Method for controlling the temperature of building rooms

Abstract

The invention relates to a method for controlling the temperature of building rooms (1) and / or for providing hot water in building rooms (1) with a temperature control circuit (2) which comprises a temperature control fluid, a feed (3) and a return (4) and runs in an environment (U), in which temperature control circuit a temperature control source (5) and at least one heat pump (7) allocated to a building room (1) are provided. In order for a desired target temperature for controlling the temperature of building rooms (1) and / or providing hot water to be reached in the most energy-saving manner possible, it is proposed that the temperature control fluid is brought to a feed temperature Tv by the temperature control source (5), said feed temperature corresponding to an average ambient temperature Tu + x °C, and the temperature control fluid is brought to a return temperature Tr by the heat pump (7), said return temperature corresponding to the average ambient temperature Tu – x °C, where |x| is less than or equal to 15.

Description

[0001] Method for tempering building rooms

[0002] Technical area

[0003] The invention relates to a method for tempering building spaces and / or for hot water preparation in building spaces, in particular building spaces in low-energy houses, with a tempering circuit comprising a tempering fluid, a flow line and a return line and running in an environment, in which a tempering source and at least one heat pump assigned to a building space are provided.

[0004] State of the art

[0005] CH708598B1 discloses a method for controlling the temperature of building spaces and for heating water in building spaces. For this purpose, a temperature control fluid flowing in a temperature control circuit is heated to a flow temperature by a central heating device acting as the temperature control source and pumped via distribution lines to decentralized heat pumps. The decentralized heat pumps extract thermal energy from the temperature control fluid, thereby lowering the flow temperature of the temperature control fluid to a return temperature. By supplying additional energy, the heat pump's working fluid can be raised to a target temperature for hot water preparation or for heating a building space to which the respective heat pump is assigned.While the use of heat pumps can already achieve a certain degree of energy efficiency in reaching the target temperature, distribution losses occur, particularly when distributing the temperature control fluid to the heat pumps, as heat is released into the environment during transport through the distribution lines. As a result, the heat pumps must be operated with correspondingly more energy to reach the desired target temperature based on the heat energy provided by the temperature control fluid.

[0006] Description of the invention

[0007] The invention is therefore based on the object of proposing a method of the type described above, in which a desired target temperature for controlling the temperature of building rooms and / or for heating water in building rooms can be achieved in the most energy-efficient manner possible. The invention is also based on the object of proposing a device with which a desired target temperature for controlling the temperature of building rooms and / or for heating water in building rooms can be achieved in the most energy-efficient manner possible.

[0008] The invention solves the problem by heating the tempering fluid from the tempering source to a flow temperature T v which corresponds to an average ambient temperature Tu + x °C of the environment, and that the tempering fluid from the heat pump is heated to a return temperature T rwhich corresponds to the average ambient temperature Tu - x °C of the environment, where |x| is less than or equal to 15, preferably 1 to 15, more preferably 1 to 10. As a result of the measures according to the invention, the distribution losses, i.e. the losses during the transport of the tempering fluid from the tempering source to the heat pumps through the distribution lines of the tempering circuit, can be kept extremely low, since the driving force for the heat transfer, the temperature gradient between the tempering fluid and the environment, is considerably reduced. In this way, the flow temperature T v , which is generated by the tempering source, can be conveyed to the heat pump with almost no loss, so that the heat pump, as soon as the system is in equilibrium, only needs energy to raise the flow temperature T vto the target temperature and not also with energy to compensate for the distribution losses. According to the invention, the temperature control fluid in the temperature control circuit is reduced or increased by the heat pump by essentially the same amount as the temperature control fluid is increased or decreased by the temperature control source, wherein the amount of the reduction or increase is in the range of less than or equal to 15, in particular 1 to 15 °C. In this way, building physics requirements can be met, so that local supercooling of the masonry and / or basement and / or soil as an environment, caused by excessive supercooling by the heat pump, and the associated formation of moisture is prevented. Preferably, |x| is in the range of 1 to 5, even more preferably |x| is in the range of 1 to 3. In addition, by increasing or decreasing the temperature of the temperature control fluid by the same amount, an energy input orEnergy loss from the balancing boundaries is prevented because, on average, there is no heating or cooling of the environment, for example of the entire masonry. Preferably, a temperature control source and several heat pumps, each assigned to a building room, can be provided in the temperature control circuit. For the purposes of the invention, assigning a heat pump to a building room does not necessarily mean that the heat pump is arranged in the building room; rather, it is sufficient that the heat pump is arranged in such a way that it can transfer heat to or extract heat from the building room. This is possible, for example, if the heat pump is arranged in a riser leading to this building room. In principle, the specified ranges of |x| apply to the steady-state system and can vary or be higher, particularly during start-up.

