AUTOMATIC FIRST-IN FIRST-OUT SOLDER CONTAINER FEEDING MANAGEMENT SYSTEM

Abstract

Automatic first-in, first-out solder container feeding management system (10), comprising: a cooling chamber (100) configured to store a variety of solder containers (2); a transfer part (200) which is arranged outside the cooling chamber (100) and configured to move at least one of the plurality of solder containers (2); a stirring element (300) formed and configured at one end of the transfer element (200) to stir the at least one solder container (2); and a hand part (400) configured to move any solder container (2) of the at least one solder container (2) positioned on the transfer part (200) to the stirring part (300); wherein the cooling chamber (100) includes a cooling housing (110) and a plurality of bearing wall parts (120) which are arranged in the cooling housing (110) and each configured to hold the plurality of solder containers (2); wherein the plurality of solder containers (2) are stored and arranged on each of the plurality of bearing wall parts (120) in a line inclined towards a floor; wherein each of the plurality of storage wall parts (120) includes a solder discharge part (123) configured to discharge an outermost solder reservoir (2) from the plurality of stored solder reservoirs (2) onto the transfer part (200); and wherein the solder discharge part (123) rests on the transfer part (200) and discharges the outermost solder container (2).

Description

BACKGROUND OF THE INVENTION 1. Field of the invention

[0001] Embodiments of the present invention relate to an automatic first-in, first-out solder container feeding management system. 2. Discussion of the related facts

[0002] Generally, solder pastes are applied in a molten state in a specific pattern to printed circuit boards used in electronic devices such as automotive components, computers, mobile phones, and household appliances, allowing for the attachment of various types of small electronic components, such as semiconductor chips. These solder pastes are stored in a solder container for distribution and storage and must be kept cool to prevent oxidation within the container.

[0003] Furthermore, if a user wishes to use solder paste immediately after removing it from a cooling chamber, condensation or a similar phenomenon may occur, making it necessary to leave the solder paste at room temperature for a certain period of time. Additionally, solder powder may precipitate in the remaining solder paste, necessitating that the paste be stirred for a predetermined time before use.

[0004] However, conventionally, the processes described above, such as refrigerated storage in a cold storage chamber, storage at room temperature for a specific period before use, and stirring, are all performed manually in individual devices, and first-in-first-out (FIFO) management for refrigerated and room temperature storage is not properly implemented. Consequently, a problem arises in that it is difficult for an operator to confirm the precise storage time for a large number of solder pastes at room temperature when using multiple pastes. This leads to numerous issues, such as the solder pastes not being stored at room temperature for a sufficient time due to operator confusion, or the production of defective products due to the lack of stirring.

[0005] Publication CN 107159999 A describes an automatic storage machine for solder containers for surface mount (SMT) applications. [Document of related information][Patent document]

[0006] Korean Patent No. 10-1186380 (Published on September 20, 2012) SUMMARY OF THE INVENTION

[0007] Embodiments of the present invention aim to provide an automatic first-in, first-out solder container feeding management system capable of preventing oxidation of the contents of solder containers by storing a large number of solder containers in a cooling chamber.

[0008] Other embodiments of the present invention aim to provide an automatic first-in, first-out solder container feeding management system that is capable of storing solder containers unloaded from a cooling chamber at room temperature for a certain period of time and then automatically stirring the solder containers.

[0009] Other embodiments of the present invention aim to provide an automatic first-in, first-out solder container feeding management system that is capable of selecting and feeding only one solder container of a particular manufacturer or type according to the needs of a user by classifying a plurality of solder containers according to each manufacturer or type and storing the plurality of solder containers in a cooled state and at room temperature.

[0010] Other embodiments of the present invention aim to provide an automatic first-in, first-out solder container feeding management system that can increase safety and convenience for the operator and in which the unloading of solder containers from a cooling chamber, the storage of solder containers at room temperature and the feeding of solder containers into a stirrer in a first-in, first-out manner are automated and which communicates with a manufacturing execution system (MES).

