DEVICE FOR ASSEMBLING A SWITCHING CARRIER

Description

[0001] The invention relates to a device for arranging a circuit carrier according to the preamble of claim 1.

[0002] For generating specific lighting functions in automotive lighting systems such as headlights or taillights, highly accurate positioning and alignment of the light-emitting areas of semiconductor light sources relative to the rest of the optical system is crucial. WO 2014 / 1535761 discloses a method for camera-controlled, highly accurate placement of semiconductor light sources on a circuit board. The light-emitting area of ​​the LED is detected, and based on its position, the LED is placed on the circuit board and then electrically connected. In a subsequent assembly step, the circuit board with the LED(s) mounted on it is then positioned and secured within the optical system of the lighting system.For this purpose, the circuit carrier has reference points or markings that are arranged relative to at least one corresponding reference area of ​​the optical system.

[0003] WO 2014 / 056012 A1 discloses a light module for a motor vehicle or for a motor vehicle headlight, wherein the light module has at least two or more light sources which are positioned in defined positions relative to each other, and wherein the light module further has two or more reflectors, each light source being assigned at least one reflector. At least one of the reflectors is movably connected to at least one adjacent reflector.

[0004] WO 2014 / 028954 A1 relates to a method for positioning a reflector relative to at least one light source, comprising the following steps: a) mounting the at least one light source on a carrier plate; b) measuring the position of the at least one light source on the carrier plate; c) mounting one or preferably more reference positions on the carrier plate, the position of the at least one reference position depending on the position of the at least one light source; d) referencing, i.e. aligning the reflector with the reference position(s) on the carrier plate; and e) fixing the reflector to the carrier plate or in relation to the carrier plate.

[0005] Based on the described prior art, the present invention aims to improve the accuracy in the positioning and alignment of light-emitting surfaces of semiconductor light sources relative to an optical system of a lighting device.

[0006] The problem underlying the invention is solved by a device according to claim 1.

[0007] In this way, a pre-installed semiconductor light source can be advantageously positioned precisely relative to the optical system by means of the design of the bores.

[0008] The resulting relative movement between the light-emitting area of ​​the semiconductor light source and an optical working area, until the stop elements contact the respective stop area, enables the precise positioning of the light-emitting area relative to the optical working area of ​​the optical system with which it interacts. This relative movement can include not only a displacement within an imaginary plane but also a rotation about an axis perpendicular to that plane.

[0009] A particular advantage lies in the fact that no optical inspection is necessary when arranging the circuit carrier and the optical system relative to each other. Instead, the exact installation position can be determined in advance by positioning and defining the stop elements and the semiconductor light source relative to each other. This allows manufacturing steps to be decoupled.

[0010] In an advantageous embodiment, the circuit carrier is fixed in a specific position relative to the optical system. This allows the position achieved through the relative movement to be fixed with minimal effort, thereby also ensuring the exact positioning of the light-emitting area relative to the optical system.

[0011] In an advantageous embodiment, the optical system comprises an optical working section that interacts optically with the semiconductor light source and is an integral part of the optical system. The working section is manufactured by a tool comprising a tool part, which also produces the stop areas.

[0012] In an advantageous further development, the optical working section is a reflector surface.

[0013] According to the invention, the target position is predetermined depending on a further target position of the at least one light-emitting area of ​​the at least one semiconductor light source with respect to the stop area of ​​the optical system. This further target position establishes a relationship between the circuit carrier to which the light-emitting area is defined and the optical system.

[0014] Further features and advantages of the present invention are explained below with reference to the figures. They show: Figures 1, 3 and 5 each show a schematic flowchart; Figures 2 and 4 each show a device for carrying out a process; and Figure 6 shows a schematic perspective view of an optical system.

