Information processing device, semiconductor manufacturing device, and information processing method

Abstract

To provide a technique, according to the present disclosure, for further improving reliability of data for performing abnormality detection of a semiconductor manufacturing device.SOLUTION: An information processing device includes: a grouping information creating part that acquires a setting value for each processing step of a semiconductor manufacturing device that executes the processing step according to the setting value, and creates information for grouping the processing steps executed according to the same setting value; a data extraction part that extracts one or more second processing steps that are the same as the setting values of the first processing step and are executed before the first processing step if the setting values of the first processing step specified from the time when an abnormality occurs are included in the information to be grouped; an analysis target section setting part that sets the first processing step and the second processing step as an analysis target section; and a display control part that displays a graph indicating an analysis result of the analysis target section.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present disclosure relates to an information processing apparatus, a semiconductor manufacturing apparatus, and an information processing method.

Background Art

[0002] Conventionally, a technique for performing anomaly detection using charts such as an SPC (Statistical Process Control) chart, a correlation chart, and an MD chart that display time-series information measured by a semiconductor manufacturing apparatus has been known (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure provides a technique for further improving the reliability of data for performing anomaly detection of a semiconductor manufacturing apparatus.

Means for Solving the Problems

[0005] One aspect of the present disclosure includes a grouping information creation unit that acquires the set value for each processing step of a semiconductor manufacturing apparatus that has executed a processing step according to a set value, and creates information for grouping the processing steps executed according to the same set value; a data extraction unit that extracts one or more second processing steps that were executed before the first processing step and that have the same set value as the set value of the first processing step if the set value of the first processing step specified from the time when an anomaly occurred is included in the information for grouping; an analysis target section setting unit that sets the first processing step and the second processing steps as an analysis target section; and a display control unit that displays a graph showing the analysis result of the analysis target section.

Advantages of the Invention

[0006] According to the present disclosure, it is possible to provide a technique for further improving the reliability of data for detecting abnormalities in semiconductor manufacturing equipment.

Brief Description of the Drawings

[0007]

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Embodiments for Carrying Out the Invention

[0008] Hereinafter, the present embodiment will be described with reference to the drawings.

[0009] <System Configuration> FIG. 1 is a configuration diagram of an example of a semiconductor manufacturing system 1 according to the present embodiment. The semiconductor manufacturing system 1 shown in FIG. 1 includes a semiconductor manufacturing apparatus 10, an apparatus controller 12, an autonomous control controller 14, a server apparatus 16, and an operator terminal 18.

[0010] The semiconductor manufacturing apparatus 10, the apparatus controller 12, and the autonomous control controller 14 are installed in the manufacturing factory 2. The server apparatus 16 and the operator terminal 18 may be installed in the manufacturing factory 2 or may be installed outside the manufacturing factory 2. The operator terminal 18 is an information processing terminal such as a PC (Personal Computer) or a smartphone that is operated by an operator such as an apparatus person in charge or an analysis person in charge of the semiconductor manufacturing apparatus 10 installed in the manufacturing factory 2.

[0011] The semiconductor manufacturing apparatus 10, the apparatus controller 12, the autonomous control controller 14, the server apparatus 16, and the operator terminal 18 are communicably connected via networks 20 and 22 such as the Internet or a LAN (Local Area Network).

[0012] The semiconductor manufacturing apparatus 10 is an apparatus that performs processes such as a film forming process, an etching process, or an ashing process, and processes, for example, a semiconductor wafer (hereinafter simply referred to as a wafer). The semiconductor manufacturing apparatus 10 is, for example, a substrate processing apparatus, a heat treatment apparatus, or a film forming apparatus.

[0013] The semiconductor manufacturing apparatus 10 receives, for example, a control command (set value) according to a recipe from the apparatus controller 12 and executes a process. The semiconductor manufacturing apparatus 10 is provided with a plurality of sensors such as a temperature sensor that measures temperature and a pressure sensor that measures pressure.

[0014] The device controller 12 has the function of a man-machine interface that receives instructions for the semiconductor manufacturing device 10 from an operator and provides information regarding the semiconductor manufacturing device 10 to the operator. The device controller 12 receives sensor data output from a plurality of sensors installed in the semiconductor manufacturing device 10. The device controller 12 may perform optimization of set values of the semiconductor manufacturing device 10, abnormality detection, or abnormality prediction, etc.

