Electronic device

Abstract

This application provides an electronic device. The electronic device includes a housing, having a first through hole and a first channel, where the first through hole penetrates the housing in a first direction, the first channel extends in a second direction, the second direction intersects with the first direction, one end of the first channel is exposed from the housing, and the other end of the first channel communicates with the first through hole; a first enclosing member, fastened on one side of the housing and covering an opening on one side of the first through hole; a second enclosing member, fastened on the other side of the housing and covering an opening on the other side of the first through hole, where the second enclosing member is provided with a communication hole; and a microphone, where the microphone is fastened on a side that is of the second enclosing member and that faces away from the first through hole, and the microphone communicates with the first through hole through the communication hole. According to the electronic device provided in this application, the housing is designed, so that a sound transmission channel of the microphone can be enclosed by the first enclosing member, the housing, and the second enclosing member, to implement a slim and lightweight design at a location at which the microphone is installed on the housing, thereby facilitating a slim and lightweight design of the entire electronic device.

Description

[0001] This application claims priority to Chinese Patent Application No. 202421075878.7, filed with the China National Intellectual Property Administration on May 16, 2024 and entitled "ELECTRONIC DEVICE", which is incorporated herein by reference in its entirety.TECHNICAL FIELD

[0002] This application relates to the field of audio technologies, and in particular, to an electronic device.BACKGROUND

[0003] In an electronic device with an audio design, a microphone is usually installed in a middle frame of the electronic device, and a sound transmission channel is disposed in the middle frame for communication between the microphone and the outside. Because the microphone needs to be installed in the middle frame, and the sound transmission channel connected to the microphone is designed, the thickness of the middle frame is relatively large, making it difficult to implement a slim and lightweight design.SUMMARY

[0004] This application provides an electronic device. The electronic device includes a microphone, a first enclosing member, a housing, and a second enclosing member. The housing is designed, so that a sound transmission channel of the microphone can be enclosed by the first enclosing member, the housing, and the second enclosing member, to implement a slim and lightweight design at a location at which the microphone is installed on the housing, thereby facilitating a slim and lightweight design of the entire electronic device.

[0005] This application provides an electronic device. The electronic device includes a housing, having a first through hole and a first channel, where the first through hole penetrates the housing in a first direction, the first channel extends in a second direction, the second direction intersects with the first direction, one end of the first channel is exposed from the housing, and the other end of the first channel communicates with the first through hole; a first enclosing member, fastened on one side of the housing and covering an opening on one side of the first through hole; a second enclosing member, fastened on the other side of the housing and covering an opening on the other side of the first through hole, where the second enclosing member is provided with a communication hole; and a microphone, where the microphone is fastened on a side that is of the second enclosing member and that faces away from the first through hole, and the microphone communicates with the first through hole through the communication hole.

[0006] In this application, a sound transmission channel is enclosed by the housing, the first enclosing member, and the second enclosing member, so that the microphone can pick up a sound by using the sound transmission channel. The first through hole penetrating the housing in a Z direction is disposed, and two sides of the first through hole are blocked by using the first enclosing member and the second enclosing member, to form the second channel (namely, a part of the sound transmission channel) through enclosure. The communication hole is provided on the second enclosing member, and the communication hole, the second channel, and the first channel sequentially communicate with each other to form the sound transmission channel. Therefore, the sound transmission channel is not integrally formed by the housing, but is formed through enclosure of a top surface of the first enclosing structural member, a bottom surface of the second enclosing structural member, and the housing. Because the first enclosing member and the second enclosing member are not a part of the housing, and are not limited by strength of the housing, arrangement of the sound transmission channel is decoupled from a minimum thickness required by the strength of the housing, so that the thickness of the housing is not limited by the sound transmission channel. Therefore, the thickness of the housing can be reduced. In other words, a middle frame can implement a thinning design, which facilitates a slim and lightweight design of the electronic device.

[0007] In some possible implementations, the housing has a first groove and a second groove that are disposed opposite to each other in the first direction, and the first through hole penetrates a groove bottom wall of the first groove and a groove bottom wall of the second groove. The first groove accommodates the first enclosing member, and the second groove accommodates at least a part of the second enclosing member and the microphone.

[0008] In the implementations, the first groove and the second groove are disposed, so that the thickness of the housing in a region in which the first through hole is disposed can be reduced. Because the microphone is installed in correspondence with the first through hole, the housing can implement a thinning design at a location at which the microphone is installed. In addition, the first groove is disposed to accommodate the first enclosing member, and the second groove is disposed to accommodate at least a part of the second enclosing member and the microphone. This helps reduce extra space occupied by the first enclosing member, the second enclosing member, and the microphone in the Z direction, and facilitates an overall thinning design of the housing.

[0009] In some possible implementations, in the first direction, a groove depth of the second groove is greater than a groove depth of the first groove.

[0010] In the implementations, the second groove can have larger accommodating space, so that the second groove can better accommodate the second enclosing member and the microphone, thereby improving space utilization of a groove structure of the housing. To be specific, the first groove with a relatively small groove depth is used to accommodate the first enclosing member, and the second groove with a relatively large groove depth is used to accommodate the second enclosing member and the microphone, thereby improving space utilization of each groove structure of the housing and facilitating an overall thinning design of the housing.

[0011] In some possible implementations, a surface that is of the microphone and that is away from the groove bottom wall of the first groove is located in the second groove.

[0012] In the implementations, in a thickness direction of the electronic device, the microphone is not higher than a top surface of the housing, so that the microphone does not occupy extra size space in the thickness direction of the electronic device, thereby facilitating an overall thinning design of the housing.

[0013] In some possible implementations, in the first direction, the first channel is offset toward a side of the microphone relative to the first through hole.

[0014] In the implementations, in an extension direction (namely, an X direction) of the first channel, wall thicknesses of the housing on two sides of the first channel in the Z direction need to meet a structural strength requirement. Therefore, the first channel is offset toward the side of the microphone relative to the first through hole in the Z direction, which helps maintain consistency of the wall thicknesses of the housing on the two sides of the first channel in the Z direction, and facilitates a reduction design of an overall thickness that is of the housing and that exists after the microphone is installed. For example, if the first channel is not offset relative to the first through hole, or the first channel is offset toward a side away from the microphone relative to the first through hole, the microphone is offset in the Z direction relative to the first channel, which may also mean that the microphone is designed to be raised relative to the first channel. In this case, to ensure structural strength of the housing at the first channel, in a case, the thickness of the housing at the first channel is set to exactly meet the structural strength requirement, and in this case, the microphone is higher than a top surface of a region that is of the housing and in which the first channel is disposed, so that a part of the microphone is higher than the second groove. Consequently, the overall thickness that is of the housing and that exists after the microphone is installed is excessively large, and it is difficult for the electronic device to implement a thinning design. In another case, a wall thickness of the housing on a side that is of the first channel and that is close to the microphone is set, so that the microphone can be fully accommodated in the second groove. Consequently, an overall wall thickness of the housing at a location at which the first channel is disposed is excessively large, and it is also difficult for the electronic device to implement a thinning design. Therefore, in the Z direction, the first channel is offset toward the side of the microphone relative to the first through hole, to properly design the thickness of the region that is of the housing and in which the first channel is disposed and the thickness of a region that is of the housing and in which the microphone is installed, so that the overall thickness of the housing at the microphone after the microphone is disposed on the housing is not greater than the thickness of the location at which the first channel is disposed on the housing. In addition, the location at which the first channel is disposed on the housing can be designed based on the thickness of strength of a neighboring structure, so that a reduction design of an overall thickness of the housing is implemented, and the overall thickness is not increased after the microphone is disposed on the housing, thereby facilitating an overall thinning design of the electronic device.

[0015] In some possible implementations, the first through hole is enclosed by the first enclosing member and the second enclosing member to form a second channel, and a volume of the first channel is greater than a volume of the second channel.

[0016] In the implementations, the volume of the first channel is set to be greater than the volume of the second channel, so that a resonance frequency of the microphone can be increased, thereby improving a use effect of the microphone.

[0017] In some possible implementations, an inner diameter of the first channel is greater than or equal to 0.8 mm.

[0018] In the implementations, an improvement to a resonance frequency of the microphone is facilitated. For example, the inner diameter of the first channel may be but is not limited to 0.8 mm, 0.9 mm, 1 mm, or another value greater than 0.8 mm.

[0019] In some possible implementations, the first through hole is enclosed by the first enclosing member and the second enclosing member to form a second channel, the size of the second channel in the first direction is greater than 0.6 mm, and the size of the second channel in the second direction is greater than 1 mm.

[0020] In the implementations, the second channel is short in size and has a large inner diameter, so that the resonance frequency of the microphone is increased, thereby improving a use effect of the microphone. For example, the size of the second channel in the Z direction may be 0.61 mm, 0.62 mm, 0.63 mm, 0.64 mm, 0.65 mm, or another value greater than 0.6 mm. The size of the second channel in the X direction may be 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm, 1.5 mm, or another value greater than 1 mm.

[0021] In some possible implementations, the first through hole includes a first part and a second part that communicate with each other, one end of the second part of the first through hole communicates with the first channel, and the other end of the second part of the first through hole communicates with the first part of the first through hole. The first part of the first through hole penetrates the groove bottom wall of the first groove and the groove bottom wall of the second groove, the second part of the first through hole penetrates the groove bottom wall of the first groove, and a sidewall that is of the second groove and that is close to the first channel blocks a part of an end that is of the second part of the first through hole and that is away from the first groove.

[0022] In the implementations, because the first channel is offset toward the side of the microphone relative to the first through hole in the thickness direction of the electronic device, a bending connection structure exists at a joint between the first channel and the first through hole. The sidewall that is of the second groove and that is close to the first channel blocks a part of the end that is of the second part of the first through hole and that is away from the first groove, so that a connection wall can be used as a sidewall of the bending connection structure, and therefore, the second part of the first through hole can be connected to the first channel.

[0023] In some possible implementations, the housing further has a fourth groove, the fourth groove is recessed in the groove bottom wall of the second groove, and the fourth groove is disposed around the first part of the first through hole. The electronic device further includes a first bonding member, the first bonding member is filled in the fourth groove, and the first bonding member bonds the housing to the second enclosing member.

[0024] In the implementations, the fourth groove is disposed to improve arrangement stability of the first bonding member, so that stability of bonding the housing to the second enclosing member by the first bonding member is improved, thereby improving sealing performance between the second enclosing member and the housing.

[0025] In some possible implementations, the width of the fourth groove is greater than 0.6 mm, and the depth of the fourth groove is greater than 0.1 mm.

[0026] In the implementations, because the width of the fourth groove may be greater than 0.6 mm, and the depth of the fourth groove may be greater than 0.1 mm, the fourth groove can accommodate the first bonding member with a sufficient amount, so that an improvement to strength of bonding the housing to the second enclosing member by the first bonding member can be facilitated, thereby improving bonding stability.

[0027] In some possible implementations, the second groove has a first surface, the first surface is located in the second groove and is disposed close to the first channel, and an included angle between the first surface and the groove bottom wall of the second groove ranges from 0° to 90°. The second enclosing member includes a first part and a second part that are connected to each other, and the first part of the second enclosing member is bonded to the first bonding member. The electronic device further includes a second bonding member, and the second bonding member is bonded between the second part of the second enclosing member and the first surface.

[0028] In the implementations, a material reduction design may be performed on regions of the second groove that are close to a first part and a third part of the connection arm, so that a second part of the connection wall protrudes from the first part and the third part of the connection wall in the Z direction, which facilitates a weight reduction design of the housing, thereby facilitating a lightweight design of the housing and reducing material costs.

[0029] In some possible implementations, the housing further includes an adhesive stopper, the adhesive stopper protrudes from the first surface, the adhesive stopper extends in a third direction, the size of the adhesive stopper is greater than the size of the first through hole in the third direction, and the third direction is perpendicular to the first direction, and intersects with the second direction. The second bonding member is disposed around the adhesive stopper.

[0030] In the implementations, because the first surface is provided with the adhesive stopper, when the second bonding member flows between the second part of the second enclosing member and the first surface before being cured, the second bonding member in a fluid state is blocked by the adhesive stopper, to prevent the second bonding member in the fluid state from flowing into the first through hole, thereby preventing the second bonding member from leaking into the sound transmission channel and affecting a sound transmission effect of the sound transmission channel. Therefore, after the second bonding member is formed through curing, the second bonding member can be disposed around the adhesive stopper.

[0031] In some possible implementations, the first bonding member is connected to the second bonding member.

[0032] In the implementations, the second bonding member may be connected to the first bonding member, to help dispose a bonding member everywhere between the second enclosing member and the housing, so that a bonding effect between the second enclosing member and the housing is improved, thereby improving a sealing effect between the second enclosing member and the housing.

[0033] In some possible implementations, the housing further has a third groove, the third groove is recessed in the groove bottom wall of the second groove, the third groove is disposed around the first part of the first through hole, the fourth groove is recessed in a groove bottom wall of the third groove, and the third groove accommodates the first part of the second enclosing member. The housing further has an adhesive storage groove, the adhesive storage groove is recessed in the groove bottom wall of the second groove, and communicates with the third groove and the fourth groove, the adhesive storage groove is located at two ends of the third groove, and parts of the first surface that are located on two sides of the adhesive stopper extend into the adhesive storage groove.

[0034] In the implementations, because the adhesive storage groove may be recessed in the groove bottom wall of the second groove, and communicates with the third groove and the fourth groove, the adhesive storage groove may be located at the two ends of the third groove, and the parts of the first surface that are located on the two sides of the adhesive stopper may extend into the adhesive storage groove, so that the second bonding member in the fluid state can flow through a gap between the second part of the second enclosing member and the first surface, bypass the adhesive stopper, and flow to the two sides of the adhesive stopper and into the adhesive storage groove. In this case, the second enclosing member in the fluid state can flow into the third groove through the adhesive storage groove, so that the second bonding member in the fluid state can be in contact with the first bonding member, and after the second bonding member is formed through curing, the second bonding member can be connected to the first bonding member. This helps dispose a bonding member everywhere between the second enclosing member and the housing, to improve a bonding effect between the second enclosing member and the housing, so that a sealing effect between the second enclosing member and the housing is improved.

[0035] In some possible implementations, the electronic device further includes a sealing member and a circuit board, the microphone is installed on the circuit board, and the sealing member is bonded between the second enclosing member and the circuit board. The sealing member has a second through hole, the circuit board has a third through hole, the third through hole and the second through hole communicate with the communication hole in the first direction, and the microphone covers an end that is of the third through hole and that is away from the second enclosing member.

[0036] In the implementations, the sealing member is disposed to implement sealing between both the microphone and the circuit board and the second enclosing member, so that sealing performance of the sound transmission channel is improved, and an improvement to a sound pickup effect of the microphone is facilitated.

[0037] In some possible implementations, in the first direction, a spacing between an edge of an orthographic projection of the sealing member on the second enclosing member and an edge of the second enclosing member is less than 0.1 mm.

[0038] In the implementations, the second enclosing member is set to extend outward by at least 0.1 mm compared with the sealing member, so that a poor sealing effect after the sealing member is offset on the second enclosing member can be prevented.

[0039] In some possible implementations, there is a limiting structure on a surface that is of the second enclosing member and that faces the sealing member, and the sealing member is installed in the limiting structure.

[0040] In the implementations, by disposing the limiting structure, an installation guide can be provided for installing the sealing member, to improve installation precision of the sealing member, and also, a limiting support can be provided for the sealing member after the sealing member is installed, to prevent deviation, detachment, and the like of the sealing member after the sealing member is installed, thereby improving a sealing installation effect of the sealing member.

[0041] In some possible implementations, the housing further has the third groove, the third groove is recessed in the groove bottom wall of the second groove, the third groove is disposed around the first part of the first through hole, the fourth groove is recessed in the groove bottom wall of the third groove, and the third groove accommodates a part of the second enclosing member. The sealing member is located in the third groove, the circuit board abuts against a surface that is of the sealing member and that is away from the second enclosing member, and is fixedly connected to the groove bottom wall of the second groove, and the sealing member is in a compressed state.

[0042] In the implementations, the circuit board abuts against the sealing member, and enables the sealing member to be in the compressed state, so that a gap between the circuit board and the sealing member and a gap between the sealing member and the second enclosing member can be eliminated, and sealing performance between the circuit board and the second enclosing member is further improved, to improve sealing performance between the communication hole, the second through hole, and the third through hole, which facilitates an improvement to a sound transmission effect of the sound transmission channel, thereby improving a use effect of the microphone. In addition, the circuit board is fixedly connected to the groove bottom wall of the second groove, so that it is ensured, by using the fixed connection between the groove bottom wall of the second groove and the circuit board, that the circuit board fully compresses the sealing member, thereby improving sealing performance between the circuit board and the second enclosing member.

[0043] In some possible implementations, the sealing member includes a sealing portion and a bonding portion that are stacked in a direction parallel to the first direction, the bonding portion bonds the second enclosing member to the sealing portion, a side that is of the sealing portion and that is away from the second enclosing member abuts against the circuit board, and a compression amount of the sealing portion ranges from 50% to 70%.

[0044] In the implementations, the circuit board can be in full contact with the sealing portion, so that sealing performance between the circuit board and the second enclosing member is improved. For example, the compression amount of the sealing portion may be but is not limited to 50%, 55%, 60%, 65%, 70%, or another value between 50% and 70%.

[0045] In some possible implementations, the housing further has a fifth groove, the fifth groove is recessed in the groove bottom wall of the first groove, and the fifth groove is disposed around the first through hole. The housing further includes a third bonding member, the third bonding member is located in the fifth groove, and the third bonding member bonds the housing to the first enclosing member.

[0046] In the implementations, the fifth groove is disposed to improve arrangement stability of the third bonding member, so that stability of bonding the housing to the first enclosing member by the third bonding member is improved, thereby improving sealing performance between the first enclosing member and the housing.

[0047] In some possible implementations, the width of the fifth groove is greater than 0.6 mm, and the depth of the fifth groove is greater than 0.1 mm.

[0048] In the implementations, because the width of the fifth groove may be greater than 0.6 mm, and the depth of the fifth groove may be greater than 0.1 mm, the fifth groove can accommodate the third bonding member with a sufficient amount, so that an improvement to strength of bonding the housing to the first enclosing member by the third bonding member can be facilitated, thereby improving bonding stability.

[0049] In some possible implementations, the thickness of the second enclosing member is greater than the thickness of the first enclosing member.

[0050] In the implementations, because the second enclosing member needs to bear the sealing member, the circuit board, and the microphone, and the first enclosing member does not need to bear another component, the second enclosing member has a higher strength requirement. Therefore, the thickness of the second enclosing member is set to be greater than the thickness of the first enclosing member, which helps ensure support strength of the second enclosing member, helps implement a thinning design at the first enclosing member, and helps reduce an overall thickness that is of the housing and that exists after the microphone is installed.

[0051] In some possible implementations, the thickness of the first enclosing member ranges from 0 mm to 0.3 mm, which facilitates a thinning design.

[0052] In some possible implementations, the thickness of the second enclosing member ranges from 0 mm to 0.3 mm, which facilitates a thinning design.

[0053] In some possible implementations, the housing further has a first end surface, and the first end surface faces away from the microphone. The first channel is exposed from the first end surface, and an opening that is of the first channel and that is located on the first end surface is located at the center of the first end surface in the first direction.

[0054] In the implementations, the opening that is of the first channel and that is located on the first end surface is located at the center of the first end surface in the Z direction, so that an improvement to appearance aesthetics of the housing is facilitated, thereby improving appearance aesthetics of the electronic device. In addition, this facilitates centering of the first channel in the housing in the Z direction, so that thickness sizes of the housing on the two sides of the first channel in the Z direction are the same, and the housing is set, based on a strength requirement, to have the same thickness size on the two sides of the first channel, thereby facilitating a slim and lightweight design of the housing.BRIEF DESCRIPTION OF DRAWINGS

[0055] FIG. 1A is a diagram of a structure of an electronic device according to an embodiment of this application; FIG. 1B is a schematic exploded view of a partial structure of the electronic device shown in FIG. 1A; FIG. 2 is a diagram of a structure in which a microphone in the electronic device shown in FIG. 1A is installed on a housing in some embodiments; FIG. 3A is a diagram of a structure in which a microphone is installed in a middle frame in the conventional technology; FIG. 3B is a diagram of simulation comparison between microphones in the embodiment shown in FIG. 2 and the conventional technology shown in FIG. 3A at different frequencies; FIG. 4A is a diagram of a three-dimensional structure in which the microphone shown in FIG. 2 is installed on a housing in some embodiments; FIG. 4B is a section diagram of a structure of an installation structure of the microphone shown in FIG. 4A along a line A-A in some embodiments; FIG. 5 is a schematic exploded view of a partial structure of an installation structure of the microphone shown in FIG. 4A; FIG. 6A is a diagram of a structure of a housing shown in FIG. 4B in some embodiments; FIG. 6B is a section diagram of a structure of the housing shown in FIG. 6A along B-B in some embodiments; FIG. 6C is a diagram of a structure of the housing shown in FIG. 6A from another perspective; FIG. 6D is a diagram of a structure of the housing shown in FIG. 6A from still another perspective; FIG. 7A is a diagram of a structure in which a first bonding member is disposed on the housing shown in FIG. 6A in some embodiments; FIG. 7B is a diagram of a structure in which a second enclosing member is installed on the housing shown in FIG. 7A in some embodiments; FIG. 7C is a diagram of a structure in which a second bonding member is disposed on the housing shown in FIG. 7B in some embodiments; FIG. 7D is a diagram of a structure in which no second enclosing member is installed on the housing shown in FIG. 7C; FIG. 8A is a diagram of a structure in which a sealing member shown in FIG. 8A is installed on the housing shown in FIG. 7C; FIG. 8B is a diagram of a structure of a sealing member in an installation structure of the microphone shown in FIG. 4A in some embodiments; FIG. 9 is a diagram of a structure in which a circuit board is installed on a housing shown in FIG. 8B in some embodiments; FIG. 10A is a diagram of a structure in which a third bonding member is installed on the housing shown in FIG. 6C in some embodiments; FIG. 10B is a diagram of a structure in which a first enclosing member is installed on the housing shown in FIG. 10A in some embodiments; FIG. 11 is a diagram of a structure of an installation structure of the microphone shown in FIG. 4B from another perspective; and FIG. 12 is a diagram of an assembly procedure of an installation structure of the microphone shown in FIG. 4A in some embodiments. DESCRIPTION OF EMBODIMENTS

[0056] The following describes embodiments of this application with reference to the accompanying drawings in embodiments of this application.

