Image sensor module and imaging device

Abstract

Task An image sensor module is provided that can adequately dissipate the heat generated in an image sensor. Means to solve An image sensor module includes the following: a sensor board having a front surface on which an image sensor configured to image an object is mounted; a base element facing a rear surface of the sensor board; a front element facing the front surface of the sensor board; a biasing element located between the sensor board and the base element and configured to bias the sensor board toward the front element; a first fastening element configured to secure the base element and the front element against a biasing force of the biasing element; and a heat dissipation element located between the sensor board and the base element while it is compressed and configured to dissipate heat generated in the sensor board to the base element.

Description

TECHNICAL AREA

[0001] The present invention relates to an image sensor module and an imaging device. STATE OF THE ART

[0002] In the prior art, a known imaging device has a function for adjusting a distance between an imaging element and a lens by means of a helical spring arranged between a holder supporting the imaging element and a housing (see, for example, patent document 1). LITERATURE LIST Patent literature

[0003] Patent Document 1: JP 02-111175 A BRIEF DESCRIPTION OF THE INVENTION Technical Problem

[0004] With the recent improvement in image resolution, the heat generation of imaging elements has also increased. Therefore, it is conceivable to arrange a heat dissipation element between the imaging element and its housing to dissipate the heat generated within the imaging element. However, the structure described in patent document 1 results in an element mounting seat, to which the imaging element is attached, being biased away from the housing by a helical spring. This makes it difficult to bring the heat dissipation element, positioned between the element mounting seat and the housing, into close contact with the element mounting seat.

[0005] The present invention was made in view of the above circumstances, and its object is to provide an image sensor module that can adequately dissipate the heat generated in an image sensor. Solution to the problem

[0006] To solve the above-mentioned problem, an image sensor module according to one embodiment of the present invention includes: a sensor board having a front surface on which an image sensor configured to image an object is mounted; a base element facing a rear surface of the sensor board; a front element facing the front surface of the sensor board; a biasing element arranged between the sensor board and the base element and configured to bias the sensor board towards the front element; a first fastening element configured to fasten the base element and the front element against a biasing force of the biasing element; and a heat dissipation element arranged between the sensor board and the base element while it is compressed and configured to dissipate heat generated in the sensor board to the base element. Advantageous effects of the invention

[0007] The present invention provides an image sensor module capable of adequately dissipating the heat generated in the image sensor. Other tasks, configurations, and effects beyond those described above are illustrated by the following description of embodiments. BRIEF DESCRIPTION OF THE DRAWINGS Fig. Figure 1 is a composite perspective view and a perspective exploded view of an imaging device seen from the front. Fig. Figure 2 is a composite perspective view and a perspective exploded view of the imaging device as seen from the rear. Fig. Figure 3 is a perspective exploded view of an image sensor module as seen from the front. Fig. Figure 4 is a perspective exploded view of the image sensor module as seen from the rear. Fig. Figure 5 is a drawing of a basic element in three views. Fig. Figure 6 shows a view of the sensor board from one side of the rear surface. Fig. Figure 7 is a cross-sectional view of the image sensor module along line VII-VII in Fig. 1. DESCRIPTION OF EXECUTION FORMS

[0008] An embodiment of the invention is described below with reference to the drawings. This embodiment contributes to Goal 9, "Industry, Innovation and Infrastructure," of the UN Sustainable Development Goals (SDGs) by realizing a highly versatile imaging device. Overall configuration of the imaging device 1

[0009] Fig. Figure 1 is a composite perspective view and a perspective exploded view of an imaging device 1 seen from the front. Fig. Figure 2 is a composite perspective view and a perspective exploded view of the imaging device 1 as seen from the rear. The imaging device 1 is a device that creates an image of an object. For example, the imaging device 1 is a small imaging device for use in the medical field, such as in ophthalmology and dentistry. However, the specific application of the imaging device 1 is not limited and could also be a surveillance camera monitoring the surroundings.

[0010] As in the Fig. 1 and Fig. As illustrated in Figure 2, the imaging device 1 mainly comprises an image sensor module 10, an optical filter module 20, and a control module 30. The imaging device 1 further comprises an optical lens holder 2, a plurality of bolts 3 (secondary fasteners), a plurality of bolts 4, and a lower support 5. However, the components of the imaging device 1 are not limited to the examples in Figure 2. Fig. 1 and Fig. 2 limited. For example, the optical lens holder 2 and the lower bracket 5 can be omitted.