[0015] The device controller 12 shown in FIG. 1 is provided for each semiconductor manufacturing device 10, but may be provided for a plurality of semiconductor manufacturing devices 10. The device controller 12 may be provided inside the housing of the semiconductor manufacturing device 10, or may be provided outside the housing.

[0016] The autonomous control controller 14 is a controller for autonomously controlling the semiconductor manufacturing device 10. The autonomous control controller 14 receives sensor data output from a plurality of sensors installed in the semiconductor manufacturing device 10. The autonomous control controller 14 performs optimization of set values of the semiconductor manufacturing device 10, abnormality detection, or abnormality prediction, etc. The autonomous control controller 14 shown in FIG. 1 is provided for each semiconductor manufacturing device 10, but may be provided for a plurality of semiconductor manufacturing devices 10. The autonomous control controller 14 may be provided inside the housing of the semiconductor manufacturing device 10, or may be provided outside the housing.

[0017] The server device 16 may receive sensor data output from a plurality of sensors installed in the semiconductor manufacturing device 10 and save it as a process log for each execution of a process (hereinafter referred to as Run).

[0018] The server device 16 may save information regarding a plurality of semiconductor manufacturing devices 10 in, for example, one or more manufacturing plants 2 (set values of processes executed by the semiconductor manufacturing devices 10, sensor data when the processes are executed according to the set values, and result data, etc.) as a process log for each Run.

[0019] The device controller 12, the autonomous control controller 14, and the server device 16 may display information regarding the semiconductor manufacturing apparatus 10 on the operator terminal 18, or may notify the operator of the operator terminal 18 using e-mail or the like. The device controller 12, the autonomous control controller 14, the server device 16, and the operator terminal 18 shown in FIG. 1 are examples of the information processing apparatus according to the present embodiment.

[0020] Note that the semiconductor manufacturing system 1 shown in FIG. 1 is an example, and it goes without saying that there are various system configuration examples depending on the application and purpose. The classification of devices such as the device controller 12, the autonomous control controller 14, and the server device 16 shown in FIG. 1 is an example. For example, various configurations are possible, such as a configuration in which at least two of the device controller 12, the autonomous control controller 14, and the server device 16 are integrated, or a further divided configuration. Also, the device controller 12 and the autonomous control controller 14 may be configured to handle a plurality of semiconductor manufacturing apparatuses 10 collectively.

[0021] <Hardware Configuration> The device controller 12, the autonomous control controller 14, the server device 16, and the operator terminal 18 shown in FIG. 1 may be realized by a computer having a hardware configuration as shown in FIG. 2, for example. FIG. 2 is a hardware configuration diagram of an example of the computer 500.

[0022] The computer 500 in FIG. 2 includes an input device 501, an output device 502, an external I / F (interface) 503, a RAM (Random Access Memory) 504, a ROM (Read Only Memory) 505, a CPU (Central Processing Unit) 506, a communication I / F 507, and an HDD (Hard Disk Drive) 508, etc., and each is mutually connected by a bus B. The input device 501 and the output device 502 may be in a form that is connected and used when necessary.

[0023] The input device 501 is a keyboard, mouse, touch panel, etc., and is used for an operator or the like to input an operation signal. The output device 502 is a display or the like, and displays the processing result by the computer 500. The communication I / F 507 is an interface that connects the computer 500 to the networks 20 and 22 shown in FIG. 1. The HDD 508 is an example of a non-volatile storage device that stores programs and data.

[0024] The external I / F 503 is an interface with an external device. The computer 500 can read a recording medium 503a such as an SD (Secure Digital) memory card via the external I / F 503. The external I / F 503 may be able to write to a recording medium 503a such as an SD memory card via the external I / F 503.

[0025] The ROM 505 is an example of a non-volatile semiconductor memory (storage device) in which programs and data are stored. The RAM 504 is an example of a volatile semiconductor memory (storage device) that temporarily holds programs and data. The CPU 506 is an arithmetic unit that realizes the control and functions of the entire computer 500 by reading programs and data from a storage device such as the ROM 505 or the HDD 508 onto the RAM 504 and executing processing.

