HEADPHONE EAR STRUCTURE

Abstract

Headphone ear cup, comprehensive: a frame (102) defining a cavity (104) dimensioned to surround a user's ear; a damping component (114) that is coupled to the frame (102) and surrounds the cavity (104); a covering component that covers the damping component (114) and includes a rim (204) that is spaced from the frame (102) and defines a continuous acoustic opening (118) around the entire circumference of the cavity (104) in order to acoustically connect the cavity (104) to the damping component (114); and a cosmetic component (120) that covers the encapsulation component and the continuous acoustic opening (118).

Description

AREA

[0001] One embodiment of the invention relates to a headphone ear cup structure, more precisely a headphone ear cup cushion, which has a multi-part structure with improved acoustic performance. Other embodiments are also described and claimed. STATE OF THE ART

[0002] Whether listening on the go via a portable media player or at home through a stereo or home theater system, consumers frequently choose headphones. Headphones typically include a pair of earcups that surround the user's ears and are held together by a headband. Headphones can be broadly categorized into two types based on the design of the earcups: closed-back and open-back. Closed-back headphones surround the user's ears and have a sealed back. Open-back headphones also surround the user's ears but have a back that is open to the surrounding environment.

[0003] Both closed-back and open-back designs have their own acoustic advantages and disadvantages. For example, closed-back earcups can offer good sound isolation because they are sealed against ambient noise. Furthermore, the size and clamping force of the earcups can be modified to further enhance sound isolation. Features of closed-back designs, such as the sealed back, size, and clamping force of the earcups, allow this design to mechanically or passively dampen ambient noise. However, due to their closed design, closed-back earcups can exhibit more pronounced resonances. For example, standing waves can accumulate within the earcups. These standing waves can degrade sound quality and reduce the sense of openness that is often desired by users.

[0004] However, open-back ear cups may not be ideal in noisy environments because their passive noise cancellation may not be as good as closed-back designs.

[0005] The prior art document US 2011 / 0216909A1 describes a headset with an ear cup having a front opening designed to be adjacent to a user's ear, the ear cup extending radially and axially and defining an ear cup volume; and a bellows cushion extending around the circumference of the front opening of the ear cup and dimensioned to engage with the user's ear, the bellows cushion comprising a plurality of folded segments located on an outer radial section of the bellows cushion and configured to be substantially compliant along an axial direction.

[0006] The state of the art document KR 101988993 B1 describes a headphone with an ear cushion. SUMMARY

[0007] The present invention is defined in the independent claims. Advantageous embodiments are specified in the dependent claims. One aspect of the invention may include a headphone configuration in which the ear cups incorporate a specific damping structure, internal structure, and covering configuration to improve ear cup performance, for example, by damping standing waves without compromising ear cup comfort. For example, each ear cup may incorporate a donut- or ring-shaped structure or pad that surrounds the driver facing the user's ear to cushion and / or seal the ear cup against the user's ear and / or head. The donut- or ring-shaped structure may be composed of a number of components, for example, a damping component (e.g., a foam), an internal support structure or covering (e.g., a foam core), or a flexible, padded, or ring-shaped cushion.a silicone layer) surrounding the damping component, and a cosmetic cover (e.g., a textile layer) surrounding the damping component and the inner structure or casing.

[0008] In some respects, the damping component can be foam, which forms the innermost part of the ear cushion. The foam can help cushion the ear against the user's ear / head. Furthermore, the foam can have acoustic impedance values ​​that specifically modify sound to dampen the standing wave within the ear chamber or cavity surrounding the user's ear.

[0009] In some respects, the internal support structure or casing may be a layer of acoustically opaque material wrapped around the attenuating component (e.g., foam) and including an opening or gap that exposes the foam to the acoustic cavity surrounding the user's ear. The term "acoustically opaque material" is intended to refer to a material that generally does not allow sound to pass through it. Examples of acoustically opaque materials may include, but are not limited to, silicone, polyurethane (PU), or thermal polyurethane (TPU). An opening or gap is further provided so that sound from within the auricular cavity can still reach the foam when enclosed by the casing. The opening or gap may be on the side of the attenuating component (e.g., foam).The outer layer (foam) facing the ear must be surrounded by a continuous opening that runs along the entire inner circumference of the damping component and cavity. The opening is located at a specific point and is of a specific size and / or shape so that it remains open and allows for a minimum level of damping when the pad is pressed against the user's ear / head. Additionally, the outer layer can be thicker towards the outside of the pad (e.g., the side facing away from the ear / head) and thinner towards the inside of the pad (e.g., the inside facing the ear / head). Having a maximum thickness of the outer layer (e.g., furthest from the user's ear / head) contributes to passive damping, while minimizing the thickness on the inner side (e.g., the side facing the ear / head) contributes to passive damping.(where the padding touches the ear / head) contributes to sealing the ear cup to the user's ear / head. In some respects, the covering may be overmolded around the ear cup frame.

