Semiconductor device and manufacturing method thereof
The semiconductor device addresses the challenge of forming contact plugs on electrode layers by using a laminated film structure with a concave-shaped plug, which reduces short circuits and improves pressure resistance, resulting in a more reliable and efficient semiconductor device.
Patent Information
- Application Number
- JP2023147955
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-09-12
- Publication Date
- 2025-03-25
AI Technical Summary
The existing semiconductor devices face challenges in forming contact plugs on electrode layers without short circuits, due to the complexity of the step structure and the need for precise placement and shape of the contact plugs.
The semiconductor device includes a first laminated film with alternately stacked insulating films and electrode layers, and a first plug with a concave shape at its lower end, which is designed to extend in the first direction and suitably placed on the top-level electrode layer, enhancing the distance between the plug and adjacent electrode layers to prevent short circuits.
This configuration allows for the effective formation of contact plugs on electrode layers, reducing the risk of short circuits and improving the pressure resistance between the contact plug and unconnected word lines, thereby enhancing the reliability and efficiency of the semiconductor device.