Heat medium supply device

Abstract

To provide a heat medium supply device capable of supplying a heat medium at a stable temperature while preventing a high load on a cooling device when the temperature of the heat medium returning from a semiconductor manufacturing device changes suddenly.SOLUTION: A heat medium supply device 1 includes: a cooling-side outlet pipe 17 that transfers a heat medium from a cooling-side tank 16 to a cooling device 8; a cooling-side bypass pipe 44 that extends from a cooling-side return pipe 26 to the cooling-side outlet pipe 17, bypassing the cooling-side tank 16; a cooling-side bypass valve 45 provided in the cooling-side bypass 44; and an operation control unit 35 that controls the operation of the cooling-side bypass valve 45. The operation control unit 35 is configured to open the cooling-side bypass valve 45 when a temperature of the heat medium in the cooling-side return pipe 26 measured by the cooling-side temperature measuring device 41 is within a preset allowable low temperature range, and to close the cooling-side bypass valve 45 when the temperature of the heat medium in the cooling-side return pipe 26 measured by the cooling-side temperature measuring device 41 is outside the allowable low temperature range.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a heat medium supply device that supplies a heat medium for adjusting the temperature of semiconductor manufacturing devices such as etching devices, CVD devices, and PVD devices to the semiconductor manufacturing devices.

Background Art

[0002] Semiconductor manufacturing devices (for example, etching devices, CVD devices, PVD devices) for manufacturing semiconductor devices are configured to execute a manufacturing process while controlling the processing temperature. For example, in an etching device, the processing temperature of a wafer is adjusted by flowing a liquid as a temperature-controlled heat medium through a flow path formed in a susceptor that supports the wafer.

[0003] FIG. 5 is a schematic diagram showing a conventional example of a heat medium supply device that supplies a heat medium to a semiconductor manufacturing device. The heat medium supply device 500 includes a heating device 501 that heats the heat medium and a cooling device 502 that cools the heat medium. The heat medium is stored in a heating-side tank 504 and a cooling-side tank 505. The heat medium heated by the heating device 501 is transferred to the heating-side tank 504 and further transferred from the heating-side tank 504 into a heat medium mixing device 507. On the other hand, the heat medium stored in the cooling-side tank 505 is transferred to the cooling device 502 and cooled by the cooling device 502. The cooled heat medium is transferred to the heat medium mixing device 507.

[0004] The heated heat medium and the cooled heat medium are mixed in the heat medium mixing device 507 and thus adjusted to the temperature required for the semiconductor manufacturing device 510. The heat medium with the adjusted temperature is sent to the semiconductor manufacturing device 510, whereby the semiconductor manufacturing device 510 is maintained at the target temperature. The heat medium that has passed through the semiconductor manufacturing device 510 is returned to the heat medium mixing device 507, branched by the heat medium mixing device 507, and transferred to the heating-side tank 504 and the cooling-side tank 505. In this way, the heat medium circulates between the heat medium supply device 500 and the semiconductor manufacturing device 510.

Prior Art Documents

Patent Document

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] The target temperature for wafer processing in the semiconductor manufacturing apparatus 510 may vary significantly during wafer processing. Along with such fluctuations in the target temperature, the temperature of the heat medium returning from the semiconductor manufacturing apparatus 510 to the heating-side tank 504 and the cooling-side tank 505 via the heat medium mixing apparatus 507 may suddenly change. As a result, a high load is temporarily applied to the heating apparatus 501 and the cooling apparatus 502, and it may take time for the supply temperature of the heat medium to the heat medium mixing apparatus 507 of the heat medium to stabilize.

[0007] Therefore, the present invention provides a heat medium supply apparatus that can prevent a high load on the cooling apparatus and supply a heat medium at a stable temperature when the temperature of the heat medium returning from the semiconductor manufacturing apparatus suddenly changes. Further, the present invention provides a heat medium supply apparatus that can prevent a high load on the heating apparatus and supply a heat medium at a stable temperature when the temperature of the heat medium returning from the semiconductor manufacturing apparatus suddenly changes.

Means for Solving the Problems

[0008] In one aspect, there is provided a heat medium supply device for supplying a heat medium for adjusting the temperature of a semiconductor manufacturing apparatus, the heat medium supply device including a heating device for heating the heat medium, a cooling device for cooling the heat medium, a heating medium transfer pipe for sending the heated heat medium to the semiconductor manufacturing apparatus, a cooling medium transfer pipe for sending the cooled heat medium to the semiconductor manufacturing apparatus, a heating side tank and a cooling side tank for holding the heat medium, a heating side return pipe for returning the heat medium that has passed through the semiconductor manufacturing apparatus to the heating side tank, a cooling side return pipe for returning the heat medium that has passed through the semiconductor manufacturing apparatus to the cooling side tank, a cooling side temperature measuring device provided in the cooling side return pipe for measuring the temperature of the heat medium in the cooling side return pipe, a cooling side outlet pipe for transferring the heat medium from the cooling side tank to the cooling device, a cooling side bypass pipe extending from the cooling side return pipe to bypass the cooling side tank and leading to the cooling side outlet pipe, a cooling side bypass valve provided in the cooling side bypass pipe, and an operation control unit for controlling the operation of the cooling side bypass valve. The operation control unit is configured to open the cooling side bypass valve when the temperature of the heat medium in the cooling side return pipe measured by the cooling side temperature measuring device is within a preset allowable low temperature range, and to close the cooling side bypass valve when the temperature of the heat medium in the cooling side return pipe measured by the cooling side temperature measuring device is outside the allowable low temperature range.

