Foldable electronic device including NFC antenna

Abstract

We provide a foldable electronic device that includes an NFC antenna. [Solution] The foldable electronic device of the present invention includes a foldable housing including a first housing, a second housing, and a hinge portion connecting the first housing and the second housing; a first metal included in the first side that provides at least a portion of the side surface of the first housing; a second metal included in the second side that provides at least a portion of the side surface of the second housing; a first ground region located in the first housing and physically separated from the first metal, where the first metal and the second metal are aligned and overlapping in the folded state of the foldable electronic device; and the second housing The device comprises a second ground region located physically separate from the second metal, a wireless communication circuit housed in the first housing, a first electrical path electrically connecting the first metal and the wireless communication circuit, a second electrical path electrically connecting the second metal and the wireless communication circuit and positioned across the hinge portion, a third electrical path electrically connecting the first metal and the first ground region, a fourth electrical path electrically connecting the second metal and the second ground region, and a fifth electrical path electrically connecting the first ground region and the second ground region and positioned across the hinge portion.

Description

【Technical Field】 【0001】 The present invention relates to a foldable electronic device including an NFC (near field communication) antenna. 【Background Art】 【0002】 An electronic device can cooperate with various applications through an NFC antenna to provide users with various experiences, not just for payment. 【0003】 The above information is provided as background information (related art) for the purpose of assisting in the understanding of the present invention. No claim is made as to whether any of the above-described content is applicable as prior art related to the present invention. 【0004】 The NFC antenna is located, for example, corresponding to the center of the back of the electronic device. To use the payment service, the user has to either leave the electronic device untouched for payment or hold the edge of the electronic device during payment, which is inconvenient. In the case of a foldable electronic device, due to the folding characteristics of the foldable electronic device in addition to the position of the NFC antenna, it may be difficult to make a smooth payment. 【Summary of the Invention】 【Problems to be Solved by the Invention】 【0005】 The present invention has been made in view of the above prior art, and an object of the present invention is to provide a foldable electronic device including an NFC antenna for improving usability. 【Means for Solving the Problems】 【0006】 The present invention is defined by the scope of the claims. Additional inventions outside the scope of the claims are incorporated for purposes of illustration and comparison. 【0007】 A foldable electronic device according to one aspect of the present invention, made to achieve the above objective, comprises a foldable housing, a first metal, a second metal, a first ground area, a second ground area, a wireless communication circuit, a first electrical path, a second electrical path, a third electrical path, a fourth electrical path, and a fifth electrical path. The foldable housing includes a first housing, a second housing, and a hinge connecting the first housing and the second housing. The first metal is included in the first side, which provides at least a portion of the side surface of the first housing. The second metal is included in the second side, which provides at least a portion of the side surface of the second housing. In the folded state of the foldable electronic device, the first metal and the second metal are aligned with each other. The first ground area is located in the first housing. The first ground area is physically separated from the first metal. The second ground area is located in the second housing. The second ground area is physically separated from the second metal. The wireless communication circuit is housed in the first housing. The first electrical path electrically connects the first metal and the wireless communication circuit. The second electrical path electrically connects the second metal to the wireless communication circuit. The second electrical path is positioned across the hinge. The third electrical path electrically connects the first metal to the first ground area. The fourth electrical path electrically connects the second metal to the second ground area. The fifth electrical path electrically connects the first ground area to the second ground area. The fifth electrical path is positioned across the hinge. 【0008】 A foldable electronic device according to one embodiment comprises a foldable housing, a first metal, a second metal, a first ground area, a second ground area, a first non-ground area, a second non-ground area, a wireless communication circuit, a first electrical path, a second electrical path, a third electrical path, a fourth electrical path, and a fifth electrical path. The foldable housing includes a first housing, a second housing, and a hinge portion connecting the first housing and the second housing. The first metal is included in the first side, which provides at least a portion of the side surface of the first housing. The second metal is included in the second side, which provides at least a portion of the side surface of the second housing. In the folded state of the foldable electronic device, the first metal and the second metal are aligned with each other. The first ground area is located in the first housing. The first ground area is physically separated from the first metal. The second ground area is located in the second housing. The first non-ground area is located between the first metal and the first ground area. The second non-ground area is located between the second metal and the second ground area. In the folded state of the foldable electronic device, the first non-ground region and the second non-ground region are aligned. The second ground region is physically separated from the second metal. The wireless communication circuit is housed in the first housing and configured to process NFC signals. A first electrical path electrically connects the first metal and the wireless communication circuit. A second electrical path electrically connects the second metal and the wireless communication circuit. The second electrical path is positioned across the hinge. A third electrical path electrically connects the first metal and the first ground region. A fourth electrical path electrically connects the second metal and the second ground region. A fifth electrical path electrically connects the first ground region and the second ground region. The fifth electrical path is positioned across the hinge. The wireless communication circuit provides a positive voltage (i.e., + voltage) through the first electrical path and a negative voltage (i.e., - voltage) through the second electrical path. 【0009】 To achieve the above objective, another aspect of the present invention provides a foldable electronic device comprising a first metal, a second metal, a hinge, and a wireless communication circuit. The first metal is included in a first side member of the first housing. The second metal is included in a second side member of the second housing. The hinge rotatably connects the first housing and the second housing. The wireless communication circuit is configured to transmit and / or receive NFC band signals through the first and second metals. In the folded state of the foldable electronic device, the first and second metals are aligned with each other. In the folded state of the foldable electronic device, the direction in which current flows on the first metal and the direction in which current flows on the second metal are the same when power is supplied from the wireless communication circuit. [Effects of the Invention] 【0010】 According to the foldable electronic device including the NFC antenna of the present invention, it is possible to reduce the limitations of the user's hand grip position, secure and / or expand the magnetic field distribution of the NFC band, and improve the usability and / or user experience of NFC services. 【0011】 Further effects that may be obtained or predicted by various embodiments of the present invention will be disclosed directly or implicitly in the detailed description of the embodiments of the present invention. 【0012】 The above and other aspects, features, and advantages of specific embodiments of the present invention will become more apparent from the following detailed description with reference to the drawings. [Brief explanation of the drawing] 【0013】 [Figure 1] This is a block diagram of electronic devices in a network environment according to one embodiment of the present invention. [Figure 2] This figure shows a foldable electronic device in an unfolded state according to one embodiment of the present invention. [Figure 3]This figure shows a foldable electronic device in a folded state according to one embodiment of the present invention. [Figure 4] This is a cross-sectional view of a foldable electronic device cut along line D-D' in Figure 2, according to one embodiment of the present invention. [Figure 5] This figure shows a foldable electronic device in an unfolded state according to one embodiment of the present invention. [Figure 6] This figure shows a foldable electronic device in an unfolded state according to one embodiment of the present invention. [Figure 7] This is a circuit diagram of a first example antenna structure included in a foldable electronic device according to one embodiment of the present invention. [Figure 8] This figure shows the current distribution in the folded state of a foldable electronic device. [Figure 9] This figure shows a foldable electronic device in an unfolded state according to one embodiment of the present invention. [Figure 10] This figure shows a foldable electronic device in an unfolded state according to one embodiment of the present invention. [Figure 11] This figure shows a foldable electronic device in an unfolded state according to one embodiment of the present invention. [Figure 12] This figure shows a foldable electronic device in an unfolded state according to one embodiment of the present invention. [Figure 13] This figure shows a foldable electronic device in an unfolded state according to one embodiment of the present invention. [Figure 14] This is a heat map showing the magnetic field distribution during power supply in the folded state of a foldable electronic device according to one embodiment of the present invention, a heat map showing the magnetic field distribution during power supply in the folded state of a foldable electronic device of the first comparative example, and a heat map showing the magnetic field distribution during power supply in the folded state of a foldable electronic device of the second comparative example. [Figure 15] This is a circuit diagram of an antenna structure included in a foldable electronic device according to one embodiment of the present invention. [Figure 16]A heat map showing the magnetic field distribution during power supply in the folded state of a foldable electronic device according to an embodiment of the present invention, a heat map showing the magnetic field distribution during power supply in the folded state of a foldable electronic device of the third comparative example, and a heat map showing the magnetic field distribution during power supply in the folded state of a foldable electronic device of the fourth comparative example. [Figure 17] A circuit diagram of an antenna structure according to an embodiment of the present invention and a circuit diagram of an antenna structure of the third comparative example. [Figure 18] A diagram showing a foldable electronic device in an unfolded state according to an embodiment of the present invention. [Figure 19] A diagram showing a foldable electronic device in an unfolded state according to an embodiment of the present invention. [Figure 20] A diagram showing a foldable electronic device in an unfolded state according to an embodiment of the present invention. [Figure 21] A diagram showing a foldable electronic device in an unfolded state according to an embodiment of the present invention. [Figure 22] A diagram showing a foldable electronic device in an unfolded state according to an embodiment of the present invention. [Figure 23] A diagram showing a foldable electronic device in an unfolded state according to an embodiment of the present invention. [Figure 24] A heat map showing the magnetic field distribution during power supply in the folded state of the foldable electronic device of FIG. 23 according to an embodiment of the present invention and a heat map showing the magnetic field distribution during power supply in the folded state of a foldable electronic device of a comparative example. [Figure 25] A diagram showing flexible printed circuit boards according to various embodiments of the present invention. [Figure 26] A diagram showing a foldable electronic device in an unfolded state according to an embodiment of the present invention. [Figure 27] A diagram showing a foldable electronic device in an unfolded state according to an embodiment of the present invention. [Figure 28]This figure shows a foldable electronic device in an unfolded state according to one embodiment of the present invention. [Figure 29] This figure shows a foldable electronic device in an unfolded state according to one embodiment of the present invention. [Figure 30] This figure shows a foldable electronic device in an unfolded state according to one embodiment of the present invention. [Figure 31] This figure shows a foldable electronic device in an unfolded state according to one embodiment of the present invention. [Figure 32] This figure shows a multifoldable electronic device in an unfolded state according to one embodiment of the present invention. [Figure 33] This is a perspective view of a multifoldable electronic device in a folded state according to one embodiment of the present invention. [Figure 34] This figure shows a multifoldable electronic device in an unfolded state according to one embodiment of the present invention. [Figure 35] This figure shows a multifoldable electronic device in an unfolded state according to one embodiment of the present invention. [Figure 36] This figure shows a multifoldable electronic device in an unfolded state according to one embodiment of the present invention. [Figure 37] This figure shows a multifoldable electronic device in an unfolded state according to one embodiment of the present invention. [Figure 38] This figure shows a multifoldable electronic device in an unfolded state according to one embodiment of the present invention. [Figure 39] This figure shows a multifoldable electronic device in an unfolded state according to one embodiment of the present invention. [Figure 40] This figure shows a multifoldable electronic device in an unfolded state according to one embodiment of the present invention. [Figure 41] This figure shows a multifoldable electronic device in an unfolded state according to one embodiment of the present invention. [Figure 42]This is a perspective view of a multifoldable electronic device in a folded state according to one embodiment of the present invention. [Figure 43] This figure shows a multifoldable electronic device in an unfolded state according to one embodiment of the present invention. [Figure 44] This figure shows a multifoldable electronic device in an unfolded state according to one embodiment of the present invention. [Figure 45] This figure shows a multifoldable electronic device in an unfolded state according to one embodiment of the present invention. [Figure 46] This figure shows a multifoldable electronic device in an unfolded state according to one embodiment of the present invention. [Figure 47] This figure shows a multifoldable electronic device in an unfolded state according to one embodiment of the present invention. [Figure 48] This figure shows a multifoldable electronic device in an unfolded state according to one embodiment of the present invention. [Figure 49] This figure shows a multifoldable electronic device in an unfolded state according to one embodiment of the present invention. [Modes for carrying out the invention] 【0014】 Hereinafter, specific examples of embodiments for carrying out the present invention will be described in detail with reference to the drawings. 【0015】 Figure 1 is a block diagram of an electronic device 101 in a network environment 100 according to one embodiment of the present invention. 【0016】 Referring to Figure 1, in the network environment 100, the electronic device 101 communicates with an external electronic device 102 via a first network 198 (e.g., a short-range wireless communication network) or with at least one of an external electronic device 104 or a server 108 via a second network 199 (e.g., a long-range wireless communication network). The electronic device 101 can communicate with an external electronic device 104 via the server 108. The electronic device 101 includes a processor 120, memory 130, input module 150, acoustic output module 155, display module 160, audio module 170, sensor module 176, interface 177, coupling terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196, and / or antenna module 197. In various embodiments of this specification, the electronic device 101 may omit at least one of these components (e.g., the coupling terminal 178) or add one or more other components. In various embodiments of this specification, some of these components may be embodied in a single integrated circuitry. For example, the sensor module 176, the camera module 180, or the antenna module 197 may be embodied in a single component (e.g., embedded in the display module 160). 【0017】 The processor 120 controls at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120 by executing software (e.g., program 140), and performs various data processing or calculations. As part of the data processing or calculations, the processor 120 loads instructions or data received from other components (e.g., sensor module 176 or communication module 190) into volatile memory 132, processes the instructions or data stored in volatile memory 132, and stores the resulting data in non-volatile memory 134. The processor 120 includes a main processor 121 (e.g., a central processing unit (CPU) or application processor (AP)), or auxiliary processors 123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor hub processor, or communication processor (CP)) that can operate independently or together. Additionally or alternatively, the auxiliary processor 123 may be configured to use less power than the main processor 121 or to specialize in a specified function. The auxiliary processor 123 may be implemented separately from or as part of the main processor 121. 【0018】 The auxiliary processor 123 controls, for example, a portion of the functions or states related to at least one component of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) on behalf of the main processor 121 when the main processor 121 is inactive (e.g., in sleep mode), or together with the main processor 121 when the main processor 121 is active (e.g., running an application). The auxiliary processor 123 (e.g., the image signal processor ISP or the communication processor CP) is embodied as part of other functionally related components (e.g., the camera module 180 or the communication module 190). According to one embodiment of the present invention, the auxiliary processor 123 (e.g., the neural network processing device) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models are generated through machine learning. Such learning may be performed, for example, on the electronic device 101 itself on which the artificial intelligence model is run, or through a separate server (e.g., server 108). Learning algorithms include, but are not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. Artificial intelligence models include multiple artificial neural network layers. Artificial neural networks include, but are not limited to, deep neural networks (DNN), convolutional neural networks (CNN), recurrent neural networks (RNN), restricted Boltzmann machines (RBM), deep belief networks (DBN), bidirectional recurrent deep neural networks (BRDNN), deep Q-networks, or a combination of two or more of the above.Artificial intelligence models may include a software structure in addition to, or instead of, a hardware structure. 【0019】 Memory 130 stores various data used by at least one component of the electronic device 101 (e.g., processor 120 or sensor module 176). The data includes, for example, software (e.g., program 140) and input or output data for instructions relating thereto. Memory 130 includes volatile memory 132 and / or non-volatile memory 134. 【0020】 Program 140 is stored as software in memory 130 and includes, for example, an operating system (OS) 142, middleware 144, and / or an application 146. 【0021】 The input module 150 receives components of the electronic device 101 (e.g., instructions or data used by the processor 120) from outside the electronic device 101 (e.g., a user). The input module 150 includes, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or a digital pen (e.g., a stylus pen). The input module 150 includes, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or a digital pen (e.g., a stylus pen). 【0022】 The acoustic output module 155 outputs an acoustic signal to the outside of the electronic device 101. The acoustic output module 155 includes, for example, a speaker or a receiver. The speaker is used for general purposes such as multimedia playback or recording and playback, and the receiver is used to receive incoming phone calls. The receiver is implemented separately from or as part of the speaker. 【0023】 The display module 160 provides information visually to an external party (e.g., a user) outside of the electronic device 101. The display module 160 includes, for example, a display, a hologram device, or a projector and a control circuit for controlling said device. The display module 160 includes a touch circuit (e.g., a touch sensor) configured to detect touches, or a sensor circuit (e.g., a pressure sensor) configured to measure the intensity of the force generated by a touch. 【0024】 The audio module 170 converts sound into an electrical signal, or conversely, converts an electrical signal into sound. The audio module 170 can acquire sound via the input module 150, or output sound via the acoustic output module 155, or via an external electronic device (e.g., electronic device 102 (e.g., speaker or headphones)) directly or wirelessly connected to the electronic device 101. 【0025】 The sensor module 176 detects the operating state of the electronic device 101 (e.g., power or temperature) or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. The sensor module 176 includes, for example, a gesture sensor, gyroscope, barometric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, IR (infrared) sensor, biosensor, temperature sensor, humidity sensor, or illuminance sensor. 【0026】 Interface 177 supports one or more designated protocols used for the electronic device 101 to connect directly or wirelessly to an external electronic device (e.g., an external electronic device 102). Interface 177 includes, for example, HDMI® (High Definition Multimedia Interface), USB (Universal Serial Bus) interface, SD Card® interface, and / or audio interface. 【0027】 The connecting terminal 178 includes a connector through which the electronic device 101 is physically connected to an external electronic device (e.g., an external electronic device 102). The connecting terminal 178 includes, for example, an HDMI® connector, a USB connector, an SD card® connector, and / or an audio connector (e.g., a headphone connector). 【0028】 The haptic module 179 converts electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that the user can perceive through touch or kinesthetic sense. The haptic module 179 includes, for example, a motor, a piezoelectric element, or an electrical stimulator. 【0029】 The camera module 180 can capture still and moving images. The camera module 180 includes one or more lenses, an image sensor, an image signal processor (ISP), or a flash. 【0030】 The power management module 188 manages the power supplied to or consumed by the electronic device 101. The power management module 188 can be embodied, for example, as at least part of a PMIC (power management integrated circuit). 【0031】 The battery 189 supplies power to at least one component of the electronic device 101. The battery 189 includes, for example, a non-rechargeable primary battery, a rechargeable secondary battery, and / or a fuel battery. 【0032】 The communication module 190 supports the establishment of a direct (e.g., wired) or wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and the execution of communication through the established communication channel. The communication module 190 includes one or more communication processors (CP) that operate independently of the processor 120 (e.g., application processor (Ap)) and support direct (e.g., wired) or wireless communication. The communication module 190 also includes a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a GNSS (global navigation satellite system) communication module) or a wired communication module 194 (e.g., a LAN (local area network) communication module, or a power line communication module). The relevant communication module among these communication modules is either a first network 198 (for example, a short-range communication network such as Bluetooth®, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network 199 (for example, a legacy cellular network, 5G5 th The communication module can communicate with an external electronic device 104 via a long-range communication network such as a generation network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN). Many types of such communication modules may be integrated into a single component (e.g., a single chip) or each may be embodied in multiple separate components (e.g., multiple chips). The wireless communication module 192 verifies or authenticates the electronic device 101 within a communication network such as the first network 198 or the second network 199 using subscriber information (e.g., an International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (SIM) 196. 【0033】 The wireless communication module 192 is 4G (4 thThe 5G network and next-generation communication technologies, such as NR (new radio access) technology, are supported. NR technology supports high-speed transmission of high-capacity data (i.e., eMBB (enhanced mobile broadband)), minimization of terminal power and connection of many terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module 192 supports high-frequency bands (e.g., mmWave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 supports various technologies to ensure performance in high-frequency bands, such as beamforming, massive array multiplexing and multiple-output (massive MIMO (multiple-input and multiple-output)), full-dimensional MIMO (FD-MIMO) (full-dimensional MIMO), array antennas, analog beamforming, or large-scale antennas. It supports technologies such as antenna. The wireless communication module 192 supports various requirements specified by the electronic device 101, external electronic devices (e.g., electronic device 104) or network system (e.g., second network 199). According to one embodiment of the present invention, the wireless communication module 192 supports a peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip of 1 ms or less) for URLLC realization. 【0034】 The antenna module 197 transmits or receives signals or power to or from an external source (e.g., an external electronic device). The antenna module 197 includes an antenna which includes a radiator which includes a conductor or conductive pattern formed on a substrate (e.g., a PCB (printed circuit board)). The antenna module 197 includes a plurality of antennas (e.g., an antenna array). In such a case, at least one antenna which is compatible with the communication scheme used in a communication network such as a first network 198 or a second network 199 is selected from the plurality of antennas, for example by the communication module 190. Signals or power are transmitted or received between the communication module 190 and an external electronic device via the selected at least one antenna. In addition to the radiator, other components (e.g., an RFIC (radio frequency integrated circuit)) may be additionally formed as part of the antenna module 197. 【0035】 According to various embodiments of the present invention, the antenna module 197 forms an mmWave antenna module. According to one embodiment of the present invention, the mmWave antenna module includes a printed circuit board (PCB), an RFIC disposed on or adjacent to a first surface (e.g., the bottom surface) of the printed circuit board and capable of supporting a specified high-frequency band (e.g., the mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., the top or side surface) of the printed circuit board and capable of transmitting or receiving signals in the specified high-frequency band. 【0036】 At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) to exchange signals (e.g., instructions or data) with each other. 【0037】 Commands or data are transmitted or received between the electronic device 101 and external electronic devices 104 via a server 108 connected to the second network 199. Each of the external electronic devices (102 or 104) is of the same or different type as the electronic device 101. All or part of the operations performed by the electronic device 101 are performed by one or more external electronic devices, either the external electronic devices (102, 104) or the server 108. For example, if the electronic device 101 must perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 may, instead of performing the function or service itself, or additionally, request one or more external electronic devices to perform at least part of that function or service. One or more external electronic devices that receive the request perform at least part of the requested function or service, or additional functions or services related to the request, and communicate the result of the execution to the electronic device 101. The electronic device 101 processes the result as is or additionally and provides it as at least part of the response to the request. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing are used. The electronic device 101 provides an ultra-low latency service using, for example, distributed computing or mobile edge computing (MEC). In another embodiment of the present invention, the external electronic device 104 includes an IoT (Internet of Things) device. The server 108 may be an intelligent server using machine learning and / or a neural network. According to one embodiment of the present invention, the external electronic device 104 or the server 108 is included within the second network 199. The electronic device 101 is applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technologies. 【0038】 The electronic devices disclosed herein in various embodiments can take on a variety of forms. These electronic devices include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. However, the electronic devices are not limited to those described above. 【0039】 The various embodiments of the present invention and the terminology used herein are not limited to any particular embodiment of the technical features described herein. In the description of the drawings, similar or related components are given similar reference numerals. The singular form of a noun corresponding to an item may include one or more items unless the context clearly indicates otherwise. In this specification, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” includes any one of the items listed together in the applicable phrase, or any possible combination thereof. Terms such as “first,” “second,” or “first” or “second” are used simply to distinguish one component from other such components and do not limit the component in other aspects (e.g., importance or procedure). When one element (e.g., the first component) is referred to as "coupled" or "connected" with or without the terms "functionally" or "communically," it means that the elements are connected to each other directly (e.g., by wire), wirelessly, or via the third component. 【0040】 The term “module” includes units embodied in hardware, software, or firmware, and is used interchangeably with terms such as logic, logic block, component, or circuit. A module is the smallest unit or part thereof of a component that is composed of a whole or performs one or more functions. For example, according to one embodiment of the present invention, a module may be embodied in the form of an ASIC (application-specific integrated circuit). 【0041】 An embodiment of the present invention may be embodied as software (e.g., program 140) comprising one or more instruction words stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, the processor (e.g., processor 120) of the machine (e.g., electronic device 101) invokes and executes at least one of the one or more instruction words stored in the storage medium. This enables the machine to be operated to perform at least one function according to the invoked at least one instruction word. The one or more instruction words include code generated by a compiler or code executed by an interpreter. The storage medium readable by the machine is provided in the form of a non-transitory storage medium, where "non-transitory" simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily. 【0042】 A method according to one embodiment of the present invention is provided in a computer program product. The computer program product is traded as a commodity between a seller and a buyer. The computer program product is distributed in the form of a device-readable storage medium (e.g., compace disc read-only memory, CD-ROM) or through an application store (e.g., Play Store). TM It is distributed online (e.g., by download or upload) via a network or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product is at least temporarily stored or temporarily generated on a storage medium that can be read by equipment such as the memory of the manufacturer's server, the application store's server, or an intermediary server. 【0043】 Each of the components described above (e.g., a module or a program) may include one or more individuals. One or more components or operations of such components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be merged into a single component. In this case, the merged component may perform one or more functions of each component of the multiple components in the same or similar manner as those performed by the component in the multiple components before the merger. Operations performed by modules, programs, or other components may be performed sequentially, in parallel, iteratively, or heuristically, or one or more of the above operations may be performed in a different order, omitted, or one or more other operations may be added. 【0044】 Figure 2 shows the foldable electronic device 2 in an unfolded state (or flat state) according to one embodiment of the present invention. Figure 3 shows the foldable electronic device 2 in a folded state (or folding state) according to one embodiment of the present invention. Figure 4 is a cross-sectional view of the foldable electronic device 2 cut along line D-D' in Figure 2, according to one embodiment of the present invention. Figure 5 shows the foldable electronic device 2 in an unfolded state according to one embodiment of the present invention. 【0045】 Referring to Figures 2 to 5, the foldable electronic device 2 includes a foldable housing 20, a first display module (e.g., a flexible display module or a foldable display module) 25, a second display module 26, a first camera module 301, a second camera module 302, a third camera module 303, a fourth camera module 304, a fifth camera module 305, a light-emitting module 306, a sensor module 307, a first acoustic input module (not shown), a second acoustic input module (not shown), a third acoustic input module (not shown), a fourth acoustic input module (not shown), a first acoustic output module (not shown), a second acoustic output module (not shown), a third acoustic output module (not shown), a key input module, a first coupling terminal 311, and / or a second coupling terminal 312. 【0046】 According to one embodiment, the foldable housing 20 includes a first housing (or first housing part or first housing structure) 21, a second housing (or second housing part or second housing structure) 22, a hinge housing 23, and / or a hinge part 24. The first housing 21 and the second housing 22 are connected through the hinge part 24 and are rotatable relative to each other with respect to the hinge part 24. The hinge part 24 includes one or more hinge modules (or hinge assemblies) (for example, the first hinge module 241, the second hinge module 242, and / or the third hinge module 243 in Figure 3). 