[0026] The device controller 12, the autonomous control controller 14, the server device 16, and the operator terminal 18 of the semiconductor manufacturing system 1 shown in FIG. 1 realize various functions by executing a program on the computer 500 shown in FIG. 2.

[0027] <Functional Configuration> Hereinafter, an example will be described in which the autonomous control controller 14 is an information processing device that further improves the reliability of data for detecting abnormalities in the semiconductor manufacturing apparatus 10. Note that the information processing device that further improves the reliability of data for detecting abnormalities in the semiconductor manufacturing apparatus 10 may be the device controller 12, the server device 16, or the operator terminal 18.

[0028] The autonomous control controller 14 of the semiconductor manufacturing system 1 according to this embodiment is realized by, for example, the functional blocks shown in FIG. 3. FIG. 3 is a functional block diagram of an example of the autonomous control controller 14 according to this embodiment. Note that the functional block diagram of FIG. 3 omits the illustration of configurations unnecessary for the description of this embodiment.

[0029] By executing a program for the autonomous control controller 14, the autonomous control controller 14 realizes a data acquisition unit 30, a data storage unit 32, an alarm acquisition unit 34, a step - type trend graph creation unit 36, an event - type trend graph creation unit 38, an input reception unit 40, a score calculation unit 42, a display control unit 44, and an abnormality detection unit 46.

[0030] The data acquisition unit 30 acquires information regarding the semiconductor manufacturing apparatus 10 that executes a process according to a set value (the set value of the process executed by the semiconductor manufacturing apparatus 10, sensor data when the process is executed according to the set value, result data, etc.). The information regarding the semiconductor manufacturing apparatus 10 acquired by the data acquisition unit 30 is stored by the data acquisition unit 30 in the data storage unit 32 for each Run as a process log (history information). Also, the information regarding the semiconductor manufacturing apparatus 10 acquired by the data acquisition unit 30 is transmitted to the abnormality detection unit 46.

[0031] The semiconductor manufacturing system 1 according to this embodiment divides a process into a plurality of processing steps (sections), and a set value is set for each processing step. The data storage unit 32 stores information regarding the semiconductor manufacturing apparatus 10 for each processing step.

[0032] The alarm acquisition unit 34 acquires alarm data reported when a specific event occurs in the semiconductor manufacturing apparatus 10 and stores it in the data storage unit 32. The alarm data includes, for example, information (such as the alarm occurrence time) used for an operator to specify an alarm to be analyzed.

[0033] The input reception unit 40 receives various specifications from the operator. For example, the specifications received from the operator include the specification of the alarm to be analyzed. The step - type trend graph creation unit 36 creates a trend graph by the step - type method described later based on the alarm specified by the operator as the analysis target. Also, the event - type trend graph creation unit 38 creates a trend graph by the event - type method described later based on the alarm specified by the operator as the analysis target.

[0034] The score calculation unit 42 calculates the score of the created trend graph based on one or more scoring methods described later. The display control unit 44 performs a ranking display of the created trend graph using the score calculated by the score calculation unit 42.

[0035] The abnormality detection unit 46 may set a management value for detecting an abnormality of the semiconductor manufacturing apparatus 10 based on the trend graph selected by the operator with reference to the score from the created trend graph. Also, the abnormality detection unit 46 may automatically select the trend graph with the highest score and set a management value for detecting an abnormality of the semiconductor manufacturing apparatus 10 based on the automatically selected trend graph. The abnormality detection unit 46 detects an abnormality of the semiconductor manufacturing apparatus 10 based on the set management value and the statistical value of the sensor data acquired by the data acquisition unit 30.

[0036] Also, FIG. 4 is a functional block diagram of an example of the event - type trend graph creation unit 38 according to the present embodiment. Note that the functional block diagram of FIG. 4 omits the illustration of the configurations unnecessary for the description of the present embodiment.

[0037] The event - type trend graph creation unit 38 shown in FIG. 4 includes an apparatus state specifying unit 50, a data extraction unit 52, and a graph creation unit 54.

