Handheld electronic device

Abstract

The present disclosure relates to handheld electronic devices. A portable electronic device can include a housing including a front cover defining a front outer surface, and a display positioned below the front cover and including a set of transparent conductive traces positioned in a graphical active area of the display and including a first plurality of transparent conductive traces and a second plurality of transparent conductive traces oriented perpendicular to the first plurality of transparent conductive traces. The portable electronic device can also include a proximity sensor including an optical emitter positioned below the display and configured to emit light through the display and through the front cover. The optical emitter can be arranged relative to an optical receiver along a direction oblique to the first plurality of transparent conductive traces and the second plurality of transparent conductive traces.

Description

[0001] Cross-reference to related applications

[0002] This patent application is a non-provisional patent application filed on January 10, 2022, entitled “Handheld Electronic Device”, and claims the benefit of that patent application, the entire disclosure of which is incorporated herein by reference. Technical Field

[0003] The subject matter of this disclosure relates generally to handheld electronic devices, and more specifically to mobile phones. Background Technology

[0004] Modern consumer electronics devices come in a variety of shapes and forms and have a wide range of uses and functions. For example, smartphones offer users various ways to interact with others outside the range of telephone communication. Such devices can include numerous systems designed to facilitate such interactions. For instance, a smartphone may include a touch-sensitive display for providing graphical output and accepting touch input, a wireless communication system for connecting with other devices to send and receive voice and data content, a camera for capturing photos and videos, and so on. However, integrating these subsystems into a compact and reliable product capable of withstanding everyday use presents several technical challenges. The systems and technologies described herein address most of these challenges while providing devices with a wide variety of functionalities. Summary of the Invention

[0005] A portable electronic device may include a housing comprising an outer shell component and a front cover, the front cover being coupled to the outer shell component and defining a front outer surface of the portable electronic device. The portable electronic device may further include a display positioned beneath the front cover, the display defining an effective display area, a first aperture surrounded by the effective display area, and a second aperture surrounded by the effective display area. The portable electronic device may further include: a first optical sensor positioned beneath the front cover and below the first aperture; a second optical sensor positioned beneath the front cover and below the second aperture; and a touch sensing component configured to detect a first touch input applied to the front cover within the effective display area of ​​the display and a second touch input applied to the front cover above the first aperture in the display.

[0006] The touch sensing component may be further configured to detect a third touch input applied to the front cover above the second hole in the display. The portable electronic device may also include a light emitter positioned below the front cover and below the first hole and configured to emit light onto an object, and the first optical sensor may be configured to receive a portion of the emitted light reflected from the object. The second touch input may be detected above the first optical sensor, and the touch sensing component may be further configured to detect a fourth touch input applied to the front cover above the light emitter.

[0007] The portable electronic device may also include an opaque shield positioned below the front cover and defining a first opening positioned above the first hole and a second opening positioned above the second hole. The portable electronic device may also include a polymer coating positioned on an inner surface of the front cover, and the opaque shield may be positioned on the polymer coating. The polymer coating may define a textured surface, and the opaque shield may be positioned on and conform to the textured surface.

[0008] A mobile phone may include a housing comprising a casing component and a front cover, the front cover being coupled to the casing component and defining a display area and a forward sensor area surrounded by the display area. The portable electronic device may also include a touch sensing component beneath the front cover, the touch sensing component comprising: a display layer defining a graphically active region configured to display graphical output therein; and a touch sensing layer defining a first touch-sensitive region and a second touch-sensitive region, the first touch-sensitive region configured to detect touch input applied to the graphically active region, and the second touch-sensitive region configured to detect touch input applied to a graphically inactive region of the forward sensor area. The touch input applied to the graphically inactive region of the forward sensor area may include gesture input. The gesture input may be a swipe input.

[0009] The mobile phone may further include a first optical sensor located in the forward sensor region and a second optical sensor located in the forward sensor region, and the touch sensing component may define a first hole located above the first optical sensor and a second hole located above the second optical sensor. Touch input applied to the graphic inactive area of ​​the forward sensor region may include a first touch input applied above the first optical sensor and a second touch input applied above the second optical sensor. The mobile phone may be configured to perform a first action in response to detecting the first touch input applied above the first optical sensor, and to perform a second action different from the first action in response to detecting the second touch input applied above the second optical sensor.

[0010] The mobile phone may also include a light emitter positioned in the forward sensor region, and the touch sensing component may define a third hole positioned above the light emitter. A first portion of the second touch-sensitive region may be positioned between the first hole and the second hole, and a second portion of the second touch-sensitive region may be positioned between the second hole and the third hole.

[0011] A portable electronic device may include: a housing including a front cover; a first optical component positioned below a first region of the front cover and configured to receive light passing through the first region of the front cover; a second optical component positioned below a second region of the front cover and configured to receive light passing through the second region of the front cover; and a display component positioned below the front cover. The display component may define a first aperture positioned above the first optical component and a second aperture positioned above the second optical component. The display component may be configured to output a first graphic output in a first display region extending around the first aperture and the second aperture, and to output a second graphic output in a second display region located between the first aperture and the second aperture. The second graphic output may be displayed in response to the portable electronic device receiving a notification event. The second display region may not display graphic output before receiving the notification event. The second display region may display a third graphic output before receiving the notification event. The portable electronic device may also include a touch-sensitive component positioned below the front cover and defining a first aperture positioned above the first optical component and a second aperture positioned above the second optical component. The touch-sensitive component can be configured to detect input applied to the front cover in the first display area and to detect input applied to the front cover in the second display area.

[0012] A mobile phone may include a display, wireless communication circuitry, a battery, and a housing encapsulating the display, the wireless communication circuitry, and the battery. The housing may include: a front cover formed of a transparent material and defining a front outer surface of the mobile phone; a rear cover formed of a glass material and defining a rear outer surface of the mobile phone; and a first housing member including a first wall segment, a second wall segment, and a central base segment, wherein the first wall segment defines a first side outer surface of the mobile phone, the second side wall segment defines a second side outer surface opposite to the first side outer surface, and the central base segment extends between the first wall segment and the second wall segment. The housing may further include a second housing member and a third housing member, the second housing member being positioned at a first end of the first housing member and defining a first outer corner surface, and the third housing member being positioned at the first end of the first housing member and defining a second outer corner surface.

[0013] The first wall section, the second wall section, and the intermediate base plate section of the first housing component may be integrally formed of a first metal material, the second housing component may be formed of a second metal material, and the third housing component may be formed of a third metal material. The housing may further include a first intermediate element and a second intermediate element, the first intermediate element being positioned between the first housing component and the second housing component and formed of a first polymer material, and the second intermediate element being positioned between the first housing component and the third housing component and formed of a second polymer material. The first wall section, the second wall section, and the intermediate base plate section may be integrally formed by extruding the first metal material.

[0014] The wireless communication circuit can be operatively connected to the second housing component and the third housing component, and the second housing component and the third housing component can be configured to operate as radiating antenna elements of the wireless communication circuit. The display can be positioned on a first side of the intermediate base plate section, and the battery can be positioned on a second side of the intermediate base plate section opposite to the first side.

[0015] The mobile phone may further include a circuit board assembly coupled to the intermediate base plate section and a thermal bridge thermally coupling the circuit board assembly to the intermediate base plate section. The thermal bridge may be located near a first side of the circuit board assembly, and the first side of the circuit board assembly may be opposite a second side of the circuit board assembly, the second side being located near the first wall section of the first housing member. The thermal bridge may include graphite material coupled to the circuit board assembly and to the intermediate base plate section of the first housing member. The thermal bridge may be offset inwardly from the first wall section.

[0016] A portable electronic device may include a housing defining an interior cavity and including a front cover assembly defining a front outer surface of the housing, a rear cover assembly defining a rear outer surface of the housing, and an intermediate housing component formed of extruded metallic material. The intermediate housing component may include a first wall section, a second wall section, and an intermediate base plate section. The first wall section defines a first side outer surface of the housing, the second wall section defines a second side outer surface opposite to the first side outer surface, and the intermediate base plate section is integrally formed with the first wall section and the second wall section and defines at least a portion of the interior cavity. The portable electronic device may further include: a battery positioned within the interior cavity of the housing and thermally coupled to the intermediate base plate section; a display positioned below the front cover assembly; and a camera array positioned below the rear cover assembly.

[0017] The front cover assembly may include a glass-ceramic sheet defining a display area and a metal frame. The glass-ceramic sheet defines a display area, and the metal frame is coupled to and surrounds the display area. The metal frame includes an array of tabs structurally coupled to the intermediate housing component. A first tab in the tab array may be structurally coupled to a first spring-loaded connecting element, and the first spring-loaded connecting element is attached to the intermediate housing component.

[0018] The portable electronic device may also include an optical facial recognition system configured to detect a user's facial features. The intermediate base plate section may define an opening, and the optical facial recognition system may be positioned below the front cover assembly and at least partially within the opening. The intermediate base plate section may define a first surface facing the front cover assembly and a second surface opposite the first surface, and the optical facial recognition system may be coupled to the second surface. The housing may also include a first outer shell component and a second outer shell component, the first outer shell component being positioned at a first end of the intermediate outer shell component and defining a first outer corner surface, and the second outer shell component being positioned at the first end of the intermediate outer shell component and defining a second outer corner surface.

[0019] An electronic device may include a housing comprising a front cover, a rear cover, and an outer casing component. The front cover is formed of a first glass material and defines a front outer surface of the housing, and the rear cover is formed of a second glass material and defines a rear outer surface of the housing. The outer casing component may include: a central base plate section that partially defines a first cavity between the central base plate section and the front cover and partially defines a second cavity between the central base plate section and the rear cover; a first wall section positioned along a first side of the central base plate section and defining a first side outer surface of the housing; and a second wall section positioned along a second side of the central base plate section and defining a second side outer surface of the housing. The electronic device may further include: a display coupled to the front cover; a circuit board assembly positioned in the second cavity and thermally coupled to the central base plate section; and a battery positioned in the second cavity and structurally coupled to the central base plate section. The first glass material may be a glass-ceramic material, and the second glass material may be an alkali-aluminosilicate material.

[0020] The intermediate base plate section may define a plate structure and an array of mounting bosses integrally formed with the plate structure, and the circuit board assembly may be connected to the array of mounting bosses by a set of threaded fasteners. The electronic device may also include a thermal bridge formed of a thermally conductive material, and the thermal bridge may be located between the circuit board assembly and the intermediate base plate section. The thermal bridge may be located near the centerline of the intermediate base plate section. The thermal bridge may be a first thermal bridge formed of a first thermally conductive material, and the electronic device may also include a second thermal bridge formed of a second thermally conductive material and located between the circuit board assembly and the intermediate base plate section.

[0021] F-EF229573

[0022] A portable electronic device may include: a housing including a front cover defining a front outer surface; and a display positioned below the front cover and including a set of transparent conductive traces located within a graphic-effective area of ​​the display and including a first plurality of transparent conductive traces and a second plurality of transparent conductive traces oriented perpendicular to the first plurality of transparent conductive traces. The portable electronic device may further include a proximity sensor including an optical emitter and an optical receiver. The optical emitter is positioned below the display and configured to emit light that passes through the display and through the front cover. The optical receiver is positioned below the display and configured to receive a reflected portion of the emitted light that passes through the display and through the front cover. The optical emitter may be arranged relative to the optical receiver in a direction oblique to both the first plurality of transparent conductive traces and the second plurality of transparent conductive traces.

[0023] The proximity sensor can be configured to detect the proximity of an object to the front outer surface. The optical emitter can be a laser emitter configured to emit light having a wavelength between about 1300 nanometers and about 1400 nanometers. The display can include a substrate, and the first plurality of transparent conductive traces can be positioned on the substrate. The display can be an organic light-emitting diode (OLED) display, the first plurality of transparent conductive traces can be a set of anodes for the OLED display, and the second plurality of transparent conductive traces can be a set of cathodes for the OLED display.

[0024] The display may include a touch sensor, the first plurality of transparent conductive traces may be a first set of electrodes for the touch sensor, and the second plurality of transparent conductive traces may be a second set of electrodes for the touch sensor. The display may include an opaque backing layer defining a first aperture and a second aperture, the optical emitter may be positioned below the first aperture, and the optical receiver may be positioned below the second aperture.

[0025] A mobile phone may include a housing comprising a casing component and a transparent cover coupled to the casing component and defining a display area and a forward sensor area surrounded by the display area. The mobile phone may also include a display located beneath the transparent cover and defining a graphic-effective area configured to display graphic output within the display area. The display may include a conductive trace grid comprising a first set of conductive traces extending along a first direction and a second set of conductive traces extending along a second direction perpendicular to the first direction. The mobile phone may also include a proximity sensor positioned below the graphic-effective area of ​​the display and including a pair of optical components positioned along a third direction oblique to both the first and second directions. The pair of optical components includes an optical emitter and an optical receiver, the optical emitter being configured to emit light through the display, and the optical receiver being configured to receive reflections of the emitted light through the display. The conductive traces in the first and second sets of conductive traces may be formed of an optically transmissive conductive material.

[0026] The third direction can be oriented at a 45-degree angle relative to the first and second directions. The proximity sensor can be configured to detect the proximity of an object to the transparent cover based at least in part on the characteristics of the reflective portion of the emitted light.

[0027] The display may include an opaque layer defining a first aperture having a first size and a second aperture having a second size larger than the first size. An optical emitter may be positioned below the first aperture, and an optical receiver may be positioned below the second aperture. A first side of the second aperture may extend along a fourth direction oblique to both the first and second directions, and a second side of the second aperture may extend along a fifth direction oblique to the first direction.

[0028] The mobile phone may also include a bracket structure within the housing and defining a first wall section extending in a fourth direction parallel to the third direction, and the proximity sensor may include a housing defining a second wall section extending in a fifth direction parallel to the third direction, the second wall section being separated from the first wall section by a gap.

[0029] A portable electronic device may include: a housing including a front cover defining a front outer surface; and a display positioned below the front cover and including one or more electrode layers. The one or more electrode layers may include a first plurality of transparent conductive traces and a second plurality of transparent conductive traces oriented perpendicular to the first plurality of transparent conductive traces. The display may also include an opaque layer positioned below the one or more electrode layers and defining a pair of apertures extending through the opaque layer and oriented obliquely to both the first plurality of transparent conductive traces and the second plurality of transparent conductive traces. The portable electronic device may also include an optical emitter and an optical receiver, the optical emitter positioned below a first aperture of the pair of apertures and configured to emit light through the first aperture, and the optical receiver positioned below a second aperture of the pair of apertures and configured to detect the proximity of an object to the portable electronic device based at least in part on a reflected portion of the light emitted by the optical emitter. The light emitted by the optical emitter may have a wavelength between about 1300 nanometers and about 1400 nanometers.

[0030] The second aperture may be larger than the first aperture. The transparent conductive traces in the first plurality of transparent conductive traces and the second plurality of transparent conductive traces may include indium tin oxide. The display may be an organic light-emitting diode (OLED) display, the first plurality of transparent conductive traces may be a set of anodes for the OLED display, and the second plurality of transparent conductive traces may be a set of cathodes for the OLED display. The optical receiver may be configured to detect the proximity of an object to the portable electronic device when the display may be generating graphic output over the first and second apertures.

[0031] A portable electronic device may include a housing comprising a front cover and a rear cover, the front cover defining a front outer surface of the portable electronic device and the rear cover defining a rear outer surface of the portable electronic device. The portable electronic device may also include a rear-facing camera and a rear-facing flash, the rear-facing flash including a light-emitting element defining a plurality of illuminating areas. The light-emitting element may be configured to illuminate a first subset of the plurality of illuminating areas to illuminate a first field of view, and to illuminate a second subset of the plurality of illuminating areas to illuminate a second field of view different from the first field of view.

[0032] The rear-facing camera may be a first rear-facing camera having the first field of view. The portable electronic device may also include a second rear-facing camera having the second field of view and a third rear-facing camera having a third field of view, which is different from both the first and second field of view. The light-emitting component may be configured to illuminate the first field of view when a first image is captured using the first rear-facing camera, illuminate the second field of view when a second image is captured using the second rear-facing camera, and illuminate a third subset of the plurality of illuminable areas to illuminate the third field of view when a third image is captured using the third rear-facing camera, the third subset being different from the first and second subsets. The rear-facing flash may include a flash lens positioned above the light-emitting component. The first subset of the plurality of illuminable areas may be a first illuminable area positioned below the center of the flash lens. The second subset of the plurality of illuminable areas may be positioned around the periphery of the first illuminable area, and the third subset of the plurality of illuminable areas may be positioned around the periphery of the first illuminable area. The plurality of illuminable areas may include an array of illuminable areas arranged in a grid.

[0033] The rear-facing flash may further include a flash lens and a flash window above the flash lens. The flash window may define an outer side and an inner side having a plurality of ridges configured to produce a pattern visible from the outer side of the flash window. The plurality of ridges may be concentric ridges. One of the ridges may be defined by a peak having a first side extending from the flash window at a first angle and a second side extending from the flash window at a second angle, the first angle and the second angle having the same magnitude and opposite signs.

[0034] A mobile phone may include a display and a housing that at least partially encloses the display. The housing may include a housing component, a front cover, and a rear cover, the front cover being coupled to the housing component and positioned above the display, and the rear cover being coupled to the housing component. The mobile phone may also include a rear-facing camera and a rear-facing flash, the rear-facing camera having a field of view and configured to capture an image of a scene, the rear-facing flash being configured to illuminate the scene and including a light-emitting component, a lens, and a flash window, the lens being above the light-emitting component and configured to project light emitted by the light-emitting component to produce a light overflow corresponding to the field of view of the rear-facing camera, and the flash window being above the lens. The flash window may define an outer side and an inner side having a series of concentric circular ridges, the series of concentric circular ridges including ridges defined by symmetrical peaks extending from the inner side of the flash window. An air gap may be defined between the flash window and the lens.

[0035] The symmetrical peak may have a first side extending from the inside of the flash window at a first angle and a second side extending from the inside of the flash window at a second angle, the first angle and the second angle having the same magnitude and opposite signs. The ridge may be a first ridge, the symmetrical peak may be a first symmetrical peak, and the series of concentric circular ridges may also include a second ridge defined by a second symmetrical peak extending from the inside of the flash window, the second symmetrical peak having a third side extending from the inside of the flash window at a third angle and a fourth side extending from the inside of the flash window at a fourth angle, the third angle being equal to the first angle and the fourth angle being equal to the second angle.

[0036] The mobile phone may also include a flash unit, the flash window of which may be defined by a transparent portion of the flash unit, and the flash unit may define an opaque portion positioned below the transparent portion. A portion of the opaque portion of the flash unit is visible through the lens. The transparent portion and the opaque portion of the flash unit may be parts of a monolithic polymer structure.

[0037] A portable electronic device may include: a housing; a front cover attached to the housing and defining the front of the portable electronic device; and a sensor array positioned along the rear of the portable electronic device. The sensor array may include: a camera configured to capture images; and a flash configured to generate an illumination field, the flash including a flash body defining a window portion, a substrate attached to the flash body, a light-emitting element positioned on the substrate and configured to emit light, and a lens positioned below the window portion and above the light-emitting element. The lens may define a flash guiding region and a support region, the flash guiding region being configured to transmit light from the light-emitting element through the window portion to illuminate the camera's field of view, and the support region surrounding the flash guiding region and being configured to transmit light reflected by the flash body through the window portion.

[0038] The support region of the lens may define an outer surface of the window portion facing the flash body and an inner surface opposite the outer surface, and a portion of at least one of the outer surface or the inner surface may have a textured surface. The textured surface may have a different surface texture than the surface defined by the flash guiding region of the lens.

[0039] The window portion may define an outer side and an inner side. The inner side may have a plurality of ridges configured to produce a pattern visible from the outer side of the window portion, the plurality of ridges including a series of concentric circular ridges extending from the inner side of the window portion and defining symmetrical peaks.

[0040] The window portion may be defined by a transparent portion of the flash unit body, and the flash unit body may further define an opaque portion positioned below the transparent portion. The light reflected by the flash unit body may be reflected by the opaque portion of the flash unit body.

[0041] The mobile phone may include a display, a housing, and a raised sensor array region. The housing encloses the display and includes a front cover positioned above the display and defining a front outer surface, and a rear cover defining a rear outer surface, with the sensor array region along the rear outer surface. The raised sensor array region may define a first aperture extending through the raised sensor array region and a second aperture extending through the raised sensor array region. The second aperture may be defined by a first opening along an inner surface of the rear cover and having a first opening size, and the second opening along the rear outer surface of the rear cover and having a second opening size smaller than the first opening size. The mobile phone may also include a first camera and a second camera. The first camera has a first lens assembly at least partially within the housing and extending into the first aperture, and the second camera has a second lens assembly at least partially within the housing and extending into the second aperture. The second lens assembly may define a base portion and an end portion. The base portion has a first outer diameter and extends through the first opening, and the end portion has a second outer diameter smaller than the first outer diameter and extends through the second opening. The rear cover may be formed of a glass material.

[0042] The second hole may be defined by a hole surface having a tapered portion near the first opening and a cylindrical portion near the second opening. The tapered portion may define a truncated conical surface.

[0043] The mobile phone may also include a frame member coupled to the back cover and defining a tapered wall section extending into the second hole, and the second camera may be attached to the frame member. The mobile phone may also include a decorative ring positioned in the second hole and coupled to the frame member. The decorative ring may be a first decorative ring, and the mobile phone may also include a second decorative ring positioned in the second hole and coupled to the first decorative ring.

[0044] The second hole may be defined by a hole surface having a tapered portion near the first opening and a cylindrical portion near the second opening, and the mobile phone may also include a sealing member positioned between and in contact with the decorative ring and the cylindrical portion of the hole surface. The mobile phone may also include an opaque coating applied to the tapered portion and the cylindrical portion of the hole surface.

[0045] A portable electronic device may include a display, a battery, and a housing. The housing encloses the display and the battery and includes a housing component, a front cover, and a rear cover. The front cover is coupled to the housing component and defines a front outer surface of the portable electronic device, and the rear cover is coupled to the housing component and defines a rear outer surface of the portable electronic device. The portable electronic device may further include: a rearward sensor array including a camera holder; a first camera coupled to the camera holder and having a first field of view; a second camera coupled to the camera holder and having a second field of view different from the first field of view; and a third camera coupled to the camera holder and having a third field of view different from the first and second fields of view. The portable electronic device may further include a first bias spring and a second bias spring. The first bias spring is positioned along a first side of the camera holder and configured to bias the camera holder toward the battery in a first direction, and the second bias spring is positioned along a second side of the camera holder and configured to bias the camera holder in a second direction transverse to the first direction.

[0046] The portable electronic device may also include a wall structure extending around the periphery of the camera holder and defining a first wall section, a second wall section, and a third wall section. The first wall section extends along a first side of the camera holder and is positioned between the camera holder and the top sidewall of the housing component. The second wall section extends along a second side of the camera holder and is positioned between the camera holder and the lateral sidewall of the housing component. The third wall section extends along a third side of the camera holder opposite to the second side and is positioned between the camera holder and the battery.

[0047] The first camera may include a first camera housing comprising a first housing component and a second housing component. The first housing component is coupled to the camera holder and defines the bottom of the first camera. The second housing component is coupled to the first housing component at a first seam and defines the top of the first camera. The second camera may include a second camera housing comprising a third housing component and a fourth housing component. The third housing component is coupled to the camera holder and defines the bottom of the second camera. The fourth housing component is coupled to the third housing component at a second seam and defines the top of the second camera housing. The camera holder may define a flange positioned between the first camera and the second camera and having a top edge that is below the first seam and the second seam. A portion of at least one of the second housing component or the fourth housing component may extend at least partially above the top edge of the flange.

[0048] The back cover may define a first hole, a second hole, and a third hole in the rearward sensor array region of the back cover. A portion of the first camera may extend into the first hole, a portion of the second camera may extend into the second hole, and a portion of the third camera may extend into the third hole. The portable electronic device may also include a decorative assembly positioned along the outer surface of the rearward sensor array region and extending into the first hole. The decorative assembly may include an inner decorative ring and an outer decorative ring. The inner decorative ring extends around a lens portion of the first camera and defines a first surface and a second surface. The first surface faces the lens portion, and the second surface is opposite to the first surface and defines a first channel. The outer decorative ring extends around the inner decorative ring and defines a third surface. The third surface faces the second surface of the inner decorative ring and defines a second channel. The first channel and the second channel define a hollow cavity between the inner and outer decorative rings. The outer decorative ring may further define a fourth surface, which is opposite to the third surface and defines a peripheral outer surface of the decorative assembly.

[0049] A portion of the first camera extends across the rear outer surface of the portable electronic device, and the portable electronic device may also include a decorative ring surrounding the portion of the first camera, the decorative ring defining a junction surface, an outer peripheral surface, and a chamfered surface, the junction surface being positioned on the rear outer surface of the portable electronic device, the outer peripheral surface having a first surface texture, and the chamfered surface extending from the junction surface to the outer peripheral surface and having a second surface texture different from the first surface texture.

[0050] A portable electronic device may include a display and a housing enclosing the display. The housing may include an outer casing component, a front cover, and a rear cover, the front cover being coupled to the outer casing component and positioned above the display, and the rear cover being coupled to the outer casing component. The portable electronic device may further include: a camera holder coupled to the outer casing component; a first camera having a first field of view and coupled to the camera holder, the camera holder connecting the first camera to the housing; a second camera having a second field of view different from the first field of view and coupled to the camera holder, the camera holder connecting the second camera to the housing; a first bias spring extending into a first hole defined in the camera holder and configured to bias the camera holder along a first direction; and a second bias spring extending into a second hole in the camera holder and configured to bias the camera holder along a second direction different from the first direction.

[0051] The housing component may include a first wall section, a second wall section, and a middle base plate section. The first wall section defines a first side outer surface of the portable electronic device, the second wall section defines a second side outer surface opposite to the first side outer surface, and the middle base plate section extends between the first wall section and the second wall section. A camera holder may be attached to the middle base plate section. The first direction may be toward the top of the portable electronic device, and the second direction may be toward one side of the portable electronic device. The camera holder may be configured to hold the first camera in a fixed position relative to the second camera.

[0052] A portable electronic device may include a housing comprising a shell component and a front cover assembly. The shell component defines a side outer surface of the portable electronic device, and the front cover assembly is coupled to the shell component and defines a front outer surface of the portable electronic device. The front cover assembly may include a cover defining a recess. The portable electronic device may include a speaker assembly positioned below the front cover assembly and coupled to an audio channel configured to transmit audio output from the speaker assembly. An end portion of the audio channel includes a gap defined between the shell component and the recess in the cover.

[0053] The gap may be defined by a set of four sides, the cover may define three of these four sides, and the inner surface of the housing component may define one of these four sides. The portable electronic device may also include a grid element positioned in the audio channel, the grid element defining an outward-facing surface that may be offset from the front outer surface by a distance greater than the thickness of the cover. The grid element may define an array of openings, each opening in the array having a width ranging from 0.1 mm to 0.5 mm. Each opening in a subset of the openings in the array may have an elongated shape, wherein the length is at least twice the width. The grid element may be molded from a polymer material.

[0054] The grid element may include a frame and a screen attached to the frame. The frame may be overmolded above the edge portion of the screen, and the screen may have an array of perforations, each perforation having a diameter ranging from 100 micrometers to 200 micrometers.

[0055] A mobile phone may include a touch-sensitive display and a housing that at least partially encloses the touch-sensitive display. The housing may include: a front cover assembly having a transparent cover defining a front outer surface of the mobile phone, the transparent cover having a recess defined along its edge; a first housing member coupled to the front cover assembly and defining an upper outer surface of the mobile phone, the first housing member and the recess of the transparent cover defining a first audio port; and a second housing member coupled to the front cover assembly and defining a lower outer surface of the mobile phone, the second housing member defining a second audio port. The mobile phone may also include a speaker assembly positioned below the front cover assembly and acoustically coupled to the first audio port, the speaker assembly positioned within the housing and acoustically coupled to the second audio port. The first audio port may have a width of less than 0.5 mm and a length ranging from 10 mm to 20 mm.

[0056] The recess in the first housing component and the transparent cover defines a gap for the first audio port. The first audio port is acoustically coupled to the speaker assembly via an audio channel, and the mobile phone may also include a grid element positioned within the audio channel. The grid element may be molded from a polymer material, and the polymer material may define a set of elongated openings positioned along the length of the grid element. The grid element may include a screen defining an array of openings and a frame molded along at least one edge of the screen.

[0057] An electronic device may include: a display; a speaker assembly configured to generate audio output; and a housing enclosing the display and the speaker assembly, the housing including a housing member and a front cover assembly, the housing member defining a first portion of a side outer surface and a front outer surface of the electronic device, the front cover assembly being coupled to the housing member and defining a second portion of the front outer surface. The front cover assembly may include a cover defining a notch along an edge of the cover, the notch and the housing member defining an open cavity acoustically coupled to the speaker assembly and configured to transmit the audio output.

