Diagnosis device and diagnosis system

Abstract

To provide a technique capable of diagnosing a device on the basis of a detection value of a sensor of the device.SOLUTION: A diagnosis system comprises: a data collection device that generates sensor information in a time sequence by acquiring a sensor signal from a die bonder in a production operation in each predetermined period; a storage device that stores the sensor information; and a diagnosis computer that associates a feature and a tendency of data transition of the sensor information stored in the storage device with a fault record of the die bonder and a maintenance record of the die bonder to calculate an event that the die bonder may occur. The data collection device calculates a difference value between a value of the sensor signal to be sampled this time and a value of the sensor signal to be sampled previously, and generates the sensor information of a CSV file format.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present disclosure relates to a diagnostic device and is applicable to, for example, the diagnosis of a die bonder. [Background technology]

[0002] As one step in the manufacturing process of a semiconductor device, a die picked up by a bond head is bonded to a substrate in a die bonder. The timing of pre-maintenance may be determined by diagnosing mechanisms that affect bonding accuracy using the recognition results from a camera during continuous operation (during production) (for example, JP 2018-166136 A). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2018-166136 A Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present disclosure is to provide a technique capable of diagnosing an apparatus based on a detection value of a sensor included in the apparatus. Other objects and novel features will become apparent from the description of this specification and the accompanying drawings. [Means for solving the problem]

[0005] A brief summary of representative aspects of this disclosure is as follows. That is, the diagnostic apparatus includes a data collection device that acquires a sensor signal from a die bonder during production operation at predetermined intervals to generate time-series sensor information, a storage device that saves the sensor information, and a diagnostic computer configured to calculate possible events that may occur in the die bonder by linking the characteristics and trends of data transitions of the sensor information saved in the storage device with failure records and maintenance records of the die bonder. The data collection device is configured to calculate a difference between the value of the sensor signal sampled this time and the value of the sensor signal sampled last time, and generate the sensor information in a CSV file format. Effect of the Invention

[0006] According to the present disclosure, it is possible to diagnose an apparatus based on detection values ​​of a sensor included in the apparatus. [Brief description of the drawings]

[0007] [Figure 1] FIG. 1 is a schematic top view showing an example of the configuration of a die bonder in an embodiment. [Diagram 2] FIG. 2 is a diagram for explaining a schematic configuration when viewed from the direction of arrow A in FIG. [Diagram 3] FIG. 3 is a block diagram showing a schematic configuration of a control system of the die bonder shown in FIG. [Figure 4] FIG. 4 is a flowchart showing a method for manufacturing a semiconductor device using the die bonder shown in FIG. [Diagram 5] FIG. 5 is a block diagram showing an example of the configuration of a system using a diagnostic device according to an embodiment. [Figure 6] FIG. 6 is a block diagram showing an example of the configuration of the PLC shown in FIG. [Figure 7] FIG. 7 is a flowchart showing a method for diagnosing a die bonder. [Figure 8] FIG. 8 is a diagram showing an example of transition waveforms of some sensor signals. [Figure 9]FIG. 9 is a diagram showing CSV file data of the waveform data shown in FIG. [Figure 10] FIG. 10 is a diagram for explaining a method for calculating the difference value. [Figure 11] FIG. 11 is a diagram for explaining a method for calculating the restored value. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, the embodiments and modifications will be described with reference to the drawings. However, in the following description, the same components are given the same reference numerals and repeated description may be omitted. Note that, in order to make the description clearer, the width, thickness, shape, etc. of each part may be shown in a schematic manner compared to the actual embodiment. Furthermore, the dimensional relationship between each element, the ratio of each element, etc. do not necessarily match between multiple drawings.

[0009] The configuration of a die bonder as an embodiment of a semiconductor manufacturing device will be described with reference to Figures 1 and 2. Figure 1 is a schematic top view showing an example of the configuration of a die bonder in an embodiment. Figure 2 is a diagram illustrating the schematic configuration as seen from the direction of arrow A in Figure 1.

