Auxiliary guide structure of electroplating cell

CN224605121UActive Publication Date: 2026-08-07DONGGUAN PURUIDE METALS-PLASTICS&PROD CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
DONGGUAN PURUIDE METALS-PLASTICS&PROD CO LTD
Filing Date
2025-07-30
Publication Date
2026-08-07

AI Technical Summary

Technical Problem

[0005]鉴于现有技术的上述缺点、不足,本实用新型提供一种电镀子槽的辅助导向结构,其解决了现有的基材导向装置在在基材张力变化时容易发生横向位移时,难以动态补偿,导致基材与溢流口发生摩擦而导致镀层损伤的技术问题

Benefits of technology

[0016]通过在槽体两端的溢流口处设置导向管,利用导向管对连续电镀时经过的基材进行辅助导向,并且可以在基材张力变化,出现横向位移时可以对基材的电镀表面进行保护,在一定程度上避免了出现基材与溢流口发生摩擦而导致镀层损伤的情况。

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Abstract

The utility model discloses an auxiliary guide structure of electroplating sub - tank, including the tank body and setting in the first anode plate and second anode plate of tank body, first anode plate and second anode plate set up in the both sides in tank body interior, the upper part of first anode plate and second anode plate is connected with the lateral wall of tank body both sides respectively, the both ends of tank body are provided with overflow, the both ends of overflow are provided with guide pipe, guide pipe sets up a clamping mouth, its beneficial effect is, through setting up guide pipe at the overflow of tank body both ends, utilize the guide pipe to the substrate that passes through when continuous electroplating is assisted and is guided to can when the substrate tension changes, appears horizontal displacement and can protect the electroplating surface of substrate, to a certain extent, avoided the situation that the substrate and overflow rub and caused the plating layer damage.
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Description

Technical Field

[0001] This utility model relates to the field of electroplating equipment technology, and in particular to an auxiliary guiding structure for an electroplating sub-tank. Background Technology

[0002] Continuous electroplating is a process of depositing a metal coating on the surface of a continuously moving substrate using electrochemical methods to improve the substrate's metallic properties. During continuous electroplating, the stable orientation of the substrate is crucial for ensuring coating uniformity and reducing mechanical damage.

[0003] Currently, the process of the substrate passing through the plating tank is guided by an independent guiding device. Usually, the guide seat is a metal guide roller or a fixed guide block. This method is prone to lateral displacement when the substrate tension changes. Existing guiding devices are difficult to dynamically compensate for this, which causes friction between the substrate and the overflow port, resulting in damage to the plating layer. Utility Model Content

[0004] (a) Technical problems to be solved

[0005] In view of the above-mentioned shortcomings and deficiencies of the prior art, the present invention provides an auxiliary guiding structure for an electroplating sub-tank, which solves the technical problem that existing substrate guiding devices are prone to lateral displacement when the substrate tension changes, making it difficult to dynamically compensate and causing friction between the substrate and the overflow port, resulting in coating damage.

[0006] (II) Technical Solution

[0007] The purpose of this utility model is to provide an auxiliary guiding structure for an electroplating sub-tank, which includes a tank body and a first anode plate and a second anode plate disposed in the tank body. The first anode plate and the second anode plate are provided with plate bodies and placed on both sides inside the tank body. The upper parts of the first anode plate and the second anode plate are respectively connected to the side walls on both sides of the tank body. Overflow ports are provided at both ends of the tank body, and guide pipes are provided at both ends of the overflow ports. The guide pipes are provided with a clamping port.

[0008] Preferably, a bottom plate is provided inside the tank, and fixed connecting blocks extending into the tank are provided on both sides of the tank.

[0009] Preferably, the number of fixed connecting blocks is four, and they are distributed in pairs on both sides of the groove.

[0010] Preferably, the upper end of the first anode plate is provided with a connecting lug, and the number of the connecting lugs is two.

[0011] Preferably, the upper end of the first anode plate is further provided with a handle and a conductive connecting block, the conductive connecting block being disposed adjacent to the handle.

[0012] Preferably, the guide tube is inserted through the clamping port and fixedly clamped on the edge of the overflow port.

[0013] Preferably, the guide tube is inserted through the clamping port and screwed onto the edge of the overflow port.

[0014] Preferably, the first anode plate and the second anode plate have the same structure.

[0015] (III) Beneficial Effects

[0016] By installing guide tubes at the overflow ports at both ends of the tank, the guide tubes can assist in guiding the substrate passing through during continuous electroplating. They can also protect the electroplated surface of the substrate when the substrate tension changes and lateral displacement occurs, thus avoiding damage to the coating caused by friction between the substrate and the overflow port to a certain extent. Attached Figure Description

[0017] The accompanying drawings are provided to further understand the technical solution of this utility model and constitute a part of the specification. They are used together with the embodiments of this utility model to explain the technical solution of this utility model, and do not constitute a limitation on the technical solution of this utility model.

