposed on the side of the insulating layer away from the substrate, and a collection area is formed on the side away from the insulating layer corresponding to the positions of each of the grooves.

[0017] In one embodiment, the acquisition element includes at least two sets of resistor bridges;

[0018] Each group of resistor bridges is set up corresponding to each of the acquisition areas.

[0019] In one embodiment, the resistor bridge includes: a first resistor to a fourth resistor;

[0020] The first resistor to the fourth resistor are arranged around the periphery of the acquisition area, and the second end of the first resistor is connected to the first end of the second resistor, the second end of the second resistor is connected to the second end of the fourth resistor, the first end of the fourth resistor is connected to the second end of the third resistor, and the first end of the third resistor is connected to the first end of the first resistor.

[0021] In one embodiment, the multi-range MEMS device further includes:

[0022] A passivation layer is disposed on the side of the diaphragm opposite to the substrate.

[0023] In addition, to achieve the above objectives, this application also provides a sensor, which includes: a substrate, an ASIC chip, and a multi-range MEMS device as described above;

[0024] The ASIC chip and the multi-range MEMS device are both disposed on the substrate. The ASIC chip is provided with a detection circuit, and the detection circuit is electrically connected to the acquisition element.

[0025] The detection circuit is used to receive the MEMS signal output by the acquisition element, and to process the MEMS signal into an electrical signal corresponding to each acquisition area for output.

[0026] In one embodiment, the sensor further includes: a housing;

[0027] A cavity is formed inside the housing, the housing is sleeved on the substrate, and the ASIC chip and the multi-range MEMS device are disposed in the cavity;

[0028] The shell has ventilation holes.

[0029] In addition, to achieve the above objectives, this application also provides a smart wearable device, which includes the sensors described above.

[0030] This application provides a multi-range MEMS device, sensor, and smart wearable device. The multi-range MEMS device includes: a substrate, the substrate including at least two grooves; a diaphragm, covering each of the grooves, and forming a collection area at a corresponding position on the side opposite to each groove; and collection elements, respectively disposed in each of the collection areas, for detecting the current deformation amplitude of the diaphragm in the collection area and outputting a corresponding MEMS signal; wherein the deformation amplitude range of the diaphragm in each collection area is inconsistent.

[0031] This application has at least two grooves on a substrate, and forms corresponding acquisition areas by covering each groove with a diaphragm. Acquisition elements are set on the acquisition areas to acquire the current deformation amplitude of the diaphragm and output the corresponding MEMS signal. Since this application sets the deformation amplitude range of the diaphragm on the acquisition areas to be inconsistent, different acquisition areas can support acquisition of different ranges in actual use. The current deformation amplitude of the corresponding diaphragm is detected by the corresponding acquisition element and the corresponding MEMS signal is output, thereby realizing multi-range acquisition. Attached Figure Description

[0032] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0033] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 This is a front view of the multi-range MEMS device in the first embodiment of the multi-range MEMS device of this application;

[0035] Figure 2 This is a top view of the multi-range MEMS device in the first embodiment of the multi-range MEMS device of this application;

[0036] Figure 3This is a circuit schematic diagram of the acquisition element in the second embodiment of the multi-range MEMS device of this application;

[0037] Figure 4 This is a schematic diagram of the substrate in the second embodiment of the multi-range MEMS device of this application;

[0038] Figure 5 This is a schematic diagram of the groove in the second embodiment of the multi-range MEMS device of this application;

[0039] Figure 6 This is a bonding diagram in the second embodiment of the multi-range MEMS device of this application;

[0040] Figure 7 This is a schematic diagram of the etching process in the second embodiment of the multi-range MEMS device of this application;

[0041] Figure 8 This is a schematic diagram of the structure of the first embodiment of the sensor in this application.

[0042] Explanation of icon numbers:

[0043] 1 base 4 solder pads 11 First groove 5 Metal traces 12 Second groove 6 passivation layer 2 diaphragm 7 ASIC chips 21 Insulation layer 8 Multi-range MEMS devices 22 silicon layer 9 case 23 First diaphragm 91 Ventilation holes 24 Second diaphragm 10 substrate 3 Acquisition Element R1~R4 First to fourth resistors

[0044] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0045] It should be understood that the specific embodiments described herein are merely illustrative of the technical solutions of this application and are not intended to limit this application.