[0011] According to one aspect of the present invention, an automatic first-in, first-out solder container feeding management system is provided, comprising a cooling chamber configured to store a plurality of solder containers; a transfer part positioned outside the cooling chamber and configured to move at least one of the plurality of solder containers; a stirring part formed at one end of the transfer part and configured to stir the at least one solder container; and a hand part configured to move any one of the solder containers of the at least one solder container positioned on the transfer part.

[0012] According to the invention, the cooling chamber comprises a cooling housing and a plurality of bearing wall parts arranged in the cooling housing and each configured to hold the plurality of solder containers, and the plurality of solder containers are held and arranged on each of the plurality of bearing wall parts in a line inclined towards a floor.

[0013] According to the invention, each of the plurality of bearing wall parts includes a solder discharge part configured to discharge an outermost solder container from the plurality of stored solder containers to the transfer part, and the solder discharge part rests on the transfer part and discharges the outermost solder container.

[0014] The transfer part can include a plurality of first conveying parts arranged and configured at the same arrangement interval as the plurality of bearing wall parts to transfer the solder container discharged from the cooling chamber, and a second conveying part arranged and configured in a direction perpendicular to a transfer direction of the first conveying part to transfer the solder container to the stirring part.

[0015] The transfer part can further include a plurality of gripping parts for transporting the solder container positioned on the plurality of first conveying parts to the side of the second conveying part, wherein each of the plurality of gripping parts can transport the solder containers that are unloaded or dispensed from the cooling chamber on the plurality of first conveying parts after a predetermined time has elapsed, and each of the plurality of gripping parts can only transport the solder container that is positioned at a predetermined position under the plurality of first conveying parts on the first conveying part to the second conveying part.

[0016] The number of the first conveying components can be the same as the number of the bearing wall components, and the first conveying components can be arranged below the bearing wall components in a lateral direction.

[0017] The handpiece may include a gripper configured to grasp any of the solder containers on the transfer part, and a hand drive part configured to move the gripper to one side in a lateral direction, with the gripper being able to move up and down in a direction perpendicular to a floor.

[0018] The stirring part can include a support frame, a stirring plate connected to the support frame via a variety of elastic support parts, and a mounting part positioned on the stirring plate on which the solder container is mounted.

[0019] The mounting part can be in the form of a hollow cylinder and a longitudinal central axis of it can be positioned so that it is inclined with respect to a ground.

[0020] The support frame can be positioned so that it encloses an outer side surface of the mixing plate in a lateral direction, the support frame can be connected to a side section of the mixing plate in the lateral direction by the plurality of elastic support parts, and the mixing plate can be rotatable about a rotational center axis. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The aforementioned and other tasks, features, and advantages of the present invention will become clearer to persons skilled in the art by describing exemplary embodiments in detail with reference to the accompanying drawings. The figures in the drawings show the following: Fig. Figure 1 is a view showing an automatic first-in, first-out solder container feeding management system according to an embodiment of the present invention; Fig. Figure 2 is an enlarged view of part A of Fig. 1; Fig. Figure 3 is a side view of the automatic first-in, first-out solder container feeding management system according to the embodiment of the present invention; Fig. Figure 4 is a front view of the automatic first-in, first-out solder container feeding management system according to the embodiment of the present invention; Fig. Figure 5 is an enlarged view of a handpiece of the automatic first-in, first-out solder container feeding management system according to the embodiment of the present invention; Fig. Figure 6 is another side view of the automatic first-in, first-out solder container feeding management system according to the embodiment of the present invention; and Fig. Figure 7 is an enlarged view of a stirring part of the automatic first-in, first-out solder container feeding management system according to the embodiment of the present invention. DETAILED DESCRIPTION OF EXAMPLE EXECUTIONS

[0022] Exemplary embodiments of the present invention are described in detail below with reference to the accompanying drawings. However, these embodiments are only examples, and the present invention is not limited to them.

[0023] If it is determined that detailed descriptions of related known technologies unnecessarily obscure the core of the present invention when describing it, the detailed descriptions will be omitted. Some of the terms described below are defined with regard to the functions of the present invention, and their meanings may vary depending on the intentions or habits of a user or operator. Therefore, throughout this description, the meanings of the terms are to be interpreted based on the scope of the present invention.