[0009] When the temperature of the heat medium in the cooling-side return pipe is outside the allowable low-temperature range, the cooling-side bypass valve is closed, and the heat medium in the cooling-side return pipe is transferred into the cooling-side tank. More specifically, when the temperature of the heat medium in the cooling-side return pipe is lower than the lower limit value of the allowable low-temperature range, the low-temperature heat medium flows into the cooling-side tank and is stored therein. During the operation of the semiconductor manufacturing apparatus, relatively high-temperature heat medium may temporarily return through the cooling-side return pipe. When the temperature of the heat medium in the cooling-side return pipe is higher than the upper limit value of the allowable low-temperature range, the high-temperature heat medium flows into the cooling-side tank. Since there is already low-temperature heat medium in the cooling-side tank, the high-temperature heat medium is mixed with the low-temperature heat medium, and the high-temperature heat medium that has flowed into the cooling-side tank and is higher than the upper limit value of the allowable low-temperature range is cooled. As a result, the temperature of the heat medium flowing from the cooling-side tank through the cooling-side outlet pipe to the cooling device becomes lower than the temperature of the heat medium in the cooling-side return pipe, and the load on the cooling device can be reduced compared to the case where the high-temperature heat medium is directly supplied to the cooling device. When the temperature of the heat medium in the cooling-side return pipe is within the allowable low-temperature range, the load on the cooling device is not large. Thus, by operating the cooling-side bypass valve based on whether the temperature of the heat medium in the cooling-side return pipe is within the allowable low-temperature range, the load on the cooling device can be stabilized.

[0010] In one aspect, the heat medium supply device further includes a heating-side temperature measuring device provided in the heating-side return pipe for measuring the temperature of the heat medium in the heating-side return pipe, a heating-side outlet pipe for transferring the heat medium from the heating-side tank to the heating device, a heating-side bypass pipe bypassing the heating-side tank from the heating-side return pipe and extending to the heating-side outlet pipe, and a heating-side bypass valve provided in the heating-side bypass pipe. The operation control unit is configured to open the heating-side bypass valve when the temperature of the heat medium in the heating-side return pipe measured by the heating-side temperature measuring device is within a preset allowable high-temperature range, and to close the heating-side bypass valve when the temperature of the heat medium in the heating-side return pipe measured by the heating-side temperature measuring device is outside the allowable high-temperature range.

[0011] When the temperature of the heat medium in the heating-side return pipe is outside the allowable high-temperature range, the heating-side bypass valve is closed, and the heat medium in the heating-side return pipe is transferred into the heating-side tank. More specifically, when the temperature of the heat medium in the heating-side return pipe is higher than the upper limit value of the allowable high-temperature range, the high-temperature heat medium flows into the heating-side tank and is stored therein. Even when the temperature of the heat medium in the heating-side return pipe is lower than the lower limit value of the allowable high-temperature range, the low-temperature heat medium flows into the heating-side tank. The low-temperature heat medium is mixed with the heat medium in the heating-side tank, and the heat medium having a temperature lower than the lower limit value of the allowable high-temperature range that has flowed into the heating-side tank is heated. As a result, the temperature of the heat medium flowing from the heating-side tank through the heating-side outlet pipe to the heating device becomes higher than the temperature of the heat medium in the heating-side return pipe, and the load on the heating device can be reduced as compared with the case where the low-temperature heat medium is directly supplied to the heating device. When the temperature of the heat medium in the heating-side return pipe is within the allowable high-temperature range, the load on the heating device is not large. Thus, by operating the heating-side bypass valve based on whether the temperature of the heat medium in the heating-side return pipe is within the allowable high-temperature range, the load on the heating device can be stabilized.

[0012] In one aspect, the semiconductor manufacturing apparatus is a plurality of semiconductor manufacturing apparatuses, and each of the heating medium transfer pipe, the cooling medium transfer pipe, the heating-side return pipe, and the cooling-side return pipe is connected to the plurality of semiconductor manufacturing apparatuses.

[0013] In one aspect, there is provided a heat medium supply device for supplying a heat medium for adjusting the temperature of a semiconductor manufacturing apparatus, the heat medium supply device including a heating device for heating the heat medium, a cooling device for cooling the heat medium, a heating medium transfer pipe for sending the heated heat medium to the semiconductor manufacturing apparatus, a cooling medium transfer pipe for sending the cooled heat medium to the semiconductor manufacturing apparatus, a heating-side tank and a cooling-side tank for holding the heat medium, a heating-side return pipe for returning the heat medium that has passed through the semiconductor manufacturing apparatus to the heating-side tank, a cooling-side return pipe for returning the heat medium that has passed through the semiconductor manufacturing apparatus to the cooling-side tank, a heating-side temperature measuring device provided in the heating-side return pipe for measuring the temperature of the heat medium in the heating-side return pipe, a heating-side outlet pipe for transferring the heat medium from the heating-side tank to the heating device, a heating-side bypass pipe extending from the heating-side return pipe to bypass the heating-side tank and reaching the heating-side outlet pipe, a heating-side bypass valve provided in the heating-side bypass pipe, and an operation control unit for controlling the operation of the cooling-side bypass valve. The operation control unit is configured to open the heating-side bypass valve when the temperature of the heat medium in the heating-side return pipe measured by the heating-side temperature measuring device is within a preset allowable high temperature range, and to close the heating-side bypass valve when the temperature of the heat medium in the heating-side return pipe measured by the heating-side temperature measuring device is outside the allowable high temperature range.

[0014] When the temperature of the heat medium in the heating-side return pipe is outside the allowable high-temperature range, the heating-side bypass valve is closed, and the heat medium in the heating-side return pipe is transferred into the heating-side tank. More specifically, when the temperature of the heat medium in the heating-side return pipe is higher than the upper limit value of the allowable high-temperature range, the high-temperature heat medium flows into the heating-side tank and is stored therein. Even when the temperature of the heat medium in the heating-side return pipe is lower than the lower limit value of the allowable high-temperature range, the low-temperature heat medium flows into the heating-side tank. The low-temperature heat medium is mixed with the heat medium in the heating-side tank, and the heat medium having a temperature lower than the lower limit value of the allowable high-temperature range that has flowed into the heating-side tank is heated. As a result, the temperature of the heat medium flowing from the heating-side tank through the heating-side outlet pipe to the heating device becomes higher than the temperature of the heat medium in the heating-side return pipe, and the load on the heating device can be reduced compared to the case where the low-temperature heat medium is directly supplied to the heating device. When the temperature of the heat medium in the heating-side return pipe is within the allowable high-temperature range, the load on the heating device is not large. Thus, by operating the heating-side bypass valve based on whether the temperature of the heat medium in the heating-side return pipe is within the allowable high-temperature range, the load on the heating device can be stabilized.

