Heat dissipation module
CN310121086SActive Publication Date: 2026-07-28BOLUO GUIHONGMING HARDWARE ELECTRONICS CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- BOLUO GUIHONGMING HARDWARE ELECTRONICS CO LTD
- Filing Date
- 2026-01-19
- Publication Date
- 2026-07-28
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Figure 000007_ABST
Abstract
1. Name of the product in this design: Heat dissipation module. 2. Purpose of this design: for heat dissipation. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D rendering 1.
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