[0058] The electronic device may also include a grid element. The grid element may be positioned below the open cavity and may be offset inward from the front outer surface by a distance greater than the thickness of the cover. The housing may define an inner shelf offset inward from the front outer surface, and the grid element may be attached to the inner shelf. The grid element may define an array of slits arranged along the length of the grid element, and each slit may have a width ranging from 0.1 mm to 0.5 mm.

[0059] The electronic device may be a mobile phone, and the open cavity may define a receiver port of the mobile phone, the receiver port being configured to direct the audio output to the user's ear. The open cavity may define a 4mm... 2 Up to 8mm 2 The area of ​​the opening.

[0060] A portable electronic device may include: a housing defining an inner cavity and having a front cover; a touch-sensitive display positioned below the front cover; and a haptic engine positioned within the inner cavity and configured to generate a haptic output along an outer surface of the portable electronic device in response to an actuation signal. The haptic engine may include: a first body member defining a first side of the haptic engine and including a first spring flexure and a first end element molded over a portion of the first spring flexure; a second body member defining a second side of the haptic engine opposite the first side and including a second spring flexure and a second end element molded over a portion of the second spring flexure; a movable mass member coupled to the first spring flexure and the second spring flexure; and a coil configured to cause linear movement of the movable mass member in response to the actuation signal, thereby generating the haptic output. In response to a portion of the linear movement of the movable mass component, the first spring flexure is compressible and the second spring flexure is extendable.

[0061] The first spring flexure may define a first end portion, a second end portion, and a bent portion. The first end element may be molded above the first end portion of the first spring flexure. The movable mass component may be coupled to the second end portion of the first spring flexure, and the bent portion deforms in response to the linear movement of the movable mass component. The movable mass component may include a molded polymer frame, which may be molded above the second end portion of the first spring flexure, thereby coupling the first spring flexure to the movable mass component. The movable mass component may further include: a magnet coupled to the molded polymer frame and configured to generate a magnetic field configured to interact with the coil to cause the linear movement of the movable mass component; and a metal weight coupled to the molded polymer frame. The first end element and the molded polymer frame may be formed of a liquid crystal polymer material.

[0062] The first and second main body components can be coupled to an intermediate main body component, which defines a portion of four additional sides of the haptic engine. The first and second main body components can be soldered to the intermediate main body component. The coil can be coupled to the interior of the intermediate main body component.

[0063] The mobile phone may include: a housing including a front cover; a display at least partially located within the housing; a touch sensor configured to detect touch input along the front cover; and a haptic engine located within the housing and configured to generate haptic output in response to the touch input. The haptic engine may include a body at least partially defining a cavity; a coil coupled to an inner surface of the body; a movable mass positioned above the coil; a first body component coupled to the body and including a first spring element and a first polymer element encapsulating a portion of the first spring element; and a second body component coupled to the body and including a second spring element and a second polymer element encapsulating a portion of the second spring element, wherein the coil may be configured to cause movement of the movable mass, thereby generating the haptic output.

[0064] The portion of the first spring element may be a first end portion of the first spring element, the portion of the second spring element may be a first end portion of the second spring element, and the movable mass may include a frame member encapsulating the second end portions of the first spring element and the second end portions of the second spring element. The first polymer element may be configured to contact the first portion of the movable mass during the movement of the movable mass to restrict the movement of the movable mass toward the first body member, and the second polymer element may be configured to contact the second portion of the movable mass during the movement of the movable mass to restrict the movement of the movable mass toward the second body member. The first polymer element, the second polymer element, and the frame member may be formed of a liquid crystal polymer material.

[0065] The first body component may further include a first metal wall structure to which the first polymer element can be molded. The second body component may further include a second metal wall structure to which the second polymer element can be molded. The body may include a metal component to which the first metal wall structure can be welded, and the second metal wall structure can be welded.

[0066] The mobile phone may also include a processor configured to detect an event, the haptic output being generated in response to the detection of the event, and the haptic output including oscillations of the movable mass within the cavity.

[0067] An electronic device may include: a housing; a display at least partially located within the housing; and a haptic engine located within the housing and configured to generate haptic output along an outer surface of the electronic device. The haptic engine may include: a first housing component that at least partially defines a cavity; a coil located within the cavity; a movable mass located within the cavity; a first flexure coupled to a first end of the movable mass; a second housing component coupled to the first housing component and at least partially enclosing a portion of the first flexure; a second flexure coupled to a second end of the movable mass; and a third housing component coupled to the first housing component and at least partially enclosing a portion of the second flexure.

[0068] The second housing component may include a first metal wall structure and a first polymer material molded to the first metal wall structure and at least partially encapsulating that portion of the first flexure. The third housing component may include a second metal wall structure and a second polymer material molded to the second metal wall structure and at least partially encapsulating that portion of the second flexure. The first flexure may be a first bent sheet metal member, and the second flexure may be a second bent sheet metal member. The portion of the first flexure may be a first portion of the first flexure, the portion of the second flexure may be a first portion of the second flexure, and the movable mass may include a polymer frame encapsulating the second portion of the first flexure and the second portion of the second flexure.

[0069] A mobile phone may include: a display; a housing enclosing the display and including a front cover and a housing component, the front cover being positioned above the display and defining a front outer surface of the mobile phone, the housing component being coupled to the front cover and defining a base plate section below the front cover. The base plate section may define a first side facing the front cover, a second side opposite the first side and defining a battery mounting area, a first recess formed along the second side in the battery mounting area, and a second recess formed along the second side in the battery mounting area. The mobile phone may further include: a battery coupled to the battery mounting area of ​​the base plate section; a first adhesive positioned in the first recess and adhering the battery to the base plate section; and a second adhesive positioned in the second recess and adhering the battery to the base plate section. The first adhesive and the second adhesive may be pressure-sensitive adhesive films.

[0070] The first recess and the second recess may have a recess depth of about 50 micrometers to about 100 micrometers. The thickness of the first adhesive and the second adhesive may be about 5 micrometers to about 30 micrometers greater than the recess depth.

[0071] The battery extends a first distance along a length axis and a second distance along a width axis. The first adhesive may be a first adhesive strip positioned on the bonding side of the battery and extending along the length axis, and the second adhesive may be a second adhesive strip positioned on the bonding side of the battery and extending along the length axis. The first adhesive and the second adhesive together may cover approximately 60% of the surface area of ​​the bonding side of the battery. The first adhesive strip may be positioned along a first edge of the bonding side of the battery, and the second adhesive strip may be positioned along a second edge of the bonding side of the battery, the second edge being opposite to the first edge, and a graphic mark may be positioned on the bonding side of the battery between the first adhesive strip and the second adhesive strip.

[0072] A portable electronic device may include a display assembly, a battery, and a housing encapsulates the battery and the display assembly and includes a front cover assembly, a rear cover assembly, and an intermediate housing component. The front cover assembly is positioned above the display assembly and defines a front outer surface of the portable electronic device, the rear cover assembly defines a rear outer surface of the portable electronic device, and the intermediate housing component is formed of a metallic material. The intermediate housing component may include a first wall segment, a second wall segment, and an intermediate base segment. The first wall segment defines a first side outer surface of the portable electronic device, the second wall segment defines a second side outer surface opposite to the first side outer surface, and the intermediate base segment is integrally formed with the first wall segment and the second wall segment. The intermediate base plate section may define a first portion and a second portion, the first portion defining a first protrusion along a first side of the intermediate base plate section and defining a first recess along a second side of the intermediate base plate section opposite to the first side, a portion of the battery extending into the first recess, the second portion defining a second protrusion along the second side of the intermediate base plate section and defining a second recess along the first side of the intermediate base plate section, a portion of the display assembly extending into the second recess.

[0073] The display assembly may include circuitry positioned along an inner surface of the display assembly, and the portion of the display assembly extending into the second recess may be part of the circuitry. The battery may define a third recess and extend along a second protrusion on a second side of the intermediate base plate segment into the third recess defined by the battery. The battery may include a battery cell portion and a battery circuit portion, the battery cell portion having a first thickness, and the battery circuit portion positioned along one side of the battery cell portion and having a second thickness less than the first thickness. The battery cell portion may be attached to the first portion of the intermediate base plate segment, and the battery circuit portion may be positioned above the second protrusion. An adhesive may be positioned in the first recess and adhere the battery to the intermediate base plate segment. The thickness of the adhesive may be approximately 5 micrometers to approximately 20 micrometers greater than the depth of the second recess. An air gap may be defined between the first portion of the intermediate base plate segment and the display assembly.

[0074] A portable electronic device may include a display, a battery, a circuit board assembly, and a housing enclosing the display, the battery, and the circuit board assembly. The housing may include a front cover positioned above the display and defining a front outer surface of the portable electronic device, and a housing component coupled to the front cover and including walls defining side outer surfaces of the portable electronic device. The portable electronic device may also include an impact barrier structure within the housing and extending around the periphery of the battery, the impact barrier structure including a first barrier member positioned between the battery and the wall of the housing component, and a second barrier member positioned between the battery and the circuit board assembly.

[0075] The portable electronic device may also include a camera module, and the impact barrier structure may further include a third barrier member positioned between the battery and the camera module. The first barrier member, the second barrier member, and the third barrier member may be formed of a non-conductive polymer material. The first barrier member may be adhered to the wall, the second barrier member may be adhered to the circuit board assembly, and the third barrier member may be adhered to the camera module.

[0076] The housing component may further include a metal base plate beneath the front cover, and at least one of the first barrier member, the second barrier member, and the third barrier member may be connected to the metal base plate. At least one of the first barrier member, the second barrier member, and the third barrier member may be welded to the metal base plate.

[0077] A mobile phone may include a housing defining an internal volume, the housing including a front cover, a rear cover, and a housing component, the front cover being formed of a transparent material and defining a front outer surface of the mobile phone, the rear cover being formed of a glass material and defining a rear outer surface of the mobile phone, and the housing component defining a side outer surface of the mobile phone. The mobile phone may include a circuit board assembly within the internal volume. The circuit board assembly may include: a circuit board; circuit components attached to an outer surface of the circuit board; and a cover attached to the circuit board and covering the circuit components, the cover having a thickness of less than about 0.5 mm and including a base structure and a thermally conductive structure, the base structure being formed of an aluminum alloy having a thickness of less than about 0.4 mm, and the thermally conductive structure being positioned above the base structure and configured to dissipate heat from the circuit board assembly.

[0078] The aluminum alloy may be a 7475 series aluminum alloy. The thermally conductive structure may include graphite. The thermally conductive structure may include a multilayer structure, comprising multiple graphite layers and multiple binder layers.

[0079] The thermally conductive structure may be a first thermally conductive structure, the cover may be coupled to a first side of the circuit board assembly, and the circuit board assembly may further include a second thermally conductive structure positioned on a second side of the circuit board assembly. The housing may include a front cover assembly, the front cover assembly may include the front cover, and the mobile phone may further include a first thermal bridge and a second thermal bridge, the first thermal bridge being coupled to the first thermally conductive structure and thermally connecting the circuit board assembly to the front cover assembly, and the second thermal bridge being coupled to the second thermally conductive structure and thermally connecting the circuit board assembly to the internal structure of the housing.

[0080] The cover may define a curved section extending from the main portion of the cover to a protruding portion of the cover, and the curved section may have a bending radius greater than about 0.5 mm. The thickness of the cover in the protruding portion may be less than the thickness of the cover in the main portion.

[0081] A portable electronic device may include a housing comprising an outer shell structure, a front cover assembly, and a rear cover assembly. The front cover assembly is coupled to the outer shell structure and includes a first transparent member defining a front surface of the portable electronic device. The rear cover assembly is coupled to the outer shell structure and includes a second transparent member defining a rear surface of the portable electronic device. The portable electronic device may also include a display at least partially within the housing and below the front cover assembly, a battery at least partially within the housing, and a circuit board assembly at least partially within the housing. The circuit board assembly may include a circuit board and a cover coupled to the circuit board and defining an outer surface of the circuit board assembly. The cover may include an aluminum alloy base structure and a graphite layer above the aluminum alloy base structure. The aluminum alloy base structure may be formed of a 7475 series aluminum alloy. The aluminum alloy base structure may have a thickness of less than about 0.4 mm.

[0082] The cover can cover substantially the entire top surface of the circuit board. The circuit board assembly may include a first circuit component coupled to the top surface of the circuit board and a second circuit component coupled to the top surface of the circuit board, and the cover can cover the first circuit component and the second circuit component.

[0083] The graphite layer may be a first graphite layer, the cover may be attached to a first side of the circuit board assembly, and the circuit board assembly may also include a multilayer thermally conductive structure attached to a second side of the circuit board assembly and including a plurality of second graphite layers and a plurality of adhesive layers.

[0084] The circuit board may be a first circuit board, and the circuit board assembly may also include a wall structure and a second circuit board, the wall structure being connected to the first circuit board, and the second circuit board being connected to the wall structure and supported above the first circuit board by the wall structure.

[0085] An electronic device may include a display, a battery, and a housing encapsulating the display and the battery. The housing may include: a front cover assembly defining a front outer surface of the electronic device; a rear cover assembly defining a rear outer surface of the electronic device; and a housing member including a first wall segment, a second wall segment, and an intermediate base plate segment, the first wall segment defining a first side outer surface of the electronic device, the second wall segment defining a second side outer surface opposite to the first side outer surface, and the intermediate base plate segment extending between the first wall segment and the second wall segment. The electronic device may further include: a circuit board assembly coupled to the intermediate base plate segment and defining a first peripheral side of the housing member near the first wall segment and a second peripheral side opposite to the first peripheral side; and a thermal bridge thermally connecting the circuit board assembly to the intermediate base plate segment, the thermal bridge being located near the first peripheral side of the circuit board assembly.

[0086] The center of the thermal bridge may be offset from the centerline of the circuit board assembly. The thermal bridge may be a first thermal bridge, and the electronic device may also include a second thermal bridge that thermally connects the circuit board assembly to the front cover assembly.

[0087] The thermal bridge may be a first thermal bridge, and the circuit board assembly may define a first segment extending along a first side of the battery and a second segment extending along a second side of the battery, the second side being perpendicular to the first side. The first thermal bridge may be located on the first segment of the circuit board assembly, and the electronic device may also include a second thermal bridge located on the second segment of the circuit board assembly. The circuit board assembly may further include: a first cover coupled to the first segment of the circuit board assembly and covering first circuit components of the circuit board assembly; a second cover coupled to the second segment of the circuit board assembly and covering second circuit components of the circuit board assembly; and a thermally conductive structure extending over both the first cover and the second cover, to which the first thermal bridge and the second thermal bridge may be coupled. Attached Figure Description

[0088] This disclosure will be readily understood from the following detailed description taken in conjunction with the accompanying drawings, wherein similar reference numerals denote similar structural elements, and wherein:

[0089] Figures 1A to 1B An example electronic device is shown;

[0090] Figures 1C to 1D Another exemplary electronic device is shown;

[0091] Figure 2 An exploded view of an exemplary electronic device is shown;

[0092] Figure 3 An exploded view of an exemplary electronic device is shown;

[0093] Figure 4A A partial exploded view of an exemplary electronic device is shown;

[0094] Figure 4B It shows Figure 4A An exploded view of a part of an electronic device;

[0095] Figure 4C A partial cross-sectional view of an exemplary electronic device is shown;

[0096] Figures 5A to 5B An exemplary circuit board assembly for an electronic device is shown;

[0097] Figure 5C An exemplary electronic device is shown;

[0098] Figure 5D A partial cross-sectional view of an exemplary electronic device is shown;

[0099] Figure 5E A partial cross-sectional view of an exemplary electronic device is shown;

[0100] Figure 5FA partial exploded view of an exemplary electronic device is shown;

[0101] Figure 6A An exemplary back cover assembly for an electronic device is shown;

[0102] Figure 6B The spring clip system of the electronic device is shown;

[0103] Figures 7A to 7B A portion of the camera area of ​​an electronic device is shown;

[0104] Figure 8 A partial cross-sectional view of the camera area of ​​the electronic device is shown;

[0105] Figure 9A A partial cross-sectional view of the camera area of ​​the electronic device is shown;

[0106] Figures 9B to 9G A partial cross-sectional view of an exemplary decorative component of an electronic device is shown;

[0107] Figure 9H The camera area of ​​another exemplary electronic device is shown;

[0108] Figure 10A A portion of an exemplary electronic device is shown;

[0109] Figure 10B The proximity sensor of the electronic device is shown;

[0110] Figure 11A A partial exploded view of the forward sensor region of an exemplary electronic device is shown;

[0111] Figures 11B to 11E A partial cross-sectional view of an exemplary forward sensor region is shown;

[0112] Figures 12A to 12D An exemplary forward sensor area of ​​an electronic device is shown;

[0113] Figures 12E to 12H A partial cross-sectional view of an exemplary forward sensor region is shown;

[0114] Figures 12I to 12J A partial cross-sectional view of an exemplary display layer is shown;

[0115] Figures 13A to 13F An exemplary touch input and graphics output are shown in the forward sensor area;

[0116] Figures 14A to 14B A partial cross-sectional view of an exemplary forward-facing camera of an electronic device is shown;

[0117] Figures 14C to 14EA partial cross-sectional view of an exemplary forward sensor region of an electronic device is shown;

[0118] Figure 15A A partial view of the speaker configuration of an exemplary electronic device is shown;

[0119] Figure 15B A partial cross-sectional view of an exemplary electronic device is shown, illustrating an exemplary configuration of a speaker opening;

[0120] Figure 15C A partial cross-sectional view of an exemplary electronic device is shown, illustrating another exemplary configuration of the speaker opening;

[0121] Figure 15D An exemplary acoustic cover structure for an electronic device is shown;

[0122] Figure 15E It shows having Figure 15D A partial cross-sectional view of an electronic device with an acoustic cover structure;

[0123] Figure 15F Another exemplary acoustic cover structure for an electronic device is shown;

[0124] Figure 16A The flash modules illuminating different fields of view are shown;

[0125] Figures 16B to 16C A partial cross-sectional view of the flash module is shown;

[0126] Figures 17A to 17F An exemplary illumination pattern of the light-emitting structure of a flash module is shown;

[0127] Figure 18A An exemplary configuration of the window portion of the flash module is shown;

[0128] Figure 18B It shows Figure 18A A partial cross-sectional view of the window portion;

[0129] Figure 19A A partial exploded view of an exemplary haptic engine is shown;

[0130] Figure 19B It shows Figure 19A A top view of the haptic engine;

[0131] Figure 20A An exemplary integrated module of an electronic device is shown;

[0132] Figure 20B It shows Figure 20A A partial exploded view of the integrated module;

[0133] Figure 20CA partial exploded view of a device with integrated modules is shown;

[0134] Figure 21A An exploded view of a device with a screen cover is shown.

[0135] Figure 21B A side view of an exemplary screen cover is shown;

[0136] Figures 21C to 21D A partial cross-sectional view of an exemplary screen saver is shown;

[0137] Figure 22A A partial exploded view of an exemplary circuit board assembly is shown;

[0138] Figure 22B It shows Figure 22A Bottom side view of the circuit board assembly;

[0139] Figures 22C to 22D A partial cross-sectional view of the cover of the circuit board assembly is shown; and

[0140] Figure 23 A schematic diagram of an exemplary electronic device is shown. Detailed Implementation

[0141] Reference will now be made specifically to the representative embodiments shown in the accompanying drawings. It should be understood that the following description is not intended to limit the embodiments to a single preferred embodiment. Rather, it is intended to cover alternative forms, modifications, and equivalents that may be included within the substance and scope of the embodiments defined by the appended claims.

[0142] Mobile phones as described herein may include complex and sophisticated components and systems that facilitate a variety of functions. For example, a mobile phone according to this disclosure may include a touch-sensitive display and / or a force-sensitive display, multiple cameras (including both a front-facing camera and a rear-facing camera), a GPS system, haptic actuators, a wireless charging system, and all necessary computing components and software for operating these (and other) systems and otherwise providing the functionality of the mobile phone.

[0143] Figure 1A and Figure 1B An exemplary electronic device 100 embodied as a mobile phone is shown. Figure 1A The front of device 100 is shown, while Figure 1BThe back of the device is shown. Although device 100 is a mobile phone, the concepts presented herein are applicable to any suitable electronic device, including portable electronic devices, wearable devices (e.g., watches), laptops, handheld gaming devices, tablets, computing peripherals (e.g., mice, touchpads, keyboards), or any other device. Therefore, any indexing of “electronic device” covers any and all of the foregoing.

[0144] Electronic device 100 includes a cover 102 (e.g., a front cover) attached to a housing 104 (which may include a housing structure defined by one or more housing components). Cover 102 may be positioned above a display 103. Cover 102 may be a sheet or sheet-like structure formed of a transparent or optically translucent material. In some cases, cover 102 is formed of or comprises a glass material and may therefore be referred to as a glass cover component. The glass material may be a silica-based glass material, aluminosilicate glass, borosilicate glass, alkali-containing aluminosilicate glass (e.g., lithium aluminosilicate glass), or chemically strengthened glass. Other exemplary materials for cover 102 include, but are not limited to, sapphire, ceramic, glass ceramic, crystallizable glass material, or plastic (e.g., polycarbonate). Glass ceramic materials may be silica-based glass ceramic materials, such as aluminosilicate glass ceramic materials or borosilicate glass ceramic materials. Glass ceramic materials may be chemically strengthened by ion exchange. Cover 102 may be formed as a monolithic or integral sheet. Cover 102 may also be formed as a composite of multiple layers of different materials, coatings, and other elements.

[0145] Display 103 may be at least partially located within the internal volume of housing 104. Display 103 may be attached to cover 102, such as via adhesive or other bonding methods. Display 103 may include liquid crystal display (LCD), light-emitting diode (LED) display, organic light-emitting diode (OLED) display, active layer organic light-emitting diode (AMOLED) display, organic electroluminescent (EL) display, electrophoretic ink display, etc. Display 103 may be configured to display graphic output, such as a graphical user interface that a user can view and interact with. The graphic output may be displayed as a graphic effective area (e.g., effective display area) of display 103.

[0146] Device 100 may also include an ambient light sensor that determines the properties of the ambient light conditions surrounding device 100. An exemplary ambient light sensor is described herein. Device 100 may use information from the ambient light sensor to alter, modify, adjust, or otherwise control display 103 (e.g., by altering the hue, brightness, saturation, or other optical aspects of the display based on information from the ambient light sensor). Device 100 may also include a proximity sensor that determines the proximity of an object (e.g., a user's face) to device 100. Device 100 may use information from the proximity sensor to alter, modify, adjust, or otherwise control display 103 or other functions of device 100 (e.g., deactivating the display when device 100 is held near a user's face during a telephone call).

[0147] As described herein, an ambient light sensor and / or proximity sensor may be positioned below the effective area of ​​display 103 (e.g., below a portion of the display that generates graphic output). The ambient light sensor and / or proximity sensor may emit and / or receive light through the effective area of ​​display 103 to perform sensing functions.

[0148] Display 103 may include or be associated with one or more touch sensing systems and / or force sensing systems. In some cases, components of the touch sensing system and / or force sensing system are integrated with the display stack. For example, electrode layers of touch sensing components such as touch sensors and / or force sensors may be provided in the form of a stack that includes the display components (and optionally is attached to or at least visible through cover 102). The touch sensing system and / or force sensing system may use any suitable type of sensing technology and touch sensing, including capacitive sensors, resistive sensors, surface acoustic wave sensors, piezoelectric sensors, strain gauges, etc. The outer or outer surface of cover 102 may define the input surfaces of the device (e.g., touch-sensitive input surfaces and / or force-sensitive input surfaces). While both touch sensing systems and force sensing systems may be included, in some cases, device 100 includes a touch sensing system but does not include a force sensing system.

[0149] Device 100 may also include a forward-facing camera 106. The forward-facing camera 106 may be positioned below or otherwise covered and / or protected by the cover 102. The forward-facing camera 106 may have any suitable operating parameters. For example, the forward-facing camera 106 may include a 12-megapixel sensor (with a pixel size of 1 micrometer) and a field of view of 80° to 90°. The forward-facing camera 106 may have an aperture of f / 1.9. The forward-facing camera 106 may include autofocus functionality (e.g., one or more lens elements may be movable relative to an optical sensor to focus an image onto the sensor). Other types of cameras may also be used with the forward-facing camera 106, such as a fixed-focus camera.

[0150] A forward-facing camera 106 (and other components) may be positioned within a forward-facing sensor region 111. The forward-facing sensor region 111 may be positioned in an island-like region at the front of the device 100 and may be surrounded by a display area of ​​the device 100 (e.g., a main display area). In some cases, as described herein, the forward-facing sensor region 111 may be positioned in or defined by one or more apertures formed through the display 103. In such cases, the forward-facing sensor region 111 may be adjacent to the effective area or region of the display 103 on all sides. In other words, the forward-facing sensor region 111 may be completely surrounded by the effective display area (e.g., the outer periphery of the forward-facing sensor region 111 may be surrounded by the effective area of ​​the display). In some cases, the forward-facing sensor region 111 includes, or is defined by, one or more shields or other visually opaque components or processes defining an opening for a sensor in the forward-facing sensor region 111. The forward-facing sensor region 111 may include components such as an infrared illuminator module 107 (which may include a flood illuminator or a dot projector), an infrared image capture device 109, and a forward-facing camera 106. Infrared illuminator module 107 is an example of a light emitter, and infrared image capture device 109 is an example of an optical receiver.

[0151] In some cases, the forward sensor region 111 is defined by or includes two holes formed through the display 103, such as a first hole providing an optical path to the forward camera 106, and a second hole providing a path to the infrared illuminator module 107 and the infrared image capture device 109. A supplementary display region 115 may be located between the first and second holes. The supplementary display region 115 may provide graphic output and touch sensing and / or force sensing functions to the forward sensor region 111. For example, the supplementary display region 115 may be used to display graphic output, such as lights, shapes, icons, or other elements (e.g., providing notifications and / or information to the user). In some cases, the supplementary display region 115 may be visually distinguishable from other effective areas of the display, such that the supplementary display region 115 appears not to be part of the display. For example, graphic output displayed on the display 103 (e.g., graphical user interface, images, videos, etc.) does not extend into the supplementary display region 115. In such cases, although the display has two separate holes separated by the effective display areas, the forward sensor region 111 may visually appear to be a single continuous area of ​​the display. The supplementary display area 115 and optional touch sensing components of the display surrounding the forward sensor area 111 may also include touch sensing and / or force sensing functions, allowing a user to touch the forward sensor area 111 to provide input to the device. In some cases, touch input applied at any location in the forward sensor area 111 (e.g., even directly above the optical components) can be detected by the device. These and other features of the forward sensor area 111 are described herein.

[0152] Device 100 may also include one or more buttons (e.g., button 120 and...). Figure 1B Button 116), switch (e.g., switch 118), Figure 1B (e.g., button 120), change speaker volume (e.g., button 116), switch between "ring" mode and "mute" mode, etc. (e.g., switch 118).

[0153] Device 100 may also include a speaker port 110 to provide audio output to a user (e.g., to the user's ear) during a voice call. In the context of a mobile phone, speaker port 110 (which is an example of an audio port) may also be referred to as a receiver, receiver port, or handset. Speaker port 110 may be defined by an opening defined along at least one side by housing 104 and along at least another side by cover 102. In some cases, cover 102 defines a notch along the edge of the cover, and this notch (also referred to as a recess or cutout) defines at least three sides of speaker port 110. Speaker port 110 may not have a mesh or other covering flush with the front surface of cover 102. In some cases, a protective grille or grating is positioned within device 100 and in the audio path between the speaker and speaker port 110 to prevent debris from entering device 100. The protective grille or grating may be recessed relative to the front surface or front of cover 102. Figures 15A to 15F An exemplary protective grid element is described.

[0154] Device 100 may also include a charging port 112 (e.g., a connector for receiving a power cable for supplying power to device 100 and charging the battery of device 100). Device 100 may also include an audio opening 114. Audio opening 114 allows power from an internal speaker system (e.g., Figure 2 The sound output from the speaker system 224 exits the housing 104. The device 100 may also include one or more microphones. In some cases, the microphones within the housing 104 may be acoustically connected to the surrounding environment via audio openings 114.

[0155] The housing 104 may be a multi-piece housing. For example, the housing 104 may be formed from a plurality of housing components 124, 125, 126, 127, 128, and 130, which are structurally connected together via one or more intermediate elements such as connector structures 122 (e.g., 122-1 to 122-6). The housing components 124, 125, 126, 127, 128, and 130, together with the connector structures 122, may define a strip-shaped housing structure that defines four sidewalls of the device 100 (and thus four external side surfaces). Thus, both the housing components and the connector structures define portions of the outer surfaces of the device 100.