[0015] To generate specific lighting functions from lighting devices (e.g., headlights or taillights in motor vehicles) that use semiconductor light sources, highly precise positioning and alignment (precise adjustment) of the light-emitting areas of the semiconductor light source relative to the rest of the lighting device's optical system is crucial. The semiconductor light sources are, for example, light-emitting diodes (LEDs). These have a light-emitting area that includes, for example, converter material. When illuminated with blue light from an LED, this material emits yellow light, which mixes with the blue light from the LED to produce white light.

[0016] With the present invention, a circuit carrier can be arranged with particular precision relative to the optical system of a lighting device. The optical system can be a light module 20 (see figure). Figure 6) a lighting device of a motor vehicle, e.g., a motor vehicle headlight or a motor vehicle lamp. The optical system 20 comprises, for example, a reflective surface 24 of a reflector, a light entry area of ​​an attachment optic made of a solid transparent material for focusing light rays by means of refraction upon entering and / or exiting the optic and / or by means of total internal reflection at lateral interfaces of the optic, or a light entry area of ​​a light guide or similar, with respect to which a highly precise arrangement of a light-emitting diode 32 is important so that the optical system 20 can generate a specified light distribution as accurately as possible. The procedure is described below with reference to the flowchart of the Figure 1 explained in more detail.

[0017] The procedure begins according to a schematic flowchart in Figure 1in a functional block 2 and terminates in a functional block 14. In a functional block 4, a target position of a light-emitting area 34 of the semiconductor light source 32 is specified with respect to at least two bores 33, 35 in the circuit carrier 30. Preferably, only two bores are used for positioning and fixing the circuit carrier 30 to the optical system 20, in order to avoid further sources of tolerance and to ensure the most precise positioning possible. The use of the two bores thus represents an advantageous compromise between effort and positioning accuracy.

[0018] In a functional block 6, a semiconductor light source 32 and two bores 33 and 35 are positioned relative to each other on the circuit carrier 30. For this purpose, in a first step according to the invention,

[0019] In an embodiment of the functional block 6, at least one light-emitting area 34 optically detects at least one semiconductor light source 32 ( Figure 2 The optical detection of the light-emitting area 34 can be carried out, for example, with a camera. The camera 52 is directed towards the light-emitting area 34 of the semiconductor light source 32. The semiconductor light source 32 can be operated to generate light in order to detect the light-emitting area 34. However, it is also possible to detect the light-emitting area 34 without generating light.

[0020] In a functional block 120 of the schematic flowchart in Figure 3The semiconductor light source 32 is arranged on the circuit carrier 30. With the semiconductor light source 32 previously arranged on the circuit carrier 30, its actual position 102 is detected in a functional block 122. For this purpose, for example, an image of the circuit carrier 30 acquired by the camera 52 is analyzed for edges of the light-emitting area 34 and / or for a center of gravity of the light-emitting area 34. Depending on the position of at least one edge and / or the center of gravity in relation to the circuit carrier 30, the actual position of the light-emitting area 34 or of the semiconductor light source 32 is thus determined. Depending on the position of the light-emitting area 34 in relation to the actual position 102, the bores 33 and 35 are subsequently drilled into the circuit carrier 30 at the respective target positions 104 and 106 in a functional block 124 using a drilling device 158.

[0021] The target positions 104 and 106 are determined based on the actual position 102. For example, a target distance from the actual position 102 to a straight line through the target positions 104 and 106 can be used to determine the target positions 104 and 106. Of course, in addition to the actual position 102, the orientation of an edge of the light-emitting area 34 can also be used to determine the target positions 104 and 106, in order to align the straight line through the target positions 104 and 106 essentially parallel to the aforementioned edge of the light-emitting area.

[0022] In a second embodiment of the functional block 6 that is not according to the invention, the semiconductor light source 34 is positioned on the circuit carrier 30 and fixed to the circuit carrier 30 depending on the position of bores 33, 35 already provided in the circuit carrier 30 ( Figure 4The light-emitting area 34 can be optically detected to determine the position of the light-emitting area 34 relative to the position of the bores 33, 35.