[0015] In one aspect, the heat medium supply device further includes a cooling-side temperature measuring device provided in the cooling-side return pipe for measuring the temperature of the heat medium in the cooling-side return pipe, a cooling-side outlet pipe for transferring the heat medium from the cooling-side tank to the cooling device, a cooling-side bypass pipe extending from the cooling-side return pipe to bypass the cooling-side tank and leading to the cooling-side outlet pipe, and a cooling-side bypass valve provided in the cooling-side bypass pipe. The operation control unit is configured to open the cooling-side bypass valve when the temperature of the heat medium in the cooling-side return pipe measured by the cooling-side temperature measuring device is within a preset allowable low-temperature range, and to close the cooling-side bypass valve when the temperature of the heat medium in the cooling-side return pipe measured by the cooling-side temperature measuring device is outside the allowable low-temperature range.

[0016] When the temperature of the heat medium in the cooling-side return pipe is outside the allowable low-temperature range, the cooling-side bypass valve is closed, and the heat medium in the cooling-side return pipe is transferred into the cooling-side tank. More specifically, when the temperature of the heat medium in the cooling-side return pipe is lower than the lower limit value of the allowable low-temperature range, the low-temperature heat medium flows into the cooling-side tank and is stored therein. During the operation of the semiconductor manufacturing apparatus, relatively high-temperature heat medium may temporarily return through the cooling-side return pipe. When the temperature of the heat medium in the cooling-side return pipe is higher than the upper limit value of the allowable low-temperature range, the high-temperature heat medium flows into the cooling-side tank. Since there is already low-temperature heat medium in the cooling-side tank, the high-temperature heat medium is mixed with the low-temperature heat medium, and the high-temperature heat medium that has flowed into the cooling-side tank and is higher than the upper limit value of the allowable low-temperature range is cooled. As a result, the temperature of the heat medium flowing from the cooling-side tank through the cooling-side outlet pipe to the cooling device becomes lower than the temperature of the heat medium in the cooling-side return pipe, and the load on the cooling device can be reduced compared to the case where the high-temperature heat medium is directly supplied to the cooling device. When the temperature of the heat medium in the cooling-side return pipe is within the allowable low-temperature range, the load on the cooling device is not large. Thus, by operating the cooling-side bypass valve based on whether the temperature of the heat medium in the cooling-side return pipe is within the allowable low-temperature range, the load on the cooling device can be stabilized.

[0017] In one aspect, the semiconductor manufacturing apparatus is a plurality of semiconductor manufacturing apparatuses, and each of the heating medium transfer pipe, the cooling medium transfer pipe, the heating-side return pipe, and the cooling-side return pipe is connected to the plurality of semiconductor manufacturing apparatuses.

Advantages of the Invention

[0018] According to an embodiment of the present invention, by operating the cooling-side bypass valve based on whether the temperature of the heat medium in the cooling-side return pipe is within the allowable low-temperature range, the load on the cooling device can be stabilized. According to an embodiment of the present invention, by operating the heating-side bypass valve based on whether the temperature of the heat medium in the heating-side return pipe is within the allowable high-temperature range, the load on the heating device can be stabilized.

Brief Description of the Drawings

[0019]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Embodiments for Carrying Out the Invention

[0020] Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic diagram showing an embodiment of a semiconductor manufacturing system including a heat medium supply device 1 and a semiconductor manufacturing device 2. The heat medium supply device 1 is configured to supply a heat medium for adjusting the temperature of the semiconductor manufacturing device 2 (for example, an etching device, a CVD device, a PVD device, etc.) to the semiconductor manufacturing device 2.

[0021] As shown in FIG. 1, the semiconductor manufacturing system includes a heat medium supply device 1, a heat medium mixing device 5 connected to the heat medium supply device 1, and a semiconductor manufacturing device 2 connected to the heat medium mixing device 5. The heat medium supply device 1 is connected to the semiconductor manufacturing device 2 via the heat medium mixing device 5. In the embodiment shown in FIG. 1, an etching device that performs a dry etching process on a wafer is used as the semiconductor manufacturing device 2, but the semiconductor manufacturing device 2 is not limited to this embodiment.

[0022] The heat medium supply device 1 includes a heating device 7 for heating the heat medium, a cooling device 8 for cooling the heat medium, a heating medium transfer pipe 11 for sending the heated heat medium to the semiconductor manufacturing device 2, a cooling medium transfer pipe 12 for sending the cooled heat medium to the semiconductor manufacturing device 2, and a heating side tank 15 and a cooling side tank 16 for holding the heat medium. The heat medium supply device 1 has a heat insulating material 18 covering the entire outer surface of the heating side tank 15 and a heat insulating material 19 covering the entire outer surface of the cooling side tank 16. The heat insulating materials 18 and 19 are configured to maintain the temperature of the heat medium held in the heating side tank 15 and the cooling side tank 16.

[0023] The heating medium transfer pipe 11 extends from the heating side tank 15 to the heat medium mixing device 5, and the cooling medium transfer pipe 12 extends from the cooling device 8 to the heat medium mixing device 5. The heat medium supply device 1 further includes a cooling side outlet pipe 17 for transferring the heat medium from the cooling side tank 16 to the cooling device 8. The cooling side outlet pipe 17 extends from the cooling side tank 16 to the cooling device 8. The cooling side outlet pipe 17 is located upstream of the cooling medium transfer pipe 12.

[0024] The heating medium transfer pipe 11 and the cooling medium transfer pipe 12 are connected to the heat medium mixing device 5 and communicate with the semiconductor manufacturing device 2 via the heat medium mixing device 5. The heat medium mixing device 5 is provided with a plurality of flow rate adjustment valves (not shown) that communicate with the heating medium transfer pipe 11 and the cooling medium transfer pipe 12 respectively. The heat medium mixing device 5 is configured to adjust the temperature required for the semiconductor manufacturing device 2 by mixing the heated heat medium and the cooled heat medium while adjusting the flow rate of the heated heat medium and the flow rate of the cooled heat medium.