[0057] In the descriptions of embodiments of this application, it should be noted that terms "installation" and "connection" should be understood in a broad sense unless otherwise specified and limited. For example, "connection" may be a detachable connection, a non-detachable connection, a direct connection, or an indirect connection through an intermediate medium. "A plurality of' means at least two.

[0058] Orientation terms mentioned in embodiments of this application, for example, "upper", "lower", "inner", "outer", "top", "bottom", and "side" are merely directions based on the accompanying drawings. Therefore, the orientation terms are used to better and more clearly describe and understand embodiments of this application, instead of indicating or implying that a specified apparatus or element should have a specific orientation, and be constructed and operated in the specific orientation. Therefore, this cannot be understood as a limitation on embodiments of this application.

[0059] In embodiments of this application, a limitation on a relative location relationship is mentioned, for example, parallel, perpendicular, or aligned. These limitations are all defined based on a current technique level, but are not absolutely strict limitations. A small deviation is allowed, and being nearly parallel, nearly perpendicular, nearly aligned, or the like is allowed. For example, that A is parallel to B means that A is parallel or nearly parallel to B, and an included angle of 0 degrees to 10 degrees between A and B is allowed. For example, that A is perpendicular to B means that A is perpendicular or nearly perpendicular to B, and an included angle of 80 degrees to 100 degrees between A and B is allowed.

[0060] In embodiments of this application, the terms "first", "second", "third", and "fourth" are merely intended for a purpose of description, and shall not be understood as an indication or implication of relative importance or an implicit indication of a quantity of indicated technical features. Therefore, a feature defined by "first", "second", "third", or "fourth" may explicitly or implicitly include one or more such features.

[0061] Referring to FIG. 1A and FIG. 1B, FIG. 1A is a diagram of a structure of an electronic device 100 according to an embodiment of this application, and FIG. 1B is a schematic exploded view of a partial structure of the electronic device 100 shown in FIG. 1A.

[0062] In some embodiments, the electronic device 100 may be a device that has a sound pickup function, for example, a foldable mobile phone, a bar-type mobile phone, a tablet computer, a multimedia player, a headset, a notebook computer, a vehicle-mounted device, a foldable terminal device, a television, or a wearable device. The wearable device may be a smart band, a smart watch, a smart head-mounted display, smart glasses, or the like. An example in which the electronic device 100 in the embodiment shown in FIG. 1 is a bar-type mobile phone is used for description. Certainly, another type of electronic device 100 may also use a similar structure, and details are not described below.

[0063] For example, the electronic device 100 may include an enclosure 1, a display screen 2, and a microphone 3. The enclosure 1 is configured to protect an internal electronic component of the electronic device 100. The enclosure 1 may include a middle frame 101 and a rear cover 102, and the middle frame 101 is connected to the rear cover 102. For example, the display screen 2 may be fastened to the middle frame 101. The display screen 2 and the rear cover 102 are disposed opposite to each other, and the interior of the electronic device 100 may be jointly enclosed by the display screen 2, the middle frame 101, and the rear cover 102. The display screen 2 may be a flexible display screen or a rigid display screen. The display screen 2 may be an organic light-emitting diode (organic light-emitting diode, OLED) display, a mini light-emitting diode (mini organic light-emitting diode) display, a micro light-emitting diode (micro organic light-emitting diode) display, a quantum dot light-emitting diode (quantum dot light-emitting diodes, QLED) display, a liquid crystal display (liquid crystal display, LCD), or the like.

[0064] The middle frame 101 may be provided with a sound transmission channel 1011. There may be one or more sound transmission channels 1011. As shown in FIG. 1, there is one sound transmission channel 1011. In another embodiment, the sound transmission channel 1011 may alternatively be disposed at a joint between the middle frame 101 and the display screen 2, a joint between the middle frame 101 and the rear cover 102, or the like.

[0065] For example, the microphone 3 may be installed in the middle frame 101 and located inside the electronic device 100. FIG. 1A shows the microphone 3 by using a dashed line. The microphone 3 may receive an external sound of the electronic device 100 by using the sound transmission channel 1011. For example, during a voice call, the microphone 3 may receive a voice of a user by using the sound transmission channel 1011.

[0066] In some embodiments, a sound pickup process of the microphone 3 may be as follows: The microphone 3 picks up a sound by using the sound transmission channel 1011, and converts a received sound signal into a current signal. The electronic device 100 converts the current signal into an analog signal, performs analog-to-digital conversion on the analog signal to form a digital signal, and then transcodes the digital signal to form an audio file. The external sound of the electronic device 100 is transferred to the microphone 3 through the sound transmission channel 1011, and drives a diaphragm in the microphone 3 to vibrate, so as to drive an electrified voice coil to vibrate in a magnetic field environment of a magnetic circuit component of the microphone 3, thereby generating the current signal.

[0067] In another embodiment, the electronic device 100 may alternatively include a plurality of microphones 3, and the plurality of microphones 3 may be configured to receive sounds in a plurality of directions, to improve a sound pickup effect.

[0068] It should be noted that FIG. 1A and FIG. 1B merely schematically show some components of the electronic device 100. Actual shapes and actual sizes of these components are not limited by FIG. 1A, FIG. 1B, and the following accompanying drawings. It should be understood that when the electronic device 100 is in another form, the electronic device 100 may not include the display screen 2, or the electronic device 100 may include a plurality of display screens 2.

[0069] The following describes an installation structure of the microphone 3 in the electronic device 100.

[0070] Referring to FIG. 2 and FIG. 3A, FIG. 2 is a diagram of a structure in which the microphone 3 in the electronic device 100 shown in FIG. 1A is installed on a housing 4 in some embodiments, and FIG. 3A is a diagram of a structure in which the microphone 3 is installed in the middle frame 101 in the conventional technology.

[0071] In some embodiments, the electronic device 100 may further include the housing 4, a first enclosing member 5, and a second enclosing member 6. The first enclosing member 5 and the second enclosing member 6 are disposed on two opposite sides of the housing 4, the sound transmission channel 1011 may be enclosed by the housing 4, the first enclosing member 5, and the second enclosing member 6, and the microphone 3 may be disposed in correspondence with the sound transmission channel 1011. In this embodiment, the sound transmission channel 1011 is enclosed by the housing 4, the first enclosing member 5, and the second enclosing member 6, so that the microphone 3 can pick up a sound by using the sound transmission channel 1011.

[0072] It should be noted that in some examples, the housing 4 may be the middle frame 101 of the electronic device 100. In other words, the housing 4 shown in the embodiment in FIG. 2 is a partial structure of the middle frame 101. In some other examples, the housing 4 may be an independent structure. The housing 4, the first enclosing member 5, the second enclosing member 6, and the microphone 3 jointly form a microphone 3 module. Correspondingly, a structure that fits the housing 4 is disposed in the middle frame 101, so that the microphone 3 module is installed in the middle frame 101 through fitting installation between the housing 4 and the middle frame 101.

[0073] For example, the housing 4 may have a first through hole 401 and a first channel 402. The first through hole 401 may penetrate the housing 4 in a first direction, the first channel 402 may extend in a second direction, and the second direction intersects with the first direction. An end of the first channel 402 is exposed from the housing 4, and the other end of the first channel 402 communicates with the first through hole 401. The first enclosing member 5 may cover an opening on one side of the first through hole 401, the second enclosing member 6 may cover an opening on the other side of the first through hole 401, and the second enclosing member 6 is provided with a communication hole 601. The microphone 3 may be fastened on a side that is of the second enclosing member 6 and that faces away from the first through hole 401, and the microphone 3 communicates with the first through hole 401 through the communication hole 601.

[0074] It should be noted that the second enclosing member 6 covers an opening on one side of the first through hole 401 as a whole, and the communication hole 601 on the second enclosing member 6 also covers a partial region of the first through hole 401.

[0075] For ease of description, a coordinate system may be established. The following defines the first direction as a Z direction (also referred to as a Z-axis direction, namely, a thickness direction of the electronic device 100) and the second direction as an X direction (also referred to as an X-axis direction), and a Y direction (also referred to as a Y-axis direction) is perpendicular to the X direction, and is perpendicular to the Z direction. Specifically, the following defines a direction in which the first channel 402 extends toward the microphone 3 as a positive direction of the X direction, a direction in which the first enclosing member 5, the housing 4, the second enclosing member 6, and the microphone 3 are sequentially arranged as a positive direction of the Z direction, and a direction obtained after the positive direction of the Z direction rotates 90° counterclockwise in a plane perpendicular to an XZ plane as a positive direction of the Y direction. It may be understood that the X direction, the Y direction, and the Z direction are merely examples. In some other embodiments, the X direction, the Y direction, and the Z direction may alternatively be defined based on other references.

[0076] It should be noted that this embodiment of this application uses an example in which the first direction is perpendicular to the second direction, in other words, the Z direction is perpendicular to the X direction, and an angle of intersection between the first direction and the second direction is not limited. In some other embodiments, the first direction and the second direction may not be perpendicular to each other.

[0077] It should be noted that for descriptions of "top" or "bottom" of each component in the following descriptions, reference may be made to a positive direction and a negative direction of a Z-axis in the coordinate system. A surface that is of a component and that faces the Z direction may be referred to as a top surface, and a surface facing the negative direction of Z may be referred to as a bottom surface.

[0078] In the conventional technology, referring to FIG. 3A, the sound transmission channel 1011 is usually designed to be integrally formed in the middle frame 101, to be specific, there is a cavity inside the middle frame 101, and the cavity is the sound transmission channel 1011. However, each part of the middle frame 101 needs to have a specific thickness in the Z direction to ensure strength. In addition, due to an appearance design of the electronic device 100, an opening that is of the sound transmission channel 1011 and that is located on an outer surface of the middle frame 101 usually needs to be in the middle of the Z direction, so that sizes of the middle frame 101 in the Z direction on two sides of the sound transmission channel 1011 need to meet a specific value. In other words, L1 marked in FIG. 3A needs to meet a specific value. For example, L1 needs to be greater than or equal to 0.3 mm, to ensure structural strength of the middle frame 101. Therefore, in the conventional technology, it is difficult to reduce the thickness of the middle frame 101.

[0079] In addition, because the microphone 3 also has a specific thickness, after the microphone 3 is disposed in the middle frame 101, a sound pickup location of the microphone 3 deviates from a centerline of the middle frame 101. In other words, a surface that is of the microphone 3, that closely fits the middle frame 101, and that faces the sound transmission channel 1011 deviates from the centerline of the middle frame 101 in the Z direction. However, a specific thickness is required in the Z direction from the sound pickup location of the microphone 3 to a top portion of the middle frame 101 to ensure strength of the middle frame 101, in other words, L2 in FIG. 3A needs to meet a specific value. Consequently, the middle frame 101 is relatively thick, and it is difficult to meet a miniaturization requirement of the electronic device 100.

[0080] Continuing to refer to FIG. 2, in this embodiment, the first through hole 401 penetrating the housing 4 in the Z direction is disposed, and two sides of the first through hole 401 are blocked by using the first enclosing member 5 and the second enclosing member 6, to form a second channel 1012 (namely, a part of the sound transmission channel 1011) through enclosure. The communication hole 601 is provided on the second enclosing member 6, and the communication hole 601, the second channel 1012, and the first channel 402 sequentially communicate with each other to form the sound transmission channel 1011. Therefore, the sound transmission channel 1011 is not integrally formed by the housing 4, but is formed through enclosure of a top surface of the first enclosing member 5, a bottom surface of the second enclosing member 6, and the housing 4. Because the first enclosing member 5 and the second enclosing member 6 are not a part of the housing 4, and are not limited by strength of the housing 4, arrangement of the sound transmission channel 1011 is decoupled from a minimum thickness (namely, the size in the Z direction) required by the strength of the housing 4, so that the thickness of the housing 4 is not limited by the sound transmission channel 1011. Therefore, the thickness of the housing 4 can be reduced. In other words, the middle frame 101 can implement a thinning design, which facilitates a slim and lightweight design of the electronic device 100.

[0081] Specifically, in this embodiment, to meet a strength requirement of the housing 4, a region that is of the housing 4 and in which the first through hole 401 is disposed needs to meet a specific thickness. In other words, L3 marked in FIG. 2 needs to meet a specific value, in other words, the size of the first through hole 401 in the Z direction needs to meet a specific value. In addition, thicknesses of the housing 4 in the Z direction on two sides of the first channel 402 also need to meet a specific value. In other words, L4 marked in FIG. 2 needs to meet a specific value.

[0082] It may be assumed that the value of a wall thickness of each part of the housing 4 or the middle frame 101 (that is, the size of a wall of each part in the Z direction) needs to be greater than or equal to W, and values of L1, L3, and L4 are all W.

[0083] In a theoretical case, a top surface of the microphone 3 is not higher than the middle frame 101. The size of the first channel 402 in the Z direction in FIG. 2 is the same as the size of the sound transmission channel 1011 in the Z direction in the conventional technology in FIG. 3A. In this case, in the embodiment shown in FIG. 2, a maximum thickness of the housing 4 may be 2×W + the size of the first channel 402 in the Z direction. In the conventional technology shown in FIG. 3A, a maximum thickness of the middle frame 101 may be 2×W + the size of the sound transmission channel 1011 in the Z direction + the thickness of the microphone 3. Therefore, it can be learned that compared with the conventional technology, the housing 4 provided in this embodiment of this application can implement a thinning design at a maximum thickness, and a specific reduced size may be the thickness of the microphone 3, to implement a thinning design of the housing 4, in other words, implement a thinning design of the middle frame 101.

[0084] In addition, in a theoretical case, in the embodiment shown in FIG. 2, the size of a location at which the microphone 3 is installed is W + the thickness of the first enclosing member 5 + the thickness of the second enclosing member 6. In the embodiment shown in FIG. 3A, the size of a location at which the microphone 3 is installed is 2×W + the size of the sound transmission channel 1011 in the Z direction. The first enclosing member 5 and the second enclosing member 6 may be designed by using a material with relatively high strength, so that a strength requirement can be met by using a relatively small size. Therefore, it can be learned that compared with the conventional technology, the housing 4 provided in this embodiment of this application can implement a thinning design at a location at which the microphone 3 is installed. A specific reduced size may be W + the size of the sound transmission channel 1011 in the Z direction - the thickness of the first enclosing member 5 - the thickness of the second enclosing member 6, so that the thickness reduction design is implemented at the location that is of the housing 4 and at which the microphone 3 is installed, thereby facilitating an overall thinning design of the housing 4, in other words, facilitating an overall thinning design of the middle frame 101. For example, W=0.3 mm. In the conventional technology, the size of the sound transmission channel 1011 in the Z direction is 1 mm, the thickness of the first enclosing member 5 is 0.05 mm, and the thickness of the second enclosing member 6 is 0.1 mm. Compared with the conventional technology, this embodiment of this application implements a design of a thickness reduction of 1.15 mm at the location at which the microphone 3 is installed, in other words, implements a design of a thickness reduction of 71.9%.

[0085] It should be noted that the theoretical case described above means that no structure other than the microphone 3, the housing 4 / middle frame 101, the first enclosing member 5, and the second enclosing member 6 is included, and the microphone 3 is not higher than the housing 4 / middle frame 101, for example, does not include the size occupied by a sealing structure.

[0086] It should be noted that the sizes listed above are merely for illustrative descriptions, to facilitate comparison between this embodiment of this application and the conventional technology, and do not limit sizes of structures in this embodiment of this application.

[0087] Referring to FIG. 2 to FIG. 3B, FIG. 3B is a diagram of simulation comparison between microphones 3 in the embodiment shown in FIG. 2 and the conventional technology shown in FIG. 3A at different frequencies.

[0088] In simulation comparison, the length of the sound transmission channel 1011 in the embodiment shown in FIG. 2 is the same as the length of the sound transmission channel 1011 in the conventional technology shown in FIG. 3A. It can be learned from simulation comparison that sound pressure levels of the microphone 3 shown in the embodiment in FIG. 2 at different frequencies are basically the same as those of the microphone 3 in the conventional technology in FIG. 3A. Therefore, compared with the conventional technology, this embodiment of this application implements a thickness reduction design of the middle frame 101 without affecting performance of the microphone 3.

[0089] The following describes a specific structure in which the microphone 3 is installed on the housing 4.

[0090] Referring to FIG. 4A to FIG. 5, FIG. 4A is a diagram of a three-dimensional structure in which the microphone 3 shown in FIG. 2 is installed on the housing 4 in some embodiments; FIG. 4B is a section diagram of a structure of an installation structure of the microphone 3 shown in FIG. 4A along a line A-A in some embodiments; and FIG. 5 is a schematic exploded view of a partial structure of an installation structure of the microphone 3 shown in FIG. 4A.

[0091] In some embodiments, the electronic device 100 may further include a first bonding member 7, a second bonding member 8, a sealing member 9, a circuit board 10, and a third bonding member 11. The first bonding member 7 and the second bonding member 8 bond the second enclosing member 6 to one side of the housing 4, and the third bonding member 11 bonds the first enclosing member 5 to the other side of the housing 4. The sealing member 9 may be disposed between the circuit board 10 and the second enclosing member 6, to connect the circuit board 10 and the second enclosing member 6 through sealing. The microphone 3 is installed on the circuit board 10.

[0092] In this embodiment, the first bonding member 7 and the second bonding member 8 are disposed to implement sealing between the second enclosing member 6 and the housing 4, the third bonding member 11 is disposed to implement sealing between the first enclosing member 5 and the housing 4, and the sealing member 9 is disposed to implement sealing between both the microphone 3 and the circuit board 10 and the second enclosing member 6, so that sealing performance of the sound transmission channel 1011 is improved, and an improvement to a sound pickup effect of the microphone 3 is facilitated.

[0093] Referring to FIG. 4B, FIG. 6A, and FIG. 6B, FIG. 6A is a diagram of a structure of the housing 4 shown in FIG. 4B in some embodiments, and FIG. 6B is a section diagram of a structure of the housing 4 shown in FIG. 6A along B-B in some embodiments.

[0094] In some embodiments, the housing 4 may have a first groove 403 and a second groove 404 that are disposed opposite to each other in the Z direction. The first through hole 401 may penetrate a groove bottom wall of the first groove 403 and a groove bottom wall of the second groove 404. The first groove 403 may accommodate the first enclosing member 5, and the second groove 404 may accommodate at least a part of the second enclosing member 6 and the microphone 3.

[0095] In this embodiment, the first groove 403 and the second groove 404 are disposed, so that the thickness of the housing 4 in a region in which the first through hole 401 is disposed can be reduced. Because the microphone 3 is installed in correspondence with the first through hole 401, the housing 4 can implement a thinning design at a location at which the microphone 3 is installed. In addition, the first groove 403 is disposed to accommodate the first enclosing member 5, and the second groove 404 is disposed to accommodate at least a part of the second enclosing member 6 and the microphone 3. This helps reduce extra space occupied by the first enclosing member 5, the second enclosing member 6, and the microphone 3 in the Z direction, and facilitates an overall thinning design of the housing 4.

[0096] For example, in the Z direction, a groove depth of the second groove 404 may be greater than a groove depth of the first groove 403, and therefore, the second groove 404 can have larger accommodating space, so that the second groove 404 can better accommodate the second enclosing member 6 and the microphone 3, thereby improving space utilization of a groove structure of the housing 4. To be specific, the first groove 403 with a relatively small groove depth is used to accommodate the first enclosing member 5, and the second groove 404 with a relatively large groove depth is used to accommodate the second enclosing member 6 and the microphone 3, thereby improving space utilization of each groove structure of the housing 4 and facilitating an overall thinning design of the housing 4.

[0097] For example, a surface that is of the microphone 3 and that is away from the groove bottom wall of the first groove 403 may be located in the second groove 404, and therefore, the microphone 3 is not higher than the top surface of the housing 4 in the Z direction, so that the microphone 3 does not occupy extra size space in the Z direction, thereby facilitating an overall thinning design of the housing 4.

[0098] For example, in the Z direction, the first channel 402 is offset toward a side of the microphone 3 relative to the first through hole 401.

[0099] In this embodiment, in an extension direction (namely, the X direction) of the first channel 402, wall thicknesses of the housing 4 on two sides of the first channel 402 in the Z direction need to meet a structural strength requirement. Therefore, the first channel 402 is offset toward the side of the microphone 3 relative to the first through hole 401 in the Z direction, which helps maintain consistency of the wall thicknesses of the housing 4 on the two sides of the first channel 402 in the Z direction, and facilitates a reduction design of an overall thickness that is of the housing 4 and that exists after the microphone 3 is installed.

[0100] For example, if the first channel 402 is not offset relative to the first through hole 401, or the first channel 402 is offset toward a side away from the microphone 3 relative to the first through hole 401, the microphone 3 is offset in the Z direction relative to the first channel 402, which may also mean that the microphone 3 is designed to be raised relative to the first channel 402.