[0018] Figure 1 This is a three-dimensional view of the overall structure of the auxiliary guide structure of the electroplating sub-tank;

[0019] Figure 2 This is an exploded view of the overall structure of the auxiliary guide structure of the electroplating sub-tank;

[0020] Figure 3 This is a three-dimensional view of the first anode plate of the auxiliary guiding structure of the electroplating sub-tank;

[0021] Figure 4 This is a 3D view of the guide tube of the auxiliary guide structure for the spot plating sub-tank;

[0022] Explanation of reference numerals in the attached figures:

[0023] 1. Tank body; 10. Overflow port; 11. Base plate; 12. Fixed connecting block; 2. First anode plate; 20. Connecting lug; 21. Handle; 22. Conductive connecting block; 23. Electrical connection post; 3. Second anode plate; 4. Guide tube; 40. Clamping port; 5. Tightening screw; 6. Base material. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0025] The following is in conjunction with the appendix Figures 1 to 4To further describe, this utility model discloses an auxiliary guiding structure for an electroplating sub-tank, including a tank body 1 and a first anode plate 2 and a second anode plate 3 disposed within the tank body 1. The first anode plate 2 and the second anode plate 3 are disposed on both sides inside the tank body 1, and are respectively connected to the side walls on both sides of the tank body 1. Overflow ports 10 are provided at both ends of the tank body 1, and guide tubes 4 are provided at both ends of the overflow ports 10. The guide tubes 4 are provided with a clamping port 40, and the guide tubes 4 guide the plate through the clamping port 40. The tank wall panels on both sides of the overflow port 10 are fixed to the edge of the overflow port 10 by the deformation of the guide tubes 4. During electroplating, when the substrate 6 passes through the overflow ports 10 at both ends of the tank 1, it passes between the two guide tubes 4 to prevent the substrate 6 from changing tension. When lateral displacement occurs, it can protect the electroplating surface of the substrate 6 to a certain extent. In addition, under the restriction of the guide tubes 4 at both ends, the width of the overflow port 10 is tightened, which relatively reduces the flow rate of the electroplating solution, thereby allowing the stirring of the electroplating solution to be adjusted.

[0026] In a preferred embodiment, a bottom plate 11 is provided inside the tank 1, and fixed connecting blocks 12 extending into the tank 1 are provided on both sides of the tank 1. Each fixed connecting block 12 is provided with a screw hole.

[0027] In a preferred embodiment, there are four fixed connecting blocks 12, which are distributed in pairs on both sides of the tank 1. The fixed connecting blocks 12 are adapted to the connecting lugs 20 on the first anode plate 2 and the second anode plate 3 respectively.

[0028] In a preferred embodiment, the upper end of the first anode plate 2 is provided with a connecting lug 20 with a through hole. There are two connecting lugs 20. The connecting lugs 20 rest on the fixed connecting block 12 and are connected to the screw holes on the fixed connecting block 12 by inserting a hand screw 5 into the through hole, so as to fix the first anode plate 2 on both sides of the tank body 1. The second anode plate 3 is installed in the same way as the first anode plate 2.

[0029] In a preferred embodiment, the upper end of the first anode plate 2 is also provided with a handle 21 and a conductive connecting block 22. The conductive connecting block 22 is located adjacent to the handle 21, the handle 21 is located between two connecting lugs 20, and the conductive connecting block 22 is located between the handle 21 and the connecting lugs 20. In addition, the upper end of the conductive connecting block 22 is also provided with an upwardly protruding electrical contact post 23.

[0030] In a preferred embodiment, the guide tube 4 is inserted into and fixedly clamped on the edge of the overflow port 10 through the clamping port 40. In addition, when the guide tube 4 is inserted into the edge of the overflow port 10 through the clamping port 40, it is also screwed into and fixed on the edge of the overflow port 10 by a plastic screw.

[0031] In a preferred embodiment, the first anode plate 2 and the second anode plate 3 have the same structure.

[0032] In a preferred embodiment, the guide tube 4 is made of PEEK material. PEEK has better wear resistance than metal in acids, alkalis or solvents and has excellent wear resistance and high temperature resistance.

[0033] In summary, by installing guide tubes at the overflow ports at both ends of the tank, the guide tubes can assist in guiding the substrate passing through during continuous electroplating. Furthermore, they can protect the surface of the substrate when the substrate tension changes and lateral displacement occurs, thus preventing damage to the coating caused by friction between the substrate and the overflow port.

[0034] Although embodiments of the present invention have been shown above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make modifications and variations to the above embodiments, but such modifications are all included within the broad scope of the foregoing disclosure, drawings and claims.

Claims

1. An auxiliary guiding structure for an electroplating sub-tank, comprising a tank body and a first anode plate and a second anode plate disposed within the tank body, wherein the first anode plate and the second anode plate are provided with plate bodies and placed on both sides inside the tank body, characterized in that: The upper parts of the first anode plate and the second anode plate are respectively connected to the side walls on both sides of the tank. The tank is provided with overflow ports at both ends, and guide tubes are provided at both ends of the overflow ports. Each guide tube is provided with a clamping port.

2. The auxiliary guiding structure for the electroplating sub-tank according to claim 1, characterized in that: The tank has a bottom plate inside, and fixed connecting blocks extending into the tank are provided on both sides of the tank.

3. The auxiliary guiding structure for the electroplating sub-tank according to claim 2, characterized in that: The number of fixed connecting blocks is four, and they are distributed in pairs on both sides of the groove.

4. The auxiliary guiding structure for the electroplating sub-tank according to claim 1, characterized in that: The upper end of the first anode plate is provided with two connecting lugs.

5. The auxiliary guiding structure for the electroplating sub-tank according to claim 1, characterized in that: The upper end of the first anode plate is also provided with a handle and a conductive connecting block, the conductive connecting block being located adjacent to the handle.

6. The auxiliary guiding structure for the electroplating sub-tank according to claim 1, characterized in that: The guide tube is inserted through the clamping port and fixedly clamped to the edge of the overflow port.

7. The auxiliary guiding structure for the electroplating sub-tank according to claim 1, characterized in that: The guide tube is inserted through the clamping port and screwed onto the edge of the overflow port.

8. The auxiliary guiding structure for the electroplating sub-tank according to claim 1, characterized in that: The first anode plate and the second anode plate have the same structure.