Cooking apparatus

Abstract

The present invention relates to a cooking apparatus configured such that high-frequency power is supplied to a terminal pattern through a connector capable of maintaining the minimum protruding vertical length from the upper end surface of a coil circuit board module, thereby enabling the minimum gap between the coil circuit board module and a top plate to be maintained, and thus heating efficiency can be effectively improved.

Description

[Technical Field]

[0001] The present disclosure relates to a cooking appliance, and more specifically, to a cooking appliance in which high-frequency power is supplied to a terminal pattern via a connector capable of maintaining a minimum protruding vertical length from an upper end surface of a coil circuit board module, thereby maintaining a minimum spacing between the coil circuit board module and a top plate, thereby effectively improving heating efficiency.[Background Art]

[0002] A cooking appliance is one of home appliances for cooking food, and is installed in a kitchen space to cook food according to a user's intention. Such cooking appliances may be classified in various ways based on a used heat source, a form, and a type of used fuel.

[0003] When the cooking appliances are classified based on the type of cooking food, the cooking appliances may be classified into an open type cooking appliance and a closed type cooking appliance based on a form of a space in which the food is placed. The closed type cooking appliance may include an oven and a microwave, and the open type cooking appliance may include a cooktop and a hop.

[0004] The cooktop as the open type cooking appliance may be configured to heat a cooking target contained in a cooking container using at least one burner.

[0005] The cooktop may be provided in a form of having a burner that uses electricity, or may be provided in a form of having a burner that uses gas.

[0006] In addition, the cooktop may be implemented alone. The cooking appliance may be implemented in a form of an oven range including an oven under the cooktop.

[0007] An example of the cooktop having the burner using electricity is an induction heating cooking appliance.

[0008] The induction heating cooking appliance is a cooking appliance that performs a cooking function in an induction heating manner. In the induction heating cooking appliance, when high-frequency power is applied to a working coil, a magnetic field may be generated around the working coil.

[0009] An eddy current is generated in the cooking container made of a magnetic material under the generated magnetic field, and the food cooking may be performed by the cooking container which acts as a resistor against the eddy current and generates heat.

[0010] Such an induction heating cooking appliance does not require combustion of gas and thus does not generate combustion exhaust gas. In addition, the induction heating cooking appliance immediately generates heat in the container itself, thereby minimizing a transfer process via radiation or conduction of heat and thus heating the food at a high speed.

[0011] In a conventional induction heating type cooktop, a working coil is formed by twisting a plurality of Litz wires, and an individual burner is formed by winding the working coil in a spiral shape multiple times so as to have a multi-multi-layer structure.

[0012] In this regard, a coil frame for maintaining and supporting a winding shape of the working coil should be necessarily provided in each burner.

[0013] Therefore, a vertical size of the individual burner as a sum of a vertical size of the working coil wound in the multi-layer structure and a vertical size of the coil frame amounts to a significantly greater percentage of an entire vertical size of the cooktop.

[0014] Due to the limitation of the size of the individual burner constituting the cooktop, the conventional cooktop has no choice but to have a limitation in increasing an output of the individual burner.

[0015] In addition, in configuring the cooktop having a plurality of burners, a space in which other components or parts are installed in the conventional cooktop is very limited, and accordingly, a total number of burners capable of being provided in the cooktop is very limited.

[0016] In an alternative to the Ritz wire-type working coil, a technology related to a cooktop in which a burner is formed by forming the working coil in a spiral multilayer pattern on a printed circuit board has been developed. (Prior Document 001, Design and Optimization of Small Inductors on Extra-Thin PCB for Flexible Cooking Surfaces / IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, VOL. 53, NO. 1, JANUARY / FEBRUARY 2017)

[0017] The cooktop disclosed in the prior document 001 may be configured such that the burner is formed by forming a working coil pattern wound in a spiral shape in a single layer or a plurality of layers on a single printed circuit board.

[0018] The cooktop disclosed in the prior art document 001 as described above may have an advantage in that the working coil patterns constituting the burner are integrally formed with each other on a single printed circuit board such that a vertical size of the cooktop may be significantly reduced compared to a conventional cooktop, thereby improving the vertical space utilization, and the number of burners may be significantly increased compared to the conventional cooktop, thereby improving the horizontal space utilization.[Disclosure] [Technical Problem]

[0019] The cooktop disclosed in the prior art document 001 may maintain the maximum heating efficiency only when the working coil pattern constituting the individual burner is positioned as close to the top plate as possible.

[0020] In this case, a terminal pattern for supplying high-frequency power to the working coil pattern may be integrally formed with the printed circuit board.

[0021] Accordingly, the cooktop disclosed in the prior art document 001 may cause a phenomenon in which a vertical free space for directly connecting the power cable connecting the inverter circuit board module to the terminal pattern to the terminal pattern is insufficient.

[0022] In addition, in the cooktop disclosed in the prior art document 001, the high-frequency power of 20A or greater is applied to the terminal pattern. Therefore, it is substantially impossible to apply a board connector coupled to the terminal pattern in a simple fitting manner, such as a conventional board connector. A method of directly connecting a terminal of a power cable to the terminal pattern via soldering or connecting the terminal thereto using a mechanical coupling means such as a screw bolt should be applied.

[0023] Accordingly, the cooktop disclosed in prior art document 001 has a problem in that, when the terminal of the power cable is coupled to the terminal pattern via soldering, there is a high possibility of damage to the soldering portion as the soldering portion comes into contact with the lower surface of the top plate, and the possibility of a contact defect is high as the soldering portion melts in the contact area therewith. When the terminal of the power cable is mechanically coupled to the terminal pattern via a screw bolt or the like, there is a high possibility that the coil circuit board module is damaged due to the fastening force of the screw bolt.

[0024] The present disclosure has been devised to solve the problems of the prior art. Thus, a first purpose of the present disclosure is to provide a cooking appliance in which the high-frequency power is supplied to a terminal pattern via a connector capable of maintaining a minimum protruding vertical length from an upper end surface of the coil circuit board module, thereby maintaining a minimum spacing between the coil circuit board module and the top plate, and thus, effectively improving heating efficiency.

[0025] In addition, a second purpose of the present disclosure is to provide a cooking appliance in which a connector for supplying high-frequency power to a coil circuit board module is constructed to be fixed to the coil circuit board module while at least partially extending through the coil circuit board module, thereby securing a great fastening force between the coil circuit board module and the connector, and effectively preventing a contact point between the connector and the terminal pattern from being removed or damaged under the torque applied when the terminal of the power cable is fastened to the connector using the screw bolt.

[0026] Purposes according to the present disclosure are not limited to the above-mentioned purpose. Other purposes and advantages according to the present disclosure that are not mentioned may be understood based on following descriptions, and may be more clearly understood based on embodiments according to the present disclosure. Further, it will be easily understood that the purposes and advantages according to the present disclosure may be realized using means shown in the claims or combinations thereof.[Technical Solution]

[0027] The cooking appliance according to the present disclosure includes: a top plate on which a container is seated; and a coil circuit board module disposed under the top plate and including a working coil for heating the container; and an inverter circuit board module disposed under the coil circuit board module and configured to generate power to be supplied to the working coil, wherein the coil circuit board module includes a terminal electrically connected to the working coil, wherein the working coil receives the power from the inverter circuit board module via the terminal.

[0028] Furthermore, the cooking appliance may further comprise a connector including: a first contact and connection portion contacting and electrically connected to the terminal; and a second contact and connection portion contacting and electrically connected to the inverter circuit board module, wherein the connector may be fixed to the coil circuit board module.

[0029] Furthermore, the first contact and connection portion may partially protrude upwardly beyond an upper end surface of the coil circuit board module, wherein a protruding vertical length by which the first contact and connection portion protrudes upwardly beyond the upper end surface of the coil circuit board module may be smaller than a vertical spacing between a lower end surface of the top plate and the upper end surface of the coil circuit board module.

[0030] Furthermore, the protruding vertical length may be smaller than or equal to 1 / 2 of the vertical spacing.

[0031] Furthermore, the terminal may be formed in the upper end surface or a lower end surface of the coil circuit board module.

[0032] Furthermore, the cooking appliance may further comprise a board supporter disposed between the coil circuit board module and the inverter circuit board module, wherein the coil circuit board module may be seated on an upper surface of the board supporter, wherein the second contact and connection portion of the connector may extend through an upper surface of the board supporter toward the inverter circuit board module.

[0033] Furthermore, a through-hole may be formed in the board supporter, wherein the second contact and connection portion of the connector may pass through the through-hole.

[0034] Furthermore, the terminal may include a pair of terminals disposed in the upper end surface of the coil circuit board module and spaced from each other, wherein the first contact and connection portion may include a pair of first contact and connection portions contacting and electrically connected to the pair of terminals, respectively, wherein a lower surface of each of the pair of first contact and connection portions may be in contact with and connected to each of the pair of terminals.

[0035] Furthermore, the connector may include a pair of bridge portions, wherein the pair of bridge portions may have respective one ends respectively connected to the pair of first contact and connection portions, and the respective other ends connected to the second contact and connection portion, wherein each of the pair of bridge portions may extend through the coil circuit board module in a vertical direction.

[0036] Furthermore, when the connector is fixed to the coil circuit board module, a restoring force acting such that a spacing between the pair of first contact and connection portions increases may be applied from the pair of bridge portions to the coil circuit board module.

[0037] Furthermore, at least one of the pair of first contact and connection portions may include an inserted protrusion protruding downwardly toward the coil circuit board module, wherein the coil circuit board module may include a coupling hole defined therein, wherein the inserted protrusion may be inserted into and coupled to the coupling hole.

[0038] Furthermore, the terminal may include a pair of terminals disposed in a lower end surface of the coil circuit board module and spaced from each other, wherein the first contact and connection portion may include a pair of first contact and connection portions in contact with and connected to the pair of terminals, respectively, wherein respective upper surfaces of the pair of first contact and connection portions may be in contact with and connected to the pair of terminals, respectively.

[0039] Furthermore, at least one of the pair of first contact and connection portions may include an inserted protrusion protruding upwardly toward the coil circuit board module, wherein the coil circuit board module may include a coupling hole defined therein, wherein the inserted protrusion may be inserted into and coupled to the coupling hole.

[0040] Furthermore, the terminal may include a pair of terminals disposed in an upper end surface or a lower end surface of the coil circuit board module and spaced from each other, wherein the first contact and connection portion may include a pair of first contact and connection portions in contact with and connected to the pair of terminals, respectively, wherein each of the pair of first contact and connection portions may include an upper contact and connection portion contacting the upper end surface of the coil circuit board module and a lower contact and connection portion contacting a lower surface of the coil circuit board module.

[0041] Furthermore, a vertical spacing between the upper contact and connection portion and the lower contact and connection portion may be smaller than or equal to a vertical thickness of the coil circuit board module.

[0042] Furthermore, the terminal may include a pair of terminals disposed in an upper end surface or a lower end surface of the coil circuit board module and spaced from each other, wherein the first contact and connection portion may include a pair of first contact and connection portions in contact with and connected to the pair of terminals, respectively, wherein each of the pair of first contact and connection portions may protrude upwardly toward the coil circuit board module, and may extend through the lower end surface to the upper end surface of the coil circuit board module so as to be in contact with and connected to each of the pair of terminals.

[0043] Furthermore, the coil circuit board module may include a pair of coupling holes defined therein, wherein the pair of first contact and connection portions may be respectively inserted into and coupled to the pair of coupling holes.

[0044] Furthermore, each of the coupling holes may act as a via hole electrically connected to each of the pair of terminals.

[0045] Furthermore, each of the pair of first contact and connection portions has been inserted into each of the coupling holes such that an upper end of each of the pair of first contact and connection portions may protrude upwardly beyond the upper surface of the coil circuit board module, wherein the upper end of each of the pair of first contact and connection portions may have a stopper constructed to prevent downward movement of the connector.

[0046] Furthermore, the coil circuit board module may be formed in a printed circuit pattern.[Advantageous Effects]

[0047] According to the present disclosure, the high-frequency power is supplied to the terminal pattern via the connector capable of maintaining a minimum protruding vertical length from an upper end surface of the coil circuit board module, thereby maintaining a minimum spacing between the coil circuit board module and the top plate, and thus, effectively improving heating efficiency.

[0048] In addition, according to the present disclosure, the connector for supplying the high-frequency power to the coil circuit board module is constructed to be fixed to the coil circuit board module while at least partially extending through the coil circuit board module, thereby securing a great fastening force between the coil circuit board module and the connector.

[0049] In addition, according to the present disclosure, the contact point between the connector and the terminal pattern may be effectively prevented from being removed or damaged under the torque applied when the terminal of the power cable is fastened to the connector using the screw bolt.

[0050] In addition to the above-described effects, specific effects of the present disclosure will be described together while describing specific matters for implementing the present disclosure.[Description of Drawings]

[0051] FIG. 1 is a front perspective view of a cooking appliance according to an embodiment of the present disclosure. FIG. 2 is a plan view of the cooking appliance shown in FIG. 1 and illustrates a state in which a display line is turned on. FIG. 3 is a perspective view of the cooking appliance shown in FIG. 1. FIG. 4 is an exploded perspective view of a cooktop of the cooking appliance shown in FIG. 1. FIG. 5 is a plan view of the cooktop illustrated in FIG. 4, and is a see-thorough view of a structure under a top plate. FIG. 6 is a schematic cross-sectional view for illustrating a multi-layer structure of a first coil circuit board module as shown in FIG. 4. FIG. 7 is a plan view of a first layer constituting a multi-layer structure of the first coil circuit board module shown in FIG. 4, and FIG. 8 is a partially enlarged view of FIG. 7. FIG. 9 is a plan view of a second layer constituting a multi-layer structure of the first coil circuit board module as shown in FIG. 4. FIG. 10 is a partially enlarged view of FIG. 7 and illustrates patterns formed in each of first to twelfth layers. FIG. 11 is a plan view of each of third to seventh layers constituting a multi-layer structure of the first coil circuit board module as shown in FIG. 4. FIG. 12 is a plan view of each of eighth to twelfth layers constituting a multi-layer structure of the first coil circuit board module as shown in FIG. 4. (a) in FIG. 13 is a plan view illustrating a portion of a first type pattern illustrated in FIG. 11, and (b) in FIG. 13 is a plan view illustrating a portion of a second type pattern illustrated in FIG. 12. (a) in FIG. 14 is a partially enlarged view of (a) in FIG. 13, and (b) in FIG. 14 is a partially enlarged view of (b) in FIG. 13. FIG. 15 is a schematic cross-sectional view illustrating a structure in which the first type patterns respectively constituting the third to seventh layers and the second type patterns respectively constituting the eighth to twelfth layers as illustrated in FIG. 4 are collectively connected to each other via a working coil via hole. (a) in FIG. 16 is a partially enlarged view of (a) in FIG. 13, and (b) in FIG. 16 is a partially enlarged view of (b) in FIG. 13, which are partially enlarged views for illustrating a common terminal of a first type pattern and a common terminal of a second type pattern, respectively. FIG. 17A is a plan view of a state in which the coil circuit board module is seated on the board supporter when viewed from the top, and FIGS. 17b and 17A are schematic cross-sectional views for explaining c support structure of the coil circuit board module and the electronic / electrical component according to another embodiment. FIG. 18 is a partially enlarged view of a plan view of the board supporter shown in FIG. 17A when viewed from the lower side. FIG. 19 is a vertical cross-sectional view of a cooktop, and FIG. 20 is a partially enlarged view of FIG. 19. FIG. 21 is a plan view illustrating a state in which a first coil circuit board module is disposed on a board supporter, and FIG. 22 is a perspective view illustrating a state in which a high-power connector is coupled to the first coil circuit board module. FIG. 23 is a perspective view of a high-power connector according to a first embodiment of the present disclosure, and FIG. 24 is a perspective view illustrating a state in which the high-power connector according to the first embodiment is installed in a first coil circuit board module. FIG. 25 is a perspective view of a high-power connector according to a second embodiment of the present disclosure, and FIG. 26 is a perspective view illustrating a state in which the high-power connector according to the second embodiment is installed in the first coil circuit board module. FIG. 27 is a perspective view of a high-power connector according to a third embodiment of the present disclosure, and FIG. 28 is a perspective view illustrating a state in which the high-power connector according to the third embodiment is installed in the first coil circuit board module. FIG. 29 is a perspective view of a high-power connector according to a fourth embodiment of the present disclosure, and FIG. 30 is a perspective view illustrating a state in which the high-power connector according to the fourth embodiment is installed in the first coil circuit board module. FIG. 31 is a perspective view and a partially enlarged view of a high-power connector according to a fifth embodiment of the present disclosure, and FIG. 32 is a perspective view illustrating a state in which the high-power connector according to the fifth embodiment is installed in a first coil circuit board module. [Best Mode]

[0052] The above-mentioned purposes, features, and advantages will be described in detail later with reference to the attached drawings, so that those skilled in the art in the technical field to which the present disclosure belongs may easily implement the technical ideas of the present disclosure. In describing the present disclosure, upon determination that a detailed description of the publicly known technology related to the present disclosure may unnecessarily obscure the gist of the present disclosure, the detailed description will be omitted. Hereinafter, a preferred embodiment according to the present disclosure will be described in detail with reference to the attached drawings. In the drawings, identical reference numerals are used to indicate identical or similar components.

[0053] Although first, second, and the like are used to describe various components, these components are not limited by such terms. Such terms are only used to distinguish one component from another component, and unless specifically stated to the contrary, a first component may also be a second component.

[0054] Throughout the present document, unless otherwise stated, each component may be singular or plural.