[0010] The die bonder 1 broadly comprises a wafer supply unit 10, a pickup unit 20, an intermediate stage unit 30, a bonding unit 40, a transport unit 50, a substrate supply unit 60, a substrate unloading unit 70, and a control unit (control device) 80. The Y2-Y1 direction is the front-rear direction of the die bonder 1, the X2-X1 direction is the left-right direction, and the Z1-Z2 direction is the up-down direction. The wafer supply unit 10 is disposed on the front side of the die bonder 1, and the bonding unit 40 is disposed on the rear side.

[0011] The wafer supply section 10 includes a wafer cassette lifter 11, a wafer holder 12, a peeling unit 13, and a wafer recognition camera 14.

[0012] A wafer cassette lifter 11 moves a wafer cassette (not shown), in which a plurality of wafer rings WR are stored, up and down to the wafer transport height. A wafer correction chute (not shown) aligns the wafer rings WR supplied from the wafer cassette lifter 11. A wafer extractor (not shown) removes the wafer rings WR from the wafer cassette and supplies them to the wafer holder 12, or removes them from the wafer holder 12 and stores them in the wafer cassette.

[0013] A wafer W is adhered (attached) onto a dicing tape DT, and the wafer W is divided into a number of dies D. The dicing tape DT is held by a wafer ring WR. The wafer W is, for example, a semiconductor wafer, and the dies D are semiconductor chips. A film-like adhesive material DF called a die attach film (DAF) is adhered between the wafer W and the dicing tape DT. The adhesive material DF hardens when heated.

[0014] The wafer holder 12 is moved in the X1-X2 and Y1-Y2 directions by a drive unit (not shown), and moves the die D to be picked up to the position of the peeling unit 13. The wafer holder 12 also rotates the wafer ring WR in the XY plane by a drive unit (not shown). The peeling unit 13 moves in the vertical direction by a drive unit (not shown). The peeling unit 13 has a sensor 871 that detects the suction pressure. The peeling unit 13 adsorbs the dicing tape DT and, for example, pushes up a block to peel off the die D from the dicing tape DT.

[0015] The wafer recognition camera 14 captures an image of the die D picked up from the wafer W, recognizes the pick-up position of the die D, and inspects the surface of the die D.

[0016] The pickup unit 20 has a pickup head 21 and a pickup head table (PHT) 23. The pickup head 21 is provided with a collet 22 that suction-holds the peeled die D at its tip, a sensor 872 that detects the die suction pressure, a sensor 873 that detects the die suction flow rate, and a linear sensor 874 that detects the vertical position of the pickup head 21. The pickup head 21 picks up the die D from the wafer supply unit 10 and places it on the intermediate stage 31. The pickup head table 23 moves the pickup head 21 in the Z1-Z2 direction, the Y1-Y2 direction, and the X1-X2 direction. The pickup head table 23 may rotate the pickup head 21.

[0017] The intermediate stage unit 30 has an intermediate stage 31 on which the die D is placed, and a stage recognition camera 34 for recognizing the die D on the intermediate stage 31. The intermediate stage 31 has suction holes that adsorb the placed die D. The placed die D is temporarily held on the intermediate stage 31. The intermediate stage 31 is both a placement stage on which the die D is placed, and a pick-up stage on which the die D is picked up.

[0018] The bonding section 40 has a bond head 41, a bond head table (BHT) 43, a substrate recognition camera 44, and a bond stage 46. The bond head 41 is provided with a collet 42 that holds the die D at its tip, a sensor 875 that detects the die suction pressure of the bond head 41, a sensor 876 that detects the die suction flow rate, and a linear sensor 877 that detects the vertical position of the bond head 41. The bond head table moves the bond head 41 in the Z1-Z2 direction, the Y1-Y2 direction, and the X1-X2 direction. The bond head table 43 may rotate the bond head 41. The substrate recognition camera 44 captures an image of the substrate S and recognizes the bond position. Here, the substrate S may be, for example, a wiring substrate or a lead frame. The substrate S has a plurality of product areas (hereinafter referred to as package areas P) that will eventually become one package. The substrate S also has a position recognition mark (not shown) for the package area P formed thereon. When the die D is placed on the substrate S, the bond stage 46 is raised and supports the substrate S from below. The bond stage 46 has a suction port (not shown) for vacuum-adsorbing the substrate S, and is capable of fixing the substrate S. The bond stage 46 has a heating unit (not shown) for heating the substrate S.