[0025] In one embodiment, a fluorine-based inert liquid is used as the heat medium. Examples of the heating device 7 include an electric heater. Examples of the cooling device 8 include a vapor compression refrigerator, an absorption refrigerator, etc. The vapor compression refrigerator includes a turbo refrigerator, a screw refrigerator, a rotary refrigerator, a scroll refrigerator, etc., and these can be used. The configurations of the heating device 7 and the cooling device 8 are not particularly limited as long as they can heat and cool the heat medium.

[0026] The heat medium supply device 1 further includes a tank communication pipe 20 that communicates the heating side tank 15 and the cooling side tank 16, a communication valve 21 provided in the tank communication pipe 20, a heating side return pipe 25 that returns the heat medium that has passed through the semiconductor manufacturing device 2 to the heating side tank 15, and a cooling side return pipe 26 that returns the heat medium that has passed through the semiconductor manufacturing device 2 to the cooling side tank 16. The heating side return pipe 25 extends from the heat medium mixing device 5 to the heating side tank 15. The cooling side return pipe 26 extends from the heat medium mixing device 5 to the cooling side tank 16.

[0027] The heating device 7 is provided in the heating side return pipe 25 and is configured to heat the heat medium flowing through the heating side return pipe 25. The heating device 7 is arranged upstream of the heating side tank 15. The heat medium heated by the heating device 7 is transferred to the heating side tank 15 through the heating side return pipe 25 and stored in the heating side tank 15. The heat medium supply device 1 includes a heating side liquid level detection device 31 that detects the liquid level of the heat medium in the heating side tank 15 and a cooling side liquid level detection device 32 that detects the liquid level of the heat medium in the cooling side tank 16.

[0028] The heat medium supply device 1 includes a heating side pump 33 connected to the heating medium transfer pipe 11. When the heating side pump 33 is operated, the heat medium (heated heat medium) in the heating side tank 15 is sent to the heat medium mixing device 5 through the heating medium transfer pipe 11 and further sent from the heat medium mixing device 5 to the semiconductor manufacturing device 2.

[0029] The cooling device 8 is arranged downstream of the cooling side tank 16. More specifically, the cooling device 8 is connected to the cooling medium transfer pipe 12 and the cooling side outlet pipe 17. The heat medium supply device 1 includes a cooling side pump 34 connected to the cooling side outlet pipe 17. When the cooling side pump 34 is operated, the heat medium is sent from the cooling side tank 16 to the cooling device 8 through the cooling side outlet pipe 17 and cooled by the cooling device 8. The cooled heat medium is sent to the heat medium mixing device 5 through the cooling medium transfer pipe 12 and further sent from the heat medium mixing device 5 to the semiconductor manufacturing device 2.

[0030] The heated heat medium and the cooled heat medium are mixed by the heat medium mixing device 5 to generate a heat medium having a preset temperature. The heat medium at the preset temperature is transferred from the heat medium mixing device 5 to the semiconductor manufacturing device 2 and heats or cools a wafer (not shown) in the semiconductor manufacturing device 2 while passing through the semiconductor manufacturing device 2. The heat medium that has passed through the semiconductor manufacturing device 2 is returned to the heat medium mixing device 5 and is divided into two flows. One of the two flows flows into the heating side return pipe 25, and the other flows into the cooling side return pipe 26. The heat medium that has flowed into the heating side return pipe 25 is heated by the heating device 7 and then flows into the heating side tank 15. The heat medium that has flowed into the cooling side return pipe 26 flows through the cooling side return pipe 26 and into the cooling side tank 16 or the cooling side outlet pipe 17.

[0031] As the heat medium circulates between the heat medium supply device 1 and the semiconductor manufacturing device 2, a difference occurs between the liquid level of the heat medium in the heating side tank 15 and the liquid level of the heat medium in the cooling side tank 16. The heat medium supply device 1 of the present embodiment is configured to open the communication valve 21 provided in the tank communication pipe 20 when the difference between the liquid level of the heat medium in the heating side tank 15 and the liquid level of the heat medium in the cooling side tank 16 exceeds a threshold value.

[0032] The heat medium supply device 1 includes an operation control unit 35 that controls the operation of the communication valve 21. The operation control unit 35 includes at least one computer. The operation control unit 35 includes a storage device 35a in which a program and the like are stored, and an arithmetic device 35b that executes arithmetic according to instructions included in the program. The storage device 35a includes a main storage device such as a random access memory (RAM) and an auxiliary storage device such as a hard disk drive (HDD) and a solid state drive (SSD). Examples of the arithmetic device 35b include a CPU (central processing unit) and a GPU (graphics processing unit). However, the specific configuration of the operation control unit 35 is not limited to these examples.

[0033] The heat medium supply device 1 includes a cooling-side temperature measuring device 41 provided in the cooling-side return pipe 26, a cooling-side bypass pipe 44 that bypasses the cooling-side tank 16 from the cooling-side return pipe 26 and extends to the cooling-side outlet pipe 17, and a cooling-side bypass valve 45 provided in the cooling-side bypass pipe 44. One end of the cooling-side bypass pipe 44 is connected to the cooling-side return pipe 26, and the other end of the cooling-side bypass pipe 44 is connected to the cooling-side outlet pipe 17. The connection point B1 between the cooling-side bypass pipe 44 and the cooling-side outlet pipe 17 is located upstream of the cooling-side pump 34. When the cooling-side bypass valve 45 is closed, the heat medium flows into the cooling-side tank 16 through the cooling-side return pipe 26. When the cooling-side bypass valve 45 is opened, most of the heat medium flowing through the cooling-side return pipe 26 flows into the cooling-side bypass pipe 44. The cooling-side bypass valve 45 is an actuator-driven valve such as an electric valve.

