Transmission strip line waveguide connector, communication system, communication apparatus, and communication method

Abstract

A communication method is provided, including: A microstrip transmits, to an element, a first radio frequency signal that is from an active component, and couples, to a waveguide, a second radio frequency signal and a third radio frequency signal that are transmitted by the element, where the second radio frequency signal is a part of the radio frequency signal transmitted to the element, and the third radio frequency signal is a radio frequency signal reflected by a capacitor including a plate and a ground plate. The communication method is applied to a transmission-strip-to-waveguide connector, and the transmission-strip-to-waveguide connector includes a transmission strip, a dielectric substrate, and the ground plate; the transmission strip is located on a first surface of the dielectric substrate, and the ground plate is located on a second surface of the dielectric substrate; a slot is provided on the ground plate, and the slot is configured to be coupled to the waveguide; and the transmission strip includes the microstrip, the plate, and the element coupled to the slot, where one end of the microstrip is connected to the plate, another end is configured to be connected to the active component, the element is located between the two ends of the microstrip and connected to the microstrip, the plate is connected to a direct current feeding end, and the plate is coupled to the ground plate.

Description

TECHNICAL FIELD

[0001] Embodiments of this application relate to the field of communication technologies, and in particular, to a transmission-strip-to-waveguide connector, a communication system, a communication apparatus, and a communication method.BACKGROUND

[0002] Currently, with development of communication technologies, frequencies of electromagnetic wave signals used for signal transmission are increasingly high, and losses of electromagnetic energy in a transmission process are also increasingly large.

[0003] In a microwave circuit system, microwave components are usually connected through planar transmission lines, and different microwave circuit systems are connected through waveguides. Therefore, a transition structure needs to be disposed between the waveguide and a microstrip.

[0004] Some active components in the microwave circuit system, such as diodes, triodes, and other radio frequency devices, are single devices and have a simple structure. A radio frequency port of the radio frequency device also serves as a power supply port. For such a component, an external circuit needs to be designed to isolate radio frequency signals from a supplied direct current, so as to prevent direct currents from damaging other components. This structure is complex and losses are large.SUMMARY

[0005] Embodiments of this application provide a transmission-strip-to-waveguide connector, a communication system, a communication apparatus, and a communication method, to implement transition between a planar microstrip and a waveguide, provide a power supply port isolated from a radio frequency signal, and implement power supply for a component and signal transmission.

[0006] According to a first aspect, a transmission-strip-to-waveguide connector is provided, including a transmission strip, a dielectric substrate, and a ground plate. The transmission strip is disposed on a first surface of the dielectric substrate, and the ground plate is disposed on a second surface of the dielectric substrate; a slot is provided on the ground plate, and the slot is configured to be coupled to a waveguide; and the transmission strip includes a microstrip, a plate, and an element coupled to the slot. A first end of the microstrip is connected to an active component, a second end of the microstrip is connected to the plate, a third end of the microstrip is connected to the element, and the third end is located between the first end and the second end; and the plate is connected to a direct current feeding end, and the plate is coupled to the ground plate.

[0007] It can be learned that the transmission-strip-to-waveguide connector may transmit, to the active component, a radio frequency signal transmitted by the waveguide, and the active component emits the signal, or a signal received by the active component may be transmitted to the waveguide, to implement signal receiving and sending. The plate is disposed at one end of the microstrip, so that the plate, the ground plate, and the dielectric substrate jointly form a capacitor, for reflecting a radio frequency signal transferred to the capacitor, thereby reducing energy leakage. In addition, the direct current feeding end is disposed on the plate of the capacitor, so that a direct current signal can be loaded to the plate. The direct current signal reaches the active component through the plate and the microstrip in sequence, to implement direct current power supply to the active component. The capacitor including the plate and the ground plate is disconnected from the direct current signal, and does not affect the direct current signal. Therefore, according to the transmission-strip-to-waveguide connector provided in this embodiment of this application, in a circuit system, a function of transition between the waveguide and the transmission strip is implemented, and a power supply port isolated from the radio frequency signal is provided, to implement direct current feeding for the active component, and implement power supply for the component and signal transmission. This structure is simple, and a loss is reduced.

[0008] In an optional implementation, the plate, the dielectric substrate, and the ground plate form the capacitor. Therefore, in radio frequency signal emitting and receiving phases, the radio frequency signal transferred to the capacitor may be reflected, thereby reducing the energy leakage. For example, in the radio frequency signal emitting phase, the radio frequency signal transmitted by the waveguide is coupled to the dielectric substrate through the slot on the ground plate, and is transferred to the element through the dielectric substrate. Then, the radio frequency signal is transmitted to the first end and the second end of the microstrip through the element. A radio frequency signal transmitted to the first end of the microstrip leads to the active component. A radio frequency signal transmitted to the second end of the microstrip leads to the plate, and is reflected at the capacitor including the plate and the ground plate, and the reflected radio frequency signal leads to the active component through the microstrip. In this way, transition between the waveguide and the microstrip is completed, to emit the radio frequency signal. Alternatively, in the radio frequency signal receiving phase, the microstrip may transfer, to the element, energy of the radio frequency signal that is from the active component, and a part of the radio frequency energy transmitted to the element is coupled to the waveguide. The other part of the radio frequency energy transmitted to the element leads to the plate, and is reflected by the capacitor including the plate and the ground plate. The reflected radio frequency energy is coupled to the waveguide through the slot on the ground plate and the radiation element, so as to complete radio frequency signal transition from the transmission strip to the waveguide.

[0009] In an optional implementation, a width of the plate is greater than a width of the microstrip. In some embodiments, the plate is a sector, and the width of the plate changes gradually. That the width of the plate is greater than the width of the microstrip may be that the largest width of the plate is greater than the width of the microstrip. In some other embodiments, the plate is a rectangle, so that a width of each part of the plate may be greater than the width of the microstrip. Therefore, a larger width of the plate indicates a larger area of the plate, a larger generated equivalent capacitance, and better performance of reflecting the radio frequency signal, thereby further reducing the energy leakage and reducing a transition loss.

[0010] In an optional implementation, a length l of the slot satisfies: l − λ 1 2 ≤ A, where λ 1 is a wavelength of an electromagnetic wave in the waveguide, and A is an error threshold. In this way, the electromagnetic wave transmitted by the waveguide can be coupled to the element through the slot, thereby facilitating signal transmission.

[0011] In an optional implementation, a length L of the element satisfies: |L - λ 2 | ≤ B , where λ 2 is a wavelength of an electromagnetic wave on the microstrip, and B is an error threshold.

[0012] In an optional implementation, the element is symmetric with respect to the microstrip. Therefore, the radio frequency energy is evenly transferred to the microstrip.

[0013] In an optional implementation, there are a plurality of elements, and a spacing d between adjacent elements satisfies: d − Nλ 2 2 ≤ C, where λ 2 is the wavelength of the electromagnetic wave on the microstrip, and N is a positive integer. Therefore, the distance between the adjacent elements is an integer multiple of a half of the wavelength. In this way, when the elements are disposed, if one of the elements is disposed at a point with a strong electric field, another element is also located at a point with a strong electric field. This helps dispose the element at the point with the strong electric field on the microstrip, improve radiation performance of the element, and reduce a loss of the radio frequency energy on the microstrip.

[0014] In an optional implementation, the transmission strip further includes a first connection line, and first ends of the two adjacent elements are connected through the first connection line. In this way, the first connection line may be used for connecting adjacent elements, thereby improving impedance matching.

[0015] In an optional implementation, a width of the first connection line is less than a width of the element. In this way, the impedance matching of the element can be further improved.

[0016] In an optional implementation, a first part of the microstrip is connected to the element, a second part of the microstrip is connected to the plate, and the second part of the microstrip is located between the plate and the element. Therefore, it is convenient to adjust a length of the microstrip based on a requirement, so that the radio frequency energy reflected back by the capacitor including the plate and the ground plate returns to a position of the element. A length of a second sub-microstrip is adjusted, so that an electric field of the radio frequency signal reflected at the capacitor is the strongest at the radiation element, and a transition loss between the waveguide and the microstrip is reduced.

[0017] In an optional implementation, a length D of the second part of the microstrip satisfies: D − 2 n − 1 λ 2 4 ≤ E, where λ 2 is the wavelength of the electromagnetic wave on the microstrip, E is an error threshold, and n is a natural number. One periodicity corresponds to a wavelength of one electromagnetic wave on the microstrip, and electric field strength is the largest at one quarter of the periodicity and three quarters of the periodicity. Therefore, a value of n may be 0, 1, 2, 3, ..., and the length of the second part of the microstrip may be λ 2 4 , 3 λ 2 4 , 5 λ 2 4 , 7 λ 2 4 , or the like. In other words, the length of the second sub-microstrip 2031b is an odd multiple of a quarter of the wavelength. In this way, after a signal reflected at the capacitor passes through the microstrip of a length 2 n − 1 λ 2 4 , an electric field is the strongest at the radiation element, thereby reducing the transition loss.

[0018] In an optional implementation, a shape of the plate includes a sector shape or a rectangular shape. Therefore, the shape of the plate can be flexibly adjusted, and an application scope is wider.

[0019] In an optional implementation, a first edge of the plate is connected to the microstrip, a second edge of the plate is opposite to the first edge, and at least one of the second edge, a third edge of the plate, and a fourth edge of the plate is connected to the direct current feeding end, where the third edge and the fourth edge are connected to the first edge and the second edge. In this way, a position at which the direct current feeding end is connected to the plate may be randomly adjusted, and a difference between transition losses at all positions is small, so that the position is more flexible, thereby facilitating production and processing.

