ELECTRONIC DEVICE WITH CAMERA
DE602023018390T2Active Publication Date: 2026-06-10SAMSUNG ELECTRONICS CO LTD
Patent Information
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- SAMSUNG ELECTRONICS CO LTD
- Filing Date
- 2023-10-04
- Publication Date
- 2026-06-10
AI Technical Summary
Technical Problem
In electronic devices with minimized bezels and expanded active areas, camera modules face issues with shallow curing depth and weakened bonding strength of UV-curable resin, leading to potential displacement and vision alignment distortion.
Method used
The camera module is designed with a convex shape and a recess that accommodates it, featuring a UV-curable resin with non-overlapping and overlapping portions, and an inclined surface with higher reflectivity to enhance bonding strength.
Benefits of technology
This design ensures stable fixation of the camera module, maintaining vision alignment and facilitating the production of thinner electronic devices with improved bonding strength.
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