Substrate treatment apparatus, method of manufacturing semiconductor device, and program

Abstract

To provide a technology that enables the prediction of an energy amount required for treatment, before a substrate is treated.SOLUTION: A substrate treatment apparatus comprises: a treatment part for treating a substrate on the basis of at least one setting item defining a substrate treatment condition; an operation part for performing a setting operation of the treatment condition defined by the setting item; and a control part capable of performing control so as to calculate the amount of energy consumed on the set treatment condition.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present disclosure relates to a substrate processing apparatus, a method for manufacturing a semiconductor device, and a program.

Background Art

[0002] In a substrate processing apparatus, the amount of energy required for processing may be calculated using measurement values obtained from various sensors during the processing of the substrate (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When calculating the amount of energy using measurement values obtained from various sensors, it may not be possible to predict the amount of energy before processing the next substrate.

[0005] The present disclosure provides a technique capable of predicting the amount of energy required for processing before processing a substrate.

Means for Solving the Problems

[0006] According to one aspect of the present disclosure, there is provided a technique including a processing unit that processes the substrate according to at least one setting item defining processing conditions of the substrate, an operation unit that performs a setting operation on the processing conditions of the setting item, and a control unit that can be controlled to calculate the amount of energy consumed under the set processing conditions.

Effects of the Invention

[0007] According to the present disclosure, it is possible to predict the amount of energy required for processing before processing a substrate.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Modes for Carrying Out the Invention

[0009] Hereinafter, one aspect of the present disclosure will be described mainly with reference to FIGS. 1 to 3. Note that the drawings used in the following description are all schematic, and the dimensional relationships and ratios of the respective elements shown in the drawings do not necessarily match the actual ones. Also, the dimensional relationships and ratios of the respective elements do not necessarily match among the plurality of drawings. Further, the present disclosure is not limited to the following embodiments, and can be implemented with appropriate modifications within the scope of the present disclosure.

[0010] First, with reference to FIGS. 1 and 2, an overview of the substrate processing apparatus according to the present embodiment will be described.

[0011] FIG. 1 is a perspective view showing an example of a substrate processing apparatus 1 according to the present embodiment. Further, FIG. 2 is a cross-sectional view of the substrate processing apparatus 1 according to the present embodiment as viewed from the side. FIGS. 1 and 2 show a vertical substrate processing apparatus 1 as an example of the substrate processing apparatus. Note that, as an example, a semiconductor wafer made of silicon or the like is shown as the substrate processed in the substrate processing apparatus 1. Note that the term "wafer" used in this specification may mean the wafer itself or a laminate of the wafer and a predetermined layer or film formed on the surface thereof. The term "surface of the wafer" used in this specification may mean the surface of the wafer itself or the surface of a predetermined layer or the like formed on the wafer. When it is described in this specification that "a predetermined layer is formed on the wafer", it may mean directly forming a predetermined layer on the surface of the wafer itself or forming a predetermined layer on a layer or the like formed on the wafer. When the term "substrate" is used in this specification, it has the same meaning as when the term "wafer" is used.

[0012] As shown in FIGS. 1 and 2, the substrate processing apparatus 1 includes a housing 2. A pod loading / unloading port 6 is formed in the front wall 3 of the housing 2 so as to communicate the inside and outside of the housing 2. The pod loading / unloading port 6 is opened and closed by a front shutter (loading / unloading port opening / closing mechanism) 7. A load port (substrate transfer container delivery stand) 8 is installed on the front side directly in front of the pod loading / unloading port 6.

[0013] The pod 9 is a sealed substrate transfer container and is configured to be loaded onto the load port 8 and unloaded from the load port 8 by an in-process transfer device (not shown).

[0014] An upper portion at a substantially central portion in the front-rear direction inside the housing 2 is provided with a rotary pod rack (substrate transfer container storage rack) 11. The rotary pod rack 11 includes a plurality of shelf boards (substrate transfer container placement shelves) 13 configured to store the pod 9 in a state where at least one pod 9 is placed.

[0015] Below the rotary pod shelf 11, a pod opener (substrate transfer container lid opening and closing mechanism) 14 is provided. The pod opener 14 is configured to place the pod 9 and to be able to open and close the lid of the pod 9.

[0016] A pod transfer mechanism (container transfer mechanism) 15 is installed between the load port 8, the rotary pod shelf 11, and the pod opener 14, and is configured to transfer the pod 9 between the load port 8, the rotary pod shelf 11, and the pod opener 14.

[0017] A sub-housing 16 is provided across the rear end at the lower part of the substantially central portion in the front-rear direction inside the housing 2. A pair of wafer loading / unloading ports (substrate loading / unloading ports) 19 for loading and unloading the wafer (substrate) 18 into and out of the sub-housing 16 are opened in the front wall 17 of the sub-housing 16.

[0018] The pod opener 14 includes a mounting table 21 for mounting the pod 9 and an opening and closing mechanism 22 for opening and closing the lid of the pod 9. The pod opener 14 is configured to open and close the wafer entrance and exit of the pod 9 by opening and closing the lid of the pod 9 mounted on the mounting table 21 with the opening and closing mechanism 22.

[0019] The sub-housing 16 forms an airtight transfer chamber 23 from the space (pod transfer space) where the pod transfer mechanism 15 and the rotary pod shelf 11 are arranged. A wafer transfer mechanism (substrate transfer mechanism) 24 is installed in the front region of the transfer chamber 23. By the wafer transfer mechanism 24, a predetermined number of wafers 18 (five in FIG. 2) for mounting the wafers 18 can be linearly moved, rotated, or lifted in the horizontal direction. The wafer transfer mechanism 24 is configured to load and unload the wafers 18 with respect to the boat (substrate holder) 26.

