PCB board mounting mechanism

Abstract

The utility model discloses a kind of PCB board mounting mechanisms, including carrier and jig, carrier includes carrier main body and magnetic attraction component, carrier main body is equipped with cavity, built-in magnetic attraction component is locked PCB board by magnetic force, carrier is placed between jig and PCB board, jig main body is with guide rail, several adsorption components movable thereon, PCB board is fixed by negative pressure adsorption.The utility model is locked by magnetic attraction piece on the carrier main body and the magnetic piece on PCB board, to ensure that carrier and PCB board are stably connected, jig main body is equipped with guide rail, and the adsorption component movable thereon is fixed by negative pressure adsorption, the vacuum degree of vacuum lifting is improved by small area contact of suction nozzle, cooperate with the magnetic attraction positioning of carrier, so that PCB board keeps stable position in mounting process, avoids deviation, simplifies operation process, improves mounting precision and production efficiency, especially suitable for high-precision assembly demand in custom LED display product automated production line.

Description

Technical Field

[0001] This utility model relates to the field of electrical component manufacturing technology, and specifically to a PCB board mounting mechanism. Background Technology

[0002] With the rapid development of LED display technology and the diversification of market demand, customized LED display products have gradually gained market favor because they can accurately meet the needs of specific scenarios. However, the PCB boards required for customized products often have characteristics such as no process edges, irregular geometric contours, and flexible substrates. Due to the limitations of these characteristics, conventional fixtures can only be designed for standard rigid PCB boards and are difficult to fix PCB boards without process edges and flexible PCB boards. This can easily lead to displacement, precision deviation, or damage during the processing, which seriously affects the production yield. At the same time, flexible PCB boards are deformed after SMT assembly, and the previous overall vacuuming has the problem of air leakage. This utility model proposes a new solution to the above problems. Utility Model Content

[0003] To overcome at least one of the aforementioned drawbacks, this utility model provides a PCB board mounting mechanism. The objective of this utility model can be achieved by employing the following technical solution: This application provides a PCB board mounting mechanism, including: The carrier includes a carrier body and a magnetic suction assembly. The carrier body has a cavity, and the magnetic suction assembly is disposed on the carrier body. The magnetic suction assembly includes a magnetic suction element located inside the cavity for magnetically attracting and locking a PCB board. A fixture, wherein the carrier is disposed on the fixture and the PCB board is located between the fixture and the PCB board. The fixture includes a fixture body and a guide rail disposed on the fixture body. A plurality of adsorption components are movably connected to the guide rail. The adsorption components generate negative pressure to adsorb and fix the PCB board.

[0004] In one possible implementation, the shape of the cavity is adapted to the shape of the PCB board.

[0005] In one possible implementation, the magnetic attraction component is disposed circumferentially along the edge region of the carrier body, and the PCB board is magnetic or has magnetic components adapted to the position of the magnetic attraction component.

[0006] In one possible implementation, the magnetic attraction component includes: The mounting component has a through hole, and the mounting component is detachably connected to the carrier by bolts passing through the through hole; The mounting component has a receiving groove for accommodating the magnetic component.

[0007] In one possible implementation, the receiving groove protrudes towards the side closer to the PCB board, and at least a portion of the receiving groove is located inside the cavity.

[0008] In one embodiment, the receiving groove includes a side wall and a bottom wall, and a hole is formed in the bottom wall. The inner diameter of the hole is smaller than the outer diameter of the magnetic attractor, and the hole is located between the magnetic attractor and the PCB board.

[0009] In one possible implementation, the vehicle further includes a handle position, which is disposed on the main body of the vehicle and located on both sides of the cavity.

[0010] In one possible implementation, the guide rail includes a plurality of crisscrossing slide rail arrays that completely cover the cavity.

[0011] In one possible implementation, the adsorption component includes: A suction tube is movably connected to the slide rail array, and a sealing ring is provided at the end of the suction tube that contacts the PCB. The air tube, through which the suction nozzle is connected to the negative pressure generating device; The U-shaped buckle is used to engage with the suction tube; The screws, the U-shaped buckles are detachably connected to the slide rail array via screws.

[0012] In one possible implementation, the fixture body is provided with fixing holes.

