INVERTER HOUSING WITH COOLING MOUNTS AND INVERTER WITH SUCH A SENSOR

Abstract

The invention relates to an inverter housing intended to receive at least one power electronics component (42, 43) of an inverter (4), the housing (41) having walls (411) defining a receiving volume (V) for at least one power electronics component (42, 43).The housing includes at least one pad (47) projecting from an internal surface (412) of the walls (411) into the receiving volume (V), the at least one pad (47) being configured such that, when the at least one component is received into the receiving volume (V), a terminal (421, 422, 432) of that at least one power electronics component (42, 43) or a conductive busbar electrically connected to the terminal (421, 422, 432) of the power electronics component (42) is opposite a free end (472) of the pad (47) at a predefined distance so that an interface element (48) can be interposed between the free end (472) of the pad (47) and the terminal (421, 422, 432) of the power electronics component (42, 43) or the busbar conductor. Figure for the abbreviation: Fig.2.

Description

Title of the invention: INVERTER HOUSING WITH COOLING PITS AND INVERTER WITH SUCH A SENSOR technical field

[0001] The invention relates to the field of cooling electrical inverters. It relates in particular to inverters adapted to control the operation of an electric traction machine of an electric or hybrid vehicle, for example a motor vehicle. STATE OF THE ART

[0002] In the field of power electronics, an inverter is a voltage converter that generates alternating voltages and currents from an electrical energy source of a different voltage or frequency. In particular, an inverter can generate the alternating voltages suitable for the operation of a synchronous or asynchronous electric motor from a direct current voltage source, such as an electric battery.

[0003] For this purpose, the inverters include components, in particular power modules comprising electronic switches, for example IGBTs (IGBT meaning Insulated Gate Bipolar Transistor), whose openings and closings are appropriately controlled.

[0004] Such an inverter thus comprises an assembly of several components which are generally enclosed in a protective housing, also called a casing. These components typically have one or more terminals allowing their interconnection, or their connection with other components related to the inverter, such as the electric battery or an electric machine.

[0005] During operation, the inverter components generate heat which can impair their proper functioning or even damage them. In particular, the power modules generate heat due to the current flowing through them and the numerous switching operations of the electronic switches.

[0006] The heat generated by the power modules can be transmitted, via the terminals, to other components of the inverter, such as capacitors that may be heat-sensitive, and / or to components connected to the inverter. Heat is also generated in the terminals due to the current flowing through them.

[0007] Furthermore, the inverter components other than the power modules as well as The components connected to the inverter can also generate heat; which heat can be transferred to the power modules via the terminals and further heat these power modules.

[0008] There are in the prior art certain general solutions which have been developed to reduce heat at the level of conductive bars, also known by the English term “bus bar”.

[0009] For example, US20200044422 proposes an inverter housing having a recess in which a thermally conductive liquid is received. The housing includes a bus bar device comprising conductive bars, one end of which is immersed in the conductive liquid.

[0010] This solution is, however, imperfect in that it requires a specific arrangement of the device, in which the conductive bars are offset to be brought into the recess. This solution therefore necessitates the manufacture of complex and specific parts and results in high production costs. These production costs are all the higher since the conductive bars are generally made of copper.

[0011] The present invention aims to thermally protect the components of an inverter by resolving all or part of the problems indicated above. In particular, the invention aims to limit the heat exchanged between two components and transmitted through the terminals of these components. Description of the invention

[0012] To this end, according to a first aspect of the invention, an inverter housing is proposed for receiving at least one power electronics component of an inverter, the housing having walls defining a receiving volume for at least one power electronics component.

[0013] The inverter housing includes at least one pad extending outward from an internal surface of the walls into the receiving volume, at least one pad being thermally conductive and adapted to drain heat to an inverter cooling system, at least one pad being configured so that, when at least one component is received into the receiving volume, a terminal of that at least one power electronics component or a conductive bar electrically connected to the terminal of the power electronics component is opposite a free end of the pad at a predefined distance so that a thermally conductive interface element can be interposed between the free end of the pad and the terminal of the power electronics component or the conductive bar.

[0014] The term "power electronics component" refers, in the context of an inverter, to any component of that inverter through which an electric current flows. For example, such a power electronics component could be a power module, a capacitor, an electronic board or even a filter, for example an EMC filter.

