Current detection device

Abstract

To provide a construction for detecting a current with better accuracy when connecting a shunt resistor by sandwiching with a tabular wiring such as a bus bar and a lead frame.SOLUTION: A current detection device comprises: a resistor of stacked structure including first and second tabular electrodes, and a tabular resistor located between the first and second electrodes; first and second tabular conductors in which the current to be measured flows and which is connected to the resistor; and a voltage detection circuit board including first and second tabular voltage terminals for detecting a voltage, an insulating circuit board, and first and second voltage detection patterns.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a current detection device. [Background technology]

[0002] In recent years, as the current used in electronic devices has become larger, modules known as power modules, which convert and control power by switching power semiconductors, have been actively developed. Power modules often use highly heat-dissipating substrates that can handle large currents, such as ceramic substrates known as DBC substrates, which are formed by directly bonding copper to an alumina substrate. In addition, power semiconductors, shunt resistors, and other components may be directly mounted on plate-shaped wiring (bus bars or lead frames) made of copper plates or other materials. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2001-358283 A [Patent Document 2] Patent Publication No. 2022-066642 Summary of the Invention [Problem to be solved by the invention]

[0004] The current detection shunt resistor described in Patent Document 1 aims to improve heat dissipation and reliability and to shorten the wiring length, but is not suitable for passing large currents because it requires bonding and connecting multiple wires.

[0005] Therefore, in order to pass a large current through such a vertically structured shunt resistor, a surface mounting method using an L-shaped electrode member has been devised as described in Patent Document 2. Patent Document 2 describes a method of drawing out a voltage signal by wire bonding in such a configuration.

[0006] On the other hand, in order to detect even larger currents, a case has been considered in which a vertical shunt resistor is sandwiched between plate-shaped wiring such as a bus bar or a lead frame, etc. In that case, the method of extracting the voltage signal for accurate current detection and the method of connection to the control circuit board become issues.

[0007] The present invention has been made to solve such problems, and aims to provide a configuration for detecting current with greater accuracy when a shunt resistor is connected by being sandwiched between plate-shaped wiring such as a bus bar or a lead frame. [Means for solving the problem]

[0008] An example of a current detection device according to the present invention is a resistor having a laminated structure, the resistor having a plate-like first electrode and a plate-like second electrode, and a plate-like resistive body disposed between the first electrode and the second electrode; a first conductor and a second conductor in the shape of a plate through which a current to be measured flows and which are connected to the resistor; a plate-shaped first voltage terminal and a plate-shaped second voltage terminal for detecting a voltage; a voltage detection board having an insulating substrate and a first voltage detection pattern and a second voltage detection pattern; Equipped with the first voltage detection pattern is disposed on one surface of the insulating substrate, the second voltage detection pattern is disposed on the other surface of the insulating substrate, each of the first voltage terminal and the second voltage terminal includes a flat portion and a connection portion formed by extending a part of a side surface; the first conductor is connected to the first electrode via a flat portion of the first voltage terminal; the second conductor is connected to the second electrode via a flat portion of the second voltage terminal; the resistor is disposed between a flat portion of the first voltage terminal and a flat portion of the second voltage terminal, and between the first conductor and the second conductor, in a stacked manner; a connection portion of the first voltage terminal connected to one end of the first voltage detection pattern; a connection portion of the second voltage terminal connected to one end of the second voltage detection pattern; The voltage detection board is disposed so as to be sandwiched between the connection portion of the first voltage terminal and the connection portion of the second voltage terminal.

[0009] In one example, the first voltage detection pattern and the second voltage detection pattern are arranged to overlap each other when viewed from the stacking direction of the voltage detection board.

[0010] In one example, in at least one of the first voltage terminal and the second voltage terminal, the resistivity of the material of a first portion including the connection portion is higher than the resistivity of the material of a second portion including at least a portion of the flat portion.