[0023] Thus, in a functional block 130 of a schematic flowchart of the Figure 5In functional block 4, two holes are drilled into the circuit carrier 30 at actual positions 108 and 110 using a further drilling device. In a subsequent functional block 132, the actual positions 108 and 110 are determined using an optical inspection system comprising the camera 52. In a subsequent functional block 134, a target position 112 for the semiconductor light source 32, in particular for the light-emitting area 34, is determined, and the semiconductor light source 32 is positioned at the target position 112 and connected to the circuit carrier 30. For this purpose, for example, an image of the semiconductor light source 32 taken with the camera 52 is analyzed for edges of the light-emitting area 34 and / or for a center of gravity of the light-emitting area 34.Depending on the position of at least one edge and / or the center of gravity in relation to the target position 112, the semiconductor light source 32 is positioned on the circuit carrier 30 and connected to the circuit carrier 30.

[0024] In a functional block 8, stop elements 140 and 142, each assigned to a stop area 26 and 28, are inserted into the bores 33 and 35, respectively. The stop elements 140 and 142 can be designed as pins with a diameter that remains constant or changes along their length.

[0025] In a functional block 10, a relative movement of the circuit carrier 30 relative to the optical system 20 or of the optical system 20 relative to the circuit carrier 30 is carried out such that the stop elements 140 and 142 arranged in the bores 33 and 35 bear against the respective stop area 28 and 26.

[0026] In a functional block 12, the circuit carrier 30 is fixed in a specific position relative to the optical system 20. For example, the circuit carrier 30 can be attached to the optical system 20. Welding, gluing, screwing, or clamping are all possible methods. This results in a lighting device with an optical system 20 in which the light-emitting surface 34 of the semiconductor light source 32 is positioned with particularly high accuracy relative to the photometrically effective areas of the optical system 20.

[0027] A particular advantage of the method described here is that one assembly step of the optical system 20 and the circuit carrier 30 is simplified by the prior arrangement of the stop elements 140, 142 and the semiconductor light source 32 relative to each other. The desired high accuracy between the light-emitting area 34 of the semiconductor light source 32 and the rest of the optical system is achieved—independently of the assembly step of the optical system and the circuit carrier 30—by specifying and arranging the light-emitting area 34 of the semiconductor light source 32 according to a target position with respect to the at least two bores 33, 35 in the circuit carrier 30. Thus, improved positioning accuracy of the semiconductor light sources 32 relative to the optical system 20 can be achieved with less effort and lower costs.

[0028] Figure 2shows a device 150 for carrying out the procedure according to Figure 1The semiconductor light source 32 is positioned on the circuit carrier 30 and connected to it. The circuit carrier 30 is held in a defined position by means of a holding device 151. The camera 52 detects the actual position 102 of the light-emitting area 34 and transmits this position 102 to a computing device 152. The computing device 152 includes a storage element 154 on which the target position of the light-emitting area 34 of the semiconductor light source 32 with respect to the at least two bores 33 and 35 is stored. This target position can be determined, for example, by practical tests on prototypes of the optical system 20 or computationally using simulation tools or a suitable calibration tool. The computing device 152 also includes a processing unit 156, for example, a microprocessor, on which a suitable computer program runs, which executes the process steps according to the Figure 1 can execute.

[0029] The camera images from camera 52 are evaluated by the computer 152, and the target positions 104 and 106 are calculated based on the actual position 102. The computer 152 controls the drilling device 158 such that the holes 33 and 35 are drilled at the target positions 104 and 106 of the circuit carrier 30.

[0030] The target positions 104 and 106 are also used to insert the stop elements 140 and 142 into the completed bores 33 and 35 by means of an insertion device 160.