[0156] The housing components 124, 125, 126, 127, 128, and 130 may be formed of a conductive material (e.g., a metal such as aluminum, stainless steel, etc.), and the connector structure 122 may be formed of one or more polymeric materials (e.g., a glass-reinforced polymer). The connector structure 122 may include two or more molded elements that may be formed of different materials. For example, the inner molded element may be formed of a first material (e.g., a polymeric material), and the outer molded element may be formed of a second material different from the first material (e.g., a different polymeric material). These materials may have different properties, which may be selected based on the different functions of the inner and outer molded elements. For example, the inner molded element may be configured to form a main structural connection between the housing components and may have higher mechanical strength and / or toughness than the outer molded element. On the other hand, the outer molded element may be configured to have a specific appearance, surface finish, chemical resistance, water resistance, etc., and its composition may be selected such that those functions take precedence over mechanical strength.

[0157] In some cases, one or more (or portions thereof) of housing components 124, 125, 126, 127, 128, and 130 are configured to operate as antennas (e.g., components configured to transmit and / or receive electromagnetic waves to facilitate wireless communication with other computers and / or devices). To facilitate the use of housing components as antennas, feed lines and ground lines may be electrically connected to the housing components to connect them to other antennas and / or communication circuitry. Furthermore, connector structure 122 may be substantially non-conductive to provide suitable spacing and / or electrical isolation between housing components (this can be used to tune radiating portions, reduce capacitive coupling between radiating portions and other structures, etc.). In addition to housing components 124, 125, 126, 127, 128, and 130, device 100 may also include various internal antenna elements configured to transmit and receive wireless communication signals through various regions of housing 104. Figure 1A As shown, device 100 may include antenna window 129, which allows radio frequency communication signals to be transmitted through a corresponding area of ​​housing 104.

[0158] The connector structure 122 can be mechanically interlocked with the housing component to structurally connect the housing component and form a structural housing component.

[0159] The outer surfaces of housing components 124, 125, 126, 127, 128, and 130 may have substantially the same color, surface texture, and overall appearance as the outer surface of connector structure 122. In some cases, the outer surfaces of housing components 124, 125, 126, 127, 128, and 130 and the outer surface of connector structure 122 undergo at least one common finishing process, such as abrasive blasting, machining, polishing, grinding, etc. Therefore, the outer surfaces of housing components and connector structures may have the same or similar surface finish (e.g., surface texture, roughness, pattern, etc.). In some cases, the outer surfaces of housing components and connector structures may undergo a two-stage blasting method to achieve the desired surface finish.

[0160] Figure 1A It also includes an exemplary coordinate system 101 that may define the orientation of reference device 100 (or other electronic device described herein). Coordinate system 101 defines a positive x-direction, a positive y-direction, and a positive z-direction. Unless otherwise specified, references herein to positive x, positive y, or positive z directions shall be understood to generally refer to coordinate system 101 and its relation to the reference device. Figure 1A The relationship between device 100 and the negative x, y, and z directions. Figure 1A The positive x, y, and z directions shown in the coordinate system are opposite.

[0161] Figure 1BThe back side of device 100 is shown. Device 100 may include a back cover or rear cover 132 coupled to housing 104 and defining at least a portion of the outer rear surface of device 100. Cover 102 (e.g., front cover), rear cover 132, and housing 104 may at least partially define the housing of device 100. Housing 100 may define an internal volume in which components of device 100 are positioned. Rear cover 132 may be formed of or comprise a transparent or optically translucent material. For example, rear cover 132 may include a substrate formed of a glass material. The glass material may be a silica-based glass material, aluminosilicate glass, borosilicate glass, alkali-containing aluminosilicate glass (e.g., lithium aluminosilicate glass), or chemically strengthened glass. Other exemplary materials for rear cover 132 include, but are not limited to, sapphire, ceramic, glass ceramic, crystallizable glass material, and plastic (e.g., polycarbonate). Glass ceramic materials may be silica-based glass ceramic materials, such as aluminosilicate glass ceramic materials or borosilicate glass ceramic materials. Glass-ceramic materials can be chemically strengthened through ion exchange. The back cover 132 can be formed as a single sheet or a monolithic sheet. The back cover 132 can also be formed as a composite of multiple layers of different materials, coatings, and other elements. The back cover 132 may include one or more decorative layers on the outer or inner surface of a substrate. For example, one or more opaque layers may be applied to the inner surface of the substrate (or otherwise positioned along the inner surface of the substrate) to provide a specific appearance to the back side of the device 100. The opaque layers may include sheets, inks, dyes, or combinations of these (or other) layers, materials, etc. In some cases, the opaque layers have a color substantially matching the color of the housing 104 (e.g., the outer surface of housing components and connector structures). The device 100 may include a wireless charging system, thereby powering the device 100 and / or recharging its battery via inductive (or other electromagnetic) coupling between the charger and the wireless charging system within the device 100. In such cases, the back cover 132 may be formed of a material that allows and / or facilitates wireless connectivity between the charger and the wireless charging system (e.g., glass).

[0162] Device 100 may also include a sensor array 141 (e.g., a backward sensor array in a backward sensor array region), which includes three cameras (e.g., as described herein). Figure 2(As shown). Sensor array 141 may be located in a sensor array region defined by protrusion 151 in the rear cover of device 100. Protrusion 151 may define a portion of the rear outer surface of device 100 and may at least partially define the raised sensor array region of sensor array 141. In some cases, protrusion 151 may be formed by attaching a material element (e.g., glass) to another material element (e.g., glass). In other cases, rear cover 132 may comprise a monolithic structure, and protrusion 151 may be part of the monolithic structure. For example, rear cover 132 may comprise a monolithic glass structure (or glass-ceramic structure or alkali aluminosilicate or other suitable material) defining protrusion 151 and the surrounding area. In such cases, protrusion 151 may be a region of increased thickness of the monolithic structure, or protrusion may have the same or substantially the same thickness as the rest of the cover (e.g., protrusion 151 may correspond to or substantially oppose a recessed region along the inner side of the monolithic structure, such that the monolithic structure has a uniform thickness while also defining protrusion 151).

[0163] The first camera 142 may include a 12-megapixel sensor and a telephoto lens with 3x optical zoom and an f / 2.8 aperture; the second camera 144 may include a 48-megapixel sensor with sensor-shift image stabilization and a wide-angle lens with an f / 1.7 aperture; and the third camera 146 may include a 12-megapixel sensor and an ultra-wide-angle camera with a wide field of view (e.g., 120° FOV) and an f / 2.2 aperture. One or more of the cameras in the sensor array 141 may also include lens-based optical image stabilization, whereby the lens is dynamically moved relative to a fixed structure within the device 100 to reduce the impact of "camera shake" or other movement on images captured by the camera, and / or sensor-based image stabilization, whereby the image sensor is moved relative to a fixed lens or optical assembly. One or more of these cameras may include autofocus functionality, wherein one or more lens elements (and / or sensors) are movable to focus an image onto the sensor.

[0164] The first camera 142 may include an image sensor with a pixel size between about 0.8 micrometers and about 1.4 micrometers. The second camera 144 may include an image sensor with a pixel size between about 1.6 micrometers and about 2.3 micrometers. The third camera 146 may include an image sensor with a pixel size between about 0.8 micrometers and about 1.4 micrometers.

[0165] Sensor array 141, together with associated processor and software, can provide several image capture features. For example, sensor array 141 can be configured to capture full-resolution video clips of a specific duration whenever a user captures a still image. As used herein, capturing a full-resolution image (e.g., a video image or a still image) may refer to capturing an image using all or substantially all pixels of an image sensor, or otherwise capturing an image using the maximum resolution of a camera (whether the maximum resolution is limited by hardware or software).

[0166] The captured video clips can be associated with still images. In some cases, users may be able to select individual frames from the video clip as representative still images associated with it. In this way, when a user takes a snapshot of a scene, the camera will actually record a short video clip (e.g., 1 second, 2 seconds, etc.), and the user can select precise frames from the video to use as still images captured (in addition to simply viewing the video clip as a video).

[0167] The camera of sensor array 141 may also have or provide a high dynamic range (HDR) mode, in which the camera captures an image with a dynamic brightness range greater than the brightness range captured when the camera is not in HDR mode. In some cases, sensor array 141 automatically determines whether to capture an image in HDR mode or non-HDR mode. Such determination may be based on various factors, such as ambient light of the scene, detected brightness range, hue, or other optical parameters in the scene. HDR images can be generated by capturing multiple images, each using different exposure or other image capture parameters, and producing a composite image from the multiple captured images.

[0168] The camera of sensor array 141 may also include software-based color balance correction. For example, when a flash (e.g., flash 148) is used during image capture, the camera (and / or associated processing functions of device 100) can adjust the image to compensate for the color temperature difference between the flash output and the ambient lighting in the image. Thus, for example, if the background of the image has a different color temperature than the foreground subject (e.g., because the foreground subject is illuminated by the flash output), the camera can modify the background and / or foreground of the image to produce a more consistent color temperature across the image.

[0169] The sensor array 141 may also include or be configured to operate in an object detection mode, in which the user can select (and / or the device 100 can automatically recognize) objects within the scene to facilitate processing, displaying, or capturing those objects in a manner different from the rest of the scene. For example, the user can select (or the device 100 can automatically recognize) a person's face in the scene, and the device 100 can focus on the person's face while selectively blurring parts of the scene other than the person's face. Notably, features such as HDR mode and object detection mode may be configured with a single camera (e.g., a single lens and sensor).

[0170] The sensor array 141 may also include a depth sensing device 149 configured to estimate the distance between the device and an individual object or target. The depth sensing device 149 may use a laser and time-of-flight calculations or other types of depth sensing components or techniques to estimate the distance between the device and an individual object or target.

[0171] The device 100 may also include a flash 148 (e.g., a rear-facing flash) configured to illuminate the scene to facilitate image capture with the camera of the sensor array 141. The flash 148 is configured to illuminate the scene to facilitate image capture with the sensor array 141. The flash 148 may include one or more light sources, such as one or more light-emitting diodes (e.g., one, two, three, four, or more LEDs). In some cases, the one or more light sources may be illuminated by multiple different lighting patterns, which, together with a lens positioned above the one or more light sources, can produce different illumination fields on the subject or scene. For example, and as described in more detail herein, the light source may be segmented into multiple illuminable areas, wherein the illuminable areas are positioned below different areas of the lens. When a first lighting pattern is active (e.g., one or more central illuminable areas), the emitted light may pass through a first area of ​​the lens (e.g., the central area) and produce a first illumination field on the subject or scene (e.g., a relatively narrow light distribution corresponding to the field of view of a telephoto lens). When the second illumination pattern is effective (e.g., one or more peripherally illuminable areas), the emitted light can pass through a second area of ​​the lens (e.g., a peripheral area) and create a second illumination field on the subject or scene (e.g., a relatively wide light distribution corresponding to the field of view of a wide-angle lens). Flash 148 can be configured to generate two, three, or more distinct illumination fields, each corresponding to the field of view of one of the cameras in sensor array 141. Thus, for example, flash 148 can generate a first illumination field corresponding to (e.g., substantially equal to or greater than) the field of view of first camera 142, a second illumination field corresponding to (e.g., substantially equal to or greater than) the field of view of second camera 144, and a third illumination field corresponding to (e.g., substantially equal to or greater than) the field of view of third camera 146.

[0172] The sensor array 141 may also include a microphone 150. The microphone 150 may be acoustically coupled to the external environment through a hole defined in the rear cover of the device 100 (e.g., a portion of the protrusion 151 defined by the rear cover).

[0173] Figure 1C and Figure 1D Another exemplary electronic device 140, embodied in a mobile phone, is shown. Electronic device 140 may have many outwardly facing components that are the same as or similar to those of electronic device 100. Therefore, from Figure 1A and Figure 1B The descriptions and details of such components (e.g., displays, buttons, switches, housings, covers, charging ports, connector structures, etc.) also apply to Figure 1C and Figure 1D The corresponding components are shown.

[0174] In some cases, device 140 may include a forward sensor region 113 located in a notched region at the front of device 140. In some cases, as described herein, the forward sensor region 113 may be located in or defined by a recessed region of the display (e.g., an area not occupied by the display or a visually effective portion of the display). In some cases, the forward sensor region 113 includes a shield or other visually opaque component or processing that defines an opening for the sensor. In some cases, one or more of the sensors or other devices (e.g., forward-facing cameras) in the forward sensor region 113 are aligned with apertures formed through one or more layers of the display to provide an optical path to the sensors. The forward sensor region 113 may include components such as a flood illuminator module, a proximity sensor module, an infrared light projector, an infrared image capture device, and a forward-facing camera.

[0175] Although Figure 1B The device 100 is shown as including a sensor array 141 with three cameras, but as Figure 1D The illustrated device 140 has a sensor array 134 including two cameras (e.g., a rearward sensor array in a rearward sensor array region). The sensor array 134 may be located in a sensor array region defined by a protrusion 137 in the rear cover of the device 140. The protrusion 137 may have a... Figure 1B The protrusion 151 in the middle has the same or similar structure.

[0176] Device 140 may also include one or more rear-facing devices as part of sensor array 134, which may include an ambient light sensor (ALS), microphone 135, and / or depth sensing devices configured to estimate the distance between device 140 and individual objects or targets. Sensor array 134 may also include multiple cameras, such as a first camera 138 and a second camera 139. The first camera 138 may include an ultra-wide-angle camera having a 12-megapixel sensor and a wide field of view (e.g., 120° FOV) optical stack with an aperture of f / 2.4; the second camera 139 may include a wide-angle camera having a 12-megapixel sensor and an aperture of f / 1.6. In some cases, sensor array 134 may include a telephoto lens (e.g., in addition to, or in place of, the first camera 138 and the second camera 139) having a 12-megapixel sensor with a 3x optical zoom optical stack in the f / 2.0 to f / 2.8 range. One or more of the cameras (e.g., cameras 138, 139) in sensor array 134 may also include optical image stabilization, whereby the lens is dynamically moved relative to a fixed structure within device 140 to reduce the impact of "camera shake" on images captured by the camera. These cameras may also perform optical image stabilization by moving the image sensor relative to a fixed lens or optical assembly. One or more of these cameras may include autofocus functionality, wherein one or more lens elements (and / or sensors) are movable to focus the image onto the sensor. Sensor array 134 may also include a flash 136 (e.g., a rear-facing flash). Flash 136 may include multiple LED segments or a single LED or other light-emitting components as described herein.

[0177] like Figure 1D As shown, the camera of sensor array 134 can be positioned diagonally relative to protrusion 137 (e.g., a raised sensor array). For example, a first hole can extend through back cover 132 near a first corner region of sensor array 134, and a first camera 138 can be at least partially positioned in the first hole; a second hole can extend through back cover 132 near a second corner region diagonally opposite to the first corner region of sensor array 134, and a second camera 139 can be at least partially positioned in the second hole. Thus, the first and second holes, and consequently the first and second cameras, can be positioned along a diagonal path from the first corner to the second corner of sensor array 134.

[0178] The second camera 139 may have an image sensor with a pixel size between about 1.5 micrometers and about 2.0 micrometers, and the first camera 138 may have an image sensor with a pixel size between about 0.8 micrometers and about 1.4 micrometers. If a camera with a telephoto lens is provided, it may have an image sensor with a pixel size between about 0.8 micrometers and about 1.4 micrometers.

[0179] Other details regarding the sensor array, individual cameras, and / or flashes of the sensor array relative to device 100 may apply to the sensor array, individual cameras, and / or flashes of device 140, and such details will not be repeated here to avoid redundancy.

[0180] Figure 2 An exploded view of an exemplary electronic device is shown. Specifically, Figure 2 An exploded view of device 200 is shown, illustrating the various components of device 200 and exemplary arrangements and configurations of these components. Device 200 may be an embodiment of device 100, and Figure 1A and Figure 1B The description of the various parts and components of device 100 is also applicable. Figure 2 The device 200 is shown. For clarity, redundant descriptions of some components will not be repeated here.

[0181] like Figure 2As shown, device 200 includes a cover 202 (e.g., a front cover), which may be formed of or comprise a transparent or optically translucent material. In some cases, cover 202 is formed of or comprises a glass material and may therefore be referred to as a glass cover component. The glass material may be a silica-based glass material, aluminosilicate glass, borosilicate glass, alkali-containing aluminosilicate glass (e.g., lithium aluminosilicate glass), or chemically strengthened glass. Other exemplary materials for cover 202 include, but are not limited to, sapphire, ceramics, glass ceramics, crystallizable glass materials, and plastics (e.g., polycarbonate). Cover 202 may be formed as a monolithic or integral sheet. Cover 202 may also be formed as a composite of multiple layers of different materials, coatings, and other elements. In this example, cover 202 may be formed of a glass ceramic material. Glass ceramic materials may comprise amorphous and crystalline or non-amorphous phases of one or more materials and may be formulated to improve the strength or other properties of cover 202. The glass-ceramic material can be a silica-based glass-ceramic material, such as aluminosilicate glass-ceramic material or borosilicate glass-ceramic material. The glass-ceramic material can be chemically strengthened by ion exchange. In some cases, the cover 202 may include a sheet of chemically strengthened glass or glass-ceramic or an optical processing element having one or more coatings, including anti-reflective (AR) coatings, oleophobic coatings, or other types of coatings. In some cases, the cover 202 includes a sheet of material less than 1 mm thick. In some cases, the sheet of material is less than 0.80 mm thick. In some cases, the sheet of material is approximately 0.50 mm thick or thinner. An ion exchange process can be used to chemically strengthen the cover 202 to form a compressive stress layer along the outer surface of the cover 202.

[0182] Cover 202 extends over substantially the entire front surface of the device and can be positioned within an opening defined by housing 210. As described in more detail below, the edges or sides of cover 202 may be surrounded by protective flanges or lips of housing 210, with no gap members between the edges of cover 202 and the corresponding flanges of housing 210. This configuration allows impacts or forces applied to housing 210 to be transmitted to cover 202, rather than directly transmitting shear stress through display 203 or frame 204.

[0183] like Figure 2As shown, display 203 is coupled to the inner surface of cover 202. Display 203 may include a frameless organic light-emitting diode (OLED) display, which measures 16.97 cm (6.69 inches) corner-to-corner (or 6.12-inch corner-to-corner). The periphery or inactive area of ​​display 203 may be reduced to allow for a very thin device boundary around the active area of ​​display 203. In some cases, display 203 allows for a boundary area of ​​1.5 mm or less. In some cases, display 203 allows for a boundary area of ​​1 mm or less. In one exemplary embodiment, the boundary area is approximately 0.9 mm. Display 203 may have a relatively high pixel density of approximately 460 pixels per inch (PPI) or greater. Display 203 may have an integrated (on-cell) touch sensing system. For example, the array of electrodes (or other touch sensing components) integrated into the OLED display may be time- and / or frequency-multiplexed to provide both display and touch sensing functionality. Electrodes may be configured to detect touch location, gesture input, multi-touch input, or other types of touch input along the outer surface of cover 202. In some cases, display 203 includes another type of display element, such as a liquid crystal display (LCD) without an integrated touch sensing system. That is, device 200 may include one or more touch and / or force sensing components or layers positioned between display 203 and cover 202.

[0184] Display 203 (also referred to as a display overlay) may include an Always-On Display (AOD) function. For example, display 203 may be configured to allow the display of a subset of designated areas or pixels while device 200 is powered on, making graphical content visible to the user even when device 200 is in low-power or sleep mode. This allows the display of time, date, battery status, recent notifications, and other graphical content in low-power or sleep mode. This graphical content may be referred to as persistent or always-on graphical output. While some battery power may be consumed when displaying persistent or always-on graphical output, this power consumption is generally less than that consumed during normal or full-power operation of display 203. This function can be enabled by operating only a subset of display pixels and / or operating at a reduced resolution to reduce the power consumption of display 203.

[0185] Display 203 may include multiple layers, including touch-sensing layers or components, optional force-sensing layers or components, display layers, etc. Display 203 may define a graphics-active area in which graphics output can be displayed. In some cases, portions of display 203 may include graphics-inactive areas, such as portions of a display layer that do not include active display components or are otherwise not configured to display graphics output (e.g., pixels). In some cases, graphics-inactive areas may be positioned along the peripheral boundaries or other edges of display overlay 203.

[0186] like Figure 2 As shown, device 200 may further include a frame member 204 (also simply referred to as frame 204) positioned below cover 202 and extending around at least one outer periphery of display 203. The periphery of frame 204 may be attached to a lower or inner surface of cover 202. A portion of frame 204 may extend below display 203 and may attach cover 202 to housing 210. Because display 203 is attached to the lower or inner surface of cover 202, frame 204 may also be described as attaching both display 203 and cover 202 to housing 210. Frame 204 may be formed of a polymeric material, a metallic material, or a combination of polymeric and metallic materials. Frame 204 may support elements of the display stack, provide anchor points for flexible circuitry, and / or be used for mounting other components and device elements. In some cases, frame 204 includes one or more metal or conductive elements that provide shielding between device components, such as between display stacks (including display components and touch sensor components) and other components such as haptic actuator 222, speaker system 224, etc.

[0187] The cover 202, display stack 203, and frame member 204 may be part of the front cover assembly 201 of the device 200. The front cover assembly 201 (e.g., the cover 202 of the front cover assembly) may define the front outer surface of the device.

[0188] The front cover assembly 201 can be assembled into a sub-assembly, which can then be attached to the housing component. For example, as described herein, the display 203 can be attached to the cover 202 (e.g., via a clear adhesive), and the frame member 204 can be attached to the cover around the periphery of the display stack 203 (e.g., via adhesive). The front cover assembly 201 can then be attached to the housing component of the device 200 by mounting and adhering the frame member 204 to a boss defined by the housing component.

[0189] Device 200 also includes a speaker module 250 configured to output sound via a speaker port. The speaker port may be located in and / or at least partially defined by a recess in cover 202. As described herein, the trim may be at least partially located in the recess to facilitate sound output while also preventing debris, liquids, or other materials or contaminants from entering device 200. The output from speaker module 250 may pass through an audio channel or acoustic path defined at least partially by speaker module 250 itself and the trim. In some cases, a portion of the acoustic path (e.g., between speaker module 250 and trim) is defined by housing 210 and / or a molding material coupled to housing 210. For example, the molding material (e.g., a fiber-reinforced polymer) may be molded against a metallic portion of housing 210 (e.g., housing component 213 described herein). The molding material may also form one or more intermediate elements such as joint structures (e.g., joint structure 218) that also structurally join housing components together. Ports or channels (e.g., tubular tunnels) may be defined to pass through the molding material to more generally acoustically connect the speaker module 250 to the trim and / or recess, thereby directing sound from the speaker module 250 to the outside of the device 200.

[0190] like Figure 2 As shown, device 200 also includes one or more cameras, optical transmitters, and / or sensing elements configured to transmit signals, receive signals, or otherwise operate along the front surface of the device. In this example, device 200 includes a front camera 206 that includes a high-resolution camera sensor. The front camera 206 may have a 12-megapixel resolution sensor with optics providing a fixed focus and an 85° field of view and an aperture of f / 1.9. The front camera 206 may include an autofocus function in which one or more lens elements are moved (e.g., perpendicular to the cover by up to about 100 micrometers) to focus an image onto the camera's sensor. In some cases, an autofocus front-facing camera is capable of providing continuous autofocus during video capture. Device 200 also includes an optical face recognition system 252 that includes an infrared light projector and an infrared light sensor configured to sense a depth point array or region along the user's face. The depth point array can be characterized as a unique feature or biometric identifier, which can be used to identify the user and unlock or authorize functions on device 200, such as purchasing software applications or using payment functions provided by device 200.

[0191] Device 200 may also include one or more other sensors or components. For example, device 200 may include a front illuminator element for providing flash or illumination to the front camera 206. Device 200 may also include an ambient light sensor (ALS) for detecting ambient light conditions for setting the exposure aspect of the front camera 206 and / or for controlling the operation of the display. Device 200 may also include a proximity sensor for detecting the proximity of a user or other object to device 200. In some cases, as described herein, the proximity sensor detects proximity to other objects within a valid area of ​​the display.

[0192] Display 203 may include one or more holes extending through the display to accommodate front camera 206, facial recognition system 252, and optional other forward-facing sensors or other components. In some cases, display 203 includes two holes, including a first hole for front camera 206 and a second hole for facial recognition system 252. In some cases, display 203 includes one hole (e.g., a single hole shared by front camera 206 and facial recognition system 252). In some cases, display 203 includes three holes (e.g., a first hole for front camera 206, a second hole for transmitter of facial recognition system 252, and a third hole for receiver of facial recognition system 252).

[0193] Figure 2 Also shown are one or more cameras, optical transmitters, and / or sensing elements configured to transmit signals, receive signals, or otherwise operate along the rear surface of the device. Figure 2 As shown, these components can be integrated into sensor array 260. In this example, sensor array 260 includes a first camera 261 with a 12-megapixel sensor and a telephoto lens with 3x optical zoom and an f / 2.8 aperture. Sensor array 260 also includes a second camera 262 with a 48-megapixel sensor and a wide-angle lens with an f / 1.7 aperture. Sensor array 260 may also include a third camera 263 with a 12-megapixel sensor and an ultra-wide-angle camera with a wide field of view (e.g., 120° FOV) and an f / 2.2 aperture. The third camera 263 may also have an f / 2.4 aperture. The first, second, and third cameras may include lens-based or sensor-based image stabilization.

[0194] The sensor array 260 also includes a light illuminator that can be used as a flash or auxiliary light source (e.g., a flashlight) for photography. The sensor array 260 is also characterized by an integrated base design that minimizes space while providing the precise alignment required for multiple high-resolution cameras. In some cases, the sensor array 260 also includes a microphone, an ambient light sensor, and other sensors adapted for sensing along the rear surface of the device 200.

[0195] Sensor array 260 may also include depth sensing device 281 (which may correspond to or be the depth sensing device 149 described herein). Figure 1B This can be an implementation of a depth sensing device (or any other depth sensing device) capable of estimating the distance to an object positioned behind device 200. Depth sensing device 281 may include an optical sensor that uses time-of-flight or other optical effects to measure the distance between device 200 and an external object. Depth sensing device 281 may include one or more optical emitters adapted to emit one or more light beams that can be used to estimate distance. In some cases, the one or more light beams are coherent beams having a substantially uniform wavelength / frequency. Coherent light sources can be advantageous for depth measurement using time-of-flight, phase shift, or other optical effects. In some cases, depth sensing device 281 uses sound output, radio output, or other types of output that can be used to measure the distance between device 200 and one or more external objects. Depth sensing device 281 may be positioned close to window 271 (e.g., an area of ​​rear cover 272 or other components covering the sensor array 260) through which depth sensing device 281 can send and / or receive signals (e.g., laser, infrared, visible light, etc.).

[0196] like Figure 2 As shown, cameras 261, 262, and 263 can be aligned with camera covers 266, 267, and 268, respectively. Covers 266, 267, and 268 can be formed of glass or sapphire material and provide clear (e.g., transparent or optically transmissive) windows through which cameras 261, 262, and 263 can capture photographic images. In other cases, covers 266, 267, and 268 are optical lenses that filter, amplify, or otherwise modulate the light received by the respective cameras 261, 262, and 263. Other sensing or emitting elements of the sensor array 260 can transmit and / or receive signals through the area of ​​the rear cover 272 or through separate covers coupled to the rear cover 272. Figure 2As shown, covers 266, 267, and 268 may extend beyond the outer surface of cover 272 and may define recesses along the inner side of cover 272, such that lenses or other components of cameras 261, 262, and 263 may extend into the respective recesses. In this way, device 200 may accommodate larger lenses or other components of cameras 261, 262, and 263 compared to lenses or other components that might be accommodated without the provided recesses. In some cases, decorative components (e.g., decorative component 269) may be attached to rear cover 272 and may support covers 266, 267, and 268.

[0197] Device 200 also includes battery 230. Battery 230 provides power to device 200 and its various systems and components. Battery 230 may be a 4.45V lithium-ion battery encapsulated in foil or other encapsulation elements (e.g., pouch). Battery 230 may include a wound electrode configuration, sometimes referred to as a “jelly roll” or a folded or stacked electrode configuration. Battery 230 may be attached to device 200 (e.g., to support structure 219) using one or more adhesives and / or other attachment techniques. In one example, battery 230 may be attached to support structure 219 or another structure of device 200 using two layers of adhesive, wherein a first adhesive adheres to battery 230 and a second adhesive, and a second adhesive bonds to the first adhesive and support structure 219 (or another structure of device 200). The first adhesive and the second adhesive may have different properties, such as different stiffness (e.g., Young's modulus), different adhesive properties, etc. For example, in some cases, a first adhesive is configured to adhere (e.g., with an adhesion strength above a threshold) to the material of battery 230, while a second adhesive is configured to adhere (e.g., with an adhesion strength above a threshold) to the support structure 219 or other structures of the device. In such cases, the first adhesive may not form a sufficiently strong bond with the support structure 219, and the second adhesive may not form a sufficiently strong bond with battery 230, but the first and second adhesives may form a sufficiently strong bond with each other. Therefore, by using two different adhesives (e.g., in the layered configuration described above) to ultimately secure battery 230 to support structure 219, the overall strength and / or security of the attachment can be greater than in the case of using a single adhesive.

