Potential stabilizer for connected electronic device
By using potential potential stabilizers composed of metal plates of different hardness and powder or granular metal materials, the ground potential and chassis potential of electronic equipment are solved, miniaturization of equipment and noise suppression are achieved, and manufacturing and maintenance costs are reduced.
Patent Information
- Application Number
- JP2023120936
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-07-25
- Publication Date
- 2025-02-06
- Estimated Expiration
- 2043-07-25
AI Technical Summary
The prior art is difficult to effectively stabilize the reference potential of electronic devices, and there are problems with noise generation and noise pollution, especially due to fluctuations in ground potential or chassis potential.
A potential potential stabilizer composed of metal plates of different hardness and powdered or granular metal materials can absorb or supply negative charges through charge transfer connections to stabilize the ground potential and chassis potential of the electronic device and suppress noise generation and noise pollution.
It realizes the miniaturization of equipment, is easy to manufacture and maintain, effectively stabilizes the ground potential and chassis potential of electronic equipment, suppresses noise generation and noise pollution, reduces manufacturing costs and simplifies the structure.
Smart Images

Figure 2025017741000001_ABST
Abstract
Description
[Technical field]
[0001] The present invention relates to a potential stabilizer for connected electronic devices that can continuously stabilize the reference potential of electronic devices such as audio equipment, measuring equipment, medical equipment, and amplifiers, and in particular to a potential stabilizer for connected electronic devices that stabilizes the earth potential or chassis earth potential of the electronic devices and suppresses noise generation and noise interference due to fluctuations in the earth potential or chassis earth potential. [Background technology]
[0002] Noise Canceller Device Patent Document 1 and Patent Document 2 are called "noise canceller devices", and the problem of the invention is to continuously stabilize the earth potential of connected electronic devices such as audio devices and electrical components, and to effectively remove ground noise. The solution of the invention of Patent Document 1 is to sandwich a sheet assembly 21, in which a semiconductor sheet having an electrode plate is wrapped in metal foil, between a first metal plate 22 and a second metal plate 24, which are metal plates, and stack them together to form a laminated unit 11. The laminated unit 11 is provided with an earth wiring body 13 connected to the first metal plate 22 and directing electrical energy from an earth terminal of a connected electronic device such as an audio device or electrical components to the laminated unit 11, and a phase rotation circuit 57 connected between the electrode plate and the second metal plate 24 and rotating the phase of the noise component from the sheet assembly 21 and returning it to the laminated unit 11. The semiconductor sheet is made of a material that converts electrical energy into thermal energy using various vibration-damping materials and consumes it (the symbols are those described in Patent Document 1).
[0003] The invention of Patent Document 2 has the same problem as Patent Document 1, and improves the form of a semiconductor sheet equipped with an electrode plate. That is, the invention of Patent Document 2 includes a wound body 13 in which a sheet body equipped with an electrode plate is superimposed on a copper plate sheet and wound into a coil, and a phase rotation circuit 32 that is connected between the electrode plate and the metal sheet and rotates the phase of the noise component from the sheet body and returns it to the copper plate sheet. A first lead wire 28 serving as an input means for inputting a signal component from the outside is electrically connected to the center of the wound body 13 wound into a coil, while a second lead wire 29 serving as an output means for outputting a signal component to the outside is electrically connected to a metal plate (copper plate in the embodiment) on the outer periphery of the wound body 13 (the symbols are those in Patent Document 2).
[0004] (Effects of the noise canceller device of Patent Document 2) The semiconductor sheet (sound quality adjustment material fo.q sheet) in Patent Document 2 is planar, and its contact resistance reducing effect is greater than that of nano-diamond-added copper wire, and it is believed that the copper plate sheet 26 wraps around it to act as a kind of pressurized conductive rubber, so the sound quality adjustment material has a large vibration damping effect, and the dual effects of reduced contact resistance and vibration damping are believed to be the reason for the large improvement in the signal-to-noise ratio of the audio device M. In addition, the noise canceller device used in the embodiment actually achieves a higher noise removal effect than conventional noise canceller devices, and therefore can further continuously stabilize the earth potential in the audio amplifier OA, or the earth potential in the electronic circuit to which electrical components such as the central processing unit CPU and operational amplifier AMP are attached.