[0011] An example of a current detection device according to the present invention is a resistor having a laminated structure, the resistor having a plate-like first electrode and a plate-like second electrode, and a plate-like resistive body disposed between the first electrode and the second electrode; a first conductor and a second conductor in the shape of a plate through which a current to be measured flows and which are connected to the resistor; a voltage detection board having an insulating substrate and a first voltage detection pattern and a second voltage detection pattern; Equipped with the first voltage detection pattern is disposed on one surface of the insulating substrate, the second voltage detection pattern is disposed on the other surface of the insulating substrate, the first voltage detection pattern and the second voltage detection pattern are arranged so as to overlap each other when viewed from the stacking direction of the insulating substrate; The first conductor is connected to the first electrode, The second conductor is connected to the second electrode, the resistor is disposed in a stack between the first conductor and the second conductor; One end of the first voltage detection pattern is connected to the first electrode.

[0012] In one example, one end of the second voltage detection pattern is connected to the second electrode.

[0013] In one example, one end of the second voltage detection pattern is connected to the second conductor.

[0014] In one example, the first electrode, the second electrode, the first voltage detection pattern, and the second voltage detection pattern each have an exposed portion on a side surface, The resistor and the voltage detection board are arranged in parallel to each other, an exposed portion of the first electrode and an exposed portion of the first voltage detection pattern are connected to each other; The exposed portion of the second electrode and the exposed portion of the second voltage detection pattern are connected.

[0015] In one example, the first electrode and the second electrode each include a voltage detection pattern connection portion formed by extending a part of a side surface, The resistor and the voltage detection board are arranged in parallel, The voltage detection board is disposed so as to be sandwiched between the voltage detection pattern connection portion of the first electrode and the voltage detection pattern connection portion of the second electrode.

[0016] In one example, At least one of the resistor and the voltage detection board has a slit extending from a side surface, The resistor and the voltage detection board intersect and are fixed to each other by being inserted into the slits. Effect of the Invention

[0017] The current detection device of the present invention has a simplified structure in which a vertically structured shunt resistor is sandwiched and connected to plate-shaped wiring such as a bus bar or a lead frame, and has a voltage signal extraction structure that enables highly accurate voltage detection, and can be easily connected to a control circuit board.

[0018] Furthermore, in the current detection device according to the present invention, the heat dissipation of the shunt resistor is improved, and excellent detection accuracy is achieved even in the case of a large current. [Brief description of the drawings]

[0019] [Figure 1] 1 is a perspective view showing a configuration example of a resistor 10 according to a first embodiment of the present invention. [Diagram 2] 1 is a side view showing a configuration example of a current detection device 100. FIG. [Diagram 3] 3 is a top view of the current detection device 100 of FIG. 2. [Figure 4] 3 is a bottom view of the voltage detection board 30 in FIG. 2. [Diagram 5] FIG. 4 is a side view showing a configuration example of a current detection device 100 according to a modified example of the first embodiment. [Figure 6] 6 is a diagram showing a further modified example of the second voltage terminal 22 in FIG. 5. [Figure 7] 6 is a diagram showing a further modified example of the second voltage terminal 22 in FIG. 5. [Figure 8] FIG. 4 is a side view showing a configuration example of a current detection device 100 according to a second embodiment of the present invention. [Figure 9] FIG. 11 is a plan view showing a configuration example of a current detection device 100 according to a modified example of the second embodiment. [Figure 10] FIG. 10 is a side view of the current detection device 100 of FIG. [Figure 11] FIG. 11 is a perspective view showing a configuration example of a current detection device 100 according to another modified example of the second embodiment. [Figure 12] FIG. 13 is a perspective view showing a configuration example of a current detection device 100 according to still another modified example of the second embodiment. [Figure 13] 13 is a perspective view of the current detection device 100 in FIG. 12, seen from a different direction than in FIG. 12. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings.

[0021] [Example 1] 1 is a perspective view showing a configuration example of a resistor 10 according to a first embodiment of the present invention.

[0022] The resistor 10 is a laminated resistor having a plate-like first electrode 12 and a plate-like second electrode 13, and a plate-like resistive body 11 disposed between the first electrode 12 and the second electrode 13. The resistor 10 is, for example, a resistor for current detection or a shunt resistor. In particular, the resistor 10 can be said to be a shunt resistor with a vertical structure. In the example of FIG. 1, the resistive body 11 is formed in a square or rectangular shape, but the shape can be designed arbitrarily.