【0047】 According to one embodiment, the first display module 25 includes a display area 250. The display area 250 includes a first display area 251, a second display area 252, and a third display area 253 connecting the first display area 251 and the second display area 252 (or between the first display area 251 and the second display area 252). A first screen area (or first active area) on which an image can be displayed is provided through the first display area 251. A second screen area (or second active area) on which an image can be displayed is provided through the second display area 252. A third screen area (or third active area) on which an image can be displayed is provided through the third display area 253. 【0048】 According to one embodiment, the first display area 251 is located corresponding to the first housing 21. The second display area 252 is located corresponding to the second housing 22. The third display area 253 is located corresponding to the hinge portion 24. The first display area 251 is positioned on the first housing 21, and the shape of the first display area 251 is maintained by the support of the first housing 21. The second display area 252 is positioned on the second housing 22, and the shape of the second display area 252 is maintained by the support of the second housing 22. The first display area 251 and the second display area 252 are provided, for example, substantially flat. The unfolded state of the foldable electronic device 2 is the state in which the third display area 253 is positioned substantially flat. In the unfolded state of the foldable electronic device 2, the first display area 251 and the second display area 252 are at an angle of approximately 180° to each other, and the display area 250 is provided (or positioned) in a substantially planar form. In the unfolded state of the foldable electronic device 2, the third display area 253 is positioned flat due to the relative positions of the first display area 251 located in the first housing 21 and the second display area 252 located in the second housing 22. In the unfolded state of the foldable electronic device 2, the third display area 253 is pulled from both sides by the first display area 251 and the second display area 252, and the pulling force is provided to reduce damage to the third display area 253 while positioning it flat. The third display area 253 is provided with an extended width such that, in the unfolded state of the foldable electronic device 2, it is pulled and laid flat by the first display area 251 and the second display area 252, reducing stress. 【0049】 According to one embodiment, in the unfolded state of the foldable electronic device 2, the hinge portion 24 supports the third display area 253 of the first display module 25. When an external force (for example, external pressure such as touch input using a user's finger or touch input using an electronic pen) is applied to the third display area 253 in the unfolded state of the foldable electronic device 2, the hinge portion 24 reduces the sagging phenomenon of the third display area 253 and contributes to keeping the third display area 253 flat. When an external impact is applied to the foldable electronic device 2 in the unfolded state for reasons such as dropping, the hinge portion 24 is configured to reduce the effect of the external impact on the third display area 253. The hinge portion 24 supports the third display area 253 so that it is positioned flat with no sagging or reduced sagging in the unfolded state of the foldable electronic device 2, and reduces the crease phenomenon. 【0050】 According to one embodiment, the display area 250 of the first display module 25 substantially provides the “front” of the appearance of the foldable electronic device 2. The front of the foldable electronic device 2 includes a first front area provided by the first display area 251, a second front area provided by the second display area 252, and a third front area provided by the third display area 253. The illustrated coordinate axes are shown with respect to the first housing 21, and the +z axis direction is defined or interpreted as the direction in which the substantially flat first front area faces. In the unfolded state of the foldable electronic device 2, the front of the foldable electronic device 2 is provided as substantially planar. 【0051】 According to one embodiment, the foldable electronic device 2 is implemented as an infolding device in which the display area 250 of the first display module 25 (or the front surface of the foldable electronic device 2 from which the display area 250 is visually visible) is folded inward. Figure 3 shows the fully folded state of the foldable electronic device 2, with the first housing 21 and the second housing 22 positioned so as not to be folded any further. In the fully folded state of the foldable electronic device 2, the first display area 251 and the second display area 252 (or the first front surface area and the second front surface area) face each other. In the fully folded state of the foldable electronic device 2, the third display area 253 is positioned in a bent form. In the fully folded state of the foldable electronic device 2, the angle between the first housing 21 and the second housing 22 (or the angle between the first display area 251 and the second display area 252, or the angle between the first front area and the second front area) is approximately 0° to approximately 10°, and the display area 250 is substantially invisible. Although not shown separately, the intermediate state of the foldable electronic device 2 is a state between the unfolded state and the fully folded state. When the angle between the first housing 21 and the second housing 22 is greater than or equal to either of these angles in the intermediate state, a user environment is provided in which there is virtually no difficulty for the user to use the display area 250. Hereinafter, "folded state of the foldable electronic device 2" as described herein means the fully folded state as opposed to the intermediate state, which is a state in which the device is not fully folded. 【0052】 According to one embodiment, when viewing the unfolded state of the foldable electronic device 2, the display area 250 of the first display module 25 is provided in a symmetrical manner with respect to the center line A of the foldable electronic device 2. When viewing the unfolded state of the foldable electronic device 2, the center line A of the foldable electronic device 2 corresponds to the midpoint of the width extended from the first boundary between the first display area 251 and the third display area 253 to the second boundary between the second display area 251 and the third display area 253. The illustrated +x coordinate axis is substantially perpendicular to the center line A, and the illustrated +y coordinate axis is substantially parallel to the center line A. Of the front surface of the foldable electronic device 2 provided by the first display area 251, the first front surface area provided by the first display area 251 is substantially parallel to the xy plane. 【0053】 According to one embodiment, the third display area 253, which is arranged in a folded form when the foldable electronic device 2 is folded, is substantially symmetrical with respect to the center line A of the foldable electronic device 2. 【0054】 According to one embodiment, when the foldable electronic device 2 is viewed in its unfolded state, the display area 250 of the first display module 25 is substantially rectangular. 【0055】 According to one embodiment, the first housing 21 includes a first frame (or first frame structure or first framework) 211 and a first cover 212 disposed on (or coupled to) the first frame 211. The combination of the first frame 211 and the first cover 212 provides a "first rear region" and a "first side region" of the appearance of the foldable electronic device 2. The first frame 211 provides at least a portion of the first side region of the foldable electronic device 2. The first cover 212 provides at least a portion of the first rear region of the foldable electronic device 2. The first rear region faces away from the first front region of the foldable electronic device 2 provided by the first display region 251 of the first display module 25. 【0056】 According to one embodiment, the first frame 211 includes a first side (or first side portion, first side member, first side structure, or first side bezel structure) 2112. The first side 2112 surrounds at least a portion of the space between the first display area 251 and the first cover 212, and provides at least a portion of the first side area of ​​the foldable electronic device 2. 【0057】 According to one embodiment, the first frame 211 includes a first support portion (or first support plate) 2111 that extends from or is connected to the first side 2112. The first support portion 2111 is a structural element located inside the foldable electronic device 2, corresponding to the first housing 21, and is referred to by other terms such as "first bracket," "first support," "first support member," or "first support structure." 【0058】 According to one embodiment, the first frame 211 is provided as an integrated or single structure (e.g., a single continuous structure or a complete structure) including a first support portion 2111 and a first side 2112. 【0059】 According to one embodiment, at least a portion of the first support portion 2111 is located between the first display area 251 and the first cover 212. The first display area 251 is positioned on the first support portion 2111, and the first support portion 2111 supports the first display area 251. 【0060】 According to one embodiment, various electrical components (not shown), such as a printed circuit board or a battery, are arranged at least partially on the first support portion 2111 of the first frame 211 between the first frame 211 and the first cover 212. 【0061】 According to one embodiment, the second housing 22 includes a second frame (or second frame structure or second framework) 221 and / or a second cover 222 disposed on the second frame 221. The combination of the second frame 221 and the second cover 222 provides a "second rear region" and a "second side region" of the appearance of the foldable electronic device 2. The second frame 221 provides at least a portion of the second side region of the foldable electronic device 2. The second cover 222 provides at least a portion of the second rear region of the foldable electronic device 2. The second rear region faces away from the second front region of the foldable electronic device 2 provided by the second display region 252. 【0062】 According to one embodiment, the second frame 221 includes a second side (or second side portion, second side member, second side structure, or second side bezel structure) 2212. The second side 2212 surrounds at least a portion of the space between the second display area 252 and the second cover 222, providing at least a portion of the second side area of ​​the foldable electronic device 2. 【0063】 According to one embodiment, the second frame 221 includes a second support portion (or second support plate) 2211 that extends from or is connected to the second side 2212. The second support portion 2211 is a structural element located inside the foldable electronic device 2, corresponding to the second housing 22, and is referred to by other terms such as "second bracket," "second support," "second support member," or "second support structure." 【0064】 According to one embodiment, the second frame 221 is provided as an integrated or single structure (e.g., a single continuous structure or a complete structure) including the second support portion 2211 and the second side 2212. 【0065】 According to one embodiment, at least a portion of the second support portion 2211 is located between the second display area 252 and the second cover 222. The second display area 252 is positioned on the second support portion 2211, and the second support portion 2211 supports the second display area 252. 【0066】 According to one embodiment, various electrical components (not shown), such as a printed circuit board or a battery, are positioned between the second frame 221 and the second cover 222, with at least a portion of them located on the second support portion 2211 of the second frame 221. 【0067】 According to one embodiment, the first side 2112 of the first frame 211 includes a first edge B1, a second edge B2, a third edge B3, and / or a fourth edge B4. The first edge B1 extends in a direction perpendicular to the centerline A of the foldable electronic device 2. The third edge B3 moves away from the first edge B1 in the direction of the centerline A of the foldable electronic device 2 and is substantially parallel to the first edge B1. The second edge B2 connects one end of the first edge B1 to one end of the third edge B3. The fourth edge B4 connects the other end of the first edge B1 to the other end of the third edge B3. The second edge B2 and the fourth edge B4 are substantially parallel. The fourth edge B4 is located closer to the centerline A of the foldable electronic device 2 than the second edge B2. 【0068】 According to one embodiment, the first corner C1 connecting the first edge B1 and the second edge B2, and / or the second corner C2 connecting the second edge B2 and the third edge B3, are provided (or formed) as a smooth curved shape. 【0069】 According to one embodiment, when viewed from above the first cover 212, the first edge B1, the second edge B2, the third edge B3, and the fourth edge B4 surround the first cover 112. 【0070】 According to one embodiment, the second side 2212 of the second frame 221 includes a fifth edge B5, a sixth edge B6, a seventh edge B7, and / or an eighth edge B8. The fifth edge B5 extends in a direction perpendicular to the centerline A of the foldable electronic device 2. The seventh edge B7 moves away from the fifth edge B5 in the direction of the centerline A of the foldable electronic device 2 and is substantially parallel to the fifth edge B5. The sixth edge B6 connects one end of the fifth edge B5 to one end of the seventh edge B7. The eighth edge B8 connects the other end of the fifth edge B5 to the other end of the seventh edge B7. The sixth edge B6 and the eighth edge B8 are substantially parallel. The eighth edge B8 is located closer to the centerline A of the foldable electronic device 2 than the sixth edge B6. 【0071】 According to one embodiment, the third corner C3 connecting the fifth edge B5 and the sixth edge B6, and / or the fourth corner C4 connecting the sixth edge B6 and the seventh edge B7, are provided (or formed) as a smooth curved shape. 【0072】 According to one embodiment, when viewed from above the second cover 222, the fifth edge B5, the sixth edge B6, the seventh edge B7, and the eighth edge B8 surround the second cover 222. 【0073】 According to one embodiment, in the folded state of the foldable electronic device 2, the first side 2112 of the first frame 211 and the second side 2212 of the second frame 221 are aligned and overlap. In the folded state of the foldable electronic device 2, the first edge B1 and the fifth edge B5 are aligned and overlap. In the folded state of the foldable electronic device 2, the second edge B2 and the sixth edge B6 are aligned and overlap. In the folded state of the foldable electronic device 2, the third edge B3 and the seventh edge B7 are aligned and overlap. 【0074】 According to one embodiment, the fourth edge B4 and the eighth edge B8 are located on the opposite side of the third display area 253. When viewed from above the front of the unfolded foldable electronic device 2, the fourth edge B4 and the eighth edge B8 are not visible. For example, when viewing the unfolded foldable electronic device 2, the surface area provided by the substantially flattened third display area 253 of the exterior of the foldable electronic device 2 is oriented in the +z-axis direction, while the surface areas provided by the fourth edge B4 and the eighth edge B8 of the exterior of the foldable electronic device 2 are oriented in the -z-axis direction on the opposite side of the surface area provided by the third display area 253. 【0075】 According to one embodiment, the hinge housing (or hinge cover) 23 is connected to one or more hinge modules (for example, a first hinge module 241, a second hinge module 242, and a third hinge module 243). One or more hinge modules connect the first support portion 2111 of the first frame 211 and the second support portion 2211 of the second frame 221. 【0076】 According to one embodiment, when the foldable electronic device 2 switches from an unfolded state to a folded state, a gap opens between the first frame 211 and the second frame 221 on the opposite side of the third display area 253 due to a change in the relative position of the first frame 211 and the second frame 221, which are connected to each other through the hinge portion 24, and a change in the state of the hinge portion 24 coupled to the hinge housing 23. The hinge housing 23 is exposed to the outside through the opened gap. In the folded state of the foldable electronic device 2, the hinge housing 23 is exposed to the outside through the opened gap between the fourth edge B4 and the eighth edge B8. The hinge housing 23 is more exposed in the folded state of the foldable electronic device 2 than in the intermediate state of the foldable electronic device 2. In the folded state of the foldable electronic device 2, the hinge housing 23 becomes part of the exterior covering the inside of the foldable electronic device 2. In the folded state of the foldable electronic device 2, the side of the foldable electronic device 2 includes a first side region provided by the first side 2112 of the first frame 211, a second side region provided by the second side 2212 of the second frame 221, and a third side region provided by the hinge housing 23. 【0077】 According to one embodiment, when the foldable electronic device 2 switches from a folded state to an unfolded state, the gap between the first frame 211 and the second frame 221 on the opposite side of the third display area 253 is closed due to a change in the relative position of the first frame 211 and the second frame 221, which are connected to each other through the hinge portion 24, and a change in the state of the hinge portion 24 coupled to the hinge housing 23. The hinge housing 23 is not exposed to the outside. In the unfolded state of the foldable electronic device 2, the gap between the fourth edge B4 and the eighth edge B8 is closed, and the hinge housing 23 is not exposed to the outside. 【0078】 According to one embodiment, the first edge B1, the second edge B2, and the third edge B3 form a one-sided bezel (or screen bezel) that surrounds one side area of ​​the first display module 25 with respect to the center line A of the foldable electronic device 2. The fifth edge B5, the sixth edge B6, and the seventh edge B7 form a other-sided bezel (or screen bezel) that surrounds the other side area of ​​the first display module 25 with respect to the center line A of the foldable electronic device 2. 【0079】 According to one embodiment, the first frame 211 and / or the second frame 221 are provided as a combination of a conductor (or metal body) (not shown) including one or more conductive portions and a non-conductor (or non-metal body) (not shown) including one or more non-conductive portions. 【0080】 According to one embodiment, the first side 2112 of the first frame 211 includes a first side metal (or a first side metal structure, a first side conductor, a first side conductive structure, a first outer metal structure, a first outer conductor, a first outer conductive structure, a first side metal, a first side metal structure, a first side conductor, or a first side conductive structure) 2112E (see Figure 5) and a first side non-metal (or a first side non-metal structure, a first side non-conductor, a first side non-conductive structure, a first outer non-metal structure, a first outer non-conductor, a first outer non-conductive structure, a first side non-metal, a first side non-metal structure, a first side non-conductor, or a first side non-conductive structure). 【0081】 According to one embodiment, the first side metal 2112E (see Figure 5) of the first side 2112 includes a plurality of metals (or outer metal, outer conductive part, or side conductive part) (E1, E2, E3, E4, E5, E6). The plurality of metals (E1, E2, E3, E4, E5, E6) of the first side metal 2112E include, for example, a first metal E1, a second metal E2, a third metal E3, a fourth metal E4, a fifth metal E5, and / or a sixth metal E6. 【0082】 According to one embodiment, the first metal E1 is located between the second metal E2 and the sixth metal E6. The first metal E1 extends from one end adjacent to the second metal E2 to the other end adjacent to the sixth metal E6. The first metal E1 provides (or forms) a portion of the first edge B1. 【0083】 According to one embodiment, the second metal E2 is located between the first metal E1 and the third metal E3. The second metal E2 extends from one end adjacent to the first metal E1 to the other end adjacent to the third metal E3. The second metal E2 provides (or forms) a first corner C1, a portion of the first edge B1 extending from the first corner C1, and a portion of the second edge B2 extending from the first corner C1. 【0084】 According to one embodiment, the third metal E3 is located between the second metal E2 and the fourth metal E4. The third metal E3 extends from one end adjacent to the second metal E2 to the other end adjacent to the fourth metal E4. The third metal E3 provides (or forms) a portion of the second edge B2. 【0085】 According to one embodiment, the fourth metal E4 is located between the third metal E3 and the fifth metal E5. The fourth metal E4 extends from one end adjacent to the third metal E3 to the other end adjacent to the fifth metal E5. The fourth metal E4 provides (or forms) a second corner C2, a portion of the second edge B2 extending from the second corner C2, and a portion of the third edge B3 extending from the second corner C2. 【0086】 According to one embodiment, the fifth metal E5 is located between the fourth metal E4 and the sixth metal E6. The fifth metal E5 extends from one end adjacent to the fourth metal E4 to the other end adjacent to the sixth metal E6. The fifth metal E5 provides (or forms) a portion of the TE3 edge B3. 【0087】 According to one embodiment, the sixth metal E6 is located between the fifth metal E5 and the first metal E1. The sixth metal E6 extends from one end adjacent to the fifth metal E5 to the other end adjacent to the first metal E1. The sixth metal E6 provides (or forms) the fourth edge B4, a portion of the first edge B1 extended from one end of the fourth edge B4, and a portion of the third edge B3 extended from the other end of the fourth edge B4. 【0088】 According to one embodiment, the first side nonmetal 2112F (see Figure 5) of the first side 2112 includes a plurality of nonmetals (or outer nonmetal, outer nonconductive portion, or side nonconductive portion) (F1, F2, F3, F4, F5, F6). The plurality of nonmetals (F1, F2, F3, F4, F5, F6) of the first side nonmetal 2112F include, for example, a first nonmetal F1, a second nonmetal F2, a third nonmetal F3, a fourth nonmetal F4, a fifth nonmetal F5, and / or a sixth nonmetal F6. 【0089】 According to one embodiment, a first non-metal F1 (e.g., a first insulating portion) is positioned in a first segment (e.g., a first gap) between a first metal E1 and a second metal E2. The first metal E1 and the second metal E2 are physically separated from each other by the first non-metal F1. The first non-metal F1 provides (or forms) a portion of the first edge B1. 【0090】 According to one embodiment, the second non-metal F2 (e.g., the second insulating portion) is positioned in the second segment (e.g., the second gap) between the second metal E2 and the third metal E3. The second metal E2 and the third metal E3 are physically separated from each other by the second non-metal F2. The second non-metal F2 provides (or forms) a portion of the second edge B2. 【0091】 According to one embodiment, the third non-metal F3 (e.g., the third insulating portion) is positioned in the third segment (e.g., the third gap) between the third metal E3 and the fourth metal E4. The third metal E3 and the fourth metal E4 are physically separated from each other by the third non-metal F3. The third non-metal F3 provides (or forms) a portion of the second edge B2. 【0092】 According to one embodiment, the fourth non-metal F4 (e.g., the fourth insulating portion) is positioned in the fourth segment (e.g., the fourth gap) between the fourth metal E4 and the fifth metal E5. The fourth metal E4 and the fifth metal E5 are physically separated from each other by the fourth non-metal F4. The fourth non-metal F4 provides (or forms) a portion of the third edge B3. 【0093】 According to one embodiment, the fifth non-metal F5 (e.g., the fifth insulating portion) is located in the fifth segment (e.g., the fifth gap) between the fifth metal E5 and the sixth metal E6. The fifth metal E5 and the sixth metal E6 are physically separated from each other by the fifth non-metal F5. The fifth non-metal F5 provides (or forms) a portion of the third edge B3. 【0094】 According to one embodiment, the sixth non-metal F6 (e.g., the sixth insulating portion) is positioned in the sixth segment (e.g., the sixth gap) between the sixth metal E6 and the first metal E1. The sixth metal E6 and the first metal E1 are physically separated from each other by the sixth non-metal F6. The sixth non-metal F6 provides (or forms) a portion of the first edge B1. 【0095】 According to various embodiments, although not shown separately, the number, position, and / or form of the multiple metals and / or multiple non-metals included in the first side 2112 may vary and are not limited to the illustrated examples. 【0096】 According to one embodiment, the first support portion 2111 of the first frame 211 is provided (or formed) by a combination of a first inner metal (not shown) and a first inner non-metal (not shown). The first inner metal includes a combination of one or more conductive portions. The first inner non-metal includes a combination of one or more non-conductive portions. A portion of the surface area of ​​the first support portion 2111 includes a conductive surface area provided by the first inner metal, and another portion of the surface area of ​​the first support portion 2111 includes a non-conductive surface area provided by the first inner non-metal. 【0097】 According to one embodiment, the first inner metal (not shown) of the first support portion 2111 is connected to the first side metal 2112E of the first side 2112. For example, the first metallic substance contained in the first inner metal of the first support portion 2111 is the same as or different from the second metallic substance contained in the first side metal 2112E. 【0098】 According to one embodiment, an integrated or single metal (or metal structure) (e.g., a single continuous structure or a complete structure) is provided (or formed) including a first inner metal (not shown) of the first support portion 2111 and a first side metal 2112E of the first side 2112. 【0099】 According to one embodiment, the first inner nonmetal (not shown) of the first support portion 2111 is connected to the first side nonmetal 2112F of the first side 2112. For example, the first nonmetallic substance contained in the first inner nonmetal is the same as or different from the second nonmetallic substance contained in the first side nonmetal F. 【0100】 According to one embodiment, an integrated or single nonmetal (or nonmetal structure) (e.g., a single continuous structure or a complete structure) is provided (or formed) including a first inner nonmetal (not shown) of the first support portion 2111 and a first side nonmetal 2112F of the first side 2112. 【0101】 According to one embodiment, the second side 2212 of the second frame 221 includes a second side metal 2212E comprising a plurality of metals (E7, E8, E9, E10, E11, E12) and a second side non-metal 2212F comprising a plurality of non-metals (F7, F8, F9, F10, F11, F12). The plurality of metals (E7, E8, E9, E10, E11, E12) of the second side metal 2212E include, for example, a seventh metal E7, an eighth metal E8, a ninth metal E9, a tenth metal E10, an eleventh metal E11, and / or a twelfth metal E12. The multiple non-metallic elements (F7, F8, F9, F10, F11, F12) of the second side non-metallic 2212F include, for example, the seventh non-metallic F7, the eighth non-metallic F8, the ninth non-metallic F9, the tenth non-metallic F10, the eleventh non-metallic F11, and / or the twelfth non-metallic F12. 【0102】 According to one embodiment, in the folded state of the foldable electronic device 2, the first side metal 2112E included in the first side 2112 of the first frame 211 and the second side metal 2212E included in the second side 2212 of the second frame 221 are aligned and overlap. For example, in the folded state of the foldable electronic device 2, the multiple metals (E1, E2, E3, E4, E5, E6) included in the first side 2112 and the multiple metals (E7, E8, E9, E10, E11, E12) included in the second side 2212 are aligned and overlap in a corresponding manner. 【0103】 According to one embodiment, in the folded state of the foldable electronic device 2, the first side non-metal 2112F included in the first side 2112 of the first frame 211 and the second side non-metal 2212F included in the second side 2212 of the second frame 221 are aligned and overlap. For example, in the folded state of the foldable electronic device 2, the multiple non-metal components (F1, F2, F3, F4, F5, F6) included in the first side 2112 and the multiple non-metal components (F7, F8, F9, F10, F11, F12) included in the second side 2212 are aligned and overlap in a corresponding manner. 【0104】 According to one embodiment, the second support portion 2211 of the second frame 221 is embodied in a manner that is at least partially identical or similar to the first support portion 2111 of the first frame 211. The second support portion 2211 is provided (or formed) by a combination of a second inner metal (not shown) and a second inner non-metal (not shown). 【0105】 According to one embodiment, the foldable electronic device 2 includes a ground structure (not shown). The ground structure reduces or prevents electromagnetic interference (EMI) to a plurality of electrical elements included in the foldable electronic device 2. The ground structure of the foldable electronic device 2 reduces or prevents electromagnetic effects of noise from outside the foldable electronic device 2 on the plurality of electrical elements included in the foldable electronic device 2. The ground structure of the foldable electronic device 2 reduces or prevents electromagnetic interference between the electrical elements included in the foldable electronic device 2. The ground structure of the foldable electronic device 2 includes, for example, a combination of a plurality of conductors that are electrically and / or physically connected to one another. 【0106】 According to one embodiment, the ground structure of the foldable electronic device 2 includes a first inner metal (not shown) of the first support portion 2111 and a second inner metal (not shown) of the second support portion 2211. 【0107】 According to one embodiment, the ground structure of the foldable electronic device 2 includes at least one ground plane contained in at least one printed circuit board (not shown) located on the first support portion 2111. The first inner metal (not shown) of the first support portion 2111 is electrically connected to the at least one ground plane contained in the at least one printed circuit board (not shown) through at least one flexible conductor (or flexible conductive portion or flexible conductive member) (not shown) located between the first inner metal (not shown) of the first support portion 2111 and the at least one printed circuit board (not shown) located on the first support portion 2111. The flexible conductor includes, for example, a conductive clip (e.g., a conductive structure including an elastic structure), a pogo pin, a spring, a conductive poron, a conductive sponge, a conductive rubber, a conductive tape, or a conductive connector. 【0108】 According to one embodiment, the ground structure of the foldable electronic device 2 includes at least one ground plane contained in at least one printed circuit board (not shown) located on the second support portion 2211. The second inner metal (not shown) of the second support portion 2211 is electrically connected to the at least one ground plane contained in the at least one printed circuit board through at least one flexible conductor located between the second inner metal (not shown) of the second support portion 2211 and the at least one printed circuit board (not shown) located on the second support portion 2211. 【0109】 According to one embodiment, the ground structure of the foldable electronic device 2 includes at least a portion of the first side metal E of the first side 2112. For example, a portion of the first side metal E is physically connected to a first inner metal (not shown) of the first support portion 2111. For example, a portion of the first side metal E is electrically connected to at least one ground plane included in at least one printed circuit board (not shown) through at least one flexible conductor located between the first side metal E and at least one printed circuit board (not shown) disposed on the first support portion 2111. 【0110】 According to one embodiment, the ground structure of the foldable electronic device 2 includes at least a portion of the second side metal (not shown) of the second side 2212. For example, a portion of the second side metal is physically connected to the second inner metal (not shown) of the second support portion 2211. For example, a portion of the second side metal is electrically connected to at least one ground plane included in the at least one printed circuit board (not shown) through at least one flexible conductor located between the second side metal and at least one printed circuit board (not shown) disposed on the second support portion 2211. 【0111】 According to one embodiment, the ground structure of the foldable electronic device 2 includes at least one conductive layer (e.g., an electromagnetic shielding metal sheet such as a copper sheet) (not shown) included in the first display module 25. For example, at least one conductive layer included in the first display module 25 is electrically connected to a first inner metal (not shown) of the first support portion 2111 through a first conductive member located between the first display module 25 and the first support portion 2111. For example, at least one conductive layer included in the first display module 25 is electrically connected to a second inner metal (not shown) of the second support portion 2211 through a second conductive member located between the first display module 25 and the second support portion 2211. The first conductive member and / or the second conductive member include a conductive adhesive (or conductive bonding material) or a flexible conductor (or flexible conductive part or flexible conductive member). 【0112】 According to one embodiment, the ground structure of the foldable electronic device 2 includes at least one conductive layer (e.g., an electromagnetic shielding metal sheet such as a copper sheet) (not shown) included in the second display module 26. For example, the at least one conductive layer included in the second display module 26 is electrically connected to a second inner metal (not shown) of the second support portion 2211 through a third conductive member located between the second display module 26 and the second support portion 2211. The third conductive member includes a conductive adhesive (or conductive bonding material) or a flexible conductor (or a flexible conductive part or flexible conductive member). 【0113】 According to various embodiments, the ground structure of the foldable electronic device 2 may further include various other conductors or metal bodies (not shown). 【0114】 According to one embodiment, at least one metal included in the first side 2112 and / or at least one metal included in the second side 2212 are electrically coupled to a wireless communication circuit (e.g., wireless communication module 192 in Figure 1) included in the foldable electronic device 2 and act as an antenna radiator. At least one metal included in the first side 2112 and / or at least one metal included in the second side 2212 are supplied (or fed) with a signal (e.g., an electromagnetic signal, a radio signal, an RF signal, or a radiated current) from the wireless communication circuit and radiate electromagnetic waves. 【0115】 According to one embodiment, the wireless communication circuit of the foldable electronic device 2 (for example, the wireless communication module 192 in Figure 1) is configured to transmit a signal of at least one selected or designated frequency band to the outside of the foldable electronic device 2 through at least one metal included in the first side 2112 and / or at least one metal included in the second side 2212. The wireless communication circuit is configured to receive a signal of at least one selected or designated frequency band from the outside of the foldable electronic device 2 through at least one metal included in the first side 2112 and / or at least one metal included in the second side 2212. 