[0005] <Problems with Patent Documents 1 and 2> Although Patent Document 1 and Patent Document 2 have the advantage of being able to continuously stabilize the earth potential, they detect the fluctuation of the earth potential using a laminated electrode in which a semiconductor sheet is superimposed on a metal plate, and then rotate the phase of a periodic phenomenon such as a wave and return it to the electrode, thereby converting the power of the fluctuation into thermal energy by the resistance component of the electrode, thereby absorbing and suppressing it. Therefore, a phase rotation circuit is required, and the target fluctuation of the earth potential must have sufficient energy to drive the circuit, and it is predicted that there is a limit to the detection accuracy and phase rotation accuracy for potential fluctuations with a weak power of less than μV. In addition, not only is a semiconductor sheet essential as a material used for the vibration-damping member, but an electronic circuit is also essential. Therefore, there are problems such as a complicated structure, difficult maintenance, and high cost.
[0006] <Filter circuit of Patent Document 3> A related technique with a different technical principle, purpose and configuration from the present invention is the filter circuit of Patent Document 3. This filter circuit aims to suppress high-frequency noise currents caused by stray capacitance by connecting a device having a power supply to an AC circuit network such as a commercial AC power supply, and adopts a configuration in which an inductance that suppresses noise is provided in the earth wire as a solution.
[0007] This filter circuit is configured to provide an impedance load to the current flowing in the earth line, and therefore its technical concept differs from that of a potential stabilizer for connected electronic equipment, which does not act on the current flowing in the earth line (feedback line) as in the present invention. [Prior art documents] [Patent documents]
[0008] [Patent Document 1] JP 2016-100826 A [Patent Document 2] Patent No. 649137 [Patent Document 3] Japanese Utility Model Application Publication No. 61-140620 Summary of the Invention [Problem to be solved by the invention]
[0009] The present invention is based on the idea of incorporating different types of metal plates or different types of powdered or granular metal substances into an exterior body, in consideration of the problems in Patent Documents 1 and 2, without using a semiconductor sheet or a phase rotation circuit, etc., and aims to provide a potential stabilizer that allows for miniaturization of the device, is extremely easy to manufacture, use, maintain, etc., and further stabilizes the earth potential and chassis earth potential of connected electronic devices such as audio equipment and measuring instruments, thereby suppressing noise generation and noise contamination due to fluctuations in the earth potential and chassis earth potential. In addition, if the reference earth potential fluctuates at the earth terminal or output terminal, for example, if it fluctuates to the positive side, there is a shortage of electrons, so electrons are supplied from the potential stabilizer to suppress the rise in potential, and if it fluctuates to the negative side, there is an excess of electrons, so electrons are absorbed to suppress the decrease in potential.
[0010] Meanwhile, those skilled in the art of this type of technology can easily imagine that the influence of the fluctuation in the reference potential described in the Background Art can be superimposed as noise on the transmitted signal (voltage information). Therefore, an object of the present invention is to preferably suppress the difference in the reference potential (e.g., earth potential) between devices.
[0011] The above and other objects and novel features of the present invention will become more fully apparent from the following description taken in conjunction with the accompanying drawings. However, the drawings are for illustrative purposes only and are not intended to limit the technical scope of the present invention. [Means for solving the problem]
[0012] The potential stabilizer for connected electronic equipment of the present invention comprises: Among a thin iron plate (2a), a thin aluminum plate (2b), a thin lead plate (2c), a thin brass plate (2d), and a thin copper plate (2e), at least three of the iron plate (2a), the aluminum plate (2b), and the copper plate (2e) are selected.The laminate is formed by bonding two metal plates together in a surface-to-surface contact state, and the laminate is placed inside an exterior body, with one end electrically connected to the metal plate that constitutes the laminate and the other end electrically connected to an electronic device. Only one The device is characterized by having a connection portion for charge transfer, and absorbing charge from the electronic device or supplying charge to the electronic device via the connection portion for charge transfer in response to fluctuations in either the earth potential or the chassis earth potential. Furthermore, In the potential stabilizer for connected electronic equipment, the metal plate of the laminate is moreover, From the group of materials including magnesium, zinc, tin, titanium, gold, silver, platinum, stainless steel, and cast iron, At least one Selected Contains It is characterized by: Furthermore, In a potential stabilizer for connected electronic equipment, The above When each metal plate of the laminate is cylindrical, it is characterized in that the cylindrical metal plates, whether solid or hollow, namely, an iron rod, a cylindrical lead sheet, a cylindrical aluminum sheet, a cylindrical lead sheet, and a cylindrical copper sheet, are bundled together in the center surrounded by the cylindrical metal plate with the smallest radius.