[0020] In the rear area of the transfer chamber 23, a standby unit 27 for accommodating and waiting the boat 26 is configured, and a vertical processing furnace 28 is provided above the standby unit 27. Note that the processing chamber 29 is also referred to as a processing container and is an example of a processing unit. The configuration of the processing furnace 28 according to this embodiment will be described with reference to FIG. 3. FIG. 3 is a longitudinal sectional view of the processing furnace 28 of the substrate processing apparatus 1 according to this embodiment.

[0021] As shown in FIG. 3, the processing furnace 28 includes a process tube 40 as a reaction tube. Inside the process tube 40, a processing chamber 29 for processing the wafer 18 is formed. The inside of the processing chamber 29 is configured to be able to accommodate the boat 26. Outside the process tube 40, a heater 41 is provided. Also, a temperature sensor 270A is installed inside the process tube 40. Below the process tube 40, a manifold 42 is disposed. The process tube 40 and the manifold 42 form a reaction vessel.

[0022] Below the manifold 42, a seal cap 34 capable of hermetically closing the lower end opening of the manifold 42 is provided. To the seal cap 34, a processing gas nozzle 44A and a purge gas nozzle 44B as gas introduction parts are connected so as to communicate with the inside of the processing chamber 29. To the processing gas nozzle 44A, a processing gas supply pipe 45A is connected. On the upstream side of the processing gas supply pipe 45A, a processing gas supply source (not shown) etc. are connected via an MFC (Mass Flow Controller) 46A as a gas flow controller. Also, to the purge gas nozzle 44B, a purge gas supply pipe 45B is connected. On the upstream side of the purge gas supply pipe 45B, a purge gas supply source (not shown) etc. are connected via an MFC 46B.

[0023] The manifold 42 is provided with an exhaust pipe 47 for exhausting the atmosphere inside the processing chamber 29. On the downstream side of the exhaust pipe 47, a pressure sensor 209A, a pressure adjusting device 48 configured as, for example, an APC (Auto Pressure Contoroller), a vacuum pump 49 etc. are connected in order from the upstream side.

[0024] On the side opposite to the processing chamber 29 of the seal cap 34, a rotation mechanism 50 for rotating the boat is installed. The rotation shaft 51 of the rotation mechanism 50 penetrates the seal cap 34 and supports the boat 26 from below. The rotation mechanism 50 is configured to be able to rotate the wafer 18 by rotating the boat 26.

[0025] The seal cap 34 is configured to be lifted and lowered in the vertical direction by the boat elevator 32. By lifting and lowering the seal cap 34, the boat 26 can be configured to be transported in and out of the processing chamber 29.

[0026] The boat 26 is configured to hold a plurality of (for example, about 50 to 125) wafers 18 centered thereon and hold them in multiple stages in a horizontal posture. Note that the notation of a numerical range such as "50 to 125" in this specification means that the lower limit value and the upper limit value are included in that range. Therefore, for example, "50 to 125" means "50 or more and 125 or less". The same applies to other numerical ranges.

[0027] Next, the operation of the substrate processing apparatus 1 will be described.

[0028] When the pod 9 is supplied to the load port 8, the pod loading / unloading port 6 is opened by the front shutter 7. The pod 9 on the load port 8 is carried into the inside of the housing 2 by the pod transfer mechanism 15 through the pod loading / unloading port 6 and placed on the designated shelf board 13 of the rotary pod shelf 11. After being temporarily stored in the rotary pod shelf 11, the pod 9 is transported from the shelf board 13 to one of the pod openers 14 by the pod transfer mechanism 15 and transferred to the mounting table 21, or is directly transferred from the load port 8 to the mounting table 21.

[0029] The pod 9 placed on the mounting table 21 has its opening-side end face pressed against the opening edge portion of the wafer loading / unloading port 19 on the front wall 17 of the sub-housing 16, and the lid is removed by the opening / closing mechanism 22, and the wafer entrance / exit is opened.

[0030] When the pod 9 is opened by the pod opener 14, the wafer transfer mechanism 24 takes out the wafer 18 from the pod 9, carries it into the standby section 27, and loads (charges) it into the boat 26.

[0031] When a predetermined number of wafers 18 are loaded into the boat 26, the furnace mouth of the processing furnace 28 that was closed by the furnace mouth shutter 31 is opened by the furnace mouth shutter 31. Subsequently, the boat 26 is lifted by the boat elevator 32 and carried into (loaded into) the processing chamber 29.

[0032] After loading, the furnace mouth is hermetically sealed by the seal cap 34. In this embodiment, at this timing (after loading), there is a purge process (pre-purge process) in which the processing chamber 29 is replaced with an inert gas. As the inert gas, for example, a nitrogen (N)-containing gas can be used. As the N-containing gas, for example, nitrogen (N2) gas, ammonia (NH3) gas, etc. can be used. As the N-containing gas, one or more of these can be used.

[0033] The processing chamber 29 is evacuated by the vacuum pump 49 so as to reach a desired pressure (degree of vacuum). Also, the processing chamber 29 is heated to a predetermined temperature by the heater 41 so as to have a desired temperature distribution.

[0034] Also, a processing gas controlled to a predetermined flow rate is supplied by the MFC 46A. In the process of the processing gas flowing through the processing chamber 29, it contacts the surface of the wafer 18, and a predetermined process is performed on the surface of the wafer 18. Further, the processing gas after the reaction is exhausted from the processing chamber 29 by the gas exhaust mechanism. The processing gas in this specification means the gas supplied into the processing chamber 29. These are the same in the following description as well.