[0020] In an optional implementation, the transmission strip further includes a shielding plate, the shielding plate is spaced apart from the microstrip, the shielding plate is disposed around the element, and the shielding plate is spaced apart from the element. Therefore, the shielding plate is configured to shield an electromagnetic wave emitted by the element. By disposing the shielding plate, the electromagnetic wave emitted by the element can be isolated within a range of the shielding plate, thereby further reducing the transition loss between the waveguide and the transmission strip.

[0021] In an optional implementation, a conductive connection portion is disposed on a dielectric layer, and the shielding plate is connected to the ground plate through the conductive connection portion. In this way, the shielding plate, the conductive connection portion, and the ground plate jointly enclose a semi-closed cavity, so that the electromagnetic wave emitted by the element can be isolated within a range of the cavity, and the transition loss between the waveguide and the transmission strip is further reduced.

[0022] In an optional implementation, the conductive connection portion includes a plurality of metal vias. Therefore, the metal via serves as a shielding structure, which has a simple structure and is easy to produce.

[0023] According to a second aspect, a communication system is provided, including an active component and the foregoing transmission-strip-to-waveguide connector, where the active component is connected to the second end of the microstrip. Therefore, the foregoing transmission-strip-to-waveguide connector is used for the communication system. In a circuit system, a function of transition between a waveguide and a transmission strip is implemented, and a power supply port isolated from a radio frequency signal is provided, to implement direct current feeding for the active component, and implement power supply for the component and signal transmission. This structure is simple, and a loss is reduced.

[0024] In an optional implementation, the active component includes a diode or a triode. Therefore, the active component has a simple structure, and a radio frequency port of the active component also serves as a power supply port. The foregoing transmission-strip-to-waveguide connector may be used, so that isolation is high and a loss is low.

[0025] According to a third aspect, a communication apparatus is provided, including a waveguide, an active component, and the foregoing transmission-strip-to-waveguide connector. The waveguide is coupled to the slot, and the active component is connected to the second end of the microstrip. Therefore, the foregoing transmission-strip-to-waveguide connector is used for the communication apparatus. In a circuit system, a function of transition between the waveguide and a transmission strip is implemented, and a power supply port isolated from a radio frequency signal is provided, to implement direct current feeding for the active component, and implement power supply for the component and signal transmission. This structure is simple, and a loss is reduced.

[0026] In an optional implementation, the communication apparatus is a base station. Therefore, the foregoing transmission-strip-to-waveguide connector is used for the base station, which has a simple structure.

[0027] According to a fourth aspect, a communication method is provided. The method includes: coupling a radio frequency signal transmitted by a waveguide to an element through a slot, and transmitting the radio frequency signal to a first end and a second end of a microstrip through the element, where a radio frequency signal transmitted to the first end of the microstrip leads to the active component, and a radio frequency signal transmitted to the second end of the microstrip leads to a plate, and is reflected at a capacitor including the plate and a ground plate, and the reflected radio frequency signal leads to the active component through the microstrip. The communication method is applied to a transmission-strip-to-waveguide connector, and the transmission-strip-to-waveguide connector includes a transmission strip, a dielectric substrate, and the ground plate; the transmission strip is located on a first surface of the dielectric substrate, and the ground plate is located on a second surface of the dielectric substrate; the slot is provided on the ground plate, and the slot is configured to be coupled to the waveguide; and the transmission strip includes the microstrip, the plate, and the element coupled to the slot, where the microstrip includes the first end and the second end that are opposite to each other, and a third end located between the first end and the second end, the first end is connected to the plate, the second end is configured to be connected to the active component, the third end is connected to the element, the plate is connected to a direct current feeding end, and the plate is coupled to the ground plate.

[0028] In an optional implementation, the plate is configured to receive a direct current signal loaded at the direct current feeding end, to cause the direct current signal to be transmitted to the active component through the plate and the microstrip in sequence.

[0029] In an optional implementation, a first part of the microstrip is connected to the element, a second part of the microstrip is connected to the plate, and the second part of the microstrip is located between the plate and the element.

[0030] In an optional implementation, a length D of the second part of the microstrip satisfies: D − 2 n − 1 λ 2 4 ≤ E, where n is a natural number.

[0031] According to a fifth aspect, a communication method is provided. The method includes: A microstrip transmits, to an element, a first radio frequency signal that is from an active component, and couples, to a waveguide, a second radio frequency signal and a third radio frequency signal that are transmitted by the element, where the second radio frequency signal is a part of the radio frequency signal transmitted to the element, and the third radio frequency signal is a radio frequency signal reflected by a capacitor including a plate and a ground plate. The communication method is applied to a transmission-strip-to-waveguide connector, and the transmission-strip-to-waveguide connector includes a transmission strip, a dielectric substrate, and the ground plate; the transmission strip is located on a first surface of the dielectric substrate, and the ground plate is located on a second surface of the dielectric substrate; a slot is provided on the ground plate, and the slot is configured to be coupled to the waveguide; and the transmission strip includes the microstrip, the plate, and the element coupled to the slot, where the microstrip includes a first end and a second end that are opposite to each other, and a third end located between the first end and the second end, the first end is connected to the plate, the second end is configured to be connected to the active component, the third end is connected to the element, the plate is connected to a direct current feeding end, and the plate is coupled to the ground plate.

[0032] In an optional implementation, the plate is configured to receive a direct current signal loaded at the direct current feeding end, to cause the direct current signal to be transmitted to the active component through the plate and the microstrip in sequence.

[0033] According to a sixth aspect, a computer-readable storage medium is provided. The storage medium stores a computer program or instructions, and when the computer program or the instructions are executed by a processing device, the foregoing method is implemented.

[0034] According to a seventh aspect, a computer program product is provided, including a computer program or instructions. When the computer program or the instructions are executed by a processing device, the foregoing method is implemented.

[0035] According to an eighth aspect, a communication apparatus is provided. The communication apparatus may be a first apparatus, may be a one-to-one corresponding module or unit (for example, a chip, a chip system, or a circuit) in the first apparatus for performing the method / operation / step / action described in the fourth / fifth aspect, or may be an apparatus that can be used in combination with the first apparatus.

[0036] According to a ninth aspect, an electronic device is provided. The electronic device includes: a transceiver, configured to receive or send a signal; a memory, configured to store computer program instructions; and a processor, configured to run the computer program instructions, to cause the electronic device to implement the foregoing communication method.

[0037] According to a tenth aspect, a chip system is provided. The chip system includes a processing circuit and a storage medium. The storage medium stores computer program instructions. When the computer program instructions are executed by the processing circuit, the foregoing method is implemented.BRIEF DESCRIPTION OF DRAWINGS

[0038] FIG. 1 is a circuit diagram of a communication system; FIG. 2 is a diagram of a structure of a coaxial line; FIG. 3 is a sectional view of the coaxial line in FIG. 2; FIG. 4 is a diagram of a structure of a waveguide; FIG. 5 is a sectional view of the waveguide in FIG. 4; FIG. 6 is a diagram of a structure of a planar transmission line; FIG. 7 is a top view of the planar transmission line in FIG. 6; FIG. 8 is a diagram of a disassembled structure of a transmission-strip-to-waveguide connector according to an embodiment of this application; FIG. 9 is a top view of a transmission-strip-to-waveguide connector according to an embodiment of this application; FIG. 10 is a diagram of electric field distribution on a microstrip according to an embodiment of this application; FIG. 11 is a top view of another transmission-strip-to-waveguide connector according to an embodiment of this application; FIG. 12 is a curve diagram of transmission losses of different direct current feeding ends in FIG. 11 for transition between a waveguide and a microstrip; FIG. 13 is a top view of another transmission-strip-to-waveguide connector according to an embodiment of this application; and FIG. 14 is a curve diagram of transmission losses of different direct current feeding ends in FIG. 13 for transition between a waveguide and a microstrip. DESCRIPTION OF EMBODIMENTS

[0039] To make the objectives, technical solutions, and advantages of this application clearer, the following further describes this application in detail with reference to the accompanying drawings.

[0040] The terms such as "first" and "second" mentioned below are merely intended for a purpose of description, and shall not be understood as an indication or implication of relative importance or implicit indication of a quantity of indicated technical features. Therefore, a feature limited by "first", "second", or the like may explicitly or implicitly include one or more features. In the descriptions of this application, unless otherwise stated, "a plurality of" means two or more than two.

[0041] In addition, in this application, position terms such as "upper" and "lower" are defined relative to an illustrative position of a component in the accompanying drawings. It should be understood that these direction terms are relative concepts and are used for relative description and clarification, and may vary accordingly depending on a position change in which components are placed in the accompanying drawings.

[0042] The following describes possible terms in embodiments of this application.

[0043] Transmission line: The transmission line is also referred to as a feeder, and refers to a connection line between a transceiver of an antenna and a radiator. The transmission line can directly perform transmission of current waves or electromagnetic waves with different frequencies and forms. A connection point that is on the radiator and that is connected to the transmission line is usually referred to as a feed point. The transmission line includes a conductingwire transmission line, a coaxial-line transmission line, a waveguide, a microstrip, or the like. The transmission line may be implemented by using LCP (Liquid Crystal Polymer, liquid crystal polymer material), an FPC (Flexible Printed Circuit, flexible printed circuit), a PCB (Printed Circuit Board, printed circuit board), or the like based on different carriers.

[0044] Electrical connection: The electrical connection may be understood as physical contact and electrical conduction of components, or may be understood as a form in which different components in a line structure are connected through a physical line that can transmit an electrical signal, for example, copper foil or a conductive wire of a PCB. The "connection" refers to a connection of a mechanical structure or a connection of a physical structure.

