LED display module and method for manufacturing display module

Abstract

To provide a display module to solve issues of related techniques that a display module is generally thick and is more expensive, and a method for manufacturing the display module.SOLUTION: In the display module including a substrate, a plurality of light-emission units, and a sealing layer, a plurality of light-emission units are provided on the front surface of the substrate, the sealing layer covers each light-emission unit, each light-emission unit includes at least one LED chip, the sealing layer causes light emitted from the LED chip to pass through the sealing layer, and the sealing layer is thicker than the light-emission unit.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to the field of LED (Light Emitting Diode, LED chip) displays, and more particularly to an LED display module and a manufacturing method for the display module. [Background technology]

[0002] LEDs are widely used in the field of displays, etc. In the field of displays, there are strict requirements for the sealing performance of LEDs and the thickness of display modules using LEDs (hereinafter also referred to as "LED display modules"). In addition, in the display field, LED lamp beads with better sealing properties are commonly used to meet the sealing performance requirements, which include a bracket, an LED chip placed in the bracket, and a sealing adhesive layer sealing the LED chip in the bracket. Summary of the Invention [Problem to be solved by the invention]

[0003] However, although LED lamp beads can meet the sealing requirements, they tend to be large in size and costly due to the use of LED brackets. As a result, display modules using LED lamp beads are thicker overall and more expensive. The present invention aims to solve the above-mentioned problems in the prior art, and the purpose of the present application is to provide an LED display module and a manufacturing method for the display module, which aims to solve the problem in the related art that the display module is generally thicker and more expensive. [Means for solving the problem]

[0004] In view of the above-mentioned problems, the present invention provides the following configuration: A display module including a substrate, a plurality of light-emitting units, and an encapsulating layer, wherein the plurality of light-emitting units are disposed on a front surface of the substrate, the encapsulating layer covers each of the light-emitting units, each of the light-emitting units includes at least one LED chip, the encapsulating layer transmits light emitted from the LED chip, and the thickness of the encapsulating layer is greater than the thickness of the light-emitting units. Furthermore, the substrate may include a first mounting portion located on the front surface of the substrate, a second mounting portion located on the back surface of the substrate, and a path extension portion around the first mounting portion, the light-emitting units are arranged in an array on the first mounting portion, the path extension portion includes at least one of a protrusion portion and a lower recess portion, the protrusion portion protruding from the front surface of the substrate, and the lower recess portion being recessed from the front surface of the substrate toward the back surface of the substrate, the sealing layer being provided on the front surface of the substrate and covering the path extension portion and the light-emitting units, and a first distance L1 between an outer surface of the path extension portion and a center of the nearest light-emitting unit may be smaller than 1 / 2 of a row spacing L2 between the centers of two adjacent light-emitting units parallel to the outer surface on the first mounting portion.

[0005] Furthermore, the encapsulating layer may include a first encapsulating layer and a second encapsulating layer, the substrate may include a display area located on the front side of the substrate, the light-emitting unit may be provided in the display area, the second encapsulating layer may be provided on the front side of the substrate and cover the light-emitting unit, and the second encapsulating layer may cover the first encapsulating layer, and may extend toward the back side of the substrate and at least partially cover the side of the substrate. In addition, at least one side of the substrate is a bonding side that bonds with a substrate of another display module, and an area of ​​the bonding side near the back surface of the substrate may be reduced to form an avoidance area, and an area of ​​the bonding side near the front surface of the substrate may be used as the bonding area. In addition, each of the light-emitting units may include a plurality of LED chips, and the display module may further include a black adhesive layer provided on the front surface of the substrate, the black adhesive layer covering a first region located between each of the light-emitting units on the front surface of the substrate and a second region between each of the LED chips in each of the light-emitting units, and the light-emitting surface of each of the LED chips may be exposed to the black adhesive layer, and the sealing layer may cover the black adhesive layer and each of the light-emitting units.

[0006] In addition, a plurality of pads may be provided on the front surface of the substrate, and the electrodes of each of the LED chips may be soldered to the corresponding pads by solder paste, which covers the pads. The solder paste may include a mixture of metal solder and flux, and the density of melanin may be lower than that of the metal solder. During the process of heating and melting the solder paste for soldering, the melanin may be extruded onto the upper surface of the solder paste under the coagulation effect of the metal solder, making the upper surface appear black. In addition, the display module may further include a black precipitate layer covering the front surface of the substrate and the top surface of each of the light-emitting units by sputtering molecules of a black base material onto the front surface of the substrate and the top surface of each of the light-emitting units, and the thickness of the black precipitate layer on the light-emitting surface of each of the light-emitting units may be thicker than the thickness of the black precipitate layer in other locations, and the sealing layer may be disposed on the front surface of the substrate and cover the black precipitate layer and each of the light-emitting units.

[0007] The sealing layer may be a translucent layer disposed on the front surface of the substrate, covering at least an area on the front surface of the substrate that is not already covered by the orthogonal projection of each of the light-emitting units. The sealing layer may include a reflective layer and a black adhesive layer adsorbed on the reflective layer. The reflective layer may include reflective particles and gaps located between each of the reflective particles, which form first light-transmitting channels for light to pass through the reflective layer. The black adhesive layer may include a transparent adhesive base layer, micron-sized glass beads distributed within the transparent adhesive base layer, and micron-sized black powder filled between each of the micron-sized glass beads, which form second light-transmitting channels for light to pass through the black adhesive layer. In addition, there may be a first gap between adjacent light-emitting units, and each of the light-emitting units may include a plurality of LED chips. The plurality of sealing layers may be second translucent adhesive layers provided on the front surface of the substrate, covering the front surface of the substrate and the light-emitting surfaces of the LED chips, and also forming a lower recess at the location of the first gap. The sealing layer may cover the black adhesive layer, and a portion of the black adhesive layer may be filled in the lower recess and cover at least the lower recess.

[0008] Furthermore, the encapsulating layer may have a plurality of first light-diffusing areas distributed at intervals in regions corresponding to the light-emitting surfaces of the LED chips provided on the front surface of the substrate, and the first light-diffusing areas may include at least one light-diffusing unit, which may include a light-incident surface facing the light-emitting surface of the LED chip and a light-exiting surface flush with the light-exiting surface of the encapsulating layer, and the light-exiting surface of the encapsulating layer may be a surface away from the substrate. [Effects of the Invention]

[0009] The present application provides a display module, which includes a substrate and light-emitting units disposed on a front surface of the substrate, each light-emitting unit including at least one LED chip, and an encapsulation layer disposed on the substrate to cover each light-emitting unit.

[0010] The display module of the present application does not use LED lamp beads as a light source, but directly uses LED chips as a light source. Therefore, the brackets included in the LED lamp beads can be omitted, which not only reduces costs but also reduces the overall thickness of the display module, contributing to a thinner and lighter display. Furthermore, the provided encapsulation layer covers each light-emitting unit, meets the encapsulation requirements of the display module, and protects each light-emitting unit. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a schematic structural diagram of a display module provided by the present application;

[0012] [Figure 2-1] 1 is a schematic structural diagram 1 of a display module provided in a first embodiment of the present application;

[0013] [Figure 2-2] FIG. 2-2 is a top view of the display module shown in FIG. 2-1.

[0014] [Figure 2-3] FIG. 2 is a bottom view of the display module shown in FIG. 2-2.

[0015] [Figure 2-4] 2 is a schematic diagram of the structure of the display module provided in the first embodiment of the present application;

[0016] [Figure 2-5] FIG. 5 is a top view of the display module shown in FIG. 2-4.

[0017] [Figure 2-6] 1 is a schematic diagram 1 of a substrate structure provided in a first embodiment of the present application.

[0018] [Figure 2-7]2 is a schematic diagram 2 of a substrate structure provided in the first embodiment of the present application.

[0019] [Figure 2-8] 3 is a schematic diagram of a substrate structure provided in the first embodiment of the present application.

[0020] [Figure 2-9] 4 is a schematic diagram of a substrate structure provided in the first embodiment of the present application.

[0021] [Figure 2-10] 5 is a schematic diagram of a substrate structure provided in the first embodiment of the present application.

[0022] [Figure 2-11] 6 is a schematic diagram of a substrate structure provided in the first embodiment of the present application.

[0023] [Figure 2-12] 7 is a schematic diagram 7 of a substrate structure provided in the first embodiment of the present application.

[0024] [Figure 2-13] 8 is a schematic diagram of a substrate structure provided in the first embodiment of the present application.

[0025] [Figure 2-14] 9 is a schematic diagram of a substrate structure provided in the first embodiment of the present application.

[0026] [Figure 2-15] 1 is a schematic diagram 10 of a substrate structure provided in a first embodiment of the present application.

[0027] [Figure 2-16] 3 is a schematic diagram of the structure of the display module provided in the first embodiment of the present application;

[0028] [Figure 2-17] 4 is a schematic diagram of the structure of the display module provided in the first embodiment of the present application;

[0029] [Figure 2-18] 5 is a schematic diagram of the structure of the display module provided in the first embodiment of the present application.

[0030] [Figure 2-19] 6 is a schematic diagram 6 of the structure of the display module provided in the first embodiment of the present application.

[0031] [Figure 2-20] 7 is a schematic diagram of the structure of the display module provided in the first embodiment of the present application;

[0032] [Figure 2-21] FIG. 2 is a schematic structural diagram of a display screen provided in the first embodiment of the present application;

[0033] [Figure 3-1] FIG. 1 is a top view of a display module provided in a first embodiment of the present application.

[0034] [Figure 3-2] FIG. 2 is a bottom view of the display module provided in the first embodiment of the present application.

[0035] [Figure 3-3] FIG. 3-2 is a cross-sectional view of the display module shown in FIG.

[0036] [Figure 3-4] 2 is a schematic diagram of the structure of the display module provided in the first embodiment of the present application;

[0037] [Figure 3-5] 3 is a schematic diagram of the structure of the display module provided in the first embodiment of the present application;

[0038] [Figure 3-6] 4 is a schematic diagram of the structure of the display module provided in the first embodiment of the present application;

[0039] [Figure 3-7] 5 is a schematic diagram of the structure of the display module provided in the first embodiment of the present application.

[0040] [Figure 3-8] 6 is a schematic diagram 6 of the structure of the display module provided in the first embodiment of the present application.

[0041] [Figure 3-9] 7 is a schematic diagram of the structure of the display module provided in the first embodiment of the present application;

[0042] [Figure 3-10] 8 is a schematic diagram of the structure of the display module provided in the first embodiment of the present application.

[0043] [Figure 4-1] 1 is a schematic structural diagram of a display module provided in a third embodiment of the present application;

[0044] [Figure 4-2] FIG. 10 is a partially enlarged schematic view of a joint portion of a display module provided in a third embodiment of the present application.

[0045] [Figure 4-3] 2 is a schematic diagram 2 of the structure of a display module provided in the third embodiment of the present application.

[0046] [Figure 4-4] 3 is a schematic diagram 3 of the structure of a display module provided in the third embodiment of the present application.

[0047] [Figure 4-5] 4 is a schematic diagram 4 of the structure of a display module provided in the third embodiment of the present application.

[0048] [Figure 4-6]FIG. 10 is a schematic diagram of a basic wiring area provided in a third embodiment of the present application.

[0049] [Figure 4-7] 5 is a schematic diagram 5 of the structure of a display module provided in the third embodiment of the present application.

[0050] [Figure 4-8] 6 is a schematic diagram 6 of the structure of a display module provided in the third embodiment of the present application.

[0051] [Figure 4-9] 7 is a schematic diagram of the structure of a display module provided in the third embodiment of the present application;

[0052] [Figure 4-10] 8 is a schematic diagram of the structure of a display module provided in the third embodiment of the present application.

[0053] [Figure 4-11] 9 is a schematic diagram of the structure of a display module provided in the third embodiment of the present application.

[0054] [Figure 4-12] 10 is a schematic diagram of the structure of a display module provided in the third embodiment of the present application.

[0055] [Figure 4-13] 11 is a schematic diagram of the structure of a display module provided in the third embodiment of the present application.

[0056] [Figure 4-14] 12 is a schematic diagram of the structure of a display module provided in the third embodiment of the present application.

[0057] [Figure 4-15] 13 is a schematic diagram of the structure of a display module provided in the third embodiment of the present application.

[0058] [Figure 4-16] 14 is a schematic diagram of the structure of a display module provided in the third embodiment of the present application.

[0059] [Figure 4-17] FIG. 1 is a schematic diagram of the bonding effect of the display module provided in the third embodiment of the present application.

[0060] [Figure 4-18] 2 is a schematic diagram of the bonding effect of the display module provided in the third embodiment of the present application;

[0061] [Figure 5-1] FIG. 10 is a schematic diagram of the front structure of a substrate provided in a fourth embodiment of the present application.

[0062] [Figure 5-2] FIG. 10 is a schematic diagram of the back structure of a substrate provided in a fourth embodiment of the present application.

[0063] [Figure 5-3] FIG. 10 is a schematic diagram of a groove structure on the front surface of a substrate provided in a fourth embodiment of the present application.

[0064] [Figure 5-4] FIG. 5-3 is a schematic diagram of the cross section taken along the line A4-A4 of FIG.

[0065] [Figure 5-5] FIG. 10 is a schematic structural diagram of a light-emitting unit attached to the front surface of a substrate provided in the fourth embodiment of the present application.

[0066] [Figure 5-6] FIG. 5 is a schematic diagram of the cross section taken along the line A4-A4 in FIG.

[0067] [Figure 5-7] FIG. 10 is a schematic structural diagram of the A4-A4 cross section after a first sealing layer is formed on the front surface of the substrate in the fourth embodiment of the present application.

[0068] [Figure 5-8] FIG. 10 is a schematic structural diagram of the A4-A4 cross section after a portion of the substrate has been craft-edged in the fourth embodiment of the present application.

[0069] [Figure 5-9] FIG. 5-3 is a schematic configuration diagram of another cross section taken along A4-A4 in FIG. 5-3 according to the fourth embodiment of the present invention.

[0070] [Figure 5-10] FIG. 5-3 is a schematic configuration diagram of another cross section taken along A4-A4 in FIG. 5-3 according to the fourth embodiment of the present invention.

[0071] [Figure 5-11] FIG. 5-3 is a schematic configuration diagram of another cross section taken along A4-A4 in FIG. 5-3 according to the fourth embodiment of the present invention.

[0072] [Figure 5-12a] FIG. 5-3 is a schematic configuration diagram of another cross section taken along A4-A4 in FIG. 5-3 according to the fourth embodiment of the present invention.

[0073] [Figure 5-12b] FIG. 5B is a schematic structural diagram of the fourth embodiment of the present invention after cutting a part of the craft edge according to FIG. 5-12a.

[0074] [Figure 5-13] 10 is a schematic configuration diagram of a cross section taken along the line A4-A4 in which driving electronic components are mounted on the rear surface of a substrate according to a fourth embodiment of the present invention. FIG.

[0075] [Figure 5-14] FIG. 10 is a schematic cross-sectional structural diagram of the bonding of two display modules in the fourth embodiment of the present application.

[0076] [Figure 5-15] FIG. 10 is a schematic cross-sectional structural view of a substrate according to a fourth embodiment of the present invention after a second sealing layer has been formed on the substrate.

[0077] [Figure 5-16] FIG. 16 is a structural schematic diagram of the fourth embodiment of the present application after cutting a portion of the craft edge based on FIGS. 5-15.

[0078] [Figure 5-17] FIG. 17 is a schematic cross-sectional structural view after the second sealing layer is formed based on FIGS. 5-16 in the fourth embodiment of the present application.

[0079] [Figure 5-18] FIG. 18 is a schematic cross-sectional structural view of two display modules after bonding shown in FIG. 5-17 according to the fourth embodiment of the present application.

[0080] [Figure 5-19] FIG. 10 is a schematic diagram of the front structure of a display module bonded to a screen in a fourth embodiment of the present application.

[0081] [Figure 5-20] 1 is a schematic diagram showing a rear groove structure formed on the rear surface of a substrate according to a fourth embodiment of the present invention.

[0082] [Figure 5-21] 10 is a schematic diagram 2 showing a rear groove structure formed on the rear surface of a substrate in accordance with a fourth embodiment of the present invention. FIG.

[0083] [Figure 5-22] 10 is a schematic diagram 3 showing a rear groove structure formed on the rear surface of a substrate in accordance with the fourth embodiment of the present invention. FIG.

[0084] [Figure 5-23] 4 is a schematic diagram 4 showing a rear groove structure formed on the rear surface of a substrate in the fourth embodiment of the present invention.

[0085] [Figure 5-24] FIG. 10 is a schematic diagram of another display module connection structure according to the fourth embodiment of the present application.

[0086] [Figure 6-1] 1 is a schematic structural diagram of a display module provided in a fifth embodiment of the present application;

[0087] [Figure 6-2] 2 is a schematic structural diagram 2 of a display module provided in the fifth embodiment of the present application;

[0088] [Figure 6-3] 3 is a schematic structural diagram of a display module provided in the fifth embodiment of the present application;

[0089] [Figure 6-4] 4 is a schematic structural diagram of a display module provided in the fifth embodiment of the present application;

[0090] [Figure 6-5a] 5 is a schematic structural diagram 5 of a display module provided in the fifth embodiment of the present application.

[0091] [Figure 6-5b] 6 is a schematic structural diagram of a display module provided in the fifth embodiment of the present application.

[0092] [Figure 6-6a] 7 is a schematic structural diagram 7 of a display module provided in the fifth embodiment of the present application.

[0093] [Figure 6-6b] 8 is a schematic structural diagram of a display module provided in the fifth embodiment of the present application.

[0094] [Figure 6-7] 9 is a schematic structural diagram of a display module provided in the fifth embodiment of the present application.

[0095] [Figure 6-8a] 10 is a schematic structural diagram of a display module provided in the fifth embodiment of the present application;

[0096] [Figure 6-8b] 11 is a schematic structural diagram of a display module provided in the fifth embodiment of the present application.

[0097] [Figure 6-9] FIG. 10 is a schematic diagram of a display module provided in a fifth embodiment of the present application.

[0098] [Figure 7-1] 1 is a schematic structural diagram of a display module provided in the sixth embodiment of the present application;

[0099] [Figure 7-2] FIG. 10 is an orthographic view of a display module provided in a sixth embodiment of the present application.

[0100] [Figure 7-3] 2 is a schematic structural diagram 2 of a display module provided in the sixth embodiment of the present application;

[0101] [Figure 7-4] FIG. 10 is a schematic structural diagram of a sealing layer provided in the sixth embodiment of the present application.

[0102] [Figure 7-5] FIG. 10 is a schematic structural diagram of a substrate provided in the sixth embodiment of the present application.

[0103] [Figure 7-6] FIG. 10 is a schematic structural diagram of a substrate clamp provided in a sixth embodiment of the present application.

[0104] [Figure 7-7] FIG. 10 is a schematic structural diagram of a substrate fixed to a substrate clamp provided in a sixth embodiment of the present invention.

[0105] [Figure 7-8] FIG. 10 is a schematic structural diagram of a sealing layer attached to a substrate provided in a sixth embodiment of the present invention.

[0106] [Figure 7-9] FIG. 10 is a schematic structural diagram of a sealing layer pressed to fit onto a substrate provided in a sixth embodiment of the present invention.

[0107] [Figure 7-10] FIG. 10 is a schematic structural diagram of the sealing layer provided in the sixth embodiment of the present invention after being pressed onto a substrate to fit.

[0108] [Figure 7-11] FIG. 10 is a schematic structural diagram of electronic components provided on the back surface of a substrate provided in a sixth embodiment of the present invention.

[0109] [Figure 7-12] FIG. 10 is a schematic structural diagram of a substrate provided in a sixth embodiment of the present invention.

[0110] [Figure 7-13] FIG. 10 is a schematic structural diagram of another substrate clamp provided in the sixth embodiment of the present invention.

[0111] [Figure 7-14] FIG. 10 is a schematic structural diagram of another substrate fixed to a substrate clamp provided in a sixth embodiment of the present invention.

[0112] [Figure 7-15] FIG. 10 is a schematic structural diagram of another sealing layer attached to a substrate provided in the sixth embodiment of the present invention.

[0113] [Figure 7-16] FIG. 10 is a schematic structural diagram of another sealing layer pressed to fit a substrate provided in a sixth embodiment of the present invention.

[0114] [Figure 7-17] FIG. 10 is a schematic structural diagram of another sealing layer provided in the sixth embodiment of the present invention after being pressed onto a substrate to fit together.

[0115] [Figure 8-1] FIG. 10 is a schematic diagram of a solder paste provided in a seventh embodiment of the present invention.

[0116] [Figure 8-2] 1 is a schematic structural diagram of a substrate provided in a seventh embodiment of the present invention;

[0117] [Figure 8-3] FIG. 2 is a structural schematic diagram 2 of a substrate provided in the seventh embodiment of the present invention.

[0118] [Figure 8-4] 1 is a structural schematic diagram 1 of a display module provided in the seventh embodiment of the present invention;

[0119] [Figure 8-5] 8-5 is a schematic diagram of a welding structure corresponding to the single LED chip of FIG. 8-4.

[0120] [Figure 8-6] FIG. 10 is a physical reference diagram of a display module provided in the seventh embodiment of the present invention.

[0121] [Figure 8-7] FIG. 2 is a structural schematic diagram 2 of a display module provided in the seventh embodiment of the present invention.

[0122] [Figure 8-8] 10A and 10B are schematic diagrams illustrating a method for manufacturing a display module according to a seventh embodiment of the present invention.

[0123] [Figure 9-1] 1 is a schematic diagram of a black sediment layer provided in the eighth embodiment of the present application.

[0124] [Figure 9-2] 2 is a schematic diagram 2 of a black sediment layer provided in the eighth embodiment of the present application.

[0125] [Figure 9-3] 3 is a schematic diagram of a black sediment layer provided in the eighth embodiment of the present application.

[0126] [Figure 9-4] 1 is a schematic diagram of a manufacturing process of a display module provided in the eighth embodiment of the present application;

[0127] [Figure 9-5] 2 is a schematic diagram 2 of the manufacturing process of the display module provided in the eighth embodiment of the present application.

[0128] [Figure 9-6] 3 is a schematic diagram 3 of the manufacturing process of the display module provided in the eighth embodiment of the present application.

[0129] [Figure 9-7] FIG. 1 is a schematic diagram of magnetron sputtering provided in the eighth embodiment of the present application.

[0130] [Figure 9-8] FIG. 2 is a schematic diagram 2 of magnetron sputtering provided in the eighth embodiment of the present application.

[0131] [Figure 9-9] 1 is a schematic structural diagram 1 of a display module provided in the eighth embodiment of the present application;

[0132] [Figure 9-10] 2 is a schematic structural diagram 2 of a display module provided in the eighth embodiment of the present application;

[0133] [Figure 9-11] 3 is a schematic structural diagram 3 of a display module provided in the eighth embodiment of the present application;

[0134] [Figure 9-12] FIG. 10 is a schematic structural diagram of an LED display screen provided in the eighth embodiment of the present application.

[0135] [Figure 10-1] FIG. 13 is a schematic diagram illustrating a substrate provided with a light-emitting unit according to a ninth embodiment of the present invention.

[0136] [Figure 10-2] FIG. 13 is a schematic diagram showing the basic structure of a semitransparent layer provided in a ninth embodiment of the present invention.

[0137] [Figure 10-3] FIG. 13 is a schematic structural diagram of a reflective layer provided in the ninth embodiment of the present invention.

[0138] [Figure 10-4] FIG. 13 is a schematic structural diagram of a third black adhesive layer provided in the ninth embodiment of the present invention.

[0139] [Figure 10-5] 1 is a schematic diagram of the optical path of a semi-transparent layer provided in a ninth embodiment of the present invention.

[0140] [Figure 10-6] 2 is a schematic diagram 2 of the optical path of the semi-transparent layer provided in the ninth embodiment of the present invention.

[0141] [Figure 10-7] 1 is a schematic structural diagram of a display module provided in a ninth embodiment of the present invention;

[0142] [Figure 10-8] 10-7 is a schematic diagram of the optical path of the display module in FIG.

[0143] [Figure 10-9] 10-7 is a schematic diagram 2 of the optical path of the display module in FIG.

[0144] [Figure 10-10] FIG. 13 is a schematic diagram of a plane mirror surface provided by a ninth embodiment of the present invention.

[0145] [Figure 10-11] FIG. 13 is a schematic diagram of a specular reflection provided by a ninth embodiment of the present invention.

[0146] [Figure 10-12] FIG. 13 is a schematic diagram of diffuse reflection provided by a ninth embodiment of the present invention.

[0147] [Figure 10-13] FIG. 2 is a structural diagram of a display module provided in the ninth embodiment of the present invention.

[0148] [Figure 10-14] 3 is a structural diagram of a display module provided in the ninth embodiment of the present invention;

[0149] [Figure 10-15] FIG. 4 is a structural diagram of a display module provided in the ninth embodiment of the present invention.

[0150] [Figure 10-16] 5 is a structural diagram of a display module provided in the ninth embodiment of the present invention.

[0151] [Figure 10-17] 6 is a structural diagram of a display module provided in the ninth embodiment of the present invention.

[0152] [Figure 10-18] FIG. 7 is a structural diagram of a display module provided in the ninth embodiment of the present invention.

[0153] [Figure 10-19] 8 is a structural diagram of a display module provided in a ninth embodiment of the present invention.

[0154] [Figure 10-20] 9 is a structural diagram 9 of a display module provided in the ninth embodiment of the present invention.

[0155] [Figure 10-21] 1 is a schematic diagram of a manufacturing process of a display module provided in a ninth embodiment of the present invention.

[0156] [Figure 10-22] 2 is a schematic diagram of the manufacturing process of the display module provided in the ninth embodiment of the present invention.

[0157] [Figure 10-23] 3 is a schematic diagram 3 of the manufacturing process of the display module provided in the ninth embodiment of the present invention.

[0158] [Figure 10-24] 4 is a schematic diagram 4 of the manufacturing process of the display module provided in the ninth embodiment of the present invention.

[0159] [Figure 10-25] 5 is a schematic diagram 5 of the manufacturing process of a display module provided in the ninth embodiment of the present invention.

[0160] [Figure 10-26] 6 is a schematic diagram 6 of the manufacturing process of a display module provided in the ninth embodiment of the present invention.

[0161] [Figure 10-27] FIG. 13 is a schematic structural diagram of a display screen provided in a ninth embodiment of the present invention.

[0162] [Figure 11-1] 1 is a schematic diagram of a manufacturing process of a display module provided by a tenth embodiment of the present invention.

[0163] [Figure 11-2] FIG. 12 is a schematic cross-sectional view of a display module provided by a tenth embodiment of the present invention after removing the first encapsulation layer.

[0164] [Figure 11-3] 2 is a schematic diagram 2 of the manufacturing process of a display module provided by the tenth embodiment of the present invention.

[0165] [Figure 11-4] FIG. 2 is a schematic cross-sectional view of a display module provided by a tenth embodiment of the present invention after removing the first encapsulation layer.

[0166] [Figure 11-5] FIG. 1 is a schematic cross-sectional view of a display module provided in a tenth embodiment of the present invention.

[0167] [Figure 11-6] FIG. 2 is a schematic cross-sectional view of a display module provided in a tenth embodiment of the present invention.

[0168] [Figure 11-7] 3 is a schematic cross-sectional view of a display module provided in a tenth embodiment of the present invention.

[0169] [Figure 11-8] 4 is a schematic cross-sectional view of a display module provided in a tenth embodiment of the present invention.

[0170] [Figure 11-9] 5 is a schematic cross-sectional view of a display module provided in a tenth embodiment of the present invention.

[0171] [Figure 11-10] 6 is a schematic cross-sectional view of a display module provided in a tenth embodiment of the present invention.

[0172] [Figure 11-11] 7 is a schematic cross-sectional view of a display module provided in the tenth embodiment of the present invention.

[0173] [Figure 11-12] 8 is a schematic cross-sectional view of a display module provided in a tenth embodiment of the present invention.

[0174] [Figure 11-13] 9 is a schematic cross-sectional view of a display module provided in a tenth embodiment of the present invention.

[0175] [Figure 12-1] FIG. 16 is a schematic structural diagram of a display module provided by the eleventh embodiment of the present application.

[0176] [Figure 12-2] FIG. 22 is a schematic diagram of a light uniformization process by a light diffusion unit provided by the eleventh embodiment of the present invention.

[0177] [Figure 12-3] 1 is a schematic diagram of a projection of a light diffusion unit on a substrate provided by an eleventh embodiment of the present application;

[0178] [Figure 12-4] 2 is a schematic diagram of the projection of a light diffusion unit on a substrate provided by the eleventh embodiment of the present application;

[0179] [Figure 12-5] 3 is a schematic diagram of the projection of a light diffusion unit on a substrate provided by the eleventh embodiment of the present application;

[0180] [Figure 12-6] 4 is a schematic diagram of the projection of a light diffusion unit on a substrate provided by the eleventh embodiment of the present application;

[0181] [Figure 13-1] FIG. 22 is a schematic structural diagram of a display module provided by the twelfth embodiment of the present application.

[0182] [Figure 13-2]FIG. 22 is a schematic diagram of a light-emitting unit including four rectangular LED chips provided by the twelfth embodiment of the present application.

[0183] [Figure 13-3] FIG. 22 is a schematic diagram of the arrangement of LED chips on a bonding substrate provided by the twelfth embodiment of the present application.

