SILICA GEL COEXTRUSION MOLD FOR LED LIGHT STRIP, AND LED LIGHT STRIP

Abstract

The present utility model provides a silica gel coextrusion mold for an LED light strip, and an LED light strip. The mold comprises: obtaining an elongated compound, the elongated compound comprising a light-blocking compound and a diffusion compound; respectively introducing the light-blocking compound, the diffusion compound, and a printed circuit board with a light bead into the light-blocking compound channels, the diffusion compound channel, and the printed circuit board channel in the mold, and extruding the introduced light-blocking and diffusion compounds toward a silica gel strip outlet by means of silica gel coextrusion, so as to form the light-blocking compound and the diffusion compound on the printed circuit board to obtain a silica gel strip. [FIGURE 2]

Description

Title of the invention: COEXTRUSION MOLD SILICA GEL FOR LED LIGHT STRIP, AND LED LIGHT STRIP Technical field

[0001] The present utility model relates to the technical field of light strip packaging, and in particular to a silica gel coextrusion mold for an LED light strip, and an LED light strip. Prior art

[0002] Currently, in a production process for packaging LED light strips on the market, dosing is generally used to protect LED dies and bonding wires by means of epoxy resin. The shape of a cured colloid directly affects the brightness, luminous efficiency and luminous uniformity of a finished light source. A flexible light strip using COB or CSP flip-chip LEDs suffers from the following problems: the light strip has low luminous efficiency and average uniformity, and cannot continue to be used in an extremely narrow space or a space with strong weather resistance. For prior art surface-mounted devices, it takes a long time to cure a colloid, it is difficult to ensure uniformity, and the production length is limited. SUMMARY

[0003] In view of this, the present utility model provides technical solutions of a silica gel coextrusion mold for an LED light strip and an LED light strip.

[0004] In a first aspect, the present utility model provides a silica gel coextrusion mold for an LED light strip, comprising a coextrusion part and a printed circuit board feeding part, wherein light blocking compound channels, a diffusion compound channel, and a silica gel strip outlet are provided in the coextrusion part; the light blocking compound channels and the diffusion compound channel are provided on a mounting surface of the coextrusion part, and the silica gel strip outlet is provided in an outlet surface of the coextrusion part;the printed circuit board feed portion is connected perpendicular to the mounting surface of the coextrusion portion, a printed circuit board channel is provided inside the printed circuit board feed portion and the coextrusion portion, and the printed circuit board channel is perpendicular to the mounting surface and passes through the portion; circuit board feeder and the coextrusion portion; and the light-blocking compound channels, the diffusion compound channel, and the circuit board channel all reach a mounting position before reaching the silica gel tape outlet, and respectively coextrude a light-blocking compound, a diffusion compound, and a circuit board to the silica gel tape outlet to form a silica gel tape.

[0005] Preferably, the printed circuit board feed portion further has an air inlet opening in communication with the silica gel strip outlet.

[0006] Preferably, one end of the printed circuit board feed portion remote from the coextrusion portion is provided with an external thread.

[0007] Preferably, an insertion structure inserted into the coextrusion portion and reaching the silica gel strip outlet is provided at one end of the printed circuit board feeding portion close to the coextrusion portion;

[0008] and / or threaded holes passing through the outlet surface for fixing the coextrusion part are further distributed in the mounting surface of the coextrusion part;

[0009] and / or a cutting line compound inlet is further provided in the mounting surface of the coextrusion portion, and the cutting line compound inlet is in communication with the mounting position so as to be mounted at the bottom of the printed circuit board during coextrusion.

[0010] Preferably, the light-blocking compound channels are distributed on two sides of the circuit board channel, the diffusion compound channel is distributed above the circuit board channel, the light-blocking compound channels are respectively located on two sides of the circuit board channel when reaching the mounting position, so that the light-blocking compounds in the light-blocking compound channels block light emitted by a light bead, and the diffusion compound channel is located above the circuit board channel, where a portion above the circuit board channel is above a position where the light bead of the circuit board is located, so that the diffusion compound in the diffusion compound channel allows diffusion and propagation of light emitted by the light bead.

[0011] Preferably, the cut line compound inlet is provided in the mounting surface of the coextrusion portion, and is located under each of the two sides of the printed circuit board channel.

[0012] Preferably, a transparent cutting line compound enters through the cutting line compound inlet, then rises to a certain height, then rises by means of an inclined surface and leads near a lower surface of the card channel. circuit board to facilitate mounting to the bottom surface of the circuit board.