[0019] With this configuration, the pick-up position and posture are corrected based on the imaging data of the stage recognition camera 34, and the bond head 41 picks up the die D from the intermediate stage 31. Then, the bond head 41 bonds the die D onto the package area P of the substrate S based on the imaging data of the substrate recognition camera 44, or bonds the die D by stacking it on top of a die that has already been bonded onto the package area P of the substrate S.

[0020] The transport section 50 has a transport claw 51 that grips and transports the substrate S, and a transport lane 52 along which the substrate S moves. The substrate S moves in the X1 direction by driving a nut (not shown) of the transport claw 51 provided on the transport lane 52 by a ball screw (not shown) provided along the transport lane 52. With this configuration, the substrate S moves from the substrate supply section 60 along the transport lane 52 to the bonding position, and after bonding, moves to the substrate unloading section 70 and hands the substrate S over to the substrate unloading section 70.

[0021] The substrate supplying section 60 removes the substrate S, which has been stored in the transport jig and carried in, from the transport jig and supplies it to the transporting section 50. The substrate unloading section 70 stores the substrate S transported by the transporting section 50 in the transport jig.

[0022] Next, the control unit 80 will be described with reference to Fig. 3. Fig. 3 is a block diagram showing a schematic configuration of a control system of the die bonder shown in Fig. 1.

[0023] The control system 8 includes a control unit (control device) 80, a drive unit 86, a signal unit 87, and an optical system 88. The control unit 80 mainly includes a control and calculation unit 81, which is mainly composed of a CPU (Central Processing Unit), a storage unit 82, an input / output unit 83, a bus line 84, and a power supply unit 85. The storage unit 82 includes a main storage unit 82a and an auxiliary storage unit 82b. The main storage unit 82a is composed of a RAM (Random Access Memory) that stores processing programs and the like. The auxiliary storage unit 82b is composed of an HDD (Hard Disk Drive) or SSD (Solid State Drive) that stores control data and image data necessary for control. The processing program is a process recipe that describes the processing procedures, conditions, and the like.

[0024] The input / output device 83 has a monitor 83a that displays the device status, information, etc., a mouse 83c that operates the monitor 83a, and an image capture device 83d that captures image data from the optical system 88. The input / output device 83 further has a motor control device 83e, an I / O signal control device 83f, and a communication device 83g.

[0025] The optical system 88 includes the wafer recognition camera 14, the stage recognition camera 34, and the substrate recognition camera 44. The wafer recognition camera 14, the stage recognition camera 34, and the substrate recognition camera 44 convert light intensity and color into numerical values.

[0026] The motor control device 83e controls the driving unit 86. The driving unit 86 includes the XY table (not shown) of the wafer supply unit 10, the pick-up head table 23, and the bond head table 43.

[0027] The I / O signal control device 83f takes in signals from various sensors 870 of the signal section 87, and controls switches and volumes that control the brightness of lighting devices and the like of the signal section 87. The sensors 870 include a sensor 871, a sensor 872, a sensor 873, a linear sensor 874, a sensor 875, a sensor 876, and a linear sensor 877. The sensors 870 may include a sensor that detects the acceleration of vibration of the pickup head 21 or the bond head 41, or a sensor that detects the angular velocity of vibration of the pickup head 21 or the bond head 41.

[0028] The communication device 83g connects the control unit 80 to a device display PC 90 that exists on the network.

[0029] The control / arithmetic unit 81 takes in necessary data from the storage device 82 or the input / output device 83 via a bus line 84, performs calculations, and controls the pickup head 21 etc. via the input / output device 83, or sends information to a monitor 83a etc.

[0030] For example, the control unit 80 stores image data captured by the wafer recognition camera 14, the stage recognition camera 34, and the substrate recognition camera 44 in the storage device 82 via the image capture device 83d. Using software programmed based on the stored image data, the control and calculation device 81 is used to position the package area P of the die D and the substrate S, and to inspect the surfaces of the die D and the substrate S. Based on the positions of the package area P of the die D and the substrate S calculated by the control and calculation device 81, the software moves the drive unit 86 via the motor control device 83e. Through this process, the die on the wafer is positioned, and the pickup head table 23 and the bond head table 43 are operated to bond the die D onto the package area P of the substrate S.

