Silica gel coextrusion mold for LED light strip, and LED light strip

Abstract

A silica gel coextrusion mould for an LED light strip, and packaging an LED light strip, the mould comprises a coextrusion portion 10, a circuit board feeding portion 20, light-blocking compound channels (101, fig 2), a diffusion compound channel (102, fig 3) are provided on a mounting surface (105, fig 2) of the coextrusion portion and a silica gel strip outlet 103 is provided in an output surface 104 of the coextrusion portion, the light-blocking compound channels, diffusion compound channel and the circuit board channel all reach a mounting position before reaching the silica gel strip outlet, and respectively coextrude a light-blocking compound, a diffusion compound, and a circuit board at the silica gel strip outlet to form a silica gel strip. A transparent cutting line compound may enter the mounting position through the cutting line compound inlet (107, fig 4) to be mounted at the bottom of the circuit board, a cutting line at the bottom of the circuit board can be seen through the transparent cutting line compound to facilitate the subsequent cutting of the light strip. The diffusion compound enables the scattering and propagation of the light emitted by a light bead.

Description

TECHNICAL FIELD The present utility model relates to the technical field of light strip packaging, and in particular to a silica gel coextrusion mold for an LED light strip, and an LED light strip. BACKGROUND ART At present, in a production process for LED light strip packaging in the market, dispensing is usually used to protect LED dies and bonding wires by means of epoxy resin. The shape of a cured colloid directly affects the brightness, luminous efficiency, and luminous uniformity of a finished light source. A flexible light strip using COB or CSP flip-chip LEDs suffers from the problems that the light strip has a low luminous efficiency and average uniformity, and cannot continue to be used in an extremely narrow space or a space with strong weatherability. For surface mounted devices (SMD) in the prior art, it takes a long time to cure a colloid, it is difficult to ensure the uniformity, and a production length is limited. SUMMARY In view of this, the present utility model provides technical solutions of a silica gel coextrusion mold for an LED light strip and an LED light strip. In a first aspect, the present utility model provides a silica gel coextrusion mold for an LED light strip, including a coextrusion portion and a circuit board feeding portion, wherein light-blocking compound channels, a diffusion compound channel, and a silica gel strip outlet are provided in the coextrusion portion; the light-blocking compound channels and the diffusion compound channel are provided on a mounting surface of the coextrusion portion, and the silica gel strip outlet is provided in an output surface of the coextrusion portion; the circuit board feeding portion is connected perpendicularly to the mounting surface of the coextrusion portion, a circuit board channel is provided inside the circuit board feeding portion and the coextrusion portion, and the circuit board channel is perpendicular to the mounting surface and runs through the circuit board feeding portion and the coextrusion portion; and the light-blocking compound channels, the diffusion compound channel and the circuit board channel all reach a mounting position before reaching the silica gel strip outlet, and respectively coextrude a light-blocking compound, a diffusion compound, and a circuit board at the silica gel strip outlet to form a silica gel strip. Preferably, the circuit board feeding portion further has an air inlet opening in communication with the silica gel strip outlet. Preferably, an end of the circuit board feeding portion away from the coextrusion portion is provided with an external thread. Preferably, an insertion structure inserted into the coextrusion portion and reaching the silica gel strip outlet is provided at an end of the circuit board feeding portion close to the coextrusion portion; and / or threaded holes running through the output surface to fix the coextrusion portion are further distributed in the mounting surface of the coextrusion portion; and / or a cutting line compound inlet is further provided in the mounting surface of the coextrusion portion, and the cutting line compound inlet is in communication with the mounting position so as to be mounted at a bottom of the circuit board during coextrusion. Preferably, the light-blocking compound channels are distributed on two sides of the circuit board channel, the diffusion compound channel is distributed above the circuit board channel, the light-blocking compound channels are respectively located on the two sides of the circuit board channel when reaching the mounting position, such that light-blocking compounds in the light-blocking compound channels block the light emitted by a light bead, and the diffusion compound channel is located above the circuit board channel, wherein a part above the circuit board channel is above a position where the light bead of the circuit board is located, such that the diffusion compound in the diffusion compound channel enables the scattering and propagation of the light emitted by the light bead. Preferably, the cutting line compound inlet is provided in the mounting surface of the coextrusion portion, and is located under each of the two sides of the circuit board channel. Preferably, a transparent cutting line compound enters from the cutting line compound inlet and then rises to a certain height, and then rises by means of an inclined surface and leads to the vicinity of a bottom surface of the circuit board