[0011] In the following, the direction of extension of an optical axis of an image sensor 111 is defined as the "axial direction." The direction of the diameter of an imaginary circle whose center lies on the optical axis and which is perpendicular to the axial direction is defined as the "radial direction," and the direction of a circle's circumference is defined as the "circumference direction." In the radial direction, a direction toward the optical axis is referred to as radially inward, and a direction away from the optical axis is referred to as radially outward. The optical axis of the image sensor 111, for example, refers to an imaging direction of the image sensor 111 (more precisely, a direction toward the center of the image sensor 111's viewing angle). In the axial direction, a direction of approach to an object is defined as "front," and a direction opposite to front is defined as "back."The axial direction is an example of a direction in which a sensor board 11, a base element 12, and a front element 13, which are described below, point. In this description, a surface located at the front in the axial direction of the sensor board 11, the base element 12, the front element 13, and the housings 21 and 31 is referred to as the front surface, and a surface located at the rear in the axial direction is referred to as the rear surface.

[0012] The image sensor module 10 is a module that images an object and generates an image (a still image or a moving image). More precisely, the image sensor module 10 is powered by the control module 30 and operates under the control of the control module 30. The image sensor module 10 outputs an image signal, which indicates the image obtained by imaging the object, to the control module 30 by photoelectrically converting external light entering through the optical filter module 20. The image sensor module 10 is subsequently referred to as follows: Fig. 3 and subsequent drawings are described in detail.

[0013] The optical filter module 20 is positioned in front of the image sensor module 10. The optical filter module 20 is a module that allows external light to enter the image sensor 111. The optical filter module 20 encloses a housing 21 made of metal (for example, die-cast aluminum). The housing 21 contains a filter 22 (for example, an IR blocking filter), a dust protection film 23, and the like. The housing 21 mainly comprises a base section 24 and a support section 25.

[0014] The base section 24 is a plate-like element with a substantially rectangular outer shape. The support section 25 has a cylindrical outer shape. The support section 25 projects forward from a front surface of the base section 24. The support section 25 detachably carries the optical lens holder 2. This means that a variety of optical lenses with different specifications (for example, magnifications) can be selectively mounted on the optical lens holder 2 (imaging device 1).

[0015] Furthermore, bolt holes 26 and front through-holes 27 are formed in the optical filter module 20. The bolt holes 26 are formed on a rear surface of the base section 24, radially outward of the support section 25. The bolts 3, which are guided through notches 125 of the image sensor module 10, are screwed into the bolt holes 26. This secures the image sensor module 10 and the optical filter module 20. The front through-holes 27 extend through the housing 21 in the thickness direction (axial direction), radially outward of the support section 25. The bolts 4 are inserted through the front through-holes 27.

[0016] The control module 30 is located on the rear side of the image sensor module 10. The control module 30 controls the operation of the image sensor 111. The control module 30 encloses a housing 31 made of metal (for example, die-cast aluminum). The housing 31 has a rectangular, parallelepiped outer shape with an open front surface. The housing 31 contains the image sensor module 10 and a control board 32, which controls the operation of the image sensor 111.

[0017] A connector 33 is provided on a rear surface of the housing 31, to which one end of a cable is detachably connected. The control module 30 (the imaging device 1) is connected to an external device via the cable connected to the connector 33. The control module 30 operates the image sensor 111 using power supplied via the cable from the external device and outputs an image signal from the image sensor 111 to the external device via the cable.

[0018] Furthermore, bolt holes 34 are formed on the front surface of the housing 31. The bolts 4, which pass through the front through-holes 27, are screwed into the bolt holes 34. This results in the image sensor module 10 and the optical filter module 20, which are secured by the bolts 3, being housed inside the housing 31 and the optical filter module 20 being attached to the control module 30. The image sensor module 10 is not in direct contact with the control module 30 (more precisely, with the housing 31).

[0019] The lower bracket 5 is attached to a lower surface of the housing 31 of the control module 30.

[0020] The lower bracket 5 serves as a stand when the imaging device 1 is placed, for example, on a surface. Components for operating the imaging device 1 can be housed inside the lower bracket 5. Configuration of the image sensor module 10

[0021] Fig. Figure 3 is a perspective exploded view of the image sensor module 10 as seen from the front. Fig. Figure 4 is a perspective exploded view of the image sensor module 10 as seen from the rear. As shown in the Fig. 3 and Fig. As illustrated in Figure 4, the image sensor module 10 mainly includes the sensor board 11, the base element 12, the front element 13, a variety of coil springs 14 (preload elements), a variety of bolts 15 (first fastening elements) and a heat dissipation element 16.

