DISPLAY DEVICE

Abstract

The present disclosure provides a display device (100).The display device (100) according to an embodiment of the present disclosure may comprise: a substrate (110) having a display area (DA) in which a plurality of pixels (P) having a plurality of subpixels (SP) are arranged, and a non-display area (NDA) surrounding the display area (DA), and an organic light-emitting layer (116) provided on the substrate (110), wherein each of the plurality of subpixels (SP) has the organic light-emitting layer (116), the organic light-emitting layer (116) being arranged to extend from the display area (DA) to one end of the substrate (110), the substrate (110) having an undercut section (UCP) in which the organic light-emitting layer (116) is interrupted, and the undercut section (UCP) being arranged in the non-display area (NDA) to surround the display area (DA).

Description

Technical field

[0001] The present disclosure relates to a device, in particular, for example, without limitation, a display device. Discussion of the state of the art

[0002] Since an organic light-emitting display device has a high response speed and low power consumption, and unlike a liquid crystal display device, emits light itself without requiring a separate light source, there is no problem with a viewing angle, and thus the organic light-emitting display device has attracted attention as a next-generation flat panel display device.

[0003] Such a display device shows an image by light emission from a light-emitting layer located between a pixel electrode and an opposite electrode.

[0004] However, since display devices have diverse applications and uses, they are manufactured in models of various sizes. To produce display devices of different sizes, light-emitting layers are typically formed using masks of different sizes.

[0005] The descriptions provided in the discussion of the "Prior Art" section should not be considered prior art simply because they are mentioned in or related to that section. The discussion of the "Prior Art" section may contain information describing one or more aspects of the technology in question, and the descriptions in that section do not limit its application. SUMMARY OF THE INVENTION

[0006] The inventors of the present disclosure have recognized that manufacturing display devices of different sizes requires masks (or EL masks) of different sizes, which leads to problems due to high manufacturing costs and increased energy consumption during production.

[0007] One aspect of the present disclosure aims to provide a display device whose manufacturing costs can be reduced even when manufactured in different sizes.

[0008] Another aspect of the present disclosure relates to the provision of a display device whose production energy can be reduced.

[0009] Another aspect of the present disclosure relates to the provision of a display device in which the ingress of moisture can be reduced or prevented even during manufacture in different sizes.

[0010] Another aspect of the present disclosure relates to the provision of a display device in which dark spot defects in a display area can be improved or prevented.

[0011] Another aspect of the present disclosure relates to the provision of an indicator device in which a failure of the cathode contact in a common current short-circuit strip can be reduced or prevented.

[0012] The problems to be solved using the examples in this disclosure are not limited to those mentioned above, and other, unmentioned problems will be apparent to the person skilled in the art who is familiar with the technical ideas of this disclosure from the following description. According to one aspect of this disclosure, a display device according to claim 1 is provided. Further embodiments of the display device are described in the dependent claims.

[0013] A display device according to at least one embodiment of the present disclosure comprises: a substrate having a display area in which a plurality of pixels with a plurality of subpixels are arranged, and a non-display area around the display area, and an organic light-emitting layer provided on the substrate, wherein each of the plurality of subpixels has the organic light-emitting layer, the organic light-emitting layer being arranged to extend from the display area to an end of the substrate, the substrate having an undercut section in which the organic light-emitting layer is interrupted, and the undercut section being arranged in the non-display area to surround the display area.

[0014] Other systems, methods, features, and advantages will be or become apparent to a person skilled in the art upon examination of the following figures and the detailed description. It is intended that all such additional systems, methods, features, and advantages are included in this description, fall within the scope of the present disclosure, and are protected by the following claims. Nothing in this section should be construed as limiting these claims. Further aspects and advantages are discussed below in connection with embodiments of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The accompanying drawings, which are included for a better understanding of the disclosure and form part of this application, illustrate embodiments of the disclosure and, together with the description, serve to explain the principle of the disclosure. The drawings include: is Fig. 1 A schematic top view of a display device according to an embodiment of the present disclosure. is Fig. 2 a schematic cross-sectional view along the in Fig. 1 shown line I-I'. is Fig. 3 a top view illustrating schematically an undercut formation area and a cathode formation area in a substrate of a display device according to an embodiment of the present disclosure. is Fig. 4 a schematic cross-sectional view along the in Fig. 3 shown line II-II'. is Fig. 5 a schematic cross-sectional view along the in Fig. 3 shown line III-III'. is Fig. 6 a schematic cross-sectional view along the in Fig. 3 shown line IV-IV'. is Fig. 7 a schematic cross-sectional view along the in Fig. 3 shown line V-V'.

[0016] Unless otherwise specified, the same drawing reference symbols in the drawings and the detailed description refer to the same elements, features, devices, and structures. The relative size and representation of these elements may be exaggerated for clarity, illustration, and conciseness. DETAILED DESCRIPTION OF THE REVELATION

[0017] Detailed reference is now made to the embodiments of the present disclosure, examples of which are shown in the accompanying drawings. Where possible, the same reference numerals are used in the drawings to refer to identical or similar parts. The following description omits a detailed description of known functions or configurations related to this document if such a description would unnecessarily obscure a core aspect of the inventive concept. The sequence of processing steps and / or operations described is an example; however, the order of the steps and / or operations is not limited to that presented here and may be modified as is known in the art, with the exception of steps and / or operations that must necessarily be carried out in a specific sequence.The names of the respective elements used in the following explanations may have been chosen for the sake of simplicity and may therefore differ from those used in actual products.

[0018] The advantages and features of the present disclosure, as well as its implementation methods, are explained with reference to the following embodiments and the accompanying drawings.

[0019] However, the present disclosure can be implemented in various forms and should not be interpreted as being limited to the embodiments set forth herein. Rather, these embodiments may be provided to ensure that this disclosure is sufficiently thorough and complete to assist the person skilled in the art in fully understanding its scope. Furthermore, the present disclosure is defined solely by the scope of the claims.

[0020] A shape, size, ratio, angle, and number disclosed in the drawings to describe embodiments of the present disclosure can only be an example. Thus, the present disclosure is not limited to the details shown.

[0021] Identical reference symbols consistently refer to the same elements. In the following description, the detailed description of the relevant known function or configuration may be omitted if it is determined that it unnecessarily obscures an important point of the present disclosure.

[0022] In a case where the terms “have”, “have”, and “contain” are used in the present disclosure, a further part may be added unless “only ~” is used. Terms of a singular form may have plural forms unless otherwise stated.

[0023] Any implementation described herein as an "example" should not necessarily be understood as preferred or advantageous over other implementations.

[0024] When interpreting an element, that element is designed in such a way that it has a margin of error, even if this is not explicitly described.

[0025] When any dimensions, relative sizes, etc., are mentioned, it should also be considered that numerical values ​​for elements or characteristics, or corresponding information (e.g., level, range, etc.), contain a tolerance or error range that can be caused by various factors (e.g., process factors, internal or external influences, noise, etc.), even if no corresponding description is given. Furthermore, the term "may" encompasses all the meanings of the term "can."

[0026] When describing a positional relationship, for example, when a positional relationship between two parts is described as "on top", "above", "below", and "next to", one or more other parts may be positioned between the two parts, unless "only" or "directly" is used. For example, if one element or layer is positioned "on top" of another element or layer, a third layer or element may be located between them.

[0027] When describing a temporal relationship, for example when the temporal sequence is described as "after", "subsequently", "next" and "before", a non-continuous case may be included unless "straight ahead" or "directly" is used.

[0028] It is understood that the terms "first," "second," etc., used here to describe various elements, are not intended to limit these elements. These terms are used only to distinguish one element from another. For example, a first element could be called a second element, and likewise a second element could be called a first element, without altering the scope of the present revelation.

[0029] “X-axis direction”, “Y-axis direction” and “Z-axis direction” should not only be interpreted as a geometric relationship of a mutual vertical relationship, but may have a broader directional dependency within the range in which the elements of the present disclosure can function functionally.

[0030] The term "at least one" should be understood to mean any combination of one or more of the listed elements. For example, the meaning of "at least one of a first element, a second element, and a third element" refers to the combination of all elements that can be derived from two or more of the first element, the second element, and the third element, as well as the first element, the second element, or the third element.

[0031] In describing elements of this revelation, the terms “first”, “second”, “A”, “B”, “(a)”, and “(b)”, etc., may be used. These terms serve only to distinguish one element from another, and the nature, sequence, arrangement, or number of any such element should not be restricted by them. For example, a first element could be called a second element, and likewise a second element could be called a first element, without altering the scope of this revelation.

[0032] When an element or layer is "connected," "coupled," or "attached" to another element or layer, this means that the element or layer may not only be directly connected or bonded to the other element or layer, but may also be indirectly connected or attached to the other element or layer, with one or more interposed elements or layers "arranged" or "interposed" between the elements or layers, unless otherwise specified. It should be understood that elements may be arranged to be in direct contact, or they may be arranged to be not in direct contact.

[0033] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as generally understood by a person skilled in the art in the field to which the embodiments belong. It is further understood that terms as defined in common dictionaries should be interpreted, for example, as having a meaning consistent with their meaning in the context of the relevant field, and should not be interpreted in an idealized or overly formal sense, unless expressly defined herein.For example, the term "part" or "unit" may refer to a separate circuit or structure, an integrated circuit, a computing block of a circuit device, or any structure configured to perform a described function as should be understandable to a person skilled in the art.

[0034] Features of different embodiments of the present disclosure can be partially or completely coupled or combined and can interact and be technically controlled in various ways, as is sufficiently understandable to a person skilled in the art in this field. The embodiments of the present disclosure can be implemented independently of one another or together in a dependent relationship.