channel to facilitate mounting to the bottom surface of the circuit board. In a second aspect, the present utility model provides an LED light strip, wherein the LED light strip is prepared by a silica gel coextrusion method for an LED light strip as described above; or the LED light strip is prepared by using a silica gel coextrusion mold for an LED light strip as described above. Compared with the prior art, the present utility model has at least the following beneficial effects: 1) the fed light-blocking compound and diffusion compound are formed on the circuit board by silica gel coextrusion of the light-blocking compound and the diffusion compound to obtain a silica gel strip, and the silica gel strip extruded from the mold is heated and shaped to obtain an LED light strip, such that the time for curing a colloid can be reduced, and the LED light strip has a good luminous uniformity; 2) with the silica gel coextrusion, the length of the obtained LED light strip is significantly increased; 3) the mold according to the embodiment of the present utility model is provided with the perpendicularly arranged coextrusion portion and circuit board feeding portion, which can ensure the stability of circuit board feeding, and enables a silica gel to be stably formed on a circuit board during the silica gel coextrusion; and 4) the provision of the air inlet opening in the circuit board feeding portion can prevent inflation during the coextrusion, in order to avoid collapse of a possible hollow part in the silica gel strip. BRIEF DESCRIPTION OF DRAWINGS The above and other objectives, features and advantages of the present utility model will be clearer from the following description of embodiments of the present utility model with reference to accompanying drawings, in which: FIG. 1 is a schematic structural diagram of an output surface of a silica gel coextrusion mold for an LED light strip according to an embodiment of the present utility model; FIG. 2 is a schematic diagram of a mounting surface of a silica gel coextrusion mold for an LED light strip according to an embodiment of the present utility model; FIG. 3 is a schematic structural diagram of an overall cross section of a silica gel coextrusion mold for an LED light strip according to an embodiment of the present utility model; FIG. 4 is a schematic structural diagram of a second cross section of a silica gel coextrusion mold for an LED light strip according to an embodiment of the present utility model taken across a cutting line compound inlet; FIG. 5 is a schematic structural diagram of a third cross section of a silica gel coextrusion mold for an LED light strip according to an embodiment of the present utility model with respect to a light-blocking compound channel and a diffusion compound channel; and FIG. 6 is a flowchart of a silica gel coextrusion method for an LED light strip according to an embodiment of the present utility model. DETAILED DESCRIPTION OF EMBODIMENTS The present utility model is described below on the basis of embodiments, but it should be noted that the present utility model is not limited to these embodiments. In the following detailed description of the present utility model, some specific details are described in detail. However, for those parts that are not described in detail, those skilled in the art can fully understand the present utility model. In addition, it should be understood by those of ordinary skill in the art that the accompanying drawings provided are merely for illustration of the objectives, features and advantages of the present utility model, and the accompanying drawings are not actually drawn to scale. In addition, unless explicitly required in the context, similar words such as "comprise" and "contain" in the whole description and claims should be interpreted as inclusive rather than exclusive or exhaustive. In other words, the words mean "including, but not limited to". In an aspect of an embodiment of the present utility model, a silica gel coextrusion mold for an LED light strip is further provided, and as shown in FIGS. 1 and 2, comprises a coextrusion portion 10 and a circuit board feeding portion 20. Light-blocking compound channels 101, a diffusion compound channel 102, and a silica gel strip outlet 103 are provided in the coextrusion portion 10. The lightblocking compound channels 101 and the diffusion compound channel 102 are provided on a mounting surface 105 of the coextrusion portion 10, and the silica gel strip outlet 103 is provided on an output surface 104 of the coextrusion portion 10. The circuit board feeding portion 20 is connected perpendicularly to the mounting surface 105 of the coextrusion portion 10. A circuit board channel 201 is provided in the circuit board feeding portion 20 and the coextrusion portion 10, and the circuit board channel 201 is perpendicular to the mounting surface 105 and runs through the circuit board feeding portion 20 and the coextrusion portion 10. The lightblocking compound channels 101, the diffusion compound channel 102, and the circuit board channel 201 all reach the same mounting position before reaching the silica gel strip outlet 103, and respectively coextrude a light-blocking compound, a diffusion compound, and a circuit board at the silica gel strip outlet 103 to form a silica gel strip. Since the above-described mold according to the embodiment of the present utility model uses silica gel coextrusion, the length of the obtained LED light strip is significantly increased, and the LED light strip has better luminous uniformity. The LED light strip obtained by the above method can have a thickness of up to 1.5 ± 0.3 mm and a transmittance of up to 90%. The mold has the perpendicularly