[0035] When a preset processing time elapses, an inert gas is supplied from an inert gas supply source (not shown) by the MFC45B, the processing chamber 29 is replaced with the inert gas, and the pressure in the processing chamber 29 is restored to normal pressure (after purge process). Then, the boat 26 is lowered by the boat elevator 32 via the seal cap 34. The processing time in this specification means the time for continuing the processing. The same applies in the following description.

[0036] Regarding the unloading of the processed wafer 18, the wafer 18 and the pod 9 are discharged to the outside of the housing 2 in the reverse procedure of the above description. Unprocessed wafers 18 are further loaded into the boat 26, and the batch processing of the wafers 18 is repeated. Note that the pod 9 having the processed wafers 18 may be temporarily stored in the rotary pod shelf 11 and then transported from the shelf board 13 to the load port 8 by the pod transport mechanism 15 and discharged to the outside of the housing 2.

[0037] Here, as shown in FIGS. 1 and 2, the substrate processing apparatus 1 includes a control device 100. The control device 100 controls the substrate processing apparatus 1. The control device 100 may be built in the substrate processing apparatus 1 or may be provided so as to be accessible from the outside of the substrate processing apparatus 1.

[0038] Next, with reference to FIG. 4, the configuration of the control system of the substrate processing apparatus 1 according to the present embodiment will be described. FIG. 4 is a block diagram showing an example of the functional configuration of the control device 100 included in the substrate processing apparatus 1 according to the present embodiment.

[0039] As shown in FIG. 4, the substrate processing apparatus 1 includes a control device (main controller) 100, an external communication unit 201, an external storage unit 202, an operation unit 203, a display unit 204, a process control unit 205, and a transfer control unit 206.

[0040] The control device 100 also includes a control unit 101, a storage unit 104, an I / O port 105, and a calculation unit 106. The control unit 101 includes a CPU (Central Processing Unit) 102, a RAM (Random Access Memory) 103, and a determination unit 107. Although the calculation unit 106 is shown separately from the control unit 101, it may be implemented as a function of the control unit 101. Also, although the determination unit 107 is shown as a function of the control unit 101, it may be implemented as a function separate from the control unit 101.

[0041] The control device 100 is connected to the operation unit 203 and, via the I / O port 105, to the process control unit 205 and the conveyance control unit 206. Since the control device 100 is electrically connected to each of the process control unit 205 and the conveyance control unit 206 via the I / O port 105, it is configured to enable the transmission and reception of each data, the download and upload of each file, and the like.

[0042] The control device 100 is connected to an external host computer (not shown) via an external communication unit 201. Therefore, even when the substrate processing apparatus 1 is installed in a clean room, the host computer can be arranged in an office or the like outside the clean room. Also, the control device 100 is connected to an external storage unit 202 as a mounting unit into which a USB (Universal Serial Bus) memory or the like, which is an example of a recording medium, is inserted and removed.

[0043] The operation unit 203 integrally has the display unit 204 or is connected to the display unit 204 via a video cable or the like. The display unit 204 is, for example, a liquid crystal display panel. The display unit 204 is configured to display each operation screen for operating the substrate processing apparatus 1. The operation screen has a screen for checking the states of the substrate process system controlled by the process control unit 205 and the substrate transfer system controlled by the transfer control unit 206. Further, the display unit 204 can also be provided with each operation button as an input unit for inputting an operation instruction to the substrate process system and the substrate transfer system via the operation unit 203. The operation unit 203 causes the display unit 204 to display information generated in the substrate processing apparatus 1 via the operation screen. Further, the operation unit 203 causes, for example, the information displayed on the display unit 204 to be output to a device such as a USB memory inserted into the external storage unit 202. The operation unit 203 receives input data (input instruction) from the operation screen displayed on the display unit 204 and transmits the input data to the control device 100. Further, the operation unit 203 receives an instruction (control instruction) to execute an arbitrary substrate processing recipe (also referred to as a process recipe) among the recipes developed in the RAM 103 or the plurality of recipes stored in the storage unit 104 and transmits it to the control device 100. Note that the operation unit 203 and the display unit 204 may be configured by a touch panel. Here, although the operation unit 203 and the display unit 204 are provided separately from the control device 100, they may be configured to be integrally included in the control device 100.

[0044] The process control unit 205 includes a temperature control unit 207, a gas flow rate control unit 208, and a pressure control unit 209. The temperature control unit 207, the gas flow rate control unit 208, and the pressure control unit 209 each constitute a sub-controller and are electrically connected to the process control unit 205, so that transmission and reception of each data, download and upload of each file, etc. are possible. Note that the process control unit 205 and each sub-controller (temperature control unit 207, gas flow rate control unit 208, and pressure control unit 209) are shown separately in the figure, but they may have an integrated configuration.

[0045] The temperature control unit 207 is connected to a heating mechanism mainly composed of a heater 41 and a temperature sensor 207A. The temperature control unit 207 is configured to control the processing temperature based on the measured value detected by the temperature sensor 207A. Specifically, the temperature control unit 207 is configured to adjust the temperature in the processing chamber 29 or the temperature of the wafer 18 by controlling the temperature of the heater 41. Note that in this specification, the processing temperature means the temperature of the wafer 18 or the temperature in the processing chamber 29.

[0046] The gas flow control unit 208 is composed of MFCs 46A and 46B to which a gas flow sensor 208A is connected. The gas flow control unit 208 is configured to adjust the gas flow rate into the processing chamber 29 to a desired flow rate based on the measured value detected by the gas flow sensor 208A.