[0038] The device state specifying unit 50 specifies the state of the semiconductor manufacturing apparatus 10 at the time when a specific event occurs, by referring to information that defines the state (events) of the semiconductor manufacturing apparatus 10. FIG. 5 is an explanatory diagram of an example of information that defines the state of the semiconductor manufacturing apparatus 10. The device state specifying unit 50 specifies the state of the semiconductor manufacturing apparatus 10 at the time of alarm occurrence, using, for example, the information that defines the state of the semiconductor manufacturing apparatus 10 shown in FIG. 5.

[0039] The data extraction unit 52 extracts, from the data storage unit 32, the history information of sensor data in an event section that matches the state of the semiconductor manufacturing apparatus 10 at the time of alarm occurrence. Note that the history information of sensor data extracted by the data extraction unit 52 is also referred to as trace data.

[0040] The graph creation unit 54 creates a trend graph showing time-series data statistically processed from sensor data, by referring to information that defines a statistical processing method. The graph creation unit 54 specifies, for example, a statistical processing method for creating a trend graph, by referring to the information that defines the statistical processing method. The information that defines the statistical processing method defines a method used to statistically process sensor data. FIG. 6 is an explanatory diagram of an example of the information that defines the statistical processing method.

[0041] Further, FIG. 7 is a functional block diagram of an example of the step method trend graph creation unit 36 according to the present embodiment. Note that the functional block diagram of FIG. 7 omits illustration of configurations unnecessary for the description of the present embodiment.

[0042] The step method trend graph creation unit 36 shown in FIG. 7 includes a grouping information creation unit 60, a data extraction unit 62, an analysis target section setting unit 64, and a graph creation unit 66.

[0043] The grouping information creation unit 60 creates a step catalog, which will be described later, from the set values for each processing step of the process executed by the semiconductor manufacturing apparatus 10 in past Runs stored in the data storage unit 32. Note that the step catalog is an example of information that groups processing steps executed according to the same set value.

[0044] The data extraction unit 62 identifies the set value of the processing step (an example of the first processing step) in which the alarm occurred from the alarm occurrence time. Further, the data extraction unit 62 searches whether the identified set value is included in the step catalog.

[0045] If the identified set value is included in the step catalog, the data extraction unit 62 extracts one or more processing steps (an example of the second processing step) that are the same as the identified set value and are executed before the first processing step.

[0046] The analysis target section setting unit 64 sets the first processing step and the second processing step as the analysis target section. The graph creation unit 66 creates a trend graph showing the analysis result of the analysis target section by using the statistical value of the sensor data of the semiconductor manufacturing apparatus 10 in the analysis target section.

[0047] <Process> The grouping information creation unit 60 creates a step catalog by, for example, the processing procedure shown in FIG. 8. FIG. 8 is a flowchart of an example of the creation process of the step catalog according to the present embodiment.

[0048] In step S10, the grouping information creation unit 60 receives from the operator the designation of the sensors of the semiconductor manufacturing apparatus 10 used for creating the step catalog.

[0049] In step S12, the grouping information creation unit 60 receives from the operator the designation of the data period of the semiconductor manufacturing apparatus 10 used for creating the step catalog.

[0050] In step S14, the grouping information creation unit 60 acquires from the data storage unit 32 the process logs of all the processing steps of all the Runs in the data period designated by the operator in step S12.

[0051] The grouping information creation unit 60 performs the processes of steps S16 to S20 on the process logs of each processing step of each Run acquired in step S14.

[0052] In step S16, the grouping information creation unit 60 acquires the set values of each processing step for all the sensors specified by the operator in step S10. In step S18, the grouping information creation unit 60 determines whether the set value of the processing step acquired in step S16 exactly matches the set value of the processing step (other processing steps) included in the step catalog.

[0053] If the set value of the processing step acquired in step S16 does not exactly match the set value of other processing steps, the grouping information creation unit 60 proceeds to step S20. The grouping information creation unit 60 adds the set value of the processing step acquired in step S16 to the step catalog as a new processing step. If the set value of the processing step acquired in step S16 exactly matches the set value of other processing steps, the grouping information creation unit 60 skips the process of step S20.

[0054] Through the processing of the flowchart in FIG. 8, the grouping information creation unit 60 can create a step catalog as information for grouping the processing steps executed according to the same set value. The step catalog is used to classify or collate the processing steps executed according to the same set value.