[0013] The potential stabilizer for connected electronic equipment of the present invention further comprises: In a preferred embodiment, at least five materials are selected from the group consisting of iron, aluminum, lead, brass, copper, magnesium, zinc, tin, titanium, stainless steel, and cast iron. A powder or granular metal object is placed inside an exterior body, one end of the metal object is electrically connected to the metal object, and the other end of the metal object is electrically connected to an electronic device. Only one The device is characterized by comprising a charge transfer connection part, and absorbing negative charge from the electronic device or supplying negative charge to the electronic device via the charge transfer connection part in response to fluctuations in either the earth potential or the chassis earth potential. Here, "electronic device" refers to an acoustic device, a measuring device, a medical device, an amplifier, an information processing device, etc. that uses AC as a power source.
[0014] Here, the term "potential stabilizer" refers to a device that stabilizes the earth potential or chassis earth potential of electronic devices such as audio equipment, measuring equipment, medical equipment, amplifiers, and information processing equipment, and suppresses noise generation or noise interference caused by fluctuations in the earth potential or chassis earth potential. Effect of the Invention
[0015] The present invention is based on the idea of incorporating, for example, types of metals with different hardness (metal plates, powdered or granular metal substances) into an exterior body without using a semiconductor sheet or a phase rotation circuit, etc., which makes it possible to miniaturize the device and makes it extremely easy to manufacture, use, maintain, etc., and further stabilizes the earth potential and chassis earth potential of electronic devices such as audio equipment, measuring instruments, and information processing devices, thereby suppressing noise generation and noise contamination due to fluctuations in the earth potential and chassis earth potential.
[0016] In addition, by simplifying the structure, except for the problem of poor terminal contact (which occurs in common with all devices), not only can the device be made smaller, easier to manufacture, easier to connect to the terminals of connected electronic devices, more flexible maintenance, and lower manufacturing costs be obtained, but there is also no need to create an inverted signal, as in Patent Documents 1 and 2, so there are no problems caused by deviations in control.
[0017] Note that the present invention differs from the filter circuit of Patent Document 3 in that it can simply suppress fluctuations in the earth potential of connected electronic devices such as audio equipment and measuring instruments by supplying and absorbing electric charge (negative electrons).
[0018] For the purpose of deepening understanding, the movement (flow) of electrons in Fig. 10 will be explained with reference to Fig. 11 using a conceptual diagram in which, for example, electronic device Y and plastic bottle X are regarded as the present product. For example, electronic device Y and plastic bottle X, which corresponds to the present device, are electrically connected via a straw 3 as a connection part, and negative electrons flow from the electronic device Y side to the plastic bottle X side, and the electrons flow from the plastic bottle X side to the electronic device Y side (bidirectional movement of electrons).