[0015] The term “terminal” refers to a component, usually metallic, which allows current to enter or leave an electronic component.

[0016] The term “thermally conductive” refers to an element having a thermal conductivity greater than or equal to IW / mK.

[0017] In the inverter housing according to the invention, the pad is positioned so that, when a power electronics component is received in the receiving volume, it is located opposite, or near, a terminal of that component. The pad may also be located opposite a conductive bar, also called a busbar, which is electrically connected to the terminal of the power electronics component. Such a conductive bar serves, in particular, to conduct an electric current and to electrically interconnect several components of the inverter, or a component of the inverter with a component external to the inverter.

[0018] When the component is received in the receiving volume, the pad fills part of the space separating the terminal or conductive bar from the internal surface at the location of this pad. The remaining part of this space, i.e., the distance between the free end of the pad and the terminal or conductive bar, is intended to be filled by a thermally conductive interface element.

[0019] The interface element ensures thermal conduction between the terminal or conductive bar and the pad. Thus, the pad brings a thermally conductive surface close to a terminal of a power electronics component or a conductive bar in order to dissipate the heat generated by this terminal towards the housing walls. Therefore, thanks to the pad, at least some of the heat from the terminal or conductive bar is dissipated to the housing's cooling system.

[0020] This limits the heat exchange, transmitted via such terminals, between two components connected by these terminals. Thanks to the stud, the housing is adaptable to different components having, for example, terminals of different shapes. In fact, such a housing eliminates the need for any structural modification of the components, and in particular of the terminals.

[0021] When the pad is electrically conductive, which may be the case depending on the material in which it is made, the interface element ensures, in addition to thermal conduction, electrical insulation between the pad and the terminal.

[0022] The invention may optionally include one or more of the following features, combined or not.

[0023] At least one pad may be made of aluminum or aluminum alloy. Aluminum has many advantages, including high thermal conductivity, The thermal conductivity is approximately 226 W / mK (watts per meter-kelvin) compared to 0.025 W / mK for air, and the density is relatively low. Therefore, an aluminum pad allows for improved heat transfer while limiting the mass of the inverter housing.

[0024] At least one pad can be integral with the inverter housing. Since housings are generally molded, preferably by die casting, only the mold needs to be adapted for manufacturing such a housing. This type of molding allows, in particular, the production of housings made of aluminum or aluminum alloy. This arrangement also allows for improved heat transfer compared to a pad that would be attached to the housing, because there is no interface between these two elements.

[0025] The stud can be made of the same material as the housing, the housing preferably being made of aluminium or aluminium alloy.

[0026] At least one pad may have a substantially constant cross-sectional area of ​​less than 300 mm², preferably less than 260 mm². In parts obtained by die casting, one of the most common causes of porosity is uneven cooling of the part inside the mold. Indeed, the material in contact with the mold walls cools more rapidly than the material furthest from the walls. It has been observed that by limiting the pad cross-section to 300 mm², the porosity rate is reduced compared to pads with a larger cross-section. The risk of leakage, whether of gas or liquid, is also reduced.

[0027] At least one block may have a cross-section that is generally square, rectangular, circular, oblong, or T-shaped, L-shaped or cross-shaped, or a combination of several of these shapes.

[0028] At least one pad may be at least partially covered by an electrically insulating outer layer, the interface element comprising said electrically insulating outer layer. Such a layer may be obtained as a result of a surface treatment, for example, anodizing or coating with an electrically insulating material. It is easier to perform this treatment on at least one pad, or even on the entire housing, rather than on a terminal of the component, since the housing generally accommodates several components, each having several terminals. Such a layer contributes to the electrical insulation between the pad and the terminal, without significantly increasing the manufacturing and / or preparation time of the inverter housing.

[0029] The cooling system may include a chamber formed in the inverter housing and adapted for the circulation of a cooling fluid, the chamber being located under a receiving area of ​​at least one power electronics component to be cooled. Such a cooling system may allow the transfer of some of the heat generated by the component away from the inverter. The at least one This feature allows for the transfer of another portion of the heat generated by the component and transmitted through the terminal to the cooling system. This results in a greater amount of heat transferred to the cooling system and more efficient overall heat dissipation.