[0101] In this case, to ensure structural strength of the housing 4 at the first channel 402, in a case, the thickness of the housing 4 at the first channel 402 is set to exactly meet the structural strength requirement, and in this case, the microphone 3 is higher than a top surface of a region that is of the housing 4 and in which the first channel 402 is disposed, so that a part of the microphone 3 is higher than the second groove 404. Consequently, the overall thickness that is of the housing 4 and that exists after the microphone 3 is installed is excessively large, and it is difficult for the electronic device 100 to implement a thinning design.

[0102] In another case, a wall thickness of the housing 4 on a side that is of the first channel 402 and that is close to the microphone 3 is set, so that the microphone 3 can be fully accommodated in the second groove 404. Consequently, an overall wall thickness of the housing 4 at a location at which the first channel 402 is disposed is excessively large, and it is also difficult for the electronic device 100 to implement a thinning design.

[0103] Therefore, in the Z direction, the first channel 402 is offset toward the side of the microphone 3 relative to the first through hole 401, to properly design the thickness of the region that is of the housing 4 and in which the first channel 402 is disposed and the thickness of a region that is of the housing 4 and in which the microphone 3 is installed, so that an overall thickness of the housing 4 at the microphone 3 after the microphone 3 is disposed on the housing 4 is not greater than the thickness of the location at which the first channel 402 is disposed on the housing 4. In addition, the location at which the first channel 402 is disposed on the housing 4 can be designed based on the thickness of strength of a neighboring structure, so that a reduction design of an overall thickness of the housing 4 is implemented, and the overall thickness is not increased after the microphone 3 is disposed on the housing 4, thereby facilitating an overall thinning design of the electronic device 100.

[0104] Continuing to refer to FIG. 4B, FIG. 6A, and FIG. 6B, in some embodiments, the first through hole 401 may include a first part 401a and a second part 401b that are connected to each other. One end of the second part of the first channel 402 communicates with the first channel 402, and the other end of the second part 401b of the first through hole 401 communicates with the first part 401a of the first through hole 401. The first part 401a of the first through hole 401 may penetrate the groove bottom wall of the first groove 403 and the groove bottom wall of the second groove 404. The second part 401b of the first through hole 401 may penetrate the groove bottom wall of the first groove 403, a sidewall that is of the second groove 404 and that is close to the first channel 402 is a connection wall 405, and the connection wall 405 may block a part of an end that is of the second part 401b of the first through hole 401 and that is away from the first groove 403.

[0105] In this embodiment, because the first channel 402 is offset toward the side of the microphone 3 relative to the first through hole 401 in the Z direction, a bending connection structure exists at a joint between the first channel 402 and the first through hole 401. The sidewall that is of the second groove 404 and that is close to the first channel 402 blocks a part of the end that is of the second part 401b of the first through hole 401 and that is away from the first groove 403, so that the connection wall 405 can be used as a sidewall of the bending connection structure, and therefore, the second part 401b of the first through hole 401 can be connected to the first channel 402.

[0106] It should be noted that in the embodiments in FIG. 6A and FIG. 6B, a dashed line at the first through hole 401 represents a boundary between the first part 401a and the second part of the first through hole 401. It may be understood that in the embodiments in FIG. 6A and FIG. 6B, the boundary between the first part 401a and the second part of the first through hole 401 is merely an example. In some other embodiments, the boundary between the first part 401a and the second part of the first through hole 401 may be located at another location.

[0107] For example, the connection wall 405 may include a first part 405a, a second part 405b, and a third part 405c, and the first part 405a, the second part 405b, and the third part 405c of the connection wall 405 may be sequentially connected in the Y direction. The second part 405b of the connection wall 405 may correspondingly block a part of the end that is of the second part 401b of the first through hole 401 and that is away from the first groove 403, and the second part 405b of the connection wall 405 may protrude from the first part 405a and the third part 405c of the connection wall 405 in the Z direction.

[0108] In this embodiment, a material reduction design may be performed on regions of the second groove 404 that are close to the first part 405a and the third part 405c of the connection arm, so that the second part 405b of the connection wall 405 protrudes from the first part 405a and the third part 405c of the connection wall 405 in the Z direction, which facilitates a weight reduction design of the housing 4, thereby facilitating a lightweight design of the housing 4 and reducing material costs.

[0109] The second groove 404 may have a first surface 4051, and the first surface 4051 is located in the second groove 404 and is disposed close to the first channel 402. An included angle (referring to α in FIG. 6B) between the first surface 4051 and the groove bottom wall of the second groove 404 may range from 0° to 90°. For example, the value of a may be but is not limited to 1°, 5°, 30°, 60°, 70°, 80°, 90°, or the like.

[0110] The first surface 4051 may be located in the second part 405b of the connection wall 405, and the included angle between the first surface 4051 and the groove bottom wall of the second groove 404 is not 90°, so that the first surface 4051 can be tilted toward the first channel 402 relative to the bottom wall of the second groove 404, which facilitates a material reduction design of the housing 4 near the first surface 4051, thereby facilitating a lightweight design of the housing 4 and reducing material costs.

[0111] The housing 4 may further include an adhesive stopper 406. The adhesive stopper 406 may protrude from the first surface 4051, the adhesive stopper 406 may extend in the Y direction, and the size of the adhesive stopper 406 is greater than the size of the first through hole 401 in the Y direction.

[0112] For example, the housing 4 may further have a third groove 407, the third groove 407 may be recessed in the groove bottom wall of the second groove 404, and the third groove 407 may be disposed around the first part 401a of the first through hole 401.

[0113] The housing 4 may further have a fourth groove 408, the fourth groove 408 may be recessed in a groove bottom wall of the third groove 407, and the fourth groove 408 may be disposed around the first part 401a of the first through hole 401.

[0114] The width (referring to W1 in FIG. 6A) of the fourth groove 408 may be greater than 0.6 mm. For example, the value of W1 may be but is not limited to 0.62 mm, 0.66 mm, 0.7 mm, 0.74 mm, or another value greater than 0.6 mm. It should be noted that the width of the fourth groove 408 is a minimum spacing between an inner sidewall close to the first through hole 401 and an inner sidewall away from the first through hole 401 at each location of the fourth groove 408.

[0115] The depth (referring to H1 in FIG. 6A) of the fourth groove 408 may be greater than 0.1 mm. For example, the value of H1 may be but is not limited to 0.12 mm, 0.16 mm, 0.2 mm, 0.24 mm, or another value greater than 0.1 mm. It should be noted that the depth of the fourth groove 408 is a spacing between a groove bottom wall of the fourth groove 408 and the groove bottom wall of the third groove 407.

[0116] The housing 4 may further have an adhesive storage groove 409, the adhesive storage groove 409 may be recessed in the groove bottom wall of the second groove 404, and communicates with the third groove 407 and the fourth groove 408, the adhesive storage groove 409 may be located at two ends of the third groove 407, and parts of the first surface 4051 that are located on two sides of the adhesive stopper 406 may extend into the adhesive storage groove 409.

[0117] It should be noted that in the embodiments in FIG. 6A and FIG. 6B, the third groove 407, the fourth groove 408, and the adhesive storage groove 409 are delineated by using dashed lines. It may be understood that delineation of the third groove 407, the fourth groove 408, and the adhesive storage groove 409 in the embodiments in FIG. 6A and FIG. 6B is merely an example. In some other embodiments, the third groove 407, the fourth groove 408, and the adhesive storage groove 409 may alternatively be delineated in another manner.

[0118] It should be noted that in some other embodiments, the third groove 407 may not be disposed on the housing 4, and the fourth groove 408 is directly disposed on the groove bottom wall of the second groove 404.

[0119] Referring to FIG. 6A and FIG. 6C, FIG. 6C is a diagram of a structure of the housing 4 shown in FIG. 6A from another perspective. It should be noted that FIG. 6C is a schematic bottom view of the housing 4 shown in FIG. 6A.

[0120] In some embodiments, the housing 4 may further have a fifth groove 410, the fifth groove 410 may be recessed in a groove bottom wall of the first groove 403, and the fifth groove 410 may be disposed around the first through hole 401.

[0121] The width (referring to W2 in FIG. 6C) of the fifth groove 410 may be greater than 0.6 mm. For example, the value of W2 may be but is not limited to 0.62 mm, 0.66 mm, 0.7 mm, 0.74 mm, or another value greater than 0.6 mm. It should be noted that the width of the fifth groove 410 is a minimum spacing between an inner sidewall close to the first through hole 401 and an inner sidewall away from the first through hole 401 at each location of the fifth groove 410.

[0122] The depth of the fifth groove 410 may be greater than 0.1 mm (referring to H2 in FIG. 6C). For example, the value of H2 may be but is not limited to 0.12 mm, 0.16 mm, 0.2 mm, 0.24 mm, or another value greater than 0.1 mm. It should be noted that the depth of the fifth groove 410 is a spacing between a groove bottom wall of the fifth groove 410 and the groove bottom wall of the first groove 403.

[0123] Referring to FIG. 4B, FIG. 6A, and FIG. 6D, FIG. 6D is a diagram of a structure of the housing 4 shown in FIG. 6A from still another perspective. It should be noted that FIG. 6D is a schematic left view of the housing 4 shown in FIG. 6A.

[0124] In some embodiments, the housing 4 may further have a first end surface 411, and the first end surface 411 faces away from the microphone 3. The first channel 402 is exposed from the first end surface 411, and an opening that is of the first channel 402 and that is located on the first end surface 411 is located at the center of the first end surface 411 in the Z direction.

[0125] In this embodiment, the opening that is of the first channel 402 and that is located on the first end surface 411 is located at the center of the first end surface 411 in the Z direction, so that an improvement to appearance aesthetics of the housing 4 is facilitated, thereby improving appearance aesthetics of the electronic device 100. In addition, this facilitates centering of the first channel 402 in the housing 4 in the Z direction, so that thickness sizes of the housing 4 on the two sides of the first channel 402 in the Z direction are the same, and the housing 4 is set, based on a strength requirement, to have the same thickness size on the two sides of the first channel 402, thereby facilitating a slim and lightweight design of the housing 4.

[0126] Referring to FIG. 6A, FIG. 7A, and FIG. 7B, FIG. 7A is a diagram of a structure in which the first bonding member 7 is disposed on the housing 4 shown in FIG. 6A in some embodiments, and FIG. 7B is a diagram of a structure in which the second enclosing member 6 is installed on the housing 4 shown in FIG. 7A in some embodiments.

[0127] In some embodiments, the first bonding member 7 bonds the housing 4 to the second enclosing member 6.

[0128] In this embodiment, the first bonding member 7 is disposed, so that the second enclosing member 6 can be stably fastened to the housing 4, to block a side that is of the first through hole 401 and that is close to the second groove 404, thereby improving sealing performance between the second enclosing member 6 and the housing 4.

[0129] For example, the first bonding member 7 may be filled in the fourth groove 408.

[0130] In this embodiment, the fourth groove 408 is disposed to improve arrangement stability of the first bonding member 7, so that stability of bonding the housing 4 to the second enclosing member 6 by the first bonding member 7 is improved, thereby improving sealing performance between the second enclosing member 6 and the housing 4.

[0131] In this embodiment, because the width of the fourth groove 408 may be greater than 0.6 mm, and the depth of the fourth groove 408 may be greater than 0.1 mm, the fourth groove 408 can accommodate the first bonding member 7 with a sufficient amount, so that an improvement to strength of bonding the housing 4 to the second enclosing member 6 by the first bonding member 7 can be facilitated, thereby improving bonding stability.

[0132] The thickness of the first bonding member 7 may be greater than 0.1 mm, so that the first bonding member 7 can have a sufficient amount, and the first bonding member 7 has sufficient strength, thereby facilitating an improvement to stability of bonding the housing 4 to the second enclosing member 6 by the first bonding member 7.

[0133] The first bonding member 7 may be a pressure-sensitive adhesive or a foam adhesive, may be formed through curing after adhesive dispensing, or the like. The pressure-sensitive adhesive and the foam need to be activated to ensure stability of bonding the housing 4 to the second enclosing member 6.

[0134] Referring to FIG. 6A, FIG. 7C, and FIG. 7D, FIG. 7C is a diagram of a structure in which the second bonding member 8 is disposed on the housing 4 shown in FIG. 7B in some embodiments, and FIG. 7D is a diagram of a structure in which no second enclosing member 6 is installed on the housing 4 shown in FIG. 7C.

[0135] In some embodiments, the second enclosing member 6 may include a first part 6a and a second part 6b that are connected to each other. The first part 6a of the second enclosing member 6 is bonded to the first bonding member 7. The second part 6b of the second enclosing member 6 is disposed in correspondence with the first surface 4051.

[0136] In this embodiment, the second enclosing member 6 is designed as two parts, the first part 6a of the second enclosing member 6 is disposed in correspondence with the first bonding member 7, and the second part 6b of the second enclosing member 6 is disposed in correspondence with the first surface 4051, so that the second enclosing member 6 can implement a profiled design on a partial structure of the housing 4, thereby improving a close-fitting effect between the housing 4 and the second enclosing member 6.

[0137] Specifically, the first bonding member 7 is disposed in the fourth groove 408. Because the third groove 407 is disposed on the groove bottom wall of the second groove 404, and the fourth groove 408 is disposed on the groove bottom wall of the third groove 407, a top surface of the first bonding member 7 may be disposed parallel to the groove bottom wall of the second groove 404, so that an included angle between the top surface of the first bonding member 7 and the first surface 4051 is consistent with the included angle between the groove bottom wall of the second groove 404 and the first surface 4051, that is, an angle α shown in FIG. 6B. Correspondingly, the same α angle is set between the first part 6a and the second part of the second enclosing member 6, so that the second enclosing member 6 can better closely fit the housing 4, thereby improving a bonding effect between the second enclosing member 6 and the housing 4.

[0138] For example, the third groove 407 may accommodate the first part 6a of the second enclosing member 6.

[0139] In this embodiment, the third groove 407 accommodates the first part 6a of the second enclosing member 6, so that limiting installation for the first part 6a of the second enclosing member 6 is provided by using the sidewall of the third groove 407, thereby improving convenience and stability of installing the second enclosing member 6.

[0140] For example, the electronic device 100 may further include the second bonding member 8. The second bonding member 8 may be bonded between the second part 6b of the second enclosing member 6 and the first surface 4051.

[0141] In this embodiment, the second bonding member 8 is disposed to bond the second part 6b of the second enclosing member 6 to the first surface 4051, so that a bonding effect between the second enclosing member 6 and the housing 4 can be further improved, thereby further improving a sealing effect between the second enclosing member 6 and the housing 4.

[0142] The second bonding member 8 may be formed after adhesive dispensing and curing between the second part 6b of the second enclosing member 6 and the first surface 4051.

[0143] In this embodiment, the second bonding member 8 is formed through adhesive dispensing, so that a bonding effect between the second part 6b of the second enclosing member 6 and the first surface 4051 can be improved. Because the second bonding member 8 is in a fluid state before being cured, the second bonding member 8 can flow between the second part 6b of the second enclosing member 6 and the first surface 4051 before being cured, to fully fill in a gap between the second part 6b of the second enclosing member 6 and the first surface 4051. In this way, a structural size tolerance of the second enclosing member 6 and an assembly tolerance that exists after the second enclosing member 6 is bonded to the first bonding member 7 are absorbed, so that a close-fitting effect between the second enclosing member 6 and the housing 4 is improved, thereby improving a sealing effect between the second enclosing member 6 and the housing 4.

[0144] In this embodiment, because the first surface 4051 is provided with the adhesive stopper 406, when the second bonding member 8 flows between the second part 6b of the second enclosing member 6 and the first surface 4051 before being cured, the second bonding member 8 in the fluid state is blocked by the adhesive stopper 406, to prevent the second bonding member 8 in the fluid state from flowing into the first through hole 401, thereby preventing the second bonding member 8 from leaking into the sound transmission channel 1011 and affecting a sound transmission effect of the sound transmission channel 1011. Therefore, after the second bonding member 8 is formed through curing, the second bonding member 8 can be disposed around the adhesive stopper 406.

[0145] In this embodiment, because the adhesive storage groove 409 may be recessed in the groove bottom wall of the second groove 404, and communicates with the third groove 407 and the fourth groove 408, the adhesive storage groove 409 may be located at the two ends of the third groove 407, and the parts of the first surface 4051 that are located on the two sides of the adhesive stopper 406 may extend into the adhesive storage groove 409, so that the second bonding member 8 in the fluid state can flow through a gap between the second part 6b of the second enclosing member 6 and the first surface 4051, bypass the adhesive stopper 406, and flow to the two sides of the adhesive stopper 406 and into the adhesive storage groove 409. In this case, the second enclosing member 6 in the fluid state can flow into the third groove 407 through the adhesive storage groove 409, so that the second bonding member 8 in the fluid state can be in contact with the first bonding member 7, and after the second bonding member 8 is formed through curing, the second bonding member 8 can be connected to the first bonding member 7. This helps dispose a bonding member everywhere between the second enclosing member 6 and the housing 4, to improve a bonding effect between the second enclosing member 6 and the housing 4, so that a sealing effect between the second enclosing member 6 and the housing 4 is improved.

[0146] It should be noted that the second bonding member 8 in the fluid state means that the second bonding member 8 can flow before being cured, and the fluid state may be a liquid state, or may be a solid-liquid mixed state.

[0147] An area of a surface that is of the second part 6b of the second enclosing member 6 and that directly faces the first surface 4051 may be greater than 1 mm 2< , to ensure that the second bonding member 8 with a sufficient amount can be disposed between the second part 6b of the second enclosing member 6 and the first surface 4051, thereby improving a bonding effect between the second enclosing member 6 and the housing 4.

[0148] In some other embodiments, the second bonding member 8 may be a pressure-sensitive adhesive, a foam adhesive, or the like. The second bonding member 8 may be directly disposed between the second part 6b of the second enclosing member 6 and the first surface 4051, to bond the second part 6b of the second enclosing member 6 to the first surface 4051.

[0149] Referring to FIG. 7C and FIG. 8A, FIG. 8A is a diagram of a structure in which the sealing member 9 shown in FIG. 8A is installed on the housing 4 shown in FIG. 7C. It should be noted that FIG. 8A is a schematic top view existing after the sealing member 9 is installed on the structure shown in FIG. 7C.

[0150] In some embodiments, the sealing member 9 may be bonded to the second enclosing member 6, and an orthographic projection of the sealing member 9 on the second enclosing member 6 in the Z direction falls within the second enclosing member 6.

[0151] In this embodiment, the sealing member 9 is set to be smaller than the second enclosing member 6, and the orthographic projection in the Z direction falls within the second enclosing member 6, thereby facilitating installation of the sealing member 9.

[0152] For example, in the Z direction, a distance (referring to L5 in FIG. 8B) between an edge of the orthographic projection of the sealing member 9 on the second enclosing member 6 and an edge of the second enclosing member 6 is less than 0.1 mm. For example, the value of L5 may be but is not limited to 0.09 mm, 0.08 mm, 0.05 mm, or another value less than 0.1 mm. In other words, the first part 6a of the second enclosing member 6 extends outward by more than 0.1 mm compared with each part of the sealing member 9.

[0153] In this embodiment, the second enclosing member 6 is set to extend outward by at least 0.1 mm compared with the sealing member 9, so that a poor sealing effect after the sealing member 9 is offset on the second enclosing member 6 can be prevented.

[0154] A limiting structure 602 may be disposed on a surface that is of the second enclosing member 6 and that faces the sealing member 9, and the sealing member 9 may be installed in the limiting structure 602.

[0155] In this embodiment, by disposing the limiting structure 602, an installation guide can be provided for installing the sealing member 9, to improve installation precision of the sealing member 9, and also, a limiting support can be provided for the sealing member 9 after the sealing member 9 is installed, to prevent deviation, detachment, and the like of the sealing member 9 after the sealing member 9 is installed, thereby improving a sealing installation effect of the sealing member 9.

[0156] It should be noted that the limiting structure 602 may be a structure such as a recess, a notch, a protrusion, or the like disposed on the surface that is of the second enclosing member 6 and that faces the sealing member 9. For example, an engraved line may be obtained through processing in a laser engraving manner on the surface that is of the second enclosing member 6 and that faces the sealing member 9, to form the limiting structure 602. It may be understood that the limiting structure 602 shown in the embodiment in FIG. 8B is merely an example. In some other embodiments, the limiting structure 602 may alternatively be disposed at another location.

[0157] Referring to FIG. 4B, FIG. 8B, and FIG. 9, FIG. 8B is a diagram of a structure of the sealing member 9 in an installation structure of the microphone 3 shown in FIG. 4A in some embodiments, and FIG. 9 is a diagram of a structure in which the circuit board 10 is installed on the housing 4 shown in FIG. 8B in some embodiments.

[0158] In some embodiments, the sealing member 9 may be bonded between the second enclosing member 6 and the circuit board 10, and the microphone 3 may be installed on the circuit board 10. The sealing member 9 may have a second through hole 903, the circuit board 10 may have a third through hole 1001, the third through hole 1001 and the second through hole 903 may communicate with the communication hole 601 in the Z direction, and the microphone 3 covers an end that is of the third through hole 1001 and that is away from the second enclosing member 6.

[0159] In this embodiment, the sealing member 9 is disposed to bond the second enclosing member 6 to the circuit board 10, to seal the circuit board 10 and the second enclosing member 6, so that sealing performance between the communication hole 601, the second through hole 903, and the third through hole 1001 is improved, which facilitates an improvement to a sound transmission effect of the sound transmission channel 1011, thereby improving a use effect of the microphone 3.

[0160] For example, the sealing member 9 may be located in the third groove 407, so that size space occupied by the sealing member 9 in the Z direction can be reduced by using the third groove 407, thereby facilitating slimness and a light weight after the microphone 3 is installed on the housing 4. In addition, a limiting function on the sealing member 9 can be further provided by using an inner sidewall of the third groove 407, which facilitates positioning installation and post-installation stability of the sealing member 9.