[0022] The sensor board 11 is a plate-shaped circuit board on which electronic components (for example, the image sensor 111 and a power supply component 112) are mounted. The sensor board 11 is, for example, a glass-epoxy circuit board. The sensor board 11 is a double-sided mounting board with a front surface on which the image sensor 111 is mounted and a rear surface on which the power supply component 112 is mounted.

[0023] The image sensor 111 photoelectrically converts external light entering through the optical lens mounted on the lens holder 2 to generate the image signal. The image sensor 111 is, for example, a complementary metal-oxide semiconductor (CMOS) or a charge-coupled device (CCD). The power supply component 112 is an IC chip that supplies the image sensor 111 with power from the control board 32.

[0024] Furthermore, an electronic component (for example, an IC chip that outputs the image signal generated by the image sensor 111 to the control board 32) is mounted on the sensor board 11, which operates the image sensor 111 according to the control commands of the control board 32. Of the electronic components mounted on the sensor board 11, the image sensor 111 and the power supply component 112 generate a particularly large amount of heat.

[0025] Through-holes 113 are formed in the sensor board 11. The through-holes 113 extend through the sensor board 11 in the thickness direction (axial direction) at a position different from the mounting area of ​​other electronic components, including the image sensor 111 and the power supply component 112. The bolts 15, which pass through the base through-holes 123, are inserted through the through-holes 113.

[0026] Furthermore, positioning holes 114a and 114b are formed in the sensor board 11. The positioning holes 114a and 114b extend through the sensor board 11 in the thickness direction (axial direction) at positions other than the mounting area of ​​other electronic components, including the image sensor 111 and the power supply component 112. Positioning projections 133, described below, are inserted through the positioning holes 114a and 114b. The positioning holes 114a are spaces whose entire perimeter is surrounded by an inner wall of the sensor board 11. The positioning holes 114b are spaces in which a portion of an outer circumferential end of the sensor board 11 is open, and the spaces extend radially inward from this portion of the outer circumferential end of the sensor board 11.

[0027] The base element 12 faces the rear surface of the sensor board 11. The base element 12 is a plate-shaped element made of metal (for example, die-cast aluminum). Fig. Figure 5 is a drawing of the base element 12 in three views (a front view, a side view, and a rear view). A part of VV of the front view (left view) in the side view (middle view) of Fig. 5 is a cross-section. As in Fig. As illustrated in Figure 5, the base element 12 has a protruding surface 121, a plurality of recessed sections 122, a plurality of base through holes 123, a plurality of cylindrical sections 124, a plurality of notches 125 and a plurality of positioning recessed sections 126.

[0028] The projecting surface 121 is provided on the front surface of the base element 12. The projecting surface 121 extends forward from the front surface of the base element 12 (towards the sensor board 11). The projecting surface 121 is a surface perpendicular to the axial direction. According to the present embodiment, the projecting surface 121 has a rectangular outer shape when viewed from the axial direction. Furthermore, the projecting surface 121 is positioned apart from the outer circumferential surfaces 124a of the plurality of cylindrical sections 124. In other words, a space is formed between the projecting surface 121 and the outer circumferential surfaces 124a of the cylindrical sections 124. The heat dissipation element 16, arranged between the sensor board 11 and the base element 12, is in contact with the projecting surface 121.

[0029] Fig. Figure 6 shows a view of the sensor board 11 from one side of the rear surface. Fig. 6 The mounting area of ​​the image sensor 111 is indicated by a dashed line and the position of the protruding surface 121 is indicated by a dashed line. As in Fig. As illustrated in Figure 6, the protruding surface 121 is arranged radially inward of the outer circumferential end of the image sensor 111. The power supply component 112 is mounted in a position that overlaps the mounting area of ​​the image sensor 111 when the sensor board 11 is viewed from an axial direction. Furthermore, it is desirable that, among the electronic components mounted on the sensor board 11, a heat-generating electronic component be mounted in a position that overlaps the protruding surface 121 when the sensor board 11 is viewed from an axial direction. The plurality of recessed sections 122 are provided at spaced-apart positions on the rear surface of the base element 12.

[0030] The recessed sections 122 extend forward from the rear surface of the base element 12. The depth of the recessed sections 122 is set to be equal to or slightly greater than the height of the head of the bolts 15. The plurality of base through-holes 123 extends through the base element 12 in the thickness direction (axial direction) at the positions of the plurality of recessed sections 122. The bolts 15 are inserted through the base through-holes 123. This allows the head of the bolts 15 to be located within the recessed sections 122 and prevents the bolts 15 from protruding backward from the rear surface of the base element 12.