[0034] The cooling-side temperature measuring device 41 is configured to measure the temperature of the heat medium in the cooling-side return pipe 26. The cooling-side temperature measuring device 41 is electrically connected to the operation control unit 35, and the measured value of the temperature of the heat medium in the cooling-side return pipe 26 is sent to the operation control unit 35. The cooling-side bypass valve 45 is electrically connected to the operation control unit 35, and the operation of the cooling-side bypass valve 45 is controlled by the operation control unit 35.

[0035] The operation control unit 35 is configured to open the cooling-side bypass valve 45 when the temperature of the heat medium in the cooling-side return pipe 26 measured by the cooling-side temperature measuring device 41 is within a preset allowable low temperature range, and to close the cooling-side bypass valve 45 when the temperature of the heat medium in the cooling-side return pipe 26 measured by the cooling-side temperature measuring device 41 is outside the allowable low temperature range.

[0036] In one embodiment, the lower limit value of the allowable low temperature range is equal to or lower than the minimum operable refrigeration capacity of the cooling device 8, and the upper limit value of the allowable low temperature range is equal to or higher than the rated refrigeration capacity of the cooling device 8. The minimum operable refrigeration capacity of the cooling device 8 is a refrigeration capacity of 10% to 20% of the rated refrigeration capacity of the cooling device 8. When the load (light load) is below this minimum operable refrigeration capacity, the cooling device 8 cannot secure the target temperature (i.e., the temperature of the load becomes lower than the target temperature). Further, for a load exceeding the rated refrigeration capacity of the cooling device 8, the cooling device 8 cannot sufficiently cool and cannot secure the target temperature (i.e., the temperature of the load becomes higher than the target temperature). From such a perspective, in one embodiment, the lower limit value of the allowable low temperature range is equal to or lower than the minimum operable refrigeration capacity of the cooling device 8, and the upper limit value of the allowable low temperature range is equal to or higher than the rated refrigeration capacity of the cooling device 8.

[0037] When the temperature of the heat medium in the cooling side return pipe 26 is outside the allowable low temperature range, the cooling side bypass valve 45 is closed, and the heat medium in the cooling side return pipe 26 is transferred into the cooling side tank 16. More specifically, when the temperature of the heat medium in the cooling side return pipe 26 is lower than the lower limit value of the allowable low temperature range, the low-temperature heat medium flows into the cooling side tank 16 and is stored in the cooling side tank 16.

[0038] During the operation of the semiconductor manufacturing apparatus 2, relatively high-temperature heat medium may temporarily return through the cooling side return pipe 26. When the temperature of the heat medium in the cooling side return pipe 26 is higher than the upper limit value of the allowable low temperature range, the high-temperature heat medium flows into the cooling side tank 16. Since there is already low-temperature heat medium in the cooling side tank 16, the high-temperature heat medium is mixed with the low-temperature heat medium, and the high-temperature heat medium that has flowed into the cooling side tank 16 and is higher than the upper limit value of the allowable low temperature range is cooled. As a result, the temperature of the heat medium flowing from the cooling side tank 16 through the cooling side outlet pipe 17 to the cooling device 8 becomes lower than the temperature of the heat medium in the cooling side return pipe 26, and the load on the cooling device 8 can be reduced compared to the case where the high-temperature heat medium is directly supplied to the cooling device 8.

[0039] When the temperature of the heat medium in the cooling-side return pipe 26 is within the allowable low-temperature range, the load on the cooling device 8 is not large. Therefore, the cooling-side bypass valve 45 is opened, and most of the heat medium flowing through the cooling-side return pipe 26 flows to the cooling-side outlet pipe 17 and hardly flows into the cooling-side tank 16. While the cooling-side bypass valve 45 is open, the cooling-side tank 16 is thermally isolated. Usually, the temperature inside the cooling-side tank 16 is significantly different from the temperature around the cooling-side tank 16. Since the entire outer surface of the cooling-side tank 16 is covered with the heat insulating material 19, the temperature inside the cooling-side tank 16 can be maintained even when the cooling-side tank 16 is thermally isolated.

[0040] As described above, by operating the cooling-side bypass valve 45 based on whether the temperature of the heat medium in the cooling-side return pipe 26 is within the allowable low-temperature range, the load on the cooling device 8 can be stabilized.

[0041] In one embodiment, as the lower limit value of the allowable low-temperature range, a first lower limit value and a second lower limit value lower than the first lower limit value may be set. The operation control unit 35 may gradually (e.g., stepwise or steplessly) close the cooling-side bypass valve 45 as the temperature of the heat medium in the cooling-side return pipe 26 decreases from the first lower limit value to the second lower limit value. That is, when the temperature of the heat medium in the cooling-side return pipe 26 decreases and reaches the first lower limit value, the operation control unit 35 starts to close the cooling-side bypass valve 45 and sends a part of the heat medium flowing through the cooling-side return pipe 26 to the cooling-side tank 16. Then, when the temperature of the heat medium in the cooling-side return pipe 26 further decreases and reaches the second lower limit value, the operation control unit 35 fully closes the cooling-side bypass valve 45. As a result, all of the heat medium flowing through the cooling-side return pipe 26 flows into the cooling-side tank 16.

[0042] FIG. 2 is a schematic diagram showing another embodiment of the heat medium supply device 1. The configuration and operation of this embodiment not specifically described are the same as those of the embodiment described with reference to FIG. 1, and thus the overlapping description is omitted. The heat medium supply device 1 of the embodiment shown in FIG. 2 includes a heating-side bypass pipe 54 and a heating-side bypass valve 55 instead of the cooling-side bypass pipe 44 and the cooling-side bypass valve 45.

[0043] The cooling medium transfer pipe 12 extends from the cooling-side tank 16 to the heat medium mixing device 5. The cooling device 8 is attached to the cooling medium transfer pipe 12 and is configured to cool the heat medium flowing through the cooling medium transfer pipe 12. The heating medium transfer pipe 11 extends from the heating device 7 to the heat medium mixing device 5. The heat medium supply device 1 further includes a heating-side outlet pipe 57 that transfers the heat medium from the heating-side tank 15 to the heating device 7. The heating-side outlet pipe 57 extends from the heating-side tank 15 to the heating device 7. The heating-side outlet pipe 57 is located upstream of the heating medium transfer pipe 11.