[0013] The beneficial technical effects of this utility model are as follows: According to the present disclosure, the PCB board mounting mechanism includes a carrier and a fixture. The magnetic components on the carrier body form a magnetic locking with the magnetic components on the PCB board, ensuring a stable connection between the carrier and the PCB board. The fixture body is equipped with a guide rail, and the movable adsorption component on it fixes the PCB board by negative pressure adsorption. The vacuum degree is improved by the small-area contact of the suction nozzle. Combined with the magnetic positioning of the carrier, the PCB board maintains a stable position during the mounting process, avoiding displacement. This simplifies the operation process, improves mounting accuracy and production efficiency, and is especially suitable for the high-precision assembly requirements in the automated production line of customized LED display products. Attached Figure Description

[0014] The following are given by way of example and without limitation in the accompanying drawings: Figure 1 A schematic diagram of the mounting structure of the carrier, fixture, and PCB board at one angle is shown according to an embodiment of the present invention; Figure 2 A schematic diagram of the structure of the vehicle at one angle according to an embodiment of the present invention is shown; Figure 3 This invention provides a schematic diagram of the vehicle from another angle according to an embodiment of the present invention. Figure 4 This diagram shows a structural schematic of the vehicle according to an embodiment of the present invention from another angle; Figure 5 This diagram shows a structural schematic of the vehicle from another angle according to an embodiment of the present invention; Figure 6 A schematic diagram of the fixture according to an embodiment of the present invention is shown; Figure 7 A schematic diagram of the installation structure of the carrier and fixture according to an embodiment of the present invention is shown; Figure 8 This diagram shows a structural schematic of the magnetic suction assembly at one angle according to an embodiment of the present invention; Figure 9 This diagram shows a structural schematic of the magnetic suction assembly from another angle according to an embodiment of the present invention; Figure 10 This diagram shows a structural schematic of the magnetic suction assembly from another angle according to an embodiment of the present invention; Figure 11 A schematic diagram of the adsorption component according to an embodiment of the present invention is shown.

[0015] In the picture: 1. Carrier; 11. Carrier body; 12. Cavity; 13. Magnetic suction assembly; 131. Mounting component; 132. Receiving slot; 133. Hole; 134. Through hole; 14. Handle position; 2. Fixture; 21. Fixture body; 22. Guide rail; 221. Slide rail array; 222. U-shaped buckle; 223. Screw; 23. Adsorption assembly; 231. Suction nozzle tube; 232. Air tube; 233. Sealing ring; 24. Fixing hole; 3. PCB board. Detailed Implementation

[0016] In the following detailed disclosure, these embodiments are fully described with reference to the accompanying drawings. In order to enable those skilled in the art to understand and clarify the technical solution of this utility model more clearly, the embodiments described below are not limited thereto. The present utility model will be further described in detail below with reference to the embodiments and the accompanying drawings.

[0017] In this utility model, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; the term "multiple" refers to two or more unless otherwise explicitly defined. The terms "install," "connect," "join," and "fix" should be interpreted broadly. For example, "connect" can be a fixed connection, a detachable connection, or an integral connection; "join" can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0018] In the description of this utility model, it should be understood that the terms "upper", "lower", "left", "right", "front", "rear", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or unit referred to must have a specific orientation or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0019] This application provides a PCB board 3-mounting mechanism, such as Figures 1-11 As shown, the device includes a carrier 1 and a fixture 2. The carrier 1 includes a carrier 1 body and a magnetic suction component 13. A cavity 12 is provided on the carrier 1 body. The magnetic suction component 13 is disposed on the carrier 1 body and includes a magnetic suction element located inside the cavity 12 for magnetically attracting the PCB board 3 to form a lock. The carrier 1 is disposed on the fixture 2 and is located between the fixture 2 and the PCB board 3. The fixture 2 includes a fixture 2 body and a guide rail 22 disposed on the fixture 2 body. Several adsorption components 23 are movably connected to the guide rail 22. The adsorption components 23 generate negative pressure to attract and fix the PCB board 3.