[0030] Advantageously, the inverter housing may have two pads arranged on either side of the receiving area so that the free ends of these pads are intended to be opposite each other at a predefined distance from the terminals of the power electronics component, said terminals being located on opposite sides of the power electronics component.

[0031] The invention also relates, according to a second aspect, to an inverter comprising an inverter housing as described above, at least one power electronics component housed in the receiving volume and a thermally interposed conductive interface element maintained in contact between a free end of at least one pad and a terminal of at least one power electronics component or a conductive bar electrically connected to the terminal of the power electronics component, the interface element ensuring thermal conduction between the terminal of the power electronics component or the conductive bar and the pad.

[0032] Such an inverter has advantages similar to those described previously in relation to the inverter housing.

[0033] The interface element may comprise a flexible solid body. The term "flexible solid body" refers to an element that is relatively firm and not liquid, while being relatively flexible, in particular deformable under the weight of a power electronics component.

[0034] This body compensates for assembly gaps and surface irregularities by deforming slightly. Due to its deformable nature, the body also maintains contact between the terminal and the pad despite deformations caused by the thermal expansion of the terminal and / or pad materials. In other words, the body absorbs such deformations while ensuring contact between the pin and the terminal. The flexible solid body can be a hardened thermal paste, preferably made from silicone. Thermal paste, also known as "gap filler," is generally more flexible than the outer layer. As a result, the thermal paste can deform more under the weight of the component and have a larger contact surface, thus enabling satisfactory heat transfer between the terminal and the interface element. Over time, the thermal layer polymerizes but remains relatively flexible.

[0035] Alternatively, the flexible solid body can be a thermal foam. Such a foam has the ability to be deformed and to return to its original shape. In addition, this foam helps to dampen vibrations, at least partially.

[0036] Alternatively, the flexible solid body can be a silicone-coated plate, also referred to by the English term "gap pad".

[0037] Alternatively, the flexible solid body can be an adhesive.

[0038] The interface element may comprise both the electrically insulating outer layer and a flexible solid body, among the alternatives described above. Such an arrangement is particularly useful when the pad is electrically conductive and the flexible solid body is not perfectly electrically insulating. This also allows for a reduction in the height, or thickness, of the flexible solid body.

[0039] The ratio between the height of the pad and the height of the interface element along an extension axis of the pad can be greater than one, preferably approximately two. In other words, the height of the pad is preferably twice the height of the interface element along the extension axis of the pad. It has been found that the rigidity and mechanical strength of the assembly formed by the pad, the interface element, and the component are improved when the height of the pad is greater than the height of the interface element (when the ratio is greater than one). It has also been found that, in addition to improving the rigidity and mechanical strength of this assembly, the assembly of the component and the manufacturing of the inverter are facilitated when the height of the pad is approximately twice the height of the interface element.

[0040] The height of the interface element along an extension axis of the pad can be between 0.5 mm and 6 mm, preferably between 3 mm and 5 mm.

[0041] The component may have at least one input terminal, i.e., the terminal through which current enters the component, with at least one distinct pad associated with each input terminal. The component may also have at least one output terminal, i.e., the terminal through which current exits the component, with at least one distinct pad associated with each output terminal. As previously described, one of the most common causes of porosity is uneven cooling of the part inside the mold. This helps prevent massive blockages in the housing, either when a component has multiple terminals or when the housing contains multiple components, each with at least one terminal.

[0042] Preferably, the inverter may comprise three components, each having three input terminals and one output terminal. Such an arrangement is generally implemented for a three-phase inverter. In this case, the components are power modules. In particular, in this arrangement, the inverter housing has at least nine separate terminals associated with the input terminals and at least three separate terminals associated with the output terminals.

[0043] Two separate pads can be associated with one of the input terminals of each of the components and a separate pad can be associated with each of the other input terminals and the output terminal. In this arrangement, the inverter housing has twelve separate pads associated with the input terminals and at least three separate pads associated with the output terminals. As described previously, such an arrangement further reduces the porosity of the inverter housing.

[0044] The invention also relates, in a third aspect, to a method for manufacturing an inverter. The method comprises: • a step involving the supply of an inverter housing as described above, • a step of depositing the interface element onto the free end of at least one pad, and • a step of positioning a terminal of the power electronics component or the conductive bar on the interface element.