[0019] Specifically, when a pipe-shaped charge transfer connection part (conductor part) provided on the plastic bottle is connected to one terminal of the connected electronic device (measuring device, stereo playback device, etc.), if the negative charge on the audio device or electronic device Y side increases through the charge transfer connection part 3 in response to a change in either the earth potential or the chassis earth potential, the negative charge flows into the plastic bottle X (i.e., the negative charge is absorbed), while if the positive charge on the audio device or electronic device Y side increases, the negative charge stored in the plastic bottle X flows back into the audio device or electronic device Y (i.e., supplies the negative charge). Therefore, as described later, the maximum value of the fluctuation in the earth potential can be lowered, and the overall wave (frequency) can be made gentle (see FIG. 10). The present invention can be used in an "open loop" for the connected electronic device, as described later. [Brief description of the drawings]
[0020] 1 to 4 are explanatory views showing a first embodiment of the present invention. 5 to 7 are explanatory views showing a second embodiment of the present invention. FIG. 8 is a perspective view of the third embodiment. [Figure 1] FIG. 4 is an explanatory diagram showing the difference between the present invention and a battery. [Diagram 2] 1 is a schematic perspective view of a first embodiment (an exterior body is shown in phantom lines); [Diagram 3] Schematic explanatory diagram from the front (exterior body shown in virtual lines). [Figure 4] FIG. 13 is an end view of the right side of the laminate. [Diagram 5] FIG. 11 is a schematic perspective view of a second embodiment (the exterior body is shown in phantom lines). [Figure 6] Right side view (exterior body shown in phantom lines). [Figure 7] FIG. 13 is an end view of the right side of the laminate. [Figure 8] FIG. [Figure 9] 9 is a cross-sectional view taken along line 9-9 in FIG. 8 . [Figure 10]A schematic diagram showing the movement of electrons due to fluctuations in the reference potential, where the dotted line indicates that fluctuations in the ground potential are suppressed. [Figure 11] A conceptual diagram explaining the movement (flow) of electrons in Figure 10, using electronic device Y and plastic bottle X as examples. [Figure 12] FIG. 1 is a schematic diagram showing the structure of earth potential fluctuations in electronic devices. [Figure 13] FIG. 1 is an explanatory diagram showing a first example of use of the present invention. [Figure 14] These are waveforms showing the change in the earth potential difference that occurs between a preamplifier and a power amplifier depending on whether or not signal amplification (regeneration) is performed when the present invention is not being used. Figure 14(a) shows the potential difference when there is no signal, Figure 14(b) shows the potential difference when signal regeneration is performed, and Figure 14(c) shows the difference between the two. [Figure 15] 1 shows waveforms illustrating the reduction characteristics of the difference in earth potential between a preamplifier and a power amplifier with and without the potential stabilizer of the present invention (also referred to as "the device") (waveform explanatory diagram). [Figure 16] A waveform showing the difference in potential drop in the wire connecting this device to the power amplifier with and without signal amplification (regeneration) (waveform diagram). [Figure 17] FIG. 11 is an explanatory diagram showing a second example of use of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0021] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described in detail with reference to the embodiments shown in the drawings. Figures 1 to 4 are explanatory diagrams showing a first embodiment of the present invention. First, Fig. 1 is an explanatory diagram showing the differences between the present invention and a battery. The left column of Fig. 1 is a section dividing the connection part, the presence or absence of an electrolyte, the connection mode with an electronic device, and the main object of the invention.
[0022] <Differences from batteries> (a) Regarding the number of connection terminals, the present invention has only one connection terminal, whereas the battery has a "-" and a "+" connection terminal. (b) Regarding the presence or absence of an electrolyte, the present invention requires a metal laminate or mixture, but does not require an electrolyte, whereas batteries generally require an electrolyte. (c) Regarding the mode of connection with an electronic device, the present invention is connected directly to the earth terminal of the electronic device, whereas the battery is connected to the "-" and "+" of an electronic circuit or a control device that constitutes an electronic circuit. (d) The main purpose of the invention is to stabilize the earth potential and chassis earth potential of connected electronic devices. In contrast, the battery is used as a power source for control devices, etc. Therefore, the present invention and the battery differ in structure, use, etc.
[0023] First Embodiment 2 to 4 are explanatory diagrams of the first embodiment. In these figures, X is a potential stabilizer for a connected electronic device that is generally board-shaped. Hereinafter, this will be referred to simply as "potential stabilizer" or "the device." This potential stabilizer X is not limited to being used for the earth potential of electronic devices, but can also be used for the potential of the chassis of the electronic device.
[0024] Reference numeral 1 denotes a flat case-type exterior body constituting the potential stabilizer X. The material and external shape of the exterior body can be freely changed.
[0025] The exterior body 1 is a square or rectangular (box-shaped) container that constitutes the external appearance of the potential stabilizer X. In this embodiment, it has a flat case-like shape, and is shown by virtual lines in Fig. 2 and Fig. 3. The bottom and top surfaces of the exterior body 1 are flat. In addition, the peripheral side surfaces (front, back, left and right side surfaces) located between the bottom and top surfaces are each band-shaped, and the connection parts are perpendicular to each other.
