CAMERA MODULE AND OPTICAL DEVICE EQUIPPED HERESO

DE602019063698T2Active Publication Date: 2024-12-18LG INNOTEK CO LTD
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Patent Information

Application Number
DE602019063698
Authority / Receiving Office
DE · DE
Patent Type
Patents
Current Assignee / Owner
Priority Date
2018-03-20
Filing Date
2019-03-18
Publication Date
2024-12-18
Estimated Expiration
2039-03-18

AI Technical Summary

Technical Problem

Camera modules in small electronic devices, such as smartphones, face challenges with optical performance and reliability due to shocks and hand tremors, and existing technologies struggle to secure reliable wire bonding and bonding force between components.

Method used

The camera module design includes a stiffener with a protruding portion and adhesive members to securely attach the image sensor and printed circuit board, optimizing the height and thickness ratios to enhance bonding and reduce warpage, thereby improving optical performance and reliability.

Benefits of technology

This design enhances the optical performance and reliability of the camera module by securing stronger bonding forces and reducing warpage, ensuring stable wire bonding and improved image quality despite external shocks and hand tremors.

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