[0047] The pressure control unit 209 is connected to a gas exhaust mechanism mainly composed of a pressure sensor 209A and a pressure adjustment device 48. Note that a vacuum pump 49 may be included in the gas exhaust mechanism. The pressure control unit 209 is configured to control the processing pressure based on the pressure value detected by the pressure sensor 209A. Specifically, the pressure control unit 209 is configured to control the switching (on / off) of the pressure adjustment device 48 and the vacuum pump so that the pressure in the processing chamber 29 becomes a desired pressure at a desired timing. Note that in this specification, the processing pressure means the pressure in the processing chamber 29.

[0048] The transfer control unit 206 includes a rotation unit 210, a lifting unit 211, and a transfer unit 212. Note that although the transfer control unit 206, the rotation unit 210, the lifting unit 211, and the transfer unit 212 are shown separately in the figure, they may be integrally configured. The rotation unit 210 is a rotation unit system of the substrate processing apparatus 1 and is composed of, for example, a pod transfer mechanism 15, a wafer transfer mechanism 24, a rotation shaft 12 disposed at the center of the rotary pod rack 11, a rotation mechanism 50, and a rotation shaft 51. It is configured to control the operation of the rotation unit system based on the measured values of the position sensor 210A and the torque sensor 210B.

[0049] The elevating unit 211 is the elevating system of the substrate processing apparatus 1, and is configured to control the operation of the elevating system based on the measured values of the position sensor 211A and the torque sensor 211B. The transfer unit 212 is the transfer mechanism of the substrate processing apparatus 1, and is configured to control the operation of the transfer mechanism based on the measured values of the position sensor 212A and the torque sensor 212B. The elevating unit 211 and the transfer unit 212 are configured to control the transfer operations of, for example, the boat elevator 32, the pod transfer mechanism 15, and the wafer transfer mechanism 24, respectively.

[0050] In this embodiment, when collectively referring to the temperature sensor 207A, the gas flow rate sensor 208A, the pressure sensor 209A, the position sensor 210A, the torque sensor 210B, the position sensor 211A, the torque sensor 211B, the position sensor 212A, and the torque sensor 212B, they are referred to as "various sensors included in the substrate processing apparatus 1". Sometimes they are simply referred to as "sensors".

[0051] Note that the control device 100, the process control unit 205, and the transfer control unit 206 according to this embodiment can be realized using a normal computer system instead of a dedicated system. For example, by installing a program for executing the above-described processing from a recording medium (such as a CD-ROM, USB, etc.) storing the program in a general-purpose computer, each controller for executing a predetermined process can be configured.

[0052] And the means for supplying these programs is arbitrary. In addition to being supplied via a predetermined recording medium as described above, for example, it may be supplied via a communication line, a communication network, a communication system, or the like.

[0053] The control device 100 is configured as a computer including a CPU 102, a RAM 103, a storage unit 104, and an I / O port 105. In the storage unit 104, there are stored various recipe files such as recipes in which processing conditions and processing procedures are defined, control program files for executing these recipe files, parameter files (setting value files) for setting processing conditions and processing procedures, error processing program files and parameter files for error processing, and various screen files including an input screen for inputting process parameters, various icon files, etc. (none of which are shown in the figure). Note that the control device 100 is connected to a network such as the Internet, a LAN (Local Area Network), or a WAN (Wide Area Network) using an external communication unit 201, and can communicate with external devices via the network.

[0054] Also, as the storage unit 104, for example, an HDD (Hard Disk Drive), an SSD (Solid State Drive), a flash memory, etc. are used. In the storage unit 104, a calculation processing program for executing the energy consumption amount calculation processing according to the present embodiment is stored.

[0055] The calculation processing program may be pre-installed in the substrate processing apparatus 1, for example. The calculation processing program may be realized by recording it on a non-volatile recording medium, distributing it via a network, and appropriately installing it in the substrate processing apparatus 1. Examples of the non-volatile recording medium include a CD-ROM, a magneto-optical disk, an HDD, a DVD-ROM, a flash memory, a memory card, and a USB.

[0056] That is, the calculation processing program is a program for causing a computer to execute a procedure for processing a substrate according to at least one setting item defining the processing conditions of the substrate, a procedure for setting the processing conditions of the setting item, a procedure for calculating the energy consumption amount consumed under the set processing conditions, and a procedure for processing the substrate according to the processing conditions.

[0057] The CPU 102 of the substrate processing apparatus 1 according to this embodiment functions as a control unit 101 including a determination unit 107, a calculation unit 106, and a determination unit 107 by writing the calculation processing program stored in the storage unit 104 into the RAM 103 and executing it.

[0058] The substrate processing apparatus 1 according to this embodiment includes a processing chamber 29, a control unit 101, and an operation unit 203.

[0059] The processing chamber 29 processes the substrate according to at least one setting item that defines the processing conditions of the substrate.

[0060] The operation unit 203 performs a setting operation on the processing conditions of the setting item. That is, the operation unit 203 performs an editing operation on at least one setting item that defines the processing conditions via the operation screen.

[0061] As an example, in this embodiment, using the recipe editing screen displayed by the display unit 204 as the operation screen, the operation unit 203 performs an editing operation on the setting item.

[0062] Referring to FIG. 5, a setting example of the processing conditions of the setting item according to this embodiment will be specifically described. FIG. 5 is a front view showing an example of the recipe editing screen 70 according to this embodiment. The recipe editing screen 70 shown in FIG. 5 includes a recipe information display area 71, a step information display area 72, an item type selection area 73, an item setting area 74, and a button display area 76.

