Assembly and method for producing an insulating layer of electrical conductors
The mold-based assembly and method create a homogeneous insulating layer on electrical conductors by using spacers to ensure uniform compound application, addressing inefficiencies and costs in conventional methods, enhancing electrical performance and flexibility.
Patent Information
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- SIEMENS ENERGY INC
- Filing Date
- 2017-07-25
- Publication Date
- 2026-06-11
AI Technical Summary
Conventional methods for producing insulating layers on electrical conductors, such as winding coils, are costly, inhomogeneous, and rely heavily on chemical processes like vacuum pressure impregnation, leading to inefficiencies and high manufacturing costs.
A mold-based assembly and method that uses spacers to maintain a uniform gap between the conductor and the mold cavity, allowing for continuous filling and curing of an insulating compound to form a homogeneous layer, eliminating the need for mica-based tapes and vacuum pressure impregnation.
This approach results in a homogeneous insulating layer with improved electrical performance, reduced manufacturing costs, and flexibility in compound composition, enabling easier repair and modification.
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Abstract
Description
TECHNICAL AREA
[0001] This invention generally relates to an assembly and a method for producing an insulating layer of an electrical conductor. DESCRIPTION OF THE STATE OF THE ART
[0002] An electrical conductor can be used in an electric machine, such as a generator or a motor. The electrical conductor can be a winding coil. The electrical conductor may need to be insulated by an insulating layer.
[0003] JP 2 851 112 B2 describes an arrangement for manufacturing cast insulators without an insulating space, in which no cracks, short circuits, and the like occur, by holding a body to be cast in casting resin. The portion located near the top is cured by locally increasing its temperature, while simultaneously the remaining portion of the casting resin, including the supports, is kept in an uncured, soft state. This allows the supports to be withdrawn from the casting cavity, and the casting resin to be preloaded into the cavities created by the withdrawal of the supports, thus curing the entire casting resin. Conventionally, the insulating layer of the electrical conductor is produced by wrapping the conductor with mica-based insulating tape and then by penetrating or filling the insulating region with a resin, forming a cured mica-resin insulation.Such a process can have disadvantages, such as high manufacturing costs, inhomogeneous insulation, etc. The process can make extensive use of chemical production processes, such as vacuum pressure impregnation (VPI). BRIEF SUMMARY OF THE INVENTION
[0004] In brief, aspects of this invention relate to an assembly and a method for producing an insulating layer of an electrical conductor.
[0005] The object of the present invention is to provide an improved assembly and a method for producing an insulating layer of an electrical conductor.
[0006] This problem is solved by means of an assembly having the features of claims 1 to 7 and by means of a method having the features of claims 8 and 9.
[0007] According to one aspect, an assembly for producing an insulating layer of an electrical conductor is presented. The assembly includes a mold that contains a cavity for enclosing the electrical conductor. The assembly includes a supply reservoir for holding an insulating compound. The assembly includes a supply line connected to the reservoir and an inlet opening of the cavity for filling the cavity with the insulating compound. The assembly includes a spacer embedded in a hole in the mold. The hole is connected to the cavity. The spacer is designed to be movable from the hole in the mold into the cavity to hold the electrical conductor within the cavity and maintain a gap between the conductor and a surface of the cavity. The spacer is also designed to be movable from the cavity into the hole in the mold to maintain a smooth surface of the cavity.The insulating compound fills the entire gap between the electrical conductor and the surface of the cavity, forming the insulating layer.
[0008] According to one aspect, a method for producing an insulating layer of an electrical conductor is presented. The method involves enclosing the electrical conductor in a cavity of a mold. A spacer is embedded in a hole of the mold. The hole is connected to the cavity. The method involves moving the spacer from the hole of the mold into the cavity to hold the electrical conductor within the cavity and maintain a gap between the electrical conductor and the surface of the cavity. The method involves filling an insulating compound from an inlet opening of the cavity through a supply line into the cavity. The supply line is connected to a supply tank. The method involves moving the spacer from the cavity into the hole of the mold to maintain a smooth surface of the cavity.The process involves continuously filling the gap with insulating compound until the insulating compound fills the entire gap between the electrical conductor and the surface of the cavity, thereby forming the insulating layer.