[0013] In a second aspect, the present utility model provides an LED light strip, wherein the LED light strip is prepared by a silica gel coextrusion method for an LED light strip as described above; or the LED light strip is prepared by using a silica gel coextrusion mold for an LED light strip as described above.

[0014] Compared to the prior art, the present utility model has at least the following beneficial effects:

[0015] 1) the light blocking compound and the supplied scattering compound are formed on the printed circuit board by silica gel coextrusion of the light-blocking compound and the diffusion compound to obtain a silica gel strip, and the silica gel strip extruded from the mold is heated and shaped to obtain an LED light strip, so that the curing time of a colloid can be reduced, and the LED light strip has good luminous uniformity;

[0016] 2) with silica gel coextrusion, the length of the LED light strip obtained is significantly increased;

[0017] 3) the mold according to the embodiment of the present utility model is provided with the coextrusion portion and the circuit board feeding portion arranged perpendicularly, which can ensure the stability of the circuit board feeding, and enables a silica gel to be stably formed on a circuit board during silica gel coextrusion; and

[0018] 4) provision of the air inlet opening in the card power supply part of printed circuit board can prevent swelling during coextrusion, to avoid collapse of possible hollow part in silica gel strip. Brief description of the drawings

[0019] The objectives, characteristics and advantages of the present utility model will be clearer from the following description of the embodiments of the present utility model with reference to the accompanying drawings, in which:

[0020] [Fig.l] is a structural diagram of an exit surface of a silica gel coextrusion mold for an LED light strip according to one embodiment of the present utility model;

[0021] [Fig.2] is a mounting surface diagram of a silica gel coextrusion mold for an LED light strip according to one embodiment of the present utility model;

[0022] [Fig.3] is a structural diagram of an overall cross-section of a mold silica gel coextrusion for an LED light strip according to one embodiment of the present utility model;

[0023] [Fig.4] is a structural diagram of a second cross-section of a mold silica gel coextrusion for an LED light strip according to an embodiment of the present utility model taken through a cutting line compound inlet;

[0024] [Fig.5] is a structural diagram of a third cross-section of a mold silica gel coextrusion for an LED light strip according to an embodiment of the present utility model with respect to a light-blocking compound channel and a diffusion compound channel; and

[0025] [Fig.6] is a flowchart of a silica gel coextrusion process for a LED light strip according to one embodiment of the present utility model. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0026] The present utility model is described below on the basis of embodiments, but it should be noted that the present utility model is not limited to these embodiments. In the following detailed description of the present utility model, some specific details are described in detail. However, for the parts which are not described in detail, those skilled in the art can fully understand the present utility model.

[0027] Furthermore, it should be understood by those skilled in the art that the drawings provided serve only to illustrate the objectives, features and advantages of the present utility model, and the drawings are not actually to scale.

[0028] Furthermore, unless explicitly required by the context, similar words such as "include" and "contain" throughout the description and claims should be interpreted as inclusive rather than exclusive or exhaustive. In other words, the words mean "including, but not limited to."

[0029] In one aspect of an embodiment of the present utility model, a silica gel coextrusion mold for an LED light strip is further provided, and as illustrated in FIGS. 1 and 2, comprises a coextrusion part 10 and a printed circuit board supply part 20. Light-blocking compound channels 101, a diffusion compound channel 102, and a silica gel strip outlet 103 are provided in the coextrusion part 10. The light-blocking compound channels 101 and the diffusion compound channel 102 are provided on a mounting surface 105 of the coextrusion part 10, and the silica gel strip outlet 103 is provided on an outlet surface 104 of the coextrusion part 10. The printed circuit board supply part 20 is connected perpendicularly to the mounting surface 105 of the coextrusion part 10. A circuit board channel A printed circuit board channel 201 is provided in the printed circuit board feed portion 20 and the coextrusion portion 10, and the printed circuit board channel 201 is perpendicular to the mounting surface 105 and passes through the printed circuit board feed portion 20 and the coextrusion portion 10. The light-blocking compound channels 101, the diffusion compound channel 102, and the printed circuit board channel 201 all reach the same mounting position before reaching the silica gel tape outlet 103, and respectively coextrude a light-blocking compound, a diffusion compound, and a printed circuit board at the silica gel tape outlet 103 to form a silica gel tape.