[0161] For example, the circuit board 10 may abut against a surface that is of the sealing member 9 and that is away from the second enclosing member 6, and is fixedly connected to the groove bottom wall of the second groove 404. The sealing member 9 is in a compressed state.

[0162] In this embodiment, the circuit board 10 abuts against the sealing member 9, and enables the sealing member 9 to be in the compressed state, so that a gap between the circuit board 10 and the sealing member 9 and a gap between the sealing member 9 and the second enclosing member 6 can be eliminated, and sealing performance between the circuit board 10 and the second enclosing member 6 is further improved, to improve sealing performance between the communication hole 601, the second through hole 903, and the third through hole 1001, which facilitates an improvement to a sound transmission effect of the sound transmission channel 1011, thereby improving a use effect of the microphone 3. In addition, the circuit board 10 is fixedly connected to the groove bottom wall of the second groove 404, so that it is ensured, by using the fixed connection between the groove bottom wall of the second groove 404 and the circuit board 10, that the circuit board 10 fully compresses the sealing member 9, thereby improving sealing performance between the circuit board 10 and the second enclosing member 6.

[0163] It should be noted that the fixed connection between the circuit board 10 and the groove bottom wall of the second groove 404 may be but is not limited to snap-fit fastening, bolt fastening, bonding fastening, or the like.

[0164] The sealing member 9 may include a sealing portion 901 and a bonding portion 902 that are stacked in a direction parallel to the Z direction, and the bonding portion 902 may be bonded between the second enclosing member 6 and the sealing portion 901. A side that is of the sealing portion 901 and that is away from the second enclosing member 6 abuts against the circuit board 10, and the sealing portion 901 may be in a compressed state.

[0165] In this embodiment, the second enclosing member 6 may be bonded by using the bonding portion 902, and compression may be implemented by using the sealing portion 901, to improve sealing performance between the circuit board 10 and the second enclosing member 6.

[0166] A compression amount of the sealing portion 901 may range from 50% to 70%, so that the circuit board 10 can be in full contact with the sealing portion 901, thereby improving sealing performance between the circuit board 10 and the second enclosing member 6. For example, the compression amount of the sealing portion 901 may be but is not limited to 50%, 55%, 60%, 65%, 70%, or another value between 50% and 70%.

[0167] It should be noted that the compression amount of the sealing portion 901 is a reduced percentage of the size of the sealing portion 901 in the Z direction after the circuit board 10 is installed, compared with the size of the sealing portion 901 in the Z direction when the sealing portion 901 is not subject to an external force.

[0168] The bonding portion 902 may include a first bonding layer 9021, a waterproof layer 9022, and a second bonding layer 9023 that are sequentially stacked. The first bonding layer 9021 is bonded to the second enclosing member 6, and the second bonding layer 9023 is bonded to the sealing portion 901.

[0169] In this embodiment, the waterproof layer 9022 is disposed in the bonding portion 902, so that the sealing member 9 can further resist water droplets and water vapor, and can prevent an external water flow or external water vapor from intruding into the sound transmission channel 1011, so that the microphone 3 can be protected, and a sound transmission effect of the sound transmission channel 1011 can be prevented from being affected by intrusion of the water droplets or the water vapor, thereby improving a use effect of the microphone 3.

[0170] The thickness of the first bonding layer 9021 is greater than the thickness of the second bonding layer 9023.

[0171] In this embodiment, because the second enclosing member 6 may be a rigid member, and the sealing portion 901 may be a flexible member, the thickness of the first bonding layer 9021 is set to be greater than the thickness of the second bonding layer 9023, so that a bonding requirement of the second enclosing member 6 being greater than a bonding requirement of the sealing portion 901 can be met. In this way, the second enclosing member 6 and the sealing portion 901 can be effectively bonded, and an adhesive thickness can be reduced to avoid a thickness increase caused by disposing an extra adhesive layer.

[0172] For example, thicknesses of all layers of structures in the sealing member 9 may be the first bonding layer 9021 of a thickness 0.1 mm + the waterproof layer 9022 of a thickness 0.01 mm + the second bonding layer 9023 of a thickness 0.05 mm + the sealing portion 901 of a thickness 0.15 mm. The first bonding layer 9021 and the second bonding layer 9023 each may be a pressure-sensitive adhesive, an adhesive tape, a foam adhesive, or the like. The waterproof layer 9022 may be a waterproof film. The sealing portion 901 may be a foam, silicone rubber, rubber, or the like.

[0173] It should be noted that the thicknesses of all the layers of structures in the sealing member 9 are merely examples for description. It may be understood that the thicknesses of all the layers of structures in the sealing member 9 may alternatively be other values. For example, the first bonding layer 9021 may be 0.15 mm thick, the waterproof layer 9022 may be 0.02 mm thick, the second bonding layer 9023 may be 0.12 mm thick, and the sealing portion 901 may be 0.2 mm thick. The thicknesses of all the layers of structures in the sealing member 9 are not listed herein.

[0174] Referring to FIG. 6C, FIG. 10A, and FIG. 10B, FIG. 10A is a diagram of a structure in which the third bonding member 11 is installed on the housing 4 shown in FIG. 6C in some embodiments, and FIG. 10B is a diagram of a structure in which the first enclosing member 5 is installed on the housing 4 shown in FIG. 10A in some embodiments.

[0175] In some embodiments, the third bonding member 11 may be located in the fifth groove 410, and the third bonding member 11 bonds the housing 4 to the first enclosing member 5.

[0176] In this embodiment, the fifth groove 410 is disposed to improve arrangement stability of the third bonding member 11, so that stability of bonding the housing 4 to the first enclosing member 5 by the third bonding member 11 is improved, thereby improving sealing performance between the first enclosing member 5 and the housing 4.

[0177] In this embodiment, because the width of the fifth groove 410 may be greater than 0.6 mm, and the depth of the fifth groove 410 may be greater than 0.1 mm, the fifth groove 410 can accommodate the third bonding member 11 with a sufficient amount, so that an improvement to strength of bonding the housing 4 to the first enclosing member 5 by the third bonding member 11 can be facilitated, thereby improving bonding stability.

[0178] For example, the thickness of the third bonding member 11 may be greater than 0.1 mm, so that the third bonding member 11 can have a sufficient amount, and the third bonding member 11 has sufficient strength, thereby facilitating an improvement to stability of bonding the housing 4 to the first enclosing member 5 by the third bonding member 11.

[0179] The third bonding member 11 may be a pressure-sensitive adhesive or a foam adhesive, may be formed through curing after adhesive dispensing, or the like. The pressure-sensitive adhesive and the foam need to be activated to ensure stability of bonding the housing 4 to the first enclosing member 5.

[0180] For example, the groove depth of the fifth groove 410 may be greater than the thickness of the third bonding member 11, and the first enclosing member 5 may be accommodated in the fifth groove 410.

[0181] In this embodiment, the groove depth of the fifth groove 410 is set to be greater than the thickness of the third bonding member 11, so that the first enclosing member 5 can be at least partially accommodated in the fifth groove 410. An inner sidewall of the fifth groove 410 may be used for positioning during installation of the first enclosing member 5, and may also be used for limiting the first enclosing member 5 after the first enclosing member 5 is installed, to improve installation stability of the first enclosing member 5.

[0182] The housing 4 may further have a sixth groove 412, the sixth groove 412 may be disposed at a groove bottom of the first groove 403, and the sixth groove 412 may be disposed around the fifth groove 410.

[0183] In this embodiment, because the groove depth of the fifth groove 410 is set to be greater than the thickness of the third bonding member 11, in other words, there is a sufficient thickness at a location that is of the housing 4 and at which the fifth groove 410 is disposed, a thinning design can be performed on a periphery of the fifth groove 410 by disposing the sixth groove 412, which facilitates an overall thinning design of the housing 4.

[0184] Referring to FIG. 4B and FIG. 11, FIG. 11 is a diagram of a structure of an installation structure of the microphone 3 shown in FIG. 4B from another perspective. It should be noted that FIG. 11 is a schematic front view of a sectional view of an installation structure of the microphone 3 shown in FIG. 4B.

[0185] In some embodiments, the thickness of the second enclosing member 6 may be greater than the thickness of the first enclosing member 5.

[0186] In this embodiment, because the second enclosing member 6 needs to bear the sealing member 9, the circuit board 10, and the microphone 3, and the first enclosing member 5 does not need to bear another component, the second enclosing member 6 has a higher strength requirement. Therefore, the thickness of the second enclosing member 6 is set to be greater than the thickness of the first enclosing member 5, which helps ensure support strength of the second enclosing member 6, helps implement a thinning design at the first enclosing member 5, and helps reduce an overall thickness that is of the housing 4 and that exists after the microphone 3 is installed.

[0187] For example, the thickness of the first enclosing member 5 ranges from 0 mm to 0.3 mm. For example, the thickness of the first enclosing member 5 may be 0.05 mm, 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, or another value between 0 mm and 0.3 mm.

[0188] A material of the first enclosing member 5 may be metal, polyethylene terephthalate (polyethylene glycol terephthalate, PET), or the like.

[0189] For example, the thickness of the second enclosing member 6 ranges from 0 mm to 0.3 mm. For example, the thickness of the first enclosing member 5 may be 0.05 mm, 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, or another value between 0 mm and 0.3 mm.

[0190] A material of the second enclosing member 6 may be metal, PET, or the like.

[0191] In some embodiments, a volume of the first channel 402 may be greater than a volume of the second channel 1012.

[0192] In this embodiment, the volume of the first channel 402 is set to be greater than the volume of the second channel 1012, so that a resonance frequency of the microphone 3 can be increased, thereby improving a use effect of the microphone 3.

[0193] For example, an inner diameter (referring to D1 in FIG. 11) of the first channel 402 may be greater than or equal to 0.8 mm, which facilitates an improvement to the resonance frequency of the microphone 3. For example, the inner diameter of the first channel 402 may be but is not limited to 0.8 mm, 0.9 mm, 1 mm, or another value greater than 0.8 mm.

[0194] For example, the size (referring to H3 in FIG. 11) of the second channel 1012 in the Z direction may be less than the size (referring to W3 in FIG. 11) of the second channel 1012 in the X direction, which helps reduce the size at the microphone 3 in the Z direction after the microphone 3 is installed on the housing 4, thereby facilitating a slim and lightweight design of an overall structure.

[0195] The size of the second channel 1012 in the Z direction may be greater than 0.6 mm, and the size of the second channel 1012 in the X direction may be greater than 1 mm, so that the second channel 1012 is short in size and has a large inner diameter, and therefore, the resonance frequency of the microphone 3 is increased, thereby improving a use effect of the microphone 3. For example, the size of the second channel 1012 in the Z direction may be 0.61 mm, 0.62 mm, 0.63 mm, 0.64 mm, 0.65 mm, or another value greater than 0.6 mm. The size of the second channel 1012 in the X direction may be 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm, 1.5 mm, or another value greater than 1 mm.

[0196] It should be noted that the size of the second channel 1012 in the Z direction is a spacing between the top surface of the first enclosing member 5 and the bottom surface of the second enclosing member 6, and the size of the second channel 1012 in the X direction is an inner diameter of the first through hole 401.

[0197] Referring to FIG. 12, FIG. 12 is a diagram of an assembly procedure of an installation structure of the microphone 3 shown in FIG. 4A in some embodiments.

[0198] In some embodiments, the assembly procedure of the installation structure of the microphone 3 may include steps S10, S20, S30, and S40, where a sequence of the steps S10, S20, and S30 is not limited.

[0199] S10. Install the first enclosing member 5 on the housing 4.

[0200] Specifically, step S10 may include S11, S12, and S13. Refer to FIG. 6C, FIG. 10A, and FIG. 10B.

[0201] S11. Dispose the third bonding member 11 in the fifth groove 410. Refer to FIG. 6C and FIG. 10A.

[0202] S12. Install the first enclosing member 5 to closely fit the third bonding member 11. Refer to FIG. 10A and FIG. 10B.

[0203] S13. Bond the first enclosing member 5 to the third bonding member 11.

[0204] The third bonding member 11 may be a pressure-sensitive adhesive or a foam adhesive, or may be formed through an adhesive dispensing process.

[0205] In some examples, the third bonding member 11 may be a pressure-sensitive adhesive or a foam adhesive. In step S11, the pressure-sensitive adhesive or the foam adhesive closely fits the groove bottom wall of the fifth groove 410. In step S13, the third bonding member 11 needs to be press-fitted, to ensure that the pressure-sensitive adhesive or the foam adhesive is activated, and poor air leakage is prevented.

[0206] In some other examples, the third bonding member 11 may be formed through an adhesive dispensing process. In step S11, an adhesive in a fluid state is disposed in the fifth groove 410 through the adhesive dispensing process. In step S13, the adhesive in the fluid state is cured, so that the first enclosing member 5 is bonded to the third bonding member 11.

[0207] S20. Install the second enclosing member 6 on the housing 4.

[0208] Specifically, step S20 may include S21, S22, S23, S24, and S25. Refer to FIG. 6A, FIG. 7A to FIG. 7C, and FIG. 8A.

[0209] S21. Dispose the first bonding member 7 in the fourth groove 408. Refer to FIG. 6A and FIG. 7A.

[0210] S22. Install the second enclosing member 6, so that the first part 6a of the second enclosing member 6 closely fits the first bonding member 7. Refer to FIG. 7A and FIG. 7B.

[0211] S23. Bond the first part 6a of the second enclosing member 6 to the first bonding member 7.

[0212] S24. Dispense an adhesive between the second part 6b of the second enclosing member 6 and the first surface 4051, and cure the adhesive to form the second bonding member 8. Refer to FIG. 7B to FIG. 7D.

[0213] S25. Install the sealing member 9 on the second enclosing member 6. Refer to FIG. 7C and FIG. 8A.

[0214] The first bonding member 7 may be a pressure-sensitive adhesive or a foam adhesive, or may be formed through the adhesive dispensing process.

[0215] In some examples, the first bonding member 7 may be a pressure-sensitive adhesive or a foam adhesive. In step S21, the pressure-sensitive adhesive or the foam adhesive closely fits the groove bottom wall of the fourth groove 408. In step S23, the first bonding member 7 needs to be press-fitted, to ensure that the pressure-sensitive adhesive or the foam adhesive is activated, and poor air leakage is prevented.

[0216] In some other examples, the first bonding member 7 may be formed through the adhesive dispensing process. In step S21, an adhesive in a fluid state is disposed in the fourth groove 408 through the adhesive dispensing process. In step S23, the adhesive in the fluid state is cured, so that the first part 6a of the second enclosing member 6 is bonded to the first bonding member 7.

[0217] In step S24, the second bonding member 8 is formed through adhesive dispensing, so that a bonding effect between the second part 6b of the second enclosing member 6 and the first surface 4051 can be improved. Because the second bonding member 8 is in the fluid state before being cured, the second bonding member 8 can flow between the second part 6b of the second enclosing member 6 and the first surface 4051 before being cured, to fully fill in a gap between the second part 6b of the second enclosing member 6 and the first surface 4051. In this way, a structural size tolerance of the second enclosing member 6 and an assembly tolerance that exists after the second enclosing member 6 is bonded to the first bonding member 7 are absorbed, so that a close-fitting effect between the second enclosing member 6 and the housing 4 is improved, thereby improving a sealing effect between the second enclosing member 6 and the housing 4.

[0218] S30. Install the microphone 3 on the circuit board 10.

[0219] The microphone 3 may be installed on the circuit board 10 through welding.

[0220] S40. Install the circuit board 10 on the housing 4 to seal the sound transmission channel 1011. Refer to FIG. 8B, FIG. 4A, and FIG. 4B.

[0221] The circuit board 10 abuts against the sealing member 9, and enables the sealing member 9 to be in the compressed state, so that a gap between the circuit board 10 and the sealing member 9 and a gap between the sealing member 9 and the second enclosing member 6 can be eliminated, and sealing performance between the circuit board 10 and the second enclosing member 6 is further improved, to improve sealing performance between the communication hole 601, the second through hole 903, and the third through hole 1001, which facilitates an improvement to a sound transmission effect of the sound transmission channel 1011, thereby improving a use effect of the microphone 3. In addition, the circuit board 10 is fixedly connected to the groove bottom wall of the second groove 404, so that it is ensured, by using the fixed connection between the groove bottom wall of the second groove 404 and the circuit board 10, that the circuit board 10 fully compresses the sealing member 9, thereby improving sealing performance between the circuit board 10 and the second enclosing member 6.

[0222] It should be noted that embodiments in this application and features in embodiments may be combined with each other without a conflict, and any combination of features in different embodiments also falls within the protection scope of this application. In other words, the foregoing described plurality of embodiments may be further combined in any manner based on an actual requirement.

[0223] It should be noted that all the foregoing accompanying drawings are example illustrations of this application, and do not represent an actual size of a product. In addition, a size proportional relationship between components in the accompanying drawings is not intended to limit an actual product in this application.

[0224] The foregoing descriptions are merely some embodiments and implementations of this application, but are not intended to limit the protection scope of this application. Any variation or replacement readily figured out by a person skilled in the art within the technical scope disclosed in this application shall fall within the protection scope of this application. Therefore, the protection scope of this application shall be subject to the protection scope of the claims.

Examples

Embodiment Construction

[0056]The following describes embodiments of this application with reference to the accompanying drawings in embodiments of this application.

[0057]In the descriptions of embodiments of this application, it should be noted that terms "installation" and "connection" should be understood in a broad sense unless otherwise specified and limited. For example, "connection" may be a detachable connection, a non-detachable connection, a direct connection, or an indirect connection through an intermediate medium. "A plurality of' means at least two.

[0058]Orientation terms mentioned in embodiments of this application, for example, "upper", "lower", "inner", "outer", "top", "bottom", and "side" are merely directions based on the accompanying drawings. Therefore, the orientation terms are used to better and more clearly describe and understand embodiments of this application, instead of indicating or implying that a specified apparatus or element should have a specific orientation, and be constr...

[0001] This application claims priority to Chinese Patent Application No. 202421075878.7, filed with the China National Intellectual Property Administration on May 16, 2024 and entitled "ELECTRONIC DEVICE", which is incorporated herein by reference in its entirety.TECHNICAL FIELD

[0002] This application relates to the field of audio technologies, and in particular, to an electronic device.BACKGROUND

[0003] In an electronic device with an audio design, a microphone is usually installed in a middle frame of the electronic device, and a sound transmission channel is disposed in the middle frame for communication between the microphone and the outside. Because the microphone needs to be installed in the middle frame, and the sound transmission channel connected to the microphone is designed, the thickness of the middle frame is relatively large, making it difficult to implement a slim and lightweight design.SUMMARY

[0004] This application provides an electronic device. The electronic device includes a microphone, a first enclosing member, a housing, and a second enclosing member. The housing is designed, so that a sound transmission channel of the microphone can be enclosed by the first enclosing member, the housing, and the second enclosing member, to implement a slim and lightweight design at a location at which the microphone is installed on the housing, thereby facilitating a slim and lightweight design of the entire electronic device.

[0005] This application provides an electronic device. The electronic device includes a housing, having a first through hole and a first channel, where the first through hole penetrates the housing in a first direction, the first channel extends in a second direction, the second direction intersects with the first direction, one end of the first channel is exposed from the housing, and the other end of the first channel communicates with the first through hole; a first enclosing member, fastened on one side of the housing and covering an opening on one side of the first through hole; a second enclosing member, fastened on the other side of the housing and covering an opening on the other side of the first through hole, where the second enclosing member is provided with a communication hole; and a microphone, where the microphone is fastened on a side that is of the second enclosing member and that faces away from the first through hole, and the microphone communicates with the first through hole through the communication hole.

[0006] In this application, a sound transmission channel is enclosed by the housing, the first enclosing member, and the second enclosing member, so that the microphone can pick up a sound by using the sound transmission channel. The first through hole penetrating the housing in a Z direction is disposed, and two sides of the first through hole are blocked by using the first enclosing member and the second enclosing member, to form the second channel (namely, a part of the sound transmission channel) through enclosure. The communication hole is provided on the second enclosing member, and the communication hole, the second channel, and the first channel sequentially communicate with each other to form the sound transmission channel. Therefore, the sound transmission channel is not integrally formed by the housing, but is formed through enclosure of a top surface of the first enclosing structural member, a bottom surface of the second enclosing structural member, and the housing. Because the first enclosing member and the second enclosing member are not a part of the housing, and are not limited by strength of the housing, arrangement of the sound transmission channel is decoupled from a minimum thickness required by the strength of the housing, so that the thickness of the housing is not limited by the sound transmission channel. Therefore, the thickness of the housing can be reduced. In other words, a middle frame can implement a thinning design, which facilitates a slim and lightweight design of the electronic device.

[0007] In some possible implementations, the housing has a first groove and a second groove that are disposed opposite to each other in the first direction, and the first through hole penetrates a groove bottom wall of the first groove and a groove bottom wall of the second groove. The first groove accommodates the first enclosing member, and the second groove accommodates at least a part of the second enclosing member and the microphone.

[0008] In the implementations, the first groove and the second groove are disposed, so that the thickness of the housing in a region in which the first through hole is disposed can be reduced. Because the microphone is installed in correspondence with the first through hole, the housing can implement a thinning design at a location at which the microphone is installed. In addition, the first groove is disposed to accommodate the first enclosing member, and the second groove is disposed to accommodate at least a part of the second enclosing member and the microphone. This helps reduce extra space occupied by the first enclosing member, the second enclosing member, and the microphone in the Z direction, and facilitates an overall thinning design of the housing.

[0009] In some possible implementations, in the first direction, a groove depth of the second groove is greater than a groove depth of the first groove.