[0198] Battery 230 can be recharged via charging port 232 (e.g., from a power cord inserted into charging port 232 through charging access opening 226) and / or via wireless charging system 240. Battery 230 can be coupled to charging port 232 and / or wireless charging system 240 via battery control circuitry that controls the power supplied to the battery and the power supplied by the battery to device 200. Battery 230 may include one or more lithium-ion battery cells or any other suitable type of rechargeable battery element.

[0199] The wireless charging system 240 may include a coil inductively coupled to the output or transmission coil of a wireless charger. The coil may provide current to the device 200 to charge the battery 230 and / or power the device. In this example, the wireless charging system 240 includes a coil assembly 242 comprising multiple turns of conductive wire or other conduit configured to generate a current (charging current) in response to being placed in an inductive charging electromagnetic field generated by a separate wireless charging device or accessory. The coil assembly 242 also includes or is associated with an array of magnetic elements arranged in a circular or radial pattern. The magnetic elements may aid in positioning the device 200 relative to a separate wireless charging device or accessory. In some embodiments, the magnetic array may also aid in radially positioning, oriented, or “rotating” the device 200 relative to a separate wireless charging device or accessory. For example, the magnetic array may include multiple magnetic elements having alternating magnetic polarities arranged in a radial pattern. The magnetic elements may be arranged to provide magnetic connection to a separate charging device in a specific orientation or a set of discrete orientations to aid in positioning the device 200 relative to the separate charging device or accessory. This functionality may be described as self-aligning or self-positioning wireless charging. Figure 2 As shown, device 200 also includes a magnetic reference 244 for assisting in the positioning of individual wireless charging devices or accessories. In one example, magnetic reference 244 is adapted to be magnetically coupled to a cable or power cord of the individual wireless charging device or other accessory. By coupling to the cable or power cord, rotational alignment of device 200 and the individual wireless charging device or other accessory can be maintained relative to an absolute position or a single position. Additionally, by magnetically coupling the cable or power cord to the rear surface of device 200, the charging device or other accessory can be more securely attached to device 200.

[0200] In some implementations, the wireless charging system 240 includes an antenna or other element for detecting the presence of a charging device or other accessory. In some cases, the charging system includes a near-field communication (NFC) antenna adapted to receive and / or transmit wireless communication between the device 200 and the wireless charger or other accessory. In some cases, the device 200 is adapted to perform wireless communication to detect or sense the presence of the wireless charger or other accessory without using a dedicated NFC antenna. The communication may also include information about the device's status, the amount of power held by the battery 230, and / or control signals for increasing charging, decreasing charging, starting charging, and / or stopping charging for wireless charging operations.

[0201] Device 200 may also include a speaker system 224. The speaker system 224 may be positioned within device 200 such that a corresponding port 235 is aligned with or otherwise proximates an audio output of the speaker system 224. Thus, sound output from the speaker system 224 exits housing 210 via the corresponding port 235. The speaker system 224 may include a speaker positioned within a housing that defines a speaker volume (e.g., an empty space in front of or behind a speaker diaphragm). The speaker volume can be used to tune the audio output from the speaker and optionally mitigate destructive interference of the sound produced by the speaker.

[0202] The device 200 may also include a haptic actuator 222. The haptic actuator 222 may include a movable mass and an actuation system configured to move the mass to generate a haptic output. The actuation system may include one or more coils and one or more magnets (e.g., permanent magnets and / or electromagnets) that interact to generate motion. The magnets may be or may include recycled magnetic materials.

[0203] When the coil is energized, it causes the mass to move, resulting in a force being applied to the device 200. The movement of the mass can be configured to cause a detectable vibration, pulse, tap, or other tactile output via the outer surface of the device 200. The tactile actuator 222 can be configured to move the mass linearly, but other movements (e.g., rotation) are also conceivable. Other types of tactile actuators can be used as an alternative to or supplement to the tactile actuator 222.

[0204] Device 200 also includes a circuit board assembly 220. Circuit board assembly 220 may include a substrate and processors, memory, and other circuit elements coupled to the substrate. Circuit board assembly 220 may include multiple circuit boards stacked and connected together to maximize the area available for electronic components and circuitry with a compact form factor. Circuit board assembly 220 may include means for a Subscriber Identity Module (SIM). Circuit board assembly 220 may include electrical contacts for receiving a physical SIM card and / or a SIM tray assembly, and / or circuit board assembly 220 may include means for an electronic SIM. Circuit board assembly 220 may be fully or partially encapsulated to reduce the chance of damage due to the ingress of water or other fluids.

[0205] The circuit board assembly 220 may also include wireless communication circuitry operatively coupled to housing components 211, 212, 213, 214, 215, or 216 (or portions thereof) and / or otherwise use these housing components (or portions thereof) as radiating elements to provide wireless communication. The circuit board assembly 220 may also include components such as accelerometers, gyroscopes, near-field communication circuitry and / or antennas, compasses, etc. In some embodiments, the circuit board assembly 220 may include a magnetometer adapted to detect and / or locate an accessory. For example, the magnetometer may be adapted to detect magnetic (or non-magnetic) signals generated by an accessory of device 200 or other device. The magnetometer's output may include a direction output that can be used to display directional markings or other navigation guidance on display 203 to guide the user toward the location of the accessory or other device.

[0206] Device 200 may also include one or more pressure transducers operable to detect changes in external pressure to determine changes in altitude. Pressure sensors may be disposed outside and / or within the watertight internal volume of housing 210. The output of the pressure sensor can be used to track climbed stairs, the location of multi-story structures (e.g., floors), movement performed during the effective period, to estimate physical exertion or calories burned, or other relative movement of device 200. Pressure sensors may be located in module 237, which is in fluid communication with the external environment via port 225 in housing 210. Module 237 may include additional components such as a microphone and a pneumatic vent (e.g., to allow pressure equalization between the interior and exterior environments of device 200 while preventing water ingress).

[0207] The circuit board assembly 220 may also include Global Positioning System (GPS) electronics that can be used to determine the position of device 200 relative to one or more satellites (e.g., Global Navigation Satellite System (GNSS)) in order to estimate the absolute position of device 200. In some implementations, the GPS electronics are capable of operating to utilize dual frequency bands. For example, the GPS electronics can use L1 (L1C), L2 (L2C), L5, L1+L5, and other GPS signal frequency bands to estimate the position of device 200.

[0208] The housing 210 may also include a support structure 219 attachable to the housing 210. The support structure 219 may be formed of metal and may serve as a structural mounting point for components of the device 200. The support structure 219 may define an opening corresponding to the size of the coil assembly 242 of the wireless charging system 240, such that the support structure 219 does not shield the wireless coil assembly 242 or otherwise adversely affect the inductive coupling between the coil of the charging system 240 and an external wireless charger or accessory. In some cases, the support structure 219 is attached to a cover 272 (e.g., using adhesives and / or other fastening techniques and / or components) to form a sub-assembly including the cover 272 and the support structure 219, which is then attached to the housing 210.

[0209] like Figure 2 As shown, the housing may include a cover 272 (e.g., a back cover or rear cover 272) that defines substantially the entire rear surface of device 200. The rear cover 272, front cover 202, and housing 210 may at least partially define the housing of device 200, which may define an internal volume in which components of device 200 are positioned. The cover 272 may be formed of or comprise a transparent or optically translucent material. For example, the cover 272 may include a substrate formed of a glass material or other suitable material (e.g., silica-based glass, aluminosilicate glass, borosilicate glass, alkali-containing aluminosilicate glass, chemically strengthened glass, sapphire, ceramic, glass ceramic, crystallizable glass material, or plastic). The glass ceramic material may be a silica-based glass ceramic material, such as aluminosilicate glass ceramic or borosilicate glass ceramic. The glass ceramic material may be chemically strengthened by ion exchange. The substrate may have a portion less than 1 mm thick. In some cases, the substrate has a portion less than 0.80 mm thick. In some cases, the substrate has a portion approximately 0.60 mm thick or less. Cover 272 may have a uniform thickness, or in some cases, may have thickened or raised portions surrounding camera covers 263, 264. Cover 272 may be machined (e.g., ground) into its final shape to provide the desired surface finish before being polished and / or textured. Texture may be specifically configured to provide a rough appearance while also resisting the accumulation of skin, lint, or other debris. A series of decorative layers may be formed along the inner surface of cover 272 to provide the desired optical effects and final color for device 200.

[0210] Cover 272 may be part of rear cover assembly 273. Rear cover assembly 273 may be attached to housing 210. In some cases, rear cover assembly 273 includes components such as camera covers 266, 267, 268, decorative components (e.g., decorative component 269), components of a wireless charging system, structural components (e.g., a frame), mounting clips and / or other components, systems, subsystems and / or materials.

[0211] Similar to that described above with respect to cover 202, cover 272 may be at least partially positioned within an opening defined in housing 210. Also similar to that described above with respect to cover 202, the edge or side of cover 272 may be surrounded by a protective flange or lip of housing 210, with no gap between the edge of cover 272 and the corresponding flange of housing 210. Typically, an ion exchange process is used to chemically strengthen cover 272 to form a compressive stress layer along the outer surface of cover 272.

[0212] As described above, the housing 210 may include housing components 211, 212, 213, 214, 215, and 216 structurally joined together via a connector structure 218. The connector structure 218 (e.g., the material of the connector structure) may extend above the inner surface of the housing components. More specifically, a portion of the connector structure 218 may contact, cover, encapsulate, and / or engage with a retaining feature extending from the inner surface of the housing component.

[0213] Housing components 211, 212, 213, 214, 215, and 216 may also be referred to herein as housing segments and may be formed of aluminum, stainless steel, or other metals or metal alloys. As described herein, housing components 211, 212, 213, 214, 215, and 216 may provide robust and impact-resistant sidewalls for device 200. In this example, housing components 211, 212, 213, 214, 215, and 216 define flat sidewalls extending around the periphery of device 200. The flat sidewalls may include rounded or chamfered edges defining the upper and lower edges of the sidewalls of housing 210. Housing components 211, 212, 213, 214, 215, and 216 may each have a flange portion or lip that extends around and at least partially covers the respective side of the front cover 202 and the rear cover 272. There may be no gap material or element between the flange portion or lip and the corresponding side surfaces of the front cover 202 and the rear cover 272. This allows forces or impacts applied to the housing 210 to be transmitted to the front cover 202 and the rear cover 272 without affecting the display or other internal structural components, which improves the drop performance of the device 200.

[0214] like Figure 2As shown, device 200 includes multiple antennas adapted for wireless communication using 5G communication protocols. Specifically, device 200 may include a (side-emitting) antenna array 282 configured to transmit and receive wireless communication signals via antenna windows 283 or waveguides formed along or otherwise integrated with the sidewall of housing 210. As described herein, the side-emitting antenna array 282 may be coupled to circuit board assembly 220 via flexible circuitry elements or other conductive connections and may include multiple radiating elements (e.g., five radiating elements) for transmitting and / or receiving wireless signals. Device 200 may also include a rear antenna module that may include one or more (rear-emitting) antenna arrays configured to transmit and receive wireless communication signals via cover 272. The antenna module may be attached to the back or bottom surface of circuit board assembly 220.

[0215] An antenna module may include multiple antenna arrays. For example, an antenna module may include one or more millimeter-wave antenna arrays. When an antenna module includes multiple millimeter-wave antenna arrays (each antenna array may include one or more radiating elements), the multiple millimeter-wave antenna arrays may be configured to operate according to a diversity scheme (e.g., spatial diversity, pattern diversity, polarization diversity, etc.). The antenna module may also include one or more ultra-wideband antennas.

[0216] The antenna array is suitable for millimeter-wave 5G communication and can be adapted to use beamforming or other technologies, or in combination with beamforming or other technologies, to adjust signal reception depending on the use case. Device 200 may also include multiple antennas for multiple-input multiple-output (MIMO) wireless communication schemes, including 4G, 4G LTE, and / or 5G MIMO communication protocols. As described herein, one or more housing components 211, 212, 213, 214, 215, and 216 (or portions thereof) may be adapted to operate as antennas for MIMO wireless communication schemes (or other wireless communication schemes).

[0217] Figure 3 An exploded view of an exemplary electronic device is shown. Specifically, Figure 3 An exploded view of device 300 is shown, illustrating the various components of device 300 and exemplary arrangements and configurations of these components. Device 200 may be an embodiment of device 140, and Figure 1A and Figure 1B The description of the various parts and components of device 100 is also applicable. Figure 3 The device shown is 300. For clarity, redundant descriptions of some components will not be repeated here.

[0218] like Figure 3As shown, device 300 includes a cover 302 (e.g., a front cover), which may be formed of or comprise a transparent or optically translucent material. In some cases, cover 302 is formed of a glass material or other suitable transparent or optically translucent material (e.g., silica-based glass, aluminosilicate glass, borosilicate glass, alkali-containing aluminosilicate glass, chemically strengthened glass, sapphire, ceramic, glass-ceramic, crystallizable glass material, or plastic). In this example, cover 302 may be formed of a glass-ceramic material. Glass-ceramic materials may include amorphous and crystalline or non-amorphous phases of one or more materials and may be formulated to improve the strength or other properties of cover 302. Glass-ceramic materials may be silica-based glass-ceramic materials, such as aluminosilicate glass-ceramic materials or borosilicate glass-ceramic materials. Glass-ceramic materials may be chemically strengthened by ion exchange. In some cases, cover 302 may include a sheet of chemically strengthened material or an optical processing element having one or more coatings, including anti-reflective (AR) coatings, oleophobic coatings, or other types of coatings. In some cases, the cap 302 comprises a sheet of material less than 1 mm thick. In some cases, the sheet of material is less than 0.80 mm thick. In some cases, the sheet of material is approximately 0.60 mm thick or thinner. An ion exchange process can be used to chemically strengthen the cap 302 to form a compressive stress layer along the outer surface of the cap 302.

[0219] The cover 302 extends over substantially the entire front surface of the device and can be positioned within an opening defined by the housing structure 310. In some cases, the edge or side of the cover 302 may be surrounded by a protective flange or lip of the housing structure 310, without any gap between the edge of the cover 302 and the corresponding flange of the housing structure 310. This configuration allows impacts or forces applied to the housing structure 310 to be transmitted to the cover 302, rather than directly transmitting shear stress through the display 303 or the frame 304.

[0220] like Figure 3As shown, display 303 is attached to the inner surface of cover 302. Display 303 may include a borderless organic light-emitting diode (OLED) display with a corner-to-corner measurement of 15.4 cm (6.1 inches). The periphery or inactive area of ​​display 303 may be reduced to allow for a very thin device boundary around the active area of ​​display 303. In some cases, display 303 allows for a boundary area of ​​1.5 mm or less. In some cases, display 303 allows for a boundary area of ​​1 mm or less. In one exemplary embodiment, the boundary area is approximately 0.9 mm. Display 303 may have a relatively high pixel density of approximately 460 pixels per inch (PPI) or greater. In some cases, display 303 has a pixel density of approximately 475 PPI. Display 303 may have an integrated (on-cell) touch sensing system. For example, the array of electrodes (or other touch sensing components) integrated into the OLED display may be time- and / or frequency-multiplexed to provide both display and touch sensing functionality. Electrodes may be configured to detect touch location, gesture input, multi-touch input, or other types of touch input along the outer surface of cover 302. In some cases, display 303 includes another type of display element, such as a liquid crystal display (LCD) without an integrated touch sensing system. That is, device 300 may include one or more touch and / or force sensing components or layers positioned between display 303 and cover 302.

[0221] Display 303 (also referred to as a display overlay) may include an Always-On Display (AOD) function. For example, display 303 may be configured to allow the display of a subset of designated areas or pixels while device 300 is powered on, making graphic content visible to the user even when device 300 is in low-power or sleep mode. This allows the display of time, date, battery status, recent notifications, and other graphic content in low-power or sleep mode. This graphic content may be referred to as persistent or always-on graphics output. While some battery power may be consumed when displaying persistent or always-on graphics output, this power consumption is generally less than that consumed during normal or full-power operation of display 303. This function can be enabled by operating only a subset of display pixels and / or operating at a reduced resolution to reduce the power consumption of display 303.

[0222] Display 303 may include multiple layers, including a touch-sensing layer or component, an optional force-sensing layer or component, a display layer, etc. Display 303 may define a graphics-active area in which graphics output can be displayed. In some cases, portions of display 303 may include graphics-inactive areas, such as portions of the display layer that do not include active display components or are otherwise not configured to display graphics output (e.g., pixels). In some cases, graphics-inactive areas may be positioned along the peripheral boundaries or other edges of display stack 303.

[0223] like Figure 3 As shown, device 300 may further include a frame member 304 (also simply referred to as frame 304) positioned below cover 302 and extending around the outer periphery of display 303. The periphery of frame 304 may be attached to the lower or inner surface of cover 302. A portion of frame 304 may extend below display 303 and may attach cover 302 to housing structure 310. Because display 303 is attached to the lower or inner surface of cover 302, frame 304 may also be described as attaching both display 303 and cover 302 to housing structure 310. Frame 304 may be formed of polymeric material, metallic material, or a combination of polymeric and metallic materials. Frame 304 may support elements of the display stack, provide anchoring points for flexible circuitry, and / or be used for mounting other components and device elements. In some cases, frame 304 includes one or more metal or conductive elements that provide shielding between device components, such as between display stacks (including display components and touch sensor components) and other components such as haptic actuator 322, speaker system 324, etc.

[0224] Cover 302, display or display stack 303, and frame member 304 may be part of front cover assembly 301 of device 300. Front cover assembly 301 (e.g., front cover of front cover assembly) may define the front outer surface of device. Front cover assembly 301 may be assembled into a sub-assembly, which may then be attached to housing components. For example, as described herein, display 303 may be attached to cover 302 (e.g., via transparent adhesive), and frame member 304 may be attached to cover around the periphery of display stack 303 (e.g., via adhesive). Front cover assembly 301 may then be attached to housing components of device 300 by mounting and adhering frame member 304 to a boss defined by housing components.

[0225] Device 300 also includes a speaker module 350 configured to output sound via a speaker port. The speaker port may be located in and / or at least partially defined by a recess 351 in cover 302. As described herein, the trim may be at least partially located in the recess 351 to facilitate sound output while also preventing debris, liquids, or other materials or contaminants from entering device 300. The output from speaker module 350 may pass through an audio channel or acoustic path defined at least partially by speaker module 350 itself and the trim. In some cases, a portion of the acoustic path (e.g., between speaker module 350 and trim) is defined by housing structure 310 and / or molding material coupled to housing structure 310. For example, molding material (e.g., fiber-reinforced polymer) may be molded against a metallic portion of housing structure 310 (e.g., housing component 313 described herein). The molding material may also form one or more intermediate elements such as joint structures (e.g., joint structure 318) that also structurally join housing components together. The channel (e.g., a tubular tunnel) may be defined to pass through the molding material to more generally acoustically connect the speaker module 350 to the trim and / or recess 351, thereby directing sound from the speaker module 350 to the outside of the device 300.

[0226] like Figure 3 As shown, device 300 also includes one or more cameras, optical transmitters, and / or sensing elements configured to transmit signals, receive signals, or otherwise operate along the front surface of the device. In this example, device 300 includes a front camera 306 that includes a high-resolution camera sensor. The front camera 306 may have a 12-megapixel resolution sensor with optics providing an 85° field of view. The front camera 306 may have an aperture of f / 1.9. The front camera 306 may include an autofocus function in which one or more lens elements are moved (e.g., perpendicular to the cover by up to about 100 micrometers) to focus an image onto the camera's sensor. In some cases, an autofocus front-facing camera is capable of providing continuous autofocus during video capture. Device 300 also includes an optical face recognition system 352 that includes an infrared light projector and an infrared light sensor configured to sense a depth point array or region along the user's face. The depth point array can be characterized as a unique feature or biometric identifier, which can be used to identify the user and unlock functions on device 300 or authorized device 300, such as purchasing software applications or using payment functions provided by device 300.

[0227] The device 300 may also include one or more other sensors or components. For example, the device 300 may include a front illuminator element for providing flash or illumination to the front camera 306. The device 300 may also include an ambient light sensor (ALS) for detecting ambient light conditions for setting the exposure aspect of the front camera 306 and / or for controlling the operation of the display.

[0228] Figure 3 Also shown are one or more cameras, optical transmitters, and / or sensing elements configured to transmit signals, receive signals, or otherwise operate along the rear surface of the device. Figure 3 As shown, these components may be part of a sensor array 360. In this example, the sensor array 360 includes a first camera 361 having a 12-megapixel image sensor and a wide-angle lens with an aperture of f / 1.6. The first camera 361 may also include a dual photodiode sensor with an APS+ sensor format. The sensor array 360 may also include a second camera 362 having a 12-megapixel image sensor and an ultra-wide-angle lens (120° FOV) with an aperture of f / 2.4. The sensor array 360 also includes a light illuminator that can be used as a flash or auxiliary light source (e.g., a flashlight) for photography. In some cases, the sensor array 360 also includes a microphone, an ambient light sensor, a depth sensor, and / or other sensors adapted to sense along the rear surface of the device 300.

[0229] like Figure 3 As shown, cameras 361 and 362 can be aligned with camera covers 363 and 364, respectively. Covers 363 and 364 may be formed of glass, glass-ceramic, or sapphire material and provide clear (e.g., transparent or optically translucent) windows through which cameras 361 and 362 can capture photographic images. In other cases, covers 363 and 364 are optical lenses that filter, magnify, or otherwise modulate the light received by the respective cameras 361 and 362. Other sensing or emitting elements of the sensor array 360 can transmit and / or receive signals through the area of ​​the rear cover 372 or through separate covers attached to the rear cover 372. Figure 3 As shown, covers 363 and 364 may extend beyond the outer surface of cover 372 and may define recesses along the inner side of cover 372, allowing lenses or other components of cameras 361 and 362 to extend into the respective recesses. In this way, device 300 can accommodate larger lenses or other components of cameras 361 and 362 compared to those that might be accommodated without the provided recesses. In some cases, decorative components 365 and 366 may be attached to cover 372 and may support covers 363 and 364.

[0230] Device 300 also includes a battery 330. Battery 330 provides power to device 300 and its various systems and components. Battery 330 may include a 4.40V lithium-ion battery encapsulated in foil or other encapsulation elements. Battery 330 may include a wound electrode configuration, sometimes referred to as a "jelly roll" or a folded or stacked electrode configuration. Battery 330 may be recharged via charging port 332 (e.g., from a power cable inserted into charging port 332 through charging access opening 326) and / or via wireless charging system 340. Battery 330 may be coupled to charging port 332 and / or wireless charging system 340 via battery control circuitry that controls the power supplied to the battery and the power supplied by the battery to device 300. Battery 330 may include one or more lithium-ion battery cells or any other suitable type of rechargeable battery element.

[0231] The wireless charging system 340 may include a coil inductively coupled to the output or transmission coil of a wireless charger. The coil may provide current to the device 300 to charge the battery 330 and / or power the device. In this example, the wireless charging system 340 includes a coil assembly 342 comprising multiple turns of conductive wire or other conduit configured to generate a current (charging current) in response to being placed in an inductive charging electromagnetic field generated by a separate wireless charging device or accessory. The coil assembly 342 also includes an array of magnetic elements arranged in a circular or radial pattern. The magnetic elements may aid in positioning the device 300 relative to a separate wireless charging device or accessory. In some embodiments, the magnetic array may also aid in radially positioning, oriented, or “rotating” the device 300 relative to a separate wireless charging device or accessory. For example, the magnetic array may include multiple magnetic elements having alternating magnetic polarities arranged in a radial pattern. The magnetic elements may be arranged to provide magnetic connection to a separate charging device in a specific orientation or a set of discrete orientations to aid in positioning the device 300 relative to the separate charging device or accessory. This functionality may be described as self-aligning or self-positioning wireless charging. Figure 3 As shown, device 300 also includes a magnetic reference 344 for assisting in the positioning of individual wireless charging devices or accessories. In one example, the magnetic reference 344 is adapted to be magnetically coupled to a cable or power cord of the individual wireless charging device or other accessory. By coupling to the cable or power cord, rotational alignment of device 300 and the individual wireless charging device or other accessory can be maintained relative to an absolute position or a single position. Additionally, by magnetically coupling the cable or power cord to the rear surface of device 300, the charging device or other accessory can be more securely attached to device 300.

[0232] In some implementations, the wireless charging system 340 includes an antenna or other element for detecting the presence of a charging device or other accessory. In some cases, the charging system includes a near-field communication (NFC) antenna adapted to receive and / or transmit wireless communication between the device 300 and the wireless charger or other accessory. In some cases, the device 300 is adapted to perform wireless communication to detect or sense the presence of the wireless charger or other accessory without using a dedicated NFC antenna. The communication may also include information about the device's status, the amount of power held by the battery 330, and / or control signals for increasing charging, decreasing charging, starting charging, and / or stopping charging for wireless charging operations.

[0233] Device 300 may also include a speaker system 324. The speaker system 324 may be positioned within device 300 such that a corresponding port 325 is aligned with or otherwise proximates an audio output of the speaker system 324. Thus, sound output from the speaker system 324 exits the housing structure 310 via the corresponding port 325. The speaker system 324 may include a speaker positioned within a housing that defines a speaker volume (e.g., an empty space in front of or behind a speaker diaphragm). The speaker volume can be used to tune the audio output from the speaker and optionally mitigate destructive interference of the sound produced by the speaker.

[0234] The device 300 may also include a haptic actuator 322. The haptic actuator 322 may include a movable mass and an actuation system configured to move the mass to generate a haptic output. The actuation system may include one or more coils interacting to generate motion and one or more magnets (e.g., permanent magnets and / or electromagnets). The magnets may be or may include recycled magnetic materials.

[0235] When the coil is energized, it causes the mass to move, resulting in a force being applied to the device 300. The movement of the mass can be configured to produce a detectable vibration, pulse, tap, or other tactile output via the outer surface of the device 300. The tactile actuator 322 can be configured to move the mass linearly, but other movements (e.g., rotation) are also conceivable. Other types of tactile actuators can be used as an alternative to or supplement to the tactile actuator 322.

[0236] Device 300 also includes a circuit board assembly 320 (also referred to herein as a circuit board assembly). Circuit board assembly 320 may include a substrate and processors, memory, and other circuit elements coupled to the substrate. Circuit board assembly 320 may include multiple circuit boards stacked and connected together to maximize the area available for electronic components and circuitry with a compact form factor. Circuit board assembly 320 may include means for a Subscriber Identity Module (SIM). Circuit board assembly 320 may include electrical contacts for receiving a physical SIM card and / or a SIM tray assembly, and / or circuit board assembly 320 may include means for an electronic SIM. Circuit board assembly 320 may be fully or partially encapsulated to reduce the chance of damage due to the ingress of water or other fluids.

[0237] The circuit board assembly 320 may be thermally coupled to the intermediate base plate section 323 of the housing structure 310. As described herein, the intermediate base plate section 323 (also simply referred to as base plate 323) may be part of a housing component 314 (e.g., an intermediate housing component) formed of an integral structure and defining the base plate 323, a first wall section 317 defining a first side outer surface of the device 300, and a second wall section 319 defining a second side outer surface of the device 300. The circuit board assembly 320 may be thermally coupled to the base plate 323 via one or more thermal bridges (such as graphite structures, graphite-encased foam, or other thermally conductive structures). Heat from the circuit board assembly may be transferred to the base plate 323 via thermal bridges, thereby removing heat from the circuit board assembly 320 (where heat may be detrimental to durability, performance, etc.) and also absorbing heat from the outer surfaces and / or components of the device 300 that come into contact with the user (e.g., the wall sections 317, 319 that define the outer surfaces of the device and can be held by the user when the device 300 is in use).

[0238] The circuit board assembly 320 may also include wireless communication circuitry operatively coupled to wall segments and / or housing components 312, 313, 317, 315, 316, or 319 (or portions thereof) and / or otherwise use these wall segments and / or housing components (or portions thereof) as radiating elements or structures to provide wireless communication. The circuit board assembly 320 may also include components such as accelerometers, gyroscopes, near-field communication circuitry and / or antennas, compasses, etc. In some embodiments, the circuit board assembly 320 may include a magnetometer adapted to detect and / or locate an accessory. For example, the magnetometer may be adapted to detect magnetic (or non-magnetic) signals generated by an accessory of device 300 or other devices. The magnetometer's output may include a direction output that can be used to display directional markings or other navigation guidance on display 303 to guide the user toward the location of the accessory or other device.