[0024] The technical concept of the present invention is defined by the attached claims. The following embodiments serve only to efficiently describe the technical scope of the present invention for a person skilled in the art.

[0025] Fig. Figure 1 is a view showing an automatic first-in, first-out solder container feeding management system 10 according to an embodiment of the present invention.

[0026] With reference to Fig. 1, the automatic first-in, first-out solder container feeding management system 10 according to the embodiment of the present invention can include a cooling chamber 100 configured to store or receive a plurality of solder containers 2, a transfer part 200 positioned outside the cooling chamber 100 and configured to move at least one of the plurality of solder containers 2, a stirring part 300 formed at one end of the transfer part 200 and configured to stir the at least one solder container 2, and a hand part 400 for moving any one of the solder containers 2 from the transfer part 200 to the stirring part 300.

[0027] This means that the multitude of solder containers 2 can be stored in a cooled state in the cooling chamber 100, the solder container 2 unloaded from the cooling chamber 100 can be transferred by the transfer part 200, and the solder container 2, which is moved by the hand part 400 to the stirring part 300, can be stirred by the stirring part 300.

[0028] Furthermore, the cooling chamber 100 can include a cooling housing 110, in which an internal temperature can be set, and a plurality of storage wall sections 120, which are arranged in the cooling housing 110 and each configured to store the plurality of solder containers 2. In this case, the plurality of solder containers 2 can be stored and arranged on each of the plurality of storage wall sections 120 in a line inclined towards the floor.

[0029] Furthermore, different types of solder containers 2 can be stored in each of the multiple storage wall sections 120. That is, a user can separate the different solder containers 2 and store them in the multiple storage wall sections 120 according to each manufacturer or specific application, and multiple solder containers 2 manufactured by the same manufacturer or with the same specific use can be stored in each of the multiple storage wall sections 120.

[0030] Furthermore, the transfer part 200 can include a plurality of first conveying parts 210, which are arranged and configured in the same arrangement interval as the plurality of bearing wall parts 120, to transfer the solder container 2 discharged into the cooling chamber 100, and a second conveying part 220, which is arranged and configured in a direction perpendicular to a transmission direction or transfer direction of the first conveying parts 210, to transfer the solder container 2 into the stirring part 300.

[0031] In particular, if three bearing wall sections 120 are arranged at a predetermined distance, three first conveying sections 210 can be arranged at the same distance as the plurality of bearing wall sections 120. Furthermore, at least one of the plurality of solder containers 2 can be unloaded or discharged in the cooling housing 110 to one end of the first conveying section 210. In this case, the at least one solder container 2 that is unloaded from the first conveying section 210 can be transferred to the other end of the first conveying section 210 by the operation of the first conveying section 210.

[0032] Furthermore, the second conveying element 220 can be positioned on a different side of the plurality of first conveying elements 210, perpendicular to the direction of transfer of the first conveying element 210. In addition, the transfer element 200 can include a plurality of gripping elements 230 for transporting the solder containers 2, positioned on the plurality of first conveying elements 210, to the second conveying element 220. Furthermore, each of the plurality of gripping elements 230 can transport the solder containers 2, unloaded from the cooling chamber 100, to the second conveying element 220 on the plurality of first conveying elements 210 after a predetermined time has elapsed.

[0033] In this case, the plurality of gripping elements 230 can be arranged on an outer surface of the second conveying element 220, spaced apart from each other by the same spacing as that of the first conveying element 210. Furthermore, each of the plurality of gripping elements 230 can transport the solder container 2, positioned on each of the plurality of first conveying elements 210, to the second conveying element 220. In particular, each of the plurality of gripping elements 230 can include a gripping element 231 configured to grip the solder container 2, a gripping motor 232 for determining whether the gripping element 231 is to be gripped, and a forward-reverse cylinder 233 configured to move the gripping element forward and backward to the first conveying element 210.