[0023] The material of the first electrode 12 and the second electrode 13 is a highly conductive metal material such as Cu. The material of the resistor 11 is a metal material suitable for current detection such as Cu-Ni, Cu-Mn, Ni-Cr, or a composite material containing a metal material. The dimensions of the resistor 10 are, for example, 5 mm x 5 mm x 0.5 mm thick. The thicknesses of the first electrode 12 and the second electrode 13 are, for example, 0.1 mm each. The thickness of the resistor 11 is, for example, 0.3 mm.

[0024] FIG. 1 shows an example of resistor 10, but other configurations are possible, for example a current sensing resistor disclosed in JP 2018-170478 A may be used.

[0025] Figures 2 to 4 show a configuration example of the current detection device 100. Figure 2 is a side view of the current detection device 100, Figure 3 is a top view of the current detection device 100, and Figure 4 is a bottom view of only the voltage detection board 30. Note that in Figure 2, only the portion of a via hole 34 described below is shown in cross section.

[0026] Current detection device 100 includes resistor 10, plate-shaped first voltage terminal 21, plate-shaped second voltage terminal 22, plate-shaped bus bar 23 (first conductor), plate-shaped Cu frame 24 (second conductor), and voltage detection board 30. A current to be measured flows through bus bar 23 and Cu frame 24. Bus bar 23 and Cu frame 24 are connected to resistor 10. First voltage terminal 21 and second voltage terminal 22 are used to detect a voltage corresponding to the current to be measured.

[0027] The first voltage terminal 21 includes a flat portion 21a and a connection portion 21b formed by extending a portion of the side surface. Similarly, the second voltage terminal 22 includes a flat portion 22a and a connection portion 22b formed by extending a portion of the side surface.

[0028] A bus bar 23 is connected to the first electrode 12 via a flat portion 21a of the first voltage terminal 21. The connection between the first electrode 12 and the first voltage terminal 21 can be realized by joining using, for example, welding, soldering, brazing, low-temperature sintering, or the like. It is preferable that this connection does not use wire bonding. The connection between the first voltage terminal 21 and the bus bar 23 can be realized by joining using, for example, welding, soldering, brazing, low-temperature sintering, or the like. Similarly, a Cu frame 24 is connected to the second electrode 13 via a flat portion 22a of the second voltage terminal 22.

[0029] With this structure, resistor 10 is arranged in a stacked manner between flat portion 21a of first voltage terminal 21 and flat portion 22a of second voltage terminal 22, and between bus bar 23 and Cu frame 24.

[0030] The voltage detection board 30 has an insulating board 31, and a conductive first voltage detection pattern 32 and a conductive second voltage detection pattern 33. The first voltage detection pattern 32 is disposed on one surface of the insulating board 31, and the second voltage detection pattern 33 is disposed on the other surface of the insulating board 31.

[0031] A via hole 34 is formed in the voltage detection board 30, penetrating the voltage detection board 30 in the stacking direction (or thickness direction, the same applies below). The second voltage detection pattern 33 is connected to the second voltage output portion 35 through the via hole 34. This connection is preferably made without using wire bonding.

[0032] The voltage detection board 30 is disposed so as to be sandwiched between the connection portion 21b of the first voltage terminal 21 and the connection portion 22b of the second voltage terminal 22. The connection portion 21b of the first voltage terminal 21 is connected to one end of the first voltage detection pattern 32. This connection can be realized by joining using, for example, welding, soldering, brazing, low-temperature sintering, or the like. It is preferable that this connection does not use wire bonding. Similarly, the connection portion 22b of the second voltage terminal 22 is connected to one end of the second voltage detection pattern 33.

[0033] In this specification, "one end" of a structure means, for example, one of the two ends to which the structure extends, and may particularly mean the terminal end, but it may also mean not only a part that includes the strict terminal end, but also a part that can essentially be considered to be the terminal end, such as the area to which connection portion 21b is connected in first voltage detection pattern 32 in Figure 3.

[0034] In this manner, in the current detection device 100, the first voltage terminal 21 and the second voltage terminal 22 are connected to the first electrode 12 and the second electrode 13 of the vertically structured resistor 10, respectively. The first voltage terminal 21 and the second voltage terminal 22 are connected to a control circuit (not shown) via the first voltage detection pattern 32 and the second voltage detection pattern 33 of the voltage detection board 30. With this configuration, it becomes possible to transmit a voltage signal to the control circuit.