[0239] The device 300 may also include one or more pressure transducers that are operable to detect changes in external pressure in order to determine changes in height. Pressure sensors may be disposed outside and / or within the watertight internal volume of the housing structure 310. The output of the pressure sensors can be used to track the climbed stairs, the location of multi-level structures (e.g., floors), movement performed during the effective period, in order to estimate physical exertion or calories burned, or other relative movement of the device 300.

[0240] The circuit board assembly 320 may also include Global Positioning System (GPS) electronics that can be used to determine the position of device 300 relative to one or more satellites (e.g., Global Navigation Satellite System (GNSS)) in order to estimate the absolute position of device 300. In some embodiments, the GPS electronics are operable to utilize dual frequency bands. For example, the GPS electronics can use L1 (L1C), L2 (L2C), L5, L1+L5, and other GPS signal frequency bands to estimate the position of device 300.

[0241] like Figure 3 As shown, the housing may include a cover 372 (e.g., a rear cover or back cover) that defines substantially the entire rear surface of device 300. The rear cover 372, front cover 302, and housing structure 310 may at least partially define the housing of device 300, which may define an internal volume in which components of device 300 are positioned. The cover 372 may be formed of or comprise a transparent or optically translucent material. For example, the cover 372 may include a substrate formed of a glass material or other suitable material (e.g., silica-based glass, aluminosilicate glass, borosilicate glass, alkali-containing aluminosilicate glass, chemically strengthened glass, sapphire, ceramic, glass-ceramic, crystallizable glass material, or plastic). The glass-ceramic material may be a silica-based glass-ceramic material, such as aluminosilicate glass-ceramic material or borosilicate glass-ceramic material. The glass-ceramic material may be chemically strengthened by ion exchange. The substrate may have a portion less than 1 mm thick. In some cases, the substrate has a portion less than 0.80 mm thick. In some cases, the substrate has a portion approximately 0.60 mm thick or less. The cover 372 may have a uniform thickness, or in some cases, may have a thickened or raised portion surrounding the camera covers 363, 364. The cover 372 may be machined (e.g., ground) into its final shape to provide the desired surface finish before being polished and / or textured. The texture may be specifically configured to provide a rough appearance while also resisting the accumulation of skin, lint, or other debris. A series of decorative layers may be formed along the inner surface of the cover 372 to provide the desired optical effects and final color for the device 300.

[0242] Cover 372 may be part of rear cover assembly 373. Rear cover assembly 373 may be coupled to housing structure 310. In some cases, rear cover assembly 373 includes components such as camera covers 363 and 364, decorative components 365, 366, components of wireless charging system, structural components (e.g., frame), decorative components, mounting clips and / or other components, systems, subsystems and / or materials.

[0243] Similar to that described above with respect to cover 302, cover 372 may be at least partially positioned within an opening defined in housing structure 310. Also similar to that described above with respect to cover 302, the edge or side of cover 372 may be surrounded by a protective flange or lip of housing structure 310, without any gap between the edge of cover 372 and the corresponding flange of housing structure 310. An ion exchange process may be used to chemically strengthen cover 372 to form a compressive stress layer along the outer surface of cover 372. In some cases, the (rear) cover 372 is formed of the same or similar material as the (front) cover 302.

[0244] The back cover 372 can be removably attached to the rest of the housing structure 310, allowing for quick and efficient removal and / or replacement. In some cases, the wireless charging system 340 is the only component attached to the back cover 372 that requires electrical connection to the circuit board assembly 320 (which is connected to the housing component 314). Therefore, the back cover 372 can be completely removed from the device by detaching it from the rest of the housing (e.g., from the housing component 314) and disconnecting the electrical connector of the wireless charging system. In this way, the device 300 provides improved repairability.

[0245] The housing structure 310 may include a housing component 314 (e.g., an intermediate housing component 314) comprising wall sections 317 and 319 and an intermediate base plate section 323 (e.g., a sheet-like metal structure extending between wall sections 317 and 319). The base plate 323 may define the mounting configuration of components of the device 300. For example, as described herein, components such as circuit board assembly 320, battery 330, sensor array 360, receiver 350, speaker module 324, haptic actuator 322, etc., may be coupled to the base plate 323 (e.g., along the rearward side of the base plate 323). By coupling components to the base plate 323 instead of the front cover assembly 301 and / or rear cover 372, the cost and complexity of the front cover assembly 301 and rear cover assembly 373 are reduced, and the removal and / or replacement of the front cover assembly 301 and / or rear cover 372 is simplified. The base plate 323 may also define one or more holes extending through it to facilitate the connection of components on one side of the base plate 323 (e.g., the display 303 and / or sensor of the front cover assembly 301) to components on the other side of the base plate 323 (e.g., the circuit board assembly 320). Additionally, as described above, the base plate 323 may also be thermally bonded to components of the device 300, such as the circuit board assembly 320, to conduct heat away from the thermally bonded components.

[0246] The housing component 314 can be a monolithic structure formed from a single material. For example, the monolithic structure of the housing component 314 can be a metal, such as aluminum, steel, titanium, etc., and can be formed by extrusion, machining, and / or a combination of these processes and other forming processes. Therefore, the wall sections 317 and 319 (which define the side outer surfaces of the device 300) and the base plate 323 can be different parts of a single material. In some cases, the housing component 314 is formed from a polymer material, a reinforced polymer material (e.g., fiber reinforcement), carbon fiber, or other suitable material.

[0247] As described above, the housing structure 310 may include housing components 312, 313, 315, and 316, which are structurally joined together and / or joined to housing component 314 (intermediate housing component 314) via a connector structure 318. The connector structure 318 (e.g., the material of the connector structure) may extend above the inner surface of the housing component. More specifically, a portion of the connector structure 318 may contact, cover, encapsulate, and / or engage with a retaining feature extending from the inner surface of the housing component (including, for example, a wall section from the intermediate housing component 314). When wall sections 317 and 319 are part of a single integral structure, the connector structure 318 may also be used to structurally join housing components 312, 313, 315, and 316 to housing component 314. When connected via connector structure 318, housing components 314, 312, 313, 315 and 316 and connector structure 318 may define a main housing assembly that defines the outer surface of device 300 and the base plate 323 within the device.

[0248] Housing components 312, 313, 315, and 316 may also be referred to herein as housing segments and may be formed of aluminum, stainless steel, or other metals or metal alloys. As described herein, housing components 312, 313, 315, and 316 and wall segments 317, 319 provide robust and impact-resistant sidewalls for device 300. In this example, housing components 312, 313, 315, and 316 and wall segments 317, 319 define flat sidewalls extending around the perimeter of device 300. The flat sidewalls may include rounded or chamfered edges defining the upper and lower edges of the sidewalls of housing structure 310. Housing components 312, 313, 315, and 316 and wall segments 317, 319 may each have a flange portion or lip that extends around and at least partially covers the respective side of the front cover 302 and the rear cover 372. There may be no gap material or element between the flange portion or lip and the corresponding side surfaces of the front cover 302 and the rear cover 372. This allows forces or impacts applied to the housing structure 310 to be transmitted to the front cover 302 and the rear cover 372 without affecting the display or other internal structural components, which improves the drop performance of the device 300.

[0249] like Figure 3As shown, device 300 includes multiple antennas adapted for wireless communication using 5G communication protocols. Specifically, device 300 may include a (side-emitting) antenna array 382 configured to transmit and receive wireless communication signals via antenna windows 383 or waveguides formed along or otherwise integrated with the sidewall of housing structure 310. The side-emitting antenna array 382 may be coupled to circuit board assembly 320 via flexible circuit elements or other conductive connections, as described herein. Device 300 may also include a rear antenna module that may include one or more (rear-emitting) antenna arrays configured to transmit and receive wireless communication signals via cover 372. The antenna module may be attached to the back or bottom surface of circuit board assembly 320.

[0250] An antenna module may include multiple antenna arrays. For example, an antenna module may include one or more millimeter-wave antenna arrays. When an antenna module includes multiple millimeter-wave antenna arrays (each antenna array may include one or more radiating elements), the multiple millimeter-wave antenna arrays may be configured to operate according to a diversity scheme (e.g., spatial diversity, pattern diversity, polarization diversity, etc.). The antenna module may also include one or more ultra-wideband antennas.

[0251] Each of these antenna arrays (e.g., antenna array 382 and the millimeter-wave array of the antenna module) is adapted for millimeter-wave 5G communication and is adapted to use beamforming or other technologies, or in combination with beamforming or other technologies, to adapt signal reception, depending on the use case. Device 300 may also include multiple antennas for multiple-input multiple-output (MIMO) wireless communication schemes, including 4G, 4G LTE, and / or 5G MIMO communication protocols. As described herein, one or more of housing components 312, 313, 315, and 316 and wall segments 317, 319 (or portions thereof) are adapted to operate as antennas for MIMO wireless communication schemes (or other wireless communication schemes).

[0252] Figure 4A A partial exploded view of an exemplary electronic device 400 is shown. Electronic device 400 may correspond to or be an embodiment of electronic device 140, 300, or any other device described herein.

[0253] like Figure 4A As shown, device 400 may include a housing defining an inner cavity and including a rear cover assembly 402, a housing structure 406, and a front cover assembly 408. The front cover assembly 408 may define a front outer surface of the housing, and the rear cover assembly 402 may define a rear outer surface of the device. The housing structure 406 may be positioned between the front cover assembly 408 and the rear cover assembly 402.

[0254] The housing structure 406 includes an intermediate housing component 410 and housing components 420, 421, 422 and 423. Figure 4B Intermediate housing component 410 may correspond to or be an embodiment of housing component 314, which includes an intermediate base plate section 428 and wall sections 417, 419. As described above with respect to housing component 314, housing component 410 may be a monolithic structure formed from a single material. For example, the monolithic structure of housing component 410 may be a metal, such as aluminum, steel, titanium, etc., and may be formed by extrusion, machining, and / or a combination of these processes and other forming processes. Thus, wall sections 417 and 419 (which define the side outer surfaces of device 400) and intermediate base plate section 428 may be different portions of a single material. In some cases, housing component 410 is formed of a polymeric material, a reinforced polymeric material (e.g., fiber reinforced), carbon fiber, or other suitable material.

[0255] Housing components 420, 421, 422, and 423 may each define an outer corner surface of the device. In some cases, the housing components may also define a portion of one or more side outer surfaces. For example, housing component 420 defines an outer corner surface and a portion of each of the two side outer surfaces (e.g., as shown in the image). Figure 4B The right and top side outer surfaces of the centrally oriented housing structure 406. Similarly, housing component 421 defines a portion of each of the two side outer surfaces (e.g., as shown in the image). Figure 4B The left and top outer surfaces of the centrally oriented housing structure 406.

[0256] The housing structure 406 may define a first cavity along a first side (e.g., a forward side) of the housing structure 406, and a second cavity along a second side (e.g., a rearward side) of the housing structure 406 opposite to the first side. Components such as component assembly 404 (and optionally portions of rear cover assembly 402) may be positioned in the second cavity, such as... Figure 4A As shown, and portions of components such as the front cover assembly 408 can be positioned in the first cavity.

[0257] Front cover assembly 408 may include a front cover, such as Figure 3 The front cover 302 is included. The front cover assembly 408 may also include a display overlay and a touch sensing system and / or force sensing system, forward sensors such as an ambient light sensor, a proximity sensor, etc.

[0258] Rear cover assembly 402 may include a rear cover, such as Figure 3The rear cover 372 is included. The rear cover assembly 402 may include wireless charging components, such as a wireless charging coil and magnetic coupling and alignment elements. The rear cover assembly 402 may also include other components and / or structures. For example, the rear cover assembly 402 may also include mounting structures, including mounting tabs or other features, camera covers, optical structures, etc.

[0259] Device 400 may include a component assembly 404, which is at least partially positioned within an interior cavity along one side of a central base plate section 428 of housing structure 406. Component assembly 404 includes components of device 400. Component assembly 404 may include circuit board assemblies, batteries, haptic actuators, speakers, antennas and / or other communication components and systems, cameras, microphones, etc. Components in component assembly 404 may be mechanically and / or electrically coupled to components on rear cover assembly 402 and front cover assembly 408.

[0260] The housing structure 406 provides a mounting and / or support structure for components of the device 400, such as component assembly 404, rear cover assembly 402, and front cover assembly 408. (As mentioned above...) Figure 3 As described, the housing structure 406 may include an intermediate housing component 410 (e.g., corresponding to housing component 314), which, together with additional housing components 420, 421, 422 and 423, and a connector structure 405 ( Figure 4A Together, they define the peripheral outer walls of the device. The intermediate housing component 410 also defines an intermediate base plate section 428 (e.g., corresponding to intermediate base plate 323). In some cases, the intermediate base plate section 428 (also simply referred to as the base plate) is or includes a plate-like structure extending from one side wall to another (e.g., from wall section 417 to wall section 419).

[0261] Figure 4B This is an exploded view of the outer shell structure 406, where the joint structure is omitted and the outer shell component is separated from the intermediate outer shell component 410. (See diagram below.) Figure 4BAs shown, the intermediate housing component 410 and the sidewalls can be a single integral structure. For example, the intermediate housing component 410 and wall segments 417, 419 can be formed by: extruding an initial structure (e.g., forming an extruded metallic material) that defines the general shape and configuration of the intermediate housing component 410 and wall segments 417, 419 (e.g., a cross-section resembling an "H"), and then using one or more additional machining or other forming processes to define the final shape and features of the intermediate housing component 410 and wall segments 417, 419. The extruded material defining the initial structure of the intermediate housing component 410 can be formed from a metallic material such as aluminum, steel, stainless steel, titanium, or another suitable metal. In some cases, the extruded material can be formed from a polymeric material, such as a fiber-reinforced polymer. Machining operations can be applied to the extruded material to form features such as holes, mounting bosses, recesses, protrusions, etc. The formed holes (e.g., via machining or other operations) can accommodate circuit board interconnects, mechanical clamps and retaining features, buttons, switches, antennas, SIM card trays, etc.

[0262] The housing structure 406 can be formed by structurally joining housing components (e.g., housing components 420, 421, 422, 423, which may correspond to or be embodiments of housing components 312, 313, 315, and 316) to the intermediate housing component 410 and to adjacent housing components via a connector structure 405 (which may correspond to or be embodiments of connector structure 318). The connector structure 405 may contact, cover, encapsulate, and / or engage with the retaining features of the housing components and / or the intermediate housing component 410. As described above, wall segments 417, 419 (which may also be referred to as sidewalls) are part of a single integral structure of the intermediate housing component 410, and the connector structure 405 can also be used to structurally join housing components 420, 421, 422, 423 to the intermediate housing component 410. When connected via connector structure 405, intermediate housing component 410, housing components 420, 421, 422, 423 and connector structure 405 may define a main housing assembly that defines the outer surface of device 400.

[0263] The intermediate base plate section 428 (also simply referred to as base plate 428) offers numerous advantages to device 400. For example, base plate 428 can serve as a mounting structure for device components such as batteries, circuit board assemblies, front and rear cover assemblies, etc. In this way, fewer components need to be connected to the front and rear cover assemblies, thereby reducing the complexity of those modules and decreasing the number of interconnections (e.g., electrical connections) that need to be made between various device sub-assemblies (e.g., between the front and rear cover assemblies and other device components).

[0264] The base plate 428 also serves the thermal management functions of the device 400. The base plate 428 may be formed of or comprise a thermally conductive material, and heat-generating and / or heat-sensitive components may be thermally connected to the base plate 428 to facilitate heat removal from those components or to otherwise advantageously dissipate heat within the device. For example, the base plate 428 may be formed of a metal such as aluminum, steel, titanium, or a metal alloy. Heat-generating and / or heat-sensitive components may be thermally connected to the base plate 428 via thermal couplings (such as graphite films or layers, graphite-coated compliant members, thermal paste, etc.). The thermal couplings may be sized and positioned at locations on the base plate 428 that allow the base plate 428 to remove heat from the heat-generating and / or heat-sensitive components. For example, a circuit board assembly may be thermally (and structurally) connected to the base plate 428 via a graphite thermal coupling. Heat from the circuit board assembly (e.g., the processor from the circuit board assembly) can be transferred to the base plate 428 via thermal couplings, thereby helping to remove heat from the circuit board assembly and reduce the temperature on the circuit board assembly or other thermal effects on the circuit board assembly. Heat can also be transferred along the base plate 428, resulting in a reduction in the peak temperature of the device.

[0265] Furthermore, the size and location of thermally connected elements on the base plate 428 can be configured to help reduce heat (e.g., temperature) reaching user-contact surfaces or structures of the device 400. For example, by positioning the thermally connected elements near the center or midline of the base plate 428 (e.g., away from wall sections 417, 419), heat can be directed or concentrated away from wall sections 417 and 419 accessible to the user when holding the device 400. In contrast, without thermally connected elements, heat from device components (such as from a processor located near one of the sidewalls) can result in peak temperatures along that sidewall, which can cause discomfort when holding the device. Other device components may also be thermally connected to the base plate 428, including but not limited to batteries, wireless charging coils, battery charging circuitry, and displays. Device components may be thermally connected to either side of the base plate 428. In some cases, the base plate 428 is thermally connected to device components along both sides of the base plate 428 (e.g., along the side facing the front cover assembly and along the opposite side facing the rear cover assembly).

[0266] The thermal functionality of the base plate 428 can improve the operation of the device 400 in several ways. For example, it can enable higher processor and battery charging / discharging speeds because they can operate at higher temperatures without causing the device to overheat and become unusable. Alternatively, the device can remain cooler during operation (e.g., with lower peak and / or lower average temperatures), making the device more comfortable to use and potentially reducing stress caused by thermal cycling.

[0267] Device components on one side of the base plate 428 may require access to the other side of the base plate 428. Therefore, the base plate 428 may include holes extending through it to facilitate interconnections and other types of access through the base plate 428. For example, the front cover assembly 408 may include components (e.g., via a flexible circuit board or other conductive connection) connected to components in the component group 404, such as display stacks and forward sensors (e.g., proximity sensors, ambient light sensors). Similarly, the component group 404 may include devices that require access to the front cover assembly 408 (and / or via the front of the device to the outside of the device), such as forward cameras, facial recognition systems, and speakers. Therefore, the base plate 428 may include or define holes, such as holes 412, 414, and 415, to enable access through the base plate 428. For example, along one side of the base plate 428 (e.g., on...) Figure 4A Components (e.g., a forward-facing camera, a facial recognition system) structurally connected to the forward sensor area of ​​the device (shown as the bottom side facing upwards) can connect to the front cover assembly 408 via hole 414, while electrical connectors 418 and 416 on the front cover assembly 408 (for the sensor and the display, respectively) can connect to components on the other side of the base plate 428 via holes 415 and 412, respectively. In some cases, the number and size of holes in the base plate 428 are minimized to maximize the structural and thermal functionality of the base plate 428.

[0268] The base plate 428 may also include or define holes 426 (426-1, ..., 426-3). Holes 426 may facilitate mechanical and / or conductive connections between the front cover assembly 408 and the housing structure 406, between the rear cover assembly 402 and the housing structure 406, and / or between the front cover assembly 408 and the rear cover assembly 402. For example, holes 426 may define channels to allow electrically conductive connections of components on opposite sides of the base plate 428, such as inter-board connectors, flexible circuit elements, cables, etc. As another example, spring-loaded coupling elements may be coupled to the housing structure 406 and may be positioned within holes 426 (such as spring-loaded coupling element 618). Figure 6B Furthermore, tabs or other features on the front cover assembly 408 and / or the rear cover assembly 402 (e.g., on the metal frame of the front cover assembly) may be structurally and electrically connected to the spring connecting element.

[0269] As described above, the base plate 428 may define an array of mounting bosses 427 (427-1, ..., 427-4) integrally formed with the plate structure of the base plate 428. The mounting bosses 427 may be machined from the same components (e.g., extruded initial structures) as the base plate 428 and wall sections 417, 419, such that they are integrally formed with the plate structure of the base plate 428. The mounting bosses may be configured to engage fasteners, such as threaded fasteners (e.g., screws, bolts, etc.), for securing components to the base plate 428. For example, circuit board assemblies (e.g., circuit board assembly 320). Figure 3 It can be connected to all or some of the mounting bosses in the mounting boss array 427 via a set of threaded fasteners. Although Figures 4A to 4B An exemplary arrangement of the mounting bosses is shown, but this is merely an exemplary arrangement, and more or fewer mounting bosses may be provided in a hypothetical specific implementation. The position of the mounting bosses may also differ from the shown position depending on the positioning of the component to be attached to the base plate 428 via the mounting bosses.

[0270] Figure 4C It is along Figure 4B A partial cross-sectional view of device 400, viewed along line 4C-4C, shows an exemplary arrangement of components in device 400 near the hole 412 extending through base plate 428. Figure 4C As shown, the front cover assembly 408 can be positioned along one side (e.g., above) of the base plate 428, and the rear cover assembly 402, together with the component 432 of the component group, can be positioned along the opposite side of the base plate 428.

[0271] A front cover assembly 408, including a display 431 along the bottom of a transparent cover 430, may be positioned above a base plate 428 (and optionally separated from the base plate 428 by a gap 434) and may span or be positioned above a hole 412 in the base plate 428. In some cases, the display 431 may come into contact with the base plate 428, such as due to touch input applied to the cover 430, a drop event, or other use or misuse of the device 400. In such cases, the hole in the base plate 428 may create localized areas of high stress or pressure, where the display is forced against the edge of the hole. These localized stress areas may produce temporary or permanent artifacts on the display 431, such as localized bright spots, which may damage the display and / or result in a poor user experience. Therefore, shims (such as shim 435) may be provided in the hole to form a structural stack 437 that reduces or eliminates stress at the edge of the hole 412. For example, Figure 4CAn example is shown in which a flexible circuit element 436 passes through a hole 412 and connects to a component 432 on the opposite side of a base plate 428. The flexible circuit element 436 may be formed into a ring shape, and a spacer 435 may be positioned within the ring (e.g., between two portions of the ring-shaped flexible circuit element 436). The spacer 435 may be configured to have a thickness and / or other dimensional or physical characteristics that cause a structural stack 437 to extend from the component 432 (or other structures below the base plate 428) to the top surface of the base plate 428 (or the side facing the display). For example, the top surface of the structural stack 437 may be substantially flush with (e.g., coplanar) the top surface of the base plate 428. Therefore, even if the cover 430 and the display 431 are deflected into or otherwise forced against the base plate 428 and the structural stack 437, the display will not be forced into or against the edge of the hole 412, because the structural stack 437 effectively provides structural support at the same height and / or plane as the base plate 428. Similar structural stacks 437 may be disposed in or near other holes in the base plate 428 located below the display 431. In such cases, the size, arrangement, number, positioning, material, and other characteristics of the gaskets (and / or other components) defining the structural stacks may be configured such that the tops of those structural stacks are also substantially flush with (e.g., coplanar) with the top surface of the base plate 428. In some cases, the gaskets may be formed of or comprise polymeric materials and may be attached to other gaskets or components via adhesives, mechanical fasteners, etc. In some cases, the gaskets may be formed of metal or other suitable materials.

[0272] Figures 5A to 5B An exemplary circuit board assembly 500 is illustrated. Circuit board assembly 500 may correspond to or be an embodiment of circuit board assembly 320 or other circuit board assemblies described herein. Circuit board assembly 500 may include a first substrate 502 (e.g., a circuit board), a second substrate 504 (e.g., a circuit board), and a wall structure 506. An interior cavity may be defined between the first substrate 502, the second substrate 504, and the wall structure 506, and components such as processors and other electronic components may be positioned within the interior cavity (e.g., coupled to one or both of the first substrate 502 and the second substrate 504).

[0273] In some cases, the processor and other electronic components may also be coupled to the outer surface of one or both of the first substrate 502 and the second substrate 504. (e.g., a cover) Figure 5A The covers 508-1, 508-2, and 508-3 and Figure 5BThe cover 514 may be positioned over an external component to protect, shield, and / or otherwise enclose the external component. Covers 508 and 514 may be formed of or comprise a metal (e.g., an aluminum alloy, such as 7075 or 7475 aluminum alloy) or another suitable material. Other exemplary materials include 5000 series aluminum alloys, 6000 series aluminum alloys, and other 7000 series aluminum alloys.

[0274] Electrical components (such as a processor) in the circuit board assembly 500 can generate heat. This generated heat can cause the device to become hot. Therefore, the circuit board assembly 500 may include user contact surfaces (such as sidewalls of the device, e.g., wall sections 417, 419) that facilitate the removal and / or dissipation of heat from the electrical components, while also preventing the device from becoming too hot to touch comfortably. Figures 4A to 4B Structures that draw away or absorb heat. For example, as described above, covers 508, 514 may be formed of a metal (e.g., aluminum) or another thermally conductive material and may conduct heat to facilitate the extraction, dissipation, and / or other removal of heat from the electrical components below. In some cases, covers 508, 514 contact the electrical components below. In some cases, a thermally conductive material (such as thermal paste or adhesive) may be positioned between the electrical components and the covers and in contact with both the electrical components and the covers.

[0275] Thermally conductive layers 512 and 516 may be positioned on one or more surfaces of covers 508 and 514, respectively. Thermally conductive layers 512 and 516 may be formed of or comprise graphite, metal foil, or film, etc. Thermally conductive layers 512 and 516 may be attached to covers 508 and 514 via adhesives, direct bonding, mechanical fasteners, etc. In some cases, thermally conductive layers 512 and 516 may be formed via material deposition processes, such as chemical vapor deposition, plasma vapor deposition, etc.

[0276] Thermally conductive layers 512 and 516 can be configured to transfer and / or distribute heat from the shroud. For example, a processor positioned beneath the shroud may cause uneven heating of the shroud (e.g., areas of the shroud directly above and / or in contact with the processor may be hotter than surrounding areas). Thermally conductive layers 512 and 516 can distribute the heat of the shroud more evenly over their entire area. This can help dissipate heat from the shroud and also reduce peak temperatures along the thermally conductive layers 512 and 516. More specifically, the high thermal conductivity of the thermally conductive layers 512 and 516 can contribute to a more uniform surface temperature along their surfaces compared to a shroud without thermally conductive layers.

[0277] Thermally conductive layers 512 and 516 can each cover or be attached to one or more shields. For example, Figure 5AThe heat-conducting layer 512 extends above three separate covers 508-1, 508-2, and 508-3. Therefore, the heat-conducting layer 512 can draw in and distribute heat from multiple different covers.

[0278] Circuit board assembly 500 may also include thermal bridges 510-1 and 510-2. Figure 5A ) and 518 Figure 5B These thermal bridges contact the thermally conductive layers 512, 516 and another structure of the device to conduct heat from the shroud and thermally conductive layers to the other structure. For example, thermal bridges 510-1, 510-2 may be located in the middle base plate section of the circuit board assembly 500 facing the housing component (e.g., Figure 3 The middle bottom plate section 323, Figures 4A to 4B On the side of the intermediate base plate section 428 in the phone. In such cases, thermal bridges 510-1, 510-2 may contact the intermediate base plate section 428, thereby forming a thermal path from the cover to the intermediate base plate section 428. As described herein, the intermediate base plate section may be formed of a metallic material and may define a plate-like structure passing through the central region of the phone. The intermediate base plate may (e.g., along one of its sides) have a surface area greater than about 50%, about 60%, about 70%, or about 80% of the front or rear surface area of ​​the phone. Therefore, the intermediate base plate has a considerable size and thus a considerable thermal mass, and may absorb, distribute, and / or dissipate heat from the thermal bridges 510-1, 510-2. Furthermore, as described herein, the thermal bridges may generally be positioned toward the interior of the device (e.g., the centerline) and away from the outer peripheral walls or surfaces of the device. For example, the center of thermal bridge 510-2 is positioned offset from the centerline of the segment where the circuit board assembly 500 is located (e.g., in...). Figure 5A (The orientation is further to the right). As described in this article, this arrangement tends to dissipate heat from the circuit board assembly 500 at a greater distance from the outer surface of the device.

[0279] A thermal bridge 518 located on the side of the circuit board assembly 500 facing the rear cover assembly is accessible to the rear cover assembly. For example, the rear cover assembly may include a frame (e.g., frame 604) defining an inner surface of the rear cover assembly. Figure 6A The frame of the back cover assembly may be formed of or comprise metal, such as aluminum, stainless steel, metal alloys, etc. A thermal bridge 518 may contact the frame and transfer heat to it. The frame may help remove, dissipate, and / or distribute heat from electrical components.

[0280] Thermal bridges 510-1, 510-2, and 518 may be compliant to accommodate various gaps between the circuit board assembly (e.g., a coated cover of the circuit board assembly) and the intermediate base plate and rear cover assembly. In some cases, thermal bridges 510-1, 510-2, and 518 comprise a compliant structure, such as foam, wrapped with a thermally conductive layer (e.g., a graphite layer). Foam or other suitable compliant members or materials provide compliance (e.g., allowing the thermal bridge to deform between the two structures) while also providing a resilient force that compels the thermal bridge into contact with the structure. The thermally conductive layer may surround the compliant structure or otherwise physically contact the structure to be thermally joined (e.g., a thermally coated cover and intermediate base plate section or rear cover assembly).