[0034] Furthermore, the solder container 2, unloaded from cooling chamber 100 to the first conveying unit 210, can be stored on the first conveying unit 210 at room temperature for a predetermined time. This prevents condensation from occurring in the contents (solder paste) of the solder container 2 as a result of a rapid temperature difference. In this case, the solder container 2, positioned on the first conveying unit 210, can be transported to the second conveying unit 220 and stirred after approximately two hours.

[0035] Furthermore, each of the multiple gripping parts 230 can only transport the solder container 2, which is positioned at a predetermined position on the first conveyor part 210 under the multiple first conveying parts 210, to the second conveyor part 220. For example, three types of solder containers 2, manufactured by different producers, can be stored separately in three storage wall parts 120, and three types of solder containers 2 can be discharged onto or unloaded from three first conveyor parts 210.

[0036] In this case, only at least one of the three gripping parts 230 can be operated according to the user's needs and can only transport the solder container 2 manufactured by at least one manufacturer to the second conveying part 220. That is, only a specific type of solder container 2 can be easily selected and used according to the user's requirements. Consequently, only the solder container 2 to be used can be transported to the second conveying part 220 and stirred by the stirring part 300, thus facilitating the management of various types of solder containers 2 stored in large numbers.

[0037] Furthermore, the solder container 2, which is transported from the first conveying unit 210 to the second conveying unit 220, can be transferred to one end of the second conveying unit 220 in the direction of transmission by the operation of the second conveying unit 220. In this case, the solder container 2, which is located at one end of the second conveying unit 220, can be moved by the handpiece 400 to the stirring unit 300. Afterwards, the contents of the solder container 2, positioned on the stirring unit 300, can be used after being stirred for a preset time while the stirring unit 300 is operating.

[0038] Furthermore, the present drawing shows that the second conveyor section 220 transports the solder container 2 upwards to the right, and the stirring element 300 is positioned at the right end of the second conveyor section 220. However, the present invention is only exemplary and not limited thereto. The second conveyor section 220 can transport the solder container 2 downwards to the left, and the stirring element 300 can also be positioned at a left end of the second conveyor section 220.

[0039] Fig. Figure 2 is an enlarged view of part A of Fig. 1, Fig. Figure 3 is a side view of the automatic first-in, first-out solder container feeding management system according to the embodiment of the present invention and Fig. Figure 4 is a front view of the automatic first-in, first-out solder container feeding management system according to the embodiment of the present invention. Meanwhile, in Fig. 2 and the following drawings illustrate the cooling housing 110 for better description.

[0040] With reference to the Fig. In 2 to 4, each of the plurality of bearing wall parts 120 can include a partition 121 with a predetermined thickness for dividing an interior space of the cooling housing 110 and an S-shaped bearing rail 122, and the bearing rail 122 can be arranged on the partition 121 perpendicular to the floor. In this case, the plurality of solder containers 2 can be stacked and stored on the bearing rail 122 in an S-shape, inclined towards the floor. Furthermore, the plurality of solder containers 2 can be cylindrical and stored in a horizontal position such that one longitudinal direction runs parallel to the floor.

[0041] Meanwhile, each of the multiple storage wall parts 120 can further include a solder discharge part 123 for discharging the outermost solder container 2 from the multiple of stored (i.e., stored) solder containers 2 onto the transfer part 200. In this case, the solder discharge part 123 can stand on the transfer part 200 and discharge the outermost solder container 2.

[0042] In particular, the solder discharge element 123 can include an engagement element 1231 formed at a lower end (i.e., an end of the solder container 2 in a direction in which the solder container 2 is moved by its own weight) of the bearing rail 122, which restricts the movement of the solder container 2. In this case, the engagement element 1231 can be hook-shaped and rotated at a predetermined angle with respect to a cardan shaft coupled to the bearing rail 122 in order to restrict the movement of the solder container 2 or to make the solder container 2 movable by its own weight.

[0043] Furthermore, the solder discharge part 123 can also include a standing discharge part 1232, which has an inlet part 1232a positioned so that it is in contact with the bottom end of the bearing rail 122 and into which the solder container 2 is inserted, and a discharge path 1232b extending downwards from the inlet part 1232a and guiding the solder container 2 to stand upright.