[0055] Hereinafter, a first component being disposed "on top of (or under)" a second component may mean that the first component may be disposed in contact with a upper end surface (or a bottom surface) of the second component, as well as a third component may be interposed between the second component and the first component disposed "on top of (or under)" the second component.

[0056] Furthermore, when a first component is described as being "connected" or "coupled" to a second component, the components may be directly connected or coupled to each other, but a third component may be "interposed" between the components or the components may be "connected" or "coupled" to each other via the third components.

[0057] As used herein, the singular constitutes "a" and "an" are intended to include the plural constitutes as well, unless the context clearly indicates otherwise. In this application, terms such as "composed of" or "include" should not be construed as necessarily including all of various components or operations described herein, but should be construed that some components or operations among those may not be included or additional components or operations may be further included.

[0058] As used herein, the singular constitutes "a" and "an" are intended to include the plural constitutes as well, unless the context clearly indicates otherwise. In this application, terms such as "composed of" or "include" should not be construed as necessarily including all of various components or operations described herein, but should be construed that some components or operations among those may not be included or additional components or operations may be further included.

[0059] Throughout the present document, "A and / or B" means A, B, or A and B, unless otherwise specified, and "C to D" means equal to or greater than C and equal to or smaller than D unless otherwise specified.[Overall structure of cooking appliance]

[0060] FIG. 1 is a perspective view illustrating the cooking appliance 1 according to an embodiment of the present disclosure, and FIG. 2 is a top view illustrating a cooktop 20 constituting the cooking appliance 1 illustrated in FIG. 1.

[0061] Referring to FIGS. 1 and 2, the cooking appliance 1 according to an embodiment of the present disclosure may include the cooktop 20 and an oven 10 disposed under the cooktop 20.

[0062] The cooking appliance 1 according to an embodiment of the present disclosure may be of an oven range type in which the cooktop 20 is disposed at an upper area and the oven 10 is disposed at a lower area. However, the present disclosure is not limited thereto, and the cooking appliance 1 according to an embodiment of the present disclosure may be embodied as the cooking appliance 1 including only the cooktop 20. Hereinafter, a case in which the cooking appliance 1 is embodied as being of the oven range type will be described by way of example.

[0063] The cooking appliance 1 according to an embodiment of the present disclosure is of the oven range type, thereby providing both a function of an oven as a closed cooking means, and a function of a cooktop as an open cooking means.

[0064] A cooking chamber may be formed inside the oven 10 serving as the closed cooking means. While the inside of the cooking chamber of the oven 10 is heated, food received therein may be cooked.

[0065] To this end, although not shown, the oven 10 may be provided with a heater for heating the inside of the cooking chamber. The heater may be a heating device using gas fuel or electricity.

[0066] A door 11 for selectively opening and closing the cooking chamber may be pivotably provided at the oven 10 of the cooking appliance 1.

[0067] For example, the door 11 may be provided in the oven 10 in a form of opening and closing the cooking chamber in a pull-down manner in which an upper end thereof rotates along a vertical direction around a lower end thereof.

[0068] A control panel 30 for operating the oven 10 and the cooktop 20 may be disposed on a top portion of a front surface of the cooking appliance 1.

[0069] Since the control panel 30 is disposed on the front surface of the cooking appliance 1, the control panel 30 may constitute a portion of an exterior of the front surface of the cooking appliance 1.

[0070] The control panel 30 may be provided with a plurality of switches for controlling the operation of the cooking appliance 1 and a display 31 for displaying an operation state of the cooking appliance 1.

[0071] In addition, as illustrated, the control panel 30 of the cooking appliance 1 may further include a plurality of knobs 32. That is, the plurality of knobs 32 for adjusting the operation of the cooking appliance 1 together with the display 31 may be included in the control panel 30 disposed on the top portion of the front surface of the cooking appliance 1.

[0072] Each knob 32 may be provided so as to be rotatable. The knob 32 may be provided to be able to control one of the oven 10 and the cooktop 20, or may be provided to be able to control both the oven 10 and the cooktop 20.

[0073] Via the manipulation of the knob provided as described above, one of a plurality of preset cooking modes may be selected, or a heating temperature or a heating step may be selected.

[0074] In addition, the control panel 30 of the cooking appliance 1 according to the present embodiment may further include a knob ring 33. The knob ring 33 may be disposed radially outwardly of the knob 32. For example, the knob ring 33 may be provided in a ring shape surrounding the knob 32 while being positioned in the radial direction outwardly thereof.

[0075] The knob ring 33 may serve to support the knob 32, and may serve to improve appearance quality of the cooking appliance 1 by finishing a surrounding appearance of the knob 32.

[0076] In addition, the knob ring 33 of the present embodiment may act as a timer setting switch and perform a role of displaying a timer time and an intensity of firepower together.

[0077] The knob ring 33 is installed to be rotatable independently of the knob 32, and a timer time may be set via a rotation of the knob ring 33 installed as described above.

[0078] As described above, the cooktop 20 may be disposed on top of the oven 10.

[0079] The cooktop 20 may perform a function of heating food or a container containing food which may be seated on an upper surface of the cooktop 20.

[0080] To this end, the cooktop 20 may include a top plate 21 which constitutes the upper surface of the cooktop 20 and on which the container containing food is seated.

[0081] In addition, a heater for heating the container containing food may be provided inside the cooktop 20 and under the top plate 21.

[0082] The heater may be configured to include at least one burner. For example, the burner constituting the heater may be provided in a form including a working coil for converting an electrical force supplied thereto into a magnetic force or a heating coil for converting the electrical force supplied thereto into thermal energy.

[0083] The cooktop 20 of the cooking appliance 1 according to an embodiment of the present disclosure may operate in an induction heating manner.

[0084] To this end, the burner of the cooktop 20 may be configured to include the working coil. The burner including the working coil may operate under a high-frequency current generated and supplied thereto by an inverter to generate a strong magnetic field.

[0085] The magnetic field generated in the burner including the working coil may generate an eddy current in the container including a metal component. As the eddy current flows through the container, the heat may be generated to heat the container. As the container is heated, the food contained in the container may be heated.

[0086] However, the working coil applied to the conventional induction heating type cooktop is generally formed by twisting a plurality of electrically conductive wires to form a cable, and winding the cable in a spiral shape.

[0087] However, as will be described later, a working coil constituting the cooktop 20 of the cooking appliance 1 according to an embodiment of the present disclosure may be composed of a plurality of patterns stacked on a printed circuit board, each pattern being formed in a spiral shape.

[0088] As described above, the working coil of the cooking appliance 1 according to the present disclosure may have a structure in which the pattern is stacked on the printed circuit board and thus may be referred to as a working coil pattern.

[0089] A detailed configuration of the heater including the working coil pattern will be described later with reference to FIG. 2.[Overall configuration of cooktop]

[0090] Hereinafter, a configuration of the cooktop 20 constituting the cooking appliance 1 according to an embodiment of the present disclosure will be described with reference to FIGS. 2 to 4.

[0091] FIG. 2 is a top view of the cooktop 20 in a state in which a display line L is turned on. FIG. 3 is a perspective view of the cooktop 20 according to the present disclosure. FIG. 4 is an exploded perspective view of the cooktop 20 illustrated in FIG. 3. FIG. 5 is a plan view of the cooktop illustrated in FIG. 3, and is a see-thorough view of a structure under a top plate.

[0092] First, referring to FIGS. 2 to 5, in a similar manner to the oven 10 described above, the cooktop 20 according to the present embodiment may include a control panel 22.

[0093] As illustrated, the control panel 22 of the cooktop 20 may be disposed on the top plate 21, and may be disposed at a position closer to a front edge thereof for user convenience.

[0094] The control panel 22 may be provided with various switches for controlling the operation of the cooktop 20 and a display panel 221 for displaying the operation state of the cooktop 20.

[0095] As will be described later, when it is detected that the container is seated on an upper surface 21a of the top plate 21 using a sensing coil pattern 2514, an icon corresponding to the container may be displayed on the display panel 221 of the control panel 22 disposed on the cooktop 20. By way of example, the icon may be provided in a size and a shape corresponding to a size and a shape of the container, and may be disposed at a position of the display panel 221 corresponding to a position of the cooking appliance 1.

[0096] The user may press the displayed icon to select a container as indicated by the icon, and may perform a manipulation for controlling the operation of the cooking appliance 1 related to the selected container.

[0097] For example, the user may press the icon to select the container to be manipulated, and then select a desired heating temperature of the selected container.

[0098] When the heating of the container is started via the manipulation of the control panel 22 as described above, the start of the heating of the container may be displayed on the top plate 21 using the display line L as shown in FIG. 2.

[0099] As illustrated in FIG. 2, a plurality of display lines L may be disposed on the top plate 21 of the cooktop 20.

[0100] The display line L displays information related to a position of the container, a heated state of the container, a temperature, etc. on the top plate 21 in a form of a light emission area, and thus may visually transmit the information to the user.

[0101] FIG. 2 shows an embodiment in which a total of seven display lines L are provided. These display lines L may be referred to as first to seventh display lines L1, L2, L3, L4, L5, L6, and L7 in an order starting from a left side of the top plate 21 in terms of convenience. The present disclosure is not limited thereto. However, for convenience, an example in which a total of seven display lines L are provided will be described

[0102] As illustrated, each of the display lines L may be a light emitting area in which a width in a left-right direction is much smaller than a length in a front-rear direction.

[0103] The display line L may be implemented using a light source module 23 disposed under the top plate 21 and disposed on a board supporter 26 to be described later so that each display line L may be formed in a form of the light emission area.

[0104] The light source module 23 may include a plurality of light source elements 231 for generating visible light, and a light source circuit board 232 on which the plurality of light source elements 231 are mounted.

[0105] The plurality of light source elements 231 may be disposed to irradiate visible light toward a lower surface of the top plate 21, and the incident visible light may travel through a light-transmission hole extending through the board supporter 26, a light-transmission slit hole H_sl formed in each of coil circuit board modules constituting a heater 25, and a clearance formed between adjacent coil circuit board modules, as will be described later and then be irradiated to a lower surface of the top plate 21.

[0106] The light source module 23 may be configured to include the plurality of light source elements 231 receiving power to generate visible light, and the light source circuit board 232 on which the plurality of light source elements 231 are mounted.

[0107] The light source element 231 may be applied without limitation as long as it is a means capable of receiving power and generating predetermined visible light, and may be, for example, an LED element. However, hereinafter, the present disclosure will be described based on an embodiment in which an LED element is applied as the light source element 231. The present disclosure is not limited thereto.

[0108] As illustrated, each light source circuit board 232 may linearly extend in the front-rear direction in a corresponding manner to each display line L extending linearly, and the plurality of light source elements 231 may be disposed on each light source circuit board 232 and be linearly arranged so as to be spaced apart from each other by an equal spacing or non-uniform spacings in the front-rear direction.

[0109] In addition, as described above, each of the plurality of light source modules 23 may be provided to independently irradiate visible light to each of the first to seventh display lines L1, L2, L3, L4, L5, L6, and L7. The plurality of light source modules 23 may be referred to as first to seventh light source modules 23a, 23b, 23c, 23d, 23e, 23f, and 23g in an order starting from the left side of the top plate 21.

[0110] The first to seventh light source modules 23a, 23b, 23c, 23d, 23e, 23f, and 23g may be arranged so as to be spaced apart from each other in the left-right direction in a corresponding manner to the first to seventh display lines L1, L2, L3, L4, L5, L6, and L7.

[0111] As will be described later, the spacing between the adjacent display lines L and the spacing between the adjacent light source modules 23 may be equal to or slightly greater than a width in the left-right direction of the working coil pattern 2512 constituting the heater 25.

[0112] As illustrated, the cooktop 20 of the cooking appliance 1 according to an embodiment of the present disclosure may include a bottom casing 24 constituting a front surface, a rear surface, a front surface, both opposing side surfaces, and a lower surface of the exterior of the cooktop 20.

[0113] The bottom casing 24 may be formed in a form in which an upper surface thereof is entirely opened, and the top plate 21 described above may be coupled to the opened upper surface thereof.

[0114] As shown in FIG. 4, a fastening bracket 211 for coupling to the bottom casing 24 to the top plate may be disposed on the lower surface of the top plate 21 at a position corresponding to a position of an upper end of the bottom casing 24.

[0115] As the top plate 21 is coupled to the upper end of the bottom casing 24, an inner space may be defined so as to be surrounded with the top plate 21 and the bottom casing 24 and may accommodate therein a plurality of internal components constituting the cooktop 20.

[0116] In addition, a plurality of mount brackets 241 may be provided integrally with or separately from the bottom casing 24.

[0117] The mount bracket 241 may be disposed in the inner space of the cooktop 20, and may protrude upwardly from the lower surface of the mount bracket 241 toward the electronic / electrical components.

[0118] The mount bracket 241 may support several electronic / electrical components 28 constituting the cooktop 20 while being disposed thereunder, thereby preventing the occurrence of sagging of components such as a main circuit board module 281, a SMPS circuit board module 282, an inverter circuit board module 283, a resonant circuit board module 284, an EMI filter module 285, etc., and supporting these components.

[0119] In addition, as illustrated in FIG. 4, an air intake hole 242 and an air exhaust hole 243 through which air for cooling the various electronic / electrical components constituting the cooktop 20 flows may be formed to extend through a lower surface 24a of the bottom casing 24 in the vertical direction.

[0120] The cooktop 20 of the cooking appliance 1 according to an embodiment of the present disclosure may further include the heater 25 including a working coil for heating a container in an induction heating manner, and as described above, the working coil may include a plurality of working coil patterns 2512 stacked on the printed circuit board, each pattern being formed in a spiral manner.

[0121] In consideration of the fact that the plurality of working coil patterns 2512 are stacked in a plurality of multi-layer structures to form a burner, the printed circuit board formed by stacking the working coil patterns 2512 may be referred to as a coil circuit board module.

[0122] In addition, as will be described later, the plurality of working coil patterns 2512, the plurality of sensing coil patterns 2514, the plurality of lead patterns 2513, a plurality of dummy pattern, etc. constituting the coil circuit board module may be formed in a manner similar to a general scheme of manufacturing a pattern of a printed circuit board. Therefore, in consideration of this fact, components referred to as the patterns below may be referred to as various terms such as a conductive portion, a copper portion, a thin film portion, and a printed portion.

[0123] In addition, in a similar manner to a general printed circuit board having a multilayer structure, the coil circuit board module of the present disclosure may include a working coil via hole H_v1, a sensing coil via hole H_v2, and a temperature sensor via hole H_v3 for electrically connecting the patterns disposed in different layers to each other, and a plurality of dummy via holes not electrically connected to other patterns. Similarly to the related art, the via holes may be formed in the through-holes formed in the coil circuit board module in a physical, chemical deposition, or coating manner, and thus, may be referred to as various terms such as a conductive coated portion or a conductive deposited portion.

[0124] A plurality of coil circuit board modules constituting the heater 25 may be provided in consideration of manufacturing convenience and efficiency.

[0125] FIGS. 4 and 5 illustrate an embodiment of the cooktop 20 including the heater 25 including a total of three coil circuit board modules. However, the present disclosure will be described below on the basis of an embodiment in which the three coil circuit board modules are provided as illustrated in the drawing. The present disclosure is not limited thereto.

[0126] The three coil circuit board modules 251, 252, and 253 are referred to as a first coil circuit board module 251, a second coil circuit board module 252, and a third coil circuit board module 253 in an order starting from the left side.

[0127] Each of the coil circuit board modules 251, 252, and 253 may include a plurality of burners 2511 for heating the container.

[0128] FIG. 5 illustrates an embodiment in which eight burners 2511 may be provided in each of the first coil circuit board module 251 and the third coil circuit board module 253, and six burners 2511 may be provided in the second coil circuit board module 252. As will be described later, the number of burners 2511 may be set to vary depending on the size and output of the cooktop 20. Hereinafter, the present disclosure will be described based on an example in which each of the first coil circuit board modules 251 and the third coil circuit board modules 253 has eight burners 2511, and the second coil circuit board module 252 has six burners.

[0129] In addition, although FIG. 5 illustrates that the shapes and sizes of the respective burners 2511 are the same as each other, this is merely an example. Similarly, the shape and size of the burners 2511 may be set to vary according to the size and output of the cooktop 20.

[0130] In each of the coil circuit board modules 251, 252, and 253, the working coil patterns 2512 constituting each of the plurality of burners 2511 may be stacked in multiple layers.

[0131] In addition, in each of the coil circuit board modules 251, 252, and 253, sensing coil patterns 2514 as a means for detecting whether the container is seated at a specific position may be stacked on the upper surface 21a of the top plate 21.

[0132] In addition, a temperature sensor 2515 for sensing a temperature of each of corresponding areas of the top plate 21 may be provided in each of the coil circuit board modules 251, 252, and 253.

[0133] In this regard, as will be described later, the working coil pattern 2512, the sensing coil pattern 2514, and the temperature sensor 2515 may be provided in a form integrated with each other in each of the coil circuit board modules 251, 252, and 253. Therefore, a vertical length of the heater 25 of the cooktop 20 according to the present disclosure is significantly reduced compared to the related art, so that the vertical size of the cooktop 20 may be reduced, thereby significantly improving space utilization and significantly simplifying a manufacturing process of the cooktop 20.

[0134] Each of the working coil pattern 2512 and the sensing coil pattern 2514 may extend in a spiral shape. The working coil patterns 2512 may be stacked in a vertical direction. The sensing coil patterns 2514 may be stacked in a vertical direction.