[0020] The PCB board 3 mounting mechanism provided in this embodiment forms a magnetic lock between the carrier 1 and the PCB board 3 through the magnetic suction component on the main body of the carrier 1, ensuring a stable connection between the carrier 1 and the PCB board 3. The main body of the fixture 2 is equipped with a guide rail 22, on which a movable adsorption component 23 fixes the PCB board 3 by negative pressure adsorption. The vacuum degree is improved by the small-area contact of the suction nozzle. Combined with the magnetic positioning of the carrier 1, the PCB board 3 maintains a stable position during the mounting process, avoiding displacement. This simplifies the operation process, improves mounting accuracy and production efficiency, and is especially suitable for the high-precision assembly requirements in the automated production line of customized LED display products.

[0021] The synergistic operation of the strong magnetic carrier 1 and the suction nozzle die bonding fixture 2 significantly improves the die bonding accuracy and stability of PCB boards 3 without process edges, irregular shapes, and flexible boards. The high-temperature magnet achieves the initial positioning and fixation of the PCB board 3 through magnetic adsorption, effectively compensating for the deformation of flexible materials and ensuring that the substrate does not shift under high temperature conditions. The suction nozzle fixture 2 applies uniform local force to the non-magnetic area through vacuum adsorption. The suction nozzle fixture 2 draws vacuum to meet the needs of the die bonding machine, avoiding warping of irregularly shaped boards or stress concentration of flexible boards. The dynamic collaboration between the two forms a closed-loop control, enabling the mounting process to adapt to complex board shapes and flexible material characteristics. It overcomes the limitations of traditional single fixing methods for designs without process edges, while taking into account the geometric constraints of irregularly shaped boards and the deformation buffer of flexible boards. Ultimately, it achieves a high yield and low damage die bonding effect, ensuring the production yield and reliability of customized LED display products.

[0022] In one possible implementation, such as Figures 1-5 As shown, the shape of cavity 12 is adapted to the shape of PCB board 3.

[0023] The carrier 1 achieves full fit and fixation of the PCB board 3 through the design of the irregular cavity 12 precisely matching the shape of the PCB board 3. The shape of the cavity 12 can be flexibly adjusted according to the size of the PCB board 3 to ensure that the PCB board 3 is stably positioned in the carrier 1, avoiding displacement or loosening caused by shape mismatch, thereby improving the mounting accuracy and production efficiency, while simplifying the operation process and being suitable for the automated assembly needs of diverse PCB boards 3.

[0024] In one possible implementation, such as Figures 1-4 As shown, the magnetic suction component 13 is arranged circumferentially along the cavity 12 in the edge area of ​​the main body of the carrier 1, and the PCB board 3 is magnetic or has magnetic components that are adapted to the position of the magnetic suction component.

[0025] Among them, the PCB board 3 can be magnetic, and magnetic materials can be directly incorporated during the manufacturing process, or a magnetic material layer can be embedded in the stacked structure of the PCB board 3, relying on the magnetic force of the PCB board 3 itself and the magnetic components to fix the PCB board.

[0026] Magnetic components can be arranged on the PCB board 3. The magnetic components 13 are evenly distributed along the inner edge of the carrier 1 body and form a precise match with the corresponding magnetic components on the PCB board 3. This achieves multi-point stable adsorption of the PCB board 3, effectively avoiding displacement or loosening caused by external force interference, ensuring the position of the PCB board 3 during the mounting process, simplifying the assembly process, and improving the overall mounting accuracy and production efficiency.

[0027] In one possible implementation, such as Figures 8-10As shown, the magnetic suction assembly 13 includes a mounting part 131 and a receiving groove 132. The mounting part 131 has a through hole 134, and the mounting part 131 is detachably connected to the carrier 1 by bolts passing through the through hole 134. The mounting part 131 has a receiving groove 132, which is used to accommodate the magnetic suction component.

[0028] The magnetic component 13 is fixed by bolts through the through hole 134 on the mounting part 131, so that the magnetic component 13 can be flexibly disassembled and assembled to adapt to different PCB boards 3 or maintenance needs. The receiving groove 132 can be fitted with the magnetic component with a small gap. The magnetic component is embedded in the receiving groove 132 to achieve precise positioning and ensure that it is stably connected with the magnetic component of the PCB board 3 during the adsorption process.