[0010] The cosmetic cover can conceal both the casing and any opening or gap. The cosmetic cover can be constructed from a cosmetically opaque material, so that the ear cushion does not include any visible openings. The term "cosmetically opaque" refers to a material that prevents a user from seeing any openings, gaps, or other aspects of the underlying layer(s). The cosmetic cover material can also be acoustically transparent, allowing sound waves to pass through the cover (and the gap in the casing) to the damping foam. The term "acoustically transparent" refers to a material that allows sound to pass through it. For example, the cosmetic cover could be constructed from a textile material that is both cosmetically opaque and acoustically transparent.The material of the cosmetic cover can also help to seal the ear cushion to the user's ear / head.

[0011] Representatively, a headphone earpiece, from one perspective, includes a frame defining a cavity sized to surround a user's ear; an attenuation component coupled to the frame and surrounding the cavity; an envelope component covering the attenuation component and defining a continuous acoustic opening around the cavity to acoustically connect the cavity to the attenuation component; and a cosmetic component covering the envelope component and the continuous acoustic opening. The envelope component may have a variable thickness. The envelope component may include an outer rim that is overmolded onto the frame and an inner rim that defines the continuous acoustic opening. The envelope component may be thicker near the outer rim than the inner rim. The continuous acoustic opening may extend around the entire circumference of the cavity.In some respects, an entire area of ​​the through-hole acoustic opening remains open when the earpiece is compressed. The casing component can include a material selected from silicone, polyurethane, or thermal polyurethane. The cosmetic component can include an acoustically transparent and cosmetically opaque material.

[0012] From another perspective, a headphone earpiece can include a frame defining an acoustic cavity acoustically coupled to a driver; and an annular pad coupled to the frame and surrounding the acoustic cavity, the annular pad comprising a damping component and an inner support element that partially covers the damping component, the inner support element having a variable thickness. In some perspectives, the variable thickness of the inner support element increases in a direction away from the acoustic cavity. In other perspectives, the inner support element defines a continuous acoustic opening between the acoustic cavity and the damping component to acoustically connect the damping component to the acoustic cavity.The continuous acoustic opening can be configured to remain open during compression of the ring-shaped cushion to maximize acoustic attenuation under compression. The attenuation component may include a foam material, and the inner support element comprises a silicone material. The inner support element may include a silicone material overmolded onto the frame. The ear cup may further include a cosmetic layer covering the inner support element and the attenuation component to form a cosmetic surface free of visible openings. The cosmetic layer may include a textile material.

[0013] From another perspective, a headphone earpiece can consist of a frame defining an acoustic cavity acoustically coupled to a driver; and a pad coupled to the frame and surrounding the acoustic cavity, the pad including an inner support element with an outer edge coupled to the frame and an inner edge defining an annular gap between the inner support element and the frame, the thickness of which decreases in a direction towards the inner edge. The outer edge of the inner support element may be overmolded onto the frame. The annular gap may completely surround the acoustic cavity. The inner support element may include an apex at a position furthest from the frame, and the thickness of the inner support element begins to decrease between the apex and the inner edge.