[0184] [Figure 13-4] FIG. 22 is a schematic diagram of another arrangement of LED chips on a bonding substrate provided by the twelfth embodiment of the present application.

[0185] [Figure 13-5] FIG. 22 is a schematic diagram of a light-emitting unit including three elliptical LED chips provided by the twelfth embodiment of the present application.

[0186] [Figure 13-6] FIG. 22 is a schematic diagram of the electrical connection of the electrodes near the center of the LED chip provided by the twelfth embodiment of the present application.

[0187] [Figure 13-7] FIG. 23 is a schematic diagram showing the arrangement direction of LED chip electrodes in another light-emitting unit provided by the twelfth embodiment of the present application.

[0188] [Figure 13-8] FIG. 22 is a schematic diagram showing the arrangement direction of LED chip electrodes in another light-emitting unit provided by the twelfth embodiment of the present application.

[0189] [Figure 13-9] FIG. 22 is another structural schematic diagram of a display module provided by the twelfth embodiment of the present application.

[0190] [Figure 13-10] FIG. 22 is a schematic diagram of the adjustable distance and adjustable angle of the LED chip relative to the center of rotational symmetry provided by the twelfth embodiment of the present application.

[0191] [Figure 13-11] FIG. 22 is a schematic diagram of a first light-emitting unit including three LED chips provided by the twelfth embodiment of the present application.

[0192] [Figure 13-12] FIG. 22 is a schematic diagram of a second light-emitting unit including three LED chips provided by the twelfth embodiment of the present application.

[0193] [Figure 13-13] FIG. 22 is a schematic diagram of a third light-emitting unit including three LED chips provided by the twelfth embodiment of the present application.

[0194] [Figure 13-14] FIG. 22 is a schematic diagram of a fourth light-emitting unit including three LED chips provided by the twelfth embodiment of the present application.

[0195] [Figure 13-15] FIG. 22 is a schematic diagram of a fifth light-emitting unit including three LED chips provided by the twelfth embodiment of the present application.

[0196] [Figure 13-16] FIG. 22 is a schematic diagram of a first light-emitting unit including four LED chips provided by the twelfth embodiment of the present application.

[0197] [Figure 13-17] FIG. 22 is a schematic diagram of a second light-emitting unit including four LED chips provided by the twelfth embodiment of the present application.

[0198] [Figure 13-18] FIG. 22 is a schematic diagram of a third light-emitting unit including four LED chips provided by the twelfth embodiment of the present application.

[0199] [Figure 13-19] FIG. 22 is a schematic diagram of a fourth light-emitting unit including four LED chips provided by the twelfth embodiment of the present application.

[0200] [Figure 14-1] 1 is a schematic structural diagram 1 of a display module provided by the thirteenth embodiment of the present application;

[0201] [Figure 14-2] 2 is a schematic structural diagram 2 of a display module provided by the thirteenth embodiment of the present application;

[0202] [Figure 14-3] 3 is a schematic structural diagram of a display module provided by the thirteenth embodiment of the present application;

[0203] [Figure 14-4] 4 is a schematic structural diagram of a display module provided by the thirteenth embodiment of the present application;

[0204] [Figure 14-5] 5 is a schematic structural diagram of a display module provided by the thirteenth embodiment of the present application;

[0205] [Figure 14-6] 6 is a schematic structural diagram of a display module provided by the thirteenth embodiment of the present application.

[0206] [Figure 14-7] 7 is a schematic structural diagram 7 of a display module provided by the thirteenth embodiment of the present application.

[0207] [Figure 14-8] FIG. 22 is a schematic diagram of a blind hole structure of a substrate provided by the thirteenth embodiment of the present application.

[0208] [Figure 14-9] FIG. 22 is a schematic structural diagram of a display screen provided by the thirteenth embodiment of the present application;

[0209] [Figure 14-10] FIG. 22 is a structural schematic diagram of a display screen provided by the thirteenth embodiment of the present application.

[0210] [Figure 15-1] 1 is a schematic structural diagram 1 of a display module provided by a fourteenth embodiment of the present invention;

[0211] [Figure 15-2] 2 is a schematic structural diagram 2 of a display module provided by the fourteenth embodiment of the present invention;

[0212] [Figure 15-3] 3 is a schematic structural diagram of a display module provided by the fourteenth embodiment of the present invention;

[0213] [Figure 15-4] 4 is a schematic structural diagram of a display module provided by the fourteenth embodiment of the present invention;

[0214] [Figure 15-5] 5 is a schematic structural diagram 5 of a display module provided by the fourteenth embodiment of the present invention.

[0215] [Figure 15-6] 6 is a schematic structural diagram 6 of a display module provided by the fourteenth embodiment of the present invention.

[0216] [Figure 16-1] FIG. 20 is a top view of the structure of the sealing layer provided by the fifteenth embodiment of the present application.

[0217] [Figure 16-2] 1 is a schematic cross-sectional view of A5-A5 of the sealing layer provided by the fifteenth embodiment of the present application.

[0218] [Figure 16-3]FIG. 2 is a schematic cross-sectional view of A5-A5 of the sealing layer provided by the fifteenth embodiment of the present application.

[0219] [Figure 16-4] 3 is a schematic cross-sectional view of A5-A5 of the sealing layer provided by the fifteenth embodiment of the present application.

[0220] [Figure 16-5] 4 is a schematic cross-sectional view of A5-A5 of the sealing layer provided by the fifteenth embodiment of the present application.

[0221] [Figure 16-6] FIG. 22 is a top view of a structure of an encapsulation layer covered on a substrate provided according to the fifteenth embodiment of the present application.

[0222] [Figure 16-7] 1 is a schematic diagram of the A6-A6 cross section of an encapsulation layer coated on a substrate provided by the fifteenth embodiment of the present application; FIG.

[0223] [Figure 16-8] 2 is a schematic diagram of the A6-A6 cross section of the sealing layer coated on the substrate provided by the fifteenth embodiment of the present application; FIG.

[0224] [Figure 16-9] 3 is a schematic diagram of the A6-A6 cross section of the sealing layer coated on the substrate provided by the fifteenth embodiment of the present application; FIG.

[0225] [Figure 16-10] 15 is a schematic cross-sectional view of A6-A6 after the sealing layer provided by the fifteenth embodiment of the present application is covered on the substrate and pressed together. FIG.

[0226] [Figure 16-11] 4 is a schematic diagram of the A6-A6 cross section of the sealing layer coated on the substrate provided by the fifteenth embodiment of the present application.

[0227] [Figure 16-12]15 is a schematic cross-sectional view of A6-A6 after the sealing layer provided by the fifteenth embodiment of the present application is covered on the substrate and pressed together. FIG.

[0228] [Figure 16-13] 15 is a schematic structural diagram of a rectangular window on a black adhesive layer provided by the fifteenth embodiment of the present application;

[0229] [Figure 16-14] FIG. 15 is a schematic structural diagram of a sealing layer according to the fifteenth embodiment of the present invention, in which protrusions are provided on the long sides of the rectangular window.

[0230] [Figure 16-15] FIG. 15 is another schematic structural diagram of a sealing layer according to the fifteenth embodiment of the present invention, in which protrusions are provided on the long sides of the rectangular window.

[0231] [Figure 16-16] FIG. 20 is a top view of another structure in which an encapsulation layer covers a substrate, provided according to the fifteenth embodiment of the present application.

[0232] [Figure 16-17] FIG. 16-16 is a cross-sectional view taken along the line A7-A7 in FIG. 16-16 according to the fifteenth embodiment of the present invention.

[0233] [Figure 16-18] FIG. 20 is a structural top view of a completed display module provided in accordance with the fifteenth embodiment of the present application.

[0234] [Figure 16-19] FIG. 16-18 is a cross-sectional view 1 taken along A8-A8 in FIGS. 16-18 provided by the fifteenth embodiment of the present application.

[0235] [Figure 16-20] FIG. 2 is a cross-sectional view taken along A8-A8 in FIGS. 16-18 provided by the fifteenth embodiment of the present application. DETAILED DESCRIPTION OF THE INVENTION

[0236] In order to facilitate understanding of the present invention, the present invention will be described in more detail below with reference to the accompanying drawings. Although preferred embodiments of the present application are shown in the accompanying drawings, the present application can be implemented in a number of different forms, and the technical scope of the present application is not limited to the embodiments described in the specification of the present application. The following embodiments are provided to describe the present application in detail and for a comprehensive understanding of the present application.

[0237] Furthermore, unless otherwise specified, all technical and scientific terms used in the specification of this application have the same meaning as commonly understood by those skilled in the art to which this application belongs. Furthermore, the terms used in the specification of this application are intended only to describe specific embodiments and are not intended to limit the technical scope of this application to the scope described in the embodiments.

[0238] Terms such as "first," "second," and the like in the specification, claims, and drawings of this application are used to distinguish between similar components and are not necessarily used to describe a particular order or sequence. It should be understood that data used in this manner may be exchanged where necessary, and the same applies to the embodiments of this application described in the specification. Furthermore, the terms "comprise" and "have" and variations thereof mean that other components may be included in addition to the components in question. For example, a process, method, system, product, or device consisting of a series of steps or units need not be limited to the explicitly listed steps or units, and may include, in addition to these, other steps or other elements not explicitly listed or not inherent to the process, method, product, or device.

[0239] Furthermore, in this application, the terms "upper," "lower," "inner," "middle," "outer," "front," and "rear" indicate orientations and positional relationships based on the orientations and positional relationships shown in the drawings. These terms are primarily used to further explain the application and its embodiments, and are not intended to limit the illustrated devices, parts, or components to having a specific orientation or to being constructed and operating in a specific orientation. Furthermore, some of the above terms may be used in other senses besides indicating a direction or positional relationship. For example, the term "on" may indicate a dependency or connection relationship. However, it is believed that a person skilled in the art would be able to understand the specific meaning of these terms in this application depending on the particular situation. Furthermore, the terms "provide," "connect," and "fix" should be understood broadly. For example, "connected" includes not only a fixed connection but also a detachable connection, or even a connection having an integral structure. Furthermore, this includes not only a mechanical connection but also an electrical connection, and not only a direct connection but also an indirect connection via an intermediate medium, and may also include an internal connection between two devices, parts, or components. However, it is believed that a person skilled in the art would be able to understand the specific meaning of the above terms in this application depending on the particular situation.

[0240] It should be noted that unless there is a particular contradiction, the features of the embodiments of the present application can be combined with each other. Hereinafter, the contents of the present invention will be described in detail with reference to the drawings and embodiments.

[0241] The present application provides a display module (also referred to as an LED display module) and an LED optical device that can be used in various fields such as home displays, medical displays, decorative displays, traffic displays, and advertising displays. Specifically, the LED display module can be applied to various electronic devices such as displays, mobile terminals, computers, wearable devices, advertising equipment, and in-vehicle equipment. As shown in FIG. 1 , the display module of the present application includes a substrate 1, a plurality of light-emitting units 2, and an encapsulating layer 3.

[0242] Substrate 1 can be used as a display backplane of a display module, or can be a carrier substrate independent of the display backplane for mounting light-emitting units. Substrate 1 may be a single-layer substrate, a composite substrate of two or more layers, a flexible substrate, or a rigid substrate. However, embodiments of the present invention are not limited to these. In FIG. 1, the surface indicated by Z is the front surface of the substrate, the surface indicated by B is the back surface of the substrate, and the surfaces located between the front and back surfaces of the substrate are side surfaces of the substrate.

[0243] The light-emitting units 2 may be provided on the front surface of the substrate, and each light-emitting unit 2 may include only one LED chip or two or more LED chips, and the number of LED chips included in each light-emitting unit 2 may be the same for at least one of the light-emitting colors. Also, the number of LED chips included in some of the light-emitting units 2 may be set to be different for at least one of the light-emitting colors. The LED chip of the present application can be a micron-level LED chip (such as a Mini LED chip or a Micro LED chip). For example, it can be a micron-level flip-chip LED chip, and of course, all or part of it can be replaced with a micron-level regular LED chip or vertical LED chip. Of course, it is also possible to exchange the size with a regular-sized LED chip as needed.

[0244] The sealing layer 3 is provided on the substrate 1, covers each light-emitting unit 2, and allows light emitted by the LED chip of the light-emitting unit 2 to pass through. The thickness of the sealing layer 3 is thicker than that of the light-emitting unit 2. The encapsulation layer 3 may be provided only on the front surface of the substrate, completely covering the front surface of the substrate, or may only partially cover the front surface of the substrate. The sealing layer 3 can extend from the front surface of the substrate to at least one surface of the substrate, and can also extend to the back surface of the substrate. The sealing layer 3 can have a single-layer structure or a multi-layer structure of two or more layers.

[0245] The display module structure provided by the present application is flexible and can be applied to a wide range of scenarios. By meeting the requirements for hermeticity, the overall thickness can be reduced, and costs can be reduced. For ease of understanding, the specific structures and manufacturing methods of several modified examples will be described below in conjunction with the following embodiments.

[0246] First embodiment

[0247] In this embodiment, the LED chips included in each light-emitting unit can be mounted directly on the substrate using COB (chip-on-board) technology, but this is not limitative. The substrate can directly dissipate heat, which not only reduces manufacturing processes and costs but also has the advantage of reduced thermal resistance, allowing for high-definition images and videos to be displayed and allowing for flexible bonding. In COB packaging, the LED chip is welded to a substrate, an encapsulation layer is applied to the substrate, and finally, the craft edge (processing boundary) at the end of the substrate is cut along a cutting line to obtain a unit board display module of the required size. After the display module is cut and removed, the LED chip is very close to the craft edge cutting line, so water vapor can easily enter the display module through the interface between the encapsulation layer and the substrate, resulting in failure of the LED chip and peeling of the packaging layer from the substrate.

[0248] To address the above-mentioned problems, this embodiment provides a display module. Please refer to FIGS. 2-1 to 2-3. FIG. 2-2 is a top view of the display module (for ease of understanding, the figure is treated as a perspective view). FIG. 2-1 is a cross-sectional view along A1-A1 in FIG. 2-2, and FIG. 2-3 shows a bottom view of the module. The display module of this embodiment includes a substrate 10, a light-emitting unit 21, and an encapsulation layer including a first encapsulation layer 31. The substrate 10 includes a first mounting portion 103 located on the front side of the substrate, a first mounting portion 103 located on the back side of the substrate, and a second mounting portion 102 located on the rear side of the substrate, respectively, and a path extension portion 101 located around the first mounting portion 103. In this embodiment, a plurality of light emitting units 21 are arranged in an array on the first mounting portion 103 (of course, other arrangement methods such as a staggered arrangement or random arrangement between adjacent rows of light emitting units 21 can also be used). The path extension 101 includes at least one of a protrusion and a lower recess, the protrusion protruding from the front surface of the substrate and the lower recess recessed from the front surface of the substrate to the rear surface of the substrate. The first sealing layer 31 is provided on the front surface of the substrate and covers the path extension portion 101 and the light-emitting units 21. Referring to FIG. 2-1 , a first distance L1 between the outer surface of the path extension portion 101 and the center of the nearest light-emitting unit 21 (i.e., the outer edge of the first mounting portion 103) (specifically, the vertical distance from the outer upper surface of the path extension portion 101 to the center point of the light-emitting unit 21) is less than half the row spacing L2 between two adjacent rows of the light-emitting units 21 parallel to the outer surface of the first mounting portion (specifically, the distance between the central axes of the light-emitting units 21 in two adjacent rows, where the central axis of each row of the light-emitting units 21 is formed by a line connecting the center points of each row of the light-emitting units 21). Therefore, when a plurality of display modules are joined to form a display screen, the gap between the display modules can be reduced, and at the same time, the joining between adjacent display modules can be ensured. The distance between the centers of two adjacent rows of light emitting units 21 at the joining position is the same as the distance L2 between the centers of two adjacent rows of light emitting units 21 in other areas (regions) on the substrate 10. In fact, the distance L2 is even smaller than L2, thereby improving the integrity and display effect of the connected display modules.

[0249] Furthermore, the arrangement of the path extension portion 101 allows the interface between the first encapsulating layer 31 and the substrate 10 to have a non-single straight line structure, widening the path for water vapor to enter the interior of the display module from the interface between the first encapsulating layer 31 and the substrate 10, thereby preventing failure of the light emitting unit 21 due to the intrusion of water vapor and improving the reliability of the display module.In addition, peeling between the path extension portion 101 and the first encapsulating layer 31 is less likely to occur, resulting in a better sealing effect.

[0250] It is noted that the substrate 10 in this embodiment can be a PCB substrate, a glass substrate, a silicon substrate, etc. The shape and size of the substrate 10 can be flexibly set. For example, in multiple embodiments, the thickness of the substrate 10 between the first mounting portion 103 and the second mounting portion 102 may be, but is not limited to, 1.5 mm to 2.5 mm. By making the substrate 10 thick in this manner, the water vapor path can be extended in the thickness direction of the substrate, making it easier to process the path extension portion 101. The substrate 10 may have a regular shape, such as a rectangular substrate, a circular substrate, a diamond-shaped substrate, a triangular substrate, or the like, or may have an irregular shape.

[0251] It should be understood that the light-emitting unit 21 in this embodiment may include only one LED chip or multiple LED chips, for example, in some embodiments, the light-emitting unit may include, but is not limited to, a red LED chip, a green LED chip, and a blue LED chip.

[0252] In this embodiment, as shown in Figures 2 to 4, a second mounting portion 102 on the back surface of the substrate can be used to install an electronic driving circuit, which can be electrically connected to drive the driving elements. The light-emitting units 21 can be flexibly controlled based on a specific display mode or display requirements via the driving components 41, thereby realizing display control of the display module. Furthermore, the driving components 41 in this embodiment can include, but are not limited to, a driving chip. The driving chip can be a bare driving chip or a driving chip that is an encapsulated bare driving chip.

[0253] In this embodiment, the path extension portion 101 forms a ring-shaped structure surrounding the outer periphery of the first mounting portion 103. Of course, the path extension portion 101 in this embodiment is not limited to a ring-shaped structure, and the path extension portion 101 may be provided only on one or more side surfaces of the first mounting portion 103, and is not limited to a closed ring structure. Furthermore, the path extension portion 101 in this embodiment includes at least one of a protrusion portion 106 protruding from the upper surface of the substrate and a lower recess portion recessed from the upper surface of the substrate toward the back surface of the substrate.

[0254] In this embodiment, the first sealing layer 31 can be formed on the substrate 10 by, but is not limited to, molding, printing, hot pressing, etc. Alternatively, it can be formed on the substrate 10 by potting, and the specific arrangement process is not limited. It should be understood that in this embodiment, the material of the first encapsulation layer 31 can be flexibly set. For example, but not limited to, an adhesive layer may be used, and the adhesive layer may be a transparent adhesive layer or a mixed adhesive layer containing light conversion particles (such as phosphors) and / or diffusing particles, etc. The first sealing layer 31 in this embodiment may have a single-layer structure or a multi-layer structure as needed. In several embodiments, the upper surface of the first sealing layer 31 may be configured as a flat surface or a curved surface as needed.

[0255] In multiple applications of this embodiment, the light-emitting units 21 are uniformly distributed on the substrate 10, and the light-emitting units 21 are mounted at corresponding positions on the front surface of the substrate. In this case, the spacing between adjacent light-emitting units 21 on the first mounting portion 103 is the same. In another application example, in order to improve the heat dissipation performance of the display module, the spacing between light-emitting units 21 closer to the driving components 41 on the substrate 10 can be set to be larger than the spacing between light-emitting units 21 farther from the driving components 41. At the same time, in order to ensure uniformity of light emission, the spacing between adjacent light-emitting units 21 can be set to gradually decrease from the center to the edge of the substrate 10.

[0256] In this embodiment, the lower recess and / or protrusion 106 included in the path extension 101 can be flexibly arranged. For example, in some application examples, the path extension 101 may include only a lower recess recessed from the front surface of the substrate toward the back surface of the substrate, and the lower recess may be a groove or a recess remaining after cutting off part of the groove. In another application, the path extension 101 may be a protrusion 106 that protrudes from the front surface of the substrate. In an application of this embodiment, the path extension 101 may include a lower recess and a protrusion 106 at the same time.

[0257] For ease of understanding, the present embodiment will be described below by taking a plurality of shapes of the path extension portion 101 as examples.

[0258] An example is shown in Figures 2-4 and 2-5. Figure 2-4 is a cross-sectional view taken along A2-A2 in Figure 2-5. In this embodiment, the path extension 101 is a first lower recess recessed from the front surface of the substrate toward the back surface of the substrate, and the lower recess may be a complete groove. In this embodiment, the path extension 101 can be formed by first processing a groove on the outer edge of the substrate 10 , and then disposing the light-emitting unit 21 and the first encapsulation layer 31 on the substrate 10 . The shape of the groove in this embodiment can be flexibly set, and for example, the groove 105 can be a square groove as shown in Figures 2 to 6. Alternatively, it can be set as a V-shaped groove as shown in Figure 2-7. Furthermore, it can also be a U-shaped groove or a trapezoidal groove as shown in Figures 2-8 and 2-9. It should be noted that the shape of the groove 105 in this embodiment is not limited to the above example. It can be flexibly configured to have other regular shapes depending on the requirements of a particular embodiment. For example, as shown in FIG. 2-10, the groove 105 can be configured as a stepped groove. Of course, the groove 105 in this embodiment can also have an irregular shape, which will not be described again here.

[0259] In this embodiment, when the path extension portion 101 is a lower recess, the specific size of the lower recess can be specifically set according to the row spacing between two adjacent rows of the light-emitting units 21. If the row spacing between two adjacent rows of the light-emitting units 21 is sufficiently large, the lower recess can include, but is not limited to, at least one complete groove in the above example. When the row spacing between two adjacent rows of the light emitting units 21 is narrow, after bonding the adjacent display modules, the spacing between the two adjacent rows of the light emitting units 21 at the bonding position is the same as the spacing L2 between the two adjacent rows of the light emitting units 21 in other areas (regions) on the substrate 10. Even if it is even smaller than L2, a lower recess can be provided as the remaining recess after cutting a part of the complete groove. For example, as shown in FIGS. 2-1 to 2-3, the path extension portion 101 is a recessed portion that remains after cutting a portion of the groove. For example, the lower recess shown in Fig. 2-1 may be a lower recess formed by cutting the groove shown in Fig. 2-6 along the processing cutting line 104 shown in Fig. 2-16. As shown in Fig. 2-16, the specific setting position of the processing cutting line 104 in this embodiment (i.e., the cutting position) can be flexibly set based on requirements. Another embodiment will be described with reference to Fig. 2-17. The position of the processing cutting line 104 shown in Fig. 2-17 is closer to the outer periphery than that shown in Fig. 2-16, and the display module after cutting is shown in Fig. 2-18. In this embodiment, after the first sealing layer 31 is placed on the substrate 10, the first sealing layer 31 may be cut together with the substrate 10, or the substrate 10 may be cut first, and then the first sealing layer 31 may be placed on the substrate 10.

[0260] 2-11 and 2-12, the path extension 101 is a protrusion 106 that protrudes from the front surface of the substrate. The protrusion 106 may be a complete protrusion, or may be a portion that remains after the complete protrusion is removed. For example, the protrusion 106 shown in Fig. 2-11 is a perfect rectangular protrusion. The protrusion 106 shown in Fig. 2-12 is a perfect triangular protrusion. Referring to another example shown in Fig. 2-20, the protrusion 106 is the remaining protrusion 106 after cutting off a part of the rectangular protrusion 106 shown in Fig. 2-11. An example of a cut is shown in Figure 2-19. The shape of the protrusion 106 in this embodiment can be flexibly set and is not limited to the shapes in the above examples, but may be a regular shape such as an arc-shaped protrusion or a trapezoidal protrusion, or other irregular shapes.

[0261] In this embodiment, the path extension portion 101 is not limited to the lower recessed portion and the protruding portion 106 shown in the above example, but may simultaneously include a lower recessed portion and a protruding portion 106. Furthermore, in several examples of this embodiment, the number of lower recessed portions included in the path extension portion 101 can be flexibly set as needed. For example, in several embodiments, the path extension portion 101 may be a lower recess provided on the substrate 10. This ensures that the distance L1 between the outer upper surface of the path extension portion 101 and the light-emitting unit 21 at the outer edge of the first mounting portion 103 is smaller than half the minimum distance between adjacent light-emitting units 21 on the first mounting portion 103. In another example, the path extension portion 101 may be a protrusion portion 106 provided on the substrate 10, or may be provided on the substrate 10 so that the protrusion portion 106 and a lower recess are adjacent to each other, and the sizes of the protrusion portion 106 and the lower recess can be flexibly arranged, provided that the distance L1 between the outside of the path extension portion 101 and the light-emitting unit 21 on the outer edge of the first mounting portion 103 can be ensured to be less than 1 / 2 of the minimum distance between adjacent light-emitting units 21 in the first mounting portion 103.

[0262] The path extension 101 shown in each of the above examples makes the contact interface between the first encapsulating layer 31 and the edge of the substrate 10 have a non-single straight line structure, so that the path for water vapor to penetrate from the edge of the contact interface between the first encapsulating layer 31 and the substrate 10 into the inside of the module is longer, making it difficult for water vapor to penetrate into the path extension 101 inside the display module, making the first encapsulating layer 31 less likely to peel off, and improving the sealing effect. Furthermore, the distance between the edge line of the display module and the display area can be made sufficiently small, and when multiple display modules are connected to display, the connection gap between the display modules can be reduced, and the distance of the first mounting part between each display module after bonding can be reduced, thereby improving the display effect. Furthermore, L1 is smaller than half of L2, so that the area of ​​the non-display part of the display module located around the first mounting part 103 can be sufficiently reduced, and the connection gap between the display modules can be reduced.

[0263] In another embodiment of the present embodiment, when the path extension portion 101 includes a lower recess, the depth of the lower recess may be set to be equal to or greater than half of the distance L2 between adjacent light-emitting units on the first mounting portion 103. A lower recess of this size not only enables the path to be extended, but also ensures the strength of the substrate 10 in the path extension portion 101. For example, the ratio of the depth of the lower recess to the width of the lower recess may be, but is not limited to, 2 to 20, which can further improve the extended path. Of course, the dimensions of the lower recess are not limited to the above example, and can be flexibly replaced with other dimensions according to specific application purposes, which will not be described again here.

[0264] In a further application example of this embodiment, when the path extension portion 101 includes a protrusion portion 106, the height of the protrusion portion 106 from the front surface of the substrate can be set to be lower than the height of the light-emitting unit 21 and / or thinner than the maximum thickness of the first encapsulating layer 31, which further helps the display module to exhibit a good display effect. And optionally, in some applications, a light reflective layer or a refractive layer can be provided on the upper surface of the protrusion 106 to prevent the protrusion 106 from affecting light and further improve the display effect.

[0265] In this embodiment, in order to further improve the extension of the path and improve the strength of the bond between the first sealing layer 31 and the substrate 10, the upper surface of the path extension portion 101 may be provided with an uneven surface, or the upper surface of the path extension portion 101 may be provided with a rough surface. By providing an uneven or rough upper surface, the path can be further emphasized or extended, and at the same time, the bonding strength between the first sealing layer 31 and the path extension portion 101 can be increased, further preventing the intrusion of water vapor from the outside. For ease of understanding, several examples of the uneven state of the upper surface of the path extension portion 101 will be described below.

[0266] 2-13, the path extension 101 shown in the figure is a groove 105. Of course, a part of the remaining recess can be cut out as a groove, and the bottom surface of the groove 105 can be made uneven. Also, if necessary, at least one side surface of the groove 105 can be made uneven. For example, referring to Fig. 2-14, the main difference between Fig. 2-14 and Fig. 2-13 is that the groove 105 is a V-shaped groove, and the side surface of the groove 105 is formed unevenly.

[0267] 2-15, the path extension 101 shown in the figure is a protrusion 106, and the top surface and at least one side surface of the protrusion 106 are uneven. Note that the path extension 101 shown in other figures of this embodiment can also be provided with an uneven or rough surface as shown in the above-mentioned Figures 2-13 to 2-15.

[0268] In this embodiment, the path extension portion 101 may be a complete annular structure surrounding the outer periphery of the first mounting portion 103, and the annular structure corresponds to the shape formed on the outer edge of the first mounting portion 103, and can be a rectangular, polygonal, circular, or elliptical structure, but is not limited to these. In an application example of this embodiment, the above-mentioned annular structure may be an incomplete annular structure composed of multiple segments. Also, the path extension portion 101 may be an annular structure surrounding the first mounting portion 103, or may be an annular structure composed of multiple winding structures surrounding the first mounting portion 103. In the case where there are multiple winding structures, the processing cutting line 104 is located on the path extension portion 101 of the outermost circle.

[0269] This embodiment provides a display screen, which is a bonded display screen bonded by at least two display modules shown in the above examples, as shown in FIG. 2-21. The number of display modules used in this embodiment can be selected according to the intended use. For example, two, three, four, or five or more display modules can be connected to form a display screen. The display modules of the display screen are less susceptible to water vapor penetration, reducing the likelihood of failure of the display light-emitting units, thereby extending the service life of the display screen. Furthermore, in a display screen connected by multiple display modules, the connection gap between the display modules can be reduced, improving the display effect of the display screen.

