Operation graphical user interface (3) of computer chip manufacturing practical training platform

Abstract

1.The name of the design product: the operation graphical user interface (3) of the computer chip manufacturing practical training platform. 2.The use of the design product: running programs. 3.The design points of the design product: the interface content and interaction mode of the graphical user interface in the screen. 4.The picture or photo that best shows the design points: design 1 front view. 5.The computer is a common design, and there is no design point. The rear view, left view, right view, top view, and bottom view of designs 1 to 6 are omitted. 6.Design 1 is specified as the basic design. 7.The use of the graphical user interface: the interface is mainly used for the operation control of the chip manufacturing practical training platform. Users can personally control the platform to complete the core process steps and truly experience the whole process of chip manufacturing. 8.The human-computer interaction mode of the graphical user interface: a sliding bar is arranged at the rightmost side of the interface in design 1 front view. By clicking and dragging the purple sliding block in the sliding bar to the middle part of the sliding bar, the interface changes to design 1 interface change state diagram 1. Six device graphical option buttons of “ICP Etcher”, “PR Coater”, “Wet Stripper”, “Thermal Oxidation”, “Lithography”, and “RTP” are arranged in the interface of design 1 interface change state diagram 1. By clicking the “ICP Etcher” device graphical option button, the interface changes to design 1 interface change state diagram 2. A “next step” option button is arranged at the upper right corner of design 1 interface change state diagram 2. By clicking the “next step” option button, the interface changes to design 1 interface change state diagram 3. A “next step” option button is arranged at the upper right corner of design 1 interface change state diagram 3. After filling in the parameters in the middle part of design 1 interface change state diagram 3, by clicking the “next step” option button, the interface changes to design 1 interface change state diagram 4. The rightmost side of the design 2 main view interface is provided with a sliding bar. By clicking and dragging the purple sliding block in the sliding bar to the middle of the sliding bar, the design 2 interface change state diagram 1 is jumped to. The design 2 interface change state diagram 1 is provided with six equipment graphic option buttons, i.e. “ICP Etcher”, “PR Coater”, “Wet Stripper”, “Thermal Oxidation”, “Lithography” and “RTP” (same as design 1). By clicking the “PR Coater” equipment graphic option button, the design 2 interface change state diagram 2 is jumped to. The right upper corner of the design 2 interface change state diagram 2 is provided with a “next step” option button. By clicking the “next step” option button, the design 2 interface change state diagram 3 is jumped to. The right upper corner of the design 2 interface change state diagram 3 is provided with a “next step” option button. After filling in the parameters in the middle of the design 2 interface change state diagram 3, by clicking the “next step” option button, the design 2 interface change state diagram 4 is jumped to. The rightmost side of the design 3 main view interface is provided with a sliding bar. By clicking and dragging the purple sliding block in the sliding bar to the middle of the sliding bar, the design 3 interface change state diagram 1 is jumped to. The design 3 interface change state diagram 1 is provided with six equipment graphic option buttons, i.e. “ICP Etcher”, “PR Coater”, “Wet Stripper”, “Thermal Oxidation”, “Lithography” and “RTP” (same as design 1). By clicking the “Wet Stripper” equipment graphic option button, the design 3 interface change state diagram 2 is jumped to. The right upper corner of the design 3 interface change state diagram 2 is provided with a “next step” option button. By clicking the “next step” option button, the design 3 interface change state diagram 3 is jumped to. The right upper corner of the design 3 interface change state diagram 3 is provided with a “next step” option button. After filling in the parameters in the middle of the design 3 interface change state diagram 3, by clicking the “next step” option button, the design 3 interface change state diagram 4 is jumped to. The rightmost side of the main view interface of Design 4 is provided with a sliding bar. By clicking and dragging the purple sliding block in the sliding bar to the middle of the sliding bar, the interface changes to Design 4 interface change state diagram 1. The interface of Design 4 interface change state diagram 1 is provided with six device graphical option buttons, i.e. “ICP Etcher”, “PR Coater”, “Wet Stripper”, “Thermal Oxidation”, “Lithography” and “RTP” (the same as Design 1). By clicking the “Thermal Oxidation” device graphical option button, the interface changes to Design 4 interface change state diagram 2. The upper right corner of Design 4 interface change state diagram 2 is provided with a “next step” option button. By clicking the “next step” option button, the interface changes to Design 4 interface change state diagram 3. The upper right corner of Design 4 interface change state diagram 3 is provided with a “next step” option button. After filling in the parameters in the middle of Design 4 interface change state diagram 3, by clicking the “next step” option button, the interface changes to Design 4 interface change state diagram 4. The rightmost side of the main view interface of Design 5 is provided with a sliding bar. By clicking and dragging the purple sliding block in the sliding bar to the middle of the sliding bar, the interface changes to Design 5 interface change state diagram 1. The interface of Design 5 interface change state diagram 1 is provided with six device graphical option buttons, i.e. “ICP Etcher”, “PR Coater”, “Wet Stripper”, “Thermal Oxidation”, “Lithography” and “RTP” (the same as Design 1). By clicking the “Lithography” device graphical option button, the interface changes to Design 5 interface change state diagram 2. The upper right corner of Design 5 interface change state diagram 2 is provided with a “next step” option button. By clicking the “next step” option button, the interface changes to Design 5 interface change state diagram 3. The upper right corner of Design 5 interface change state diagram 3 is provided with a “next step” option button. After filling in the parameters in the middle of Design 5 interface change state diagram 3, by clicking the “next step” option button, the interface changes to Design 5 interface change state diagram 4. The rightmost side of the design 6 main view interface is provided with a sliding bar. By clicking and dragging the purple sliding block in the sliding bar to the middle of the sliding bar, the design 6 interface change state diagram 1 is jumped to. The design 6 interface change state diagram 1 is provided with six equipment graphic option buttons (the same as the design 1) of “ICP Etcher”, “PR Coater”, “Wet Stripper”, “Thermal Oxidation”, “Lithography” and “RTP”. By clicking the “RTP” equipment graphic option button, the design 6 interface change state diagram 2 is jumped to. The right upper corner of the design 6 interface change state diagram 2 is provided with a “next step” option button. By clicking the “next step” option button, the design 6 interface change state diagram 3 is jumped to. The right upper corner of the design 6 interface change state diagram 3 is provided with a “next step” option button. After filling in the parameters in the middle of the design 6 interface change state diagram 3, the “next step” option button is clicked, and the design 6 interface change state diagram 4 is jumped to.

Images