A butt joint type circuit board with positioning guide posts
Patent Information
- Application Number
- CN202522560300.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-02
- Publication Date
- 2026-11-03
- Estimated Expiration
- 2035-12-02
AI Technical Summary
Existing guide post positioning and docking circuit boards suffer from problems such as insufficient positioning accuracy, low space utilization, and poor structural stability, and cannot meet the requirements for high precision and high stability.
A circuit board structure was designed, comprising a rectangular circuit board substrate, guide post docking components, symmetrically arranged electrolytic capacitors, integrated toggle switches, and interface modules. Through designs such as welding fixation, positioning holes, and extended mounting feet, the positioning accuracy, space utilization, and structural stability are improved.
It significantly improves the accuracy of guide post positioning, optimizes circuit performance, simplifies assembly processes, enhances long-term reliability, and solves problems such as misalignment, electromagnetic interference, and component loosening in existing technologies.
Smart Images

Figure CN224935841U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of circuit board technology, specifically relating to a docking type circuit board with guide post positioning. Background Technology
[0002] The guide post positioning docking type circuit board is a core circuit carrier component used in modular assembly scenarios such as electronic equipment and industrial control equipment. Its core definition is a circuit board assembly that uses a circuit board substrate as a carrier and achieves precise docking and positioning with other circuit boards or external functional modules through a guide post structure. The core function of this type of circuit board is to rely on the positioning and guiding function of the guide posts to ensure the accuracy and stability of the electrical connection between the circuit board and the docking component. At the same time, it simplifies the assembly process, improves the efficiency of modular assembly, and reduces the difficulty of disassembly and assembly during later maintenance. It is a key basic component for realizing the modular and integrated design of electronic equipment, and its structural design directly affects the equipment assembly accuracy, electrical connection reliability, and long-term stability.
[0003] Existing guide post positioning and docking type circuit boards typically consist of only a rectangular circuit board substrate, cylindrical guide post positioning components without precise dimensional control, a few simple interface modules soldered to the edge of the substrate, and scattered electrolytic capacitors and small electronic components. Compared with the circuit board structure of this application, existing products have significant shortcomings: First, the soldering of the guide post positioning components to the circuit board substrate relies solely on the basic pins for fixation, and the cylindrical docking ends of the guide posts and the positioning holes lack a clear clearance fit design, making it prone to misalignment during docking and resulting in insufficient positioning accuracy; Second, the electrolytic capacitors lack a symmetrical arrangement design and are randomly distributed. The first problem is that the substrate has low space utilization and is prone to electromagnetic interference, affecting circuit performance. The second problem is that the lack of a dedicated toggle switch requires an external switch assembly, increasing assembly steps and occupying more installation space. The third problem is that there are no standardized requirements for the installation of small electronic components. The through-hole components are simply soldered through the substrate without reinforcement design, which can easily cause the pins to detach due to equipment vibration. The fourth problem is that the interface module is fixed by soldering only a few pins without extended mounting feet for reinforcement, which can easily cause the interface to loosen when subjected to force. The overall structure cannot meet the requirements of high-precision and high-stability guide post positioning and docking. Utility Model Content
[0004] To address the problems of insufficient positioning accuracy, low space utilization, and poor structural stability in existing guide post positioning docking circuit boards, the purpose of this utility model is to provide a guide post positioning docking circuit board with accurate positioning, reasonable spatial layout, and stable structure, so as to improve docking assembly accuracy, optimize circuit performance, simplify assembly process, and enhance long-term reliability.