[0031] A part of the manufacturing process of a semiconductor device using the die bonder 1 (a method for manufacturing a semiconductor device) will be described with reference to Fig. 4. Fig. 4 is a flowchart showing a method for manufacturing a semiconductor device using the die bonder shown in Fig. 1. In the following description, the operation of each part constituting the die bonder 1 is controlled by a control unit 80.

[0032] (Wafer loading process: process S1) The wafer ring WR is supplied to the wafer cassette of the wafer cassette lifter 11. The supplied wafer ring WR is then supplied to the wafer holder 12.

[0033] (Substrate loading process: Process S2) The transport jig storing the substrate S is supplied to the substrate supply section 60. In the substrate supply section 60, the substrate S is taken out of the transport jig and fixed to the transport claws 51.

[0034] (Pickup process: process S3) After step S1, the wafer holder 12 is moved so that the desired die D can be picked up from the dicing tape DT. The die D is photographed by the wafer recognition camera 14, and the die D is positioned and its surface inspected based on the image data acquired by photographing. The image data is processed to calculate the amount of deviation (X, Y, and θ directions) of the die D on the wafer holder 12 from the die position reference point of the die bonder, and the die is positioned. Note that the die position reference point is previously held at a predetermined position of the wafer holder 12 as the initial setting of the device. The image data is processed to inspect the surface of the die D.

[0035] The positioned die D is peeled off from the dicing tape DT by the peeling unit 13 and the pick-up head 21. The die D peeled off from the dicing tape DT is attracted to and held by a collet 22 provided on the pick-up head 21, and is transported to and placed on the intermediate stage 31.

[0036] The die D on the intermediate stage 31 is photographed by the stage recognition camera 34, and the positioning and surface inspection of the die D are performed based on the image data acquired by photographing. The image data is subjected to image processing to calculate the amount of deviation (X, Y, and θ directions) of the die D on the intermediate stage 31 from the die position reference point of the die bonder, and positioning is performed. Note that the die position reference point is previously held at a predetermined position of the intermediate stage 31 as the initial setting of the device. The image data is subjected to image processing to perform surface inspection of the die D.

[0037] The pickup head 21 that transported the die D to the intermediate stage 31 is returned to the wafer supply unit 10. The next die D is peeled off from the dicing tape DT according to the above-mentioned procedure, and thereafter, the dies D are peeled off one by one from the dicing tape DT according to the same procedure.

[0038] (Bond process: Process S4) The substrate S is transported to the bond stage 46 by the transport unit 50. The substrate S placed on the bond stage 46 is imaged by the substrate recognition camera 44, and image data is acquired by the image capture. The image data is processed to calculate the amount of deviation (X, Y, and θ directions) of the substrate S from the substrate position reference point of the die bonder 1. Note that the substrate position reference point is previously held at a predetermined position of the bonding unit 40 as the initial setting of the device.

[0039] The suction position of the bond head 41 is corrected based on the deviation amount of the die D on the intermediate stage 31 calculated in step S3, and the die D is suctioned by the collet 42. The bond head 41 that has suctioned the die D from the intermediate stage 31 bonds the die D to a predetermined position of the substrate S supported by the bond stage 46. The substrate recognition camera 44 photographs the die D bonded to the substrate S, and based on the image data acquired by photographing, an inspection is performed to determine whether the die D has been bonded at the desired position, etc.

[0040] After bonding the die D to the substrate S, the bond head 41 is returned to the intermediate stage 31. Following the procedure described above, the next die D is picked up from the intermediate stage 31 and bonded to the substrate S. This is repeated until a die D is bonded to every package area P of the substrate S.

[0041] (Substrate unloading process: Process S5) The substrate S with the die D bonded thereto is transported to the substrate unloading section 70. In the substrate unloading section 70, the substrate S is removed from the transport claws 51 and stored in a transport jig. The transport jig storing the substrate S is unloaded from the die bonder 1.