[0045] Coupling: The coupling may be understood as direct coupling and / or indirect coupling, and a "coupling connection" may be understood as a direct coupling connection and / or an indirect coupling connection. The direct coupling may also be referred to as an "electrical connection", and may be understood as physical contact and electrical conduction of components; or may be understood as a form in which different components in a line structure are connected through a physical line that can transmit an electrical signal, for example, copper foil or a conductive wire of a printed circuit board (printed circuit board, PCB). The "indirect coupling" may be understood as electrical conduction of two conductors through air or without contact. In an embodiment, the indirect coupling may also be referred to as capacitive coupling. For example, signal transmission is implemented by forming an equivalent capacitor through coupling in a gap between two spaced conductive members.

[0046] Connection: Two or more components are conducted or connected through "electrical connection" or "coupling connection" to perform signal / energy transmission, which may be referred to as connection.

[0047] Transmission loss: The transmission loss is a ratio of output power to input power, and refers to a capability loss caused by factors such as a transmission medium during transmission. Spatial propagation of ultra-high frequency and microwave band signals may cause a plurality of types of transmission impairments, great attenuation, and multipath fading to the signals. The transmission loss may be represented by S21. A larger value of S21 indicates a smaller transmission loss. An ideal value is 1, that is, 0 dB. Usually, signal quality can be ensured if the value is greater than -3 dB.

[0048] Capacitor: The capacitor may be understood as a lumped capacitor and / or a distributed capacitor. The lumped capacitor is a capacitive component, for example, a capacitor element. The distributed capacitor (or a distributed capacitor) is an equivalent capacitor including two conductive members that are spaced by a specific gap. The capacitor in this application is a distributed capacitor, and includes two plates and an insulation medium disposed between the two plates.

[0049] To better understand the signal transmission method disclosed in embodiments of this application, a communication system to which embodiments of this application are applicable is described.

[0050] Technical solutions / apparatuses in embodiments of this application may be used in various communication systems, for example, a global system for mobile communications, a long term evolution (long term evolution, LTE) system, a universal mobile telecommunications system, a 4th generation (4th generation, 4G) mobile communication technology system, a next-generation radio access network (next-generation radio access network, NG-RAN), a new radio (new radio, NR) technology system, and a 5th generation mobile network (5th generation mobile network, 5G) system. With continuous development of communication technologies, the technical solutions in embodiments of this application may be further applied to a subsequent evolved communication system, for example, a 6th generation mobile network (6th generation mobile network, 6G) system or 7th generation mobile network (7th generation mobile network, 7G) system.

[0051] Embodiments of this application provide a communication apparatus. The communication device may be a transceiver, a network device, a microwave communication device, a Wi-Fi communication device, or the like, or may be various types of terminal devices.

[0052] In embodiments of this application, the terminal device may also be referred to as user equipment (user equipment, UE), a terminal (terminal), an access terminal, a subscriber unit (subscriber unit), a subscriber station, a mobile station (mobile station, MS), a remote station, a remote terminal, a mobile device, a user terminal, a user agent, or a user apparatus, and may be used in a 4G, 5G, or even 6G system. The terminal device in embodiments of this application may be a handheld device, a vehicle-mounted device, a wearable device, a compute device, or another processing device connected to a wireless modem that has a wireless communication function. The terminal device may be a terminal that has a function of connecting to a cellular base station. Alternatively, the terminal device may be a terminal (namely, a Wi-Fi terminal) in a wireless fidelity (wireless fidelity, Wi-Fi) system, and the Wi-Fi terminal has a function of connecting to a Wi-Fi wireless access point (access point, AP) (namely, a Wi-Fi AP). For example, the terminal device may be a cellular phone (cellular phone), a smartphone (smartphone), a pad (Pad), a wireless data card, a personal digital assistant (personal digital assistant, PDA) computer, a tablet computer, a wireless modem (modem), a handheld device (handset), a laptop computer (laptop computer), a machine type communication (machine type communication, MTC) terminal, or the like. Alternatively, the terminal device may be a virtual reality (virtual reality, VR) terminal device, an augmented reality (augmented reality, AR) terminal device, a wireless terminal in industrial control (industrial control), a wireless terminal in self-driving (self-driving), a wireless terminal in remote medical (remote medical), a wireless terminal in a smart grid (smart grid), a wireless terminal in transportation safety (transportation safety), a wireless terminal in a smart city (smart city), a wireless terminal in a smart home (smart home), or the like.

[0053] The network device in this application is a device having a wireless transceiver function, for example, a radio access network (radio access network, RAN). A radio access network device may provide a wireless communication function service, and may connect a terminal to a wireless network. The radio access network device may be a node in the radio access network, referred to as a RAN node for short.

[0054] In a possible scenario, the RAN node may be a base station (base station, BS), an evolved NodeB (evolved NodeB, eNodeB), a transmission reception point (transmission reception point, TRP), a home evolved NodeB (home evolved NodeB or home NodeB, HNB), an access point (access point, AP) of wireless fidelity (wireless fidelity, Wi-Fi), a mobile switching center, a next generation NodeB (next generation NodeB, gNB) in a 5G mobile communication system, a next generation base station in a 6G mobile communication system, a base station in a future mobile communication system, or the like. Alternatively, the RAN node may be a device that functions as a base station in a device-to-device (device-to-device, D2D) communication system, a vehicle-to-everything (vehicle-to-everything, V2X) communication system, a machine-to-machine (machine-to-machine, M2M) communication system, or an internet of things (internet of things, IoT) communication system. Alternatively, the RAN node may be a RAN node in a non-terrestrial network (non-terrestrial network, NTN). In other words, the RAN node may be deployed on a high-altitude platform or a satellite. The RAN node may be a macro base station, may be a micro base station or an indoor base station, may be a relay node, a donor node, or the like, or may be a radio controller in a cloud radio access network (cloud radio access network, CRAN) scenario, a node in an open radio access network (open radio access network, O-RAN or ORAN) scenario, or the like. Optionally, the RAN node may alternatively be a server, a wearable device, a vehicle, a vehicle-mounted device, or the like. For example, a RAN node in a V2X technology may be a road side unit (road side unit, RSU). Certainly, the RAN node may alternatively be a node in a core network.

[0055] In some embodiments, the communication apparatus includes a waveguide and a communication system. The communication system may be configured to perform transmission of a radio frequency signal.

[0056] In some embodiments, the communication system may be a microwave circuit system. A microwave is an electromagnetic wave whose frequency ranges from 30 MHz to 300 GHz, has characteristics of easy clustering, high directionality and straight-line transmission, and can be used for transmission of high frequency signals in free space without line-of-sight obstruction. A frequency of the microwave is higher than that of a common radio wave, and the microwave is also called an ultra-high frequency electromagnetic wave.

[0057] In some other embodiments, the communication system may be configured to perform transmission of a radio frequency signal above 40 GHz.

[0058] FIG. 1 is a circuit diagram of a communication system. In some embodiments, the communication system includes one or more microwave devices. The microwave devices include active components and passive components.

[0059] The active components in the microwave devices, such as diodes, triodes, switches, and power amplifiers, all need direct current power supply. For an integrated chip that has integrated a plurality of components, the integrated chip has a designed independent power supply port, and this type of port is generally separated from a radio frequency transmission line. However, radio frequency devices such as the diodes and the triodes are single devices, have a small structure, and have no independent power supply port. A radio frequency port also serves as a power supply port. Therefore, an external circuit needs to be designed to isolate radio frequency signals from a supplied direct current, so as to prevent direct currents from damaging other components.

[0060] In some embodiments, a planar transmission line may serve as a transmission line connecting microwave devices.

[0061] In some embodiments, different communication systems may be connected through a waveguide. Therefore, a structure of transition between the waveguide and the planar transmission line needs to be provided.

[0062] For example, as shown in FIG. 1, the communication system includes a first transmission line 01, a direct current feeding end 02, an active component 03, and a second transmission line 04.

[0063] The first transmission line 01 is connected to the active component 03 through the second transmission line 04. The first transmission line 01 is configured to input a radio frequency signal to the active component 03. The direct current feeding end 02 is connected to the active component 03 through the second transmission line 04. The direct current feeding end 02 is configured to feed a direct current into the active component 03.

[0064] Types of the first transmission line and the second transmission line are not limited in this embodiment of this application. The transmission line is classified into a coaxial line, the waveguide, and the planar transmission line. The following describes structures of different types of transmission lines with reference to FIG. 2, FIG. 3, FIG. 4, FIG. 5, FIG. 6, and FIG. 7.

[0065] FIG. 2 is a diagram of a structure of a coaxial line according to an embodiment of this application. FIG. 3 is a sectional view of the coaxial line in FIG. 2. As shown in FIG. 2 and FIG. 3, the coaxial line includes: a first conductor 1, a second conductor 2, and a dielectric layer 3. The first conductor 1 and the second conductor 2 are coaxial, and the dielectric layer 3 is located between the first conductor 1 and the second conductor 2.

[0066] A closed structure is used for the coaxial line, and an electromagnetic wave is propagated in a medium between inner and outer conductors of the coaxial line. In a scenario in which there is a low frequency, a loss of the coaxial line is small. However, in a scenario in which there is a high frequency, for example, a millimeter wave scenario, a dielectric loss in the coaxial line increases, causing a large transmission loss. Therefore, generally, there are few scenarios in which the coaxial line serves as a main transmission line in a millimeter wave frequency band greater than 40 GHz.

[0067] FIG. 4 is a diagram of a structure of a waveguide according to an embodiment of this application. FIG. 5 is a sectional view of the waveguide in FIG. 4. As shown in FIG. 4 and FIG. 5, the waveguide is a single conductor transmission line, and the waveguide includes a first conductor 1. The first conductor 1 encloses as a cavity, and there is air 4 inside the cavity.