[0030] Since the above-described mold according to the embodiment of the present utility model uses silica gel coextrusion, the length of the obtained LED light strip is significantly increased, and the LED light strip has better luminous uniformity. The LED light strip obtained by the above method can have a thickness of up to 1.5 ± 0.3 mm and a transmittance of up to 90%. The mold has the coextrusion portion 10 and the circuit board feeding portion 20 arranged perpendicularly, which can ensure the stability of the feeding of the circuit board and enables a silica gel to be stably formed on a circuit board during the silica gel coextrusion.

[0031] In a preferred implementation, the printed circuit board feed portion 20 further has an air inlet opening 203 in communication with the silica gel strip outlet 103. The provision of the air inlet opening 203 can prevent inflation during coextrusion to avoid collapse of a possible hollow portion in the silica gel strip. The air inlet opening 203 and the printed circuit board channel 201 may be provided together, or may be provided separately.

[0032] In a preferred implementation, one end of the printed circuit board feed portion 20 remote from the coextrusion portion 10 is provided with an external thread 202. The external thread 202 may be configured to connect a head (not shown) for feeding a compound, and the other end of the head is connected to a compound mixing device (not shown). Light-blocking and scattering compounds may be obtained using the compound mixing device.

[0033] In a preferred implementation, an insertion structure 204 inserted into the coextrusion portion 10 and reaching the silica gel strip outlet 103 is provided at one end of the printed circuit board feed portion 20 close to the coextrusion portion 10.

[0034] In a preferred implementation, threaded holes 106 that pass through the outlet surface 104 to secure the coextrusion portion 10 are further distributed in the surface mounting 105 of the coextrusion part 10, in order to facilitate the mounting of the coextrusion part 10 on a production line frame or at a tunnel furnace inlet.

[0035] In a preferred implementation, [Fig. 4] is a structural diagram of a second cross-section taken through a cut-line compound inlet 107 in an embodiment of the present utility model. The diagram of the second cross-sectional structure is a sectional view of the extrusion part in a plane where a cut-line compound channel 108 is located, and thus the cut-line compound channel 108 is visible, a cut-line compound inlet 107 is further provided in the mounting surface 105 of the coextrusion part 10, and the cut-line compound inlet 107 is in communication with the mounting position in order to be mounted at the bottom of a printed circuit board during coextrusion. A transparent cut-line compound can enter the mounting position through the cut-line compound inlet 107 to be mounted at the bottom of the printed circuit board.A cutting line at the bottom of the printed circuit board can be seen through the transparent cutting line compound to facilitate subsequent cutting of the light strip. The arrows shown in [Fig. 3] show a path of the cutting line compound channel 108. The transparent cutting line compound enters from the cutting line compound inlet 107 and then rises to a certain height, then rises by means of an inclined surface and leads near a lower surface of the printed circuit board channel 201 to facilitate mounting to the lower surface of the printed circuit board.

[0036] In a preferred implementation, [Fig. 5] is a structural diagram of a third cross-section with respect to a light-blocking compound channel 101 and a diffusion compound channel 102 in an embodiment of the present utility model. The structural diagram of the third cross-section is a sectional view of the extrusion portion in a plane where the light-blocking compound channels 101 and the diffusion compound channel 102 are located.The light-blocking compound channels 101 are distributed on two sides of the circuit board channel 201, and the light-blocking compound channels 101 are respectively located on two sides of the circuit board channel 201 when they reach the mounting position, so that the light-blocking compounds in the light-blocking compound channels 101 block the light emitted by a light bead, and the diffusion compound channel 102 is located above the circuit board channel 201. A portion above the circuit board channel 201 is above a position where the light bead of the circuit board is located, so that the diffusion compound in the diffusion compound channel 102 allows diffusion and propagation of the light emitted by the light bead.

[0037] In a preferred implementation, as indicated by the arrows in [Fig.6], the light-blocking compound channels 101 for transporting the light-blocking compound ultimately lead to a lower side or two sides of the printed circuit board channel 201, and the diffusion compound channel 102 for transporting the diffusion compound ultimately leads to an upper side of the printed circuit board channel 201 to implement extrusion packaging of the printed circuit board.

[0038] In another aspect of an embodiment of the present utility model, an embodiment of the present utility model further provides an LED light strip, which is prepared by using a silica gel coextrusion mold for an LED light strip according to the above embodiment.

[0039] As illustrated in [Fig.6], an embodiment of the present utility model provides a silica gel coextrusion method for an LED light strip, comprising the following steps.

[0040] In step S1, an elongated compound is obtained, the elongated compound comprising a light blocking compound and a scattering compound.