[0046] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0047] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0048] Furthermore, the use of terms such as "first" and "second" in this application is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed in this application.

[0049] Understandably, with the development of technology, smart wearable devices (such as smart bracelets and smart glasses) are rapidly integrating into daily life. From health monitoring to information acquisition, from fitness tracking to social interaction, smart wearable devices are changing the way people interact in their daily lives.

[0050] Currently, smart wearable devices generally incorporate Micro-Electro-Mechanical Systems (MEMS) sensors. These MEMS sensors acquire pressure data through their MEMS components and output MEMS signals to an Application-Specific Integrated Circuit (ASIC) chip. The ASIC chip then converts these MEMS signals into electrical signals for output. With increasing functional diversity, smart wearable devices increasingly require measurement across different ranges. For example, a larger measurement range corresponds to a wider measurement range, while a smaller range requires higher measurement accuracy. However, a single MEMS sensor typically only supports one measurement range. Therefore, enabling a single MEMS sensor to handle multiple measurement ranges is a pressing technical challenge.

[0051] Therefore, to address the aforementioned shortcomings, this embodiment provides a multi-range MEMS device, sensor, and smart wearable device. This embodiment has at least two grooves on a substrate, and corresponding acquisition areas are formed by covering each groove with a diaphragm. Acquisition elements are set on the acquisition areas to acquire the current deformation amplitude of the diaphragm and output the corresponding MEMS signal. Since this embodiment sets the deformation amplitude range of the diaphragm in the acquisition areas to be inconsistent, different acquisition areas can support acquisition of different ranges in actual use. By detecting the current deformation amplitude of the corresponding diaphragm through the corresponding acquisition element and outputting the corresponding MEMS signal, multi-range acquisition is achieved.

[0052] For ease of understanding, the following is combined with Figures 1 to 7 The multi-range MEMS devices provided in the embodiments of this application will be described in detail.

[0053] Reference Figure 1 , Figure 1 This is a front view of the multi-range MEMS device in the first embodiment of the multi-range MEMS device of this application. The first embodiment of the multi-range MEMS device of this application is presented as follows: Figure 1 As shown, in this embodiment, the multi-range MEMS device includes:

[0054] The substrate 1 includes at least two grooves.

[0055] It should be noted that the multi-range MEMS device in this embodiment can be any MEMS device with multiple ranges. The multi-range MEMS device can be used to collect the pressure of the surrounding environment, and the multi-range MEMS device can be used in combination with an ASIC chip to serve as a MEMS sensor.

[0056] It should also be noted that the substrate 1 mentioned above can be used as a support structure for the multi-range MEMS device in this embodiment. It can generally be made of silicon material, but other materials can also be used. This embodiment does not limit this.

[0057] Understandably, in order to accommodate the downward pressing process of the diaphragm 2, at least two grooves can be formed on one side of the substrate 1 in this embodiment. The specific number of grooves can correspond to the number of measurement ranges that need to be detected. For ease of subsequent understanding, this embodiment uses the acquisition of two measurement ranges for illustration. Figure 1 The diagram shows two grooves, which can be referred to as the first groove 11 and the second groove 12, respectively. The positions of each groove can be set according to the actual situation, and the opening directions of each groove can be the same or different. This embodiment uses the same direction for explanation, and the first groove 11 and the second groove 12 are arranged alternately for explanation.

[0058] It is also understood that the depth of each groove in this embodiment can be set according to the actual situation, and this embodiment does not limit it.

[0059] Furthermore, the aforementioned multi-range MEMS device may also include: a diaphragm 2, which is disposed on each of the grooves and forms a collection area at a corresponding position on the side opposite to each of the grooves; wherein the deformation range of the diaphragm 2 in each collection area is inconsistent.