[0045] Such a method has advantages similar to those described above in relation to the inverter housing and the inverter.

[0046] The interface element may comprise a flexible solid body. The deposition step may then comprise the deposition of at least two superimposed layers of the flexible solid body of the interface element. The flexible body may be deposited in a paste-like form.

[0047] To achieve the desired height of the interface element, depositing two thin layers, each less than the desired height, rather than a single layer with the desired height, prevents the body from spreading. This results in better mechanical strength of the body and therefore of the interface element.

[0048] The positioning step can be followed by a polymerization step of the flexible body, in particular when the flexible body is deposited in paste form. BRIEF DESCRIPTIONS OF THE FIGURES

[0049] The invention, according to an exemplary embodiment, will be well understood and its advantages will be more apparent upon reading the following detailed description, given by way of example and not limiting in any way, with reference to the attached drawings.

[0050] Fig. 1 represents, in a very schematic view, an electric or hybrid motor vehicle comprising an electric machine, a battery and an inverter according to an embodiment of the invention.

[0051] Fig.2 is a cross-sectional view of the inverter of Fig.1, the inverter comprising a housing according to a first embodiment.

[0052] Fig. 3 is a partial top view of a housing according to a second embodiment, showing a receiving area for a first power electronics component.

[0053] Fig. 4 is a partial perspective view of the housing of Fig. 3, showing a receiving area of ​​a second power electronics component.

[0054] Fig. 5 is a diagram illustrating a method for manufacturing an inverter according to the invention. DETAILED DESCRIPTION

[0055] Figure 1 schematically represents a motor vehicle 1 which is, for example, hybrid or electric. The vehicle 1 comprises an electric machine 2, a battery 3 and an inverter 4 electrically connected to the electric machine 2 and to the battery 3.

[0056] The electric machine 2 is configured to propel the vehicle 1.

[0057] The inverter 4 is configured to generate an alternating voltage suitable for the operation of the electrical machine 2 from a direct voltage supplied by the battery 3.

[0058] The inverter 4, according to a first embodiment, is more clearly visible in [Fig.2],

[0059] The inverter 4 includes a housing 41, or casing, configured to house inverter components. The housing 41 has walls 411 having an internal surface 412 and an external surface 413 opposite the internal surface 412.

[0060] The walls 411 define, on the side of the internal surface 412, a receiving volume V for the components of the inverter 4. The walls 411 also define an opening O allowing access to the receiving volume V, for example for the assembly of the components.

[0061] The housing 41 is adapted to be mechanically connected to a housing of the electrical machine 2. The opening O is intended to be turned towards the electrical machine 2 when the housing 41 of the inverter 4 is mechanically connected to the housing of the electrical machine 2, so that the components of the inverter and the components of the electrical machine can be interconnected.

[0062] The opening O is for example bordered by a sealing element (not shown) which is intended to ensure the sealing of the receiving volume V when the housing 41 is mechanically connected to the housing (not shown) of the electrical machine 2.

[0063] The housing 41 is for example made of aluminium, or of aluminium alloy.

[0064] In the example illustrated in [Fig. 2], the walls 411 of the housing 2 define, at inside the receiving volume V, a first receiving zone ZM for a component of the inverter 4. The walls 411 of the housing 2 also define, in the vicinity of the first receiving zone ZM, a second receiving zone Zc for another component of the inverter 4.

[0065] The inverter 4 includes a cooling system 44. The cooling system 44 is configured to cool a component of the inverter 4 located in the first receiving zone ZM. The cooling system 44 is also configured to cool the walls 411 of the housing 41.

[0066] The cooling system 44 includes a thermally conductive plate 441, fixed to the internal surface 412 of the walls 411 and defining, with this internal surface, a sealed chamber 442.

[0067] For this purpose, the housing 41 includes a sealing gasket 45 positioned between the plate 441 and the internal surface 412.

[0068] The sealed chamber 442 is adapted for the circulation of a cooling fluid, for example a coolant such as water. The chamber 442 is, for example, connected to a cooling circuit (not shown) comprising a heat exchanger, through which the cooling fluid circulates.

