Active matrix substrate, liquid crystal display device, self-luminous display device, and imaging device

Abstract

To provide an active matrix substrate, a liquid crystal display device, a self-luminous display device, and an imaging device with which, when the array width of a terminal is wider than the array width of a pixel wiring connected to the terminal, the width in the array direction of the pixel wiring required for disposition of the terminal can be reduced to the array width of the pixel wiring or below.SOLUTION: An active matrix substrate 300 comprises a plurality of pixel electrodes, a plurality of switching elements that connect to the plurality of pixel electrodes, respectively, a plurality of pixel wirings GL that connect to the plurality of switching elements, respectively, a plurality of connection wirings 335 that connect to the plurality of pixel wirings GL, respectively, and a plurality of terminals 330 that connect to the plurality of connection wirings 335, respectively. An arrangement direction of the pixel wirings GL and an arrangement direction AD1 of the terminals 330 are different.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present disclosure relates to an active matrix substrate, a liquid crystal display device, a self-luminous display device, and an imaging device. [Background technology]

[0002] Active matrix substrates having thin film transistors (TFTs) are used in display devices, imaging devices, etc. On the active matrix substrate, a gate driver that supplies signals to the gate wiring (pixel wiring) and a data driver that supplies signals to the data wiring (pixel wiring) are mounted. The gate driver is connected to the gate electrode of the TFT, and the data driver is connected to the source electrode of the TFT.

[0003] The gate driver and the data driver are mounted in the frame region of the active matrix substrate by a COF (Chip On Film) method, a COG (Chip On Glass) method, or the like. In the COF method, a flexible substrate on which a driving IC (Integrated Circuit) is mounted is connected to the terminals of the active matrix substrate. In the COG method, the driving IC is directly connected to the terminals of the active matrix substrate. The terminals of the active matrix substrate and the pixel wiring connected to the terminals are arranged in the same direction, and the interval between the terminals of the active matrix substrate is narrower than the interval between the pixel wiring connected to the terminals (for example, Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2020-160393 A Summary of the Invention [Problem to be solved by the invention]

[0005] In the configuration of terminals and pixel wiring in Patent Document 1, as the pixel pitch (distance between pixel wirings) of display devices, imaging devices, etc. becomes narrower with the increase in resolution of display devices, imaging devices, etc., the distance between terminals of the active matrix substrate must also be narrowed. In this case, there is a risk of a decrease in the yield of the process of connecting the driving IC or flexible substrate to the active matrix substrate. In addition, the options for usable flexible substrates are narrowed.

[0006] On the other hand, if the interval between the terminals of the active matrix substrate is made wider than the interval between the pixel wirings connected to the terminals, the arrangement width of the terminals connected to one driving IC or flexible substrate will also be wider, which will increase the width in the arrangement direction of the pixel wirings required to provide the terminals connected to one driving IC or flexible substrate.

[0007] The present disclosure has been made in consideration of the above circumstances, and aims to provide an active matrix substrate, a liquid crystal display device, a self-luminous display device, and an imaging device that, when the arrangement width of a terminal is wider than the arrangement width of the pixel wiring connected to that terminal, can make the width in the arrangement direction of the pixel wiring necessary for providing the terminal equal to or less than the arrangement width of the pixel wiring. [Means for solving the problem]

[0008] In order to achieve the above object, an active matrix substrate according to a first aspect of the present disclosure comprises: A plurality of pixel electrodes; A plurality of switching elements connected to the plurality of pixel electrodes, respectively; a plurality of pixel wirings connected to the plurality of switching elements, respectively; A plurality of connection lines connected to the plurality of pixel lines, respectively; a plurality of terminals connected to the plurality of connection wirings, The arrangement direction of the pixel lines and the arrangement direction of the terminals are different.

[0009] A liquid crystal display device according to a second aspect of the present disclosure comprises: The active matrix substrate; an opposing substrate opposed to the active matrix substrate; The display device includes a liquid crystal sandwiched between the active matrix substrate and the opposing substrate.

[0010] A self-luminous display device according to a third aspect of the present disclosure includes: The active matrix substrate; and a self-emitting portion provided on the pixel electrode.

[0011] An imaging device according to a fourth aspect of the present disclosure, The active matrix substrate; A photoelectric conversion element is provided on the pixel electrode. Effect of the Invention

[0012] According to the present disclosure, since the arrangement direction of the pixel wirings is different from the arrangement direction of the terminals connected to the pixel wirings, the width in the arrangement direction of the pixel wirings required to provide the terminals connected to the pixel wirings can be made equal to or smaller than the arrangement width of the pixel wirings. [Brief description of the drawings]

[0013] [Figure 1] FIG. 1 is a plan view showing a liquid crystal display device according to a first embodiment. [Diagram 2] 1 is a plan view showing a display region of an active matrix substrate according to a first embodiment. [Diagram 3] FIG. 2 is a plan view showing a gate terminal and a gate connection line according to the first embodiment. [Figure 4] FIG. 11 is a plan view showing a gate terminal and a gate connection line according to Comparative Example 1. [Diagram 5] FIG. 2 is a plan view showing a data terminal and a data connection line according to the first embodiment. [Figure 6] FIG. 2 is a plan view showing a gate driving IC and a flexible substrate according to the first embodiment. [Figure 7] FIG. 2 is a plan view showing a data driving IC and a flexible substrate according to the first embodiment. [Figure 8]FIG. 11 is a plan view showing a gate terminal and a gate connection line according to the second embodiment. [Figure 9] FIG. 11 is a schematic diagram for explaining the arrangement direction of gate terminals according to the second embodiment. [Figure 10] FIG. 11 is a side view showing a liquid crystal display device according to embodiment 3. [Figure 11] FIG. 11 is a plan view showing a gate terminal and a flexible substrate according to a third embodiment. [Figure 12] FIG. 11 is a plan view showing a data terminal and a flexible substrate according to a third embodiment. [Figure 13] FIG. 11 is a plan view showing a gate connection wiring and a flexible substrate according to embodiment 4. [Figure 14] 14 is a cross-sectional view of the gate connection wiring and the flexible substrate shown in FIG. 13 taken along line AA. [Figure 15] FIG. 11 is a plan view showing a self-luminous display device according to a fifth embodiment. [Figure 16] FIG. 11 is a plan view showing a display region of an active matrix substrate according to a fifth embodiment. [Figure 17] FIG. 11 is a cross-sectional view showing a light-emitting element according to embodiment 5. [Figure 18] FIG. 13 is a plan view showing an imaging device according to a sixth embodiment. [Figure 19] FIG. 11 is a plan view showing an imaging region of an active matrix substrate according to a fifth embodiment. [Figure 20] FIG. 11 is a cross-sectional view showing a photoelectric conversion element according to embodiment 5. [Figure 21] FIG. 13 is a plan view showing a flexible substrate according to a modified example. [Figure 22] FIG. 13 is a plan view showing a gate connection wiring according to a modified example. [Figure 23] FIG. 13 is a plan view showing a gate connection wiring according to a modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, an active matrix substrate, a liquid crystal display device, a self-luminous display device, and an imaging device according to embodiments will be described with reference to the drawings.