[0044] In particular, the inlet part 1232a can include an inlet (not shown) with a cross-sectional area that is perpendicular to the inlet and decreases in a downward direction, and the inlet can be designed to be inclined with respect to the ground so that the outermost solder container 2 can be inserted onto the bearing rail 122 at a predetermined inclination. Furthermore, the discharge path 1232b can be formed in a cylindrical shape, with a diameter of an inner circumferential surface being larger than the diameter of an outer circumferential surface of the solder container 2. In this case, the discharge path 1232b can extend downwards from a lower end of the inlet part 1232a (towards the first conveying part 210), and the diameter of a lower end of the inlet and the diameter of the inner circumferential surface of the discharge path 1232b can be identical.

[0045] Furthermore, a longitudinal center axis of the discharge path 1232b can be arranged such that it is axially aligned with a vertical center axis of the plurality of solder containers 2 stored on the support rail 122. That is, the outermost solder container 2 on the support rail 122 can be inserted in a state in which it is biased to one side in a lateral direction of the inlet part 1232a, and can be inserted into the discharge path 1232b in an inclined state through the downwardly inclined inlet. In this case, the solder container 2 can be guided through the cylindrical discharge path 1232b and unloaded in a standing position onto the first conveying part 210.

[0046] Furthermore, an ideal storage temperature in the cooling housing 110 can be maintained in a range of 0 °C to 15 °C and, more preferably, in a range of 1 °C to 10 °C. If the internal temperature of the cooling housing 110 is lower than 0 °C, particles of the contents of the solder container 2 may freeze, and if the internal temperature of the cooling housing 110 is higher than 15 °C, the contents of the solder container 2 may oxidize.

[0047] Furthermore, the cooling housing 110 can include a door 111 forming a surface of the cooling housing 110, and the door 111 can be opened or closed by rotating it at a predetermined angle with respect to a hinged coupling part. In this case, the door 111 can be arranged perpendicular to the plurality of bearing wall parts 120, and an inlet 1111, through which the solder container 2 can be inserted into the plurality of bearing rails 122, can be formed on a section of the top of the door 111. In particular, the inlet 1111 can be formed in the same number as the number of bearing wall parts 120 and can be formed at a position (i.e., a starting point where the solder container 2 is supported in the bearing rail 122) adjacent to a top end of the bearing rail 122.

[0048] Furthermore, each of the multiple storage wall sections 120 can be slid laterally towards the outside of the cooling enclosure 110. In particular, the cooling enclosure 110 can include multiple sliding guides 112 on its underside. In this case, each of the multiple storage wall sections 120 can be positioned on the multiple sliding guides 112 and moved laterally along them. Accordingly, with the door 111 open, the user can slide each of the multiple storage wall sections 120 to the outside of the cooling enclosure 110 and place a large number of solder containers 2 onto the storage rail 122 or easily pull out the solder containers 2 located on the storage rail 122.

[0049] Furthermore, each of the plurality of sliding guides 112 can include a plurality of roller elements, but the present invention is only exemplary and not limited thereto, and it is sufficient that each of the plurality of sliding guides 112 can have a structure that can move the bearing wall part 120 in the transverse direction.

[0050] Furthermore, the automatic first-in, first-out solder container feeding management system according to the embodiment of the present invention can communicate with a manufacturing execution system (MES), so that it is possible to monitor each process in real time, confirm a work history, i.e., a workflow, and determine a status.

[0051] Furthermore, as described above, the plurality of first conveying parts 210 can be formed in the same number as the plurality of bearing wall parts 120. Additionally, the plurality of first conveying parts 210 can be arranged below the cooling housing 110 in the transverse direction along the orientation direction of the plurality of bearing wall parts 120. In this case, the second conveying part 220 can also be arranged below the cooling housing 110.

[0052] Accordingly, the space occupied by the automatic first-in, first-out solder container feeding management system according to the embodiment of the present invention can be minimized. Furthermore, the solder container 2, which is introduced through the inlet 1111 located on one side of the cooling housing 110, can be emptied to the first conveying section 210 on another side of the cooling housing 110, and the emptied solder container 2 can be transferred back to one side of the cooling housing 110 by the first conveying section 210 and the second conveying section 220 and then stirred.