[0005] To solve the above-mentioned technical problems, this utility model provides the following technical solution: The guide post positioning docking circuit board provided by this utility model includes a rectangular plate-shaped circuit board substrate. Two guide post docking components are fixedly installed side by side in the middle area of the circuit board substrate. Each guide post docking component is integrally formed with an outwardly extending cylindrical docking end. The guide post docking component is fixed to the circuit board substrate by welding to the solder pads of the circuit board substrate through an integrally formed welding foot at the bottom. Four cylindrical electrolytic capacitors are welded on the circuit board substrate at the periphery of the guide post docking components. The four electrolytic capacitors are symmetrically distributed in pairs on both sides of the two guide post docking components, and the two electrolytic capacitors in each pair are along the width of the circuit board substrate. The electrolytic capacitors are arranged in an directional orientation, with their leads vertically soldered to the surface of the circuit board substrate. Rectangular modular interface modules are fixedly mounted at opposite edges of the circuit board substrate. The main body of each interface module is fitted to the surface of the circuit board substrate, with its mating port facing outwards. Extended mounting feet are provided on the sides of the interface modules, and these feet are soldered to pads on the edge of the circuit board substrate. Matching circular pads are provided on the circuit board substrate at the mounting positions of the guide post-type mating components, electrolytic capacitors, and interface modules, and the leads of each component are soldered to the corresponding pads. Several circular positioning holes are provided on the circuit board substrate, located in a pre-defined positioning area next to the guide post-type mating components. Two cuboid toggle switches are soldered to the front side of the circuit board substrate, near the guide post type docking component. The operating tabs of the toggle switches extend along the length of the circuit board substrate, and the pins of the toggle switches are soldered to the corresponding pads on the circuit board substrate. Several small electronic components are also soldered on the circuit board substrate. The small electronic components include surface mount components and through-hole components. The surface mount components are soldered to the pads on the surface of the circuit board substrate, and the pins of the through-hole components penetrate the circuit board substrate and are soldered to the pads on the back side. The small electronic components are distributed in the empty area between the guide post type docking component, electrolytic capacitor, and interface module.
[0006] One or more technical solutions provided in this application embodiment have at least the following technical effects or advantages compared with the prior art:
[0007] 1. By setting positioning holes and columnar docking ends, the problem of docking misalignment in existing products is solved, and the positioning accuracy of guide pillars is greatly improved;
[0008] 2. The four electrolytic capacitors are arranged symmetrically in pairs, which not only improves the space utilization of the circuit board substrate, but also reduces electromagnetic interference and optimizes the circuit performance.
[0009] 3. The integrated rectangular toggle switch eliminates the need for additional external switch components, simplifying the assembly process and saving installation space;
[0010] 4. The mounting method of small electronic components has been standardized. Through-hole components are soldered to the back pads through the substrate, which enhances the mounting stability of the components and reduces the risk of pin desoldering caused by equipment vibration.
[0011] 5. The interface module is equipped with extended mounting feet, which strengthens the fixing structure of the interface and avoids the problem of interface loosening when subjected to force, thus improving the overall structural stability and long-term reliability of the circuit board.
[0012] Other advantages, objectives and features of this invention will be set forth in part in the description which follows, and in part will be apparent to those skilled in the art from the following examination or study, or may be taught from the practice of this invention. Attached Figure Description
[0013] Figure 1 This is a three-dimensional schematic diagram of a docking circuit board with guide post positioning according to the present invention;
[0014] Figure 2 Another perspective elevation view of a docking circuit board with guide post positioning according to this utility model;
[0015] Figure 3 This is a bottom elevation view of a docking circuit board with guide post positioning according to the present invention.
[0016] Figure 4 This is a schematic diagram of the component distribution of a docking circuit board with guide post positioning according to this utility model.
[0017] As shown in the figure:
[0018] 1. Circuit board substrate; 2. Guide post type docking component; 3. Column-shaped docking end; 4. Positioning hole; 5. Toggle switch; 6. Small electronic component; 61. Insert-type component; 7. Interface module; 8. Electrolytic capacitor. Detailed Implementation
[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0020] It should be noted that the terms "vertical," "horizontal," "up," "down," "left," "right," and similar expressions used in this article are for illustrative purposes only and do not represent the only possible implementation.
[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains; the terminology used herein in the description of this invention is for the purpose of describing particular embodiments only and is not intended to limit the invention; the term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0022] like Figure 1 As shown, a rectangular circuit board substrate 1 serves as the main support. Two guide post type connectors 2 are fixedly mounted side-by-side in the central area. Each guide post type connector 2 has an integrally formed cylindrical connector end 3 extending outwards. The guide post type connector 2 is welded to the corresponding circular pad on the circuit board substrate 1 via an integrally formed welding foot at the bottom. Four cylindrical electrolytic capacitors 8 are welded to the periphery of the guide post type connector 2. The four electrolytic capacitors 8 are symmetrically distributed in pairs on both sides of the two guide post type connectors 2, with each pair of two electrolytic capacitors 8 extending along... The circuit board substrate 1 is arranged in the width direction, and the pins of the electrolytic capacitor 8 are vertically soldered to the surface of the circuit board substrate 1. A rectangular modular interface module 7 is fixedly installed on the left edge of the circuit board substrate 1. The main body of the interface module 7 is attached to the surface of the circuit board substrate 1, and its side-extending mounting feet are soldered and fixed to the pads on the edge of the circuit board substrate 1. The docking port faces the outside of the circuit board substrate 1. A through-hole component 61 is also soldered in the area between the guide post docking component 2 and the electrolytic capacitor 8. Its pins penetrate the circuit board substrate 1 and are soldered to the back pads.