[0031] The plurality of base through-holes 123 each consists of a large-diameter hole 123a and a small-diameter hole 123b. One end of the large-diameter hole 123a opens to a protruding end of the cylindrical section 124, and the other end communicates with the small-diameter hole 123b inside the base element 12. If the cylindrical section 124 is omitted, one end of the large-diameter hole 123a opens on the front surface of the base element 12. One end of the small-diameter hole 123b opens on the rear surface of the base element 12, and the other end communicates with the large-diameter hole 123a inside the base element 12. The diameter of the small-diameter hole 123b is smaller than the diameter of the large-diameter hole 123a.More precisely, the diameter of the large-diameter hole 123a is larger than the diameter of the coil spring 14 and the shank of the bolt 15. Conversely, the diameter of the small-diameter hole 123b is smaller than the diameter of the coil spring 14 and larger than the diameter of the shank of the bolt 15.

[0032] The large-diameter hole 123a and the small-diameter hole 123b are each defined by inner wall surfaces 123c and 123d formed inside the base element 12. The inner wall surfaces 123c and 123d are cylindrical surfaces, each having a circular cross-section perpendicular to the thickness direction of the base element 12 and extending in the thickness direction of the base element 12. The inner wall surface 123c of the large-diameter hole 123a is connected to the inner wall surface 123d of the small-diameter hole 123b by a step surface 123e. The step surface 123e is a surface perpendicular to one of the extension directions of the base through-hole 123.An outer circumferential surface of the step surface 123e is connected to the inner wall surface 123c of the large diameter hole 123a, and an inner circumferential surface of the step surface 123e is connected to the inner wall surface 123d of the small diameter hole 123b.

[0033] This results in the bolt 15, which is inserted into the base through-hole 123 from the side of the rear surface of the base element 12, passing through the small-diameter hole 123b and the large-diameter hole 123a, and protruding towards the side of the front surface of the base element 12. Conversely, the coil spring 14, which is inserted into the base through-hole 123 from the side of the front surface of the base element 12, passes through the large-diameter hole 123a, and a rear end comes into contact with the step surface 123e. The coil spring 14 is inserted around the bolt 15. In other words, the coil spring 14 is positioned so that it covers the area around the bolt 15. The coil spring 14 is located between the bolt 15 and the inner wall surface 123c of the large-diameter hole 123a.

[0034] Furthermore, the plurality of base through-holes 123 is arranged such that it surrounds the projecting surface 121. For example, the projecting surface 121 is arranged within an imaginary circle that passes through the center point of each plurality of base through-holes 123. It is also desirable that the center of gravity of the projecting surface 121 coincides with the center point of the imaginary circle that passes through the center point of each plurality of base through-holes 123. As another example, the projecting surface 121 is arranged within a polygon (in the present embodiment, a triangle), with the centers of each plurality of base through-holes 123 being the vertices.Furthermore, it is desirable that the position of the center of gravity of the protruding surface 121 coincides with the position of the center of gravity of the polygon, with the centers of the plurality of base passage holes 123 being the vertices.

[0035] The plurality of cylindrical sections 124 are provided on the front surface of the base element 12 at positions that each surround the plurality of base through-holes 123. The cylindrical sections 124 project forward from the front surface of the base element 12 (toward the sensor board 11). The cylindrical sections 124 have a hollow cylindrical shape. The interior of the cylindrical section 124 is a space that forms part of the large-diameter hole 123a.

[0036] The projection of the cylindrical sections 124 is greater than the projection of the protruding surface 121. In other words, the protruding end of the cylindrical sections 124 is located in front of the protruding end of the protruding surface 121 (at a position closer to the sensor board 11). The projection of the cylindrical sections 124 is set to a range in which a pointed end of the cylindrical sections 124 does not contact the sensor board 11 when the image sensor module 10 is assembled in an assembly procedure described below. The projection of the protruding surface 121 is set according to the thickness of the heat dissipation element 16, which is a commercially available product described below, and the distance between the sensor board 11 and the base element 12 during assembly of the image sensor module 10.

[0037] The cylindrical sections 124 define a space between the helical springs 14 and the projecting surface 121. More precisely, the outer circumferential surface 124a of the cylindrical sections 124 is located between the helical spring 14, which is arranged in the base through-hole 123, and the projecting surface 121. When the heat dissipation element 16 provided on the projecting surface 121 is compressed, the outer circumferential surface 124a of the cylindrical sections 124 comes into contact with the heat dissipation element 16, thereby preventing the heat dissipation element 16 from contacting the helical springs 14.This means that when the heat dissipation element 16 embedded between the sensor board 11 and the base element 12 is compressed and expands radially outwards from the protruding surface 121, the contact of the heat dissipation element 16 with the helical springs 14 can be prevented by the cylindrical sections 124.