[0060] Reference Figure 2 , Figure 2 This is a top view of the multi-range MEMS device in the first embodiment of the multi-range MEMS device of this application. Figure 2 As shown, in this embodiment, a membrane 2 can be covered on the side of the substrate 1 where the groove is provided. Specifically, a bonding operation can be used, and other covering operations can also be used. This embodiment does not limit this.

[0061] The aforementioned diaphragm 2 can be any device used for sensing pressure, such as a silicon diaphragm (silicon-on-insulator (SOI) wafer), etc., and this embodiment does not limit it. During detection, external pressure can be applied downwards from above into the groove, causing the diaphragm 2 at the groove to deform. The magnitude of the pressure can be obtained by detecting the deformation amplitude of the diaphragm 2.

[0062] Furthermore, since this embodiment is provided with a first groove 11 and a second groove 12, the membrane 2 covering the first groove 11 can be referred to as the first membrane 23, and the membrane 2 covering the second groove 12 can be referred to as the second membrane 24.

[0063] It should be understood that the above-mentioned collection area can be an area used for pressure detection. In this embodiment, the area corresponding to the diaphragm 2 on the groove can be referred to as the collection area. Pressure is detected by detecting the deformation of the diaphragm 2 in the collection area.

[0064] Furthermore, since this embodiment is provided with a first membrane 23 and a second membrane 24, the collection area of ​​the first membrane 23 can be referred to as the first collection area, and the collection area of ​​the second membrane 24 can be referred to as the second collection area.

[0065] It should be emphasized that the main reason for the different measurement ranges is that the deformation range of the diaphragm 2 on each groove is different. The deformation range of the diaphragm 2 corresponding to the larger measurement range may be larger, while the deformation range of the diaphragm 2 corresponding to the smaller measurement range may be smaller. Therefore, in this embodiment, the deformation range of the diaphragm 2 in each collection area can be set to be different, thereby obtaining multiple measurement ranges.

[0066] Specifically, in this embodiment, the deformation range of the first diaphragm 23 and the second diaphragm 24 can be set to be different. For example, if the deformation range of the first diaphragm 23 is smaller than that of the second diaphragm 24, then the first acquisition area can correspond to the detection of a small range, and the second acquisition area can correspond to the detection of both sides.

[0067] Furthermore, the aforementioned multi-range MEMS device may also include: a data acquisition element 3, which is disposed in each of the data acquisition areas, for detecting the current deformation amplitude of the diaphragm 2 in the data acquisition area and outputting the corresponding MEMS signal.

[0068] In order to detect the current deformation amplitude of each diaphragm 2, in this embodiment, a collection element 3 can be provided in each collection area. The collection element 3 can be any element used to collect the deformation of the diaphragm 2, such as a resistor bridge, etc. Specifically, a Wheatstone resistor bridge can be used. Of course, other methods can also be used to collect the deformation of the diaphragm 2. This embodiment does not limit this.

[0069] Furthermore, in this embodiment, multiple sets of acquisition elements 3 can be set. Specifically, each acquisition area can have one set of acquisition elements 3. The acquisition elements 3 in each acquisition area can acquire the current deformation amplitude of the diaphragm 2 in that acquisition area and generate a corresponding MEMS signal for output. Subsequently, the corresponding pressure parameters can be obtained based on the MEMS signal.

[0070] Therefore, since the deformation amplitude range of the diaphragm 2 in different acquisition areas is not consistent in this embodiment, different acquisition areas can support acquisition of different ranges in actual use. The current deformation amplitude of the corresponding diaphragm 2 is detected by the corresponding acquisition element 3 and the corresponding MEMS signal is output, thereby realizing multi-range acquisition.

[0071] Furthermore, in order to achieve inconsistent deformation ranges of the diaphragm 2 in each collection area, in this embodiment, the size and / or thickness of the diaphragm 2 in each collection area are different.

[0072] It should be noted that in this embodiment, the size of the diaphragm 2 in each collection area can be set differently to achieve different deformation ranges. Specifically, the cross-sections of the diaphragm 2 in each collection area can be different. Since the size of the diaphragm 2 in the collection area can correspond to the groove, it can also be understood that the cross-sections of the grooves are inconsistent.