[0009] Various aspects and embodiments of the application, as described above and below, can be used not only in the explicitly described combinations but also in other combinations. Modifications will occur to the person skilled in the art when reading and understanding the description. BRIEF DESCRIPTION OF THE DRAWINGS
[0010] Examples of the application's implementation are explained in more detail with reference to the accompanying drawings. The drawings include: Fig. Figure 1 illustrates a schematic partial cross-sectional side view of an assembly for producing an insulating layer of an electrical conductor according to an embodiment of the invention; Fig. Figure 2A illustrates a schematic enlarged partial cross-sectional view of the assembly according to an embodiment of the invention along a [path / section / section] Fig. Line AA shown in 1, wherein according to Fig. 2A Spacers are shown in a cavity, with insulating material filling the gap except for the space occupied by the spacers; Fig. Figure 2B illustrates a schematic enlarged partial cross-sectional view of the assembly according to an embodiment of the invention along a [path / section / section] Fig. Line AA shown in 1, wherein according to Fig. 2B Spacers are shown in holes of a mold, with insulating material filling the entire gap; Fig. Figure 2C illustrates a schematic enlarged partial cross-sectional view of the assembly according to an embodiment of the invention along a [path / section / section] Fig. Line AA shown in 1, wherein according to Fig. 2C is shown as insulating compound that has hardened to form a solid insulating layer of the electrical conductor.
[0011] For better understanding, identical reference numbers were used wherever possible to identify identical elements common to the figures. DETAILED DESCRIPTION OF THE INVENTION
[0012] A detailed description relating to aspects of the present invention is described below with reference to the accompanying figures.
[0013] Fig. Figure 1 illustrates a schematic partial cross-sectional side view of an assembly 100 for producing an insulating layer of an electrical conductor 200 according to an embodiment of the invention. The assembly 100 includes a mold 110. The mold 110 can comprise an upper part 111 and a lower part 112. A cavity 114 can be formed inside the mold 110 when the mold 110 is closed by placing the upper part 111 onto the lower part 112. An electrical conductor 200 can be enclosed in the cavity 114 of the mold 110. The electrical conductor 200 can be a winding bar of an electric machine, such as a generator. The mold 110 can be closed after the electrical conductor 200 has been placed in the cavity 114. Edges between the upper part 111 and the lower part 112 can be sealed by means of a sealing element 113.The sealing element 113 can maintain a vacuum in the cavity 114 once a vacuum has been established in the cavity 114. The sealing element 113 can, for example, include a silicone rubber seal. (When in .) Fig. Figure 1 illustrates a cavity 114 inside the mold 110. According to one embodiment, a plurality of cavities 114 can be formed inside the mold 110. A plurality of electrical conductors 200 can each be enclosed in the plurality of cavities 114.
[0014] The cavity 114 can include at least one inlet opening 122 for filling with insulating compound 201. The inlet opening 122 can be located at a lower part of the cavity 114, so that air within the cavity 114 can be forced from the lower part to the upper part when the insulating compound 201 is filled into the cavity 114. Such an arrangement can prevent air bubbles inside the insulating compound 201. The cavity 114 can include at least one overflow opening 132 for the insulating compound 201 to overflow. The overflow opening 132 can be located at the upper part of the cavity 114 to ensure that the cavity 114 is completely filled with the insulating compound 201.