[0063] In the recipe information display area 71, for example, the recipe name (file name), processing time, currently selected step number (step No.), total energy amount, etc. are displayed. Among these, the "total energy amount" is the total amount of energy calculated by the calculation unit 106. In addition, in the recipe information display area 71 of the present embodiment, a detailed button 71A as an icon for instructing the calculation of the energy amount is also displayed. When the detailed button 71A is pressed (for example, a touch operation, a cursor operation, etc.), the details of the energy amount calculated by the calculation unit 106 are displayed. Note that the detailed display of the energy amount will be described later.

[0064] In the step information display area 72, a list of step information registered in the recipe is displayed. Note that the step information includes, for example, the step number, the step processing time in step units, the step name (ID), and the presence or absence of an execution command. In the example shown in FIG. 5, the state where the step No. 3 is selected is shown. Note that the step information display area 72 is, for example, an area for displaying each step (procedure) of processing the wafer 18 with the processing gas supplied to the surface of the wafer 18 and for selecting the step to be edited. Note that the steps may be separated by a period during which the energy amount is calculated. The period may be, for example, at least one of the temperature rising period, the high temperature period, and the stable period in the processing chamber 29. Also, for example, the period may be a period indicating the division of the substrate processing. Also, for example, the period may be a period during which the transfer mechanism for transferring the substrate operates. In the example shown in FIG. 5 above, these periods correspond to the step, and by selecting the step, at least one of these periods is in a selected state.

[0065] In the item type selection area 73, items to be displayed in the item setting area 74 are displayed so as to be selectable. The items referred to here are examples of setting items. Selectable items include, for example, temperature, MFC, pressure, conveyance control (conveyance mechanism), and valves. The item setting area 74 is displayed so that the operation unit 203 can set the selectable items.

[0066] In the example shown in FIG. 5, the item setting area 74 includes a temperature setting area 74A, an MFC setting area 74B, a pressure setting area 74C, a conveyance setting area 74D, and a valve setting area 74E. The temperature setting area 74A is an area for setting information regarding the processing temperature controlled by the temperature control unit 207. Examples of the information that can be set include the name, the set value of the temperature, and the ramp rate value. The MFC setting area 74B is an area for setting information regarding the gas flow rate in the processing furnace 28 controlled by the MFCs 46A and 46B as the gas flow rate control units 208. Examples of the information that can be set include the name and the set value of the gas flow rate. The pressure setting area 74C is an area for setting information regarding the processing pressure controlled by the pressure control unit 209. Examples of the information that can be set include the name of the mode for controlling the pressure, the command for controlling the pressure, and the set value of the pressure. The conveyance setting area 74D is an area for setting information regarding the conveyance control for the rotation unit 210, the lifting unit 211, and the conveyance unit 212. Examples of the information that can be set include the command for controlling the conveyance mechanism. Further, the valve setting area 74E is an area for setting information regarding the valves provided in the processing furnace 28. Examples of the information that can be set include the name and the state (on / off) of the valve. Note that in the item type selection area 73, tabs 75 corresponding to each of these items are provided, and by selecting the tab 75, detailed setting of information regarding each item becomes possible.

[0067] Note that the selectable items, that is, the settable setting items are not limited to those illustrated in FIG. 5, and any item that defines the conditions related to the processing of the substrate in the substrate processing apparatus 1 may be used.

[0068] In the button display area 76, a plurality of buttons such as an Esc button 76A and a Save button 76B are displayed.

[0069] When the Esc button 76A is pressed, an operation to close the recipe editing screen 70 is executed. When the Save button 76B is pressed, an operation to save the content edited on the recipe editing screen 70 is executed. Note that the storage destination of the content of the recipe editing screen 70 may be the storage unit 104 or the external storage unit 202. In this way, by saving the edited recipe, the substrate can be processed according to the saved recipe.

[0070] In the example shown in FIG. 5, when the detail button 71A on the recipe editing screen 70 is pressed, the calculation of the energy amount consumed under the set processing conditions is performed. In this way, by calculating the energy consumption amount at the timing when the detail button 71A is pressed, the burden on the substrate processing apparatus 1 can be reduced. The control unit 101 can be controlled to calculate the energy amount consumed under the set processing conditions. In the present embodiment, the control unit 101 is controlled to calculate the energy amount consumed under the set processing conditions by controlling the calculation unit 106. Note that when the burden on the substrate processing apparatus 1 is small, the energy amount may be calculated when the recipe editing screen 70 is started, and the calculated result may be displayed in the total energy amount on the recipe editing screen 70.

[0071] The calculation unit 106 calculates the energy amount. The energy amount calculated by the calculation unit 106 is calculated from at least one set item. Specifically, the energy amount consumed under the processing conditions of the set items set on the recipe editing screen 70 is calculated by the calculation unit 106. Here, the above-described consumed energy amount calculation process is a process of calculating the energy amount consumed when the process is executed according to the processing conditions of the set items for which the setting operation has been performed. The "energy amount consumed" calculated here includes the energy amount calculated prior to executing the process on the substrate and the energy amount calculated in at least one of the states during and after the execution of the process on the substrate. The former energy amount is the energy amount calculated using the processing conditions of the set items set by the operation unit 203. So to speak, the former energy amount is the energy amount estimated to be consumed (estimated energy amount). On the other hand, the latter energy amount is the energy amount calculated using the measured values obtained from various sensors provided in the substrate processing apparatus 1 as data reported during the substrate processing by actually executing the substrate processing using the processing conditions of the set items set by the operation unit 203 as a recipe. So to speak, the latter energy amount is the energy amount actually consumed (actual energy amount). Note that the estimated energy amount may be derived during or after actually executing the substrate processing using the processing conditions of the set items set by the operation unit 203 as a recipe.