【0116】 According to one embodiment, the wireless communication circuit of the foldable electronic device 2 (e.g., the wireless communication module 192 in Figure 1) processes the transmit and / or receive signals in at least one selected or designated frequency band, which includes at least one of LB (low band) (approximately 600 MHz (megahertz) to approximately 1 GHz (gigahertz)), MB (middle band) (approximately 1 GHz to approximately 2.3 GHz), HB (high band) (approximately 2.3 GHz to approximately 2.7 GHz), or UHB (ultra-high band) (approximately 2.7 GHz to approximately 6 GHz). The selected or designated frequency band may include a variety of other frequency bands. 【0117】 According to one embodiment, when the foldable electronic device 2 is folded, the arrangement of multiple non-metallic elements (F1, F2, F3, F4, F5, F6, F7) included in the first side 2112 and multiple non-metallic elements included in the second side 2212 in a corresponding manner reduces the degradation of the antenna radiation performance when at least one metal included in the first side 2112 and / or at least one metal included in the second side 2212 are used as antenna radiators. 【0118】 According to one embodiment, the foldable electronic device 2 includes a first conductive region (not shown) and a second conductive region (not shown). The first conductive region and the second conductive region are electrically connected, or electrically and / or physically connected. According to various embodiments of the present invention, when the first conductive region is configured to substantially radiate electromagnetic waves, the first conductive region of the combination of the first and second conductive regions may be defined or interpreted as an antenna radiator, and the second conductive region of the combination of the first and second conductive regions may be defined or interpreted as a ground structure of the foldable electronic device 2 distinct from the antenna radiator. According to various embodiments of the present invention, when the first conductive region is configured to substantially radiate electromagnetic waves, the combination of the first and second conductive regions may be defined or interpreted as a ground structure of the foldable electronic device 2, and the first conductive region may be defined or interpreted as an antenna radiator embodied by a portion of the ground structure of the foldable electronic device 2. According to various embodiments of the present invention, when the first conductive region is configured to substantially radiate electromagnetic waves, the second conductive region may be configured as an antenna ground that electromagnetically influences the first conductive region (e.g., an antenna radiator). The antenna ground contributes to ensuring antenna radiation performance (or radio wave transmission / reception performance or communication performance) and / or coverage with respect to the antenna radiator. The antenna ground reduces electromagnetic interference (EMI) or signal loss with respect to the antenna radiator. 【0119】 According to one embodiment, a portion of the ground structure of the foldable electronic device 2 (not shown) acts as an antenna radiator. This portion of the ground structure of the foldable electronic device 2 is electrically connected to the wireless communication circuit of the foldable electronic device 2 (e.g., the wireless communication module 192 in Figure 1). This portion of the ground structure of the foldable electronic device 2 is supplied (or fed) with signals (e.g., electromagnetic signals, radio signals, RF signals, or radiated currents) from the wireless communication circuit and acts as an antenna radiator (or radiator, radiating part, or resonator). Various conductive parts (or conductors, conductive regions, or conductive patterns) configured to radiate electromagnetic waves are excluded from the definition or interpretation of the ground structure of the foldable electronic device 2. 【0120】 According to one embodiment, a portion (not shown) of the ground structure of the foldable electronic device 2 forms an antenna ground that electromagnetically influences at least one antenna radiator (not shown). 【0121】 According to one embodiment, the second display module 26 is located between the second cover 222 and the second support portion 2211 of the second frame 221. The second display module 26 is positioned on or coupled to the second cover 222 and / or the second support portion 2211. The display area of ​​the second display module 26 is visually visible through the second cover 222. 【0122】 According to one embodiment, the first camera module 301, the second camera module 302, the third camera module 303, the fourth camera module 304, and / or the fifth camera module 305 each include one or more lenses, an image sensor, and / or an image signal processor (ISP). 【0123】 According to one embodiment, the first camera module 301, the second camera module 302, and the third camera module 303 are housed in the first housing 21 corresponding to the first cover 212 (or the first rear region of the foldable electronic device 1). For example, the first cover 212 includes a first camera hole (or first light-transmitting region) corresponding to the first camera module 301, a second camera hole (or second light-transmitting region) corresponding to the second camera module 302, and / or a third camera hole (or third light-transmitting region) corresponding to the third camera module 303. The positions or number of camera modules housed in the first housing 21 corresponding to the first cover 212 are not limited to the illustrated example and can vary. 【0124】 According to one embodiment, the first camera module 301, the second camera module 302, or the third camera module 303 includes a wide-angle camera module, a telephoto camera module, a color camera module, a monochrome camera module, or an IR camera (e.g., a TOF (time of flight) camera, a structured light camera) module. 【0125】 According to one embodiment, the first camera module 301, the second camera module 302, and the third camera module 303 have different attributes (e.g., field of view) or functions from each other. 【0126】 According to various embodiments, the first camera module 301, the second camera module 302, or the third camera module 303 can provide different angles of view (or lenses with different angles of view). The foldable electronic device 2 selectively uses the angles of view of the first camera module 301, the second camera module 302, or the third camera module 303 based on the user's choice regarding the angle of view. 【0127】 According to one embodiment, the fourth camera module 304 is housed in the first housing 21, corresponding to the first front area of ​​the foldable electronic device 2. 【0128】 According to one embodiment, the fourth camera module 304 overlaps the first display area 251 of the first display module 25 when viewed from above the first front area of ​​the foldable electronic device 2. The fourth camera module 304 is located behind or below the first display area 351. When viewed from outside the foldable electronic device 2, the fourth camera module 304, or the location of the fourth camera module 304, is not substantially visually identifiable (or exposed). The fourth camera module 304 includes, for example, a hidden display-rear camera (e.g., UDC: under display camera). External light passes through the first display module 25 and reaches the fourth camera module 304. 【0129】 In various embodiments, the illustrated embodiment can be modified so that a fourth camera module 304 is housed in the second housing 12 corresponding to the second front area of ​​the foldable electronic device 2. In various embodiments, a further camera module (not shown) may be housed in the second housing 22 corresponding to the second front area of ​​the foldable electronic device 2. 【0130】 According to one embodiment, the fifth camera module 305 can be housed in the second housing 22 corresponding to the second cover 222 (or the second rear area of ​​the foldable electronic device 2). 【0131】 According to one embodiment, the fifth camera module 305 is positioned aligned with or at least partially inserted into an opening provided in the second display module 26. External light reaches the fifth camera module 305 through the openings provided in the second cover 222 and the second display module 26. The opening in the second display module 26 aligned with or overlapping the fifth camera module 305 is a through hole. In various embodiments, the opening in the second display module 26 aligned with or overlapping the fifth camera module 305 may be provided as a notch (not shown). 【0132】 According to various embodiments, the fifth camera module 305 may overlap the second display module 26 when viewed from above the second rear region of the foldable electronic device 2. The fifth camera module 305 is located behind or below the second display module 26. When viewed from outside the foldable electronic device 2, the fifth camera module 305, or the location of the fifth camera module 305, is not substantially visually identifiable (or exposed). The fifth camera module 305 includes, for example, a hidden display rear camera (e.g., UDC). External light passes through the second cover 222 and the second display module 26 to reach the fifth camera module 305. 【0133】 According to various embodiments, the first camera module 301, the second camera module 302, the third camera module 303, the fourth camera module 304, or the fifth camera module 305 can operate as at least part of a sensor module. For example, an IR camera module operates as at least part of a sensor module. 【0134】 According to one embodiment, the light-emitting module 306 is housed in the first housing 21 corresponding to the first cover 212 (or the first rear region of the foldable electronic device 2). The first cover 212 includes a flash hole (or a fourth light-transmitting region) corresponding to the light-emitting module 306. The light-emitting module 306 includes, for example, an LED or a xenon lamp. The light-emitting module 306 includes a light source for the first camera module 301, the second camera module 302, and / or the third camera module 303. 【0135】 In various embodiments, the foldable electronic device 2 may further include other light-emitting modules (not shown) housed in the foldable housing 20 corresponding to the front of the foldable electronic device 2. The light-emitting modules provide state information of the foldable electronic device 2 in optical form. In various embodiments, the light-emitting modules may provide a light source that is synchronized with the operation of the fourth camera module 304. 【0136】 According to one embodiment, the sensor module 307 is housed in the foldable housing 20, corresponding to the front surface of the foldable electronic device 2. 【0137】 According to one embodiment, the sensor module 307 includes an optical sensor module. The optical sensor module includes, for example, a proximity sensor module or an illuminance sensor module. 【0138】 According to one embodiment, when viewed from above the first front area of ​​the foldable electronic device 2, the sensor module 307 overlaps the first display area 251 of the first display module 25. The sensor module 307 is located behind or below the first display area 251. When viewed from outside the foldable electronic device 2, the sensor module 307, or the location of the sensor module 307, is substantially not visually identifiable (or exposed). External light passes through the first display module 25 and reaches the sensor module 307. 【0139】 According to various embodiments, the foldable electronic device 2 may further include various other sensor modules (e.g., biosensor modules) (not shown). 【0140】 According to one embodiment, the first acoustic input module includes a first microphone (or first microphone) (not shown). The second acoustic input module includes a second microphone (or second microphone) (not shown). The third acoustic input module includes a third microphone (or third microphone) (not shown). The fourth acoustic input module includes a fourth microphone (or fourth microphone) (not shown). The first microphone is housed in the first housing 21 corresponding to a first microphone hole H11 included in the first edge B1 of the first side 2112. The second microphone is housed in the first housing 21 corresponding to a second microphone hole H12 included in the third edge B3 of the first side 2112. The third microphone is housed in the first housing 21 corresponding to a third microphone hole H13 included in the third edge B3 of the first side 2112. The fourth microphone is housed in the second housing 22 corresponding to a fourth microphone hole H14 included in the seventh edge B7 of the second side 2212. The microphone and the position or number of microphone holes corresponding to the microphone are not limited to the examples shown and can vary. 【0141】 According to one embodiment, the first sound output module includes a first speaker (not shown). The second sound output module includes a second speaker (not shown). The first speaker or the second speaker is a speaker for multimedia playback or recording playback. The first speaker is housed in the second housing 22 corresponding to a first speaker hole H21 included in the second side 2212. The second speaker is housed in the second housing 22 corresponding to a second speaker hole H21 provided in the second side 2212. The speakers for multimedia playback or recording playback and the positions or number of speaker holes corresponding to the speakers are not limited to the illustrated example and can vary. 【0142】 According to one embodiment, the third acoustic output module includes a third speaker (not shown). The third speaker includes a call receiver. The third speaker is housed in the first housing 21 corresponding to a third speaker hole H23 provided between the second cover 222 and the seventh edge B7 of the second side 2212. The location or number of the call speaker and the corresponding speaker holes are not limited to the illustrated example and may vary. 【0143】 According to one embodiment, the key input module includes a first key (or first side key) 309, a second key (or second side key) 310, and / or a key signal generation unit (not shown). The first key 309 is located in a first keyhole included in the second edge B2 of the first side 2112. The second key 310 is located in a second keyhole included in the second edge B2 of the first side 2112. The key signal generation unit is configured to generate a first key signal in response to a press or touch of the first key 309, and a second key signal in response to a press or touch of the second key 310. The position or number of key input modules is not limited to the illustrated example and can vary. 【0144】 According to one embodiment, a first connection terminal 311 (e.g., a first connector or first interface terminal) is housed in the first housing 21 corresponding to a first connection terminal hole (e.g., a first connector hole) included in the first edge B1 of the first side 2112. The foldable electronic device 2 transmits and / or receives power and / or data to and from an external electronic device electrically connected to the first connection terminal 311. The first connection terminal 311 includes, for example, a USB connector or an HDMI® connector. The location of the first connection terminal 311 and the first connection terminal hole corresponding to the first connection terminal 311 are not limited to the illustrated example and may vary. 【0145】 According to one embodiment, the second connecting terminal (e.g., second connector or second interface terminal) 312 is housed in the second housing 22 corresponding to the second connecting terminal hole (e.g., second connector hole) included in the sixth edge B6 of the second side 2112. An external storage medium such as an SD (secure digital memory) card, SIM card, or USIM (universal SIM) is connected to the second connecting terminal 312. The positions of the second connecting terminal 312 and the second connecting terminal hole corresponding to the second connecting terminal 312 are not limited to the illustrated example and may vary. 【0146】 Foldable electronic device 2 further includes various components depending on its form of provision. These components vary in many ways according to the convergence trend of foldable electronic device 2, and it is not possible to enumerate them all, but components at a level equivalent to those described above are further included in foldable electronic device 2. In various embodiments, depending on its form of provision, certain components may be excluded from the above components or replaced with other components. It should be understood that in the present invention, all combinations of the above-described features and / or embodiments are conceived and included. That is, all combinations of the above-described features should be considered as being included in the present invention as specific examples. 【0147】 Figure 6 shows a foldable electronic device 2 in an unfolded state according to one embodiment of the present invention. Figure 7 is a circuit diagram of a first example antenna structure 600 included in the foldable electronic device 2 according to one embodiment of the present invention. Figure 8 shows the current distribution of the foldable electronic device 2 in a folded state. It should be understood in the present invention that all combinations of features and / or embodiments disclosed in relation to Figures 6 to 8 are conceptually included. That is, all combinations of features described later in relation to Figures 6 to 8 should be considered as being included in the present invention as specific examples. 【0148】 Referring to Figures 6 to 8, the foldable electronic device 2 includes a first side metal 2112E, a second side metal 2212E, a first ground area G1, a second ground area G2, a first electrical path EP1, a second electrical path EP2, a third electrical path EP3, a fourth electrical path EP4, a fifth electrical path EP5, a wireless communication circuit 610, an EMI filter 620, a matching circuit 630, a first filter 640, and / or a second filter 650. The foldable electronic device 2 also includes a first non-ground area NG1 and a second non-ground area NG2. Although not shown separately, the foldable electronic device 2 may omit at least one of these components or may have one or more additional components. 【0149】 According to one embodiment, the first side metal 2112E includes a plurality of metals (E1, E2, E3, E4, E5, E6). The second side metal 2212E includes a plurality of metals (E7, E8, E9, E10, E11, E12). For example, in the folded state of the foldable electronic device 2 (see Figure 3), the plurality of metals (E1, E2, E3, E4, E5, E6) included in the first side metal 2112E and the plurality of metals (E7, E8, E9, E10, E11, E12) included in the second side metal 2212E are aligned and overlapping in correspondence. 【0150】 According to one embodiment, the first ground region G1 includes a portion of the ground structure (not shown) of the foldable electronic device 2 that is located corresponding to the first housing 21 (see Figure 2). The first ground region G1 includes, for example, a combination of at least one ground plane included in at least one printed circuit board (not shown) located on the first support portion 2111 (see Figure 4), a first inner metal (not shown) of the first support portion 2111 (see Figure 4), and / or at least one other conductor (or conductive region or conductive structure). 【0151】 According to one embodiment, when viewed from above the first rear region (or the first display region 251 in Figure 2) of the foldable electronic device 2, the first ground region G1 overlaps the first rear region. When viewed from above the first rear region of the foldable electronic device 2, the first ground region G1 is surrounded by the first side metal 2112E. 【0152】 According to one embodiment, at least one of the multiple metals (E1, E2, E3, E4, E5, E6) included in the first side metal 2112E is electrically and / or physically connected to the first ground region G1. 【0153】 According to one embodiment, at least one of the multiple metals (E1, E2, E3, E4, E5, E6) included in the first side metal 2112E is physically separated from the first ground area G1. 【0154】 According to one embodiment, the second ground region G2 includes a portion of the ground structure (not shown) of the foldable electronic device 2 that is located in correspondence with the second housing 22 (see Figure 2). The second ground region G2 includes, for example, a combination of at least one ground plane included in at least one printed circuit board (not shown) located on the second support portion 2211 (see Figure 4), a second inner metal (not shown) of the second support portion 2211 (see Figure 4), and / or at least one other conductor (or conductive region or conductive structure). 【0155】 According to one embodiment, when viewed from above the second rear region (or the second display region 252 in Figure 2) of the foldable electronic device 2, the second ground region G2 overlaps the second rear region. When viewed from above the second rear region of the foldable electronic device 2, the second ground region G2 is surrounded by the second side metal 2212E. 【0156】 According to one embodiment, at least one of the multiple metals (E7, E8, E9, E10, E11, E12) included in the second side metal 2212E is electrically and / or physically connected to the second ground area G2. 【0157】 According to one embodiment, at least one of the multiple metals (E7, E8, E9, E10, E11, E12) included in the second side metal 2212E is physically separated from the second ground area G2. 【0158】 According to one embodiment, the foldable electronic device 2 includes one or more first non-ground regions (or non-conductive regions) that are physically separated from at least a portion of the first ground region G1 and the first side metal 2112E. The illustrated first non-ground region NG1 is, for example, one of one or more first non-ground regions located in the first housing 21 (see Figure 2). 【0159】 According to one embodiment, one or more first non-ground regions located in the first housing 21 (see Figure 2) include one or more first openings formed in the first ground region G1. In various embodiments, one or more first non-ground regions may include (e.g., filled) non-conductive material (not shown) placed in one or more first openings. The non-conductive material placed in one or more first openings is included, for example, in a first inner non-metal (not shown) included in the first support portion 2111 (see Figure 4). 【0160】 According to one embodiment, the first non-ground region NG1 is located corresponding to the first edge B1. The first metal E1 is physically separated from the first ground region G1, for example, by the first non-ground region NG1. The first non-ground region NG1 includes a first opening in the form of a notch formed in the first ground region G1, for example, corresponding to the first metal E1. The first non-ground region NG1 includes, for example, a non-conductive material placed in the first opening. 【0161】 According to one embodiment, the foldable electronic device 2 includes one or more second non-ground regions (or non-conductive regions) that are physically separated from at least a portion of the second ground region G2 and the second side metal 2212E. The illustrated second non-ground region NG2 is, for example, one of the one or more second non-ground regions located in the second housing 22 (see Figure 2). 【0162】 According to one embodiment, one or more second non-ground regions located in the second housing 22 (see Figure 2) include one or more second openings formed in the second ground region G2. In various embodiments, one or more second non-ground regions may include (e.g., filled) non-conductive material (not shown) placed in one or more second openings. The non-conductive material placed in one or more second openings is included, for example, in a second inner non-metal (not shown) included in the second support portion 2211 (see Figure 4). 【0163】 According to one embodiment, the second non-ground region NG2 is located corresponding to the fifth edge B2. The seventh metal E7 is physically separated from the second ground region G2, for example, by the second non-ground region NG2. The second non-ground region NG2 includes a second opening in the form of a notch formed in the second ground region G2, for example, corresponding to the seventh metal E7. The second non-ground region NG2 includes, for example, a non-conductive material placed in the second opening. 【0164】 According to one embodiment, in the folded state of the foldable electronic device 2 (see Figure 3), the first non-ground region NG1 and the second non-ground region NG2 overlap. 【0165】 According to one embodiment, the first electrical path EP1 electrically connects the first metal E1 and the wireless communication circuit 610. The first electrical path EP1 may be electrically connected to the first point P1 of the first metal E1. The first electrical path EP1 includes one or more conductive paths (or conductors or conductive structures) (not shown) between the first metal E1 and the wireless communication circuit 610. 【0166】 According to one embodiment, the first electrical path EP1 is housed in the first housing 21 (see Figure 2). 【0167】 According to one embodiment, the wireless communication circuit 610 is arranged on a first printed circuit board (not shown) positioned on a first support portion 2111 (see Figure 4). The first electrical path EP1 includes, for example, a first conductive line (e.g., a first wiring) included in the first printed circuit board, and an electrical connection structure between the first metal E1 and the first printed circuit board. One end of the first conductive line is electrically connected to the wireless communication circuit 610. The other end of the first conductive line is electrically connected to the electrical connection structure between the first metal E1 and the first printed circuit board. The electrical connection structure between the first metal E1 and the first printed circuit board includes, for example, a flexible conductor (or a flexible conductive part or flexible conductive member) (not shown) positioned between the first metal E1 and the first printed circuit board. The flexible conductor can be various, such as a conductive clip (e.g., a conductive structure including an elastic structure), a pogo pin, a spring, a conductive poron, a conductive rubber, a conductive tape, or a conductive connector. The first metal E1 includes a first projection (not shown) that physically contacts a flexible conductor, for example, placed on a first printed circuit board. The first projection includes a first point P1. 【0168】 According to one embodiment, the second electrical path EP2 electrically connects the seventh metal E7 and the wireless communication circuit 610. The second electrical path EP2 is electrically connected to the second point P2 of the seventh metal E7. The second electrical path EP2 includes one or more conductive paths (or conductors or conductive structures) (not shown) between the seventh metal E7 and the wireless communication circuit 610. 【0169】 According to one embodiment, the second electrical path EP2 extends from the first housing 21 (see Figure 2) to the second housing 22 (see Figure 2). The second electrical path EP2 is arranged across the hinge portion 24. 【0170】 According to one embodiment, the foldable electronic device 2 includes a first printed circuit board (not shown) located on a first support portion 2111 (see Figure 4), a second printed circuit board (not shown) located on a second support portion 2211 (see Figure 4), and a flexible printed circuit board (e.g., flexible printed circuit board 2500 in Figure 25) that electrically connects the first and second printed circuit boards. The flexible printed circuit board extends from the first housing 21 (see Figure 2) to the second housing 22 (see Figure 2) across the hinge portion 24. The second electrical path EP2 includes a second conductive line (e.g., second wiring) included in the first printed circuit board on which the wireless communication circuit 610 is located, a third conductive line (e.g., third wiring) included in the second printed circuit board, a fourth conductive line (e.g., fourth wiring) included in the flexible printed circuit board, and / or an electrical connection structure between the seventh metal E7 and the second printed circuit board. The second conductive line is electrically connected to the wireless communication circuit 610. The third conductive line is electrically connected to an electrical connection structure between the seventh metal E7 and the second printed circuit board. The fourth conductive line electrically connects the second conductive line and the third conductive line. The electrical connection structure between the seventh metal E7 and the second printed circuit board includes, for example, a flexible conductor (or flexible conductive part or flexible conductive member) (e.g., a conductive clip, pogo pin, spring, conductive poron, conductive rubber, conductive tape, or conductive connector) (not shown) disposed between the seventh metal E7 and the second printed circuit board. The seventh metal E7 includes, for example, a second projection (not shown) that physically contacts the flexible conductor disposed on the second printed circuit board. The second projection includes a second point P2. 【0171】 According to one embodiment, the third electrical path EP3 electrically connects the first metal E1 and the first ground region G1. The third electrical path EP3 is electrically connected to the third point P3 of the first metal E1. The third electrical path EP3 includes one or more conductive paths (or conductors or conductive structures) (not shown) between the first metal E1 and the first ground region G1. 【0172】 According to one embodiment, the third electrical path EP3 includes a flexible conductor (or flexible conductive part or flexible conductive member) (e.g., a conductive clip, pogo pin, spring, conductive poron, conductive rubber, conductive tape, or conductive connector) (not shown) that electrically connects the first metal E1 and the first ground region G1. The flexible conductor is, for example, located on a first printed circuit board (not shown) arranged on a first support 2111 (see Figure 4) and electrically connected to the first ground region G1. The first metal E1 includes, for example, a third projection (not shown) that physically contacts the flexible conductor. The third projection includes a third point P3. 【0173】 According to one embodiment, the fourth electrical path EP4 electrically connects the seventh metal E7 and the second ground region G2. The fourth electrical path EP4 is electrically connected to the fourth point P4 of the seventh metal E7. The fourth electrical path EP4 includes one or more combinations of conductive paths (or conductors or conductive structures) (not shown) between the seventh metal E7 and the second ground region G2. 【0174】 According to one embodiment, the fourth electrical path EP4 includes a flexible conductor (or flexible conductive part or flexible conductive member) (e.g., a conductive clip, pogo pin, spring, conductive poron, conductive rubber, conductive tape, or conductive connector) (not shown) that electrically connects the seventh metal E7 and the second ground region G2. The flexible conductor is, for example, located on a second printed circuit board (not shown) positioned on a second support portion 2211 (see Figure 4) and electrically connected to the second ground region G2. The seventh metal E7 includes, for example, a fourth projection (not shown) that physically contacts the flexible conductor. The fourth projection includes a fourth point P4. 【0175】 According to one embodiment, the fifth electrical path EP5 electrically connects the first ground region G1 and the second ground region G2. The fifth electrical path EP5 includes one or more combinations of conductive paths (or conductors or conductive structures) (not shown) between the first ground region G1 and the second ground region G2. 【0176】 According to one embodiment, at least a portion of the fifth electrical path EP5 is included in a flexible printed circuit board (for example, the flexible printed circuit board 2500 in Figure 25) that is positioned across the hinge portion 24. 【0177】 According to one embodiment, the foldable electronic device 2 includes a flexible printed circuit board (for example, the flexible printed circuit board 2500 in Figure 25) that extends from the first housing 21 (see Figure 2) to the second housing 22 (see Figure 2) across the hinge portion 24. The flexible printed circuit board includes, for example, conductive lines included in the second electrical path EP2 and conductive lines included in the fifth electrical path EP5. 【0178】 According to one embodiment, the fifth electrical path EP5 includes at least one hinge module (e.g., the first hinge module 241, the second hinge module 242, and / or the third hinge module 243 in Figure 3) included in the hinge portion 24. The first inner metal (not shown) included in the first ground region G1 of the first support portion 2111 (see Figure 4) and the second inner metal (not shown) included in the second ground region G2 of the second support portion 2211 (see Figure 4) are electrically connected through at least one hinge module. 【0179】 According to one embodiment, the fifth electrical path EP5 is defined or interpreted as a part (e.g., a connector, a connecting member, or a connecting structure) that electrically connects the first ground region G1 and the second ground region G2 of the ground structure of the foldable electronic device 2. 【0180】 According to one embodiment, the first example antenna structure 600 included in the foldable electronic device 2 includes a first metal E1, a seventh metal E7, a first ground region G1, a second ground region G2, a first electrical path EP1, a second electrical path EP2, a third electrical path EP3, a fourth electrical path EP4, and / or a fifth electrical path EP5. 【0181】 According to one embodiment, the wireless communication circuit 610 provides (or supplies) a positive voltage (i.e., + voltage) to the first metal E1 through a first electrical path EP1 and a negative voltage (i.e., - voltage) to the seventh metal E7 through a second electrical path EP2. The provision of a + voltage to the first metal E1 through the first electrical path EP1 and a - voltage to the second metal E7 through the second electrical path EP2 by the wireless communication circuit 610 is defined or interpreted as "differential feeding". Hereinafter, the provision of a + voltage by the wireless communication circuit 610 will be referred to as "+ feeding", and the provision of a - voltage by the wireless communication circuit 610 will be referred to as "- feeding". 【0182】 According to one embodiment, the combination of the first ground region G1, the second ground region G2, and the fifth electrical path EP5 acts as an antenna ground G, which is of the same potential, when the wireless communication circuit 610 is positively and negatively fed. 【0183】 According to one embodiment, when positive power is supplied to the first electrical path EP1 and negative power is supplied to the second electrical path EP2, a potential difference provides (or forms) a first current flow corresponding to the first metal E1 and a second current flow corresponding to the seventh metal E7. The first current flow has a first current path (or first loop) L1 (see Figure 7) through which current (or radiated current) flows from the first electrical path EP1 to the third electrical path EP3. The second current flow has a second current path (or second loop) L2 (see Figure 7) through which current (or radiated current) flows from the fourth electrical path EP4 to the second electrical path EP2. The distribution of current (or radiated current) through the first current path L1 forms an electromagnetic field (or magnetic field distribution) 701. The second current path L2 and the current distribution through the second current path L2 form an electromagnetic field (or magnetic field distribution) 702. 【0184】 According to one embodiment, when positive power is supplied to the first electrical path EP1 and negative power is supplied to the second electrical path EP2, an electromagnetic field 701 including an electromagnetic force passing through a first non-ground region NG1 between the first metal E1 and the first ground region G1, and an electromagnetic field 702 including an electromagnetic force passing through a second non-ground region NG2 between the seventh metal E7 and the second ground region G2 are provided (or formed). 【0185】 According to one embodiment, the wireless communication circuit 610 is configured to transmit and / or receive a signal in a selected or specified frequency band through an electromagnetic field 701 generated in correspondence with a first current path L1 including a first metal E1 and / or an electromagnetic field 702 generated in correspondence with a second current path L2 including a seventh metal E7, when supplying positive power to a first electrical path EP1 and negative power to a second electrical path EP2. 【0186】 According to one embodiment, the wireless communication circuit 610 is configured to transmit and / or receive signals of approximately 13.56 MHz related to NFC through an electromagnetic field 701 generated in correspondence with a first current path L1 including a first metal E1 and / or an electromagnetic field 702 generated in correspondence with a second current path L2 including a seventh metal E7. 