[0044] The heating device 7 is arranged downstream of the heating-side tank 15. More specifically, the heating device 7 is connected to the heating medium transfer pipe 11 and the heating-side outlet pipe 57. The heat medium supply device 1 includes a heating-side pump 33 connected to the heating-side outlet pipe 57. When the heating-side pump 33 is operated, the heat medium is sent from the heating-side tank 15 through the heating-side outlet pipe 57 to the heating device 7 and is heated by the heating device 7. The heated heat medium is sent to the heat medium mixing device 5 through the heating medium transfer pipe 11 and further sent from the heat medium mixing device 5 to the semiconductor manufacturing device 2.

[0045] The heated heat medium and the cooled heat medium are mixed by the heat medium mixing device 5 to generate a heat medium having a preset temperature. The heat medium having the preset temperature is transferred from the heat medium mixing device 5 to the semiconductor manufacturing device 2 and heats or cools a wafer (not shown) in the semiconductor manufacturing device 2 while passing through the semiconductor manufacturing device 2. The heat medium that has passed through the semiconductor manufacturing device 2 is returned to the heat medium mixing device 5 and is divided into two flows. One of the two flows flows into the cooling-side return pipe 26, and the other flows into the heating-side return pipe 25. The heat medium that has flowed into the cooling-side return pipe 26 flows into the cooling-side tank 16. The heat medium that has flowed into the heating-side return pipe 25 flows into the heating-side tank 15 or the heating-side outlet pipe 57 through the heating-side return pipe 25.

[0046] The heat medium supply device 1 includes a heating-side temperature detector 51 provided in the heating-side return pipe 25, a heating-side bypass pipe 54 that bypasses the heating-side tank 15 from the heating-side return pipe 25 and extends to the heating-side outlet pipe 57, and a heating-side bypass valve 55 provided in the heating-side bypass pipe 54. One end of the heating-side bypass pipe 54 is connected to the heating-side return pipe 25, and the other end of the heating-side bypass pipe 54 is connected to the heating-side outlet pipe 57. The connection point B2 between the heating-side bypass pipe 54 and the heating-side outlet pipe 57 is located upstream of the heating-side pump 33. When the heating-side bypass valve 55 is closed, the heat medium flows into the heating-side tank 15 through the heating-side return pipe 25. When the heating-side bypass valve 55 is opened, most of the heat medium flowing through the heating-side return pipe 25 flows into the heating-side bypass pipe 54. The heating-side bypass valve 55 is an actuator-driven valve such as an electric valve.

[0047] The heating-side temperature detector 51 is configured to measure the temperature of the heat medium in the heating-side return pipe 25. The heating-side temperature detector 51 is electrically connected to the operation control unit 35, and the measured value of the temperature of the heat medium in the heating-side return pipe 25 is sent to the operation control unit 35. The heating-side bypass valve 55 is electrically connected to the operation control unit 35, and the operation of the heating-side bypass valve 55 is controlled by the operation control unit 35.

[0048] The operation control unit 35 is configured to open the heating-side bypass valve 55 when the temperature of the heat medium in the heating-side return pipe measured by the heating-side temperature detector 51 is within a preset allowable high-temperature range, and to close the heating-side bypass valve 55 when the temperature of the heat medium in the heating-side return pipe 25 measured by the heating-side temperature detector 51 is outside the allowable high-temperature range.

[0049] In one embodiment, the upper limit value of the allowable high temperature range is equal to or lower than the minimum operable heating capacity of the heating device 7, and the lower limit value of the allowable high temperature range is equal to or higher than the rated heating capacity of the heating device 7. The minimum operable heating capacity of the heating device 7 is a heating capacity that is 10% to 20% of the rated heating capacity of the heating device 7. When the load (light load) is below this minimum operable heating capacity, the heating device 7 cannot secure the target temperature (i.e., the temperature of the load becomes higher than the target temperature). Also, for a load exceeding the rated heating capacity of the heating device 7, the heating device 7 cannot heat sufficiently and cannot secure the target temperature (i.e., the temperature of the load becomes lower than the target temperature). From such a perspective, in one embodiment, the upper limit value of the allowable high temperature range is equal to or lower than the minimum operable heating capacity of the heating device 7, and the lower limit value of the allowable high temperature range is equal to or higher than the rated heating capacity of the heating device 7.

[0050] When the temperature of the heat medium in the heating side return pipe 25 is outside the allowable high temperature range, the heating side bypass valve 55 is closed, and the heat medium in the heating side return pipe 25 is transferred into the heating side tank 15. More specifically, when the temperature of the heat medium in the heating side return pipe 25 is higher than the upper limit value of the allowable high temperature range, the high-temperature heat medium flows into the heating side tank 15 and is stored in the heating side tank 15.

[0051] Even when the temperature of the heat medium in the heating side return pipe 25 is lower than the lower limit value of the allowable high temperature range, the low-temperature heat medium flows into the heating side tank 15. Since there is already a high-temperature heat medium in the heating side tank 15, the low-temperature heat medium is mixed with the heat medium in the heating side tank 15, and the low-temperature heat medium that is lower than the lower limit value of the allowable high temperature range flowing into the heating side tank 15 is heated. As a result, the temperature of the heat medium flowing from the heating side tank 15 through the heating side outlet pipe 57 to the heating device 7 becomes higher than the temperature of the heat medium in the heating side return pipe 25, and the load on the heating device 7 can be reduced compared to the case where the low-temperature heat medium is supplied to the heating device 7 as it is.