[0072] The calculation unit 106 of the present embodiment calculates the consumed energy amount using a predetermined calculation method such as a calculation formula or a calculation table stored in the storage unit 104. As an example, the calculation unit 106 of the present embodiment uses the calculation method and the calculation formula defined in the SEMI Standard specification, here the SEMI Standard specification S23, and when executed using the parameters defined for each type of energy to be calculated, which are items compliant with the specification, the parameters may be adjustable. For example, the parameters may be adjustable according to the processing result of the substrate.

[0073] FIG. 6 is a front view showing an example of the parameter setting screen 90 according to the present embodiment. The parameter setting screen 90 shown in FIG. 6 includes a parameter setting area 91 for each item, an Esc button 92, and a Save button 93. In the parameter setting area 91 for each item, a first coefficient and a second coefficient as parameters used for calculating the energy consumption amount are displayed so as to be settable for each item defined in the SEMI Standard specification. When the Esc button 76A is pressed, an operation of closing the parameter setting screen 90 is executed. When the Save button 93 is pressed, an operation of saving the parameters (the first coefficient and the second coefficient) set on the parameter setting screen 90 is executed. Note that the storage destination of the set parameters may be the storage unit 104 or the external storage unit 202. By enabling adjustment of the parameters, the calculation conditions of the energy amount can be changed according to the configuration, machine differences, and aging deterioration of the substrate processing apparatus 1. Further, when the number of items displayed in the parameter setting area 91 for each item exceeds the number of items that can be displayed in the parameter setting area 91 for each item, a button or a scroll bar for switching items may be provided.

[0074] Further, the calculation unit 106 of the present embodiment calculates the energy amount for a predetermined period. Specifically, the calculation unit 106 calculates the energy amount consumed during a period corresponding to the step selected by the step information display area 72 of the recipe editing screen 70 described above. In this way, by determining the period for calculating the energy consumption amount, it is possible to easily compare the energy consumption amounts under the same processing conditions such as similar other recipes.

[0075] For example, as described above, by calculating the energy consumption during at least one of the temperature increase period, high temperature period, and stable period in the processing chamber 29, or during the period indicating the division of substrate processing, it is possible to clarify how much energy is consumed in each period. Thereby, for example, it is possible to consider reducing the energy consumption amount for the period with a large energy consumption amount. Also, for example, as described above, by calculating the energy consumption during the period when the transport mechanism for transporting the substrate operates, it is possible to calculate not only the energy consumption in the process system but also the energy consumption amount in the transport system. In this way, by calculating the energy consumption amount consumed in each of the process system and the transport system, it is also possible to calculate the energy consumption amount consumed by the entire substrate processing apparatus 1.

[0076] The calculated energy consumption amount is displayed by the display unit 204 by the calculation unit 106. FIG. 7 is a front view showing an example of the energy consumption amount display screen 80 according to the present embodiment. Note that the energy consumption amount display screen 80 and the recipe editing screen 70 may be displayed side by side, or either one may be displayed in a state where the energy consumption amount display screen 80 and the recipe editing screen 70 can be switched. Also, the energy consumption amount display screen 80 may always be displayed in front of the recipe editing screen 70.

[0077] The energy consumption amount display screen 80 shown in FIG. 7 includes a total consumption amount display area 81 and a consumption amount display area 82 for each item. In the total consumption amount display area 81, the total consumption amount obtained by aggregating the energy consumption amount (consumption amount) for each item displayed in the consumption amount display area 82 for each item is displayed as "Total". Note that the calculation unit 106 of the present embodiment calculates the energy consumption amount as the used power value, and displays the energy consumption amount as the power value on the energy consumption amount display screen 80. FIG. 7 shows the case where "kWh" is adopted as the unit of the power amount to be calculated and "kW" is adopted as its average. By representing it as the power value in this way, the energy consumption amount can be provided as unified information.

[0078] In addition, in the consumption amount display area 82 for each item, the energy consumption amount calculated by the calculation unit 106 is displayed for each item defined in the SEMI Standard. In this way, the energy amount (energy consumption amount) calculated and displayed in this embodiment corresponds to the types compliant with the SEMI Standard. Therefore, an energy consumption amount compliant with the standard can be provided. In this case, for example, the reliability of the calculated energy consumption amount can be ensured. In this case, among the items defined in the SEMI Standard, it is sufficient to calculate and display the energy consumption amount for at least one or more items.

[0079] In addition, the CO2 emission amount converted from the amount of emitted carbon dioxide (CO2) may be calculated, and the energy consumption amount may be displayed as the CO2 emission amount instead of or together with the power value on the energy consumption amount display screen 80. In this case, the calculation unit 106 converts the power value into the CO2 emission amount using a predetermined CO2 emission coefficient. Note that the CO2 emission coefficient varies depending on the region and the like. Therefore, for example, a CO2 emission coefficient corresponding to the region where the substrate processing apparatus 1 is installed may be stored in advance, or it may be possible to appropriately select from among a plurality of CO2 emission coefficients. In this way, by calculating the CO2 emission amount, the emission amount of CO2 emitted by the substrate processing apparatus 1 can be clarified.

[0080] Also, in this embodiment, the energy amount (energy consumption amount) calculated by the calculation unit 106 has a threshold value, and the determination unit 107 compares the threshold value with the energy consumption amount calculated by the calculation unit 106. The threshold value used here defines the target value of the energy consumption amount. For example, a value obtained from the results of experiments or the energy consumption amount calculated from the recipe results that have been normally completed in the past can be used. The threshold value is, for example, defined in advance in the storage unit 104. Note that the threshold value used here can be at least one of the upper limit value and the lower limit value. Also, the threshold value may be provided for the total consumption amount, or may be provided for the consumption amount for each item.