[0069] The plate 441 is configured to drain heat into the chamber 442. In particular, the plate 441 has a first substantially flat face 443 and a second face 444, opposite the first face, provided, on at least a portion of this face, with several thermally conductive fins 445. The first face 443 of the plate 441 is oriented towards the opening O of the housing 41 and the second face 444 is oriented towards the inner surface 412 of the walls 411, so that the fins 445 extend into the sealed chamber 442. These fins 445 are arranged so as to be in contact with the cooling fluid in order to transfer the drained heat to the cooling fluid.

[0070] The housing 41 has pads 47 projecting from the inner surface 412 of the housing 41 into the receiving volume V. The pads 47 are thermally conductive and adapted to drain heat to the cooling system 44 of the inverter 4. In particular, each pad 47 is configured to drain the heat generated at a terminal of a component of the inverter.

[0071] The pads 47 are arranged, in [Fig.2], on either side of the first receiving zone ZM. In particular, [Fig.2] represents a first pad 47a, located to the left of the first receiving zone ZM in [Fig.2], and a second pad 47b, located to the right of the receiving zone ZM in [Fig.2].

[0072] Each of these studs 47a, 47b has a connecting end 471a, 471b attached to the walls 411 and a free end 472a, 472b which is distal to the connecting end 471a, 471b. The free ends 472a, 472b of the studs 47 are relatively flat and here belong to the same plane.

[0073] Each stud 47 has a height, along an extension axis of the stud, of between 1 mm and 12 mm. This height corresponds to the distance between the connecting end 471 and the free end 472. The extension axis of the stud is here perpendicular to the internal surface 412.

[0074] In particular, the height of the first stud 47a corresponds to the distance between the internal surface 412 located directly to the right of this first stud 47a on [Fig. 2] and its free end 472a, while the height of the second stud 47b corresponds to the distance between the internal surface 412 located on either side of this second stud 47b on the [Fig.2] and its free end 472b.

[0075] The studs 47 have a substantially constant cross-section over their entire height. This cross-section has, for example, an area between 4 mm² and 300 mm², preferably between 10 mm² and 260 mm², and even more preferably between 16 mm² and 256 mm². The cross-section is, for example, generally square in shape.

[0076] The studs 47 are for example made of aluminium, or aluminium alloy.

[0077] The studs 47 are here in one piece with the housing 4.

[0078] The inverter 4 further comprises a first power electronics component 42, a second power electronics component 43 and an electrical connector 46.

[0079] The first power electronics component 42 is, for example, a power module comprising power switches whose openings and closings are appropriately controlled to generate, from a direct voltage, an alternating voltage of predetermined frequency.

[0080] The first power electronics component 42 is received in the first receiving zone ZM of the housing 4L

[0081] The first power electronics component 42 has an input terminal 421 and an output terminal 422. For example, the input terminal 421 is intended to be electrically connected to a component supplying a DC voltage, such as the second power electronics component 43, while the output terminal 422 is intended to be electrically connected to a component receiving an AC voltage, such as the electric machine 2.

[0082] The electrical connector 46 is for example a conductive bar intended to electrically connect the first power electronics component 42 to the electrical machine 2.

[0083] The second power electronics component 42 is for example formed by a set of capacitors configured to smooth the DC voltage supplied by the battery 3.

[0084] The second power electronics component 43 is received in the second receiving zone Zc of the housing 4L

[0085] The second power electronics component 43 has an input terminal (not shown) and an output terminal 432. For example, the input terminal is intended to be electrically connected to a component supplying a DC voltage, such as the battery 3 or an inverter filter, and the output terminal 432 is intended to be electrically connected to a component receiving a DC voltage, such as the first power electronics component 42.

[0086] The inverter 4 includes an interface element 48 configured to form a thermally conductive interface and, for example, electrical insulation between the terminals of the components of the inverter 4, in particular the first power electronics component 42 and the second power electronics component 43, and the free end 472 of the pads 47.

[0087] The interface element 48 comprises a body that is both solid and flexible. This body is a thermal paste, preferably made from silicone. The thermal paste has, for example, a thermal conductivity between 1W / mK and 100W / mK, for example approximately equal to 4W / mK. The thermal paste is capable of polymerizing, but nevertheless remains relatively flexible, particularly under the effect of the weight of the components.