[0055] Note that in the flowchart of FIG. 8, an example of receiving the designation of the data period of the semiconductor manufacturing apparatus 10 used for creating the step catalog from the operator is described, but it may also be performed by batch processing for each predetermined period.

[0056] The autonomous control controller 14 according to the present embodiment displays the trend graph in ranking according to the processing procedure shown in FIG. 9, for example. FIG. 9 is a flowchart of an example of the display process of the trend graph according to the present embodiment.

[0057] In step S30, the input reception unit 40 receives from the operator a specification of the alarm to be analyzed. The specification of the alarm to be analyzed may be made, for example, by inputting the alarm generation time.

[0058] In step S32, the input reception unit 40 determines whether creation of a trend graph by the step method is selected. If creation of a trend graph by the step method is not selected, the event method trend graph creation unit 38 creates a trend graph by the event method in step S34.

[0059] If creation of a trend graph by the step method is selected, the step method trend graph creation unit 36 proceeds to step S36. In step S36, the step method trend graph creation unit 36 identifies the set value of the processing step (the corresponding processing step) at which the alarm occurred from the alarm generation time. Further, the step method trend graph creation unit 36 determines whether the identified set value exists in the step catalog.

[0060] If the identified set value exists in the step catalog, the step method trend graph creation unit 36 creates a trend graph by the step method in step S38. If the identified set value does not exist in the step catalog, the step method trend graph creation unit 36 proceeds to step S40. In step S40, the step method trend graph creation unit 36 adds the corresponding processing step as a new processing step to the step catalog and then ends the processing of the flowchart in FIG. 9.

[0061] Subsequently, following step S34 or S38, the process proceeds to step S42, and the score calculation unit 42 calculates the score of the trend graph created in step S34 or S38 based on one or more scoring methods described later. Further, the display control unit 44 ranks and displays the created trend graph using the score calculated by the score calculation unit 42 and then ends the processing of the flowchart in FIG. 9.

[0062] The trend graph is a graph that plots the statistical values of trace data at each processing step of each Run in chronological order, for example, an SPC chart. An operator can select a trend graph with reference to the scores from the ranked trend graphs.

[0063] Regarding the creation of the trend graph by the event method shown in step S34, further explanation is provided. The device state identification unit 50 identifies a state that matches the state of the semiconductor manufacturing device 10 at the time of alarm occurrence using the information defining the state of the semiconductor manufacturing device 10 shown in FIG. 5.

[0064] Next, the data extraction unit 52 extracts the history information of the sensor data in the event interval that matches the state of the semiconductor manufacturing device 10 at the time of alarm occurrence (for example, during LEAK CHECK, etc.) from the data storage unit 32.

[0065] Next, the graph creation unit 54 refers to the information defining the statistical processing method shown in FIG. 6, selects a method for statistically processing the history information of the sensor data in the extracted event interval, and creates a trend graph by the event method using the selected statistical processing method.

[0066] For example, the event method trend graph creation unit 38 extracts the past sensor data near the event interval where a trouble occurred and creates a plurality of SPC charts. When the average value is selected as the statistical processing method, the event method trend graph creation unit 38 creates an SPC chart of the average value of the past sensor data near the event interval where a trouble occurred.

[0067] Regarding the creation of the trend graph by the step method shown in step S38, further explanation is provided. FIG. 10 is a diagram for explaining an example of the creation of the trend graph by the step method. FIG. 10 describes the Run of the semiconductor manufacturing device 10 where an alarm occurred as AlarmRun100.

[0068] In step S100, the data extraction unit 62 identifies the set value of the processing step (processing step D) of AlarmRun100 at which the alarm occurred from the alarm generation time of AlarmRun100.

[0069] In step S102, the data extraction unit 62 searches the step catalog using the set value identified in step S100 to determine whether the processing step of the identified set value has been executed in the past. FIG. 10 shows an example in which the set value of "Catalog-2" included in the step catalog is the same as the set value identified in step S100.