[0035] According to such a configuration, it is possible to detect a current with higher accuracy. For example, since a voltage can be extracted by the plate-like first voltage terminal 21 and second voltage terminal 22 without using wire bonding, the accuracy is improved.

[0036] In this embodiment, the first voltage detection pattern 32 and the second voltage detection pattern 33 are disposed adjacent to each other. That is, as shown in Fig. 3, the first voltage detection pattern 32 and the second voltage detection pattern 33 are disposed so as to overlap with each other at least partially when viewed from the stacking direction of the voltage detection board 30. This configuration can reduce the influence of external noise.

[0037] Fig. 5 is a side view showing a configuration example of a current detection device 100 according to a modified example of the first embodiment. The first voltage terminal 21 and the second voltage terminal 22 are made of a composite material, and the material of the flat parts 21a and 22a is different from the material of the connection parts 21b and 22b. In Fig. 5, in order to illustrate that the materials are different, the connection parts 21b and 22b are particularly shown with patterns (the same applies to Figs. 6 and 7 below).

[0038] The resistivity (ρ) of the material of the connecting portions 21b and 22b is higher than the resistivity of the material of the flat portions 21a and 22a. By increasing the resistivity of the connecting portions 21b and 22b, the temperature coefficient of resistance (TCR) of the current detection device 100 can be controlled.

[0039] In first voltage terminal 21, flat portion 21a and connecting portion 21b may be joined by butt welding, or may be joined by a method such as machining a thin groove in flat portion 21a and embedding thin connecting portion 21b in the groove.

[0040] Due to the difference in resistivity, the current flow path is dominated by the path along arrow A in Fig. 5. Voltage is detected from the point farthest from the current path, and in this case, the TCR shifts to the negative side. This is because a large potential difference occurs in the first voltage terminal 21, making it difficult for current to flow near the connection part 21b (current density becomes low), and the TCR value changes. The same is true for the second voltage terminal 22.

[0041] The connecting portions 21b and 22b are preferably formed of a material having a significantly higher resistivity than the flat portions 21a and 22a. For example, if the flat portions 21a and 22a are formed of oxygen-free Cu (1.7 μΩ·cm) and the connecting portions 21b and 22b are formed of a CuMn-based alloy (20 to 130 μΩ·cm), a CuNi-based alloy (10 to 50 μΩ·cm), a CuZn-based alloy (20 to 40 μΩ·cm), a Ni-based alloy (80 to 140 μΩ·cm), or the like, a resistivity ratio of 10 times or more can be obtained depending on the configuration.

[0042] In this modified example, both first voltage terminal 21 and second voltage terminal 22 are made of a composite material, but the same effect can be obtained if at least one of first voltage terminal 21 and second voltage terminal 22 is made of such a material.

[0043] Fig. 6 is a diagram showing a further modified example of the second voltage terminal 22 of Fig. 5. Fig. 6(a) shows a bottom view, and Fig. 6(b) shows a side view. The second voltage terminal 22 is made of a composite material and includes a first portion 22c and a second portion 22d. It is preferable that the second portion 22d is made of a material having a significantly higher resistivity than the first portion 22c.

[0044] The first portion 22c includes at least a part of the flat portion 22a. The second portion 22d includes the connecting portion 22b. In this example, the first portion 22c and the second portion 22d do not overlap at all when viewed from the stacking direction.

[0045] The resistivity of the material of the second portion 22d is higher than the resistivity of the material of the first portion 22c. By increasing the resistivity of the second portion 22d, the temperature coefficient of resistance (TCR) of the current detection device 100 can be controlled.

[0046] When the second portion 22d is enlarged relative to the first portion 22c, the voltage extracting portion approaches the current path, and the TCR shifts to the positive side. For example, when the boundary between the second portion 22d and the first portion 22c is moved toward the first portion 22c (i.e., in the direction of the arrow B in FIG. 6(a)), the TCR shifts to the positive side.

[0047] It is preferable that the second voltage terminal 22 be in a state where it can be easily joined, for example by soldering, to the second electrode 13, Cu frame 24, voltage detection board 30, etc., and it is preferable, for example, to subject the entire second voltage terminal 22 to Ni plating, Au flash plating, etc.