[0270] Second embodiment

[0271] In the case of a display module, the LED chips near the edge are close to the edge of the substrate, and the encapsulation layer only covers the front surface (front face) of the substrate. This means that water vapor can easily penetrate into the display module through the interface between the encapsulation layer and the substrate, causing failure of the LED chips and easily causing delamination between the encapsulation layer and the substrate, reducing the reliability of the display module. This embodiment also provides other display module structure examples that can solve the problem, and it should be understood that the display module provided in this embodiment can be implemented independently from other embodiments.

[0272] An example of a display module provided by this embodiment is shown in Figures 3-1 to 3-3, where Figure 3-1 is a top view of the display module (partially seen through for ease of understanding), and Figure 3-2 is a bottom view of the display module. 3-3 is a cross-sectional view taken along the line A3-A3 in FIG. 3-1. As shown in the figure, the display module of this embodiment includes a substrate 12 and a plurality of light-emitting units 22. The light-emitting units 22 are disposed in a display area 121 on the front surface of the substrate. In this embodiment, the display area 121 on the front of the board is an area to which the light-emitting unit 22 is electrically connected and which drives and controls the light-emitting unit 22 to light up the display, and this area is also used to mount the light-emitting unit 22. Regarding the number, color, size, type, etc. of the LED chips included in the light-emitting unit 22 in this embodiment, and the material, shape, and size of the substrate 12, it is sufficient to refer to the above-mentioned embodiment, but this is not limited to these, and further explanation will be omitted here. A circuit function area 122 is provided on the rear surface of the substrate, and driving electronic components 42 for driving and controlling the light emitting units 22 are mounted on the circuit function area 122 . In the display region 121 on the front surface of the substrate, a sealing layer including a first sealing layer 321 and a second sealing layer 322 that covers all the light emitting units 22 is provided. The second encapsulation layer 322 covers the first encapsulation layer 321 and extends toward the back surface of the substrate and covers at least a portion of the side surface 123 of the substrate 12 , thereby covering the bond between the first encapsulation layer 321 and the substrate 12 . In this way, as shown in FIG. 3-3, it is possible to prevent water vapor from directly penetrating into the interior of the display module through the joint between the first sealing layer 321 and the substrate 12. Furthermore, if water vapor is present in the usage environment, the water vapor must pass through the bonding region between the second encapsulation layer 322 and the side surface 123 of the substrate 12 before spreading to the bonding portion between the first encapsulation layer 321 and the substrate 12. This lengthens the path for water vapor to penetrate into the interior of the display module, better protecting the light-emitting units 22 and further improving the reliability of the display module. In this embodiment, the specific size of the area covered by the second encapsulation layer 322 on the side surface 123 of the substrate 12 can be flexibly set depending on the intended use. For example, the second encapsulation layer 322 can cover only a portion of the side surface 123 of the substrate 12, or can cover the entire side surface of the substrate 12. This can further lengthen the path that water vapor takes to penetrate into the interior of the display module, thereby improving the reliability of the display module.

[0273] In this embodiment, the first sealing layer 321 and the second sealing layer 322 can be formed by, but are not limited to, molding, printing, potting, etc. The first sealing layer 321 and the second sealing layer 322 are both light-transmitting layers, and the materials thereof may be the same (for example, both may be transparent adhesive layers) or different. Both the first encapsulation layer 321 and the second encapsulation layer 322 can have a single layer structure, or at least one of them can have a composite layer structure formed from at least two sub-layers.

[0274] In some embodiments of this embodiment, at least one of light conversion particles and diffusing particles may be added as needed to at least one of the first encapsulation layer 321 and the second encapsulation layer 322. For example, in one application, light conversion particles may be added to the first encapsulation layer 321 to achieve light color conversion, and diffusing particles may be added to the second encapsulation layer 322 to further improve luminous efficiency.

[0275] In some embodiments of this embodiment, the light emitting units 22 may first be placed in the display area 121 on the front surface of the substrate. Next, a first encapsulating layer 321 is formed on the front surface of the substrate, and the formed first encapsulating layer 321 can cover the entire front surface of the substrate. For example, referring to FIG. 3-3, the first encapsulating layer 321 covers the entire front surface of the substrate. Then, during manufacturing, as shown in FIG. 3-4, the first encapsulating layer 321 can be formed on the front surface of the substrate after the light-emitting units 22 are installed in the display area 121 on the front surface of the substrate. Next, the substrate 12 and the first sealing layer 321 are cut along the cutting plane 124 to obtain the substrate 12 and the first sealing layer 321 on the substrate 12 shown in FIG. 3-3.

[0276] In other embodiments of this embodiment, the first encapsulating layer 321 may partially cover the front surface of the substrate, for example, as shown in Figure 3-5, the first encapsulating layer 321 only covers the display area 121 on the front surface of the substrate and the light-emitting units 22 within the display area 121, and the second encapsulating layer 322 covers the area of ​​the front surface of the substrate exposed to the first encapsulating layer 321. In the manufacturing process, as shown in Figures 3 to 6, after the light-emitting units 22 are installed in the display area 121 on the front surface of the substrate, a first encapsulating layer 321 can be formed on the front surface of the substrate. The first encapsulating layer 321 partially covers the front surface 103 of the substrate 12, and then the substrate 12 and the first encapsulating layer 321 are cut along the processing cutting plane 124 to obtain the substrate 12 and the first encapsulating layer 321 on the substrate 12 in Figures 3 to 5.

[0277] Of course, in this embodiment, the area where the first sealing layer 321 covers the substrate 12 can be flexibly set according to the requirements of use and is not limited to the above example, but will not be described again here. In the above example of this embodiment, after first cutting the first encapsulating layer 321 and the substrate 12, the second encapsulating layer 322 is formed, and the formed second encapsulating layer 322 extends toward the side surface 123 of the substrate 12. Then, by completely or partially covering the side surface 123 of the substrate 12, the light emitting units 22 are protected by the first encapsulating adhesive layer, and dust and the like can be prevented from affecting the light emitting units 22 during cutting, which further improves the reliability of the manufactured display module. The second encapsulation layer 322 protects the first encapsulation layer 321 and the light-emitting units 22. Water vapor can only enter the display area 121 of the display module by passing through the interface between the second encapsulation layer 322 and the side surface 123 of the substrate 12 and the interface between the first encapsulation layer 321 and the front surface of the substrate. This lengthens the path for water vapor to penetrate into the display module, further protecting the light-emitting units 22, making the light-emitting units 22 less susceptible to breakdown, and improving the reliability of the display module.

[0278] As shown in FIG. 3-4 or FIG. 3-6, the first sealing layer 321 may cover the cut surface 124 of the substrate 12, may extend beyond the cut surface 124 of the substrate 12, or may not extend beyond the cut surface 124 of the substrate 12. After cutting, the side surface of the first encapsulation layer 321 may or may not be flush with the side surface 123 of the substrate 12. As shown in FIG. 3-6, the side surface of the first encapsulation layer 321 may be located within the cut surface 124 of the substrate 12. The length of the first encapsulation layer is shorter than the length of the substrate 12, and it extends to part of the front edge portions on both sides of the substrate. Then, the second encapsulation layer 322 is formed again to cover the extended portions of the front edge portions of the substrate, and at the same time, it is sufficient to completely or partially cover the side surface 123 of the substrate 12.

[0279] For example, in order to further increase the path through which water vapor can invade the interior of the display module, a lower recess 125 can be provided on the outer periphery of the display area 121 of the substrate 12. By providing the lower recess 125, the path through which water vapor can invade the interior of the display module can be further increased compared to a planar structure. The lower recess 125 in this embodiment may be a complete recessed groove, or may be a recess obtained by cutting out a part of a groove. Specifically, it can be flexibly set according to required conditions.

[0280] 3 to 7, a lower recess 125 is provided on the front surface of the substrate around the periphery of the display area 121. The lower recess 125 is a recess formed by cutting out a part of the recessed groove. For example, as shown in FIGS. 3 to 8, a recessed groove can be provided around the periphery of the display area 121 of the substrate 12, and cutting can be performed along the cutting plane 124 for processing. After cutting, the remaining part of the groove forms a lower recess 125 at the edge of the substrate 12, and a step structure is formed on the side surface 123 of the substrate 12. In this case, the contact area between the first sealing layer 321 or the second sealing layer 322 and the substrate 12 is increased, and the path through which water vapor can penetrate from the interface between the sealing adhesive layer and the substrate 12 can be extended, thereby improving the packaging effect of the display module. 3-7, the water vapor intrusion path is as follows: from the interface between the second sealing layer 322 and the side surface 123 of the substrate 12, to the interface between the second sealing layer 322 and the groove bottom and groove wall of the lower recess 125, and further to the interface between the first sealing layer 321 and the front surface of the substrate, which realizes an extension of the water vapor intrusion path.

[0281] In this embodiment, the depth of the lower recess 125 is not limited to, for example, 0.1 to 0.9 times the thickness of the substrate 12, but can be set flexibly. It can be understood that the depth of the lower recess 125 is the distance between the bottom of the second lower recess 125 and the front surface of the substrate. The deeper the lower recess 125, the longer the path through which water vapor penetrates from the interface between the second sealing layer 322 and the substrate 12.

[0282] In this embodiment, the first sealing layer 321 may cover the lower recess 125 on the substrate 12, or may not cover the lower recess 125 on the substrate 12. For example, as shown in Figures 3 to 7, the first encapsulating layer 321 does not cover the lower recess 125 on the substrate 12. When manufacturing the display module shown in Figure 3-7, as shown in Figure 3-8, the first encapsulating layer 321 can be first formed on the front side of the substrate 12, but the first encapsulating layer 321 does not cover the recess. Next, cutting is performed along the processing cutting plane 124. After cutting, the substrate 12 and the first sealing layer 321 shown in FIG. 3-7 are obtained. Next, the second sealing layer 322 is formed on the substrate 12, and the second sealing layer 322 completely covers the lower recess 125.

[0283] In another embodiment, the first encapsulation layer 321 covers the lower recess 125 on the substrate 12, as shown in FIG. 3-9. When manufacturing the display module shown in FIG. 3-9, first, a first encapsulation layer 321 is formed on the front surface of the substrate, and the first encapsulation layer 321 covers the groove, as shown in FIG. 3-10. Next, cutting is performed along the processing cut surface 124. After cutting, the substrate 12 and the first sealing layer 321 shown in FIG. 3-9 are obtained. Then, the second sealing layer 322 is formed on the substrate 12, and the second sealing layer 322 does not cover the lower recess 125. The intrusion path of water vapor in Figure 3-9 is as follows: From the interface between the second sealing layer 322 and the side surface 123 of the substrate 12, the interface between the first sealing layer 321 and the groove bottom and groove wall of the lower recess 125, and the interface between the first sealing layer 321 and the front surface of the substrate can also be extended to lengthen the intrusion path of water vapor.

[0284] Of course, this embodiment is not limited to extending the intrusion path of water vapor by providing the lower recess 125. Also, the lower recess 125 can be replaced with a convex portion or a combination of a lower recess and a convex portion (i.e., replaced with a concave-convex structure). Furthermore, to further increase the path for water vapor penetration, the upper surfaces of the lower recesses 125 and protrusions may be roughened. For example, they may be configured as stepped or sawtooth surfaces, which not only further increases the path for water vapor penetration but also improves the bond strength between the sealing adhesive layer and the substrate 12. In this embodiment, if the lower recess 125 is replaced with a protrusion, or a combination of a lower recess and a protrusion, the protrusion can be set to a height that is not higher than the light-emitting surface of the light-emitting unit 22, thereby preventing the light emitted from the light-emitting surface of the light-emitting unit 22 from being blocked or interfered with by the protrusion, thereby ensuring the light-emitting effect. Of course, in other embodiments of this embodiment, the convex portion may be higher than the light-emitting surface of the light-emitting unit 22, thereby blocking at least a portion of the light emitted from the light-emitting surface of the light-emitting unit 22, and to some extent, avoiding optical crosstalk between adjacent display modules when multiple display modules are connected to form a display screen.

[0285] In this embodiment, the refractive index of the first encapsulation layer 321 is equal to or greater than the refractive index of the second encapsulation layer 322. This can improve the luminous efficiency of the light-emitting unit 22 and improve the display effect of the display module. For example, in some applications, the refractive index of the first encapsulation layer 321 can be selected to be 1.50 to 1.58, and the refractive index of the second encapsulation layer 322 can be selected to be 1.50 to 1.52.

[0286] When displayed by joining at least two display modules, the distance C1 between the cut surface 124 of the predetermined processing and the endmost light-emitting unit 22 on the substrate 12 in the examples of Figures 3-4, 3-6, 3-7, and 3-10 may be less than half the row spacing C2 between adjacent rows of the light-emitting units 22. In this case, the connection gap can be kept sufficiently small, and the distance between the edge of the display module and the display area can be kept sufficiently small. When multiple display modules are connected to display, the connection gap between the display modules is reduced, improving the integrity of the display and the display effect. In addition, when displaying using separate display modules, the distance between the cutting surface 124 of the processing and the edge of the light-emitting unit 22 on the substrate 12 can be kept to achieve a good display effect, and is not particularly limited in this embodiment.

[0287] Furthermore, to achieve a better sealing effect, the second encapsulation layer 322 can also extend along the side surface 123 of the substrate 12 to the rear surface of the substrate. The second encapsulation layer 322 covers the side surface 123 and the rear surface of the substrate 12. Therefore, there is no inlet for water vapor at the side surface 123 of the substrate 12, and the sealing effect of the display module is better.

[0288] This embodiment further provides a display screen including the display module shown in the above embodiment. Also, a display screen can be generated using only one of the above display modules. In other embodiments, a bonded display screen can be obtained by bonding at least two display modules together, and an example of the bonding effect is shown in Figure 2-21. The display module of the display screen is resistant to moisture intrusion and failure, ensuring a good display effect and extending the service life of the display screen. Furthermore, when multiple display modules are connected to display simultaneously, the connection gap is reduced, improving the display effect.

[0289] Third embodiment

[0290] A common application of display modules is to connect multiple display modules together to form a large display screen. In addition, display modules have a certain degree of thickness and rigidity, making it easy to connect them seamlessly or with few gaps when connecting them on a two-dimensional plane. However, in some special application scenarios, multiple display modules need to be connected to form a curved structure. Currently, there must be obvious seams between the display modules. Especially when the curvature of the connecting surface is large, the seams generated during the connection tend to be large, which significantly affects the continuity of the image and the sensory effect.

[0291] To address the above problems, the present embodiment provides a novel display module and a substrate for the display module. The display module and the substrate in this embodiment can be mounted independently from other embodiments. For ease of understanding, an example of a substrate and a display module manufactured using the substrate is shown below.

[0292] The substrate provided in this embodiment can be used to support and arrange the light-emitting units, for example, the light-emitting units can be arranged on the front surface of the substrate. The front surface of the substrate is also used to support an encapsulation layer, and in this embodiment, the encapsulation layer includes a first encapsulation layer arranged on the front surface of the substrate to cover the light-emitting units. At least one side of the substrate is a bonding side that is bonded to a substrate of another display module, and the area of ​​the bonding side near the back surface of the substrate is reduced to form an avoidance area, and the area of ​​the bonding side near the front surface of the substrate is used as the bonding area. When two substrates are joined together via the joining area such that the back surfaces of the two substrates form a predetermined angle greater than 0° and less than 180°, the avoidance areas on the joining side surfaces of the two substrates do not interfere with each other. The avoidance areas may not interfere with each other, or may be in contact with each other but not interfere with each other, with a certain gap formed between the avoidance areas. It should be noted that when two substrates are bonded via their bonding sides, the bonding areas of the two substrates are bonded close to each other. The back surfaces of the two substrates can be bonded at an angle of less than 180°, and the visual effect when viewed from the top of the substrates is that the bonding areas appear to protrude slightly outward. In addition, the existence of an avoidance area and the formation of the avoidance area by shrinking (recessing inward, the same applies below) the area close to the back surface of the substrates can bring the back surfaces of the two substrates closer together. As a result, the bonding areas of the two substrates are closer together, and the bonding seam formed between the bonding areas of the two substrates can be made smaller. As an example, as shown in FIG. 4-1, this embodiment provides a schematic cross-sectional view of a display module manufactured using a substrate. Here, the light-emitting unit 23 is provided on the front surface of the substrate, and the first sealing layer 34 not only covers the light-emitting unit 23 on the front surface of the substrate 13, but also covers the entire front area of ​​the substrate 13. The driving electronic components 43 are arranged on the back surface of the substrate, and both the left and right surfaces of the substrate 13 serve as bonding sides. When the substrate 13 is bonded to a substrate of another display module, a bonding area 131 near the front of the substrate is bonded to a corresponding bonding area of ​​the substrate of the other display module, and an area near the back of the substrate shrinks to form an avoidance area 132 to avoid contact with the substrate of the other display module. It should be noted that when the two substrates are joined together, a joining seam is formed between the avoidance area 132 and the nearest visible area of ​​the two backplanes when viewed from the front of the substrates. The bonding side of the substrate 13 can be formed by methods including, but not limited to, cutting, trimming, machining, etc. As shown in FIG. 4-1, the dotted line portion is the cut-out portion.

[0293] FIG. 4-2 is an enlarged schematic diagram of the bonded portion of the two substrates shown in FIG. 4-1. In the figure, β is the included angle (angle) between the back surfaces of the two substrates. This angle is the angle formed when the two substrates are bonded, and a person skilled in the art can set the angle according to the actual situation and requirements. For example, in this embodiment, the included angle β can be set to 160°, 85°, 60°, etc., and can be any angle greater than 0° and less than 180°. The specific angle of the included angle is not limited in the present application.

[0294] In this embodiment, in the covered area of ​​the first sealing layer 34, as shown in Figures 4-3 and 4-4, the thickness of the first sealing layer 34 can be controlled between 150 microns and 300 microns, for example, 150 microns. The first sealing layer 34 shown in Fig. 4-3 covers all of the light-emitting units 23 to form the whole. The first sealing layer 34 shown in Fig. 4-4 covers each light-emitting unit 23 individually, but it is of course possible to combine the two setting methods, and the present embodiment is not limited to this. In this embodiment, the number of bonding sides of the substrate 13 can be set to 1, 2, 3, or 4 according to requirements. For example, the substrate 13 shown in Figures 4-5 has only one bonding side. The substrate 13 provided in this embodiment is particularly suitable for bonding thicker substrates, and the effect is more obvious. Bonding multiple display modules on a curved surface greatly improves the continuity of the bonded display screen and the user experience.

[0295] It should be noted that in this embodiment, the circuits on the front and back of the substrate adopt the following design: The circuit layout area S1 on the front of the substrate is equal to or greater than the area S2 of the circuit function area 134 on the back, so S1:S2=1.1 to 1.5, and in one example, S1:S2=1.5, as shown in Figures 4-6. The materials for the substrate in this embodiment can be those shown in the above embodiments, and are not limited to these, so a repeated description will be omitted here.

[0296] In some embodiments, the inner reduction of the avoidance area 132 of the substrate 13 is an inclined surface. The inclined surface may be flat, curved (arcuate), or a combination of flat and curved surfaces. If flat, the inclined surface may have a structure as shown in Figure 4-1. In some applications, the inclined surface may be flat or may be as shown in Figures 4-7 and 4-8. As shown in Figure 4-7, the slope is chamfered and cut based on the intersection line between the back surface and the side surface of the substrate, and is also cut as close as possible to the intersection point between the front surface of the substrate and the side surface. As shown in FIG. 4-8, the inclined surface (slope) is chamfered and cut based on the intersection line between the back surface and the side surface of the substrate, and the intersection line between the front surface of the substrate and the side surface is completely cut. When the inclined surface is curved, as shown in Figure 4-9, the inclined surface is one of arc-shaped structures, and the avoidance area near the back surface of the board is cut out in an arc. When the inclined surface is a combination of a flat surface and a curved surface, as shown in Figure 4-10, the inclined surface has a structure that combines a flat surface and a curved surface, and the avoidance area near the back surface of the board is cut into a shape that combines an inclined surface and a curved surface. In addition, when the inclined surface is arc-shaped or when the inclined surface is a combination of an arc and an arc, the other two cutting methods similar to when the inclined surface is flat are also included, but detailed description thereof will be omitted in this embodiment. Also, when there are multiple bonding sides on the substrate 13, at least one of the shape and size of the avoidance area 132 of each bonding side may be the same or different to accommodate different bonding requirements.

[0297] In some embodiments, the avoidance area 132 of the substrate 13 may also be reduced to a stepped surface. As shown in FIG. 4-11, the avoidance area 132 near the back surface of the substrate is cut out into a rectangle, and the size of the rectangle area can be set by those skilled in the art based on the actual conditions and requirements. The avoidance area 132 is a step surface and may include at least two step surfaces. As shown in FIG. 4-12, the avoidance area near the rear surface of the substrate may be divided into step surface T1 and step surface T2. The cutting is done in a stepped shape including T2, and those skilled in the art can set the number of step faces based on the actual conditions and requirements.

[0298] In the examples shown in FIGS. 4-7 to 4-12, each avoidance area 132 can be formed by removing the area of ​​the substrate 13 enclosed by the dotted line.

[0299] In some embodiments, when the avoidance area 132 is an inclined surface, the inclination angle of the inclined surface can be set to 5° or more and 60° or less, and the specific inclination angle can be set according to the situation. For example, as shown in FIG. 4-1, the inclination angle of the inclined surface is set to 60°, but of course it can also be set to 5°, 10°, 30°, 45°, 50°, etc. as needed.

[0300] In some embodiments, the top and back surfaces of the substrate can be rectangular, with one, two, three, or four of the four sides of the substrate being bonding sides.

[0301] In this embodiment, the encapsulation layer of the display module may further include a second encapsulation layer covering the first encapsulation layer 34 . See, for example, the embodiment of Figure 4-13, which is based on the display module shown in Figure 4-1 and adds a second encapsulation layer 35. For another embodiment, see Figure 4-14. The display module is based on the display module shown in Figure 4-11, and adds a second encapsulation layer 35. In each of the above embodiments, the second sealing layer 35 completely covers the bonding side between the first sealing layer 34 and the substrate 13. This improves the sealing performance and reliability of the entire display module, and the outer side of the second sealing layer 35 becomes a new bonding side. Similarly, the portion of the second sealing layer 35 that covers the bonding area 131 is used as a new bonding area, and the portion that covers the avoidance area 132 is used as a new avoidance area. In this embodiment, the second sealing layer 35 may be provided so as not to cover the side surface of the substrate 13, or may cover part of the side surface of the substrate 13 (for example, it may cover only the bonding area 131).

[0302] When the display module shown in FIGS. 4-13 and 4-14 is produced, the area covered by the second sealing layer 35 includes the area indicated by T3 in FIGS. 4-15 and 4-16. Next, the areas are cut to produce the display modules shown in Figures 4-13 and 4-14, respectively, which lengthens the path for water vapor to penetrate into the display module, improves the airtightness of the display module, and prevents the first sealing layer 34 from easily peeling off from the substrate, thereby improving the reliability of the display module.

[0303] This embodiment also provides a display device, which includes at least two display modules shown in the above embodiments joined together. A schematic diagram of the joining effect is shown in Figure 4-17. During coupling, each display module 12 can be connected via an adapter, which in this embodiment includes a plug connector 51 and an adapter plate 452. It should be noted that the connection between the plug connector 51 and the adapter plate 452 may be a detachable connection as long as they are connectable, or may be a non-removable fixed connection using fasteners, adhesive, welding, etc. Then, the adapter plate 452 can be installed and fixed at a required location by a fixing method including, but not limited to, copper posts 453, screws, or welding.

[0304] Another example of a display device is shown in Fig. 4-18. Based on Fig. 4-17, when the angle between the avoidance areas of the joint sides of adjacent display modules is greater than 0°, there is an accommodation space between the two joint areas. At this time, the connection between the two boards also includes a connector 54, the fitting portion of which is angled to fill the space between the avoidance areas, and the connector 54 contacting the joint area can also play a role in strengthening the display device. At the same time, when installing the display module, it is easy to quickly position the two boards, improving installation efficiency, and the portion of the connector 54 cooperating with the joint area can also play a supporting role in the joint area. The display module is also supported on the connecting side, resulting in a compact structure and excellent strength.

[0305] Fourth embodiment

[0306] This embodiment provides a method for manufacturing a display module, which can be used to manufacture the display module shown in the above embodiment, but is not limited to this. It can also be used to separately manufacture display modules different from those shown in the above embodiment, and the display module obtained by this method can be used alone or multiple modules can be connected to form a larger display screen.

[0307] An example of a method for manufacturing a display module in this embodiment includes the following steps.

[0308] Step a1: Provide a substrate. The provided substrate 14 includes a front surface Z (shown in FIG. 5-1), a back surface B (shown in FIG. 5-2) opposite the front surface Z, and a surface 142 for mounting light-emitting units positioned around the periphery of the substrate 14 and defined by the front surface Z (the area surrounded by dotted lines and covered with diagonal lines in FIG. 5-1). In this embodiment, the substrate 14 is a rectangular substrate, and both the front surface Z and the back surface B of the substrate are flat. In FIG. 5-1, the process edge 141 surrounds four sides of the display area 142. In other embodiments, depending on the actual situation and processing requirements, the process edge 141 may surround one or two opposite or adjacent sides of the display area 142, but is not limited thereto. In other embodiments, the substrate 14 may have other polygonal shapes, such as, but not limited to, a triangle or a regular hexagon. The front surface Z of the substrate can also be presented as a regular or specially designed uneven surface to create special visual effects, such as a wave effect, a relief effect, etc., and there is no limitation to the effect that can be displayed.

[0309] Step b1: As shown in Figures 5-3 and 5-4, a recessed groove 144 (the recessed groove 144 is located on the side of the process edge 141, as shown in the area covered by the hatched box surrounding the dotted box area in Figure 5-3) is created around the process edge 141 adjacent to the display area 142 (i.e., located at the junction of the display area 142 and the process edge 141). Here, the groove 144 does not penetrate the substrate 14 (as shown in FIG. 5-4), and the depth of the groove 144 is greater than the thickness of the non-penetrating portion of the substrate. The groove is rectangular, and the front surface of the substrate is vertical, making it easy to process. In other embodiments, as shown in FIGS. 5 to 9, the groove 144 may be V-shaped. Furthermore, within the scope of conventional processing techniques, this embodiment does not limit the shape of the groove 144; for example, an inverted trapezoid or a U-shape may also be acceptable. The groove 144 can be formed by partially etching the portions not covered by the mask using machining or etching.

[0310] Step c1: As shown in Figures 5-5 and 5-6, the light emitting unit array 20 is mounted on the display area 142. In this embodiment, a plurality of light emitting units 24 are arranged in a rectangular shape at equal intervals. The dotted area in FIG. 5-5 shows a schematic arrangement of 5 rows and 9 columns of light-emitting units, although other types of arrays may be used in other embodiments. In order to ensure that the display module emits uniform light, the row spacing or column spacing of the light-emitting units 24 in the light-emitting unit array 20 is designed, and the row spacing or column spacing of the light-emitting units 24 refers to the linear distance between the center lines of the rows or columns where the light-emitting units 24 in adjacent rows / columns are located. Generally, the row spacing or column spacing is fixed to a uniform value, but it does not necessarily have to be fixed to a uniform value. Considering the heat dissipation issue, the row spacing value of the light emitting units 24 close to the driving electronics 44 in the substrate 14 is larger than the row spacing value of the light emitting units far from the LED driving electronics 44 . However, in consideration of uniform light emission, the row spacing value of the light emitting units in adjacent rows or columns will gradually change, and in order to ensure the visual effect of the display module, there will be no obvious visual contradiction, but the equidistant distribution in this embodiment means that the distances appear to be equal visually, and is not limited to the equidistant distribution in the concept of precision measurement. However, the equidistant distribution in this embodiment should be understood based on the requirements of the display effect. For example, in a display that requires equidistant spacing only in the horizontal or vertical direction, the light-emitting units 24 of this embodiment only need to be equally spaced in the horizontal or vertical direction, and do not necessarily need to be equally spaced in both the horizontal and vertical directions. In this embodiment, the light emitting unit 24 may include an LED chip or an LED package having a package structure. In this embodiment, the light emitting unit 24 is an LED chip. The LED chip can be appropriately selected to emit light within the wavelength range of visible light, and may be, for example, a red LED chip, a green LED chip, a blue LED chip, etc. Furthermore, one light-emitting unit 24 may include only one red LED chip, one green LED chip, or one blue LED chip, or may be a package consisting of one or more of a red LED chip, a green LED chip, and a blue LED chip.

[0311] Step d1: As shown in FIGS. 5-7, a first encapsulating layer 31 is formed on the substrate 14. The first encapsulating layer 31 covers the display area 142 and fills the grooves 144. The first sealing layer 31 may be a light-transmitting resin such as an epoxy resin or a silicone resin. The first sealing layer 31 is preferably formed of a hard material to protect the light-emitting units 24. The first sealing layer 31 is preferably formed by transfer molding, compression molding, or the like using a resin that has excellent heat resistance, weather resistance, and light resistance.