[0281] The cover, thermally conductive layer, and thermal bridges 510-1, 510-2, and 518 work together to perform several thermal functions. For example, they act as heat sinks for components of the circuit board assembly, thereby helping to maintain lower component temperatures, which can contribute to improved efficiency, processing speed, and extended component life. Additionally, the locations of the thermal bridges 510-1, 510-2, and 518 are chosen to position heat transfer areas away from structures that may become hot and uncomfortable to touch. For example, to mitigate the effects of heat on the sidewalls of the device, which may be made of metal and could make the device uncomfortable to use if they become overheated, the thermal bridges may be located near the centerline of the base plate section or otherwise offset inward from the wall of the device (e.g., from wall section 419). In this way, heat from the circuit board assembly 500 can generally be directed towards the center of the device, thereby helping to reduce the temperature at the sidewalls or other external structures of the device, especially those that can be good thermal conductors.

[0282] Figure 5C A plan view of the rear of device 400 is shown, illustrating the circuit board assembly and thermal bridges 510-1, 510-2, and 518. As shown, thermal bridges 510-1, 510-2, and 518 are offset toward the centerline 501 of the device. In other words, thermal bridges 510-1, 510-2, and 518 are positioned on their respective covers, closer to the centerline 501 of the device than the sidewalls (e.g., sidewall 419). In this way, heat generated by components beneath the covers can be largely directed to the center or middle of the device, rather than the outer perimeter.

[0283] The intermediate base plate section of the housing component can define various features, thereby accommodating equipment components in a space-efficient manner. For example, such as Figure 4A and Figure 4B As shown, the base plate 428 may include recesses 425-1, 425-2 formed along one side of the base plate 428 in the battery mounting area, and adhesive for adhering the battery 440 to the base plate 428 may be accommodated in the recesses 425-1, 425-2. For example, as Figure 4AAs shown, adhesive films 438 and 439 (e.g., pressure-sensitive adhesive films) can be positioned on the battery 440 such that when the battery 440 is positioned on the base plate 428, the adhesive films 438 and 439 are respectively positioned in the recesses 425-1 and 425-2. The adhesive films 438 and 439 can be adhesive strips positioned on the adhesive side of the battery 440. The battery 440 can be positioned along the length axis of the device (e.g., as shown in the diagram). Figure 4B The vertical axis oriented in the center extends a first distance and along the width axis of the device (e.g., as shown in the image). Figure 4B The second distance extends along the horizontal axis of the battery, and the adhesive film or strip may extend along the length axis (e.g., essentially the entire length of the battery, such as more than 80%, more than 90%, or more than 95% of the length axis).

[0284] Adhesive films 438 and 439 may be positioned on the battery 440 to accommodate graphics or other features on the battery surface. For example, a first adhesive film strip 438 may be positioned along a first edge of the adhesive side of the battery 440, and a second adhesive film strip 439 may be positioned along a second edge of the adhesive side of the battery 440. The middle portion of the adhesive side of the battery between the first and second strips may be free of adhesive. Graphic markings, such as barcodes, QR codes, numeric codes, serial numbers, batch numbers, manufacturing information, images, or other graphic markings, may be positioned between the adhesive strips on the adhesive side of the battery 440. In this way, the graphic markings are not obscured by the adhesive films.

[0285] The adhesive films 438 and 439 together may cover a substantial portion of the surface area of ​​the bonding side of the battery 440 (e.g., the side of the battery 440 facing the base plate 428). For example, in some cases, the adhesive films 438 and 439 together cover approximately 60%, approximately 70%, or approximately 80% of the surface area of ​​the bonding side.

[0286] The recess in the base plate 428 helps to reduce the thickness of the device by accommodating the adhesive therein, so that the battery can be positioned closer to the surface of the base plate 428 during battery installation. Figure 5D For along Figure 4BA partial cross-sectional view of the device 400 for 5D-5D observation is shown. As shown, adhesive films 438 and 439 are positioned within recesses 425-1 and 425-2. In some cases, the thickness of adhesive films 438 and 439 is substantially equal to the depth of recesses 425-1 and 425-2. Therefore, the mounting surface of the battery can contact the base plate 428. In some cases, the thickness of adhesive films 438 and 439 may be approximately 5 micrometers to approximately 30 micrometers greater than the depth of the recesses. This helps ensure positive contact between adhesive films 438 and 439 and the battery 440 and the base plate 428, and takes into account manufacturing, assembly, or other tolerances in the battery 440, base plate 428, adhesive films 438 and 439, etc. The depth of recesses 425-1 and 425-2 may be approximately 50 micrometers to approximately 100 micrometers, or approximately 50 micrometers to approximately 250 micrometers. In some cases, the depth of the recesses 425-1, 425-2 can be from about 100 micrometers to about 500 micrometers. Other depths have also been considered, and other depths can be selected based on the specific thickness of the adhesive films 438, 439 (e.g., such that the depth is greater than or equal to the thickness of the film).

[0287] The base plate 428 may include or define other features that physically accommodate equipment components to help reduce the overall size and / or thickness of the equipment. Figure 5E It is along Figure 4B A partial cross-sectional view of device 400 observed along line 5E-5E shows a portion of a base plate 428 configured to structurally house a portion of a battery and a portion of a display component. Specifically, the base plate 428 defines a first portion 522 along a first side of the base plate 428 (e.g., along the bottom side, as shown). Figure 5E (as depicted) defines the first protrusion 527 and extends along the second side of the base plate 428 opposite to the first side (e.g., along the top side, as shown in the image). Figure 5E The base plate 428 (as depicted) defines a first recess 528. The base plate 428 further defines a second portion 523 that defines a second protrusion 529 along a second side of the base plate 428 and a second recess 530 along a first side of the base plate 428. The first and second protrusions, as well as the first and second recesses, may be defined by a single continuous element of the base plate 428, which may have a substantially continuous thickness. Steps, bends, or deflections in the base plate 428 may define the protrusions and recesses, such as... Figure 5E As shown. In some cases, the first portion 522 and the second portion 523 of the base plate 428 are formed by machining an intermediate housing component.

[0288] The recess and protrusion defined by the first portion 522 and the second portion 523 can accommodate irregularly shaped (e.g., non-planar) parts or assemblies. The recess and protrusion can allow for efficient nesting of parts to reduce the overall thickness of the device. For example, a battery 440 positioned on a first side of a base plate 428 may include: a battery cell portion 525 comprising battery cells and having a first thickness; and a battery circuit portion 524 comprising battery circuit components (e.g., a battery management unit) and having a second thickness less than the first thickness. The thinner portion of the battery may define a recess along at least one side of the battery.

[0289] The display assembly 526, positioned on a second side of the base plate 428 opposite to the first side, may include an irregular, non-planar surface facing the base plate. For example, a circuit element 521 may be positioned along the base plate-facing surface of the display assembly 526 (e.g., positioned on a circuit board 520, such as a flexible circuit element, which loops along and is coupled to the base plate-facing surface). The configuration of protrusions and recesses in the base plate 428 may be configured to accommodate these irregularly shaped and / or non-planar components. For example, a first portion of the battery 440 (e.g., battery cell portion 525) may extend into a first recess 528 defined by a first portion 522 of the base plate 428, and a second portion of the battery 440 (e.g., battery circuit portion 524) may be positioned over a second protrusion 529 defined by a second portion 523. A first portion of the display assembly 526 may be positioned opposite a first protrusion 527 (and may define an air gap between the first portion of the display and the first protrusion 527 of the base plate 428), while a second portion of the display assembly 526 (e.g., circuit element 521) may extend into a second recess 530. Furthermore, a second protrusion 529 may extend into a recess defined by a thinner battery circuit portion 524. The arrangement of the recesses and protrusions formed by the cleavage in the base plate 428, compared to a flat or planar base plate, allows the display assembly 526 and the battery 440 to be positioned closer to each other while still maintaining a suitable distance between the base plate and the components.

[0290] Figure 5FAn exemplary device 550 is shown, which includes an impact barrier structure 553 extending around the periphery of a battery 551. Device 550 may correspond to or be an embodiment of device 400, and battery 551 may correspond to or be an embodiment of battery 440. The impact barrier structure 553 is configured to protect the sides of the battery from impacts or contact with other components or structures within device 550. Such contact or impact could damage the battery or components of the device. For example, in some cases, components adjacent to the sides of battery 551 may be irregular, have protruding edges or features, and may include components such as screws, bolts, fasteners, etc., which may generate high stress on battery 551 in the event of contact or impact. Therefore, the impact barrier structure 553 may provide an irregular surface around the periphery of battery 551 to reduce stress from surrounding components and absorb some or all of the impact force and prevent or inhibit contact between the battery and adjacent components.

[0291] The impact barrier structure 553 may include one or more barrier members. For example, the impact barrier structure 553 may include a first barrier member 552-1 positioned between the battery and the wall 557 of the housing component, and a second barrier member 552-2 positioned between the battery 551 and the circuit board assembly 555 (e.g., corresponding to or for an embodiment of the circuit board assembly 500). In some cases, the impact barrier structure 553 may include a third barrier member 552-3 positioned between the battery 551 and the camera module 556, and a fourth barrier member 552-4 positioned between the battery 551 and another component 554 within the device. The impact barrier structure 553 may include more, fewer, or differently arranged barrier members 552, and may be configured such that one barrier member is positioned along each peripheral side of the battery 551. The barrier members 552 may be substantially planar on at least the side facing the battery and optionally along the opposite sides.

[0292] The barrier member 552 may be formed of a non-conductive polymer material, such as polyethylene, polycarbonate, etc. In some cases, the barrier member 552 also forms an electrical isolation barrier between the battery 551 and other components of the device. In some cases, the barrier member 552 may be formed of metal, carbon fiber, or another suitable material.

[0293] The barrier member 552 can be fixed within the device in various ways. For example, the barrier member 552 can be adhered to a component or structure within the system. For example, the first barrier member 552-1 can be adhered to a first wall, the second barrier member 552-2 can be adhered to a circuit board assembly 555, the third barrier member 552-3 can be adhered to a camera module 556, and the fourth barrier member 552-4 can be adhered to other components 554 of the device.

[0294] In some cases, the barrier members may be fixed to the base plate 558 of the equipment (e.g., an embodiment corresponding to or for base plate 428). For example, base plate 558 may be a metal base plate, and at least one of the barrier members 552 (and optionally all of the barrier members 552) may be attached to the metal base plate, such as by welding, brazing, mechanical fasteners (e.g., screws, bolts, etc.), riveting, etc.

[0295] Figure 6A A rear cover assembly 600 is shown. The rear cover assembly 600 may correspond to or be an embodiment of rear cover assemblies 273, 373, 408, or other rear cover assemblies described herein. As described herein, the cover assembly 600 may be coupled to a housing or housing structure (e.g., housing structure 310, 406, or other housing structures described herein).

[0296] The rear cover assembly 600 includes a rear cover 602 (e.g., corresponding to or being an embodiment of rear cover 272, 372, or other rear covers described herein) and a frame 604 coupled to the rear cover 602. The frame 604 may be formed of metal and may include mounting and / or retaining features that are connected to the housing or housing structure (e.g., housing structure 406). Figure 4A The rear cover assembly 600 engages complementary features and / or mechanisms with the housing structure. For example, the rear cover assembly 600 includes tabs 610 and 614 and a fastening feature 612. Tab 610 engages complementary retaining features of the housing structure to hold the rear cover assembly 600 to the housing structure. For example, the rear cover assembly 600 may be positioned at an angle to the housing structure to allow a protrusion of the housing structure to extend into an opening in tab 610. The rear cover assembly 600 may then pivot toward the housing structure (e.g., while maintaining engagement between the protrusion and tab 610), thus securing the rear cover assembly 600 to the housing structure. When the rear cover assembly 600 is in place relative to the housing structure, the fastening feature 612 may align with a corresponding fastening feature of the front cover assembly and may be fastened via screws, bolts, or other fasteners extending through holes in the fastening feature 612 (and optionally, the fastening features of the front cover assembly). The fasteners may extend into and / or anchor into holes (e.g., threaded holes) in the housing structure.

[0297] Frame 604 may include or define a plate-like structure that extends above (e.g., over substantially the entire back cover 602, as shown) and defines the inner surface of the back cover assembly 600. In some cases, a layer 605, such as a graphite film, polymer film, ink, coating, decorative layer, etc., may be positioned on frame 604.

[0298] The rear cover assembly 600 also includes a tab array 614. Tabs 614 may be part of the frame 604, or the tabs may be attached to the frame 604 (or another part of the rear cover assembly 600). For example, the frame 604 may be formed of or include a metal structure, and the tabs 614 may be integral with the frame 604 (e.g., formed of the same metal part as the frame 604). In other cases, the tabs 614 may be formed separately from the frame 604 and attached to the frame via welding, adhesive, solder, brazing, fasteners, or another suitable technique. Tabs 614 may be electrically coupled to the frame 604 or another part of the rear cover assembly 600 and may be used to define a conductive path between the rear cover assembly 600 and the housing structure or other parts of the device, as per [reference to...]. Figure 6B As stated above.

[0299] Figure 6B A portion of the device is shown, typically corresponding to Figure 4B Regions 6B-6B illustrate how the tabs of the front and rear cover assemblies can be attached to housing component 616 (which may be an embodiment of wall sections 417 or 419 or otherwise correspond to wall sections). For ease of illustration, portions of housing structure 406 are shown in cross-section. Figure 6B As shown, the spring coupling element 618 can be coupled to the housing structure. For example, the spring coupling element 618 can be coupled to a wall section of the housing structure, such as wall sections 317, 319, 417, 419 or other wall sections (or other housing structures or components) described herein. The spring coupling element 618 can be coupled via fasteners, welding, soldering, brazing, etc.

[0300] Spring-connecting element 618 is electrically coupled to housing structure 616 and can be configured to be mechanically and electrically coupled to tabs 622, 614 of the front cover assembly and rear cover assembly, respectively. Spring-connecting element 618 may include spring clips configured to be mechanically and electrically coupled to tabs 614, 622 of the rear cover assembly and front cover assembly, respectively. In some cases, spring-connecting element 618 includes multiple spring clips engaging a single tab. For example, spring-connecting element 618 may include spring clips 620, 626 engaging tab 614 (of the rear cover assembly) and spring clips 621, 628 engaging tab 622 (of the front cover assembly). In some cases, spring clips may be configured to contact different portions of the tab to optimize or otherwise facilitate different functions. For example, spring clips 620, 621 may be configured to mechanically retain tabs 614, 622, while spring clips 626, 628 may be configured to electrically engage tabs 614, 622 to define a conductive connection between the front cover assembly, the rear cover assembly, and the housing component 616. Spring clips 620, 621 may define protrusions or other features that engage with holes 631, 632 (or lips, recesses, or other features) in tabs 614, 622 to provide mechanical retention between the tabs and the spring clips.

[0301] While spring clips 620 and 621 can also be electrically connected to tabs 614 and 622, the interlocking or engaging features of clips 620 and 621 and tabs 614 and 622 may not provide a sufficiently reliable conductive connection. For example, movement of the tabs relative to the spring clips can disengage protrusions and recesses or holes, or otherwise create a suboptimal conductive connection. Therefore, spring clips 626 and 628 can engage different portions of tabs 614 and 622, such as the conductive connection areas 629 and 630 of tabs 614 and 622, thereby providing a reliable and consistent conductive connection that can accommodate slight movement and / or misalignment. Conductive connection areas 629 and 630 can access holes 631 and 632. Thus, the dual-clip system provides both a reliable mechanical connection and a reliable conductive connection between the cover assembly and the housing structure using the same tabs. Furthermore, providing clips for both the front and rear cover assemblies on a single structure between the cover assembly and the housing structure provides a low-resistance conductive path while reducing the total number of parts and device complexity.

[0302] Both spring clips 626 and 628 and contacts 614 and 622 may be formed of metal or another conductive material. In some cases, the contacts and spring clips are part of the electrical ground plane of the device. For example, contacts 614 and 622 may be conductively connected to components and / or structures of the front and rear cover assemblies that are part of a designated electrical ground or reference plane. Additionally, spring clips 626 and 628 may be conductively connected to components and / or structures that are part of a designated electrical ground or reference plane, and these components and / or structures are connected to the housing structure 616. Thus, the spring clips and contacts define conductive paths to define a single electrical ground of the device.

[0303] Figure 7A A portion of device 400 (e.g., a portion of housing structure 406) is shown, in which one or more camera modules may be positioned. As described herein, housing structure 406 may define an intermediate base plate segment 428, which may define a rearward surface ( Figure 7A (shown in the image) and the forward surface opposite the rearward surface. Rearward cameras 750, 751 (shown in the image) Figure 7B As shown, it can correspond to or be Figure 3 In embodiments of the cameras 361, 362, the cameras may be positioned on and fixed to the rearward surface of the intermediate base plate section 428 and may be facing away from the intermediate base plate section 428 (e.g., to capture images through the rear cover). In the example shown, the cameras are positioned near a corner of the device 400, such as the corner defined by housing parts 420, 421 and wall section 417.

[0304] To reliably and securely position the camera within device 400, device 400 may include bias spring structures 702, 704, which are coupled to a camera mount (e.g., camera mount 720). Figure 7B The camera mount 720 is engaged to bias the camera module coupled to the camera mount toward a desired reference position (e.g., toward a corner of housing structure 406). The biasing spring structures 702, 704 may include base structures 706, 710 extending from base plate 428. Base structures 706, 710 may be fastened to base plate 428 (e.g., via screws, bolts, adhesives, mechanical interlocking features, etc.), or the base structures may be integral with base plate 428. In the latter case, the base structures may be machined from the same material as base plate 428 (e.g., the base structure may be a machined feature of base plate 428). The biasing spring structures 702, 704 may also include spring members 708, 712 coupled to base structures 706, 710. The spring members provide a biasing force that biases the camera mount 720 toward a target position.

[0305] Figure 7BDevice 400 is shown, in which a camera bracket 720 is positioned within a housing structure 406. The camera bracket 720 may define holes 722, 724 into which biasing spring structures 702, 704 extend to engage the camera bracket 720 and bias it toward or into a desired reference position. Holes 722, 724 may define inner surfaces 730, 732 that engage or contact with spring members 708, 712. Spring members 708, 712 contact the inner surfaces 730, 732 and push the camera bracket 720 along biasing directions 726, 728. Thus, in this example, spring members 708, 712 bias the camera bracket 720 toward the top of the device (e.g., toward housing member 420) and toward the sides of the device (e.g., toward wall section 417). Spring members 708, 712 may together bias the camera bracket 720 toward a corner of device 400.

[0306] Figure 8 A partial cross-sectional view of the device through a pair of cameras is shown, such as... Figure 2 The rear-facing cameras in the middle are 261, 262, and 263. Figure 3Cameras 361, 362 or other cameras described herein (and specific cameras close to each other) may be used. Cameras 802, 804 may be positioned within camera housings 800, 801, respectively. Camera housings 800, 801 may include first housing components 806, 808 and second housing components 810, 812. Second housing components 810, 812 may be coupled to first housing components 806, 808 at seams 809, 811. First housing components 806, 808 may each define the bottom of their respective camera housings 800, 801, and second housing components 810, 812 may each define the top of their respective camera housings 800, 801. Camera housings 802, 804 may be coupled to a camera bracket 814, which may define a flange 816 positioned between the first and second cameras. The flange 816 may have a top edge below seams 809, 811. In some cases, a portion of at least one of the second housing components 810, 812 extends at least partially above the top edge of the flange 816. Because the top edge of the flange 816 is below the seams 809, 811, the cameras 802, 804 can be positioned closer to each other than possible camera positions with other flange configurations. More specifically, camera housings 800, 801, and more specifically, the upper or second housing components 810, 812 can be positioned closer to each other (and optionally overlap the top of the flange 816) without having to provide clearance distance from the sides of the flange 816. In contrast, a higher flange 816 can result in the camera housings 800, 801 being positioned further apart to provide sufficient clearance between the sides of the housings 800, 801 and the flange 816. Therefore, the relative positioning of the flange 816 and the seams 809, 811 of the camera housing (e.g., the top edge of the flange 816 is below the seams 809, 811) allows for higher filling efficiency and a smaller overall device size.

[0307] Figure 9A It is along Figure 2 A partial cross-sectional view of the device 200 observed along lines 9A-9A shows various aspects of the rearward sensor region with a rearward camera. Although Figure 2 An exploded view is shown, but Figure 9A This refers to device 200, which is at least partially assembled. It should be understood that the features described with respect to device 200 are equally applicable to any other device and / or rear sensor region described herein.

[0308] Figure 9ACamera 262 and depth sensing device 281 are shown (which may also represent other optical components, such as a second camera). Device 200 includes a frame member 921 that is attached to (and is part of) the rear cover 272 of device 200. Components of the rear sensor array, such as cameras in a camera array, camera mounts (e.g., camera mount 920), depth sensing devices, microphones, strobes, or flashes, may be attached to frame member 921.

[0309] Camera 262 can be electrically coupled to other components within device 200. For example, flexible circuit element 922 can electrically couple camera 262 to circuit component 924, such as circuit board assembly (e.g., circuit board assembly 220). Figure 2 Alternatively, the flexible circuit element 922 may be electrically coupled to the circuit component 924 via a connector system 925 (e.g., a zero-insertion-force connector or other inter-board connector system). Due to the orientation of the flexible circuit element 922 in the general plane of the path between the camera 262 and the circuit component 924, minute misalignments in the positioning of the camera 262 and the circuit component 924 can cause the flexible circuit element to become tangled, bent, or otherwise fail to align properly with the connector on the circuit component 924. Additionally, to reach the circuit component 924, the flexible circuit element may extend over another component or system, such as the depth sensing device 281. Therefore, the flexible circuit component 922 defines a relaxation section 926 that provides a degree of compliance to accommodate positional tolerances of system components without imposing excessive stress on the flexible circuit component 922, the connector system 925, the camera 262, or other components. The relaxation section 926 may take the form of one or more bent or folded portions of the flexible circuit component 922, which may be further bent or folded to allow the flexible circuit component 922 (e.g., as...) Figure 9A (As shown from left to right) Lateral movement without causing deformation or tangling of the flexible circuit component 922 or otherwise imposing excessive stress on the flexible circuit component 922, connector system 925, camera 262 or other components.

[0310] In some cases, the relaxation section 926 may be positioned between the rigid stack region and the connector system 925. For example, when the flexible circuit component 922 passes over the depth sensing device 281 (or other components of the device 200, such as a rear camera), the flexible circuit component 922 may be trapped between components in the component stack, such as spacer 927 (e.g., foam, pad, shield, cover, or other structure, material, or component positioned above the depth sensing device 281) and camera housing 923. In some cases, positioning the flexible circuit component 922 in the stack above the depth sensing device 281 helps to hold the flexible circuit component 922 in place and reduce stress at the interface between the flexible circuit component 922 and the camera 262, while positioning the relaxation section 926 between the connector system 925 and the rigid stack region provides compliance for the flexible circuit component 922 to reduce stress on both the connector system 925 and the rigid stack region.

[0311] Cover 923 can also be positioned on camera 262, depth sensing device 281 and other components (e.g., cameras 261, 263, etc.). Figure 2 Above. In some cases, the shroud 923 covers essentially the entire rearward sensor array (e.g., sensor array 260, Figure 2 The cover 923 can be configured to physically protect components of the sensor array and can provide electrical shielding (e.g., shielding against electromagnetic interference, radio frequency signals, etc.). The cover 923 can be formed of metal, such as aluminum, steel, metal alloys, etc. In some cases, the cover 923 is formed of or includes 7000 series aluminum alloys, such as 7475 series aluminum alloys.

[0312] The cover 923 may have different thicknesses in different regions and may be formed with recesses, cleavage, protrusions, and / or other shapes. For example, a first portion 930 of the cover 923 (e.g., the portion positioned above the depth sensing device 281 and / or other cameras such as cameras 261, 263) may have a first thickness, and a second portion 931 of the cover 923 (e.g., the portion positioned above camera 262) may have a second thickness less than the first thickness. The second portion 931 may also be stepped upward relative to the first portion 930, such as providing a larger gap between the cover 923 and the camera 262. In some cases, the camera 262 extends above the depth sensing device 281 and / or other components below the cover 923, and an additional gap below the stepped second portion 931 accommodates a larger camera 262 while maintaining a suitable gap. The first thickness may be from about 0.25 mm to about 0.35 mm, and the second thickness may be from about 0.18 mm to about 0.25 mm.

[0313] The second portion 931 can be made thinner than the first portion 930 by chemical etching or another material removal process (e.g., machining). In some cases, the second portion 931 can be made thinner by forming processes such as forging, stamping, molding, etc.

[0314] The first portion 930 may define a recessed outer surface relative to the outer surface of the second portion 931. In some cases, a thermally conductive material 911 (such as graphite) may contact or be positioned along the outer surface of the first portion 930. In some cases, when the device 200 is assembled, the thermally conductive material 911 may be coupled to a structure positioned above the cover 923. For example, the thermally conductive material 911 may be positioned on the front cover assembly (e.g., the inner surface of the front cover assembly 201). Figure 2 The cover assembly may be positioned above and / or in contact with the outer surface of the first portion 930 when attached to the housing (e.g., housing 210). In some cases, the thermally conductive material 911 is attached (e.g., adhered) to the first portion 930 of the cover and is positioned near and / or in contact with the front cover assembly when attached to the housing. The thermally conductive material 911 can conduct heat generated by components of the rearward sensor array (e.g., cameras in a camera array) away from the cameras and toward another component or structure of the device. For example, the thermally conductive material 911 can help draw heat away from the rearward sensor array and into, for example, the front cover assembly.

[0315] A portion of camera 262, such as a portion of lens assembly 960, may extend into and optionally through a hole 916 extending through rear cover 272. Lens assembly 960 may define a base portion 909 and an end portion 961, the base portion having a first outer diameter and the end portion having a second outer diameter smaller than the first outer diameter. A portion of camera 262 (e.g., end portion 961 of lens assembly 960) may extend through the rear outer surface of rear cover 272. As described herein, decorative components may surround and / or protect the portion of camera 262 extending through the rear outer surface of rear cover 272.

[0316] In some cases, a certain clearance distance may be required between the lens assembly 960 and adjacent components in the device 200, such as to prevent unintentional contact between the lens assembly 960 and adjacent components during assembly and / or use of the device. Therefore, the aperture 916 may define a multi-segment aperture surface to accommodate the lens assembly 960 while minimizing the size of the opening along the outer surface of the rear cover 272. For example, the aperture 916 may be defined by an aperture surface having a tapered portion 906 near the opening of the aperture along the inner surface of the rear cover 272 and a cylindrical portion 905 near the opening of the aperture along the outer surface of the rear cover 272. The tapered portion 906 may define a truncated conical surface. The tapered portion 906 provides clearance for the lens assembly 960 near the wider base portion 909 of the lens assembly. The clearance provided by the tapered portion 906 facilitates various structural and positioning advantages. For example, the external opening of the aperture (compared to a cylindrical or straight-walled aperture) can be smaller because the tapered portion 906 provides additional clearance near the wider portion of the lens assembly 960. Additionally or alternatively, the lens assembly 960 can be positioned further within the aperture 916 without placing the lens assembly 960 too close to the aperture surface. In some cases, the edge of the internal opening defines a chamfered surface 907.

[0317] In some cases, frame member 921 may define a tapered wall section 908 extending into bore 916. Tapered wall section 908 may define a tapered shape of a tapered portion 906 substantially parallel to the bore surface. The tapered matching of tapered wall section 908 and tapered portion 906 of bore 916 provides the advantages of a tapered bore portion, while also providing additional protection, light blocking, and other functions for the tapered wall section 908 within the bore. In some cases, as described herein, decorative components extending around lens assembly 960, protecting lens assembly 960, and retaining camera cap may be attached to tapered wall section 908.

[0318] As described above, the device may include decorative components for a rear-facing camera, such as camera 262 (and Figure 2 (Cameras 261, 263, or other cameras described herein). Figure 9A An exemplary decorative component 904 is shown, which may be Figure 2 The implementation scheme of decorative component 269. Other cameras in the device may also include... Figure 9AThe same or similar decorative components shown, or other cameras may use different decorative components. Decorative component 904 may include an inner decorative ring 912 extending around a lens portion of camera 262 (e.g., lens assembly 960) and defining a first surface 962 and a second surface, the first surface facing the lens portion, the second surface opposite the first surface 962 and defining a first channel 918. Decorative component 904 may also include an outer decorative ring 910 extending around the inner decorative ring 912 and defining a third surface and a fourth surface 963, the third surface facing the second surface of the inner decorative ring and defining a second channel 917, the fourth surface opposite the third surface and defining a peripheral outer surface of decorative component 904. The first channel 917 and the second channel 918 may define a hollow cavity 919 between the inner decorative ring 912 and the outer decorative ring 910. The hollow cavity 919 may provide weight savings relative to a decorative component excluding channels 917, 918, and may also reduce the material cost of the device. In some cases, the hollow chamber 919 may be filled with materials such as polymer materials, foam, adhesives, etc.