[0015] According to one embodiment, the insulating compound 201 can comprise a filled polymer or a filled organic compound consisting of a polymer matrix and inorganic fillers. For example, the polymer matrix of the insulating compound 201 can comprise epoxy, phenolic resins, novolac, polyimide, silicone rubber, polyethylene, or polypropylene. The inorganic fillers of the insulating compound 201 can comprise mica, aluminum oxide, silicon dioxide, clay, etc. The insulating compound 201 can also comprise various functional additives, such as curing accelerators, fracture tougheners, antioxidants, thermal conductivity enhancers, etc.
[0016] The assembly 100 can include a supply tank 120. The supply tank 120 contains an insulating compound 201. A supply line 121 is connected to the supply tank 120 and the inlet opening 122 of the cavity 114. The insulating compound 201 can be injected from the supply tank 120 into the cavity 114 through the supply line 121 and the inlet opening 122. A supply control valve 123 can be arranged in the supply line 121. The supply control valve 123 is open during the injection of the insulating compound 201 into the cavity 114. The supply control valve 123 closes as soon as the entire cavity 114 is filled with the insulating compound 201. A smooth surface of the cavity 114 is maintained at the inlet opening 122 as soon as the supply control valve 123 is closed.
[0017] The assembly 100 can include an overflow tank 130. The overflow tank 130 can be connected to an overflow opening 132 of the cavity 114 via an overflow line 131. The overflow tank 130 can receive overflow of the insulating compound 201 from the cavity 114 via the overflow opening 132. An overflow control valve 133 can be arranged in the overflow line 131. The overflow control valve 133 is open during the filling of the cavity 114 with the insulating compound 201. The overflow control valve 133 closes as soon as the entire cavity 114 is filled with the insulating compound 201. A smooth surface of the cavity 114 is maintained at the overflow opening 132 as soon as the overflow control valve 133 is closed.
[0018] The assembly 100 can include a vacuum device 140. The vacuum device 140 is connected to a vacuum opening 142 of the cavity 114 by a vacuum line 141. The vacuum device 140 can create a vacuum in the cavity 114 before the insulating compound is poured into it. A vacuum control valve 143 can be arranged on the vacuum line 141. The vacuum control valve 143 is open while the vacuum is being created in the cavity 114. The vacuum control valve 143 closes as soon as a certain degree of vacuum is reached in the cavity 114 and maintained for a period of time. A smooth surface of the cavity 114 is maintained at the vacuum opening 142 as soon as the vacuum control valve 143 is closed.
[0019] The assembly 100 can include a curing device 150. The curing device 150 can be embedded in the mold 110. The curing device 150 can include a heating device 151. The curing device 150 can include a cooling device 151. The curing device 150 can maintain the mold 110 at a certain temperature. The curing device 150 can heat or cool the mold 110 based on a curing temperature profile of the insulating compound 201 for curing the insulating compound 201 in the cavity 114.
[0020] Assembly 100 includes at least one spacer 160. The spacer 160 can be embedded in a hole 161 of the mold 110. The hole 161 is connected to the cavity 114. The spacer 160 can be moved from the hole 161 of the mold 110 into the cavity 114 to hold the electrical conductor 200 in the cavity 114. The spacer 160 can hold the electrical conductor 200 in the cavity 114 to maintain a gap 163 between the electrical conductor 200 and the surface of the cavity 114. Insulating compound 201 can be injected into the gap 163 through the inlet opening 122. The spacer 160 can be moved from the cavity 114 into the hole 161 of the mold to maintain a smooth surface of the cavity 114. A control device 162 can be functionally connected to the spacer 160 to control a movement of the spacer 160. The control device 162 can include something like a digital microprocessor. According to the in Fig. In the illustrated embodiment 1, the assembly 100 includes a plurality of spacers 160.