[0009] The temperature control source can be a heat or cold source. For example, the temperature control source can be a waste heat source, an electric heater, a fuel heater, a geothermal heater, or a solar heater. Particularly high energy efficiency can be achieved if the temperature control source itself is also a heat pump. The temperature control source can be powered by a photovoltaic system. The temperature control source heats the temperature control fluid to a flow temperature T that can be specified by a control unit. vafter which the tempering fluid, for example water, is pumped via a pump through the tempering circuit to the heat pumps. The heat circuit can comprise a central heat circuit in which the tempering source is arranged, and one or more decentralized heat circuits, each fluidly connected to the central heat circuit, in each of which a heat pump is arranged. Alternatively, only one heat circuit can be provided, in which the heat pump(s) and the tempering source are thus connected in series. The heat pumps can each be assigned to a building space and can heat the building space itself or a hot water storage tank by absorbing the energy transported via the tempering fluid by the heat pump, whereby the temperature of the tempering fluid in the tempering circuit is reduced to a return temperature T rThe heat energy absorbed by the heat pump is converted into heat in a manner known from the state of the art, whereby the flow temperature T v , through additional energy input, to a target temperature. To heat the building space, the building space can have its own heating circuit, into which the heat absorbed by the tempering fluid and additionally generated by the heat pump is introduced via, for example, heat exchangers. Of course, cooling can also occur if the heat pumps operate in opposite directions, with energy from the building space being absorbed by the heat pump and transferred to the tempering fluid.

[0010] The difference between the flow temperature Tv and return temperature T rto the ambient temperature Tu can be in a range greater than or equal to 0 and less than or equal to 15 °C. The definition of the ambient temperature depends on the application. If the predominant part of the temperature control circuit is located in the masonry as the environment, the average internal masonry temperature can be assumed as the average ambient temperature. If the predominant part of the temperature control circuit is located in the ground as the environment, for example, as in the case of a district heating network, the average ground temperature can be assumed as the average ambient temperature. The average ambient temperature Tu can be determined, for example, by representative measuring points, by the oscillation of the temperature control fluid without consumption or supply, or by energy balancing. The extent of heat transfer from the temperature control source to the temperature control fluid and from the temperature control fluid to the building rooms or hot water storage tank can be controlled by a control unit to maintain the control conditions (Tv = Tu + x , T r = Tu - x , |x| = less than or equal to 15, or in particular 1 to 15 or 1 to 10 or preferably 1 to 5 or 1 to 3 or 1 to 2). Therefore, x can be specified by the control unit. The control unit can control the temperature control source, the heat pumps, and the pump to increase or decrease the flow rates of the respective temperature control fluids or working media.

[0011] Example - Heating

[0012] Tu = 18°C; x = 2°C; |x| = 2

[0013] The temperature control source serves as a heat source and increases the temperature of the temperature control fluid to a flow temperature T v of 20°C

[0014] (Tv = Tu + x °C = 18 °C + 2 °C). The 20 °C warm tempering fluid is conveyed via the supply line to the heat pumps, which extract so much heat from the tempering fluid that the temperature of the tempering fluid in the return line, i.e. the return temperature T r 16°C (T r= Tu - x °C = 18 °C - 2 °C). This can be controlled by a control unit. The absorbed heat can be used in a manner known from the prior art to heat a room in a building or a hot water tank. The heat source can then heat the tempering fluid from the return temperature Tr to the flow temperature Tv.