[0035] It is obvious to a person skilled in the art that various modifications and variations can be made to the display device, including the present disclosure, without deviating from the technical idea or the scope of the disclosures. Therefore, the present disclosure is intended to cover the modifications and variations of this disclosure, provided they fall within the scope of the appended claims and their modifications.

[0036] The embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.

[0037] Fig. 1 is a schematic top view of a display device according to an embodiment of the present disclosure, Fig. 2 is a schematic cross-sectional view along the in Fig. 1 shown line I-I', and Fig. Figure 3 is a top view illustrating schematically an undercut formation area and a cathode formation area in a substrate of a display device according to an embodiment of the present disclosure.

[0038] In the following, a first direction (Y-axis direction) represents a vertical direction based on Fig. 1 represents a second direction (X-axis direction), a horizontal direction based on Fig. One direction represents a third direction (Z-axis direction) and a third direction represents a thickness direction of a display device 100. For example, the first direction (Y-axis direction) can be a direction parallel to a data wiring (not shown), and the second direction (X-axis direction) can be a direction parallel to a gate wiring (not shown).

[0039] With reference to Fig. 1. A display device 100 according to an embodiment of the present disclosure can have a display panel having a gate driver GD. The display panel can have a substrate 110 and a opposite substrate 200 (shown in Fig. 2) exhibit which are interconnected.

[0040] The substrate 110 according to an example can have a display area DA in which a plurality of pixels P with a plurality of subpixels SP are arranged, and a non-display area NDA around the display area DA.

[0041] A display device 100 according to an embodiment of the present disclosure may further comprise an organic light-emitting layer 116 provided on the substrate 110 and any one of the plurality of subpixels SP. The organic light-emitting layer 116 may be arranged such that it extends from the display area DA to one end of the substrate 110.

[0042] For example, the organic light-emitting layer 116, as in Fig. As shown in Figure 1, the organic light-emitting layer 116 can be arranged such that it extends from the display area DA to an end 110a (or a first end 110a) of the substrate 110 in a first non-display area NDA1 of the non-display area NDA. Additionally, the organic light-emitting layer 116 can be arranged such that it extends from the display area DA to an end 110b (or a second end 110b) of the substrate 110 in a second non-display area NDA2 of the non-display area NDA. Additionally, the organic light-emitting layer 116 can be arranged such that it extends from the display area DA to an end 110c (or a third end 110c) of the substrate 110 in a third non-display area NDA3 of the non-display area NDA.Furthermore, the organic light-emitting layer 116 can be arranged to extend from the display area DA to one end 110d (or a fourth end 110d) of the substrate 110 in a fourth non-display area NDA4 of the non-display area NDA. Accordingly, the organic light-emitting layer 116 can be arranged in both the display area DA and the non-display area NDA.

[0043] As a result, the display device 100 according to an embodiment of the present disclosure can have a structural feature in which the organic light-emitting layer 116 is arranged such that it extends from the display area DA to the end of the substrate 110.

[0044] In a conventional display device, where a light-emitting layer is typically formed using masks (or EL masks) of different sizes to produce display devices of different sizes, masks (or EL masks) of different sizes are required. Consequently, the conventional display device suffers from the limitations of high manufacturing costs and increased energy consumption during production.

[0045] However, since the display device 100 according to an embodiment of the present disclosure is provided such that the organic light-emitting layer 116 extends from the display area DA to the end of the substrate 110, no masks (or EL masks) of different sizes are required, so that even when manufacturing in different sizes the manufacturing costs can be reduced.

[0046] However, as described above, in the general display device, the light-emitting layer is typically formed using masks (or EL masks) of various sizes. The mask (or mask opening) of the general display device is designed to be smaller than the substrate so that the light-emitting layer is not placed at the end of the substrate. If the light-emitting layer were placed at the end of the substrate, it would be exposed to the outside, and defects could occur due to moisture and oxygen permeability (or penetration). Therefore, in the case of the general display device, a mask (or EL mask) is required to form a light-emitting layer, and the size of the mask (or mask opening) is provided to be smaller than the substrate.

[0047] In contrast, the display device 100 can be provided according to an embodiment of the present disclosure such that the substrate 110 has an undercut section UCP. According to one example, the undercut section UCP serves to separate the organic light-emitting layer 116. As in Fig. As shown in Figure 1, the undercut section UCP can be positioned in the non-display area NDA such that it surrounds the display area DA. The undercut section UCP can have a first undercut UC1, a second undercut UC2, a third undercut UC3, and a fourth undercut UC4.

[0048] Therefore, in the display device 100 according to one embodiment of the present disclosure, the undercut section UCP is arranged such that it surrounds the display area DA, so that even if the organic light-emitting layer 116 is arranged to extend from the display area DA to the end of the substrate 110, the penetration (or ingress) of moisture and oxygen through the organic light-emitting layer 116 can be reduced or prevented by the undercut section UCP. That is, in the display device 100 according to one embodiment of the present disclosure, the penetration of moisture can be reduced or prevented by arranging the undercut section UCP, in which the organic light-emitting layer 116 is interrupted, around the display area DA.Since the display device 100 according to one embodiment of the present disclosure does not require a mask (or EL mask) for forming the organic light-emitting layer 116, the manufacturing costs can be reduced even when it is manufactured in different sizes.

[0049] Furthermore, since the display device 100 according to an embodiment of the present disclosure can be manufactured in different sizes without masks (or EL masks) of different sizes, a process can be optimized compared to a general display device manufactured using masks (or EL masks) of different sizes, thereby reducing the production energy.

[0050] With reference to Fig. 1. A display device 100 according to an embodiment of the present disclosure may comprise a source driver integrated circuit (hereinafter referred to as “IC”) 120, a flexible film 130, a printed circuit board 140 and a timing control section 150.

[0051] Substrate 110 can contain a thin-film transistor and can be a transistor array substrate, a bottom substrate, a base substrate, or a first substrate. Substrate 110 can be a transparent glass substrate or a transparent plastic substrate.

[0052] The opposing substrate 200 can be bound to the substrate 110 via an adhesive element. For example, the opposing substrate 200 is smaller than the substrate 110 and can be bound to a remaining section of the substrate 110, except for a pad section PA. The opposing substrate 200 can be an upper substrate, a second substrate, or an encapsulation substrate.

[0053] The gate driver GD supplies gate signals to the gate lines according to the gate control signal input from the timing control section 150. When the source driver IC 120 is manufactured as a driver chip, it can be packaged in the flexible film 130 using a chip-on-film (COF) or chip-on-plastic (COP) process.

[0054] Pads, such as data pads, can be formed in the non-display area of ​​the display panel. Traces connecting the pads to the source driver IC 120 and traces connecting the pads to traces of the printed circuit board 140 can be formed in the flexible film 130. The flexible film 130 can be applied to the pads using an anisotropic conductive film, thereby connecting the pads to the traces of the flexible film 130.

[0055] With reference to Fig. 1. According to an example, substrate 110 can have a display area DA and a non-display area NDA.

[0056] The display area DA is an area where an image is displayed and can be a pixel array area, an active area, a pixel array unit, a display unit, or a screen. For example, the display area DA can be located in a central section of the display panel.

[0057] The display area DA, according to one example, can have gate wiring, data wiring, pixel power wiring, and a plurality of pixels P. Each of the plurality of pixels P can have a plurality of subpixels SP, which can be defined by gate wiring and data wiring. Each of the plurality of subpixels SP can be defined as the smallest unit area in which light is actually emitted.

[0058] According to one example, at least four adjacent subpixels SP, configured to emit light of different colors, form a unit pixel P from a plurality of subpixels SP. This unit pixel can have, but is not limited to, a red subpixel, a green subpixel, a blue subpixel, and a white subpixel.

[0059] Each of the multiple subpixels SP can include a thin-film transistor and an organic light-emitting element connected to the thin-film transistor. The subpixel can have an organic light-emitting layer (or light-emitting layer) positioned between a first electrode and a second electrode.

[0060] The organic light-emitting layer arranged in each of the plurality of subpixels SP can individually emit light of different colors or collectively emit white light. For example, if the organic light-emitting layer of each of the plurality of subpixels SP collectively emits white light, each of the red, green, and blue subpixels can have a color filter CF (or a wavelength conversion element CF) that converts the white light into light of another color. In this case, the white subpixel, for example, might not have a color filter. The color filter CF, for example, could have a red color filter, a green color filter, and a blue color filter.

[0061] In a display device 100 according to an embodiment of the present disclosure, an area provided with the red color filter can be a red subpixel SP1, an area provided with the green color filter can be a green subpixel SP3, an area provided with the blue color filter can be a blue subpixel SP4, and an area without a color filter can be a white subpixel SP2. In the present disclosure, the red subpixel SP1 can be represented as a first subpixel equipped to emit red light, the green subpixel SP3 can be represented as a third subpixel equipped to emit green light, the blue subpixel SP4 can be represented as a fourth subpixel equipped to emit blue light, and the white subpixel SP2 can be represented as a second subpixel equipped to emit white light.

[0062] Each subpixel SP, using the thin-film transistor, supplies a predetermined current to the organic light-emitting element according to a data voltage from the data wiring when a gate signal is input from the gate line. Therefore, the light-emitting layer of each subpixel can emit light with a predetermined brightness according to the predetermined current.

[0063] As in Fig. As shown in Figure 2, the display area DA can have a light-emitting area EA and a non-light-emitting area NEA. The light-emitting area EA is the area in which light is emitted by means of the organic light-emitting element layer E. The non-light-emitting area NEA is the area that does not transmit most of the light incident from the outside.