[0021] Fig. 2A, Fig. 2B and Fig. Figure 2C illustrates enlarged schematic partial cross-sectional views of assembly 100 according to an embodiment of the invention along a [path / section / etc.]. Fig. Line AA shown in 1. According to Fig. 1 and Fig. 2A, the spacers 160 are moved from the hole 161 of the shape 110 into the cavity 114. The spacers 160 hold the electrical conductor 200 in the cavity 114 to maintain a gap 163 between the electrical conductor 200 and the surface of the cavity 114. The supply control valve 123 is open. The overflow control valve 133 is open. Insulating compound 201 is filled from the supply line 121 through the inlet opening 122 into the gap 163, except for the spaces occupied by the spacers 160.
[0022] According to Fig. 1 and Fig. 2B, the spacers 160 are moved from the cavity 114 into the hole 161 of the mold 110 to maintain a smooth surface of the cavity 114. The insulating compound 201 is continuously poured into the gap 163 to fill the spaces previously occupied by the spacers 160. The supply control valve 123 and the overflow control valve 133 are closed after the entire gap 163 has been filled with the insulating compound 201. A smooth surface of the cavity 114 is maintained after the supply control valve 123 and the overflow control valve 133 have been closed.
[0023] According to Fig. 1 and Fig.2C Any remaining insulating compound 201 in the supply line 121 can be drawn back into the supply tank 120 after the supply control valve 123 has been closed. Similarly, any remaining insulating compound 201 in the overflow line 131 can be drawn back into the overflow tank 130 after the overflow control valve 133 has been closed. The insulating compound 201 is cured by the heating device 151 and the cooling device 152, based on a curing temperature profile for the insulating compound 201. The cured insulating compound 201 forms a solid insulating layer 202 around the electrical conductor 200. The width of the gap 163 is defined by the thickness of the insulating layer 202. The spacer 160 maintains a uniform distance across the entire gap 163 between the electrical conductor 200 and the surface of the cavity 114.The uniform width of the gap 163 and the smooth surface of the cavity 114 can provide the insulation layer 202 with a homogeneous thickness.
[0024] A process for producing an insulating layer 202 of an electrical conductor 200 according to an embodiment of the invention can be as follows. The mold 110 is open. The spacers 160 on the lower part 112 of the mold 110 are moved out of the holes 161 into the cavity 114, the width of which is defined by the thickness of the insulating layer 202. An electrical conductor 200 can be placed in the cavity 114. The mold 110 is closed by placing the upper part 111 of the mold 110 onto the lower part 112. The spacers 160 on the upper part 111 of the mold 110 are moved out of the holes 161 into the cavity 114, the same width being defined by the thickness of the insulating layer 202. A gap 163 with a uniform width between the electrical conductor 200 and the surface of the cavity 114 is held by the spacers 160.Edges between the upper part 111 and the lower part 112 are sealed by means of a sealing element 113. The curing device 150 can maintain the mold 110 and the electrical conductor 200 at a certain temperature. The vacuum control valve 143 is open. A vacuum is created by a vacuum device 140 through a vacuum line 141 and a vacuum port 142 in the cavity 114. The vacuum control valve 143 closes as soon as a certain degree of vacuum is reached in the cavity 114 and maintained for a period of time. A smooth surface of the cavity 114 is maintained at the vacuum port 142 once the vacuum control valve 143 is closed. The supply control valve 123 is open. The overflow control valve 133 is open. The insulating compound 201 is filled from a supply tank 120 through a supply line 121 and an inlet port 122 into the gap 163.An excess of the insulating compound 201 flows through an overflow pipe 131 and an overflow opening 132 into an overflow tank 130. The spacers 160 are moved from the cavity 114 into the holes 161 of the mold 110 after the gap 163 has been filled with the insulating compound 201, except for the spaces occupied by the spacers 160.