[0015] Example - Cooling

[0016] Tu = 23°C; x = -4 °C; |x| = 4 The temperature control source serves as a heat sink or cold source and lowers the temperature of the temperature control fluid to a flow temperature T v of 19°C (T v = Tu + x °C = 23 °C - 4°C). The 19°C cool tempering fluid is conveyed via the feed line to the heat pumps, which transfer so much heat to the tempering fluid that the temperature of the tempering fluid in the return line, i.e. the return temperature T r 27°C (T r= Tu - x °C = 23 °C - (-4) °C). This can be controlled by a control unit. The released heat can be used to cool a room in a building in a manner known from the prior art. The heat sink can then cool the tempering fluid from the return temperature Tr to the supply temperature Tv.

[0017] In order to optimally adapt the control conditions to the current conditions with regard to the nature of the building rooms, the temperature control circuit piping systems, and also the ambient conditions, it is proposed that an acceptance class be assigned to the environment in which the temperature control circuit runs and / or to the temperature control circuit, and that |x| be selected depending on this acceptance class. Thus, the environment in which the temperature control circuit runs can be divided into several, for example, two acceptance classes. Different values ​​of |x| can be assigned to different acceptance classes. An acceptance class 1 can correspond to an amount of |x| of less than or equal to 15, in particular 1 to 15, while an acceptance class 2 can correspond to an amount of |x| of less than or equal to 10, in particular 1 to 10, preferably less than or equal to 5, in particular 1 to 5, more preferably less than or equal to 3, in particular 1 to 3.If the temperature control circuit is located in an outdoor environment, for example in the ground as the environment, larger local temperature differences can be tolerated, so that an outdoor environment can be assigned an acceptance class of 1 and thus the value of |x| can be less than or equal to 15, in particular 1 to 15. If the temperature control circuit is located in an indoor environment, for example in masonry as the environment, only small local temperature differences are permitted due to building physics, so that an indoor environment can be assigned an acceptance class of 2 and thus the value of |x| can be less than or equal to 10, preferably 1 - 10, in particular 1 to 5, more preferably 1 to 3. Alternatively or additionally, the allocation with regard to the acceptance classes can also be based on the nature of the temperature control circuit.If the temperature control circuit predominantly comprises insulated pipes, comparatively lower heat losses result even with a higher temperature difference between the temperature control fluid and the ambient temperature Tu. A temperature control circuit that comprises insulated pipes can therefore be assigned an acceptance class 1. If, on the other hand, the pipes are uninsulated, the temperature control circuit can be assigned an acceptance class 2. Three acceptance classes can also be provided. In this case, an acceptance class 1 can correspond to an amount of |x| of less than or equal to 15, in particular 1 - 15, an acceptance class 2 can correspond to an amount of |x| of less than or equal to 10, in particular 1 to 10, and an acceptance class 3 can correspond to an amount of |x| of less than or equal to 5, in particular 1 - 5, preferably less than or equal to 3, in particular 1 to 3.

[0018] A particularly energy-efficient process is achieved when several cascaded temperature control circuits are used, which are coupled to one another via a temperature control source, in particular via a heat pump.This can be implemented in that a pre-tempering circuit comprising a pre-tempering fluid, a pre-tempering flow and a pre-tempering return and running in a pre-tempering environment is connected upstream of the temperature control circuit, which pre-tempering circuit comprises a pre-tempering source and is coupled to the temperature control circuit via the temperature control source, and in that the pre-tempering fluid is brought from the pre-tempering source to a pre-tempering flow temperature Tw which corresponds to an average ambient temperature Tu + x °C of the pre-tempering environment, and in that the pre-tempering fluid is brought from the temperature control source to a pre-tempering return temperature Tvr which corresponds to the average ambient temperature Tu - x °C of the pre-tempering environment, where |x| is less than or equal to 15, in particular is 1 to 15.The value of |x| can, analogously to the above statements, preferably be less than or equal to 10, in particular 1 to 10, preferably less than or equal to 5, in particular 1 to 5, more preferably less than or equal to 3, in particular 1 to 3. This results in two or more temperature control circuits, through which a temperature increase or decrease from the preceding to the subsequent temperature control circuit takes place in the manner according to the invention, before a final increase or decrease takes place by the heat pumps assigned to the building rooms. The different temperature control circuits, i.e. the temperature control circuit and the pre-temperature control circuit, can have different ambient temperatures Tu, since, for example, the pre-temperature control circuit runs in the ground as the pre-temperature control environment and the temperature control circuit in the basement of a building as the environment.Here, too, |x| can be selected depending on the approval classes, so that different values ​​of |x| are used in different temperature control circuits. Furthermore, particularly efficient cascading is achieved when the ambient temperature Tu of the subsequent temperature control circuit is higher than the ambient temperature Tu of the preceding temperature control circuit. In the case of cooling, however, this situation can be reversed.