[0053] Fig. Figure 5 is an enlarged view of the handpiece 400 of the automatic first-in, first-out solder container feeding management system according to the embodiment of the present invention, and Fig. Figure 6 is another side view of the automatic first-in, first-out solder container feeding management system according to the embodiment of the present invention.

[0054] With reference to the Fig. 5 and Fig. 6. The handpiece 400 can include a gripper 410 configured to grasp one of the solder containers 2 on the transfer part 200, and a hand drive part 420 configured to move the gripper 410 to one side in a lateral direction. Furthermore, the gripper 410 can be moved up and down in a direction perpendicular to the floor.

[0055] In particular, the solder container 2, which is transported by the gripping element 230 to the second conveying element 220, can be transferred to one end of the second conveying element 220 in the direction of transmission by the operation of the second conveying element 220. In this case, a position fixing element 221 can be formed at one end of the second conveying element 220 in the direction of transmission, which restricts the movement of the solder container 2. A fixing groove can be shaped such that it is curved inwards from the position fixing element 221 and recessed in it, and the solder container 2 can be restricted in its movement by being inserted into the fixing groove.This means that it is possible to prevent the solder container 2 from being released to the outside of the second conveying part 220 while the solder container 2 is being transferred, and the solder container 2 can be positioned at a preset position at the end of the second conveying part 220 in the transfer direction.

[0056] Furthermore, the gripper 410 can be moved horizontally in the transmission direction of the second conveying part 220 from above the second conveying part 220 by the manual drive element 420. In this case, the manual drive element 420 can be formed in a structure in which the gripper 410 slides along a guide rail, but the present invention is only exemplary and not limited thereto, and it is sufficient that the manual drive element 420 has a structure in which the gripper 410 is moved horizontally in one direction by the operation of a drive motor.

[0057] Furthermore, the gripper 410 can be positioned at the same lateral position as the second conveyor belt section 220 with respect to the ground. In particular, the horizontal direction of movement of the gripper 410 and the transmission direction of the second conveyor section 220 can be parallel to each other in any plane perpendicular to the ground.

[0058] Furthermore, the gripper 410 can be designed to move up and down relative to the ground. In addition, the gripper 410 can be rotated by a predetermined angle in an inclined direction relative to the direction perpendicular to the ground. Accordingly, the gripper 410 can easily grasp the solder container 2 on the second conveying section 220 and easily attach the solder container 2 to a mounting part 330 of the stirring section 300, as described below. Moreover, the upward and downward movement and the predetermined rotational movement of the gripper 410 can be effected by two drive motors or cylinders, but the present invention is only exemplary and not limited thereto.

[0059] Fig. Figure 7 is an enlarged view of the stirring part 300 of the automatic first-in, first-out solder container feeding management system according to the embodiment of the present invention.

[0060] With reference to Fig. 7. The agitator 300 can include a support frame 310, which is arranged on a side section of the end of the second conveying section 220 in the transmission direction, an agitator plate 320, which is connected to the support frame 310 via a plurality of elastic support elements 340, and a mounting part 330, which is arranged on the agitator plate 320 and on which the solder container 2 is mounted. In this case, the mounting part 330 can be designed in the form of a hollow cylinder and a central axis in the longitudinal direction thereof can be positioned so that it is inclined with respect to the ground.

[0061] Furthermore, the mixing plate 320 can be positioned parallel to the ground, and a side wall section 321, positioned perpendicular to the ground, can be formed along an edge in a lateral direction therefrom. In this case, the support frame 310 can be positioned so that it surrounds the side wall section 321 of the mixing plate 320, and the side wall section 321 and the support frame 310 can be connected to each other via the plurality of elastic support elements 340.

[0062] Furthermore, the stirring plate 320 can be rotated back and forth about a rotating central axis 322. Since the stirring plate 320 is connected to the support frame 310 via the multiple elastic support elements 340, the rotation range of the stirring plate 320 can be limited to a predetermined angle. Furthermore, by rotating the stirring plate 320, the mounting part 330 positioned on the stirring plate 320 can also be rotated laterally (transversely), and the solder container 2 positioned on the mounting part 330 can be stirred horizontally.