[0038] The multiple notches 125 are spaces formed at spaced-apart positions in the base element 12. The notches 125 extend through the base element 12 in the thickness direction (axial direction). Furthermore, the outer circumferential end of the base element 12 is open at the position where the notches 125 are formed. The notches 125 are sized to allow the shank of the bolts 3 to pass through while preventing the head of the bolts 3 from passing through. The image sensor module 10 and the optical filter module 20 are attached by screwing the bolts 3, which pass through the notches 125, into the bolt holes 26 from the side of the rear surface of the base element 12.

[0039] The multiple positioning recess sections 126 are arranged at spaced-apart positions on the base element 12. The positioning recess sections 126 can extend from the front surface through the rear surface of the base element 12, or the rear surface can be closed. The positioning projections 133, which protrude through the positioning holes 114a and 114b, are each located within the positioning recess sections 126.

[0040] The front element 13 faces the front surface of the sensor board 11. The front element 13 is made of metal (for example, die-cast zinc). The front element 13 has a frame-like outer shape that extends circumferentially and thus surrounds the image sensor 111. An opening 131, formed by an inner circumferential side surface of a frame, is formed in the front element 13. In other words, the opening 131, which has a larger area than the image sensor 111, extends in the thickness direction through the center of the front element 13.

[0041] The front element 13 has a plurality of bolt holes 132. These bolt holes are arranged around the opening 131 (i.e., within a frame section). The bolt holes 132 are formed on the rear surface of the front element 13. Alternatively, the bolt holes 132 can extend from the front surface through the rear surface of the front element 13. The bolts 15, which pass through the base through holes 123 and the circuit board through holes 113, are screwed into the bolt holes 132. This secures the sensor circuit board 11, the base element 12, and the front element 13.

[0042] Furthermore, a plurality of positioning projections 133 are formed in the front element 13. The plurality of positioning projections 133 are provided around the opening 131 (i.e., in the frame section).

[0043] The positioning projections 133 protrude from the rear surface of the front element 13. They then pass through the positioning holes 114a and 114b of the sensor board 11 and are each accommodated in the positioning recesses 126 of the base element 12. This positions the sensor board 11, the base element 12, and the front element 13 in a direction perpendicular to the axial direction.

[0044] The coil springs 14 are arranged between the sensor board 11 and the base element 12. More precisely, and as shown in Fig. As illustrated in Figure 7, the coil springs 14 are inserted around the bolts 15. The rear end of the coil springs 14 enters the base through-hole 123 from the side of the front surface (i.e., the side of the large-diameter hole 123a) of the base element 12 and comes into contact with the step surface 123e. Furthermore, a front end of the coil springs 14 comes into contact with the rear surface of the sensor board 11 at a position surrounding the board through-hole 113. Thus, the coil springs 14 bias the sensor board 11 toward the front element 13. In other words, the coil springs 14 bias the sensor board 11 in a direction away from the base element 12.

[0045] The heat dissipation element 16 has a substantially rectangular, parallelepiped outer shape. The heat dissipation element 16 is flexible. In this description, "flexibility" refers to a property whereby, when compressed by the sensor board 11 and the base element 12, the heat dissipation element 16 exhibits a reduced thickness dimension that depends on the distance between the sensor board 11 and the base element 12 and expands radially outwards. The term "flexibility" also refers to a property where the thickness dimension increases with increasing distance between the sensor board 11 and the base element 12. This increase in thickness can be such that it can follow a slight reduction in the tightening torque of the bolts 15 at a tilt setting described below. Furthermore, the heat dissipation element 16 is made of a material with high thermal conductivity.There are no particular restrictions on the material from which the heat dissipation element 16 is formed; however, it is, for example, made of a combination of polyurethane and ceramic filler or silicone rubber. As another example, the heat dissipation element 16 can be a gel-like element.

[0046] The heat dissipation element 16 is positioned between the sensor board 11 and the base element 12 while being compressed. More precisely, the heat dissipation element 16 is located between the back surface of the sensor board 11 and the protruding surface 121 of the base element 12. The axial dimension (i.e., the thickness) of the heat dissipation element 16 before compression is selected, for example, from prefabricated commercial products. Conversely, the size and shape of the heat dissipation element 16 before compression, in the direction perpendicular to the axial direction, correspond to the size and shape of the protruding surface 121. The heat dissipation element 16, compressed by the sensor board 11 and the base element 12, expands radially outward (in the direction perpendicular to the axial direction) and becomes larger than the protruding surface 121.