[0023] In this implementation plan, Figure 1 The parallel layout of the central guide post type docking component 2, combined with the cylindrical columnar docking end 3, allows for more uniform force distribution when the circuit board is docked with the external structure, avoiding the problem of one-sided docking offset. The symmetrical arrangement of the electrolytic capacitors 8 not only makes efficient use of the space around the guide post type docking component 2, but also reduces electromagnetic interference between capacitors, improving the stability of circuit operation. The interface module 7, through the structure of side-extended mounting feet welded to the substrate, increases the connection strength compared to the existing interface that relies solely on pin fixation, effectively solving the problem of easy loosening of the existing interface when receiving force, and ensuring the structural stability during insertion and removal.
[0024] like Figure 2As shown, two guide post type docking components 2 on the circuit board substrate 1 are respectively distributed at both ends of the substrate, and their cylindrical columnar docking ends 3 extend outward; four cylindrical electrolytic capacitors 8 are located between the two guide post type docking components 2, arranged along the length direction of the circuit board substrate 1, and their leads are vertically soldered to the surface of the substrate; several adjustment elements with circular knobs are installed in the area between the guide post type docking components 2 and the electrolytic capacitors 8. The adjustment elements are cylindrical in structure, and their leads are vertically soldered downward to the corresponding pads on the circuit board substrate 1. The knobs protrude from the surface of the circuit board substrate 1; an interface module 7 is also fixedly installed on the right edge of the circuit board substrate 1, and its installation method is the same as that of the interface module on the left.
[0025] In this implementation plan, Figure 2 The placement of the central guide post type docking component 2 at both ends of the substrate, together with the electrolytic capacitor 8 in the middle, makes the stress on the circuit board substrate 1 more balanced, avoiding the problem of excessive local stress and easy deformation of the substrate caused by the concentrated layout of existing guide posts; the adjustment element with a circular knob is integrated on the substrate, replacing the design of the existing external adjustment component, which simplifies the assembly process and saves installation space inside the equipment; the layout of the adjustment element between the guide post and the capacitor takes into account both ease of operation and space utilization, further optimizing the modular design of the circuit board.
[0026] like Figure 3 As shown, the back side of the circuit board substrate 1 is visible: the soldering feet at the bottom of the guide post type docking component 2 are soldered to the pads on the back side of the substrate; the pins of the through-hole component 61 penetrate the circuit board substrate 1 and are soldered to the corresponding pads on the back side; several circular positioning holes 4 are provided on the circuit board substrate 1, and the positioning holes 4 are located in the preset positioning area next to the guide post type docking component 2; the mounting feet extending from the side of the interface module 7 are also soldered to the edge pads on the back side of the substrate.
[0027] In this implementation plan, Figure 3 The demonstrated through-hole component 61 uses a "penetrating substrate + back soldering" method, which, compared to the existing structure that only solders on the front, increases the connection points between the component and the substrate, significantly reducing the risk of pin desoldering caused by equipment vibration, and solving the problem of insufficient installation stability of existing small components.
[0028] like Figure 4As shown, on the front side of the circuit board substrate 1, two guide post type docking components 2 are located at the top two ends respectively; two cuboid toggle switches 5 are soldered to the area between the guide post type docking components 2, and their operating levers extend along the length direction of the circuit board substrate 1, with their pins soldered to the corresponding pads on the substrate; four cylindrical electrolytic capacitors 8 are located in the lower middle area of the substrate, arranged along the width direction of the circuit board substrate 1; interface modules 7 are provided on both sides of the circuit board substrate 1, and several surface-mount small electronic components 6 are distributed in the empty area between the guide post type docking components 2, electrolytic capacitors 8 and interface modules 7, and are soldered to the pads on the surface of the substrate.