[0135] In this regard, as will be described below, each of the first to third coil circuit board modules 251, 252, and 253 may be formed in a form in which the working coil patterns 2512 are stacked in 10 to 12 layers and the sensing coil patterns 2514 are stacked in two layers in the vertical direction. Accordingly, each of the coil circuit board modules 251, 252, and 253 may have a multi-layer structure having 12 to 14 layers.

[0136] In addition, since a thickness in the vertical direction of each layer is small due to the characteristics of a layer stacking process of the printed circuit board, the number of layers of each of the coil circuit board modules 251, 252, and 253 may exceed 14. That is, although the number of layers of each of the coil circuit board modules 251, 252, and 253 is determined according to a specific design condition, there is no particular limitation to the number of layers of each of the coil circuit board modules 251, 252, and 253.

[0137] In a cross-sectional view perpendicular to a current traveling direction, the working coil pattern 2512 having a spiral shape should be formed while the copper pattern extends along the vertical and horizontal directions. Therefore, the working coil pattern 2512 having 4 or greater layers may be applied. That is, each of the coil circuit board modules 251, 252, and 253 may have at least four layers of the copper pattern

[0138] Each sensing coil pattern may be disposed inwardly of an area occupied with the working coil pattern 2512 constituting the individual burner 2511, or may be disposed in an area between a pair of adjacent working coil patterns 2512.

[0139] In the present embodiment, a pair of sensing coil patterns 2514 may be disposed inwardly of an area occupied with each working coil pattern 2512, and a pair of sensing coil patterns 2514 may be disposed in an area between the pair of adjacent working coil patterns 2512, as will be described later in consideration of the efficiency and accuracy of container detection.

[0140] Each temperature sensor 2515 for sensing the temperature of the top plate 21 may be disposed at a position corresponding to a center of each of the sensing coil patterns 2514.

[0141] Details of the working coil pattern 2512, the sensing coil pattern 2514, and the temperature sensor 2515 constituting the first to third coil circuit board modules 251, 252, and 253 will be described later with reference to FIG. 6.

[0142] The cooktop 20 of the cooking appliance 1 according to an embodiment of the present disclosure may further include the board supporter 26.

[0143] The internal components disposed inside the cooktop 20 may be mounted on the board supporter 26 which serves to support the internal components.

[0144] More specifically, as illustrated in FIGS. 4, the first to third coil circuit board modules 251, 252, and 253 and a ferrite core module 27 may be seated on an upper surface of the board supporter 26. Therefore, the board supporter 26 functions as a coil base on which a working coil and a ferrite core are mounted conventionally.

[0145] In addition, as shown in FIG. 4, several electronic / electrical components 28 constituting the cooktop 20 may be installed under the board supporter 26.

[0146] The electronic / electrical components 28 may include the main circuit board module 281, the SMPS circuit board module (a switching mode power supply device) 282, the inverter circuit board module 283, the resonant circuit board module 284, the EMI filter module 285, a blower module 286, a light source module 23, etc.

[0147] These electronic / electrical components 28 may be disposed in a space formed under the board supporter 26 and between the lower surface 24a of the bottom casing 24 and the board supporter 26.

[0148] By way of example, in order to effectively accommodate these electronic / electrical components 28, the board supporter 26 may have a box shape turned upside down such that a lower surface thereof facing the bottom casing 24 is entirely open.

[0149] Accordingly, the main circuit board 281, the SMPS circuit board (switching mode power supply device) 282, the inverter circuit board 283, the resonant circuit board 284, the EMI filter 285, a blowing fan module 286, and the light source module 23 may be assembled with the board supporter 26 in a stacked manner in an accommodation space formed inside the board supporter 26.

[0150] As described above, the first to third coil circuit board modules 251, 252, and 253 are seated on the upper surface of the board supporter 26, and the electronic / electrical component 28 is seated on the lower surface of the board supporter 26 and inside the board supporter 26. Thus, a wiring structure between the electronic / electrical component 28 and a wiring structure between the electronic / electrical component 28 and the first to third coil circuit board modules 251, 252, and 253 may be significantly simplified and simple.

[0151] In particular, in a conventional cooktop 20, almost all components need to be disassembled in a reverse order of an assembly process in order to repair the inverter circuit board as a major cause of failure and defect.

[0152] On the contrary, in the cooktop 20 of the cooking appliance 1 according to an embodiment of the present disclosure, when only the bottom casing 24 is disassembled in a state in which the cooktop is turned upside down such that the bottom casing 24 faces upwardly, a user may have easy access to the electronic / electrical component 28 such as the inverter circuit board module 283, thereby easily repairing or replacing the electronic / electrical component 28 in which a failure has occurred.

[0153] In this regard, the assembly process of the cooktop 20 of the cooking appliance 1 according to an embodiment of the present disclosure will be briefly described.

[0154] First, a plurality of ferrite core modules 27 may be assembled to the upper surface 261 of the board supporter 26.

[0155] The ferrite core module 27 according to an embodiment of the present disclosure may be configured in a modularized manner by coupling a plurality of ferrite cores to each other. This is devised with taking into account that crack defects or magnetic field loss may occur when a ferrite core formed as a single body and having a relatively large volume is applied.

[0156] As described above, the plurality of ferrite cores are modularized to form the ferrite core module 27 which in turn may be installed on the board supporter 26, thereby reducing the number of components and simplifying the assembly process.

[0157] By way of example, the ferrite core module 27 may be manufactured in an insert injection manner. As described above, the ferrite core module 27 is manufactured in the insert injection manner, such that a separate jig for fixing the ferrite core unit employed when the cooktop 20 is assembled as in the related art may be omitted.

[0158] In addition, as described above, the ferrite cores are modularized to form the plurality of ferrite core modules 27. Thus, even when some of the ferrite cores are damaged, the damaged cores may be repaired via simple replacement of the damaged ones.

[0159] When the installation of the plurality of ferrite core modules 27 on the upper surface 261 of the board supporter 26 has been completed, the first to third coil circuit board modules 251, 252, and 253 may be seated on top of the ferrite core modules 27.

[0160] Next, in a state in which the first to third coil circuit board modules 251, 252, and 253 have been seated thereon, the board supporter 26 may be turned upside down, and the electronic / electrical components 28 may be assembled.

[0161] As described above, several electronic / electrical components 28 may be installed and assembled on the lower surface of the board supporter 26. In this regard, these electronic / electrical components 28 may be installed and assembled on the board supporter 26 while being in a turned upside down state.

[0162] The cooktop 20 of the cooking appliance 1 according to an embodiment of the present disclosure may further include an thermal insulator 291 disposed between the first to third coil circuit board modules 251, 252, and 253 and the top plate 21 and on top of the first to third coil circuit board modules 251, 252, and 253.

[0163] The thermal insulator 291 is disposed on the upper surface 21a of the top plate 21 and serves to minimize the transfer of heat generated from the container heated by the working coil pattern 2512 to the working coil pattern 2512.

[0164] In order to perform such a heat insulation function, the thermal insulator 291 may be disposed in a form of a pad covering an entirety of the first to third coil circuit board modules 251, 252, and 253.

[0165] In the present embodiment, the thermal insulator 291 may be divided into a plurality of pads.

[0166] More specifically, each of the thermal insulators 291 may be divided into a plurality of pads, each having a width in the left-right direction corresponding to a width in the left-right direction of the burner 2511 formed in each of the first to third coil circuit board modules 251, 252, and 253.

[0167] As described above, the thermal insulator 291 is divided into a plurality of thermal insulators 291, such that a predetermined gap may be formed between the adjacent thermal insulators 291. Thus, the visible light generated from the light source module 23 may travel through the predetermined gap and be irradiated to the lower surface of the top plate 21 so that the above-described display line L may be displayed on the top plate 21.

[0168] The thermal insulator 291 may additionally serve to electrically insulate the working coil pattern 2512 or the sensing coil pattern 2514 formed in the first to third coil circuit board modules 251, 252, and 253 from the top plate 21.

[0169] In this regard, the thermal insulator 291 may be made of a material having both thermal insulation performance and electrical insulation performance.

[0170] In one example, although not shown, in order to additionally supplement the electrical insulation performance of the thermal insulator 291, an electrical insulator may be added between the thermal insulator 291 and the top plate 21 and be disposed on top of the thermal insulator 291. By way of example, the electrical insulator may be a mica sheet having a thickness smaller than a vertical thickness of the thermal insulator 291.[Detailed configuration of coil circuit board module]

[0171] Hereinafter, a detailed configuration of each of the coil circuit board modules 251, 252, and 253 of the cooktop 20 constituting the cooking appliance 1 according to an embodiment of the present disclosure will be described with reference to FIGS. 6 to 15.

[0172] As described above, the cooktop of an embodiment of the present disclosure may include the first to third coil circuit board modules 251, 252, and 253.

[0173] In this regard, the first to third coil circuit board modules 251, 252, and 253 may be configured in substantially the same manner as each other except for the number of working coil patterns 2512 and the number of sensing coil patterns 2514 constituting the burner 2511.

[0174] Therefore, hereinafter, the description will be made based on the first coil circuit board module 251. Unless otherwise described, the description as set forth below may be applied to the second coil circuit board module 252 and the third coil circuit board module 253 in substantially the same manner.

[0175] First, as described above, the first coil circuit board module 251 may be formed by stacking the working coil patterns 2512 in multiple layers so as to constitute each of the plurality of burners 2511.

[0176] As illustrated in FIG. 6, for example, the first coil circuit board module 251 may include working coil patterns 2512 vertically arranged in a multi-layer structure of 10 layers, sensing coil patterns 2514 vertically arranged in a multi-layer structure of 2 layers, and each electrical insulating material disposed between adjacent ones of the working coil patterns 2512 and the sensing coil patterns 2514 to electrically insulate the adjacent ones from each other. The electrical insulating material may be formed by curing a prepreg composed of a thermosetting resin generally used to form a printed circuit board and glass fibers. In an example, the applicable thermosetting resin is preferably epoxy resin-based, and specifically, FR-4 may be applied as the applicable thermosetting resin.

[0177] The electrical insulating material including the prepreg as described above may be disposed between the layers of the working coil pattern 2512 having the multi-layer structure to insulate the coil patterns of the layers from each other, and may be disposed between the sensing coil patterns 2514 to insulate the sensing coil patterns 2514 from each other. In addition, the electrical insulating material may fill an area in which the patterns such as the working coil pattern 2512, the sensing coil pattern 2514, and the lead coil pattern 2513 are absent and thus may serve to constitute a layered structure of the individual layer.

[0178] Therefore, based on the working coil pattern 2512 and the sensing coil pattern 2514, the first coil circuit board module 251 may have a multi-layer structure having a total of 12 layers from a first layer 251a constituting the uppermost layer to the twelfth layer 2511 constituting the lowermost layer along the vertical direction.

[0179] In this regard, the first sensing coil pattern 2514a constituting the sensing coil pattern 2514 may be disposed at the first layer 251a of the first coil circuit board module 251 having the 12-layers structure.

[0180] In addition, a lead pattern 2513 may be disposed at the first layer 251a to electrically connect the first sensing coil pattern 2514a to a signal processor 2518 to be described later or to electrically connect the working coil pattern 2512 disposed at each of the third to twelfth layers 251c, 251d, 251e, 251f, 251g, 251h, 251i, 251j, 251k, and 2511 to the high-power terminal pattern 2516 to which the high-frequency power is applied.

[0181] In this regard, the lead pattern 2513 may include a first lead pattern 2513a for electrically connecting the working coil pattern 2512 disposed at each of the third to twelfth layers 251c, 251d, 251e, 251f, 251g, 251h, 251i, 251j, 251k, and 2511 to the high-power terminal pattern 2516, and a second lead pattern 2513b for electrically connecting the first sensing coil pattern 2514a to the signal processor 2518.

[0182] In addition, although not shown in FIG. 6, the temperature sensor 2515 for sensing the temperature of the top plate 21, the high-power terminal pattern 2516 to which high-frequency power is supplied from the inverter circuit board module 283, the signal processor 2518 for processing an output signal of the sensing coil pattern 2514 and an output signal of the temperature sensor 2515, and a third lead pattern 2513c for electrically connecting the temperature sensor 2515 and the signal processor 2518 to each other may be further added to the first layer 251a.

[0183] A second sensing coil pattern 2514b constituting the sensing coil pattern 2514 and a second lead pattern 2513b electrically connecting the second sensing coil pattern 2514b to the signal processor 2518 may be disposed at the second layer 251b of the first coil circuit board module 251.

[0184] That is, in order to increase the efficiency and effect of sensing of the container, the sensing coil pattern 2514 may include the first sensing coil pattern 2514a disposed at the first layer 251a and the second sensing coil pattern 2514b disposed at the second layer 251b.

[0185] In this regard, as will be described later, the first sensing coil pattern 2514a and the second sensing coil pattern 2514b may be configured to be connected in series with each other via a sensing coil via hole H_v2 extending through the first layer 251a and the second layer 251b, thereby serving as the single sensing coil pattern 2514.

[0186] The second sensing coil pattern 2514b constituting the sensing coil pattern 2514 may be disposed on the second layer 251b of the first coil circuit board module 251.

[0187] As will be described later, the working coil pattern 2512 disposed in the cooktop 20 of the cooking appliance 1 according to an embodiment of the present disclosure may include a first type pattern 2512a and a second type pattern 2512b in which a traveling direction or a winding direction of individual pattern strands 2512a-1 and 2512b-1 are opposite to each other so that the magnetic field may evenly act on the container.

[0188] As illustrated in FIG. 6, for example, the working coil pattern 2512 of the first type pattern 2512a may be formed at each of the third to seventh layers 251c, 251d, 251e, 251f, and 251g. In this regard, in the first type pattern 2512a, the traveling direction or the winding direction of the individual pattern strand 2512a-1 is a first direction.

[0189] In addition, in an example, the working coil pattern 2512 of the second type pattern 2512b may be formed at each of the eighth to twelfth layers 251h, 251i, 251j, 251k, and 2511. In this regard, in the second type pattern 2512b, the traveling direction or the winding direction of the individual pattern strand 2512b-1 is a second direction.

[0190] In this regard, as illustrated, the first lead pattern 2513a formed in the first layer 251a, the first type pattern 2512a disposed in each of the third to seventh layers 251c, 251d, 251e, 251f, and 251g, and the second type pattern 2512b disposed in each of the eighth to twelfth layers 251h, 251i, 251j, 251k, and 2511 may be configured to be collectively connected to each other via a working coil via hole H_v1 continuously extending through the first layer 251a to the twelfth layer 2511.

[0191] Accordingly, the plurality of first type patterns 2512a and the plurality of second type patterns 2512b constituting a specific burner among the plurality of burners as described below may be collectively connected in series to each other via the working coil via hole H_v1.

[0192] In one example, although not shown, an electrical insulating material may be additionally formed on top of the first layer 251a and under the twelfth layer 2511.

[0193] The multi-layer structure of the first coil circuit board module 251 illustrated in FIG. 6 is merely an example.

[0194] That is, the multi-layer structure may be modified so that the second sensing coil pattern 2514b is disposed at the sixth layer 251f or the seventh layer 251g serving as a middle layer or disposed at the twelfth layer 2511 serving as the lowermost layer as a layer other than the second layer 251b.

[0195] In addition, although FIG. 6 illustrates that the first type patterns 2512a are consecutively arranged from the third layer 251c to the seventh layer 251g and the second type patterns 2512b are consecutively arranged from the eighth layer 251h to the twelfth layer 2511, the present disclosure is not limited thereto, and the first type patterns 2512a and the second type patterns 2512b may be alternately and repeatedly arranged with each other vertically.

[0196] It will be considered that such a modified example naturally falls within the scope of the present disclosure. However, hereinafter, the description will be given based on the multi-layer structure of the first coil circuit board module 251 as shown in FIG. 6. However, the present disclosure is not limited thereto.

[0197] In the first coil circuit board module 251 having the multi-multi-layer structure, a shape of the working coil pattern 2512 serving as the second type pattern 2512b may be printed on a copper thin film in a masking manner, an unnecessary portion may be removed using an etching process to form a pattern, and an electrical insulating material may be coated on the formed pattern to form the twelfth layer 2511 serving as the lowest layer.

[0198] A thickness of the copper thin film applied in this embodiment may be in a range of 0.13mm to 0.15mm, preferably 0.14mm.

[0199] Therefore, when additional surface treatment or the like is not performed during the layer formation process, the thickness in the vertical direction of the individual pattern formed via the patterning of the copper thin film may be in a range of 0.13mm to 0.15mm.

[0200] In addition, a thickness of the electrical insulating material applied in the present embodiment may be in a range of 0.09mm to 0.11, preferably 0.1mm.

[0201] As described above, the twelfth layer 2511 serving as the lowermost layer has been formed, and then, the same process as the process of forming the twelfth layer 2511 is repeated thereon, thereby constituting the multi-layer structure as shown in FIG. 6.

[0202] Therefore, when the formation of the first coil circuit board module 251 having a total of 12 layers has been completed, a thickness of the first coil circuit board module 251 in the vertical direction may be in a range of 2.7mm to 3.3mm, preferably 3 mm.

[0203] In the present embodiment, the first coil circuit board module 251 is illustrated as having the multi-layer structure having a total of 12 layers. However, as mentioned above, the number of layers thereof may be greater than 12. In this case, the thickness of the first coil circuit board module 251 may be smaller than 10mm. When the thickness exceeds 10 mm, a spacing between the first coil circuit board module 251 and the top plate 21 may be too small, and it may be difficult to place the terminal pattern and the connector. For this reason, the thickness of the first coil circuit board module 251 in the vertical direction may be in a range of 2mm to 10mm.