[0312] Step e1: A part of the process edge 141 is cut along one side of the process edge 141 shown in FIG. 5-8 (that is, along the position indicated by the dotted line in FIG. 5-7). When cutting, the substrate is cut perpendicularly to the front surface, and a cut surface P is formed outside the display module. After cutting, the outer surface of the sealing adhesive layer is flush with the outer surface of the substrate located on the process side, and the distance h from the center point of the light-emitting unit 24 closest to the cutting plane P (i.e., the outermost part of the remaining part of the process edge 141) on the plane where the display area 142 is located to the cutting plane P is less than or equal to 1 / 2 of the row spacing value H between two columns of light-emitting units parallel to the cutting plane P (i.e., the distance between the center lines of two columns of light-emitting units). In this way, first, the display modules 200 of this embodiment are joined together to form a large screen (see Figure 5-19, which is an example of a large screen joined by four display modules 200; refer to Figure 5-14, which shows a schematic cross-sectional structure diagram of two adjacent display modules 200 joined together). In this case, the distance H' between the light-emitting units 24 on either side of the joining seam is equal to or substantially equal to the row spacing value H between two columns of light-emitting units parallel to the cutting plane P. Each light-emitting unit array 20 appears visually continuous, and each light-emitting unit 24 emits uniform light.

[0313] It should be noted that the steps in this embodiment can be performed consecutively or without conflict. The order of some steps can be changed, such as swapping step b1 with step c1, or new operational steps can be added. In the above method, when manufacturing the display module 200, the process edge 141 is used to clamp by a corresponding jig to avoid damaging the substrate 14 or other components installed on the substrate 14 during processing. The process edge 141 can be partially removed during the assembly process of the display module 200 without affecting the display effect of the final display module 200 . In order to prevent water vapor from entering from outside the display module through the joint between the first sealing layer 31 and the substrate 14 during use or transportation of the product, the following procedure is taken. That is, in this embodiment, a groove 144 is provided on the side of the process edge 141 along the periphery of the display area 142, and the first sealing layer 31 is filled into the groove 144, thereby increasing the contact area between the first sealing layer 31 and the substrate 14, so that the path of water vapor extends longer along the thickness direction of the substrate 14 and the path of water vapor penetration becomes longer. As a result, it becomes difficult for water vapor to enter the display area 142 and come into contact with the light-emitting unit 24, and damage to the light-emitting unit 24 caused by water vapor is reduced. At the same time, the groove 144 also increases the contact area between the first sealing layer 31 and the substrate 14, thereby improving the bonding strength between the first sealing layer 31 and the substrate 14. This extends the life of the light-emitting unit 24, and in this embodiment, the distance h from the center point of the light-emitting section 24 closest to the cross-section P on the plane in which the display area 142 is located to the cross-section P is less than half the row spacing value H between the two rows of light-emitting units parallel to the cross-section p. When the display modules 200 are joined, as shown in Fig. 5-19, the distance H' between the light-emitting units on both sides of the joining seam (i.e., the row center distance between the light-emitting units in two columns at the joining point) is equal or substantially equal to the row spacing value H between two adjacent rows of the light-emitting units 24. This allows the joined display screen to emit uniform light, and solves the problems existing in the prior art. Furthermore, the manufacturing method provided by this embodiment cleverly utilizes the process edge 141 of the substrate 14, and simply provides a groove 144 on the process edge 141, and then fills the groove 144 when molding the first sealing layer 31, thereby reducing the difficulty of implementation, increasing production efficiency, and improving the water vapor prevention performance of the display module 200.

[0314] Preferably, in this embodiment, as shown in Figure 5-7, when cutting a portion of the process edge 141 along the side of the process edge 141 in step e1, the cutting is done from the groove 144, and the outer surface of the first sealing layer 31 is flush with the outer surface of the substrate 14 located at the process edge 141. Referring to Figures 5-8, at least a portion of the recessed groove 144 and a portion of the process edge 141 remain on one side of the cut display module. 5-7, the cutting position is located in the center of the groove 144. At this time, the bottom surface of the groove 144 after cutting is connected to the outer surface of the display module 200 (i.e., the cut surface, which is the outer surface of the process edge 141). The display module of this embodiment is joined through the cut surface P. In order to reduce the joint seam, the cut portion needs to be near the display area 142. Therefore, by cutting along the groove 144, the joint seam can be reduced and the display module can be easily joined.

[0315] Specifically, in this embodiment, as shown in Fig. 5-4, one groove 144 is opened in step b1, but in other embodiments, multiple grooves 144 may be opened in step b1. Referring to the substrate 14 shown in Figure 5-12a, four grooves 144 are provided, and correspondingly, the cross-sectional structure of the display module 200 formed after molding the first sealing layer 31 on the substrate 14 shown in Figure 5-12a and cutting off part of the process edge is shown in Figure 5-12b. Naturally, in order to extend the path for water vapor to penetrate into the display area 142, it is necessary to open as many grooves 144 as possible. However, when the requirements for the joining seam are very small, limited by the process precision and the material strength of the substrate 14, the number of grooves 144 cannot be too many, and at least one groove 144 must be opened, which can be determined according to actual requirements and is not limited thereto.

[0316] Specifically, referring to FIG. 5-4, in this embodiment, the inner wall of the groove 144 is relatively smooth, whereas in other preferred embodiments, the side wall of the groove 144 on the display area 142 side opened in step b1 has irregularities and is not flat. The advantage is that the bonding area between the first encapsulation layer 31 and the sidewall can be increased, making the two more tightly bonded and more difficult to separate. For example, in another embodiment, as shown in FIG. 5-10, the sidewall of the groove 144 near the display area 142 is stepped, which improves the bonding strength between the first sealing layer 31 and the substrate 14. Referring to Figures 5-11, the sidewalls of the groove 144 near the display area 142 have a saw-like jagged shape, which provides better bonding strength between the first sealing layer 31 and the substrate 14 and at the same time provides a longer path for water vapor to enter the display area 142. Furthermore, the unevenness of the sidewall of the groove 144 near the display area 142 can also be formed by etching, further lengthening the path through which water vapor can pass.

[0317] 5-2 and 5-13, in this embodiment, step c1 may also include: A driving mounting area 143 (the shaded area of ​​the dotted frame in FIG. 5-2) for mounting electronic driving components is defined on the back surface B of the substrate. The driving electronic components 44 (see FIG. 5-13) are mounted in the driving mounting area 143. The driving electronic components 44 are electrically connected to the light-emitting units 24 via electrical circuits pre-installed on the substrate 14, thereby driving the light-emitting units 24 to emit light, eliminating the need for a separate driving circuit and increasing the integration density of the display module. Here, the electronic driving components include resistors, capacitors, inductors, integrated circuits, etc.

[0318] In this embodiment, in step e1, the ratio of the thickness of the remaining part of the process edge 141 to the depth of the recessed groove 144 is between 2 and 20. The thickness of the remaining portion of the process edge 141 is the thickness of the portion of the recessed groove 144 that does not penetrate through the substrate 14 . The depth of the groove 144 is the distance from the opening of the groove 144 to the bottom of the groove, and the function of the groove 144 is to retard the penetration of water vapor into the light-emitting units in the display area, so the groove 144 should be as deep as possible, but not so deep as to cause insufficient strength in the connection between the process edge 141 and the substrate 14. In practical applications, the ratio of the thickness to the width of the remaining part of the process edge 141 is between 2 and 20.

[0319] In this embodiment, the thickness of the substrate 14 is 1 mm to 5 mm. In this embodiment, the substrate 14 can be a printed circuit board, a glass substrate, or other types of substrate, and an appropriate substrate can be selected based on the requirements of the usage environment. In this embodiment, a printed circuit board is preferred. The board can have prefabricated circuitry and metal pads for the display area 142 and driver mounting areas. The light-emitting units 24 and driver electronics 44 are preferably mounted using an SMT (surface mount) process. If the thickness of the substrate 14 is too thin, the depth of the grooves 144 will be shallow and the path of the water vapor will be too short, so in order to make the path of the water vapor as long as possible, it is necessary to make the grooves 144 as deep as possible and the substrate 14 as thick as possible. However, if the substrate 14 is too thick, the volume of the display module will increase, making it difficult to achieve a slim and lightweight design. In practice, the thickness of the substrate 14 is 1 to 5 mm, and a multi-layer printed wiring board can be used, formed by alternating multi-layer insulating substrates and multi-layer circuit layers.

[0320] When the display module is used for a long period of time, a mismatch in the expansion coefficients of the first sealing layer and the substrate may occur (for example, the expansion coefficient of the substrate and the expansion coefficient of the translucent sealing colloid may be too different, resulting in different degrees of expansion of the substrate and the translucent sealing colloid when the temperature rises. In this embodiment, the expansion coefficient of the first sealing layer is much greater than that of the substrate), which may result in a large gap between the first sealing layer and the substrate, reducing airtightness. As a result, water vapor can easily penetrate into the interior of the module through the interface between the first sealing layer and the substrate, potentially causing failure of the light-emitting unit. In this embodiment, the first sealing layer is composed of a translucent colloid that is mixed with a nanopowder material (the preferred particle size of the nanopowder material is 5 nm to 200 nm) to form a mixed colloid (it is preferable to mix uniformly during mixing to make the properties of each component uniform) in order to improve the expansion coefficient of the first sealing layer and narrow the gap between the first sealing layer and the substrate. In this embodiment, epoxy resin, silica gel, or silicone resin is selected, and the nanopowder material mixed with the translucent colloid is selected from nanosilica powder, nanoalumina powder, nanozirconium tungstate powder, or a mixture of at least two of these three materials. In addition, the expansion coefficients of nano-silica powder, nano-alumina powder and nano-zirconium tungstate powder materials are much smaller than those of epoxy resin, silica gel and silicone resin, and in particular, nano-zirconium tungstate material is a material with a negative expansion coefficient, which reduces the expansion coefficient of the transparent encapsulating colloid formed after mixing, thereby reducing the difference in expansion coefficient with the substrate. In this embodiment, the expansion coefficients of the epoxy resin, silicone, and silicone resin can be effectively adjusted by adding nanopowder material to the translucent colloid to modify it, thereby improving the mismatch in expansion coefficients between the epoxy resin, silicone, and silicone resin and the substrate. This increases the airtightness between the first sealing layer and the substrate, improving the stability of the display module during long-term use, and also prevents water vapor from penetrating the module through the interface between the sealing adhesive and the substrate, which can cause damage to the LED chip or separation between the adhesive layer and the substrate, due to a decrease in airtightness.

[0321] This embodiment provides another method for manufacturing a display module, which includes the following steps.

[0322] Step a2: Prepare a substrate. This is the same as the substrate prepared in step a1 above, so it will not be explained again.

[0323] Step b2: A groove is created around the display area on the craft edge side. The groove does not penetrate the substrate, and the depth of the groove is thicker than the thickness of the non-penetrating part of the substrate. Step b2 in this embodiment is the same as step b1 in the first embodiment, so please refer to the description of step b1 in the first embodiment above. It will not be described again here.

[0324] Step c2: Mounting the light-emitting units on the display area, and molding the first sealing layer 32 on the display area. In this embodiment, unlike step c1, as shown in FIGS. 5 to 15, after mounting the light-emitting unit array 20 on the display area 142, the first sealing layer 32 is first molded. The first sealing layer 32 then covers the light-emitting units 24 in the display area to prevent the light-emitting units 24 from loosening due to vibrations that occur when cutting off part of the craft edge in step d2.

[0325] Step d2: Referring to FIG. 5-16, cut off a part of the process edge along the process edge 141. Also, form a cutting plane P' on the outside of the display module, and set the distance from the center point of the light-emitting unit 24 closest to the cutting plane P' on the plane where the display area is located to the cutting plane P' to be less than 1 / 2 of the row spacing value between the light-emitting units in two columns parallel to the cutting plane P'.

[0326] Step e2: Referring to Figure 5-17, a second sealing layer 33 is formed on the substrate, and the second sealing layer 33 covers the first sealing layer 32 and the front surface Z of the substrate (i.e., located above the front surface Z of the substrate and in direct or indirect contact with the front surface Z of the substrate). Then, the groove 144 extending to cover the cut surface P' until it is flush with the back surface B of the substrate is filled, and the distance h1 from the center point of the light-emitting unit 24 closest to the outermost part of the second sealing layer 33 on the surface where the display area 142 is located to the outermost part of the second sealing layer 33 is set to be less than 1 / 2 of the row spacing value H1 between two rows of light-emitting units parallel to the top surface of the second sealing layer 33.

[0327] In this embodiment, the second sealing layer 33 fills the recessed groove 144 and covers the side surface of the drive mounting area (i.e., the rear surface B of the substrate 14). This makes the path through which water vapor passes longer than in the first embodiment. Although the process of this embodiment is more complicated than in the first embodiment, it is more effective in making it difficult for water vapor to enter.

[0328] It should be noted that the steps of the above method of this embodiment can be performed in order, and some step sequences can be changed or new steps can be added as long as they do not conflict. In this embodiment, the light-emitting unit 24 is mounted in the display area before the process edge is cut. Then, the first sealing layer 32 is molded in the display area to protect the light-emitting unit. This prevents the light-emitting unit 24 from peeling off from the substrate 14 due to vibration of the substrate caused by cutting the process edge. After the process edge is cut, the second encapsulation layer 33 can be molded to fill the groove and cover the rear drive mounting area, thereby increasing the contact area between the first encapsulation layer and the outside of the substrate and lengthening the path for water vapor to penetrate. This makes it difficult for water vapor to penetrate into the display area and contact the light-emitting unit 24, thereby extending the life of the light-emitting unit 24. Combining Figures 5-17 and 5-18, on the surface where the display area is located, the distance from the center point of the light-emitting unit 24 closest to the outermost part of the second sealing layer 33 to the outermost part of the second sealing layer 33 is less than half the row spacing value between two rows of light-emitting units 24 parallel to the outermost surface of the second sealing layer 151. When the display modules used for connection are connected, the distance H' between the light-emitting units on both sides of the connection gap is exactly or approximately the same as the row spacing value H between the two columns of light-emitting units parallel to the cutting surface, which does not affect the display effect after bonding and ensures that the bonded display emits light uniformly. In addition, by making good use of the craft edge of the substrate, grooves are provided only on the craft edge, and the first encapsulating layer 32 is molded first. By filling the grooves when molding the second encapsulating layer 33, the mounting difficulty can be reduced, production efficiency can be increased, and the display module's ability to prevent water vapor intrusion can be improved.

[0329] In this embodiment, the grooves 144 are not yet filled when the first sealing layer 32 is molded, which reduces the cutting resistance during cutting. However, in other embodiments, the grooves 144 may be filled first when the first sealing layer 32 is molded. 5-20, in another embodiment, the second encapsulation layer 33 can extend to the back surface B of the substrate, and the back groove 145 can be provided on the back surface B of the substrate. By having the second encapsulation layer 33 also fill the back groove 145, the path for water vapor to enter can be further extended, and the bonding strength between the substrate and the first encapsulation layer can be further strengthened.

[0330] In this embodiment, the refractive index of the second sealing layer 33 is higher than that of the first sealing layer 32, and the light emitted from the light-emitting unit 24 is refracted by the first sealing layer 32 and the second sealing layer 33, resulting in a larger angle of outward diffusion, which helps to disperse the light and make the light output effect more uniform.

[0331] In another embodiment of this embodiment, referring to Figure 5-21, in the above step b2, the groove 144 may be open around the periphery of the display area 142 (see Figure 5-3), that is, the groove 144 may be open to the front Z of the substrate. In this embodiment, the rear groove 145 opens on the rear surface B of the substrate. Referring to FIG. 5-22, after the first encapsulation layer 32 is formed, a portion of the process edge is removed from the rear groove 145, and then the second encapsulation layer 33 is formed. In this embodiment, the path for water vapor to pass is extended to be flush with the back surface B of the substrate 14, so that the path for water vapor is longer than that of the display module provided in the first embodiment, and the second sealing layer 33 is more tightly bonded to the substrate 14.

[0332] No light-emitting unit 24 is installed on the rear surface B of the substrate, and when the driving electronic components 44 are installed on the rear surface B of the substrate, they do not need to be arranged evenly. Therefore, there is enough space to provide a rear recess on the rear surface of the substrate, and the shape of the rear recess can be designed to be wide. For example, referring to FIG. 5-23, the rear recess 145 is an inverted "V" shaped groove. After cutting (in FIG. 5-23, the dotted lines on both ends of the substrate 14 indicate the cut-out portions), a slope 1451 is formed on the side of the substrate 14, sloping toward the middle of the rear surface B of the substrate. The advantage of this is that it allows for three-dimensional connections, as shown in Figure 5-24, i.e., in addition to planar connections, angled connections can also be achieved. Although Fig. 5-24 shows two display modules connected at a 90° angle, they can also be joined at an angle greater than 90° but less than 180°. The inclined surface 1451 can prevent interference at the joint when two display modules are joined at an angle. Therefore, the display module of this embodiment is highly practical and has a wide range of applications.

[0333] 5-19, this embodiment also provides an LED display screen made by bonding together the display modules of the above embodiments, and the display module 200 is connected to an adapter plate (not shown) via a connector (not shown). The adapter plate is then firmly fixed to the outer frame of the structure via copper posts, forming a seamless LED display.

[0334] Fifth embodiment

[0335] When COB sealing technology is used to manufacture display modules and LED optical devices, the COB integrated package can achieve smaller dot spacing and bring about better display effects. COB display packaging products have two main technical advantages. First, COB is a modular package, and the entire top surface of the product is protected by colloidal packaging, effectively reducing the packaging interface and improving product reliability. Second, the use of COB integrated packaging technology has the technical advantage of being natural in smaller pitch fields. However, current flip-chip COB display package products have significant industry issues, such as poor product contrast and poor black display effect after installation, as well as inconsistent ink color after the screen is turned off. Currently, the industry generally adds black components to the encapsulation adhesive to achieve high contrast after encapsulation. However, this often results in ink color inconsistency between modules. As a result, the overall screen contrast and brightness of COB display package products are low, resulting in a poor display effect.

[0336] To address the above-mentioned problems, the present embodiment provides a display module that can improve the contrast and brightness of the entire screen. The display module provided in this embodiment can be implemented independently from other embodiments. An example of a display module provided by this embodiment is shown in Figure 6-1, which includes a substrate 15 and a plurality of light-emitting units 25 disposed on the front surface of the substrate, and each light-emitting unit 25 includes a plurality of LED chips 251. A black adhesive layer 351 is provided to cover the front surface of the substrate, and is also referred to as a black optical layer in the present invention. The black adhesive layer 351 covers first regions 1351 between the light-emitting units 25 on the front surface of the substrate. The black adhesive layer 351 is then covered by second regions 152 located between the LED chips 251 in each light-emitting unit 25. The light-emitting surface of each LED chip 251 is exposed on the black adhesive layer 351. The height of the black adhesive layer 351 is lower than that of the LED chip 251. A first encapsulating layer 36 is provided on the front surface of the substrate and covers the black adhesive layer 351 and each light-emitting unit 25. It should be noted that, as shown in FIG. 6-1, electronic components 45 for driving the LED chip 251 to emit light are provided on the rear surface of the substrate. It can be understood that the LED chip 251 can be disposed on the front surface of the substrate by welding or mounting, and the specific disposition method is not limited in the present invention. The first encapsulation layer 36 can be formed on the substrate by methods including, but not limited to, injection molding, dispensing, molding, etc. Therefore, the black adhesive layer 351 and the light-emitting units 25 are tightly bonded together. In some embodiments, the first encapsulating layer 36 may cover only the entire light-emitting unit 25 on the front surface of the substrate, or may cover the entire front surface of the substrate at the same time. The first encapsulating layer 36 may contain, but is not limited to, a certain percentage of diffusing particles to improve the light-emitting efficiency, and may contain, for example, a certain percentage of diffusing powder, phosphor, etc.

[0337] In this embodiment, the display module further includes a moisture-proof layer 52, which includes at least one of the following: a first moisture-proof layer 521 is disposed between the black adhesive layer 351 and the front surface of the substrate, and a second moisture-proof layer 522 covers each LED chip 251. For example, Fig. 6-2 is a schematic cross-sectional view of the moisture-proof layer of a display module and an LED optical device. Note that in Fig. 6-2, a first moisture-proof layer 521 is disposed between the black adhesive layer 351 and the front surface of the substrate. Fig. 6-3 shows a cross-sectional view of another display module and a moisture-proof layer of an LED optical device. The second moisture-proof layer 522 in FIG. 6-3 covers each LED chip 251, and the method for forming the moisture-proof layer 52 is not particularly limited, but examples thereof include molding and hot pressing. Of course, the moisture-proof layer 52 can also be provided between the black adhesive layer and the front surface of the substrate to cover each LED chip. For example, Figure 6-4 shows a schematic cross-sectional structure diagram of the moisture-proof layer of another display module and LED optical device. 6-4 is simultaneously disposed between the front surface of the substrate and each LED chip 251. The side surface of the LED chip 251 is a surface located between the light-emitting surface and the bottom surface.

[0338] In this embodiment, the moisture-proof layer 52 shown in FIG. 6-4 comprises a first moisture-proof layer 521 and a second moisture-proof layer 522, and the first moisture-proof layer 521 and the second moisture-proof layer 522 may be integrally formed or may not be integrally formed, but are not limited thereto. In addition, if the first moisture-proof layer 521 and the second moisture-proof layer 522 are not formed integrally, when the first moisture-proof layer 521 and the second moisture-proof layer 522 are provided, the joint between the two must be connected more tightly to prevent the intrusion of water vapor. The moisture barrier layer 52 can include, but is not limited to, a polymer nanolayer that can completely prevent the penetration of water molecules. In addition, by skillfully combining the chip, PCB substrate, and sealing adhesive, the mechanical strength can be improved without affecting the display effect, thereby improving user satisfaction. In this embodiment, as shown in Figures 6-8a, the top surface 511 of the black adhesive layer 351 located in the first region 151 is parallel to the front surface of the substrate and the top surface 512 of the black adhesive layer 351 located in the second region 152. In the example of the display module shown in Figures 6-8b, the upper surface 511 of the black adhesive layer 351 located in the first region 151 and the region close to the light-emitting unit 25 may be an inclined or curved surface. The maximum height of the upper surface 511 of the black adhesive layer 351 is lower than the height of the light-emitting surface of the LED chip 251, so that the area covered by the side surface of the LED chip 251 is larger. This can significantly reduce light channeling between the light-emitting units. Of course, for example, Figures 6-6a and 6-6b are schematic diagrams of other display modules, in which the height of the upper surface 511 of the black adhesive layer 351 in the display module is higher than the light-emitting surface of the LED chip 251 to prevent the light-emitting units from transmitting light to each other and affecting the display effect. By setting the height of the black adhesive layer between the light-emitting units higher than the height of the light-emitting surface of the LED chip, when the light is mixed between each light-emitting unit, it does not affect the other light-emitting units, resulting in a better display effect. It should be noted that other display modules are also contemplated, as shown in Figures 6-7. The upper surface 511 of the black adhesive layer 351 may be a concave curved surface facing downward toward the front surface of the substrate, and the maximum height of the upper surface 511 of the first black adhesive layer is the same as the height of the light-emitting surface of the LED chip. That is, the black adhesive layer extends along the side of the LED chip toward its light-emitting surface, and ultimately becomes flush with the light-emitting surface.

[0339] 6-8a and 6-8b are schematic diagrams of another display module in this embodiment. The upper surface 512 of the black adhesive layer 351 located in the second region 152 may also be a concave curved surface toward the front surface of the substrate. It should be noted that the upper surface 512 of the black adhesive layer located in the second region is not higher than the light-emitting surface of the LED chip. Because the second region is located between the LED chips in the light-emitting unit 25, if the height of the upper surface of the black adhesive layer in the second region is higher than the height of the light-emitting surface of the LED chip, the light mixing effect of the LED chip will be greatly affected, and even light mixing will be impossible. In such a situation, in order to improve the light mixing effect and display effect, the upper surface of the black adhesive layer in the second region should not be higher than the light-emitting surface of the LED chip.

[0340] It should be noted that in this embodiment, the top surface of the black adhesive layer in the first and second regions can be simultaneously parallel to the front surface of the substrate. Alternatively, the top surface of the black adhesive layer in the first region can be a curved or sloped surface that is concave downward toward the front surface of the substrate. Alternatively, the top surface of the black adhesive layer in the first region can be parallel. The upper surface of the black adhesive layer in the second region is a curved or inclined surface concave downward toward the front surface of the substrate. Alternatively, the upper surface of the black adhesive layer in the first region may be a curved or inclined surface concave downward toward the front surface of the substrate, and the upper surface of the black adhesive layer in the second region is parallel. Of course, the upper surfaces of the black adhesive layer in the first and second regions may be parallel, while the other regions may be curved or sloped downward toward the front surface of the substrate, but this is not limiting and can be determined by those skilled in the art based on actual conditions and needs.

[0341] It is to be noted that the display module in this embodiment may include, but is not limited to, the height of the upper surface of the black adhesive layer in the first region being higher than the height of the light-emitting surface of the LED chip; the height of the upper surface of the black adhesive layer in the second region being lower than the height of the light-emitting surface of the LED chip; the height of the upper surface of the black adhesive layer in the second region being lower than the height of the light-emitting surface of the LED chip; and the height of the upper surface of the black adhesive layer in the second region being lower than the height of the light-emitting surface of the LED chip. Of course, the height of the upper surface of the black adhesive layer in the first region may be equal to the height of the light-emitting surface of the LED chip, and the height of the upper surface of the black adhesive layer in the second region may be equal to the height of the light-emitting surface of the LED chip. Those skilled in the art can set the height of the upper surface of the black adhesive layer in the first and second regions according to the actual situation and needs, and this embodiment is not limited as long as the height of the upper surface of the black adhesive layer in the second region is equal to or lower than the height of the light-emitting surface of the LED chip. Preferably, in this embodiment, the height of the upper surface of the black adhesive layer in the first region is higher than the height of the light-emitting surface of the LED chip, thereby preventing the light-emitting units from transmitting light through each other. It should be noted that the upper surface of the black adhesive layer being higher than the light-emitting surface of the LED chip means that at least a portion of the upper surface of the black adhesive layer is higher than the light-emitting surface of the LED chip; at the same time, the upper surface of the black adhesive layer is not higher than the light-emitting surface of the LED chip, which means that no part of the upper surface of the black adhesive layer is higher than the light-emitting surface of the LED chip, but may also include at least a portion being flush with the light-emitting surface of the LED chip. It should be noted that the black adhesive layer in the first and second regions is parallel to the front surface of the substrate or concave toward the front surface of the substrate. The height of the black adhesive layer in the first and second regions can be determined in various ways and can be set by those skilled in the art according to actual conditions and needs.

[0342] In this embodiment, the number, primary color, size, etc. of LED chips included in the light-emitting unit 25 can refer to the settings of light-emitting units in other embodiments, but are not limited to these and will not be described in detail here.

[0343] In this embodiment, the black adhesive layer 351 is a molded black adhesive layer molded onto the front surface of the substrate, or a hot-pressed black adhesive layer hot-pressed onto the front surface of the substrate. In some embodiments, when the black adhesive layer 351 is a molded black adhesive layer molded on the front side of the substrate, a substrate made of PCB material can be selected. After cleaning and dehumidification, LED chips are fixed on the front side of the PCB substrate, and electronic components are attached to the back side of the PCB. After a certain period of aging verification, it is confirmed that all the LED chips light up normally. Next, a black adhesive layer is molded to cover the top surface of the LED chip, baked to solidify, and the top surface of the chip is etched with the black adhesive by methods including, but not limited to, chemical etching and physical etching until the top surface of the chip is completely exposed. Finally, an encapsulation layer is molded on the molded black adhesive layer and the upper light-emitting surface of the LED chip, improving product reliability and achieving a light mixing effect. In this embodiment, when the black adhesive layer 351 is a hot-pressed black adhesive layer that is hot-pressed onto the front surface of the substrate, a pre-prepared hot-pressed black adhesive film can be hot-pressed onto the top surface of the substrate, and the LED chip is baked and solidified. The hot-pressed black adhesive film forms a concave shape toward the front of the substrate together with the surrounding LED chip. Next, the hot-pressed black adhesive film on the top of the LED chip is etched by methods including but not limited to chemical etching and physical etching until the top surface of the LED chip is completely exposed, ensuring that the top light-emitting surface of the LED chip can emit normal light. Finally, an encapsulation layer is formed on the hot-pressed black adhesive film and the top of the LED chip to improve product reliability and achieve the light mixing effect.

[0344] In this embodiment, black adhesive layers of different heights and shapes are provided between the light-emitting units on the front of the substrate and between the LED chips in the light-emitting units to enhance contrast and brightness and improve the display effect. At the same time, moisture-proof layers are provided on the black adhesive layer, the front surface of the substrate, and the top surface of the LED chip to prevent the intrusion of water vapor, thereby solving the problems of poor ink color consistency, poor contrast, and malfunctions caused by moisture inside the display module, improving contrast and display effect, and greatly increasing user satisfaction.

[0345] This embodiment provides a display screen as shown in Figures 6-9, but the sealing layer is shown as transparent in the figures to more clearly show the structure of the display screen. The display screen includes at least one display module as shown in the examples above, for example, Figures 6-9 show three display modules 300 assembled together. Two adjacent display modules are fixed by means of, but not limited to, fixing brackets, screws, and adhesives. The display screen can be set on a flat or curved surface, and the specific setting method can be set by those skilled in the art according to actual situations and requirements, and is not particularly limited in this application.