[0048] 6 shows only the second voltage terminal 22, but the first voltage terminal 21 can be configured in a similar manner. Furthermore, if the voltage detection board 30 is a flexible board, this increases the degree of freedom in connection with the control circuit, which is preferable.

[0049] Figure 7 shows a further modified example of the second voltage terminal 22 of Figure 5. Figure 7(a) shows a bottom view, and Figure 7(b) shows a side view.

[0050] In this example, the position of connection portion 22b is moved in the lateral direction (the direction perpendicular to the extension direction of connection portion 22b and the thickness direction of second voltage terminal 22), and in particular is located at the lateral end of connection portion 22b. The distribution of first portion 22c and second portion 22d is also changed, and in particular the lateral dimension of second portion 22d is reduced, and in the plan view, it becomes a rectangular range that extends connection portion 22b. In this example, as shown in FIG. 7(b), first portion 22c and second portion 22d partially overlap each other when viewed from the stacking direction.

[0051] In this example, when the second portion 22d is enlarged relative to the first portion 22c, the TCR shifts to the positive side. For example, when the boundary between the first portion 22c and the second portion 22d is moved toward the first portion 22c (i.e., in the direction of the arrow B or the arrow C in FIG. 7(a)), the TCR shifts to the positive side.

[0052] 7 shows only the second voltage terminal 22, the first voltage terminal 21 can be configured in the same manner. By changing the configurations of the first voltage terminal 21 and the second voltage terminal 22 in this way, it becomes possible to control the TCR more flexibly.

[0053] In Figures 6 and 7, the first portion 22c and the second portion 22d may be joined by butt welding, or may be joined by a method such as machining a thin groove in the first portion 22c and embedding the thin second portion 22d in the groove.

[0054] [Example 2] 8 is a side view showing a configuration example of a current detection device 100 according to a second embodiment of the present invention. The second embodiment will be described below, but the description of parts common to the first embodiment may be omitted.

[0055] The resistor 10 and the voltage detection board 30 are arranged in parallel to each other. The first voltage terminal 21 and the second voltage terminal 22 of the first embodiment (FIG. 1) are not provided in the second embodiment, and the bus bar 23 is connected to the first electrode 12 of the resistor 10. Similarly, the Cu frame 24 is connected to the second electrode 13 of the resistor 10. For example, the first electrode 12 and the bus bar 23 may be in direct contact with each other, or may be joined by welding, soldering, brazing, low-temperature sintering, or the like. It is preferable that this connection does not use wire bonding. The same is true for the second electrode 13 and the Cu frame 24. With this structure, the resistor 10 is arranged in a stacked manner between the bus bar 23 and the Cu frame 24 in a simpler structure.

[0056] Also, one end of the first voltage detection pattern 32 is connected to the first electrode 12. For example, a side surface of the first electrode 12 (a side surface of the first electrode 12 in FIG. 8 that faces the voltage detection board 30) and a side surface of the first voltage detection pattern 32 (a side surface of the first voltage detection pattern 32 in FIG. 8 that faces the resistor 10) are joined directly by welding or by soldering using a joining material. It is preferable that this joining does not use wire bonding. Similarly, one end of the second voltage detection pattern 33 is connected to the second electrode 13.

[0057] In this manner, the first electrode 12, the second electrode 13, the first voltage detection pattern 32, and the second voltage detection pattern 33 each have an exposed portion on the side surface. The exposed portion of the first electrode 12 and the exposed portion of the first voltage detection pattern 32 are joined and connected, and the exposed portion of the second electrode 13 and the exposed portion of the second voltage detection pattern 33 are joined and connected. It is preferable that this connection is made without using wire bonding.

[0058] In this embodiment, the resistor 10 and the voltage detection board 30 have the same or almost the same thickness. The resistor 11 and the insulating board 31, the first electrode 12 and the first voltage detection pattern 32, and the second electrode 13 and the second voltage detection pattern 33 also have the same or almost the same thickness. This configuration makes joining easy.

[0059] In the second embodiment, the current can be detected with higher accuracy, similarly to the first embodiment. For example, the voltage can be extracted without relying on wire bonding, improving the accuracy.