arranged coextrusion portion 10 and circuit board feeding portion 20, which can ensure the stability of circuit board feeding and enables a silica gel to be stably formed on a circuit board during the silica gel coextrusion. In a preferred implementation, the circuit board feeding portion 20 further has an air inlet opening 203 in communication with the silica gel strip outlet 103. The provision of the air inlet opening 203 can prevent inflation during the coextrusion to avoid collapse of a possible hollow part in the silica gel strip. The air inlet opening 203 and the circuit board channel 201 may be provided together, or may be separately provided. In a preferred implementation, an end of the circuit board feeding portion 20 away from the coextrusion portion 10 is provided with an external thread 202. The external thread 202 may be configured to connect a head (not shown) for feeding a compound, and the other end of the head is connected to a compound mixing device (not shown). Both the light-blocking compound and the diffusion compound can be obtained by means of the compound mixing device. In a preferred implementation, an insertion structure 204 inserted into the coextrusion portion 10 and reaching the silica gel strip outlet 103 is provided at an end of the circuit board feeding portion 20 close to the coextrusion portion 10. In a preferred implementation, threaded holes 106 that run through the output surface 104 to fix the coextrusion portion 10 are further distributed in the mounting surface 105 of the coextrusion portion 10, so as to facilitate the mounting of the coextrusion portion 10 on a production line frame or at an inlet of a tunnel furnace. In a preferred implementation, FIG. 4 is a schematic structural diagram of a second cross section taken across a cutting line compound inlet 107 in an embodiment of the present utility model. The schematic diagram of the second cross-sectional structure is a sectional view of the extrusion portion in a plane where a cutting line compound channel 108 is located, and thus the cutting line compound channel 108 is visible, a cutting line compound inlet 107 is further provided in the mounting surface 105 of the coextrusion portion 10, and the cutting line compound inlet 107 is in communication with the mounting position so as to be mounted at a bottom of a circuit board during coextrusion. A transparent cutting line compound may enter the mounting position through the cutting line compound inlet 107 to be mounted at the bottom of the circuit board. A cutting line at the bottom of the circuit board can be seen through the transparent cutting line compound to facilitate the subsequent cutting of the light strip. The arrows shown in FIG. 3 shows a path of the cutting line compound channel 108. The transparent cutting line compound enters from the cutting line compound inlet 107 and then rises to a certain height, and then rises by means of an inclined surface and leads to the vicinity of a bottom surface of the circuit board channel 201 to facilitate mounting to the bottom surface of the circuit board. In a preferred implementation, FIG. 5 is a schematic structural diagram of a third cross section with respect to a light-blocking compound channel 101 and a diffusion compound channel 102 in an embodiment of the present utility model. The schematic structural diagram of the third cross section is a cross-sectional view of the extrusion portion in a plane where the light-blocking compound channels 101 and the diffusion compound channel 102 are located. The light-blocking compound channels 101 are distributed on two sides of the circuit board channel 201, and the light-blocking compound channels 101 are respectively located on the two sides of the circuit board channel 201 when reaching the mounting position, such that the light-blocking compounds in the light-blocking compound channels 101 block the light emitted by a light bead, and the diffusion compound channel 102 is located above the circuit board channel 201. A part above the circuit board channel 201 is above a position where the light bead of the circuit board is located, such that the diffusion compound in the diffusion compound channel 102 enables the scattering and propagation of the light emitted by the light bead. In a preferred implementation, as indicated by the arrows in FIG. 6, the lightblocking compound channels 101 for conveying the light-blocking compound finally lead to a lower side or two sides of the circuit board channel 201, and the diffusion compound channel 102 for conveying the diffusion compound finally leads to an upper side of the circuit board channel 201 to implement the extrusion packaging of the circuit board. In another aspect of an embodiment of the present utility model, an embodiment of the present utility model further provides an LED light strip, which is prepared by using a silica gel coextrusion mold for an LED light strip according to the above embodiment. As shown in FIG. 6, an embodiment of the present utility model provides a silica gel coextrusion method for an LED light strip, comprising the following steps. In step SI, an elongated compound is obtained, the elongated compound comprising a light-blocking compound and a diffusion compound. In step S2, the light-blocking compound, the diffusion compound, and a circuit board with a light bead are respectively fed into a light-blocking compound channel 101, a diffusion compound channel 102, and a circuit board channel 201 in the mold, and the fed light-blocking compound and diffusion compound are extruded at a silica gel strip outlet 103 by means of silica gel coextrusion, so as to form the lightblocking compound and the diffusion compound on the circuit board in