[0026] 4, and can protect the laminate 2 from impacts, etc. There is no particular limit to the material of the exterior body 1, but it is preferably made of an insulating resin material such as polycarbonate (PC), polypropylene (PP), polyethylene (PE), polyphenylene sulfide resin (PPS), polybutylene terephthalate (PBT), or ABS resin, or a metal that constitutes the laminate 2.
[0027] 4 is a right end view of the laminate 2 of the first embodiment. In the first embodiment, the laminate 2 is made by overlapping metal plates with different hardness in a surface contact state and joining them together. The metal plates constituting the laminate 2 are selected from the group consisting of iron, aluminum, lead, brass, copper, magnesium, zinc, tin, titanium, gold, silver, platinum, stainless steel, and cast iron. Three The above metal plates are stacked in any order. In a preferred embodiment, the following metal plates are selected from the following materials: iron, aluminum, lead, brass, and copper. At least the iron plate (2a), the aluminum plate (2b), and the copper plate (2e) The most preferable layering order is an iron plate 2a, an aluminum plate 2b, a lead plate 2c, a brass plate 2d, and a copper plate 2e, and each of the metal plates is a thin plate.
[0028] In Fig. 2 and Fig. 3, the reference numeral 3 denotes only one charge transfer connection part, the other end 3a of which is connected to a terminal (e.g., a ground terminal) of an electronic device. One end 3b of this charge transfer connection part 3 is electrically connected to at least one or more metal plates (preferably copper plates) 2e constituting the laminate 2, and can absorb negative charges from an electronic device or supply negative charges to an electronic device through the charge transfer connection part 3 in response to fluctuations in either the ground potential or the chassis ground potential. Since the charge transfer connection part 3 is a connection terminal as a conductor, its shape and structure can be appropriately changed to a protruding piece, a cord-like shape, etc. by using a protruding piece, a conducting wire, etc., but its tip part can be either an insertion type or an external fitting type in response to the shape and structure of the ground terminal or the negative terminal of the electronic device. In addition, when the charge transfer connection part 3 is a protruding piece regardless of the length, the terminal of the electronic device can be made into a protruding piece state and connected in a state in which both protruding pieces are overlapped.
[0029] Second Embodiment 5 to 7 are explanatory diagrams of the second embodiment. In these figures, X1 is a relatively long, cylindrical potential stabilizer for a connected electronic device. Hereinafter, it will be simply referred to as the "second potential stabilizer." This second potential stabilizer X1 can also be used for the potential of the chassis of an electronic device, not limited to the earth potential of the electronic device. In describing the second embodiment, the same or similar reference symbols are used for the same parts as those in the first embodiment, and duplicate descriptions will be omitted.
[0030] The main differences between the second potential stabilizer X1 of the second embodiment and that of the first embodiment are: (1) the shape of the exterior body 1A is a relatively long cylinder whose axial length is at least twice as long as its radial length; and (2) when each metal plate of the laminated body 2A is cylindrical, an iron rod, whether solid or hollow, is arranged in the center, and cylindrical metal plates of cylindrical lead sheet, cylindrical aluminum sheet, cylindrical lead sheet, and cylindrical copper sheet are bundled in any order on the outside of the iron rod, in accordance with the shape of the exterior body 1A. In the embodiment, an iron rod is arranged in the center, and cylindrical metal plates of cylindrical lead sheet, cylindrical aluminum sheet, cylindrical lead sheet, and cylindrical copper sheet are bundled in a nested manner on the outside of the iron rod in any order. Of course, the embodiment is not limited to the above, and each metal plate may be formed into a square tube shape with a rod at the center, and stacked in the radial direction. (3) the charge transfer connection part 3A protrudes from a portion of the upper surface 1a of the cylindrical exterior body 1A near the outer periphery with reference to Fig. 5, and (4) the number of each of the metal plates 2a to 2e of the laminate 2A is reduced by one, and for example, the brass plate 2d of the first embodiment is not present. In this way, even if the structure of the exterior body 1A and the laminate 2A is changed by appropriately increasing or decreasing the number of metal plates, the same object and effect as the first embodiment can be obtained.