[0346] Sixth embodiment

[0347] The display module of this embodiment can omit the moisture-proof layer compared to the display module of the fifth embodiment, and can be mounted independently of the above-mentioned embodiments. For ease of understanding, in this embodiment, the encapsulating layer of the display module includes a seventh encapsulating layer and an eighth layer located on the seventh encapsulating layer. Here, the seventh sealing layer is a second black adhesive layer (the black adhesive layer shown in the above embodiment can be used, but is not limited to this), and the first sealing layer is a first light-transmitting adhesive layer (the first sealing layer shown in the above embodiment can be used, but is not limited to this). However, in this embodiment, the sealing layer is formed after the LED chips of each light-emitting unit are disposed on the front surface of the substrate, and is formed by pressing the front surface of the substrate 16 .

[0348] 7-1 and 7-2 show exemplary display modules provided by this embodiment, which include a substrate 16 and light-emitting units disposed on the substrate 16, each of which includes at least one LED chip 26. The encapsulation layer of the display module includes a black adhesive layer 37 and a first encapsulation layer 38. Optionally, in this embodiment, the display module may further include a transparent protective film 30 covering the first sealing layer 38. By providing the transparent protective film 30, the protective performance of the display module can be further improved. The thickness of the transparent protective film in this embodiment can also be flexibly set as needed, and can be, for example, from 10 μm to 300 μm, but is not limited to these lengths. In this embodiment, the transparent protective film 30 may have a two-layer structure consisting of at least two sub-adhesive layers, or may have a single-layer structure. Examples of the transparent protective film 30 include, but are not limited to, a transparent adhesive layer and a plastic sheet.

[0349] For ease of understanding, the present embodiment provides examples of a manufacturing method for a display module, including but not limited to the following embodiments.

[0350] Step a3: The substrate 16 and the sealing layer are formed.

[0351] In this embodiment, preparing the substrate 16 includes placing the substrate 16 and placing each LED chip on the front surface of the substrate 16 . In this embodiment, the electronic components can also be placed on the back surface of the substrate 16. That is, the electronic components can also be placed on the back surface of the substrate 16 before the surface of the sealing layer provided with the black adhesive layer 37 is pressed against the front surface of the substrate 16. Of course, in other embodiments, the encapsulation layer may be formed on the front side of the substrate 16 before the electronic components are applied to the back side of the substrate 16 .

[0352] In this embodiment, creating the sealing layer includes providing a first mounting film 62, a first sealing layer being placed on the first mounting film 62, and then a black adhesive layer 37 being also placed on the first sealing layer. It should be understood that in this embodiment, the process of providing the first sealing layer on the first mounting film 62 and the black adhesive layer on the first sealing layer can be flexibly selected. Here, the black adhesive layer 37 is also referred to as a black optical layer in the present invention. For example, but not limited to, coating, silkscreen printing, molding, etc. can be used.

[0353] It should be understood that in this embodiment, the substrate 16 and the encapsulation layer can be fabricated simultaneously, or the substrate 16 can be fabricated first, followed by the encapsulation layer. Additionally, the substrate 16 and / or the encapsulation layer can be sourced directly from a previous process.

[0354] It should be understood that in this step, the first sealing layer and the black adhesive layer 37 sequentially provided on the first mounting film 62 may be in a cured state. Subsequently, they are heated in the process of being pressed against the front side of the substrate body, and are changed from a cured state to a semi-cured state. Of course, the first sealing layer and black adhesive layer 37, which are sequentially formed on the first mounting film 62 in this process, may also be in a semi-cured state. This is convenient for later pressing directly on the front surface of the substrate body. This pressing method can be a heat press or other pressing method, but a detailed description will be omitted here.

[0355] Step b3: Press the side of the encapsulating layer provided with the black adhesive layer 37 or the black optical layer against the front of the substrate 16. The first encapsulating layer and the black adhesive layer 37, which are sequentially arranged on the first mounting film 62, are in a semi-cured state, gradually exposing the black adhesive layer 37 from the light-emitting surface of each LED chip, and the first encapsulating layer covers the black adhesive layer 37 and the light-emitting surface of each LED chip.

[0356] As a non-limiting example of this embodiment, the side of the encapsulation layer provided with the black adhesive layer 37 can be pressed together with the front surface of the substrate 16 by hot pressing. At this time, the surface of the sealing layer on which the black adhesive layer 37 is provided is attached to the upper surface of the substrate 16, and the sealing layer is heated and pressure is applied toward the substrate body to press the sealing layer against the substrate body. In the pressing step, the first sealing layer and the black adhesive layer are brought into a semi-molten state, and at the same time, pressure is applied toward the substrate body, gradually exposing the black adhesive layer 37 on the light-emitting surface of each LED chip.

[0357] In some embodiments of this embodiment, to improve yield and manufacturing efficiency, a substrate clamp 6 may be provided, which has a receiving cavity that fits over the substrate. The substrate can be fixed to the substrate clamp 6 by pressing the surface of the encapsulation layer provided with the black adhesive layer 37 against the front of the substrate 16. After fixing, the substrate body is fixed in the receiving cavity of the substrate clamp 6, with the back surface of the substrate 16 facing the bottom of the receiving cavity. The front surface of the substrate 16 and each LED chip are open toward the top of the receiving cavity so that one side of the encapsulation layer provided with the black adhesive layer 37 can be attached. In this embodiment, when electronic components are first mounted on the back surface of the substrate 16 before the surface of the sealing layer provided with the black adhesive layer or black optical layer 37 is pressed against the front surface of the substrate 16, receiving cavities corresponding to each electronic component are also provided at the bottom of the receiving cavities, and after the substrate 16 is fixed to the substrate clamp 6, each electronic component is placed in the corresponding receiving cavity. The substrate clamp 6 used in this embodiment has a simple structure, is easy to manufacture, and is low-cost.

[0358] Referring to the above manufacturing method, the black adhesive layer 37 used in this embodiment has a certain degree of viscosity, which facilitates bonding between the substrate body and the LED chip, improves airtightness, and better protects the LED chip. At the same time, the fluidity of the black adhesive layer or black optical layer 37 can be used during the pressing process to completely fill the gap between the substrate body and the LED chip, further improving contrast.

[0359] In this embodiment, the first sealing layer and the black adhesive layer 37 are sequentially arranged on the first mounting film 62, which simplifies the process, improves production efficiency, and reduces manufacturing costs compared to a method in which the black adhesive layer 37 is formed on the substrate body at once and then the first sealing layer is formed on top of it. Then, the first sealing layer and the black adhesive layer 37 are pressed onto the substrate body at one time, and the black adhesive layer 37 and the first sealing layer have high integrity, which helps to improve the lamination density. Furthermore, this embodiment does not require an additional method such as spraying a black ink layer on the front surface of the substrate 16 to make it black, which further simplifies the manufacturing process and reduces manufacturing costs. At the same time, omitting the black ink layer allows the thickness of the display panel to be reduced.

[0360] In some embodiments of this embodiment, the first mounting film 62 in the sealing layer can be directly set as a transparent protective film, and in this embodiment, the first mounting film 62 can be held after the surface of the sealing layer provided with the black adhesive layer 37 is pressed against the front side of the substrate 16. The remaining first mounting film 62 is a transparent protective film formed on the first sealing layer. In this case, there is no need to remove the first mounting film 62, and there is no need to use an additional transparent protective film on the first sealing layer, which further simplifies the manufacturing process, improves manufacturing efficiency, and reduces costs.

[0361] Of course, in other embodiments of this embodiment, the first mounting film 62 can be removed after the surface of the sealing layer provided with the black adhesive layer 37 is pressed against the front surface of the substrate 16. Next, one or more pre-fabricated films are sequentially adhered onto the first sealing layer to form a transparent protective film. Of course, a transparent protective film can be formed on the first sealing layer by, but not limited to, coating, molding, silkscreening, printing, etc. In this embodiment, the first mounting film 62 can also be replaced by a carrier substrate 16.

[0362] For ease of understanding, the present embodiment will be described below by taking two manufacturing methods of the display module shown in Fig. 7-3 as an example. Examples of the manufacturing methods are shown in Fig. 7-4 to Fig. 7-11. These include, but are not limited to:

[0363] Step a4: Create a sealing layer as shown in Figure 7-4.

[0364] For example, a piece of film of the first mounting membrane 62 (which may be transparent) is first laid flat. The thickness of the first mounting film 62 is in the range of 10 μm to 300 μm, and the thickness uniformity is in the range of 1% to 10%. The light transmittance is in the range of 30% to 100%. Next, two layers of adhesive are sequentially placed on the first mounting film 62. First, a light-transmitting adhesive is applied to form the first sealing layer 38. The thickness of the first sealing layer 38 is in the range of 5 μm to 300 μm. The film thickness uniformity is 1% to 10%, and the light transmittance is 30% to 100%. Next, a black adhesive layer is disposed on the first sealing layer 38 to form the black adhesive layer 37. The thickness of the black adhesive layer 37 ranges from 5 μm to 200 μm. The thickness uniformity is 1% to 10%, and the light transmittance is 0% to 30%. The resulting structure of the sealing layer is shown in Fig. 7-4. In this embodiment, the black adhesive layer 37 and the first sealing layer 38 formed in step a4 may be in a semi-cured state or a cured state.

[0365] In this embodiment, the specific thickness of the black adhesive layer 37 is set so that the black adhesive layer 37 does not cover the upper light-emitting surface of the LED chip 26 as much as possible, preventing a decrease in light-emitting efficiency, and the black adhesive layer 37 can cover the light-emitting surface of the LED chip 26 as much as possible, basically making the side of the LED chip 26 as flexible as possible. In this way, when the semi-cured black adhesive layer 37 is pushed into the LED chip 26 in the process of pressing the black adhesive layer 37 onto the upper surface of the substrate 16, the outer surface 371 formed by the portion hanging down toward the LED chip 26 becomes an inclined or curved surface. This makes it possible to more appropriately avoid the influence of light channeling between the LED chips 26, further improving contrast and increasing yield.

[0366] Step b4: The substrate 16 shown in FIG. 7-5 is prepared.

[0367] In this example, this includes completing die bonding of the LED chips 26 on the front side of the substrate 16. In this example, various chip transfer methods (such as a material transfer method) can be used to transfer the LED chips 26 to the front side of the substrate 16. The light emitting color of the LED chips 26 may include at least one of red, green, blue, white, etc. The pitch of the LED chips 26 is 200 μm to 1000 μm.

[0368] Step c4: The substrate clamp 6 shown in FIG. 7-6 is created.

[0369] 7-6, the substrate clamp 6 of this embodiment includes a receiving cavity 61 that fits the substrate 16. In this example, the bottom of the receiving cavity 61 does not have a receiving groove for receiving the electronic component 46. In this embodiment, the material of the substrate clamp 6 can be, but is not limited to, metal, ceramic, or other material, and will not be described again.

[0370] Step d4: The fabricated substrate 16 is fixed to the substrate clamp 6. The fixed state is shown in Figure 7-7. The substrate clamp 6 fixes the substrate 16 and keeps it in a stable state.

[0371] Step e4: The surface of the sealing layer on which the black adhesive layer 37 is provided is bonded to the front surface of the substrate 16 (the state after bonding is shown in FIG. 7-8).

[0372] Step f4: The encapsulation layer is heated and pressure is applied to the substrate 16 to press the encapsulation layer against the substrate 16. During the pressing process, the black adhesive layer 37 is semi-molten due to the heat. At the same time, pressure is applied toward the substrate 16, and the upper light-emitting surface of each LED chip 26 gradually exposes (i.e., penetrates) the black adhesive layer 37. The outer surface 371 formed by the portion hanging over the side of the LED chip 26 is an inclined or curved surface. See Figures 7-9 and 7-10.

[0373] Step g4: After the black adhesive layer 37 and the first sealing layer 38 are cured, the substrate clamp 6 is removed and an electronic component 46 is placed on the back surface of the substrate 16, as shown in FIGS.

[0374] Other examples of manufacturing methods are shown in Figures 7-12 through 10-8, including but not limited to the following.

[0375] Step a5: The substrate 16 shown in FIGS. 7-12 is prepared.

[0376] This example involves completing the curing of the LED chip 26 on the front side of the substrate 16 and placing the electronic components 46 on the back side of the substrate 16 .

[0377] Step b5: The substrate clamp 6 shown in FIG. 7-13 is created.

[0378] 7-13, the substrate clamp 6 in this example includes a receiving cavity 61 that fits the substrate 16. In this example, the bottom of the receiving cavity 61 is provided with a receiving groove 63 for receiving the electronic component 46.

[0379] Step c5: The substrate 16 prepared in Fig. 7-12 is fixed to the substrate clamp 6 in Fig. 7-13, and the fixed state is shown in Fig. 7-14. The electronic components 46 on the back side of the substrate 16 are accommodated in the accommodation grooves 63, and the substrate 16 is fixed by the substrate clamp 6, so that the substrate 16 is kept in a stable state.

[0380] Step d5: Attach the side of the sealing layer (the sealing layer shown in FIG. 7-4 is also used in this embodiment) having the black adhesive layer 37 to the front of the substrate 16. The state after sealing is shown in FIG. 7-15.

[0381] Step e5: The sealing layer is heated, and pressure is applied to the substrate 16 side to press the sealing layer against the substrate 16. During the pressure application process, the black adhesive layer 37 is put into a semi-molten state by the heat. At the same time, the upper light-emitting surface of each LED chip 26 is pressed toward the substrate 16 so as to gradually expose (ie, penetrate) the black adhesive layer 37, as shown in FIGS. 7-16 and 7-17.

[0382] Step f5: After the black adhesive layer 37 and the first sealing layer 38 are cured, the substrate clamp 6 is removed to obtain the display module shown in FIG. 7-6.

[0383] In the application example of this embodiment, when the first mounting film 62 is directly provided as the transparent protective film 30 out of the two manufacturing methods described above, the transparent protective film 30 can be held. When the first mounting film 62 is not used as the transparent protective film 30, the black adhesive layer 37 is pressed against the substrate 16, the first mounting film 62 is removed, and then the transparent protective film 30 is provided on the first sealing layer 38. Of course, when manufacturing the display module shown in Figures 7-1 to 7-4, the first mounting film 62 can also be removed in this embodiment.

[0384] The manufacturing method of the display module provided in this embodiment uses a film manufacturing process, which can be pressed. In COB LED technology, the light-emitting surface of the LED chip 26 is exposed to the black adhesive layer 37, which has a certain degree of viscosity. This facilitates the bonding between the substrate body and the LED chip, improves airtightness, and better protects the LED chip. At the same time, the fluidity of the black adhesive layer 37 is utilized during the pressure application process to completely fill the gap between the substrate body and the LED chip. In this way, the entire front surface of the substrate 16 is filled with black except for the LED chip, further improving contrast. Furthermore, because the light-emitting surface of the LED chip is covered with the first encapsulation layer, the light transmission loss rate can be reduced.

[0385] In addition, since there is no need to spray a black ink layer on the front surface of the substrate 16 to make it black, the manufacturing process can be simplified, manufacturing costs can be reduced, and the thickness of the display panel can be made thinner; by omitting the black ink layer, the thickness of the display panel can be made thinner. At the same time, the first encapsulation layer also has a transparent protective film, which can optimize display performance and improve protection. Therefore, the display module and its manufacturing method provided in this embodiment can achieve high contrast, low transmittance loss, and high protection.

[0386] Seventh embodiment

[0387] In the prior art, after the LED chip is welded to the substrate via the pad, part of the pad is not covered by the LED chip. During the welding process, the solder paste used turns silver when melted and covers the top surface of the soldering pad. However, due to the reflective properties of silver, when the screen is black, the display is not dark enough, reducing the display contrast and affecting the display effect. One approach to solving this problem is to encapsulate a black adhesive layer on the top of the LED chip, covering the top of the LED chip and pads, and masking the silver outer surface with this black adhesive layer to improve contrast, where the black adhesive layer is also referred to as a black optical layer in the present invention. However, the black adhesive layer reduces the luminous efficiency of the LED chip, which increases the power consumption and heat generation of the LED chip. Therefore, this embodiment provides a solder paste that can solve the above technical problems, and the solder paste is suitable for soldering the LED chip to the corresponding pad on the substrate in the above embodiment. Of course, the solder paste of this embodiment is not limited to use in display modules, but can also be used in other applications.

[0388] The solder paste provided in this embodiment includes a mixture of metal solder, flux, and melanin. In this embodiment, the density of the melanin is smaller than the density of the metal solder, so that when the solder paste is heated and melted for soldering, the melanin can be pushed out to the top surface of the solder paste under the coagulation effect of the metal solder, resulting in the top surface of the solder paste appearing black. For this reason, when the solder paste is applied to solder an LED chip, after the LED chip is soldered to the corresponding pad on the substrate, the top surface of the solder paste covering the top surface of the solder pad appears black compared to the conventional top surface of solder paste covering the top surface of the solder pad, which appears silver. This embodiment utilizes the optical properties of black to absorb incident light, eliminating the reflection of silver on the top surface of the pad, improving contrast, and eliminating the need for additional processes or setting up an additional black adhesive layer on the top surface of the LED chip, simplifying the structure and reducing costs.

[0389] In some instances of this embodiment, the melanin may be mixed into the solder paste in the physical form of particles. In some applications, these particles may be mixed uniformly into the solder paste. Of course, in other applications, these particles may be mixed non-uniformly into the solder paste. In this embodiment, when the melanin is mixed into the solder paste in the physical form of particles, the particle size can be set to micron or nano size, that is, the melanin in this case can include, but is not limited to, at least one of micron-sized non-metallic black particles and nano-sized non-metallic black particles. That is, in this embodiment, the melanin may contain all micron-sized non-metallic black particles, or may contain nano-sized non-metallic black particles, if desired, and may be configured to contain micron-level non-metallic black particles, as well as nano-sized non-metallic black particles, and may be sized according to the needs of a particular application.

[0390] In other examples of this embodiment, the melanin may not be present in the solder paste in the physical form of particles, for example, the melanin may be dissolved in the solder paste.

[0391] In this embodiment, the cohesive effect of the metal solder refers to the solder paste during the welding process, and when the metal solder in the solder paste melts due to heat, it sinks and adheres to the object to be soldered (such as a pad or a chip electrode). The melanin in the solder paste is relatively squeezed and floats as the metal solder sinks, and is eventually pushed out to the top surface of the solder paste, where it adheres and appears black. In this embodiment, in order to meet the requirements for the depth of the black color on the top surface of the solder paste and ensure the uniformity of the black color distribution on the top surface of the solder paste, the weight ratio of melanin in the solder paste can be set to 1% to 1.4%. For example, the weight ratio of melanin in the solder paste can be set to 1%, 1.1%, 1.12%, 1.15%, 1.2%, 1.25%, 1.3%, 1.35%, 1.4%, etc.

[0392] In this embodiment, the melanin can be made of various black materials that can achieve the above purpose, such as, but not limited to, carbon. When the melanin is mixed into the solder paste in the form of physical particles, the melanin in this embodiment includes carbon particles mixed into the solder paste, and the particle size of the carbon particles can be in the micron range, for example, the carbon particles can be 2 microns or less, or can be at the nanometer level, for example, carbon particles of 500 nm or less.

[0393] In this embodiment, the metal solder contained in the solder paste is a tin alloy solder, but is not limited to this, and the solder paste in this embodiment is also referred to as solder paste. Furthermore, it goes without saying that the material of the tin alloy solder in this embodiment can be flexibly set. For example, a solder alloy containing lead can be used as the tin alloy solder, and it may be a tin-lead alloy, a tin-lead-bismuth alloy, a tin-lead-silver alloy, or the like. Tin alloy solder can also be used as a lead-free solder alloy, such as a tin-silver alloy, a tin-bismuth alloy, a tin-zinc alloy, a tin-antimony alloy, a tin-silver-copper alloy, or a tin-bismuth-silver alloy.

[0394] In this embodiment, the flux of the solder paste may include, but is not limited to, at least one of the following:

[0395] Resin: By hardening the resin, the adhesion of the solder paste is improved, making it easier to fix the object to be welded, and it can protect and prevent re-oxidation of the pad after welding.

[0396] Thixotropic agent: By setting a thixotropic agent, the viscosity and printing performance of the solder paste can be adjusted, preventing phenomena such as tailing and adhesion during printing.

[0397] Activator: Can be used to remove oxidized materials from the top surface of the pad or the welding area of ​​the object to be welded (such as the electrodes of an LED chip), and also has the effect of reducing the top surface tension of tin or lead.

[0398] Solvent: This component is the solvent of the flux components and can adjust the uniformity during the stirring process of the solder paste.

[0399] For ease of understanding, the following description will be given taking the solder paste shown in FIG. 8-1 as an example. In the example shown in Figure 8-1, the solder paste is a solder paste 64 containing tin alloy solder, which contains carbon particles 65 as melanin. When heated and melted during soldering, the metal solder in the solder paste 64 settles and adheres to the object being soldered. As the metal solder settles, the carbon particles 65 in the solder paste are relatively crushed and float, and are eventually pushed out to the top surface of the solder paste 64. As a result, the top surface appears black, that is, the top surface of the solder paste 64 covering the top surface of the pad appears black. This improves contrast and enhances lighting and display effects.

[0400] In this embodiment, a substrate is also provided, and as shown in FIG. 8-2, pads 171 for welding electrodes of an LED chip are provided on the front surface of the substrate 17. In this embodiment, the number of pads 171 and their arrangement on the front surface of the substrate 17 can be flexibly set according to the requirements of the application. For example, a plurality of pads 171 may be provided, a plurality of pads 171 may be arranged in an array on the substrate 17, or adjacent rows of pads 171 may be arranged in a staggered pattern. In some examples of this embodiment, the material of the pad 171 may be, but is not limited to, copper, silver, gold, etc. In this embodiment, the pad 171 may be used for electrical connection with an electrode of the LED chip, but is not limited to this. The LED chip in this embodiment may refer to the LED chip shown in the above embodiment, but is not limited to this, and a repeated description will be omitted here. The substrate 17 in this embodiment may be, but is not limited to, the substrate in the above embodiment.

[0401] As shown in FIG. 8-2, in this embodiment, solder paste 172 is also provided on each pad 171 on the substrate 17. In this embodiment, the method for providing the solder paste 172 on each pad 171 can be flexibly selected, and for example, printing, molding, etc. The solder paste 172 contains melanin, so that after the electrodes of the LED chip are soldered to the corresponding pads 171, the melanin in the solder paste 172 is pushed out to the upper surface of the solder paste 172 due to the cohesion effect of the metal solder, making the upper surface appear black, thereby improving the contrast of a display module manufactured using this substrate.

[0402] See Figure 8-3. In some examples of this embodiment, a black shielding layer 173 can also be provided on the front side of the substrate in the area outside the pads 171 to further improve the contrast of a display module manufactured using the substrate shown in Figure 8-2. The black shield layer 173 in this embodiment can be, but is not limited to, a black adhesive layer or a black ink layer, and when it is a black adhesive layer, it can be formed through, but is not limited to, molding or other processes. When it is an ink layer, it can be formed by a spray method or the like, but is not limited to this. The black shield layer 173 prevents the area other than the pads 171 on the front side of the substrate 17 from reducing the contrast of the display module due to light reflection, thereby further improving the display or lighting effect.

[0403] When creating a display module using the substrate shown in Figure 8-2 or Figure 8-3, each solder pad 171 is pre-applied with solder paste 172, so all that is required is to align the LED chip with the corresponding solder pad 171 and solder it. However, in some examples, the solder paste 172 does not have to be pre-disposed on each pad 171, but may be pre-coated on the electrodes of the LED chip. Of course, in some examples, the solder paste 172 may be pre-installed on the pads 171 on the substrate and the electrodes of the LED chip, which can be flexibly selected according to application requirements, and will not be described in detail here.

[0404] Furthermore, in some applications of this embodiment, corresponding solder pads can be provided on the backside of the substrate as needed, based on the frontside solder pads 171 and solder paste 172. The solder paste 172 can be pre-applied to the soldering pads on the backside of the substrate, or can be applied without pre-applied solder paste 172, and the substrate 17 can then be used to fabricate a double-sided light-emitting display module.

[0405] The present embodiment also provides a display module that can be used as a display panel in the display field and as an illumination source in the lighting field. This includes the substrates shown in the examples above, as well as LED chips. The electrodes of the LED chips are welded to the pads via solder paste, which covers the pads. Because melanin is present on the top surface of the solder paste, the solder paste on the pads turns silver, which can reflect light and reduce contrast.

[0406] For example, examples of display modules are shown in Figures 8-4 and 8-5. Figure 8-5 shows a schematic diagram of the welding structure of a single LED chip on the substrate of Figure 8-4. The display module includes a substrate as shown in FIG. 8-3, and also includes a plurality of light-emitting units arranged on the front surface of the substrate, each light-emitting unit including at least one LED chip 27, and the electrode 271 of each LED chip 27 is welded to a corresponding pad 171 via solder paste. When the solder paste is heated and melted, the metal solder in the solder paste sinks and adheres to the pads 171 and the electrodes 271 of the LED chip 27 , respectively, to form a metal solder layer 174 . The melanin in the solder paste is relatively squeezed by the sedimentation process of the metal solder, causing it to rise and eventually be pushed out to the top surface of the solder paste, thereby forming a melanin layer 175 attached to the top surface of the solder paste, which makes the area on pad 171 appear black. Referring to the actual reference diagram shown in Figure 8-6, the top surface on the pad is not a silver outer top surface but a black melanin layer 175. The LED chip 27 shown in Figures 8-4 and 8-5 is a flip chip and can be replaced with other types of LED chips.

[0407] In this embodiment, when the display module shown in Figure 8-6 is used as a display panel, in order to realize color display, the light-emitting units in the display module can be configured as pixels to support the emission of red light, green light, and blue light. In this embodiment, a group of LED chips arranged at the same pixel point can be called a light-emitting unit, as shown by K in Fig. 8-6. Therefore, in this embodiment, one light-emitting unit may include three LED chips 27 in some cases, but may also include more LED chips 27 in other cases.

[0408] 8-7, in some embodiments of this embodiment, the display module may include a display module disposed in front of the main body of the substrate, with an encapsulation layer 38 covering each LED chip 27. The encapsulation layer 38 in this embodiment may be the encapsulation layer shown in the above embodiment, but is not limited thereto. The light transmittance of the encapsulation adhesive layer may be 30% to 100%, and the thickness thereof may be 20 μm to 1000 μm, but is not limited thereto. For ease of understanding, this embodiment also provides a method for manufacturing a display module, including, but not limited to, the following embodiments, as shown in FIG. 8-8 :

[0409] Step a6: Prepare the substrate, the LED chip 27, and the solder paste.

[0410] 8-8, step a6, the exemplary substrate includes a substrate 17, a pad 171 provided on the substrate 17, and a black shield layer 173. The black shield layer 173 may be lower than the pad 171, may be flush with the soldering pad 171, or may be higher than the pad 171. In addition, in this embodiment, the LED chip 27 is a flip-chip chip.

[0411] Step b6: Solder paste is placed between the electrodes and pads of the LED chip 27.

[0412] In this example, disposing the solder paste between the electrodes and pads of the LED chip 27 includes at least one of the following:

[0413] That is, the solder paste is set on the electrodes of the LED chip 27.

[0414] The solder paste is placed on the pads of the substrate.

[0415] For example, as shown in step b6 of Fig. 8-8, solder paste 172 is provided on each pad 171 on the front side of the substrate 17. In this example, you can choose not to provide solder paste on the electrodes of the LED chip 27, or you can choose to provide solder paste on the electrodes of the LED chip 27 according to requirements.

[0416] Step c6: The electrodes of the LED chip 27 are aligned with the pads.

[0417] It should be understood that various chip transfer methods can be used in this step, but are not limited to these. For example, material transfer involves transferring the LED chips 27 to the substrate and aligning them with the corresponding pads. An example of alignment setup is shown in step c6 of FIG. 8-8. The electrodes 271 of each LED chip 27 are aligned with the corresponding pads 171 on the substrate 17, and the solder paste 172 is positioned between the corresponding pads 171 and the electrodes 271.

[0418] Step d6: The solder paste is heated to solder the electrodes of the LED chip 27 to the pads, and the solder paste then covers the solder pads, and the melanin is squeezed onto the top surface of the solder paste.

[0419] For example, as shown in step d6 of FIG. 8-8, the electrodes 271 of each LED chip 27 are welded to the corresponding pads 171 via solder paste. When the solder paste is heated and melted, the metal solder in the solder paste sinks and adheres to the solder pads 171 and the electrodes 271 of the LED chip 27, forming a metal solder layer 174. As the metal solder sinks, the melanin in the solder paste is squeezed relatively and rises to the surface, eventually being pushed out to the top surface of the solder paste, forming a melanin layer 175 on the top surface of the solder paste, making the area above the soldering pads 171 appear black.

[0420] Step e6: Form a sealing layer on the substrate.

[0421] For example, as shown in step e6 of FIG. 8-8, the encapsulation layer 5 can be formed on the front surface of the substrate by, but not limited to, molding, coating, or other methods.

[0422] The manufacturing method of the display module provided by this embodiment does not require the adoption of any other special process in the manufacturing process, and does not require the original manufacturing process route to be changed, making the manufacturing process simple and convenient. In the manufactured display module, the upper surface of each pad on the substrate is covered with the melanin layer 175 and appears black, thereby improving the contrast of the display module, thereby improving the display or lighting effect. In addition, since there is no need to provide a black adhesive layer on the upper surface of the LED chip 27, the light transmission loss rate of the LED chip 27 is reduced, and the power consumption and heat generation of the LED chip 27 can be reduced.