[0010] In the implementations, the second groove can have larger accommodating space, so that the second groove can better accommodate the second enclosing member and the microphone, thereby improving space utilization of a groove structure of the housing. To be specific, the first groove with a relatively small groove depth is used to accommodate the first enclosing member, and the second groove with a relatively large groove depth is used to accommodate the second enclosing member and the microphone, thereby improving space utilization of each groove structure of the housing and facilitating an overall thinning design of the housing.

[0011] In some possible implementations, a surface that is of the microphone and that is away from the groove bottom wall of the first groove is located in the second groove.

[0012] In the implementations, in a thickness direction of the electronic device, the microphone is not higher than a top surface of the housing, so that the microphone does not occupy extra size space in the thickness direction of the electronic device, thereby facilitating an overall thinning design of the housing.

[0013] In some possible implementations, in the first direction, the first channel is offset toward a side of the microphone relative to the first through hole.

[0014] In the implementations, in an extension direction (namely, an X direction) of the first channel, wall thicknesses of the housing on two sides of the first channel in the Z direction need to meet a structural strength requirement. Therefore, the first channel is offset toward the side of the microphone relative to the first through hole in the Z direction, which helps maintain consistency of the wall thicknesses of the housing on the two sides of the first channel in the Z direction, and facilitates a reduction design of an overall thickness that is of the housing and that exists after the microphone is installed. For example, if the first channel is not offset relative to the first through hole, or the first channel is offset toward a side away from the microphone relative to the first through hole, the microphone is offset in the Z direction relative to the first channel, which may also mean that the microphone is designed to be raised relative to the first channel. In this case, to ensure structural strength of the housing at the first channel, in a case, the thickness of the housing at the first channel is set to exactly meet the structural strength requirement, and in this case, the microphone is higher than a top surface of a region that is of the housing and in which the first channel is disposed, so that a part of the microphone is higher than the second groove. Consequently, the overall thickness that is of the housing and that exists after the microphone is installed is excessively large, and it is difficult for the electronic device to implement a thinning design. In another case, a wall thickness of the housing on a side that is of the first channel and that is close to the microphone is set, so that the microphone can be fully accommodated in the second groove. Consequently, an overall wall thickness of the housing at a location at which the first channel is disposed is excessively large, and it is also difficult for the electronic device to implement a thinning design. Therefore, in the Z direction, the first channel is offset toward the side of the microphone relative to the first through hole, to properly design the thickness of the region that is of the housing and in which the first channel is disposed and the thickness of a region that is of the housing and in which the microphone is installed, so that the overall thickness of the housing at the microphone after the microphone is disposed on the housing is not greater than the thickness of the location at which the first channel is disposed on the housing. In addition, the location at which the first channel is disposed on the housing can be designed based on the thickness of strength of a neighboring structure, so that a reduction design of an overall thickness of the housing is implemented, and the overall thickness is not increased after the microphone is disposed on the housing, thereby facilitating an overall thinning design of the electronic device.

[0015] In some possible implementations, the first through hole is enclosed by the first enclosing member and the second enclosing member to form a second channel, and a volume of the first channel is greater than a volume of the second channel.

[0016] In the implementations, the volume of the first channel is set to be greater than the volume of the second channel, so that a resonance frequency of the microphone can be increased, thereby improving a use effect of the microphone.

[0017] In some possible implementations, an inner diameter of the first channel is greater than or equal to 0.8 mm.

[0018] In the implementations, an improvement to a resonance frequency of the microphone is facilitated. For example, the inner diameter of the first channel may be but is not limited to 0.8 mm, 0.9 mm, 1 mm, or another value greater than 0.8 mm.

[0019] In some possible implementations, the first through hole is enclosed by the first enclosing member and the second enclosing member to form a second channel, the size of the second channel in the first direction is greater than 0.6 mm, and the size of the second channel in the second direction is greater than 1 mm.

[0020] In the implementations, the second channel is short in size and has a large inner diameter, so that the resonance frequency of the microphone is increased, thereby improving a use effect of the microphone. For example, the size of the second channel in the Z direction may be 0.61 mm, 0.62 mm, 0.63 mm, 0.64 mm, 0.65 mm, or another value greater than 0.6 mm. The size of the second channel in the X direction may be 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm, 1.5 mm, or another value greater than 1 mm.

[0021] In some possible implementations, the first through hole includes a first part and a second part that communicate with each other, one end of the second part of the first through hole communicates with the first channel, and the other end of the second part of the first through hole communicates with the first part of the first through hole. The first part of the first through hole penetrates the groove bottom wall of the first groove and the groove bottom wall of the second groove, the second part of the first through hole penetrates the groove bottom wall of the first groove, and a sidewall that is of the second groove and that is close to the first channel blocks a part of an end that is of the second part of the first through hole and that is away from the first groove.

[0022] In the implementations, because the first channel is offset toward the side of the microphone relative to the first through hole in the thickness direction of the electronic device, a bending connection structure exists at a joint between the first channel and the first through hole. The sidewall that is of the second groove and that is close to the first channel blocks a part of the end that is of the second part of the first through hole and that is away from the first groove, so that a connection wall can be used as a sidewall of the bending connection structure, and therefore, the second part of the first through hole can be connected to the first channel.

[0023] In some possible implementations, the housing further has a fourth groove, the fourth groove is recessed in the groove bottom wall of the second groove, and the fourth groove is disposed around the first part of the first through hole. The electronic device further includes a first bonding member, the first bonding member is filled in the fourth groove, and the first bonding member bonds the housing to the second enclosing member.

[0024] In the implementations, the fourth groove is disposed to improve arrangement stability of the first bonding member, so that stability of bonding the housing to the second enclosing member by the first bonding member is improved, thereby improving sealing performance between the second enclosing member and the housing.

[0025] In some possible implementations, the width of the fourth groove is greater than 0.6 mm, and the depth of the fourth groove is greater than 0.1 mm.

[0026] In the implementations, because the width of the fourth groove may be greater than 0.6 mm, and the depth of the fourth groove may be greater than 0.1 mm, the fourth groove can accommodate the first bonding member with a sufficient amount, so that an improvement to strength of bonding the housing to the second enclosing member by the first bonding member can be facilitated, thereby improving bonding stability.

[0027] In some possible implementations, the second groove has a first surface, the first surface is located in the second groove and is disposed close to the first channel, and an included angle between the first surface and the groove bottom wall of the second groove ranges from 0° to 90°. The second enclosing member includes a first part and a second part that are connected to each other, and the first part of the second enclosing member is bonded to the first bonding member. The electronic device further includes a second bonding member, and the second bonding member is bonded between the second part of the second enclosing member and the first surface.

[0028] In the implementations, a material reduction design may be performed on regions of the second groove that are close to a first part and a third part of the connection arm, so that a second part of the connection wall protrudes from the first part and the third part of the connection wall in the Z direction, which facilitates a weight reduction design of the housing, thereby facilitating a lightweight design of the housing and reducing material costs.

[0029] In some possible implementations, the housing further includes an adhesive stopper, the adhesive stopper protrudes from the first surface, the adhesive stopper extends in a third direction, the size of the adhesive stopper is greater than the size of the first through hole in the third direction, and the third direction is perpendicular to the first direction, and intersects with the second direction. The second bonding member is disposed around the adhesive stopper.

[0030] In the implementations, because the first surface is provided with the adhesive stopper, when the second bonding member flows between the second part of the second enclosing member and the first surface before being cured, the second bonding member in a fluid state is blocked by the adhesive stopper, to prevent the second bonding member in the fluid state from flowing into the first through hole, thereby preventing the second bonding member from leaking into the sound transmission channel and affecting a sound transmission effect of the sound transmission channel. Therefore, after the second bonding member is formed through curing, the second bonding member can be disposed around the adhesive stopper.

[0031] In some possible implementations, the first bonding member is connected to the second bonding member.

[0032] In the implementations, the second bonding member may be connected to the first bonding member, to help dispose a bonding member everywhere between the second enclosing member and the housing, so that a bonding effect between the second enclosing member and the housing is improved, thereby improving a sealing effect between the second enclosing member and the housing.

[0033] In some possible implementations, the housing further has a third groove, the third groove is recessed in the groove bottom wall of the second groove, the third groove is disposed around the first part of the first through hole, the fourth groove is recessed in a groove bottom wall of the third groove, and the third groove accommodates the first part of the second enclosing member. The housing further has an adhesive storage groove, the adhesive storage groove is recessed in the groove bottom wall of the second groove, and communicates with the third groove and the fourth groove, the adhesive storage groove is located at two ends of the third groove, and parts of the first surface that are located on two sides of the adhesive stopper extend into the adhesive storage groove.

[0034] In the implementations, because the adhesive storage groove may be recessed in the groove bottom wall of the second groove, and communicates with the third groove and the fourth groove, the adhesive storage groove may be located at the two ends of the third groove, and the parts of the first surface that are located on the two sides of the adhesive stopper may extend into the adhesive storage groove, so that the second bonding member in the fluid state can flow through a gap between the second part of the second enclosing member and the first surface, bypass the adhesive stopper, and flow to the two sides of the adhesive stopper and into the adhesive storage groove. In this case, the second enclosing member in the fluid state can flow into the third groove through the adhesive storage groove, so that the second bonding member in the fluid state can be in contact with the first bonding member, and after the second bonding member is formed through curing, the second bonding member can be connected to the first bonding member. This helps dispose a bonding member everywhere between the second enclosing member and the housing, to improve a bonding effect between the second enclosing member and the housing, so that a sealing effect between the second enclosing member and the housing is improved.

[0035] In some possible implementations, the electronic device further includes a sealing member and a circuit board, the microphone is installed on the circuit board, and the sealing member is bonded between the second enclosing member and the circuit board. The sealing member has a second through hole, the circuit board has a third through hole, the third through hole and the second through hole communicate with the communication hole in the first direction, and the microphone covers an end that is of the third through hole and that is away from the second enclosing member.

[0036] In the implementations, the sealing member is disposed to implement sealing between both the microphone and the circuit board and the second enclosing member, so that sealing performance of the sound transmission channel is improved, and an improvement to a sound pickup effect of the microphone is facilitated.

[0037] In some possible implementations, in the first direction, a spacing between an edge of an orthographic projection of the sealing member on the second enclosing member and an edge of the second enclosing member is less than 0.1 mm.

[0038] In the implementations, the second enclosing member is set to extend outward by at least 0.1 mm compared with the sealing member, so that a poor sealing effect after the sealing member is offset on the second enclosing member can be prevented.

[0039] In some possible implementations, there is a limiting structure on a surface that is of the second enclosing member and that faces the sealing member, and the sealing member is installed in the limiting structure.

[0040] In the implementations, by disposing the limiting structure, an installation guide can be provided for installing the sealing member, to improve installation precision of the sealing member, and also, a limiting support can be provided for the sealing member after the sealing member is installed, to prevent deviation, detachment, and the like of the sealing member after the sealing member is installed, thereby improving a sealing installation effect of the sealing member.

[0041] In some possible implementations, the housing further has the third groove, the third groove is recessed in the groove bottom wall of the second groove, the third groove is disposed around the first part of the first through hole, the fourth groove is recessed in the groove bottom wall of the third groove, and the third groove accommodates a part of the second enclosing member. The sealing member is located in the third groove, the circuit board abuts against a surface that is of the sealing member and that is away from the second enclosing member, and is fixedly connected to the groove bottom wall of the second groove, and the sealing member is in a compressed state.

[0042] In the implementations, the circuit board abuts against the sealing member, and enables the sealing member to be in the compressed state, so that a gap between the circuit board and the sealing member and a gap between the sealing member and the second enclosing member can be eliminated, and sealing performance between the circuit board and the second enclosing member is further improved, to improve sealing performance between the communication hole, the second through hole, and the third through hole, which facilitates an improvement to a sound transmission effect of the sound transmission channel, thereby improving a use effect of the microphone. In addition, the circuit board is fixedly connected to the groove bottom wall of the second groove, so that it is ensured, by using the fixed connection between the groove bottom wall of the second groove and the circuit board, that the circuit board fully compresses the sealing member, thereby improving sealing performance between the circuit board and the second enclosing member.

[0043] In some possible implementations, the sealing member includes a sealing portion and a bonding portion that are stacked in a direction parallel to the first direction, the bonding portion bonds the second enclosing member to the sealing portion, a side that is of the sealing portion and that is away from the second enclosing member abuts against the circuit board, and a compression amount of the sealing portion ranges from 50% to 70%.

[0044] In the implementations, the circuit board can be in full contact with the sealing portion, so that sealing performance between the circuit board and the second enclosing member is improved. For example, the compression amount of the sealing portion may be but is not limited to 50%, 55%, 60%, 65%, 70%, or another value between 50% and 70%.

[0045] In some possible implementations, the housing further has a fifth groove, the fifth groove is recessed in the groove bottom wall of the first groove, and the fifth groove is disposed around the first through hole. The housing further includes a third bonding member, the third bonding member is located in the fifth groove, and the third bonding member bonds the housing to the first enclosing member.

[0046] In the implementations, the fifth groove is disposed to improve arrangement stability of the third bonding member, so that stability of bonding the housing to the first enclosing member by the third bonding member is improved, thereby improving sealing performance between the first enclosing member and the housing.

[0047] In some possible implementations, the width of the fifth groove is greater than 0.6 mm, and the depth of the fifth groove is greater than 0.1 mm.

[0048] In the implementations, because the width of the fifth groove may be greater than 0.6 mm, and the depth of the fifth groove may be greater than 0.1 mm, the fifth groove can accommodate the third bonding member with a sufficient amount, so that an improvement to strength of bonding the housing to the first enclosing member by the third bonding member can be facilitated, thereby improving bonding stability.

[0049] In some possible implementations, the thickness of the second enclosing member is greater than the thickness of the first enclosing member.

[0050] In the implementations, because the second enclosing member needs to bear the sealing member, the circuit board, and the microphone, and the first enclosing member does not need to bear another component, the second enclosing member has a higher strength requirement. Therefore, the thickness of the second enclosing member is set to be greater than the thickness of the first enclosing member, which helps ensure support strength of the second enclosing member, helps implement a thinning design at the first enclosing member, and helps reduce an overall thickness that is of the housing and that exists after the microphone is installed.

[0051] In some possible implementations, the thickness of the first enclosing member ranges from 0 mm to 0.3 mm, which facilitates a thinning design.

[0052] In some possible implementations, the thickness of the second enclosing member ranges from 0 mm to 0.3 mm, which facilitates a thinning design.

[0053] In some possible implementations, the housing further has a first end surface, and the first end surface faces away from the microphone. The first channel is exposed from the first end surface, and an opening that is of the first channel and that is located on the first end surface is located at the center of the first end surface in the first direction.

[0054] In the implementations, the opening that is of the first channel and that is located on the first end surface is located at the center of the first end surface in the Z direction, so that an improvement to appearance aesthetics of the housing is facilitated, thereby improving appearance aesthetics of the electronic device. In addition, this facilitates centering of the first channel in the housing in the Z direction, so that thickness sizes of the housing on the two sides of the first channel in the Z direction are the same, and the housing is set, based on a strength requirement, to have the same thickness size on the two sides of the first channel, thereby facilitating a slim and lightweight design of the housing.BRIEF DESCRIPTION OF DRAWINGS

[0055] FIG. 1A is a diagram of a structure of an electronic device according to an embodiment of this application; FIG. 1B is a schematic exploded view of a partial structure of the electronic device shown in FIG. 1A; FIG. 2 is a diagram of a structure in which a microphone in the electronic device shown in FIG. 1A is installed on a housing in some embodiments; FIG. 3A is a diagram of a structure in which a microphone is installed in a middle frame in the conventional technology; FIG. 3B is a diagram of simulation comparison between microphones in the embodiment shown in FIG. 2 and the conventional technology shown in FIG. 3A at different frequencies; FIG. 4A is a diagram of a three-dimensional structure in which the microphone shown in FIG. 2 is installed on a housing in some embodiments; FIG. 4B is a section diagram of a structure of an installation structure of the microphone shown in FIG. 4A along a line A-A in some embodiments; FIG. 5 is a schematic exploded view of a partial structure of an installation structure of the microphone shown in FIG. 4A; FIG. 6A is a diagram of a structure of a housing shown in FIG. 4B in some embodiments; FIG. 6B is a section diagram of a structure of the housing shown in FIG. 6A along B-B in some embodiments; FIG. 6C is a diagram of a structure of the housing shown in FIG. 6A from another perspective; FIG. 6D is a diagram of a structure of the housing shown in FIG. 6A from still another perspective; FIG. 7A is a diagram of a structure in which a first bonding member is disposed on the housing shown in FIG. 6A in some embodiments; FIG. 7B is a diagram of a structure in which a second enclosing member is installed on the housing shown in FIG. 7A in some embodiments; FIG. 7C is a diagram of a structure in which a second bonding member is disposed on the housing shown in FIG. 7B in some embodiments; FIG. 7D is a diagram of a structure in which no second enclosing member is installed on the housing shown in FIG. 7C; FIG. 8A is a diagram of a structure in which a sealing member shown in FIG. 8A is installed on the housing shown in FIG. 7C; FIG. 8B is a diagram of a structure of a sealing member in an installation structure of the microphone shown in FIG. 4A in some embodiments; FIG. 9 is a diagram of a structure in which a circuit board is installed on a housing shown in FIG. 8B in some embodiments; FIG. 10A is a diagram of a structure in which a third bonding member is installed on the housing shown in FIG. 6C in some embodiments; FIG. 10B is a diagram of a structure in which a first enclosing member is installed on the housing shown in FIG. 10A in some embodiments; FIG. 11 is a diagram of a structure of an installation structure of the microphone shown in FIG. 4B from another perspective; and FIG. 12 is a diagram of an assembly procedure of an installation structure of the microphone shown in FIG. 4A in some embodiments. DESCRIPTION OF EMBODIMENTS

[0056] The following describes embodiments of this application with reference to the accompanying drawings in embodiments of this application.

[0057] In the descriptions of embodiments of this application, it should be noted that terms "installation" and "connection" should be understood in a broad sense unless otherwise specified and limited. For example, "connection" may be a detachable connection, a non-detachable connection, a direct connection, or an indirect connection through an intermediate medium. "A plurality of' means at least two.

[0058] Orientation terms mentioned in embodiments of this application, for example, "upper", "lower", "inner", "outer", "top", "bottom", and "side" are merely directions based on the accompanying drawings. Therefore, the orientation terms are used to better and more clearly describe and understand embodiments of this application, instead of indicating or implying that a specified apparatus or element should have a specific orientation, and be constructed and operated in the specific orientation. Therefore, this cannot be understood as a limitation on embodiments of this application.

[0059] In embodiments of this application, a limitation on a relative location relationship is mentioned, for example, parallel, perpendicular, or aligned. These limitations are all defined based on a current technique level, but are not absolutely strict limitations. A small deviation is allowed, and being nearly parallel, nearly perpendicular, nearly aligned, or the like is allowed. For example, that A is parallel to B means that A is parallel or nearly parallel to B, and an included angle of 0 degrees to 10 degrees between A and B is allowed. For example, that A is perpendicular to B means that A is perpendicular or nearly perpendicular to B, and an included angle of 80 degrees to 100 degrees between A and B is allowed.

[0060] In embodiments of this application, the terms "first", "second", "third", and "fourth" are merely intended for a purpose of description, and shall not be understood as an indication or implication of relative importance or an implicit indication of a quantity of indicated technical features. Therefore, a feature defined by "first", "second", "third", or "fourth" may explicitly or implicitly include one or more such features.

[0061] Referring to FIG. 1A and FIG. 1B, FIG. 1A is a diagram of a structure of an electronic device 100 according to an embodiment of this application, and FIG. 1B is a schematic exploded view of a partial structure of the electronic device 100 shown in FIG. 1A.

[0062] In some embodiments, the electronic device 100 may be a device that has a sound pickup function, for example, a foldable mobile phone, a bar-type mobile phone, a tablet computer, a multimedia player, a headset, a notebook computer, a vehicle-mounted device, a foldable terminal device, a television, or a wearable device. The wearable device may be a smart band, a smart watch, a smart head-mounted display, smart glasses, or the like. An example in which the electronic device 100 in the embodiment shown in FIG. 1 is a bar-type mobile phone is used for description. Certainly, another type of electronic device 100 may also use a similar structure, and details are not described below.

[0063] For example, the electronic device 100 may include an enclosure 1, a display screen 2, and a microphone 3. The enclosure 1 is configured to protect an internal electronic component of the electronic device 100. The enclosure 1 may include a middle frame 101 and a rear cover 102, and the middle frame 101 is connected to the rear cover 102. For example, the display screen 2 may be fastened to the middle frame 101. The display screen 2 and the rear cover 102 are disposed opposite to each other, and the interior of the electronic device 100 may be jointly enclosed by the display screen 2, the middle frame 101, and the rear cover 102. The display screen 2 may be a flexible display screen or a rigid display screen. The display screen 2 may be an organic light-emitting diode (organic light-emitting diode, OLED) display, a mini light-emitting diode (mini organic light-emitting diode) display, a micro light-emitting diode (micro organic light-emitting diode) display, a quantum dot light-emitting diode (quantum dot light-emitting diodes, QLED) display, a liquid crystal display (liquid crystal display, LCD), or the like.

[0064] The middle frame 101 may be provided with a sound transmission channel 1011. There may be one or more sound transmission channels 1011. As shown in FIG. 1, there is one sound transmission channel 1011. In another embodiment, the sound transmission channel 1011 may alternatively be disposed at a joint between the middle frame 101 and the display screen 2, a joint between the middle frame 101 and the rear cover 102, or the like.

[0065] For example, the microphone 3 may be installed in the middle frame 101 and located inside the electronic device 100. FIG. 1A shows the microphone 3 by using a dashed line. The microphone 3 may receive an external sound of the electronic device 100 by using the sound transmission channel 1011. For example, during a voice call, the microphone 3 may receive a voice of a user by using the sound transmission channel 1011.