[0015] <Embodiment 1> A liquid crystal display device 10 including an active matrix substrate 300 according to the present embodiment will be described with reference to Figs. 1 to 7. As shown in Fig. 1, the liquid crystal display device 10 includes a liquid crystal display panel 100, a gate driving IC 400, and a data driving IC 500. The liquid crystal display device 10 also includes a driving circuit, a backlight, and the like (not shown). For ease of understanding, the present specification will be described with the right direction (right direction on the paper) of the liquid crystal display device 10 in Fig. 1 as the +X direction, the upward direction (upward on the paper) as the +Y direction, and the direction perpendicular to the +X direction and the +Y direction (toward the viewer on the paper) as the +Z direction. The description will also be given assuming that a viewer is located on the +Z side of the liquid crystal display device 10.

[0016] The liquid crystal display panel 100 of the liquid crystal display device 10 includes a counter substrate 200, an active matrix substrate 300, and a liquid crystal LC. The liquid crystal display panel 100 also includes polarizing plates (not shown) on the +Z side surface of the counter substrate 200 and on the -Z side surface of the active matrix substrate 300. In this embodiment, the liquid crystal display panel 100 is a transmissive liquid crystal display panel. The liquid crystal display panel 100 operates, for example, in a known transverse electric field mode.

[0017] The liquid crystal display panel 100 has a display area 11 capable of displaying characters, images, etc., and a frame area 12 surrounding the display area 11. A plurality of pixels PX are arranged in a matrix in the display area 11. A gate driving IC 400 and a data driving IC 500 are mounted in the frame area 12. The frame area 12 is formed from a frame area 302 of an active matrix substrate 300, as described later.

[0018] The counter substrate 200 of the liquid crystal display panel 100 is located on the +Z side (observer side) and faces the active matrix substrate 300. The counter substrate 200 is bonded to the active matrix substrate 300 by a sealant (not shown). The outer dimensions of the counter substrate 200 are smaller than those of the active matrix substrate 300, and the counter substrate 200 is bonded to the active matrix substrate 300 with the +X side edge of the counter substrate 200 aligned with the +X side edge of the active matrix substrate 300, and the -Y side edge of the counter substrate 200 aligned with the -Y side edge of the active matrix substrate 300. Therefore, the -X side end and the +Y side end of the active matrix substrate 300 form the frame region 12 of the liquid crystal display panel 100 (the frame region 302 of the active matrix substrate 300).

[0019] The counter substrate 200 is, for example, a glass substrate. A color filter, a black matrix, an alignment film for aligning liquid crystal LC, and the like (none of which are shown) are provided on the surface of the counter substrate 200 facing the active matrix substrate 300.

[0020] The active matrix substrate 300 of the liquid crystal display panel 100 is located on the -Z side and faces the counter substrate 200. The active matrix substrate 300 is, for example, a glass substrate. On a surface 300a of the active matrix substrate 300 facing the counter substrate 200, pixel electrodes 310, a plurality of gate lines GL, a plurality of data lines DL, a gate terminal 330 described later, an alignment film for aligning liquid crystal LC, and the like are provided, as shown in FIG.

[0021] First, a region 301 of the active matrix substrate 300 corresponding to the display region 11 of the liquid crystal display panel 100 (hereinafter referred to as the display region 301 of the active matrix substrate 300) will be described. A pixel electrode 310, a switching element 320, a plurality of gate lines GL, a plurality of data lines DL, etc. are provided in the display region 301 of the active matrix substrate 300. Note that, for ease of understanding, Fig. 2 illustrates only a portion of the display region 301 of the active matrix substrate 300. Also, Fig. 2 illustrates only the pixel electrode 310 and the switching element 320 of one pixel PX.

[0022] 2, the gate lines GL of the active matrix substrate 300 extend in the X direction and are arranged in the Y direction. The data lines DL of the active matrix substrate 300 extend in the Y direction and are arranged in the X direction. The gate lines GL and the data lines DL surround a set of a pixel electrode 310, a common electrode (not shown), and a switching element 320 that form a pixel PX. The gate lines GL and the data lines DL are made of a metal such as aluminum (Al) or molybdenum (Mo). The gate lines GL and the data lines DL correspond to pixel lines.

[0023] The pixel electrodes 310 of the active matrix substrate 300 are arranged in a matrix in the X and Y directions. The pixel electrodes 310 are formed, for example, in a comb shape from ITO (Indium Tin Oxide). The common electrode of the active matrix substrate 300 is also formed in a comb shape from ITO. The comb portions of the pixel electrodes 310 and the comb portions of the common electrode are arranged alternately and parallel to each other. As a result, a transverse electric field parallel to the surface 300a of the active matrix substrate 300 is generated between the comb portions of the pixel electrodes 310 and the comb portions of the common electrode.

[0024] The switching element 320 of the active matrix substrate 300 is, for example, a TFT element. The switching element 320 is provided near the intersection of the gate line GL and the data line DL. The switching element 320 has a gate electrode, a source electrode, a drain electrode, and a semiconductor layer (none of which are shown). The gate electrode of the switching element 320 is connected to the gate line GL, and the source electrode of the switching element 320 is connected to the data line DL. The drain electrode of the switching element 320 is connected to the pixel electrode 310. The gate electrode, source electrode, and drain electrode are made of a metal such as aluminum or molybdenum. The semiconductor layer of the switching element 320 is made of amorphous silicon, an oxide containing indium (In), gallium (Ga), and zinc (Zn), or the like.

[0025] The switching elements 320 are sequentially driven based on a scanning signal supplied from a gate driving IC 400 (gate driver) via a gate wiring GL connected to the gate electrode. When the switching elements 320 are in an open state, an image signal (grayscale voltage) supplied from a data driving IC 500 (data driver) is supplied to the drain electrode via a data wiring DL connected to the source electrode. Then, a predetermined transverse electric field parallel to the surface 300a of the active matrix substrate 300 is generated between the comb teeth of the pixel electrodes 310 connected to the drain electrode and the comb teeth of the common electrode, and the predetermined transverse electric field is applied to the liquid crystal LC. The common electrode is connected to a common wiring, and the potential of the common electrode is controlled to a predetermined potential.