[0031] Third embodiment 8 and 9 are explanatory diagrams of the third embodiment. In these Figs. 8 and 9, X2 is, for example, a relatively short cylindrical potential stabilizer for connected electronic equipment. Hereinafter, it will be simply referred to as the "third potential stabilizer." This third potential stabilizer X2 can also be used for the potential of the chassis of an electronic equipment, not limited to the earth potential of the electronic equipment. In describing this third embodiment, the same or similar reference numerals are used for the same parts as those in the first or second embodiment, and duplicate descriptions will be omitted.
[0032] This third potential stabilizer X2 is a mixture 2B of multiple types of powdered or granular metal materials having different hardness, which is housed inside a hollow exterior body 1B, and has, for example, one end protruding outward from the upper surface of one side of the exterior body 1B and one end connected to one or more metal materials of the mixture 2B and only one charge transfer connection part 3B connected to a terminal of an electronic device, and can absorb negative charge from the electronic device or supply negative charge to the electronic device via the charge transfer connection part 3B in response to fluctuations in either the earth potential or the chassis earth potential.
[0033] In the embodiment, the side of the mixture 2B on which the protruding charge transfer connection portion 3B is located is the upper surface 1a of the hollow outer casing 1B, and the opposite side to the upper surface 1a is the lower surface 1b, with the materials iron 2a, aluminum 2b, lead 2c, brass 2d, and copper 2e being layered in this order from the lower surface (inner surface of the bottom wall) 1b to the upper surface (inner surface of the upper wall).
[0034] The powdered or granular metal material 2B filled in the exterior body 1B does not need to contain all of iron 2a to copper 2e, and the mixed material is selected from two or more materials in the group of iron, aluminum, lead, brass, copper, magnesium, zinc, tin, titanium, gold, silver, platinum, stainless steel, and cast iron. Also, the "mixture" here may refer to either a case where different metals are in a layered state, or a case where different metals are mixed together in an integrated manner.
[0035] Knowledge Based on knowledge of electromagnetism, the change in electric potential is caused by the amount of electric charge held by an object, and usually, when connected to an external object or a power source by a conductor, the connected objects maintain the same electric potential by exchanging electric charges with each other. Therefore, the inventor of the present application has proposed to maintain the same electric potential by supplying positive or negative electric charges in response to changes in electric potential. As is well known, electric charges themselves are electrons, and the supply of positive electric charge can be achieved by removing electrons from the target object, and the supply of negative electric charge can be achieved by supplying electrons.
[0036] Therefore, the technology of the present invention is concerned with electrostatic charging of metals, and electrically bonds them as a single unit, such as by stacking or mixing multiple types of metals, without any particular constraints on shape, size, or bonding method, and connects them to the potential reference point of an electronic device using a common terminal, either directly or by using a conductor, thereby stabilizing the earth potential in response to slight potential fluctuations by removing or supplying electrons from the reference potential point.
[0037] The principle of charge generation is the same as that of static electricity that occurs in metals due to the potential difference between this device as a potential stabilizer and the electronic device to which it is connected. For example, if the potential of the connected device rises (electron shortage), metals that tend to be positively charged will release electrons and supply them to the electronic device (target device), thereby eliminating and neutralizing the potential difference between this device and the electronic device. Conversely, if the potential of an electronic device drops (electrons are excessive), the metal, which is easily negatively charged, absorbs the electrons and neutralizes the potential difference between the two. This means that the fluctuation range can be reduced by half (a 6 dB reduction in voltage) at most.
[0038] Incidentally, electric charge generation is carried out in a similar way to static electricity generation, but since metals themselves are good conductors and are connected by conductors, the electric charge does not remain and become charged, but becomes an electric current and travels between electronic devices (target devices). Figure 10 shows a schematic diagram of this process. Fig. 10 omits the connection between the device X and electronic device Y and shows that the large fluctuations in the earth potential of Y are suppressed to a small, gentle state. Also, the arrows conceptually show that when the fluctuations in the earth potential of Y are below the reference voltage of 0V, it is "absorption," whereas when the fluctuations are above the reference voltage of 0V, it is "supply."
[0039] Referring to Figure 10, the generation and discharge effects are used, and the applicable potential fluctuation is thought to be on the order of μV. If the resistance of the cable used for the measurement is 0.1Ω, a fluctuation of 1 μV at 1000 Hz corresponds to approximately 10-9 coulombs of charge, or approximately 1010 electrons. For example, 1 mol (141 g) of iron contains 6.02×1023 atoms and 1.6×1025 electrons, so 1010 electrons is 1 / 1015 of the electrons contained in a lump of iron.