[0052] When the temperature of the heat medium in the heating-side return pipe 25 is within the allowable high-temperature range, the load on the heating device 7 is not large. Therefore, the heating-side bypass valve 55 is opened, and most of the heat medium flowing through the heating-side return pipe 25 flows into the heating-side outlet pipe 57 and hardly flows into the heating-side tank 15. While the heating-side bypass valve 55 is open, the heating-side tank 15 is thermally isolated. Usually, the temperature inside the heating-side tank 15 is significantly different from the temperature around the heating-side tank 15. Since the entire outer surface of the heating-side tank 15 is covered with the heat insulating material 18, the temperature inside the heating-side tank 15 can be maintained even when the heating-side tank 15 is thermally isolated.

[0053] As described above, by operating the heating-side bypass valve 55 based on whether the temperature of the heat medium in the heating-side return pipe 25 is within the allowable high-temperature range, the load on the heating device 7 can be stabilized.

[0054] In one embodiment, as the upper limit value of the allowable high-temperature range, a first upper limit value and a second upper limit value higher than the first upper limit value may be set. The operation control unit 35 may gradually (for example, stepwise or steplessly) close the heating-side bypass valve 55 as the temperature of the heat medium in the heating-side return pipe 25 rises from the first upper limit value to the second upper limit value. That is, when the temperature of the heat medium in the heating-side return pipe 25 rises and reaches the first upper limit value, the operation control unit 35 starts to close the heating-side bypass valve 55 and sends a part of the heat medium flowing through the heating-side return pipe 25 to the heating-side tank 15. Then, when the temperature of the heat medium in the heating-side return pipe 25 further rises and reaches the second upper limit value, the operation control unit 35 fully closes the heating-side bypass valve 55. As a result, all of the heat medium flowing through the heating-side return pipe 25 flows into the heating-side tank 15.

[0055] FIG. 3 is a schematic diagram showing still another embodiment of the heat medium supply device 1. The embodiment shown in FIG. 3 is a combination of the embodiment described with reference to FIG. 1 and the embodiment described with reference to FIG. 2. That is, the heat medium supply device 1 of the embodiment shown in FIG. 3 includes a cooling-side bypass pipe 44, a cooling-side bypass valve 45, a heating-side bypass pipe 54, and a heating-side bypass valve 55. Since the configuration and operation of this embodiment not particularly described are the same as those of the embodiments described with reference to FIGS. 1 and 2, the overlapping description thereof is omitted.

[0056] The cooling medium transfer pipe 12 extends from the cooling device 8 to the heat medium mixing device 5, and the cooling-side outlet pipe 17 extends from the cooling-side tank 16 to the cooling device 8. The heating medium transfer pipe 11 extends from the heating device 7 to the heat medium mixing device 5, and the heating-side outlet pipe 57 extends from the heating-side tank 15 to the heating device 7. The heating device 7 is disposed downstream of the heating-side tank 15 and is connected to the heating medium transfer pipe 11 and the heating-side outlet pipe 57. The cooling device 8 is disposed downstream of the cooling-side tank 16 and is connected to the cooling medium transfer pipe 12 and the cooling-side outlet pipe 17.

[0057] The heat medium supply device 1 includes a cooling-side temperature measuring device 41 provided in the cooling-side return pipe 26, a cooling-side bypass pipe 44 that bypasses the cooling-side tank 16 from the cooling-side return pipe 26 and extends to the cooling-side outlet pipe 17, a cooling-side bypass valve 45 provided in the cooling-side bypass pipe 44, a heating-side temperature measuring device 51 provided in the heating-side return pipe 25, a heating-side bypass pipe 54 that bypasses the heating-side tank 15 from the heating-side return pipe 25 and extends to the heating-side outlet pipe 57, and a heating-side bypass valve 55 provided in the heating-side bypass pipe 54.

[0058] The operation control unit 35 is configured to open the cooling-side bypass valve 45 when the temperature of the heat medium in the cooling-side return pipe 26 measured by the cooling-side temperature measuring device 41 is within a preset allowable low temperature range, and to close the cooling-side bypass valve 45 when the temperature of the heat medium in the cooling-side return pipe 26 measured by the cooling-side temperature measuring device 41 is outside the allowable low temperature range.

[0059] Furthermore, when the temperature of the heat medium in the heating-side return pipe 25 measured by the heating-side temperature measuring device 51 is within a preset allowable high-temperature range, the operation control unit 35 opens the heating-side bypass valve 55, and when the temperature of the heat medium in the heating-side return pipe 25 measured by the heating-side temperature measuring device 51 is outside the allowable high-temperature range, the operation control unit 35 closes the heating-side bypass valve 55.

[0060] According to the present embodiment, the cooling-side bypass valve 45 operates based on whether the temperature of the heat medium in the cooling-side return pipe 26 is within the allowable low-temperature range, and the heating-side bypass valve 55 operates based on whether the temperature of the heat medium in the heating-side return pipe 25 is within the allowable high-temperature range. As a result, the loads of the cooling device 8 and the heating device 7 can be stabilized.

[0061] FIG. 4 is a schematic diagram showing another embodiment of a semiconductor manufacturing system including a heat medium supply device 1 and a plurality of semiconductor manufacturing devices 2. The heat medium supply device 1 is the heat medium supply device 1 of any of the embodiments described with reference to FIGS. 1 to 3. As shown in FIG. 4, the heat medium supply device 1 is connected to a plurality of semiconductor manufacturing devices 2 via a plurality of heat medium mixing devices 5. More specifically, each of the heating medium transfer pipe 11, the cooling medium transfer pipe 12, the heating-side return pipe 25, and the cooling-side return pipe 26 of the heat medium supply device 1 is connected to a plurality of semiconductor manufacturing devices 2 via a plurality of heat medium mixing devices 5. The heat medium supply device 1 of the present embodiment can adjust the processing temperatures of the plurality of semiconductor manufacturing devices 2.

[0062] The above-described embodiments are described for the purpose of enabling a person having ordinary knowledge in the technical field to which the present invention pertains to practice the present invention. Various modifications of the above embodiments can be naturally made by those skilled in the art, and the technical idea of the present invention can also be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, but is to be construed in the broadest scope in accordance with the technical idea defined by the claims.