[0063] In particular, the support frame 310 can include a support element 311 with a fixed position and a plurality of bent elements 312, which are formed by bending a section of the support element 311 at a predetermined angle and to which the elastic support elements 340 are connected. That is, the side wall element 321 can be connected to the plurality of bent elements 312 via the plurality of elastic support elements 340. In this case, each of the plurality of bent elements 312 can be configured such that it is elastically bent at a predetermined angle to the side wall element 321 when the agitator plate 320 is rotated in one direction. Furthermore, each of the plurality of bent elements 312 can be elastically bent towards the outside of the side wall element 321 when the agitator plate 320 is rotated in the opposite direction.

[0064] Furthermore, the side wall section 321 can preferably be designed with four surfaces. Eight bent sections 312 can be formed, and two bent sections 312 can be connected to one side wall section 321. In this case, eight elastic support sections 340 can be formed to elastically connect each of the eight bent sections 312 to the agitator plate 320. As described above, in addition to the elastic support section 340, the elastic rotation of the bent section 312 is added, so that the rotation range of the agitator plate 320 can be increased and the stirring performance of the solder container 2 can be increased.

[0065] In addition, the longitudinal center axis of the solder container 2 positioned on the mounting part 330 can be inclined relative to the ground, so that the contents in the solder container 2 can be stirred up and down as well as to the left and right when the stirring plate 320 is rotated.

[0066] Furthermore, the mounting part 330 can be positioned eccentrically to the axis of rotation 322. In particular, a pivot point of the mounting part 330 can be positioned externally in a transverse direction to the axis of rotation 322, and the pivot point of the mounting part 330 can be repeatedly rotated through an arc of a predetermined angle when the stirring plate 320 is repeatedly rotated. Accordingly, even when the stirring plate 320 is rotated at a relatively small angle, a portion of the mounting part 330 can be rotated at a predetermined angle, and the stirring performance of the soldering medium container can be increased.

[0067] According to the embodiments of the present invention, a large number of solder containers are stored in a cooling chamber, which prevents the oxidation of the contents of the solder containers.

[0068] Furthermore, according to the embodiments of the present invention, solder containers discharged from a cooling chamber can be stored at room temperature for a predetermined time and then automatically stirred.

[0069] Furthermore, according to the embodiments of the present invention, a plurality of solder containers of each manufacturer or type are classified and stored in a cooled state and at room temperature, so that only one solder container of a particular manufacturer or type can be selected and supplied according to the user's needs.

[0070] Furthermore, according to the embodiments of the present invention, processes for unloading solder containers from a cooling chamber, for storing solder containers at room temperature, and for feeding solder containers to a stirrer in a first-in-first-out manner are automated, and an automatic first-in-first-out solder container feeding management system communicates with an MES, thereby increasing the safety and comfort of an operator.

[0071] While the present invention has been described in detail above with reference to the representative embodiments, those skilled in the art in the field will recognize that the embodiments can be modified in various ways without altering the scope of the present invention. Therefore, the scope of the present invention is not defined by the described embodiment, but by the appended claims and includes equivalents that fall within the scope of protection of the appended claims. [List of reference symbols] 10 AUTOMATIC FIRST-IN FIRST-OUT SOLDER CONTAINER FEED MANAGEMENT SYSTEM 100 cold rooms 110 cooling cases 111 DOOR 1111 ADMISSION 112 SLIDING GUIDE 120 Storage Room Wall Section 121 DIVISION WALL 122 Bearing Rail 123 Solder discharge section 1231 ENGINE PART 1232 STANDING CHARGING PART 1232a INLET PART 1232b DISCHARGE PATH 200 TRANSFER PART 210 FIRST PART OF FUNDING 220 SECOND PART OF FUNDING 221 POSITION FIXING PART 230 GRIP PART 231 GRIP ELEMENT 232 GRIP MOTOR 233 FORWARD-REVERSE CYLINDERS 300 Stirring part 310 SUPPORT FRAME 311 SUPPORT PART 312 CURVED PART 320 STIRRING PLATE 321 SIDE WALL PANEL 322 Rotational Center Axis 330 MOUNTING PART 340 ELASTIC SUPPORT 400 HANDLE 410 GRABERS 420 HAND PASSENGER 2 solder containers