[0319] The inner decorative ring 912 can support the camera cover 267 or window through which the camera receives light. The camera cover 267 can be adhesively or otherwise attached to the mounting surface of the inner decorative ring 912.

[0320] A sealing member may also be disposed between the decorative ring and / or the bore surface. For example, a first sealing member 915 may be positioned between and in contact with the outer decorative ring 910 and the bore surface (e.g., the cylindrical portion 905 of the bore 916). A second sealing member 914 may be positioned between and in contact with the inner decorative ring 912 and the outer decorative ring 910. The sealing member may be formed of rubber, foam, or another deformable or compliant material that is in close contact with the surfaces of the decorative ring and / or the bore surface (or other surfaces). The sealing member can prevent the ingress of liquids, water, dust, and / or other contaminants.

[0321] Decorative rings 910 and 912 may be formed of or comprise metallic materials, such as aluminum, steel, zinc, titanium, metal alloys, etc. One or both of decorative rings 910 and 912 may alternatively be formed of polymeric materials, composite materials, or another suitable material or combination of materials. Decorative rings 910 and 912 may be formed of the same material (e.g., aluminum), or they may be formed of different materials (e.g., an aluminum decorative ring and a polymer decorative ring).

[0322] Figures 9B to 9F Additional exemplary decorative components and other features in the rear camera area are shown. For simplicity, Figures 9B to 9FVarious decorative components, shields, frame structures, etc., attached to the rear cover 272 are shown, including the camera cover 913, but it should be understood that they may also be used with other rear covers and / or camera covers. Figure 9B An exemplary decorative assembly is shown, including an inner decorative ring 933 coupled to an outer decorative ring 932. A camera cover 913 is coupled to the inner decorative ring 933. The inner decorative ring 933 and the outer decorative ring 932 may each include flange portions 936 and 948, respectively, which extend to a hole 916 in the rear cover 272. Figure 9A In the context of the outer decorative ring 932, the flange portion may correspond to the portion of the decorative ring within the hole and / or extending into the interior of the device, while the outer portion of the decorative ring may correspond to the portion extending through the rear outer surface of the cover 272. The flange portions 936, 948 may be joined to each other and / or connected to the frame member 921. For example, the flange portions 936, 948 may be welded, brazed, adhered, or otherwise joined to each other and / or connected to the frame member 921. The flange portion 948 of the outer decorative ring 932 may define a recess or channel 964 in the surface facing the inner decorative ring 933, thereby defining a hollow cavity between the outer decorative ring 932 and the inner decorative ring 933. The hollow cavity provides the weight and material reduction described above.

[0323] like Figure 9B As shown, coatings 934 and 935 may be applied to the surface of the back cover 272. Coatings 934 and 935 may be opaque and / or light-blocking coatings to prevent or suppress the visibility of internal components through the back cover 272. Coatings 934 and 935 may be formed by inks, dyes, paints, or deposited coatings (e.g., coatings deposited using PVD, CVD, etc.). Coating 935 may be positioned along the inner surface of the back cover 272, opposite the rear outer surface of the back cover 272. Coating 934 may be positioned along the surface of a hole, including a tapered portion and a cylindrical portion along the surface of the hole. Coatings 934 and 935 may be formed from or comprise the same or different materials. In some cases, coatings 934 and 935 may have the same or substantially the same color, providing a uniform appearance through the back cover 272 (which may be a transparent or translucent glass material, sapphire, glass ceramic, ceramic, etc.). In some cases, the sealing member (e.g., sealing member 915) contacts the coated hole surface. Figure 9A The decorative ring may have the same or substantially the same color as the coating. In some cases, the flange portion of the decorative ring (and specifically, the flange portion of the outer decorative ring) may have the same or substantially the same color as the coating.

[0324] In some cases, the outer portion of the decorative ring has a different color than the flange portion. For example, the flange portion of the inner decorative ring may have a first color (e.g., to match the coating), while the outer portion may have a different color. The different colored portions of the decorative ring can be produced in various ways. For example, one or both portions of the decorative ring may be sprayed, coated, plated, textured, anodized, etched, dyed, etc., to produce the desired color along the flange portion and the outer portion.

[0325] Figure 9C An exemplary decorative assembly including an inner decorative ring 938 and an outer decorative ring 937 is shown. The outer decorative ring 937 defines a first channel 965 in its flange portion and a second channel 968 in its outer portion (e.g., the portion of the outer decorative ring 937 extending beyond the rear outer surface of the rear cover 272). Additionally, the inner decorative ring 938 defines a third channel 966 in its flange portion, which is opposite to the first channel 965 and together with the first channel 965 defines a first hollow cavity between the flange portions. The second channel 968 defines a second hollow cavity between the outer portions of the decorative ring. The hollow cavity provides the weight and material reduction described above. Discussions of other aspects of the decorative rings described herein (e.g., materials, attachment techniques, colors, etc.) are equally applicable to decorative rings 937 and 938.

[0326] Figure 9D An exemplary decorative assembly including an inner decorative ring 940 and an outer decorative ring 939 is shown. The outer decorative ring 939 defines a channel 969 in its outer portion. The channel 969 defines a first hollow cavity between the outer decorative ring 939 and the inner decorative ring 940. Additionally, the outer decorative ring 939 includes a partial flange portion 970 that extends only partially into the hole (e.g., less than about 50%, about 40%, or about 30% of the length of the hole). The partial flange portion 970 may define a second hollow cavity 941 between the hole surface and the flange portion of the inner decorative ring 940. The hollow cavity provides the weight and material reduction described above. Figure 9DA shield 942 is also shown that can be positioned on or along one or more surfaces of the rear cover 272. For example, the shield 942 may extend along at least a portion of the inner surface of the rear cover 272 and may extend along the bore surface into the bore 916. The shield 942 may suppress the visibility of internal components through the rear cover 272. The shield 942 may also have a color that matches or substantially matches a coating (e.g., coating 935) positioned on the inner surface of the rear cover 272, thereby providing a uniform appearance through the rear cover 272. The shield 942 may be used in addition to or in place of a coating on the bore surface. In some cases, the shield 942 may extend only partially into the bore 916, such that the sealing member 971 does not contact the shield (but is between and in contact with both the outer decorative ring 939 and the bore surface). In such cases, at least a portion of the bore surface not covered by the shield 942 may include a color-matched coating. The discussion of other aspects of the decorative rings described herein (e.g., materials, attachment techniques, colors, etc.) is equally applicable to decorative rings 939 and 940.

[0327] Figure 9E An exemplary decorative assembly including an inner decorative ring 944 and an outer decorative ring 943 is shown. The outer decorative ring 943 defines a channel 945 in its outer portion, which defines a hollow cavity between the outer decorative ring 943 and the inner decorative ring 944. Additionally, the inner decorative ring 944 does not have a flange portion but is attached to a mounting surface 946 on the outer portion of the outer decorative ring 943. Therefore, as shown, the inner decorative ring 944 may not extend into the hole (e.g., the entire or substantially the entire inner decorative ring 944 may be outside the hole). The inner decorative ring 944 can be attached to the outer decorative ring 943 in various ways. For example, an adhesive 947 can adhere the inner decorative ring 944 to the mounting surface 946. In other examples, instead of or in addition to an adhesive, the inner decorative ring 944 may be attached via welding, brazing, mechanical interlocking features (e.g., threads), fasteners, etc. The discussion of other aspects of the decorative rings described herein (e.g., materials, attachment techniques, colors, etc.) is equally applicable to decorative rings 943 and 944.

[0328] Figure 9FAn exemplary decorative assembly including an inner decorative ring 952 and an outer decorative ring 951 is shown. The outer decorative ring 951 may include a structural member 954 and an outer housing 953. The structural member 954 may define a flange portion and an outer portion, and the outer housing 953 may be coupled to the outer portion (or other portions of the structural member 954) and may define an outer surface of the outer decorative ring 951 visible from the outside of the device. The structural member 954 and the outer housing 953 may be formed of different materials. For example, the structural member 954 may be formed of a polymer material, while the outer housing 953 may be formed of a metallic material. In such cases, the structural member 954 and the outer housing 953 may be joined together via an insert molding process. For example, the outer housing 953 may be positioned in a mold cavity, and polymer material may be introduced into the mold to engage the outer housing 953 and form the shape of the structural member 954. In some cases, the outer housing 953 may be a coating, a plating layer (e.g., a metallic plating layer), a deposited coating (e.g., a PVD or CVD coating), etc. Structural component 954 and outer housing 953 may have different colors. For example, structural component 954 may have a color that matches or substantially matches the color of a coating (e.g., coatings 935, 934) positioned on the surface of the rear cover 272, thereby providing a uniform appearance through the rear cover 272. The discussion of other aspects of the decorative rings described herein (e.g., materials, attachment techniques, colors, etc.) is equally applicable to decorative rings 951, 952.

[0329] Figure 9G It shows Figure 9A A detailed view of the decorative component 904 shows the inner decorative ring 912 and the outer decorative ring 910. The outer decorative ring 910 defines a junction surface 957 positioned on (in contact with) the rear outer surface of the rear cover 272, as shown. The outer decorative ring 910 further defines an outer peripheral surface 956 and a chamfered surface 955, the outer peripheral surface having a first texture, and the chamfered surface extending from the junction surface 957 to the outer peripheral surface 956 and having a second texture different from the first texture. In some cases, the first texture of the outer peripheral surface 956 has a lower surface roughness than the second texture. In some cases, the outer peripheral surface 956 has a polished appearance, and the chamfered surface 955 has a textured or unpolished appearance. The chamfered surface 955 may be subjected to texturing processes such as blasting (e.g., beading, sandblasting, etc.), machining, grinding, etching, or another suitable process to produce the desired texture. The outer peripheral surface 956 may be subjected to polishing processes to produce the desired texture of the outer peripheral surface 956. In some cases, different textures, and specifically, the higher surface roughness of the chamfered surface 955 relative to the outer peripheral surface 956, can result in a reduced appearance of the height of the outer decorative ring 910 (e.g., the distance the outer decorative ring 910 extends across the outer surface of the back cover 272).

[0330] The chamfered surface 955 may define an angle 958 relative to the outer peripheral surface 956. The angle 958 may be less than 45 degrees. In such cases, the chamfered region defined by the chamfered surface 955 may have a width greater than its length (e.g., along the perimeter). Figure 9G The horizontal dimension shown is greater than the height (e.g., along the horizontal dimension). Figure 9G (The vertical dimensions are shown). In other words, an angle of 95° can produce a chamfered area with a height greater than its depth. In some cases, the height of the chamfered area can be from about 0.25 mm to about 0.40 mm, and the width of the chamfered area can be from about 0.10 mm to about 0.20 mm.

[0331] Figure 9H A portion of device 980 is shown, which may be Figure 2 An implementation of device 200 is shown, illustrating a portion of a backward sensor array. Figure 9H The view shown corresponds to a view of the device with the front cover assembly removed. Device 980 includes a wall structure 986 and a camera bracket 985 positioned within the wall structure 986.

[0332] Wall structure 986 may at least partially surround camera bracket 985. For example, wall structure 986 may define a first wall section 982 that extends along a first side of camera bracket 985 and is positioned between camera bracket 985 and top sidewall 981 of housing component. Wall structure 986 may further define a second wall section 984 that extends along a second side of camera bracket 985 and is positioned between camera bracket 985 and lateral sidewall 991 of housing component. Wall structure 986 may further define a third wall section 988 that extends along a third side of camera bracket opposite to the first side and is positioned between camera bracket and battery 987. Wall structure 986 may further define a fourth wall section 989 that extends along a fourth side of camera bracket 988 opposite to the second side and is positioned between camera bracket and another internal component or structure (e.g., speaker module).

[0333] A first bias spring 983 and a second bias spring 990 may be positioned along a first side and a second side of the camera bracket 985, respectively. The first bias spring 983 and the second bias spring 990 may be coupled to a wall section of the wall structure 986 and positioned between the wall section and the camera bracket 985, such that these bias springs impart a biasing force between the wall section and the camera bracket 985. For example, the first bias spring 983 biases the camera bracket toward the battery 987 in a first direction (e.g., downwards away from the top sidewall 981 of the device), and the second bias spring 990 biases the camera bracket 985 toward the sidewall 991 of the device. In some cases, the second bias spring 990 may bias the camera bracket 985 in the opposite direction (e.g., it may be positioned between the second wall section 991 and the camera bracket 985). The second bias spring 990 may bias the camera bracket 985 in a direction transverse to the first direction.

[0334] As described above, the device may include a forward-facing sensor region positioned along the front of the device. Figure 10A An exemplary device 1000 having this configuration is shown. Device 1000 may correspond to or be an implementation of electronic device 100, 200 or any other device described herein.

[0335] Device 1000 includes a forward sensor region 1002, which may correspond to or be about Figure 1A An embodiment of the forward sensor region 111 is described. The forward sensor region 1002 may appear as a pill-shaped region along the display 1009 of the device. The forward sensor region 1002 may appear as a non-functional area of ​​the display 1009 and may be completely surrounded by the functional area of ​​the display.

[0336] As described herein, the forward sensor region 1002 can provide both input and output functionality for the device 1000. For example, the forward sensor region 1002 may include sensors such as a facial recognition system and a forward-facing camera. Additionally, as described herein, the forward sensor region 1002 may include a supplementary display region 1012, which may appear to be part of a non-graphical area of ​​the display but is actually used to provide graphical output to the user. For example, as described herein, the supplementary display region 1012 may be used to selectively generate graphical output (such that the graphical output is displayed within the forward sensor region 1002). When no graphical output is generated, the supplementary display region 1012 in the forward sensor region 1002 may appear to be the same as or similar to the non-graphical area (e.g., a portion of the display below that is covered).

[0337] A forward-facing sensor region 1002 may be at least partially defined by one or more apertures formed through the display to allow optical components such as a forward-facing camera 1007 and a facial recognition system (which may include an optical transmitter 1008 and an optical receiver 1006) to pass through the display. For example, a first aperture 1004 may be formed through the display (e.g., through all or a subset of layers in a display stack), and the forward-facing camera 1007 may be positioned relative to the first aperture 1004 such that the camera 1007 can capture an image through the front cover 1001 of the device 1000. A second aperture 1005 may be formed through the display (e.g., through all or a subset of layers in a display stack), and the optical transmitter 1008 and optical receiver 1006 may be positioned relative to the second aperture 1005 such that infrared light can be emitted and received through the front cover 1001 of the device 1000. As described herein, the optical transmitter 1008 may be an infrared illuminator module, and the optical receiver 1006 may be an infrared image capture device.

[0338] In some cases, the forward sensor region 1002 may include one or more masks, coatings, and / or other materials or treatments to define the boundaries of the forward sensor region 1002 and to obscure the visibility of internal components of the device through the forward sensor region 1002. For example, masks 1010, 1011 may be applied to the cover 1001 to provide a substantially uniform appearance to the forward sensor region 1002 and / or to block the visibility of the device through the forward sensor region 1002. Masks 1010, 1011 may be positioned on the inner surface of the front cover 1001 in the area where the second hole 1005 and the first hole 1004 of the display are located. In some cases, the display overlay overlaps with the masks 1010, 1011 behind the mask, such that the masks 1010, 1011 obscure or block the visibility of openings in the display. Mask 1010 may define one or both holes above the optical emitter 1008 and the optical receiver 1006. For example, mask 1010 may define a single aperture surrounding both optical transmitter 1008 and optical receiver 1006, or define a separate aperture for each of optical transmitter 1008 and optical receiver 1006. Mask 1011 may define a single aperture surrounding forward-facing camera 1007.

[0339] Furthermore, a coating that is substantially visually opaque but at least partially transparent to infrared light may be applied to the cover 1001 over the optical emitter 1008 and the optical receiver 1006. The forward sensor region 1002 may be configured such that when the display 1009 is in an inactive state (e.g., unlit and / or generating graphic output), the forward sensor region 1002 and the display appear to be substantially continuous. In other words, when the display 1009 is inactive, there may be little or no discernible visual difference between the display 1009 and the forward sensor region 1002. To achieve this, the visually opaque infrared-transmitting coating and mask 1010 may be designed to have similar optical properties (e.g., color, reflectivity, opacity, etc.) to the display when it is inactive.

[0340] As described herein, the forward sensor region 1002 may include sensors, such as a facial recognition system and a forward-facing camera. Additionally, as described herein, the forward sensor region 1002 may include a supplementary display region 1012, which may appear to be part of a non-graphical area of ​​the display but can actually be used to provide graphical output to the user. For example, graphical output generated by the display 1009 (e.g., the graphical user interface of the device's operating system and / or applications) may not extend into or be displayed by the supplementary display region 1012. However, the supplementary display region 1012 may be used to display icons, glyphs, lights, or other graphical output to provide information to the user. As a non-limiting example, an indicator 1013 may be displayed in the supplementary display region 1012 to notify the user of an event or the status of the device. For example, the indicator 1013 may indicate that a new message has been received (e.g., an email, text message, application notification), or it may indicate that the forward-facing camera or facial recognition sensor is active.

[0341] Figure 10AThe dashed line in the diagram illustrates the boundary between the supplementary display area 1012 and the main effective area of ​​the display 1009. This boundary can be a programming boundary (e.g., the display 1009 does not display the main graphic output within this boundary) or a physical or optical boundary (e.g., it can be defined by a coating, ink, etc.). In some cases, substantially the entire supplementary display area 1012 is defined by a mask that covers and blocks the display but defines one or more apertures that allow light from the display to pass through to produce graphic output within the supplementary display area 1012. For example, an indicator 1013 may be indicated or defined by an aperture through an opaque mask positioned above the display. For example, a supplementary display area mask may be positioned between masks 1010, 1011 and above the effective portion of the display. The supplementary display area mask may define an aperture, and the indicator 1013 may appear to be illuminated when the area of ​​the display below is illuminated. The supplementary display area mask may be part of a series of masks (which may define masks 1010, 1011 and the supplementary display area mask). In other examples, the supplementary display area mask may be a mask different from masks 1010 and 1011 (e.g., formed of one or more different materials and / or layers).

[0342] Furthermore, the forward sensor area 1002 or a portion thereof may be touch and / or force sensitive, allowing a user to provide touch input to the forward sensor area 1002. For example, touching or tapping the forward sensor area 1002 may launch a camera application on the device 1000. Similarly, when a notification is active in the supplementary display area 1012, touching or tapping the forward sensor area 1002 may display an application or other information related to that notification on the device.

[0343] Figure 10A Other features of the front portion of the device 1000 are shown. For example, the device 1000 may include a speaker port 1014 positioned between the cover 1001 and the housing 1003. This may correspond to or be... Figure 1AIn one embodiment of speaker port 110, speaker port 1014 may be positioned outside the effective area of ​​display 1009, and speaker port may be defined on at least a first side by a notch formed in cover 1001 and on at least a second side by housing 1003. A grid element or other protective structure may be positioned within speaker port 1014 to prevent debris from entering device 1000. Speaker assembly 1099 may be positioned below front cover 1001 and may be coupled to audio channel 1040, which is configured to transmit audio from speaker assembly 1099. Audio channel 1040 may extend from speaker assembly 1099 to speaker port 1014. Sound may travel through audio channel 1040, as shown by path 1015, to exit the device and be audible to a user. Device 1000 may also include microphone 1020 positioned within the device and configured to receive sound through speaker port 1014.

[0344] F-EF229573

[0345] The device 1000 may also include an ambient light sensor 1018, which may be positioned outside the forward sensor area 1002 and below the display 1009 (e.g., such that the ambient light sensor 1018 captures light passing through the display stack in the effective area of ​​the display).

[0346] Device 1000 may also include a proximity sensor 1016, which may be positioned outside the forward sensor region 1002 and below the display 1009 (e.g., such that the proximity sensor 1016 emits and / or receives light across the display overlay in the effective area of ​​the display to detect the proximity of an object to the device). The proximity sensor 1016 is operable (e.g., emitting light and receiving reflected light) when the display overlay is active (e.g., effectively displaying graphic output).

[0347] Figure 10B It shows Figure 10ARegions 10B-10B in the diagram illustrate details of the proximity sensor 1016 and its relationship to the display 1009. The proximity sensor 1016 may include an optical emitter 1032 (e.g., a laser emitter) configured to emit light onto an object and an optical receiver 1034 configured to receive and / or detect light reflected from the emitter by the object. The optical emitter 1032 may emit light with wavelengths ranging from about 1300 nanometers (nm) to about 1400 nm. In some cases, the optical emitter 1032 emits light with a wavelength of 1370 nm. The wavelength of the optical emitter 1032 may be selected to reduce or minimize the degree to which the light emission of the optical emitter 1032 interferes with the display 1009. For example, certain wavelengths of light (e.g., from about 900 nm to about 1000 nm) may cause optical artifacts on the display 1009 (or otherwise make them visible on the front of the device). Therefore, when the optical emitter 1032 emits light, the selected wavelength (e.g., in the range of about 1300 nm to about 1400 nm) can reduce or eliminate visible artifacts (e.g., flicker, bright spots, distortion, etc.) at the front of the device.

[0348] In some cases, the optical emitter 1032 and the optical receiver 1034 are positioned diagonally relative to the trace grid or pattern in the display stack. For example, the display stack may include a first set of conductive traces 1030 oriented perpendicular to the second set of conductive traces 1031 (e.g., forming a trace grid). For simplicity, three conductive traces in each set of conductive traces (1030-1, 1030-2, 1030-3 and 1031-1, 1031-2, 1031-3) are shown; however, these conductive traces are only a portion of the conductive traces present in the display stack. The conductive traces may be electrodes for touch sensors, electrodes for display components, or electrodes for other purposes. In the case of a display component, the first set of conductive traces 1030 or the second set of conductive traces 1031 may be a set of anodes for an OLED display, and the first set of conductive traces 1030 or the second set of conductive traces 1031 may be a set of cathodes for an OLED display. The conductive traces can be optically transmissive (e.g., transparent) conductive traces and can be formed from indium tin oxide (ITO), silver nanowires, conductive polymers, etc., and can be positioned on the substrate of the display.

[0349] In some cases, the optical receiver 1034 may be positioned diagonally opposite the optical transmitter 1032 relative to the trace grid formed by the first trace 1030 and the second trace 1031. This arrangement can reduce or minimize the optical effects of the traces, such as the traces reflecting light emitted from the optical transmitter 1032 into the optical receiver 1034. For example, Figure 10BA pair of conductive traces 1030-1 and 1031-1 intersect above optical emitter 1032. When optical emitter 1032 emits light, the light can be reflected by and / or propagated along conductive traces 1030-1 and 1031-1. If optical receiver 1034 is positioned relative to optical emitter 1032 along either conductive trace 1030-1 or 1030-2, the light reflected by and / or propagated along these conductive traces can be detected by optical receiver 1034, which may negatively affect the signal-to-noise ratio of proximity sensor 1016. More specifically, proximity sensor 1016 can determine the proximity of an object (e.g., a user's face, the inside of a user's pocket, etc.) to the device by emitting light from optical emitter 1032 and receiving the reflected portion of that light at optical receiver 1034. If light from optical emitter 1032 leaks into optical receiver 1034 (e.g., due to reflection via conductive traces or otherwise guided to optical receiver 1034), it may impair the optical receiver 1034's ability to distinguish leaked light from light reflected from external objects (e.g., potentially increasing the signal-to-noise ratio). By positioning optical receiver 1034 along a direction oblique to traces 1030, 1031, the amount of trace passing over both optical emitter 1032 and optical receiver 1034 can be reduced. In some cases, traces 1030, 1031 are not positioned over both optical emitter 1032 and optical receiver 1034. In some cases, optical receiver 1034 and optical emitter 1032 may be positioned at approximately 40 to 50 degrees relative to either trace 1030 or trace 1031. In some cases, optical emitter 1032 may be positioned at approximately 45 degrees relative to trace 1030 or trace 1031. In some cases, the optical transmitter 1032 and the optical receiver 1034 are positioned below portions of the display where no traces exist (e.g., gaps in the trace grid).

[0350] Optical emitter 1032 and optical receiver 1034 may be positioned below apertures 1028 and 1026 defined through a backing layer of display 1009, respectively. The backing layer may be a sheet or layer of metal (or other material) as part of a display stack. The backing layer may be opaque, thus providing optical pathways for optical emitter 1032 and optical receiver 1034 through apertures 1028 and 1026. Optical emitter 1032 and optical receiver 1034 may emit and receive light through portions of display 1009 located above the emitter and receiver, respectively, and through apertures 1028 and 1026.

[0351] In some cases, aperture 1026 (for optical receiver 1034) has a larger dimension than aperture 1028. Aperture 1026 may also be shaped to minimize or reduce crosstalk between optical emitter 1032 and optical receiver 1034. For example, aperture 1026 may become narrower where it is closest to optical emitter 1032 and wider further away from optical emitter 1032, thus presenting a smaller opening near the emitter where light is more likely to be reflected into the receiver by the display and / or cover. Aperture 1026 may have a first side 1042 extending in an inclined direction (relative to the conductive trace) and a second side 1044 extending in a different inclined direction (relative to the conductive trace) to define the tapered shape of aperture 1026 (e.g., gradually narrowing from a wider end away from aperture 1028 to a narrower end closer to aperture 1028).

[0352] The proximity sensor 1016 may include a housing 1024 and may be positioned near a bracket structure 1022 within the device. The bracket structure 1022 may be a bracket structure for a rear-facing camera or sensor array. The bracket structure 1022 may define an angled wall segment 1046 positioned obliquely to traces 1030, 1031. The housing 1024 may define a wall segment 1048, also obliquely to traces 1030, 1031, and parallel to wall segment 1046 (and separated from wall segment 1046 by a gap). The angled wall segments 1046, 1048 allow the proximity sensor 1016 to be positioned near the bracket structure 1022 while still providing sufficient target clearance between components. Furthermore, the angled wall sections 1046, 1048 allow the proximity sensor 1016 and the bracket structure 1022 to be positioned closer to each other than if either or both components had full corners, which could ultimately reduce the overall width of the device or otherwise allow for more space within the device for other components.

[0353] Figure 11A A partial exploded view of device 1100 is shown. Device 1100 may correspond to or be an embodiment of electronic devices 100, 200, or any other device described herein. Figure 11A Various components of a forward sensor region, such as forward sensor region 1002, are shown. Device 1100 may also include a front cover 1101, which may correspond to or be an embodiment of front cover 1101 or another front cover described herein. Front cover 1101 may include one or more opaque shields, including shields 1140, 1138, and 1139. Shield 1140 may define and / or extend around the outer periphery of the effective display area of ​​the display. Shield 1138 may define or extend around a window region 1136 through which components of the facial recognition system (e.g., optical transmitter 1008 and optical receiver 1006) may emit and / or receive light. As described above regarding... Figure 10A The shield 1138 may define a single opening for both the optical transmitter and the optical receiver (e.g., Figure 11A (As shown) or define separate openings for each of the optical transmitter and optical receiver. As described herein, a visually opaque infrared-transmitting coating 1160 may be applied to the inner surface of the front cover 1101 in the window region 1136. A shield 1139 may define or extend around the window region 1137, through which a forward-facing camera (e.g., camera 1007) may receive light passing through.

[0354] Masks 1138, 1139, and 1140 may be formed of or comprise the same material or combination of materials (optionally including multiple material layers). In some cases, the masks may be formed of or comprise different materials or combinations of materials. For example, mask 1138 may be formed of a different material (or combination of materials) than mask 1140. Masks 1138, 1139, and 1140 may be formed of or comprise inks, paints, dyes, deposited coatings (e.g., CVD coatings, PVD coatings, etc.). In some cases, one or more masks may be formed of a transparent polymer (optionally defining a surface texture) and inks, dyes, or other opaque coatings (e.g., applied to a textured surface). Figure 12G An exemplary mask is shown, having a light-transmitting (e.g., transparent) polymer and an opaque coating. Masks 1138, 1139, 1140 (and optional, additional masks) may be positioned between the front cover 1101 and any edge region of the display 1141 to mask the edges of the display.

[0355] Display 1141 may be attached to front cover 1101, such as with adhesive, and front cover 1101 may be attached to frame 1142 (e.g., corresponding to or for the embodiment of frame 204). Figure 2 The display 1141 may include apertures 1104 and 1105 formed therethrough. Apertures 1104 and 1105 may correspond to or be used with an optical transmitter 1108, an optical receiver 1106, and a camera 1107 (which may correspond to or be used with...). Figure 10A The optical transmitter 1008, optical receiver 1006, and camera 1007, or other corresponding components described herein, are aligned (and provided with an optical path through the display for them).