[0040] <Problem> Normally, electronic devices such as audio equipment, measuring equipment, and medical equipment process and amplify minute voltage output from sensors, etc., and display it on a display device (speaker or display), or output it as a drive signal for a device connected to the next stage. Therefore, in electronic devices, the power supply built into the device is used as an energy source to amplify the minute voltage signal, and output it after amplifying it to a power sufficient for the display device or the drive input of the next stage. The output signal is determined based on the voltage standard of the device, but usually the chassis ground is set to 0V for each device. To prevent noise, the chassis ground in the device is connected to the frame (chassis) at one of the input point, output point, or power supply, so the input point and output point are slightly different due to the voltage drop caused by the internal impedance (resistance) in the middle of the circuit or in the power supply. The variation depends on the magnitude of the output. For example, Figure 12 shows a schematic diagram of this situation.
[0041] In audio equipment, for example, this variation is less than 0.1 μV and is usually ignored. However, in electronic devices that handle audio or minute signals, it is added to the signal as noise, causing a decrease in accuracy. For example, Figure 14 shows the change in the difference in earth potential between a preamplifier and a power amplifier (for example, as in Figure 13 showing Example 1 of the present invention) connected by an interconnect cable in audio equipment, measured when there is no signal and when playback is in progress.
[0042] Figure 14(a) shows the potential difference when there is no signal, Figure 14(b) shows the potential difference when a signal is being reproduced, and Figure 14(c) shows the difference between the two. As Figure 14(c) shows, around 1000Hz, a maximum fluctuation of 20dBV (10 times the voltage fluctuation) occurs, and up to around 10000Hz, there is an increase of 2dBV compared to when there is no signal, in other words, the fluctuation amplitude of the earth potential is about 1.25 times larger.
[0043] <About the measurement> Here, the measurement will be explained. The earth potential when there is no signal is about -130 dBV (about 0.3 μV) in the range of 1000 to 2000 Hz, but the difference increases to about 3 μV when the signal is reproduced. The object of the present invention is to reduce this effect.
[0044] Originally, the music signal itself has a magnitude of about -40 to -20 dBV in the amplifier, and noise of about -130 dBV can be ignored in terms of the signal. In addition, signals such as music signals are made up of only certain frequencies, and frequencies other than the specific frequencies become noise and are usually weak. On the other hand, human hearing analyzes the frequency of the sound heard by the cochlea and analyzes the meaning in the brain, but noise of the same frequency as the music signal is not recognized due to the masking effect. However, noise of other frequencies is taken in and processed as information, so weak sounds other than music signals are also recognized and ultimately processed as noise. In the case of measuring instruments, signals that are originally weak are often detected, and furthermore, the frequency information of the signal is usually unknown, so it is not possible to selectively select and separate only specific frequencies, and even if it were possible, it is not certain whether what is detected from the weak signal is the target signal or noise. Therefore, how to suppress background noise is the key to improving accuracy.
[0045] Furthermore, when electronic devices are connected in multiple stages in a cascade connection, such as in an audio system, a reference potential (0V) is set for each device, and the devices are connected by interconnect cables, etc., which causes a mismatch in the reference potentials, and the difference is transmitted as noise. The present invention aims to reduce such problems. However, in principle, it cannot handle large fluctuations (caused by power devices, etc.).
[0046] Effects of Measurement The exchange of charges (the movement of electrons) between this device and an electronic device to which this device is connected can be measured as a potential difference between the two. Examples of the measurement results are shown in Figures 15 and 16. First, FIG. 15 shows, in waveform form, the reduction characteristics of the difference in earth potential occurring between a preamplifier and a power amplifier with or without the potential stabilizer of the present invention (referred to as "this device") (waveform explanatory diagram).
[0047] Next, Figure 16 shows the difference in potential drop in the wire connecting this device to the power amplifier with and without signal amplification (regeneration) in the form of a waveform (waveform explanatory diagram).
[0048] For the measurements, an ONOSOKKI DS2000 frequency analyzer was used, with a frequency range of 0 to 40,000 Hz. Figure 15 compares the difference in earth potential between the preamplifier and power amplifier when this device is used and when it is not used, and shows that this device can suppress fluctuations in earth potential by an average of about 0.7 dBV in the audible range.