[0068] The air is inside the waveguide, and an electromagnetic wave is propagated in the waveguide. Therefore, a loss is significantly small, and a power capacity is large. However, due to a non-planarized structure, the waveguide, similar to the coaxial line, is also difficult to be applicable to a scenario in which there are a large quantity of active components.

[0069] The planar transmission line includes forms such as a microstrip, a strip line, a groove line, and a coplanar waveguide. A planar transmission line may be integrated with an active component to form a microwave circuit, where the microstrip has a simple structure and is often used in the microwave circuit.

[0070] FIG. 6 is a diagram of a structure of a planar transmission line according to an embodiment of this application. FIG. 7 is a top view of the planar transmission line in FIG. 6. As shown in FIG. 6 and FIG. 7, the planar transmission line includes: a first conductor 1, a dielectric layer 3 disposed on the first conductor 1, and a transmission strip 5 disposed on the dielectric layer. The first conductor 1 serves as a ground plate.

[0071] In an embodiment, the first transmission line 01 is, for example, a coaxial line. The coaxial line is applicable to a circuit system with a low frequency.

[0072] The communication system provided in this application has a high frequency. Therefore, the waveguide and the planar transmission line may separately serve as a transmission line.

[0073] For example, in some embodiments, the first transmission line 01 is the waveguide, and the second transmission line 04 is the planar transmission line. For example, the second transmission line 04 may be the planar transmission line shown in FIG. 6.

[0074] Radio frequency devices such as diodes and triodes are single devices and have a simple structure. A radio frequency port of the radio frequency device also serves as a power supply port. For such a component, an external circuit needs to be designed to isolate radio frequency signals from a supplied direct current, so as to prevent direct currents from damaging other components.

[0075] As shown in FIG. 1, a first inductor 002 is connected in parallel to a radio frequency transmission line at an input end of the active component 03, and a second inductor 003 is connected in parallel to a radio frequency transmission line at an output end of the active component 03, so as to perform direct current power supply. Therefore, the two power supply inductors are connected in parallel to the radio frequency transmission lines at the two ends of the active component 03, to supply direct current power to the diode.

[0076] Still refer to FIG. 1. A first capacitor 001 is connected in series to the radio frequency transmission line at the input end of the active component 03, and a second capacitor 004 is connected in series to the radio frequency transmission line at the output end of the active component 03, to isolate the supplied direct current. In this way, the two capacitors are connected in series to the input and output transmission lines of the active component 03, so as to prevent a direct current that supplies power to the active component 03 from being connected in series to the radio frequency transmission line.

[0077] However, the foregoing structure is applicable only to a microwave circuit with a low frequency. In a microwave frequency band with a high frequency, for example, a frequency band above 40 GHz, a loss at the power supply port is large, and it is difficult to implement a good radio frequency isolation effect by using a conventional inductor, so that a complex power supply isolation circuit needs to be additionally designed.

[0078] Therefore, an embodiment of this application provides an improved communication system. The communication system includes a transmission-strip-to-waveguide connector that integrates a function of connection between a waveguide and a transmission strip, and a direct current power supply function.

[0079] FIG. 8 shows a communication system according to an embodiment of this application. As shown in FIG. 8, the communication system 100 includes a waveguide 10 and a transmission-strip-to-waveguide connector 20 that are disposed in a stacked manner in a z direction. The connector 20 is coupled to the waveguide 10.

[0080] In some embodiments, a planar transmission line is used for the transmission-strip-to-waveguide connector 20. For example, as shown in FIG. 8, the planar transmission line may be a microstrip.

[0081] As shown in FIG. 8, the transmission-strip-to-waveguide connector 20 includes a transmission strip 203, a dielectric substrate 202, and a ground plate 201 that are disposed in a stacked manner in the z direction.

[0082] In some embodiments, the transmission strip 203, the dielectric substrate 202, and the ground plate 201 may be respectively disposed at different layers in a thickness direction of the connector. These layers may be parallel to each other. A plane in which each layer is located may be referred to as an x-y plane, and a direction perpendicular to the x-y plane may be referred to as the z direction. In other words, the transmission strip 203, the dielectric substrate 202, and the ground plate 201 may be distributed hierarchically in the z direction.

[0083] The transmission strip 203 is disposed on a first surface of the dielectric substrate 202, and the ground plate 201 is disposed on a second surface of the dielectric substrate 202.

[0084] In some embodiments, the ground plate 201 is disposed on the second surface of the dielectric substrate 202.

[0085] The dielectric substrate 202 is configured to bear the ground plate 201 and the transmission strip 203.

[0086] In some embodiments, the dielectric substrate 202 is made of an insulation material, such as resin, ceramic, or glass fiber. The ground plate 201 may be a metal structure disposed on the dielectric substrate 202 shown in FIG. 8.

[0087] In some other embodiments of this application, the dielectric substrate 202 is, for example, a printed circuit board (PCB, Printed Circuit Board), and the ground plate 201 is made of a conductive material.

[0088] In an embodiment, the conductive material may be any one of the following materials: copper, aluminum, stainless steel, brass and an alloy thereof, copper foil on insulation laminates, aluminum foil on insulation laminates, gold foil on insulation laminates, silver-plated copper, silver-plated copper foil on insulation laminates, silver foil and tin-plated copper on insulation laminates, cloth impregnated with graphite powder, graphite-coated laminates, copper-plated laminates, brass-plated laminates, and aluminum-plated laminates. A person skilled in the art may understand that the ground plate 201 may also be made of another conductive material.

[0089] In an embodiment, a material of the ground plate 201 may be metal copper. To be specific, the ground plate 201 may be specifically a copper-clad layer on the second surface of the dielectric substrate 202.

[0090] In some embodiments, the ground plate 201 is printed on the first surface of the dielectric substrate 202.

[0091] In another embodiment, the dielectric substrate 202 may alternatively be another substrate having a bearing function, and the material of the ground plate 201 may alternatively be another conductor. This is not specifically limited in this application.

[0092] The waveguide 10 is disposed close to the ground plate 201.

[0093] In some embodiments, the waveguide 10 is a radio frequency signal input port or a radio frequency signal output port of an external circuit, and is configured to transmit a radio frequency signal to an active component, or may receive a radio frequency signal sent by an active component.

[0094] In some embodiments, a slot 2011 is provided on the ground plate 201, and the waveguide 10 is coupled to the slot 2011.

[0095] In some embodiments, the transmission strip 203 includes a microstrip 2031, a plate 2033, and an element 2032, where both the plate 2033 and the element 2032 are connected to the microstrip 2031. The microstrip 2031 is further configured to be connected to the active component.

[0096] In some embodiments, a first end of the microstrip 2031 is configured to be connected to the active component, a second end of the microstrip 2031 is connected to the plate 2033, and a third end of the microstrip 2031 is connected to the element 2032. The third end of the microstrip 2031 is located between the first end of the microstrip 2031 and the second end of the microstrip 2031. That is, the element 2032 is disposed between the two ends of the microstrip 2031.

[0097] The element 2032 is coupled to the slot 2011 on the ground plate 201.

[0098] In a radio frequency signal emitting phase, a radio frequency signal transmitted by the waveguide 10 is coupled to the dielectric substrate 202 through the slot 2011 on the ground plate 201, and is transferred to the element 2032 through the dielectric substrate 202. Then, the radio frequency signal is transmitted to the first end and the second end of the microstrip 2031 through the element 2032. A radio frequency signal transmitted to the first end of the microstrip leads to the active component, to complete transition between the waveguide 10 and the microstrip 2031, so as to emit the radio frequency signal.

[0099] Alternatively, in a radio frequency signal receiving phase, the microstrip 2031 may transfer, to the element 2032, energy of the radio frequency signal that is from the active component, then the energy is coupled to the slot 2011 on the ground plate 201 through the dielectric substrate 202, and is coupled to the waveguide 10 through the slot 2011, so as to receive the radio frequency signal.

[0100] In the foregoing embodiment, after being transmitted to the second end of the microstrip 2031, a radio frequency signal reaches the plate. To aggregate the radio frequency signal at the element 2032 to reduce a loss, in some embodiments, the transmission-strip-to-waveguide connector 20 further includes a capacitor.

[0101] In some embodiments, the capacitor is a distributed capacitor, which is an equivalent capacitor including two conductive members that are spaced by a specific gap.

[0102] The capacitor includes the plate 2033, the ground plate 201, and the dielectric substrate 202 located between the plate 2033 and the ground plate 201.

[0103] The plate 2033 is opposite to the ground plate 201. Both the plate 2033 and the ground plate 201 are conductors, and the two are spaced by the specific gap to form the equivalent capacitor. The plate 2033 and the ground plate 201 may serve as two electrodes of the capacitor.

[0104] A shape and a material of the plate 2033 are not limited in this embodiment of this application. In some embodiments, the material of the plate 2033 may be the same as that of the microstrip 2031. The shape of the plate 2033 may include a sector shape, a rectangular shape, a circular shape, and the like.

[0105] In some embodiments, a size of the plate 2033 in a y direction is greater than a size of the microstrip 2031 in the y direction. For example, as shown in FIG. 9 and FIG. 13, a width of the microstrip 2031 in the y direction is N1, and a width of the plate 2033 in the y direction is N2.

[0106] In some embodiments, as shown in FIG. 9, the plate 2033 is a sector, and the width N2 of the plate 2033 in the y direction changes gradually. That the size of the plate 2033 in the y direction is greater than the size of the microstrip 2031 in the y direction may be that a largest size (a largest value of the width N2) of the plate 2033 in the y direction is greater than the size of the microstrip 2031 in the y direction.