[0356] Device 1100 may include a light-suppressing structure for suppressing light emitted from optical emitter 1108 from being reflected through front cover 1101 toward optical receiver 1106 (e.g., causing crosstalk or otherwise reducing the signal-to-noise ratio). For example, as described herein, device 1100 may include an upper light-absorbing structure 1143 comprising a portion positioned between optical emitter 1108 and optical receiver 1106 (and optionally defining two apertures, one for optical emitter 1108 and the other for optical receiver 1106). Upper light-absorbing structure 1143 may be formed of foam, polymer structure, ink layer, paint, coating, etc. In some cases, upper light-absorbing structure 1143 may be attached to the inner surface of front cover 1101 via adhesive 1155. In some cases, lower light-absorbing structure 1144 may be attached to bracket 1145 to which optical emitter 1108 and optical receiver 1106 are also attached. The light-absorbing structures 1143, 1144 and the adhesive 1155 may be configured to block and / or absorb light, as described herein.

[0357] Figure 11B For along Figure 11AThe image shows a partial cross-sectional view of device 1100 observed along lines 11B-11B. As described above, optical emitter 1108 may be configured to illuminate an object, such as a user's face, and optical receiver 1106 may receive a portion of the light reflected from the user's face (e.g., for biometric identification of the user for authentication or other purposes). Light emitted by optical emitter 1108 passes through a front cover 1101 above optical emitter 1108, and a reflected portion of this light also passes through the front cover 1101 above optical receiver 1106. However, a portion of the light emitted from optical emitter 1108 may be reflected or propagated through cover 1101 in some cases, as shown by light 1146. If light 1146 is ultimately received by optical receiver 1106, it may interfere with the operation of optical receiver 1106, such as by reducing the signal-to-noise ratio, or otherwise distorting or interfering with the image received by optical receiver 1106. Therefore, the light-absorbing features, including light-absorbing structures 1143, 1144 and adhesive 1155, can absorb, block, or otherwise interfere with the propagation of light 1146 through the interior of cover 1101. For example, adhesive 1155 may be formed of or include light-absorbing materials, such as light-absorbing ink, light-absorbing particles, etc. Adhesive 1155 may be a pressure-sensitive adhesive film, a heat-sensitive adhesive film, a liquid adhesive, etc. Upper light-absorbing structure 1143 may be formed of or include light-absorbing materials, such as light-absorbing ink, light-absorbing particles, etc. In some cases, upper light-absorbing structure 1143 is compliant (e.g., foam material), causing optical emitter 1108 and optical receiver 1106 to slightly deform the structure, thereby sealing the optical emitter 1108 and optical receiver 1106 against upper light-absorbing structure 1143. Adhesive 1155 may adhere to a visually opaque infrared-transmitting coating 1160, which may be positioned in the window area 1136 of the front cover 1101.

[0358] The lower light-absorbing structure 1144 may be positioned below the upper light-absorbing structure 1143 and may be configured to absorb (or otherwise not reflect) other light incident upon it. For example, some light may pass through the upper light-absorbing structure 1143, and the lower light-absorbing structure 1144 may absorb some of that light, thereby reducing the amount of light reflected within the system that can ultimately be received by the optical receiver 1106. The lower light-absorbing structure 1144 may be formed of or include light-absorbing inks, light-absorbing coatings, light-absorbing particles, light-absorbing films, or coatings.

[0359] The visually opaque infrared-transmitting coating 1160, adhesive 1155, and upper light-absorbing structure 1143 (and / or other light-absorbing materials or layers in the stack) may have a refractive index substantially similar to that of the front cover 1101. By selecting materials with similar refractive indices, light reflected within the materials of the cover 1101 (e.g., light 1146) may be more likely to penetrate through the interfaces between the materials rather than undergoing internal reflection. By allowing light to pass through the cover 1101 (and into the adhesive 1155 and upper light-absorbing structure 1143), the amount of light ultimately propagating toward and entering the optical receiver 1106 is reduced. In some cases, the refractive index of the visually opaque infrared-transmitting coating 1160, adhesive 1155, and upper light-absorbing structure 1143 may differ from the refractive index of the front cover 1101 by less than about 10%, less than about 7%, less than about 5%, less than about 2%, or less than about 1%. In some cases, the adhesive 1155 and upper light-absorbing structure 1143 may comprise a light-absorbing medium within the matrix. In such cases, the matrix may have a refractive index substantially similar to that of the cap 1101 (or an adjacent layer in the stack), and the light-absorbing medium may have a more significantly different refractive index.

[0360] Figure 11C Another exemplary arrangement of light-absorbing materials and / or structures within device 1100 is shown. Figure 11C In the example shown, the light-absorbing layer 1150 may be positioned on the inner surface of the cover 1101, and a visually opaque infrared-transmitting coating 1151 may be positioned above the light-absorbing layer 1150 (e.g., such that the coating 1151 covers the window area 1136). The light-absorbing layer 1150 may be located between the cover 1101 and the coating 1151. In some examples, the coating 1151 may not cover the light-absorbing layer 1150, or may only partially cover the light-absorbing layer 1150. The light-absorbing layer 1150 may be an ink, dye, paint, deposited coating (e.g., a CVD or PVD coating), or a combination thereof. The light-absorbing layer 1150 may also include a light-absorbing medium in a matrix material. The light-absorbing layer 1150 may have a refractive index substantially similar to that of the cover 1101, as described above regarding other light-absorbing materials.

[0361] Figure 11D Another exemplary arrangement of light-absorbing materials and / or structures within device 1100 is shown. Figure 11D In the example shown, the light-absorbing layer 1152 may be positioned beneath the visually opaque infrared-transmitting coating 1160 on the cover 1101. The light-absorbing layer 1152 may be an ink, dye, coating, deposited coating (e.g., CVD or PVD coating), light-absorbing adhesive, light-absorbing foam, or a combination thereof. The light-absorbing layer 1152 may also include a light-absorbing medium in the matrix material. The light-absorbing layer 1152 may have a refractive index substantially similar to that of the cover 1101 and the visually opaque infrared-transmitting coating 1151, as described above regarding other light-absorbing materials.

[0362] Figure 11E Additional techniques for absorbing light propagating from the optical emitter 1108 through the interior of the cover 1101 to the optical receiver 1106 are illustrated. For example, the cover 1101 may include an internal light-absorbing feature 1156 (referred to herein as internal feature 1156). In some cases, the internal feature 1156 may be a mark formed within the material of the cover 1101 via laser marking. The mark may be a darkened portion of the material in the cover 1101 or a void formed in the cover 1101. The mark may be formed as a three-dimensional pattern configured to reduce horizontal (e.g., as...) Figure 11E The markings are formed by light transmission and / or internal reflection on the inner surface of the cover 1101 (as directed in the center), while minimizing or almost eliminating their impact on the visual appearance of the markings when viewed from the front of the device. The markings may be formed as a predetermined three-dimensional pattern, or they may be formed as a random or pseudo-random pattern. In some examples, the markings may be formed as a substantially planar array perpendicular to the inner surface of the cover 1101 (e.g., ...). Figure 11E The internal feature 1156 extends (in a directional manner) to the outer surface of the cover 1101. The internal feature 1156 can be other types of features and can be formed in different ways. For example, the internal feature 1156 can be ions introduced into the cover 1101 via a chemical bath. Alternatively, the internal feature 1156 can be a localized pigment within the cover 1101. The internal feature 1156 can block, absorb, reflect, or otherwise interfere with light propagating through the cover 1101 toward the interior of the optical receiver 1106.

[0363] In some cases, the cover 1101 may include a textured region 1157. The textured region 1157 may cause light that would otherwise be reflected from the inner surface of the cover 1101 to be absorbed, reflected in different directions (e.g., away from the optical receiver 1106), directed out of the cover 1101 (e.g., toward the interior of the device, and optionally toward a light-absorbing material, such as light-absorbing foam 1158), or otherwise interfered with. The texture of the textured region 1157 may be formed via laser processing, chemical etching, blasting, machining (e.g., grinding, polishing), or any other suitable technique.

[0364] about Figures 11A to 11E The described light-absorbing components, materials, features, structures, and other technologies can be used alone or in combination with other technologies. For example, in Figure 11B In the example shown, the internal light-absorbing features can also be included in the cover 1101. For example, Figure 11B The light-absorbing adhesive 1155 and light-absorbing structure 1143 shown may be included Figure 11CIn the example shown, the light-absorbing layer 1150 is positioned between the cover 1101 and the infrared-transmitting coating 1151. Other combinations of the described components, materials, features, structures, and other techniques are also considered.

[0365] As described herein, light-absorbing materials or structures may be configured to absorb light by their presence in a device. The light-absorbing materials and / or structures described herein may have absorbance values ​​greater than about 0.5, greater than about 0.75, greater than about 1.0, greater than about 1.5, or another suitable absorbance value (e.g., the logarithm of the ratio of incident radiation power to radiation power transmitted through the material or structure).

[0366] Figure 12A An exemplary configuration showing layers in a stack within a region of the forward sensor region 1002 is illustrated. Figure 12A As shown, the dashed line defining the periphery of the forward sensor region 1002 may correspond to the periphery of a mask (e.g., ink, dye, coating, etc.) positioned on the cover (e.g., along the bottom surface or inner surface). For example, the dashed line defining the periphery of the forward sensor region 1002 may correspond to... Figure 11A The outer periphery of the shield 1138 (which can be positioned along the inner surface of the cover and positioned between the cover and the display). The shield can extend to boundary 1206. In some cases, the shield can extend to the line defining the optical transmitter 1008, the optical receiver 1006 and the forward camera 1007, or extend to another location within the forward sensor area 1002.

[0367] Boundary 1202 may define the boundary of an area in the display that includes effective display pixels (e.g., pixels used by the device to generate graphic output). As described above, in some cases, device 1000 may include a supplementary display area 1208 between components of the forward sensor area 1002 (e.g., between the forward camera 1007 and the facial recognition system). Supplementary display area 1208 may include effective pixels that can be used to display graphic output (such as icons, shapes, indicator lights, etc.). Supplementary display area 1208 may also be touch and / or force sensitive. For example, supplementary display area 1208 may include all layers in the display stack, including any touch and / or force sensitive layers and graphic-effective layers. Supplementary display area 1208 may serve as a functionally and / or physically distinct input and output area. For example, the display may typically define an area outside (e.g., around) the forward sensor area 1002 that includes a first touch-sensitive area and a first display area. Within the forward sensor region 1002, the display may typically define a second touch-sensitive region (e.g., display pixels at or near the boundary of the forward sensor region 1002 and / or in the supplementary display region) and a second display region (e.g., supplementary display region 1208).

[0368] Boundary 1204 may define the boundary of the effective touch-sensitive area of ​​the display stack. In other words, the area between 1202 and 1204 may correspond to one or more touch-sensing components, such as layers in the display stack that can sense touch input (e.g., one or more electrode layers or other touch-sensitive components defining touch pixels). Therefore, as Figure 12A As shown, the effective touch-sensitive area of ​​the display stack extends beyond the effective display pixels in the forward sensor area 1002, and defines an extended touch-sensitive area 1203 within the forward sensor area 1002. The extended touch-sensitive area 1203 can be positioned on a mask (e.g., ink, dye, coating, etc., such as...). Figure 11A Below the mask 1138, which is positioned on the cover to at least partially define the forward sensor region 1002. By extending the effective touch-sensitive region 1203 into the forward sensor region 1002 and beyond the effective display pixels, the forward sensor region 1002 can exhibit improved touch sensing responsiveness. For example, the additional touch-sensitive area within the forward sensor region 1002 reduces the area of ​​the forward sensor region 1002 without touch-sensing components (e.g., electrodes or touch pixels). In some cases, the area of ​​the forward sensor region 1002 without touch-sensing components is less than about 0.25 square inches. In some cases, as described herein, the forward sensor region 1002 can sense touch input applied thereto even when touch input is applied to or covers the area of ​​the forward sensor region 1002 without touch-sensing components. Figures 13A to 13F The touch sensitivity of the forward sensor area 1002 is further illustrated.

[0369] In some cases, the touch pixel and / or electrode pattern near boundary 1204 (e.g., closest to the hole formed through the display stack) may differ from the touch pixel and / or electrode pattern elsewhere in the display (e.g., in the main display area). For example, the touch pixel and / or electrode pattern near boundary 1204 (e.g., the touch-inactive area surrounding the forward sensor area 1002) may have different sizes, shapes, arrangements, patterns, distributions, or other characteristics than the touch pixel and / or electrode patterns in the main display area.

[0370] Boundary 1206 may define the boundary of an ineffective area of ​​the display stack (e.g., an area that does not produce graphic output and is not touch and / or force sensitive). In other words, the area between 1204 and 1206 may correspond to one or more layers in the display stack that are ineffective and do not produce graphic output or sense touch input. For example, the display stack may include layers and / or materials that do not sense touch or produce graphics, such as light diffusers, polarizers, adhesives, etc. Such layers may extend beyond the effective display area and effective touch-sensitive area of ​​the display. In some cases, boundary 1206 corresponds to (e.g., defines) a hole formed through the display stack to provide an unobstructed optical path through the component in the forward sensor area 1002 to the cover. In other words, line 1206 may correspond to an edge of the display stack.

[0371] As described herein, although no touch-sensing components are present in any region of the forward sensor region 1002, touch sensing functionality can still be provided within the forward sensor region 1002. For example, as described above, holes formed through the display stack to accommodate optical components (e.g., optical emitters, receivers, cameras) do not have a touch-sensing layer. However, even when a touch is centered over a portion of the forward sensor region 1002 without touch-sensing components (e.g., over the holes for optical components), the device can detect touch input applied to the forward sensor region 1002. For example, the touch-sensing layer of the display may include touch pixels (e.g., formed by or including touch-sensing electrodes) that detect or facilitate the detection of touch input, such as via capacitive coupling between the finger and the pixels. When a user touches a region of the forward sensor region 1002 without touch pixels, such as directly above the optical emitter 1008, optical receiver 1006, or camera 1007, touch pixels positioned around the periphery of the forward sensor region 1002 in the display can capacitively couple with the user's finger. The electrical response of peripheral touch pixels to touch input in the forward sensor region 1002 may differ from the electrical response of touch pixels in the main display region to conventional touch input. For example, peripheral touch pixels may detect less capacitive coupling and / or a smaller area of ​​capacitive coupling compared to the detectable capacitive coupling for conventional touch input in the main display region.

[0372] To facilitate the detection of touch input in the forward sensor region 1002, exemplary input can be provided to the exemplary forward sensor region 1002 to determine whether an electrical response is detected in response to the exemplary input. For example, a series of taps, touches, gestures (e.g., swipes), etc., in different areas of the forward sensor region 1002 can be provided, and the electrical responses of surrounding touch pixels to each touch can be recorded. The device can then be configured to recognize that a particular electrical response (e.g., a capacitance change detected by a set of touch pixels) corresponds to a particular input. In some cases, the exemplary input can be used to train a machine learning model, which is then used by the device to detect input. For example, signals or other information or electrical characteristics from touch pixels can be provided to the machine learning model (which is trained using the exemplary input), and the machine learning model determines whether these signals or other information / characteristics indicate a touch input.

[0373] In some cases, a device may employ different touch sensing schemes in different areas of the display. For example, in the main display area (e.g., all locations except for the forward sensor area 1002), the device may employ a first touch sensing scheme, and near the forward sensor area 1002, the device may employ a second touch sensing scheme. The first touch sensing scheme may be a conventional touch sensing scheme, such as one in which the face center of the touch input is determined based on electrical characteristics detected at a set of touch pixels. The second touch sensing scheme may employ a machine learning model, in which signals or other information or electrical characteristics from touch pixels near the forward sensor area 1002 may be fed to the machine learning model, which then determines whether these signals or other information / characteristics indicate a touch input.

[0374] Figure 12B Another example configuration showing layers in a stack in the forward sensor region 1211 of device 1210 is illustrated. Device 1210 may correspond to or be an embodiment of device 1000. Figure 12B As shown, the dashed line defining the periphery of the forward sensor region 1211 may correspond to the periphery of a mask (e.g., ink, dye, coating, etc.) positioned on the cover (e.g., along the bottom surface or inner surface). For example, the dashed line defining the periphery of the forward sensor region 1211 may correspond to... Figure 11A The mask 1138 (which can be positioned along the inner surface of the cover and positioned between the cover and the display) is used. Additionally, the boundary 1212 can define the boundary of the area in the display that includes effective display pixels (e.g., pixels used by the device to generate graphic output). In this example, the boundary 1212 can be... Figure 12A The boundaries depicted in the text are the same.

[0375] Boundary 1214 can define the boundary of the effective touch-sensitive area of ​​the display layer. Therefore, as Figure 12BAs shown, the effective touch-sensitive area of ​​the display stack extends between the optical emitter 1008 and the optical receiver 1006, thereby increasing the touch-sensitive area within the forward sensor region 1211 (e.g., with...). Figure 12A (Compared to). In other words, the forward sensor region 1211 has a separate aperture through the display stack for each optical component of the forward sensor region 1211, thereby increasing the touch-sensitive area of ​​the forward sensor region 1211. This configuration also reduces the proportion of the area within the forward sensor region 1211 that does not contain touch-sensing components (e.g., electrodes), which can improve the overall touch sensitivity or touch responsiveness of the forward sensor region 1211. A portion of the touch-sensitive region of the display stack extending between the optical emitter 1008 and the optical receiver 1006 may define a supplementary touch-sensitive region 1213.

[0376] Similar to Figure 12A Boundary 1216 may define the boundaries of non-functional areas of the display stack (e.g., areas that do not produce graphic output and are not touch and / or force sensitive). Thus, as described above, boundary 1216 may correspond to a hole formed through the display stack to provide an unobstructed optical path through the component in the forward sensor region 1211 to the cover.

[0377] Figure 12C Another example configuration showing layers in a stack within the forward sensor region 1221 of device 1220 is illustrated. Device 1220 may correspond to or be an embodiment of device 1000. Figure 12C As shown, the dashed line defining the periphery of the forward sensor region 1221 may correspond to the periphery of a mask (e.g., ink, dye, coating, etc.) positioned on the cover (e.g., along the bottom surface or inner surface). For example, the dashed line defining the periphery of the forward sensor region 1221 may correspond to... Figure 11A The mask 1138 (which can be positioned along the inner surface of the cover and positioned between the cover and the display) is included. Additionally, the boundary 1222 can define the boundary of the area in the display that includes effective display pixels (e.g., pixels used by the device to generate graphic output). In this example, the boundary 1222 can be... Figure 12A The boundaries depicted in the text are the same.

[0378] Boundary 1224 can define the boundary of the effective touch-sensitive area of ​​the display layer. Therefore, as Figure 12C As shown, the effective touch-sensitive area of ​​the display stack defines extended regions 1223-1 and 1223-2, which extend into the region between the optical transmitter 1008 and the optical receiver 1006 but do not extend completely across the region between the optical transmitter 1008 and the optical receiver 1006. Therefore, extended regions 1223-1 and 1223-2 increase the touch-sensitive area within the forward sensor region 1221 (e.g., compared to...). Figure 12AIn contrast, a single opening is still defined for both the optical transmitter 1008 and the optical receiver 1006. In other words, the forward sensor region 1221 has a single hole through the display stack for the optical transmitter and receiver, and a single hole for the forward camera 1007. This configuration also reduces the proportion of the area within the forward sensor region 1221 that lacks touch-sensing components (e.g., electrodes), which improves the overall touch sensitivity or touch responsiveness of the forward sensor region 1221. Extension regions 1223-1 and 1223-2 define supplementary touch-sensitive areas within the forward sensor region 1221.

[0379] Similar to Figure 12A Boundary 1226 may define the boundaries of non-functional areas of the display stack (e.g., areas that do not produce graphic output and are not touch and / or force sensitive). Thus, as described above, boundary 1226 may correspond to a hole formed through the display stack to provide an unobstructed optical path through the component in the forward sensor region 1221 to the cover.

[0380] Figure 12D Another exemplary configuration of the forward sensor region 1231 of device 1230 is shown. Device 1230 may correspond to or be an embodiment of device 1000. As shown, the forward sensor region 1231 may include a pattern of conductive elements 1232. The conductive elements 1232 may be, for example, traces of conductive material applied to a front cover (e.g., the inner surface of the front cover) of device 1230. Alternatively, the conductive elements 1232 may be positioned on a mask or coating positioned along the inner surface of the front cover. In other examples, the conductive elements 1232 may be positioned on or otherwise combined with any suitable layer, layer, or coating of the forward sensor region. The conductive elements 1232 may be formed of conductive materials, such as metal traces (e.g., CVD or PVD metal traces), carbon fiber filaments, indium tin oxide traces, wires, silver nanowire traces, or any other suitable material.

[0381] The conductive element 1232 can provide conductive or capacitive coupling between touch input applied to the forward sensor region 1231 and touch pixels on one (or more) touch sensing layers of the display stack. More specifically, in Figure 12D In the example, the touch-sensitive layer may terminate at or near the boundary indicated by the dashed line 1231, and the conductive element 1232 extends to (and optionally overlaps or is coupled to) the touch-sensitive layer. When a user applies a finger to the forward sensor region 1231, the capacitive coupling (or conductive coupling) between the user's finger and the conductive element 1232 may ultimately alter the relationship between the conductive element 1232 and the edge near and / or around the forward sensor region 1231 (e.g., near the edge of the forward sensor region 1231). Figure 12DThe touch sensing system of the device can detect changes caused by the user's contact with the forward sensor area 1231 (and subsequent capacitive coupling with the conductive element 1232) and determine whether a touch input has been applied (and where).

[0382] Although Figures 12A to 12D Various components, boundaries, limits, layers, etc., are shown; however, it should be understood that these components are not necessarily visible from the front of the device or visually identifiable (to the naked eye). Instead, as described herein, shielding, coatings and / or other layers, components, materials, treatments, etc., may be provided along the inner surface of the cover. For example, in some cases, the device includes a shield (e.g., shield 1138, Figure 11A The mask includes an optional visually opaque infrared-transmitting coating that defines the visual appearance of the forward-facing sensor region. In some cases, the mask defines one or more openings for optical components in the forward-facing sensor region (e.g., an annular mask defines a central opening). In some cases, such as above the optical transmitter and / or receiver of a facial recognition system, the infrared-transmitting coating is positioned within the opening of the mask and defines the visual appearance of that portion of the forward-facing sensor region. Each annular mask in the forward-facing sensor region may accommodate one or more optical components. For example, as... Figure 11A As shown, mask 1138 may define an opening for both the optical transmitter and the optical receiver, and mask 1139 may define an opening for the forward-facing camera. In other examples, separate openings are defined for the optical transmitter and the optical receiver in one or more masks.

[0383] Figure 12E This is a partial cross-sectional view of a portion of the forward-facing sensor area. Figure 12E The view shown can typically correspond to along Figure 12A The cross section observed from line 12E-12E. Figure 12E A portion of a visually opaque infrared-transmitting coating 1257 (also referred to as coating 1257) is shown, which can be positioned over an optical component in a forward-facing sensor region (e.g., an optical transmitter and / or optical receiver). Coating 1257 may partially overlap with a shielding structure 1258 defining an opening for the optical component. The visually opaque infrared-transmitting coating 1257 and shielding structure 1258 may correspond to or be other visually opaque infrare...

Claims

1. A portable electronic device, comprising: A housing, the housing including a front cover defining a front outer surface; A display, positioned below the front cover, includes a set of transparent conductive traces positioned within the display's effective graphics area and comprising: The first multiple transparent conductive traces; and A second plurality of transparent conductive traces, the second plurality of transparent conductive traces being oriented perpendicular to the first plurality of transparent conductive traces; and Proximity sensor, the proximity sensor comprising: An optical emitter, located below the display and configured to emit light that passes through the display and through the front cover; and An optical receiver is located below the display and is configured to receive a reflected portion of emitted light through the display and through the front cover. The optical emitter is arranged relative to the optical receiver in a direction oblique to the first plurality of transparent conductive traces and oblique to the second plurality of transparent conductive traces.

2. The portable electronic device according to claim 1, wherein, The proximity sensor is configured to detect the proximity of the object to the front outer surface.

3. The portable electronic device according to claim 1, wherein, The optical emitter is a laser emitter configured to emit light with a wavelength between 1300 nanometers and 1400 nanometers.

4. The portable electronic device according to claim 1, wherein: The display includes a substrate; and The first plurality of transparent conductive traces are positioned on the substrate.

5. The portable electronic device according to claim 1, wherein: The display is an organic light-emitting diode (OLED) display. The first plurality of transparent conductive traces are a set of anodes for the OLED display; and The second plurality of transparent conductive traces are a set of cathodes for the OLED display.

6. The portable electronic device according to claim 1, wherein: The display includes a touch sensor; The first plurality of transparent conductive traces are a first set of electrodes for the touch sensor; and The second plurality of transparent conductive traces are a second set of electrodes for the touch sensor.

7. The portable electronic device according to claim 6, wherein: The display includes an opaque backing layer defining a first hole and a second hole; The optical transmitter is positioned below the first aperture; and The optical receiver is positioned below the second aperture.

8. A mobile phone, comprising: Housing, the housing comprising: Housing components; and A transparent cover is attached to the housing component and defines a display area and a forward sensor area surrounded by the display area; A display, located beneath the transparent cover and defining a graphics-effective area configured to display graphics output in the display area, includes a conductive trace grid comprising: A first set of conductive traces, the first set of conductive traces extending along a first direction; and A second set of conductive traces extends along a second direction perpendicular to the first direction; and A proximity sensor, positioned below the effective graphic area of ​​the display and including a pair of optical components positioned along a third direction obliquely intersecting the first direction and the second direction, the pair of optical components including: An optical emitter configured to emit light through the display; and An optical receiver configured to receive emitted light passing through a reflective portion of the display.

9. The mobile phone according to claim 8, wherein, The third direction is oriented at a 45-degree angle relative to the first direction and the second direction.

10. The mobile phone according to claim 8, wherein, The proximity sensor is configured to detect the proximity of the object to the transparent cover based at least in part on the characteristics of the reflective portion of the emitted light.

11. The mobile phone according to claim 8, wherein: The display includes an opaque layer, the opaque layer defining: A first hole, the first hole having a first size; and A second hole, the second hole having a second dimension larger than the first dimension; The optical transmitter is positioned below the first aperture; and The optical receiver is positioned below the second aperture.

12. The mobile phone according to claim 11, wherein: The first side of the second hole extends along a fourth direction, which intersects the first direction and the second direction obliquely; and The second side of the second hole extends along the fifth direction, which is oblique to the first direction.

13. The mobile phone according to claim 8, wherein, The conductive traces in the first group of conductive traces and the conductive traces in the second group of conductive traces are formed of optically transmissive conductive material.

14. The mobile phone according to claim 8, wherein: The mobile phone also includes a bracket structure within the housing and defining a first wall section extending in a fourth direction parallel to the third direction; and The proximity sensor includes a housing that defines a second wall section extending along a fifth direction parallel to the third direction, the second wall section being separated from the first wall section by a gap.

15. A portable electronic device, comprising: A housing, the housing including a front cover defining a front outer surface; A display, positioned below the front cover, includes: One or more electrode layers, the one or more electrode layers comprising: The first multiple transparent conductive traces; and A second plurality of transparent conductive traces, the second plurality of transparent conductive traces being oriented perpendicular to the first plurality of transparent conductive traces; and An opaque layer is positioned below the one or more electrode layers and defines a pair of holes that extend through the opaque layer and are oriented in a direction obliquely intersecting the first plurality of transparent conductive traces and the second plurality of transparent conductive traces; An optical emitter, positioned below the first of the pair of apertures and configured to emit light through the first aperture; and An optical receiver, positioned below the second of the pair of holes and configured to detect the proximity of an object to the portable electronic device based at least in part on the reflected portion of the light emitted by the optical emitter.

16. The portable electronic device according to claim 15, wherein, The light emitted by the optical emitter has a wavelength between 1300 nanometers and 1400 nanometers.

17. The portable electronic device according to claim 15, wherein, The second hole is larger than the first hole.

18. The portable electronic device according to claim 15, wherein, The transparent conductive traces in the first plurality of transparent conductive traces and the transparent conductive traces in the second plurality of transparent conductive traces include indium tin oxide.

19. The portable electronic device according to claim 15, wherein: The display is an organic light-emitting diode (OLED) display. The first plurality of transparent conductive traces are a set of anodes for the OLED display; and The second plurality of transparent conductive traces are a set of cathodes for the OLED display.

20. The portable electronic device according to claim 15, wherein, The optical receiver is configured to detect the proximity of the object to the portable electronic device when the display is generating graphic output above the first and second holes.

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