[0049] Meanwhile, Figure 16 compares the difference in earth potential between the preamplifier and power amplifier when using this device and when there is no signal and when a signal is being played back. In the results shown in Figure 14, there was a fluctuation of about 20 dBV, but by using this device, the fluctuation is suppressed to about 10 dBV, and the fluctuation in earth potential can be suppressed.
[0050] <Additional Note, Example 2> FIG. 17 is an explanatory diagram showing a second example of use of the present invention. In the second example of use, the diagram on the left shows the earth terminal or input terminal ( I n1 / I n2) and other connecting devices. On the other hand, the figure on the right shows the case where the device X is connected to the earth terminal of the sensor part or the earth electrode of the output terminal. In this way, the device can be used as a part of various electronic devices.
[0051] Here, although it is not a specific requirement of the present invention, a brief explanation will be given of the configuration of the measuring device Y. Usage example 2 is directed to the measuring device Y, which is composed of an analysis device main body a and a sensor b connected to the analysis device main body a via a wire c or wirelessly, and this device X indicates that a plurality of sensors are appropriately connected to each terminal of the device main body a of the measuring device Y and the sensor b. Note that, although the sensor b is electrically connected to the analysis device main body a via the wire c in this usage example, it may be provided integrally on the outer surface of the housing of the analysis device main body a. [Industrial Applicability]
[0052] INDUSTRIAL APPLICABILITY The present invention is used in industries that manufacture and sell potential stabilizers for connected electronic devices, which stabilize the earth potential of electronic devices and suppress noise generation and noise interference caused by fluctuations in the earth potential. [Explanation of symbols]
[0053] X, X1, X2...Potential stabilizer (this device), Y...Electronic equipment, 1, 1A, 1B...Exterior body, 2, 2A, 2B...Laminate, 2a...iron, 2b...aluminum, 2c...lead, 2d...brass, 2e...copper, 3, 3A, 3B... Connection for charge transfer.
Claims
1. A potential stabilizer for connected electronic equipment which comprises metal plates of different hardness joined together in a surface-to-surface contact state to form a laminate, which is then housed inside an exterior body and has a charge transfer connection part which is electrically connected at one end to the metal plates that make up the laminate and at the other end to an electronic device, and which absorbs charge from the electronic device via the charge transfer connection part in response to fluctuations in either the earth potential or the chassis earth potential, or supplies charge to the electronic device via the charge transfer connection part.
2. 2. The potential stabilizer for connected electronic devices of claim 1, wherein the metal plates of the laminate are made of two or more materials selected from the group consisting of iron, aluminum, lead, brass, copper, magnesium, zinc, tin, titanium, gold, silver, platinum, stainless steel, and cast iron, which are easily charged with negative or positive electric charges.
3. 2. The potential stabilizer for connected electronic equipment of claim 1, wherein when the metal plates of the laminate are stacked horizontally, two or more metal plates selected from the group consisting of iron, aluminum, lead, brass, copper, magnesium, zinc, tin, titanium, gold, silver, platinum, stainless steel, and cast iron are stacked in any order.
4. In the potential stabilizer for connected electronic devices of claim 1, when each metal plate of the laminate is cylindrical, each of the cylindrical metal plates, whether solid or hollow, namely, an iron rod, a cylindrical lead sheet, a cylindrical aluminum sheet, a cylindrical lead sheet, and a cylindrical copper sheet, are bundled together in the center surrounded by the cylindrical metal plate with the smallest radius.
5. A potential stabilizer for connected electronic equipment which has powdered or granular metal objects of different hardness housed inside an exterior body, one end of which is electrically connected to the metal objects and the other end of which is electrically connected to an electronic device, and which absorbs negative charge from the electronic device via the charge transfer connection part in response to fluctuations in either the earth potential or the chassis earth potential, or supplies negative charge to the electronic device.
6. 6. The potential stabilizer for connected electronic devices of claim 5, wherein the mixture is made of two or more materials selected from the group consisting of iron, aluminum, lead, brass, copper, magnesium, zinc, tin, titanium, gold, silver, platinum, stainless steel, and cast iron.
Citation Information
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