[0088] In the present embodiment of the inverter 4, the first power electronics component 42 is positioned on the first face 443 of the cooling system plate 441. In this way, some of the heat generated by the first power electronics component 42 is transferred to the cooling system 44.

[0089] The input terminal 421 of the first power electronics component 42 is opposite the free end 472a of the first pad 47a. The output terminal 422 of the first power electronics component 42 is opposite the free end 472b of the second pad 47b.

[0090] The output terminal 432 of the second power electronics component 43 is opposite the free end 472a of the first pin 47a.

[0091] The input terminal 421 of the first power electronics component 42 and the output terminal of the second power electronics component 43 are superimposed and fixed to each other, for example by laser welding, to establish their electrical connection.

[0092] The electrical connector 46 is opposite the free end 472b of the second pin 47b.

[0093] The output terminal 422 of the first power electronics component 42 and the electrical connector 46 are superimposed and in contact with each other to establish their electrical connection. The output terminal 422 and the electrical connector 46 are, for example, fixed to each other, for example by laser welding.

[0094] The interface element 48 is arranged, in [Fig.2], at the level of the first pad 47a and at the level of the second pad 47b. In particular, [Fig.2] represents a first interface element 48a, located on the first pad 47a, and a second interface element 48b, located on the second pad 47b.

[0095] The first interface element 48a is interposed and held in contact between the free end 472a of the first pin 47a and one of the output terminals 432 and the input terminal 421, depending on whether output terminal 432 is located above or below input terminal 421.

[0096] The second interface element 48b is interposed and kept in contact between the free end 472b of the second pin 47b and one of the output terminal 422 and the electrical connector 46, depending on whether the output terminal 422 is located above or below the electrical connector 46.

[0097] The body of the interface element 48 is for example disposed on the free end 472 of each pad 47.

[0098] The interface element 48 is slightly compressed between the free end 472 of each pad 47 and the associated terminals. Each interface element 48 has a height, once compressed and along an extension axis of the pad 47 on which this interface element 48 is disposed, of between 0.5 mm and 6 mm. Preferably, the height of the interface element 48 is between 3 mm and 5 mm.

[0099] The ratio between the height of each plot 47 and the height of the interface element 48 arranged on this plot 47 is greater than one, preferably substantially equal to two.

[0100] Figure 3 shows an inverter housing according to a second embodiment. In this figure, the cooling system plate and the sealing gasket are not shown.

[0101] The housing 41 according to the second embodiment is for example adapted for a three-phase inverter.

[0102] The housing 41 according to the second embodiment is intended to receive three first power electronics components 42 each having three input terminals 421 and one output terminal 422.

[0103] The walls 411 of the housing 41 define a first receiving zone ZM configured to receive the first three power electronics components 42. The first receiving zone ZM is generally elongated and extends along a direction XX, referred to as the alignment direction. The first power electronics components 42 are intended to be aligned along the alignment direction XX so that the input terminals 421 and the output terminals 422 are aligned with each other.

[0104] In this embodiment, the studs 47 are arranged according to a first series Si arranged on one side of the receiving zone ZM and a second series S2 arranged on the other side of the first receiving zone.

[0105] The first series Si and the second series S2 are parallel to the alignment direction XX.

[0106] The pads 47a, 47c of the first series Si are configured so that, when the first power electronics components 42 are received in the first receiving zone ZM, each input terminal 421 is opposite at least one pad 47a or 47c of this first series Si.

[0107] In particular, the first series Si comprises studs 47a, 47c of different sections, namely single studs 47a and double studs 47c. Each double stud 47c is formed by two distinct studs, each having a cross-section, for example square, whose area is less than the area of ​​a cross-section of a single stud 47a, which has a substantially rectangular cross-section.

[0108] The first series Si has, along the alignment direction XX, an alternation of single studs 47a and double studs 47c. In particular, the first series Si comprises nine distinct studs 47a, 47c, of which six are single studs 47a and three are double studs 47c.

[0109] The pads 47b of the second series S2 are configured so that, when the first power electronics components 42 are received in the first receiving zone ZM, each output terminal 422 is opposite a pad 47b of this second series S2.