[0031] In a subsequent step according to functional block 10, the optical system 20 and the circuit carrier 30 are moved relative to each other by means of a manipulator 162 or by hand such that the stop elements 140 and 142 bear against the stop areas 26 and 28 of the optical system 20 and are thus pre-fixed by means of the device 150 or an auxiliary device. Subsequently, the optical system 20 and the circuit carrier 30 can be permanently fixed relative to each other.

[0032] Figure 4 shows a device 170 for carrying out the method according to Figure 1 . Unlike Figure 2The bores 33 and 35 are pre-drilled in the circuit carrier 30. Using the camera 52, the computer 152 determines the actual positions 108 and 110 of the bores 33 and 35. Depending on the previously determined target position, which is stored on the memory element 154, a target position 112 of the light-emitting area 34 is determined. Using a manipulator 164, the semiconductor light source 32 is positioned on the circuit carrier 30 according to the target position 112 and connected to it. Subsequently, using the insertion device 160, the stop elements 140 and 142 are inserted into the bores 30 and 35, and the relative movement of the optical system 20 and the circuit carrier 30 is carried out.

[0033] The in the Figure 2 and 4 The elements of devices 150 and 160 designated by reference numerals 160, 52, 152, 158, 162 and 164 can also generally be described as means.

[0034] Figure 6 Figure 1 shows a schematic perspective view of an optical system 20 with an optical section 24, which is shown here as an example of a reflector surface. Of course, the optical section 24 can also be configured as a transmission element that transmits light emitted by the semiconductor light source 32. Therefore, the features described below, which are not explicitly directed at a reflector, can also be applied to a corresponding transmission element.

[0035] The optical working section 24 is an integral part of the optical system 20. The stop areas 26 and 28 are oriented in the x-direction and are integrally arranged on the optical system 20 on a narrow side of a base plate of the optical system 20, which is arranged in the direction of emission of the optical system 20. A light beam 200 emitted by the semiconductor light source 32 is reflected by the working section 24 as a reflected light beam 202.

[0036] On the side facing away from the optical working section 24, the optical system 20 has stop and / or fastening sections (not shown). For example, the optical system 20 can include a contact geometry and / or a contact surface facing the circuit carrier 30. The contact surface can thus serve for bonding to the circuit carrier 30.

[0037] Furthermore, the optical system 20 can also be screwed to the circuit carrier 30 or another element. For this purpose, the optical system 20 provides corresponding screw holes on the side facing away from the optical working section 24. This allows for height compensation to prevent or reduce stresses in the optical system 20.

[0038] The stop elements 140 and 142, designed as pins, are inserted into bores 33 and 35. In the illustrated installation position of the optical system 20, the stop elements 140 and 142 abut the stop areas 26 and 28. A holding device 46, on which the circuit carrier 30 is arranged, can be designed as a heat sink.

[0039] The contact of the stop elements 42 and 44 with the stop areas 26 and 28 achieved by the relative movement of the optical system 20 to the circuit carrier 30 limits the movement of the circuit carrier 30 and the optical system 20 relative to each other in at least one plane, for example the yz-plane.

[0040] The stop area 26 runs essentially parallel to the y-axis and, together with the stop element 142, limits the movement of the optical system 20 in the positive x-direction with the circuit carrier 30 stationary.

[0041] The stop area 28, on the other hand, is V-shaped and, together with the stop element 140, limits the movement of the optical system 20 relative to the stationary circuit carrier 30 in the positive x-direction and in both the positive and negative y-directions. Thus, the stop elements 142 and 140, together with the stop areas 26 and 28, limit the movement of the optical system 20 and the circuit carrier 30 relative to each other. A highly precise pre-positioned semiconductor light source 32 ensures, firstly, highly accurate positioning of the light-emitting area 34 relative to the optical system 20. Secondly, the step for arranging the optical system 20 and the circuit carrier 30 relative to each other is simplified, as optical inspection systems are not necessarily required for this arrangement step.

[0042] Furthermore, the stop areas 26 and 28 are designed as projecting ribs in their respective course.