[0026] Next, the frame region 302 of the active matrix substrate 300 will be described. The frame region 302 of the active matrix substrate 300 surrounds the display region 301 of the active matrix substrate 300. In this embodiment, as shown in Fig. 1, a gate driving IC 400 is mounted on an end portion on the -X side of the frame region 302 by the COF method using a flexible substrate 410. Also, a data driving IC 500 is mounted on an end portion on the +Y side of the frame region 302 by the COF method using a flexible substrate 510.

[0027] As shown in Fig. 3, a gate terminal 330 and a gate connection wiring 335 are provided at an end of the frame region 302 of the active matrix substrate 300 on the -X side. The gate terminal 330 is a terminal for connecting the gate wiring GL to the outside of the active matrix substrate 300. The gate connection wiring 335 connects the gate wiring GL to the gate terminal 330. Note that the outside of the active matrix substrate 300 refers to devices, members, drive circuits, etc. other than the active matrix substrate 300. In this embodiment, the flexible substrates 410 and 510 correspond to the outside. Also, in Fig. 3, for ease of understanding, only a part of the frame region 302 of the active matrix substrate 300 is illustrated.

[0028] In this embodiment, adjacent gate lines GL are connected to one gate driving IC 400 via the same number of gate terminals 330. In this specification, for ease of understanding, the gate terminals 330 and the gate connection lines 335 will be described using as an example a configuration (FIG. 3) in which five adjacent gate lines GL are connected to one gate driving IC 400 via five gate terminals 330. The data terminals 340 and the data connection lines 345 will also be described in the same manner as the gate terminals 330 and the gate connection lines 335.

[0029] The gate terminal 330 has a rectangular shape that is long in the Y direction perpendicular to the direction (X direction) in which the gate wiring GL extends. The five gate terminals 330 are arranged in the X direction perpendicular to the arrangement direction (Y direction) of the gate wiring GL. Since the gate terminals 330 are arranged in the X direction perpendicular to the arrangement direction of the gate wiring GL, as shown in FIG. 3, by setting the interval P1 of the gate terminals 330 to an interval that facilitates connection to the flexible substrate 410, even if the arrangement width D1 of the gate terminals 330 is wider than the arrangement width D2 of the gate wiring GL, the arrangement of the gate terminals 330 can be accommodated within the arrangement width D2 of the gate wiring GL. That is, since the arrangement direction of the gate wiring GL and the arrangement direction AD1 of the gate terminals 330 are perpendicular to each other, the arrangement of the gate terminals 330 can be accommodated within the arrangement width D2 of the gate wiring GL, and the interval P1 of the gate terminals 330 can be set to an interval that facilitates connection to the flexible substrate 410 regardless of the interval P2 of the gate wiring GL (pixel pitch of the pixels PX). This can improve the yield of the process of connecting the flexible substrate 410 to the gate terminal 330. It also increases the options for usable flexible substrates 410. Furthermore, it can reduce the manufacturing cost of the liquid crystal display device 10.

[0030] The gate connection wiring 335 connects the gate line GL and the gate terminal 330. Each of the gate connection wirings 335 has a first portion 335a, a second portion 335b, and a third portion 335c. The first portion 335a extends from the gate terminal 330 in the -Y direction, and the second portion 335b extends from the first portion 335a in the +X direction. The third portion 335c extends from the second portion 335b to an end of the gate line GL. Since each of the gate connection wirings 335 extends in the -Y direction and then in the +X direction, the interval P3 of the second portion 335b that extends in the X direction and does not need to sandwich the pixel electrode 310 and the switching element 320 can be made extremely narrower than the interval P2 of the gate line GL, and the length L1 of the first portion 335a extending in the Y direction can be shortened.

[0031] In this embodiment, as described above, since the arrangement direction AD1 of the gate terminals 330 and the arrangement direction of the gate wiring GL are perpendicular to each other, even if the arrangement width D1 of the gate terminals 330 is wider than the arrangement width D2 of the gate wiring GL, the arrangement of the gate terminals 330 can be accommodated within the arrangement width D2 of the gate wiring GL. In addition, since the gate terminals 330 are merely electrodes electrically connected to the flexible substrate 410, the length L2 of the gate terminals 330 in the connection direction (Y direction) to the flexible substrate 410 can be made extremely short. Furthermore, as described above, the length L1 of the first portion 335a of the gate connection wiring 335 extending in the arrangement direction (Y direction) of the gate wiring GL can also be made short. As a result, even if the arrangement width D1 of the gate terminals 330 is wider than the arrangement width D2 of the gate wiring GL as shown in FIG. 3, the width D3 in the arrangement direction (Y direction) of the gate wiring GL required to provide the gate terminals 330 can be made equal to or smaller than the arrangement width D2 of the gate wiring GL. The width D3 in the arrangement direction (Y direction) of the gate wiring GL required to provide the gate terminal 330 is the sum of the width in the arrangement direction of the gate wiring GL of the region where the gate terminal 330 is provided (in this embodiment, the length L2 in the Y direction of the gate terminal 330) and the width in the arrangement direction of the gate wiring GL of the region required to connect the gate wiring GL and the gate terminal 330 (in this embodiment, the longest length of the length L1 of the first portion 335a).

[0032] On the other hand, when the gate terminals 330 are arranged in the same direction as the arrangement direction of the gate wirings GL (Y direction) and the arrangement width D1 of the gate terminals 330 is wider than the arrangement width D2 of the gate wirings GL (hereinafter referred to as a comparative example), the width D3 in the arrangement direction of the gate wirings GL required to provide the gate terminals 330 is wider than the arrangement width D2 of the gate wirings GL, as shown in Fig. 4. That is, in the comparative example, by setting the interval P1 of the gate terminals 330 to an interval that facilitates connection to the flexible substrate 410, the arrangement width D1 of the gate terminals 330 is widened, and the width D3 in the arrangement direction of the gate wirings GL required to provide the gate terminals 330 becomes wider than the arrangement width D2 of the gate wirings GL.