[0025] A smooth surface of the cavity 114 is maintained once the spacers 160 are moved into the holes 161. The insulating compound 201 is continuously poured into the gap 163 to fill the spaces previously occupied by the spacers 160. The insulating compound 201 fills the entire gap 163 between the electrical conductor 200 and the surface of the cavity 114 with a uniform thickness defined by the insulating layer 202. The supply control valve 123 is closed. The overflow control valve 133 is closed. A smooth surface of the cavity 114 is maintained after the supply control valve 123 and the overflow control valve 133 have been closed. Any remaining insulating compound 201 in the supply line 121 can be drawn back into the supply tank 120 after the supply control valve 123 has been closed.Residues of the insulating compound 201 in the overflow pipe 131 can be drawn back into the overflow tank 130 after the overflow control valve 133 has been closed. The insulating compound 201 is cured by heating and cooling the mold 110 using the heating device 151 and the cooling device 152, based on a specific curing temperature profile, until a solid insulating layer 202 of the electrical conductor 200 is formed. The electrical conductor 200 is removed from the mold 110. Post-processing procedures can be applied to the insulating layer 202 of the electrical conductor 200.
[0026] According to one aspect, the proposed assembly 100 and the method for producing an insulating layer 202 of an electrical conductor 200 can provide a homogeneous insulating layer 202 of the electrical conductor 200. The homogeneous insulating layer 202 can improve the electrical performance of the electrical conductor 200 and reduce electrical insulation failure of the electrical conductor 200 due to inhomogeneous areas.
[0027] According to one aspect, the proposed assembly 100 and the method for producing an insulating layer 202 of an electrical conductor 200 can allow greater flexibility for the insulating compound 201 to meet different design requirements for different electrical conductors 200. The proposed embodiments of the invention can provide an easier way to change the composition of an insulating compound 201; for example, certain additives can be added to the insulating compound 201 to increase the thermal conductivity of the insulating layer 202.
[0028] According to one aspect, the proposed assembly 100 and the method for producing an insulating layer 202 of an electrical conductor 200 can repair the insulating layer 202 by injecting the same insulating compound 201 as in the original manufacture.
[0029] According to one aspect, the proposed assembly 100 and the method can produce an insulating layer 202 of an electrical conductor 200 without wrapping the electrical conductor 200 with a mica-based insulating tape. The proposed method can modify the production process for manufacturing an insulating layer 202. For example, the proposed method can eliminate a vacuum pressure impregnation (VPI) process during the manufacture of the insulating layer 202. The proposed method can produce an insulating layer 202 of an electrical conductor 200 by injection and curing.
[0030] According to one aspect, the proposed assembly 100 and the method for producing an insulating layer 202 of an electrical conductor 200 can provide a variety of advantages for producing the insulating layer 202 of the electrical conductor 200, for example, significant reduction in manufacturing costs, better electrical performance of the insulating layer 202 of the electrical conductor 200, desired electrical properties of the insulating layer 202 of the electrical conductor 200, and easier repair of the insulating layer 202 of the electrical conductor 200, etc.
[0031] Although various embodiments incorporating the teachings of the present invention have been shown and described in detail here, those skilled in the art can immediately devise many other varied embodiments that still incorporate these teachings. The invention is not limited in its application to the details of the exemplary embodiment with regard to the construction and arrangement of components described in the text or illustrated in the drawings. The invention is capable of other embodiments and of being implemented or carried out in various ways. It is also understood that the phraseology and terminology used herein serve descriptive purposes and are not to be considered limiting. The use of "include," "comprise," or "feature" and their variants herein is intended to include both the points listed below and their equivalents, as well as additional points.Unless otherwise specified or limited, the terms "mounted," "connected," "held," and "coupled," and their variants, are used broadly and include direct and indirect assemblies, connections, supports, and couplings. Furthermore, "connected" and "coupled" are not limited to physical or mechanical connections or couplings. Reference symbol list: 100 assembly 110 Form 111 Upper part of the form 112 Lower part of the form 113 Sealing element 114 Cavity 120 supply tank 121 Supply line 122 Entrance 123 Supply control valve 130 overflow tank 131 Overflow pipe 132 Overflow opening 133 Overflow control valve 140 vacuum device 141 Vacuum line 142 Vacuum opening 143 Vacuum control valve 150 curing device 151 Heating device 152 Cooling device 160 spacer 161 holes 162 Control device 163 Gap between electrical conductor and the surface of the cavity 200 Electrical conductor 201 Insulation compound 202 Insulation layer