[0081] By providing such a threshold value and performing the determination by the determination unit 107, it is possible to easily determine whether or not the target is satisfied.

[0082] The control unit 101 notifies the determination result of the determination unit 107. Specifically, the control unit 101 notifies the display unit 204 whether or not the amount of consumed energy calculated by the calculation unit 106 exceeds the threshold value as the determination result of the determination unit 107. In this case, upon receiving the notification from the control unit 101, the display unit 204 gives a warning when the determination result is that the threshold value is exceeded. Examples of the warning include displaying a message indicating the warning on at least one of the consumed energy amount display screen 80 and the recipe editing screen 70. By giving such a warning, it is possible to avoid creating a recipe that consumes a wasteful amount of energy.

[0083] Further, when the determination result exceeds the threshold value, the display unit 204 may switch the display of the consumed energy amount to a display different from the normal one. For example, among the items displayed in the per-item consumption amount display area 82, the display of the corresponding item may be switched to a display different from that of other items. Examples of the different display include displays with different colors, character fonts, application of character decorations such as underlines, and different character sizes. By making it visually different from other items in this way, the different part can be clarified.

[0084] Next, with reference to FIG. 8, the operation of the substrate processing apparatus 1 according to the present embodiment will be described. FIG. 8 is a flowchart showing an example of the sequence of the consumed energy amount calculation process according to the present embodiment. As an example, in the present embodiment, the consumed energy amount calculation process shown in FIG. 8 is executed while the consumed energy amount display screen 80 by the display unit 204 is being displayed.

[0085] In step S100, the control unit 101 is notified that the detailed button 71A displayed on the consumed energy amount display screen 80 of the display unit 204 has been pressed by the operation unit 203.

[0086] In step S102, the control unit 101 requests the calculation unit 106 to calculate the amount of consumed energy in response to the notification.

[0087] In step S103, as described above, the calculation unit 106 calculates the amount of consumed energy based on the setting items set on the recipe editing screen 70.

[0088] In step S104, the calculation unit 106 outputs the calculation result, that is, the calculated amount of consumed energy, to the control unit 101.

[0089] In step S105, the control unit 101 notifies the display unit 204 of the calculation result of the calculation unit 106. As a result, in step S106A, the display unit 204 displays the amount of energy calculated by the calculation unit 106, that is, the amount of consumed energy, as the above-described consumed energy display screen 80.

[0090] Also, in step S106B, the determination unit 107 of the control unit 101 compares the calculation result with the threshold value as described above. In step S107, the control unit 101 notifies the display unit 204 of the determination result of the determination unit 107 as described above.

[0091] In step S108, the display unit 204 determines whether or not the determination result exceeds the threshold value. If the amount of energy (amount of consumed energy) calculated by the calculation unit 106 exceeds the threshold value, in step 109, the display unit 204 performs an error display as the above-described warning. When the process of step S109 ends, the consumed energy amount calculation process shown in FIG. 8 ends. On the other hand, even if the amount of energy (amount of consumed energy) calculated by the calculation unit 106 does not exceed the threshold value, the consumed energy amount calculation process shown in FIG. 8 ends.

[0092] As described above, the substrate processing apparatus 1 of the present embodiment can be controlled by the control unit 101 of the control device 100 and the operation unit 203 to calculate the amount of energy consumed under the processing conditions of the set setting items.

[0093] Therefore, the amount of energy required for the process, i.e., the amount of consumed energy, can be calculated and recognized prior to the execution of the process on the substrate. Further, it becomes possible to correct the processing conditions of the setting items before processing the substrate based on the calculated amount of energy, and the amount of consumed energy for processing the substrate can be suppressed.

[0094] Further, when the detailed button 71A of the recipe editing screen 70 is pressed during the processing of the substrate, the calculation unit 106 may calculate the amount of energy (amount of consumed energy) based on the output values from the respective sensors of the substrate processing apparatus 1 obtained during the processing of the substrate. In this case, the display unit 204 can display the amount of consumed energy during the processing of the substrate. Thereby, for example, it becomes possible to correct the recipe in advance before executing the next recipe.

[0095] Further, the calculation unit 106 may calculate the estimated energy amount and the actual energy amount as described above. In this case, the display unit 204 can display the comparison result of comparing the estimated energy amount and the actual energy amount. Thereby, the difference between the estimated energy amount and the actual energy amount can be clarified. Note that, regarding the actual energy amount, the amount of consumed energy consumed during the period set as described above can also be calculated. Thereby, the comparison between the estimated energy amount and the actual energy amount can be facilitated.

[0096] In addition to, or instead of, the form of the energy consumption amount display screen 80 shown in FIG. 7 described above, the display unit 204 may display the energy amount for each period of substrate processing in time series. That is, the display unit 204 may display the energy consumption amount in time series for each period during which the calculation unit 106 calculates the energy consumption amount. Examples of the form of display in time series include a table form and a chart form. For example, in the case of a table form, the vertical axis may represent the period (step), the horizontal axis may represent the energy amount (energy consumption amount), and the energy consumption amount may be displayed. In addition, when the estimated energy amount and the actual energy amount are displayed as described above, the difference therebetween may also be displayed. Further, for example, in the case of a chart form, the horizontal axis may represent the period (step), the vertical axis may represent the energy amount (energy consumption amount), and the estimated energy amount at the time of recipe setting and the actual energy amount at the time of execution of processing according to the set recipe may be plotted. In this case, the threshold value may also be displayed. By displaying in time series in this way, the difference can be visually clarified.