[0073] It is understood that the cross-sectional shape of the aforementioned groove can be rectangular, circular, or other shapes, and this embodiment does not limit this. When it is rectangular, to ensure inconsistent dimensions, the length and width of each groove can be different. The specific dimensions can be set according to actual needs. Specifically, in this embodiment, for example... Figure 2 As shown, the first groove 11 (that is...) can be... Figure 2 The length of the first diaphragm 23 is set to l1, and the width is set to d1. The second groove 12 (that is...) Figure 2 The length of the second membrane 24 is set to l2 and the width is set to d2, that is, l1 is not equal to l2 and / or d1 is not equal to d2.

[0074] As another implementation, when the cross-section of the groove is circular, the diameters of the grooves can be different to ensure inconsistent dimensions.

[0075] It should also be noted that, in this embodiment, the thickness of the membrane 2 in each collection area can be set differently to achieve different deformation ranges. The specific thickness can be set according to the actual situation, and this embodiment does not impose any restrictions on it.

[0076] Of course, in this embodiment, the size and thickness of the membrane 2 in each collection area can also be set to be different.

[0077] Furthermore, in order to achieve the output of MEMS signals, such as Figure 1 and Figure 2 As shown, in this embodiment, the multi-range MEMS device further includes: pads 4 and metal traces 5;

[0078] The pad 4 is located on one side of the diaphragm 2 opposite to the substrate 1;

[0079] The metal trace 5 is electrically connected between the acquisition element 3 and the pad 4.

[0080] It should be understood that the aforementioned pad 4 can be any component used to connect multi-range MEMS devices to external devices, and is generally implemented using gold, copper, etc. For example... Figure 1 and Figure 2 As shown, in this embodiment, multiple pads 4 can be provided and located on the side of the diaphragm 2 facing away from the substrate 1, which can also be understood as the outward-facing side of the diaphragm 2. To avoid occupying the acquisition area, the pads 4 can generally be located at the edge of the diaphragm 2, etc. The specific location and number can be set according to the actual situation, and this embodiment does not impose any restrictions on this.

[0081] It should also be understood that the aforementioned metal trace 5 can be a trace that electrically connects the acquisition element 3 and the pad 4, and can also be implemented using gold, copper, etc. Figure 1 and Figure 2 As shown, metal traces 5 can be set between the acquisition element 3 and the corresponding pad 4 to realize the transmission of MEMS signals.

[0082] Furthermore, in order to prevent MEMS signal interference, in this embodiment, the diaphragm 2 includes: an insulating layer 21 and a silicon layer 22;

[0083] The insulating layer 21 is provided over each of the grooves;

[0084] The silicon layer 22 is disposed on the side of the insulating layer 21 away from the substrate 1, and a collection area is formed on the side away from the insulating layer 21 corresponding to each of the grooves.

[0085] It should be noted that the insulating layer 21 can be any layer with insulating capabilities, such as silicon dioxide, and the silicon layer 22 can be any layer with pressure sensing capabilities, such as silicon.

[0086] It should also be noted that, in this embodiment, after the diaphragm 2 is bonded to the substrate 1, an insulating layer 21 and a silicon layer 22 can be formed on the substrate 1. The substrate 1 and the silicon layer 22 are located on opposite sides of the insulating layer 21. The pads 4 and metal traces 5 can be disposed on the side of the silicon layer 22 away from the insulating layer 21. The corresponding positions of each groove on the side of the silicon layer 22 away from the insulating layer 21 form the aforementioned acquisition area, thereby setting the aforementioned acquisition element 3. The insulating layer 21 provides electrical insulation, thereby preventing interference with the MEMS signals of the pads 4, the acquisition element 3, and the metal traces 5.

[0087] Furthermore, to prevent external interference from affecting the surface of multi-range MEMS devices and ensure performance stability, such as... Figure 1 As shown, in this embodiment, the multi-range MEMS device further includes:

[0088] A passivation layer 6 is disposed on the side of the membrane 2 opposite to the substrate 1.