[0033] As shown in Fig. 5, a data terminal 340 and a data connection wiring 345 are provided at an end on the +Y side of the frame region 302 of the active matrix substrate 300. The data terminal 340 is a terminal for connecting the data wiring DL to the outside of the active matrix substrate 300 (flexible substrate 510). The data connection wiring 345 connects the data wiring DL and the data terminal 340. Note that Fig. 5 illustrates only a part of the frame region 302 of the active matrix substrate 300 for ease of understanding. Hereinafter, the data terminal 340 and the gate terminal 330 may be collectively referred to as terminals. Furthermore, the gate connection wiring 335 and the data connection wiring 345 may be collectively referred to as connection wiring.

[0034] In this embodiment, adjacent data lines DL are connected to one data driving IC 500 via the same number of data terminals 340. The data terminals 340 and the data connecting lines 345 will be described using a configuration (FIG. 5) in which five adjacent data lines DL are connected to one data driving IC 500 via five data terminals 340, as in the case of the gate terminals 330 and the gate connecting lines 335.

[0035] The data terminal 340 has a rectangular shape that is long in the X direction perpendicular to the direction (Y direction) in which the data wiring DL extends. The five data terminals 340 are arranged in the Y direction perpendicular to the arrangement direction (X direction) of the data wiring DL. Since the arrangement direction of the data wiring DL and the arrangement direction AD2 of the data terminals 340 are perpendicular to each other, the arrangement of the data terminals 340 can be accommodated within the arrangement width D6 of the data wiring DL, as with the gate terminal 330, even if the arrangement width D5 of the data terminals 340 is wider than the arrangement width D6 of the data wiring DL, and the interval P5 of the data terminals 340 can be set to an interval that facilitates connection to the flexible substrate 510, regardless of the interval P6 of the data wiring DL (pixel pitch of the pixels PX). This can improve the yield of the process of connecting the flexible substrate 510 to the data terminals 340. In addition, the number of options for the flexible substrate 510 that can be used can be increased, and the manufacturing cost of the liquid crystal display device 10 can be reduced.

[0036] The data connection wiring 345 connects the data wiring DL and the data terminal 340. Each of the data connection wirings 345 has a fifth portion 345a, a sixth portion 345b, and a seventh portion 345c. The fifth portion 345a extends from the data terminal 340 in the -X direction, and the sixth portion 345b extends from the fifth portion 345a in the -Y direction. The seventh portion 345c extends from the sixth portion 345b to an end of the data wiring DL. Since each of the data connection wirings 345 extends in the -X direction and then in the -Y direction, similarly to the gate connection wiring 335, the interval P7 of the sixth portion 345b can be made extremely narrower than the interval P6 of the data wiring DL, and the length L5 of the fifth portion 345a extending in the X direction can be shortened.

[0037] In this embodiment, even if the arrangement width D5 of the data terminals 340 is wider than the arrangement width D6 of the data wirings DL, the arrangement of the data terminals 340 can be accommodated within the arrangement width D6 of the data wirings DL. Moreover, since the data terminals 340 are merely electrodes electrically connected to the flexible substrate 510, the length L6 of the data terminals 340 in the connection direction (X direction) to the flexible substrate 510 can be made extremely short. Furthermore, the length L5 of the fifth portion 345a of the data connection wiring 345 extending in the arrangement direction of the data wirings DL can also be made short. As a result, as shown in FIG. 5, even if the arrangement width D5 of the data terminals 340 is wider than the arrangement width D6 of the data wirings DL, the width D7 in the arrangement direction of the data wirings DL required to provide the data terminals 340 can be made equal to or smaller than the arrangement width D6 of the data wirings DL.

[0038] The liquid crystal LC of the liquid crystal display panel 100 is a nematic liquid crystal. The liquid crystal LC is homogeneously oriented by the alignment film of the counter substrate 200 and the alignment film of the active matrix substrate 300. The liquid crystal LC rotates in a plane parallel to the surface 300a of the active matrix substrate 300 due to a lateral electric field generated by a potential difference between the pixel electrode 310 and the common electrode. This allows the amount of light transmitted through each pixel PX to be controlled for each pixel PX.

[0039] The gate driving IC 400 of the liquid crystal display device 10 sequentially supplies scanning signals to the gate wiring GL of the liquid crystal display panel 100 based on a signal from the driving circuit, thereby sequentially driving the pixels PX having the switching elements 320 connected to the gate wiring GL. As shown in FIG. 6, the gate driving IC 400 is connected to the gate terminal 330 via a flexible substrate 410 (COF method). The flexible substrate 410 on which the gate driving IC 400 is mounted has wiring connecting the gate driving IC 400 and the gate terminal 330, and is connected to the multiple gate terminals 330 by thermocompression bonding using an anisotropic conductive film (ACF). The flexible substrate 410 is also connected to the driving circuit. Note that the wiring of the flexible substrate 410, the gate connection wiring 335, etc. are omitted in FIG. 6.

[0040] The data driving IC 500 of the liquid crystal display device 10 supplies an image signal (grayscale voltage) to each of the data wirings DL of the liquid crystal display panel 100 based on a signal from the driving circuit. The data driving IC 500 is connected to the data terminal 340 via a flexible substrate 510 as shown in Fig. 7. The flexible substrate 510 has a similar configuration to that of the flexible substrate 410. Note that the wiring of the flexible substrate 510, the data connection wiring 345, etc. are omitted in Fig. 7.

[0041] As described above, the gate terminals 330 are arranged in a direction (Y direction) perpendicular to the arrangement direction (X direction) of the gate lines GL connected to the gate terminals 330, and the data terminals 340 are arranged in a direction (X direction) perpendicular to the arrangement direction (Y direction) of the data lines DL connected to the data terminals 340. This allows the intervals between the terminals (the interval P1 between the gate terminals 330, the interval P5 between the data terminals 340) to be set to intervals that facilitate connection to the flexible substrates 410 and 510, regardless of the pixel pitch of the pixels PX (the interval P2 between the gate lines GL, the interval P6 between the data lines DL). Furthermore, even if the arrangement width of the terminals (the arrangement width D1 of the gate terminals 330, the arrangement width D5 of the data terminals 340) is wider than the arrangement width of the pixel lines (the arrangement width D2 of the gate lines GL, the arrangement width D6 of the data lines), the width in the arrangement direction of the pixel lines required to provide the terminals (the width D3 in the arrangement direction of the gate lines GL, the width D7 in the arrangement direction of the data lines DL) can be set to be equal to or smaller than the arrangement width of the pixel lines.

[0042] <Embodiment 2> In the first embodiment, the terminals (gate terminals 330, data terminals 340) are arranged in a direction perpendicular to the arrangement direction of the pixel lines (gate lines GL, data lines DL) connected to the terminals. The arrangement direction of the terminals and the arrangement direction of the pixel lines may be different.