[0066] In some embodiments, a sound pickup process of the microphone 3 may be as follows: The microphone 3 picks up a sound by using the sound transmission channel 1011, and converts a received sound signal into a current signal. The electronic device 100 converts the current signal into an analog signal, performs analog-to-digital conversion on the analog signal to form a digital signal, and then transcodes the digital signal to form an audio file. The external sound of the electronic device 100 is transferred to the microphone 3 through the sound transmission channel 1011, and drives a diaphragm in the microphone 3 to vibrate, so as to drive an electrified voice coil to vibrate in a magnetic field environment of a magnetic circuit component of the microphone 3, thereby generating the current signal.

[0067] In another embodiment, the electronic device 100 may alternatively include a plurality of microphones 3, and the plurality of microphones 3 may be configured to receive sounds in a plurality of directions, to improve a sound pickup effect.

[0068] It should be noted that FIG. 1A and FIG. 1B merely schematically show some components of the electronic device 100. Actual shapes and actual sizes of these components are not limited by FIG. 1A, FIG. 1B, and the following accompanying drawings. It should be understood that when the electronic device 100 is in another form, the electronic device 100 may not include the display screen 2, or the electronic device 100 may include a plurality of display screens 2.

[0069] The following describes an installation structure of the microphone 3 in the electronic device 100.

[0070] Referring to FIG. 2 and FIG. 3A, FIG. 2 is a diagram of a structure in which the microphone 3 in the electronic device 100 shown in FIG. 1A is installed on a housing 4 in some embodiments, and FIG. 3A is a diagram of a structure in which the microphone 3 is installed in the middle frame 101 in the conventional technology.

[0071] In some embodiments, the electronic device 100 may further include the housing 4, a first enclosing member 5, and a second enclosing member 6. The first enclosing member 5 and the second enclosing member 6 are disposed on two opposite sides of the housing 4, the sound transmission channel 1011 may be enclosed by the housing 4, the first enclosing member 5, and the second enclosing member 6, and the microphone 3 may be disposed in correspondence with the sound transmission channel 1011. In this embodiment, the sound transmission channel 1011 is enclosed by the housing 4, the first enclosing member 5, and the second enclosing member 6, so that the microphone 3 can pick up a sound by using the sound transmission channel 1011.

[0072] It should be noted that in some examples, the housing 4 may be the middle frame 101 of the electronic device 100. In other words, the housing 4 shown in the embodiment in FIG. 2 is a partial structure of the middle frame 101. In some other examples, the housing 4 may be an independent structure. The housing 4, the first enclosing member 5, the second enclosing member 6, and the microphone 3 jointly form a microphone 3 module. Correspondingly, a structure that fits the housing 4 is disposed in the middle frame 101, so that the microphone 3 module is installed in the middle frame 101 through fitting installation between the housing 4 and the middle frame 101.

[0073] For example, the housing 4 may have a first through hole 401 and a first channel 402. The first through hole 401 may penetrate the housing 4 in a first direction, the first channel 402 may extend in a second direction, and the second direction intersects with the first direction. An end of the first channel 402 is exposed from the housing 4, and the other end of the first channel 402 communicates with the first through hole 401. The first enclosing member 5 may cover an opening on one side of the first through hole 401, the second enclosing member 6 may cover an opening on the other side of the first through hole 401, and the second enclosing member 6 is provided with a communication hole 601. The microphone 3 may be fastened on a side that is of the second enclosing member 6 and that faces away from the first through hole 401, and the microphone 3 communicates with the first through hole 401 through the communication hole 601.

[0074] It should be noted that the second enclosing member 6 covers an opening on one side of the first through hole 401 as a whole, and the communication hole 601 on the second enclosing member 6 also covers a partial region of the first through hole 401.

[0075] For ease of description, a coordinate system may be established. The following defines the first direction as a Z direction (also referred to as a Z-axis direction, namely, a thickness direction of the electronic device 100) and the second direction as an X direction (also referred to as an X-axis direction), and a Y direction (also referred to as a Y-axis direction) is perpendicular to the X direction, and is perpendicular to the Z direction. Specifically, the following defines a direction in which the first channel 402 extends toward the microphone 3 as a positive direction of the X direction, a direction in which the first enclosing member 5, the housing 4, the second enclosing member 6, and the microphone 3 are sequentially arranged as a positive direction of the Z direction, and a direction obtained after the positive direction of the Z direction rotates 90° counterclockwise in a plane perpendicular to an XZ plane as a positive direction of the Y direction. It may be understood that the X direction, the Y direction, and the Z direction are merely examples. In some other embodiments, the X direction, the Y direction, and the Z direction may alternatively be defined based on other references.

[0076] It should be noted that this embodiment of this application uses an example in which the first direction is perpendicular to the second direction, in other words, the Z direction is perpendicular to the X direction, and an angle of intersection between the first direction and the second direction is not limited. In some other embodiments, the first direction and the second direction may not be perpendicular to each other.

[0077] It should be noted that for descriptions of "top" or "bottom" of each component in the following descriptions, reference may be made to a positive direction and a negative direction of a Z-axis in the coordinate system. A surface that is of a component and that faces the Z direction may be referred to as a top surface, and a surface facing the negative direction of Z may be referred to as a bottom surface.

[0078] In the conventional technology, referring to FIG. 3A, the sound transmission channel 1011 is usually designed to be integrally formed in the middle frame 101, to be specific, there is a cavity inside the middle frame 101, and the cavity is the sound transmission channel 1011. However, each part of the middle frame 101 needs to have a specific thickness in the Z direction to ensure strength. In addition, due to an appearance design of the electronic device 100, an opening that is of the sound transmission channel 1011 and that is located on an outer surface of the middle frame 101 usually needs to be in the middle of the Z direction, so that sizes of the middle frame 101 in the Z direction on two sides of the sound transmission channel 1011 need to meet a specific value. In other words, L1 marked in FIG. 3A needs to meet a specific value. For example, L1 needs to be greater than or equal to 0.3 mm, to ensure structural strength of the middle frame 101. Therefore, in the conventional technology, it is difficult to reduce the thickness of the middle frame 101.

[0079] In addition, because the microphone 3 also has a specific thickness, after the microphone 3 is disposed in the middle frame 101, a sound pickup location of the microphone 3 deviates from a centerline of the middle frame 101. In other words, a surface that is of the microphone 3, that closely fits the middle frame 101, and that faces the sound transmission channel 1011 deviates from the centerline of the middle frame 101 in the Z direction. However, a specific thickness is required in the Z direction from the sound pickup location of the microphone 3 to a top portion of the middle frame 101 to ensure strength of the middle frame 101, in other words, L2 in FIG. 3A needs to meet a specific value. Consequently, the middle frame 101 is relatively thick, and it is difficult to meet a miniaturization requirement of the electronic device 100.

[0080] Continuing to refer to FIG. 2, in this embodiment, the first through hole 401 penetrating the housing 4 in the Z direction is disposed, and two sides of the first through hole 401 are blocked by using the first enclosing member 5 and the second enclosing member 6, to form a second channel 1012 (namely, a part of the sound transmission channel 1011) through enclosure. The communication hole 601 is provided on the second enclosing member 6, and the communication hole 601, the second channel 1012, and the first channel 402 sequentially communicate with each other to form the sound transmission channel 1011. Therefore, the sound transmission channel 1011 is not integrally formed by the housing 4, but is formed through enclosure of a top surface of the first enclosing member 5, a bottom surface of the second enclosing member 6, and the housing 4. Because the first enclosing member 5 and the second enclosing member 6 are not a part of the housing 4, and are not limited by strength of the housing 4, arrangement of the sound transmission channel 1011 is decoupled from a minimum thickness (namely, the size in the Z direction) required by the strength of the housing 4, so that the thickness of the housing 4 is not limited by the sound transmission channel 1011. Therefore, the thickness of the housing 4 can be reduced. In other words, the middle frame 101 can implement a thinning design, which facilitates a slim and lightweight design of the electronic device 100.

[0081] Specifically, in this embodiment, to meet a strength requirement of the housing 4, a region that is of the housing 4 and in which the first through hole 401 is disposed needs to meet a specific thickness. In other words, L3 marked in FIG. 2 needs to meet a specific value, in other words, the size of the first through hole 401 in the Z direction needs to meet a specific value. In addition, thicknesses of the housing 4 in the Z direction on two sides of the first channel 402 also need to meet a specific value. In other words, L4 marked in FIG. 2 needs to meet a specific value.

[0082] It may be assumed that the value of a wall thickness of each part of the housing 4 or the middle frame 101 (that is, the size of a wall of each part in the Z direction) needs to be greater than or equal to W, and values of L1, L3, and L4 are all W.

[0083] In a theoretical case, a top surface of the microphone 3 is not higher than the middle frame 101. The size of the first channel 402 in the Z direction in FIG. 2 is the same as the size of the sound transmission channel 1011 in the Z direction in the conventional technology in FIG. 3A. In this case, in the embodiment shown in FIG. 2, a maximum thickness of the housing 4 may be 2×W + the size of the first channel 402 in the Z direction. In the conventional technology shown in FIG. 3A, a maximum thickness of the middle frame 101 may be 2×W + the size of the sound transmission channel 1011 in the Z direction + the thickness of the microphone 3. Therefore, it can be learned that compared with the conventional technology, the housing 4 provided in this embodiment of this application can implement a thinning design at a maximum thickness, and a specific reduced size may be the thickness of the microphone 3, to implement a thinning design of the housing 4, in other words, implement a thinning design of the middle frame 101.

[0084] In addition, in a theoretical case, in the embodiment shown in FIG. 2, the size of a location at which the microphone 3 is installed is W + the thickness of the first enclosing member 5 + the thickness of the second enclosing member 6. In the embodiment shown in FIG. 3A, the size of a location at which the microphone 3 is installed is 2×W + the size of the sound transmission channel 1011 in the Z direction. The first enclosing member 5 and the second enclosing member 6 may be designed by using a material with relatively high strength, so that a strength requirement can be met by using a relatively small size. Therefore, it can be learned that compared with the conventional technology, the housing 4 provided in this embodiment of this application can implement a thinning design at a location at which the microphone 3 is installed. A specific reduced size may be W + the size of the sound transmission channel 1011 in the Z direction - the thickness of the first enclosing member 5 - the thickness of the second enclosing member 6, so that the thickness reduction design is implemented at the location that is of the housing 4 and at which the microphone 3 is installed, thereby facilitating an overall thinning design of the housing 4, in other words, facilitating an overall thinning design of the middle frame 101. For example, W=0.3 mm. In the conventional technology, the size of the sound transmission channel 1011 in the Z direction is 1 mm, the thickness of the first enclosing member 5 is 0.05 mm, and the thickness of the second enclosing member 6 is 0.1 mm. Compared with the conventional technology, this embodiment of this application implements a design of a thickness reduction of 1.15 mm at the location at which the microphone 3 is installed, in other words, implements a design of a thickness reduction of 71.9%.

[0085] It should be noted that the theoretical case described above means that no structure other than the microphone 3, the housing 4 / middle frame 101, the first enclosing member 5, and the second enclosing member 6 is included, and the microphone 3 is not higher than the housing 4 / middle frame 101, for example, does not include the size occupied by a sealing structure.

[0086] It should be noted that the sizes listed above are merely for illustrative descriptions, to facilitate comparison between this embodiment of this application and the conventional technology, and do not limit sizes of structures in this embodiment of this application.

[0087] Referring to FIG. 2 to FIG. 3B, FIG. 3B is a diagram of simulation comparison between microphones 3 in the embodiment shown in FIG. 2 and the conventional technology shown in FIG. 3A at different frequencies.

[0088] In simulation comparison, the length of the sound transmission channel 1011 in the embodiment shown in FIG. 2 is the same as the length of the sound transmission channel 1011 in the conventional technology shown in FIG. 3A. It can be learned from simulation comparison that sound pressure levels of the microphone 3 shown in the embodiment in FIG. 2 at different frequencies are basically the same as those of the microphone 3 in the conventional technology in FIG. 3A. Therefore, compared with the conventional technology, this embodiment of this application implements a thickness reduction design of the middle frame 101 without affecting performance of the microphone 3.

[0089] The following describes a specific structure in which the microphone 3 is installed on the housing 4.

[0090] Referring to FIG. 4A to FIG. 5, FIG. 4A is a diagram of a three-dimensional structure in which the microphone 3 shown in FIG. 2 is installed on the housing 4 in some embodiments; FIG. 4B is a section diagram of a structure of an installation structure of the microphone 3 shown in FIG. 4A along a line A-A in some embodiments; and FIG. 5 is a schematic exploded view of a partial structure of an installation structure of the microphone 3 shown in FIG. 4A.

[0091] In some embodiments, the electronic device 100 may further include a first bonding member 7, a second bonding member 8, a sealing member 9, a circuit board 10, and a third bonding member 11. The first bonding member 7 and the second bonding member 8 bond the second enclosing member 6 to one side of the housing 4, and the third bonding member 11 bonds the first enclosing member 5 to the other side of the housing 4. The sealing member 9 may be disposed between the circuit board 10 and the second enclosing member 6, to connect the circuit board 10 and the second enclosing member 6 through sealing. The microphone 3 is installed on the circuit board 10.

[0092] In this embodiment, the first bonding member 7 and the second bonding member 8 are disposed to implement sealing between the second enclosing member 6 and the housing 4, the third bonding member 11 is disposed to implement sealing between the first enclosing member 5 and the housing 4, and the sealing member 9 is disposed to implement sealing between both the microphone 3 and the circuit board 10 and the second enclosing member 6, so that sealing performance of the sound transmission channel 1011 is improved, and an improvement to a sound pickup effect of the microphone 3 is facilitated.

[0093] Referring to FIG. 4B, FIG. 6A, and FIG. 6B, FIG. 6A is a diagram of a structure of the housing 4 shown in FIG. 4B in some embodiments, and FIG. 6B is a section diagram of a structure of the housing 4 shown in FIG. 6A along B-B in some embodiments.

[0094] In some embodiments, the housing 4 may have a first groove 403 and a second groove 404 that are disposed opposite to each other in the Z direction. The first through hole 401 may penetrate a groove bottom wall of the first groove 403 and a groove bottom wall of the second groove 404. The first groove 403 may accommodate the first enclosing member 5, and the second groove 404 may accommodate at least a part of the second enclosing member 6 and the microphone 3.

[0095] In this embodiment, the first groove 403 and the second groove 404 are disposed, so that the thickness of the housing 4 in a region in which the first through hole 401 is disposed can be reduced. Because the microphone 3 is installed in correspondence with the first through hole 401, the housing 4 can implement a thinning design at a location at which the microphone 3 is installed. In addition, the first groove 403 is disposed to accommodate the first enclosing member 5, and the second groove 404 is disposed to accommodate at least a part of the second enclosing member 6 and the microphone 3. This helps reduce extra space occupied by the first enclosing member 5, the second enclosing member 6, and the microphone 3 in the Z direction, and facilitates an overall thinning design of the housing 4.

[0096] For example, in the Z direction, a groove depth of the second groove 404 may be greater than a groove depth of the first groove 403, and therefore, the second groove 404 can have larger accommodating space, so that the second groove 404 can better accommodate the second enclosing member 6 and the microphone 3, thereby improving space utilization of a groove structure of the housing 4. To be specific, the first groove 403 with a relatively small groove depth is used to accommodate the first enclosing member 5, and the second groove 404 with a relatively large groove depth is used to accommodate the second enclosing member 6 and the microphone 3, thereby improving space utilization of each groove structure of the housing 4 and facilitating an overall thinning design of the housing 4.

[0097] For example, a surface that is of the microphone 3 and that is away from the groove bottom wall of the first groove 403 may be located in the second groove 404, and therefore, the microphone 3 is not higher than the top surface of the housing 4 in the Z direction, so that the microphone 3 does not occupy extra size space in the Z direction, thereby facilitating an overall thinning design of the housing 4.

[0098] For example, in the Z direction, the first channel 402 is offset toward a side of the microphone 3 relative to the first through hole 401.

[0099] In this embodiment, in an extension direction (namely, the X direction) of the first channel 402, wall thicknesses of the housing 4 on two sides of the first channel 402 in the Z direction need to meet a structural strength requirement. Therefore, the first channel 402 is offset toward the side of the microphone 3 relative to the first through hole 401 in the Z direction, which helps maintain consistency of the wall thicknesses of the housing 4 on the two sides of the first channel 402 in the Z direction, and facilitates a reduction design of an overall thickness that is of the housing 4 and that exists after the microphone 3 is installed.

[0100] For example, if the first channel 402 is not offset relative to the first through hole 401, or the first channel 402 is offset toward a side away from the microphone 3 relative to the first through hole 401, the microphone 3 is offset in the Z direction relative to the first channel 402, which may also mean that the microphone 3 is designed to be raised relative to the first channel 402.

[0101] In this case, to ensure structural strength of the housing 4 at the first channel 402, in a case, the thickness of the housing 4 at the first channel 402 is set to exactly meet the structural strength requirement, and in this case, the microphone 3 is higher than a top surface of a region that is of the housing 4 and in which the first channel 402 is disposed, so that a part of the microphone 3 is higher than the second groove 404. Consequently, the overall thickness that is of the housing 4 and that exists after the microphone 3 is installed is excessively large, and it is difficult for the electronic device 100 to implement a thinning design.

[0102] In another case, a wall thickness of the housing 4 on a side that is of the first channel 402 and that is close to the microphone 3 is set, so that the microphone 3 can be fully accommodated in the second groove 404. Consequently, an overall wall thickness of the housing 4 at a location at which the first channel 402 is disposed is excessively large, and it is also difficult for the electronic device 100 to implement a thinning design.

[0103] Therefore, in the Z direction, the first channel 402 is offset toward the side of the microphone 3 relative to the first through hole 401, to properly design the thickness of the region that is of the housing 4 and in which the first channel 402 is disposed and the thickness of a region that is of the housing 4 and in which the microphone 3 is installed, so that an overall thickness of the housing 4 at the microphone 3 after the microphone 3 is disposed on the housing 4 is not greater than the thickness of the location at which the first channel 402 is disposed on the housing 4. In addition, the location at which the first channel 402 is disposed on the housing 4 can be designed based on the thickness of strength of a neighboring structure, so that a reduction design of an overall thickness of the housing 4 is implemented, and the overall thickness is not increased after the microphone 3 is disposed on the housing 4, thereby facilitating an overall thinning design of the electronic device 100.

[0104] Continuing to refer to FIG. 4B, FIG. 6A, and FIG. 6B, in some embodiments, the first through hole 401 may include a first part 401a and a second part 401b that are connected to each other. One end of the second part of the first channel 402 communicates with the first channel 402, and the other end of the second part 401b of the first through hole 401 communicates with the first part 401a of the first through hole 401. The first part 401a of the first through hole 401 may penetrate the groove bottom wall of the first groove 403 and the groove bottom wall of the second groove 404. The second part 401b of the first through hole 401 may penetrate the groove bottom wall of the first groove 403, a sidewall that is of the second groove 404 and that is close to the first channel 402 is a connection wall 405, and the connection wall 405 may block a part of an end that is of the second part 401b of the first through hole 401 and that is away from the first groove 403.

[0105] In this embodiment, because the first channel 402 is offset toward the side of the microphone 3 relative to the first through hole 401 in the Z direction, a bending connection structure exists at a joint between the first channel 402 and the first through hole 401. The sidewall that is of the second groove 404 and that is close to the first channel 402 blocks a part of the end that is of the second part 401b of the first through hole 401 and that is away from the first groove 403, so that the connection wall 405 can be used as a sidewall of the bending connection structure, and therefore, the second part 401b of the first through hole 401 can be connected to the first channel 402.

[0106] It should be noted that in the embodiments in FIG. 6A and FIG. 6B, a dashed line at the first through hole 401 represents a boundary between the first part 401a and the second part of the first through hole 401. It may be understood that in the embodiments in FIG. 6A and FIG. 6B, the boundary between the first part 401a and the second part of the first through hole 401 is merely an example. In some other embodiments, the boundary between the first part 401a and the second part of the first through hole 401 may be located at another location.

[0107] For example, the connection wall 405 may include a first part 405a, a second part 405b, and a third part 405c, and the first part 405a, the second part 405b, and the third part 405c of the connection wall 405 may be sequentially connected in the Y direction. The second part 405b of the connection wall 405 may correspondingly block a part of the end that is of the second part 401b of the first through hole 401 and that is away from the first groove 403, and the second part 405b of the connection wall 405 may protrude from the first part 405a and the third part 405c of the connection wall 405 in the Z direction.

[0108] In this embodiment, a material reduction design may be performed on regions of the second groove 404 that are close to the first part 405a and the third part 405c of the connection arm, so that the second part 405b of the connection wall 405 protrudes from the first part 405a and the third part 405c of the connection wall 405 in the Z direction, which facilitates a weight reduction design of the housing 4, thereby facilitating a lightweight design of the housing 4 and reducing material costs.

[0109] The second groove 404 may have a first surface 4051, and the first surface 4051 is located in the second groove 404 and is disposed close to the first channel 402. An included angle (referring to α in FIG. 6B) between the first surface 4051 and the groove bottom wall of the second groove 404 may range from 0° to 90°. For example, the value of a may be but is not limited to 1°, 5°, 30°, 60°, 70°, 80°, 90°, or the like.

[0110] The first surface 4051 may be located in the second part 405b of the connection wall 405, and the included angle between the first surface 4051 and the groove bottom wall of the second groove 404 is not 90°, so that the first surface 4051 can be tilted toward the first channel 402 relative to the bottom wall of the second groove 404, which facilitates a material reduction design of the housing 4 near the first surface 4051, thereby facilitating a lightweight design of the housing 4 and reducing material costs.