[0204] A means known in the art may be applied to a method for manufacturing the multilayer printed circuit board for forming the first coil circuit board module 251 having the above-described shape and structure, and thus a detailed description of the manufacturing method will be omitted below.

[0205] FIG. 7 and FIG. 8 illustrate a plan view of the first layer 251a and the second layer 251b of the first coil circuit board module 251 having the multilayer structure, respectively.

[0206] In the present embodiment, the first coil circuit board module 251 may be constructed to have a rectangular shape in which a width in the front-rear direction is greater than a width in the left-right direction, based on the state in which the first coil circuit board module 251 is disposed in the cooktop 20.

[0207] Correspondingly, each of the first layer 251a serving as the uppermost layer and the second layer 251b serving as the next uppermost layer may be constructed to have a rectangular shape in which a width in the front-rear direction is greater than a width in the left-right direction.

[0208] As described above, the first sensing coil pattern 2514a constituting one layer of the sensing coil pattern 2514 arranged in two layers may be disposed in the first layer 251a. The second sensing coil pattern 2514b constituting the other layer of the sensing coil pattern 2514 arranged in the two layers may be disposed in the second layer 251b.

[0209] In this regard, as illustrated, each of the first sensing coil pattern 2514a and the second sensing coil pattern 2514b may be wound in a shape different from a shape in which the working coil pattern 2512 is wound.

[0210] That is, each of the first sensing coil pattern 2514a and the second sensing coil pattern 2514b may be wound in a circular spiral shape. By way of example, each of the first sensing coil pattern 2514a and the second sensing coil pattern 2514b may be set to have a winding number of 18 turns, and an outer diameter thereof may be in a range of 32mm to 34mm, preferably, 33mm. In addition, a width of each of the individual pattern strands constituting each of the first sensing coil pattern 2514a and the second sensing coil pattern 2514b may be in a range of 0.27mm to 0.33mm, preferably 0.3mm.

[0211] As will be described later, the working coil pattern 2512 is wound in a quadrilateral spiral shape.

[0212] In addition, each of the first sensing coil pattern 2514a and the second sensing coil pattern 2514b is positioned so as to partially overlap the working coil pattern 2512 in the vertical direction.

[0213] Accordingly, there is a possibility that a malfunction or a sensing error of each of the first sensing coil pattern 2514a and the second sensing coil pattern 2514b may occur due to the overlapping area.

[0214] As described above, each of the first sensing coil pattern 2514a and the second sensing coil pattern 2514b is wound in the circular spiral shape, such that interference between each of the first sensing coil pattern 2514a and the second sensing coil pattern 2514b and the working coil pattern 2512 wound in the quadrilateral spiral shape may be minimized. Thus, the possibility of malfunction and detection error of each of the first sensing coil pattern 2514a and the second sensing coil pattern 2514b may be minimized.

[0215] Each of the first sensing coil pattern 2514a and the second sensing coil pattern 2514b may be wound so that a winding start point thereof is not positioned at a center of the circular spiral. That is, a first central inner area in which each of the first sensing coil pattern 2514a and the second sensing coil pattern 2514b is not formed may be formed in a center area of the circular spiral shape.

[0216] The temperature sensor 2515 may be mounted in the central inner area of each of the first sensing coil pattern 2514a as described below. In order to distinguish the central inner area of the first sensing coil pattern 2514a from a central inner area formed inwardly of the working coil pattern 2512 described later, the central inner area of the first sensing coil pattern 2514a is referred to as the first central inner area below.

[0217] A detailed configuration of the arrangement of the temperature sensor 2515 will be described later with reference to FIG. 9.

[0218] In the present embodiment, a plurality of first sensing coil patterns 2514a and a plurality of second sensing coil patterns 2514b may be provided.

[0219] More specifically, each of some of the plurality of first sensing coil patterns 2514a may be entirely disposed in an area of a specific burner, while each of the others thereof may be disposed across a pair of adjacent burners 2511. Each of some of the plurality of second sensing coil patterns 2514b may be entirely disposed in an area of the specific burner, while each of the others thereof may be disposed across the pair of adjacent burners 2511.

[0220] By way of example, in the embodiment as illustrated in FIG. 7, when the first coil circuit board module 251 includes a total of eight burners 2511, a total of 28 first sensing coil patterns 2514a and a total of 28 second sensing coil patterns 2514b may be provided.

[0221] However, this is merely an example, and the number of the first sensing coil patterns 2514a may be adjusted to vary according to the size of the individual burner 2511 and the size of the first coil circuit board module 251. However, hereinafter, the description will be made based on an embodiment in which 28 first sensing coil patterns 2514a and 28 second sensing coil patterns 2514b are provided in the first coil circuit board module 251. The present disclosure is not limited thereto.

[0222] The first sensing coil patterns 2514a disposed at different positions may be constructed to have substantially the same number of turns, and similarly, the second sensing coil patterns 2514b disposed at different positions may be constructed to have the same number of turns.

[0223] A sensing coil via hole H_v2 may be formed at a start point or an end point of the first sensing coil pattern 2514a, and the sensing coil via hole H_v2 may be connected to an end point or a starting point of the second sensing coil pattern 2514b. Accordingly, the first sensing coil pattern 2514a and the second sensing coil pattern 2514b may be connected in series to each other to form the single sensing coil pattern 2514.

[0224] A start point or an end point not connected to the sensing coil via hole H_v2 may be electrically connected to the signal processor 2518 provided in the first layer 251a via the second lead pattern 2513b formed in the first layer 251b or the second layer 251a, as shown in FIGS. 7 and 8.

[0225] In one example, the temperature sensor 2515 to be described later may be electrically connected to the signal processor 2518 via the third lead pattern 2513c. As illustrated in FIG. 8, the third lead pattern 2513c may be formed in the second layer 251b.

[0226] As illustrated in FIG. 7, when a total of 28 sensing coil patterns 2514 are provided, four signal processors 2518 may be provided by way of example. In this case, one pair of signal processors 2518 may be disposed in a center area of a rear edge of the first layer 251a and adjacent to each other, while the other pair of signal processors 2518 may be disposed in a center area of a front edge of the first layer 251a and adjacent to each other.

[0227] For example, in an embodiment as illustrated in FIG. 7, a group of six sensing coil patterns 2514 which are arranged in the left side among the plurality of sensing coil patterns 2514 which are arranged in the left and right sides and are arranged in an area between a center line in a front-rear direction and the front edge of the first layer 251a, and 6 temperature sensors 2515 which are respectively arranged in the six sensing coil patterns 2514 may be allocated to a left signal processor 2518 among the pair of signal processors 2518 disposed at the front edge of the first layer 251a. A group of six sensing coil patterns 2514 which are arranged in the right side among the plurality of sensing coil patterns 2514 which are arranged in the left and right sides and are arranged in an area between the center line in a front-rear direction and the front edge of the first layer 251a, and 6 temperature sensors 2515 which are respectively arranged in the six sensing coil patterns 2514 may be allocated to a right signal processor 2518 among the pair of signal processors 2518 disposed at the front edge of the first layer 251a.

[0228] A group of sensing coil patterns 2514 and the temperature sensors 2515 may be allocated to the pair of signal processors 2518 disposed at the rear edge of the first layer 251a in the same manner as the allocation manner as described above.

[0229] As described above, the two pairs of signal processors 2518 are spaced from each other by the maximum spacing along the front-rear direction, such that the structure of each of the second lead pattern 2513b connecting the individual sensing coil patterns 2514 to the signal processor 2518 and the third lead pattern 2513c connecting the individual temperature sensor 2515 to the signal processor 2518 may be simplified and a length thereof may be minimized.

[0230] In addition, a low-power terminal (not shown) for signal transmission / reception and a lower-power connector 2518g mounted on the low-power terminal may be mounted together at each of the front edge and the rear edge of the first layer 251a and be disposed adjacent to each signal processor 2518 and may transmit an electrical signal output to the signal processor 2518 to the above-described main circuit board module 281.

[0231] In one example, as will be described later, the first lead pattern 2513a for transmitting high-frequency power to each of the first type pattern 2512a and the second type pattern 2512b constituting the working coil pattern 2512 may be disposed in the first layer 251a.

[0232] As shown, each first lead pattern 2513a may be constructed to be divided into a plurality of pattern strands.

[0233] Accordingly, the first lead pattern 2513a is divided into a plurality of pattern strands, so that power loss that may occur due to the skin effect when the high-frequency power is applied thereto may be minimized.

[0234] In one example, in consideration of the efficiency of power supply, the plurality of pattern strands may be coupled to each other at one end and the other end of the first lead pattern 2513a to form a common lead terminal 2513a1.

[0235] The common lead terminal 2513a1 formed at one end of the first lead pattern 2513a may be connected to the high-power terminal pattern 2516 formed at each of the front edge and the rear edge of the first layer 251a.

[0236] In one example, the first lead pattern 2513a may be disposed inside the first layer 251a and may extend from one end thereof and may extend toward the common lead terminal 2513a1 formed at the other end thereof.

[0237] In one example, in the present embodiment, the high-frequency power may be supplied to the pair of working coil patterns 2512 disposed adjacent to each other via three high-power terminal patterns 2516 and three first lead patterns 2513a.

[0238] That is, when the high-frequency power is supplied to each of the working coil patterns 2512 via the pair of high-power terminal patterns 2516 and the pair of first lead patterns 2513a, two pairs of high-power terminal patterns 2516 and two pairs of first lead patterns 2513a should be allocated to the pair of working coil patterns 2512.

[0239] In accordance with the present disclosure, the high-frequency power is supplied to the pair of working coil patterns 2512 via the three high-power terminal patterns 2516 and the three first lead patterns 2513a disposed adjacent to each other, so that the number of the high-power terminal patterns 2516 and the number of the first lead patterns 2513a may be minimized, and accordingly, the circuit configuration may be simplified.

[0240] This will be described in more detail with reference to FIG. 8.

[0241] FIG. 8 is a partially enlarged view of FIG. 7, and a detailed configuration of the high-power terminal pattern 2516 and the first lead pattern 2513a for supplying the power to the pair of working coil patterns 2512 disposed adjacent to each other and in a left rear side based on the state illustrated in FIG. 7 is illustrated.

[0242] Based on the illustrated state, the leftmost high-power terminal pattern 2516 is referred to as a first high-power terminal pattern 2516a, the middle high-power terminal pattern 2516 is referred to as a second high-power terminal pattern 2516b, and the rightmost high-power terminal pattern 2516 is referred to as a third high-power terminal pattern 2516c.

[0243] In addition, the first lead pattern 2513a connected to the first high-power terminal pattern 2516a will be referred to as a (1-1)th lead pattern 2513a-1, the first lead pattern 2513a connected to the second high-power terminal pattern 2516b will be referred to as a (1-2)th lead pattern 2513a-2, and the first lead pattern 2513a connected to the third high-power terminal pattern 2516c will be referred to as a (1-3)th lead pattern 2513a-3.

[0244] As illustrated, the first high-power terminal pattern 2516a may be electrically connected to an outer common terminal of one working coil pattern 2512 disposed further rearwardly of the other working coil pattern 2512 among the pair of working coil patterns 2512 via the (1-1)th lead pattern 2513a-1.

[0245] Hereinafter, the outer common terminal of the working coil pattern 2512 will be referred to as a second common terminal 2512a-3 and 2512b-3, and an inner common terminal of the working coil pattern 2512 will be referred to as a first common terminal 2512a-2 and 2512b-2.

[0246] As will be described later, the first common terminal 2512a-2 and 2512b-2 may include the first common terminal 2512a-2 of the first type pattern 2512a and the first common terminal 2512b-2 of the second type pattern 2512b. The first common terminal 2512a-2 of the first type pattern 2512a and the first common terminal 2512b-2 of the second type pattern 2512b may be connected in series to each other via a working coil via hole H_v1. As will be described later, the first common terminal 2512a of the first type pattern 2512a-2 and the first common terminal 2512b of the second type pattern 2512b-2 may be formed at positions vertically overlapping each other.

[0247] Similarly, the second common terminal 2512a-3 and 2512b-3 may include the second common terminal 2512a-3 of the first type pattern 2512a and the second common terminal 2512b-3 of the second type pattern 2512b. The second common terminal 2512a-3 of the first type pattern 2512a and the second common terminal 2512b-3 of the second type pattern 2512b may be connected in series to each other via the working coil via hole H_v1. As will be described later, the second common terminal 2512a-3 of the first type pattern 2512a and the second common terminal 2512b-3 of the second type pattern 2512b may be formed at positions vertically overlapping each other.

[0248] In this regard, the common lead terminal 2513a1 formed at the other end of the (1-1)th lead pattern 2513a-1 may be formed at a position vertically overlapping the second common terminal 2512a-3 and 2512b-3 of the working coil pattern 2512 disposed at the rear side, and may be connected in series with the second common terminal 2512a-3 and 2512b-3 of the working coil pattern 2512 via the working coil via hole H_v1.

[0249] As illustrated, the second high-power terminal pattern 2516b may be electrically connected to the second common terminal 2512a-3 and 2512b-3 of one working coil pattern 2512 disposed in front of the other working coil pattern 2512 among the pair of working coil patterns 2512 via the (1-2)th lead pattern 2513a-2.

[0250] In this regard, the common lead terminal 2513a1 formed at the other end of the first-second lead pattern 2513a-2 may be formed at a position vertically overlapping the second common terminal 2512a-3 and 2512b-3 of one working coil pattern 2512 disposed in front of the other working coil pattern 2512 among the pair of working coil patterns 2512, and may be connected in series with the second common terminal 2512a-3 and 2512b-3 of the working coil pattern 2512 via the working coil via hole H_v1.

[0251] In addition, the third high-power terminal pattern 2516c may be electrically connected to both the first common terminals 2512a-2 and 2512b-2 of the pair of working coil patterns 2512 via the (1-3)th lead pattern 2513a-3.

[0252] That is, as illustrated, the (1-3)th lead pattern 2513a-3 may have a common lead terminal 2513a1 formed at the other end thereof. A common lead terminal 2513a1 may be additionally provided at a middle position between one end and the other end of the (1-3)th lead pattern 2513a-3.

[0253] The common lead terminal 2513a1 formed at the other end of the (1-3)th lead pattern 2513a-3 may be electrically connected to the first common terminal 2512a-2 and 2512b-2 of one working coil pattern 2512 disposed in front of the other working coil pattern 2512 among the pair of working coil patterns 2512 via the working coil via hole H_v1.

[0254] In addition, the common lead terminal 2513a1 formed at the middle position of the (1-3)th lead pattern 2513a-3 may be electrically connected to the first common terminal 2512a-2 and 2512b-2 of one working coil pattern 2512 disposed in rear of the other working coil pattern 2152 among the pair of working coil patterns 2512 via the working coil via hole H_v1.

[0255] That is, the (1-3)th lead pattern 2513a-3 may be constructed to act as a common lead pattern capable of supplying the power to both the pair of working coil patterns 2512.

[0256] Accordingly, the pair of working coil patterns 2512 may be controlled to work as follows: When only the rear working coil pattern 2512 works, the power is supplied to the first high-power terminal pattern 2516a and the third high-power terminal pattern 2516c and power to the second high-power terminal pattern 2516b is cut off; When only the front working coil pattern 2512 works, the power is supplied to the second high-power terminal pattern 2516b and the third high-power terminal pattern 2516c and the power to the first high-power terminal pattern 2516a is cut off; or When both the pair of working coil patterns 2512 simultaneously work, the power is supplied to all of the first to third high-power terminal patterns 2516c.

[0257] In one example, based on the state illustrated in FIGS. 7 and 8, a plurality of edge notches 2517 may be formed at each of the front edge and the rear edge of the first layer 251a.

[0258] The edge notch 2517 serves to provide a coupling space which a high-power connector 254 for supplying the high-frequency power to the high-power terminal pattern 2516 may be fitted into.

[0259] As shown, the individual high-power terminal patterns 2516 may be arranged in a divided manner while the edge notch 2517 is interposed between adjacent ones thereof such that the connector may be connected to the high-power terminal pattern 2516 while the connector is fitted into the edge notch 2517.

[0260] As described above, the edge notch 2517 serves to provide a space to which a connector to be described later may be coupled. Accordingly, the edge notch 2517 may be referred to as a connector coupling portion, an edge portion, a cut-away, an opening, or the like, in consideration of a function and a shape thereof.

[0261] In order to reduce a manufacturing cost via component commonization, the connectors having the same shape and the same structure may be respectively fitted to the edge notches 2517. To this end, the edge notches 2517 may be formed to have the same shape and the same size.

[0262] In one example, as illustrated in FIG. 9, the edge notch 2517 may extend through the first layer 251a to the twelfth layer 2511 of the first coil circuit board module 251. A detailed configuration of each of the connector and the edge notch 2517 will be described later with reference to FIG. 17A and subsequent drawings.

[0263] In addition, a screw hole H_sc may be formed so as to extend through the first coil circuit board module 251. The screw hole H_sc may be formed to extend through the first layer 251a to the twelfth layer 2511 in the same manner as the edge notch 2517 does.

[0264] A fastening means such as a screw bolt which is not shown may pass through the screw hole H_sc and be coupled to the above-described board supporter 26. Thus, the first coil circuit board module 251 may be firmly fastened to the above-described board supporter 26.

[0265] By way of example, the screw hole H_sc may be disposed at each of four corners so as not to interfere with the patterns constituting the first coil circuit board module 251.

[0266] In addition, a ground terminal for grounding the first coil circuit board module 251 may be formed in the first layer 251a and around the screw hole H_sc.

[0267] The first coil circuit board module 251 may have a light-transmission slit hole H_sl formed therein to extend through the first layer 251a to the twelfth layer 2511.