[0064] For example, the non-light-emission region (NEA) can be an area that excludes the light-emitting region (EA) where light is emitted. In one example, the non-light-emission region (NEA) can include a circuit area (CA). The circuit area (CA) can include a thin-film transistor (112) for driving the organic light-emitting element layer (E). Additionally, the non-light-emitting region (NEA) can contain a plurality of pixels (P) and a plurality of lines for driving each of the plurality of pixels (P). According to one example, the plurality of lines can include a plurality of first signal lines and a plurality of second signal lines.

[0065] The majority of first signal lines can extend in the second direction (X-axis direction). Each of the majority of first signal lines can have at least one gate line (or scan line). The gate line can be electrically connected to the gate driver GD, as shown in one example.

[0066] The majority of second signal lines can extend in the first direction (Y-axis direction). The majority of second signal lines can intersect the majority of first signal lines. Each of the majority of second signal lines can include a pixel power line, a majority of data lines, and a reference line. The majority of data lines can include a first data line for driving the first subpixel SP1, a second data line for driving the second subpixel SP2, a third data line for driving the third subpixel SP3, and a reference line. The majority of data lines can include a first data line for driving the first subpixel SP1, a second data line for driving the second subpixel SP2, a third data line for driving the third subpixel SP3, and a fourth data line for driving the fourth subpixel SP4.

[0067] Referring to Fig. 1. The non-display area (NDA) is an area where no image is displayed and can be a peripheral circuit area, a signal supply area, an inactive area, or a frame area. The non-display area (NDA) can be configured to be located near the display area (DA). That is, the non-display area (NDA) can be arranged to surround the display area (DA). For example, the non-display area (NDA) can have a first non-display area (NDA1), a second non-display area (NDA2), a third non-display area (NDA3), and a fourth non-display area (NDA4).

[0068] The display device 100 according to an embodiment of the present disclosure can have a pad section PA arranged in the non-display area NDA. The pad section PA can serve to drive the plurality of pixels P. For example, the pad section PA can supply current and / or signals to the plurality of pixels P arranged in the display area DA to output images. According to one example, the pad section PA can be located in the first non-display area NDA1 below the display area DA according to Fig. 1 be arranged. As in Fig. As shown in Figure 1, the first non-display area NDA1 can be adjacent to a first side DAL1 of the display area DA. The first side DAL1 of the display area DA can be a side that runs parallel to the second direction (X-axis direction) in the display area DA. The first undercut UC1, which has the undercut section UCP, can be formed in the first non-display area NDA1.

[0069] The gate driver GD supplies gate signals to the gate lines according to the gate control signal input from the timing control section 150. The gate driver GD can be implemented on one side of the display area DA of the display panel or on the non-display area NDA outside both sides of the display area DA in a gate driver using the panel GIP method, as shown in Fig. 1 shown.

[0070] The plurality of gate drivers GD can be arranged separately on a left side of the display area DA, i.e., the second non-display area, and on a right side of the display area DA, i.e., the third non-display area. For example, the plurality of gate drivers GD can be connected to the plurality of pixels P and the plurality of first signal lines to supply signals to the plurality of pixels P. The plurality of first signal lines can include at least one signal line for supplying a signal to drive pixel P.

[0071] The second non-display area, NDA2, can be connected to the first non-display area, NDA1. Additionally, the third non-display area, NDA3, can also be connected to the first non-display area, NDA1, and the fourth non-display area, NDA4, can be connected to the first non-display area, NDA1, via the second non-display area, NDA2, and the third non-display area, NDA3. Accordingly, the first through fourth non-display areas, NDA1, NDA2, NDA3, and NDA4, can be configured to surround the display area, DA.

[0072] As in Fig. As shown in Figure 1, the second non-display area NDA2 can be adjacent to a second side DAL2 of the display area DA. The second side DAL2 of the display area DA can be a side that runs parallel to the first direction (Y-axis direction) in the display area DA. The second undercut UC2, which has the undercut section UCP, can be formed in the second non-display area NDA2.

[0073] The third non-display area NDA3 can be provided spaced apart from the second non-display area NDA2, with the display area DA in between. The third undercut UC3, which includes the undercut section UCP, can be formed within the third non-display area NDA3.

[0074] The plurality of second signal lines can run in the first direction (Y-axis direction). The plurality of second signal lines can include a pixel power line and at least one data line to supply a data voltage to the pixel P. Each of the plurality of second signal lines can be connected to at least one of a plurality of pads, a pixel power shorting strip, and a common power shorting strip EVSB. The pixel power shorting strip and the common power shorting strip EVSB can be located in the fourth non-display area NDA4 opposite the pad section PA based on the display area DA. By way of example, the fourth non-display area NDA4 can be spaced from the first non-display area NDA1 with the display area DA in between. The fourth undercut UC4, which includes the undercut section UCP, can be formed in the fourth non-display area NDA4.

[0075] As in Fig. As shown in Figure 1, the first undercut UC1, the second undercut UC2, the third undercut UC3, and the fourth undercut UC4 can all be interconnected. Accordingly, the display device 100 according to an embodiment of the present disclosure can have improved reliability by reducing or preventing the ingress of moisture through the organic light-emitting layer 116 by arranging the first to fourth undercuts UC1, UC2, UC3, UC4 such that they surround the display area DA in the non-display area NDA.

[0076] The pixels P are arranged such that they overlap with at least one of the first or second signal lines and emit predetermined light to display an image. The light emission area EA can correspond to an area that emits light in which pixel P...

[0077] With reference to Fig. 2. The non-light-emission area (NEA) can refer to an area provided within the display area (DA) that does not emit light and can be described as a dead zone because it does not emit light. The dead zone, according to one example, can be an area where a black matrix and / or a bank is provided, but is not limited to this and can refer to any area where no light is emitted.

[0078] The following refers to the Fig. 2 and Fig. 3. The structure of each of the plurality of subpixels SP is described in detail.

[0079] The display device 100 according to an embodiment of the present disclosure can comprise a buffer layer BL, a plurality of inorganic films 111, a thin-film transistor 112, a color filter CF, a planarization layer 113, a pixel electrode 114, a bank 115, an organic light-emitting layer 116, a first cathode electrode 117, a second cathode electrode 117' (shown in Fig. 3) have an encapsulation layer 118 and a filling layer 119.

[0080] Each of the subpixels SP according to an embodiment can have the plurality of inorganic films 111 provided on an upper surface of the buffer layer BL, including a gate insulating layer 111a, an intermediate insulating layer 111b, a first passivation layer 111c and a second passivation layer 111d.

[0081] Furthermore, each of the subpixels SP can have a color filter CF, which is provided on the majority of inorganic films 111, and a planarization layer 113, which is provided on the color filter CF. The pixel electrode 114 can be arranged on the planarization layer 113.

[0082] Each of the subpixels SP can further comprise a bank 115 covering an edge of the pixel electrode 114, an organic light-emitting layer 116 on the pixel electrode 114 and the bank 115, and a first cathode electrode 117 on the organic light-emitting layer 116. The encapsulation layer 118 can be arranged on the first cathode electrode 117, and the filler layer 119 can be arranged on the encapsulation layer 118.

[0083] The majority of inorganic films 111 can be provided between the substrate 110 and the organic light-emitting layer 116. The thin-film transistor 112 for driving the subpixel SP can be arranged on the majority of inorganic films 111. The majority of inorganic films 111 can also be referred to as a circuit element layer.

[0084] The buffer layer BL can be included in the majority of inorganic films 111 together with the gate insulating layer 111a, the intermediate insulating layer 111b, the first passivation layer 111c and the second passivation layer 111d. The pixel electrode 114, the organic light-emitting layer 116 and the cathode electrode 117 can be included in a light-emitting element layer E.

[0085] The buffer layer BL can be formed between the substrate 110 and the gate insulating layer 111a to protect the thin-film transistor 112. The buffer layer BL can be arranged over the entire surface (or front side) of the substrate 110. The buffer layer BL can serve to block the diffusion of a material contained in the substrate 110 into a transistor layer during a high-temperature process of the manufacturing process of the thin-film transistor 112.

[0086] The thin-film transistor 112 (or a drive transistor) according to an example can have an active layer 112a, a gate electrode 112b, a source electrode 112c and a drain electrode 112d.

[0087] The active layer 112a can have a channel region, a drain region, and a source region formed within a thin-film transistor region of a circuit region CA of the subpixel SP. The drain region and the source region can be spaced apart from each other with the channel region in between.

[0088] The active layer 112a can be formed from a semiconductor material based on any of amorphous silicon, polycrystalline silicon, oxide and organic material.

[0089] The gate insulating layer 111a can be formed on the channel region of the active layer 112a. For example, the gate insulating layer 111a can be formed in an island shape only on the channel region of the active layer 112a, or it can be formed on the entire front surface of the substrate 110 or the buffer layer BL, including the active layer 112a.

[0090] The gate electrode 112b can be formed on the gate insulating layer 111a to overlap with the channel area of ​​the active layer 112a.

[0091] The interlayer insulating layer 111b can be configured to partially overlap the gate electrode 112b and the drain and source regions of the active layer 112a. The interlayer insulating layer 111b can extend over the entire light-emitting region, as shown in Fig. 3, formed in the circuit area CA and in the subpixel SP.

[0092] The source electrode 112c can be electrically connected to the source region of the active layer 112a through a source contact hole provided in the interlayer insulating layer which overlaps with the source region of the active layer 112a.

[0093] The drain electrode 112d can be electrically connected to the drain area of ​​the active layer 112a through a drain contact hole provided in the interlayer insulating layer that overlaps with the drain area of ​​the active layer 112a.