[0107] In some embodiments, as shown in FIG. 13, the plate 2033 is a rectangle, and the width N2 of the plate 2033 in the y direction is unchanged. That the size of the plate 2033 in the y direction is greater than the size of the microstrip 2031 in the y direction may be that the size (width N2) of the plate 2033 in the y direction is greater than the size of the microstrip 2031 in the y direction.

[0108] Therefore, a larger size of the plate 2033 indicates a larger area of the plate 2033, a larger generated equivalent capacitance, and better performance of reflecting the radio frequency signal, thereby further reducing a loss.

[0109] The plate 2033, the ground plate 201, and the dielectric substrate 202 jointly form the capacitor, and the radio frequency signal transmitted to the second end of the microstrip 2031 leads to the plate 2033 connected to the microstrip 2031. Because the plate 2033 and the ground plate 201 form the capacitor, the capacitor is short-circuited to the high-frequency radio frequency signal, and therefore an electric field at a position of the capacitor is zero, and the radio frequency signal is totally reflected back at the position.

[0110] For example, in the radio frequency signal emitting phase, the radio frequency signal transmitted by the waveguide 10 is coupled to the dielectric substrate 202 through the slot 2011 on the ground plate 201, and is transferred to the element 2032 through the dielectric substrate 202. Then, the radio frequency signal is transmitted to the first end and the second end of the microstrip 2031 through the element 2032. The radio frequency signal transmitted to the first end of the microstrip leads to the active component. The radio frequency signal transmitted to the second end of the microstrip leads to the plate, and is reflected at the capacitor including the plate and the ground plate, and the reflected radio frequency signal leads to the active component through the microstrip. In this way, the transition between the waveguide 10 and the transmission strip is completed, to emit the radio frequency signal.

[0111] Alternatively, in the radio frequency signal receiving phase, the microstrip 2031 may transfer, to the element 2032, the energy of the radio frequency signal that is from the active component, and a part of the radio frequency energy transmitted to the element 2032 is coupled to the waveguide 10.

[0112] The other part of the radio frequency energy transmitted to the element 2032 leads to the plate 2033, and is reflected by the capacitor including the plate and the ground plate. The reflected radio frequency energy is coupled to the waveguide 10 through the slot on the ground plate 201 and the radiation element 2032, to complete radio frequency signal transition from the transmission strip to the waveguide 10.

[0113] In the foregoing example, an energy transition principle from the waveguide 10 to the microstrip 2031 is opposite to a signal transmission direction from the microstrip 2031 to the waveguide 10.

[0114] In some embodiments, the transmission-strip-to-waveguide connector 20 further includes a direct current feeding end 205. The direct current feeding end 205 is connected to the plate 2033. Because the plate 2033 is connected to the microstrip 2031, a direct current bias may be loaded to the microstrip 2031 by supplying a direct current on the plate 2033 directly.

[0115] During operating, the direct current feeding end 205 may load a direct current signal to the plate 2033, and the direct current signal reaches the active component through the plate 2033 and the microstrip 2031 in sequence, to implement direct current power supply to the active component.

[0116] The transmission-strip-to-waveguide connector 20 provided in this embodiment of this application may transmit, to the active component, the radio frequency signal transmitted by the waveguide 10, and the active component emits the signal, or the signal received by the active component may be transmitted to the waveguide 10, to implement signal receiving and sending.

[0117] The plate 2033 is disposed at one end of the microstrip, so that the plate 2033, the ground plate 201, and the dielectric substrate 202 jointly form the capacitor, for reflecting the radio frequency signal transferred to the capacitor, thereby reducing energy leakage.

[0118] In addition, the direct current feeding end 205 is disposed on the plate 2033 of the capacitor, so that the direct current signal can be loaded to the plate 2033. The direct current signal reaches the active component through the plate 2033 and the microstrip 2031 in sequence, to implement the direct current power supply to the active component. The capacitor including the plate 2033 and the ground plate 201 is disconnected from the direct current signal, and does not affect the direct current signal.

[0119] Therefore, according to the connector provided in this embodiment of this application, the plate is reused in the capacitor and the direct current feeding circuit. In a circuit system, a function of the transition between the waveguide and the transmission strip is implemented, and a power supply port isolated from the radio frequency signal is provided, to implement direct current feeding for the active component, and implement power supply for the component and signal transmission. This structure is simple, and a loss is reduced in comparison with the circuit shown in FIG. 1.

[0120] The following describes structures of the slot 2011 and the element 2032 with reference to FIG. 8 and FIG. 9.

[0121] As shown in FIG. 8, two slots 2011, to be specific, a first slot 2011a and a second slot 2011b that are arranged in the y direction as shown in FIG. 9, are provided on the ground plate 201.

[0122] The first slot 2011a and the second slot 2011b are provided in parallel, and lengths of the first slot 2011a and the second slot 2011b are the same, for example, both are l. The lengths l of the first slot 2011a and the second slot 2011b satisfy: l − λ 1 2 ≤ A, where λ 1 is a wavelength of an electromagnetic wave in the waveguide 10, and A is an error threshold. In some embodiments, a range of A satisfies: -0.1 λ 1 ≤A≤0.1 λ 1 . That is, a range of the slot length satisfies: 0.4 λ 1 ≤l≤0.6 λ 1 . For example, in some embodiments, the slot length l is 0.5λ 1 .

[0123] The element 2032 in FIG. 8 includes at least the following: a first element 2032a and a second element 2032b that are arranged in an x direction shown in FIG. 9. A projection of the first element 2032a on the ground plate 201 overlaps the first slot 2011a, and a projection of the second element 2032b on the ground plate 201 overlaps the second slot 2011b. An error may exist for overlapping between the projection of the element on the ground plate 201 and the slot. For example, the projection of the element on the ground plate 201 may partially overlap the slot. For example, the projection of the element on the ground plate 201 is parallel to the slot, and a center of the projection of the element on the ground plate 201 overlaps a center of the slot.

[0124] Lengths of the first element 2032a and the second element 2032b are the same, for example, both are L. The lengths L of the first element 2032a and the second element 2032b satisfy: |L-λ 2 | ≤ B, where λ 2 is a wavelength of an electromagnetic wave on the microstrip, and B is an error threshold. In some embodiments, a range of B satisfies: -0.3 λ 2 ≤B≤0.3 λ 2 . That is, a range of the lengths L of the first element 2032a and the second element 2032b satisfies: 0.7 λ 2 ≤l≤1.3 λ 2 . For example, in some embodiments, the lengths L of the first element 2032a and the second element 2032b are λ 2 .

[0125] When the error threshold is within the foregoing range, a radio frequency transmission loss does not exceed 60%, and radio frequency performance is good.

[0126] A quantity of elements is not limited in this embodiment of this application. In some embodiments, there may be more than two elements 2032. The quantity of elements 2032 is the same as a quantity of slots 2011, and the element and the slot are in one-to-one correspondence. The quantity of elements 2032 and the quantity of slots 2011 are related to an aperture of the waveguide 10, and the slot 2011 should be within an opening range of the waveguide 10.

[0127] The following describes a structure of the planar transmission line with reference to FIG. 8 and FIG. 9.

[0128] In some embodiments, the transmission strip further includes a first connection line 2032c, and a first end of the first element 2032a is connected to a first end of the second element 2032b through the first connection line 2032d.

[0129] In some embodiments, a width of the first connection line is less than a width of the element. In this way, impedance matching of the first element 2032a and the second element 2032b can be improved.

[0130] In some other embodiments, as shown in FIG. 9, the transmission strip further includes a second connection line 2032d.

[0131] For example, the first end of the first element 2032a is connected to the first end of the second element 2032b through the first connection line 2032c, and a second end of the first element 2032a is connected to a second end of the second element 2032b through the second connection line 2032d. Widths of the first connection line 2032c and the second connection line 2032d are small. For example, the widths of the first connection line 2032c and the second connection line 2032d are both less than the width of the element.

[0132] Structures of the first connection line 2032c and the second connection line 2032d are not limited in this embodiment of this application. The first connection line 2032c and the second connection line 2032d may alternatively be of other structures used for impedance matching.

[0133] The following describes a structure of the microstrip 2031 with reference to FIG. 8 and FIG. 9.

[0134] In some embodiments, a first part of the microstrip 2031 is connected to the element 2032, a second part of the microstrip 2031 is connected to the plate 2033, and the second part of the microstrip 2031 is located between the plate 2033 and the element 2032.

[0135] In some embodiments, a length L a of the first element 2032a satisfies: |La - λ 2 | ≤ B , and the first element 2032a is symmetric with respect to the microstrip 2031.

[0136] A length Lb of the second element 2032b satisfies: |Lb - λ 2 | ≤ B, and the second element 2032b is symmetric with respect to the microstrip 2031.

[0137] Therefore, more radio frequency energy is transferred to the microstrip 2031 by disposing two elements as compared with disposing one element.

[0138] In addition, the first element 2032a and the second element 2032b each are symmetrically disposed with respect to the microstrip 2031. This helps evenly transfer the radio frequency energy to the microstrip 2031 through the first element 2032a and the second element 2032b separately, thereby avoiding impedance mismatch caused by uneven transfer of the radio frequency energy.

[0139] To further improve radio frequency transmission performance of the connector, the microstrip may be further improved.

[0140] In some embodiments of this application, the microstrip includes a first sub-microstrip 2031a, a second sub-microstrip 2031b, and a third sub-microstrip 2031c.

[0141] The first sub-microstrip 2031a is located between the second sub-microstrip 2031b and the third sub-microstrip 2031c, and the first sub-microstrip 2031a is connected to the element 2032.

[0142] One end of the second sub-microstrip 2031b is connected to the first sub-microstrip 2031a, and the other end is connected to the plate 2033.

[0143] One end of the third sub-microstrip 2031c is connected to the first sub-microstrip 2031a, and the other end is connected to the active component.