[0014] The foregoing summary does not constitute an exhaustive enumeration of all aspects of the present invention. It is considered that the invention is intended to encompass all practically implementable systems and methods derived from all suitable combinations of the various aspects summarized above, as well as those disclosed in the detailed description below and expressly mentioned in the claims filed with the application. Such combinations offer certain advantages not specifically stated in the foregoing summary. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The embodiments are illustrated in an exemplary and non-limiting manner in the figures of the accompanying drawings, where identical references denote identical elements. It should be noted that references to "one" embodiment in this disclosure do not necessarily refer to the same embodiment, but rather mean at least one. Fig. Figure 1 illustrates a schematic diagram of a cross-sectional view of a viewpoint of a headphone auricle structure. Fig. Figure 2 illustrates a schematic diagram of an enlarged cross-sectional view of the headphone auricle structure of Fig. 1. Fig. Figure 3 illustrates a schematic diagram of an enlarged cross-sectional view of the headphone auricle structure of Fig. 1. Fig. Figure 4 illustrates a schematic diagram of an enlarged cross-sectional view of the headphone auricle structure of Fig. 1. Fig. Figure 5 is a schematic diagram of a top view of the headphone auricle structure of Fig. 1. Fig. Figure 6 illustrates a simplified schematic view of an embodiment of an electronic device in which the headphone earpiece structure may be implemented. DETAILED DESCRIPTION

[0016] This section explains various preferred aspects with reference to the accompanying drawings. In cases where the shapes, relative positions, and other aspects of the parts described in the embodiments are not clearly defined, the scope of the invention is not limited to the parts shown, which are included solely for illustrative purposes. While numerous details are presented, it is understood that some aspects can be implemented without these details. In other cases, generally known structures and techniques have not been shown in detail to avoid complicating the understanding of this description.

[0017] Fig. Figure 1 illustrates a schematic diagram of a cross-sectional view of one aspect of a headphone ear cup structure. It is understood that the figures illustrate only one of a pair of left and right ear cups of headphones 100, which may be connected by a headband (not shown). Thus, each of the features relating to the in Fig. The descriptions of the ear cup of the headphone 100 in Figure 1 are to be understood as applying to the other ear cup of the headphone 100. The ear cup of the headphone 100 encloses a frame 102 that forms a housing dimensioned to surround a user's ear 106 and to form an acoustic cavity 104 around it. The acoustic cavity 104 can surround the ear 106 when the ear cup of the headphone 100 is positioned on the user's head.

[0018] A driver 108 for emitting sound (S) (e.g., a music signal) in a direction towards the ear 106 can be attached to the frame 102. The driver 108 can be any type of electrical-to-acoustic transducer with a pressure-sensitive diaphragm and switching logic configured to produce sound in response to an electrical audio signal input (e.g., a loudspeaker). The electrical audio signal can be a music signal input to the driver 108 by a sound source 110. The sound source 110 can be any type of audio device capable of outputting an audio signal, for example, an electronic audio device such as a smartphone, a portable music player, a home stereo system, or a home theater system capable of outputting an audio signal.

[0019] The ear cup of the headphone 100 may further include an ear cushion or pad 112. The ear cushion 112 may be attached to a side or surface of the frame 102 facing the ear 106 and forming the acoustic cavity 104. In some cases, the ear cushion 112 may form part of the acoustic cavity 104 and help to create a seal between the acoustic cavity 104 and the user's ear 106. The ear cushion 112 may be a donut-shaped or otherwise similar circular, racetrack-shaped, or elliptical structure that surrounds the acoustic cavity 104 and can seal around or on the user's head or ear 106. The ear cushion 112 can be compressed and adapt to the head and / or ear 106 of the user when pressed against the head and / or ear of the user to improve user comfort.

[0020] In addition to contributing to cushioning the auricle against the user's head and / or ear 106, the auricle cushion 112 can be configured to enhance the acoustic performance of the auricle. For example, the cushion 112 can be configured to counteract resonances that may adversely affect acoustic performance. Resonances within the auricle can cause a number of problems, including a loss of high-frequency resolution, tonal imbalance, a narrowing of the stereo image, and / or a more reverberant high-frequency sound signature. The auricle cushion 112 can be configured to optimize acoustic damping to counteract resonances. For example, the auricle cushion 112 may include a damping component 114 and an internal support element 116 that partially envelops the damping component 114. The damping component 114 can help to dampen standing waves.The internal support element 116 can provide rigidity and structure to the padding 112 and further contribute to improving acoustic performance and / or sealing. In some aspects, the ear padding 112 can also include a cosmetic cover 120 that completely encloses all underlying components of the ear padding 112, so that the ear cup 112 has a continuous surface without any opening or other non-cosmetic features visible to the user.