[0094] The drain electrode 112d and the source electrode 112c can be made of the same or substantially the same metal material. For example, the drain electrode 112d and the source electrode 112c can each be made of a single metal layer, a single layer of an alloy, or a multiple layer of two or more layers, the material of which is the same as or different from that of the gate electrode 112b.

[0095] Additionally, the thin-film transistor provided in the pixel area may have a property in which the threshold voltage is shifted by light. To reduce or prevent this, the display panel or substrate 110 may further include a light-shielding layer (not shown) provided beneath the active layer 112a of at least one thin-film transistor 112, a first switching thin-film transistor, and a second switching thin-film transistor. The light-shielding layer is provided between the substrate 110 and the active layer 112a to block light passing through the substrate 110 onto the active layer 112a, thereby reducing or minimizing changes in the transistor's threshold voltage caused by external light.In addition, the light-shielding layer can be provided between the substrate 110 and the active layer 112a to reduce or prevent the thin-film transistor from being visible to the user.

[0096] The first passivation layer 111c can be provided on the substrate 110 to cover the pixel area. The first passivation layer 111c covers a drain electrode 112d, a source electrode 112c, and a gate electrode 112b of the thin-film transistor 112, as well as the buffer layer BL.

[0097] The second passivation layer 111d can be provided on the substrate 110 to cover the first passivation layer 111c. The second passivation layer 111d can be partially positioned between the first passivation layer 111c and the color filter CF.

[0098] The color filter CF can be located on the second passivation layer 111d. For example, the color filter CF can be located between the majority of inorganic films 111 and the planarization layer 113. The color filter CF can include a red color filter located in the red subpixel SP1, a green color filter located in the green subpixel SP3, and a blue color filter located in the blue subpixel SP4. Since the white subpixel SP2 is provided to emit white light, it cannot, for example, contain the color filter.

[0099] The planarization layer 113 can be provided on the substrate 110 to cover the second passivation layer 111d and the color filter CF. For example, the planarization layer 113 can be located between the majority of inorganic films 111 and the organic light-emitting layer 116. The planarization layer 113 can be formed across the entire circuit area CA, where the thin-film transistor 112 is located, and across the entire light-emitting area EA. Furthermore, the planarization layer 113 can be formed across the other non-display area NDA, with the exception of a pad section PA of the non-display area NDA, and across the entire display area DA. For example, the planarization layer 113 can have an extension section (or an enlarged section) that extends from the display area DA to the other non-display area NDA, with the exception of the pad section PA.Therefore, the planarization layer 113 can have a size that is relatively larger than that of the display area DA.

[0100] The planarization layer 113, according to one example, can be designed to have a relatively thick surface, thus providing a flat area on the display area DA and the non-display area NDA. For example, the planarization layer 113 can be made of an organic material such as photoacrylic, benzocyclobutene, polyimide, and fluoropolymer.

[0101] Meanwhile, the upper surface of the planarization layer 113 can be flat. Accordingly, the pixel electrode 114 on the planarization layer 113 can also be flat, and the organic light-emitting layer 116 and first cathode electrode 117 formed thereon can likewise be flat. Since the pixel electrode 114, the organic light-emitting layer 116, and the first cathode electrode 117—that is, the organic light-emitting element layer E—are flat within the light-emitting region EA, the thicknesses of the pixel electrode 114, the organic light-emitting layer 116, and the first cathode electrode 117 within the light-emitting region EA can be uniform. Consequently, the organic light-emitting layer 116 can emit light uniformly within the light-emitting region EA without deviations.

[0102] The pixel electrode 114 can be formed on the planarization layer 113. The pixel electrode 114 can be connected to the drain electrode or the source electrode of the thin-film transistor via a contact hole that penetrates the planarization layer 113, the second passivation layer 111d, and the first passivation layer 111c. Edge sections on both sides of the pixel electrode 114 can be covered by the bank 115. The pixel electrode 114 can be made of at least one transparent or semi-transparent metal material.

[0103] Since the display device 100 is configured as a ground emission type according to an embodiment of the present disclosure, the pixel electrode 114 can be made of a transparent conductive material (or TCO), such as indium tin oxide (ITO) or indium zinc oxide (IZO), which can transmit light, or of a semi-transparent conductive material, such as magnesium (Mg), silver (Ag) or an alloy of Mg and Ag.

[0104] The material forming pixel electrode 114 may contain MoTi. Pixel electrode 114 may be a first electrode or an anode electrode.

[0105] Bank 115 can be a non-light-emitting region and can be located adjacent to the light-emitting region EA of each of the plurality of subpixels SP. For example, bank 115 can be located within the non-light-emitting region NEA. Bank 115 can be configured to cover a section containing the edge of the pixel electrode 114. Accordingly, bank 115 can obstruct the pixel electrode 114 and the cathode electrode 117 at the edge of the pixel electrode 114. The exposed portion of the pixel electrode 114 not covered by bank 115 can be contained within the light-emitting section (or light-emitting region EA).

[0106] Once the bank 115 is formed, an organic light-emitting layer 116 can be formed to cover the pixel electrode 114 and the bank 115. Thus, the bank 115 can be partially positioned between the pixel electrode 114 and the organic light-emitting layer 116. The bank 115 can be expressed in terms of pixel definition films. The bank 115 can, for example, consist of organic and / or inorganic material.

[0107] The organic light-emitting layer 116 can be formed on the pixel electrode 114 and the bank 115. The organic light-emitting layer 116 can be located beneath the first cathode electrode 117. For example, the organic light-emitting layer 116 can be located in the light-emitting region EA and in the non-light-emitting region NEA. The organic light-emitting layer 116 can be positioned between the pixel electrode 114 and the first cathode electrode 117. Therefore, when a voltage is applied to the pixel electrode 114 and the first cathode electrode 117, an electric field is generated between them. Consequently, the organic light-emitting layer 116 can emit light. The organic light-emitting layer 116 can be formed from a plurality of subpixels SP and a common layer located on the bank 115.

[0108] The organic light-emitting layer 116 according to one embodiment can be configured to emit white light. The organic light-emitting layer 116 can have a plurality of stacks that emit light of different colors. For example, the organic light-emitting layer 116 can have a first stack, a second stack, and a charge-generating layer (CGL) provided between the first and second stacks. The light-emitting layer can be configured to emit white light, and thus each of the plurality of subpixels SP can have a color filter CF suitable for a corresponding color.

[0109] The first stack can be provided on the pixel electrode 114 and implemented in a structure in which a hole injection layer (HIL), a hole transport layer (HTL), an emission layer (EML(B)) and an electron transport layer (ETL) are stacked sequentially.

[0110] The charge-generating layer can supply an electric charge to the first stack and the second stack. The charge-generating layer can have an N-type charge-generating layer for supplying an electron to the first stack and a P-type charge-generating layer for supplying a hole to the second stack. The N-type charge-generating layer can contain a metallic material as a dopant.

[0111] The second stack can be provided on top of the first stack and implemented in a structure in which a hole transport layer (HTL), a yellow-green (YG) emission layer (EML(YG)) and an electron injection layer (EIL) are stacked sequentially.

[0112] In the display device 100 according to one embodiment of the present disclosure, the first stack, the charge generation layer, and the second stack can be arranged across the plurality of subpixels SP, since the organic light-emitting layer 116 is provided as a common layer. According to another example, the organic light-emitting layer 116 can be provided in a three-layer or four-layer structure, depending on the number of stacked stacks.

[0113] However, since in the display device 100 according to an embodiment of the present disclosure the organic light-emitting layer 116 is interrupted by the undercut section UCP around the display area DA, the ingress of moisture can be reduced or prevented, even if the organic light-emitting layer 116 is arranged to extend from the display area DA to the end of the substrate 110.

[0114] The first cathode electrode 117 can be formed on the organic light-emitting layer 116. The first cathode electrode 117 can overlap (or be located in) the non-display area NDA (or a portion thereof) and the display area DA. Within the display area DA, the first cathode electrode 117 can be located in the light-emitting area EA and in the non-light-emitting area NEA. That is, the first cathode electrode 117 can be provided such that it covers the entire display area DA. Consequently, the first cathode electrode 117 can be provided such that it is larger than the display area DA and smaller than the substrate 110, allowing it to be located in both the non-display area NDA (or a portion thereof) and the display area DA. The first cathode electrode 117 can be formed in front of the second cathode electrode 117'.

[0115] As described above, the first cathode electrode 117 can be located in the non-display area NDA (or the part of the non-display area NDA) and in the entire display area DA. Therefore, in the display device 100 according to one embodiment of the present disclosure, foreign substances that may occur during a process for forming the second cathode electrode 117' can be reduced or prevented from adhering to the organic light-emitting layer 116 of the display area DA, thus reducing the error rate of the display device.That is, in the display device 100 according to an embodiment of the present disclosure, the first cathode electrode 117 is formed in front of the second cathode electrode 117' in order to cover the entire non-display area NDA (or the part of the non-display area NDA) and the display area DA, so that the influence of foreign substance deposits on the display area DA, which may occur during the movement process to form the second cathode electrode 117', can be reduced.

[0116] The first cathode electrode 117 can, according to one example, comprise a metallic material. The first cathode electrode 117 can reflect light emitted from the organic light-emitting layer 116 into the plurality of subpixels SP to the lower surface of the substrate 110. Therefore, the display device 100 can, according to one embodiment of the present disclosure, be implemented as a bottom-emission display device.