[0423] Eighth embodiment

[0424] After the LED chip 27 is soldered to the substrate via the pad, some of the pad is not covered by the LED chip 27. During the welding process, the solder paste melts and turns silver, covering the top surface of the pad. Because silver has reflective properties, the display is not dark enough when the screen is black, reducing the display contrast and affecting the display effect. This embodiment provides another display module and manufacturing method thereof that can solve the technical problem. Furthermore, the display module and manufacturing method of this embodiment can be implemented independently of other embodiments.

[0425] The manufacturing method of the display module provided in this embodiment includes, but is not limited to:

[0426] Step a7: Install multiple light-emitting units on the upper surface of the substrate. In this embodiment, multiple pads are provided on the front surface of the substrate to electrically connect with the electrodes of the light-emitting units. The pads can be distributed in a matrix, but other distribution methods can also be used as needed, and this embodiment is not limited to this. In some examples of this embodiment, the material of the pads may be, but is not limited to, copper, silver, gold, etc. In this embodiment, the pads on the front side of the substrate may be used to electrically connect to the electrodes of the light-emitting units, but is not limited to this. In addition, the electrodes of the light-emitting units may be electrically connected to the corresponding pads via, but is not limited to, solder and conductive adhesive. The light-emitting unit and the substrate in this embodiment may refer to the light-emitting unit and the substrate in the above example, but are not limited thereto, and a repeated description will be omitted. In this embodiment, the light-emitting unit includes a plurality of LED chips 27. Specific arrangements of the LED chips 27 include a Z-shaped arrangement, a linear arrangement, a centrally symmetric arrangement, etc., but are not limited thereto in this embodiment.

[0427] Step b7: A black adhesive layer is formed, which in this embodiment is also referred to as a black deposition layer, a black molecular layer 66, or a black optical layer. Black substrate molecules (which in this embodiment can also be referred to as particles) are sputtered onto the front surface of the substrate and the top surface of each light-emitting unit (i.e., the light-emitting surface of the light-emitting unit and all of its side surfaces are covered, the light-emitting surface of the light-emitting unit is the side away from the front surface of the substrate, the back surface of the light-emitting unit is the side closer to the top surface of the substrate, and the side surface of the light-emitting unit is the surface between the light-emitting surface and the back surface), forming a black deposition layer 66 that covers the front surface of the substrate and the front surface of each light-emitting unit.

[0428] In this embodiment, the method for forming the black adhesive layer or black deposition layer 66 is to sputter black substrate particles onto the front surface of the substrate and the top surface of each light-emitting unit. This eliminates the influence of the flatness of the front surface of the substrate and the entire light-emitting unit 28 placed in front of it, and the sputtered molecules are deposited to form a black layer of uniform thickness in the area where the black deposition layer 66 is required, allowing the molecules to be sputtered in any area where the black deposition layer 66 needs to be formed, reducing blind spots that cannot be covered. This ensures uniformity of the formed black sediment layer 66 and reduces the chromaticity difference of the black at each position of the black sediment layer 66, thereby improving the contrast of the display screen produced by the display module of the present application and avoiding spots on the display screen when viewed from the side. At the same time, the sputtering process has low production control difficulty, high yield, and can reduce production costs.For ease of understanding, the present embodiment will be described below with several sputtering process examples.

[0429] Example 1: In a vacuum magnetic flux environment, a magnetic field is used to guide ions to collide with a black substrate. Molecules of the black substrate are uniformly sputtered onto the front surface of the substrate and the upper surface of each light-emitting unit 28. In this manner, a black deposition layer 66 is deposited. An example of the structure of the black deposition layer 66 formed in this example is shown in Figure 9-1. The black deposition layer 66 in this example is deposited from a first molecule 661.

[0430] Example 2: In a vacuum magnetic flux environment, a magnetic field is used to guide ions to collide with at least two black substrates simultaneously. Molecules of the at least two black substrates are uniformly sputtered onto the front surface of the substrate and the top surface of each light-emitting unit 28, depositing a black deposition layer 66. In this embodiment, at least two black substrates are irradiated simultaneously, so that molecules of at least two black substrates can be sputtered in the area where the black deposition layer 66 needs to be formed simultaneously, and then deposited to form a black layer containing a mixture of various molecules. An example of the structure of the black deposition layer 66 formed in this embodiment is shown in Figure 9-2. The black precipitate layer 66 in this example is deposited by simultaneously sputtering a first molecule 661 (from a first black substrate) and a second molecule 662 (from a second black substrate) onto a given area. Of course, this embodiment is not limited to sputtering molecules from two black substrates to deposit (evaporate) the black layer, and it is also possible to sputter molecules from three or more black substrates if necessary, but this will not be described in detail here.

[0431] Example 3: In a vacuum magnetic flux environment, a magnetic field is used to guide ions to collide with at least two black substrates in succession, and molecules of the at least two black substrates are uniformly sputtered onto the front surface of the substrate and the top surface of each light-emitting unit 28, depositing a black deposition layer 66. In this embodiment, at least two black substrates are irradiated in sequence, so that the molecules of the at least two black substrates can be sequentially sputtered in the area where the black deposition layer 66 needs to be formed, and then deposited to form a black layer containing the molecules. An example of the structure of the black deposition layer 66 formed in this embodiment is shown in Figure 9-3. In this embodiment, a magnetic field can be used to guide the ions to collide with the first black substrate during time period t1, and first molecules 661 of the first black substrate are uniformly sputtered onto the front surface of the substrate and the top surface of each light-emitting unit 28 to form a first molecular sublayer. Next, a magnetic field is used to guide the ions to collide with the third black substrate during time period t2, and third molecules 663 of the third black substrate are uniformly sputtered onto the front surface of the substrate and the top surface of each light-emitting unit 28 to form a second molecular sublayer. In the final period t3, a magnetic field is used to guide the ions to collide with the second black substrate, and second molecules 662 on the second black substrate are uniformly sputtered onto the front surface of the substrate and the top surface of each light-emitting unit 28, forming a third molecular sublayer. It should be noted that this embodiment is not limited to sequentially sputtering three black substrate molecules to deposit a black layer, and two or more black substrate molecules can be successively sputtered to deposit a black layer according to requirements, and in this example, the above molecular sublayers can be alternately arranged. For example, the first molecule 661 and the second molecule 662 can alternately form corresponding molecular sublayers, but this example will not go into detail. Furthermore, the exchange of different target materials in this embodiment can be, but is not limited to, manual exchange or automatic device exchange.

[0432] According to the above embodiment, it can be understood that the sputtering process in this embodiment can be, but is not limited to, a magnetron sputtering process, and the consistency and coverage of the formed black deposition layer 66 can be easily controlled, and the produced black deposition layer 66 has a high yield, high efficiency, and low cost. In this embodiment, the black precipitate layer 66 may be deposited by one type of molecule, or may be formed by mixed deposition of two or more types of molecules (see, for example, Figure 9-2) or layered deposition (see, for example, Figure 9-3). Therefore, the black sediment layer 66 can be flexibly set according to the requirements of the light transmittance and blackness of the black sediment layer 66 in a specific application case. In particular, the black precipitate layer 66 in the second and third embodiments described above includes at least two kinds of molecules, and the blackness and light transmittance of the black precipitate layer 66 can be flexibly adjusted according to application requirements, thereby improving the display effect and ensuring contrast. At the same time, this embodiment is not limited to using a magnetron sputtering process, and other sputtering processes that can realize the black precipitate layer 66 can equally be used, but this embodiment is not limited thereto.

[0433] The black substrate in this embodiment can be flexibly selected. For example, in some examples, the black substrate in this embodiment can include, but is not limited to, at least one of an oxide, a silicide, a nitride, and a composite material. The composition in this embodiment can be, but is not limited to, at least two of an oxide, a silicide, and a nitride. For example, in this application example, at least one of an AZO substrate, a SiO2 substrate, a SiO substrate, a SiC substrate, a Si3N4 substrate, or a composite substrate of at least two of the above substrates can be used, but is not limited thereto. For example, the first molecule 661 in the black sediment layer 66 shown in FIG. 9-2 may be, but is not limited to, a molecule of one of the above substrates, and the second molecule may be another molecule of the above substrates. The first molecule 661, the second molecule 662, and the third molecule 663 of the black precipitate layer 66 shown in Fig. 9-3 may be, but are not limited to, the molecules of the three substrates described above. The oxide substrate, silicide substrate, nitride substrate, and composite substrate exemplified in this embodiment are all conventionally available materials, which are low-cost and highly versatile.

[0434] The thickness of the black precipitate layer 66 manufactured in this embodiment can also be flexibly set according to the requirements for light transmittance and blackness of the black precipitate layer 66. For example, in this application example, the thickness of the formed black precipitate layer 66 is between 2 nanometers and 300 nanometers, which means that the black precipitate layer 66 in this example is an ultra-thin layer. In this way, the overall thickness of the display module is not significantly increased, which can contribute to making the display module ultra-thin.

[0435] Step c7: At least a part of the black adhesive layer or black deposition layer 66 on the light-emitting surface of each light-emitting unit 28 is removed.

[0436] In this embodiment, after forming the black sediment layer 66, at least a portion of the black sediment layer 66 on the light-emitting surface of each light-emitting unit 28 is also removed, thereby ensuring the light-emitting efficiency from the light-emitting surface of each light-emitting unit 28, and when the display module is used as a display screen, the display brightness of the display screen can be guaranteed. It should be understood that in this embodiment, the black sediment layer 66 on the light-emitting surface of the light-emitting unit 28 may be removed entirely or only partially, or if a part is removed, how much of it is removed can be flexibly set according to the needs of a particular case and the light transmittance of the black sediment layer 66. For example, when the black sediment layer 66 is opaque (in this embodiment, opacity is a relative term, for example, if the light transmittance of the black sediment layer 66 is less than 20% or 10%, etc., it can be considered opaque), all of the black sediment layer 66 on the light-emitting surface of each light-emitting unit 28 can be removed. Of course, even if the black precipitate layer 66 is transparent, the black precipitate layer 66 on the light-emitting surface of each light-emitting unit 28 can be entirely removed according to specific requirements. If the black sediment layer 66 is translucent, and only a portion of the black sediment layer 66 on the light-emitting surface of each light-emitting unit 28 is removed, for example, if the thickness of that portion of the black sediment layer 66 before removal is d and the thickness of the black sediment layer 66 after removal is X*d, when the value of X is greater than or equal to 0 and less than 1, the specific value of X can be flexibly determined based on the current requirement for brightness and the light transmittance, blackness and thickness of the black sediment layer 66 itself, and this embodiment does not impose any special restrictions on it.

[0437] In this embodiment, the light transmittance is lowest in the thickest region of the black sediment layer 66. The light transmittance is highest in the thinnest region of the black sediment layer 66, and the light transmittance in the thickest region of the black sediment layer 66 can be set to 30% or more. The specific value can be set according to the requirements of the application, for example, the transmittance can be set to 30% or more and 50% or less according to the requirements of the application, thereby satisfying the requirements of the transmittance, ensuring the display effect, and improving the contrast.

[0438] Of course, in some applications, if desired, only a portion of the black precipitate layer 66 on the upper light-emitting surfaces of some of the light-emitting units 28 can be removed, while the black precipitate layer 66 on the upper light-emitting surfaces of other portions of the light-emitting units 28 is completely removed. In some cases, only a portion of the black sediment layer 66 on the upper light-emitting surfaces of some of the light-emitting units 28 is removed, or the entire black sediment layer 66 on the upper light-emitting surfaces of some of the light-emitting units 28 is removed, and none of the black sediment layer 66 on the upper light-emitting surfaces of the remaining light-emitting units 28 is removed. The specific settings can be flexibly set based on the requirements of the application.

[0439] The method for removing the black sediment layer 66 in this embodiment is not particularly limited. For example, in some application examples, after the black sediment layer 66 is formed, the black sediment layer 66 on the light-emitting surface of each light-emitting unit 28 can be directly removed before proceeding to the next process. It can also be removed by laser removal, but this is not a limitation. Laser removal has the advantages of high efficiency, high precision, mature technology, and low cost. In this application example, a laser can be used to directly remove at least a portion of the black sediment layer 66 on the light-emitting surface of each light-emitting unit 28. For example, a laser can be used to irradiate the black sediment layer 66 on the light-emitting surface of each light-emitting unit 28, thereby removing at least a portion of the black sediment layer 66 on the light-emitting surface of each light-emitting unit 28.

[0440] Another embodiment may include forming a sacrificial sealing layer on the black sedimentary layer 66 before removing at least a portion of the black sedimentary layer 66 on the light-emitting surface of each light-emitting unit 28, where the sacrificial sealing layer is an adhesive layer. In this embodiment, removing at least a portion of the black precipitated layer 66 on the light-emitting surface of each light-emitting unit 28 may include: The sacrificial encapsulating layer on the light-emitting surface of each light-emitting unit 28 is removed together with at least a portion of the black precipitated layer 66 on the light-emitting surface of each light-emitting unit 28. In this application example, processes such as, but not limited to, grinding and plasma etching can be used. The sacrificial encapsulation layer on the light-emitting surface of each light-emitting unit 28 is removed together with at least a portion of the black precipitated layer 66 on the light-emitting surface of each light-emitting unit 28. Processes such as grinding and plasma etching also have the advantages of high efficiency, high precision, mature process, and low cost. Of course, this embodiment is not limited to removing at least a portion of the black sediment layer 66 on the light-emitting surface of each light-emitting unit 28, and at least a portion of the black sediment layer 66 in other regions may be removed depending on the situation. For example, it is necessary to remove at least a portion of the black sediment layer 66 of the light-emitting unit 28, and it is necessary to remove the black sediment layer 66 on one side.

[0441] In this embodiment, when it is necessary to remove all of the black sediment layer 66 on the light-emitting surface of each light-emitting unit 28, as an alternative process, before the above step b7, a mask of a corresponding shape is used to cover the light-emitting surface of each light-emitting unit 28 and expose other areas on the mask where the black sediment layer 66 needs to be formed, so that in step c7, the black sediment layer 66 is formed directly without covering the light-emitting surface of each light-emitting unit 28, and the process of removing the black sediment layer 66 is not required in this replacement process. However, this method of using a mask requires the manufacture of an additional mask, which is costly and inefficient, and the manufacturing accuracy of the mask directly affects the coating accuracy of the black sediment layer 66, making it more difficult to control the accuracy by removing all or part of the mask as needed compared to directly forming the black sediment layer 66 on the light-emitting surface of each light-emitting unit 28. Of course, this replacement process does not address the requirement to form a black deposition layer 66 on the light-emitting surface of each light-emitting unit 28, further limiting its applicability.

[0442] Step d7: A sealing layer, which is a light-transmitting layer that covers the black deposition layer 66 on the front surface of the substrate and each of the light-emitting units 28, is formed.

[0443] The forming process and material of the first sealing layer in this embodiment can be flexibly set and are not limited to this embodiment. For example, in several embodiments, the first sealing layer may be an adhesive layer, but is not limited to this, and the forming method can be, but is not limited to, coating, molding, printing, pre-filming, mounting, etc. The first encapsulating layer in this embodiment can protect the light-emitting units 28 and the black sedimentary layer 66. For example, in some applications, the first encapsulating layer can be a transparent encapsulating adhesive layer using a transparent epoxy adhesive, which provides encapsulating protection for the light-emitting units 28 and the black sedimentary layer 66 on the substrate. In some applications, at least one of white powder (e.g., including but not limited to SiO2 powder), melanin, light conversion particles (phosphors, quantum dots, etc.), light diffusion particles, etc. can be added to the transparent epoxy adhesive as needed to further adjust the light-emitting effect of the display module. In this embodiment, the upper surface of the first sealing layer (i.e., the area away from the front surface of the substrate) The surface of the first encapsulation layer can be set to a matte surface, bright surface, frosted surface, matte surface, etc. as needed, realizing various appearance and light effects, further enhancing the display effect and improving user experience satisfaction.

[0444] For ease of understanding, this embodiment will describe the manufacturing process of the display module provided in this embodiment with reference to the accompanying drawings. An example of the manufacturing process of the display module is shown in Figure 9-4, which includes but is not limited to:

[0445] Step a8: Arrange a plurality of light-emitting units 28 on the front surface of the substrate 18. In this embodiment, the substrate 18 is a display substrate, and at least two LED chips 281 constitute the light-emitting unit 28. For example, the light-emitting unit 28 includes three LED chips 281 that emit red, blue, and green light, respectively.

[0446] Step b8: Black base material molecules are sputtered onto the front surface of the substrate 18 and the upper surface of each light-emitting unit 28. A black deposition layer 66 covering the front surface of the substrate 18 and the front surface of each light-emitting unit 28 is formed. For example, see Figure 9-7. In this example, a first black substrate J1 (such as a SiC substrate) and a second black substrate J2 (such as a SiN substrate) are used. In a vacuum environment, the first black substrate J1 and the second black substrate J2 are placed on a mounting table as targets. The front side of the substrate 18 and the light-emitting units 28 provided on the front side thereof are positioned facing the first black substrate J1 and the second black substrate J2. Ions Q are induced to collide with the first black substrate J1 and the second black substrate J2 simultaneously. First molecules 661 and second molecules 662 of the first black substrate J1 and the second black substrate J2 are sputtered onto the upper surface of the substrate 18 and the upper surfaces of the light-emitting units 28, respectively, to form a black deposition layer 66 similar to that shown in Figure 9-2.

[0447] Step c8: Remove all of the black sediment layer 66 on the light-emitting surface of each light-emitting unit 28. For example, but not limited to, laser removal may be used to remove all of the black sediment layer 66 on the light-emitting surface of each light-emitting unit 28, leaving the black sediment layer 66 in other areas. Of course, in this example, if the black sediment layer 66 is translucent, only a portion of the black sediment layer 66 on the light-emitting surface of each light-emitting unit 28 may be removed based on specific application requirements.

[0448] Step d8: Form the black deposition layer 66 on the front surface of the substrate 18 and the first sealing layer 39 covering each light-emitting unit 28.

[0449] Other exemplary display module manufacturing processes are shown in Figure 9-5, including but not limited to:

[0450] Step a9: A plurality of light-emitting units 28 are provided on the front surface of the substrate 18.

[0451] Step b9: Sputtering black substrate molecules onto the front surface of the substrate 18 and the upper surface of each light-emitting unit 28 to form a black deposition layer 66 covering the front surface of the substrate 18 and the upper surface of each light-emitting unit 28. For example, see FIG. 9-8. In this example, a third black substrate J3 (such as a SiO substrate) is used, and the third black substrate J3 is placed on a mounting table as a target in a vacuum environment. The front surface of the substrate 18 and the light-emitting units 28 provided on its upper surface are arranged facing the third black substrate J3, and guide ions Q are bombarded onto the third black substrate J3, causing third molecules 663 of the third black substrate J3 to be sputtered onto the front surface of the substrate 18 and the upper surfaces of the light-emitting units 28, forming a black deposition layer 66 similar to that shown in FIG. 9-1.

[0452] Step c9: Form a sacrificial sealing layer 664 on the black deposition layer 66. The sacrificial sealing layer 664 in this embodiment may be made of the same material and forming process as the first sealing layer 39 described above, or other forming methods may be used, which will not be described again here.

[0453] Step d9: Remove all of the sacrificial sealing layer 664 on the exhaust side of each light-emitting unit 28 and the black precipitate layer 66 on the light-emitting surface of each light-emitting unit 28. For example, but not limited to, a plasma etching process can be used to remove the sacrificial sealing layer 664 on the light-emitting surface of each light-emitting unit 28, and the black precipitate layer 66 on the light-emitting surface of each light-emitting unit 28 is completely removed. Of course, in this embodiment, if the black sediment layer 66 is translucent, only a portion of the black sediment layer 66 on the light-emitting surface of each light-emitting unit 28 can be removed based on specific application requirements. In addition, the above plasma etching process can be replaced with a grinding process or a laser removal process, if necessary.

[0454] Step d9: Form the first sealing layer 39 on the sacrificial sealing layer 664. The material and forming process of the first sealing layer 39 are the same as those described in the above example, and therefore will not be described again here.

[0455] Other display module manufacturing processes are shown in Figure 9-6, including but not limited to:

[0456] Step a10: A plurality of light-emitting units 28 are provided on the upper surface of the substrate 18.

[0457] Step b10: Sputter black substrate particles onto the front surface of the substrate 18 and the upper surface of each light-emitting unit 28 to form a black deposition layer 66 covering the front surface of the substrate 18 and the upper surface of each light-emitting unit 28.

[0458] In this embodiment, a first black substrate J1, a second black substrate J2, and a third black substrate J3 are used, and in a vacuum environment, first, the first black substrate J1 is set on a mounting table as a target, and the front surface of the substrate 18 and the light-emitting units 28 provided on the front surface are arranged to face the first black substrate J1, and ions Q are induced to collide with the first black substrate J1, sputtering the first molecules 661 of the first black substrate J1 onto the front surface of the substrate 18 and the upper surfaces of each light-emitting unit 28. Next, the first black substrate J1 is replaced with a second black substrate J2 and the above procedure is repeated, and finally, the second black substrate J2 is replaced with a third black substrate J3 and the above procedure is repeated to obtain a structure of the black deposition layer 66 similar to that shown in Figure 9-3 above.

[0459] Step c10: Form a sacrificial sealing layer 664 on the black deposition layer 66. In this example, the sacrificial sealing layer 664 can be made using the same material and forming process as the first sealing layer 39 described above, and other forming methods can also be adopted, but will not be described in detail here.

[0460] Step d10: Remove the sacrificial sealing layer 664 on the light-emitting surface of each light-emitting unit 28, along with a portion of the black precipitated layer 66 on the light-emitting surface of each light-emitting unit 28. For example, but not limited to, a grinding process can be used to remove the sacrificial sealing layer 664 on the light-emitting surface of each light-emitting unit 28. The portion of the black precipitated layer 66 on the light-emitting surface of each light-emitting unit 28 is removed. Of course, the black sediment layer 66 in this example is translucent, but referring to Figure 9-6, only a portion of the black sediment layer 66 on the light-emitting surface of each light-emitting unit 28 has been removed, and the thickness of the black sediment layer 66 obtained in this manner on the light-emitting surface of each light-emitting unit 28 is thinner than the thickness of the black sediment layer 66 in other parts. Of course, if all of the black sediment layer 66 on the light-emitting surface of each light-emitting unit 28 is removed, the thickness of the black sediment layer 66 on the light-emitting surface of each light-emitting unit 28 can be considered to be 0, and the rule that the thickness 66 of the black sediment layer on the light-emitting surface of each light-emitting unit 28 is thinner than the thickness of the black sediment layer 66 in other parts is also satisfied. In addition, the above grinding process can be replaced by a plasma etching or laser removal process if necessary.Furthermore, in this example, assuming that the light transmittance of the black precipitation layer 66 in the thickness region is greater than 30%, the thickness of the black precipitation layer 66 in the thickness region is correspondingly thinner than that of the thickness region, so that the light transmittance of the thickness region is higher than that of the thickness region, thereby meeting the requirements of luminous efficiency, ensuring the display effect, and improving the contrast.

[0461] Step e10: Form a first sealing layer 39 on the sacrificial sealing layer 664. The material and forming process of the first sealing layer 39 are the same as those described in the above example, and will not be described again here.

[0462] 9-5 and 9-6, after the black deposition layer 66 is formed on the light-emitting surface of each light-emitting unit 28, a sacrificial sealing layer 664 is formed on the black deposition layer 66. This provides strong support around each light-emitting unit 28, resulting in a more integrated sealing structure. Next, when the sacrificial sealing layer 664 on the light-emitting surface of each light-emitting unit 28 is removed together with at least a portion of the black precipitate layer 66 on the light-emitting surface of each light-emitting unit 28, the support effect of the sacrificial sealing layer around the light-emitting unit 28 improves workability when performing processing such as grinding or plasma etching. This makes it less likely that the light-emitting units 28 will fall off, and the black precipitate layer 66 on the top surface of the light-emitting units 28 can be removed more uniformly.

[0463] This embodiment provides a display module, which may be manufactured by the display module manufacturing method described above, but is not limited thereto. The display module includes a substrate and a plurality of light-emitting units 28 disposed on the front side of the substrate. A black precipitated layer 66 is deposited on the front side of the substrate and on the upper surface of each light-emitting unit 28, and the thickness of the black precipitated layer 66 on the light-emitting surface of each light-emitting unit 28 is thinner than the thickness of the black precipitated layer 66 in other locations. A light-transmitting first encapsulating layer is disposed on the front side of the substrate, covering the black precipitated layer 66 and each light-emitting unit 28. In this embodiment, the thickness of the black sediment layer 66 can be 2 nanometers or more and 300 nanometers or less, and the thickness of the black sediment layer 66 can be 0 nanometers or more and 300 nanometers or less. When the thickness of the black sediment layer 66 is equal to 0, the black sediment layer 66 can be opaque or translucent. When the thickness of the black sediment layer 66 is greater than 0, the black sediment layer 66 becomes transparent, and its translucency can be flexibly set. For example, but not limited to, it can be set to 30% or more and 50% or less to improve contrast while ensuring display brightness. For ease of understanding, this embodiment will be described below with reference to schematic structural diagrams of several exemplary display modules.

[0464] Referring to the display module shown in Fig. 9-9, which can be manufactured through, but is not limited to, the manufacturing process shown in Fig. 9-4, it includes a substrate 18, and a plurality of soldering pads are provided on the front surface of the substrate 18. The electrodes of the LED chip 281 included in each light-emitting unit 28 are electrically connected to the corresponding pads by soldering with solder paste or conductive adhesive. The display module includes a black precipitated layer 66 deposited on the front surface of the substrate 18 and on the top surface of each light-emitting unit 28. In this example, the thickness of the black precipitated layer 66 on the light-emitting surface of each light-emitting unit 28 is zero, and the thickness of the black precipitated layer 66 elsewhere is between 2 nanometers and 300 nanometers. For example, it may be, but is not limited to, 10 nanometers, 50 nanometers, 100 nanometers, 200 nanometers, 300 nanometers, etc. The display module is disposed on the front of the substrate 18, and the black deposition layer 66 and each light-emitting unit 28 are covered with a first encapsulation layer 39, which in this example is a transparent adhesive layer or an adhesive layer mixed with at least one of melanin, light-diffusing particles, and light-converting particles (quantum dots and / or phosphors).

[0465] 9-10, compared with the display module shown in FIG. 9-9, the main difference is that the thickness of the black deposition layer 66 on the light-emitting surface of each light-emitting unit 28 is greater than 0. Also, the display module of this example The module is also manufactured through the manufacturing process shown in Fig. 9-4 above, but is not limited to this. However, in Fig. 9-4, when removing the black precipitate layer 66 on the light-emitting surface of the light-emitting unit 28, only a part of it is removed, not the whole.

[0466] Referring to another example of a display module shown in FIG. 9-11, compared with the display module shown in FIG. 9-9, the main difference is that there is also a sacrificial sealing layer 664 between the black deposition layer 66 and the first sealing layer 39. The display module of this example can be manufactured by, but is not limited to, the manufacturing process shown in FIG. 9-5. And the sacrificial sealing layer 664 in this example can be a transparent adhesive layer, or a sealing layer including at least one of melanin, light-diffusing particles, light-converting particles, etc., but is not limited to this embodiment.

[0467] It can be seen that the black deposition layer in the display module provided by this embodiment is formed by sputtering and depositing black substrate molecules on the front surface of the substrate and the upper surface of each light-emitting unit, which allows the black substrate molecules to be sputtered in various locations where the black deposition layer needs to be formed, and is no longer limited by the flatness of the area where the black deposition layer is formed, allowing the black deposition layer to achieve coverage with fewer dead corners. In addition, the formed black sediment layer is uniform, which reduces the chromaticity difference of the black at each position in the black sediment layer, thereby improving the contrast of the display screen using this display module and preventing the occurrence of luminous speckles due to the side viewing angle of the display screen. The sputtering process can reduce production costs by at least partially removing the black precipitate layer on the light-emitting surface of each light-emitting unit, thereby ensuring the light-emitting efficiency of each light-emitting unit, improving the brightness of the display screen of the display module, and ensuring the display effect of the display module.

[0468] This embodiment also provides a display screen including at least one display module according to the above embodiment, and also includes a driving element. The driving element is disposed on the rear or front side of the substrate of the display module and electrically connected to each light-emitting unit. The driving element in this embodiment can drive the display module using an AM active driving method or a PM passive driving method. For ease of understanding, this embodiment will be described below using an LED display screen using the display module shown in Figures 9-9 as an example. As shown in Figures 9-12, the driving components 48 of the display screen are arranged on the back surface of the substrate 18. They are electrically connected to each light-emitting unit 28 on the front side of the substrate 18 to drive the LED chips in each light-emitting unit 28. In addition, in multiple applications of this example, other electronic components besides the light-emitting units 288 can also be flexibly arranged on the front and / or back surface of the substrate 18. The provided electronic components include, but are not limited to, resistors, capacitors, etc., and can be selected according to application requirements.

[0469] Ninth embodiment

[0470] When the LED chip is soldered to the substrate via the pad, the solder paste melts and turns silver, covering the top surface of the pad. Because silver has reflective properties, the display may not be dark enough when the screen is black, reducing the display contrast and affecting the display effect. This embodiment also provides other encapsulation layers, display modules, and manufacturing methods that can solve technical problems, and this embodiment can be implemented independently of other embodiments.