[0019] Advantageous transfer ratios, which can also be controlled particularly precisely, are achieved when the heat pump(s) include at least one Peltier element. The Peltier elements can be connected to the pipes of the temperature control circuit via appropriate heat exchanger surfaces and, as needed, pump heat from the supply line to the building space or hot water tank, or heat from the building spaces or hot water tanks to the return line. To heat the building space, the building space can have its own heating circuit, for example, an underfloor heating system.

[0020] To ensure that the temperature control of building rooms and the hot water preparation can be operated largely independently of external infrastructure, it is proposed that the heat pump(s) be powered by a photovoltaic system. In this way, the additional energy required to raise the flow temperature of the temperature control fluid to a target temperature can be produced independently. In particular, the Peltier elements can be powered by a photovoltaic system, so that the energy required to generate the temperature gradient can be produced independently. The heat pump(s) can also be powered by a wind turbine. Energy storage units can be assigned to the photovoltaic system and / or wind turbine as buffer storage.

[0021] To increase the energy efficiency of the temperature control source in heating mode and reduce additional energy consumption, the temperature control source can transfer heat from a building's wastewater line into the temperature control circuit. This transfer can be achieved through a state-of-the-art heat exchanger incorporated into the temperature control source.

[0022] The method according to the invention can be implemented with a device for tempering building spaces and / or for hot water preparation in building spaces, comprising a tempering circuit comprising a tempering fluid, a flow line and a return line, in which a tempering source and at least one heat pump associated with a building space are provided. According to the invention, a control unit is signal-connected to the tempering source and to the heat pump, wherein the control unit is configured to control the tempering source to raise or lower the temperature of the tempering fluid to a flow temperature T v, which corresponds to an average ambient temperature Tu + x °C, and wherein the control unit is configured to control the heat pump to lower or raise the temperature of the tempering fluid to a return temperature Tr, which corresponds to the average ambient temperature Tu - x °C, where |x| is less than or equal to 15, in particular 1 to 15. A pump can be provided to pump the tempering fluid in the tempering circuit. This pump can also be controlled by the control unit for flow rate adjustment. For the exact specification of the flow temperature T v and the return temperature T rThe control unit can be connected to temperature sensors in the supply and return lines and can control the temperature control source or the heat pump(s) until the specified supply temperature Tv and return temperature Tr are reached. The control unit can also be connected to a temperature sensor in the building room and / or in the hot water tank to prevent heating or cooling once the desired building room temperature or hot water temperature has been reached. The heat pumps can include a Peltier element. The heat pumps can be connected to a photovoltaic system. The temperature control source can include a heat exchanger connected to a wastewater pipe in the building. In this way, the residual heat from the wastewater pipe can be used to increase the temperature of the temperature control fluid. The temperature control source itself can also be a heat pump and connected to a photovoltaic system.The value of |x| can, analogously to the above statements, preferably be less than or equal to 10, in particular 1 to 10, preferably less than or equal to 5, in particular 1 to 5, further preferably less than or equal to 3, in particular 1 to 3.