[0021] Specific aspects of each of the components of the ear cushion 112 will now be discussed with reference to Fig. 2 described in more detail. In particular illustrated Fig. 2 a schematic diagram of an enlarged cross-sectional view of the auricular pad 112 of Fig. 1. From this view, it is evident that the padding structure includes the damping component 114, the inner support element 116, and the cosmetic cover 120, which is attached to the frame 102. The damping component 114 can form the innermost structure of the padding 112 and may have a ring-shaped or donut-like form that surrounds the user's ear during use. The damping component 114 can, for example, be an acoustically transparent material, such as a foam material. The foam material can be any acoustically transparent foam material and can have acoustic impedance values ​​that, in particular, modify sound to dampen the standing wave. In addition to exhibiting damping properties, the foam can be compressed to help cushion and seal the ear padding 112 against the user's head or ear 106.

[0022] The inner support element 116 can be encased around the damping component 114 or otherwise formed. The inner support element 116 can be constructed of an acoustically opaque material that provides structural rigidity and passive damping to the auricle. For example, the inner support element 116 can be constructed of an acoustically opaque material such as silicone, polyurethane (PU), or thermal polyurethane (TPU). Representatively, the inner support element 116 can be a silicone sheath or a solid, sheet-like structure that at least partially encases the outer surface of the damping component 114. To allow sound (S) to continue to pass from the acoustic cavity 104 to the damping component 114, a gap or opening 118 can be formed between the inner support element 116 and the frame 102.For example, the inner support element 116 can have one side or edge 202 that is attached to the frame 102, and another side or edge 204 that forms the gap or opening 118 to the damping component 114. The side or edge 202 can be overmolded onto the frame 102, and the remainder of the support element 116 is then wrapped around the damping component 114 in the direction of the cavity 104. For example, the frame 102 can be made of a polycarbonate (PC) material, and the support element 116 can then be cured / molded onto the frame 102. The side or edge 202 can be considered an outer side or outer edge because it is furthest from or facing away from the cavity 104.The side or edge 204 can be considered an inside or inner side or an inner edge because it is closest to or faces the cavity 104. The side or edge 204 terminates just before the inside or inner side of the frame 102 to form the gap or opening 118, allowing sound to pass between the cavity 104 and the damping component 114. The opening 118 can be formed at a specific location around a circumference of the cavity 104 and may have a specific size / shape that has been found to improve damping and provide a consistent seal. Furthermore, the inner support element 116 may have a specific structure, for example, a variable thickness, that has been found to be suitable for maintaining the desired size and / or shape of the opening 118 under compression and providing passive damping.The structure of the inner support element 116 and the associated opening 118, which contribute to improving the acoustic performance, is described with reference to . Fig. 3, Fig. 4 to Fig. 5 discussed in more detail.

[0023] The cosmetic cover 120 can be made of an acoustically transparent material, allowing sound to pass through the opening 118. Alternatively, the cosmetic cover 120 can be cosmetically opaque, so that no visible openings are present in the ear cushion 112. Furthermore, in some cases, the ear cushion 112 can include a cosmetic cover 120 that completely encloses the inner support element 116 and the opening 118. The cosmetic cover 120 can be made of an acoustically transparent material, allowing sound to pass through the opening 118, or it can be cosmetically opaque, so that no visible openings are present in the ear cushion 112. For example, the cosmetic cover 120 can be made of a continuous sheet of material that extends over the inner support element 116 and covers one side or edge 206 (e.g.,The cosmetic cover 120 has an outer side or edge attached to the outside of the frame 102 and another side or edge 208 attached to an inner side of the frame 102 that surrounds the cavity 104. As discussed previously, the cosmetic cover 120 can be made of a material that is both acoustically transparent and cosmetically opaque, allowing sound to pass through the opening 118 under the cover 120 to the damping component 114 while the opening 118 remains concealed and therefore not visible to the user. For example, the cosmetic cover 120 can be made of a textile material (e.g., a material of interwoven fibers) that allows sound to pass through while still concealing underlying openings or components of the padding 112.Furthermore, the cosmetic cover 120 can help to smooth the surface (contour) of the padding 112 and prevent leakage between the padding 112 and the user. For example, in some cases, when putting on the headphones, compressing the padding 112 can cause wrinkles in the underlying inner support element 116. The cosmetic cover 120 can help to smooth out such wrinkles, so that the padding 112 maintains a more uniform shape and / or seal with the user's head. Since the cosmetic cover 120 is a textile material, it can also have a higher coefficient of friction than other materials, which helps it adhere to the user's skin, further improving the seal.