[0471] The second encapsulating layer provided in this embodiment comprises a composite including multiple sub-layers, including a second encapsulating layer that is a semi-transparent layer (also called a one-way see-through layer), which can be used in display modules and optical devices to improve the display contrast and display effect of the display module. Figure 10-2 shows a schematic structural diagram for illustrating and understanding the one-way perspective arrangement of the second sealing layer 310 of the present invention based on the optical path principle, and is a schematic diagram that differs from the actual situation.The second sealing layer 310 includes a reflective layer 3101 and a black adhesive layer 3102 provided on the reflective layer 3101.

[0472] The reflective layer 3101 includes reflective particles 301 and gaps between the reflective particles 301 , which form first light-transmitting channels 302 for light to pass through the reflective layer 3101 . A schematic structural diagram of one example of the reflective layer 3101 is shown in Figure 10-3. It includes reflective particles 301 tiled on the support surface of the carrier (i.e., the attachment surface of the reflective layer 3101) and gaps between the reflective particles 301, which form first light-transmitting channels 302. The reflective particles 301 in this embodiment may be in the form of molecules or other particles, and may be disposed on the supporting surface through, but not limited to, a mature vacuum ion plating or vapor deposition process, which is easy to produce, low-cost, and has good controllability. The reflective particles 301 in this embodiment may include at least one of various metal optical particles (e.g., nano-sized aluminum alloy particles, silver nitrate particles, Ag particles, Al particles, Rh particles, Cr particles, Pt particles, Cu particles, Au particles, and Ti particles, but are not limited thereto, and preferably include at least one of aluminum alloy particles and silver nitrate particles, which are low-cost, highly reflective, and highly versatile) that can have specific light reflective properties, and non-metal optical particles (e.g., nano-sized TiOz particles, ZnO particles, BaSO4 particles, and AlzO3 particles, but are not limited thereto). The reflective particles 301 in this embodiment may be particles having a nanometer particle size, and the particle size of the reflective particles 301 determines the thickness of the reflective layer 3101. For example, but not limited to, in some applications, the reflective particles 301 may be particles having a particle size of 2 nm to 300 nm, and the corresponding thickness of the formed reflective layer 3101 is 2 nm to 300 nm. By setting the thickness of the reflective layer 3101 at the nanometer level, the contrast can be improved, and at the same time, it can further contribute to reducing the thickness of the display module, and further contribute to the ultra-thin design of the display module. In some applications, the reflective particles 301 may specifically be particles having a particle size of 100 nanometers to 300 nanometers. The corresponding thickness of the reflective layer 3101 is 100 nanometers to 300 nanometers, and the diameter of the reflective particles 301 is, for example, 100 nanometers, 150 nanometers, 200 nanometers, 250 nanometers, 300 nanometers, etc. Correspondingly, it should be understood that the width and height (i.e., gap) of each first light-transmitting channel 302 in this embodiment is also nanometer-sized.

[0473] In this embodiment, as shown in FIGS. 10-2 and 10-3, the first light-transmitting channels 302 of the reflective layer 3101 form a matrix-like distribution. To improve contrast while ensuring good luminous efficiency that meets the needs of the display, in this embodiment, the first light-transmitting channels 302 are particle gaps in the reflective layer 3101. In an orthogonal projection of the reflective layer 3101, the area occupied by the first light-transmitting channels 302 is 60% to 70% of the orthogonal projection area of ​​the reflective layer 3101. For example, in some examples, the area ratio can be set to 60%, 65%, 70%, etc. Correspondingly, in the orthogonal projection of the reflective layer 3101, the area occupied by the reflective particles 301 in the reflective layer 3101 is 30% to 40% of the orthogonal projection area of ​​the reflective layer 3101. This configuration can significantly reduce the proportion of the reflective particles 301, thereby reducing the amount of reflective particles 301 used, which helps to reduce costs.

[0474] The black adhesive layer 3102 includes a transparent adhesive base layer, which is used as a carrier base layer for supporting micron-sized glass beads and nano-sized black powder (not shown in FIG. 10-2 ). The transparent adhesive base layer, the micron-sized glass beads 303 dispersed in the transparent adhesive base layer, and the nano-sized black powder filled between the micron-sized glass beads 303, and the nano-sized black powder deposited on each micron-sized glass microsphere 303 form a black light-blocking unit 304. Each micron-sized glass microbead 303 constitutes a second light-transmitting channel through which light passes through the black adhesive layer 3102. In this example, the position of at least a portion of the second light-transmitting channel can be set to correspond to the position of at least a portion of the first light-transmitting channel 302, so that light can pass through the second sealing layer 310 via the first light-transmitting channel 302 and the second light-transmitting channel located at the corresponding positions. A schematic structural diagram of one example of the third black adhesive layer 3102 is shown in Figure 10-4, which includes a transparent adhesive substrate layer 305. Micron-sized glass beads 303 dispersed in the transparent adhesive substrate layer 305, nano-sized black powder dispersed in the transparent adhesive substrate layer 305 and filled between the micron-sized glass beads 303, and the nano-sized black powder are deposited together in the transparent adhesive substrate layer to form a black light-blocking unit 304. In this embodiment, to prevent the nanometer-sized black powder from adhering to the micron-sized glass beads 303 and affecting the light transmittance of the micron-sized glass beads 303, when the black adhesive layer 3102 is produced, the micron-sized glass beads 303 are charged negatively, and the nanometer-sized black powder is also set to have a negative charge. Therefore, the micron-sized glass beads 303 can repel the nano-sized black powder mixed in the transparent adhesive substrate layer 305. That is, the micron-sized glass beads 303 can repel the negatively charged nano-sized black powder, thereby preventing the nano-sized black powder from adhering to the micron-sized glass beads 303, and the second light-transmitting channels formed by the micron-sized glass beads 303 spread on the upper and / or lower surfaces of the black adhesive layer 3102.

[0475] In this embodiment, to ensure that the third black adhesive layer 3102 can improve contrast and ensure a certain luminous efficiency, the volume occupied by the micron-sized glass beads 303 in the third black adhesive layer 3102 can be set to 50% to 70% of the volume of the third black adhesive layer, and the volume ratio can be set to 50%, 55%, 60%, 65%, 70%, etc. In other words, it can be understood that the area occupied by the micron-sized glass beads 303 in the orthogonal projection of the third black adhesive layer 3102 can be 50% to 70% of the orthogonal projection area of ​​the third black adhesive layer.

[0476] In this embodiment, the thickness of the black adhesive layer 3102 can be set to 50 to 100 microns. Setting the thickness of the black adhesive layer 3102 at the micron level can improve contrast, and at the same time, further help reduce the thickness of the semi-transparent layer, which is conducive to an ultra-thin design of the display module. Furthermore, the ratio of the particle size of the micron-sized glass beads 303 to the thickness of the black adhesive layer 3102 can be set to 0.8 to 1.0 so that the micron-level glass beads 303 can form a second light-transmitting channel for light to pass through the black adhesive layer 3102. That is, the particle size of the micron-sized glass beads 303 may be, but is not limited to, 40 microns to 100 microns. For example, in some applications, when the ratio of the particle size of the micron-sized glass beads 303 to the thickness of the black adhesive layer 3102 is set to 0.8, micron-sized glass beads 303 with a particle size of approximately 40 microns are used when the thickness of the black adhesive layer 3102 is 50 microns. When the ratio of the particle size of the micron-sized glass beads 303 to the thickness of the black adhesive layer 3102 is set to 0.9, and the thickness of the black adhesive layer 3102 is 100 microns, micron-sized glass beads 303 with a particle size of approximately 90 microns are used. When the ratio of the particle size of the micron-sized glass beads 303 to the thickness of the black adhesive layer 3102 is set to 1.0, and the thickness of the black adhesive layer 3102 is 100 microns, micron-sized glass beads 303 with a particle size of approximately 100 microns are used. Glass beads can be manufactured from borosilicate raw materials through high-tech processing, and have the advantages of being lightweight, low thermal conductivity, sound insulation, high dispersion, good electrical insulation, good thermal stability, high strength, good chemical stability, and low cost. In addition, the micron-sized glass beads 303 have low thermal conductivity and excellent thermal stability, which can reduce the heat generated when the electronic components on the front side of the board are operating from being released to the outside through the black adhesive layer 3102, thereby ensuring the stability of the black adhesive layer 3102.

[0477] It should be understood that the micron-sized glass beads 303 in this embodiment may be solid glass beads. However, in some applications, the micron-sized glass beads 303 may preferably be hollow micron-sized glass beads 303. Using hollow micron-sized glass beads 303 can further improve the thermal insulation performance of the black adhesive layer 3102, and furthermore, the black adhesive layer 3102 becomes lighter. When micron-sized glass beads 303 having a hollow structure are used, the wall thickness of the micron-sized glass beads 303 may be, but is not limited to, 1 micron to 2 microns. The nano-sized black powder in this embodiment may include, but is not limited to, nano-sized black carbon powder. Nano-sized black carbon powder with a particle size of 1 nm to 100 nm may also be used, but is not limited to this, to ensure the blackness of the black adhesive layer 3102. The transparent adhesive substrate layer 305 in this embodiment can be made of a transparent adhesive, but is not limited to this. Examples of transparent adhesive materials include polyester, polyvinyl chloride, modified epoxy, modified silicone, etc., and have the advantages of being low cost and highly versatile.

[0478] In this embodiment, the side of the black adhesive layer 3102 away from the reflective layer 3101 (i.e., the top surface of the black adhesive layer 3102) can also be treated based on the requirements of visual effect. For example, in some applications, if the black adhesive layer 3102 needs to appear as a black mirror effect, the top surface of the black adhesive layer 3102 can be a smooth top surface. When it is necessary to prevent the black adhesive layer 3102 from exhibiting a black mirror effect, the upper surface of the black adhesive layer 3102 can be configured as an uneven surface. The uneven surface can include, but is not limited to, a matte upper surface, a frosted upper surface, or a rough upper surface with different degrees of texture. By configuring the upper surface of the black adhesive layer 3102 as an uneven surface, light from the external environment may be diffused on the upper surface of the black adhesive layer 3102, reducing the clarity of the LEDs and reducing the interference of ambient light, thereby reducing the black mirror effect on the upper surface of the display module. This eliminates the interference of external ambient light when the display module is lit, ensures high black contrast, and provides a better viewing experience, making it suitable for various applications.

[0479] Based on the specific structure of the semi-transparent layer 310 in the above embodiment, when no light is emitted from the reflective layer 3101 to the black adhesive layer and only light is incident from the black adhesive layer to the reflective layer 3101, part of the incident light, light I1, is reflected by the reflective particles in the reflective layer 3101 and exits through the second transparent channel, and part of the light I3 is reflected by the reflective particles to the nanoscale black powder in the black adhesive layer and absorbed. A portion of the light I2 enters under the reflective layer 3101 through the first light-transmitting channel of the reflective layer 3101, is reflected and / or absorbed multiple times by objects (substrate, light-emitting unit, etc.) under the reflective layer 3101, and is emitted back into the second light-transmitting channel, or is absorbed back into the nanoscale black powder in the black adhesive layer. If the intensity of the light I2 is much smaller than the intensity of the light I1, the area covered with the semi-transparent layer will appear black to the human eye. This allows the contrast to be improved, and conversely, when light of sufficient intensity is emitted from the self-reflective layer to the black adhesive layer, normal display becomes possible, and by utilizing the one-way see-through visual effect of the semi-transparent layer, the display effect can be ensured while improving the contrast.

[0480] For ease of understanding, a specific example of applying the semi-transparent layer to a display module is given below: The display module includes: a substrate and a plurality of pads for electrically connecting with electrodes of light-emitting units on the front surface of the substrate; a plurality of light-emitting units are provided on the upper surface of the substrate, and the electrodes of each light-emitting unit are electrically connected to corresponding pads.

[0481] In this embodiment, the arrangement of the pads on the substrate can be flexibly set. For example, a matrix distribution is possible, and other arrangement methods can be set as needed, but this embodiment is not limited thereto. In this embodiment, at least one of the substrate, bonding pads, and light-emitting units can refer to the above-described embodiments, but is not limited thereto. In several application examples of this embodiment, multiple light-emitting units provided on the substrate can be formed into multiple pixel units.

[0482] The display module of this embodiment also includes a second encapsulation layer disposed on the front surface of the substrate, which in the above example is a semi-transparent layer and covers at least the area on the front surface of the substrate that is not covered by the orthogonal projection of each light-emitting unit. It should be noted that in this embodiment, the second encapsulation layer may be provided on the front surface of the substrate and may be directly attached to the front surface of the substrate, or the second encapsulation layer may be provided indirectly on the front surface of the substrate (i.e., there is another layer structure between the second encapsulation layer and the front surface of the substrate). In this embodiment, the second sealing layer covering at least the area on the front surface of the substrate that is not covered by the orthogonal projection of each light-emitting unit means that on the front side of the substrate, other areas on the front side are covered by the second sealing layer, except for the areas covered by the orthogonal projection of each light-emitting unit on the front side. For example, referring to Fig. 10-1 as an example, Fig. 10-1 shows a substrate 19 of a display module and a plurality of light-emitting units 29 provided on the front surface of the substrate. The area of ​​the upper surface of the substrate 19 that is not covered by the orthogonal projection of each light-emitting unit 29 includes an area indicated as S0 in Fig. 10-1. This can improve the contrast of the display module and enhance the display effect.

[0483] The second encapsulation layer used in this embodiment has a one-way visual perspective effect, that is, when the external ambient light intensity of the display module is 1.5 times or more than the internal ambient light intensity of the display module, the area of ​​the display module covered by the second encapsulation layer appears black to the human eye, thereby improving contrast. On the other hand, when the brightness of the internal light of the display module is greater than 1.5 times the brightness of the external light of the display module, the display module can achieve normal display. For example, as shown in Figure 10-5, when the light-emitting unit is not lit, that is, when the display module is turned off, there is no light in the internal environment. Theoretically, light visible to the human eye is composed of three parts: external ambient light is reflected by the reflective particles in the reflective layer 3101 as light I1; a small portion of the external ambient light enters the internal environment through the corresponding first and second light-transmitting channels, is reflected and absorbed multiple times in the internal environment, and then returns to the external environment as light I2; and the external ambient light is absorbed by the black light-blocking units 304 in the third black adhesive layer, resulting in a visually black I3. According to the principle of one-way perspective, when the brightness of the external ambient light exceeds 1.5 times the brightness of the internal environment, human vision ignores the received internal ambient light, and in Figure 10-5, the light intensity of I2 is much smaller than the light intensity of I1, and at this time, the area covered by the second sealing layer 310 appears black to human vision.

[0484] Please refer to Figure 10-6. When the light-emitting part is turned on, that is, when the display module is displayed, the light-emitting part in the internal environment will generate light, and the light visible to the human eye is theoretically composed of the following five parts: That is, the light is structured as follows: external ambient light is reflected by reflective particles in the reflective layer 3101 as light I1; a small portion of the external ambient light enters the internal environment through the corresponding first and second light-transmitting channels, is reflected and absorbed multiple times in the internal environment, and then returns to the external environment as light I2; external ambient light is absorbed by the black light-blocking units 304 of the third black adhesive layer, and appears visually black as light I3 due to the absorption of light; light I4 is generated by the light-emitting units and directly emitted to the external environment from the corresponding first and second light-transmitting channels; and light I5 generated by the LEDs is reflected and absorbed multiple times by the internal environment, and then emitted to the external environment from the corresponding first and second light-transmitting channels. Generally, the brightness of the display screen can reach 300nit-500nit, achieving a very good display effect. The light emitted by the LED, that is, the light with a brightness of I4+I5, can reach 800nit-2000nit, which is greater than 300nit-500nit, and at this time, the human eye can fully see the content displayed on the LED display.

[0485] As described above, in this embodiment, the second encapsulation layer 310 may be indirectly provided on the front surface of the substrate 19, or may be directly attached to the front surface of the substrate 19. For ease of understanding, this embodiment will be described below with reference to several configuration examples shown in the drawings.

[0486] In an example where the second encapsulating layer 310 is indirectly disposed on the front surface of the substrate, the display module may further include an eleventh encapsulating layer disposed between the front surface of the substrate and the semi-transparent layer. The eleventh encapsulating layer in this embodiment is a transparent layer. The forming process and material of the eleventh sealing layer in this embodiment can be flexibly set and are not limited to this. For example, in several examples, the eleventh sealing layer may be an adhesive layer, but is not limited to this. The forming method can be, but is not limited to, coating, molding, printing, pre-filming, mounting, etc. The eleventh sealing layer in this embodiment has the functions of waterproofing, moisture-proofing, and anti-collision, protecting the light-emitting unit, and also functions as a base for the semi-transparent layer. For example, in some examples, the eleventh sealing layer may be a transparent sealing adhesive layer using a transparent epoxy adhesive, which forms a sealing protection for the light-emitting unit on the substrate. In some applications, at least one of white powder (including but not limited to SiO2 powder), melanin, light-diffusing particles, etc. can be added to the transparent epoxy adhesive as needed to further adjust the light-emitting effect of the display module. In this embodiment, the top surface of the eleventh encapsulating layer (i.e., the front surface of the eleventh encapsulating layer away from the front surface of the substrate) can be matte, bright, frosted, etc. as needed to achieve various appearance and light effects, further enhancing the display effect and improving the satisfaction of the user experience.

[0487] An example structure in which the second encapsulating layer is indirectly disposed on the front surface of the substrate is shown in Figure 10-7. The second encapsulating layer includes a substrate 19, a plurality of light-emitting units 29 disposed on the front surface of the substrate 19, and an eleventh encapsulating layer 311 disposed on the front surface of the substrate 19 and covering each light-emitting unit 29. In this embodiment, the side of the light-emitting unit 29 away from the front surface of the substrate is the light-emitting surface, the side closer to the front surface of the substrate is the bottom surface, and the surface between the top surface and the bottom surface is the side surface. The display module includes a second encapsulating layer 310 formed on an eleventh encapsulating layer 311. In this embodiment, the second sealing layer 310 covers the area on the front surface of the substrate 19 that is not covered by the orthogonal projection of each light-emitting unit 29, and also covers the light-emitting surface of each light-emitting unit 29, i.e., the second sealing layer 310 in this example completely covers the eleventh sealing layer. When the light emitting portion 29 of the display module of this example does not light up, a schematic model of the light path when the screen is off is shown in FIG. 10-8, and a schematic model of the light path when the screen is on is shown in FIG. 10-9. For ease of understanding, the present embodiment will be described below using an example in which a display module is applied to a display screen, in combination with several concepts in the existing display field.

[0488] Existing LCD screen: Refers to the LCD screens currently in common use, with a typical brightness of 350nits and a maximum brightness of up to 500nits. Existing LCD displays have relatively low brightness, but they have a filter within their structure, which contains a super black matrix, allowing the LCD screen to display a high degree of black when the screen is off. The contrast ratio of current LCD screens is the best of all current types of displays. That is, even if the brightness is low, if the ratio between the black brightness when the screen is off and the maximum brightness when the screen is on is large enough, a very high black contrast can be achieved.Normal COB display screens have leakage from the solder pads, so when the screen is off, what the human eye sees is natural light reflected by the silver solder paste on the top of the solder pads, which simply appears as an uneven surface on the solder paste, and since it cannot form a mirror surface, what the human eye sees is a silver top surface. According to the above analysis, the second encapsulation layer 310 provided in this embodiment blocks all silver, and when the screen is turned off, due to the principle of one-way perspective, the human eye can only see the second encapsulation layer 310 to achieve the purpose of blocking the silver pad, and the second encapsulation layer 310 can improve the contrast of black, so that the black becomes very black.

[0489] Figures 10-5 and 10-8 explain the light received by the human eye: When the light-emitting part is not lit (the screen is off), the light received by the human eye is I1 + I2, and I3 is light that is absorbed by black and appears as black to the human eye, so it is represented by a dotted line. If the external natural light is I, I1, I2, and I3 are three parts of the external natural light, some of which are directly reflected by the reflective layer and received by the human eye. That is, part of I1 enters the internal environment and returns to the external environment after multiple reflections and absorptions and is received by the human eye. Part of I2 is directly absorbed by the black, which is I3. Therefore, the outside of I is >1.5×(I1+I2+I3). Therefore, the area covered by the second encapsulating layer 310 appears black to the human eye. When the top surface of the third black adhesive layer 3102 is smooth, the second encapsulating layer 310 visually resembles a black mirror.

[0490] Figures 10-6 and 10-9 illustrate the light perceived by the human eye: when the light-emitting unit is turned on, the LED light is divided into two parts, I4 + I5, which are perceived by the human eye. Referring to the above ratio of the first and second light-transmitting channels, we can see that the minimum value of I4 + I5 can reach more than 50% of the LED's luminance. If the LED's luminance is I, then I > I4 + I5 > 50%L, and within 50%I it can reach 400nit to 1000nit, so I4 + I5 > 300nit, and at this point, the user can already enjoy the full display effect.

[0491] When the top surface of the black adhesive layer 3102 is smooth, the second sealing layer 310 can be visually regarded as a black mirror. First, the principle of mirrors is shown in Figure 10-10. Light from a candle B1 is reflected by the smooth reflective layer of mirror C, and the human eye receives the reflected light. The image presented to the human brain is a candle B2, creating the illusion that there is a candle inside the mirror. This is the principle of specular reflection.

[0492] Referring to Figures 10-5 and 10-9, the micron-sized glass beads in the third black adhesive layer 3102 are glass crystals, and the reflective layer 3101 contains reflective particles. When the light-emitting units are not emitting light, the micron-sized glass beads and reflective particles form a mirror. However, at the same time, the presence of the black light-blocking units 304 in the third black adhesive layer 3102 can be imagined as adding a super-black matrix consisting of the black light-blocking units 304 to the mirror. Here, since the micron-sized glass beads are micron-sized crystals, it appears like a black mirror to the human eye.

[0493] In this embodiment, the upper surface of the third black adhesive layer 3102 is set as a non-smooth surface to form diffuse reflection on the upper surface. As shown in Figure 10-11, if the upper surface of the third black adhesive layer 3102 is smooth, specular reflection will be formed on the upper surface, as shown in Figure 10-11. When the top surface of the third black adhesive layer 3102 is not smooth, such as a rough top surface as shown in Figure 10-12, diffuse reflection as shown in Figure 10-12 is formed on the top surface, but what is seen by the human eye in this case is not a perfect mirror image (which can be understood as a matte screen), but rather the shape of the mirror image is distorted due to diffuse reflection, which can reduce the interference of ambient light and improve the display effect.

[0494] Another structural example in which the second encapsulating layer 310 is indirectly disposed on the front surface of the substrate 19 is shown in Figure 10-13. Compared with the display module shown in Figure 10-7, the main difference is that the thickness of the eleventh encapsulating layer 311 is substantially equal to the height of each light-emitting unit 29, and the light-emitting surface of each light-emitting unit 29 (i.e., the side of the light-emitting unit 29 opposite to the substrate 19) is exposed to the eleventh encapsulating layer 311. The second encapsulating layer 310 located on the light-emitting surface of each light-emitting unit 29 is directly attached to the light-emitting surface of each light-emitting unit 29, and the second encapsulating layer 310 completely covers the upper surface of the eleventh encapsulating layer 311. Another structural example in which the second encapsulation layer 310 is indirectly disposed on the front surface of the substrate 19 is shown in Fig. 10-14. Compared with the display module shown in Fig. 10-7, the main difference is that the thickness of the eleventh encapsulation layer 311 is thinner, and its upper surface is distributed non-uniformly based on the layout of the light-emitting units 29.

[0495] Another structural example in which the second encapsulation layer 310 is indirectly disposed on the front surface of the substrate 19 is shown in FIG. 10-15. Compared with the display module shown in FIG. 10-7, the main differences are as follows: the second encapsulation layer 310 covers the area of ​​the upper surface of the substrate 19 that is not covered by the orthogonal projection of each light-emitting unit 29, and the light-emitting surface of each light-emitting unit 29 is exposed to the second encapsulation layer 310, so the second encapsulation layer 310 does not cover the light-emitting surface of each light-emitting unit 29. In this embodiment, the second sealing layer 310 does not cover the light-emitting surface of each light-emitting unit 29, so most of the light emitted from the upper light surface of each light-emitting unit 29 is emitted directly through the eleventh sealing layer 311 and does not need to pass through the second sealing layer 310, thereby improving the display brightness. 10-16 show an example of a structure in which the second encapsulating layer 310 is directly attached to the front surface of the substrate 19. This structure includes a substrate 19, a plurality of light-emitting units 29 provided on the front surface of the substrate 19, and a second encapsulating layer 310 attached to the front surface of the substrate 19, where the second encapsulating layer 310 covers the area of ​​the front surface of the substrate 19 that is not covered by the orthogonal projection of each light-emitting unit 29, and the light-emitting surface and side surfaces of each light-emitting unit 29 are exposed to the second encapsulating layer 310. Therefore, most of the light emitted from the front and side surfaces of each light-emitting unit 29 is emitted without passing through the second encapsulation layer 310, thereby improving light-emitting efficiency and ensuring display brightness. The display module of this example also includes a twelfth encapsulation layer 312 disposed on the second encapsulation layer 310 and covering each light-emitting unit 29. The material, shape, and formation method of the twelfth encapsulating layer 312 in this embodiment are similar to, but not limited to, the eleventh encapsulating layer 311 in the above embodiment, and therefore will not be described again here. Another structural example in which the second encapsulating layer 310 is directly attached to the front surface of the substrate 19 is shown in FIG. 10-17. Compared with the display module shown in FIG. 10-16, the main difference is that the second encapsulating layer 310 also covers the side surfaces of each light-emitting unit 29, and the upper light surfaces of each light-emitting unit 29 are exposed to the second encapsulating layer 310. Therefore, most of the light from the upper light surfaces of each light-emitting unit 29 is emitted without passing through the second encapsulating layer 310, thereby improving luminous efficiency and ensuring display brightness. Another structural example in which the second encapsulating layer 310 is directly attached to the front surface of the substrate 19 is shown in FIG. 10-18. Compared with the display module shown in FIG. 10-16, the main difference is that the second encapsulating layer 310 also covers the light-emitting surface of each light-emitting unit 29, and the side surface of each light-emitting unit 29 is exposed to the second encapsulating layer 310. Therefore, most of the light from each light-emitting unit 29 can be emitted without passing through the second encapsulation layer 310, improving the light-emitting efficiency and ensuring the display brightness. Another structural example in which the second encapsulation layer 310 is directly attached to the front of the substrate 19 is shown in FIG. 10-19. Comparing this with the display module shown in FIG. 10-16, the main difference is that the second encapsulation layer 310 also covers the side and upper light surfaces of each light-emitting unit 29. Therefore, in this example, the coverage rate of the second encapsulation layer 310 is greater than that of the above example, resulting in a relatively higher black contrast.

[0496] Of course, it should be understood that the structures shown in Figure 10-7, Figure 10-13 to Figure 10-19 are merely examples of structures for ease of understanding, and other equivalent modifications can also be made based on this, for example, an example of a modification is shown in Figure 10-20. Based on the example shown in FIG. 10-17, a second encapsulation layer 310 is also provided on the twelfth encapsulation layer 312. That is, the example shown in FIG. 10-20 includes a double-layered second encapsulation layer 310 to further improve contrast. Of course, when a double-layered second encapsulation layer 310 is provided to ensure luminous efficiency, the light transmittance and blackness of each layer of the second encapsulation layer 310 can be adjusted accordingly, which will not be described again here.

[0497] For ease of understanding, the present embodiment will be described below taking the above-described method for manufacturing a semi-transparent layer as an example, but is not limited to this.

[0498] Step a11: A reflective layer is formed on the support surface of the carrier by a vacuum ion plating or vapor deposition process. For ease of understanding, the following description will be given taking vacuum ion plating as an example. In one example, in a vacuum magnetic flux environment, a magnetic field is used to guide ions to bombard a predetermined reflective material substrate. Molecules of the reflective material base material are uniformly sputtered onto the corresponding areas on the support surface to form a reflective layer. It should be understood that the carrier in this embodiment may be a substrate, and the support surface may be the front surface of the substrate. If the eleventh sealing layer is provided on the substrate, the carrier may be the eleventh sealing layer, and the support surface may be the side of the eleventh sealing layer away from the substrate. Of course, the carrier may also be a connecting adhesive layer provided on the second mounting film. The support surface may be the side of the connecting adhesive layer away from the second mounting film. The bearing body and the corresponding support surface in this embodiment can be flexibly configured based on specific application scenarios, allowing for a wide range of applications and excellent versatility.

[0499] Step b11: Mix micron-sized glass beads and nano-sized black powder evenly into the transparent adhesive to obtain a mixed adhesive. In this step, the micron-sized glass beads and nano-sized black powder are mixed evenly before the transparent adhesive is applied. First, the micron-sized glass beads are added. For example, the micron-sized glass beads can be moved away from the micron-sized glass beads and rubbed against a specific object to be negatively charged. This causes the nano-sized black powder to be negatively charged. For example, carbon black powder is used for nanoscale black powder. Then, negatively charged micron-sized glass beads and nano-sized black powder are mixed uniformly into a transparent adhesive, and the negatively charged micron-sized glass beads and nano-sized black powder repel each other in the transparent adhesive, preventing the nano-sized black powder from adhering to the micron-sized glass beads.