[0110] In particular, the second series S2 comprises three distinct studs 47b. These studs 47b have a substantially oblong cross-section whose longest axis is parallel to the alignment direction XX.

[0111] Figure 4 shows the second receiving zone Zc of the inverter housing according to the second embodiment. Part of the first series Si of studs 47a, 47c is visible on the left of this figure. The first series Si is arranged along one side of the second receiving zone Zc. The inverter housing 41 has studs 57 on one side of the second receiving zone Zc that is opposite the side where the first series Si of studs 47 is located.

[0112] Each pin 57 is configured for example to be opposite at a predefined distance from an input terminal (not shown) of the second power electronics component.

[0113] Unlike the studs 47 of the first series Si or of the second series S2 described with reference to [Fig.3], the studs 57 have a T-shaped cross-section. The studs 57 have, like the studs 47, a substantially constant cross-section of less than 300 mm2, preferably less than 260 mm2.

[0114] Figure 5 illustrates a manufacturing method 100 for the inverter 4. The manufacturing method 100 includes a step 101 of supplying a housing according to the first embodiment or according to the second embodiment. The housing is, for example, made by molding, preferably by die casting, from aluminum or aluminum alloy.

[0115] The manufacturing process 100 then includes a step 102 of depositing the interface element onto the free end of the pads. The deposition step 102 includes, for example, the deposition of two superimposed layers of the body of the interface element, namely the thermal paste.

[0116] The manufacturing process 100 finally includes a step 103 of positioning the terminals of a first power electronics component and / or the terminals of a second power electronics component on the interface element. Preferably, the first power electronics component and / or the second power electronics component are merely deposited on the interface element; that is, they press on the interface element only by the effect of their weight.

[0117] Of course, various modifications can be made by a person skilled in the art to the invention which has just been described without going out of the scope of the disclosure of the invention.

[0118] The housing can be produced using another manufacturing process. Alternatively, the housing is produced by additive manufacturing, more commonly known as 3D printing.

[0119] The structure of the housing can vary. In one alternative, the housing has more or fewer studs. In another alternative, each stud has a different cross-sectional shape or a different height.

[0120] According to an alternative not shown, the studs are attached to the housing, for example by gluing, welding, screwing, press-fitting, or any other known method of fastening between two elements. In this case, the studs may be made from a material different from that of the housing. For example, the studs may be made from a metallic material other than aluminum, such as copper.

[0121] The structure of the cooling system may vary. Alternatively, the cooling system is external to the housing. Alternatively, the cooling system is formed by the external surface of the housing in contact with the ambient air.

[0122] The interface element may vary. Alternatively, the interface element may have an electrically insulating outer layer. The layer is obtained, for example, by a surface treatment, such as anodizing. In this case, the body of the interface element is an alumina layer. Alternatively, the layer is obtained by spraying or coating with an electrically insulating material.

[0123] According to these variants, the deposition step includes a sub-step of surface treatment, spraying or coating.

[0124] Alternatively, the interface element comprises two superimposed bodies, namely a first body and a second body. In this case, the first body is, for example, an electrically insulating outer layer as described above, and the second body is a thermal paste as previously described. In this case, the second body is interposed between the first body and the terminals.

[0125] According to this variant, the deposition step comprises a sub-step of surface treatment, spraying or coating, followed by the deposition of two layers of the second body.

[0126] The inverter structure may vary. Alternatively, the inverter comprises a single power electronics component. Alternatively, the inverter may contain more than two power electronics components.

[0127] According to an unrepresented embodiment, one of the first and second power electronics components is a power module, a capacitor, a circuit board, or a filter, for example, an EMC filter. The structure of the components may vary. In an alternative embodiment, the power electronics components have only one input terminal or only one output terminal. In another alternative embodiment, the components have more than one input terminal and / or more than one output terminal.

[0128] In an unrepresented variant, the first power electronics component and the second power electronics component are mounted on an electronic board.

[0129] The invention thus developed makes it possible to drain some of the heat released by the components of an inverter, while also facilitating the assembly of these components. The inverter housing according to the invention is simple to manufacture. Indeed, its manufacture requires very few modifications compared to housings manufactured to date. Furthermore, the manufacture of the inverter according to the invention can be automated.