[0117] The display device 100 according to one embodiment of the present disclosure is of a ground-emission type and must reflect light emitted by the light-emitting layer 116 towards the substrate 110. Therefore, the first cathode electrode 117 can be made of a metallic material with high reflectivity. According to one example, the first cathode electrode 117 can be formed from an opaque metallic material. The opaque metallic material can, for example, be a metallic material with high reflectivity, such as silver (Ag), aluminum (Al), a stacked structure (Ti / Al / Ti) of aluminum and titanium, a stacked structure (ITO / Al / ITO) of aluminum and ITO, an Ag alloy, and a stacked structure (ITO / Ag alloy / ITO) of Ag alloy and ITO. The Ag alloy can be an alloy such as silver (Ag), palladium (Pd), and copper (Cu).The first cathode electrode 117 can be referred to as a second electrode, a counter electrode and a reflecting electrode.

[0118] The second cathode electrode 117' can be arranged on the first cathode electrode 117. The second cathode electrode 117' can be formed later than the first cathode electrode 117 and can therefore be arranged on the first cathode electrode 117. Accordingly, the second cathode electrode 117' can also be formed on the organic light-emitting layer 116. With reference to Fig. 3. The second cathode electrode 117' can overlap (or be positioned) in the first non-display area NDA1. For example, as shown in Fig. As shown in Figure 3, the second cathode electrode 117' can be arranged such that it extends (or extends) from one end 110a of the substrate 110 in the first non-display area NDA1 to an area between the display area DA and the common current short-circuit strip EVSB. Accordingly, as shown in Fig. As shown in Figure 3, the second cathode electrode 117' partially overlaps the first cathode electrode 117. For example, the second cathode electrode 117' can partially contact an upper surface of the first cathode electrode 117. Accordingly, the second cathode electrode 117' can be electrically connected to the first cathode electrode 117 and thus receive an equal or substantially equal common current from the pad section PA.

[0119] The second cathode electrode 117' can be formed from at least one opaque metal material, one transparent metal material, and one semi-transparent metal material. For example, the second cathode electrode 117' can be formed from an opaque metal material such as silver (Ag), aluminum (Al), a laminated structure of aluminum and titanium (Ti / Al / Ti), a laminated structure of aluminum and ITO (ITO / Al / ITO), an Ag alloy, or a laminated structure of Ag alloy and ITO (ITO / Ag alloy / ITO). Since the second cathode electrode 117' has low resistance in this case, a common current drop can be reduced or prevented. As another example, the second cathode electrode 117' can be formed from a transparent metal material such as ITO or IZO, or from a semi-transparent metal material.As described above, since the second cathode electrode 117' is located in the first non-display area NDA1, it cannot, for example, be configured to reflect light emitted by the organic light-emitting layer 116 towards the substrate 110. Accordingly, the display device 100, according to one embodiment of the present disclosure, can have the second cathode electrode 117' formed from at least one opaque metal material, one transparent metal material, and one semi-transparent metal material.

[0120] In the display device 100 according to one embodiment of the present disclosure, the substrate 110 can have a first region A1, a second region A2, and a third region A3. The first region A1 can be a region in which the first cathode electrode 117 is arranged. The second region A2 can be a region in which the second cathode electrode 117' is arranged. The third region A3 can be a region in which the first cathode electrode 117 and the second cathode electrode 117' overlap. For example, the first region A1 can be a region in which the first cathode electrode 117 is arranged in a first direction (Y-axis direction). The second region A2 can be a region in which the second cathode electrode 117' is arranged in the first direction (Y-axis direction).The third region A3 can be a region where the first cathode electrode 117 and the second cathode electrode 117' overlap in the first direction (Y-axis direction). As in . Fig. As shown in Figure 3, the first region A1, the second region A2, and the third region A3 can be arranged in a row in the first direction (Y-axis direction), and the third region A3 can be arranged between the first region A1 and the second region A2 in the first direction (Y-axis direction). The combined length of the first region A1 and the second region A2 in the first direction (Y-axis direction) can be equal to or similar to the length of the substrate 110 in the first direction (Y-axis direction).

[0121] Referring to Fig. 2. The encapsulation layer 118 is formed on the first cathode electrode 117 and / or the second cathode electrode 117'. The encapsulation layer 118 serves to reduce or prevent the penetration of oxygen or moisture into the organic light-emitting layer 116, the first cathode electrode 117, and the second cathode electrode 117'. The encapsulation layer 118 can be provided with a plurality of layers, each comprising at least one inorganic layer and at least one organic layer.

[0122] Meanwhile, as in Fig. As shown in Figure 2, the encapsulation layer 118 can be located not only in the light emission region EA, but also in the non-light emission region NEA. Fig. 2. The encapsulation layer 118 can be arranged between the first cathode electrode 117 and the opposite substrate 200. However, in the first non-display region NDA1, where the second cathode electrode 117' is located, the encapsulation layer 118 can be arranged between the second cathode electrode 117' and the opposite substrate 200.

[0123] The filler layer 119 is positioned between the organic light-emitting layer 116 formed on the substrate 110 and the opposing substrate 200, thereby reducing or preventing external moisture and / or oxygen penetrating through the opposing substrate 200 from reaching the organic light-emitting layer 116. In other words, the filler layer 119 can act as a barrier, reducing or preventing moisture penetration. Furthermore, the filler layer 119 can contain an absorbent material to absorb moisture or oxygen, thereby enhancing the moisture reduction or prevention effect. The absorbent material could, for example, be a getter.

[0124] Simultaneously, the filler layer 119 can contain at least one pressure-sensitive transparent adhesive and one thermosetting transparent adhesive. In this case, the filler layer 119 can be used to bond the substrate 110 and the opposing substrate 200. Therefore, the bond strength between the substrate 110 and the opposing substrate 200 can be further improved by the filler layer 119.

[0125] With reference to Fig. 3. In the display device 100 according to one embodiment of the present disclosure, the common current short-circuit strip EVSB can be provided in a strip-like or square shape. For example, the common current short-circuit strip EVSB can be arranged in the second region A2, which does not overlap with the third region A3. The common current short-circuit strip EVSB can be provided such that it extends along the first side DAL1 of the display region DA in the second region A2. In one example, the length of the common current short-circuit strip EVSB in the second direction (X-axis direction) can be equal to or similar to the length of the display region DA in the second direction (X-axis direction).

[0126] In the case of a general display device, a common current shorting strip is provided in a triangular (or octopus) shape. Since, in the general display device, the organic light-emitting layer is not located at one end of the substrate, the entire common current shorting strip can be used as a contact section for applying common current to the cathode electrode. Because the common current shorting strip in the general display device is provided in a triangular (or octopus) shape, a large contact area can be provided between the common current shorting strip and the cathode electrode.

[0127] In contrast, according to one embodiment of the present disclosure, the indicator device 100 can be arranged such that the organic light-emitting layer 116 extends from the indicator area DA to the end of the substrate 110 in the non-indicator area NDA. That is, the organic light-emitting layer 116 can be provided over the entire indicator area DA and the non-indicator area NDA. According to one embodiment of the present disclosure, the indicator device 100 can contact the common current shorting strip EVSB and the cathode electrode (or the second cathode electrode 117') by means of a plurality of undercuts (or a plurality of common current contact undercuts ECUC).Accordingly, if the common current shorting strip is provided in a triangular shape (or an octopus shape), the contact area can become small, so that the common current supply may not be smooth and heat may be generated in the contact area, which can reduce reliability.

[0128] Since the indicator device 100, according to an embodiment of the present disclosure, has the common current short-circuit strip EVSB in a strip-like or square shape, the contact area between the common current short-circuit strip EVSB and the cathode electrode (or the second cathode electrode 117') can be increased compared to a case in which the common current short-circuit strip is provided in a triangular (or octopus) shape, so that the common current can be applied smoothly and heat generation in a contact area where the common current short-circuit strip EVSB and the cathode electrode (or the second cathode electrode 117') come into contact can also be reduced, thereby improving reliability.

[0129] Fig. Figure 4 is a schematic cross-sectional view along the in Fig. 3 shown line II-II'.

[0130] With reference to Fig. 4. In the display device 100, according to one embodiment of the present disclosure, the second undercut UC2 can be formed by removing a section of the plurality of inorganic films 111 and a section of the planarization layer 113. According to one example, the second undercut UC2 can be formed by partially removing each of the buffer layer BL, the intermediate insulating layer 111b, the first passivation layer 111c, the second passivation layer 111d, and the planarization layer 113. Accordingly, the plurality of inorganic films 111, as in Fig. Figure 4 shows an island inorganic film 111' that is interrupted (or separated) by a plurality of second undercuts UC2. The planarization layer 113 can also have an island planarization layer 113' arranged on top of the island inorganic film 111'.

[0131] Meanwhile, the majority of second undercuts UC2 can be provided on both sides of each of the island inorganic films 111' and the island planarization layer 113'. For example, as in Fig. As shown in Figure 4, two second undercuts UC2 are provided on both sides of each of the island inorganic films 111' and the island planarization layer 113'. Each of the two second undercuts UC2 provided on both sides of the island inorganic layer 111' and the island planarization layer 113' can be formed by the same or substantially the same etching (or structuring) process. Therefore, according to one embodiment of the present disclosure, the display device 100 can have a structural feature in which the plurality of second undercuts UC2 (or two second undercuts UC2) are provided in a symmetrical shape with respect to the island inorganic film 111' and the island planarization layer 113'.As a result, it can also exhibit a structural feature in which a center of the island inorganic film 111' and a center of the island planarization layer 113' are arranged in a column in the third direction (Z-axis direction). As in . Fig. As shown in Figure 4, since two second undercuts UC2 are provided on both sides of each of the island inorganic film 111' and the island planarization layer 113', it can be expressed as double-sided symmetric undercuts or double-sided symmetric undercuts.