[0144] The element 2032 includes the first element 2032a and the second element 2032b.

[0145] In some embodiments, a first end of the first sub-microstrip 2031a is connected to the first element 2032a, and a second end of the first sub-microstrip 2031a is connected to the second element 2032b.

[0146] FIG. 10 is a diagram of electric field distribution on a transmission strip according to an embodiment of this application. As shown in FIG. 10, electric field strength at a and b in the figure is the largest, where a is located at one quarter of a periodicity, and b is located at three quarters of the periodicity. One periodicity corresponds to a wavelength of one electromagnetic wave on a microstrip. A position at one quarter of the periodicity is a position at one quarter of the wavelength, and a position at three quarters of the periodicity is a position at three quarters of the wavelength.

[0147] To further reduce the loss of the radio frequency energy on the microstrip, in some embodiments, the element 2032 may be disposed at a position with largest electric field strength on the microstrip, and a length of the second sub-microstrip 2031b may be adjusted, so that the radio frequency energy reflected back by the capacitor 2030 including the plate 2033 and the ground plate 201 returns to the position of the element 2032.

[0148] In some embodiments, a spacing d between adjacent elements 2032 satisfies: d − Nλ 2 2 ≤ C, where λ 2 is a wavelength of an electromagnetic wave on the microstrip, and N is a positive integer. For example, N is 1, 2, 3, 4, 5, or the like. C is an error threshold. In some embodiments, a range of C satisfies: -0.1N λ 2 ≤C≤0.1N λ 2 . That is, the range of the spacing d between the adjacent elements 2032 satisfies: 0.4N λ 2 ≤ l ≤0.6N λ 2 . For example, in some embodiments, the spacing d between the adjacent elements 2032 is 0.5N λ 2 .

[0149] In some embodiments, a spacing between the first element 2032a and the second element 2032b is Nλ 2 2 . For example, the spacing may be λ 2 2 , λ 2 , 3 λ 2 2 , 2λ 2 , or 5 λ 2 2 . In other words, the distance between the first element 2032a and the second element 2032b is an integer multiple of a half of the wavelength. In this way, when the first element 2032a and the second element 2032b are disposed, if one of the elements is disposed at a point with a strong electric field, the other element is also located at a point with a strong electric field.

[0150] Therefore, the first element 2032a and the second element 2032b may be disposed at points with a strong electric field on the microstrip, to improve radiation performance of the first element 2032a and the second element 2032b.

[0151] In some embodiments, the second sub-microstrip 2031b is located between the first end of the first sub-microstrip 2031a and the plate, so that a length D of the second sub-microstrip 2031b satisfies: D − 2 n − 1 λ 2 4 ≤ E, where λ 2 is the wavelength of the electromagnetic wave on the microstrip, and n is a natural number. For example, n is 0, 1, 2, 3, 4, or the like. E is an error threshold. In some embodiments, a range of E satisfies: -0.05 (2n-1) λ 2 ≤C≤0.05 (2n-1) λ 2 . That is, a range of the length D of the second sub-microstrip 2031b satisfies: 0.2 (2n-1)N λ 2 ≤D≤0.3 (2n-1)N λ 2 . For example, in some embodiments, the length D of the second sub-microstrip 2031b is 0.25 (2n-1)N λ 2 .

[0152] In some embodiments, the length of the second sub-microstrip 2031b is 2 n − 1 λ 2 4 , where n is a natural number. For example, n is 0, 1, 2, 3, 4, or the like. For example, the length of the second sub-microstrip 2031b may be λ 2 4 , 3 λ 2 4 , 5 λ 2 4 , 7 λ 2 4 , or the like. In other words, the length of the second sub-microstrip 2031b is an odd multiple of a quarter of the wavelength. In this way, after a signal reflected by the capacitor 2030 passes through the microstrip 2031 of the length 2 n − 1 λ 2 4 , an electric field is the strongest at the radiation element 2032, thereby reducing a transition loss.

[0153] For example, the radio frequency signal is transmitted to two ends of the microstrip 2031 through the element 2032, passes through the microstrip 2031 of the length of 2 n − 1 λ 2 4 , and then reaches the plate 2033. Because the capacitor 2030 including the plate 2033 and the ground plate is short-circuited to the radio frequency signal, the electric field at the position of the capacitor 2030 is zero, and the radio frequency signal is totally reflected back at this point. After the radio frequency signal passes through the microstrip 2031 of the length of 2 n − 1 λ 2 4 , the electric field is the strongest at the radiation element 2032, thereby reducing the transition loss.

[0154] In this way, the length of the second sub-microstrip 2031b is adjusted, so that the electric field of the radio frequency signal reflected at the capacitor 2030 may be the strongest at the radiation element 2032, and the transition loss between the waveguide 10 and the microstrip is reduced.

[0155] The shape of the plate 2033 is not limited in this embodiment of this application. In some embodiments of this application, the shape of the plate 2033 includes a sector shape, a rectangular shape, and a circular shape.

[0156] In some embodiments, as shown in FIG. 9 and FIG. 11, the shape of the plate 2033 is a sector shape. The sector-shaped plate 2033 includes a first edge and a second edge that are opposite to each other in the X direction, and a third edge and a fourth edge that connect the first edge and the second edge.

[0157] The first edge, the third edge, and the fourth edge are straight edges, and the second edge is an arc-shaped edge.

[0158] In some embodiments, the first edge includes a first end and a second end that are opposite to each other, the second edge includes a third end and a fourth end that are opposite to each other, the third edge is configured to connect the first end of the straight edge and the first end of the arc-shaped edge, and the fourth edge is configured to connect the second end of the first edge and the second end of the second edge.

[0159] In some embodiments, the first edge of the plate is connected to the microstrip, and at least one of the second edge, the third edge, and the fourth edge is configured to be connected to the direct current feeding end.

[0160] In some embodiments, the second edge is connected to the direct current feeding end 205.

[0161] A structure of the sector-shaped plate 2033 is not limited in this embodiment of this application. For example, a radius of the sector-shaped plate 2033 is approximately 0.125 λ 2 to 0.25 λ 2 , where λ 2 is the wavelength of the electromagnetic wave on the microstrip.

[0162] In some embodiments, a radian of the sector-shaped plate 2033 is 120°.

[0163] A position of the direct current feeding end 205 is not limited in this embodiment of this application. The direct current feeding end 205 may be connected to the second edge of the sector-shaped plate 2033, and the position or an angle is not limited.

[0164] FIG. 11 is a diagram of positions and angles of direct current feeding ends 205. FIG. 11 shows seven direct current feeding ends: a first direct current feeding end 205A, a second direct current feeding end 205B, a third direct current feeding end 205C, a fourth direct current feeding end 205D, a fifth direct current feeding end 205E, a sixth direct current feeding end 205F, and a seventh direct current feeding end 205G. The direct current feeding ends may be connected to the second edge of the sector-shaped plate 2033, and are at different positions.

[0165] An included angle between the first direct current feeding end 205A and the first edge of the sector-shaped plate 2033 is 40°, an included angle between the second direct current feeding end 205B and the first edge of the sector-shaped plate 2033 is 50°, an included angle between the third direct current feeding end 205C and the first edge of the sector-shaped plate 2033 is 60°, an included angle between the fourth direct current feeding end 205D and the first edge of the sector-shaped plate 2033 is 70°, an included angle between the fifth direct current feeding end 205E and the first edge of the sector-shaped plate 2033 is 80°, an included angle between the sixth direct current feeding end 205F and the first edge of the sector-shaped plate 2033 is 90°, and an included angle between the seventh direct current feeding end 205G and the first edge of the sector-shaped plate 2033 is 120°.

[0166] FIG. 12 is a curve diagram of transmission losses of different direct current feeding ends in FIG. 11 for transition between a waveguide and a microstrip. As shown in FIG. 12, in a frequency band from 66 GHz to 76 GHz, the radio frequency transmission losses corresponding to the first direct current feeding end 205A, the second direct current feeding end 205B, the third direct current feeding end 205C, the fourth direct current feeding end 205D, the fifth direct current feeding end 205E, the sixth direct current feeding end 205F, and the seventh direct current feeding end 205G are similar, and are approximately -1 dB. The transmission losses are small, and signal quality is improved.

[0167] In some other embodiments, as shown in FIG. 13, the shape of the plate 2033 is a rectangular shape. The rectangular plate 2033 includes a first edge and a second edge that are opposite to each other in the X direction, and a third edge and a fourth edge that connect the first edge and the second edge.

[0168] The first edge, the second edge / third edge, and the fourth edge are all straight edges.

[0169] In some embodiments, the first edge includes a first end and a second end that are opposite to each other, the second edge includes a third end and a fourth end that are opposite to each other, the third edge is configured to connect the first end of the straight edge and the first end of the arc-shaped edge, and the fourth edge is configured to connect the second end of the first edge and the second end of the second edge.

[0170] In some embodiments, the first edge of the plate is connected to the microstrip, and at least one of the second edge, the third edge, and the fourth edge is configured to be connected to the direct current feeding end.

[0171] In some embodiments, as shown in FIG. 13, the second edge is connected to an eighth direct current feeding end 205M.

[0172] In some other embodiments, as shown in FIG. 13, the fourth edge is connected to a ninth direct current feeding end 205N.

[0173] A position of the direct current feeding end 205 is not limited in this embodiment of this application. In some embodiments, the direct current feeding end 205 may be connected to the second edge or the fourth edge of the rectangular plate 2033, and the position or an angle is not limited.