[0023] A further aspect of the invention relates to a prefabricated wall element for tempering building spaces and / or for hot water preparation in building spaces, comprising a tempering circuit section comprising a flow section and a return section for guiding a tempering fluid, wherein the flow and return sections comprise a connection for flow connection to a tempering source and / or other flow and return sections, wherein a heat pump is provided in the tempering circuit section, which is connected to a control unit, which is designed to control the heat pump to lower or raise the temperature of the tempering fluid to a return temperature T r, which corresponds to an average ambient temperature Tu - x °C, where x is the difference between the flow temperature T v and average ambient temperature Tu, and |x| is less than or equal to 15, in particular 1 to 15. According to the inventive design, several prefabricated wall elements can be connected via the connections of the supply and return sections and, together with a temperature control source, form a complete, closed temperature control circuit. To enable proper control of the closed temperature control circuit, the control units of the interconnected prefabricated wall elements can also be signal-connected. The control units of the individual prefabricated wall elements can also be measuring and control devices that are signal-connected to a central control unit. The return temperature T in question r and flow temperature T vrefer to the temperature in the return or flow of a closed temperature control circuit preferably made from several prefabricated wall elements. The average ambient temperature Tu refers to the average internal masonry temperature of the masonry preferably formed from several prefabricated wall elements. The flow and return sections are preferably embedded in the prefabricated wall. The heat pump is also preferably embedded, at least in sections, in the prefabricated wall. Depending on whether the prefabricated wall element is a terminal element or an intermediate element, the flow section can be separate from the return section of a prefabricated wall element (intermediate element) or the flow section can be connected to the return section (terminal element). The heat pump preferably comprises a Peltier element. The temperature control fluid can be part of the prefabricated wall element. The temperature control source can also be part of the prefabricated wall element.The mode of operation of the temperature control by the prefabricated wall elements is analogous to the method described above. The value of |x| can, analogously to the above explanations, preferably be less than or equal to 10, in particular 1 to 10, preferably less than or equal to 5, in particular 1 to 5, more preferably less than or equal to 3, in particular 1 to 3.

[0024] Brief description of the invention

[0025] The drawing shows an example of the subject matter of the invention.

[0026] Fig. 1 is a schematic representation of a first embodiment of a device for tempering building rooms and / or for hot water preparation in building rooms,

[0027] Fig. 2 is a schematic representation of a second embodiment of a device for tempering building rooms and / or for hot water preparation in building rooms, Fig. 3 is a schematic representation of a prefabricated wall element for tempering building rooms and / or for hot water preparation in building rooms and

[0028] Fig. 4 is a schematic representation of a third embodiment of a device for tempering building rooms and / or for hot water preparation in building rooms.

[0029] Ways to implement the invention

[0030] A device for tempering building rooms 1 and / or for hot water preparation in building rooms 1 has, as can be seen from Figs. 1 and 2, a tempering circuit 2 running in an environment U, in which a tempering fluid is conducted. The tempering circuit 2 has a supply line 3 and a return line 4. The tempering fluid can be tempered, i.e. heated or cooled, by a tempering source 5, for example a heat pump, and pumped through the tempering circuit 2 by a pump 6. Heat pumps 7, for example Peltier elements, are also provided in the tempering circuit 2, each of which is assigned to a building room 1. As indicated in Fig. 1, the heat circuit 2 can comprise a central heat circuit 2a, in which the temperature control source 5 is arranged, and a plurality of decentralized heat circuits 2b, each fluidly connected to the central heat circuit 2a, in each of which a heat pump 7 is arranged.The decentralized heat circuits 2b can be decoupled from the central heat circuit 2a, for example, via switching valves 8. According to the invention, a control unit 9 is signal-connected to the temperature control source 5 and to the heat pumps 7 (indicated by dashed signal lines), wherein the control unit 9 controls the temperature control source 5 such that the temperature control fluid from the temperature control source 5 is heated to a flow temperature T. v which corresponds to an average ambient temperature Tu + x °C, and wherein the control unit 9 controls the heat pumps 7 so that the tempering fluid from the heat pumps 7 is brought to a return temperature T r which corresponds to the average ambient temperature Tu - x °C, where |x| (the value of x) is less than or equal to 15. Due to this small difference between the temperature of the tempering fluid and the ambient temperature, the distribution losses can be kept low. To determine the flow temperature T vand the return temperature T r The control unit 9 can be signal-connected to temperature sensors 10 in the flow line 3 and the return line 4. Temperature sensors 10, which are not shown for reasons of clarity, can also be used to determine the ambient temperature.

[0031] If the device is used to heat the building rooms 1 or a hot water tank 11, the temperature of the tempering fluid is reduced by the heat pumps 7 from a higher level to a lower return temperature T rreduced, which occurs through the heat absorption of the heat pumps 7 from the tempering fluid. By additional effort, the heat absorbed by the heat pump 7 can be increased in a manner known from the prior art and used to heat a building room 1 or a hot water tank 11. The heat pump 7 can be connected to an underfloor heating system 12 or to an infrared heater 13 to heat a building room 1, for example. For hot water preparation, the heat pump 7 can be connected to a hot water tank 11. The meaning of the term "assignment" within the meaning of the invention becomes clear from the illustration of the heat pump 7 connected to the hot water tank 11. Thus, assignment does not necessarily have to mean that the heat pump 7 is arranged in the building room 1; rather, it is sufficient that the heat pump 7 is arranged in such a way that it can transfer heat from or extract heat from the building room 1.This is possible, for example, if the heat pump 7 is arranged in a riser leading to this building space.