[0029] In this implementation plan, Figure 4 The integrated rectangular toggle switch 5 replaces the existing external switch solution, simplifying the assembly process and saving equipment space; the rational distribution of surface-mount small electronic components 6 in the spare area maximizes the use of the substrate space and solves the problem of low space utilization caused by the messy distribution of existing components; the layered layout of the guide posts, switches, and capacitors optimizes the rationality of the circuit routing, reduces signal interference between different components, improves the working performance of the circuit, and makes up for the lack of electromagnetic interference in existing circuit boards.
[0030] Based on the structural design of the above specific embodiments, the guide post positioning and docking type circuit board of this utility model can be adapted to various existing electronic devices and modular assembly scenarios of industrial control modules. The usage status of each structure and the linkage details with existing devices are as follows:
[0031] Scenario 1: Interlocking and assembling modular functional units of industrial control equipment
[0032] In the assembly of existing industrial control equipment (such as signal acquisition units and power output units in automated production lines), traditional circuit boards often suffer from misalignment and poor electrical connection due to the lack of a positioning structure. The process of using this device is as follows: First, align the cylindrical docking end 3 of the guide post docking component 2 of this circuit board with the pre-set guide post hole (the standard positioning structure of the existing unit) on the outer shell of the existing industrial control functional unit. The cylindrical docking end 3 and the positioning hole are used to achieve misalignment-free insertion. At the same time, the positioning hole 4 of the circuit board substrate 1 engages with the auxiliary positioning pin of the existing unit to form a double positioning structure, which replaces the cumbersome operation of aligning screw holes in the existing technology. At this point, the usage status of each structure is as follows: the guide post type docking component 2 is fully fitted with the guide post hole of the existing unit, and its bottom welding foot is electrically connected to the solder pad of the existing unit; the extension mounting foot of the interface module 7 is inserted into the interface slot of the existing unit, and the docking port is precisely docked with the signal interface of the existing unit, avoiding the risk of loosening that traditional interfaces rely solely on pin fixation; the electrolytic capacitors 8 are in a symmetrically arranged working state, which reduces electromagnetic interference between capacitors and ensures the stability of signal acquisition when the industrial control equipment is running under high load; the toggle switch 5 protrudes from the outside of the operation panel of the existing unit and can directly control the circuit on and off without disassembling the equipment casing, solving the problem of cumbersome maintenance operations in the existing technology.
[0033] Scenario 2: Integration and assembly of consumer electronics expansion modules
[0034] In the assembly of existing portable docking stations (such as interface expansion modules for laptops), traditional circuit boards are prone to loosening of interfaces and component desoldering when plugging in or unplugging external devices due to insufficient structural stability. The usage process of this device is as follows: Align the guide post type docking component 2 of this circuit board with the docking slot of the existing docking station host (the standard modular interface structure of the existing host), insert the column-shaped docking end 3 into the guide post positioning slot of the host, and at the same time, the positioning hole 4 cooperates with the positioning pin of the host to complete the precise positioning. After that, it is soldered and fixed to the circuit system of the host through the solder pads. At this time, the usage status of each structure is as follows: the surface-mount components of the small electronic components 6 are attached to the substrate surface, and the through-hole components 61 are soldered to the back side through the substrate. When the expansion dock is shaken (such as when it is moved in a backpack), the pins will not become detached, which solves the defect of easy loosening of traditional expansion dock components; the docking port of the interface module 7 faces the outside of the expansion dock, and its extended mounting feet engage with the fixing slot of the host shell. When plugging and unplugging external devices such as USB flash drives and charging cables, the interface will not shift due to force; the symmetrical layout of the electrolytic capacitors 8 makes full use of the small space of the expansion dock, while reducing electromagnetic interference during charging and ensuring the power supply stability of the expansion dock.