[0042] As described above, the die D is mounted on the substrate S and is carried out from the die bonder 1. Thereafter, for example, a transport jig storing the substrate S on which the die D is mounted is transported to a wire bonding process, and the electrodes of the die D are electrically connected to the electrodes of the substrate S via Au wires or the like. Then, the substrate S is transported to a molding process, and the die D and the Au wires are sealed with molding resin (not shown), thereby completing a semiconductor package.

[0043] In the case of stacked bonding, following the wire bonding process, a transport jig on which a substrate S on which a die D is mounted is loaded and stored is carried into a die bonder, where the die D is stacked on the die D mounted on the substrate S, and after being carried out of the die bonder, the die D is electrically connected to the electrodes of the substrate S via Au wires in a wire bonding process. The dies D above the second stage are peeled off from the dicing tape DT by the above-mentioned method, then transported to the bonding section and stacked on the dies D. After the above process is repeated a predetermined number of times, the substrate S is transported to a molding process, where the multiple dies D and Au wires are sealed with molding resin (not shown) to complete a stacked package.

[0044] The diagnosis device for the die bonder 1 will be described with reference to Fig. 5 and Fig. 6. Fig. 5 is a block diagram showing an example of the configuration of a system using the diagnosis device in the embodiment. Fig. 6 is a block diagram showing an example of the configuration of the PLC shown in Fig. 5.

[0045] The diagnostic device (DGN) 110 includes a diagnostic PC 120 as a computer, a programmable logic controller (PLC) 130 as a data collection device, a storage device (STD) 140, and a monitor switch 150. The diagnostic device 110 diagnoses the die bonder 1 based on a sensor signal from the die bonder 1.

[0046] The die bonder 1 to be diagnosed includes the control unit 80 as the above-mentioned device control computer, as well as the device display PC 90 as a computer and the display PC monitor 91 as a display device. The device display PC 90 acquires the process recipe and the device log (fault record, maintenance record, etc.) from the control unit 80. The device display PC 90 supplies the production information to the diagnosis PC 120 via the network 201. The device display PC 90 is connected to the monitor switch 150 by, for example, a DVI (Digital Visual Interface) cable 203a. The display PC monitor 91 is connected to the monitor switch 150 by the DVI cable 203a. The display PC monitor 91 displays the device production information from the device display PC 90 via the DVI cable 203a, the monitor switch 150, and the DVI cable 203b. The display PC monitor 91 displays the diagnosis result from the diagnosis PC 120 via the DVI cable 203c, the monitor switch 150, and the DVI cable 203b. The sensor signal from the die bonder 1 is supplied to the PLC 130 via a signal line 202 .

[0047] 6, the PLC 130 includes an input unit (IN) 131, a calculation unit (CPU) 132, a memory unit (MM) 133, and an output unit (OUT) 134. The input unit 131 is connected to a sensor 870 of the die bonder 1 via a signal line 202. The input unit 131 converts the sensor signal, which is an analog signal, into sensor information as a digital signal. The calculation unit 132 processes the sensor information from the input unit 131 and stores it in the memory unit 133. The output unit 134 transfers the processed sensor information to the STD 140 by FTP (File Transfer Protocol). The STD 140 saves the sensor information.

[0048] The diagnostic PC 120 acquires sensor information from the STD 140. The diagnostic PC 120 also acquires die production information from the apparatus display PC 90 of the die bonder 1 via the network 201.

[0049] A method of diagnosing the die bonder 1 will be described with reference to Figs. 7, 8, and 9. Fig. 7 is a flowchart showing the method of diagnosing the die bonder. Fig. 8 is a diagram showing an example of transition waveforms of some sensor signals. Fig. 9 is a diagram showing CSV file data of the waveform data shown in Fig. 8. Fig. 8 shows sensor signals from sensor 871, sensor 872, sensor 873, and linear sensor 874.

[0050] (Step S11) The PLC 130 acquires time-series data of a plurality of sensors from the die bonder 1 and stores the data in the STD 140 .