[0268] The above-described light source module 23 may be disposed under the light-transmission slit hole H_sl, and the visible light generated from the light source module 23 may travel through the light-transmission slit hole H_sl and then be irradiated to the lower surface of the top plate 21. Accordingly, the display line L extending linearly may be displayed in the top plate 21.

[0269] In order to implement the display line L extending linearly, the light-transmission slit hole H_sl may extend linearly in a shape corresponding to the shape of the display line L.

[0270] However, as illustrated in FIG. 7, in order to prevent the rigidity of the first coil circuit board module 251 from being rapidly degraded, the light-transmission slit hole H_sl may be divided into a plurality of divided holes, and the divided light-transmission slit holes H_sl may be linearly arranged.

[0271] In addition, a connection portion connecting the divided light-transmission slit holes H_sl to each other may be provided between the divided light-transmission slit holes H_s1.

[0272] The light-transmission slit hole H_sl may be formed in a process of punching a corresponding portion after an entire stacking process of the circuit board module has been completed.

[0273] Alternatively, in order to project the visible light generated from the light source module 23, two coil circuit board modules may be disposed to be spaced apart from each other so that a predetermined gap is formed between the two coil circuit board modules entirely isolated from each other. Accordingly, a separate punching process or a separate slit hole process on the first coil circuit board module 251 may be omitted.

[0274] Hereinafter, a relative arrangement position of the sensing coil pattern 2514 and an arrangement and arrangement structure of the temperature sensor 2515 will be described with reference to FIG. 10.

[0275] FIG. 10 is a partially enlarged top view of the illustrated first coil circuit board module 251. In FIG. 11, the sensing coil pattern 2514 and the working coil pattern 2512 are shown together with each other for the purpose of description and understanding of relative positions. However, in the present embodiment, because the sensing coil pattern 2514 and the working coil pattern 2512 are actually disposed at different layers, both the sensing coil pattern 2514 and the working coil pattern 2512 may not be observed at the same time.

[0276] As described above, the individual sensing coil patterns 2514 wound in the circular spiral shape may be disposed so as to partially overlap the working coil pattern 2512 wound in the quadrilateral spiral shape along the vertical direction.

[0277] In this regard, each of some of the plurality of sensing coil patterns 2514 may be entirely disposed inside the single burner 2511 composed of the working coil pattern 2512, while each of the others of the plurality of sensing coil patterns 2514 may be disposed across the pair of adjacent burners 2511.

[0278] (a) in FIG. 10 illustrates a state in which the sensing coil pattern 2514 is entirely disposed inside the working coil pattern 2512, and (b) in FIG. 10 illustrates a state in which the sensing coil pattern 2514 is disposed across a pair of adjacent working coil patterns 2512.

[0279] First, as will be described later, the working coil pattern 2512 formed by stacking the plurality of first type patterns 2512a and the plurality of second type patterns 2512b may be wound a plurality of times to have a quadrilateral spiral shape.

[0280] For example, each of the first type patterns 2512a and the second type patterns 2512b constituting the working coil pattern 2512 may be wound a total of nine times. That is, the working coil pattern 2512 may be wound to have 9 turns. In this regard, each of the individual turns of each of the first type pattern 2512a and the second type pattern 2512b may be defined to mean a state in which a coil is wound one round in a spiral manner. That is, the nine turns may mean a state in which each of the first type pattern 2512a and the second type pattern 2512b is spirally wound nine turns or nine windings.

[0281] In addition, for example, six to five pattern strands 2512a-1 and 2512b-1 may be bundled with each other to form one bundle which is wound.

[0282] In this regard, as illustrated, a spacing between adjacent ones of the turns constituting each of the first type pattern 2512a and the second type pattern 2512b may be maintained to be substantially constant. However, a horizontal spacing between the third turn and the fourth turn may be much larger than a horizontal spacing between adjacent ones of the other turns.

[0283] The area corresponding to the relatively larger horizontal spacing may constitute an inner clearance D1.

[0284] In addition, an outer clearance D2 as a front-rear clearance similar to the inner clearance D1 may be formed between the pair of working coil patterns 2512 disposed adjacent to each other in the front-rear direction based on a state in which the first coil circuit board module 251 is disposed as illustrated in (b) in FIG. 10.

[0285] The inner clearance D1 and the outer clearance D2 may be formed to have the same size, and for example, each of the inner clearance D1 and the outer clearance D2 may be a range of 3.8mm to 4.2mm, and preferably 4 mm.

[0286] As illustrated, the sensing coil pattern 2514 may be disposed such that the center point thereof is located in each of the inner clearance D1 and the outer clearance D2.

[0287] Preferably, when the center point of the sensing coil pattern 2514 is located in the inner clearance D1 as shown in (a) in FIG. 10, the center point of the sensing coil pattern 2514 may approximately coincide with a middle position of an area between the third turn and the fourth turn.

[0288] In addition, preferably, when the center point of the sensing coil pattern 2514 is located in the outer clearance D2 as shown in (b) in FIG. 10, the center point of the sensing coil pattern 2514 may approximately coincide with a middle position of an area between the pair of working coil patterns 2512 disposed adjacent thereto.

[0289] In addition, as described above, each of the first sensing coil pattern 2514a and the second sensing coil pattern 2514b has an area in which no pattern is formed. Thus, a first central inner area 2514c may be formed inwardly of the sensing coil pattern 2514.

[0290] As illustrated, the first central inner area 2514c of the sensing coil pattern 2514 may have a disk shape, and a diameter of the disk-shaped inner area may be equal to or slightly smaller than a size of each of the inner clearance D1 and the outer clearance D2.

[0291] A combination of the inner clearance D1 and the outer clearance D2 of the working coil pattern 2512 and the first central inner area 2514c of the sensing coil pattern 2514 may provide a space in which the temperature sensor 2515 may be mounted.

[0292] As illustrated, the temperature sensor 2515 for sensing the temperature of the top plate 21 may be mounted in the first layer 251a and in the first central inner area 2514c of each sensing coil pattern 2514. In this regard, the size of each of the inner clearance D1 and the outer clearance D2 and the diameter of the sensing coil pattern 2514 may be larger than a size of the temperature sensor 2515, that is, a longitudinal width thereof.

[0293] Accordingly, when being viewed from the top plate 21, the individual temperature sensor 2515 may be disposed in the first layer 251a and in the first central inner area 2514c as surrounded with each sensing coil pattern 2514.

[0294] In addition, the temperature sensor 2515 may be disposed at a position vertically non-overlapping the sensing coil pattern 2514 and in the first central inner area 2514c so that interference between the temperature sensor 2515 and the sensing coil pattern 2514 does not occur.

[0295] In one example, in an example, the temperature sensor 2515 may be embodied as a surface mounted devices (SMD) type sensor in a form of a chip that is relatively small, easily mounted in the first layer 251a, and has excellent sensing capability.

[0296] The SMD-type temperature sensor 2515 may include, for example, a sensor body, a thermistor disposed in the sensor body, and a pair of electrodes exposed to an upper end surface of the first coil circuit board module 251.

[0297] The temperature sensor 2515 may be mounted on the upper end surface of the first coil circuit board module 251. That is, the temperature sensor 2515 may be attached and fixed to the upper end surface of the first coil circuit board module 251.

[0298] More specifically, a pair of conductive sensor pads (not shown) for attaching the temperature sensor 2515 may be disposed in the first coil circuit board module 251, and the pair of electrodes of the temperature sensor 2515 may be attached to the pair of sensor pads, respectively.

[0299] In this regard, the pair of electrodes of the temperature sensor 2515 may be electrically connected and attached to the corresponding pair of sensor pads using various physical and chemical methods, such as welding, soldering, and adhesive, respectively.

[0300] However, when the SMD-type temperature sensor 2515 is mounted on and attached to the upper end surface of the first coil circuit board module 251, there is a high possibility that the SMD type temperature sensor 2515 is affected by heat generated from the working coil pattern 2512.

[0301] In order that the influence of the heat generation from the working coil pattern 2512 on the SMD-type temperature sensor may be minimized, it is necessary for the SMD-type temperature sensor to be positioned as far as possible from the working coil pattern 2512 along the horizontal direction.

[0302] A position of the SMD-type temperature sensor at which the influence of the heat generation thereon may be minimized may be selected from an area in which the first central inner area 2514c of the sensing coil pattern 2514 and the inner clearance D1 overlap each other, and an area in which the first central inner area 2514c of the sensing coil pattern 2514 and the outer clearance D2 overlap each other.

[0303] Although FIG. 10 illustrates that the temperature sensor 2515 is disposed at a position at which a center point of the temperature sensor 2515 and a center point of the first central inner area 2514c of the sensing coil pattern 2514 substantially coincide with each other, this is merely an example. The influence of heat generation from the working coil pattern 2512 on the temperature sensor 2515 may be minimized merely by positioning the temperature sensor 2515 at any position in each of the area in which the first central inner area 2514c of the sensing coil pattern 2514 and the inner clearance D1 overlap each other and the area in which the first central inner area 2514c of the sensing coil pattern 2514 and the outer clearance D2 overlap each other.

[0304] In addition, the temperature sensor 2515 may be disposed in each of the area in which the first central inner area 2514c of the sensing coil pattern 2514 and the inner clearance D1 overlap each other, and the area in which the first central inner area 2514c of the sensing coil pattern 2514 and the outer clearance D2 overlap each other, so that a space in which the third lead pattern 2513c electrically connecting the temperature sensor 2515 to the signal processor 2518 and a temperature sensor via hole H_v3 via which the temperature sensor 2515 and the third lead pattern 2513c are connected to each other are installed may be effectively secured.

[0305] In this regard, as described above, the SMD-type temperature sensor 2515 may have a first electrode and a second electrode constituting a pair of electrodes respectively formed at both opposing ends in the longitudinal direction thereof. The first layer 251a may include a pair of sensor pads respectively soldered to the first electrode and the second electrode.

[0306] As illustrated, in the present embodiment, a direction in which the first electrode and the second electrode respectively provided at both opposing ends of the temperature sensor 2515 are arranged to be spaced apart from each other may be parallel to the extending direction of the working coil pattern 2512 disposed adjacent to the temperature sensor 2515 or may intersect the extending direction of the working coil pattern 2512.

[0307] That is, when, as shown in (a) in FIG. 10, the temperature sensor 2515 is disposed in the area of the first clearance D1, the individual pattern strands 2512a-1 and 2512b-1 of the working coil pattern 2512 disposed adjacent to one side of the temperature sensor 2515 may extend in the front-rear direction. Accordingly, the direction in which the first electrode and the second electrode of the temperature sensor 2515 disposed in the area of the first clearance D1 are arranged to be spaced apart from each other may be the front-rear direction or the left-right direction intersecting the front-rear direction.

[0308] In addition, when, as illustrated in (b) in FIG. 10, the temperature sensor 2515 is disposed in the area of the second clearance D2, the individual pattern strands 2512a-1 and 2512b-1 of each of the working coil patterns 2512 respectively disposed adjacent to both opposing sides of the temperature sensor 2515 may extend along the left-right direction. Accordingly, the direction in which the first electrode and the second electrode of the temperature sensor 2515 disposed in the area of the second clearance D2 are arranged to be spaced apart from each other may be the left-right direction or the front-rear direction intersecting the left-right direction.

[0309] In this regard, a pair of sensor pads respectively corresponding to the first electrode and the second electrode of the temperature sensor 2515 disposed in the area of the first clearance D1 may be arranged in the same direction as the direction in which the first electrode and the second electrode thereof are arranged. A pair of sensor pads respectively corresponding to the first electrode and the second electrode of the temperature sensor 2515 disposed in the area of the second clearance D2 may be arranged in the same direction as the direction in which the first electrode and the second electrode thereof are arranged.

[0310] Accordingly, the third lead pattern 2513c for transmitting the electrical signal generated from the temperature sensor 2515 to the signal processor 2518 may extend toward the signal processor 2518 without interference thereof with the working coil pattern 2512 or in a state in which interference thereof with the working coil pattern 2512 is minimized.

[0311] More specifically, a portion of the third lead pattern 2513c which overlaps the sensing coil pattern 2514 and extends across the sensing coil pattern 2514 may be disposed in one of the third to seventh layers 251c, 251d, 251e, 251f, and 251g in which the first type pattern 2512a is formed, or may be disposed in one of the eighth to twelfth layers 251h, 251i, 251j, 251k, and 2511 in which the second type pattern 2512b is formed.

[0312] For example, in the present embodiment, as illustrated in FIG. 13, the third lead pattern 2513b may be provided in one of the eighth to twelfth layers 251h, 251i, 251j, 251k, and 2511 in which the second type pattern 2512c is formed, and the third lead pattern 2513c formed in one of the eighth to twelfth layers 251h, 251i, 251j, 251k, and 2511 may extend in a parallel manner to the pattern strands 2512b-1 of the second type pattern 2512b while being disposed in each of the first clearance D1 and the second clearance D2.

[0313] Accordingly, the third lead pattern 2513c may extend so as to effectively bypass the working coil pattern 2512.

[0314] The remaining portion of the third lead pattern 2513c may be disposed in the first layer 251a or the second layer 251b in which interference thereof with the working coil pattern 2512 does not occur, as shown in FIGS. 9 and 10.

[0315] Hereinafter, a detailed configuration of each of the first type pattern 2512a and the second type pattern 2512b constituting the working coil pattern 2512 will be described with reference to FIGS. 11 to 16.

[0316] FIG. 11 illustrates a structure in a plan view of the third layer 251c of the first coil circuit board module 251 having a multilayer structure.

[0317] A configuration of the third layer 251c of the first coil circuit board module 251 described below may be equally applied to each of the fourth to seventh layers 251d, 251e, 251f, and 251g unless otherwise specified.

[0318] Referring to FIG. 11, the first type patterns 2512a of eight working coil patterns 2512 respectively constituting eight burners 2511 may be arranged in the third layer 251c of the first coil circuit board module 251.

[0319] As illustrated, one first type pattern 2512a may be allocated to one burner 2511. The first type patterns 2512a may have the same size so that the individual burners 2511 may have the same size.

[0320] In this regard, for example, the eight burners 2511 may be arranged in a lattice shape, and accordingly, the first type patterns 2512a may be arranged in a lattice shape.

[0321] Accordingly, the first type patterns 2512a are arranged in the lattice shape and each of the first type patterns 2512a may be constructed to be wound in the quadrilateral spiral shape, such that heating areas may be evenly arranged inside the third layer 251c.

[0322] In one example, when the plurality of first type patterns 2512a are arranged in the lattice shape as described above, the first type patterns 2512a may be arranged in a symmetrical manner.

[0323] That is, the plurality of first type patterns 2512a may be arranged in a left-right symmetrical manner with each other around the light-transmission slit hole H_sl serving as a center line in the left-right direction of the third layer 251c.

[0324] In addition, the plurality of first type patterns 2512a may be arranged in a front-rear symmetrical shape with each other around the front-rear center line of the third layer 251c. Based on the illustrated embodiment, a front-rear center line of the third layer 251c may be defined as a virtual horizontal line around which a total of eight burner 2511 are divided into front four burners 2511 and rear four burners 2511 in a front-rear direction.

[0325] Since the plurality of first type patterns 2512a are arranged in the symmetrical manner with each other, a length of the first lead pattern 2513c for supplying the high-frequency power to the individual third layer 251a may be minimized, and the structure of the first lead pattern 2513a may be simplified.

[0326] FIG. 12 illustrates a structure in a plan view of the eighth layer 251h of the first coil circuit board module 251 having a multilayer structure.

[0327] A configuration of the eighth layer 251h of the first coil circuit board module 251 described below may be equally applied to each of the ninth to twelfth layers 251i, 251j, 251k, and 2511 unless otherwise specified.

[0328] As illustrated in FIG. 12, the second type patterns 2512b of 8 working coil patterns 2512 respectively constituting eight burners 2511 may be arranged in the eighth layer 251h of the first coil circuit board module 251.

[0329] As illustrated, one second type pattern 2512b may be allocated to one burner 2511. The second type patterns 2512b may have the same size so that the individual burners 2511 may have the same size.

[0330] In this regard, in the similar manner to the first type pattern 2512a, the second type patterns 2512b may be arranged in a lattice shape.

[0331] In addition, in the similar manner to the first type pattern 2512a as described above, the plurality of second type patterns 2512b may be arranged in a left-right symmetrical manner each other around the light-transmission slit hole H_sl, and the plurality of second type patterns 2512b may be arranged in a front-rear symmetrical manner with each other around the center line in the front-rear direction of the eighth layer 251h.

[0332] FIG. 13 shows the first type pattern 2512a and the second type pattern constituting one same burner 2511.

[0333] The first type patterns 2512a and the second type patterns 2512b illustrated in FIG. 13 may be arranged in a multi-layer structure along the vertical direction as described above so as to constitute the same burner 2511.

[0334] As illustrated in FIG. 13, each of the first type pattern 2512a and the second type pattern 2512b constituting the working coil pattern 2512 may be wound in the quadrilateral spiral shape and extend from the first common terminal 2512a-2 and 2512b-2 as the inner common terminal toward the second common terminal 2512a-3 and 2512b-3 as the outer common terminal.

[0335] For example, each of the first type pattern 2512a and the second type pattern 2512b may be wound a total of nine windings while extending from the first common terminal 2512a-2 and 2512b-2 to the second common terminal 2512a-3 and 2512b-3. That is, each of the first type pattern 2512a and the second type pattern 2512b may be wound so as to have nine turns.