[0089] It is understood that the passivation layer 6 can be any layer used for isolation, such as silicon dioxide or silicon nitride, and this embodiment does not limit it.

[0090] In actual design, after setting up the pads 4, metal traces 5 and acquisition elements 3, a passivation layer 6 can be set on the top of the device. Specifically, the passivation layer 6 can be set on the side of the silicon layer 22 that is away from the insulating layer 21.

[0091] In this embodiment, at least two grooves are provided on the substrate 1, and corresponding acquisition areas are formed by covering each groove with a diaphragm 2. Acquisition elements 3 are provided on the acquisition areas to acquire the current deformation amplitude of the diaphragm 2 and output the corresponding MEMS signal. Since the deformation amplitude range of the diaphragm 2 on the acquisition areas is set to be inconsistent in this embodiment, different acquisition areas can support acquisition of different ranges in actual use. The current deformation amplitude of the corresponding diaphragm 2 is detected by the corresponding acquisition element 3 and the corresponding MEMS signal is output, thereby realizing multi-range acquisition.

[0092] Reference Figure 3 , Figure 3 This is a circuit diagram of the acquisition element 3 in the second embodiment of the multi-range MEMS device of this application. Based on the first embodiment described above, a second embodiment of the multi-range MEMS device of this application is proposed.

[0093] To achieve pressure acquisition and MEMS signal output, combined with Figure 1 as well as Figure 2 In this embodiment, the acquisition element 3 includes at least two sets of resistor bridges;

[0094] Each group of resistor bridges is set up corresponding to each of the acquisition areas.

[0095] It should be noted that the above-mentioned resistor bridge can be composed of any two sets of two resistors to form a symmetrical "bridge" circuit. When the value of one or more resistors in the bridge changes, the originally balanced bridge will lose its balance and generate a voltage difference. By measuring this voltage difference, the change in resistance can be known.

[0096] It should also be noted that, since the groove in this embodiment is described as rectangular, a set of resistor bridges can be set on each collection area, specifically a Wheatstone bridge.

[0097] Furthermore, since the resistor bridge can include four resistors, thus, as Figure 3 As shown, the resistor bridge includes: a first resistor R1 to a fourth resistor R4;

[0098] The first resistor R1 to the fourth resistor R4 are arranged around the periphery of the acquisition area, and the second end of the first resistor R1 is connected to the first end of the second resistor R2, the second end of the second resistor R2 is connected to the second end of the fourth resistor R4, the first end of the fourth resistor R4 is connected to the second end of the third resistor R3, and the first end of the third resistor R3 is connected to the first end of the first resistor R1.

[0099] Understandably, in Figure 2 In this embodiment, the four resistors in the resistor bridge can be set around the perimeter of the acquisition area. Specifically, when the acquisition area is rectangular, a resistor is set at the position of each of the four sides. When the acquisition area is circular, resistors can be set at even intervals around the perimeter of the acquisition area.

[0100] In this embodiment, if the connection point between the first resistor R1 and the third resistor R3 is denoted as point a, the connection point between the second resistor R2 and the fourth resistor R4 is denoted as point b, the connection point between the third resistor R3 and the fourth resistor R4 is denoted as point c, and the connection point between the first resistor R1 and the second resistor R2 is denoted as point d, then two of these points can be selected as the power supply input terminals, and the remaining two points can be used as MEMS signal output terminals, for example... Figure 3 Points a and b can be used as power input terminals, and points c and d can be used as MEMS signal output terminals.

[0101] Points a and b are connected to their corresponding pads 4 via metal traces 5. Pads 4 are then connected to the ASIC chip 7, which powers the resistor bridge. Points c and d are connected to their corresponding pads 4 via metal traces 5. Pads 4 are then connected to the ASIC chip 7, and the resistor bridge transmits the generated MEMS signal to the ASIC chip 7. The ASIC chip 7 then obtains an electrical signal based on the MEMS signal, which can be used to characterize the pressure value.