[0047] Thus, before being compressed, the heat dissipation element 16 is in contact with the rear surface of the sensor board 11 within the mounting area of ​​the image sensor 111, which is located in Fig. Figure 6 illustrates this. An area where the heat dissipation element 16 is in contact with the rear surface of the sensor board 11 after compression is approximated to the mounting area of ​​the image sensor 111. Furthermore, the heat dissipation element 16 is in contact with the rear surface of the sensor board 11 both before and after compression, while covering the power supply component 112. However, the power supply component 112 can also be mounted outside the area where the heat dissipation element 16 is in contact with the rear surface of the sensor board 11 before compression, and within the area where the heat dissipation element 16 is in contact with the rear surface of the sensor board 11 after compression.

[0048] The heat dissipation element 16 absorbs the heat generated in the sensor board 11 (more precisely, in the image sensor 111 and the power supply component 112) and transfers the heat to the base element 12. The heat absorbed by the heat dissipation element 16 is then transferred to the external environment of the imaging device 1 via the metal base element 12, the bolts 15, and the housing 21 of the optical filter module 20. Since the base element 12 and the control module 30 (more precisely, the housing 31) are not in direct contact with each other, the heat is not transferred directly from the base element 12 to the housing 31. Assembly procedure of the imaging device 1

[0049] Fig. Figure 7 is a cross-sectional view of the image sensor module 10 along line VII-VII in Fig. 1. A mounting method for the imaging device 1 is described with reference to the Fig. Sections 1 to 7 are described. It is assumed that the optical filter module 20 and the control module 30 are already assembled, and the assembly procedure is omitted. The assembly sequence described below is an example and is not mandatory.

[0050] First, a worker inserts the bolts 15 into the base through-holes 123 from the side of the rear surface of the base element 12. The worker also inserts the coil springs 14 around the bolts 15 from the side of the front surface of the base element 12. This brings the rear end of the coil springs 14 into contact with the stepped surface 123e. Finally, the worker places the heat dissipation element 16 onto the protruding surface 121.

[0051] Next, the worker brings the rear surface of the sensor board 11 and the front surface of the base element 12 together so that they are facing each other, and inserts the bolts 15, which pass through the base through-holes 123, from the side of the rear surface of the sensor board 11 into the board through-holes 113. This brings the tip end of the coil springs 14 into contact with the rear surface of the sensor board 11 at a position surrounding the board through-hole 113. At this point, the heat dissipation element 16 may, but does not have to, be in contact with the rear surface of the sensor board 11.

[0052] Next, the worker brings the front surface of the sensor board 11 and the rear surface of the front element 13 together so that they face each other, and inserts the positioning projections 133 from the front surface of the sensor board 11 into the positioning holes 114a and 114b and the positioning recesses 126, respectively. This positions the sensor board 11, the base element 12, and the front element 13 in the direction perpendicular to the axial direction, and the bolts 15, which pass through the base through holes 123 and the board through holes 113, can be screwed into the bolt holes 132.

[0053] Next, the worker screws the bolts 15 into the bolt holes 132. This secures the base element 12 and the front element 13 with the sensor board 11 inserted between them and compresses the coil springs 14. That is, the bolts 15 fasten the base element 12 and the front element 13 against a preload force exerted by the coil springs 14. As the bolts 15 are tightened, the heat dissipation element 16 inserted between the sensor board 11 and the base element 12 is compressed and expanded radially outward from the protruding surface 121. As the tightening torque of the bolts 15 increases, the degree of compression (i.e., the amount of radial outward expansion) of the heat dissipation element 16 increases.Then the radially outwardly compressed and expanded heat dissipation element 16 is blocked by the outer circumferential surface 124a of the cylindrical sections 124 and flows out into the space between the protruding surface 121 and the outer circumferential surface 124a.

[0054] Furthermore, the worker performs a so-called "tilt adjustment" by individually adjusting the tightening torque of the plurality of bolts 15. The tilt adjustment is a process in which the light-receiving surface of the image sensor 111 is aligned perpendicular to the optical axis of the optical lens by adjusting (increasing or decreasing) the distance between the sensor board 11 and the base element 12 at the position of each of the plurality of bolts 15. The protruding end of the cylindrical sections 124 is spaced from the rear surface of the sensor board 11, and a gap is always maintained between the protruding end and the sensor board 11. The worker then secures the bolts 15 by filling the base through-holes 123 and the board through-holes 113 with an adhesive after performing the tilt adjustment. This completes the assembly of the image sensor module 10.