[0097] Note that, in the above description, the substrate processing apparatus according to the embodiment has been exemplified and described. However, the embodiment may be in the form of a program for causing a computer to execute the functions of the substrate processing apparatus. The embodiment may also be in the form of a non-transitory computer-readable recording medium storing these programs.

[0098] In addition, the configuration of the substrate processing apparatus described in the above embodiment is an example, and may be changed according to the situation without departing from the gist.

[0099] Also, the flow of the program processing described in the above embodiment is an example, and unnecessary steps may be deleted, new steps may be added, or the processing order may be changed without departing from the gist.

[0100] In the above-described embodiment, the case where the processing according to the embodiment is realized by software configuration using a computer by executing a program has been described, but the present invention is not limited to this. The embodiment may be realized, for example, by a hardware configuration or a combination of a hardware configuration and a software configuration.

[0101] In the above-described embodiment, an example of forming a film using a batch-type substrate processing apparatus that processes a plurality of substrates at once has been described. The present disclosure is not limited to the above-described aspect, and can be suitably applied, for example, even when forming a film using a single-wafer type substrate processing apparatus that processes one or several substrates at once. Further, in the above-described aspect, an example of forming a film using a substrate processing apparatus having a hot-wall type processing furnace has been described. The present disclosure is not limited to the above-described aspect, and can be suitably applied even when forming a film using a substrate processing apparatus having a cold-wall type processing furnace.

[0102] Even when these substrate processing apparatuses are used, each process can be performed under the same processing procedure and processing conditions as in the above-described embodiment, and the same effects as in the above-described embodiment can be obtained.

Description of Reference Numerals

[0103] 1 Substrate processing apparatus 29 Processing chamber (processing unit) 101 Control unit 203 Operation unit

Claims

1. A processing unit that processes the substrate according to at least one setting item defining the processing conditions of the substrate; An operation unit that sets the processing conditions of the setting item; A control unit that can be controlled to calculate the amount of energy consumed under the set processing conditions; A substrate processing apparatus comprising the above.

2. Comprising a calculation unit that calculates the amount of energy; The amount of energy calculated by the calculation unit is calculated from at least one of the setting items The substrate processing apparatus according to Claim 1.

3. The calculation unit calculates the amount of energy for a predetermined period The substrate processing apparatus according to Claim 2.

4. The period is at least one of a temperature rise period, a high temperature period, and a stable period within the processing unit The substrate processing apparatus according to Claim 3.

5. The period is a period indicating the separation of substrate processing The substrate processing apparatus according to Claim 3.

6. Further comprising a transfer mechanism for transferring the substrate, The period is a period during which the transfer mechanism operates The substrate processing apparatus according to Claim 3.

7. Having a threshold value for the amount of energy, Furthermore, the control unit includes a determination unit that compares the threshold value with the amount of energy, The control unit notifies the determination result of the determination unit The substrate processing apparatus according to Claim 1.

8. Further comprising a display unit that displays the amount of energy, The display unit receives a notification from the control unit and gives a warning when the determination result indicates that the threshold value is exceeded The substrate processing apparatus according to Claim 7.

9. The amount of energy is the power value used The substrate processing apparatus according to Claim 1.

10. The energy amount is a value obtained by converting the used power value into the amount of CO ２ emissions The substrate processing apparatus according to Claim 1.

11. Further comprising a display unit that displays the amount of energy, The amount of energy is the estimated energy amount calculated from the set processing conditions and the actual energy amount calculated from the data reported during substrate processing, The display unit displays the comparison result of comparing the estimated energy amount and the actual energy amount The substrate processing apparatus according to Claim 1.

12. The calculation unit calculates the amount of energy for each period of the substrate processing from the processing result of the executed substrate The substrate processing apparatus according to Claim 3.

13. Further comprising a display unit that displays the amount of energy, The display unit displays the amount of energy for each period of the substrate processing in time series The substrate processing apparatus according to Claim 3.

14. The amount of energy corresponds to a type compliant with SEMI Standard The substrate processing apparatus according to claim 1.

15. The apparatus further includes a display unit for displaying the amount of energy, The display unit has an icon for instructing calculation of the amount of energy, and when the icon is selected, the operation unit requests the control unit to calculate the amount of energy. The substrate processing apparatus according to claim 1.

16. Calculation of the amount of energy is performed using parameters defined for each type, and the parameters are adjustable according to the processing result of the substrate. The substrate processing apparatus according to claim 14.

17. The apparatus further includes a display unit for displaying the amount of energy, The display unit receives a notification from the control unit and, in the case of a determination result that the threshold value is exceeded, switches the display of the corresponding item to a display different from that of other items. The substrate processing apparatus according to claim 7.

18. The apparatus further includes a display unit for displaying the amount of energy, The display unit is capable of displaying the amount of energy during processing of the substrate. The substrate processing apparatus according to claim 1.

19. A step of processing the substrate by at least one setting item defining processing conditions of the substrate, A step of setting the processing conditions of the setting item by a setting operation, A step of controlling to calculate the amount of energy consumed under the set processing conditions, A method for manufacturing a semiconductor device including these steps.

20. A procedure for processing the substrate by at least one setting item defining processing conditions of the substrate, A procedure for setting the processing conditions of the setting item by a setting operation, A procedure for controlling to calculate the amount of energy consumed under the set processing conditions, A program for causing a computer to execute the procedures on a substrate processing apparatus.

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