[0043] In this embodiment, the arrangement direction of the terminals and the arrangement direction of the pixel lines will be described using the gate lines GL and the gate terminals 330 as examples. The configuration of the liquid crystal display device 10 of this embodiment is similar to that of the liquid crystal display device 10 of embodiment 1, except for the configuration of the gate terminals 330.

[0044] 8, the arrangement direction AD1 of the gate terminals 330 in this embodiment is rotated at an acute angle (angle θ) clockwise with respect to the +Y direction, which is the arrangement direction of the gate lines GL. That is, the arrangement direction of the gate lines GL and the arrangement direction AD1 of the gate terminals 330 are different.

[0045] 8, since the arrangement direction of the gate wirings GL and the arrangement direction AD1 of the gate terminals 330 are different, even if the arrangement width D1 of the gate terminals 330 is wider than the arrangement width D2 of the gate wirings GL, the arrangement of the gate terminals 330 can be accommodated within the arrangement width D2 of the gate wirings GL. Furthermore, as in the first embodiment, the length L2 of the gate terminals 330 in the connection direction to the flexible substrate 410 can be made extremely short, and the length L1 of the first portion 335a of the gate connection wiring 335 extending in the Y direction can be made short. As a result, even if the arrangement width D1 of the gate terminals 330 is wider than the arrangement width D2 of the gate wirings GL, the width D3 in the arrangement direction of the gate wirings GL required to provide the gate terminals 330 can be made narrower than the arrangement width D2 of the gate wirings GL.

[0046] Moreover, similarly to the first embodiment, the interval P1 between the gate terminals 330 can be set to an interval that facilitates connection to the flexible substrate 410. This improves the yield in the process of connecting the flexible substrate 410 to the gate terminals 330, and increases the options for usable flexible substrates 410. It also reduces the manufacturing cost of the liquid crystal display device 10. Furthermore, the lengths of the gate connection wiring 335 and the data connection wiring 345 can be shortened.

[0047] 9, assuming a configuration in which the gate terminals 330 are arranged over the entire length of the arrangement width D2 of the gate wiring GL, the width D3 in the arrangement direction of the gate wiring GL required to provide the gate terminals 330 is expressed by the following formula (1). Therefore, it is preferable that the angle θ between the arrangement direction AD1 of the gate terminals 330 and the +Y direction satisfies the following formula (2).

[0048]

number

number

[0049] <Embodiment 3> The liquid crystal display panel 100 (active matrix substrate 300) of the liquid crystal display device 10 may be curved. In addition, it is sufficient that either the gate terminals 330 or the data terminals 340 are arranged in a direction perpendicular to the arrangement direction of the pixel wirings to which they are connected. The configurations of the gate driving IC 400 and the data driving IC 500 of this embodiment are the same as those of the first embodiment. Here, the liquid crystal display panel 100 of this embodiment will be described.

[0050] The liquid crystal display panel 100 (active matrix substrate 300) of this embodiment is curved in a convex shape toward the -Z side around a curved axis parallel to the X-axis, as shown in Fig. 10. The configurations of the counter substrate 200, the pixel electrodes 310, the switching elements 320, the gate lines GL, and the data lines DL of the active matrix substrate 300 are the same as those of the first embodiment. Here, the gate terminals 330, the gate connection lines 335, the data terminals 340, and the data connection lines 345 will be described.

[0051] The gate terminals 330 of this embodiment have a rectangular shape, similar to the gate terminals 330 of embodiment 1, and are arranged in the X direction perpendicular to the arrangement direction (Y direction) of the gate lines GL (FIG. 3). Furthermore, the gate connection lines 335 of this embodiment connect the gate lines GL and the gate terminals 330, similar to the gate connection lines 335 of embodiment 1.

[0052] In this embodiment, since the gate terminals 330 are arranged in the X direction, when the active matrix substrate 300 is viewed in a plan view, the arrangement direction AD1 of the gate terminals 330 and the curvature axis BD of the active matrix substrate 300 are parallel to each other as shown in Fig. 11. This makes it possible to reduce stress caused by the curvature of the active matrix substrate 300, which is applied to the gate terminals 330 and the flexible substrate 410 when the gate driving IC 400 is mounted.

[0053] 12, the data terminals 340 of this embodiment have a rectangular shape and are arranged in the same direction (parallel direction) as the arrangement direction (X direction) of the data wiring DL. In this embodiment, the arrangement width D5 of the data terminals 340 is narrower than the arrangement width D6 of the data wiring DL. The data connection wiring 345 of this embodiment linearly connects the data terminals 340 and the data wiring DL.

[0054] Since the data terminals are arranged in the X direction, when the active matrix substrate 300 is viewed in a plan view, the arrangement direction AD2 of the data terminals 340 and the curvature axis BD of the active matrix substrate 300 are also parallel. Therefore, even when the data driving IC 500 is mounted, the stress caused by the curvature of the active matrix substrate 300 that is applied to the data terminals 340 and the flexible substrate 510 can be alleviated.

[0055] In this embodiment, the arrangement direction of the terminals (arrangement direction AD1 of the gate terminals 330, arrangement direction AD2 of the data terminals 340) and the curvature axis BD of the active matrix substrate 300 are parallel, so that the stress caused by the curvature of the active matrix substrate 300 acting on the terminals (gate terminals 330, data terminals 340) and the flexible substrates 410 and 510 can be alleviated. Furthermore, the arrangement direction AD of the gate terminals 330 and the arrangement direction of the gate lines GL are perpendicular to each other, so that the interval P1 of the gate terminals 330 can be set to an interval that facilitates connection to the flexible substrate 410, regardless of the pixel pitch of the pixels PX, as in the first embodiment. Furthermore, even if the arrangement width D1 of the gate terminals 330 is wider than the arrangement width D2 of the gate lines GL, the width D3 of the arrangement direction of the gate lines GL required for providing the gate terminals 330 can be set to be equal to or smaller than the arrangement width D2 of the gate lines GL.

[0056] <Embodiment 4> In the first embodiment, the flexible substrate 410 extends from the gate terminal 330 to be connected to the +Y side, and does not overlap the gate connection wiring 335 connected to the gate terminal 330. Moreover, the flexible substrate 510 extends from the data terminal 340 to be connected to the +X side, and does not overlap the data connection wiring 345 connected to the data terminal 340. The flexible substrate 410 may overlap the gate connection wiring 335, and the flexible substrate 510 may overlap the data connection wiring 345. Here, the flexible substrate 410 will be described taking the flexible substrate 410, the gate terminal 330, and the gate connection wiring 335 as examples.