Explanation of Reference Numerals

[0063] 1 Heat medium supply device 2 Semiconductor manufacturing equipment 5 Heat medium mixing device 7 Heating device 8 Cooling device 11 Heating medium transfer pipe 12 Cooling medium transfer pipe 15 Heating side tank 16 Cooling side tank 17 Cooling side outlet pipe 18, 19 Heat insulation material 20 Tank communication pipe 21 Communication valve 25 Heating side return pipe 26 Cooling side return pipe 31 Heating side liquid level detection device 32 Cooling side liquid level detection device 33 Heating side pump 34 Cooling side pump 35 Operation control unit 41 Cooling side temperature measuring device 44 Cooling side bypass pipe 45 Cooling side bypass valve 51 Heating side temperature measuring device 54 Heating side bypass pipe 55 Heating side bypass valve 57 Heating side outlet pipe

Claims

1. A heat medium supply device for supplying a heat medium for adjusting the temperature of a semiconductor manufacturing apparatus, comprising: a heating device for heating the heat medium; a cooling device for cooling the heat medium; a heating medium transfer pipe for sending the heated heat medium to the semiconductor manufacturing apparatus; a cooling medium transfer pipe for sending the cooled heat medium to the semiconductor manufacturing apparatus; a heating side tank and a cooling side tank for holding the heat medium; a heating side return pipe for returning the heat medium that has passed through the semiconductor manufacturing apparatus to the heating side tank; a cooling side return pipe for returning the heat medium that has passed through the semiconductor manufacturing apparatus to the cooling side tank; a cooling side temperature measuring device provided in the cooling side return pipe for measuring the temperature of the heat medium in the cooling side return pipe; a cooling side outlet pipe for transferring the heat medium from the cooling side tank to the cooling device; a cooling side bypass pipe extending from the cooling side return pipe to bypass the cooling side tank and extending to the cooling side outlet pipe; a cooling side bypass valve provided in the cooling side bypass pipe; and an operation control unit for controlling the operation of the cooling side bypass valve, wherein the operation control unit opens the cooling side bypass valve when the temperature of the heat medium in the cooling side return pipe measured by the cooling side temperature measuring device is within a preset allowable low temperature range; and is configured to close the cooling side bypass valve when the temperature of the heat medium in the cooling side return pipe measured by the cooling side temperature measuring device is outside the allowable low temperature range. A heat medium supply device.

2. a heating side temperature measuring device provided in the heating side return pipe for measuring the temperature of the heat medium in the heating side return pipe; a heating side outlet pipe for transferring the heat medium from the heating side tank to the heating device; a heating side bypass pipe extending from the heating side return pipe to bypass the heating side tank and extending to the heating side outlet pipe; further comprising a heating side bypass valve provided in the heating side bypass pipe, wherein the operation control unit opens the heating side bypass valve when the temperature of the heat medium in the heating side return pipe measured by the heating side temperature measuring device is within a preset allowable high temperature range; and is configured to close the heating side bypass valve when the temperature of the heat medium in the heating side return pipe measured by the heating side temperature measuring device is outside the allowable high temperature range. The heat medium supply device according to claim 1.

3. The semiconductor manufacturing apparatus is a plurality of semiconductor manufacturing apparatuses. The heat medium supply device according to claim 1, wherein each of the heat medium transfer pipe, the cooling medium transfer pipe, the heating side return pipe, and the cooling side return pipe is connected to the plurality of semiconductor manufacturing apparatuses.

4. A heat medium supply device for supplying a heat medium for adjusting the temperature of a semiconductor manufacturing apparatus, comprising: a heating device for heating the heat medium; a cooling device for cooling the heat medium; a heating medium transfer pipe for sending the heated heat medium to the semiconductor manufacturing apparatus; a cooling medium transfer pipe for sending the cooled heat medium to the semiconductor manufacturing apparatus; a heating side tank and a cooling side tank for holding the heat medium; a heating side return pipe for returning the heat medium that has passed through the semiconductor manufacturing apparatus to the heating side tank; a cooling side return pipe for returning the heat medium that has passed through the semiconductor manufacturing apparatus to the cooling side tank; a heating side temperature measuring device provided in the heating side return pipe for measuring the temperature of the heat medium in the heating side return pipe; a heating side outlet pipe for transferring the heat medium from the heating side tank to the heating device; a heating side bypass pipe extending from the heating side return pipe to bypass the heating side tank and extending to the heating side outlet pipe; a heating side bypass valve provided in the heating side bypass pipe; an operation control unit for controlling the operation of the cooling side bypass valve, wherein the operation control unit opens the heating side bypass valve when the temperature of the heat medium in the heating side return pipe measured by the heating side temperature measuring device is within a preset allowable high temperature range; The heat medium supply device is configured to close the heating side bypass valve when the temperature of the heat medium in the heating side return pipe measured by the heating side temperature measuring device is outside the allowable high temperature range.

5. a cooling side temperature measuring device provided in the cooling side return pipe for measuring the temperature of the heat medium in the cooling side return pipe; a cooling side outlet pipe for transferring the heat medium from the cooling side tank to the cooling device; a cooling side bypass pipe extending from the cooling side return pipe to bypass the cooling side tank and extending to the cooling side outlet pipe; further comprising a cooling side bypass valve provided in the cooling side bypass pipe, wherein the operation control unit opens the cooling side bypass valve when the temperature of the heat medium in the cooling side return pipe measured by the cooling side temperature measuring device is within a preset allowable low temperature range; The heat medium supply device according to claim 4, wherein when the temperature of the heat medium in the cooling side return pipe measured by the cooling side temperature detector is outside the allowable low temperature range, the cooling side bypass valve is configured to be closed.

6. The semiconductor manufacturing apparatus is a plurality of semiconductor manufacturing apparatuses, The heat medium supply device according to claim 4, wherein each of the heating medium transfer pipe, the cooling medium transfer pipe, the heating side return pipe, and the cooling side return pipe is connected to the plurality of semiconductor manufacturing apparatuses.

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