Substrate processing module and substrate processing method

The substrate processing module with an open-cell cleaning member, fine bubble generation, and controlled liquid supply addresses the inefficiencies of conventional cleaning methods, achieving enhanced cleaning efficiency and surface reliability for substrates.

JP2025043597APending Publication Date: 2025-04-01EBARA CORP
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Patent Information

Application Number
JP2023150967
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-09-19
Publication Date
2025-04-01

AI Technical Summary

Technical Problem

The existing cleaning methods for substrates, particularly in the semiconductor industry, face inefficiencies due to the small size of particles on the substrate surface, which are not effectively removed by conventional physical cleaning tools with larger cleaning members.

Method used

A substrate processing module equipped with a cleaning member having an open-cell structure, a gas supply device to generate fine bubbles, and a liquid supply device, along with a distance adjusting mechanism, ultrasonic transducer, and temperature regulator, to enhance cleaning efficiency.

Benefits of technology

The module significantly improves the cleaning efficiency of substrates by effectively removing small particles through the use of fine bubbles and controlled liquid and gas supply, leading to better surface cleanliness and adhesion reliability.

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Abstract

To provide a substrate processing module capable of improving the cleaning efficiency of an object to be cleaned.SOLUTION: A substrate processing module includes a gas supplying device 350 that supplies gas to a gap between a cleaning member 400 and a surface to be cleaned 600. The gas supplying device 350 generates fine bubbles through the cleaning member 400.SELECTED DRAWING: Figure 7
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