[0102] Furthermore, in order to fabricate the aforementioned multi-range MEMS chip, in this embodiment, reference is made to... Figure 4 as well as Figure 5 , Figure 4 This is a schematic diagram of substrate 1 in the second embodiment of the multi-range MEMS device of this application. Figure 5 This is a schematic diagram of the groove in the second embodiment of the multi-range MEMS device of this application.

[0103] like Figure 4 As shown, first, a piece of silicon can be obtained, and the silicon is etched to the corresponding dimensions to obtain substrate 1. Remember as... Figure 5 As shown, at least two grooves can be etched to form on one side of the substrate 1 according to the corresponding dimensions (i.e., Figure 5 (The first groove 11 and the second groove 12).

[0104] Reference Figure 6 as well as Figure 7 , Figure 6 This is a bonding diagram in the second embodiment of the multi-range MEMS device of this application. Figure 7 This is a schematic diagram of the etching process in the second embodiment of the multi-range MEMS device of this application. Figure 6 As shown, after obtaining the grooves, the membrane 2 can be bonded to the substrate 1 with the grooves, and then... Figure 7 As shown, the silicon wafer in film 2 can be thinned to a preset thickness using processes such as chemical mechanical polishing. This preset thickness can be set according to the actual situation, and different collection areas can be thinned to different preset thicknesses.

[0105] Next refer to Figure 1 After thinning, the aforementioned resistors can be formed at corresponding positions on the side of the thinned silicon layer 22 away from the insulating layer 21 through processes such as doping, thus forming a resistor bridge. Pads 4 and metal traces 5 are then placed at corresponding positions, and the pads 4 and the resistor bridge are electrically connected through the metal traces 5. Finally, a passivation layer 6 is deposited on the surface, thereby obtaining a multi-range MEMS device.

[0106] Furthermore, to achieve the above objectives, embodiments of this application also provide a sensor, referring to... Figure 8 , Figure 8 This is a schematic diagram of the structure of the first embodiment of the sensor in this application. Figure 8 As shown, in this embodiment, the sensor includes: a substrate 10, an ASIC chip 7, and a multi-range MEMS device 8 as described above;

[0107] The ASIC chip 7 and the multi-range MEMS device 8 are both disposed on the substrate 10. The ASIC chip 7 is provided with a detection circuit, which is electrically connected to the acquisition element 3.

[0108] The detection circuit is used to receive the MEMS signal output by the acquisition element 3, and to process the MEMS signal into an electrical signal corresponding to each acquisition area for output.

[0109] It should be noted that the substrate 10 mentioned above can be any substrate 10 with load-bearing capacity, such as a circuit board, etc., and this embodiment does not limit it. The ASIC chip 7 mentioned above may be provided with a detection circuit, which can be a circuit for obtaining an electrical signal based on the MEMS signal output by the multi-range MEMS device 8. The specific circuit can be set according to the actual situation, and this embodiment does not limit it. The electrical signal can be a signal used to characterize the pressure value.

[0110] It should also be noted that in this embodiment, the ASIC chip 7 can be disposed on one side of the substrate 10, which can be done by adhesive bonding. Of course, other methods can also be used, and this embodiment does not limit this. The multi-range MEMS device 8 can be disposed on the side of the ASIC chip 7 away from the substrate 10, which can also be done by adhesive bonding.

[0111] As another implementation, in this embodiment, the multi-range MEMS device 8 and the ASIC chip 7 may not be stacked, but rather directly disposed on the substrate 10. Of course, the specific arrangement can be set according to the actual situation, and this embodiment does not limit it.

[0112] Furthermore, in order to achieve pressure detection, such as Figure 8 As shown, the sensor also includes: a housing 9;

[0113] A cavity is formed inside the housing 9, and the housing 9 is sleeved on the substrate 10. The ASIC chip 7 and the multi-range MEMS device 8 are disposed in the cavity.

[0114] The housing 9 has a vent hole 91.

[0115] It is understood that the aforementioned housing 9 can be any housing 9 with protective capabilities. In this embodiment, a vent hole 91 can be provided at any position on the housing 9, so that the external air pressure can be connected with the air pressure inside the housing 9 through the vent hole 91. When the external air pressure changes, the air pressure in the cavity inside the housing 9 can also change, thereby deforming the diaphragm 2 in the acquisition area of ​​the multi-range MEMS device 8 to achieve pressure detection.