[0174] Still refer to FIG. 13. FIG. 13 shows two direct current feeding ends: the eighth direct current feeding end 205M and the ninth direct current feeding end 205N. The eighth direct current feeding end 205M may be connected to the second edge of the rectangular plate 2033, the ninth direct current feeding end 205N may be connected to the fourth edge of the rectangular plate 2033, and the eighth direct current feeding end 205M and the ninth direct current feeding end 205N are at different positions.

[0175] An included angle between the eighth direct current feeding end 205M and the first edge of the rectangular plate 2033 is 110°, and an included angle between the ninth direct current feeding end 205N and the first edge of the rectangular plate 2033 is 140°.

[0176] FIG. 14 is a curve diagram of transmission losses of different direct current feeding ends in FIG. 13 for transition between a waveguide and a microstrip. As shown in FIG. 14, in a frequency band from 66 GHz to 76 GHz, the radio frequency transmission losses corresponding to the eighth direct current feeding end 205M and the ninth direct current feeding end 205N are similar, and are approximately -1 dB. The transmission losses are small, and signal quality is improved.

[0177] In some embodiments, as shown in FIG. 8, the transmission strip 203 further includes a shielding plate 204, the shielding plate 204 is spaced apart from the microstrip 2031, the shielding plate 204 is disposed around the element 2032, and the shielding plate 204 is spaced apart from the element 2032.

[0178] Refer to FIG. 9. The width of the microstrip 2031 is N1, a width of a gap between the shielding plate 204 and the element 2032 is M1, and a width of a gap between the shielding plate 204 and the microstrip 2031 is M2, where M1 should satisfy: N1≤M1≤3 N1, and M2 should satisfy: N1≤M2≤3 N1.

[0179] In this way, the element 2032 is surrounded by the shielding plate 204, to prevent leakage of radio frequency energy. In addition, both the width of the gap between the element 2032 and the shielding plate 204 and the width of the gap between the shielding plate 204 and the microstrip 2031 satisfy a preset range. When the widths of the gaps are within the preset range, the shielding plate 204 has little impact on the microstrip 2031 and the element 2032, and shielding effect of the shielding plate 204 can be supported.

[0180] In some embodiments, as shown in FIG. 9, the shielding plate 204 includes a first shielding plate 2041 and a second shielding plate 2042.

[0181] The first shielding plate 2041 and the second shielding plate 2042 are disposed on two sides of the microstrip 2031 in the y direction, and are spaced apart from the microstrip 2031.

[0182] In some embodiments, the first element 2032a and the second element 2032b are separately connected to the second connection line 2032d, and are located on one side of the microstrip 2031, to form a first ring structure. The first shielding plate 2041 is disposed around the first ring structure, and is spaced apart from the first ring structure.

[0183] In addition, the first element 2032a and the second element 2032b are separately connected to the first connection line 2032c, and are located on another side of the microstrip 2031, to form a second ring structure. The second shielding plate 2042 is disposed around the second ring structure, and is spaced apart from the second ring structure.

[0184] In some embodiments, as shown in FIG. 8, a conductive connection portion 2021 is disposed in the dielectric substrate 202, and the shielding plate 204 is connected to the ground plate 201 through the conductive connection portion 2021.

[0185] In some embodiments, the conductive connection portion 2021 includes a plurality of metal vias.

[0186] In this way, the shielding plate is connected to the ground plate 201 through the conductive connection portion, and the shielding plate 204, the conductive connection portion 2021, and the ground plate 201 enclose a metal cavity with an opening on a single side, to further prevent the leakage of the radio frequency energy.

[0187] In some embodiments, a projection of the conductive connection portion 2021 on the ground plate 201 is within a projection range of the shielding plate 204 on the ground plate 201, so that the shielding plate 204 can be better connected to the ground plate 201 through the conductive connection portion 2021.

[0188] A quantity of conductive connection portions is not limited in this embodiment of this application. A proper quantity of conductive connection portions may be determined based on the projection range of the shielding plate 204 on the ground plate 201.

[0189] The transmission-strip-to-waveguide connector provided in this embodiment of this application includes the transmission strip, the dielectric substrate, and the ground plate. The transmission strip is located on the first surface of the dielectric substrate, and the ground plate is located on the second surface of the dielectric substrate. The slot is provided on the ground plate, and the slot is configured to be coupled to the waveguide. The transmission strip includes the microstrip, the plate, and the element coupled to the slot.

[0190] The microstrip includes the first end and the second end that are opposite to each other, and the third end located between the first end and the second end, the first end is connected to the plate, the second end is configured to be connected to the active component, and the third end is connected to the element. The plate is connected to the direct current feeding end, and the plate is coupled to the ground plate.

[0191] An embodiment of this application further provides a communication method. The communication method is applied to the transmission-strip-to-waveguide connector, and the transmission-strip-to-waveguide connector includes a transmission strip, a dielectric substrate, and a ground plate; the transmission strip is located on a first surface of the dielectric substrate, and the ground plate is located on a second surface of the dielectric substrate; a slot is provided on the ground plate, and the slot is configured to be coupled to a waveguide; and the transmission strip includes a microstrip, a plate, and an element coupled to the slot, where the microstrip includes a first end and a second end that are opposite to each other, and a third end located between the first end and the second end, the first end is connected to the plate, the second end is configured to be connected to an active component, the third end is connected to the element, the plate is connected to a direct current feeding end, and the plate is coupled to the ground plate.

[0192] The method is applied to a phase in which the waveguide 10 emits a radio frequency signal through the active component, and the method includes:

[0193] The radio frequency signal transmitted by the waveguide is coupled to the element through the slot, and is transmitted to the first end and the second end of the microstrip through the element, where a radio frequency signal transmitted to the first end of the microstrip leads to the active component.

[0194] A radio frequency signal transmitted to the second end of the microstrip leads to the plate, and is reflected at a capacitor including the plate and the ground plate, and the reflected radio frequency signal leads to the active component through the microstrip.

[0195] An embodiment of this application further provides a communication method. The communication method is also applied to the transmission-strip-to-waveguide connector. For a structure of the transmission-strip-to-waveguide connector, refer to the foregoing descriptions. Details are not described herein again.

[0196] The method is applied to a phase in which a waveguide 10 receives a radio frequency signal through an active component, and the method includes:

[0197] A microstrip transmits, to an element, a first radio frequency signal that is from the active component, and couples, to a waveguide, a second radio frequency signal and a third radio frequency signal that are transmitted by the element.

[0198] The second radio frequency signal is a part of the radio frequency signal transmitted to the element, and the third radio frequency signal is a radio frequency signal reflected by a capacitor including a plate and a ground plate.

[0199] When the radio frequency signal is emitted and the radio frequency signal is received, a direct current feeding end 205 is disposed on the plate 2033 of the capacitor, so that a direct current signal can be loaded to the plate 2033, and the direct current signal reaches the active component through the plate 2033 and the microstrip 2031 in sequence.

[0200] Therefore, the transmission-strip-to-waveguide connector provided in this embodiment of this application not only implements a function of transition between the waveguide 10 and a transmission strip through a circuit system, which has a simple structure and a low loss, but also can implement direct current power supply for the active component.

[0201] An embodiment of this application further provides a controller. The controller may be a controller of a communication apparatus, and may be configured to perform the foregoing communication method, to emit and receive a radio frequency signal.

[0202] It may be understood that, to implement functions of any one of the foregoing embodiments, a communication system includes a corresponding hardware structure and / or software module for performing each function. A person skilled in the art should easily be aware that, in combination with units and algorithm steps of the examples described in embodiments disclosed in this specification, this application may be implemented by hardware or a combination of hardware and computer software. Whether a function is performed by hardware or hardware driven by computer software depends on particular applications and design constraints of the technical solutions. A person skilled in the art may use different methods to implement the described functions for each particular application, but it should not be considered that the implementation goes beyond the scope of this application.

[0203] In embodiments of this application, the communication system may be divided into functional modules. For example, each functional module may be obtained through division based on each corresponding function, or two or more functions may be integrated into one processing module. The integrated module may be implemented in a form of hardware, or may be implemented in a form of a software functional module. It should be noted that, in embodiments of this application, module division is an example, and is merely a logical function division. During actual implementation, another division manner may be used.

[0204] It should be further understood that the modules in the communication system may be implemented in a form of software and / or hardware. This is not specifically limited. In other words, the electronic device is presented in a form of a functional module. The "module" herein may be an application-specific integrated circuit (application-specific integrated circuit, ASIC), a circuit, a processor that executes one or more software programs or firmware programs, a memory, an integrated logic circuit, and / or another component that can provide the foregoing function.

[0205] In an optional manner, when software is used for implementing data transmission, the data transmission may be completely or partially implemented in a form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the procedures or functions according to embodiments of this application are all or partially implemented. The computer may be a general-purpose computer, a dedicated computer, a computer network, or another programmable apparatus. The computer instructions may be stored in a computer-readable storage medium or may be transmitted from a computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions may be transmitted from a website, computer, server, or data center to another website, computer, server, or data center in a wired (for example, a coaxial cable, an optical fiber, or a digital subscriber line (digital subscriber line, DSL)) or wireless (for example, infrared, radio, or microwave) manner. The computer-readable storage medium may be any usable medium accessible to the computer, or a data storage device, for example, a server or a data center, integrating one or more usable media. The usable medium may be a magnetic medium (for example, a floppy disk, a hard disk, or a magnetic tape), an optical medium (for example, a digital video disk (digital video disk, DVD)), a semiconductor medium (for example, a solid state disk (solid state disk, SSD)), or the like.