[0032] The heat pumps 7, the temperature control source 5 and other electrical components can be supplied via a photovoltaic system 14.

[0033] Fig. 2 shows an alternative embodiment of the device according to the invention, in which the photovoltaic system has been omitted for reasons of clarity, although this embodiment can of course also be supplied by such a system. This embodiment has only one temperature control circuit 2. In order to ensure that the conditions regarding the return temperature (T r= Tu - x °C and |x| = less than or equal to 15, in particular 1 to 15) can be maintained, the temperature sensor 10 for determining this can be arranged after the last heat pump 7. In order to be able to continue to maintain this condition and, for example, to prevent excessive subcooling of the tempering fluid in the return line 4, the various heat pumps 7 can be switched on or off by the control unit 9. An additional or alternative possibility is that the control unit 9 can be used to control which heat pump 7 contributes which percentage contribution to the heat dissipation and thus to the temperature reduction of the tempering fluid, and that the heat dissipation by the heat pumps 7 is only activated by the control unit 9 as long as the conditions (T r = Tu - x °C and |x| = less than or equal to 15, in particular 1 to 15) are met and the desired room temperature in building room 1 is reached.

[0034] Fig. 2 discloses that the temperature control source 5 may comprise a heat exchanger 15 that feeds heat from a wastewater line 16 into the temperature control circuit 2. Such an embodiment may, of course, also be provided in Fig. 1.

[0035] Fig. 3 shows a prefabricated wall element 17 for tempering building rooms 1 and / or for hot water preparation in building rooms 1. The prefabricated wall element 17 has a tempering circuit section 18 comprising a flow section 19 and a return section 20. A tempering fluid can be guided in the tempering circuit section 18. The flow and return sections 19, 20 have one or more connections 21 for flow connection to a tempering source 5 and / or for flow connection to other flow and return sections 19, 20 of another prefabricated wall element 17. In this way, a closed tempering circuit 2 can be formed from several prefabricated wall elements 17 by combining their flow and return sections 19, 20 and by adding a temperature source 5. According to the invention, a heat pump 7 is provided in the tempering circuit section 18.The heat pump can be connected to an infrared heater 22 to control the temperature of a building room 1. The heat pump 7 is also connected to a control unit 9, which is configured to control the heat pump 7 to lower or raise the temperature of the tempering fluid to a return temperature T. r , which corresponds to an average ambient temperature Tu - x °C, where x is the difference between the flow temperature T v and average ambient temperature Tu, and |x| is less than or equal to 15, in particular 1 to 15. x can be specified by the control unit. The supply section 19 and return section 20 can also be designed as risers.

[0036] Fig. 4 shows that a pre-tempering circuit 23, for example a district heating network with a pre-tempering source 24, can be connected upstream of the temperature control circuit 2. The pre-tempering circuit 23 comprises a pre-tempering fluid, a pre-tempering flow 25, and a pre-tempering return 26, and is arranged in a pre-tempering environment VU. The pre-tempering fluid can be brought by the pre-tempering source 24 to a pre-tempering flow temperature Tw, which corresponds to an average ambient temperature Tu + x °C. Subsequently, the pre-tempering fluid can be brought by the temperature control source 5 to a pre-tempering return temperature Tvr, which corresponds to the average ambient temperature Tu - x °C, where |x| is less than or equal to 15, in particular 1 to 15. Since the pre-tempering circuit 23 is located in a different environment VU than the tempering circuit 2, different ambient temperatures Tu may occur.The |x| can also be different in the different temperature control circuits 2,23.