[0043] This improves, among other things, the positioning accuracy. In particular, when the stop elements 140 and 142 contact the stop areas 26 and 28, a rotation is performed about an axis essentially parallel to the y-axis in order to permanently fix the optical system 20 and the circuit carrier 30 relative to each other. Crucially, the stop areas 26 and 28 taper towards the respective stop elements 140 and 142 relative to the base plate in order to reduce the effective contact area and increase positioning accuracy.

[0044] The tool for manufacturing the optical system 20 is designed in such a way that there is no tool or slide separation at the stop areas 26 and 28, which further increases the positioning accuracy due to a corresponding burr-free optical system 20 in this area.

[0045] The bores 33 and 35, into which the stop elements 140 and 142 are inserted, are arranged transversely to the x-direction, i.e., essentially perpendicular to the direction of emission, oriented towards the edges of the circuit carrier 30 and / or towards the edges of the optical system 20. Advantageously, the distance between the target positions 104 and 106 or the distance between the actual positions 108 and 110 is chosen to be as large as possible, which minimizes tolerances and errors and thus further improves positioning accuracy.

Claims

1. Apparatus (150) for arranging a circuit carrier (30), comprising at least one semiconductor light source (32), in a specific position relative to an optical system (20) of an illumination device of a motor vehicle, wherein the apparatus (150) has: - a memory element (154) for storing a target position for a light-emitting region (34) of the semiconductor light source (32) in relation to at least two bores (33, 35) in the circuit carrier (30), - means (158; 164) for fixing the at least one semiconductor light source (32) and the bores (33, 35) relative to each other on the basis of the target position, - a camera (52) for capturing an actual position (102) of the light-emitting region (34) of the semiconductor light source (32) in relation to the circuit carrier (30), - means for determining target positions (104, 106) for the bores (33, 35) on the basis of the actual position (102), - means for introducing the bores (33, 35) into the circuit carrier (30) at the respective target positions (104, 106), and the apparatus (150) is characterized by: - means (160) for inserting a stop element (140, 142) assigned to a particular stop region (26, 28) of the optical system (20) into each of the bores (33, 35), - means (162) for performing a relative movement of the circuit carrier (30) with the stop elements (140, 142) and of the optical system (20) with the stop regions (26, 28) relative to each other in such a way that the stop elements (140, 142) bear against the respective stop regions (26, 28), - a base plate of the optical system (20), on the narrow side of which, which is arranged in the emission direction of the optical system (20), the stop regions (26, 28) are integrally arranged, and - a tapering of the stop regions (26, 28) toward the respective stop elements (140, 142) relative to the base plate, wherein one stop region (28) is V-shaped and together with the associated stop element (140) limits the movement of the optical system (20) relative to the stationary circuit carrier (30) in a plane spanned by two axis directions (x-direction, y-direction), namely in the one axis direction (x-direction) exclusively in the positive axis direction and in the other axis direction (y-direction) in both the positive and negative axis directions, wherein the other stop region (26) - extends substantially parallel to the other axis direction (y-direction), and - together with the stop element (142) limits the movement of the optical system (20) in the positive direction of the one axis direction (x-direction) when the circuit carrier is stationary.

2. Apparatus (150) according to claim 1, characterized in that the stop regions (26, 28) are formed as projecting ribs in their respective courses.

3. Apparatus (150) according to either of claims 1 or 2, which has means for carrying out a method - in which the circuit carrier (30) is fixed in the specific position relative to the optical system (20) and - in which the optical system (20) comprises an optical active portion (24) which optically cooperates with the semiconductor light source (32) and which is an integral part of the optical system (20), wherein the active portion (24) is produced by means of a tool comprising a tool part, by means of which tool the stop regions (26, 28) are also produced.

4. Apparatus (150) according to claim 3, characterized in that the optical active portion (24) is a reflector surface.