[0057] The flexible substrate 410 on which the gate driving IC 400 is mounted is connected to the gate terminal 330 by thermocompression bonding using an anisotropic conductive film (ACF). In this embodiment, as shown in Fig. 13, the flexible substrate 410 extends from the gate terminal 330 to the -Y side and overlaps with the gate connection wiring 335 that connects the gate terminal 330 and the gate wiring GL.

[0058] 13 and 14, the flexible substrate 410 has a shield portion 412 on a surface 410a facing the gate connection wiring 335 (active matrix substrate 300). The shield portion 412 blocks noise between the wiring of the flexible substrate 410 and the gate connection wiring 335. The shield portion 412 is formed in a thin film shape from copper (Cu), aluminum (Al), or the like.

[0059] In this embodiment, the flexible substrate 410 is disposed at a position overlapping the gate connection wiring 335, so that it is possible to reduce the space required for disposing the flexible substrate 410. In addition, the flexible substrate 410 has a shield portion 412 on a surface 410a facing the gate connection wiring 335, so that noise between the wiring of the flexible substrate 410 and the gate connection wiring 335 can be shielded.

[0060] <Embodiment 5> In the first to fourth embodiments, the active matrix substrate 300 is used in a liquid crystal display device 10. The active matrix substrate 300 may also be used in other devices. In this embodiment, a self-luminous display device 20 including the active matrix substrate 300 will be described.

[0061] The self-luminous display device 20 is, for example, an OLED (Organic Light Emitting Diode) display device. As shown in Fig. 15, the self-luminous display device 20 includes an OLED display panel 120, a gate driving IC 400, and a data driving IC 500. The self-luminous display device 20 also includes a driving circuit (not shown). Since the configurations of the gate driving IC 400 and the data driving IC 500 are the same as those of the first embodiment, the OLED display panel 120 will be described.

[0062] The OLED display panel 120 includes a sealing substrate 220 and an active matrix substrate 300. The OLED display panel 120 has a display area 21 capable of displaying characters, images, and the like, and a frame area 22 surrounding the display area 21. In the display area 21, a plurality of pixels PX are arranged in a matrix, similar to the liquid crystal display panel 100 of the first embodiment. In addition, a gate driving IC 400 and a data driving IC 500 are mounted in the frame area 22.

[0063] The sealing substrate 220 of the OLED display panel 120 is bonded to the active matrix substrate 300 by a glass frit. The sealing substrate 220 seals the display area 301 of the active matrix substrate 300. Dry air is sealed between the sealing substrate 220 and the active matrix substrate 300.

[0064] The active matrix substrate 300 of the OLED display panel 120 is, for example, a glass substrate. In a display region 301 (surface 300a) of the active matrix substrate 300, switching elements 322, light-emitting elements E1, gate lines GL, data lines DL, etc. are provided as shown in FIG.

[0065] The configurations of the gate lines GL and the data lines DL in this embodiment are similar to those of the gate lines GL and the data lines DL in embodiment 1. In this embodiment, the gate lines GL and the data lines DL surround the switching elements 322 and 324, the storage capacitor C1, and the light-emitting element E1 that form the pixel PX.

[0066] The switching elements 322 and 324 and the storage capacitor C1 of the active matrix substrate 300 form a pixel circuit. The pixel circuit controls the emission of the light emitting element E1. The pixel circuit is connected to a gate driving IC 400 and a data driving IC 500 via a gate line GL and a data line DL.

[0067] The switching element 322 is a TFT element that selects the pixel PX. A gate electrode of the switching element 322 is connected to the gate line GL. A source electrode of the switching element 322 is connected to the data line DL. A drain electrode of the switching element 322 is connected to the gate electrode of the switching element 324.

[0068] The switching element 324 is a TFT element that drives the light-emitting element E1. A gate electrode of the switching element 324 is connected to a drain electrode of the switching element 322, and a source electrode of the switching element 324 is connected to a power supply line Vdd. A drain electrode of the switching element 324 is connected to an anode electrode 602 of the light-emitting element E1, which will be described later. The cathode electrode of the light-emitting element E1 is connected to a cathode wiring 325. In this embodiment, the anode electrode 602 of the light-emitting element E1 corresponds to a pixel electrode.

[0069] The storage capacitor C1 is formed between the anode electrode 602 of the light emitting element E1 and the gate electrode of the switching element 324.

[0070] The pixel circuit operates as follows. The gate driving IC 400 outputs a scanning signal to the gate line GL to open the switching element 322. When the switching element 322 is in the open state, the grayscale voltage supplied via the data driving IC 500 and the data line DL is held in the holding capacitance C1. The voltage held in the holding capacitance C1 changes the open / close state of the switching element 324, and a current corresponding to the grayscale of the light-emitting element E1 is supplied from the power line Vdd to the light-emitting element E1. Then, the light-emitting element E1 emits light, and characters, images, etc. are displayed in the display area 21.

[0071] As shown in FIG. 17, the light-emitting element E1 is formed of an anode electrode (pixel electrode) 602, a self-emitting portion 604, and a cathode electrode 606. The anode electrode 602 is connected to the drain electrode of the switching element 324. The anode electrode 602 is formed of, for example, three layers of ITO and an aluminum alloy or a silver alloy and ITO. The self-emitting portion 604 is provided on the anode electrode 602. The self-emitting portion 604 is formed of, for example, a hole injection layer, a hole transport layer, an organic light-emitting layer, an electron transport layer, and an electron injection layer. The cathode electrode 606 is provided on the self-emitting portion 604 and connected to the cathode wiring 325. The cathode electrode 606 is formed of lithium (Li), aluminum, magnesium (Mg), ytterbium (Yb), an alloy thereof, or the like.

[0072] The configurations of the gate terminals 330 and the data terminals 340 of the active matrix substrate 300 are the same as those in the first embodiment (FIGS. 3 and 5). In this embodiment as well, the gate terminals 330, the data terminals 340, the gate connection wirings 335, and the data connection wirings 345 are provided in the frame region 302 (surface 300a) of the active matrix substrate 300. The gate terminals 330 connected to the gate wirings GL are arranged in a direction perpendicular to the arrangement direction of the gate wirings GL. The data terminals 340 connected to the data wirings DL are arranged in a direction perpendicular to the arrangement direction of the data wirings DL. The gate terminals 330 and the gate wirings GL are connected by the gate connection wirings 335, and the data terminals 340 and the data wirings DL are connected by the data connection wirings 345.