[0024] Aspects of the inner support element 116 will now be discussed with reference to Fig. 3 and Fig. 4 described in more detail. Fig. Figure 3 illustrates an enlarged cross-sectional view of the inner support element 116 in a natural, uncompressed configuration and a compressed configuration. Fig. Figure 4 illustrates an enlarged cross-sectional view of the inner support element 116, showing the variable thickness for contributing to controlling the extent of compression and enabling passive damping. The damping component 114 and the cosmetic cover 120 are omitted in these views.

[0025] Referring to Fig. As can be seen from this view, the inner support element 116 has a natural, uncompressed configuration (C1) and then bends towards the frame 102 into a compressed configuration (C2) (illustrated by dashed lines). This transition from the uncompressed configuration (C1) to the compressed configuration (C2) can occur when the user puts on the headphones and the padding 112 is pressed against the user's ear / head (e.g., when the foam damping component is compressed). It is therefore understood that the inner support element 116 has a certain degree of flexibility to allow the padding 112 to be compressed. However, as the inner support element 116 bends towards the frame 102, the inner surface or inner edge 204, which defines the opening 118, moves towards the frame 102, as shown.The size and / or shape of the opening 118 therefore also changes between a natural, uncompressed size / shape (O1) and a compressed size / shape (O2). The size / shape of the opening 118 can be designed so that it remains open in both the uncompressed size / shape (O1) and compressed size / shape (O2), allowing a minimum amount of attenuation under compression. In other words, even when compressed, an opening remains between the underlying attenuating element and the acoustic cavity of the auricle to allow attenuation. For example, the uncompressed size / shape (O1) and the compressed size / shape (O2) may lie within a predetermined range that has been found to be suitable for achieving a minimum level of attenuation in both configurations.This can be achieved, for example, by having the inside or inner edge 204 of the inner support element 116 terminate at a specific location or distance from the frame 102, as shown. Furthermore, the bending of the inner support element 116 can be controlled by modifying its thickness so that it is flexible enough to bend and provide user comfort, yet still rigid enough to maintain a desired size / shape of the opening 118.

[0026] Representative, now referring to Fig. 4, is out Fig. As can be seen in Figure 4, the inner support element 116 has a thickness (T1) at the outer end or edge 202 and then decreases in thickness to thickness (T2) towards the inner end or edge 204. The variation in thickness can be adjusted to achieve a desired degree of stiffness and / or flexibility suitable for maintaining the opening 118. Furthermore, the variation in thickness can be adjusted to achieve passive damping. For example, in some aspects, the inner support element 116 may begin to taper after the vertex (A). This configuration can help to maximize the overall bending stiffness or otherwise make the inner support element 116 less flexible. This, in turn, can help to adjust or otherwise maintain the desired size / shape (O1, O2) of the opening 118.Furthermore, this configuration can help maximize passive damping because it maximizes the thickness of the section of the inner support element 116 facing the environment (or away from the acoustic cavity). For example, the thickness (T1) of the section of the inner support element 116 between the apex and the edge 202 can be selected to be thick enough to maximize passive damping while still allowing some flexion of the inner support element 116. Alternatively, the inner support element 116 can begin to taper before the apex (A) to minimize bending stiffness or otherwise make the inner support element 116 more flexible. This configuration may be desirable when a less stiff or more compliant ear cushion is required.

[0027] Now, referring to Fig. 5 illustrates Fig. 5, that the opening 118 can be a continuous opening formed around the entire circumference of the cavity 104. For example, in cases where the ear cushion 112 is a donut-shaped structure, the opening 118 can be an annular opening formed between the end or edge of the inner support element 116 and the frame 102, completely surrounding the acoustic cavity 104. It is further understood that, whether the cushion 112 is uncompressed or compressed, the entire opening 118 remains open and does not close in any area around the circumference of the cavity 104. This specific location of the opening 118 allows for a consistent seal against the user's head while still achieving a minimum level of attenuation under compression.