[0336] As illustrated, the first common terminal 2512a-2 and 2512b-2 may be formed at a position eccentric in an outward direction from a center of the burner 2511. That is, an area in which the first type pattern 2512a and the second type pattern 2512b are not formed may be formed in a center of the burner 2511. This is to prevent overheating that may occur when heat generated from the individual pattern strands 2512a-1 and 2512b-1 is concentrated on the center of the burner 2511. Although not shown, a means for preventing overheating of the central area of the burner 2511 may be additionally provided in a form of a via hole in the central area of the burner 2511.

[0337] In addition, as described above, while the spacing between adjacent ones of the turns constituting each of the first type pattern 2512a and the second type pattern 2512b is maintained to be substantially constant, the inner clearance D1 in which the temperature sensor 2515 is disposed may be formed between the third turn and the fourth turn.

[0338] For example, the first type pattern 2512a may have six pattern strands 2512a-1 bundled with each other to form one turn, and the second type pattern 2512b may have five pattern strands 2512b-1 bundled with each other to form one turn.

[0339] Widths of the individual pattern strands 2512a-1 and 2512b-1 constituting each of the first type pattern 2512a and the second type pattern 2512b may be equal to each other and may be in a range of 0.27mm to 0.33mm, preferably 0.3mm.

[0340] In this regard, in the first type pattern 2512a, a total of six individual pattern strands 2512a-1 constitute one turn. However, the first type pattern 2512a does not extend from the first turn to the ninth turns only using the six individual pattern strands 2512a-1.

[0341] Likewise, in the second type pattern 2512b, a total of five individual pattern strands 2512b-1 constitute one turn. However, the second type pattern 2512b does not extend from the first turn to the ninth turn only using the five individual pattern strands 2512b-1.

[0342] That is, while the first type pattern 2512a extends from the first turn to the ninth turn, one turn has been completed, and then, in the next turn, one of the six individual pattern strands 2512a-1 may be terminated, and a new individual pattern strand 2512a-1 may extend. In this way, each of the plurality of pattern strands 2512a-1 may extend in a divided manner.

[0343] Similarly, while the second type pattern 2512b extends from the first turn to the ninth turn, one turn has been completed, and then, in the next turn, one of the five individual pattern strands 2512b-1 may be terminated, and a new individual pattern strand 2512b-1 may extend. In this way, each of the plurality of pattern strands 2512b-1 may extend in a divided manner.

[0344] As described above, the first type pattern 2512a may be composed of the plurality of individual pattern strands 2512a-1 extending in the divided manner. The second type pattern 2512b may be composed of the plurality of individual pattern strands 2512b-1 extending in the divided manner. Thus, the wires may be bundled with each other in a similar manner to the Litz wire applied to the conventional cooktop.

[0345] In this regard, as illustrated in FIG. 14, the start point and the end point of the individual pattern strands 2512a-1 of the first type pattern 2512a arranged to constitute a new turn and the start point and the end point of the individual pattern strands 2512b-1 of the second type pattern 2512b arranged to constitute a new turn may be connected in series with each other via the working coil via holes H_v1, respectively.

[0346] In this regard, each of the working coil via holes H_v1 respectively connecting the start point and the end point of the individual pattern strands 2512a-1 of the first type pattern 2512a to the start point and the end point of the individual pattern strands 2512b-1 of the second type pattern 2512b may extend entirely from the third layer 251c to the twelfth layer 2511 as shown in FIG. 16 to collectively connect the individual pattern strands 2512a-1 and 2512b-1 disposed in all of the layers to each other.

[0347] However, as illustrated in FIG. 14, the direction in which the individual pattern strands 2512a-1 constituting the first type pattern 2512a extend and the direction in which the individual pattern strands 2512b-1 constituting the second type pattern 2512b extend may be opposite to each other.

[0348] For example, the individual pattern strands 2512a-1 constituting the first type pattern 2512a may extend in a first direction W1, while the individual pattern strands 2512b-1 constituting the second type pattern 2512b may extend in a second direction W2 opposite to the first direction W1.

[0349] For example, as illustrated, the first direction W1 may be a clockwise direction, and the second direction W2 may be a counterclockwise direction.

[0350] Accordingly, when the high-frequency power is supplied via the same working coil via hole H_v1, currents having opposite flow directions may flow through the individual pattern strands 2512a-1 of the first type pattern 2512a and the individual pattern strands 2512b-1 of the second type pattern 2512b which are simultaneously electrically connected to the same working coil via hole H_v1, and thus, magnetic fields may be generated in opposite directions from the first type pattern 2512a and the second type pattern 2512b.

[0351] As described above, the magnetic fields in the opposite directions are respectively generated from the first type pattern 2512a and the second type pattern 2512b, such that the dispersion effect of the magnetic field may be generated similarly to the conventional Litz wire constructed in a twisted shape.

[0352] Accordingly, the magnetic fields generated from the first type pattern 2512a and the second type pattern 2512b are uniformly transmitted to the container without being concentrated on a specific portion of the container, thereby improving heating efficiency and heating effect of the container.

[0353] In one example, as illustrated in FIG. 16, a plurality of working coil via holes H_v1 may be formed in each of the first common terminal 2512a-2 of the first type pattern 2512a and the first common terminal 2512b-2 of the second type pattern 2512b in order to minimize loss due to resistance.

[0354] Each of the plurality of working coil via holes H_v1 may be formed to extend through the first layer 251a to the twelfth layer 251a so as to be electrically connected to the first lead pattern 2513a formed in the first layer 2511.

[0355] As the common working coil via hole H_v1 is formed so as to extend through all of the layers, the heat generated from the individual working coil pattern 2512 may be effectively discharged from the first coil circuit board module 251 through the working coil via hole H_v1. That is, the working coil via hole H_v1 may act as a ventilation hole for preventing overheating of the first coil circuit board module 251.

[0356] Although not shown in FIG. 16, in the similar manner to the first common terminal 2512a-2 and 2512b-2, a plurality of working coil via holes H_v1 may be formed in each of the second common terminal 2512a-3 of the first type pattern 2512a and the second common terminal 2512b-3 of the second type pattern 2512b so as to extend through the first layer 251a to the twelfth layer 2511.[Detailed configuration of support structure of first coil circuit board module and connector]

[0357] Hereinafter, a detailed configuration of each of a support structure of the first coil circuit board module 251 of the cooking appliance 1 according to the present disclosure and the high-power connector 254 for supplying the high-frequency power to the first coil circuit board module 251 will be described with reference to FIGS. 17A to 32.

[0358] First, FIGS. 17A to 21 illustrate a support structure of the first coil circuit board module 251 of the cooking appliance 1 according to the present disclosure.

[0359] As described above, the first coil circuit board module 251 is disposed under the top plate 21 on which the container is seated.

[0360] In addition, as illustrated in FIG. 17A, the board supporter 26 may be disposed under the first coil circuit board module 251, and the first coil circuit board module 251 may be seated on the upper surface 261 of the board supporter 26 and supported on the board supporter 26. In this case, as illustrated in FIG. 17A, the main circuit board module 281, the SMPS circuit board (a switching mode power supply device) 282, the inverter circuit board module 283, the resonant circuit board module 284, the EMI filter module 285, the blower fan module 286, and the light source module 23 constituting the electronic / electrical component 28 may be disposed inside the board supporter 26 and be fixed to the lower surface 262 thereof.

[0361] Alternatively, the inverter circuit board module 283 may be fixed to and supported on another separate component rather than being fixed to the board supporter 26. More specifically, as shown in FIG. 17B, an additional supporter 26a may be further disposed under the board supporter 26 such that the inverter circuit board module 283 is fixed to and supported on the additional supporter 26a.

[0362] As illustrated, the additional supporter 26a may be fixedly disposed onto the upper surface of the bottom case 24, and the inverter circuit board module 283 may be fixedly onto an upper surface of the additional supporter 26a. Under this configuration, the high-power connector 254 for supplying power to the first coil circuit board module 251 may pass through a through-hole 263 of the board supporter 26 and may be more easily electrically connected to the inverter circuit board module 283. In this case, the board supporter 26 may be supported by a support leg 264 and be fixed to the bottom case 24 via the support leg 264 in a state of being isolated from the inverter circuit board module 283.

[0363] Alternatively, as shown in FIG. 17C, the inverter circuit board module 283 may be supported by the additional supporter 26a, and the high-power connector 254 may be constructed to pass through another gap or groove defined outside the board supporter 26 so as to be electrically connected to the inverter circuit board module 283 without passing through the through-hole 263 of the board supporter 26.

[0364] FIGS. 17C and 17C illustrate that the high-power connector 254 has a shape of one rod that electrically connects the first coil circuit board module 251 and the inverter circuit board module 283 to each other. However, as will be described later, the first coil circuit board module 251 and the inverter circuit board module 283 may be electrically connected to each other via a combination of the high-power connector 254 and a high-power cable 256. This is because it is difficult to maintain an exact alignment between the first coil circuit board module 251 and the inverter circuit board module 283 when the first coil circuit board module 251 and the inverter circuit board module 283 are coupled to each other, and it may be advantageous to include the high-power cable 256 in consideration of maintenance convenience.

[0365] As described above, the working coil pattern 2512 constituting the burner 2511 should be positioned as close to the top plate 21 as possible so that the heating efficiency of the container may be maximally maintained.

[0366] This will be described with reference to an embodiment shown in FIGS. 19 and 20 as follows.

[0367] Based on the illustrated embodiment, the top plate 21 may have a vertical thickness of approximately 4 mm.

[0368] In addition, when, as described above, the working coil patterns 2512 are arranged in 10 layered structures along the vertical direction and the first coil circuit board module 251 has a total of 12 layered structures, the first coil circuit board module 251 may have a thickness of about 3 mm in the vertical direction.

[0369] In this case, in order to achieve the maximum heating efficiency of the working coil pattern 2512, a vertical spacing GH1 defined between the upper end surface 251t of the first coil circuit board module 251 and the lower surface 21b of the top plate 21 may be in a range of 2.7mm to 3.3mm, and may be preferably set to 3 mm, as shown in FIG. 20.

[0370] As described above, a plurality of high-power terminal patterns 2516 acting as a terminal for supplying the high-frequency power to the working coil pattern 2512 may be integrally formed with the working coil pattern 2512 to constitute the first coil circuit board module 251.

[0371] As illustrated in FIG. 20, the plurality of high-power terminal patterns 2516 may be close to each of the front edge and the rear edge of the first coil circuit board module 251, and may be arranged along each of the front edge and the rear edge.

[0372] In the embodiment, the high-power terminal pattern 2516 is illustrated as being formed in the upper end surface 251t of the first coil circuit board module 251. However, alternatively, the high-power terminal pattern 2516 may be constructed differently according to embodiments so that the high-power terminal pattern 2516 may be formed in the lower end surface 251v of the first coil circuit board module 251 or may be formed in both the upper end surface 251t and the lower end surface 251v of the first coil circuit board module 251. In addition, according to an embodiment, the high-power terminal pattern 2516 may be constructed to be formed in a front edge surface or a rear edge surface of the first coil circuit board module 251.

[0373] The high-frequency power having an effective value of approximately 20 A or greater is applied to the high-power terminal pattern 2516. Therefore, it is substantially impossible to apply a connector coupled to the high-power terminal pattern 2516 in a simple fitting manner, such as a conventional board connector. The high-frequency power applied to the high-power terminal pattern 2516 may be generated by the inverter circuit board module 283 received inside the board supporter 26 and disposed on the lower surface 262 of the board supporter 26, as shown in FIG. 18 and then may be supplied to the high-power terminal pattern 2516.

[0374] It is substantially impossible to apply the general board connector to the first coil circuit board module 251. Thus, the first coil circuit board module 251 according to the present disclosure may be connected to the high-power terminal pattern 2516 by directly soldering a cable terminal of the power cable supplying the high-frequency power to the high-power terminal pattern 2516 to the high-power terminal pattern, or by fastening the cable terminal to the high-power terminal pattern using a mechanical coupling means such as a screw bolt.

[0375] However, when the cable terminal of the power cable is directly coupled to the high-power terminal pattern 2516 via the soldering as described above, a vertical spacing GH1 defined between the upper end surface 251t of the first coil circuit board module 251 and the lower surface 21b of the top plate 21 is considerably small as described above, such that there is a high possibility that the soldering portion of the high-power terminal pattern 2516 is in contact with the lower surface 21b of the top plate 21, and thus there is a high possibility that the soldering portion is damaged and the soldering portion in a contact area therewith is melted, resulting in a contact defect.

[0376] In addition, when the cable terminal of the power cable is mechanically coupled to the high-power terminal pattern 2516 using the screw bolt or the like, there is a very high possibility that the first coil circuit board module 251 is damaged due to a fastening force of the screw bolt.

[0377] As a means for solving the problem caused by the direct coupling of the high-power terminal pattern 2516 and the cable terminal of the power cable to each other, the present disclosure may propose the high-power connector 254 of which one side is in contact with and connected to the high-power terminal pattern 2516 of the first coil circuit board module 251 and the other side is electrically connected to an inverter 2831 of the inverter circuit board module 283 via the power cable 256.

[0378] In this regard, a first contact and connection portion constituting one side of the high-power connector 254 may be in contact with and connected to the high-power terminal pattern 2516 of the first coil circuit board module 251 via soldering and be fixed to the first coil circuit board module 251, while a second contact and connection portion constituting the other side of the high-power connector 254 may be in contact with and connected to the cable terminal 255 of the power cable 256 via a mechanical fastening means such as a fastening bolt B.

[0379] In one example, as shown in FIGS. 19 and 20, in order for the high-power connector 254 to be soldered to the high-power terminal pattern 2516 when the high-power terminal pattern 2516 is formed in the upper end surface 251t of the first coil circuit board module 251, the first contact and connection portion of the high-power connector 254 at least partially protrudes upwardly beyond the upper end surface 251t of the first coil circuit board module 251.

[0380] In this regard, a protruding vertical length of a portion of the high-power connector 254 protruding upwardly beyond the upper end surface 251t of the first coil circuit board module 251 may be set to be smaller than the vertical spacing GH1 defined between the upper end surface 251t of the first coil circuit board module 251 and the lower surface 21b of the top plate 21.

[0381] More specifically, the protruding vertical length of the portion of the high-power connector 254 protruding upwardly beyond the upper end surface 251t of the first coil circuit board module 251 may be limited to a value smaller than or equal to half of the vertical spacing GH1 defined between the upper end surface 251t of the first coil circuit board module 251 and the lower surface 21b of the top plate 21.

[0382] For example, as described above, when the vertical spacing GH1 is set to a range of 2.7mm to 3.3mm, the protruding vertical length of the portion of the high-power connector 254 protruding upwardly beyond the upper end surface 251t of the first coil circuit board module 251 may be in a range of 0.8mm to 1.2mm.

[0383] As described above, the protruding vertical length of the portion of the high-power connector 254 protruding upwardly beyond the upper end surface 251t of the first coil circuit board module 251 may be limited to a predetermined relative range such that the soldering portion of the high-power terminal pattern 2516 may be constructed not to contact the lower surface 21b of the top plate 21, and accordingly, the possibility of damage to the contact and connection portion between the high-power terminal pattern 2516 and the high-power connector 254 and the possibility of the contact defect occurring while the soldering portion melts may be fundamentally suppressed.

[0384] In one example, the second contact and connection portion electrically connected to the inverter 2831 via the power cable 256 may extend through the upper surface 261 of the board supporter 26 and extend toward the inside of the board supporter 26, as shown in FIG. 18.

[0385] More specifically, as shown in FIG. 18, each of the cable terminals 255 may be provided at each of both opposing ends of the power cable 256. A fastening hole through which the fastening bolt B may pass may be formed in the cable terminal 255 such that the cable terminal 255 may be fixed using the fastening bolt B. The cable terminal 255 provided at one end of the power cable 256 may be mechanically coupled to a plurality of supply terminals 2841 arranged along an edge of the resonant circuit board module 284 using the fastening bolt B. In addition, the cable terminal 255 provided at the other end of the power cable 256 may be mechanically coupled to the second contact and connection portion of the high-power connector 254 passing through the through-hole 263 formed in the board supporter 26 so as to be disposed inside the board supporter 26 using the fastening bolt B, as described later.

[0386] Accordingly, the high-frequency power generated from the inverter circuit board module 283 may be supplied to the first coil circuit board module 251 via the resonant circuit board module 284 and then via the power cable 256 and the high-power connector 254. Although FIG. 18 shows an example in which the power cable 256 extends across the EMI filter module 285, the power cable 256 may be constructed to extend along a space that does not overlap with a component disposed in the EMI filter module 285 and a component disposed in the resonant circuit board module 284 in the vertical direction in order to avoid interference thereof with the component disposed in the EMI filter module 285 and the component disposed in the resonant circuit board module 284 as much as possible. As described above, the second contact and connection portion may extend through the board supporter 26 toward the inside of the board supporter 26 in which the electronic / electrical components 28 including the inverter 2831, the inverter circuit board module 283, and the EMI filter module are accommodated so as to be disposed inside the board supporter 26, such that the second contact and connection portion of the high-power connector 254 may be connected to the inverter 2831 via the power cable 256 with the shortest length of the power cable 256 while the power cable 256 does not bypass the board supporter 26.

[0387] This may achieve an effect that the length of the power cable 256 connecting the inverter 2831 and the second contact and connection portion of the high-power connector 254 to each other may be minimized, and the connection structure between the inverter 2831 and the high-power connector 254 via the power cable 256 may be simplified.