[0132] Furthermore, as in Fig. 4 shown, since the display device 100 according to one embodiment of the present disclosure does not require a mask (or EL mask), the organic light-emitting layer 116 can be arranged such that it extends to the end 110b of the substrate 110 in the second non-display area NDA2. According to one embodiment of the present disclosure, the display device 100 can reduce or prevent the penetration of moisture through the organic light-emitting layer 116 by allowing the organic light-emitting layer 116 to be separated by the second undercut UC2, even if the organic light-emitting layer 116 extends to an end 110b of the substrate 110 in the second non-display area NDA2. Furthermore, as shown in Fig. As shown in Figure 4, in the display device 100 according to an embodiment of the present disclosure, the planarization layer 113 made of an organic material is also separated by the second undercut UC2, so that the reduction or prevention of the ingress of moisture can be improved or maximized.

[0133] Since in the display device 100 according to an embodiment of the present disclosure both a separate organic light-emitting layer 116 and a separate planarization layer 113 are covered by the first cathode electrode 117 and the encapsulation layer 118, the reduction or prevention of the penetration of moisture through the organic light-emitting layer 116 and the planarization layer 113 can be further improved or maximized.

[0134] As in Fig. As shown in Figure 4, the display device 100 according to an embodiment of the present disclosure can have a structural feature in which the organic light-emitting layer 116 and the planarization layer 113 are separated by the second undercut UC2, so that the first cathode electrode 117 formed in a subsequent process comes into contact with an upper surface 110' of the substrate 110 in the second undercut UC2.

[0135] Fig. 5 is a schematic cross-sectional view along the in Fig. 3 shown line III-III'.

[0136] With reference to Fig. 5. The organic light-emitting layer 116 can be arranged such that it extends to the end 110a of the substrate 110 in the first non-display area NDA1, since the display device 100, according to one embodiment of the present disclosure, does not require a mask (or EL mask). As in Fig. As shown in Figure 5, in the display device 100 according to one embodiment of the present disclosure, the organic light-emitting layer 116 can be interrupted by the first undercut UC1, even if the organic light-emitting layer 116 extends to the end 110a of the substrate 110 in the first non-display area NDA1. Accordingly, in the display device 100 according to one embodiment of the present disclosure, since the organic light-emitting layer 116 extending to the first non-display area NDA1 can be separated by the first undercut UC1 in the second area A2, the penetration of moisture through the organic light-emitting layer 116 can be reduced or prevented.

[0137] According to one example, the first undercut UC1 can be formed by removing a section of the majority of inorganic films 111 and a section of the planarization layer 113 in the second region A2. For example, the first undercut UC1 can be formed by removing a section of the second passivation layer 111d from the majority of inorganic films 111 and a section of the planarization layer 113. Accordingly, the organic light-emitting layer 116, which extends to the first non-display region NDA1, can be separated by the first undercut UC1.

[0138] Meanwhile, since the first non-display area NDA1 with a pad section PA (or a tab binding area TBP (shown in Fig. 3)) provided, to which a pool is bound, the planarization layer 113 at an outer edge of the first non-display area NDA1 (or an area where the pad section PA is provided) can be removed by an etching (or structural) process. Accordingly, as in Fig. As shown in Figure 5, the planarization layer 113 on the left side with respect to the first undercut UC1, for example, may not be provided and may, for example, only be provided on the right side. Therefore, according to one embodiment of the present disclosure, the display device 100 may have a structural feature in which both sides are provided asymmetrically with respect to the first undercut UC1.

[0139] Consequently, in the display device 100 according to one embodiment of the present disclosure, the second undercut UC2 is provided symmetrically with respect to the island inorganic layer 111' and the island planarization layer 113', and a left structure and a right structure are provided asymmetrically with respect to the first undercut UC1, so that the second undercut UC2 and the first undercut UC1 can be provided with different structures. That is, in the display device 100 according to one embodiment of the present disclosure, the second undercut UC2 can be provided such that it has a different shape than the first undercut UC1.

[0140] However, since the pad section PA is not provided in either the third non-display area NDA3 or the fourth non-display area NDA4, the third undercut UC3 can be provided in the third non-display area NDA3 and the fourth undercut UC4 in the fourth non-display area NDA4 to have the same or substantially the same shape as the second undercut UC2. Accordingly, the third undercut UC3 and the fourth undercut UC4 can be provided symmetrically with respect to the island inorganic film 111' and the island planarization layer 113', respectively, like the second undercut UC2. Therefore, the organic light-emitting layer 116, which extends to one end 110c of the substrate 110 in the third non-display area NDA3, can be separated by the third undercut UC3.And the organic light-emitting layer 116, which extends to one end 110d of the substrate 110 in the fourth non-display area NDA4, can be separated by the fourth undercut UC4.

[0141] Consequently, in the display device 100 according to one embodiment of the present disclosure, the first undercut UC1, the second undercut UC2, the third undercut UC3, and the fourth undercut UC4 are arranged to surround the display area DA, such that even if the organic light-emitting layer 116 is arranged to extend from the display area DA to the end of the substrate 110, the penetration (or infiltration) of moisture and oxygen through the organic light-emitting layer 116 can be reduced or prevented by the first undercut UC1, the second undercut UC2, the third undercut UC3, and the fourth undercut UC4. Therefore, the display device 100 according to one embodiment of the present disclosure can have improved reliability, thereby extending its service life.

[0142] With reference to Fig. 5. The common current short-circuit strip EVSB, located in the second region A2, can be electrically connected to an LS layer LS and a connecting electrode CE, which are stacked sequentially on the upper surface of the substrate 110. The LS layer LS is connected to the pad section PA and can apply the common current from the pad section PA to the connecting electrode CE. The connecting electrode CE can apply the common current from the LS layer LS to the common current short-circuit strip EVSB. Therefore, the common current short-circuit strip EVSB can receive common current from the pad section PA.

[0143] With reference to Fig. In the display device 100, according to one embodiment of the present disclosure, the second cathode electrode 117' can partially contact an upper surface of the first cathode electrode 117 in the third region A3. Accordingly, the second cathode electrode 117' can be electrically connected to the first cathode electrode 117.

[0144] Meanwhile, the first undercut UC1 can be formed by removing a section of the second passivation layer 111d. In contrast, the second undercut UC2 can be formed by partially removing each of the buffer layer BL, the intermediate insulating layer 111b, the first passivation layer 111c, the second passivation layer 111d, and the planarization layer 113. Accordingly, the depth D1 of the first undercut UC1 can be smaller than the depth D2 of the second undercut UC2. As in Fig. As shown in Figure 5, in the first undercut UC1, the second cathode electrode 117' can be in contact with a stopper metal SM. The stopper metal SM can be an etch-protective layer to prevent the first passivation layer 111c from being etched. As an example, the stopper metal SM can be provided on the same or substantially the same layer as the common current shorting strip EVSB and can be made of the same or substantially the same material.

[0145] Fig. 6 is a schematic cross-sectional view along the in Fig. 3 shown line IV-IV'.

[0146] With reference to Fig. 6. According to one embodiment of the present disclosure, the display device 100 may further comprise a plurality of common current contact undercuts ECUC. Each of the plurality of common current contact undercuts ECUC serves to separate the organic light-emitting layer 116, so that the common current short-circuit strip EVSB and the cathode electrode (or the second cathode electrode 117') are connected.

[0147] Since the display device 100, according to one embodiment of the present disclosure, does not require a mask (or EL mask), the organic light-emitting layer 116 can be arranged to extend to the end 110a of the substrate 110 in the first non-display area NDA1. Accordingly, the organic light-emitting layer 116 arranged on the common current short-circuit strip EVSB is typically separated so that the cathode electrode (or the second cathode electrode 117') receives common current from the common current short-circuit strip EVSB.

[0148] In the display device 100 according to an embodiment of the present disclosure, each of the plurality of common current contact undercuts ECUC can separate an organic light-emitting layer 116 arranged on a common current short-circuit strip EVSB. For example, each of the plurality of common current contact undercuts ECUC can be formed by partially removing the second passivation layer 111d provided on the common current short-circuit strip EVSB (or the second area A2) and the planarization layer 113 provided on the second passivation layer 111d.

[0149] In the second region A2, after the formation of the majority of common current contact undercuts ECUC, the organic light-emitting layer 116, the second cathode electrode 117', and the encapsulation layer 118' can be formed successively. Accordingly, as shown in Fig. As shown in Figure 6, the organic light-emitting layer 116 on the common current short-circuit strip EVSB is separated by each of the plurality of common current contact undercuts ECUC. The second cathode electrode 117' can be in contact with the common current short-circuit strip EVSB at each of the plurality of common current contact undercuts ECUC. Therefore, according to one embodiment of the present disclosure, the indicator device 100 can smoothly receive common current from the common current short-circuit strip EVSB by having the second cathode electrode 117' contact the common current short-circuit strip EVSB at each of the plurality of common current contact undercuts ECUC, thereby increasing the contact area.As described above, the common power supply applied to the second cathode electrode 117' can be applied to the first cathode electrode 117, since the second cathode electrode 117' is electrically connected to the first cathode electrode 117 in the third region A3.

[0150] Since each of the plurality of common current contact undercuts ECUC is formed by partial removal of the second passivation layer 111d and the planarization layer 113, a depth D1 (or a first depth D1) of each of the common current contact undercuts ECUC can be equal to or substantially equal to the depth D1 (or the first depth D1) of the first undercut UC1 formed in Fig. 5 is shown.