[0051] Specifically, the PLC 130 collects waveform data (analog data) of sensor values ​​of multiple sensors 870 during production operations every cycle as shown in Fig. 8. Here, every cycle means periodically (between specific operations or every predetermined period), where between specific operations is, for example, from pick-up operation to pick-up operation, and the predetermined period is, for example, about 300 ms. The PLC 130 saves the collected waveform data (time series data) in the STD 140 in a CSV (Comma Separated Value) file format as shown in Fig. 9.

[0052] (Step S12) The diagnostic PC 120 performs analysis based on the time series data of a plurality of sensors acquired from the STD 140 .

[0053] More specifically, the diagnostic PC 120 uses machine learning to compare the die production information of the die bonder 1, failure records, and maintenance records (events) obtained from the equipment display PC 90, and obtains analysis results by linking the characteristics and trends of the changes in the time series data with the events.

[0054] (Step S13) Possible events (diagnosis results) that may occur are calculated from the analysis results of step S12 and the characteristics and trends of the transitions in the time-series data of multiple sensors during operation, and are displayed on the display PC monitor 91.

[0055] If the waveform data acquired in step S11 is directly acquired in the CSV file in the STD 140 for a long period of time, this may put a strain on the storage area of ​​the STD 140. It is preferable to reduce the amount of stored data by using a method of calculating difference values ​​from the CSV file of the waveform data collected by the PLC 130.

[0056] The method for calculating the difference value will be explained with reference to Fig. 10. Fig. 10 is a diagram for explaining the method for calculating the difference value. The left side of Fig. 10 shows the CSV file data of the waveform data itself, and the right side shows the CSV file data in which the difference value has been calculated. Columns A to D are the same as Fig. 9, and the data is from different sensors on a column-by-column basis.

[0057] The PLC 130 acquires the first sampled value (reference value) of the waveform data of the sensor value during production operation, and stores the first sampled value in the first line of the CSV file.

[0058] Next, the PLC 130 obtains the second sampled value of the waveform data and subtracts 1 from the second sampled value. No. The PLC 130 calculates the difference between the first sampled value (reference value) and the second sampled value, and stores the calculated difference value in the second line of the CSV file.

[0059] Next, the PLC 130 obtains the third sampled value of the waveform data, and calculates the difference between the third sampled value and the second sampled value (reference value). The PLC 130 stores the calculated difference value in the third line of the CSV file.

[0060] Thereafter, the PLC 130 repeatedly calculates the difference value (currently sampled value - previously sampled value) and stores the calculated difference value in a CSV file.

[0061] As shown in Figure 10, the sampled value in the first line of the CSV file is a four-digit decimal number, but the difference value is one to three digits, making it possible to reduce the amount of data. Note that since the data is saved in binary, the difference in the number of digits between the sampled value and the difference value becomes larger, resulting in a large amount of data reduction.

[0062] When displaying the waveform of data stored in STD 140 using differential values, the file is restored using a method for calculating restored values. The method for calculating restored values ​​will be described with reference to FIG. 11. FIG. 11 is a diagram for explaining the method for calculating restored values. The left side of FIG. 11 shows data of the CSV file for which differential values ​​have been calculated, and the right side shows data of the CSV file for which restored values ​​have been calculated.

[0063] The diagnostic PC 120 restores the second sampled value by adding the difference value, which is the data in the second line, to the first sampled value (reference value), which is the data in the first line of the CSV file on the left side of FIG.

[0064] Next, the diagnostic PC 120 restores the third sampled value by adding the difference value, which is the data in the third line of the CSV file on the left side of Figure 11, to the restored second sampled value (reference value).

[0065] Thereafter, the diagnostic PC 120 repeats the restoration (reference value+difference value) a number of times equal to (sampling number-1).

[0066] According to this embodiment, at least one of the following effects is obtained.

[0067] (a) It is possible to reduce the amount of data to be stored, making it possible to accumulate data in a small storage area.

[0068] (b) Data can be stored in a small amount of storage space without reducing the amount of information.

[0069] (c) It is possible to reduce the amount of data required to store, making it possible to accumulate more data. It is also possible to increase the number of samplings and the amount of sensor information.

[0070] (d) Since the amount of data is reduced, it becomes possible to shorten the processing time when moving, compressing, deleting, or transferring CSV files.