[0388] As illustrated in FIGS. 17A and 21, a plurality of through-holes 263 extending through the upper surface 261 to the lower surface 262 of the board supporter 26 may be formed in the board supporter 26. The second contact and connection portion of the high-power connector 254 illustrated in FIG. 22 may pass thorough each of some of the plurality of through-holes 263. A lower end of the low power connector 2518g as illustrated in FIG. 21 may pass directly through each of the others of the plurality of through-holes 263, or a communication flat cable (not shown) as a counterpart of the low power connector 2518g may pass through each of the others of the plurality of through-holes 263.

[0389] In addition, when the high-power terminal patterns 2516 are arranged so as to be spaced from each other while the edge notch 2517 is interposed therebetween as in the embodiment, a position of the through-hole 263 may be set so that the edge notch 2517 entirely overlaps the through-hole 263 along the vertical direction.

[0390] Detailed configurations of the high-power connector 254 according to various embodiments will be described later with reference to FIG. 23 and subsequent drawings.[Detailed configuration of high-power connector according to first embodiment]

[0391] First, FIGS. 23 and 24 show a detailed configuration of the high-power connector 254a according to the first embodiment of the present disclosure.

[0392] Referring to FIG. 23, the high-power connector 254a according to the first embodiment of the present disclosure may include a first contact and connection portion 254a-1 contacting and electrically connected to the high-power terminal pattern 2516 of the first coil circuit board module 251, a second contact and connection portion 254a-2 contacting and electrically connected to the inverter circuit board module 283, and a bridge portion 254a-3 connecting the first contact and connection portion 254a-1 and the second contact and connection portion 254a-2 to each other.

[0393] As described above, the high-frequency power having an effective value of about 20 A or higher is applied to the high-power connector 254a. Further, as described below, the cable terminal 255 of the power cable 256 is coupled to the high-power connector 254a via the mechanical fastening means such as a fastening bolt. For these reasons, predetermined electrical stability and predetermined mechanical strength are required.

[0394] Therefore, in order to meet such electrical stability and mechanical strength, the high-power connector 254a may be manufactured by performing a press working on a plate-shaped metal material having a predetermined thickness.

[0395] The metal material may be, for example, a copper-based alloy material or a stainless-based alloy material having electrical stability and mechanical rigidity.

[0396] In addition, the thickness of the plate-shaped metal material may be about 1 mm.

[0397] As shown in the drawing, the high-power connector 254a may be formed by bending a plate-shaped metal material having a thickness of about 1 mm to be generally U-shaped, and then bending an upper end portion of the U-shape to extend in a horizontal direction.

[0398] Therefore, in the present embodiment, the first contact and connection portion 254a-1 may be the upper end portion of the U-shaped structure bent so as to extend in the horizontal direction, the second contact and connection portion 254a-2 may be a lower end portion of the U-shaped structure, and the bridge portion 254a-3 may be a portion extending in the vertical direction of the U-shaped structure.

[0399] As illustrated in FIG. 24, a pair of high-power terminal patterns 2516 may be disposed in the upper end surface 251t of the first coil circuit board module 251 while the edge notch 2517 is interposed therebetween.

[0400] Correspondingly, the first contact and connection portion 254a-1 as the upper end portion of the U-shaped structure in contact with and connected to the high-power terminal pattern 2516 may include as a pair of first contact and connection portions 254a-1 integrally formed with upper ends of a pair of bridge portions 254a-3, respectively.

[0401] As illustrated, the first contact and connection portion 254a-1 may have a contact surface having a predetermined front-rear width Wa and a predetermined left-right width. Accordingly, a lower surface of each of the pair of first contact and connection portions 254a-1 may be in surface-contact with each of the pair of high-power terminal patterns 2516, and may be fixed thereto via soldering.

[0402] As illustrated, the first contact and connection portion 254a-1 constitutes the uppermost end of the high-power connector 254a according to the first embodiment along the vertical direction, and is constructed to entirely protrude upwardly beyond the upper surface of the first coil circuit board module 251.

[0403] As described above, the high-power connector 254a including the first contact and connection portion 254a-1 is manufactured using a plate-shaped member having a thickness of about 1 mm. Thus, a vertical length by which the high-power connector 254a protrudes upwardly beyond the upper end surface 251t of the first coil circuit board module 251 may be maintained at about 1 mm.

[0404] Accordingly, a sum of a vertical length of the soldering portion formed during the soldering and a thickness of the first contact and connection portion 254a-1 may be maintained to be smaller than the vertical spacing GH1 between the top plate 21 and the upper surface of the first coil circuit board module 251.

[0405] As illustrated, the second contact and connection portion 254a-2 constitutes the lowermost end of the high-power connector 254a according to the first embodiment along the vertical direction. The cable terminal 255 of the power cable 256 is constructed to be in contact with and connected to the second contact and connection portion 254a-2.

[0406] More specifically, the cable terminal 255 of the power cable 256 may be in surface contact with and connected to a bottom surface of the second contact 254a-2.

[0407] A plate-shaped contact portion 254a-21 having a rectangular shape or a circular shape may constitute a lower end of the second contact and connection portion 254a-2 so that at least an effective contact surface may be secured.

[0408] In addition, as illustrated, a bolt hole 254a-22 through which the fastening bolt B may pass may be formed at a center of the contact portion 254a-21, and a burring portion 254a-23 concentric with the bolt hole 254a-22 and having a screw thread formed on an inner circumferential surface thereof may be formed on an upper end surface of the second contact and connection portion 254a-2.

[0409] In one example, a guide portion 254a-24 for guiding a position of the cable terminal 255 of the power cable 256 may be further included in the second contact and connection portion 254a-2.

[0410] The guide portion 254a-24 serves to guide a position where the cable terminal 255 is disposed on the contact portion 254a-21 of the second contact and connection portion 254a-2 when the cable terminal 255 of the power cable 256 is coupled to the high-power connector 254a.

[0411] As illustrated, by way of example. the guide portion 254a-24 may be provided in a form of a protrusion formed by cutting a portion of the bridge portion 254a-3 and bending a remaining portion downwardly.

[0412] In one example, as illustrated, the bridge portion 254a-3 may act to connect the first contact and connection portion 254a-1 and the second contact and connection portion 254a-2 constituting the high-power connector 254a to each other.

[0413] The bridge portion 254a-3 may extend substantially in the vertical direction so as to be disposed between and connect the first contact and connection portion 254a-1 constituting the uppermost end of the U-shaped structure and the second contact and connection portion 254a-2 constituting the lowermost end thereof to each other.

[0414] In addition, the pair of bridge portions 254a-3 may be provided to respectively connect the pair of first contact and connection portions 254a to the second contact and connection portion 254a-2. As illustrated, the pair of bridge portions 254a-3 may be arranged so as to face each other.

[0415] In this case, a horizontal spacing between the pair of bridge portions 254a-3 may be set to gradually increase as each of the pair of bridge portions 254a-3 extends upwardly from the second contact and connection portion 254a-2 toward each of the first contact and connection portions 254a-1.

[0416] That is, based on a state before the high-power terminal pattern 2516 is assembled to the first coil circuit board module 251, a horizontal spacing between inner side surfaces of the pair of bridge portions 254a-3 facing each other or a horizontal spacing Wb between outer side surfaces of the pair of bridge portions 254a-3 may be set to gradually increase while each of the pair of bridge portions 254a-3 extends upwardly from the second contact and connection portion 254a-2 toward each of the first contact and connection portions 254a-1.

[0417] In this case, the horizontal spacing Wb between the outer side surfaces at the respective lower ends of the pair of bridge portions 254a-3 may be smaller than a horizontal width of the edge notch 2517, while the horizontal spacing Wb between the outer side surfaces at respective upper ends of the pair of bridge portions 254a-3 may be larger than the horizontal width of the edge notch 2517.

[0418] Accordingly, as illustrated in FIG. 24, when the pair of bridge portions 254a-3 are inserted into the edge notch 2517 while passing through the edge notch 2517 of the first coil circuit board module 251 in the vertical direction, the horizontal spacing Wb between the outer side surfaces at the upper ends of the pair of bridge portions 254a-3 decreases, such that elastic deformation of the pair of bridge portions 254a-3 may occur.

[0419] Accordingly, a restoring force acting in a direction such that a spacing between the pair of first contact and connection portions 254a increases is applied from the pair of bridge portions 254a-3 to the edge notch 2517 of the first coil circuit board module 251.

[0420] Under the restoring force, movement of the cable terminal 255 may be minimized during the process of soldering between the first contact and connection portion 254a-1 and the high-power terminal pattern 2516 and during the coupling process between the second contact and connection portion 254a-2 and the cable terminal 255, and these assembly processes may be stably performed without adding additional equipment for temporarily fixing the high-power connector 254a.[Detailed configuration of high-power connector according to second embodiment]

[0421] FIGS. 25 and 26 show a detailed configuration of a high-power connector 254b according to a second embodiment of the present disclosure.

[0422] Referring to FIG. 25, unlike the first embodiment, the high-power connector 254b according to the second embodiment of the present disclosure may be constructed such that an inserted protrusion 254b-11 protruding downwardly toward the first coil circuit board module 251 is included in at least one of the pair of first contact and connection portions 254b-1.

[0423] As described above, configurations except for the inserted protrusion 254b-11 may be substantially the same as those of the first embodiment.

[0424] That is, a detailed configuration of a pair of first contact and connection portions 254b-1, a detailed configuration of a second contact and connection portion 254b-2 including a contact portion 254b-21, a bolt hole 254b-22, a burring portion 254b-23, and a guide portion 254b-24, and a detailed configuration of a pair of bridge portions 254b-3 may be same as those as described in the first embodiment unless otherwise specified. Hereinafter, descriptions of contents duplicate with those as described above with reference to the first embodiment will be omitted.

[0425] In a similar manner to the first embodiment, the first contact and connection portion 254b-1 of the high-power connector 254b according to the second embodiment may be constructed to protrude upwardly beyond the upper end surface 251t of the first coil circuit board module 251, and may be formed to extend in a parallel manner to the upper end surface 251t of the first coil circuit board module 251 and the high-power terminal pattern 2516.

[0426] As described above, in the first embodiment, the restoring force of the pair of bridge portions may be applied to minimize the movement of the high-power connector during the fastening process of the second contact and connection portion 254b-2 and the cable terminal 255 to each other using the fastening bolt B. However, when a significantly high torque is instantaneously applied to the fastening bolt B, the high-power connector receives a great rotational force, and thus the bridge portion is highly likely to be removed from the edge notch 2517. When the bridge portion of the high-power connector is removed from the edge notch 2517 as described above, there is a concern that a serious problem in which the soldering portion between the first contact and connection portion and the high-power terminal pattern 2516 is damaged may additionally occur.

[0427] As a means for preventing the rotation of the high-power connector 254b due to the torque acting on the fastening bolt B, the high-power connector 254b according to the second embodiment may further include the inserted protrusion 254b-11.

[0428] The inserted protrusion 254b-11 may be integrally formed with at least one of the pair of first contact and connection portions 254b-1 constituting the uppermost end of the high-power terminal pattern 2516.

[0429] FIGS. 25 and 26 illustrate an example configuration in which a pair of inserted protrusions 254b-11 are provided in the pair of first contact and connection portions 254b-1, respectively. Hereinafter, the configuration in which the pair of inserted protrusions 254b-11 are integrally formed with the first contact and connection portions 254a, respectively, as in the illustrated embodiment will be described. However, the present disclosure is not limited thereto

[0430] As illustrated, the inserted protrusion 254b-11 may be formed by partially cutting an inner portion of a free end of the first contact and connection portion 254b-1 to form a notch such that a U-shape is formed and then bending each of remaining both opposing portions in the downward direction.

[0431] As shown in FIG. 26, the inserted protrusion 254b-11 may be inserted into a coupling hole 251h_b defined in the first coil circuit board module 251 in the downward direction and thus fixed to the first coil circuit board module 251.

[0432] Therefore, in order to secure at least an effective insertion depth, a vertical length by which the inserted protrusion 254b-11 protrudes downwardly from a lower end surface of the first contact and connection portion 254b-1 may be greater than 1 / 2 of the thickness in the vertical direction of the first coil circuit board module 251.

[0433] In corresponding to the vertical length by which the inserted protrusion 254b-11 protrudes downwardly from the lower end surface of the first contact and connection portion 254b-1, a vertical depth of the coupling hole 251h_b formed in the first coil circuit board module 251 may be equal to or greater than the downwardly protruding vertical length of the inserted protrusion 254b-11.

[0434] Accordingly, the coupling hole 251h_b may be formed to have a depth equal to or greater than 1 / 2 of the thickness in the vertical direction of the first coil circuit board module 251. However, an upper end of the coupling hole 251b-11 may be entirely opened regardless of the depth size of the coupling hole 251h_b so that the inserted protrusion 254h_b may be inserted into the coupling hole while moving downwardly along a direction shown in FIG. 26.

[0435] In one example, the coupling hole 251h_b may be disposed in an area in which the high-power terminal pattern 2516 is formed, or may be disposed outside an area in which the high-power terminal pattern 2516 is formed.

[0436] FIG. 26 shows an example configuration in which the coupling hole 251h_b is disposed in the high-power terminal pattern 2516

[0437] When the coupling hole 251h_b is disposed in the high-power terminal pattern 2516 as described above, the coupling hole 251h_b may be formed as a via hole in which a conductor is coated on an inner side surface thereof.

[0438] In this case, the coupling hole 251h_b serving as the via hole may be electrically connected to the high-power terminal pattern 2516.

[0439] As the coupling hole 251h_b is formed as the via hole, the inserted protrusion 254b-11 may indirectly contact and be electrically connected to the high-power terminal pattern 2516.

[0440] This may achieve an effect of additionally increasing an electrical contact area between the high-power terminal pattern 2516 and the high-power connector 254b.[Detailed configuration of high-power connector according to third embodiment]

[0441] FIGS. 27 and 28 show a detailed configuration of a high-power connector 254c according to a third embodiment of the present disclosure.

[0442] Referring to FIG. 27, unlike the first embodiment, the high-power connector 254c according to the third embodiment of the present disclosure may be constructed such that a first contact and connection portion 254c-1 is in contact with, connected to, and fixed to the lower end surface 251v of the first coil circuit board module 251.

[0443] In addition, unlike the first embodiment, the high-power connector 254c according to the third embodiment may be constructed such that an inserted protrusion 254c-11 protruding upwardly toward the first coil circuit board module 251 is included in at least one of the pair of first contact and connection portions 254c-1.

[0444] As described above, other configurations except for the first contact and connection portion 254c-1 and the inserted protrusion 254c-11 may be substantially the same as those of the first embodiment.

[0445] That is, a detailed configuration of a second contact and connection portion 254c-2 including a contact portion 254c-21, a bolt hole 254c-22, a burring portion 254c-23, and a guide portion 254c-24, and a detailed configuration of a pair of bridge portions 254c-3 described in the third embodiment may be the same as those as described in the first embodiment unless otherwise specified. Hereinafter, descriptions of contents duplicate with those as described above with reference to the first embodiment will be omitted.

[0446] In a similar manner to the first embodiment, the first contact and connection portion 254c-1 constituting the high-power connector 254c of the third embodiment may include a pair of first contact and connection portions 254c-1 respectively integrally coupled to upper ends of the U-shaped structure, that is, upper ends of a pair of bridge portions 254c-3.

[0447] However, the first contact and connection portion 254c-1 of the high-power connector 254c according to the third embodiment may be fixed to the first coil circuit board module 251 in a state of being in contact with and connected to the lower end surface 251v of the first coil circuit board module 251.

[0448] Accordingly, an upper end surface of the first contact and connection portion 254c-1 of the high-power connector 254c according to the third embodiment is in contact with, connected to, and soldered to the high-power terminal pattern 2516.

[0449] Accordingly, the third embodiment is suitable for a configuration in which the high-power terminal patterns 2516 respectively in contact with and connected to the first contact and connection portions 254a are disposed in the lower end surface 251v of the first coil circuit board module 251 so as to be spaced from each other.

[0450] In addition, the first contact and connection portion 254c-1 is fixed to the lower end surface 251v of the first coil circuit board module 251, such that each of the pair of bridge portions 254c-3 is constructed not to extend through the first coil circuit board module 251. Accordingly, the edge notch 2517 as illustrated in FIG. 28 may be omitted.

[0451] In one example, in a similar manner to the second embodiment, an inserted protrusion 254c-11 provided in the third embodiment acts as a means for preventing the rotation of the high-power connector 254c due to the torque acting on the fastening bolt B.

[0452] However, unlike the second embodiment, the inserted protrusion 254c-11 of the third embodiment may be inserted upwardly into the coupling hole 251h_b formed in the first coil circuit board module 251 as shown in FIG. 28 and fixed to the coupling hole.

[0453] Therefore, only except that the insertion directions of the inserted protrusions in the second and third embodiments into the coupling holes are different from each other, the inserted protrusion 254c-11 and the coupling hole 251h_b of the third embodiment may be constructed in a similar manner to those in the second embodiment.

[0454] That is, in order to secure at least the effective insertion depth, a vertical length by which the inserted protrusion 254c-11 protrudes upwardly from the upper end surface of the first contact and connection portion 254c-1 may be greater than 1 / 2 of the vertical thickness of the first coil circuit board module 251, and a vertical depth of the coupling hole 251h_b formed in the first coil circuit board module 251 may be equal to or greater than the protruding vertical length of the inserted protrusion 254c-11.

[0455] However, a lower end of the coupling hole 251h_b may be maintained in an entirely open state regardless of the depth size of the coupling hole 251h_b so that the inserted protrusion 254c-11 may be inserted into the coupling hole while moving upwardly in the direction shown in FIG. 28.