[0055] The coil springs 14 generate a preload force in a direction that increases the distance between the sensor board 11 and the base element 12. During the tilt adjustment process, the tightening torque of the bolts 15 can be reduced. This means that the axial distance between the sensor board 11 and the base element 12 can be greater after the heat dissipation element 16 has been compressed. Conversely, the flexible heat dissipation element 16 can accommodate the slight increase in the distance between the sensor board 11 and the base element 12 and remain in close contact with both.

[0056] Next, the worker aligns the front surface of the image sensor module 10 and the rear surface of the optical filter module 20 so that they are facing each other, and screws the bolts 3, which pass through the notches 125, into the bolt holes 26 from the rear surface of the image sensor module 10. This completes the assembly of the image sensor module 10 and the optical filter module 20. The tilt adjustment described above can be performed after the image sensor module 10 and the optical filter module 20 have been assembled.

[0057] Next, the worker assembles the image sensor module 10 and the optical filter module 20 with the housing 31 of the control module 30 and screws the bolts 4, which pass through the front through-holes 27, into the bolt holes 34 from the front surface of the optical filter module 20. This completes the assembly of the image sensor module 10, the optical filter module 20, and the control module 30. The worker then places the imaging device 1, which is located in the Fig. 1 and Fig. 2 is illustrated, completed by attaching the optical lens and the lower bracket 5. Advantageous effects of the design

[0058] The above embodiment enables the heat generated in the image sensor 111 to be dissipated to the base element 12 by arranging the heat dissipation element 16 between the sensor board 11 and the base element 12. The heat dissipation element 16 can be brought into close contact with both the sensor board 11 and the base element 12 by compressing it.

[0059] This prevents displacement and detachment of the heat dissipation element 16 and thus ensures adequate heat dissipation.

[0060] According to the embodiment described above, the positioning of the heat dissipation element 16 during assembly is facilitated by the provision of the protruding surface 121. Alternatively, instead of the protruding surface 121, a recessed section for receiving the heat dissipation element 16 can be provided on the front surface of the base element 12. However, the protruding surface 121 is larger than the recessed section to allow for radial outward expansion of the compressed heat dissipation element 16. By adjusting the projection of the protruding surface 121 according to the thickness of the heat dissipation element 16, the degree of compression of the commercially available heat dissipation element 16 can be appropriately adapted.

[0061] According to the embodiment described above, the heat dissipation element 16 is positioned within the mounting area of ​​the image sensor 111 before being compressed. This prevents the radially outwardly compressed and expanded heat dissipation element 16 from extending excessively beyond the mounting area of ​​the image sensor 111. This also prevents the radially outwardly expanded heat dissipation element 16 from interfering with other components (for example, the coil springs 14).

[0062] In the above embodiment, the degree of compression of the heat dissipation element 16 can be suitably adjusted, and the inclination adjustment can be achieved by individually adjusting the tightening torque of the plurality of bolts 15. This allows manufacturing deviations in the components to be compensated for and the imaging quality of the imaging device 1 to be stabilized.

[0063] According to the embodiment described above, the coil springs 14 are inserted around the bolts 15, and the stepped surface 123e of the base through holes 123 is used as a spring seat. This allows the imaging device 1 to be miniaturized compared to a case where the coil springs 14 and the bolts 15 are installed in different positions, and enables the coil springs 14 to be extended and contracted stably.

[0064] According to the above embodiment, it is possible to prevent the radially outwardly compressed and expanded heat dissipation element 16 from coming into contact with the helical springs 14 by limiting the space between the base through holes 123 (i.e. the helical springs 14 inserted into the base through holes 123) and the protruding surface 121 by the cylindrical sections 124.

[0065] According to the embodiment described above, the projecting surface 121 is spaced apart from the outer circumferential surface 124a of the cylindrical sections 124, so that the radially outwardly compressed and expanded heat dissipation element 16 is blocked by the outer circumferential surface 124a and flows into the space between the projecting surface 121 and the outer circumferential surface of the cylindrical sections 124. This prevents the heat dissipation element 16 from extending beyond the cylindrical sections 124.

[0066] According to the embodiment described above, after the tilt adjustment, the base through-holes 123 and the circuit board through-holes 113 are filled with adhesive to secure the bolts 15. This prevents the distance between the sensor circuit board 11 and the base element 12 from subsequently changing. This allows the tilted state to be maintained and prevents the heat dissipation element 16 from shifting or detaching.