[0130] Although in the above description the particular aspects of the invention, in particular the implementation of the inverter, have been described in the context of a motor vehicle, the latter could be implemented in other configurations, in particular with other types of vehicles.

Claims

Demands

1. Inverter housing for receiving at least one power electronics component (42, 43) of an inverter (4), the housing (41) having walls (411) defining a receiving volume (V) for the at least one power electronics component (42, 43), characterized in that it has at least one pad (47, 57) projecting from an internal surface (412) of the walls (411) into the receiving volume (V), the at least one pad (47, 57) being thermally conductive and adapted to drain heat to a cooling system (44) of the inverter (4), the at least one pad (47, 57) being configured so that, when the at least one component is received into the receiving volume (V), a terminal (421, 422, 432) of this at least one power electronics component (42, 43) or a conductive bar electrically connected to the terminal (421, 422, 432) of the power electronics component (42) is opposite a free end (472) of the pad (47,57) at a predefined distance so that a thermally conductive interface element (48) can be interposed between the free end (472) of the pad (47, 57) and the terminal (421, 422, 432) of the power electronics component (42, 43) or the conductive bar.

2. Inverter housing according to claim 1, characterized in that at least one pad (47, 57) is integral with the inverter housing (41).

3. Inverter housing according to any one of claims 1 or 2, characterized in that the pad (47, 57) is made of the same material as the housing (41), the housing (41) preferably being made of aluminium or aluminium alloy.

4. Inverter housing according to any one of claims 1 to 3, characterized in that at least one pad (47, 57) is covered at least partially with an external electrically insulating layer, the interface element (48) comprising said external electrically insulating layer.

5. Inverter housing according to any one of claims 1 to 4, characterized in that at least one pad (47, 57) has a substantially constant cross-section of less than 300 mm2, preferably less than 260 mm2.

6. Inverter housing according to any one of claims 1 to 5, ca- characterized in that the cooling system (44) includes a chamber (442) provided in the inverter housing (41) and adapted for the circulation of a cooling fluid, the chamber (442) being disposed under a receiving zone (ZM) of at least one power electronics component (42) to be cooled.

7. Inverter housing according to claim 6, characterized in that it comprises two pads (47) arranged on either side of the receiving zone (ZM) of the power electronics component (42) such that the free ends (472) of these pads (47) are intended to be opposite each other at a predetermined distance from terminals (421, 422) of the power electronics component (42), said terminals (421, 422) being located on opposite sides of the power electronics component (42).

8. Inverter comprising an inverter housing according to any one of claims 1 to 7, at least one power electronics component (42, 43) housed in the receiving volume (V) and a thermally interposed conductive interface element (48) maintained in contact between a free end (472) of at least one pad (47, 57) and a terminal (421, 422, 432) of at least one power electronics component (42, 43) or a conductive bar electrically connected to the terminal of at least one component, the interface element (48) ensuring thermal conduction between the terminal (421, 422, 432) of the power electronics component (42, 43) or the conductive bar and the pad (47, 57).

9. Inverter according to claim 8, characterized in that the interface element (48) comprises a flexible solid body.

10. Inverter according to claim 9, characterized in that the flexible solid body is a hardened thermal paste, preferably made from silicone.

11. Inverter according to any one of claims 8 to 10, characterized in that the ratio between a height of the pad (47, 57) with respect to a height of the interface element (48) along an extension axis of the pad (47, 57) is greater than one, preferably substantially equal to two.

12. Inverter according to any one of claims 8 to 11, characterized in that the interface element (48) has a height, along an extension axis of the pad (47, 57), of between 0.5 mm and 6 mm, preferably between 3 mm and 5 mm.

13. A method for manufacturing an inverter, comprising: • a step of supplying (101) an inverter housing (41) according to any one of claims 1 to 7, • a step of depositing (102) the interface element (48) onto the free end of at least one pad (47, 57), and • a positioning step (103) of a terminal (421, 422, 432) of the power electronics component (42, 43) or of the conductive bar on the interface element (48).

14. A manufacturing method according to claim 13 in which the interface element (48) comprises a flexible solid body, characterized in that the deposition step (102) comprises the deposition of at least two superimposed layers of the flexible solid body of the interface element (48).

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