[0070] When it is determined that the processing step of the identified set value has been executed in the past, the data extraction unit 62 proceeds to step S104. The data extraction unit 62 extracts the processing steps of one or more Runs (Run_k to Run_1) that were executed before AlarmRun100 and that have the same processing step as the processing step D of the set value identified in step S100.

[0071] When it is determined that the processing step of the identified set value has not been executed in the past, the grouping information creation unit 60 adds the set value of the processing step D obtained in step S100 to the step catalog as a new processing step.

[0072] The analysis target section setting unit 64 sets the processing step D at which the alarm occurred and the processing steps extracted in step S104 as the analysis target section. The data extraction unit 62 extracts the history information of the sensor data in the analysis target section from the data storage unit 32.

[0073] Next, the graph creation unit 66 refers to the information defining the statistical processing method shown in FIG. 6, selects a method for statistically processing the history information of the sensor data in the extracted analysis target section, and creates a trend graph in a step-by-step manner using the selected statistical processing method.

[0074] For example, the step-by-step trend graph creation unit 36 extracts sensor data of the processing steps in the analysis target section and creates a plurality of SPC charts. When the average value is selected as the statistical processing method, the step-by-step trend graph creation unit 36 creates an SPC chart of the average value of the sensor data of the processing steps in the analysis target section.

[0075] The ranking display of the trend graph shown in step S42 will be further explained. The score calculation unit 42 calculates the score of the created trend graph based on one or more scoring methods.

[0076] FIG. 11 is a diagram for explaining an example of the created trend graph. The horizontal axis of the trend graph shown in FIG. 11 indicates the date and time (hour), and the vertical axis indicates the average value of the gas flow rate. The average value of the gas flow rate is an example of a statistical value. The statistical value may be, for example, the standard deviation of the gas flow rate or a value obtained by statistically processing other sensor data.

[0077] FIG. 12 is a diagram for explaining an example of a scoring method for calculating the score of the trend graph. As the scoring method for calculating the score of the trend graph, for example, a scoring method for calculating a trend score, an alarm score, or a confidence score shown in FIG. 12 is used. Note that the scoring method for calculating the score of the trend graph is not limited to the scoring method shown in FIG. 12, and other scoring methods such as a scoring method using a regression coefficient may be used.

[0078] The operator selects one trend graph with reference to the score from the ranked trend graphs, for example. The abnormality detection unit 46 may set a control value for detecting an abnormality of the semiconductor manufacturing apparatus 10 based on the trend graph selected by the operator with reference to the score from the created trend graphs. The control value is at least one of the upper limit value and the lower limit value of the trend graph used for issuing an alarm.

[0079] For example, in the trend graph of FIG. 11, a management value for issuing an alarm (the line indicated by Alarm Band in FIG. 11) is set. The abnormality detection unit 46 can monitor the statistical value of the sensor data of the semiconductor manufacturing apparatus 10 using the management value set as shown in FIG. 11, for example, and detect an abnormality in the semiconductor manufacturing apparatus 10.

[0080] According to the semiconductor manufacturing system 1 according to the present embodiment, the measurement interval at the time of creating a trend graph by the event method can be set using an event interval defined in advance for each semiconductor manufacturing apparatus 10.

[0081] Further, according to the semiconductor manufacturing system 1 according to the present embodiment, by grouping the processing steps with the same set value, the analysis target interval at the time of creating a trend graph by the step method can be set. Further, according to the semiconductor manufacturing system 1 according to the present embodiment, by grouping the processing steps with the same set value, it becomes possible to compare the statistical values of the processing steps with different set values, and the reliability of the trend graph by the step method is improved.

[0082] Further, according to the semiconductor manufacturing system 1 according to the present embodiment, at the time of creating a trend graph by the step method, an unknown processing step is automatically added to the step catalog as a new processing step, so that the step catalog grows by itself and can be treated as a known processing step after the next time. Further, according to the semiconductor manufacturing system 1 according to the present embodiment, at the time of creating a trend graph by the step method, a processing step other than the alarm generation time can be set as the analysis target interval.

[0083] Furthermore, the semiconductor manufacturing system 1 according to the present embodiment may create and use a step catalog of the semiconductor manufacturing apparatus 10 for each unit, or may create and use a step catalog of a plurality of semiconductor manufacturing apparatuses 10.