[0037] Fig. 4 shows that intermediate heat pumps 27 can be provided between the heat pumps 7 and the temperature control circuit 2, 2a, 2b. This results in a further intermediate temperature control circuit between the heat pumps 7 and the associated intermediate heat pumps 27, with a yet different ambient temperature Tu, which depends on the intermediate environment, for example, the masonry. Fig. 4 thus shows several cascaded temperature control circuits 23, 2, 2a, 2b, 28, which are each coupled to one another via at least one temperature control source 5, 27, in particular via a heat pump. In particular, the ambient temperature Tu of the subsequent temperature control circuit 2, 2a, 2b, 28 can be higher than the ambient temperature Tu of the preceding temperature control circuit 23, 2, 2a, 2b.

Claims

Patent claims 1 . Method for tempering building rooms (1) and / or for hot water preparation in building rooms (1) with a tempering circuit (2) comprising a tempering fluid, a flow (3) and a return (4) and running in an environment (U), in which a tempering source (5) and at least one heat pump (7) assigned to a building room (1) are provided, characterized in that the tempering fluid is heated from the tempering source (5) to a flow temperature T v which corresponds to an average ambient temperature Tu + x °C, and that the tempering fluid from the heat pump (7) is heated to a return temperature T r which corresponds to the mean ambient temperature Tu - x °C, where |x| is less than or equal to 15.

2. Method according to claim 1, characterized in that the environment (U) in which the temperature control circuit (2) runs and / or the temperature control circuit (2) is assigned an admissibility class and |x| is selected depending on this admissibility class.

3. Method according to claim 1 or 2, characterized in that a pre-tempering circuit (23) comprising a pre-tempering fluid, a pre-tempering flow (25) and a pre-tempering return (26) and running in a pre-tempering environment (VU) is connected upstream of the tempering circuit (2), which pre-tempering circuit comprises a pre-tempering source (24) and is coupled to the tempering circuit (2) via the tempering source (5), and in that the pre-tempering fluid is brought from the pre-tempering source (24) to a pre-tempering flow temperature Tw which corresponds to an average ambient temperature Tu + x °C of the pre-tempering environment (VU), and in that the pre-tempering fluid is brought from the tempering source (5) to a pre-tempering return temperature Tvr which corresponds to the average ambient temperature Tu - x °C of the pre-tempering environment (VU), where |x| is less than or equal to 15.

4. Method according to one of claims 1 to 3, characterized in that the heat pump (7) comprises at least one Peltier element.

5. Method according to one of claims 1 to 4, characterized in that the heat pump (7) is supplied via a photovoltaic system (14).

6. Method according to one of claims 1 to 5, characterized in that the temperature control source (5) transfers heat from a wastewater pipe (16) of the building into the temperature control circuit (2).

7. Method according to one of claims 1 to 6, characterized in that the average ambient temperature Tu is the average internal masonry temperature of the masonry through which the temperature control circuit (2) runs.

8. Device for tempering building rooms (1) and / or for preparing hot water in building rooms (1) with a tempering circuit (2) comprising a tempering fluid, a flow (3) and a return (4), in which a tempering source (5) and at least one heat pump (7) assigned to a building room (1) are provided, characterized in that a control unit (9) is signal-connected to the tempering source (5) and to the heat pump (7), wherein the control unit (9) is designed to control the tempering source (5) to raise or lower the temperature of the tempering fluid to a flow temperature T v which corresponds to an average ambient temperature Tu + x °C, and wherein the control unit (9) is designed to control the heat pump (7) to lower or raise the temperature of the tempering fluid to a return temperature T r, which corresponds to the average ambient temperature Tu - x °C, where |x| is less than or equal to 15.

9. Prefabricated wall element (17) for tempering building rooms (1 ) and / or for hot water preparation in building rooms (1 ) with a A tempering circuit section (18) comprising a flow section (19) and a return section (20) for guiding a tempering fluid, wherein the flow and return sections (19, 20) comprise a connection (21) for flow connection to a tempering source (5) and / or other flow and return sections (19, 20), characterized in that A heat pump (7) is provided in the temperature control circuit section (18) and is connected to a control unit (9) which is designed to control the heat pump (7) to lower or raise the temperature of the temperature control fluid to a return temperature T r, which corresponds to an average ambient temperature Tu - x °C, where x is the difference between the flow temperature T v and average ambient temperature Tu, and |x| is less than or equal to 15.

10. Prefabricated wall element according to claim 9, characterized in that the heat pump comprises a Peltier element.

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