[0151] Since the depth D1 (or first depth D1) of the first undercut UC1 is smaller than the depth D2 (or second depth D2) of the second undercut UC2, the depth D1 (or first depth D1) of each of the common current contact undercuts ECUC can also be smaller than the depth D2 (or second depth D2) of the second undercut UC2. Since the depth D1 (or first depth D1) of each of the common current contact undercuts ECUC is smaller than the depth D2 (or second depth D2) of the second undercut UC2, it can be difficult for the second cathode electrode 117' to contact the common current shorting strip EVSB in each of the common current contact undercuts ECUC.Therefore, in the display device 100 according to an embodiment of the present disclosure, the first cathode electrode 117, which is provided in the second undercut UC2, can be formed by a chemical vapor deposition process, and the second cathode electrode 117', which is provided in the common current contact undercut ECUC (or the first undercut UC1), can be formed by a sputtering process.

[0152] The chemical vapor deposition (CVD) process, as described in one example, is a method of depositing a material forming the second cathode electrode 117' onto the substrate 110 by means of a chemical reaction such as thermal decomposition, photochemical decomposition, or a redox reaction. In contrast, the sputtering process is a method in which a gas, such as ionized argon, is accelerated in a low vacuum and collided with the material forming the second cathode electrode 117' to form a film on the substrate 110. Therefore, the sputtering process may be better suited for shallow (or low-level) undercuts than the chemical vapor deposition process.

[0153] Therefore, according to an embodiment of the present disclosure, the display device 100 can have a process feature in which a first cathode electrode 117, provided in a second undercut UC2 having the second depth D2, is formed by the chemical vapor deposition process, and a second cathode electrode 117', provided in the common current contact undercut ECUC (or the first undercut UC1), having the first depth D1, is formed by the sputtering process.

[0154] Due to the process properties described above, if a foreign substance is present on the display area DA (or above the pixel electrode 114), a material (e.g., Al) forming the first cathode electrode 117 cannot penetrate deeply beneath it during the chemical vapor deposition process. This reduces or prevents a short circuit between the pixel electrode 114 and the first cathode electrode 117. In contrast, a material (e.g., IZO) forming the second cathode electrode 117' can penetrate deeply into the common current contact undercut ECUC during the sputtering process. This reduces or prevents cathode contact failure in the common current short circuit strip EVSB.

[0155] Since the cathode electrode (or first cathode electrode 117) provided in the display area DA is formed in the display device 100 according to an embodiment of the present disclosure by a chemical vapor deposition process, dark spot defects in the display area DA can be improved or prevented.

[0156] Furthermore, since the cathode electrode (or the second cathode electrode 117') on the common current short-circuit strip EVSB of the display device 100 is formed by the sputtering process according to an embodiment of the present disclosure, a failure of the cathode contact in the common current short-circuit strip EVSB can be reduced or prevented.

[0157] As in Fig. As shown in Figure 6, the second cathode electrode 117', which contacts the common current short-circuit strip EVSB in the common current contact undercut ECUC, has the task of supplying the display area DA with common current and can therefore be referred to as a common current cathode electrode.

[0158] With reference to Fig. 6. In the display device 100 according to an embodiment of the present disclosure, each of the plurality of common current contact undercuts ECUC can be provided only on one side of the second passivation layer 111d. For example, each of the plurality of common current contact undercuts ECUC can be provided only on a right-hand side of the second passivation layer 111d based on Fig. 6 will be provided.

[0159] If the common current contact undercut ECUC is provided as a double-sided undercut like the second undercut UC2, the distance between the planarization layers 113 becomes short, making it difficult for a material forming the second cathode electrode 117' to penetrate the common current contact undercut ECUC.

[0160] Therefore, according to one embodiment of the present disclosure, the display device 100 can ensure sufficient spacing between the planarization layers 113 by providing each of the plurality of common current contact undercuts ECUC only on one side of the second passivation layer 111d, thereby allowing a material forming the second cathode electrode 117' to penetrate deeply into the common current contact undercut ECUC. Therefore, according to one embodiment of the present disclosure, a contact fault between the second cathode electrode 117' and the common current short-circuit strip EVSB in the plurality of common current contact undercuts ECUC can be reduced or prevented in the display device 100.

[0161] As in Fig. As shown in Figure 6, the common current contact undercut ECUC is provided only on one underside of a side of the planarization layer 113 and can therefore be referred to as a one-sided undercut or as a one-sided common current undercut.

[0162] Fig. 7 is a schematic cross-sectional view along the in Fig. Line V-V' shown in section 3. In particular, Fig. 7 a drawing showing a schematic cross-sectional view along the in Fig. 3 line VV' shown, and is a drawing that schematically shows a fastening process of a tab binding section TBP and a plurality of tabs 130a.

[0163] With reference to Fig. 7. According to an embodiment of the present disclosure, the display device 100 may further comprise a plurality of tab binding sections TBP.

[0164] The majority of tab binding sections TBP are provided for attaching a majority of tabs 130a, which are provided on the flexible film 130. For example, a majority of tab binding sections TBP may be provided in the first non-display area NDA1. As shown in Fig. As shown in Figure 3, each of the plurality of tab-binding sections TBP can have a plurality of pad-section contact undercuts PCUC in which the organic light-emitting layer 116 is interrupted.

[0165] Each of the multiple pad section contact undercuts PCUC can be connected to the first undercut UC1. For example, in Fig. As shown in Figure 3, the plurality of pad-section contact undercuts PCUC can be connected to the first undercut UC1, which is arranged to extend in the second direction (X-axis direction). Each of the plurality of pad-section contact undercuts PCUC can be arranged to extend in the first direction (Y-axis direction). Accordingly, the organic light-emitting layer 116 in the first non-display area NDA1 can be separated by the first undercut UC1, which is arranged to extend in the second direction (X-axis direction). And the organic light-emitting layer 116 in the plurality of tab-binding sections TBP can be separated by the plurality of pad-section contact undercuts PCUC, which are arranged to extend in the first direction (Y-axis direction).Therefore, in the display device 100 according to an embodiment of the present disclosure, the first non-display area NDA1, which may be relatively susceptible to moisture ingress due to the pad section PA, can be more effectively protected from or prevented from moisture ingress due to a connection structure of the first undercut UC1 and the plurality of pad section contact undercuts PCUC.

[0166] With reference to Fig. 7. Each of the plurality of tab-bonding sections TBP, according to an example, can have a gate insulating layer 111a, a pad electrode PE, a first passivation layer 111c, and an undercut metal UM. The gate insulating layer 111a can be provided on the substrate 110. The pad electrode PE can be provided on the gate insulating layer 111a. According to an example, the pad electrode PE can be on the same or substantially the same layer as the connecting electrode CE. Fig. 5 be provided and can be made with the same or substantially the same material as the CE connecting electrode of Fig. 5. The first passivation layer 111c can be provided on the pad electrode PE. For example, a first passivation layer 111c can be provided such that it partially contacts two spaced-apart pad electrodes PE.

[0167] The undercut metal UM can be provided on the first passivation layer 111c. For example, the undercut metal UM can be formed on the same or substantially the same layer as the common current shorting strip EVSB and provided with the same or substantially the same material as the common current shorting strip EVSB. For instance, the undercut metal UM can be provided with a metallic material. Because the undercut metal UM is provided as a metallic material, deformation caused by heat generated during an ACF bonding process for bonding the majority of tabs 130a and the second cathode electrode 117' can be reduced or minimized. The ACF bonding process can refer to a process for bonding two materials using heat.

[0168] Referring to Fig. 7. The undercut metal UM serves to form the pad-section contact undercut PCUC. For example, by providing the undercut metal UM so that it protrudes towards one side of the first passivation layer 111c, the pad-section contact undercut PCUC can be formed under the undercut metal UM. Accordingly, as in Fig. Figure 7 shows that each of the plurality of pad-section contact undercuts PCUC can be provided on a bottom side of one side of the undercut metal UM. For example, each of the plurality of pad-section contact undercuts PCUC can be provided on a bottom side of a right side of the undercut metal UM based on Fig. 7 will be provided.

[0169] If the pad-section contact undercut PCUC of the pad section is provided as a double-sided undercut like the second undercut UC2, the distance between the undercut metals UM becomes short, making it difficult for a material forming the second cathode electrode 117' to penetrate the pad-section contact undercut PCUC.

[0170] Therefore, according to one embodiment of the present disclosure, the display device 100 can ensure a sufficient distance between the undercut metals UM by providing each of the plurality of pad-section contact undercuts PCUC only on one side of the first passivation layer 111c, so that a material forming the second cathode electrode 117' can penetrate deep into the pad-section contact undercut PCUC, thereby reducing or preventing a contact fault between the second cathode electrode 117' and the pad electrode PE.

[0171] As in Fig. As shown in Figure 7, each of the majority of pad section contact undercuts PCUC is provided only on the underside of one side of the undercut metal UM and can therefore be referred to as a one-sided undercut or a one-sided pad undercut.

[0172] The second cathode electrode 117', which comes into contact with the pad electrode PE in the pad section contact undercut PCUC, has the task of applying data current, reference current, pixel current and common current applied by the pad section PA to the display area DA, and can therefore be referred to as a cathode electrode for applying pad current or as a cathode electrode for applying pad section signal.

[0173] With reference to Fig. 7. A plurality of pad-section contact undercuts PCUC are provided at each plurality of tab-bonding sections TBP, such that the organic light-emitting layer 116 can be separated at each plurality of pad-section contact undercuts PCUC. Furthermore, the second cathode electrode 117' can be brought into contact with the pad electrode PE in each plurality of pad-section contact undercuts PCUC. Accordingly, since the second cathode electrode 117' and the pad electrode PE are in contact in the tab-bonding section TBP, the second cathode electrode 117' can be provided as an electrode integrated with the pad electrode PE. Therefore, in the display device 100 according to one embodiment of the present disclosure, each plurality of tabs 130a provided on the flexible film 130 can be readily bonded to each plurality of tab-bonding sections TBP.