[0060] An example of the configuration of a current detection device 100 according to a modified example of the second embodiment will be described with reference to Fig. 9 and Fig. 10. Fig. 9 is a plan view, and Fig. 10 is a side view.

[0061] The first electrode 12 has a voltage detection pattern connection portion 12a formed by extending a part of a side surface. Similarly, the second electrode 13 has a voltage detection pattern connection portion 13a formed by extending a part of a side surface.

[0062] The resistor 10 and the voltage detection board 30 are arranged in parallel, and in particular, the voltage detection board 30 is arranged sandwiched between the voltage detection pattern connection portion 12a of the first electrode 12 and the voltage detection pattern connection portion 13a of the second electrode 13. With this configuration, the voltage detection board 30 can be stably fixed by the voltage detection pattern connection portions 12a and 13a.

[0063] A configuration example of a current detection device 100 according to another modified example of the second embodiment will be described with reference to Fig. 11. The resistor 10 has a slit 10a extending inward from a side surface. The slit 10a is, for example, rectangular. The slit 10a is formed by forming slits in corresponding regions of the resistive body 11, the first electrode 12, and the second electrode 13.

[0064] Similarly, the voltage detection board 30 has a slit 30a extending inward from a side surface thereof. The slit 30a is, for example, rectangular. The slit 30a is formed in, for example, an insulating board 31.

[0065] The resistor 10 and the voltage detection board 30 are arranged to intersect (for example, perpendicularly) and are fixed to each other by being inserted into the slits. In the example of Fig. 11, they are arranged so that their slit positions match each other, i.e., the voltage detection board 30 is inserted into the slit 10a of the resistor 10, and the resistor 10 is inserted into the slit 30a of the voltage detection board 30.

[0066] Although not specifically shown in Fig. 11, the connection for drawing out the voltage is realized by, for example, soldering. For example, one end of the first voltage detection pattern 32 and the first electrode 12 are connected by soldering. It is preferable that this connection does not use wire bonding.

[0067] With this configuration, positioning can be performed via the slit, making the assembly process easier.

[0068] In the example of Fig. 11, both the resistor 10 and the voltage detection board 30 have slits, but only one of them may have a slit. Even if only one of them has a slit, they can be inserted so that they cross each other as shown in Fig. 11.

[0069] A configuration example of a current detection device 100 according to still another modified example of the embodiment 2 will be described with reference to Fig. 12 and Fig. 13. Fig. 12 is a perspective view seen from the same direction as Fig. 11, and Fig. 13 is a perspective view seen from a different direction.

[0070] In this example, at the longitudinal ends of the bus bar 23 and the Cu frame 24, the resistor 10 (particularly the first electrode 12) extends longer than the bus bar 23, and the Cu frame 24 extends longer than the resistor 10 (particularly the second electrode 13).

[0071] The voltage detection board 30 has a step portion 30b formed thereon. The voltage detection board 30 is disposed in the same orientation as in FIG. 11 (in the orientation intersecting with the resistor 10). In particular, the side of the step portion 30b is disposed so as to contact the upper surface of the resistor 10 (i.e., the upper surface of the first electrode 12), and a part of the side surface other than the step portion 30b is disposed so as to contact the upper surface of the Cu frame 24. As in FIG. 11, the resistor 10 may have a slit 10a extending inward from the side surface, and the voltage detection board 30 may be inserted into the slit 10a of the resistor 10. In the examples of FIG. 12 and FIG. 13, the resistor 10 has the slit 10a, and the voltage detection board 30 has the step portion 30b, but only one of the slit 10a and the step portion 30b may be provided.

[0072] 12, the first voltage detection pattern 32 is connected to the first electrode 12 via solder 41 by soldering. Moreover, as shown in FIG 13, one end of the second voltage detection pattern 33 is connected to the Cu frame 24 via solder 42 by soldering. It is preferable that these connections are made without using wire bonding. Note that, as described above, the Cu frame 24 is connected to the second electrode 13, and therefore the second voltage detection pattern 33 is connected to the second electrode 13 as a result. [Explanation of symbols]