【0187】 According to one embodiment, the first rear region of the exterior of the foldable electronic device 2 includes a first region (or first top region) 201, a second region (or first middle region) 202, and a third region (or first lower region) 203. The second region 202 is located between the first region 201 and the third region 203. The first region 201 is located closer to the first edge B1 than the second region 202. The third region 203 is located closer to the third edge B3 than the second region 202. The second rear region of the exterior of the foldable electronic device 2 includes a fourth region (or second top region) 204, a fifth region (or second middle region) 205, and a sixth region (or second lower region) 206. The fifth region 205 includes the fourth region 204 and the sixth region 206. The fourth region 204 is located closer to the fifth edge B5 than the fifth region 205. The sixth region 206 is located closer to the seventh edge B7 than the fifth region 205. In the folded state of the foldable electronic device 2, the first region 201 and the fourth region 204, the second region 202 and the fifth region 205, and the third region 203 and the sixth region 206 overlap, respectively. When positive power is supplied to the first electrical path EP1 and negative power is supplied to the second electrical path EP2, the electromagnetic field 701 generated in correspondence with the first current path L1 including the first metal E1 is radiated through the first region 201 of the first back region, and the electromagnetic field 702 generated in correspondence with the second current path L2 including the seventh metal E7 is radiated through the fourth region 204 of the second back region. The first region 201 is less likely to be included in the user's hand grip position for the foldable electronic device 2 in the unfolded or folded state compared to the second region 202 and the third region 203. By ensuring that the electromagnetic field 701 generated in accordance with the first current path L1 including the first metal E1 is radiated through the first region 201 of the first back region, the limitations on the user's hand grip position to the foldable electronic device 2 in an unfolded or folded state can be reduced, and the possibility of the user's hand (e.g., dielectric) degrading the radiation performance can be reduced. The fourth region 204 is less likely to be included in the user's hand grip position to the foldable electronic device 2 in an unfolded or folded state compared to the fifth region 205 and the sixth region 206.By ensuring that the electromagnetic field 702 generated in the second current path L2, which includes the seventh metal E7, is radiated through the fourth region 204 of the second back region, the limitations on the user's hand grip position for the foldable electronic device 2 in an unfolded or folded state can be reduced, and the possibility of the radiation performance being degraded by the user's hand (e.g., dielectric) can be reduced. 【0188】 According to one embodiment, in the folded state of the foldable electronic device 2, the first current path (or first loop) L1 including the first metal E1 and the second current path (or second loop) L2 including the seventh metal E7 provide (or form) a coil (or a loop in the form of a coil). The first current path L1 provides (or forms) the first turn of the coil. The second current path L2 provides (or forms) the second turn of the coil. When positive power is supplied to the first electrical path EP1 and negative power is supplied to the second electrical path EP2, the coil formed by the combination of the first turn of the first current path L1 and the second turn of the second current path L2 in the folded state of the foldable electronic device 2 generates an electromagnetic field which is a composite of the electromagnetic field 701 generated through the first current path L1 and the electromagnetic field 702 generated through the second current path L2, thereby improving the radiation performance. 【0189】 According to one embodiment, the third point P3 of the first metal E1 electrically connected to the third electrical path EP3 is located closer to the hinge portion 24 than the first point P1 of the first metal E1 electrically connected to the first electrical path EP1. The second point P2 of the seventh metal E7 electrically connected to the second electrical path EP2 is located closer to the hinge portion 24 than the fourth point P4 of the seventh metal E7 electrically connected to the fourth electrical path EP4. When positive power is supplied to the first electrical path EP1 and negative power is supplied to the second electrical path EP2, current (or radiated current) flows from the first point P1 to the third point P3 on the first metal E1, and from the fourth point P4 to the second point P2 on the seventh metal E7. In the folded state of the foldable electronic device 2, the first metal E1 and the seventh metal E7 are aligned and overlap. In the folded state of the foldable electronic device 2, when positive power is supplied to the first electrical path EP1 and negative power is supplied to the second electrical path EP2, the direction in which current (or radiated current) flows on the first metal E1 from the first point P1 to the third point P3 and the direction in which current flows on the seventh metal E7 from the fourth point P4 to the second point P2 are substantially the same. In the folded state of the foldable electronic device 2, having the current (or radiated current) flow in substantially the same direction (see 800 in Figure 8) in the first metal E1 and the seventh metal E7 which are aligned and overlapping with each other generates an electromagnetic field with greater electromagnetic force strength and improves radiation performance compared to having the current flow in opposite directions (e.g., in opposite directions) in the first metal E1 and the seventh metal E7 which are aligned and overlapping with each other in the folded state of the foldable electronic device 2. 【0190】 In the present invention, when the foldable electronic device 2 is in the folded state, the fact that the radiated current flows in the same direction on two metals aligned with each other during power supply (e.g., the first metal E1 and the seventh metal E7) means that the phase (phase of the alternating current) of the radiated current flowing on one metal (e.g., the first metal E1) and the phase of the radiated current flowing on the other metal (e.g., the seventh metal E7) substantially coincide at a specific point in time, that is, the phase relationship between the waveforms is in phase. The fact that the waveform of the radiated current flowing on one metal (e.g., the first metal E1) and the waveform of the radiated current flowing on the other metal (e.g., the seventh metal E7) are in phase with each other means that they are perfectly aligned in time and the difference between the waves is zero. In the folded state of the foldable electronic device 2, the fact that radiated currents flow in different directions on two metals aligned with each other (e.g., the first metal E1 and the seventh metal E7) during power supply means that the phase (phase of the alternating current) of the radiated current flowing on one metal (e.g., the first metal E1) and the phase of the radiated current flowing on the other metal (e.g., the seventh metal E7) do not coincide at a given time, for example, that the phase relationship between the waveforms is either in opposite phase or between in-phase and out-of-phase. 【0191】 In various embodiments, although not shown separately, the first electrical path EP1 is electrically connected to the third point P3, and the third electrical path EP3 is electrically connected to the first point P1. Although not shown separately, the second electrical path EP2 is electrically connected to the fourth point P4, and the fourth electrical path EP4 is electrically connected to the second point P2. When positive power is supplied to the first electrical path EP1 and negative power is supplied to the second electrical path EP2, current (or radiated current) flows from the third point P3 to the first point P1 on the first metal E1, and from the second point P2 to the fourth point P4 on the seventh metal E7. When the foldable electronic device 2 is in its folded state and positive power is supplied to the first electrical path EP1 and negative power is supplied to the second electrical path EP2, the direction in which current (or radiated current) flows from the third point P3 to the first point P1 on the first metal E1 and the direction in which current flows from the second point P2 to the fourth point P4 on the seventh metal E7 are substantially the same. When the foldable electronic device 2 is in its folded state and current (or radiated current) flows in substantially the same direction in the first metal E1 and the seventh metal E7 which are aligned and overlapping with each other, it is possible to generate an electromagnetic field with a greater electromagnetic force intensity and improve the radiation performance compared to when the current flows in opposite directions (e.g., in opposite directions) in the first metal E1 and the seventh metal E7. 【0192】 According to various embodiments, the first metal E1 may extend from a first end adjacent to the second metal E2 to a second end adjacent to the sixth metal E6. The first point P1 is substantially located at the first end of the first metal E1, but is not limited to this, and may be formed at other locations between the first and second ends of the first metal E1. The third point P3 is substantially located at the second end of the first metal E1, but is not limited to this, and may be formed at other locations between the first and second ends of the first metal E1. 【0193】 According to various embodiments, the seventh metal E7 may extend from a third end adjacent to the eighth metal E8 to a fourth end adjacent to the twelfth metal E12. The fourth point P4 is substantially located at the third end of the seventh metal E7, but is not limited to this, and may be formed at other locations between the third and fourth ends of the seventh metal E7. The second point P2 is substantially located at the fourth end of the seventh metal E7, but is not limited to this, and may be formed at other locations between the third and fourth ends of the seventh metal E7. 【0194】 According to one embodiment, the EMI filter 620 is located in or electrically connected to the first electrical path EP1 and / or the second electrical path EP2. The EMI filter 620 reduces or shields noise affecting a signal in a selected or specified frequency band (e.g., an NFC signal). 【0195】 According to one embodiment, the matching circuit 630 is located in or electrically connected to the first electrical path EP1 and / or the second electrical path EP2. The matching circuit 630 adjusts the frequency of the first example antenna structure 600 so that resonance occurs in a selected or specified frequency band. The matching circuit 630 shifts the resonant frequency of the first example antenna structure 600 to a specified frequency, or shifts the resonant frequency by a specified amount. 【0196】 According to one embodiment, when the foldable electronic device 2 is in an unfolded state and positive power is supplied to the first electrical path EP1 and negative power is supplied to the second electrical path EP2, the matching circuit 630 adjusts the frequency of the first example antenna structure 600 so that the electromagnetic field 701 generated in correspondence with the first current path L1 including the first metal E1 and the electromagnetic field 702 generated in correspondence with the second current path L2 including the seventh metal E7 have a resonant frequency of approximately 13.56 MHz with respect to NFC. For example, when the foldable electronic device 2 is in an unfolded state and positive power is supplied to the first electrical path EP1 and negative power is supplied to the second electrical path EP2, the matching circuit 630 adjusts the frequency of the first example antenna structure 600 so that the electromagnetic field generated from the coil formed by the combination of the first turn of the first current path and the second turn of the second current path has a resonant frequency of approximately 13.56 MHz with respect to NFC. 【0197】 According to one embodiment, the matching circuit 630 adjusts the inductance of the first example antenna structure 600 so that it has a specified inductance value when positive power is supplied to the first electrical path EP1 and negative power is supplied to the second electrical path EP2. For example, when positive power is supplied to the first electrical path EP1 and negative power is supplied to the second electrical path EP2 in the unfolded state of the foldable electronic device 2, the matching circuit 630 adjusts the inductance of the first example antenna structure 600 so that the electromagnetic field 701 generated in the first current path L1 including the first metal E1 and the electromagnetic field 702 generated in the second current path L2 including the seventh metal E7 have an inductance value of approximately 8 to approximately 10 μH (microhenry) for approximately 13.56 MHz related to NFC. For example, when the foldable electronic device 2 is in the folded state and positive power is supplied to the first electrical path EP1 and negative power is supplied to the second electrical path EP2, the matching circuit 630 adjusts the inductance of the first example antenna structure 600 so that the electromagnetic field generated from the coil formed by the combination of the first turn of the first current path and the second turn of the second current path has an inductance value of approximately 8 to approximately 10 μH for approximately 13.56 MHz with respect to NFC. 【0198】 According to one embodiment, the matching circuit 630 provides (or forms) impedance matching. When supplying positive power to the first electrical path EP1 and negative power to the second electrical path EP2, the matching circuit 630 reduces transmission loss by impedance matching. 【0199】 According to one embodiment, the first filter 640 is located on or electrically connected to the first electrical path EP1. The wireless communication circuit 610 is electrically connected to the first metal E1, for example, through the first filter 640. When the first metal E1 is used as an antenna radiator in a non-NFC band (referred to as a non-NFC frequency band) such as LB, MB, HB, or UHB, the first filter 640 reduces the influence (e.g., electromagnetic interference) that the antenna structure 600 of the first example has on the non-NFC band. For example, when the first metal E1 is used as an antenna radiator in a non-NFC band such as LB, MB, HB, or UHB, the first filter 640 reduces or prevents the occurrence of resonance in the NFC band (also referred to as the NFC frequency band). 【0200】 According to one embodiment, the first filter 640 is provided as at least one filter (also referred to as a filter circuit), at least one switch (also referred to as a switch circuit), or a combination thereof. 【0201】 According to one embodiment, the first filter 640 includes a diplexer or duplexer that separates and transmits the NFC band and the non-NFC band, respectively. 【0202】 According to one embodiment, the second filter 650 is located in or electrically connected to the second electrical path EP2. The wireless communication circuit 610 is electrically connected to the seventh metal E7, for example, through the second filter 650. When the seventh metal E7 is used as an antenna radiator in a non-NFC band such as LB, MB, HB, or UHB, the second filter 650 reduces the influence (e.g., electromagnetic interference) that the antenna structure 600 of the first example has on the non-NFC band. For example, when the seventh metal E7 is used as an antenna radiator in a non-NFC band such as LB, MB, HB, or UHB, the second filter 650 reduces or prevents the occurrence of resonance in the NFC band. 【0203】 According to one embodiment, the second filter 650 is provided as at least one filter (also referred to as a filter circuit), at least one switch (also referred to as a switch circuit), or a combination thereof. 【0204】 According to one embodiment, the second filter 650 includes a diplexer or duplexer that separates and transmits the NFC band and the NFC band separately. 【0205】 The embodiment shown in Figure 6 discloses a configuration in which the first metal E1 and the seventh metal E7 are connected in series with the wireless communication circuit 610. However, the embodiment is not limited to this configuration, and the first metal E1 and the seventh metal E7 can be configured in parallel with the wireless communication circuit 610. For example, a configuration in which the first metal E1 and the seventh metal E7 are connected in parallel with the wireless communication circuit 610 will be described with reference to Figure 9. 【0206】 Figure 9 shows a foldable electronic device 2 in an unfolded state according to one embodiment of the present invention. It should be understood in the present invention that all combinations of features and / or embodiments disclosed in relation to Figure 9 are conceptually included. That is, all combinations of features described later in relation to Figure 9 should be considered to be included in the present invention as specific examples. 【0207】 Referring to Figure 9, the foldable electronic device 2 includes a first side metal 2112E containing multiple metals (E1, E2, E3, E4, E5, E6), a second side metal 2212E containing multiple metals (E7, E8, E9, E10, E11, E12), a first ground area G1, a second ground area G2, a first electrical path EP1, a second electrical path EP2, a fifth electrical path EP5, a sixth electrical path EP6, a seventh electrical path EP7, a wireless communication circuit 610, an EMI filter 620, a matching circuit 630, a first filter 640, and / or a second filter 650. In Figure 9, descriptions of some components that are the same as those shown in Figure 6 are omitted. 【0208】 According to one embodiment, the second example antenna structure 900 included in the foldable electronic device 2 includes a first metal E1, a seventh metal E7, a first ground region G1, a second ground region G2, a first electrical path EP1, a second electrical path EP2, a fifth electrical path EP5, a sixth electrical path EP6, and / or a seventh electrical path EP7. 【0209】 According to one embodiment, the sixth electrical path EP6 can electrically connect the first electrical path EP1 and the fourth point P4 of the seventh metal E7. The seventh metal E7 may be electrically connected to the first electrical path EP1 through the sixth electrical path EP6. The sixth electrical path EP6 includes one or more combinations of conductive paths (or conductors or conductive structures) (not shown) between the first electrical path EP1 and the fourth point P4 of the seventh metal E7. 【0210】 According to one embodiment, the sixth electrical path EP6 extends from the first housing 21 (see Figure 2) to the second housing 22 (see Figure 2). The sixth electrical path EP6 is arranged across the hinge portion 24. 【0211】 According to one embodiment, the foldable electronic device 2 includes a first printed circuit board (not shown) located on a first support portion 2111 (see Figure 4), a second printed circuit board (not shown) located on a second support portion 2211 (see Figure 4), and a flexible printed circuit board (e.g., flexible printed circuit board 2500 in Figure 25) that electrically connects the first and second printed circuit boards. The flexible printed circuit board is located across the hinge portion 24. The sixth electrical path EP6 includes a fifth conductive line (e.g., fifth wiring) included in the first printed circuit board on which the wireless communication circuit 610 is located, a sixth conductive line (e.g., sixth wiring) included in the second printed circuit board, and / or a seventh conductive line (e.g., seventh wiring) included in the flexible printed circuit board. The fifth conductive line is electrically connected to the first electrical path EP1. The sixth conductive line is electrically connected to the fourth point P4 of the seventh metal E7. The seventh conductive line electrically connects the fifth conductive line and the sixth conductive line. 【0212】 According to one embodiment, the seventh electrical path EP7 electrically connects the second electrical path EP2 and the third point P3 of the first metal E1. The first metal E1 is electrically connected to the second electrical path EP2 through the seventh electrical path EP7. The seventh electrical path EP7 includes one or more combinations of conductive paths (or conductors or conductive structures) (not shown) between the second electrical path EP2 and the third point P3 of the first metal E1. 【0213】 According to one embodiment, the seventh electrical path EP7 is housed in the first housing 21 (see Figure 2). 【0214】 According to one embodiment, the seventh electrical path EP7 includes an eighth conductive line (e.g., an eighth wiring) included in a first printed circuit board (not shown) located on the first support portion 2111 (see Figure 4). The first printed circuit board includes a second conductive line (e.g., a second wiring) included in the second electrical path EP2. The eighth conductive line is electrically connected to the second conductive line. 【0215】 According to one embodiment, the foldable electronic device 2 includes a flexible printed circuit board (e.g., flexible printed circuit board 2500 in Figure 25) extending from the first housing 21 (see Figure 2) to the second housing 22 (see Figure 2) across the hinge portion 24. The flexible printed circuit board includes, for example, conductive lines included in a second electrical path EP2, conductive lines included in a fifth electrical path EP5, and / or conductive lines included in a sixth electrical path EP6. In various embodiments, the sixth electrical path EP6 may include a second printed circuit board (not shown) housed in the second housing 22 and be electrically connected to the flexible printed circuit board. 【0216】 According to one embodiment, the wireless communication circuit 610 provides (or supplies) a + voltage to a first electrical path EP1 and a - voltage to a second electrical path EP2. The + voltage is provided to a first point P1 of the first metal E1 through the first electrical path EP1. The + voltage is provided to a fourth point P4 of the second metal E2 through a sixth electrical path EP6. The - voltage is provided to a second point P2 of the seventh metal E7 through the second electrical path EP2. The - voltage is provided to a third point P3 of the first metal E1 through a seventh electrical path EP7. 【0217】 According to one embodiment, when positive power is supplied to the first electrical path EP1 and negative power is supplied to the second electrical path EP2, a first current flow corresponding to the first metal E1 and a second current flow corresponding to the seventh metal E7 are provided (or formed). The first current flow has a first current path (or first loop) through the first metal E1 through which current (or radiating current) flows from the first electrical path EP1 to the seventh electrical path EP7. The second current flow has a second current path (or second loop) through the seventh metal E7 through which current (or radiating current) flows from the sixth electrical path EP6 to the second electrical path EP2. 【0218】 According to one embodiment, the first current path and the distribution of current (or radiated current) following the first current path form an electromagnetic field that includes an electromagnetic force passing through the first non-ground region NG1 between the first metal E1 and the first ground region G1. 【0219】 According to one embodiment, the second current path and the current distribution through the second current path form an electromagnetic field that includes an electromagnetic force passing through the second non-ground region NG2 between the seventh metal E7 and the second ground region G2. 【0220】 According to one embodiment, the wireless communication circuit 610 is configured to transmit and / or receive signals in a selected or specified frequency band through an electromagnetic field generated in a first current path including a first metal E1 and / or an electromagnetic field generated in a second current path including a seventh metal E7 when supplying positive power to a first electrical path EP1 and negative power to a second electrical path EP2. 【0221】 According to one embodiment, the wireless communication circuit 610 is configured to transmit and / or receive signals of approximately 13.56 MHz related to NFC through an electromagnetic field generated in correspondence with a first current path including a first metal E1 and / or an electromagnetic field generated in correspondence with a second current path including a seventh metal E7. 【0222】 According to one embodiment, in the folded state of the foldable electronic device 2, the first current path (or first loop) including the first metal E1 and the second current path (or second loop) including the seventh metal E7 provide (or form) a coil (or a loop in the form of a coil). The first current path provides (or forms) the first turn of the coil. The second current path provides (or forms) the second turn of the coil. When positive power is supplied to the first electrical path EP1 and negative power is supplied to the second electrical path EP2, the coil formed by the combination of the first turn of the first current path and the second turn of the second current path in the folded state of the foldable electronic device 2 generates an electromagnetic field which is a composite of the electromagnetic field generated through the first current path and the electromagnetic field generated through the second current path, thereby improving the radiation performance. 【0223】 According to one embodiment, when positive power is supplied to the first electrical path EP1 and negative power is supplied to the second electrical path EP2, current (or radiated current) flows on the first metal E1 from the first point P1 to the third point P3, and on the seventh metal E7 from the fourth point P4 to the second point P2. In the folded state of the foldable electronic device 2, the first metal E1 and the seventh metal E7 are aligned and overlap. In the folded state of the foldable electronic device 2, when positive power is supplied to the first electrical path EP1 and negative power is supplied to the second electrical path EP2, the direction in which current (or radiated current) flows on the first metal E1 from the first point P1 to the third point P3 and the direction in which current flows on the seventh metal E7 from the fourth point P4 to the second point P2 are substantially the same. By arranging the first metal E1 and the seventh metal E7, which are aligned and overlapping with each other in the folded state of the foldable electronic device 2, to have the current (or radiated current) flow in substantially the same direction, it is possible to generate an electromagnetic field with greater electromagnetic force strength and improve radiation performance compared to arranging the currents to flow in opposite directions (e.g., in opposite directions) with each other in the first metal E1 and the seventh metal E7, which are aligned and overlapping with each other in the folded state of the foldable electronic device 2. 【0224】 In various embodiments, although not shown separately, the first electrical path EP1 is electrically connected to the third point P3, and the seventh electrical path EP7 is electrically connected to the first point P1. Although not shown separately, the second electrical path EP2 is electrically connected to the fourth point P4, and the sixth electrical path EP6 is electrically connected to the second point P2. When positive power is supplied to the first electrical path EP1 and negative power is supplied to the second electrical path EP2, current (or radiated current) flows from the third point P3 to the first point P1 on the first metal E1, and from the second point P2 to the fourth point P4 on the seventh metal E7. When the foldable electronic device 2 is in its folded state and positive power is supplied to the first electrical path EP1 and negative power is supplied to the second electrical path EP2, the direction in which current (or radiated current) flows from the third point P3 to the first point P1 on the first metal E1 and the direction in which current flows from the second point P2 to the fourth point P4 on the seventh metal E7 are substantially the same. When the foldable electronic device 2 is in its folded state and current (or radiated current) flows in substantially the same direction in the first metal E1 and the seventh metal E7 which are aligned and overlapping with each other, it is possible to generate an electromagnetic field with greater electromagnetic force strength and improve radiation performance compared to when the current flows in opposite directions (e.g., in opposite directions) in the first metal E1 and the seventh metal E7 which are aligned and overlapping with each other, 【0225】 Figure 10 shows a foldable electronic device 2 in an unfolded state according to one embodiment of the present invention. It should be understood in the present invention that all combinations of features and / or embodiments disclosed in relation to Figure 10 are conceptually included. That is, all combinations of features described later in relation to Figure 10 should be considered to be included in the present invention as specific examples. 【0226】 Referring to Figure 10, the foldable electronic device 2 includes a first side metal 2112E containing multiple metals (E1, E2, E3, E4, E5, E6), a second side metal 2212E containing multiple metals (E7, E8, E9, E10, E11, E12), a first ground area G1, a second ground area G2, a first electrical path EP1, a second electrical path EP2, a fifth electrical path EP5, an eighth electrical path EP8, a wireless communication circuit 610, an EMI filter 620, a matching circuit 630, a first filter 640, and / or a second filter 650. In Figure 9, the description of some components that are the same as those shown in Figure 6 is omitted. 【0227】 According to one embodiment, a third example antenna structure 1000 included in the foldable electronic device 2 includes a first metal E1, a seventh metal E7, a first ground region G1, a second ground region G2, a first electrical path EP1, a second electrical path EP2, a fifth electrical path EP5, and / or an eighth electrical path EP8. 【0228】 According to one embodiment, the eighth electrical path EP8 electrically connects the first metal E1 and the seventh metal E7. The eighth electrical path EP8 includes one or more conductive paths (or conductors or conductive structures) (not shown) between the first metal E1 and the seventh metal E7. 【0229】 According to one embodiment, the eighth electrical path EP8 extends from the first housing 21 (see Figure 2) to the second housing 22 (see Figure 2). The eighth electrical path EP8 is arranged across the hinge portion 24. 【0230】 According to one embodiment, the foldable electronic device 2 includes a first printed circuit board (not shown) disposed on a first support portion 2111 (see Figure 4), a second printed circuit board (not shown) disposed on a second support portion 2211 (see Figure 4), and a flexible printed circuit board (e.g., flexible printed circuit board 2500 in Figure 25) that electrically connects the first and second printed circuit boards. The flexible printed circuit board is disposed across the hinge portion 24. The eighth electrical path EP8 includes a ninth conductive line (e.g., ninth wiring) included in the first printed circuit board on which the wireless communication circuit 610 is disposed, a tenth conductive line (e.g., tenth wiring) included in the second printed circuit board, an eleventh conductive line (e.g., eleventh wiring) included in the flexible printed circuit board, an electrical connection structure between the first metal E1 and the first printed circuit board, and / or an electrical connection structure between the seventh metal E7 and the second printed circuit board. The ninth conductive line is electrically connected to an electrical connection structure between the first metal E1 and the first printed circuit board. The tenth conductive line is electrically connected to an electrical connection structure between the seventh metal E7 and the second printed circuit board. The eleventh conductive line electrically connects the ninth conductive line and the tenth conductive line. The electrical connection structure between the first metal E1 and the first printed circuit board includes, for example, a flexible conductor (or flexible conductive part or flexible conductive member) (e.g., a conductive clip, pogo pin, spring, conductive poron, conductive rubber, conductive tape, or conductive connector) (not shown) disposed between the first metal E1 and the first printed circuit board. The electrical connection structure between the seventh metal E7 and the second printed circuit board includes, for example, a flexible conductor (or flexible conductive part or flexible conductive member) (e.g., a conductive clip, pogo pin, spring, conductive poron, conductive rubber, conductive tape, or conductive connector) (not shown) disposed between the seventh metal E7 and the second printed circuit board. 【0231】 According to one embodiment, one end of the eighth electrical path EP8 is electrically connected to the third point P3 of the first metal E1, and the other end of the eighth electrical path EP8 is electrically connected to the fourth point P4 of the seventh metal E7. 【0232】 According to one embodiment, the foldable electronic device 2 includes a flexible printed circuit board (e.g., the flexible printed circuit board 2500 in Figure 25) that extends from the first housing 21 (see Figure 2) to the second housing 22 (see Figure 2) across the hinge portion 24. The flexible printed circuit board includes, for example, conductive lines included in the second electrical path EP2, conductive lines included in the fifth electrical path EP5, and / or conductive lines included in the eighth electrical path EP8. 【0233】 According to one embodiment, the wireless communication circuit 610 provides (or supplies) a + voltage to a first electrical path EP1 and a - voltage to a second electrical path EP2. The + voltage is provided to a first point P1 of the first metal E1 through the first electrical path EP1. The - voltage is provided to a second point P2 of the seventh metal E7 through the second electrical path EP2. 【0234】 According to one embodiment, when positive power is supplied to the first electrical path EP1 and negative power is supplied to the second electrical path EP2, a current flow is provided (or formed) through the first metal E1, the eighth electrical path EP8, and the seventh metal E7, through which current (or radiating current) flows from the first electrical path EP1 to the second electrical path EP2. The current flow includes a first current flow corresponding to the first metal E1 and a second current flow corresponding to the seventh metal E7. The first current flow has a first current path (or first loop) through the first metal E1 through which current (or radiating current) flows from the first electrical path EP1 to the eighth electrical path EP8. The second current flow has a second current path (or second loop) through the seventh metal E7 through which current (or radiating current) flows from the eighth electrical path EP8 to the second electrical path EP2. 【0235】 According to one embodiment, the first current path and the distribution of current (or radiated current) following the first current path form an electromagnetic field that includes an electromagnetic force passing through the first non-ground region NG1 between the first metal E1 and the first ground region G1. 【0236】 According to one embodiment, the second current path and the current distribution through the second current path form an electromagnetic field that includes an electromagnetic force passing through the second non-ground region NG2 between the seventh metal E7 and the second ground region G2. 【0237】 According to one embodiment, the wireless communication circuit 610 is configured to transmit and / or receive signals in a selected or specified frequency band through an electromagnetic field generated in a first current path including a first metal E1 and / or an electromagnetic field generated in a second current path including a seventh metal E7 when supplying positive power to a first electrical path EP1 and negative power to a second electrical path EP2. 【0238】 According to one embodiment, the wireless communication circuit 610 is configured to transmit and / or receive signals of approximately 13.56 MHz related to NFC through an electromagnetic field generated in correspondence with a first current path including a first metal E1 and / or an electromagnetic field generated in correspondence with a second current path including a seventh metal E7. 【0239】 According to one embodiment, in the folded state of the foldable electronic device 2, the first current path (or first loop) including the first metal E1 and the second current path (or second loop) including the seventh metal E7 provide (or form) a coil (or a loop in the form of a coil). The first current path provides (or forms) the first turn of the coil. The second current path provides (or forms) the second turn of the coil. When positive power is supplied to the first electrical path EP1 and negative power is supplied to the second electrical path EP2, the coil formed by the combination of the first turn of the first current path and the second turn of the second current path in the folded state of the foldable electronic device 2 generates an electromagnetic field which is a composite of the electromagnetic field generated through the first current path and the electromagnetic field generated through the second current path, thereby improving the radiation performance. 