[0028] Fig. Figure 6 illustrates a simplified schematic view of an embodiment of an electronic device in which the headphone earpiece disclosed herein may be implemented. For example, the headphones 100 are examples of systems that may include part or all of the switching logic illustrated by an electronic device 600.

[0029] The electronic device 600 can, for example, include a power supply 602, a storage device 604, a signal processor 606, a memory 608, a processor 610, a communication switching logic 612, and an input / output switching logic 614. In some embodiments, the electronic device 600 can include more than one of each switching logic component; however, for the sake of simplicity, only one of each is shown. Fig. 6 shown. Furthermore, a person skilled in the art would recognize that the functionality of certain components can be combined or omitted, and that additional or fewer components that are in Fig. 1, Fig. 2, Fig. 3, Fig. 4 to Fig. 5 are not shown, for example, 100 may be included in the headphones.

[0030] The power supply 602 can provide power to the components of the electronic device 600. In some embodiments, the power supply 602 can be connected to a power grid, such as a wall outlet. In some embodiments, the power supply 602 can include one or more batteries or accumulators to provide power to headphones or other electronic devices associated with the headphones. As another example, the power supply 602 can be configured to generate power from a natural source (e.g., solar power using solar cells).

[0031] The storage device 604 can include, for example, a hard disk, flash memory, a cache, ROM, and / or RAM. Furthermore, the storage device 604 can be local to and / or remote from the electronic device 600. For example, the storage device 604 can include an integrated storage medium, a removable storage medium, storage space on a remote server, a wireless storage medium, or any combination thereof.

[0032] Furthermore, storage 604 can contain data such as system data, user profile data and any other relevant data.

[0033] The 606 signal processor, for example, could be a digital signal processor used for the real-time processing of digital signals, which are converted from analog signals, for instance, by the 614 input / output switching logic. After processing the digital signals, they could then be converted back into analog signals. For example, the 606 signal processor could be used to analyze digitized audio signals received from ambient or error microphones to determine how much of the audio signal is ambient noise or ear noise, and how much is, for example, music.

[0034] Memory 608 can include any form of temporary memory, such as RAM, buffers, and / or cache. Memory 608 can also be used to store data required for operating electronic devices (e.g., operating system instructions).

[0035] In addition to the signal processor 606, the electronic device 600 may also include the general-purpose processor 610. The processor 610 may be capable of interpreting system instructions and processing data. For example, the processor 610 may be capable of executing instructions or programs, such as system applications, firmware applications, and / or any other application. Furthermore, the processor 610 has the capability to execute instructions to communicate with one or all components of the electronic device 600. For example, the processor 610 may execute instructions stored in the memory 608 to enable or disable ANC, or instructions to open or close a passive control arrangement valve.

[0036] The 612 communication switching logic can be any suitable communication switching logic capable of initiating a communication request, establishing a connection to a communication network, and / or transmitting communication data to one or more servers or devices within the communication network. For example, the 612 communication switching logic can support one or more of the following communication protocols: Wi-Fi (e.g., an 802.11 protocol), Bluetooth®, radio frequency systems, infrared, GSM, GSM plus EDGE, CDMA, or any other communication protocol and / or any combination thereof.

[0037] The input / output switching logic 614 can convert analog signals and other signals (e.g., physical contact inputs, physical movements, analog audio signals, etc.) into digital data (and, if necessary, encode / decode them). The input / output switching logic 614 can also convert digital data into any other type of signal. The digital data can be supplied to and received from the processor 610, the storage device 604, the memory 608, the signal processor 606, or any other component of the electronic device 600. The input / output switching logic 614 can be used to establish an interface with any suitable input or output devices. Furthermore, the electronic device 600 can include specialized input switching logic associated with input devices, such as one or more proximity sensors, accelerometers, etc.The electronic device 600 can also include specialized output switching logic that is assigned to output devices, such as one or more loudspeakers, earphones, etc.

[0038] Finally, the bus 616 can provide a data transmission path for transferring data to, from, or between the processor 610, the storage 604, the memory 608, the communication switching logic 612, and any other component enclosed in the electronic device 600. Although the bus 616 in Fig. If Figure 6 is illustrated as a single component, the person skilled in the art would recognize that the electronic device 600 may include one or more components.