[0029] Among them, the magnetic suction component can use a high-temperature resistant magnet to maintain stable magnetic performance in the high-temperature environment of reflow soldering. Its strong magnetic characteristics can achieve reliable fixation even in a small volume design. It can also be magnetized to improve the reusability of the carrier 1.

[0030] The magnetic component can be made of cylindrical iron sheet or other magnetic materials. The cross-section of the magnetic component is circular and its size is similar to that of a high-temperature magnet. For example, a cylindrical iron sheet is glued to the PCB board 3 with high-temperature adhesive. The magnetic component is easy to pick up during automated placement process in SMT. The circular magnetic component increases the contact area with the PCB board 3, reduces the risk of falling off, and improves the reliability of the bonding. The circular magnetic component is more uniformly stressed, and it evenly distributes the external pressure to the entire surface, forming high-density support points, effectively dispersing mechanical stress and suppressing board deformation.

[0031] In one possible implementation, such as Figure 5 As shown, the receiving groove 132 protrudes towards the side closer to the PCB board 3, and at least part of the receiving groove 132 is located inside the cavity 12.

[0032] The receiving groove 132 protrudes towards the side closer to the PCB board 3, and the recessed groove ensures that the magnetic component can make more precise contact with the inner wall of the receiving groove 132 during assembly. At least part of the receiving groove 132 is located inside the cavity 12, and the magnetic attractor is closer to the magnetic component on the PCB board 3, thereby enhancing the stability of magnetic coupling. The protruding structure shortens the distance between the magnetic component and the magnetic attractor, reduces the loss of the magnetic force transmission path, and enables the carrier 1 to maintain reliable adsorption force in the high temperature environment of reflow soldering, avoiding positioning displacement caused by thermal deformation.

[0033] In one possible implementation, such as Figure 8 and Figure 9 As shown, the receiving groove 132 includes a side wall and a bottom wall. A hole 133 is provided on the bottom wall. The inner diameter of the hole 133 is smaller than the outer diameter of the magnetic component. The hole 133 is located between the magnetic component and the PCB board 3.

[0034] The sidewall and bottom wall of the receiving groove 132 form a stable structure. The inner diameter of the hole 133 in the bottom wall is smaller than the outer diameter of the magnetic component, ensuring that the magnetic component is precisely positioned during assembly and achieving physical isolation between the magnetic component and the magnetic component.

[0035] Among them, the hole 133 is located between the magnetic suction component and the PCB board 3, which shortens the magnetic force transmission path and significantly improves the adsorption stability. Several adsorption components 23 generate negative pressure to adsorb and fix the PCB board 3.

[0036] In one possible implementation, such as Figure 2 As shown, the vehicle 1 also includes a handle position 14, which is disposed on the main body of the vehicle 1 and located on both sides of the cavity 12.

[0037] The handle positions 14 of the carrier 1 are located on both sides of the cavity 12, which makes it easier for operators to quickly lift or move the device through the handle positions 14, making the disassembly process smoother.

[0038] In one possible implementation, such as Figure 6 and Figure 7 As shown, the guide rail 22 includes several horizontally and vertically intersecting slide rail arrays 221, which completely cover the cavity 12.

[0039] Among them, the guide rail 22, through the crisscrossing slide rail array 221, fully covers the cavity 12 area in a grid structure, providing a multi-degree-of-freedom movement path for the adsorption component 23. The adsorption component 23 can move flexibly along the slide rail array 221. Several adsorption components 23 generate negative pressure to adsorb and fix the PCB board 3. The small-area contact design of the suction nozzle significantly improves the vacuum degree of the vacuum pump.

[0040] In one possible implementation, such as Figure 11 As shown, the adsorption assembly 23 includes a suction tube 231, an air tube 232, a U-shaped buckle 222, and a screw 223. The suction tube 231 is movably connected to the slide rail array 221. The end of the suction tube 231 that contacts the PCB is provided with a sealing ring 233. The suction tube 231 is connected to the negative pressure generating device through the air tube 232. The U-shaped buckle 222 is used to engage with the suction tube 231. The U-shaped buckle 222 is detachably connected to the slide rail array 221 through the screw 223.