【0240】 According to one embodiment, when positive power is supplied to the first electrical path EP1 and negative power is supplied to the second electrical path EP2, current (or radiated current) flows on the first metal E1 from the first point P1 to the third point P3, and on the seventh metal E7 from the fourth point P4 to the second point P2. In the folded state of the foldable electronic device 2, the first metal E1 and the seventh metal E7 are aligned and overlap. In the folded state of the foldable electronic device 2, when positive power is supplied to the first electrical path EP1 and negative power is supplied to the second electrical path EP2, the direction in which current (or radiated current) flows on the first metal E1 from the first point P1 to the third point P3 and the direction in which current flows on the seventh metal E7 from the fourth point P4 to the second point P2 are substantially the same. By arranging the first metal E1 and the seventh metal E7, which are aligned and overlapping with each other in the folded state of the foldable electronic device 2, to have the current (or radiated current) flow in substantially the same direction, it is possible to generate an electromagnetic field with greater electromagnetic force strength and improve radiation performance compared to arranging the currents to flow in opposite directions (e.g., in opposite directions) with each other in the first metal E1 and the seventh metal E7, which are aligned and overlapping with each other in the folded state of the foldable electronic device 2. 【0241】 According to various embodiments, although not shown, the first electrical path EP1 may be electrically connected to the third point P3, and the eighth electrical path EP8 may be electrically connected to the first point P1. Although not shown, the second electrical path EP2 may be electrically connected to the fourth point P4, and the eighth electrical path EP8 may be electrically connected to the second point P2. When positive power is supplied to the first electrical path EP1 and negative power is supplied to the second electrical path EP2, current (or radiated current) flows from the third point P3 to the first point P1 on the first metal E1, and from the second point P2 to the fourth point P4 on the seventh metal E7. When the foldable electronic device 2 is in its folded state and positive power is supplied to the first electrical path EP1 and negative power is supplied to the second electrical path EP2, the direction in which current (or radiated current) flows from the third point P3 to the first point P1 on the first metal E1 and the direction in which current flows from the second point P2 to the fourth point P4 on the seventh metal E7 are substantially the same. When the foldable electronic device 2 is in its folded state and current (or radiated current) flows in substantially the same direction in the first metal E1 and the seventh metal E7 which are aligned and overlapping with each other, it is possible to generate an electromagnetic field with greater electromagnetic force strength and improve radiation performance compared to when the current flows in opposite directions (e.g., in opposite directions) in the first metal E1 and the seventh metal E7 which are aligned and overlapping with each other, 【0242】 Figure 11 shows a foldable electronic device 2 in an unfolded state according to one embodiment of the present invention. It should be understood in the present invention that all combinations of features and / or embodiments disclosed in relation to Figure 11 are conceptually included. That is, all combinations of features described later in relation to Figure 11 should be considered to be included in the present invention as specific examples. 【0243】 Referring to Figure 11, the foldable electronic device 2 includes a first side metal 2112E comprising multiple metals (E1, E2, E3, E4, E5, E6), a second side metal 2212E comprising multiple metals (E7, E8, E9, E10, E11, E12), a first ground region G1, a second ground region G2, a first non-ground region NG1, a second non-ground region NG2, a first electrical path EP1, a second electrical path EP2, a third electrical path EP3, a fourth electrical path EP4, a fifth electrical path EP5, a wireless communication circuit 610, an EMI filter 620, a matching circuit 630, a first filter 640, a second filter 650, a helical conductive pattern 1100, a ninth electrical path EP9, and / or a tenth electrical path EP10. The first example antenna structure 600 includes a first metal E1, a seventh metal E7, a first ground region G1, a second ground region G2, a first electrical path EP1, a second electrical path EP2, a third electrical path EP3, a fourth electrical path EP4, and / or a fifth electrical path EP5. The embodiment in Figure 11 further includes a helical conductive pattern 1100, a ninth electrical path EP9, and a tenth electrical path EP10 compared to the embodiment in Figure 6. In Figure 11, descriptions of some components that are the same as those shown in Figure 6 are omitted. 【0244】 According to one embodiment, the helical conductive pattern 1100 has a loop of current path extending from a first end 1101 to a second end 1102. For example, the helical conductive pattern 1100 includes a planar coil (e.g., a planar coil or a patterned coil) containing a plurality of turns. 【0245】 According to one embodiment, the helical conductive pattern 1100 is represented by a flexible printed circuit board (not shown). 【0246】 According to one embodiment, the helical conductive pattern 1100 is housed in the first housing 21 (see Figure 2). The helical conductive pattern 1100 is housed in the first housing 21 (see Figure 2) corresponding to the first back region of the foldable electronic device 2. The helical conductive pattern 1100 is located, for example, between the first cover 212 (see Figure 2) and the first support portion 2111 (see Figure 4). 【0247】 According to one embodiment, the first end 1101 of the helical conductive pattern 1100 is electrically connected to the first electrical path EP1 through the ninth electrical path EP9. The second end 1102 of the helical conductive pattern 1100 is electrically connected to the second electrical path EP2 through the tenth electrical path EP10. 【0248】 According to one embodiment, the foldable electronic device 2 includes a first printed circuit board (not shown) arranged on a first support portion 2111 (see Figure 4). The ninth electrical path EP9 includes, for example, a twelfth conductive line included in the first printed circuit board. One end of the twelfth conductive line is electrically connected to the first end 1101 of the helical conductive pattern 1100, and the other end of the twelfth conductive line is electrically connected to the first electrical path EP1. The tenth electrical path EP10 includes, for example, a thirteenth conductive line included in the first printed circuit board. One end of the thirteenth conductive line is electrically connected to the second end 1102 of the helical conductive pattern 1100, and the other end of the thirteenth conductive line is electrically connected to the second electrical path EP2. 【0249】 According to one embodiment, the wireless communication circuit 610 provides (or supplies) a + voltage to a first electrical path EP1 and a - voltage to a second electrical path EP2. The + voltage is provided to a first point P1 of the first metal E1 through the first electrical path EP1. The + voltage is provided to a first end 1101 of the helical conductive pattern 1100 through a ninth electrical path EP9. The - voltage is provided to a second point P2 of the seventh metal E7 through the second electrical path EP2. The - voltage is provided to a second end 1102 of the helical conductive pattern 1100 through a tenth electrical path EP10. 【0250】 According to one embodiment, when supplying positive power to the first electrical path EP1 and negative power to the second electrical path EP2, the embodiment in Figure 11 further provides a third current path through which current (or radiated current) flows along the helical conductive pattern 1100, and an electromagnetic field generated by the distribution of current (or radiated current) following the third current path, compared to the embodiment in Figure 6. The wireless communication circuit 610 is configured to transmit and / or receive signals in a selected or specified frequency band (e.g., about 13.56 MHz for NFC) through the electromagnetic field generated by the helical conductive pattern 1100. 【0251】 According to one embodiment, when viewed from above the first back region of the foldable electronic device 2, the helical conductive pattern 1100 overlaps with the second region 202 of the first back region. When positive power is supplied to the first electrical path EP1 and negative power is supplied to the second electrical path EP2, the electromagnetic field generated by the helical conductive pattern 1100 is radiated through the second region 202. 【0252】 In various embodiments, although not shown separately, the helical conductive pattern 1100 is housed in the first housing 21 (see Figure 2) such that, when viewed from above the first back region of the foldable electronic device 2, it overlaps with the third region 203 of the first back region. During positive power supply to the first electrical path EP1 and negative power supply to the second electrical path EP2, the electromagnetic field generated by the helical conductive pattern 1100 is radiated through the third region 203. 【0253】 According to various embodiments, although not shown separately, the helical conductive pattern 1100 can be housed in the second housing 22 (see Figure 2) such that, when viewed from above the second back region of the foldable electronic device 2, it overlaps with the fifth region 205 of the second back region. During positive power supply to the first electrical path EP1 and negative power supply to the second electrical path EP2, the electromagnetic field generated by the helical conductive pattern 1100 is radiated through the fifth region 205. 【0254】 According to various embodiments, although not shown separately, the helical conductive pattern 1100 can be housed in the second housing 22 (see Figure 2) such that, when viewed from above the second back region of the foldable electronic device 2, it overlaps with the sixth region 206 of the second back region. During positive power supply to the first electrical path EP1 and negative power supply to the second electrical path EP2, the electromagnetic field generated by the helical conductive pattern 1100 is radiated through the sixth region 206. 【0255】 According to one embodiment, when positive power is supplied to the first electrical path EP1 and negative power is supplied to the second electrical path EP2, the electromagnetic field generated corresponding to the first current path L1 (see Figure 7) including the first metal E1 is radiated through the first region 201 of the first back region of the foldable electronic device 2, and the electromagnetic field generated corresponding to the second current path L2 (see Figure 7) including the seventh metal E7 is radiated through the fourth region 204 of the second back region of the foldable electronic device 2. For example, the first region 201 of the first back region is less likely to be included in the grip position of the user's hand on the foldable electronic device 2 in an unfolded or folded state compared to the second region 202 and the third region 203 of the first back region. For example, the fourth region 204 of the second back region is less likely to be included in the grip position of the user's hand on the foldable electronic device 2 in an unfolded or folded state compared to the fifth region 205 and the sixth region 206 of the second back region. Even if the user's hand grip position on the foldable electronic device 2 in an unfolded or folded state overlaps with the spiral conductive pattern 1100, radiation performance can be ensured by ensuring that the electromagnetic field generated in correspondence with the first current path L1 (see Figure 7) including the first metal E1 is radiated through the first region 201, and / or that the electromagnetic field generated in correspondence with the second current path L2 (see Figure 7) including the seventh metal E7 is radiated through the fourth region 204. 【0256】 Figure 12 shows a foldable electronic device 2 in an unfolded state according to one embodiment of the present invention. It should be understood in the present invention that all combinations of features and / or embodiments disclosed in relation to Figure 12 are conceptually included. That is, all combinations of features described later in relation to Figure 12 should be considered to be included in the present invention as specific examples. 【0257】 Referring to Figure 12, the foldable electronic device 2 includes a first side metal 2112E comprising multiple metals (E1, E2, E3, E4, E5, E6), a second side metal 2212E comprising multiple metals (E7, E8, E9, E10, E11, E12), a first ground region G1, a second ground region G2, a first electrical path EP1, a second electrical path EP2, a fifth electrical path EP5, a sixth electrical path EP6, a seventh electrical path EP7, a wireless communication circuit 610, an EMI filter 620, a matching circuit 630, a first filter 640, a second filter 650, a helical conductive pattern 1100, a ninth electrical path EP9, and / or a tenth electrical path EP10. The second example antenna structure 900 includes a first metal E1, a seventh metal E7, a first ground region G1, a second ground region G2, a first electrical path EP1, a second electrical path EP2, a fifth electrical path EP5, a sixth electrical path EP6, and / or a seventh electrical path EP7. The embodiment in Figure 12 further includes a helical conductive pattern 1100, a ninth electrical path EP9, and a tenth electrical path EP10, compared to the embodiment in Figure 9. In Figure 12, descriptions of some components that are the same as those shown in Figure 9 and / or Figure 11 are omitted. 【0258】 According to one embodiment, the first end 1101 of the helical conductive pattern 1100 is electrically connected to the first electrical path EP1 through the ninth electrical path EP9. The second end 1102 of the helical conductive pattern 1100 is electrically connected to the second electrical path EP2 through the tenth electrical path EP10. 【0259】 According to one embodiment, the wireless communication circuit 610 provides (or supplies) a + voltage to the first electrical path EP1 and provides (or supplies) a - voltage to the second electrical path EP2. The + voltage is provided to the first point P1 of the first metal E1 through the first electrical path EP1. The + voltage is provided to the fourth point P4 of the seventh metal E7 through the sixth electrical path EP6. The + voltage is provided to the first end 1101 of the spiral conductive pattern 1100 through the ninth electrical path EP9. The - voltage is provided to the second point P2 of the seventh metal E7 through the second electrical path EP2. The - voltage is provided to the third point P3 of the first metal E1 through the seventh electrical path EP7. The - voltage is provided to the second end 1102 of the spiral conductive pattern 1100 through the tenth electrical path EP10. 【0260】 According to one embodiment, during the + power supply to the first electrical path EP1 and the - power supply to the second electrical path EP2, the embodiment of FIG. 12 further provides an electromagnetic field generated by the distribution of the current (or radiated current) flowing along the third current path along the spiral conductive pattern 1100 and the current (or radiated current) following the third current path compared to the embodiment of FIG. 9. The wireless communication circuit 610 is configured to transmit and receive signals in a selected or specified frequency band (for example, about 13.56 MHz related to NFC) through the electromagnetic field generated by the spiral conductive pattern 1100. 【0261】 According to one embodiment, when viewed from above the first back region of the foldable electronic device 2, the spiral conductive pattern 1100 overlaps the second region 202 of the first back region. During the + power supply to the first electrical path EP1 and the - power supply to the second electrical path EP2, the electromagnetic field generated by the spiral conductive pattern 1100 is radiated through the second region 202. 【0262】 According to various embodiments, although not shown separately, when viewed from above the first back region of the foldable electronic device 2, the spiral conductive pattern 1100 can be housed in the first housing 21 (see FIG. 2) so as to overlap with the third region 203 of the first back region. When + power is supplied to the first electrical path EP1 and - power is supplied to the second electrical path EP2, the electromagnetic field generated by the spiral conductive pattern 1100 is radiated through the third region 203. 【0263】 According to various embodiments, although not shown separately, when viewed from above the second back region of the foldable electronic device 2, the spiral conductive pattern 1100 can be housed in the second housing 22 (see FIG. 2) so as to overlap with the fifth region 205 of the second back region. When + power is supplied to the first electrical path EP1 and - power is supplied to the second electrical path EP2, the electromagnetic field generated by the spiral conductive pattern 1100 is radiated through the fifth region 205. 【0264】 According to various embodiments, although not shown separately, when viewed from above the second back region of the foldable electronic device 2, the spiral conductive pattern 1100 can be housed in the second housing 22 (see FIG. 2) so as to overlap with the sixth region 206 of the second back region. When + power is supplied to the first electrical path EP1 and - power is supplied to the second electrical path EP2, the electromagnetic field generated by the spiral conductive pattern 1100 is radiated through the sixth region 206. 【0265】 According to one embodiment, when positive power is supplied to the first electrical path EP1 and negative power is supplied to the second electrical path EP2, the electromagnetic field generated corresponding to the first current path including the first metal E1 is radiated through the first region 201 of the first back region of the foldable electronic device 2, and the electromagnetic field generated corresponding to the second current path including the seventh metal E7 is radiated through the fourth region 204 of the second back region of the foldable electronic device 2. For example, the first region 201 of the first back region is less likely to be included in the grip position of the user's hand on the foldable electronic device 2 in an unfolded or folded state compared to the second region 202 and the third region 203 of the first back region. For example, the fourth region 204 of the second back region is less likely to be included in the grip position of the user's hand on the foldable electronic device 2 in an unfolded or folded state compared to the fifth region 205 and the sixth region 206 of the second back region. Even when the user's hand grip position on the foldable electronic device 2 in an unfolded or folded state overlaps with the spiral conductive pattern 1100, radiation performance can be ensured by ensuring that the electromagnetic field generated in accordance with the first current path including the first metal E1 is radiated through the first region 201, and / or the electromagnetic field generated in accordance with the second current path including the seventh metal E7 is radiated through the fourth region 204. 【0266】 Figure 13 shows a foldable electronic device 2 in an unfolded state according to one embodiment of the present invention. It should be understood in the present invention that all combinations of features and / or embodiments disclosed in relation to Figure 13 are conceptually included. That is, all combinations of features described later in relation to Figure 13 should be considered to be included in the present invention as specific examples. 【0267】 Referring to Figure 13, the foldable electronic device 2 includes a first side metal 2112E comprising multiple metals (E1, E2, E3, E4, E5, E6), a second side metal 2212E comprising multiple metals (E7, E8, E9, E10, E11, E12), a first ground region G1, a second ground region G2, a first electrical path EP1, a second electrical path EP2, a fifth electrical path EP5, an eighth electrical path EP8, a wireless communication circuit 610, an EMI filter 620, a matching circuit 630, a first filter 640, a second filter 650, a helical conductive pattern 1100, a ninth electrical path EP9, and / or a tenth electrical path EP10. The third example antenna structure 1000 includes a first metal E1, a seventh metal E7, a first ground region G1, a second ground region G2, a first electrical path EP1, a second electrical path EP2, a fifth electrical path EP5, and / or an eighth electrical path EP8. The embodiment in Figure 13 further includes a helical conductive pattern 1100, a ninth electrical path EP9, and a tenth electrical path EP10, compared to the embodiment in Figure 10. In Figure 13, descriptions of some components that are the same as those shown in Figures 10 and / or 11 are omitted. 【0268】 According to one embodiment, the first end 1101 of the helical conductive pattern 1100 is electrically connected to the first electrical path EP1 through the ninth electrical path EP9. The second end 1102 of the helical conductive pattern 1100 is electrically connected to the second electrical path EP2 through the tenth electrical path EP10. 【0269】 According to one embodiment, the wireless communication circuit 610 provides (or supplies) a + voltage to a first electrical path EP1 and a - voltage to a second electrical path EP2. The + voltage is provided to a first point P1 of the first metal E1 through the first electrical path EP1. The + voltage is provided to a first end 1101 of the helical conductive pattern 1100 through a ninth electrical path EP9. The - voltage is provided to a second point P2 of the seventh metal E7 through the second electrical path EP2. The - voltage is provided to a second end 1102 of the helical conductive pattern 1100 through a tenth electrical path EP10. 【0270】 According to one embodiment, when supplying positive power to the first electrical path EP1 and negative power to the second electrical path EP2, the embodiment in Figure 13 further provides a third current path through which current (or radiated current) flows along the helical conductive pattern 1100, and an electromagnetic field generated by the distribution of current (or radiated current) following the third current path, compared to the embodiment in Figure 10. The wireless communication circuit 610 is configured to transmit and / or receive signals in a selected or specified frequency band (e.g., about 13.56 MHz for NFC) through the electromagnetic field generated by the helical conductive pattern 1100. 【0271】 According to one embodiment, when viewed from above the first back region of the foldable electronic device 2, the helical conductive pattern 1100 overlaps with the second region 202 of the first back region. When positive power is supplied to the first electrical path EP1 and negative power is supplied to the second electrical path EP2, the electromagnetic field generated by the helical conductive pattern 1100 is radiated through the second region 202. 【0272】 According to various embodiments, although not shown separately, the helical conductive pattern 1100 can be housed in the first housing 21 (see Figure 2) such that, when viewed from above the first back region of the foldable electronic device 2, it overlaps with the third region 203 of the first back region. During positive power supply to the first electrical path EP1 and negative power supply to the second electrical path EP2, the electromagnetic field generated by the helical conductive pattern 1100 is radiated through the third region 203. 【0273】 According to various embodiments, although not shown separately, the helical conductive pattern 1100 can be housed in the second housing 22 (see Figure 2) such that, when viewed from above the second back region of the foldable electronic device 2, it overlaps with the fifth region 205 of the second back region. During positive power supply to the first electrical path EP1 and negative power supply to the second electrical path EP2, the electromagnetic field generated by the helical conductive pattern 1100 is radiated through the fifth region 205. 【0274】 According to various embodiments, although not shown separately, the helical conductive pattern 1100 can be housed in the second housing 22 (see Figure 2) such that, when viewed from above the second back region of the foldable electronic device 2, it overlaps with the sixth region 206 of the second back region. During positive power supply to the first electrical path EP1 and negative power supply to the second electrical path EP2, the electromagnetic field generated by the helical conductive pattern 1100 is radiated through the sixth region 206. 【0275】 According to one embodiment, when positive power is supplied to the first electrical path EP1 and negative power is supplied to the second electrical path EP2, the electromagnetic field generated corresponding to the first current path including the first metal E1 is radiated through the first region 201 of the first back region of the foldable electronic device 2, and the electromagnetic field generated corresponding to the second current path including the seventh metal E7 is radiated through the fourth region 204 of the second back region of the foldable electronic device 2. For example, the first region 201 of the first back region is less likely to be included in the grip position of the user's hand on the foldable electronic device 2 in an unfolded or folded state compared to the second region 202 and the third region 203 of the first back region. For example, the fourth region 204 of the second back region is less likely to be included in the grip position of the user's hand on the foldable electronic device 2 in an unfolded or folded state compared to the fifth region 205 and the sixth region 206 of the second back region. Even when the user's hand grip position on the foldable electronic device 2 in an unfolded or folded state overlaps with the spiral conductive pattern 1100, radiation performance can be ensured by ensuring that the electromagnetic field generated in accordance with the first current path including the first metal E1 is radiated through the first region 201, and / or the electromagnetic field generated in accordance with the second current path including the seventh metal E7 is radiated through the fourth region 204. 【0276】 Figure 14 shows a heat map 1410 showing the magnetic field distribution during power supply in the folded state of a foldable electronic device 2 according to one embodiment of the present invention, a heat map 1420 showing the magnetic field distribution during power supply in the folded state of a foldable electronic device 1421 of the first comparative example, and a heat map 1430 showing the magnetic field distribution during power supply in the folded state of a foldable electronic device 1431 of the second comparative example. 【0277】 A foldable electronic device 2 according to one embodiment of the present invention is embodied in the embodiments shown in Figure 6, Figure 9, or Figure 10. The foldable electronic device 1421 of the first comparative example is configured such that, compared to the foldable electronic device 2 of Figure 6 according to the present invention, the second electrical path EP2 is electrically connected to the fourth point P4 of the seventh metal E7, and the fourth electrical path EP4 is electrically connected to the second point P2 of the seventh metal E7. The foldable electronic device 1421 of the first comparative example is configured such that, compared to the foldable electronic device 2 of Figure 9 according to the present invention, the second electrical path EP2 is electrically connected to the fourth point P4 of the seventh metal E7, and the sixth electrical path EP6 is electrically connected to the second point P2 of the seventh metal E7. The foldable electronic device 1421 of the first comparative example is configured such that, compared to the foldable electronic device 2 of Figure 10 according to the present invention, the second electrical path EP2 is electrically connected to the fourth point P4 of the seventh metal E7, and the eighth electrical path EP8 is electrically connected to the second point P2 of the seventh metal E7. The second comparative example foldable electronic device 1431, compared to the foldable electronic device 2 of Figure 6 according to the present invention, has the first electrical path EP1 electrically connected to the third point P3 of the first metal E1, and the third electrical path EP3 electrically connected to the first point P1 of the first metal E1. The second comparative example foldable electronic device 1431, compared to the foldable electronic device 2 of Figure 9 according to the present invention, has the first electrical path EP1 electrically connected to the third point P3 of the first metal E1, and the seventh electrical path EP7 electrically connected to the first point P1 of the first metal E1. The second comparative example foldable electronic device 1431, compared to the foldable electronic device 2 of Figure 10 according to the present invention, has the first electrical path EP1 electrically connected to the third point P3 of the first metal E1, and the eighth electrical path EP8 electrically connected to the first point P1 of the first metal E1. 【0278】 In the folded state of the electronic device 1421 of the first comparative example and the electronic device 1431 of the second comparative example, when power is supplied, current flows in opposite directions (for example, in reverse directions) in the first metal E1 and the seventh metal E7 which are aligned and overlapping with each other, causing mutual cancellation interference. The foldable electronic device 2 of the present invention, as shown in Figures 6, 9, or 10, allows current to flow in the same direction in the first metal E1 and the seventh metal E7 which are aligned and overlapping with each other in the folded state, compared to the electronic device 1421 of the first comparative example and the electronic device 1431 of the second comparative example, thereby providing an improved magnetic field strength and / or magnetic field distribution. 【0279】 Figure 15 is a circuit diagram of an antenna structure 1500 included in a foldable electronic device 2 according to one embodiment of the present invention. It should be understood in the present invention that all combinations of features and / or embodiments disclosed in connection with Figure 15 are conceptually included. That is, all combinations of features described later in connection with Figure 15 should be considered to be included in the present invention as specific examples. 【0280】 Referring to Figure 15, the antenna structure 1500 is part of the first example antenna structure 600 in Figure 6 or Figure 11, or the third example antenna structure 1000 in Figure 10 or Figure 13, and the first metal E1 and the seventh metal E7 are connected in series with the wireless communication circuit 610. 【0281】 According to one embodiment, the antenna structure 1500 includes a first current path (or first loop) L1 including a first metal E1, and a second current path (or second loop) L2 including a seventh metal E7. 【0282】 According to one embodiment, when power is supplied to the foldable electronic device 2 in its unfolded state, the current flow in the first current path L1 generates a first electromagnetic field (or first magnetic field distribution) 1511 (first electromagnetic field 711 in Figure 7), and the current flow in the second current path L2 generates a second electromagnetic field (or second magnetic field distribution) 1512. 【0283】 According to one embodiment, when power is supplied in the unfolded state of the foldable electronic device 2, the direction in which current (or radiated current) flows in the first metal E1 and the direction in which current (or radiated current) flows in the seventh metal E7 are the same. In the unfolded state of the foldable electronic device 2, a coil including a first turn by the first current path L1 and a second turn by the second current path L2 is formed. When power is supplied, the coil formed by the combination of the first turn of the first current path L1 and the second turn of the second current path L2 in the folded state of the foldable electronic device 2 generates an electromagnetic field in which the electromagnetic field 1511 generated by the first current path L1 and the electromagnetic field 1512 generated by the second current path L2 are combined, improving the radiation performance. 【0284】 According to one embodiment, in the antenna structure 1500, the portion connecting the first current path L1 and the second current path L2 (or the portion between the first current path L1 and the second current path L2) is provided (or formed) narrower than the first current path L1 and the second current path L2. In the antenna structure 1500, the portion connecting the first current path L1 and the second current path L2 is arranged across the hinge portion 24. In the antenna structure 1500, the portion connecting the first current path L1 and the second current path L2 is included in an integrated or single flexible printed circuit board (for example, the flexible printed circuit board 2500 in FIG. 25) extending from the first housing 21 (see FIG. 2) to the second housing 22 (see FIG. 2) across the hinge portion 24. In the form in which the portion connecting the first current path L1 and the second current path L2 in the antenna structure 1500 gathers on an integrated or single flexible printed circuit board, the portion connecting the first current path L1 and the second current path L2 in the antenna structure 1500 is formed narrower than the first current path L1 and the second current path L2. The form in which the portion connecting the first current path L1 and the second current path L2 in the antenna structure 1500 is narrower than the first current path L1 and the second current path L2 is called a "concave structure". 【0285】 Figure 16 shows a heat map 1610 showing the magnetic field distribution during power supply in the folded state of the foldable electronic device 2 according to one embodiment of the present invention, a heat map 1620 showing the magnetic field distribution during power supply in the folded state of the foldable electronic device 1621 of the third comparative example, and a heat map 1630 showing the magnetic field distribution during power supply in the folded state of the foldable electronic device 1631 of the fourth comparative example. Figure 17 shows the circuit diagram of the antenna structure 1710 according to one embodiment of the present invention and the circuit diagram of the antenna structure 1720 of the third comparative example. 【0286】 A foldable electronic device 2 according to one embodiment of the present invention is embodied in the embodiments shown in Figures 11, 12, or 13. The antenna structure 1710 in Figure 17, included in the foldable electronic device 2 according to the present invention, is included in the first example antenna structure 600 in Figure 11, the second example antenna structure 900 in Figure 12, or the third example antenna structure 1000 in Figure 13, and the first metal E1 and the helical conductive pattern 1100 are connected in parallel to the wireless communication circuit 610. In the antenna structure 1720 included in the third comparative example foldable electronic device 1621, the first metal E1 and the helical conductive pattern 1100 are connected in series to the wireless communication circuit 610. The fourth comparative example foldable electronic device 1731 does not include the first example antenna structure 600 in Figure 11, the second example antenna structure 900 in Figure 12, or the third example antenna structure 1000 in Figure 13, compared to the foldable electronic device 2 according to the present invention. 【0287】 An antenna structure 1710 included in a foldable electronic device 2 according to one embodiment of the present invention includes a first current path (or first loop) L1 including a first metal E1, and a third current path (or third loop) L3 including a helical conductive pattern 1100. When power is supplied, the current flow in the first current path L1 generates a first electromagnetic field (or first magnetic field distribution) 1711 (first electromagnetic field 711 in Figure 7), and the current flow in the third current path L3 generates a third electromagnetic field (or third magnetic field distribution) 1712. The direction in which the current (or radiated current) flows in the first metal E1 and the direction in which the current (or radiated current) flows in the helical conductive pattern 1000 are substantially opposite when viewed from the loop including the first current path L1 and the second current path L2. 