[0084] As described above, the preferred embodiments of the present embodiment have been described in detail. However, the present embodiment is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope of the present embodiment.

[0085] The semiconductor manufacturing apparatus 10 of the present disclosure is applicable to any type of apparatus such as an Atomic Layer Deposition (ALD) apparatus, a Capacitively Coupled Plasma (CCP), an Inductively Coupled Plasma (ICP), a Radial Line Slot Antenna (RLSA), an Electron Cyclotron Resonance Plasma (ECR), or a Helicon Wave Plasma (HWP). The semiconductor manufacturing apparatus 10 of the present disclosure is also applicable to a CVD (chemical vapor deposition) apparatus and an oxidation / annealing apparatus.

[0086] The semiconductor manufacturing system 1 of the present disclosure is not limited to the configuration shown in FIG. 1, and it goes without saying that there are various system configuration examples according to the application and purpose. The semiconductor manufacturing apparatus 10 of the present disclosure can be applied to any of a single-wafer apparatus that processes substrates one by one, a batch apparatus that processes a plurality of substrates collectively, and a semi-batch apparatus. The processes performed by the semiconductor manufacturing apparatus 10 of the present disclosure include, for example, a film formation process, an etching process, and the like.

Description of Reference Numerals

[0087] 1 Semiconductor manufacturing system 10 Semiconductor manufacturing apparatus 12 Apparatus controller 14 Autonomous control controller 16 Server apparatus 18 Operator terminal 36 Step method trend graph creation unit 38 Event method trend graph creation unit 60 Grouping information creation unit 62 Data extraction unit 64 Analysis target section setting unit 66 Graph Creation Unit

Claims

1. A grouping information creation unit that acquires the set values for each processing step of a semiconductor manufacturing apparatus that has executed processing steps according to set values, and creates information for grouping the processing steps executed according to the same set values; If the set value of the first processing step specified from the time when an abnormality occurred is included in the information for grouping, a data extraction unit that extracts one or more second processing steps that are the same as the set value of the first processing step and that were executed before the first processing step; An analysis target range setting unit that sets the first processing step and the second processing steps as an analysis target range; A display control unit that displays a graph showing the analysis result of the analysis target range; An information processing apparatus having the above.

2. The grouping information creation unit: If the set value of the first processing step is not included in the information for grouping, adds the set value of the first processing step to the information for grouping The information processing apparatus according to Claim 1.

3. A graph creation unit that creates a graph showing the analysis result of the analysis target range by using a statistical value of sensor data of the semiconductor manufacturing apparatus in the analysis target range, The information processing apparatus according to Claim 1 or 2, further comprising the above.

4. A score calculation unit that calculates a score of the graph based on one or more scoring methods, Further comprising: The graph creation unit: Creates one or more graphs showing the analysis result of the analysis target range by using the statistical values calculated based on one or more statistical processing methods, The display control unit displays a ranking result of the one or more graphs by using the score The information processing apparatus according to Claim 3.

5. An abnormality detection unit that detects an abnormality of the semiconductor manufacturing apparatus by using a management value set based on the graph, The information processing apparatus according to Claim 1 or 2, further comprising the above.

6. A grouping information creation unit that acquires set values for each executed processing step and creates information for grouping the processing steps executed according to the same set values; If the set value of the first processing step specified from the time when an abnormality occurred is included in the information for grouping, a data extraction unit that extracts one or more second processing steps that are the same as the set value of the first processing step and that were executed before the first processing step; An analysis target section setting unit that sets the first processing step and the second processing step in an analysis target section; A display control unit that displays a graph showing the analysis result of the analysis target section; A semiconductor manufacturing apparatus having the same.

7. An information processing method performed by an information processing apparatus, comprising: Obtaining the set value for each processing step of a semiconductor manufacturing apparatus that has executed processing steps according to a set value, and creating information for grouping the processing steps executed according to the same set value; If the set value of the first processing step specified from the time when an abnormality occurred is included in the information for grouping, extracting one or more second processing steps that are the same as the set value of the first processing step and are executed before the first processing step; Setting the first processing step and the second processing step in an analysis target section; Displaying a graph showing the analysis result of the analysis target section; An information processing method having the same.

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