[0035] Scenario 3: Circuit board disassembly and assembly during equipment maintenance
[0036] In the maintenance of existing industrial controllers, traditional circuit boards suffer from inefficiency due to their ambiguous positioning structure, requiring repeated alignment of multiple screw holes and interfaces during disassembly and assembly. The operation of this device is as follows: During maintenance, simply grasp the guide post type connector 2 of this circuit board and pull it out along the axis of the columnar connector end 3 to separate it from the existing controller's connector structure. After replacement or repair, align the columnar connector end 3 with the guide post hole of the existing controller, align the positioning hole 4 with the controller's auxiliary guide post, and insert it smoothly to achieve precise positioning without repeated adjustments. The usage status of each structure is as follows: the guide post type connector 2 serves as the force point for disassembly and assembly; its integrated structure avoids the problem of easily damaging components during the disassembly and assembly of traditional circuit boards. The toggle switch 5 can disconnect the circuit before disassembly and assembly, avoiding the safety hazards of live operation, whereas traditional circuit boards require disconnecting the main power supply of the equipment for operation. When re-connecting the interface module 7, its extended mounting feet can automatically snap into the interface fixing slot of the existing controller, simultaneously completing electrical connection and structural fixation. Compared to the traditional interface which requires separate alignment of pins, this significantly improves maintenance efficiency.
[0037] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be determined by the claims.
Claims
1. A docking circuit board with guide post positioning, characterized in that, The circuit board substrate (1) is rectangular in shape. Two guide post type docking components (2) are fixedly installed side by side in the middle area of the circuit board substrate (1). Each guide post type docking component (2) is integrally formed with an outwardly extending cylindrical column docking end (3). Several cylindrical electrolytic capacitors (8) are welded on the circuit board substrate (1) and on the periphery of the guide post docking component (2). The leads of the electrolytic capacitors (8) are vertically welded to the surface of the circuit board substrate (1). The interface modules (7) with rectangular modular structure are fixedly installed at the relative edge positions of the circuit board substrate (1), and the main body of the interface module (7) is attached to the surface of the circuit board substrate (1). The circuit board substrate (1) is provided with matching circular pads at the mounting positions of the guide post docking component (2), electrolytic capacitor (8), and interface module (7), and the pins of each component are soldered to the corresponding pads. The circuit board substrate (1) has several circular positioning holes (4).
2. The mating circuit board with guide post positioning according to claim 1, characterized in that, The number of electrolytic capacitors (8) is four. The four electrolytic capacitors (8) are symmetrically distributed in pairs on both sides of the two guide post type docking parts (2), and the two electrolytic capacitors (8) in each group are arranged along the width direction of the circuit board substrate (1).
3. The docking circuit board with guide post positioning according to claim 1, characterized in that, On the circuit board substrate (1), in the area between the guide post type docking component (2) and the interface module (7), there are also several adjustment elements with circular knobs. The adjustment elements are cylindrical structures with their pins vertically soldered to the corresponding pads on the circuit board substrate (1). The knobs protrude from the surface of the circuit board substrate (1).
4. The mating circuit board with guide post positioning according to claim 1, characterized in that, Two cuboid toggle switches (5) are welded to the front side of the circuit board substrate (1) near the guide post type docking component (2). The operating tabs of the toggle switches (5) extend along the length of the circuit board substrate (1), and the pins of the toggle switches (5) are welded to the corresponding pads on the circuit board substrate (1).
5. The mating circuit board with guide post positioning according to claim 1, characterized in that, The guide post type docking component (2) is fixed to the solder pad of the circuit board substrate (1) by welding the integrally formed welding foot at the bottom.
6. The mating circuit board with guide post positioning according to claim 1, characterized in that, Several small electronic components (6) are also soldered on the circuit board substrate (1). The small electronic components (6) include surface mount components and through-hole components (61). The surface mount components are soldered to the pads on the surface of the circuit board substrate (1). The pins of the through-hole components (61) penetrate the circuit board substrate (1) and are soldered to the back pads. The small electronic components (6) are distributed in the empty area between the guide post docking component (2), the electrolytic capacitor (8), and the interface module (7).
7. The mating circuit board with guide post positioning according to claim 1, characterized in that, The interface module (7) has a docking end (3) facing the outside of the circuit board substrate (1). The side of the interface module (7) is provided with extended mounting feet. The mounting feet are welded and fixed to the pads on the edge of the circuit board substrate (1). The surface of the interface module (7) is flush with or slightly higher than the surface of the circuit board substrate (1).