【0288】 The antenna structure 1720 of the foldable electronic device 1621 of the third comparative example includes a fourth current path (or fourth loop) L4 including a first metal E1, and a fifth current path (or fifth loop) L5 including a helical conductive pattern 1100. During feeding, the current flow in the fourth current path L4 generates a fourth electromagnetic field (or fourth magnetic field distribution) 1721, and the current flow in the fifth current path L5 generates a fifth electromagnetic field (or fifth magnetic field distribution) 1722. The direction in which the current (or radiated current) flows in the first metal E1 and the direction in which the current (or radiated current) flows in the helical conductive pattern 1000 are substantially the same when viewed from the loops including the fourth current path L4 and the fifth current path L5. The portion connecting the fourth current path L4 and the fifth current path L5 in the antenna structure 1720 according to the third comparative example (or the portion between the fourth current path L4 and the fifth current path L5) is provided (or formed) as a narrower concave structure compared to the fourth current path L4 and the fifth current path L5. The antenna structure 1720 of the third comparative example generates a sixth electromagnetic field (or sixth magnetic field distribution) 1723 by the flow of current on the sixth current path L6 corresponding to the concave structure. The antenna structure 1720 of the third comparative example generates a seventh electromagnetic field (or seventh magnetic field distribution) 1724 by the flow of current on the seventh current path L7 corresponding to the concave structure. The antenna structure 1720 of the third comparative example further includes a sixth electromagnetic field 1723 and a seventh electromagnetic field 1724 in addition to the fourth electromagnetic field 1721 and the fifth electromagnetic field 1722, and has a broad electromagnetic field distribution. The electromagnetic field distribution of the antenna structure 1720 according to the third comparative example can provide a wide NFC recognition area for external electronic devices, but it may relatively reduce the NFC recognition distance to external electronic devices. The sixth electromagnetic field 1723 and the seventh electromagnetic field 1724 are interpreted as electromagnetic field leakage that relatively weakens the fourth electromagnetic field 1721 and the fifth electromagnetic field 1722. 【0289】 The antenna structure 1710 according to one embodiment of the present invention can reduce electromagnetic field leakage corresponding to the concave structure (for example, the portion connecting the first current path L1 and the third current path L3) compared to the antenna structure 1720 of the third comparative example. The antenna structure 1710 according to one embodiment of the present invention can improve the intensity or distribution of the first electromagnetic field 1711 and the third electromagnetic field 1712 compared to the antenna structure 1720 of the third comparative example. The antenna structure 1710 according to the present invention can relatively improve the NFC recognition distance with external electronic devices compared to the antenna structure 1720 of the third comparative example. 【0290】 The foldable electronic device 2 according to one embodiment of the present invention includes an antenna structure 1710 compared to the foldable electronic device 1631 of the fourth comparative example, and can expand the electromagnetic field distribution. The foldable electronic device 2 according to one embodiment of the present invention can expand the NFC recognition area through the antenna structure 1710 compared to the foldable electronic device 1631 of the fourth comparative example. For example, compared to the foldable electronic device 1631 of the fourth comparative example, even if the user's hand grip position on the foldable electronic device 2 in an unfolded or folded state overlaps with the spiral conductive pattern 1100, radiation performance can be ensured through the antenna structure 1710. 【0291】 According to various embodiments, in the embodiments of Figures 6, 9, 10, 11, 12, or 13, the wireless communication circuit 610 may be configured to provide (or supply) a + voltage to the second electrical path EP2 and a - voltage to the first electrical path EP1. 【0292】 Figure 18 shows a foldable electronic device 2 in an unfolded state according to one embodiment of the present invention. It should be understood in the present invention that all combinations of features and / or embodiments disclosed in relation to Figure 18 are conceptually included. That is, all combinations of features described later in relation to Figure 18 should be considered to be included in the present invention as specific examples. 【0293】 Referring to Figure 18, the foldable electronic device 2 includes a first side metal 2112E comprising multiple metals (E1, E2, E3, E4, E5, E6), a second side metal 2212E comprising multiple metals (E7, E8, E9, E10, E11, E12), a first ground area G1, a second ground area G2, a first non-ground area NG1, a second non-ground area NG2, a third non-ground area NG3, a fourth non-ground area NG4, a first electrical path EP1, a second electrical path EP2, a third electrical path EP3, a fourth electrical path EP4, a fifth electrical path EP5, an eleventh electrical path E11, a twelfth electrical path E12, a thirteenth electrical path E13, a fourteenth electrical path E14, a wireless communication circuit 610, an EMI filter 620, a matching circuit 630, a first filter 640, and / or a second filter 650. The fourth example antenna structure 1800 includes a first metal E1, a seventh metal E7, a fifth metal E5, an eleventh metal E11, a first ground region G1, a second ground region G2, a first electrical path EP1, a second electrical path EP2, a third electrical path EP3, a fourth electrical path EP4, a fifth electrical path EP5, an eleventh electrical path 11, a twelfth electrical path E12, a thirteenth electrical path E13, and / or a fourteenth electrical path E14. The embodiment in Figure 18 further includes an eleventh electrical path EP11 and a twelfth electrical path EP12 compared to the embodiment in Figure 6. In Figure 18, descriptions of some components that are the same as those shown in Figure 6 are omitted. 【0294】 According to one embodiment, the 11th electrical path E11 electrically connects the first electrical path E1 and the fifth metal E5. The fifth point P5 on the fifth metal E5 is electrically connected to the first electrical path E11. The 11th electrical path E11 is housed in the first housing 21 (see Figure 2). The 11th electrical path E11 includes one or more combinations of conductive paths (or conductors or conductive structures) between the first electrical path E1 and the fifth metal E5 (not shown). 【0295】 According to one embodiment, the 13th electrical path E13 electrically connects the 5th metal E5 and the 1st ground area G1. The 7th point P7 on the 5th metal E5 is electrically connected to the 13th electrical path E13. The 13th electrical path E13 is housed in the 1st housing 21 (see Figure 2). The 13th electrical path E13 includes one or more combinations of conductive paths (or conductors or conductive structures) (not shown) between the 5th metal E5 and the 1st ground area G1. 【0296】 According to one embodiment, the seventh point P7 on the fifth metal E5 is positioned closer to the hinge portion 24 than the fifth point P5 on the fifth metal E5. 【0297】 According to one embodiment, the 12th electrical path E12 electrically connects the 2nd electrical path E2 and the 11th metal E11. The 6th point P6 on the 11th metal E11 is electrically connected to the 12th electrical path E12. The 12th electrical path E12 is housed in the 2nd housing 22 (see Figure 2). The 12th electrical path E12 includes one or more combinations of conductive paths (or conductors or conductive structures) (not shown) between the 2nd electrical path E2 and the 11th metal E11. 【0298】 According to one embodiment, the 14th electrical path E14 electrically connects the 11th metal E11 and the second ground area G2. The 7th point P7 on the 11th metal E11 is electrically connected to the 14th electrical path E14. The 14th electrical path E14 is housed in the second housing 22 (see Figure 2). The 14th electrical path E14 includes one or more combinations of conductive paths (or conductors or conductive structures) (not shown) between the 11th metal E11 and the second ground area G2. 【0299】 According to one embodiment, the sixth point P6 on the eleventh metal E11 is located closer to the hinge portion 24 than the eighth point P8 on the eleventh metal E11. 【0300】 According to one embodiment, the wireless communication circuit 610 provides (or supplies) a + voltage to a first electrical path EP1 and a - voltage to a second electrical path EP2. The + voltage is provided to a first point P1 of the first metal E1 through the first electrical path EP1. The + voltage is provided to a fifth point P5 of the fifth metal E5 through an eleventh electrical path EP11. The - voltage is provided to a second point P2 of the seventh metal E7 through the second electrical path EP2. The - voltage is provided to a sixth point P6 of the eleventh metal E11 through a twelfth electrical path EP12. 【0301】 In one embodiment, when supplying positive power to the first electrical path EP1 and negative power to the second electrical path EP2, the embodiment in Figure 18 further provides a third current path through which current (or radiated current) flows along the fifth metal E5 and an electromagnetic field generated by the distribution of current (or radiated current) following the third current path, compared to the embodiment in Figure 6. When supplying positive power to the first electrical path EP1 and negative power to the second electrical path EP2, the embodiment in Figure 18 further provides a fourth current path through which current (or radiated current) flows along the eleventh metal E11 and an electromagnetic field generated by the distribution of current (or radiated current) following the fourth current path, compared to the embodiment in Figure 6. The wireless communication circuit 610 is configured to transmit and / or receive signals in a selected or specified frequency band (e.g., about 13.56 MHz for NFC) through the electromagnetic fields generated by the first metal E1, the fifth metal E5, the seventh metal E7, and the eleventh metal E11 in the folded state of the foldable electronic device 2. 【0302】 According to one embodiment, in the folded state of the foldable electronic device 2, when power is supplied, the radiated current flows in the same direction on the first metal E1 and the fifth metal E5. In the folded state of the foldable electronic device 2, when power is supplied, the radiated current flows in the same direction on the fifth metal E5 and the eleventh metal E11. In the folded state of the foldable electronic device 2, when power is supplied, the radiated current flows in the same direction on the first metal E1 and the seventh metal E7 which are aligned with each other. In the folded state of the foldable electronic device 2, when power is supplied, the radiated current flows in the same direction on the fifth metal E5 and the eleventh metal E11 which are aligned with each other. 【0303】 According to one embodiment, in the folded state of the foldable electronic device 2, the electromagnetic field generated by the fifth metal E5 during power supply is radiated through the third region 203. In the folded state of the foldable electronic device 2, the electromagnetic field generated by the eleventh metal E11 during power supply is radiated through the sixth region 206. 【0304】 According to one embodiment, the third non-ground region NG3 is located corresponding to the third edge B3. The fifth metal E5 is physically separated from the first ground region G1, for example, by the third non-ground region NG3. The third non-ground region NG3 includes a third opening in the form of a notch formed in the first ground region G1, for example, corresponding to the fifth metal E5. The third non-ground region NG3 includes, for example, a non-conductive material placed in the third opening. 【0305】 According to one embodiment, the fourth non-ground region NG4 is located corresponding to the seventh edge B7. The eleventh metal E11 is physically separated from the second ground region G2, for example, by the fourth non-ground region NG4. The fourth non-ground region NG4 includes a fourth opening in the form of a notch formed in the second ground region G2, for example, corresponding to the eleventh metal E11. The fourth non-ground region NG4 includes a non-conductive material disposed in the fourth opening, for example. 【0306】 According to one embodiment, in the folded state of the foldable electronic device 2, the third non-ground region NG3 and the fourth non-ground region NG4 are aligned and overlapping with each other. In the folded state of the foldable electronic device 2, the electromagnetic force of the electromagnetic field radiated through the fifth metal E5 and the electromagnetic force of the electromagnetic field radiated through the eleventh metal E11 during power supply pass through the aligned and overlapping third non-ground region NG3 and fourth non-ground region NG4. By preventing the magnetic flux of the third non-ground region NG3 from being reduced by the first ground region G1, and by preventing the magnetic flux of the fourth non-ground region NG4 from being reduced by the second ground region G2, the reduction in the radiation performance of the antenna structure 1800 of the fourth example can be reduced. 【0307】 Figure 19 shows a foldable electronic device 2 in an unfolded state according to one embodiment of the present invention. It should be understood in the present invention that all combinations of features and / or embodiments disclosed in relation to Figure 19 are conceptually included. That is, all combinations of features described later in relation to Figure 19 should be considered to be included in the present invention as specific examples. 【0308】 Referring to Figure 19, the foldable electronic device 2 includes a first side metal 2112E containing multiple metals (E1, E2, E3, E4, E5, E6), a second side metal 2212E containing multiple metals (E7, E8, E9, E10, E11, E12), a first ground area G1, a second ground area G2, a first non-ground area NG1, a second non-ground area NG2, a first electrical path EP1, a fifth electrical path EP5, a fifteenth electrical path EP15, a sixteenth electrical path EP16, a seventeenth electrical path EP17, a eighteenth electrical path EP18, a balun 1901, a wireless communication circuit 610, an EMI filter 620, a matching circuit 630, a first filter 640, and / or a second filter 650. The fifth example antenna structure 1900 includes a first metal E1, a seventh metal E7, a first ground region G1, a second ground region G2, a first electrical path EP1, a fifth electrical path EP5, a fifteenth electrical path EP15, a sixteenth electrical path EP16, a seventeenth electrical path EP17, a eighteenth electrical path EP18, and a balun 1901. In Figure 19, descriptions of some components that are the same as the reference numerals in the drawings described above are omitted. 【0309】 According to one embodiment, the balun 1901 is housed in a first housing 21. The balun 1901 is placed on a printed circuit board (not shown) housed in the first housing 21. 【0310】 According to one embodiment, the first point P1 of the first metal E1 is electrically connected to the balun 1901 through the first electrical path EP1. 【0311】 According to one embodiment, the first filter 640 is located in or electrically connected to the first electrical path EP1. 【0312】 According to one embodiment, the balun 1901 is electrically connected to the wireless communication circuit 610 through a 15th electrical path EP15. The 15th electrical path EP15 is housed in the first housing 21. The 15th electrical path EP15 includes one or more combinations of conductive paths (or conductors or conductive structures) (not shown) between the balun 1901 and the wireless communication circuit 610. 【0313】 According to one embodiment, the balun 1901 is electrically connected to the wireless communication circuit 610 through a 16th electrical path EP16. The 16th electrical path EP16 is housed in the first housing 21. The 16th electrical path EP16 includes one or more conductive paths (or conductors or conductive structures) (not shown) between the balun 1901 and the wireless communication circuit 610. 【0314】 According to one embodiment, the EMI filter 620 and the matching circuit 630 are located in the 15th electrical path EP15 and / or the 16th electrical path EP16, or are electrically connected to the 15th electrical path EP15 and / or the 16th electrical path EP16. 【0315】 According to one embodiment, the 17th electrical path EP17 electrically connects the 3rd point P3 of the 1st metal E1 and the 4th point P4 of the 7th metal E7. The 17th electrical path EP17 is arranged across the hinge portion 24. The 17th electrical path EP17 includes one or more combinations of conductive paths (or conductors or conductive structures) (not shown) between the 3rd point P3 of the 1st metal E1 and the 4th point P4 of the 7th metal E7. 【0316】 According to one embodiment, the second point P2 of the seventh metal P7 is electrically connected to the second ground region G2 through the 18th electrical path EP18. The 18th electrical path EP18 includes one or more combinations of conductive paths (or conductors or conductive structures) (not shown) between the second point P2 of the seventh metal P7 and the second ground region G2. 【0317】 According to one embodiment, the second filter 640 is located in or electrically connected to the 18th electrical path EP18. Although not shown separately, the second filter 640 may be located in or electrically connected to the 17th electrical path EP17. 【0318】 According to one embodiment, the wireless communication circuit 610 provides a first power supply (e.g., a + voltage) to the 15th electrical path EP15 and a second power supply (e.g., a - voltage) to the 16th electrical path EP16. The balun 1901 transmits one of the power supplies, the first power supply via the 15th electrical path EP15 and the second power supply via the 16th electrical path EP16, to the first electrical path EP1. Of the first and second power supplies, the one selected by the balun 1901 is provided to the first point P1 of the first metal E1 through the first electrical path EP1. 【0319】 According to one embodiment, when the foldable electronic device 2 is in a folded state and power is supplied, a radiated current flows on the first metal E1 and the seventh metal E7 due to the potential difference between a first point P1 of the first metal E1, which is electrically connected to the first electrical path EP1, and a second point P2 of the seventh metal E7, which is electrically connected to the second ground region G2 through the eighteenth electrical path EP18. When the foldable electronic device 2 is in a folded state and power is supplied, the radiated current flows in the same direction on the first metal E1 and the seventh metal E7, which are aligned with each other. The wireless communication circuit 610 is configured to transmit and / or receive signals in a selected or specified frequency band (e.g., about 13.56 MHz for NFC) through the electromagnetic field generated by the first metal E1 and the seventh metal E7 when the foldable electronic device 2 is in a folded state. 【0320】 Figure 20 shows a foldable electronic device 2 in an unfolded state according to one embodiment of the present invention. It should be understood in the present invention that all combinations of features and / or embodiments disclosed in relation to Figure 20 are conceptually included. That is, all combinations of features described later in relation to Figure 20 should be considered to be included in the present invention as specific examples. 【0321】 Referring to Figure 20, the foldable electronic device 2 includes a first side metal 2112E comprising multiple metals (E1, E2, E3, E4, E5, E6), a second side metal 2212E comprising multiple metals (E7, E8, E9, E10, E11, E12), a first ground region G1, a second ground region G2, a first non-ground region NG1, a second non-ground region NG2, a first electrical path EP1, a second electrical path EP2, a third electrical path EP3, a fourth electrical path EP4, a fifth electrical path EP5, a phase shifter 2001, a wireless communication circuit 610, an EMI filter 620, a matching circuit 630, a first filter 640, and / or a second filter 650. The sixth example antenna structure 2000 includes a first metal E1, a seventh metal E7, a first ground region G1, a second ground region G2, a first electrical path EP1, a second electrical path EP2, a third electrical path EP3, a fourth electrical path EP4, a fifth electrical path EP5, and a phase converter 2001. In Figure 20, descriptions of some components that are the same as the reference numerals in the drawings described above are omitted. 【0322】 According to one embodiment, a first point P1 of the first metal E1 is electrically connected to a wireless communication circuit 610 through a first electrical path EP1. The first electrical path EP1 is housed in a first housing 21 (see Figure 2). The first electrical path EP1 includes one or more combinations of conductive paths (or conductors or conductive structures) (not shown) between the first point P1 of the first metal E1 and the wireless communication circuit 610. 【0323】 According to one embodiment, a second point P2 of the first metal E1 is electrically connected to a first ground region G1 through a third electrical path EP3. The third electrical path EP3 is housed in a first housing 21 (see Figure 2). The third electrical path EP3 includes one or more combinations of conductive paths (or conductors or conductive structures) (not shown) between the third point P3 of the first metal E1 and the first ground region G1. 【0324】 According to one embodiment, the second point P2 of the seventh metal E7 is electrically connected to the second ground region G2 through a fourth electrical path EP4. The fourth electrical path EP4 is housed in a second housing 22 (see Figure 2). The fourth electrical path EP4 includes one or more combinations of conductive paths (or conductors or conductive structures) (not shown) between the second point P2 of the seventh metal E7 and the second ground region G2. 【0325】 According to one embodiment, the fourth point P4 of the seventh metal E7 is electrically connected to the wireless communication circuit 610 through a second electrical path EP2. The second electrical path EP2 is arranged across the hinge portion 24. The second electrical path EP2 includes one or more combinations (not shown) of conductive paths (or conductors or conductive structures) between the fourth point P4 of the seventh metal E7 and the wireless communication circuit 610. 【0326】 According to one embodiment, the phase converter 2001 is located in the second electrical path EP2. The phase converter 2001 is housed in a second housing 22 (see Figure 2). The phase converter 2001 is located on a printed circuit board (not shown) housed in the second housing 22. 【0327】 According to one embodiment, although not shown separately, the phase converter 2001 may be housed in a first housing 21 (see Figure 2). The phase converter 2001 is placed on a printed circuit board (not shown) housed in the first housing 21. 【0328】 According to one embodiment, although not shown separately, the phase converter 2001 may be located in the 15th electrical path EP15 and / or the 16th electrical path EP16, or be electrically connected to the 15th electrical path EP15 and / or the 16th electrical path EP16. The phase converter 2001 is located, for example, between the wireless communication circuit 610 and the EMI filter 620. The phase converter 2001 is located, for example, between the EMI filter 620 and the matching circuit 630. 【0329】 According to one embodiment, the wireless communication circuit 610 provides a first power supply (e.g., a + voltage) to a first electrical path EP1 and a second power supply (e.g., a - voltage) to a second electrical path EP2. The phase converter 2001, in the folded state of the foldable electronic device 2, matches the phase of the radiated current flowing on the first metal E1 and the radiated current flowing on the seventh metal E7, which are aligned with each other, when power is supplied from the wireless communication circuit 610. 【0330】 Figure 21 shows a foldable electronic device 2 in an unfolded state according to one embodiment of the present invention. It should be understood in the present invention that all combinations of features and / or embodiments disclosed in relation to Figure 21 are conceptually included. That is, all combinations of features described later in relation to Figure 21 should be considered to be included in the present invention as specific examples. 【0331】 Referring to Figure 21, the foldable electronic device 2 includes a first side metal 2112E comprising multiple metals (E1, E2, E3, E4, E5, E6), a second side metal 2212E comprising multiple metals (E7, E8, E9, E10, E11, E12), a first ground region G1, a second ground region G2, a first non-ground region NG1, a second non-ground region NG2, a first electrical path EP1, a fifth electrical path EP5, a fifteenth electrical path EP15, a sixteenth electrical path EP16, a seventeenth electrical path EP17, a eighteenth electrical path EP18, a balun 1901, a phase converter 2001, a wireless communication circuit 610, an EMI filter 620, a matching circuit 630, a first filter 640, and / or a second filter 650. The seventh example antenna structure 2100 includes a first metal E1, a seventh metal E7, a first ground region G1, a second ground region G2, a first electrical path EP1, a fifth electrical path EP5, a fifteenth electrical path EP15, a sixteenth electrical path EP16, a seventeenth electrical path EP17, a eighteenth electrical path EP18, a balun 1901, and a phase converter 2001. In Figure 21, descriptions of some components that are the same as the reference numerals in the drawings described above are omitted. 【0332】 According to one embodiment, the first point P1 of the first metal E1 is electrically connected to the balun 1901 through the first electrical path EP1. 【0333】 According to one embodiment, the balun 1901 is electrically connected to the wireless communication circuit 610 through a 15th electrical path EP15. The balun 1901 is electrically connected to the wireless communication circuit 610 through a 16th electrical path EP16. The wireless communication circuit 610 provides a first power supply (e.g., + voltage) to the 15th electrical path EP15 and a second power supply (e.g., - voltage) to the 16th electrical path EP16. The balun 1901 transmits one of the power supplies, the first power supply through the 15th electrical path EP15 and the second power supply through the 16th electrical path EP16, to the first electrical path EP1. Of the first and second power supplies, the power supply selected by the balun 1901 is provided to a first point P1 of the first metal E1 through the first electrical path EP1. 【0334】 According to one embodiment, the 17th electrical path EP17 electrically connects the 3rd point P3 of the 1st metal E1 and the 4th point P4 of the 7th metal E7. The 17th electrical path EP17 is arranged across the hinge portion 24. 【0335】 According to one embodiment, the phase converter 2001 is located in the 17th electrical path EP17. 【0336】 According to one embodiment, the phase converter 2001 is housed in a first housing 21 (see Figure 2). The phase converter 2001 is placed on a printed circuit board (not shown) housed in the first housing 21. 【0337】 According to one embodiment, although not shown separately, the phase converter 2001 may be housed in a second housing 22 (see Figure 2). The phase converter 2001 is placed on a printed circuit board (not shown) housed in the first housing 22. 【0338】 According to one embodiment, the second point P2 of the seventh metal P7 is electrically connected to the second ground area G2 through the 18th electrical path EP18. 【0339】 According to one embodiment, in the folded state of the foldable electronic device 2, a radiated current flows on the first metal E1 and the seventh metal E7 due to the potential difference between a first point P1 of the first metal E1, which is electrically connected to the first electrical path EP1 during power supply, and a second point P2 of the seventh metal E7, which is electrically connected to the second ground region G2 through the eighteenth electrical path EP18. In the folded state of the foldable electronic device 2, the radiated current flows in the same direction on the first metal E1 and the seventh metal E7, which are aligned with each other during power supply. The wireless communication circuit 610 is configured to transmit and / or receive signals in a selected or specified frequency band (e.g., about 13.56 MHz for NFC) through the electromagnetic field generated by the first metal E1 and the seventh metal E7 in the folded state of the foldable electronic device 2. 【0340】 According to one embodiment, the phase converter 2001, in the folded state of the foldable electronic device 2, matches the phase of the radiated current flowing on the first metal E1 and the phase of the radiated current flowing on the seventh metal E7, which are aligned with each other when power is supplied from the wireless communication circuit 610. 【0341】 Figure 22 shows a foldable electronic device 2 in an unfolded state according to one embodiment of the present invention. It should be understood in the present invention that all combinations of features and / or embodiments disclosed in relation to Figure 22 are conceptually included. That is, all combinations of features described later in relation to Figure 22 should be considered to be included in the present invention as specific examples. 【0342】 Referring to Figure 22, the foldable electronic device 2 includes a first side metal 2112E containing multiple metals (E1, E2, E3, E4, E5, E6), a second side metal 2212E containing multiple metals (E7, E8, E9, E10, E11, E12), a first ground region G1, a second ground region G2, a first electrical path EP1, a fifth electrical path EP5, an eleventh electrical path EP11, a wireless communication circuit 610, an EMI filter 620, a matching circuit 630, a first filter 640, and / or a third filter 660. In Figure 22, descriptions of some components that are the same as those shown in Figure 6 are omitted. 【0343】 According to one embodiment, the eighth example antenna structure 2200 included in the foldable electronic device 2 includes a first metal E1, a seventh metal E7, a first ground region G1, a second ground region G2, a first electrical path EP1, a fifth electrical path EP5, and / or an eleventh electrical path EP11. 【0344】 According to one embodiment, the 11th electrical path EP11 electrically connects the wireless communication circuit 610 and the third point P3 of the first metal E1. The first metal E1 is electrically connected to the third point P3 of the first metal E1 through the 11th electrical path EP11. The 11th electrical path EP11 includes one or more combinations of conductive paths (or conductors or conductive structures) (not shown) between the wireless communication circuit 610 and the third point P3 of the first metal E1. 【0345】 According to one embodiment, the wireless communication circuit 610 provides (or supplies) a + voltage to a first electrical path EP1 and a - voltage to an eleventh electrical path EP11. The + voltage is provided to a first point P1 of the first metal E1 through the first electrical path EP1. The - voltage is provided to a third point P3 of the first metal E1 through the eleventh electrical path EP11. 【0346】 According to one embodiment, when positive power is supplied to the first electrical path EP1 and negative power is supplied to the eleventh electrical path EP11, a current flow corresponding to the first metal E1 is provided (or formed). The current flow has a current path (or loop) through the first metal E1, through which current (or radiated current) flows from the first electrical path EP1 to the eleventh electrical path EP11. The current path and the distribution of current (or radiated current) following the current path form an electromagnetic field (or magnetic field distribution). 【0347】 According to one embodiment, when supplying positive power to the first electrical path EP1 and negative power to the 11th electrical path EP11, an electromagnetic field including an electromagnetic force passing through the first non-ground region NG1 between the first metal E1 and the first ground region G1 is provided (or formed). 【0348】 According to one embodiment, the wireless communication circuit 610 is configured to transmit and / or receive signals of a selected or specified frequency band through an electromagnetic field generated in correspondence with the current path including the first metal E1 when supplying positive power to the first electrical path EP1 and negative power to the eleventh electrical path EP11. 【0349】 According to one embodiment, the wireless communication circuit 610 is configured to transmit and / or receive signals of approximately 13.56 MHz related to NFC through an electromagnetic field generated in correspondence with a current path including a first metal E1. 【0350】 According to one embodiment, in the folded state of the foldable electronic device 2 (see Figure 3), the first non-ground region NG1 and the second non-ground region NG2 are aligned and overlapping with each other. When positive power is supplied to the first electrical path EP1 and negative power is supplied to the 11th electrical path EP11, the electromagnetic force of the electromagnetic field generated corresponding to the current path including the first metal E1 passes through the first non-ground region NG1 and the second non-ground region NG2, which are aligned and overlapping with each other. The second non-ground region NG2 prevents the magnetic flux from being reduced by the second ground region G2, thereby reducing the decrease in the radiation performance of the antenna structure 2200 of the 8th example. When the reduction in magnetic flux by the second non-ground region NG2 is reduced in the folded state of the foldable electronic device 2, the energy of the electromagnetic field increases due to the increase in the inductance value, and the radiation performance of the antenna structure 2200 of the 8th example can be improved. 【0351】 According to one embodiment, the EMI filter 620 is located in or electrically connected to the first electrical path EP1 and / or the eleventh electrical path EP11. The EMI filter 620 reduces or shields noise affecting a selected or specified frequency band (e.g., an NFC signal). 【0352】 According to one embodiment, the matching circuit 630 is located in or electrically connected to the first electrical path EP1 and / or the eleventh electrical path EP11. The matching circuit 630 adjusts the frequency of the eighth example antenna structure 2200 so that resonance occurs in a selected or specified frequency band. The matching circuit 630 shifts the resonant frequency of the eighth example antenna structure 2200 to a specified frequency, or shifts the resonant frequency by a specified amount. 【0353】 According to one embodiment, when positive power is supplied to the first electrical path EP1 and negative power is supplied to the eleventh electrical path EP11, the matching circuit 630 adjusts the frequency of the antenna structure 2200 of the eighth example so that the electromagnetic field generated in correspondence with the current path including the first metal E1 has a resonant frequency of approximately 13.56 MHz with respect to NFC. 【0354】 According to one embodiment, the matching circuit 630 adjusts the inductance of the antenna structure 2200 of the eighth example so that it has a specified inductance value when positively feeding power to the first electrical path EP1 and negatively feeding power to the eleventh electrical path EP11. For example, when positively feeding power to the first electrical path EP1 and negatively feeding power to the eleventh electrical path EP11, the matching circuit 630 adjusts the inductance of the antenna structure 2200 of the eighth example so that the electromagnetic field generated in accordance with the current path including the first metal E1 has an inductance value of about 8 to about 10 μH for about 13.56 MHz with respect to NFC. 【0355】 According to one embodiment, the matching circuit 630 provides (or forms) impedance matching. When supplying positive power to the first electrical path EP1 and negative power to the eleventh electrical path EP11, the matching circuit 630 reduces transmission loss through impedance matching. 【0356】 According to one embodiment, the first filter 640 is located in or electrically connected to the first electrical path EP1. When the first metal E1 is used as an antenna radiator in a non-NFC band such as LB, MB, HB, or UHB, the first filter 640 reduces the influence (e.g., electromagnetic interference) that the antenna structure 2200 of the eighth example has on the non-NFC band. For example, when the first metal E1 is used as an antenna radiator in a non-NFC band such as LB, MB, HB, or UHB, the first filter 640 reduces or prevents the occurrence of resonance in the NFC band. 【0357】 According to one embodiment, the first filter 640 is provided as at least one filter (also referred to as a filter circuit), at least one switch (also referred to as a switch circuit), or a combination thereof. 