[0174] As in Fig. As shown in Figure 7, the organic light-emitting layer 116 and the second cathode electrode 117' can be sequentially laminated onto the undercut metal UM in each of the plurality of tab bond sections TBP. Since the organic light-emitting layer 116 is provided on the flat undercut metal UM, it can be provided flat. Since the second cathode electrode 117' is provided on the flat organic light-emitting layer 116, the second cathode electrode 117' can also be provided flat. Consequently, the second cathode electrode 117' laminated onto the undercut metal UM can be provided flat.

[0175] According to one embodiment of the present disclosure, the display device 100 can have the second cathode electrode 117' laminated onto the undercut metal UM so that it is flat. Accordingly, the display device 100 can have a tab 130a having a flat lower surface that can be more easily attached to the second cathode electrode 117', according to one embodiment of the present disclosure. Furthermore, in the display device 100, according to one embodiment of the present disclosure, a contact area can be widened compared to the case where the second cathode electrode is provided in a coarse shape, so that current and / or signals from the pad section PA can be easily applied to the second cathode electrode 117'.

[0176] As a result, according to an embodiment of the present disclosure, the display device 100 can prevent the ingress of moisture through the organic light-emitting layer 116 by applying an undercut structure to each of the non-display area NDA, an area provided with the common current shorting strip EVSB, and an area provided with the tab binding section TBP.And the display device 100 according to an embodiment of the present disclosure can have a structural feature in which the organic light-emitting layer 116 is interrupted by an undercut structure in each of a region in which the common current short-circuit bar EVSB is provided and a region in which the tab-binding section TBP is provided, so that the cathode electrode (or the second cathode electrode 117') and the common current short-circuit bar EVSB can be in contact in the region in which the common current short-circuit bar EVSB is provided, and the cathode electrode (or the second cathode electrode 117') and the plurality of tabs 130a can be in contact in the region in which the tab-binding section TBP is provided.

[0177] The display device according to the present disclosure can be configured such that the organic light-emitting layer extends from the display area to the end of the substrate. Accordingly, even if the display device according to the present disclosure is manufactured in different sizes, masks (or EL masks) of different sizes are not required, thus reducing manufacturing costs.

[0178] Furthermore, the display device according to the present disclosure can be manufactured in various sizes without masks (or EL masks) of different sizes. Therefore, the display device according to the present disclosure can optimize a process compared to display devices manufactured using masks (or EL masks) of different sizes, thus reducing energy consumption during manufacturing.

[0179] Furthermore, according to the present disclosure, the display device can reduce or prevent the ingress of moisture by providing an undercut section in which the organic light-emitting layer around the display area is interrupted.

[0180] Furthermore, in the present disclosure, a cathode electrode (or a first cathode electrode) provided in a display area can be formed by a chemical vapor deposition process. Accordingly, a dark spot defect in the display area can be improved or prevented in the present disclosure.

[0181] Furthermore, the present disclosure provides that a cathode electrode (or a second cathode electrode) provided in a common current short-circuit strip can be formed by a sputtering process. Accordingly, the present disclosure can reduce or prevent cathode contact failure in the common current short-circuit strip.

Claims

[1] Display device (100), comprising: a substrate (110) having a display area (DA) in which a plurality of pixels (P) with a plurality of subpixels (SP) are arranged, and a non-display area (NDA) around the display area (DA), and an organic light-emitting layer (116) provided on the substrate (110) wherein each of the plurality of subpixels (SP) has the organic light-emitting layer (116), wherein the organic light-emitting layer (116) is arranged such that it extends from the display area (DA) to one end of the substrate (110), wherein the substrate (110) has an undercut section (UCP) in which the organic light-emitting layer (116) is interrupted, and wherein the undercut section (UCP) is arranged in the non-display area (NDA) such that it surrounds the display area (DA). [2] Display device (100) according to claim 1, wherein the non-display area (NDA) comprises: a first non-display area (NDA1) that has a pad section (PA) and is adjacent to a first side of the display area (DA), and a second non-display area (NDA2) connected to the first non-display area (NDA1) and adjacent to a second side of the display area (DA), and where the undercut section (UCP) has: a first undercut (UC1) in the first non-display area (NDA1) and a second undercut (UC2) in the second non-display area (NDA2). [3] The display device (100) according to claim 2, wherein the second undercut (UC2) has a different shape than the first undercut (UC1). [4] Display device (100) according to claim 2 or 3, wherein the non-display area (NDA) comprises: a third non-display area (NDA3) that is spaced apart from the second non-display area (NDA2) with the display area (DA) in between, and a fourth non-display area (NDA4) that is spaced apart from the first non-display area (NDA1) with the display area (DA) in between, the undercut section (UCP) further features: a third undercut (UC3) in the third non-display area (NDA3) and a fourth undercut (UC4) in the fourth non-display area (NDA4), where the third undercut (UC3) and the fourth undercut (UC4) have the same shape as the second undercut (UC2). [5] Display device (100) according to any one of claims 2 to 4, wherein the substrate (110) comprises: a first cathode electrode (117) arranged on the organic light-emitting layer (116) and overlapping with the display area (DA) and a section of the first non-display area (NDA1), and a second cathode electrode (117') which is partially in contact with an upper surface of the first cathode electrode (117) and is located in the first non-display area (NDA1). [6] Display device (100) according to claim 5, wherein the first cathode electrode (117) is formed by a chemical vapor deposition process and the second cathode electrode (117') is formed by a sputtering process. [7] Display device (100) according to claim 5 or 6, wherein the first cathode electrode (117) is formed from an opaque metal material and the second cathode electrode (117') is formed from at least one of an opaque metal material, a transparent metal material and a semi-transparent metal material. [8] Display device (100) according to any one of claims 5 to 7, wherein the substrate (110) comprises: a first area (A1) in which the first cathode electrode (117) is arranged, a second area (A2) in which the second cathode electrode (117') is located, and a third area (A3) in which the first cathode electrode (117) and the second cathode electrode (117') overlap, the third area (A3) is provided between the first area (A1) and the second area (A2). [9] Display device (100) according to claim 8, wherein the organic light-emitting layer (116) is arranged such that it extends from the display area (DA) to an end of the substrate (110) which has the first non-display area (NDA1), and wherein the organic light-emitting layer (116) extending to the first non-display area (NDA1) is interrupted by means of the first undercut (UC1) in the second area (A2). [10] Display device (100) according to claim 8 or 9, wherein the substrate (110) further comprises a common current short-circuit strip (EVSB) arranged in the second region (A2), and wherein the common current short-circuit strip (EVSB) is provided in a strip shape or a square shape. [11] The display device (100) according to claim 10, where a plurality of common current contact undercuts (ECUC) are provided on the common current short-circuit bar (EVSB), wherein the organic light-emitting layer (116) is interrupted by each of the plurality of common electrical contact undercuts (ECUC) and wherein the second cathode electrode (117') is in contact with the common current short-circuit bar (EVSB) in each of the plurality of common current contact undercuts (ECUC). [12] The display device (100) according to claim 11, wherein each of the plurality of common current contact undercuts (ECUC) is formed by partially removing both a passivation layer (111d) provided on the common current short-circuit bar (EVSB) and a planarization layer (113) provided on the passivation layer (111d). [13] Display device (100) according to claim 12, wherein each of the plurality of common current contact undercuts (ECUC) is provided only on one side of the passivation layer (111d). [14] Display device (100) according to any one of claims 5 to 13, wherein the substrate (110) has a plurality of tab binding sections (TBP) provided in the first non-display area (NDA1), and each of the plurality of tab binding sections (TBP) has a plurality of tab section contact undercuts (PCUC) in which the organic light-emitting layer (116) is interrupted. [15] The display device (100) according to claim 14, wherein each of the plurality of tab section contact undercuts (PCUC) is connected to the first undercut (UC1). [16] The display device (100) according to claim 14 or 15, where each has a majority of tab binding sections (TBP): a gate insulating layer (111a) provided on the substrate (110), a pad electrode (PE) provided on the gate insulating layer (111a), a passivation layer (111c) provided on the pad electrode (PE), and an undercut metal (UM) provided on the passivation layer (111c), and wherein each of the plurality of pad section contact undercuts (PCUC) is provided on a bottom side of one side of the undercut metal (UM). [17] Display device (100) according to claim 16, wherein the second cathode electrode (117') is in contact with the pad electrode (PE) in each of the plurality of pad section contact undercuts (PCUC). [18] Display device (100) according to claim 16 or 17, wherein the organic light-emitting layer (116) and the second cathode electrode (117') are successively laminated onto the undercut metal (UM) and the second cathode electrode (117') laminated onto the undercut metal (UM) is provided flat. [19] The display device (100) according to any one of claims 2 to 18, further comprising: a plurality of inorganic films (111) between the substrate (110) and the organic light-emitting layer (116) and a planarization layer (113) between the majority of inorganic films (111) and the organic light-emitting layer (116), wherein the second undercut (UC2) is formed by removing a section of the majority of inorganic films (111) and a section of the planarization layer (113). [20] Display device (100) according to claim 19, wherein the plurality of inorganic films (111) have an island inorganic layer (111') which is interrupted by a plurality of second undercuts (UC2), wherein the planarization layer (113) has an island planarization layer (113') arranged on the island inorganic film (111'), and where the majority of second undercuts (UC2) are provided in a symmetrical form based on the island inorganic film (111') and the island planarization layer (113').

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