[0039] Although certain aspects have been described and shown in the accompanying drawings, it should be understood that such embodiments are merely illustrative and not limiting to the broader invention, and that the invention is not limited to the specific embodiments and arrangements shown and described, because the person skilled in the art may conceive of various other modifications. The description is thus to be considered illustrative and not limiting. Furthermore, to assist the Patent Office and all readers of patents granted based on this application in interpreting the accompanying claims, the applicants wish to state that they do not intend to rely on the application of 35 USC 112(f) with respect to any of the accompanying claims or claim elements, unless the terms “means for” or “step for” are expressly used in the particular claim.

Claims

[1] Ear cup, encompassing: a frame (102) defining a cavity (104) dimensioned to surround a user's ear; a damping component (114) that is coupled to the frame (102) and surrounds the cavity (104); a covering component that covers the damping component (114) and includes a rim (204) that is spaced from the frame (102) and defines a continuous acoustic opening (118) around the entire circumference of the cavity (104) in order to acoustically connect the cavity (104) to the damping component (114); and a cosmetic component (120) that covers the encapsulation component and the continuous acoustic opening (118). [2] Headphone ear cup according to claim 1, wherein the covering component comprises a variable thickness. [3] Headphone ear cup according to claim 1, wherein the encasing component comprises an outer rim (202) which is overmolded onto the frame (102) and an inner rim (204) which defines the through acoustic opening (118). [4] Headphone ear cup according to claim 3, wherein the covering component near the outer edge (202) is thicker than the inner edge (204). [5] Headphone earpiece according to claim 1, wherein an entire area of ​​the through acoustic opening (118) remains open when the headphone earpiece is compressed. [6] Headphone ear cup according to claim 1, wherein the covering component comprises a material selected from a silicone, a polyurethane or a thermal polyurethane. [7] Headphone ear cup according to claim 1, wherein the cosmetic component (120) comprises an acoustically transparent and cosmetically opaque material. [8] Headphone ear cup, encompassing: a frame (102) defining an acoustic cavity (104) acoustically coupled to a driver (108); and an annular pad (112) coupled to the frame (102) and surrounding the acoustic cavity (104), wherein the annular pad (112) comprises a damping component (114) and an inner support element (116) that partially covers the damping component (114), wherein the inner support element (116) has a variable thickness along a section of the inner support element (116) facing the acoustic cavity (104). [9] Headphone earpiece according to claim 8, wherein the variable thickness of the inner support element (116) increases in a direction away from the acoustic cavity (104). [10] Headphone ear cup according to claim 8, wherein the inner support element (116) defines a continuous acoustic opening (118) between the acoustic cavity (104) and the damping component (114) to acoustically connect the damping component (114) to the acoustic cavity (104). [11] Headphone ear cup according to claim 10, wherein the continuous acoustic opening (118) is configured to remain open during compression of the annular pad (112) in order to maximize acoustic attenuation under compression. [12] Headphone ear cup according to claim 8, wherein the damping component (114) comprises a foam material and the inner support element (116) comprises a silicone material. [13] Headphone ear cup according to claim 8, wherein the inner support element (116) comprises a silicone material which is overmolded onto the frame (102). [14] Headphone ear cup according to claim 8, further comprising a cosmetic cover (120) covering the inner support element (116) and the damping component (114) to form a cosmetic surface that is free of visible openings. [15] Headphone ear cup according to claim 14, wherein the cosmetic cover (120) comprises a textile material. [16] Headphone ear cup, encompassing: a frame (102) defining an acoustic cavity (104) acoustically coupled to a driver (108); and a cushion (112) coupled to the frame (102), wherein the cushion (112) comprises an inner support element (116) with an outer edge (202) coupled to the frame (102) and an inner edge (204) defining a gap between the inner support element (116) and the frame (102), and wherein the thickness of the inner support element (116) decreases in a direction towards the inner edge (204). [17] Headphone ear cup according to claim 16, wherein the outer edge (202) is overmolded on the frame (102). [18] Headphone ear cup according to claim 16, wherein the gap completely surrounds the acoustic cavity (104). [19] Headphone ear cup according to claim 16, wherein the inner support element (116) comprises a vertex at a position furthest from the frame (102) and the thickness of the inner support element (116) begins to decrease between the vertex (A) and the inner edge (204).

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