【0358】 According to one embodiment, the first filter 640 includes a diplexer or duplexer that separates and transmits the NFC band and the NFC band separately. 【0359】 According to one embodiment, the third filter 660 is located in or electrically connected to the 11th electrical path EP11. When the first metal E1 is used as an antenna radiator in a non-NFC band such as LB, MB, HB, or UHB, the third filter 660 reduces the influence (e.g., electromagnetic interference) that the antenna structure 2200 of the 8th example has on the non-NFC band. For example, when the first metal E1 is used as an antenna radiator in a non-NFC band such as LB, MB, HB, or UHB, the third filter 660 reduces or prevents the occurrence of resonance in the NFC band. 【0360】 According to one embodiment, the third filter 660 is provided as at least one filter (also referred to as a filter circuit), at least one switch (also referred to as a switch circuit), or a combination thereof. 【0361】 According to one embodiment, the third filter 660 includes a diplexer or duplexer that separates and transmits the NFC band and the NFC band. 【0362】 Figure 23 shows a foldable electronic device 2 in an unfolded state according to one embodiment of the present invention. It should be understood in the present invention that all combinations of features and / or embodiments disclosed in relation to Figure 23 are conceptually included. That is, all combinations of features described later in relation to Figure 23 should be considered to be included in the present invention as specific examples. 【0363】 Referring to Figure 23, the foldable electronic device 2 includes a first side metal 2112E containing multiple metals (E1, E2, E3, E4, E5, E6), a second side metal 2212E containing multiple metals (E7, E8, E9, E10, E11, E12), a first ground region G1, a second ground region G2, a first electrical path EP1, a fifth electrical path EP5, an eleventh electrical path EP11, a wireless communication circuit 610, an EMI filter 620, a matching circuit 630, a first filter 640, a third filter 660, a helical conductive pattern 1100, a ninth electrical path EP9, and / or a tenth electrical path EP10. The antenna structure 2200 of the eighth example includes a first metal E1, a seventh metal E7, a first ground region G1, a second ground region G2, a first electrical path EP1, a fifth electrical path EP5, and / or an eleventh electrical path EP11. The embodiment in Figure 19 further includes a helical conductive pattern 1100, a ninth electrical path EP9, and a tenth electrical path EP10, compared to the embodiment in Figure 18. In Figure 23, descriptions of some components that are the same as those shown in Figure 22 are omitted. 【0364】 According to one embodiment, the helical conductive pattern 1100 has a loop of current path extending from a first end 1101 to a second end 1102. For example, the helical conductive pattern 1100 includes a planar coil (e.g., a planar coil or a patterned coil) containing a plurality of turns. 【0365】 According to one embodiment, the first end 1101 of the helical conductive pattern 1100 is electrically connected to the first electrical path EP1 through the ninth electrical path EP9. The second end 1102 of the helical conductive pattern 1100 is electrically connected to the eleventh electrical path EP11 through the tenth electrical path EP10. 【0366】 According to one embodiment, the wireless communication circuit 610 provides (or supplies) a + voltage to a first electrical path EP1 and a - voltage to an eleventh electrical path EP11. The + voltage is provided to a first point P1 of the first metal E1 through the first electrical path EP1. The + voltage is provided to a first end 1101 of the helical conductive pattern 1100 through a ninth electrical path EP9. The - voltage is provided to a third point P3 of the first metal E1 through the eleventh electrical path EP11. The - voltage is provided to a second end 1102 of the helical conductive pattern 1100 through a tenth electrical path EP10. 【0367】 According to one embodiment, when supplying positive power to the first electrical path EP1 and negative power to the eleventh electrical path EP11, the embodiment in Figure 23 provides, compared to the embodiment in Figure 22, a current path through which current (or radiated current) flows along the helical conductive pattern 1100 and an electromagnetic field generated by the distribution of current (or radiated current) following the current path. The wireless communication circuit 610 is configured to transmit and / or receive signals in a selected or specified frequency band (e.g., about 13.56 MHz for NFC) through the electromagnetic field generated by the helical conductive pattern 1100. 【0368】 According to one embodiment, the helical conductive pattern 1100 overlaps the second region 202 of the first back region of the foldable electronic device 2 when viewed from above. When positive power is supplied to the first electrical path EP1 and negative power is supplied to the eleventh electrical path EP11, the electromagnetic field generated by the helical conductive pattern 1100 is radiated through the second region 202. 【0369】 According to various embodiments, although not shown separately, the helical conductive pattern 1100 can be housed in the first housing 21 (see Figure 2) such that, when viewed from above the first back region of the foldable electronic device 2, it overlaps with the third region 203 of the first back region. When positive power is supplied to the first electrical path EP1 and negative power is supplied to the eleventh electrical path EP11, the electromagnetic field generated by the helical conductive pattern 1100 is radiated through the third region 203. 【0370】 In various embodiments, although not shown separately, the helical conductive pattern 1100 may be housed in the second housing 22 (see Figure 2) such that it overlaps with the fifth region 205 of the second back region when viewed from above the second back region of the foldable electronic device 2. When supplying positive power to the first electrical path EP1 and negative power to the eleventh electrical path EP11, the electromagnetic field generated by the helical conductive pattern 1100 may be radiated through the fifth region 205. 【0371】 According to various embodiments, although not shown separately, the helical conductive pattern 1100 can be housed in the second housing 22 (see Figure 2) such that, when viewed from above the second back region of the foldable electronic device 2, it overlaps with the sixth region 206 of the second back region. When positive power is supplied to the first electrical path EP1 and negative power is supplied to the eleventh electrical path EP11, the electromagnetic field generated by the helical conductive pattern 1100 is radiated through the sixth region 206. 【0372】 According to various embodiments, in the embodiment shown in Figure 22 or Figure 23, the wireless communication circuit 610 may be configured to provide (or supply) a + voltage to the 11th electrical path EP11 and a - voltage to the first electrical path EP1. 【0373】 Figure 24 shows a heatmap 2410 of the magnetic field distribution during power supply in the folded state of the foldable electronic device 2 of Figure 23 according to one embodiment of the present invention, and heatmaps (2420, 2430, 2440, 2450) of comparative foldable electronic devices (2421, 2431, 2441, 2451) during power supply in the folded state. 【0374】 In the foldable electronic device 2 shown in Figure 23 according to one embodiment of the present invention, the seventh metal E7 and the second ground region G2 are physically and electrically isolated from each other. 【0375】 The comparative examples of foldable electronic devices (2421, 2431, 2441, 2451) include the foldable electronic device 2421 of the fifth comparative example, the foldable electronic device 2431 of the sixth comparative example, the foldable electronic device 2441 of the seventh comparative example, and / or the foldable electronic device 2451 of the eighth comparative example. The foldable electronic device 2421 of the fifth comparative example includes a twelfth electrical path EP12 that electrically connects the second point P2 of the seventh metal E7 to the second ground area G2. The foldable electronic device 2431 of the sixth comparative example includes a thirteenth electrical path EP13 that electrically connects the fourth point P4 of the seventh metal E7 to the second ground area G2. The foldable electronic device 2441 of the 7th comparative example includes a 12th electrical path EP12 that electrically connects the 2nd point P2 of the 7th metal E7 to the 2nd ground region G2, and a 13th electrical path EP13 that electrically connects the 4th point P4 of the 7th metal E7 to the 2nd ground region G2. In the foldable electronic device 2451 of the 8th comparative example, the 2nd non-ground region NG2 (see Figure 23) is omitted. Heatmaps 2420 showing the magnetic field distribution during power supply in the folded state of the foldable electronic device 2421 of the 5th comparative example, 2430 showing the magnetic field distribution during power supply in the folded state of the foldable electronic device 2431 of the 6th comparative example, 2440 showing the magnetic field distribution during power supply in the folded state of the foldable electronic device 2441 of the 7th comparative example, and 2450 showing the magnetic field distribution during power supply in the folded state of the foldable electronic device 2451 of the 8th comparative example are shown. 【0376】 In the folded state of the foldable electronic device 2 shown in Figure 23 according to one embodiment of the present invention, when positive power is supplied to the first electrical path EP1 and negative power is supplied to the eleventh electrical path EP11, current flows through the seventh metal E7 due to electromagnetic coupling between the first metal E1 and the seventh metal E7. In the folded state of the foldable electronic device 2 shown in Figure 23 according to one embodiment of the present invention, the direction in which current flows through the seventh metal E7 is formed opposite to the direction in which current flows through the first metal E1. However, the insulation between the seventh metal E7 and the second ground region G2 substantially prevents the formation of a current path (or loop), thereby reducing the reduction in the radiation performance of the antenna structure 2200 of the eighth example. 【0377】 In the folded state of the foldable electronic device 2421 of the fifth comparative example, the foldable electronic device 2431 of the sixth comparative example, or the foldable electronic device 2441 of the seventh comparative example, the reverse current phenomenon in the current path (or loop) including the seventh metal E7 is difficult to reduce due to the electrical connection between the seventh metal E7 and the second ground region G2, resulting in reduced radiation performance compared to the foldable electronic device 2 of Figure 23 according to the present invention. The foldable electronic device 2 of Figure 23 according to the present invention can reduce the reverse current phenomenon in the current path including the seventh metal E7 in the folded state and have improved magnetic field distribution and / or radiation performance compared to the foldable electronic device 2421 of the fifth comparative example, the foldable electronic device 2431 of the sixth comparative example, or the foldable electronic device 2441 of the seventh comparative example. 【0378】 The foldable electronic device 2 shown in Figure 23, according to one embodiment of the present invention, has an improved magnetic field distribution compared to the foldable electronic device 2451 of the eighth comparative example, which does not include the second non-ground region NG2, and can improve radiation performance. 【0379】 According to various embodiments, the first example antenna structure 600 in Figure 6 or Figure 11, the second example antenna structure 900 in Figure 9 or Figure 12, the third example antenna structure 1000 in Figure 10 or 13, the fourth example antenna structure 1800 in Figure 18, the fifth example antenna structure 1900 in Figure 19, the sixth example antenna structure 2000 in Figure 20, the seventh example antenna structure 2100 in Figure 21, and the eighth example antenna structure 2200 in Figure 22 or Figure 23 include two other metals that align and overlap each other in the folded state of the foldable electronic device 2, instead of the first metal E1 and the seventh metal E7. 【0380】 According to various embodiments, although not shown separately, the foldable electronic device 2 of the present invention is not limited to being foldable with respect to a center line A (see Figure 2) parallel to the +y axis, but can also be foldable with respect to a center line parallel to the +x axis. 【0381】 Figure 25 shows a flexible printed circuit board 2500 according to various embodiments of the present invention. It should be understood in the present invention that all combinations of features and / or embodiments disclosed in relation to Figure 21 are conceptually included. That is, all combinations of features described later in relation to Figure 25 should be considered as being included in the present invention as specific examples. 【0382】 Referring to Figure 25, the flexible printed circuit board 2500 extends from the first housing 21 (see Figure 2) to the second housing 22 (see Figure 2), crossing the hinge portion 24 (see Figure 3). The flexible printed circuit board 2500 bends during the transition between the unfolded and folded states of the foldable electronic device 2 (see Figure 2). 【0383】 According to one embodiment, the flexible printed circuit board 2500 electrically connects a first printed circuit board (not shown) housed in a first housing 21 (see Figure 2) and a second printed circuit board (not shown) housed in a second housing 22 (see Figure 2). The flexible printed circuit board 2500 includes a first connector (also referred to as the first connector end) 2501 electrically connected to the first printed circuit board and a second connector (also referred to as the second connector end) 2502 electrically connected to the second printed circuit board, and extends to the first connector 2501 and the second connector 2502. 【0384】 According to one embodiment, the flexible printed circuit board 2500 includes a plurality of signal lines 2510 and a ground structure (not shown). The plurality of signal lines 2510 and the ground structure extend from a first connector 2501 to a second connector 2502. The ground structure encloses at least a portion of the plurality of signal lines 2510, reducing or preventing electromagnetic interference (EMI) to the plurality of signal lines 2510. The ground structure reduces or prevents electromagnetic effects of noise from outside the foldable flexible printed circuit board 2500 on the plurality of signal lines 2510. The ground structure reduces or prevents electromagnetic interference between the plurality of signal lines. Although not shown separately, the number of plurality of signal lines, or the relative positions between the plurality of signal lines, can vary and are not limited to the illustrated example. 【0385】 According to one embodiment, the ground structure (not shown) of the flexible printed circuit board 2500 is included in the fifth electrical path EP5 in the embodiments of Figures 6, 9, 10, 11, 12, 13, 18, 19, 20, 21, 22, or 23. 【0386】 According to one embodiment, in the embodiment shown in Figure 6 or Figure 11, one of the multiple signal lines 2510 is included in the second electrical path EP2. The one of the multiple signal lines 2510 included in the second electrical path EP2 is, for example, one of the two outermost signal lines (2511, 2519). The one of the multiple signal lines 2510 included in the second electrical path EP2 is, for example, one of the signal lines (2512, 2513, 2514, 2515, 2516, 2517, or 2518) located between the two outermost signal lines (2511, 2519) of the multiple signal lines 2510. 【0387】 In one embodiment, in the embodiment shown in Figure 9 or Figure 12, one of the multiple signal lines 2510 is included in the second electrical path EP2. In the embodiment shown in Figure 9 or Figure 12, one of the other signal lines 2510 is included in the sixth electrical path EP6. For example, one of the signal lines 2510 included in the second electrical path EP2 is one of the two outermost signal lines (2511, 2519), and one of the signal lines 2510 included in the sixth electrical path EP6 is the remaining one of the two outermost signal lines (2511, 2519). One of the signal lines 2510 included in the second electrical path EP2 and one of the signal lines 2510 included in the sixth electrical path EP6 are, for example, any two signal lines located between the two outermost signal lines (2511, 2519). Any one signal line included in the second electrical path EP2 of the multiple signal lines 2510 and any one signal line included in the sixth electrical path EP6 of the multiple signal lines 2510 are, for example, adjacent without at least one other signal line in between, or separated from each other with at least one other signal line in between. 【0388】 In one embodiment, in the embodiment shown in Figure 10 or Figure 13, one of the multiple signal lines 2510 is included in the second electrical path EP2. In the embodiment shown in Figure 10 or Figure 13, one of the other signal lines 2510 is included in the eighth electrical path EP8. For example, one of the multiple signal lines 2510 included in the second electrical path EP2 is one of the two outermost signal lines (2511, 2519), and one of the multiple signal lines 2510 included in the eighth electrical path EP8 is the remaining one of the two outermost signal lines (2511, 2519). One of the multiple signal lines 2510 included in the second electrical path EP2 and one of the multiple signal lines 2510 included in the eighth electrical path EP8 are, for example, any two signal lines located between the two outermost signal lines (2511, 2519) of the multiple signal lines 2510. Any one signal line included in the second electrical path EP2 of the multiple signal lines 2510 and any one signal line included in the eighth electrical path EP8 of the multiple signal lines 2510 are either adjacent to each other without at least one other signal line in between, or separated from each other with at least one other signal line in between. 【0389】 According to one embodiment, in the embodiment shown in Figure 18, one of the multiple signal lines 2510 is included in the second electrical path EP2. The one of the multiple signal lines 2510 included in the second electrical path EP2 is, for example, one of the two outermost signal lines (2511, 2519). The one of the multiple signal lines 2510 included in the second electrical path EP2 is, for example, one of the signal lines (2512, 2513, 2514, 2515, 2516, 2517, or 2518) located between the two outermost signal lines (2511, 2519) of the multiple signal lines 2510. 【0390】 According to one embodiment, in the embodiment shown in Figure 19 or Figure 21, one of the multiple signal lines 2510 is included in the 17th electrical path EP17. The one of the multiple signal lines 2510 included in the 17th electrical path EP17 is, for example, one of the two outermost signal lines (2511, 2519). The one of the multiple signal lines 2510 included in the 17th electrical path EP17 is, for example, one of the signal lines (2512, 2513, 2514, 2515, 2516, 2517, or 2518) located between the two outermost signal lines (2511, 2519) of the multiple signal lines 2510. 【0391】 According to one embodiment, in the embodiment shown in Figure 20, one of the multiple signal lines 2510 is included in the second electrical path EP2. The one of the multiple signal lines 2510 included in the second electrical path EP2 is, for example, one of the two outermost signal lines (2511, 2519). The one of the multiple signal lines 2510 included in the second electrical path EP2 is, for example, one of the signal lines (2512, 2513, 2514, 2515, 2516, 2517, or 2518) located between the two outermost signal lines (2511, 2519) of the multiple signal lines 2510. 【0392】 Figure 26 shows a foldable electronic device 2 in an unfolded state according to one embodiment of the present invention. It should be understood in the present invention that all combinations of features and / or embodiments disclosed in relation to Figure 26 are conceptually included. That is, all combinations of features described later in relation to Figure 26 should be considered to be included in the present invention as specific examples. 【0393】 Referring to Figure 26, the foldable electronic device 2 includes a first side metal 2112E containing multiple metals (E1, E2, E3, E4, E5, E6), a second side metal 2212E containing multiple metals (E7, E8, E9, E10, E11, E12), an antenna ground G, a first electrical path EP1, a second electrical path EP2, a third electrical path EP3, a fourth electrical path EP4, a 19th electrical path EP19, a 20th electrical path EP20, an NFC wireless communication circuit (also called the first wireless communication circuit) 2610, a Non-NFC wireless communication circuit (also called the second wireless communication circuit) 2620, a first filter 640, and / or a second filter 650. In Figure 26, explanations of some components that are the same as those shown in Figure 6 are omitted. For example, the Non-NFC wireless communication circuit 2620 includes wireless communication circuits other than wireless communication circuits that support NFC communication, such as the NFC wireless communication circuit 2610. 【0394】 According to one embodiment, the NFC wireless communication circuit 2610 is configured to transmit and / or receive signals in the NFC band and includes, for example, the wireless communication circuit 610 shown in Figure 6. For example, the NFC wireless communication circuit 2610 further includes the EMI filter 620 and / or matching circuit 630 shown in Figure 6. 【0395】 According to one embodiment, the Non-NFC wireless communication circuit 2620 is configured to transmit and / or receive signals in a Non-NFC band such as LB, MB, HB, or UHB. 【0396】 According to one embodiment, the 19th electrical path EP19 electrically connects the first filter 640 and the Non-NFC wireless communication circuit 2620. The 19th electrical path EP19 is electrically connected to the first electrical path EP1 through the first filter 640. The Non-NFC wireless communication circuit 2620 is electrically connected to the first metal E1 through the 19th electrical path EP19, the first filter 640, and the first electrical path EP1. The Non-NFC wireless communication circuit 2620 is configured to transmit and / or receive signals in the Non-NFC band through the first metal E1. 【0397】 According to one embodiment, when the Non-NFC wireless communication circuit 2620 provides (or feeds) an electromagnetic signal (or radio signal, RF signal, or radiated current) to the 19th electrical path EP19, a first signal path is formed through which the electromagnetic signal flows between a first point P1 to which the first electrical path EP1 of the first metal E1 is electrically connected and a third point P3 to which the electromagnetic signal flows through the third electrical path EP3 of the first metal E1 to the antenna ground G. When the Non-NFC wireless communication circuit 2620 provides (or feeds) an electromagnetic signal to the 19th electrical path EP19, a first radiation pattern (or first radiation field or first electromagnetic field) is provided (or formed) by the electromagnetic coupling between the first signal path and the antenna ground G. The first radiation pattern has a first resonant frequency corresponding to the electrical length (e.g., length shown as a ratio of wavelengths) of the first signal path. 【0398】 According to one embodiment, when the Non-NFC wireless communication circuit 2620 transmits and / or receives a signal through the first metal E1, the first filter 640 reduces the influence (e.g., electromagnetic interference) that the antenna structure 600 of the first example has on the Non-NFC band. For example, when the Non-NFC wireless communication circuit 2620 transmits and / or receives a signal through the first metal E1, the first filter 640 reduces or prevents the occurrence of resonance in the NFC band. 【0399】 According to one embodiment, the first filter 640 is provided as at least one filter (also referred to as a filter circuit), at least one switch (also referred to as a switch circuit), or a combination thereof. 【0400】 According to one embodiment, the first filter 640 includes a diplexer or duplexer that separates and transmits the NFC band and the NFC band separately. 【0401】 According to various embodiments, the first filter 640 may include a matching circuit. The matching circuit adjusts the frequency, for example, so that resonance occurs in a selected or specified frequency band. The matching circuit shifts the resonant frequency to a specified frequency, or shifts the resonant frequency by a specified amount. The matching circuit provides (or forms) impedance matching, for example. 【0402】 While various embodiments disclose that the 19th electrical path EP19 is branched from the first electrical path EP1 through the first filter 640, the invention is not limited thereto. The 19th electrical path EP19 may be electrically connected to the first metal E1, and the first electrical path EP1 may be branched from the 19th electrical path EP19 through the first filter 640. 【0403】 According to one embodiment, the 20th electrical path EP20 electrically connects the second filter 650 and the Non-NFC wireless communication circuit 2620. The 20th electrical path EP20 is electrically connected to the second electrical path EP2 through the second filter 650. The Non-NFC wireless communication circuit 2620 is electrically connected to the 7th metal E7 through the 20th electrical path EP20, the second filter 650, and the 2nd electrical path EP2. The Non-NFC wireless communication circuit 2620 is configured to transmit and / or receive signals in the Non-NFC band through the 7th metal E7. 【0404】 According to one embodiment, when the Non-NFC wireless communication circuit 2620 provides (or feeds) an electromagnetic signal (or radio signal, RF signal, or radiated current) to the 20th electrical path EP20, a second signal path is formed through which the electromagnetic signal flows between a second point P2 to which the second electrical path EP2 of the 7th metal E7 is electrically connected and a fourth point P4 to which the electromagnetic signal flows through the fourth electrical path EP4 of the 7th metal E7 and is electrically connected to the antenna ground G. When the Non-NFC wireless communication circuit 2620 provides (or feeds) an electromagnetic signal to the 20th electrical path EP20, a second radiation pattern (or second radiation field or second electromagnetic field) is provided (or formed) through the second signal path. The second radiation pattern has a second resonant frequency corresponding to the electrical length (e.g., length shown as a ratio of wavelengths) of the second signal path. 【0405】 According to one embodiment, when the Non-NFC wireless communication circuit 2620 transmits and / or receives a signal through the seventh metal E7, the second filter 650 reduces the influence (e.g., electromagnetic interference) that the antenna structure 600 of the first example has on the Non-NFC band. For example, when the Non-NFC wireless communication circuit 2620 transmits and / or receives a signal through the seventh metal E7, the second filter 650 reduces or prevents the occurrence of resonance in the NFC band. 【0406】 According to one embodiment, the second filter 650 is provided as at least one filter (also referred to as a filter circuit), at least one switch (also referred to as a switch circuit), or a combination thereof. 【0407】 According to one embodiment, the second filter 650 includes a diplexer or duplexer that separates and transmits the NFC band and the NFC band separately. 【0408】 According to various embodiments, the second filter 650 may include a matching circuit. The matching circuit adjusts the frequency, for example, so that resonance occurs in a selected or specified frequency band. The matching circuit shifts the resonant frequency to a specified frequency, or shifts the resonant frequency by a specified amount. The matching circuit provides (or forms) impedance matching, for example. 【0409】 While various embodiments disclose that the 20th electrical path EP20 is branched from the second electrical path EP2 through the second filter 650, the invention is not limited thereto. The 20th electrical path EP20 may be electrically connected to the 7th metal E7, and the second electrical path EP2 may be branched from the 20th electrical path EP20 through the second filter 650. 【0410】 Figure 27 shows a foldable electronic device 2 in an unfolded state according to one embodiment of the present invention. It should be understood in the present invention that all combinations of features and / or embodiments disclosed in relation to Figure 27 are conceptually included. That is, all combinations of features described later in relation to Figure 27 should be considered to be included in the present invention as specific examples. 【0411】 Referring to Figure 27, the foldable electronic device 2 includes a first side metal 2112E containing multiple metals (E1, E2, E3, E4, E5, E6), a second side metal 2212E containing multiple metals (E7, E8, E9, E10, E11, E12), an antenna ground G, a first electrical path EP1, a second electrical path EP2, a third electrical path EP3, a fourth electrical path EP4, a 19th electrical path EP19, a 21st electrical path EP21, an NFC wireless communication circuit (also called the first wireless communication circuit) 2610, a Non-NFC wireless communication circuit (also called the second wireless communication circuit) 2620, a first filter 640, a second filter 650, and / or a fourth filter 670. In Figure 27, the description of some components that are the same as the reference numerals shown in Figures 6 and 26 is omitted. 【0412】 According to one embodiment, the 21st electrical path EP21 electrically connects the 7th metal E7 and the Non-NFC wireless communication circuit 2620. The 21st electrical path EP21 includes one or more combinations (not shown) of conductive paths (or conductors or conductive structures) between the 7th metal E7 and the Non-NFC wireless communication circuit 2620. 【0413】 According to one embodiment, the 21st electrical path EP21 is electrically connected to the 5th point P5 of the 7th metal E7. The 5th point P5 is separated from the 2nd point P2, which is electrically connected to the 2nd electrical path EP2 of the 7th metal E7, and from the 4th point P4, which is electrically connected to the 4th electrical path EP4 of the 7th metal E7. For example, the 5th point P5 is located between the 2nd point P2 and the 4th point P4, but the location or number of the 5th point P5 is not limited. 【0414】 According to one embodiment, the Non-NFC wireless communication circuit 2620 is configured to transmit and / or receive signals in the Non-NFC band through the seventh metal E7. When the Non-NFC wireless communication circuit 2620 provides (or feeds) an electromagnetic signal (or radio signal, RF signal, or radiated current) to the fifth point P5 of the seventh metal E7 through the 21st electrical path EP21, a third signal path is formed through which the electromagnetic signal flows between the fifth point P5, to which the 21st electrical path EP21 of the seventh metal E7 is electrically connected, and the fourth point P4, to which the fourth electrical path EP4 of the seventh metal E7 is electrically connected to the antenna ground G. When the Non-NFC wireless communication circuit 2620 provides (or feeds) an electromagnetic signal to the 21st electrical path EP21, a third radiation pattern (or third radiation field or third electromagnetic field) is provided (or formed) by the electromagnetic coupling between the third signal path and the antenna ground G. The third radiation pattern has a third resonant frequency that corresponds to the electrical length (e.g., length expressed as a ratio of wavelengths) of the third signal path. 【0415】 According to one embodiment, the fourth filter 670 is located on or electrically connected to the 21st electrical path EP21. The Non-NFC wireless communication circuit 2620 is electrically connected to the 7th metal E7, for example, through the fourth filter 670. When the Non-NFC wireless communication circuit 2620 transmits and / or receives signals through the 7th metal E7, the fourth filter 670 reduces the influence (e.g., electromagnetic interference) that the antenna structure 600 of the first example has on the Non-NFC band. For example, when the Non-NFC wireless communication circuit 2620 transmits and / or receives signals through the 7th metal E7, the fourth filter 670 reduces or prevents resonance in the NFC band. 【0416】 According to one embodiment, the fourth filter 670 is provided as at least one filter (also referred to as a filter circuit), at least one switch (also referred to as a switch circuit), or a combination thereof. 【0417】 According to one embodiment, the fourth filter 670 includes a diplexer or duplexer that separates and transmits the NFC band and the NFC band separately. 【0418】 According to various embodiments, the fourth filter 670 may include a matching circuit. The matching circuit adjusts the frequency, for example, so that resonance occurs in a selected or specified frequency band. The matching circuit shifts the resonant frequency to a specified frequency, or shifts the resonant frequency by a specified amount. The matching circuit provides (or forms) impedance matching, for example. 【0419】 Figure 28 shows a foldable electronic device 2 in an unfolded state according to one embodiment of the present invention. It should be understood in the present invention that all combinations of features and / or embodiments disclosed in relation to Figure 28 are conceptually included. That is, all combinations of features described later in relation to Figure 28 should be considered to be included in the present invention as specific examples. 【0420】 Referring to Figure 28, the foldable electronic device 2 includes a first side metal 2112E containing multiple metals (E1, E2, E3, E4, E5, E6), a second side metal 2212E containing multiple metals (E7, E8, E9, E10, E11, E12), an antenna ground G, a first electrical path EP1, a second electrical path EP2, a third electrical path EP3, a fourth electrical path EP4, a 20th electrical path EP20, a 22nd electrical path EP22, an NFC wireless communication circuit (also called the first wireless communication circuit) 2610, a Non-NFC wireless communication circuit (also called the second wireless communication circuit) 2620, a first filter 640, and / or a second filter 650. In Figure 28, the description of some components that are the same as those shown in Figures 6 and 26 is omitted. 【0421】 According to one embodiment, the 22nd electrical path EP22 electrically connects the first metal E1 and the Non-NFC wireless communication circuit 2620. The 22nd electrical path EP22 includes one or more conductive paths (or conductors or conductive structures) (not shown) between the first metal E1 and the Non-NFC wireless communication circuit 2620. 【0422】 According to one embodiment, the 22nd electrical path EP22 is electrically connected to the 6th point P6 of the first metal E1. The 6th point P6 is separated from the 1st point P1, which is electrically connected to the 1st electrical path EP1 of the 1st metal E1, and the 3rd point P3, which is electrically connected to the 3rd electrical path EP3 of the 1st metal E1. For example, the 6th point P6 is located between the 1st point P1 and the 3rd point P3, but the position or number of the 6th point P6 is not limited. 【0423】 According to one embodiment, the Non-NFC wireless communication circuit 2620 is configured to transmit and / or receive signals in the Non-NFC band through the first metal E1. When the Non-NFC wireless communication circuit 2620 provides (or feeds) an electromagnetic signal (or radio signal, RF signal, or radiated current) to the sixth point P6 of the first metal E1 through the 22nd electrical path EP22, a fourth signal path is formed through which the electromagnetic signal flows between the sixth point P6, to which the 22nd electrical path EP22 of the first metal E1 is electrically connected, and the third point P3, to which the third electrical path EP3 of the first metal E1 is electrically connected to the antenna ground G. When the Non-NFC wireless communication circuit 2620 provides (or feeds) an electromagnetic signal to the 22nd electrical path EP22, a fourth radiation pattern (or fourth radiation field or fourth electromagnetic field) is provided (or formed) through the fourth signal path. The fourth radiation pattern has a fourth resonant frequency that corresponds to the electrical length (e.g., length expressed as a ratio of wavelengths) of the fourth signal path. 【0424】 According to one embodiment, the first filter 640 is located in or electrically connected to the 22nd electrical path EP22. The Non-NFC wireless communication circuit 2620 is electrically connected to the first metal E1, for example, through the first filter 640. When the Non-NFC wireless communication circuit 2620 transmits and / or receives signals through the first metal E1, the first filter 640 reduces the influence (e.g., electromagnetic interference) that the antenna structure 600 of the first example has on the Non-NFC band. For example, when the Non-NFC wireless communication circuit 2620 transmits and / or receives signals through the first metal E1, the first filter 640 reduces or prevents resonance in the NFC band. 