order to obtain a silica gel strip. In step S3, the silica gel strip extruded from the mold is heated and shaped to obtain an LED light strip, wherein the mold has the light-blocking compound channels 101, the diffusion compound channel 102, the circuit board channel 201, and the silica gel strip outlet 103, and the light-blocking compound channels 101, the diffusion compound channel 102, and the circuit board channel 201 are in communication with the silica gel strip outlet 103. An opaque silica gel material may be selected for the light-blocking compound in step SI. For example, a material with fire protection properties at levels UL94V0, VI and V2 or level UL94HB is selected, and the Shore A30-90 hardness is selected in term of hardness to meet different mechanical strength and deformation requirements. The flame retardant properties may be defined as follows. For a sample having a thickness of 3-13 mm, the burning velocity is less than 40 mm per minute; and for a samples having a thickness of less than 3 mm, the burning velocity is less than 70 mm per minute, such that the light-blocking compound has a better weather resistance and safety protection characteristics. The diffusion compound in step SI is a light-transmissive silica gel material. For example, a transparent silica gel or a colored translucent silica gel having a refractive index of 83-98% may be selected to achieve a better light output. In one of the implementations, obtaining an elongated compound include: fully mixing a vulcanizing agent with a silica gel raw material to obtain a mixed compound; and cutting the mixed compound into an elongated form to form an elongated compound. Preferably, the diffusion compound is obtained by mixing a transparent silica gel with a colored additive to achieve different color combinations, and can achieve different color combinations in combination with the colors of light-blocking silicon materials, such as a combination of a white opaque light-blocking silicon material and a transparent diffusion silica gel, a combination of a white opaque light-blocking silicon material and a milk white translucent diffusion silica gel, a combination of a black opaque light-blocking silicon material, a milk white silica gel and a gray translucent diffusion silica gel, or a combination of a brown opaque light-blocking silicon material and a brown translucent diffusion silica gel, so as to present a wide variety of LED light strip combinations that can be used at home and in furniture, props, and other applications to be integrated with a corresponding space. In an alternative implementation, heating and shaping the silica gel strip extruded from the mold to obtain an LED light strip in step S3 includes: inputting the silica gel strip into the tunnel furnace for heating to implement vulcanization and shaping to obtain the LED light strip. The length by which the silica gel light strip is added into the tunnel furnace and the temperature of the tunnel furnace can be adjusted according to an actual situation. For example, a length of 20 meters and a heating temperature of 170°C may be used to implement better vulcanization and shaping. This can reduce the time for curing a colloid, and the LED light strip has a good luminous uniformity and a good heat resistance and a cold resistance. The silica gel in the obtained LED light strip can be used at a temperature in the range from -50°C to 250°C. In an alternative implementation, in order to facilitate the cutting of the LED light strip, while the light-blocking compound, the diffusion compound, and the circuit board with a light bead are respectively fed into the light-blocking compound channels 101, the diffusion compound channel 102, and the circuit board channel 201 in the mold, the cutting line at the bottom of the circuit board needs to be exposed. This may be implemented by feeding a transparent cutting line compound (such as transparent latex) into the cutting line compound channel 108 in the mold, and forming the transparent cutting line compound at the bottom of the circuit board to facilitate the visualization of the cutting line at the bottom of the circuit board. In subsequent steps, the LED light strip may be cut into a length as desired. In an alternative implementation, in step S2, the fed light-blocking compound and diffusion compound are extruded at the silica gel strip outlet 103 by silica gel coextrusion, wherein before reaching the silica gel strip outlet 103, the lightblocking compound, the diffusion compound, etc. can enter the mounting position, and are extruded, in the mounting position, from the silica gel strip outlet 103 together with the input circuit board under the extrusion effect of coextrusion, so as to form a silica gel strip. Since the silica gel strip is a full silica gel line, compared with other materials, the silica gel strip is softer, more corrosion-resistant, and also UV-resistant, can reach the waterproof level IP68, and can be used in use scenarios such as swimming pools. The above-mentioned embodiments are merely for the purpose of describing the implementations of the present utility model, and the descriptions thereof are specific and detailed, which, however, should not be construed as limiting the scope of the patent for the present utility model. It should be noted that several variations, several modifications, equivalent substitutions, improvements, etc. can also be made by those of ordinary skill in the art without departing from the concept of the present utility model. These all fall within the scope of protection of the present utility model. Therefore, the scope of protection of the patent for the present utility model shall be subject to the appended claims.