[0041] The adsorption component 23 is movably connected to the slide rail array 221 via the suction tube 231. Combined with the design of the sealing ring 233, it ensures airtightness when in contact with the PCB board 3, thereby achieving efficient and stable negative pressure adsorption. The connection between the air tube 232 and the negative pressure generating device forms an airflow channel, enabling the suction tube 231 to respond quickly to changes in vacuum.

[0042] The U-shaped buckle 222 and the suction tube 231 are connected to simplify the assembly and disassembly process. The U-shaped buckle 222 is fixed to the slide rail array 221 by screws 223, which enhances the flexibility and maintenance convenience of the overall structure. The suction tube 231 can be moved and fixed by the slide rail and the U-shaped buckle 222, ensuring that different models of PCB boards of the same size are universal and reducing the cost of fixture 2.

[0043] In one possible implementation, such as Figure 6 As shown, the main body of the fixture 2 is provided with a fixing hole 24, which is used to accurately position and fix the fixture 2 on the equipment or workbench to ensure that the fixture 2 maintains stability and repeatability during operation, thereby ensuring the reliability of processing or testing. It is usually connected to the base by bolts, pins or quick clamps, which can withstand mechanical stress and facilitate quick disassembly and adjustment.

[0044] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0045] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

[0046] In view of the detailed description above, these and other changes can be made to these embodiments. This written description includes embodiments of the best mode disclosed in this utility model. The patent scope of this utility model is defined by the claims, which are not limited by this disclosure. The protection scope of this utility model is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope disclosed in this utility model, based on the technical solution and concept of this utility model, are within the protection scope of this utility model.

Claims

1. A PCB board mounting mechanism, characterized in that, include: The carrier includes a carrier body and a magnetic suction assembly. The carrier body has a cavity, and the magnetic suction assembly is disposed on the carrier body. The magnetic suction assembly includes a magnetic suction element located inside the cavity for magnetically attracting and locking a PCB board. A fixture, wherein the carrier is disposed on the fixture and the PCB board is located between the fixture and the PCB board. The fixture includes a fixture body and a guide rail disposed on the fixture body. A plurality of adsorption components are movably connected to the guide rail. The adsorption components generate negative pressure to adsorb and fix the PCB board.

2. The PCB board mounting mechanism according to claim 1, characterized in that, The shape of the cavity is adapted to the shape of the PCB board.

3. The PCB board mounting mechanism according to claim 1, characterized in that, The magnetic attraction component is arranged circumferentially along the cavity in the edge region of the vehicle body, and the PCB board is magnetic or has magnetic components adapted to the position of the magnetic attraction component.

4. The PCB board mounting mechanism according to claim 1, characterized in that, The magnetic attraction component includes: The mounting component has a through hole, and the mounting component is detachably connected to the carrier by bolts passing through the through hole; The mounting component has a receiving groove for accommodating the magnetic component.

5. The PCB board mounting mechanism according to claim 4, characterized in that, The receiving groove protrudes towards the side closer to the PCB board, and at least part of the receiving groove is located inside the cavity.

6. The PCB board mounting mechanism according to claim 4, characterized in that, The receiving groove includes a side wall and a bottom wall. A hole is formed in the bottom wall. The inner diameter of the hole is smaller than the outer diameter of the magnetic component. The hole is located between the magnetic component and the PCB board.

7. The PCB board mounting mechanism according to any one of claims 1-6, characterized in that, The vehicle also includes a handle, which is disposed on the main body of the vehicle and located on both sides of the cavity.

8. The PCB board mounting mechanism according to any one of claims 1-7, characterized in that, The guide rail comprises a plurality of crisscrossing slide rail arrays, which completely cover the cavity.

9. The PCB board mounting mechanism according to claim 8, characterized in that, The adsorption component includes: A suction tube is movably connected to the slide rail array, and a sealing ring is provided at the end of the suction tube that contacts the PCB. The air tube, through which the suction nozzle is connected to the negative pressure generating device; The U-shaped buckle is used to engage with the suction tube; The screws, the U-shaped buckles are detachably connected to the slide rail array via screws.

10. The PCB board mounting mechanism according to claim 1, characterized in that, The fixture body is provided with fixing holes.

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