[0111] The housing 4 may further include an adhesive stopper 406. The adhesive stopper 406 may protrude from the first surface 4051, the adhesive stopper 406 may extend in the Y direction, and the size of the adhesive stopper 406 is greater than the size of the first through hole 401 in the Y direction.

[0112] For example, the housing 4 may further have a third groove 407, the third groove 407 may be recessed in the groove bottom wall of the second groove 404, and the third groove 407 may be disposed around the first part 401a of the first through hole 401.

[0113] The housing 4 may further have a fourth groove 408, the fourth groove 408 may be recessed in a groove bottom wall of the third groove 407, and the fourth groove 408 may be disposed around the first part 401a of the first through hole 401.

[0114] The width (referring to W1 in FIG. 6A) of the fourth groove 408 may be greater than 0.6 mm. For example, the value of W1 may be but is not limited to 0.62 mm, 0.66 mm, 0.7 mm, 0.74 mm, or another value greater than 0.6 mm. It should be noted that the width of the fourth groove 408 is a minimum spacing between an inner sidewall close to the first through hole 401 and an inner sidewall away from the first through hole 401 at each location of the fourth groove 408.

[0115] The depth (referring to H1 in FIG. 6A) of the fourth groove 408 may be greater than 0.1 mm. For example, the value of H1 may be but is not limited to 0.12 mm, 0.16 mm, 0.2 mm, 0.24 mm, or another value greater than 0.1 mm. It should be noted that the depth of the fourth groove 408 is a spacing between a groove bottom wall of the fourth groove 408 and the groove bottom wall of the third groove 407.

[0116] The housing 4 may further have an adhesive storage groove 409, the adhesive storage groove 409 may be recessed in the groove bottom wall of the second groove 404, and communicates with the third groove 407 and the fourth groove 408, the adhesive storage groove 409 may be located at two ends of the third groove 407, and parts of the first surface 4051 that are located on two sides of the adhesive stopper 406 may extend into the adhesive storage groove 409.

[0117] It should be noted that in the embodiments in FIG. 6A and FIG. 6B, the third groove 407, the fourth groove 408, and the adhesive storage groove 409 are delineated by using dashed lines. It may be understood that delineation of the third groove 407, the fourth groove 408, and the adhesive storage groove 409 in the embodiments in FIG. 6A and FIG. 6B is merely an example. In some other embodiments, the third groove 407, the fourth groove 408, and the adhesive storage groove 409 may alternatively be delineated in another manner.

[0118] It should be noted that in some other embodiments, the third groove 407 may not be disposed on the housing 4, and the fourth groove 408 is directly disposed on the groove bottom wall of the second groove 404.

[0119] Referring to FIG. 6A and FIG. 6C, FIG. 6C is a diagram of a structure of the housing 4 shown in FIG. 6A from another perspective. It should be noted that FIG. 6C is a schematic bottom view of the housing 4 shown in FIG. 6A.

[0120] In some embodiments, the housing 4 may further have a fifth groove 410, the fifth groove 410 may be recessed in a groove bottom wall of the first groove 403, and the fifth groove 410 may be disposed around the first through hole 401.

[0121] The width (referring to W2 in FIG. 6C) of the fifth groove 410 may be greater than 0.6 mm. For example, the value of W2 may be but is not limited to 0.62 mm, 0.66 mm, 0.7 mm, 0.74 mm, or another value greater than 0.6 mm. It should be noted that the width of the fifth groove 410 is a minimum spacing between an inner sidewall close to the first through hole 401 and an inner sidewall away from the first through hole 401 at each location of the fifth groove 410.

[0122] The depth of the fifth groove 410 may be greater than 0.1 mm (referring to H2 in FIG. 6C). For example, the value of H2 may be but is not limited to 0.12 mm, 0.16 mm, 0.2 mm, 0.24 mm, or another value greater than 0.1 mm. It should be noted that the depth of the fifth groove 410 is a spacing between a groove bottom wall of the fifth groove 410 and the groove bottom wall of the first groove 403.

[0123] Referring to FIG. 4B, FIG. 6A, and FIG. 6D, FIG. 6D is a diagram of a structure of the housing 4 shown in FIG. 6A from still another perspective. It should be noted that FIG. 6D is a schematic left view of the housing 4 shown in FIG. 6A.

[0124] In some embodiments, the housing 4 may further have a first end surface 411, and the first end surface 411 faces away from the microphone 3. The first channel 402 is exposed from the first end surface 411, and an opening that is of the first channel 402 and that is located on the first end surface 411 is located at the center of the first end surface 411 in the Z direction.

[0125] In this embodiment, the opening that is of the first channel 402 and that is located on the first end surface 411 is located at the center of the first end surface 411 in the Z direction, so that an improvement to appearance aesthetics of the housing 4 is facilitated, thereby improving appearance aesthetics of the electronic device 100. In addition, this facilitates centering of the first channel 402 in the housing 4 in the Z direction, so that thickness sizes of the housing 4 on the two sides of the first channel 402 in the Z direction are the same, and the housing 4 is set, based on a strength requirement, to have the same thickness size on the two sides of the first channel 402, thereby facilitating a slim and lightweight design of the housing 4.

[0126] Referring to FIG. 6A, FIG. 7A, and FIG. 7B, FIG. 7A is a diagram of a structure in which the first bonding member 7 is disposed on the housing 4 shown in FIG. 6A in some embodiments, and FIG. 7B is a diagram of a structure in which the second enclosing member 6 is installed on the housing 4 shown in FIG. 7A in some embodiments.

[0127] In some embodiments, the first bonding member 7 bonds the housing 4 to the second enclosing member 6.

[0128] In this embodiment, the first bonding member 7 is disposed, so that the second enclosing member 6 can be stably fastened to the housing 4, to block a side that is of the first through hole 401 and that is close to the second groove 404, thereby improving sealing performance between the second enclosing member 6 and the housing 4.

[0129] For example, the first bonding member 7 may be filled in the fourth groove 408.

[0130] In this embodiment, the fourth groove 408 is disposed to improve arrangement stability of the first bonding member 7, so that stability of bonding the housing 4 to the second enclosing member 6 by the first bonding member 7 is improved, thereby improving sealing performance between the second enclosing member 6 and the housing 4.

[0131] In this embodiment, because the width of the fourth groove 408 may be greater than 0.6 mm, and the depth of the fourth groove 408 may be greater than 0.1 mm, the fourth groove 408 can accommodate the first bonding member 7 with a sufficient amount, so that an improvement to strength of bonding the housing 4 to the second enclosing member 6 by the first bonding member 7 can be facilitated, thereby improving bonding stability.

[0132] The thickness of the first bonding member 7 may be greater than 0.1 mm, so that the first bonding member 7 can have a sufficient amount, and the first bonding member 7 has sufficient strength, thereby facilitating an improvement to stability of bonding the housing 4 to the second enclosing member 6 by the first bonding member 7.

[0133] The first bonding member 7 may be a pressure-sensitive adhesive or a foam adhesive, may be formed through curing after adhesive dispensing, or the like. The pressure-sensitive adhesive and the foam need to be activated to ensure stability of bonding the housing 4 to the second enclosing member 6.

[0134] Referring to FIG. 6A, FIG. 7C, and FIG. 7D, FIG. 7C is a diagram of a structure in which the second bonding member 8 is disposed on the housing 4 shown in FIG. 7B in some embodiments, and FIG. 7D is a diagram of a structure in which no second enclosing member 6 is installed on the housing 4 shown in FIG. 7C.

[0135] In some embodiments, the second enclosing member 6 may include a first part 6a and a second part 6b that are connected to each other. The first part 6a of the second enclosing member 6 is bonded to the first bonding member 7. The second part 6b of the second enclosing member 6 is disposed in correspondence with the first surface 4051.

[0136] In this embodiment, the second enclosing member 6 is designed as two parts, the first part 6a of the second enclosing member 6 is disposed in correspondence with the first bonding member 7, and the second part 6b of the second enclosing member 6 is disposed in correspondence with the first surface 4051, so that the second enclosing member 6 can implement a profiled design on a partial structure of the housing 4, thereby improving a close-fitting effect between the housing 4 and the second enclosing member 6.

[0137] Specifically, the first bonding member 7 is disposed in the fourth groove 408. Because the third groove 407 is disposed on the groove bottom wall of the second groove 404, and the fourth groove 408 is disposed on the groove bottom wall of the third groove 407, a top surface of the first bonding member 7 may be disposed parallel to the groove bottom wall of the second groove 404, so that an included angle between the top surface of the first bonding member 7 and the first surface 4051 is consistent with the included angle between the groove bottom wall of the second groove 404 and the first surface 4051, that is, an angle α shown in FIG. 6B. Correspondingly, the same α angle is set between the first part 6a and the second part of the second enclosing member 6, so that the second enclosing member 6 can better closely fit the housing 4, thereby improving a bonding effect between the second enclosing member 6 and the housing 4.

[0138] For example, the third groove 407 may accommodate the first part 6a of the second enclosing member 6.

[0139] In this embodiment, the third groove 407 accommodates the first part 6a of the second enclosing member 6, so that limiting installation for the first part 6a of the second enclosing member 6 is provided by using the sidewall of the third groove 407, thereby improving convenience and stability of installing the second enclosing member 6.

[0140] For example, the electronic device 100 may further include the second bonding member 8. The second bonding member 8 may be bonded between the second part 6b of the second enclosing member 6 and the first surface 4051.

[0141] In this embodiment, the second bonding member 8 is disposed to bond the second part 6b of the second enclosing member 6 to the first surface 4051, so that a bonding effect between the second enclosing member 6 and the housing 4 can be further improved, thereby further improving a sealing effect between the second enclosing member 6 and the housing 4.

[0142] The second bonding member 8 may be formed after adhesive dispensing and curing between the second part 6b of the second enclosing member 6 and the first surface 4051.

[0143] In this embodiment, the second bonding member 8 is formed through adhesive dispensing, so that a bonding effect between the second part 6b of the second enclosing member 6 and the first surface 4051 can be improved. Because the second bonding member 8 is in a fluid state before being cured, the second bonding member 8 can flow between the second part 6b of the second enclosing member 6 and the first surface 4051 before being cured, to fully fill in a gap between the second part 6b of the second enclosing member 6 and the first surface 4051. In this way, a structural size tolerance of the second enclosing member 6 and an assembly tolerance that exists after the second enclosing member 6 is bonded to the first bonding member 7 are absorbed, so that a close-fitting effect between the second enclosing member 6 and the housing 4 is improved, thereby improving a sealing effect between the second enclosing member 6 and the housing 4.

[0144] In this embodiment, because the first surface 4051 is provided with the adhesive stopper 406, when the second bonding member 8 flows between the second part 6b of the second enclosing member 6 and the first surface 4051 before being cured, the second bonding member 8 in the fluid state is blocked by the adhesive stopper 406, to prevent the second bonding member 8 in the fluid state from flowing into the first through hole 401, thereby preventing the second bonding member 8 from leaking into the sound transmission channel 1011 and affecting a sound transmission effect of the sound transmission channel 1011. Therefore, after the second bonding member 8 is formed through curing, the second bonding member 8 can be disposed around the adhesive stopper 406.

[0145] In this embodiment, because the adhesive storage groove 409 may be recessed in the groove bottom wall of the second groove 404, and communicates with the third groove 407 and the fourth groove 408, the adhesive storage groove 409 may be located at the two ends of the third groove 407, and the parts of the first surface 4051 that are located on the two sides of the adhesive stopper 406 may extend into the adhesive storage groove 409, so that the second bonding member 8 in the fluid state can flow through a gap between the second part 6b of the second enclosing member 6 and the first surface 4051, bypass the adhesive stopper 406, and flow to the two sides of the adhesive stopper 406 and into the adhesive storage groove 409. In this case, the second enclosing member 6 in the fluid state can flow into the third groove 407 through the adhesive storage groove 409, so that the second bonding member 8 in the fluid state can be in contact with the first bonding member 7, and after the second bonding member 8 is formed through curing, the second bonding member 8 can be connected to the first bonding member 7. This helps dispose a bonding member everywhere between the second enclosing member 6 and the housing 4, to improve a bonding effect between the second enclosing member 6 and the housing 4, so that a sealing effect between the second enclosing member 6 and the housing 4 is improved.

[0146] It should be noted that the second bonding member 8 in the fluid state means that the second bonding member 8 can flow before being cured, and the fluid state may be a liquid state, or may be a solid-liquid mixed state.

[0147] An area of a surface that is of the second part 6b of the second enclosing member 6 and that directly faces the first surface 4051 may be greater than 1 mm 2< , to ensure that the second bonding member 8 with a sufficient amount can be disposed between the second part 6b of the second enclosing member 6 and the first surface 4051, thereby improving a bonding effect between the second enclosing member 6 and the housing 4.

[0148] In some other embodiments, the second bonding member 8 may be a pressure-sensitive adhesive, a foam adhesive, or the like. The second bonding member 8 may be directly disposed between the second part 6b of the second enclosing member 6 and the first surface 4051, to bond the second part 6b of the second enclosing member 6 to the first surface 4051.

[0149] Referring to FIG. 7C and FIG. 8A, FIG. 8A is a diagram of a structure in which the sealing member 9 shown in FIG. 8A is installed on the housing 4 shown in FIG. 7C. It should be noted that FIG. 8A is a schematic top view existing after the sealing member 9 is installed on the structure shown in FIG. 7C.

[0150] In some embodiments, the sealing member 9 may be bonded to the second enclosing member 6, and an orthographic projection of the sealing member 9 on the second enclosing member 6 in the Z direction falls within the second enclosing member 6.

[0151] In this embodiment, the sealing member 9 is set to be smaller than the second enclosing member 6, and the orthographic projection in the Z direction falls within the second enclosing member 6, thereby facilitating installation of the sealing member 9.

[0152] For example, in the Z direction, a distance (referring to L5 in FIG. 8B) between an edge of the orthographic projection of the sealing member 9 on the second enclosing member 6 and an edge of the second enclosing member 6 is less than 0.1 mm. For example, the value of L5 may be but is not limited to 0.09 mm, 0.08 mm, 0.05 mm, or another value less than 0.1 mm. In other words, the first part 6a of the second enclosing member 6 extends outward by more than 0.1 mm compared with each part of the sealing member 9.

[0153] In this embodiment, the second enclosing member 6 is set to extend outward by at least 0.1 mm compared with the sealing member 9, so that a poor sealing effect after the sealing member 9 is offset on the second enclosing member 6 can be prevented.

[0154] A limiting structure 602 may be disposed on a surface that is of the second enclosing member 6 and that faces the sealing member 9, and the sealing member 9 may be installed in the limiting structure 602.

[0155] In this embodiment, by disposing the limiting structure 602, an installation guide can be provided for installing the sealing member 9, to improve installation precision of the sealing member 9, and also, a limiting support can be provided for the sealing member 9 after the sealing member 9 is installed, to prevent deviation, detachment, and the like of the sealing member 9 after the sealing member 9 is installed, thereby improving a sealing installation effect of the sealing member 9.

[0156] It should be noted that the limiting structure 602 may be a structure such as a recess, a notch, a protrusion, or the like disposed on the surface that is of the second enclosing member 6 and that faces the sealing member 9. For example, an engraved line may be obtained through processing in a laser engraving manner on the surface that is of the second enclosing member 6 and that faces the sealing member 9, to form the limiting structure 602. It may be understood that the limiting structure 602 shown in the embodiment in FIG. 8B is merely an example. In some other embodiments, the limiting structure 602 may alternatively be disposed at another location.

[0157] Referring to FIG. 4B, FIG. 8B, and FIG. 9, FIG. 8B is a diagram of a structure of the sealing member 9 in an installation structure of the microphone 3 shown in FIG. 4A in some embodiments, and FIG. 9 is a diagram of a structure in which the circuit board 10 is installed on the housing 4 shown in FIG. 8B in some embodiments.

[0158] In some embodiments, the sealing member 9 may be bonded between the second enclosing member 6 and the circuit board 10, and the microphone 3 may be installed on the circuit board 10. The sealing member 9 may have a second through hole 903, the circuit board 10 may have a third through hole 1001, the third through hole 1001 and the second through hole 903 may communicate with the communication hole 601 in the Z direction, and the microphone 3 covers an end that is of the third through hole 1001 and that is away from the second enclosing member 6.

[0159] In this embodiment, the sealing member 9 is disposed to bond the second enclosing member 6 to the circuit board 10, to seal the circuit board 10 and the second enclosing member 6, so that sealing performance between the communication hole 601, the second through hole 903, and the third through hole 1001 is improved, which facilitates an improvement to a sound transmission effect of the sound transmission channel 1011, thereby improving a use effect of the microphone 3.

[0160] For example, the sealing member 9 may be located in the third groove 407, so that size space occupied by the sealing member 9 in the Z direction can be reduced by using the third groove 407, thereby facilitating slimness and a light weight after the microphone 3 is installed on the housing 4. In addition, a limiting function on the sealing member 9 can be further provided by using an inner sidewall of the third groove 407, which facilitates positioning installation and post-installation stability of the sealing member 9.

[0161] For example, the circuit board 10 may abut against a surface that is of the sealing member 9 and that is away from the second enclosing member 6, and is fixedly connected to the groove bottom wall of the second groove 404. The sealing member 9 is in a compressed state.

[0162] In this embodiment, the circuit board 10 abuts against the sealing member 9, and enables the sealing member 9 to be in the compressed state, so that a gap between the circuit board 10 and the sealing member 9 and a gap between the sealing member 9 and the second enclosing member 6 can be eliminated, and sealing performance between the circuit board 10 and the second enclosing member 6 is further improved, to improve sealing performance between the communication hole 601, the second through hole 903, and the third through hole 1001, which facilitates an improvement to a sound transmission effect of the sound transmission channel 1011, thereby improving a use effect of the microphone 3. In addition, the circuit board 10 is fixedly connected to the groove bottom wall of the second groove 404, so that it is ensured, by using the fixed connection between the groove bottom wall of the second groove 404 and the circuit board 10, that the circuit board 10 fully compresses the sealing member 9, thereby improving sealing performance between the circuit board 10 and the second enclosing member 6.

[0163] It should be noted that the fixed connection between the circuit board 10 and the groove bottom wall of the second groove 404 may be but is not limited to snap-fit fastening, bolt fastening, bonding fastening, or the like.

[0164] The sealing member 9 may include a sealing portion 901 and a bonding portion 902 that are stacked in a direction parallel to the Z direction, and the bonding portion 902 may be bonded between the second enclosing member 6 and the sealing portion 901. A side that is of the sealing portion 901 and that is away from the second enclosing member 6 abuts against the circuit board 10, and the sealing portion 901 may be in a compressed state.

[0165] In this embodiment, the second enclosing member 6 may be bonded by using the bonding portion 902, and compression may be implemented by using the sealing portion 901, to improve sealing performance between the circuit board 10 and the second enclosing member 6.

[0166] A compression amount of the sealing portion 901 may range from 50% to 70%, so that the circuit board 10 can be in full contact with the sealing portion 901, thereby improving sealing performance between the circuit board 10 and the second enclosing member 6. For example, the compression amount of the sealing portion 901 may be but is not limited to 50%, 55%, 60%, 65%, 70%, or another value between 50% and 70%.

[0167] It should be noted that the compression amount of the sealing portion 901 is a reduced percentage of the size of the sealing portion 901 in the Z direction after the circuit board 10 is installed, compared with the size of the sealing portion 901 in the Z direction when the sealing portion 901 is not subject to an external force.

[0168] The bonding portion 902 may include a first bonding layer 9021, a waterproof layer 9022, and a second bonding layer 9023 that are sequentially stacked. The first bonding layer 9021 is bonded to the second enclosing member 6, and the second bonding layer 9023 is bonded to the sealing portion 901.

[0169] In this embodiment, the waterproof layer 9022 is disposed in the bonding portion 902, so that the sealing member 9 can further resist water droplets and water vapor, and can prevent an external water flow or external water vapor from intruding into the sound transmission channel 1011, so that the microphone 3 can be protected, and a sound transmission effect of the sound transmission channel 1011 can be prevented from being affected by intrusion of the water droplets or the water vapor, thereby improving a use effect of the microphone 3.

[0170] The thickness of the first bonding layer 9021 is greater than the thickness of the second bonding layer 9023.

[0171] In this embodiment, because the second enclosing member 6 may be a rigid member, and the sealing portion 901 may be a flexible member, the thickness of the first bonding layer 9021 is set to be greater than the thickness of the second bonding layer 9023, so that a bonding requirement of the second enclosing member 6 being greater than a bonding requirement of the sealing portion 901 can be met. In this way, the second enclosing member 6 and the sealing portion 901 can be effectively bonded, and an adhesive thickness can be reduced to avoid a thickness increase caused by disposing an extra adhesive layer.

[0172] For example, thicknesses of all layers of structures in the sealing member 9 may be the first bonding layer 9021 of a thickness 0.1 mm + the waterproof layer 9022 of a thickness 0.01 mm + the second bonding layer 9023 of a thickness 0.05 mm + the sealing portion 901 of a thickness 0.15 mm. The first bonding layer 9021 and the second bonding layer 9023 each may be a pressure-sensitive adhesive, an adhesive tape, a foam adhesive, or the like. The waterproof layer 9022 may be a waterproof film. The sealing portion 901 may be a foam, silicone rubber, rubber, or the like.

[0173] It should be noted that the thicknesses of all the layers of structures in the sealing member 9 are merely examples for description. It may be understood that the thicknesses of all the layers of structures in the sealing member 9 may alternatively be other values. For example, the first bonding layer 9021 may be 0.15 mm thick, the waterproof layer 9022 may be 0.02 mm thick, the second bonding layer 9023 may be 0.12 mm thick, and the sealing portion 901 may be 0.2 mm thick. The thicknesses of all the layers of structures in the sealing member 9 are not listed herein.