【0425】 According to one embodiment, the first filter 640 is provided as at least one filter (also referred to as a filter circuit), at least one switch (also referred to as a switch circuit), or a combination thereof. 【0426】 According to one embodiment, the first filter 640 includes a diplexer or duplexer that separates and transmits the NFC band and the NFC band separately. 【0427】 According to various embodiments, the first filter 640 may include a matching circuit. The matching circuit adjusts the frequency, for example, so that resonance occurs in a selected or specified frequency band. The matching circuit shifts the resonant frequency to a specified frequency, or shifts the resonant frequency by a specified amount. The matching circuit provides (or forms) impedance matching, for example. 【0428】 According to various embodiments, although not shown separately, the first filter 640 may be located in or electrically connected to the first electrical path EP1. The NFC wireless communication circuit 2610 is electrically connected to the first metal E1, for example, through the first filter 640. 【0429】 Various examples of foldable electronic devices are described below with reference to the drawings. Any one example of a foldable electronic device is interpreted as being a modification or alteration of at least some of the components of any other example of a foldable electronic device, and is considered to fall within the scope of various embodiments of the present invention. In relation to the description of any one example of a foldable electronic device, the same terminology and / or the same reference numerals are used for components that are at least partially identical, similar, or related to components of any other example of a foldable electronic device. In any two examples of foldable electronic devices, two components that have the same terminology but different reference numerals are understood to be substantially identical or to be modified or altered in form. 【0430】 Figure 29 shows an unfolded foldable electronic device 29 according to one embodiment of the present invention. It should be understood in the present invention that all combinations of features and / or embodiments disclosed in relation to Figure 29 are conceptually included. That is, all combinations of features described later in relation to Figure 29 should be considered to be included in the present invention as specific examples. 【0431】 Referring to Figure 29, the foldable electronic device 29 is foldable with respect to a center line A parallel to the +x axis, whereas the foldable electronic device 2 in Figure 2 is foldable with respect to a center line A parallel to the +y axis. 【0432】 According to one embodiment, the foldable electronic device 29 includes a first side metal 2112E comprising a plurality of metals (E1, E2, E3, E4, E5, E6), a second side metal 2212E comprising a plurality of metals (E7, E8, E9, E10, E11, E12), an antenna ground G, a first electrical path EP1, a second electrical path EP2, a third electrical path EP3, a fourth electrical path EP4, a 19th electrical path EP19, a 20th electrical path EP20, an NFC wireless communication circuit (also referred to as the first wireless communication circuit) 2610, a Non-NFC wireless communication circuit (also referred to as the second wireless communication circuit) 2620, a first filter 640, and / or a second filter 650. 【0433】 According to one embodiment, the foldable electronic device 25 is configured in substantially the same manner as the foldable electronic device 2 in Figure 22, with the NFC wireless communication circuit 2610 and the Non-NFC wireless communication circuit 2620 transmitting and / or receiving signals through the first metal E1 and the second metal E7. 【0434】 Figure 30 shows an unfolded foldable electronic device 30 according to one embodiment of the present invention. It should be understood in the present invention that all combinations of features and / or embodiments disclosed in relation to Figure 30 are conceptually included. That is, all combinations of features described later in relation to Figure 30 should be considered to be included in the present invention as specific examples. 【0435】 Referring to Figure 30, the foldable electronic device 30 is foldable based on a center line A parallel to the +x axis, whereas the foldable electronic device 2 in Figure 2 is foldable based on a center line A parallel to the +y axis. 【0436】 According to one embodiment, the foldable electronic device 30 includes a first side metal 2112E comprising a plurality of metals (E1, E2, E3, E4, E5, E6), a second side metal 2212E comprising a plurality of metals (E7, E8, E9, E10, E11, E12), an antenna ground G, a first electrical path EP1, a second electrical path EP2, a third electrical path EP3, a fourth electrical path EP4, a 19th electrical path EP19, a 20th electrical path EP20, an NFC wireless communication circuit (also referred to as the first wireless communication circuit) 2610, a Non-NFC wireless communication circuit (also referred to as the second wireless communication circuit) 2620, a first filter 640, a second filter 650, and / or a fourth filter 670. 【0437】 According to one embodiment, the foldable electronic device 26 is configured in substantially the same manner as the foldable electronic device 2 in Figure 27, with the NFC wireless communication circuit 2610 and the Non-NFC wireless communication circuit 2620 transmitting and / or receiving signals through the second metal E2 and the eighth metal E8. 【0438】 Figure 31 shows a foldable electronic device 27 in an unfolded state according to one embodiment of the present invention. It should be understood in the present invention that all combinations of features and / or embodiments disclosed in relation to Figure 31 are conceptually included. That is, all combinations of features described later in relation to Figure 31 should be considered to be included in the present invention as specific examples. 【0439】 Referring to Figure 31, the foldable electronic device 31 is foldable based on a center line A parallel to the +x axis, whereas the foldable electronic device 2 in Figure 2 is foldable based on a center line A parallel to the +y axis. 【0440】 According to one embodiment, the foldable electronic device 31 includes a first side metal 2112E comprising a plurality of metals (E1, E2, E3, E4, E5, E6), a second side metal 2212E comprising a plurality of metals (E7, E8, E9, E10, E11, E12), an antenna ground G, a first electrical path EP1, a second electrical path EP2, a third electrical path EP3, a fourth electrical path EP4, a 20th electrical path EP20, a 22nd electrical path EP22, an NFC wireless communication circuit (also referred to as the first wireless communication circuit) 2610, a Non-NFC wireless communication circuit (also referred to as the second wireless communication circuit) 2620, a first filter 640, and / or a second filter 650. 【0441】 According to one embodiment, the foldable electronic device 31 is configured in substantially the same manner as the foldable electronic device 2 in Figure 28, in which the NFC wireless communication circuit 2610 and the Non-NFC wireless communication circuit 2620 transmit and / or receive signals through the first metal E1 and the seventh metal E7. 【0442】 Various examples of multifoldable electronic devices are described below with reference to the drawings. Any example of a multifoldable electronic device is interpreted as a modification or alteration of at least some of the components of any other example of a multifoldable electronic device, and is considered to fall within the scope of various embodiments of the present invention. In relation to the description of any one example of a multifoldable electronic device, the same terminology and / or reference numerals shall be used for components that are at least partially identical, similar, or related to components of any other example of a multifoldable electronic device. In any two examples of a multifoldable electronic device, two components with the same terminology but different reference numerals are understood to be substantially identical or modified or altered in form. 【0443】 Figure 32 is a diagram showing a multifoldable electronic device 32 in an unfolded state according to one embodiment of the present invention. Figure 33 is a perspective view of the multifoldable electronic device 32 in a folded state according to one embodiment of the present invention. It should be understood in the present invention that all combinations of features and / or embodiments disclosed in relation to Figures 32 and 33 are conceptually included. That is, all combinations of features described later in relation to Figures 32 and 33 should be considered to be included in the present invention as specific examples. 【0444】 Referring to Figures 32 and 33, the multifoldable electronic device 32 includes a foldable housing 3210, a first display module 3220, a second display module 3230, and / or a plurality of camera modules 3240. 【0445】 According to one embodiment, the foldable housing 3210 includes a first housing 3211, a second housing 3212, and / or a third housing 3213. When viewing the unfolded state of the multifoldable electronic device 32, the first housing 3211 is positioned between the second housing 3212 and the third housing 3213. The foldable housing 3210 is embodied in a foldable manner between the first housing 3211 and the second housing 3212. The first housing 3211 and the second housing 3212 are connected, for example, by hinges. The foldable housing 3210 is embodied in a foldable manner between the first housing 3211 and the third housing 3213. The first housing 3211 and the third housing 3213 are connected, for example, by hinges. 【0446】 According to one embodiment, the foldable housing 3210 includes a first hinge portion 3214 which includes one or more hinge modules connecting a first housing 3211 and a second housing 3212. The first hinge portion 3214 causes the foldable housing 3210 to fold with respect to a first folding axis (also called a first centerline) A1. The foldable housing 3210 also includes a second hinge portion 3215 which includes one or more hinge modules connecting a first housing 3211 and a third housing 3213. The second hinge portion 3215 causes the foldable housing 3210 to fold with respect to a second folding axis (also called a second centerline) A2. 【0447】 According to one embodiment, the foldable housing 3210 is foldably embodied such that, in the folded state of the multifoldable electronic device 32, the second housing 3212 is located between the first housing 3211 and the third housing 3213. 【0448】 According to one embodiment, a first display module 3220 is housed in a foldable housing 3210. The first display module 3220 includes a flexible display or a foldable display. The display area of ​​the first display module 3220 includes a first display area housed in the first housing 3211, a second display area extending from the first display area and housed in the second housing 3212, and a third display area extending from the first display area and housed in the third housing 3212. When viewing the multifoldable electronic device 32 in its unfolded state, the first display area is located between the second and third display areas. In the unfolded state of the multifoldable electronic device 32, the display area of ​​the first display module 3220 provides the front surface of the multifoldable electronic device 32. The illustrated coordinate axes are shown relative to the first housing 3211, and the +z axis direction is defined or interpreted as the direction in which the substantially flat first display area faces. The xy-plane is substantially parallel to the plane provided by the first display area. The +y-axis and -y-axis directions are substantially parallel to the first folding axis A1 and the second folding axis A2. 【0449】 According to one embodiment, the second display area 3230 is housed in the third housing 3213. The display area of ​​the second display area 3230 faces in the opposite direction to the third display area of ​​the first display module 3220. 【0450】 According to one embodiment, the multiple camera modules 3240 are located in the first housing 3211. The multiple camera modules 3240 are oriented in the opposite direction to the first display area of ​​the first display module 3220. 【0451】 According to one embodiment, the first housing 3211 includes a first frame which includes a first side 32111 and a first support (or first support plate) (not shown). The first side 32111 provides (or forms) at least a portion of the side surface of the first housing 3211. The first support extends from or is connected to the first side 32111 and is located inside the multifoldable electronic device 32 to support a plurality of components. 【0452】 According to one embodiment, the second housing 3212 includes a second frame which includes a second side 32121 and a second support (or second support plate) (not shown). The second side 32121 provides (or forms) at least a portion of the side surface of the second housing 3212. The second support extends from or is connected to the second side 32121 and is located inside the multifoldable electronic device 32 to support a plurality of components. 【0453】 According to one embodiment, the third housing 3213 includes a third frame, which includes a third side 32131 and a third support (or third support plate) (not shown). The third side 32131 provides (or forms) at least a portion of the side surface of the third housing 3213. The third support extends from or is connected to the third side 32131 and is located inside the multifoldable electronic device 32 to support a plurality of components. 【0454】 According to one embodiment, the first side 32111 of the first housing 3211, the second side 32121 of the second housing 3212, and the third side 32131 of the third housing 3213 include a plurality of physically separated metals that are at least partially identical or similar to the first side 2112 or the second side 2212 of Figure 5. At least some of the plurality of metals of the first side 32111, at least some of the plurality of metals of the second side 32121, and at least some of the plurality of metals of the third side 32131 are aligned and overlap in the folded state of the multifoldable electronic device 32. For example, the first metal E21 of the first side 32111, the second metal E22 of the second side 32121, and the third metal E23 of the third side 32131 are aligned and overlap. 【0455】 According to one embodiment, the multifoldable electronic device 32 is configured to transmit and / or receive NFC band signals through the first metal E21, the second metal E22, and the third metal E23. 【0456】 According to one embodiment, when the multifoldable electronic device 32 is folded and power is supplied from the NFC wireless communication circuit, the first current path (or first loop) including the first metal E21, the second current path (or second loop) including the second metal E22, and the third current path (or third loop) including the third metal E23 form a coil (or a loop in the form of a coil). The first current path provides (or forms) the first turn of the coil. The second current path provides (or forms) the second turn of the coil. The third current path provides (or forms) the third turn. When the multifoldable electronic device 32 is folded, the coil formed by the combination of the first turn of the first current path, the second turn of the second current path, and the third turn of the third current path generates an electromagnetic field which is a composite of the first electromagnetic field generated through the first current path, the second electromagnetic field generated through the second current path, and the third electromagnetic field generated through the third current path, thereby improving the radiation performance. 【0457】 According to one embodiment, when the multifoldable electronic device 32 is in a folded state and power is supplied from the NFC wireless communication circuit, the direction 3301 in which the current (or radiated current) flows on the first metal E21, the direction 3302 in which the current flows on the second metal E22, and the direction 3303 in which the current flows on the third metal E23 are substantially the same. In the folded state of the multifoldable electronic device 32, the current (or radiated current) in the first metal E21, the second metal E22, and the third metal E23, which are aligned and overlapping with each other, is configured to flow in the same direction opposite to the illustrated direction. Ensuring that current (or radiated current) flows in substantially the same direction in the first metal E21, second metal E22, and third metal E23, which are aligned and overlapping with each other in the folded state of the multifoldable electronic device 32, generates an electromagnetic field with greater electromagnetic force strength and improves radiation performance compared to ensuring that current flows in opposite directions (e.g., reverse directions) in any two of the metals among the first metal E21, second metal E22, and third metal E23, which are aligned and overlapping with each other in the folded state of the multifoldable electronic device 32. 【0458】 According to one embodiment, when the multifoldable electronic device 32 is in a folded state and power is supplied from the NFC wireless communication circuit, the phases of the current flowing on the first metal E21 (or radiated current), the phases of the current flowing on the second metal E22, and the phases of the current flowing on the third metal E23 are substantially the same. Making the phases of the currents flowing on the first metal E21, the second metal E22, and the third metal E23, which are aligned and overlapping with each other in the folded state of the multifoldable electronic device 32, the same generates an electromagnetic field with a greater electromagnetic force and improves radiation performance compared to making the phases of the currents flowing on any two of the metals among the first metal E21, the second metal E22, and the third metal E23, which are aligned and overlapping with each other in the folded state of the multifoldable electronic device 32, different. 【0459】 According to various embodiments, the technical features of the present invention are applicable to a multifoldable electronic device (not shown) in which the screen (or flexible display) can be folded three or more times. 【0460】 Figure 34 shows a multifoldable electronic device 32 in an unfolded state according to one embodiment of the present invention. It should be understood in the present invention that all combinations of features and / or embodiments disclosed in relation to Figure 34 are conceptually included. That is, all combinations of features described later in relation to Figure 34 should be considered to be included in the present invention as specific examples. 【0461】 Referring to Figure 34, the multifoldable electronic device 32 includes a first metal E21, a second metal E22, a third metal E23, an antenna ground G3, and an NFC wireless communication circuit 3201. 【0462】 According to one embodiment, the antenna ground G3 includes a first ground area G31 located corresponding to the first housing 3211 (see Figure 32), a second ground area G32 located corresponding to the second housing 3212 (see Figure 32), and / or a third ground area G33 located corresponding to the third housing 3213 (see Figure 32). 【0463】 According to one embodiment, the first ground region G31 includes a combination of at least one ground plane and / or at least one other conductor (or conductive region or conductive structure) contained in at least one printed circuit board (not shown) housed in a first housing 3211 (see Figure 32). 【0464】 According to one embodiment, the second ground region G32 includes a combination of at least one ground plane and / or at least one other conductor (or conductive region or conductive structure) contained in at least one printed circuit board (not shown) housed in the second housing 3212 (see Figure 32). 【0465】 According to one embodiment, the third ground region G33 includes a combination of at least one ground plane and / or at least one other conductor (or conductive region or conductive structure) contained in at least one printed circuit board (not shown) housed in a third housing 3213 (see Figure 32). 【0466】 According to one embodiment, the first ground area G31, the second ground area G32, and the third ground area G33 are electrically connected. 【0467】 In one embodiment, the first ground region G31 and the second ground region G32 are electrically connected through a flexible printed circuit board (for example, the flexible printed circuit board 2500 in Figure 25) positioned across the first hinge portion 3214 (see Figure 32). In one embodiment, the first ground region G31 and the second ground region G32 are electrically connected through at least one hinge module included in the first hinge portion 3214 (see Figure 32). 【0468】 In one embodiment, the first ground region G31 and the third ground region G33 are electrically connected through a flexible printed circuit board (for example, the flexible printed circuit board 2500 in Figure 25) positioned across the second hinge portion 3215 (see Figure 32). In one embodiment, the first ground region G31 and the third ground region G33 are electrically connected through at least one hinge module included in the second hinge portion 3215 (see Figure 32). 【0469】 According to one embodiment, the NFC wireless communication circuit 3201 is housed in a first housing 3211 (see Figure 32). 【0470】 According to one embodiment, the NFC wireless communication circuit 3201 is electrically connected to the first point P21 of the first metal E21 via the first power supply path 3801. For example, the first power supply path 3801 includes one or more combinations of conductive paths (or conductors or conductive structures) (not shown) between the NFC wireless communication circuit 3201 and the first point P21 of the first metal E21. 【0471】 According to one embodiment, the NFC wireless communication circuit 3201 is electrically connected to the second point P22 of the second metal E22 via a second power supply path 3802. For example, the second power supply path 3802 includes one or more combinations of conductive paths (or conductors or conductive structures) (not shown) between the NFC wireless communication circuit 3201 and the second point P22 of the second metal E22. 【0472】 According to one embodiment, the NFC wireless communication circuit 3201 is electrically connected to the fifth point P25 of the third metal E23 via a third power supply path 3403. For example, the third power supply path 3403 includes one or more combinations of conductive paths (or conductors or conductive structures) (not shown) between the NFC wireless communication circuit 3201 and the fifth point P25 of the third metal E23. 【0473】 According to one embodiment, the NFC wireless communication circuit 3201 is electrically connected to the sixth point P26 of the third metal E23 via a fourth power supply path 3404. For example, the fourth power supply path 3404 includes one or more combinations of conductive paths (or conductors or conductive structures) (not shown) between the NFC wireless communication circuit 3201 and the sixth point P26 of the third metal E23. 【0474】 According to one embodiment, the third point P23 of the first metal E21 is electrically connected to the antenna ground G3 through a first grounding path 3811. For example, the first grounding path 3811 includes one or more combinations of conductive paths (or conductors or conductive structures) (not shown) between the third point P23 of the first metal E21 and the first ground region G31 of the antenna ground G3. 【0475】 According to one embodiment, the fourth point P24 of the second metal E22 is electrically connected to the antenna ground G3 through a second grounding path 3812. For example, the second grounding path 3812 includes one or more combinations of conductive paths (or conductors or conductive structures) (not shown) between the fourth point P24 of the second metal E22 and the second ground region G32 of the antenna ground G3. 【0476】 According to one embodiment, the NFC wireless communication circuit 3201 provides (or supplies) a positive voltage to the first metal E21 through the first power supply path 3801. When positive power is supplied to the first power supply path 3801, current (or radiated current) flows on the first metal E21 from the first point P21 to the third point P23. 【0477】 According to one embodiment, the NFC wireless communication circuit 3201 provides (or supplies) a voltage to the second metal E22 through the second power supply path 3802. When supplying power to the second power supply path 3802, current (or radiated current) flows on the second metal E22 from the fourth point P24 to the second point P22. 【0478】 According to one embodiment, the NFC wireless communication circuit 3201 provides (or supplies) a positive voltage to the third metal E23 through the third power supply path 3403. The NFC wireless communication circuit 3201 also provides (or supplies) a negative voltage to the third metal E23 through the fourth power supply path 3404. During the positive power supply to the third power supply path 3403 and the negative power supply to the fourth power supply path 3404, current (or radiated current) flows on the third metal E23 from the fifth point P25 to the sixth point P26. 【0479】 According to one embodiment, when the multifoldable electronic device 32 is folded and power is supplied from the NFC wireless communication circuit 3201, the first current path (or first loop) including the first metal E21, the second current path (or second loop) including the second metal E22, and the third current path (or third loop) including the third metal E23 form a coil (or a loop in the form of a coil). The first current path provides (or forms) the first turn of the coil. The second current path provides (or forms) the second turn of the coil. The third current path provides (or forms) the third turn. When the multifoldable electronic device 32 is folded, the coil formed by the combination of the first turn of the first current path, the second turn of the second current path, and the third turn of the third current path generates an electromagnetic field which is a composite of the first electromagnetic field generated through the first current path, the second electromagnetic field generated through the second current path, and the third electromagnetic field generated through the third current path, thereby improving the radiation performance. 【0480】 According to one embodiment, when the multifoldable electronic device 32 is in a folded state and power is supplied from the NFC wireless communication circuit 3201, the direction (or phase of the current) 3301 in which current flows from the first point P21 to the third point P23 on the first metal E21, the direction 3302 in which current flows from the fourth point P24 to the second point P22 on the second metal E22, and the direction 3303 in which current flows from the fifth point P25 to the sixth point P26 on the third metal E23 are substantially the same. Ensuring that current (or radiated current) flows in substantially the same direction in the first metal E21, second metal E22, and third metal E23, which are aligned and overlapping with each other in the folded state of the multifoldable electronic device 32, generates an electromagnetic field with greater electromagnetic force strength and improves radiation performance compared to ensuring that current flows in opposite directions (e.g., reverse directions) in any two of the metals among the first metal E21, second metal E22, and third metal E23, which are aligned and overlapping with each other in the folded state of the multifoldable electronic device 32. 【0481】 According to one embodiment, when the multifoldable electronic device 32 is in a folded state and power is supplied from the NFC wireless communication circuit 3201, the phases of the current flowing on the first metal E21, the phases of the current flowing on the second metal E22, and the phases of the current flowing on the third metal E23 are substantially the same. Making the phases of the currents flowing on the first metal E21, the second metal E22, and the third metal E23, which are aligned and overlapping with each other in the folded state of the multifoldable electronic device 32, the same generates an electromagnetic field with a greater electromagnetic force and improves radiation performance compared to making the phases of the currents flowing on any two of the metals among the first metal E21, the second metal E22, and the third metal E23, which are aligned and overlapping with each other in the folded state of the multifoldable electronic device 32, different. 【0482】 According to various embodiments, the current (or radiated current) in the first metal E21, second metal E22, and third metal E23, which are aligned and overlapping with each other in the folded state of the multifoldable electronic device 32, may be configured to flow in the same direction opposite to the directi...

Claims

[Claim 1] Foldable electronic device (2), A foldable housing (20) including a first housing (21), a second housing (22), and a hinge portion 24 connecting the first housing and the second housing (22), A first metal (E1) is included in the first side (2112) which provides at least a portion of the side surface of the first housing (21), A second metal (E7) is included in the second side (2112) which provides at least a portion of the side surface of the second housing (22), and is aligned with the first metal (E1) in the folded state of the foldable electronic device (2), A first ground region (G1) located in the first housing (21) and physically separated from the first metal (E1), A second ground region (G2) located in the second housing (22) and physically separated from the second metal (E7), The wireless communication circuit (610) housed in the first housing (21), A first electrical path (EP1) electrically connects the first metal (E1) and the wireless communication circuit (610), The second metal (E7) and the wireless communication circuit (610) are electrically connected, and the second electrical path (EP2) is arranged across the hinge portion 24, A third electrical path (EP3) electrically connects the first metal (E1) and the first ground region (G1), A fourth electrical path (EP4) electrically connects the second metal (E7) and the second ground region (G2), A foldable electronic device characterized by comprising: a fifth electrical path (EP5) electrically connecting the first ground area (G1) and the second ground area (G2) and arranged across the hinge portion (24). [Claim 2] The foldable electronic device according to claim 1, characterized in that the wireless communication circuit (610) is configured to process NFC (near-field communication) signals. [Claim 3] The foldable electronic device (2) includes a first non-ground region N (G1) between the first metal (E1) and the first ground region (G1), and a second non-ground region N (G2) between the second metal (E7) and the second ground region (G2). The foldable electronic device according to claim 1 or 2, characterized in that, in the folded state of the foldable electronic device (2), the first non-ground region N(G1) and the second non-ground region N(G2) are aligned. [Claim 4] The foldable electronic device according to any one of claims 1 to 3, characterized in that the wireless communication circuit (610) provides a positive voltage to the first electrical path (EP1) and a negative voltage to the second electrical path (EP2). [Claim 5] The first electrical path (EP1) is electrically connected to the first point P1 of the first metal (E1), The third electrical path (EP3) is electrically connected to the third point P3 of the first metal (E1), The second electrical path (EP2) is electrically connected to the second point P2 of the second metal (E7), The fourth electrical path (EP4) is electrically connected to the fourth point P4 of the second metal (E7), The third point P3 is located between the first point P1 and the hinge portion (24). The foldable electronic device according to any one of claims 1 to 4, characterized in that the second point P2 is located between the fourth point P4 and the hinge portion (24). [Claim 6] The first electrical path (EP1) and the fourth electrical path (EP4) are electrically connected, and a sixth electrical path (EP6) is arranged across the hinge portion (24), The foldable electronic device according to any one of claims 1 to 5, further comprising a seventh electrical path (EP7) that electrically connects the second electrical path (EP2) and the third electrical path (EP3). [Claim 7] The flexible printed circuit board extends from the first housing (21) to the second housing (22) across the hinge portion (24), The foldable electronic device according to claim 6, characterized in that the flexible printed circuit board includes a first conductive line included in the second electrical path (EP2) and a second conductive line included in the sixth electrical path (EP6). [Claim 8] A spiral conductive pattern (1100) housed in the first housing (21), A ninth electrical path (EP9) electrically connects the first end (1101) of the helical conductive pattern (1100) and the first electrical path (EP1), The foldable electronic device according to any one of claims 1 to 7, further comprising a tenth electrical path (EP10) that electrically connects the second end (1102) of the helical conductive pattern (1100) and the second electrical path (EP2). [Claim 9] The first rear region of the first housing (21) includes a first region (201), a second region (202), and a third region (203), The second region (202) is located between the first region (201) and the third region (203). The second rear region of the second housing (22) includes a fourth region (204), a fifth region (205), and a sixth region 206. The fifth region (205) is located between the fourth region (204) and the sixth region 206. With the foldable electronic device (2) in the folded state, the first region (201) and the fourth region (204), the second region (202) and the fifth region (205), and the third region (203) and the sixth region (206) are aligned with each other. The first metal (E1) is located in correspondence with the first region (201), The second metal (E7) is located in correspondence with the fourth region (204), The foldable electronic device according to claim 8, characterized in that the helical conductive pattern (1100) is located in correspondence with the second region (202). [Claim 10] The foldable electronic device according to any one of claims 1 to 9, characterized in that it includes a matching circuit (630) electrically connected to the first electrical path (EP1) and the second electrical path (EP2). [Claim 11] A foldable electronic device according to any one of claims 1 to 10, characterized in that it includes a first filter (640) arranged in the first electrical path (EP1). [Claim 12] The foldable electronic device according to any one of claims 1 to 11, characterized in that it includes a second filter (650) arranged in the second electrical path (EP2). [Claim 13] Foldable electronic device (2), The first metal (E1) included in the first side member (2112) of the first housing (21), The second metal (E7) included in the second side member (2112) of the second housing (22), A hinge portion (24) rotatably connects the first housing (21) and the second housing (22), The system includes a wireless communication circuit (610) configured to transmit and / or receive signals in the NFC (near-field communication) band through the first metal (E1) and the second metal (E7), In the folded state of the foldable electronic device (2), the first metal (E1) and the second metal (E7) are aligned with each other. A foldable electronic device (2) characterized in that, in the folded state, the direction in which current flows on the first metal (E1) and the direction in which current flows on the second metal (E7) are the same when power is supplied from the wireless communication circuit (610). [Claim 14] A balun (1901) between the first metal (E1) and the wireless communication circuit (610), A first electrical path (EP1) electrically connects the first metal (E1) and the wireless communication circuit (610), A second electrical path (EP15) electrically connects the wireless communication circuit (610) and the balun (1901), A third electrical path (EP16) electrically connects the wireless communication circuit (610) and the balun (1901), The first metal (E1) and the second metal (E7) are electrically connected, and a fourth electrical path (EP17) is arranged across the hinge portion (24), The present invention includes a fifth electrical path (EP18) that electrically connects the second metal (E7) and the ground region (G2) located in the second housing (22), The foldable electronic device according to claim 13, characterized in that the wireless communication circuit (610) provides a positive voltage to the second electrical path (EP15) and a negative voltage to the third electrical path (EP16). [Claim 15] The foldable electronic device according to claim 14, further comprising a phase converter (2001) arranged in the fourth electrical path (EP17).

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