[0206] Method or algorithm steps described in combination with embodiments of this application may be implemented by hardware, or may be implemented by a processor by executing software instructions. The software instructions may include a corresponding software module. The software module may be stored in a random access memory (Random Access Memory, RAM), a flash memory, a read-only memory (Read-Only Memory, ROM), an erasable programmable read-only memory (Erasable Programmable Read-Only Memory, EPROM), an electrically erasable programmable read-only memory (Electrically Erasable Programmable read-only memory, EEPROM), a register, a hard disk, a removable hard disk, a compact disc read-only memory (Compact Disc Read-Only Memory, CD-ROM), or any other form of storage medium well-known in the art. For example, the storage medium is coupled to the processor, so that the processor can read information from the storage medium and write information to the storage medium. Certainly, the storage medium may be a component of the processor. The processor and the storage medium may be disposed in an ASIC. In addition, the ASIC may be located in an electronic device. Certainly, the processor and the storage medium may alternatively exist in the communication system as discrete components.

[0207] The foregoing descriptions about implementations allow a person skilled in the art to understand that, for the purpose of convenient and brief description, division of the foregoing functional modules is taken as an example for illustration. In actual application, the foregoing functions can be allocated to different functional modules and implemented according to a requirement, that is, an inner structure of an apparatus is divided into different functional modules to implement all or some of the functions described above.

[0208] The foregoing descriptions are merely specific implementations of this application, but are not intended to limit the protection scope of this application. Any variation or replacement within the technical scope disclosed in this application shall fall within the protection scope of this application. Therefore, the protection scope of this application shall be subject to the protection scope of the claims.

Claims

1. A transmission-strip-to-waveguide connector, comprising a transmission strip, a dielectric substrate, and a ground plate, wherein the transmission strip is disposed on a first surface of the dielectric substrate, and the ground plate is disposed on a second surface of the dielectric substrate; a slot is provided on the ground plate, and the slot is configured to be coupled to a waveguide; and the transmission strip comprises a microstrip, a plate, and an element coupled to the slot, wherein a first end of the microstrip is connected to an active component, a second end of the microstrip is connected to the plate, a third end of the microstrip is connected to the element, and the third end is located between the first end and the second end; and the plate is connected to a direct current feeding end, and the plate is coupled to the ground plate.

2. The transmission-strip-to-waveguide connector according to claim 1, wherein the plate, the dielectric substrate, and the ground plate form a capacitor.

3. The transmission-strip-to-waveguide connector according to claim 1 or 2, wherein a width of the plate is greater than a width of the microstrip.

4. The transmission-strip-to-waveguide connector according to any one of claims 1 to 3, wherein a length l of the slot satisfies: l − λ 1 2 ≤ A, wherein λ1 is a wavelength of an electromagnetic wave in the waveguide, and A is an error threshold.

5. The transmission-strip-to-waveguide connector according to any one of claims 1 to 4, wherein a length L of the element satisfies: |L - λ2|≤ B, wherein λ2 is a wavelength of an electromagnetic wave on the microstrip, and B is an error threshold.

6. The transmission-strip-to-waveguide connector according to any one of claims 1 to 5, wherein the element is symmetric with respect to the microstrip.

7. The transmission-strip-to-waveguide connector according to any one of claims 1 to 6, wherein there are a plurality of elements, and a spacing d between adjacent elements satisfies: d − Nλ 2 2 ≤ C, wherein C is an error threshold, and N is a positive integer.

8. The transmission-strip-to-waveguide connector according to claim 7, wherein the transmission strip further comprises a first connection line, and first ends of the two adjacent elements are connected through the first connection line.

9. The transmission-strip-to-waveguide connector according to claim 8, wherein a width of the first connection line is less than a width of the element.

10. The transmission-strip-to-waveguide connector according to any one of claims 1 to 9, wherein a first part of the microstrip is connected to the element, a second part of the microstrip is connected to the plate, and the second part of the microstrip is located between the plate and the element.

11. The transmission-strip-to-waveguide connector according to claim 10, wherein a length D of the second part of the microstrip satisfies: D − 2 n − 1 λ 2 4 ≤ E, wherein E is an error threshold, and n is a natural number.

12. The transmission-strip-to-waveguide connector according to any one of claims 1 to 11, wherein a shape of the plate comprises a sector shape or a rectangular shape.

13. The transmission-strip-to-waveguide connector according to any one of claims 1 to 12, wherein a first edge of the plate is connected to the microstrip, a second edge of the plate is opposite to the first edge, and at least one of the second edge, a third edge of the plate, and a fourth edge of the plate is connected to the direct current feeding end, wherein the third edge and the fourth edge are connected to the first edge and the second edge.

14. The transmission-strip-to-waveguide connector according to any one of claims 1 to 13, wherein the transmission strip further comprises a shielding plate, the shielding plate is spaced apart from the microstrip, the shielding plate is disposed around the element, and the shielding plate is spaced apart from the element.

15. The transmission-strip-to-waveguide connector according to claim 14, wherein the shielding plate is configured to shield an electromagnetic wave emitted by the element.

16. The transmission-strip-to-waveguide connector according to claim 14 or 15, wherein a conductive connection portion is disposed in the dielectric substrate, and the shielding plate is connected to the ground plate through the conductive connection portion.

17. The transmission-strip-to-waveguide connector according to claim 16, wherein the conductive connection portion comprises a plurality of metal vias.

18. A communication apparatus, comprising an active component and the transmission-strip-to-waveguide connector according to any one of claims 1 to 17, wherein the active component is connected to the second end of the microstrip.

19. The communication apparatus according to claim 18, wherein the active component comprises a diode or a triode.

20. A communication system, comprising a waveguide and the communication apparatus according to claim 18 or 19, wherein the waveguide is coupled to the slot of the transmission-strip-to-waveguide connector.

21. A communication method, wherein the communication method is applied to a transmission-strip-to-waveguide connector, and the transmission-strip-to-waveguide connector comprises a transmission strip, a dielectric substrate, and a ground plate; the transmission strip is located on a first surface of the dielectric substrate, and the ground plate is located on a second surface of the dielectric substrate; a slot is provided on the ground plate, and the slot is configured to be coupled to a waveguide; the transmission strip comprises a microstrip, a plate, and an element coupled to the slot, wherein the microstrip comprises a first end and a second end that are opposite to each other, and a third end located between the first end and the second end, the first end is connected to the plate, the second end is configured to be connected to an active component, the third end is connected to the element, the plate is connected to a direct current feeding end, and the plate is coupled to the ground plate; and the method comprises: coupling a radio frequency signal transmitted by the waveguide to the element through the slot, and transmitting the radio frequency signal to the first end and the second end of the microstrip through the element, wherein a radio frequency signal transmitted to the first end of the microstrip leads to the active component; and a radio frequency signal transmitted to the second end of the microstrip leads to the plate, and is reflected at a capacitor consisting of the plate and the ground plate, and the reflected radio frequency signal leads to the active component through the microstrip.

22. The communication method according to claim 21, wherein the plate is configured to receive a direct current signal loaded at the direct current feeding end, to cause the direct current signal to be transmitted to the active component through the plate and the microstrip in sequence.

23. The communication method according to claim 21 or 22, wherein a first part of the microstrip is connected to the element, a second part of the microstrip is connected to the plate, and the second part of the microstrip is located between the plate and the element.

24. The communication method according to claim 23, wherein a length D of the second part of the microstrip satisfies: D − 2 n − 1 λ 2 4 ≤ E, wherein E is an error threshold, and n is a natural number.

25. A communication method, wherein the communication method is applied to a transmission-strip-to-waveguide connector, and the transmission-strip-to-waveguide connector comprises a transmission strip, a dielectric substrate, and a ground plate; the transmission strip is located on a first surface of the dielectric substrate, and the ground plate is located on a second surface of the dielectric substrate; a slot is provided on the ground plate, and the slot is configured to be coupled to a waveguide; the transmission strip comprises a microstrip, a plate, and an element coupled to the slot, wherein the microstrip comprises a first end and a second end that are opposite to each other, and a third end located between the first end and the second end, the first end is connected to the plate, the second end is configured to be connected to an active component, the third end is connected to the element, the plate is connected to a direct current feeding end, and the plate is coupled to the ground plate; and the method comprises: transmitting, by the microstrip to the element, a first radio frequency signal that is from the active component, and coupling, to the waveguide, a second radio frequency signal and a third radio frequency signal that are transmitted by the element, wherein the second radio frequency signal is a part of the radio frequency signal transmitted to the element; and the third radio frequency signal is a radio frequency signal reflected by a capacitor consisting of the plate and the ground plate.

26. The communication method according to claim 25, wherein the plate is configured to receive a direct current signal loaded at the direct current feeding end, to cause the direct current signal to be transmitted to the active component through the plate and the microstrip in sequence.

27. The communication method according to claim 25 or 26, wherein a first part of the microstrip is connected to the element, a second part of the microstrip is connected to the plate, and the second part of the microstrip is located between the plate and the element.

28. The communication method according to claim 27, wherein a length D of the second part of the microstrip satisfies: D − 2 n − 1 λ 2 4 ≤ E, wherein E is an error threshold, and n is a natural number.

29. A computer-readable storage medium, wherein the storage medium stores a computer program or instructions, and when the computer program or the instructions are executed by a processing device, the method according to any one of claims 21 to 28 is implemented.

30. A computer program product, comprising a computer program or instructions, wherein when the computer program or the instructions are executed by a processing device, the method according to any one of claims 21 to 28 is implemented.

31. An electronic device, wherein the electronic device comprises: a transceiver, configured to receive or send a signal; a memory, configured to store computer program instructions; and a processor, configured to run the computer program instructions, to cause the electronic device to implement the communication method according to any one of claims 21 to 28.

32. A chip system, wherein the chip system comprises a processing circuit and a storage medium, the storage medium stores computer program instructions, and when the computer program instructions are executed by the processing circuit, the method according to any one of claims 21 to 28 is implemented.

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