[0071] (e)By reducing the time required to handle CSV files, diagnosis can be performed in closer to real time.

[0072] The disclosure made by the present inventors has been specifically described above based on the embodiments, but it goes without saying that the present disclosure is not limited to the above-described embodiments and can be modified in various ways.

[0073] For example, in the embodiment, the data collected by the PLC 130 is output to a CSV file, but the data may be stored in a database. Since file operations are eliminated, the diagnostic processing time can be reduced.

[0074] In the embodiment, the diagnosis device is provided outside the die bonder, but a part or the whole of the diagnosis device may be provided inside the die bonder. For example, the diagnosis PC 120, the PLC 130, and the monitor switch 150 may be integrated with the device display PC 90 or the device control PC 80.

[0075] In the embodiment, an example using a die attachment film has been described, but a preform section that applies adhesive to the substrate may be provided, eliminating the need for a die attachment film. The preform section includes a preform head that applies a paste adhesive and a preform table that drives the preform head in vertical and horizontal directions. The preform table may be configured in the same manner as in the embodiment.

[0076] In the embodiment, a die bonder has been described in which a pick-up head picks up a die from a wafer supply section and places it on an intermediate stage, and then a bond head bonds the die placed on the intermediate stage to a substrate, but the present invention is not limited to this and can be applied to any die bonding apparatus that picks up a die from a wafer supply section.

[0077] For example, the present invention can also be applied to a die bonder that does not have an intermediate stage and a pick-up head, and that bonds a die from a wafer supply section to a substrate with a bond head.

[0078] The present invention can also be applied to a flip chip bonder that does not have an intermediate stage, picks up a die from a wafer supply section, rotates the die pickup head upwards, and delivers the die to the bond head, which then bonds the die to a substrate. [Explanation of symbols]

[0079] 1. Die bonder 13. Peeling unit 21 Pickup head (head) 41 Bond head (head) 90....PC (computer) for displaying the device 91 Display PC monitor (display device) 110 Diagnostic equipment 120 Diagnostic PC (computer) 130···PLC (data collector) 140 Storage devices

Claims

1. A diagnostic device for diagnosing a die bonder, the diagnostic device comprising a peeling unit, a head, a display device, and a computer, a data collection device that acquires a sensor signal from the die bonder during production operation at predetermined intervals to generate time-series sensor information; a storage device for storing the sensor information; A diagnostic computer configured to link the characteristics and trends of data transitions of the sensor information stored in the storage device with a failure record of the die bonder and a maintenance record of the die bonder to calculate events that may occur in the die bonder; Equipped with The diagnostic device is configured such that the data collection device calculates a difference between a currently sampled value of the sensor signal and a previously sampled value of the sensor signal, and generates the sensor information in a CSV file format.

2. 2. The diagnostic device of claim 1, A diagnostic device, wherein the diagnostic computer is configured to provide the calculated events to the display device.

3. 2. The diagnostic device of claim 1, The diagnostic computer is configured to acquire production information of the die bonder via a network.

4. 2. The diagnostic device of claim 1, The diagnostic apparatus is configured such that the data collection device and the diagnostic computer are included in the die bonder.

5. 2. The diagnostic device of claim 1, The diagnostic device, wherein the sensor signal is a signal from at least one of a sensor included in the peeling unit and a sensor included in the head.

6. The diagnostic device according to claim 4, A diagnostic device in which the sensor signal is a signal from at least one of a sensor that detects pressure, a sensor that detects flow rate, a sensor that detects position, a sensor that detects vibration acceleration, and a sensor that detects angular velocity.

7. a die bonder including a peeling unit, a head, a monitor and a computer; a data collection device that acquires a sensor signal from the die bonder during production operation and generates time-series sensor information; a storage device for storing the sensor information; A diagnostic computer configured to link the characteristics and trends of data transitions of the sensor information stored in the storage device with a failure record of the die bonder and a maintenance record of the die bonder to calculate events that may occur in the die bonder; Equipped with The diagnostic system is configured such that the data collection device calculates a difference between a currently sampled value of the sensor signal and a previously sampled value of the sensor signal, and generates the sensor information in a CSV file format.

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