[0073] As described above, the active matrix substrate 300 of this embodiment is used in the self-luminous display device 20.

[0074] <Embodiment 6> In the first to fourth embodiments, the active matrix substrate 300 is used in a liquid crystal display device 10. The active matrix substrate 300 may also be used in an imaging device 30.

[0075] The imaging device 30 captures, for example, an X-ray image. As shown in Fig. 18, the imaging device 30 includes a scintillator substrate 240, an active matrix substrate 300, a gate driving IC 400, and a data read IC 505. The imaging device 30 also includes a driving circuit, an image processing circuit, and the like (not shown).

[0076] The imaging device 30 has an imaging region 31 capable of capturing an X-ray image, and a frame region 32 surrounding the imaging region 31. A plurality of pixels PX are arranged in a matrix in the imaging region 31. A gate driving IC 400 and a data read IC 505 are mounted in the frame region 32. The frame region 32 is formed from a frame region 302 of an active matrix substrate 300, as in the first embodiment.

[0077] The scintillator substrate 240 of the imaging device 30 is located on the +Z side (image target side) and faces the active matrix substrate 300. The scintillator substrate 240 is attached to the active matrix substrate 300 by a sealing material (not shown). The scintillator substrate 240 is a glass substrate or a resin film having a scintillator layer formed on the surface facing the active matrix substrate 300. The scintillator layer is made of a phosphor and converts X-rays into visible light. The scintillator substrate 240 functions as a scintillator.

[0078] The active matrix substrate 300 of the imaging device 30 is located on the -Z side and faces the scintillator substrate 240. The active matrix substrate 300 is, for example, a glass substrate.

[0079] 19, a switching element 326, a photoelectric conversion element E2, a gate line GL, and a data line DL are provided in an imaging region 301 (surface 300a) of an active matrix substrate 300. The photoelectric conversion element E2 is, for example, a photodiode.

[0080] The configurations of the gate lines GL and the data lines DL are similar to those of the gate lines GL and the data lines DL in embodiment 1. In this embodiment, the gate lines GL and the data lines DL surround the switching element 326 and the photoelectric conversion element E2 that form the pixel PX.

[0081] The switching element 326 is, for example, a TFT element. A gate electrode of the switching element 326 is connected to a gate line GL. A source electrode of the switching element 326 is connected to a first electrode 612 (a cathode terminal of a photodiode) described later. A drain electrode of the switching element 326 is connected to a data line DL. In this embodiment, the first electrode 612 corresponds to a pixel electrode.

[0082] The photoelectric conversion element E2 of this embodiment is a PIN photodiode. The photoelectric conversion element (PIN photodiode) E2 accumulates a signal charge according to the amount of visible light converted from X-rays by the scintillator substrate 240.

[0083] As shown in FIG. 20, the photoelectric conversion element E2 has an n-type amorphous silicon layer 613, an intrinsic amorphous silicon layer 614, and a p-type amorphous silicon layer 615. The n-type amorphous silicon layer 613 is formed on the first electrode 612, and the intrinsic amorphous silicon layer 614 is formed on the n-type amorphous silicon layer 613. The p-type amorphous silicon layer 615 is formed on the intrinsic amorphous silicon layer 614. In addition, a second electrode (anode terminal) 616 is formed on the p-type amorphous silicon layer 615. The second electrode 616 is connected to a bias wiring BL that supplies a bias voltage. The first electrode 612 is formed of chromium (Cr), molybdenum, aluminum, or the like, and the second electrode 616 is formed of ITO.

[0084] In the frame region 302 (surface 300a) of the active matrix substrate 300, gate terminals 330, data terminals 340, gate connection lines 335, and data connection lines 345 are provided, as in the first embodiment. The configurations of the gate terminals 330 and the data terminals 340 are the same as in the first embodiment (FIGS. 3 and 5). In this embodiment as well, the gate terminals 330 are arranged in a direction perpendicular to the arrangement direction of the gate lines GL. The data terminals 340 are arranged in a direction perpendicular to the arrangement direction of the data lines DL. The gate terminals 330 and the gate lines GL are connected by the gate connection lines 335, and the data terminals 340 and the data lines DL are connected by the data connection lines 345.

[0085] The gate driving IC 400 of the imaging device 30 sequentially supplies scanning signals to the gate lines GL based on signals from the driving circuit, thereby sequentially opening the switching elements 326 connected to the gate lines GL. The gate driving IC 400 is connected to the gate terminal 330 via a flexible substrate 410, similar to the gate driving IC 400 of the first embodiment.

[0086] The data read IC 505 of the imaging device 30 reads out the signal charge accumulated in the photoelectric conversion element E2 through the data wiring DL, and outputs a voltage value according to the read signal charge to the image processing circuit. The data read IC 505 is connected to the data terminal 340 through the flexible substrate 510, similar to the data drive IC 500 of the first embodiment.

[0087] Here, the reading of the signal charge will be described. The anode terminal of the photoelectric conversion element E2 is connected to the bias wiring BL, and a bias potential is applied to the anode terminal of the photoelectric conversion element E2. On the other hand, a reference potential is applied to the data wiring DL. Therefore, when the switching element 326 is in an open state, the photoelectric conversion element E2 is charged with a differential voltage between the bias potential and the reference potential. In this embodiment, the differential voltage is set to a reverse bias voltage in which the cathode potential is higher than the anode potential. The charge required to recharge the photoelectric conversion element E2 to the reverse bias voltage depends on the amount of visible light irradiated on the photoelectric conversion element E2. The data reading IC 505 reads out the signal charge by integrating the current flowing when the photoelectric conversion element E2 is recharged to the reverse bias.

[0088] The imaging device 30 reads out the signal charge accumulated in the photoelectric conversion element E2 according to the amount of X-ray irradiation (the amount of visible light converted from X-rays) by opening the switching element 326. The imaging device 30 captures an X-ray image by reading out the signal charge accumulated in the photoelectric conversion element E2 from each of the pixels PX.

[0089] As described above, the active matrix substrate 300 of this embodiment is used in the imaging device 30.

[0090] <Modification> Although the embodiments have been described above, the present disclosure can be modified in various ways without departing from the gist of the present disclosure.

[0091] The objects to be connected to the terminals (gate terminal 330, data terminal 340) are not limited to the flexible substrates 410, 510. For example, the gate driving IC 400 may be directly connected to the gate terminal 330.

[0092] In the first embodiment, the pixel electrodes 310, the switching elements 320, and the common electrode are provided on the active matrix substrate 300. The common electrode does not have to be provided on the active matrix substrate 300. For example, when the liquid crystal display panel 100 operates in a TN (Twisted Nematic) mode, the common electrode is provided on the counter substrate 200.