[0041] In step S2, the light-blocking compound, the diffusion compound, and a printed circuit board with a light bead are respectively introduced into a light-blocking compound channel 101, a diffusion compound channel 102, and a printed circuit board channel 201 in the mold, and the supplied light-blocking compound and diffusion compound are extruded to a silica gel strip outlet 103 by means of silica gel coextrusion, so as to form the light-blocking compound and the diffusion compound on the printed circuit board to obtain a silica gel strip.

[0042] In step S3, the silica gel strip extruded from the mold is heated and shaped to obtain an LED light strip, where the mold has the light-blocking compound channels 101, the diffusion compound channel 102, the circuit board channel 201, and the silica gel strip outlet 103, and the light-blocking compound channels 101, the diffusion compound channel 102, and the circuit board channel 201 are in communication with the silica gel strip outlet 103.

[0043] An opaque silica gel material may be selected for the light-blocking compound in step SL. For example, a material with fire-resistant properties at UL94V0, VI, and V2 levels or UL94HB level is selected, and Shore hardness A30-90 is selected in terms of hardness to meet different mechanical strength and deformation requirements. The fire-resistant properties may be defined as follows. For a sample having a thickness of 3-13 mm, the burning rate is less than 40 mm per minute; and for samples with a thickness of less than 3 mm, the burning rate is less than 70 mm per minute, so the light-blocking compound has better weather resistance and safety protection characteristics.

[0044] The diffusion compound in step S1 is a translucent silica gel material. For example, a transparent silica gel or a colored translucent silica gel having a refractive index of 83-98% may be selected to obtain better light efficiency.

[0045] In one embodiment, obtaining an elongated compound comprises: fully mixing a vulcanizing agent with a silica gel raw material to obtain a mixed compound; and cutting the mixed compound into an elongated shape to form an elongated compound.

[0046] Preferably, the diffusion compound is obtained by mixing a transparent silica gel with a colored additive to obtain different color combinations, and can obtain different color combinations in combination with the colors of the light-blocking silica materials, such as a combination of a white opaque light-blocking silica material and a transparent diffusion silica gel, a combination of a white opaque light-blocking silica material and a milky white translucent diffusion silica gel, a combination of a black opaque light-blocking silica material, a milky white silica gel and a gray translucent diffusion silica gel, or a combination of a brown opaque light-blocking silica material and a brown translucent diffusion silica gel, so as to present a wide variety of LED light strip combinations that can be used in the home and in furniture, accessories,and other applications to be integrated into a corresponding space.

[0047] In an alternative implementation, heating and shaping the silica gel strip extruded from the mold to obtain an LED light strip in step S3 comprises:

[0048] introducing the silica gel strip into the tunnel oven for heating to implement vulcanization and shaping to obtain the LED light strip. The length by which the silica gel strip is added into the tunnel oven and the temperature of the tunnel oven can be adjusted according to the actual situation. For example, a length of 20 meters and a heating temperature of 170°C can be used to implement better vulcanization and shaping. This can reduce the curing time of a colloid, and the LED light strip has good luminous uniformity and heat and cold resistance. The silica gel in the obtained LED light strip can be used at a temperature ranging from -50°C to 250°C.

[0049] In an alternative implementation, in order to facilitate cutting of the LED light strip, while the light blocking compound, the diffusion compound, and the card of printed circuit board with a light bead are respectively introduced into the light-blocking compound channels 101, the diffusion compound channel 102, and the printed circuit board channel 201 in the mold, the cut line at the bottom of the printed circuit board must be exposed. This can be implemented by introducing a transparent cut line compound (such as transparent latex) into the cut line compound channel 108 in the mold, and forming the transparent cut line compound at the bottom of the printed circuit board to facilitate viewing of the cut line at the bottom of the printed circuit board. In the following steps, the LED light strip can be cut to the desired length.

[0050] In an alternative implementation, in step S2, the supplied light-blocking compound and diffusion compound are extruded to the silica gel strip outlet 103 by silica gel coextrusion, where before reaching the silica gel strip outlet 103, the light-blocking compound, diffusion compound, etc. can enter the mounting position, and are extruded, in the mounting position, from the silica gel strip outlet 103 with the input circuit board under the extrusion effect of the coextrusion, so as to form a silica gel strip. Since the silica gel strip is a complete silica gel line, compared with other materials, the silica gel strip is softer, more corrosion-resistant, and also UV-resistant, can reach the waterproof level of IP68, and can be used in usage scenarios such as swimming pools.