Claims

1. A silica gel coextrusion mold for an LED light strip, characterized by comprising a coextrusion portion and a circuit board feeding portion, wherein lightblocking compound channels, a diffusion compound channel, and a silica gel strip outlet are provided in the coextrusion portion; the light-blocking compound channels and the diffusion compound channel are provided on a mounting surface of the coextrusion portion, and the silica gel strip outlet is provided in an output surface of the coextrusion portion; the circuit board feeding portion is connected perpendicularly to the mounting surface of the coextrusion portion, a circuit board channel is provided inside the circuit board feeding portion and the coextrusion portion, and the circuit board channel is perpendicular to the mounting surface and runs through the circuit board feeding portion and the coextrusion portion; and the light-blocking compound channels, the diffusion compound channel and the circuit board channel all reach a mounting position before reaching the silica gel strip outlet, and respectively coextrude a light-blocking compound, a diffusion compound, and a circuit board at the silica gel strip outlet to form a silica gel strip.

2. The silica gel coextrusion mold for an LED light strip according to claim 1, characterized in that the circuit board feeding portion further has an air inlet opening in communication with the silica gel strip outlet.

3. The silica gel coextrusion mold for an LED light strip according to claim 1, characterized in that an end of the circuit board feeding portion away from the coextrusion portion is provided with an external thread.

4. The silica gel coextrusion mold for an LED light strip according to claim 1 or 2, characterized in that an insertion structure inserted into the coextrusion portion and reaching the silica gel strip outlet is provided at an end of the circuit board feeding portion close to the coextrusion portion.

5. The silica gel coextrusion mold for an LED light strip according to claim 1 or 2, characterized in that threaded holes running through the output surfaceto fix the coextrusion portion are further distributed in the mounting surface of the coextrusion portion.

6. The silica gel coextrusion mold for an LED light strip according to claim 1 or 2, characterized in that a cutting line compound inlet is further provided in the mounting surface of the coextrusion portion, and the cutting line compound inlet is in communication with the mounting position so as to be mounted at a bottom of the circuit board during coextrusion.

7. The silica gel coextrusion mold for an LED light strip according to any one of claims 1 to 3, characterized in that the light-blocking compound channels are distributed on two sides of the circuit board channel, the diffusion compound channel is distributed above the circuit board channel, the light-blocking compound channels are respectively located on the two sides of the circuit board channel when reaching the mounting position, such that light-blocking compounds in the lightblocking compound channels block the light emitted by a light bead, and the diffusion compound channel is located above the circuit board channel, wherein a part above the circuit board channel is above a position where the light bead of the circuit board is located, such that the diffusion compound in the diffusion compound channel enables the scattering and propagation of the light emitted by the light bead.

8. The silica gel coextrusion mold for an LED light strip according to claim 6, characterized in that the cutting line compound inlet is provided in the mounting surface of the coextrusion portion, and is located under each of the two sides of the circuit board channel.

9. The silica gel coextrusion mold for an LED light strip according to claim 8, characterized in that a transparent cutting line compound enters from the cutting line compound inlet and then rises to a certain height, and then rises by means of an inclined surface and leads to the vicinity of a bottom surface of the circuit board channel to facilitate mounting to the bottom surface of the circuit board.

10. An LED light strip, characterized in that the LED light strip is prepared by a silica gel coextrusion method for an LED light strip according to any one ofclaims 1 to 4; or the LED light strip is prepared by using a silica gel coextrusion mold for an LED light strip according to any one of claims 5 to 9.

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