[0500] Step c11: Setting the mixed adhesive layer on the reflective layer, and curing the mixed adhesive layer to obtain a third black adhesive layer.

[0501] It should be understood that in this embodiment, the method of disposing the mixed adhesive layer on the reflective layer may be, but is not limited to, coating, molding, printing, etc. Of course, in some examples, the mixed adhesive layer can be placed on a second mounting film to create a black film. The black film is then attached to the reflective layer. Because the colloids in the mixed adhesive layer have a certain viscosity and tension, they do not flow into the gaps between the reflective particles of the reflective layer, or only a portion of the transparent adhesive flows into them. However, this does not affect the formation of the first light-transmitting channel through the gap.

[0502] For ease of understanding, the present embodiment will be described below taking the above-described example of a manufacturing method for a display module as an example, but is not limited to this.

[0503] Step a12: Install a plurality of light emitting units on the front surface of the substrate, and electrically connect the electrodes of each light emitting unit to the corresponding pads. As mentioned in the above example, the electrical connection can be made via, but is not limited to, solder paste or conductive silver adhesive.

[0504] Step b12: A semi-transparent layer is provided on the upper surface of the substrate, covering at least the front area of ​​the substrate that is not covered by the orthogonal projection of each light-emitting unit.

[0505] For ease of understanding, the present embodiment will be described below together with several specific manufacturing processes of display modules.

[0506] As shown in FIGS. 10-21, the manufacturing process of this embodiment includes, but is not limited to:

[0507] Step a13: A plurality of light emitting units 29 are installed in front of the substrate 19.

[0508] Step b13: An eleventh sealing layer 311 is formed on the front surface of the substrate 19. In this example, the eleventh sealing layer 311 is a transparent adhesive layer.

[0509] Step c13: A reflective layer 3101 having a thickness of 200 nanometers is formed by vacuum ion plating or vapor deposition on the side of the eleventh sealing layer 311 opposite to the substrate 19. That is, in this example, the eleventh sealing layer 311 is the carrier, and the side thereof away from the substrate 19 is the support surface.

[0510] Step d13: The mixed adhesive layer is printed, embossed or coated onto the reflective layer 3101 and cured to obtain the black adhesive layer 3102. The thickness of the black adhesive layer 3102 in this embodiment is 100 microns.

[0511] As shown in Figure 10-22, the manufacturing process in this example includes, but is not limited to:

[0512] Step a14: A plurality of light emitting units 29 are provided on the front surface of the substrate 19.

[0513] Step b14: A reflective layer 3101 is formed on the upper surface of the substrate 19 by vacuum ion plating or vapor deposition. The reflective layer 3101 has a thickness of 200 nanometers and covers both the side and front surfaces of each light-emitting unit 29. That is, in this embodiment, the substrate 19 is the carrier, and the front side of the substrate 19 is the supporting surface.

[0514] Step c14: Print, emboss or coat the mixed adhesive layer onto the reflective layer 3101 and cure it to obtain a black adhesive layer 3102.

[0515] Step d14: A twelfth sealing layer 312 is formed on the black adhesive layer 3102 by printing, molding, or coating. In this example, the twelfth sealing layer 312 is mixed with light conversion particles and / or light diffusion particles.

[0516] 10-23 , the manufacturing process of this embodiment also includes a step of removing at least a portion of the semi-transparent layer on the light-emitting surface of the light-emitting unit 29. Here, the removal method is not limited to laser removal, grinding, plasma etching, etc. Next, a twelfth encapsulating layer 312 is formed on the third black adhesive layer 3102 by printing, molding, or coating, and the twelfth encapsulating layer 312 covers each light-emitting unit 29, including but not limited to the following:

[0517] Step a15: A connecting adhesive layer is set on the second mounting film. The connecting adhesive layer in this embodiment can have various adhesive properties. When heated, the adhesive layer changes from a solidified state to a semi-molten state. For example, a heat-sensitive adhesive layer, a modified epoxy adhesive layer, a modified silicone layer, etc. can be used, and can be flexibly adopted depending on the application, but is not limited to these.

[0518] Step b15: Form a reflective layer on the connecting adhesive layer by vacuum ion plating or vapor deposition process, that is, in this example, the connecting adhesive layer is the carrier, and the side of the connecting adhesive layer away from the second mounting film is the support surface.

[0519] Step c15: Mix the micron-sized glass beads and nano-sized black powder into the transparent adhesive uniformly to obtain a mixed adhesive.

[0520] Step d15: Place the mixed adhesive layer on the reflective layer, and solidify the mixed adhesive layer to obtain a third black adhesive layer.

[0521] Step e15: Remove the second mounting film, cover one side of the connecting adhesive layer on the front side of the substrate, and perform hot pressing.

[0522] For ease of understanding, the present embodiment will be described below together with several specific manufacturing processes of display modules.

[0523] As shown in Figures 10-24, the manufacturing process of this embodiment includes, but is not limited to:

[0524] Step a16: A plurality of light emitting units 29 are installed on the front surface of the substrate 19.

[0525] Step b16: Form an eleventh sealing layer 311 on the front surface of the substrate 19, which in this example is a transparent adhesive layer.

[0526] Step c16: Place a connecting adhesive layer 307 on the second mounting film 306, and the connecting adhesive layer in this example may be, but is not limited to, a heat-sensitive adhesive layer, a modified epoxy adhesive layer, or a modified silicone adhesive layer, etc.

[0527] Step d16: Through vacuum ion plating or vapor deposition process, a reflective layer 3101 is formed on the connecting adhesive layer 307. The thickness of the reflective layer 3101 is 200 nanometers.

[0528] Step e16: Print, emboss or coat the mixed adhesive layer onto the reflective layer 3101 and cure it to obtain a third black adhesive layer 3102. The thickness of the third black adhesive layer 3102 in this example is 100 microns.

[0529] Step f16: The second mounting film 306 is removed.

[0530] Step g16: One side of the connection adhesive layer 307 is covered on the eleventh sealing layer (sealing adhesive layer) 311.

[0531] Step h16: The connecting adhesive layer 307 is adhered to the eleventh sealing layer 311 by, but not limited to, a hot pressing method.

[0532] As shown in FIG. 10-25, the manufacturing process of this example includes, but is not limited to:

[0533] Step a17: A plurality of light emitting units 29 are installed in front of the substrate 19.

[0534] Steps b17 to c17 are the same as steps a16 to a16 in the above example, and in this example, the connection adhesive layer 307 can be a modified epoxy adhesive layer or a modified silicone adhesive layer.

[0535] Step d17: After removing the second mounting film 306, one surface of the connecting adhesive layer 307 is placed on the eleventh sealing layer 311 and pressed together (laminated). Of course, if necessary, a further black adhesive layer can be provided on the black adhesive layer 3102.

[0536] 10-26, steps a18 to d18 of the manufacturing process in this example are similar to steps a17 to d17 in the above example. The difference is that the thickness of the connecting adhesive layer 307 is thicker. Thus, after the second mounting film 306 is removed in step e18, one side of the connecting adhesive layer 307 covers the light-emitting surface of each light-emitting unit 29. Then, in step f18, the adhesive layer 307 is heated and pressurized to adhere to the upper surface of the substrate 19, and the pressed adhesive layer 307 also serves as the first sealing layer. In some application examples, the initial thickness of the adhesive layer 307 before lamination in this example is set to 100 μm or more, and the thickness after being compressed together is 50 μm or more.

[0537] In another example of this embodiment, the positions of the reflective layer 3101 and the black adhesive layer 3102 on the second mounting film 306 can be swapped. For example, the black adhesive layer 3102 can be formed directly on the second mounting film 306. Then, the reflective layer 3101 is formed on the black adhesive layer 3102. During bonding, one side of the reflective layer 3101 is directly attached to the front surface of the substrate 19 or to the sealing layer on the front surface of the substrate 19, thereby obtaining the structures of the above examples. Of course, in some applications, an adhesive layer (the adhesive layer is a light-transmitting layer, such as a transparent adhesive layer) can be provided between the reflective layer 3101 and the front surface of the substrate 19 or the sealing layer on the front surface of the substrate 19, so as to enhance the bonding strength between the reflective layer 3101 and the front surface of the substrate 19 or the sealing layer on the front surface of the substrate 19. This modification is also within the scope of protection of the present invention.

[0538] It can be seen that the manufacturing method of the display module provided by this embodiment is simple, efficient, and highly efficient. This embodiment provides a display screen including at least one display module according to the above embodiment. For ease of understanding, this embodiment will be described below using the display module shown in Figures 10-27 as an example. The driving components 49 of the display screen are disposed on the rear surface of the substrate 19 and are electrically connected to each light-emitting unit 29 on the front surface of the substrate to drive each light-emitting unit 29. In addition, in multiple application examples of this embodiment, other electronic components besides the light-emitting units 29 can also be flexibly arranged on the front and / or rear surfaces of the substrate 19. The provided electronic components include, but are not limited to, resistors, capacitors, etc., and can be selected according to application requirements.

[0539] Tenth embodiment

[0540] This embodiment provides a solution to the problem of the upper surface of the solder pad being covered with silver solder paste. The display module and the manufacturing method thereof can avoid the problem of the black adhesive remaining on the light-emitting surface of the LED chip, which reduces the contrast of the display screen. This embodiment can be implemented independently of other embodiments.

[0541] The manufacturing method of the display module provided in this embodiment includes, but is not limited to:

[0542] Step a19: Create the substrate and packaging layers.

[0543] In this embodiment, the step of manufacturing the substrate includes, but is not limited to, providing a substrate and fixing a plurality of light-emitting units to a front surface of the substrate with a first gap between adjacent light-emitting units. In this embodiment, the light-emitting unit includes multiple LED chips, and the electrodes of each LED chip are welded to corresponding pads on the substrate. The silver outer surface formed by welding the LED chips to the pads of each light-emitting unit is mainly distributed in the first gap f1. In this embodiment, other electronic components can be first disposed on the front and / or back of the substrate. Then, an encapsulation layer is disposed on the substrate. It is also possible to place the light-emitting units and encapsulation layer on the front of the substrate and then place the electronic components on the back of the substrate.

[0544] In this embodiment, creating the encapsulation layer includes providing a black adhesive layer and a fourteenth encapsulation layer that are laminated together. In this example, when creating the encapsulation layer, the black adhesive layer can be formed first. Then, the first encapsulation layer can be formed on the black adhesive layer. Alternatively, the first encapsulation layer can be formed first, and then the black adhesive layer can be formed on the first encapsulation layer. In either case, during lamination by hot pressing, the black adhesive layer faces the front surface of the substrate (i.e., the side of the black adhesive layer away from the first sealing layer faces the front surface of the substrate), and the black adhesive layer and the first sealing layer are pressed together onto the front surface of the substrate. In this embodiment, the processes for forming the black adhesive layer and the first encapsulation layer are not limited. The process used to form the black adhesive layer and the process used to form the first encapsulation layer may be the same or different. Specific processes that may be used include, but are not limited to, coating, silkscreen printing, molding, etc. In this embodiment, the substrate and the encapsulation layer may be manufactured simultaneously, or the substrate may be manufactured first and then the encapsulation layer may be manufactured, or the substrate and / or the encapsulation layer may be purchased directly from the previous process.

[0545] The black adhesive layer and first encapsulation layer formed in this embodiment are in a semi-cured state and can be maintained in that state, facilitating subsequent direct pressing against the front surface of the substrate. This embodiment is not limited to a hot pressing process using colloids. For example, when the formed black adhesive layer and first encapsulation layer are in a certain semi-cured state, they can be directly pressed without heating. This method is also an equivalent alternative to the hot pressing process in this embodiment.

[0546] Step b19: Through a hot pressing process, the black adhesive layer and the first sealing layer are pressed together on the front side of the substrate.

[0547] In this embodiment, after the black adhesive layer and the first encapsulating layer are pressed together on the front surface of the substrate through a hot press process, the black adhesive layer covers the front surface of the substrate and the light-emitting surface of each LED chip, and together forms a lower recess in the first gap between adjacent light-emitting units, and a portion of the first encapsulating layer fills the lower recess and covers at least the lower recess (i.e., covers at least the entire third recess). In this embodiment, the light-emitting surface of each LED chip is on the side away from the front surface of the substrate.

[0548] For example, a black adhesive layer is placed on the front of the substrate and adhered to the light-emitting surface of each LED chip on the front of the substrate, then hot-pressed. During the lamination process, the black adhesive layer and first encapsulating layer are in a semi-cured state. The transparent adhesive layer and first encapsulating layer gradually approach the front of the substrate under pressure, until the black adhesive layer is attached to the front of the substrate, covering each LED chip on the front of the substrate and its light-emitting surface. The black adhesive layer forms a lower recess in the first gap between adjacent light-emitting units. After laminating the first encapsulating layer on top of the black adhesive layer, at least the lower recess is completely filled. This covers the outer surface of the silver on the pad, improving the contrast of the display module and enhancing the display effect. The black adhesive layer covers the light-emitting surface of each LED chip, preventing the first encapsulating layer from coming into contact with the light-emitting surface of the LED chip during the lamination process, preventing light directly emitted by the LED from remaining behind and ensuring the light-emitting characteristics of the LED chip. At the same time, during the lamination process, the black adhesive layer is disposed between the first encapsulation layer and the substrate as a buffer layer, and even if one or more LED chips are tilted on the front side of the substrate during the fixing process, the black adhesive layer can also form a top surface as flat as possible in the area directly above each LED chip. This improves the consistency of each area on the black adhesive layer and the first encapsulation layer after lamination, further improving the consistency of the light-emitting effect. The black adhesive layer and the first encapsulation layer are pressed together on the front of the substrate, eliminating the need to laminate the black adhesive layer and the first encapsulation layer twice, improving production efficiency. The hot-pressing process used is simple and mature, ensuring and improving yield and making it easier to control production costs.

[0549] For ease of understanding, a specific example of a method for manufacturing a display module will be described below as shown in FIG. 11-1.

[0550] Step a20: A sealing layer is prepared, including forming a black adhesive layer 313 and a first sealing layer 314 overlaid on the black adhesive layer 313. Here, the black adhesive layer 313 is also referred to as a black optical layer. In FIG. 11-1 , the first sealing layer 314 is positioned on the black adhesive layer 313. However, during manufacturing, the first sealing layer 314 may be formed first, and then the black adhesive layer 313 may be formed on the first sealing layer 314, or the black adhesive layer 313 may be formed first, and then the first sealing layer 314 may be formed on the black adhesive layer 313.

[0551] Step b20: Prepare a substrate. For example, see the substrate shown in FIG. 11-1. The substrate 110 is provided with a plurality of light-emitting units, and there is a first gap f1 between adjacent light-emitting units. A main portion of the silver outer surface Y formed during the welding process is within the first gap f1.

[0552] Step c20: The black adhesive layer 313 and the first encapsulation layer 314 are laminated on the LED chip 2101 on the front side of the substrate 110, and pressed together using a hot press process, so that the opposite side of the black adhesive layer 313 from the first encapsulation layer 314 faces the substrate 110.

[0553] Step d20: After the black adhesive layer 313 and the first encapsulation layer 314 are pressed onto the upper surface of the substrate 110, the black adhesive layer 313 covers the front surface of the substrate 110 and each LED chip 2101. The black adhesive layer 313 then forms recesses in the gaps between adjacent light-emitting units. A schematic diagram of the recess is shown in Figure 11-2 (Figure 11-2 shows the structure of the display module obtained after removing the black adhesive layer after lamination in step d20 of Figure 11-1), where F11 in Figure 11-2 indicates a lower recess formed in the first gap f1 between adjacent light-emitting units, and the side wall of the lower recess f11 includes an arc surface d formed by the fluidity of the black adhesive layer 313, and the formation of the arc surface d can further increase the bonding area between the black adhesive layer 313 and the first sealing layer 314, thereby improving the adhesive strength between the two.

[0554] 11-1 and 11-2, after pressing in this embodiment, the first encapsulating layer 314 covers each lower recess f11 and each silver outer upper surface Y is covered by the first encapsulating layer 314, thereby improving the contrast of the display module and enhancing the display effect. Each LED chip 2101 is covered by the first encapsulating layer 314, and the black adhesive layer 313 covers the first encapsulating layer 314, but the black adhesive layer 313 does not come into contact with the LED chip 2101. Therefore, no black adhesive layer 313 remains, thereby ensuring the light-emitting properties of the LED chip 2101.

[0555] At the same time, in the above step c20, the black adhesive layer 313 and the first encapsulation layer 314 are pressed together on the front side of the substrate, which simplifies the manufacturing process, improves production efficiency, and the hot pressing process is simple and mature, which ensures and improves yield and makes it easier to control production costs.

[0556] In this embodiment, for ease of understanding, a cross-sectional view of the substrate in another direction is used, but the same manufacturing process as in Figure 11-1 is used as an example. Specifically, referring to Figure 11-3, steps a21 to d21 in Figure 11-3 are the same as steps a20 to d20 in Figure 11-1, respectively, so repeated explanations will be omitted. See step b21 in Figure 11-3. Assuming that the LED chips X1 and X2 are tilted during the welding process, as shown in Figures 11-3 and 11-4 (Figure 11-4 shows the structure of the display module obtained after removing the first encapsulation layer 314 after lamination in Figure 11-3), the black adhesive layer can also form a flat surface Q in the area of ​​the first encapsulation layer 314 directly above the light-emitting surface of the LED chip 2101. The first encapsulation layer 314 is used to compensate as much as possible for the unevenness caused by the tilt of the LED chips X1 and X2, ensuring the consistency of the black adhesive layer 313 between the areas on the first encapsulation layer 314 and improving the consistency of the light-emitting effect of the module.

[0557] 11-1 and 11-3, in this embodiment, each light-emitting unit includes multiple LED chips. In each light-emitting unit 210, a gap f2 is provided between adjacent LED chips 2101, and the width of the gap f2 between the LED chips 2101 is much smaller than the width of the gap f1 between the light-emitting units 210. The specific difference between the two can be flexibly set according to specific embodiments and is not limited here.

[0558] In this example, as shown in Figures 11-3 and 11-4, after the black adhesive layer 313 and the first encapsulating layer 314 are pressed together on the front side of the substrate through a hot pressing process, the area of ​​the first encapsulating layer 314 above the gap f2 between the LED chips forms a recess f12, and the black adhesive layer 313 fills the recess f12 to completely cover the top surface of the first encapsulating layer 314. 11-4, a distance h2 from the lowest point of the recess f12 to the upper surface of the substrate is greater than a distance h1 from the light-emitting surface of the LED chip 2101 to the upper surface of the substrate. Specifically, in this example, the thickness of the first encapsulating layer 314 filled in the recess f12 is greater than the thickness of the LED chip 2101.

[0559] In another embodiment, a distance h3 from the lowest point of the recess f11 formed between the light-emitting units 210 to the upper surface of the substrate 110 is shorter than a distance h1 from the light-emitting surface of the LED chip 2101 to the upper surface of the substrate 110. Specifically, in this example, the thickness of the first encapsulating layer 314 filled in the recess f11 is thinner than the thickness of the LED chip 2101. For example, in some cases, h3 can be set to 2 / 3*h1 or less. This structure allows the thickness of the entire display module to be as thin as possible, contributing to a lighter and thinner display screen, as well as improving the utilization rate of adhesive materials and reducing costs. For example, in some specific display module structures, h3 can be set to 1 / 3*h1, 1 / 2*h1, or 2 / 3*h1, etc., and preferably, h3 can be set to 1 / 2*h1 or more and 2 / 3*h1 or less, thereby easing the requirements for miniaturization of the thickness of the black adhesive layer 313 and the requirements for process accuracy.

[0560] In some applications of this example, the first encapsulation layer 314 can be configured to meet the contrast performance of the display. The first encapsulation layer 314 can also be configured to have a certain light transmittance. In this application, after the display module is manufactured using the manufacturing method shown in FIG. 11-1 or 11-3, the first encapsulation layer 314 does not need to be processed, which simplifies the manufacturing process and improves manufacturing efficiency.

[0561] Of course, in this embodiment, even if the black adhesive layer 313 has light transmission properties, in order to further improve the light-emitting efficiency of the display module, after the display module is manufactured, a portion of the black adhesive layer 313 on the light-emitting surface of the LED chip 2101 can be removed. By removing a portion of the black adhesive layer 313, the black adhesive layer 313 becomes thinner, thereby improving the light-emitting efficiency. After removal, the black adhesive layer 313 still covers the first encapsulation layer 314 on the light-emitting surface of the LED chip 2101, and the top surface of the black adhesive layer 313 is a flat surface. In the display module shown in FIG. 11-5, part of the black adhesive layer 313 can be removed by, but not limited to, grinding and other processes. 11-6 shows a schematic diagram of the partial removal of the black adhesive layer 313 in the display module. After removal, the upper surface of the black adhesive layer 313 still covers the first encapsulating layer 314, the recesses f11, and the recesses f12 on the light-emitting surface of the LED chip 2101, and the upper surface of the black adhesive layer 313 is flat.

[0562] 11-7 shows partial removal of the black adhesive layer 313 disposed on the light-emitting surface of the LED chip in the display module of FIG. 11-1, and FIG. 11-8 shows partial removal of the black adhesive layer 313 disposed on the display module of FIG. 11-1. Therefore, the thickness of the black adhesive layer 313 directly above the light-emitting surface of the LED chip 2101 is thinner than the thickness of the black adhesive layer 313 in the display module of FIG. 11-3, and the light-emitting efficiency can be improved using the display modules shown in FIGS. 11-1 and 11-3. In this example, the first encapsulation layer 314 can be removed by, but is not limited to, an etching process.

[0563] In this embodiment, the black adhesive layer 313, also referred to as a black optical layer in the present invention, has a certain light transmittance. Regardless of whether the above-described steps of removing the black adhesive layer 313 shown in Figures 11-5 to 11-8 are used, the light transmittance of the black adhesive layer 313 can be ensured, and the light-emitting surface of the LED chip 2101 can be set to 40% or more to ensure the brightness and display effect of the module.

[0564] In another example of this embodiment, the manufacturing method of the display module may include, but is not limited to, the following methods.

[0565] After the black adhesive layer 313 and the first encapsulation layer 314 are pressed together on the front side of the substrate by a hot pressing process, all of the first encapsulation layer 314 directly above the light-emitting surface of each LED chip 2101 is removed.

[0566] For example, in some applications, removing all of the black adhesive layer 314 directly above the light-emitting surface of each LED chip 2101 includes completely removing the black adhesive disposed in the area of ​​the recess f12, and after removal, the black adhesive layer 313 is flush with the first encapsulating layer 314 on the light-emitting surface of the LED chip. For example, see the display module shown in FIG. 11-9 for an application example. This involves removing a portion of the entire black adhesive layer 313 in FIG. 11-1 until a portion of the first encapsulation layer 314 directly above the light-emitting surface of each LED chip 2101 is exposed. After removal, the black adhesive layer 313 is flush with the first encapsulation layer 314 on the light-emitting surface of the LED chip 2101. In this application example, a schematic diagram of the display module shown in FIG. 11-3 with a portion of the entire first encapsulation layer 314 removed is shown in FIG. 11-10. The first encapsulation layer 313 directly above the light-emitting surface of each LED chip 2101 is exposed to the black adhesive layer 313. The removed black adhesive layer 313 still fills the recess f2 and is flush with the first encapsulation layer 314 on the light-emitting surface of each LED chip 2101. In the example shown in Figures 11-9 and 11-10, after being removed, the black adhesive layer 313 still covers the first encapsulating layer 314 on the edge region of the light-emitting surface of the LED chip 2101, so that the black adhesive layer 313 can cover the existing silver outer surface Y, further improving the display contrast of the module.

[0567] In this example, Fig. 11-11 shows another example of removing all of the black adhesive at the bottom of the lower recess f2 of the first encapsulation layer 314. Compared with the removal method shown in Fig. 11-10, when removing the black adhesive layer 313, the black adhesive layer 313 located at the recess f12 is also completely removed until the black adhesive layer 313 is removed (as can be seen from Fig. 11-11, the recess f12 on the first encapsulation layer 314 is also completely removed), and after removal, the black adhesive layer 313 becomes flush with the first encapsulation layer 314 on the light-emitting surface of the LED chip 2101, and the recess f12 no longer exists in the first encapsulation layer 314. Compared to the example shown in FIG. 11-10, the total thickness of the black adhesive layer 313 and the first sealing layer 314 is thinner, which is advantageous for making the module thinner and lighter.

[0568] Furthermore, when removing all of the black adhesive of the black adhesive layer 313 located in the recess f12, a partial removal method can also be used. For example, as shown in FIG. 11-12, the black adhesive of the black adhesive layer 313 of the display module shown in FIG. 11-1 is used in the black adhesive layer 313. 11-1 located on the light-emitting surface of the LED chip 2101 is partially and completely removed. Then, referring to FIG. 11-13, the black adhesive of the black adhesive layer 313 of the display module is used for the black adhesive layer 313, and the portion shown in FIG. 11-3 located directly above the light-emitting surface of the LED chip 2101 is partially and completely removed.

[0569] In this embodiment, when the black adhesive layer 313 is partially removed in the above example, the removal efficiency of the black adhesive layer 313 can be improved, and in the examples shown in Figures 11-9 to 11-13, the black adhesive layer 313 may or may not have light-transmitting properties, and the material selection of the black adhesive layer 313 is more flexible and has wider applicability.

[0570] In some further examples of this embodiment, to improve yield and manufacturing efficiency, a substrate clamp is provided, and the substrate clamp is provided with a receiving cavity that fits the substrate. The substrate can be fixed to the substrate clamp by pressing the black adhesive layer and the first encapsulation layer against the top surface of the substrate. After fixing, the substrate is fixed within the receiving cavity of the substrate clamp, with the back surface of the substrate facing the bottom of the receiving cavity. The front surfaces of the substrate and each LED chip are open toward the top of the receiving cavity for the black adhesive layer to be attached. In another embodiment of this embodiment, a substrate fixture may be provided to improve yield and manufacturing efficiency. The substrate clamp has a receiving cavity that fits the substrate. The substrate can be fixed to the substrate clamp by pressing the black adhesive layer and the first encapsulation layer against the front side of the substrate. After fixing, the substrate is fixed in the receiving cavity of the substrate clamp, with the back side of the substrate facing the bottom of the receiving cavity.

[0571] The manufacturing method of the display module provided by this embodiment is simple, efficient, and low-cost, and the manufactured display module has good display contrast. The first encapsulating layer included in the display module has good conformity and is less likely to remain on the light-emitting surface of the LED chip. This embodiment also provides a display screen manufactured using at least one of the display module manufacturing methods described above. The display screen provided by this embodiment has better black contrast. In addition, the manufacturing process is simple, so there is little impact on the flatness of each LED chip after the LED chip is fixed to the substrate, resulting in high yield and low cost.

[0572] Eleventh embodiment

[0573] In rela...

Claims

1. An LED display module comprising a substrate, a plurality of light-emitting units, a light-transmittable encapsulation layer, and a black optical layer, The light emitting units are disposed on an upper surface of the substrate and electrically connected to the substrate; the sealing layer is provided on an upper surface of the substrate and covers light-emitting surfaces of the plurality of light-emitting units; The LED display module, characterized in that the black optical layer is disposed on the encapsulation layer and covers gaps between the plurality of light emitting units.

2. 2. The LED display module according to claim 1, wherein an upper surface of the black optical layer is lower than the light-emitting surfaces of the light-emitting units, and the black optical layer extends upward along the sides of the light-emitting units to surround them.

3. 2. The LED display module as claimed in claim 1, wherein the black optical layer does not cover the light-emitting surfaces of the light-emitting units and does not contact the light-emitting units.

4. Further comprising another sealing layer that is light-transmittable; 2. The LED display module as claimed in claim 1, wherein the other encapsulating layer is disposed on the black optical layer and covers a plurality of the light emitting units.

5. 5. The LED display module according to claim 4, wherein the black optical layer partially covers the light-emitting surfaces of the plurality of light-emitting units, and a thickness of the black optical layer on the light-emitting surfaces of the plurality of light-emitting units is smaller than a thickness of the black optical layer in the gaps between the plurality of light-emitting units, and a light transmittance of the black optical layer on the light-emitting surfaces of the plurality of light-emitting units is 40% or more.

6. 2. The LED display module as claimed in claim 1, wherein the light emitting unit comprises a plurality of LED chips, at least one of which is a red, green, blue or white LED chip.

7. Providing a substrate; A plurality of light-emitting units are fixedly disposed on the front surface of the substrate; A first gap is provided between adjacent light emitting units, a plurality of said light emitting units including a plurality of LED chips; providing a laminated light transmissible encapsulant layer and a black optical layer; pressing the encapsulation layer and the black optical layer onto a front surface of the substrate; the black optical layer is disposed on the encapsulation layer and spaced apart from the light emitting surfaces of the plurality of light emitting units; and covering the black optical layer and the sealing layer with another light-transmitting sealing layer.

8. The method for manufacturing a display module according to claim 7 , further comprising the step of removing all of the black optical layer above the light-emitting surface of each of the plurality of light-emitting units.

9. The method for manufacturing a display module according to claim 7 , wherein the black optical layer does not cover the light-emitting surfaces of the plurality of light-emitting units.

10. The method for manufacturing a display module according to claim 7 , wherein the method for pressing the encapsulation layer and the black optical layer includes a heat pressing process.

Images