[0067] The above embodiment enables efficient dissipation of the heat generated in the sensor board 11 to the base element 12 by covering the power supply component 112, which has a large heat emission, with the heat dissipation element 16.

[0068] Furthermore, the above embodiment, by dissipating the heat absorbed by the heat dissipation element 16 to the outside through the base element 12, the bolts 15 and the housing 21 of the optical filter module 20, enables the propagation of heat to the control module 30 (more precisely to the control board 32) to be suppressed.

[0069] Although various embodiments have been described above with reference to the drawings, it is understood that the present disclosure is not limited to these examples. Various changes, modifications, replacements, additions, deletions, and equivalents within the scope described in the claims are obvious to the person skilled in the art, and it is understood that these naturally fall within the technical scope of the present disclosure.

[0070] The components in the various embodiments described above can be combined as needed without deviating from the scope of the invention. List of reference symbols 1 Imaging device 2 optical lenses 3, 4, 15 bolts 5 lower bracket 10 Image sensor module 11 Sensor board 12 Basic element 13 Front element 14 coil spring 16 Heat dissipation element 20 Optical filter module 21, 31 Housing 22 filters 23 Dust protection film 24 Basic section 25 Lens carrier section 26, 34, 132 bolt hole 27 front through hole 30 Control module 32 Control board 33 connection 111 Image sensor 112 Power supply component 113 Circuit board through-hole 114a, 114b Positioning hole 121 protruding surface 122 in-depth section 123 Base Passage Hole 123a Large diameter hole 123b Small diameter hole 123c, 123d Interior wall surface 123e Step surface 124 cylindrical section 124a Outer circumferential surface 125 notch 126 Positioning indentation section 131 Opening 133 Positioning advantage QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] JP 02-111175 A

[0003]

Claims

[1] Image sensor module comprising: a sensor board having a front surface on which an image sensor is mounted, configured to image an object; a base element facing a rear surface of the sensor board; a front element facing the front surface of the sensor board; a biasing element that is positioned between the sensor board and the base element and is configured to bias the sensor board towards the front element; a first fastening element configured to fasten the base element and the front element against a preload force of the preload element; and a heat dissipation element that is positioned between the sensor board and the base element while it is being compressed, and is configured to dissipate heat generated in the sensor board to the base element. [2] Image sensor module according to claim 1, wherein a protruding surface is formed on a front surface of the base element, projecting towards the sensor board and The heat dissipation element is positioned between the back surface of the sensor board and the protruding surface of the base element while it is compressed. [3] Image sensor module according to claim 2, wherein the protruding surface, viewed from a direction of application of the sensor board and the base element, is arranged radially inwards of an outer circumferential end of the image sensor, and The size of the heat dissipation element before compression corresponds to the size of the protruding surface. [4] Image sensor module according to claim 2, wherein the first fastening element is a bolt which passes through a base through-hole extending through the base element and a board through-hole extending through the sensor board and is screwed into a bolt hole provided in the front element, and a distance between the sensor board and the base element is set by individually adjusting the tightening torque of a plurality of bolts. [5] Image sensor module according to claim 4, wherein the base through-hole consists of a large-diameter hole opening on the front surface of the base element and a small-diameter hole opening on a rear surface of the base element, which has a smaller diameter than the large-diameter hole, and the preload element is a coil spring arranged around the bolt and has a rear end in contact with a step surface connecting an inner wall surface of the base element defining the large diameter hole and an inner wall surface of the base element defining the small diameter hole, and a front end in contact with the rear surface of the sensor board. [6] Image sensor module according to claim 5, wherein a cylindrical section projecting towards the sensor board is provided on a front surface of the base element and The cylindrical section defines a space between the helical spring and the protruding surface. [7] Image sensor module according to claim 6, wherein the protruding surface is provided at a position spaced apart from an outer circumferential surface of the cylindrical section. [8] Image sensor module according to claim 4, wherein the bolt is secured by an adhesive which is injected into the base through-hole and the circuit board through-hole. [9] Image sensor module according to claim 1, wherein a power supply component configured to power the image sensor is mounted on the rear surface of the sensor board, and the compressed heat dissipation element is in contact with the rear surface of the sensor board while covering the power supply component. [10] Imaging device comprising: the image sensor module according to claim 1; an optical filter module positioned in front of the image sensor module and is configured to allow external light to enter the image sensor; and a control module located behind the image sensor module and configured to control the operation of the image sensor, wherein The base element, a housing of the optical filter module, and a second mounting element configured to secure the base element and housing are made of metal.

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