Claims
[1] Assembly (100) for producing an insulating layer (202) of an electrical conductor (200) comprising the following: a form (110) comprising a cavity (114) for enclosing the electrical conductor (200); a supply tank (120) for holding an insulating mass (201); a supply line (121) which is connected to the supply tank (120) and an inlet opening (122) of the cavity (114) for filling the insulating compound (201) into the cavity (114); a spacer (160) embedded in a hole (161) of the shape (110), wherein the hole (161) is connected to the cavity (114), wherein the spacer (161) is designed to be movable from the hole (161) of the shape (110) into the cavity (114) in order to hold the electrical conductor (200) with a gap (163) between the electrical conductor (200) and a surface of the cavity (114) in the cavity (114), wherein the spacer (160) is designed to be movable from the cavity (114) into the hole (161) of the mold (110) in order to maintain a smooth surface of the cavity (114), and an overflow tank (130) which is connected via an overflow line (131) to an overflow opening (132) of the cavity (114), wherein the overflow opening (132) is located at an upper part of the cavity (114) and an overflow control valve (133) is arranged in the overflow line (131), wherein the insulating mass (201) fills the entire gap (163) between the electrical conductor (200) and the surface of the cavity (114), forming the insulating layer (202). [2] Assembly (100) according to claim 1, wherein a width of the gap (163) is defined by a thickness of the insulating layer (202) of the electrical conductor (200). [3] Assembly (100) according to claim 1, which further comprises a control device (162) for controlling a movement of the spacer (160). [4] Assembly (100) according to claim 1, wherein the form (110) comprises an upper part (111) and a lower part (112), and wherein the assembly (100) further comprises a sealing element (113) for sealing an edge between the upper part (111) and the lower part (112). [5] Assembly (100) according to claim 1, wherein the inlet opening (122) is located at a lower part of the cavity (114). [6] Assembly (100) according to claim 1, further comprising a vacuum device (140) connected to a vacuum opening (142) of the cavity (114) for producing a vacuum in the cavity (114). [7] Assembly (100) according to claim 1, which further comprises a curing device (150) for curing the insulating compound (201). [8] Method for producing an insulating layer (202) of an electrical conductor (200) comprising the following steps: Enclosing the electrical conductor (200) in a cavity (114) of a shape (110), wherein a spacer (160) is embedded in a hole (161) of the shape (110) and wherein the hole (161) is connected to the cavity (114); Moving the spacer (160) from the hole (161) of the mold (110) into the cavity (114) to connect the electrical conductor (200) with a gap (163) between the electrical conductor (200) and a surface of the cavity (114) in the cavity (114); Filling an insulating compound (201) into the gap (163) from an inlet opening (122) of the cavity (114) through a supply line (121), wherein the supply line (121) is connected to a supply tank (120) and an excess of the insulating compound (201) flows through an overflow opening (132) at an upper part of the cavity (114) via an overflow line (131) into an overflow tank (130), wherein an overflow control valve (133) is arranged in the overflow line (131), which is open during the filling of the insulating compound (201) into the cavity (114) and is closed as soon as the entire cavity (114) is filled with the insulating compound (201); Moving the spacer (160) from the cavity (114) into the hole (161) of the mold (110) to maintain a smooth surface of the cavity (114); and continuous filling of the insulating compound (201) into the gap (163) until the insulating compound (201) fills the entire gap (163) between the electrical conductor (200) and the surface of the cavity (114), forming the insulating layer (202). [9] Method according to claim 8, wherein a width of the gap (163) is defined by a thickness of the insulating layer (202) of the electrical conductor (200).