[0456] In addition, in a similar manner to the second embodiment, the coupling hole 251h_b of the third embodiment may be disposed ins the area where the high-power terminal pattern 2516 is formed, or may be disposed outside the area where the high-power terminal pattern 2516 is formed.

[0457] As illustrated in FIG. 28, when the coupling hole 251h_b is disposed in the high-power terminal pattern 2516, the coupling hole 251h_b may be formed as a via hole in which a conductor is coated on an inner side surface thereof.

[0458] The coupling hole 251h_b serving as the via hole may be electrically connected to the high-power terminal pattern 2516, and the inserted protrusion 254c-11 may indirectly contact and be electrically connected to the high-power terminal pattern 2516.

[0459] In one example, in a similar manner to the first embodiment, when the inserted protrusion 254c-11 is inserted into the coupling hole 251h_b while moving upwardly, the pair of bridge portions 254c-3 may be elastically deformed, and thus, the restoring force of the bridge portion 254c-3 generated while being elastically deformed may act on the coupling hole 251h_b via the inserted protrusion 254c-11.[Detailed configuration of high-power connector according to fourth embodiment]

[0460] FIGS. 29 and 30 show a detailed configuration of a high-power connector 254d according to the fourth embodiment of the present disclosure.

[0461] Referring to FIG. 29, unlike the first embodiment, the high-power connector 254d according to the fourth embodiment of the present disclosure may be constructed such that a first contact and connection portion 254d-1 is in contact with, connected to, and fixed to both the upper end surface 251t and the lower end surface 251v of the first coil circuit board module 251.

[0462] As described above, other configurations except for the first contact and connection portion 254d-1 may be substantially the same as those of the first embodiment.

[0463] That is, a detailed configuration of a second contact and connection portion 254d-2 including a contact portion 254d-21, a bolt hole 254d-22, a burring portion 254d-23, and a guide portion 254d-24, and a detailed configuration of a pair of bridge portions 254d-3 described in the fourth embodiment may be the same as those as described in the first embodiment unless otherwise specified. Hereinafter, descriptions of contents duplicate with those as described above with reference to the first embodiment will be omitted.

[0464] In a similar manner to the first embodiment, the first contact and connection portion 254d-1 constituting the high-power connector 254d of the fourth embodiment may include a pair of first contact and connection portions 254d-1 respectively integrally coupled to upper ends of the U-shaped structure, that is, upper ends of a pair of bridge portions 254d-3.

[0465] However, each of the first contact and connection portions 254d-1 of the high-power connector 254d according to the fourth embodiment may be fixed to the first coil circuit board module 251 in a state of being in contact with and connected to both the upper end surface 251t and the lower end surface 251v of the first coil circuit board module 251.

[0466] To this end, as illustrated, each of the first contact and connection portions 254d-1 of the high-power connector 254d according to the fourth embodiment may include an upper contact and connection portion 254d-11 in contact with and connected to the upper end surface 251t of the first coil circuit board module 251 and a lower contact and connection portion 254d-12 in contact with and connected to the lower end surface 251v of the first coil circuit board module 251.

[0467] Accordingly, both a lower end surface of the upper contact and connection portion 254d-11 and an upper end surface of the lower contact and connection portion 254d-12 of the high-power connector 254d according to the fourth embodiment are in contact with and connected to and soldered to the high-power terminal pattern 2516.

[0468] The fourth embodiment may be suitable for a configuration in which the high-power terminal pattern 2516 in contact with and connected to the first contact and connection portion 254d-1 include upper and lower high-power terminal patterns respectively disposed in the upper end surface and the lower end surface of the first coil circuit board module 251.

[0469] The upper contact and connection portion 254d-11 and the lower contact and connection portion 254d-12 of the high-power connector 254d according to the fourth embodiment may be formed by cutting the first contact and connection portion and an upper end of the bridge portion of the first embodiment along two cutting lines to form divided three segments and bending at least one of the divided three segments.

[0470] FIG. 29 illustrates a configuration in which the lower contact and connection portion 254d-12 is formed by bending a middle segment among the three divided segments, and the remaining unbent segments constitute the upper contact and connection portions 254d-11. However, this is merely an example. Unlike this configuration, a configuration in which a middle segment among the three divided segments constitutes the upper contact and connection portions 254d-11 while the remaining segments constitutes the lower contact and connection portion 254d-12. This configuration naturally falls within the scope of the present disclosure. The present disclosure is not limited thereto. However, the present disclosure will be described below with reference to the embodiment illustrated in the drawings by way of example.

[0471] The upper contact and connection portions 254d-11 and the lower contact and connection portion 254d-12 may extend in a parallel manner to each other, and a predetermined vertical spacing may be defined between the upper contact and connection portions 254a and the lower contact and connection portion 254d-12.

[0472] The vertical spacing between the lower contact and connection portion 254d-12 and the upper contact and connection portions 254d-11 may be substantially equal to the vertical thickness of the first coil circuit board module 251.

[0473] Accordingly, as illustrated in FIG. 30, the high-power connector 254d may be coupled to the first coil circuit board module 251 by moving the high-power connector 254d in a parallel manner to the horizontal direction so that the first coil circuit board module 251 is fitted into between the lower contact and connection portion 254d-12 and the upper contact and connection portion 254d-11.

[0474] As described above, the parallel movement of the high-power connector 254d along the horizontal direction has been completed, and then, the upper contact and connection portion 254d-11 and the lower contact and connection portion 254d-12 may be soldered to the upper end surface 251t and the lower end surface 251v of the first coil circuit board module 251, respectively, and thus, the high-power connector 254d may be fixed to the first coil circuit board module 251.

[0475] As the soldering is performed on each of the upper contact and connection portion 254d-11 and the lower contact and connection portion 254d-12, the coupling force between the connector 254d and the first coil circuit board module 251 may be further improved, and thus, the high-power connector 254d may be firmly fixed to the first coil circuit board module 251.

[0476] In addition, as the soldering is performed on each of the upper contact and connection portion 254d-11 and the lower contact and connection portion 254d-12, an electrical contact area between the high-power terminal pattern 2516 and the high-power connector 254d may be additionally increased.[Detailed configuration of high-power connector according to fifth embodiment]

[0477] FIGS. 31 and 32 show a detailed configuration of a high-power connector 251e according to a fifth embodiment of the present disclosure.

[0478] Referring to FIG. 31, unlike the first embodiment, a high-power connector 251e according to the fifth embodiment of the present disclosure may be constructed to be in contact with, connected to, and fixed to the first coil circuit board module 251 only using an inserted protrusion 254e-11 protruding upwardly from an upper end of a bridge portion 254e-3.

[0479] That is, the high-power connector 251e according to the fifth embodiment may be constructed such that a pair of inserted protrusions 254e-11 provided at the upper end of the bridge portion 254a function as the first contact and connection portion 254e-1.

[0480] As illustrated, other configurations except that the first contact and connection portion is replaced with the pair of inserted protrusions 254e-11 may be substantially the same as those of the first embodiment.

[0481] That is, a detailed configuration of a second contact and connection portion 254e-2 including a contact portion 254e-21, a bolt hole 254e-22, a burring portion 254e-23, and a guide portion 254e-24, and a detailed configuration of a pair of bridge portions 254e-3 described in the fifth embodiment may be the same as those as described in the first embodiment unless otherwise specified. Hereinafter, descriptions of contents duplicate with those as described above with reference to the first embodiment will be omitted.

[0482] In a similar manner to the above-described third embodiment, the inserted protrusion 254e-11 provided in the fifth embodiment acts as a means for preventing the rotation of the high-power connector 2516 due to torque acting on the fastening bolt B.

[0483] Therefore, as shown in FIG. 32, the inserted protrusion 254e-11 of the fifth embodiment may be inserted into the coupling hole 251h_b formed in the first coil circuit board module 251 in the upward direction and then fixed thereto.

[0484] Furthermore, the inserted protrusion 254e-11 of the fifth embodiment may also serve to prevent the high-power connector 2516 from being removed downwardly from the first coil circuit board module 251.

[0485] To this end, a vertical length by which the inserted protrusion 254e-11 protrudes upwardly from the upper end of the bridge portion 254e-3 may be greater than the vertical thickness of the first coil circuit board module 251.

[0486] That is, the inserted protrusion 254e-11 may be constructed to entirely extend through the first coil circuit board module 251 so that an upper end thereof protrudes upwardly beyond the upper end surface 251t of the first coil circuit board module 251.

[0487] Correspondingly, the coupling hole 251h_b formed in the first coil circuit board module 251 may be a through-hole extending through an entirety of the lower end surface 251v to the upper end surface 251t of the first coil circuit board module 251.

[0488] However, the protruding vertical length by which the inserted protrusion 254e-11 protrudes upwardly beyond the upper end surface 251t of the first coil circuit board module 251 may be limited to 1 mm or smaller in the same manner as in the above-described embodiments.

[0489] A portion of the inserted protrusion 254e-11 protruding upwardly beyond the upper end surface 251t of the first coil circuit board module 251 may be in contact with, connected to, and fixed to the first coil circuit board module 251 via soldering.

[0490] In addition, in a similar manner to the third embodiment, the coupling hole 251h_b of the fifth embodiment may be disposed in an area in which the high-power terminal pattern 2516 is formed.

[0491] As illustrated in FIG. 32, when the coupling hole 251h_b is disposed in the high-power terminal pattern 2516, the coupling hole 251h_b may be formed as a via hole in which a conductor is coated on an inner side surface thereof.

[0492] The coupling hole 251h_b serving as the via hole may be electrically connected to the high-power terminal pattern 2516. Accordingly, the portion of the inserted protrusion 254e-11 protruding upwardly beyond the upper end surface 251t of the first coil circuit board module 251 may directly contact and be electrically connected to the high-power terminal pattern 2516. A portion of the inserted protrusion 254e-11 inserted into the coupling hole 251h_b may indirectly contact and be electrically connected to the high-power terminal pattern 2516 via the via hole.

[0493] In one example, the high-power connector 2516 according to the fifth embodiment may further include a means for preventing the removal thereof from the first coil circuit board module 251.

[0494] The means for preventing the removal of the high-power connector 2516 from the first coil circuit board module 251 may be a stopper 254t provided at the portion of the inserted protrusion 254e-11 protruding upwardly beyond the upper surface 251e-12 of the first coil circuit board module 251.

[0495] As illustrated in FIG. 31, the stopper 254e-12 may be embodied as a curved portion formed by bending the portion of the inserted protrusion 254e-11 protruding upwardly beyond the upper end surface 251t of the first coil circuit board module 251.

[0496] Although the illustrated embodiment illustrates a configuration in which the curved portion is formed by convexly bending the portion outwardly of the high-power connector 2516, the curved portion may be formed by convexly bending the portion inwardly of the high-power connector 2516.

[0497] As the curved portion is formed by bending the portion of the inserted protrusion 254e-11 protruding upwardly beyond the upper end surface 251t of the first coil circuit board module 251 outwardly or inwardly of the high-power connector 2516 as described above, a horizontal width between the curved portions of the pair of the inserted portions facing each other may be variable as each of the curved portions extends along the vertical direction.

[0498] That is, the horizontal width between the curved portions of the pair of the inserted portions facing each other gradually increases and then gradually decreases as each of the curved portions extends downwardly.

[0499] In this regard, when the inserted protrusion 254h_b has been inserted into the coupling hole 251e-11, the curved portion entirely protrudes upwardly beyond the upper end surface 251t of the first coil circuit board module 251.

[0500] Therefore, when the inserted protrusion 254e-11 has been inserted into the coupling hole 251h_b, a lower end of the curved portion is stopped by the coupling hole 251h_b. Thus, the lower end of the curved portion functions as the stopper 254e-12 for preventing the inserted protrusion 254e-11 from being removed from the coupling hole in the downward direction, thereby effectively preventing the high-power connector 2516 from being removed from the first coil circuit board module 251 without providing an additional removal prevention means.

[0501] Although the present disclosure has been described above with reference to the drawings illustrated with respect to the present disclosure, the present disclosure is not limited to the embodiments and drawings disclosed in the present disclosure. It is obvious that various modifications may be made thereto by a person skilled in the art within the scope of the technical idea of the present disclosure. In addition, even though the effects according to the configuration of the present disclosure are not explicitly described while illustrating the embodiment of the present disclosure, it is obvious that the predictable effect therefrom should also be recognized.

Claims

1. A cooking appliance comprising: a top plate on which a container is seated; and a coil circuit board module disposed under the top plate and including a working coil for heating the container; and an inverter circuit board module disposed under the coil circuit board module and configured to generate power to be supplied to the working coil, wherein the coil circuit board module includes a terminal electrically connected to the working coil, wherein the working coil receives the power from the inverter circuit board module via the terminal.

2. The cooking appliance of claim 1, wherein the cooking appliance further comprises a connector including: a first contact and connection portion contacting and electrically connected to the terminal; and a second contact and connection portion contacting and electrically connected to the inverter circuit board module, wherein the connector is fixed to the coil circuit board module.

3. The cooking appliance of claim 2, wherein the first contact and connection portion partially protrudes upwardly beyond an upper end surface of the coil circuit board module, wherein a protruding vertical length by which the first contact and connection portion protrudes upwardly beyond the upper end surface of the coil circuit board module is smaller than a vertical spacing between a lower end surface of the top plate and the upper end surface of the coil circuit board module.

4. The cooking appliance of claim 3, wherein the protruding vertical length is smaller than or equal to 1 / 2 of the vertical spacing.

5. The cooking appliance of claim 2, wherein the terminal is formed in the upper end surface or a lower end surface of the coil circuit board module.

6. The cooking appliance of claim 2, wherein the cooking appliance further comprises a board supporter disposed between the coil circuit board module and the inverter circuit board module, wherein the coil circuit board module is seated on an upper surface of the board supporter, wherein the second contact and connection portion of the connector extends through an upper surface of the board supporter toward the inverter circuit board module.

7. The cooking appliance of claim 6, wherein a through-hole is formed in the board supporter, wherein the second contact and connection portion of the connector passes through the through-hole.

8. The cooking appliance of claim 2, wherein the terminal includes a pair of terminals disposed in the upper end surface of the coil circuit board module and spaced from each other, wherein the first contact and connection portion includes a pair of first contact and connection portions contacting and electrically connected to the pair of terminals, respectively, wherein a lower surface of each of the pair of first contact and connection portions is in contact with and connected to each of the pair of terminals.

9. The cooking appliance of claim 8, wherein the connector includes a pair of bridge portions, wherein the pair of bridge portions have respective one ends respectively connected to the pair of first contact and connection portions, and the respective other ends connected to the second contact and connection portion, wherein each of the pair of bridge portions extends through the coil circuit board module in a vertical direction.

10. The cooking appliance of claim 9, wherein when the connector is fixed to the coil circuit board module, a restoring force acting such that a spacing between the pair of first contact and connection portions increases is applied from the pair of bridge portions to the coil circuit board module.

11. The cooking appliance of claim 9, wherein at least one of the pair of first contact and connection portions includes an inserted protrusion protruding downwardly toward the coil circuit board module, wherein the coil circuit board module includes a coupling hole defined therein, wherein the inserted protrusion is inserted into and coupled to the coupling hole.

12. The cooking appliance of claim 2, wherein the terminal includes a pair of terminals disposed in a lower end surface of the coil circuit board module and spaced from each other, wherein the first contact and connection portion includes a pair of first contact and connection portions in contact with and connected to the pair of terminals, respectively, wherein respective upper surfaces of the pair of first contact and connection portions are in contact with and connected to the pair of terminals, respectively.

13. The cooking appliance of claim 12, wherein at least one of the pair of first contact and connection portions includes an inserted protrusion protruding upwardly toward the coil circuit board module, wherein the coil circuit board module includes a coupling hole defined therein, wherein the inserted protrusion is inserted into and coupled to the coupling hole.

14. The cooking appliance of claim 2, wherein the terminal includes a pair of terminals disposed in an upper end surface or a lower end surface of the coil circuit board module and spaced from each other, wherein the first contact and connection portion includes a pair of first contact and connection portions in contact with and connected to the pair of terminals, respectively, wherein each of the pair of first contact and connection portions includes an upper contact and connection portion contacting the upper end surface of the coil circuit board module and a lower contact and connection portion contacting a lower surface of the coil circuit board module.

15. The cooking appliance of claim 14, wherein a vertical spacing between the upper contact and connection portion and the lower contact and connection portion is smaller than or equal to a vertical thickness of the coil circuit board module.

16. The cooking appliance of claim 2, wherein the terminal includes a pair of terminals disposed in an upper end surface or a lower end surface of the coil circuit board module and spaced from each other, wherein the first contact and connection portion includes a pair of first contact and connection portions in contact with and connected to the pair of terminals, respectively, wherein each of the pair of first contact and connection portions protrudes upwardly toward the coil circuit board module, and extends through the lower end surface to the upper end surface of the coil circuit board module so as to be in contact with and connected to each of the pair of terminals.

17. The cooking appliance of claim 16, wherein the coil circuit board module includes a pair of coupling holes defined therein, wherein the pair of first contact and connection portions are respectively inserted into and coupled to the pair of coupling holes.

18. The cooking appliance of claim 17, wherein each of the coupling holes acts as a via hole electrically connected to each of the pair of terminals.

19. The cooking appliance of claim 16, wherein each of the pair of first contact and connection portions has been inserted into each of the coupling holes such that an upper end of each of the pair of first contact and connection portions protrudes upwardly beyond the upper surface of the coil circuit board module, wherein the upper end of each of the pair of first contact and connection portions has a stopper constructed to prevent downward movement of the connector.

20. The cooking appliance of claim 1, wherein the coil circuit board module is formed in a printed circuit pattern.

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