[0116] Preferably, in this embodiment, the vent 91 can be located on the housing 9 at a position corresponding to the acquisition area of ​​the multi-range MEMS device 8, thereby improving the accuracy of acquisition.

[0117] Furthermore, in order to prevent interference from moisture and other factors, this embodiment can also provide a waterproof and breathable membrane on the vent hole 91, so as to achieve the functions of waterproofing and breathability.

[0118] It should be emphasized that the specific implementation of the sensor in this embodiment can refer to the specific implementation of the multi-range MEMS device 8 described above, and therefore also has all the beneficial effects of the multi-range MEMS device 8 embodiment described above. This embodiment will not elaborate on this.

[0119] In addition, to achieve the above objectives, this application also provides a smart wearable device, which includes the sensors described above.

[0120] It should be emphasized that the specific implementation of the smart wearable device in this embodiment can refer to the specific implementation of the sensor described above, and therefore also has all the beneficial effects of the sensor embodiment described above. This embodiment will not elaborate on this further.

[0121] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A multi-range MEMS device, characterized in that, The multi-range MEMS device includes: A substrate, the substrate comprising at least two grooves; A diaphragm is placed over each of the grooves, and a collection area is formed at a corresponding position on the side opposite to each of the grooves; The acquisition elements are respectively located in each acquisition area, and are used to detect the current deformation amplitude of the diaphragm in the acquisition area and output the corresponding MEMS signal; The deformation range of the membrane in each of the aforementioned collection areas is inconsistent.

2. The multi-range MEMS device as described in claim 1, characterized in that, The size and / or thickness of the membrane in each of the aforementioned collection areas are different.

3. The multi-range MEMS device as described in claim 1, characterized in that, The multi-range MEMS device also includes: pads and metal traces; The pad is located on the side of the diaphragm opposite to the substrate; The metal trace is electrically connected between the acquisition element and the pad.

4. The multi-range MEMS device as described in claim 1, characterized in that, The diaphragm includes: an insulating layer and a silicon layer; The insulating layer is provided over each of the grooves; The silicon layer is disposed on the side of the insulating layer away from the substrate, and a collection area is formed on the side away from the insulating layer corresponding to the positions of each of the grooves.

5. The multi-range MEMS device as described in claim 1, characterized in that, The data acquisition element includes: at least two sets of resistor bridges; Each group of resistor bridges is set up corresponding to each of the acquisition areas.

6. The multi-range MEMS device as described in claim 5, characterized in that, The resistor bridge includes: a first resistor to a fourth resistor; The first resistor to the fourth resistor are arranged around the periphery of the acquisition area, and the second end of the first resistor is connected to the first end of the second resistor, the second end of the second resistor is connected to the second end of the fourth resistor, the first end of the fourth resistor is connected to the second end of the third resistor, and the first end of the third resistor is connected to the first end of the first resistor.

7. The multi-range MEMS device as described in any one of claims 1 to 6, characterized in that, The multi-range MEMS device also includes: A passivation layer is disposed on the side of the diaphragm opposite to the substrate.

8. A sensor, characterized in that, The sensor includes: a substrate, an ASIC chip, and a multi-range MEMS device as described in any one of claims 1 to 7; The ASIC chip and the multi-range MEMS device are both disposed on the substrate. The ASIC chip is provided with a detection circuit, and the detection circuit is electrically connected to the acquisition element. The detection circuit is used to receive the MEMS signal output by the acquisition element, and to process the MEMS signal into an electrical signal corresponding to each acquisition area for output.

9. The sensor as described in claim 8, characterized in that, The sensor also includes: a housing; A cavity is formed inside the housing, the housing is sleeved on the substrate, and the ASIC chip and the multi-range MEMS device are disposed in the cavity; The shell has ventilation holes.

10. A smart wearable device, characterized in that, The smart wearable device includes the sensor as described in claim 8 or 9.

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