[0051] The embodiments mentioned above are solely for the purpose of describing the implementations of the present utility model, and the descriptions thereof are specific and detailed, which, however, should not be construed as limiting the scope of the patent for the present utility model. It should be noted that several variations, modifications, equivalent substitutions, improvements, etc. may also be made by those skilled in the art without departing from the concept of the present utility model. All of this falls within the scope of protection of the present utility model. Therefore, the scope of protection of the patent for the present utility model should be subject to the attached claims.

Claims

Claims

1. A silica gel coextrusion mold for an LED light strip, characterized by having a coextrusion part (10) and a circuit board feeding part (20), wherein light blocking compound channels (101), a diffusion compound channel (102), and a silica gel strip outlet (103) are provided in the coextrusion part (10); the light blocking compound channels (101) and the diffusion compound channel (102) are located on a mounting surface (105) of the coextrusion part (10), and the silica gel strip outlet (103) is located on an outlet surface (104) of the coextrusion part (10);the circuit board feed portion (20) is connected perpendicularly to the mounting surface (105) of the coextrusion portion (10), a circuit board channel (201) is provided inside the circuit board feed portion (20) and the coextrusion portion (10), and the circuit board channel (201) is perpendicular to the mounting surface (105) and passes through the circuit board feed portion (20) and the coextrusion portion (10); and the light blocking compound channels (101), the diffusion compound channel (102) and the circuit board channel (201) all reach a mounting position before reaching the silica gel tape outlet (103), and respectively coextrude a light blocking compound, a diffusion compound and a circuit board to the silica gel tape outlet (103) to form a silica gel tape.;

2. The silica gel coextrusion mold for an LED light strip according to claim 1, characterized in that the circuit board feeding portion (20) further comprises an air inlet opening (203) in communication with the silica gel strip outlet (103).

3. The silica gel coextrusion mold for an LED light strip according to claim 1, characterized in that one end of the printed circuit board feeding portion (20) away from the coextrusion portion (10) is provided with an external thread (202).

4. The silica gel coextrusion mold for an LED light strip according to claim 1 or 2, characterized in that a structure insertion (204) inserted into the coextrusion part (10) and reaching the silica gel strip outlet (103) is provided at one end of the printed circuit board feeding part (20) close to the coextrusion part (10).

5. The silica gel coextrusion mold for an LED light strip according to claim 1 or 2, characterized in that threaded holes (106) passing through the outlet surface (104) for fixing the coextrusion part (10) are further distributed in the mounting surface (105) of the coextrusion part (10).

6. The silica gel coextrusion mold for an LED light strip according to claim 1 or 2, characterized in that a cutting line compound inlet (107) is further provided in the mounting surface (105) of the coextrusion part (10), and the cutting line compound inlet (107) is in communication with the mounting position so as to be mounted at the bottom of the printed circuit board during coextrusion.

7. The silica gel coextrusion mold for an LED light strip according to any one of claims 1 to 3, characterized in that the light-blocking compound channels (101) are distributed on two sides of the circuit board channel (201), the diffusion compound channel (102) is distributed above the circuit board channel (201), the light-blocking compound channels (101) are respectively located on two sides of the circuit board channel (201) when reaching the mounting position, so that the light-blocking compounds (101) in the light-blocking compound channels block light emitted by a light bead, and the diffusion compound channel (102) is located above the circuit board channel (201), where a portion above the circuit board channel (201) is above a position where the light bead of the circuit board is located,such that the diffusion compound in the diffusion compound channel (102) enables diffusion and propagation of the light emitted by the light bead.,

8. The silica gel coextrusion mold for an LED light strip according to claim 6, characterized in that the cutting line compound inlet (107) is located in the mounting surface (105) of the coextrusion part (10), and is located under each of the two sides of the printed circuit board channel (201).

9. The silica gel coextrusion mold for an LED light strip according to claim 8, characterized in that a transparent cutting line compound enters from the cutting line compound inlet (107) and then rises to a certain height, then rises by means of an inclined surface and leads near a lower surface of the printed circuit board channel (201) to facilitate mounting to the lower surface of the printed circuit board.

10. An LED light strip, characterized in that the LED light strip is prepared by a silica gel coextrusion method for an LED light strip according to any one of claims 1 to 4; or the LED light strip is prepared using a silica gel coextrusion mold for an LED light strip according to any one of claims 5 to 9.

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