Claims

[1] Automatic first-in, first-out solder container feeding management system (10), comprising: a cooling chamber (100) configured to store a variety of solder containers (2); a transfer part (200) which is arranged outside the cooling chamber (100) and configured to move at least one of the plurality of solder containers (2); a stirring element (300) formed and configured at one end of the transfer element (200) to stir the at least one solder container (2); and a hand part (400) configured to move any solder container (2) of the at least one solder container (2) positioned on the transfer part (200) to the stirring part (300); wherein the cooling chamber (100) includes a cooling housing (110) and a plurality of bearing wall parts (120) which are arranged in the cooling housing (110) and each configured to hold the plurality of solder containers (2); wherein the plurality of solder containers (2) are stored and arranged on each of the plurality of bearing wall parts (120) in a line inclined towards a floor; wherein each of the plurality of storage wall parts (120) includes a solder discharge part (123) configured to discharge an outermost solder reservoir (2) from the plurality of stored solder reservoirs (2) onto the transfer part (200); and wherein the solder discharge part (123) rests on the transfer part (200) and discharges the outermost solder container (2). [2] Automatic first-in, first-out solder container feeding management system (10) according to claim 1, wherein the transfer part (200) comprises: a plurality of first conveying parts (210) arranged and configured at the same arrangement interval as the plurality of bearing wall parts (120) to transfer the solder container (2) discharged from the cooling chamber (100); and a second conveying part (220) which is arranged in a direction perpendicular to a transfer direction of the first conveying part (210) and is configured to transfer the solder container (2) to the stirring part (300). [3] Automatic first-in, first-out solder container feeding management system (10) according to claim 2, wherein the transfer part (200) further comprises a plurality of gripping parts (230) for transporting the solder container (2) positioned on the plurality of first conveying parts (210) to one side of the second conveying part (220), Each of the multiple gripping parts (230) transports the solder containers (2) unloaded from the cooling chamber (100) onto the multiple of first conveying parts (210) after a predetermined time and one of the multiple gripping parts (230) transports only the solder container (2), which is positioned on the first conveying part (210) under the multiple first conveying parts (210) at a predetermined position, to the second conveying part (220). [4] Automatic first-in, first-out solder container feeding management system (10) according to claim 2, wherein: the number of multiple first conveying parts (210) is equal to the number of multiple bearing wall parts (120); and the multitude of first conveying parts (210) are arranged below the multitude of bearing wall parts (120) in a lateral direction thereof. [5] Automatic first-in, first-out solder container feeding management system (10) according to claim 1, wherein the hand part (400) comprises: a gripper (410) configured to grasp one of the solder containers on the transfer part (200); and a hand drive part (420) configured to move the gripper (410) in a lateral direction to one side, wherein the gripper (410) is movable upwards and downwards in a direction perpendicular to a floor. [6] Automatic first-in, first-out solder container feeding management system (10) according to claim 1, wherein the stirring part (300) includes: a support frame (310); a stirring plate (320) which is connected to the support frame (310) via a plurality of elastic support elements (340); and a mounting part (330) which is positioned on the stirring plate (320) and on which the solder container (2) is attached. [7] Automatic first-in, first-out solder container feeding management system (10) according to claim 6, wherein the mounting part (330) is formed in a hollow cylindrical shape and a longitudinal central axis thereof is positioned such that it is inclined with respect to a floor. [8] Automatic first-in, first-out solder container feeding management system (10) according to claim 6, wherein: the support frame (310) is positioned such that it surrounds an outer side surface of the stirring plate (320) in a lateral direction; the support frame (310) is connected to a side section of the agitator plate (320) in a lateral direction by the plurality of elastic support elements (340); and the stirring plate (320) is rotatable about a rotational center axis.

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