[0093] In the active matrix substrate 300 of the second embodiment, the arrangement direction of the terminals is different from that of the pixel wirings. In the active matrix substrates 300 of the fifth and sixth embodiments, the arrangement direction of the terminals is different from that of the pixel wirings.

[0094] In the third embodiment, the arrangement direction of the terminals is parallel to the curvature axis BD of the active matrix substrate 300. The arrangement direction of the terminals and the curvature axis BD of the active matrix substrate 300 need not be perpendicular in a plan view. This makes it possible to reduce stress acting on the terminals and flexible substrates 410 and 510 due to the curvature of the active matrix substrate 300.

[0095] Although the self-luminous display device 20 of the fifth embodiment is an OLED display device, the self-luminous display device 20 is not limited to an OLED display device. The self-luminous display device 20 may be, for example, a micro LED (Light emitting diode) display device. When the self-luminous display device 20 is a micro LED display device, an LED chip is provided as a self-luminous unit 604 on a pixel electrode 602 of an active matrix substrate 300.

[0096] Although the imaging device 30 of the fifth embodiment captures an X-ray image, the image captured by the imaging device 30 is not limited to an X-ray image. For example, the imaging device 30 may capture a visible light image.

[0097] In the first to sixth embodiments, one gate driving IC 400 is mounted on one flexible substrate 410 and connected to the gate terminal 330. As shown in FIG. 21, a plurality of gate driving ICs 400 may be mounted on one flexible substrate 415 and connected to the gate terminal 330. This can reduce the number of steps for mounting the gate driving IC 400 on the active matrix substrate 300, and can improve the manufacturing yield. Furthermore, the driving circuit may be provided on the flexible substrate 415. Note that, in FIG. 21, the gate terminal 330 and the gate connection wiring 335 are omitted for ease of understanding. Also, regarding the data driving IC 500 and the data readout IC 505, a plurality of data driving ICs 500 or data readout ICs 505 may be mounted on one flexible substrate.

[0098] In the present disclosure, it is preferable that the resistance values ​​of the connection wirings (gate connection wirings 335 or data connection wirings 345) are equal. For example, as shown in Fig. 22, the resistance values ​​of the gate connection wirings 335 can be made equal by bending the gate connection wirings 335 and making the lengths L3 of the gate connection wirings 335 equal. Also, as shown in Fig. 23, the resistance values ​​of the gate connection wirings 335 can be made equal by adjusting the width D8 of the gate connection wirings 335. In the present disclosure, since the arrangement direction of the pixel wirings and the arrangement direction of the terminals are different, it is possible to easily ensure a space in which the length or width of each connection wiring can be adjusted.

[0099] Although the preferred embodiments have been described above, the present disclosure is not limited to such specific embodiments, and the present disclosure includes the invention described in the claims and their equivalents. [Explanation of symbols]

[0100] 10 liquid crystal display device, 11 display area, 12 frame area, 20 self-luminous display device, 21 display area, 22 frame area, 30 imaging device, 31 imaging area, 32 frame area, 100 liquid crystal display panel, 120 OLED display panel, 200 opposing substrate, 220 sealing substrate, 240 scintillator substrate, 300 active matrix substrate, 300a surface, 301 display area, imaging area, 302 frame area, 310 pixel electrode, 320, 322, 324, 326 switching element, 325 cathode wiring, 330 gate terminal, 335 gate connection wiring, 335a first portion, 335b second portion, 335c third portion, 340 data terminal, 345 data connection wiring, 345a fifth portion, 345b sixth portion, 345c seventh portion, 400 Gate driving IC, 410, 415 Flexible substrate, 410a surface, 412 Shielding portion, 500 Data driving IC, 505 Data readout IC, 510 Flexible substrate, 602 Anode electrode (pixel electrode), 604 Self-emitting portion, 606 Cathode electrode, 612 First electrode (pixel electrode), 613 N-type amorphous silicon layer, 614 Intrinsic amorphous silicon layer, 615 P-type amorphous silicon layer, 616 Second electrode, AD1, AD2 Array direction, ACF Anisotropic conductive film, BD Curved axis, BL Bias wiring, C1 Storage capacitance, DL Data wiring, E1 Light-emitting element, E2 Photoelectric conversion element, GL Gate wiring, LC Liquid crystal, P1 to P3, P5 to P7 Interval, PX Pixel, Vdd Power supply line, D1 to D3, D5 to D7 Array width, D8 Width, L1, L2, L3, L5, L6 Length, θ Angle

Claims

1. A plurality of pixel electrodes; A plurality of switching elements connected to the plurality of pixel electrodes, respectively; a plurality of pixel wirings connected to the plurality of switching elements, respectively; A plurality of connection lines connected to the plurality of pixel lines, respectively; a plurality of terminals connected to the plurality of connection wirings, The arrangement direction of the pixel lines and the arrangement direction of the terminals are different. Active matrix substrate.

2. an arrangement width of the plurality of terminals is wider than an arrangement width of the plurality of pixel wirings; 2. The active matrix substrate according to claim 1.

3. an arrangement direction of the pixel wirings and an arrangement direction of the terminals are perpendicular to each other; 3. The active matrix substrate according to claim 1.

4. Curved around a given axis of curvature, When viewed in a plan view, the arrangement direction of the terminals is not perpendicular to the direction of the bending axis.

3. The active matrix substrate according to claim 1.

5. The resistance values ​​of the plurality of connection wirings are equal.

3. The active matrix substrate according to claim 1.

6. a substrate having wiring connected to each of the terminals is disposed in a position overlapping the plurality of connection wirings; the substrate has a shield portion for blocking noise on a surface facing the plurality of connection wirings; 3. The active matrix substrate according to claim 1.

7. a substrate having wiring connected to each of the terminals is disposed in a position overlapping the plurality of connection wirings; A plurality of ICs connected to the wiring and a circuit for supplying signals to the plurality of ICs are provided on the substrate.

3. The active matrix substrate according to claim 1.

8. An active matrix substrate according to claim 1 or 2; an opposing substrate opposed to the active matrix substrate; A liquid crystal sandwiched between the active matrix substrate and the opposing substrate. LCD display device.

9. An active matrix substrate according to claim 1 or 2; A self-emitting portion provided on the pixel electrode. Self-luminous display device.

10. An active matrix substrate according to claim 1 or 2; A photoelectric conversion element provided on the pixel electrode. Imaging device.

Images