[0073] 10...Resistor 10a…Slit 11…Resistor 12...1st electrode 12a…Voltage detection pattern connection part 13a…Voltage detection pattern connection part 13…Second electrode 21...First voltage terminal 21a...Flat area 21b…Connection 21c…Part 1 21d…Second part 22...Second voltage terminal 22a...Flat area 22b…Connection 22c…Part 1 22d…Second part 23...Busbar (first conductor) 24...Cu frame (second conductor) 30...Voltage detection board 30a…Slit 30b…Step 31...Insulating substrate 32…First voltage detection pattern 33…Second voltage detection pattern 34…Beer hall 35…Second voltage output section 100...Current detection device

Claims

1. a resistor having a laminated structure, the resistor having a plate-like first electrode and a plate-like second electrode, and a plate-like resistive body disposed between the first electrode and the second electrode; a first conductor and a second conductor in the shape of a plate through which a current to be measured flows and which are connected to the resistor; a plate-shaped first voltage terminal and a plate-shaped second voltage terminal for detecting a voltage; a voltage detection board having an insulating substrate and a first voltage detection pattern and a second voltage detection pattern; Equipped with the first voltage detection pattern is disposed on one surface of the insulating substrate, the second voltage detection pattern is disposed on the other surface of the insulating substrate, each of the first voltage terminal and the second voltage terminal includes a flat portion and a connection portion formed by extending a part of a side surface; the first conductor is connected to the first electrode via a flat portion of the first voltage terminal; the second conductor is connected to the second electrode via a flat portion of the second voltage terminal; the resistor is disposed between the flat portion of the first voltage terminal and the flat portion of the second voltage terminal, and between the first conductor and the second conductor, in a stacked manner; a connection portion of the first voltage terminal connected to one end of the first voltage detection pattern; a connection portion of the second voltage terminal connected to one end of the second voltage detection pattern; the voltage detection board is disposed by being sandwiched between the connection portion of the first voltage terminal and the connection portion of the second voltage terminal; Current detection device.

2. The current detection device according to claim 1 , wherein the first voltage detection pattern and the second voltage detection pattern are arranged so as to overlap each other when viewed from a stacking direction of the voltage detection board.

3. 3. The current detection device of claim 1, wherein in at least one of the first voltage terminal and the second voltage terminal, the resistivity of the material of a first portion including the connection portion is higher than the resistivity of the material of a second portion including at least a portion of the flat portion.

4. a resistor having a laminated structure, the resistor having a plate-like first electrode and a plate-like second electrode, and a plate-like resistive body disposed between the first electrode and the second electrode; a first conductor and a second conductor in the shape of a plate through which a current to be measured flows and which are connected to the resistor; a voltage detection board having an insulating substrate and a first voltage detection pattern and a second voltage detection pattern; Equipped with the first voltage detection pattern is disposed on one surface of the insulating substrate, the second voltage detection pattern is disposed on the other surface of the insulating substrate, the first voltage detection pattern and the second voltage detection pattern are arranged so as to overlap each other when viewed from a stacking direction of the insulating substrate; The first conductor is connected to the first electrode, The second conductor is connected to the second electrode, The resistor is disposed in a stack between the first conductor and the second conductor, One end of the first voltage detection pattern is connected to the first electrode. Current detection device.

5. The current detection device according to claim 4 , wherein one end of the second voltage detection pattern is connected to the second electrode.

6. The current detection device according to claim 4 , wherein one end of the second voltage detection pattern is connected to the second conductor.

7. the first electrode, the second electrode, the first voltage detection pattern, and the second voltage detection pattern each have an exposed portion on a side surface, The resistor and the voltage detection board are arranged in parallel to each other, an exposed portion of the first electrode and an exposed portion of the first voltage detection pattern are connected to each other; an exposed portion of the second electrode and an exposed portion of the second voltage detection pattern are connected to each other; The current detection device according to claim 5 .

8. the first electrode and the second electrode each include a voltage detection pattern connection portion formed by extending a part of a side surface, The resistor and the voltage detection board are arranged in parallel, the voltage detection board is disposed by being sandwiched between the voltage detection pattern connection portion of the first electrode and the voltage detection pattern connection portion of the second electrode; The current detection device according to claim 5 .

9. At least one of the resistor and the voltage detection board has a slit extending from a side surface, 7. The current detection device according to claim 4, wherein the resistor and the voltage detection board intersect and are fixed to each other by being inserted into the slits.

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