[0174] Referring to FIG. 6C, FIG. 10A, and FIG. 10B, FIG. 10A is a diagram of a structure in which the third bonding member 11 is installed on the housing 4 shown in FIG. 6C in some embodiments, and FIG. 10B is a diagram of a structure in which the first enclosing member 5 is installed on the housing 4 shown in FIG. 10A in some embodiments.

[0175] In some embodiments, the third bonding member 11 may be located in the fifth groove 410, and the third bonding member 11 bonds the housing 4 to the first enclosing member 5.

[0176] In this embodiment, the fifth groove 410 is disposed to improve arrangement stability of the third bonding member 11, so that stability of bonding the housing 4 to the first enclosing member 5 by the third bonding member 11 is improved, thereby improving sealing performance between the first enclosing member 5 and the housing 4.

[0177] In this embodiment, because the width of the fifth groove 410 may be greater than 0.6 mm, and the depth of the fifth groove 410 may be greater than 0.1 mm, the fifth groove 410 can accommodate the third bonding member 11 with a sufficient amount, so that an improvement to strength of bonding the housing 4 to the first enclosing member 5 by the third bonding member 11 can be facilitated, thereby improving bonding stability.

[0178] For example, the thickness of the third bonding member 11 may be greater than 0.1 mm, so that the third bonding member 11 can have a sufficient amount, and the third bonding member 11 has sufficient strength, thereby facilitating an improvement to stability of bonding the housing 4 to the first enclosing member 5 by the third bonding member 11.

[0179] The third bonding member 11 may be a pressure-sensitive adhesive or a foam adhesive, may be formed through curing after adhesive dispensing, or the like. The pressure-sensitive adhesive and the foam need to be activated to ensure stability of bonding the housing 4 to the first enclosing member 5.

[0180] For example, the groove depth of the fifth groove 410 may be greater than the thickness of the third bonding member 11, and the first enclosing member 5 may be accommodated in the fifth groove 410.

[0181] In this embodiment, the groove depth of the fifth groove 410 is set to be greater than the thickness of the third bonding member 11, so that the first enclosing member 5 can be at least partially accommodated in the fifth groove 410. An inner sidewall of the fifth groove 410 may be used for positioning during installation of the first enclosing member 5, and may also be used for limiting the first enclosing member 5 after the first enclosing member 5 is installed, to improve installation stability of the first enclosing member 5.

[0182] The housing 4 may further have a sixth groove 412, the sixth groove 412 may be disposed at a groove bottom of the first groove 403, and the sixth groove 412 may be disposed around the fifth groove 410.

[0183] In this embodiment, because the groove depth of the fifth groove 410 is set to be greater than the thickness of the third bonding member 11, in other words, there is a sufficient thickness at a location that is of the housing 4 and at which the fifth groove 410 is disposed, a thinning design can be performed on a periphery of the fifth groove 410 by disposing the sixth groove 412, which facilitates an overall thinning design of the housing 4.

[0184] Referring to FIG. 4B and FIG. 11, FIG. 11 is a diagram of a structure of an installation structure of the microphone 3 shown in FIG. 4B from another perspective. It should be noted that FIG. 11 is a schematic front view of a sectional view of an installation structure of the microphone 3 shown in FIG. 4B.

[0185] In some embodiments, the thickness of the second enclosing member 6 may be greater than the thickness of the first enclosing member 5.

[0186] In this embodiment, because the second enclosing member 6 needs to bear the sealing member 9, the circuit board 10, and the microphone 3, and the first enclosing member 5 does not need to bear another component, the second enclosing member 6 has a higher strength requirement. Therefore, the thickness of the second enclosing member 6 is set to be greater than the thickness of the first enclosing member 5, which helps ensure support strength of the second enclosing member 6, helps implement a thinning design at the first enclosing member 5, and helps reduce an overall thickness that is of the housing 4 and that exists after the microphone 3 is installed.

[0187] For example, the thickness of the first enclosing member 5 ranges from 0 mm to 0.3 mm. For example, the thickness of the first enclosing member 5 may be 0.05 mm, 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, or another value between 0 mm and 0.3 mm.

[0188] A material of the first enclosing member 5 may be metal, polyethylene terephthalate (polyethylene glycol terephthalate, PET), or the like.

[0189] For example, the thickness of the second enclosing member 6 ranges from 0 mm to 0.3 mm. For example, the thickness of the first enclosing member 5 may be 0.05 mm, 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, or another value between 0 mm and 0.3 mm.

[0190] A material of the second enclosing member 6 may be metal, PET, or the like.

[0191] In some embodiments, a volume of the first channel 402 may be greater than a volume of the second channel 1012.

[0192] In this embodiment, the volume of the first channel 402 is set to be greater than the volume of the second channel 1012, so that a resonance frequency of the microphone 3 can be increased, thereby improving a use effect of the microphone 3.

[0193] For example, an inner diameter (referring to D1 in FIG. 11) of the first channel 402 may be greater than or equal to 0.8 mm, which facilitates an improvement to the resonance frequency of the microphone 3. For example, the inner diameter of the first channel 402 may be but is not limited to 0.8 mm, 0.9 mm, 1 mm, or another value greater than 0.8 mm.

[0194] For example, the size (referring to H3 in FIG. 11) of the second channel 1012 in the Z direction may be less than the size (referring to W3 in FIG. 11) of the second channel 1012 in the X direction, which helps reduce the size at the microphone 3 in the Z direction after the microphone 3 is installed on the housing 4, thereby facilitating a slim and lightweight design of an overall structure.

[0195] The size of the second channel 1012 in the Z direction may be greater than 0.6 mm, and the size of the second channel 1012 in the X direction may be greater than 1 mm, so that the second channel 1012 is short in size and has a large inner diameter, and therefore, the resonance frequency of the microphone 3 is increased, thereby improving a use effect of the microphone 3. For example, the size of the second channel 1012 in the Z direction may be 0.61 mm, 0.62 mm, 0.63 mm, 0.64 mm, 0.65 mm, or another value greater than 0.6 mm. The size of the second channel 1012 in the X direction may be 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm, 1.5 mm, or another value greater than 1 mm.

[0196] It should be noted that the size of the second channel 1012 in the Z direction is a spacing between the top surface of the first enclosing member 5 and the bottom surface of the second enclosing member 6, and the size of the second channel 1012 in the X direction is an inner diameter of the first through hole 401.

[0197] Referring to FIG. 12, FIG. 12 is a diagram of an assembly procedure of an installation structure of the microphone 3 shown in FIG. 4A in some embodiments.

[0198] In some embodiments, the assembly procedure of the installation structure of the microphone 3 may include steps S10, S20, S30, and S40, where a sequence of the steps S10, S20, and S30 is not limited.

[0199] S10. Install the first enclosing member 5 on the housing 4.

[0200] Specifically, step S10 may include S11, S12, and S13. Refer to FIG. 6C, FIG. 10A, and FIG. 10B.

[0201] S11. Dispose the third bonding member 11 in the fifth groove 410. Refer to FIG. 6C and FIG. 10A.

[0202] S12. Install the first enclosing member 5 to closely fit the third bonding member 11. Refer to FIG. 10A and FIG. 10B.

[0203] S13. Bond the first enclosing member 5 to the third bonding member 11.

[0204] The third bonding member 11 may be a pressure-sensitive adhesive or a foam adhesive, or may be formed through an adhesive dispensing process.

[0205] In some examples, the third bonding member 11 may be a pressure-sensitive adhesive or a foam adhesive. In step S11, the pressure-sensitive adhesive or the foam adhesive closely fits the groove bottom wall of the fifth groove 410. In step S13, the third bonding member 11 needs to be press-fitted, to ensure that the pressure-sensitive adhesive or the foam adhesive is activated, and poor air leakage is prevented.

[0206] In some other examples, the third bonding member 11 may be formed through an adhesive dispensing process. In step S11, an adhesive in a fluid state is disposed in the fifth groove 410 through the adhesive dispensing process. In step S13, the adhesive in the fluid state is cured, so that the first enclosing member 5 is bonded to the third bonding member 11.

[0207] S20. Install the second enclosing member 6 on the housing 4.

[0208] Specifically, step S20 may include S21, S22, S23, S24, and S25. Refer to FIG. 6A, FIG. 7A to FIG. 7C, and FIG. 8A.

[0209] S21. Dispose the first bonding member 7 in the fourth groove 408. Refer to FIG. 6A and FIG. 7A.

[0210] S22. Install the second enclosing member 6, so that the first part 6a of the second enclosing member 6 closely fits the first bonding member 7. Refer to FIG. 7A and FIG. 7B.

[0211] S23. Bond the first part 6a of the second enclosing member 6 to the first bonding member 7.

[0212] S24. Dispense an adhesive between the second part 6b of the second enclosing member 6 and the first surface 4051, and cure the adhesive to form the second bonding member 8. Refer to FIG. 7B to FIG. 7D.

[0213] S25. Install the sealing member 9 on the second enclosing member 6. Refer to FIG. 7C and FIG. 8A.

[0214] The first bonding member 7 may be a pressure-sensitive adhesive or a foam adhesive, or may be formed through the adhesive dispensing process.

[0215] In some examples, the first bonding member 7 may be a pressure-sensitive adhesive or a foam adhesive. In step S21, the pressure-sensitive adhesive or the foam adhesive closely fits the groove bottom wall of the fourth groove 408. In step S23, the first bonding member 7 needs to be press-fitted, to ensure that the pressure-sensitive adhesive or the foam adhesive is activated, and poor air leakage is prevented.

[0216] In some other examples, the first bonding member 7 may be formed through the adhesive dispensing process. In step S21, an adhesive in a fluid state is disposed in the fourth groove 408 through the adhesive dispensing process. In step S23, the adhesive in the fluid state is cured, so that the first part 6a of the second enclosing member 6 is bonded to the first bonding member 7.

[0217] In step S24, the second bonding member 8 is formed through adhesive dispensing, so that a bonding effect between the second part 6b of the second enclosing member 6 and the first surface 4051 can be improved. Because the second bonding member 8 is in the fluid state before being cured, the second bonding member 8 can flow between the second part 6b of the second enclosing member 6 and the first surface 4051 before being cured, to fully fill in a gap between the second part 6b of the second enclosing member 6 and the first surface 4051. In this way, a structural size tolerance of the second enclosing member 6 and an assembly tolerance that exists after the second enclosing member 6 is bonded to the first bonding member 7 are absorbed, so that a close-fitting effect between the second enclosing member 6 and the housing 4 is improved, thereby improving a sealing effect between the second enclosing member 6 and the housing 4.

[0218] S30. Install the microphone 3 on the circuit board 10.

[0219] The microphone 3 may be installed on the circuit board 10 through welding.

[0220] S40. Install the circuit board 10 on the housing 4 to seal the sound transmission channel 1011. Refer to FIG. 8B, FIG. 4A, and FIG. 4B.

[0221] The circuit board 10 abuts against the sealing member 9, and enables the sealing member 9 to be in the compressed state, so that a gap between the circuit board 10 and the sealing member 9 and a gap between the sealing member 9 and the second enclosing member 6 can be eliminated, and sealing performance between the circuit board 10 and the second enclosing member 6 is further improved, to improve sealing performance between the communication hole 601, the second through hole 903, and the third through hole 1001, which facilitates an improvement to a sound transmission effect of the sound transmission channel 1011, thereby improving a use effect of the microphone 3. In addition, the circuit board 10 is fixedly connected to the groove bottom wall of the second groove 404, so that it is ensured, by using the fixed connection between the groove bottom wall of the second groove 404 and the circuit board 10, that the circuit board 10 fully compresses the sealing member 9, thereby improving sealing performance between the circuit board 10 and the second enclosing member 6.

[0222] It should be noted that embodiments in this application and features in embodiments may be combined with each other without a conflict, and any combination of features in different embodiments also falls within the protection scope of this application. In other words, the foregoing described plurality of embodiments may be further combined in any manner based on an actual requirement.

[0223] It should be noted that all the foregoing accompanying drawings are example illustrations of this application, and do not represent an actual size of a product. In addition, a size proportional relationship between components in the accompanying drawings is not intended to limit an actual product in this application.

[0224] The foregoing descriptions are merely some embodiments and implementations of this application, but are not intended to limit the protection scope of this application. Any variation or replacement readily figured out by a person skilled in the art within the technical scope disclosed in this application shall fall within the protection scope of this application. Therefore, the protection scope of this application shall be subject to the protection scope of the claims.

Examples

Embodiment Construction

[0056]The following describes embodiments of this application with reference to the accompanying drawings in embodiments of this application.

[0057]In the descriptions of embodiments of this application, it should be noted that terms "installation" and "connection" should be understood in a broad sense unless otherwise specified and limited. For example, "connection" may be a detachable connection, a non-detachable connection, a direct connection, or an indirect connection through an intermediate medium. "A plurality of' means at least two.

[0058]Orientation terms mentioned in embodiments of this application, for example, "upper", "lower", "inner", "outer", "top", "bottom", and "side" are merely directions based on the accompanying drawings. Therefore, the orientation terms are used to better and more clearly describe and understand embodiments of this application, instead of indicating or implying that a specified apparatus or element should have a specific orientation, and be constr...

Claims

1. An electronic device (100), comprising: a housing (4), having a first through hole (401) and a first channel (402), wherein the first through hole (401) penetrates the housing (4) in a first direction, the first channel (402) extends in a second direction, the second direction intersects with the first direction, one end of the first channel (402) is exposed from the housing (4), and the other end of the first channel (402) communicates with the first through hole (401); a first enclosing member (5), fastened on one side of the housing (4) and covering an opening on one side of the first through hole (401); a second enclosing member (6), fastened on the other side of the housing (4) and covering an opening on the other side of the first through hole (401), wherein the second enclosing member (6) is provided with a communication hole (601); and a microphone (3), wherein the microphone (3) is fastened on a side that is of the second enclosing member (6) and that faces away from the first through hole (401), and the microphone (3) communicates with the first through hole (401) through the communication hole (601).

2. The electronic device (100) according to claim 1, wherein the housing (4) has a first groove (403) and a second groove (404) that are disposed opposite to each other in the first direction, and the first through hole (401) penetrates a groove bottom wall of the first groove (403) and a groove bottom wall of the second groove (404); and the first groove (403) accommodates the first enclosing member (5), and the second groove (404) accommodates at least a part of the second enclosing member (6) and the microphone (3).

3. The electronic device (100) according to claim 2, wherein in the first direction, a groove depth of the second groove (404) is greater than a groove depth of the first groove (403); and / or a surface that is of the microphone (3) and that is away from the groove bottom wall of the first groove (403) is located in the second groove (404).

4. The electronic device (100) according to claim 2, wherein in the first direction, the first channel (402) is offset toward a side of the microphone (3) relative to the first through hole (401).

5. The electronic device (100) according to claim 4, wherein the first through hole (401) is enclosed by the first enclosing member (5) and the second enclosing member (6) to form a second channel (1012), and a volume of the first channel (402) is greater than a volume of the second channel (1012).

6. The electronic device (100) according to claim 4, wherein an inner diameter of the first channel (402) is greater than or equal to 0.8 mm; and / or the first through hole (401) is enclosed by the first enclosing member (5) and the second enclosing member (6) to form a second channel (1012), a size of the second channel (1012) in the first direction is greater than 0.6 mm, and a size of the second channel (1012) in the second direction is greater than 1 mm.

7. The electronic device (100) according to any one of claims 4 to 6, wherein the first through hole (401) comprises a first part (401a) and a second part (401b) that communicate with each other, one end of the second part (401b) of the first through hole (401) communicates with the first channel (402), and the other end of the second part (401b) of the first through hole (401) communicates with the first part (401a) of the first through hole (401); and the first part (401a) of the first through hole (401) penetrates the groove bottom wall of the first groove (403) and the groove bottom wall of the second groove (404), the second part (401b) of the first through hole (401) penetrates the groove bottom wall of the first groove (403), and a sidewall that is of the second groove (404) and that is close to the first channel (402) blocks a part of an end that is of the second part (401b) of the first through hole (401) and that is away from the first groove (403).

8. The electronic device (100) according to claim 7, wherein the housing (4) further has a fourth groove (408), the fourth groove (408) is recessed in the groove bottom wall of the second groove (404), and the fourth groove (408) is disposed around the first part (401a) of the first through hole (401); and the electronic device (100) further comprises a first bonding member (7), the first bonding member (7) is filled in the fourth groove (408), and the first bonding member (7) bonds the housing (4) to the second enclosing member (6).

9. The electronic device (100) according to claim 8, wherein a width of the fourth groove (408) is greater than 0.6 mm, and a depth of the fourth groove (408) is greater than 0.1 mm.

10. The electronic device (100) according to claim 8, wherein the second groove (404) has a first surface (4051), the first surface (4051) is located in the second groove (404) and is disposed close to the first channel (402), and an included angle between the first surface (4051) and the groove bottom wall of the second groove (404) ranges from 0° to 90°; the second enclosing member (6) comprises a first part (6a) and a second part (6b) that are connected to each other, and the first part (6a) of the second enclosing member (6) is bonded to the first bonding member (7); and the electronic device (100) further comprises a second bonding member (8), and the second bonding member (8) is bonded between the second part (6b) of the second enclosing member (6) and the first surface (4051).

11. The electronic device (100) according to claim 10, wherein the housing (4) further comprises an adhesive stopper (406), the adhesive stopper (406) protrudes from the first surface (4051), the adhesive stopper (406) extends in a third direction, a size of the adhesive stopper (406) is greater than a size of the first through hole (401) in the third direction, and the third direction is perpendicular to the first direction, and intersects with the second direction; and the second bonding member (8) is disposed around the adhesive stopper (406).

12. The electronic device (100) according to claim 11, wherein the first bonding member (7) is connected to the second bonding member (8).

13. The electronic device (100) according to claim 12, wherein the housing (4) further has a third groove (407), the third groove (407) is recessed in the groove bottom wall of the second groove (404), the third groove (407) is disposed around the first part (401a) of the first through hole (401), the fourth groove (408) is recessed in a groove bottom wall of the third groove (407), and the third groove (407) accommodates the first part (6a) of the second enclosing member (6); and the housing (4) further has an adhesive storage groove (409), the adhesive storage groove (409) is recessed in the groove bottom wall of the second groove (404), and communicates with the third groove (407) and the fourth groove (408), the adhesive storage groove (409) is located at two ends of the third groove (407), and parts of the first surface (4051) that are located on two sides of the adhesive stopper (406) extend into the adhesive storage groove (409).

14. The electronic device (100) according to any one of claims 8 to 13, wherein the electronic device (100) further comprises a sealing member (9) and a circuit board (10), the microphone (3) is installed on the circuit board (10), and the sealing member (9) is bonded between the second enclosing member (6) and the circuit board (10); and the sealing member (9) has a second through hole (903), the circuit board (10) has a third through hole (1001), the third through hole (1001) and the second through hole (903) communicate with the communication hole (601) in the first direction, and the microphone (3) covers an end that is of the third through hole (1001) and that is away from the second enclosing member (6).

15. The electronic device (100) according to claim 14, wherein in the first direction, a spacing between an edge of an orthographic projection of the sealing member (9) on the second enclosing member (6) and an edge of the second enclosing member (6) is less than 0.1 mm.

16. The electronic device (100) according to claim 14, wherein there is a limiting structure (602) on a surface that is of the second enclosing member (6) and that faces the sealing member (9), and the sealing member (9) is installed in the limiting structure (602).

17. The electronic device (100) according to claim 14, wherein the housing (4) further has the third groove (407), the third groove (407) is recessed in the groove bottom wall of the second groove (404), the third groove (407) is disposed around the first part (401a) of the first through hole (401), the fourth groove (408) is recessed in the groove bottom wall of the third groove (407), and the third groove (407) accommodates a part of the second enclosing member (6); and the sealing member (9) is located in the third groove (407), the circuit board (10) abuts against a surface that is of the sealing member (9) and that is away from the second enclosing member (6), and is fixedly connected to the groove bottom wall of the second groove (404), and the sealing member (9) is in a compressed state.

18. The electronic device (100) according to claim 17, wherein the sealing member (9) comprises a sealing portion (901) and a bonding portion (902) that are stacked in a direction parallel to the first direction, the bonding portion (902) bonds the second enclosing member (6) to the sealing portion (901), a side that is of the sealing portion (901) and that is away from the second enclosing member (6) abuts against the circuit board (10), and a compression amount of the sealing portion (901) ranges from 50% to 70%.

19. The electronic device (100) according to any one of claims 2 to 6, 8 to 13, and 15 to 18, wherein the housing (4) further has a fifth groove (410), the fifth groove (410) is recessed in the groove bottom wall of the first groove (403), and the fifth groove (410) is disposed around the first through hole (401); and the housing (4) further comprises a third bonding member (11), the third bonding member (11) is located in the fifth groove (410), and the third bonding member (11) bonds the housing (4) to the first enclosing member (5).

20. The electronic device (100) according to claim 19, wherein a width of the fifth groove (410) is greater than 0.6 mm, and a depth of the fifth groove (410) is greater than 0.1 mm.

21. The electronic device (100) according to any one of claims 1 to 6, 8 to 13, 15 to 18, and 20, wherein a thickness of the second enclosing member (6) is greater than a thickness of the first enclosing member (5).

22. The electronic device (100) according to claim 21, wherein the thickness of the first enclosing member (5) ranges from 0 mm to 0.3 mm; and / or the thickness of the second enclosing member (6) ranges from 0 mm to 0.3 mm.

23. The electronic device (100) according to any one of claims 1 to 6, 8 to 13, 15 to 18, 20, and 22, wherein the housing (4) further has a first end surface (411), and the first end surface (411) faces away from the microphone (3); and the first channel (402) is exposed from the first end surface (411), and an opening that is of the first channel (402) and that is located on the first end surface (411) is located at a center of the first end surface (411) in the first direction.

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