Liquid ejection head

Abstract

To provide a liquid ejection head which is capable of holding heat generators and a substrate with ease without growing in size.SOLUTION: A liquid ejection head includes a liquid ejection part, heat generators, a substrate, a temperature control part, and a plate spring. The liquid ejection part includes nozzle arrays. The heat generators correspond to the nozzle arrays. The substrate is connected to the heat generators. The temperature control part abuts on the substrate and the heat generators. The plate spring holds the substrate and the heat generators.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] An embodiment of the present invention relates to a liquid ejection head. [Background technology]

[0002] Liquid ejection heads that eject liquid such as ink onto a medium have been known for some time. In such liquid ejection heads, a driver IC and other components are mounted on a wiring film connected to a substrate. Some liquid ejection heads are also known to have a cooling unit with a flow path that controls the temperature of a heat generating element such as the driver IC, or to have the cooling unit hold the substrate. Furthermore, as the number of nozzle rows in a liquid ejection head increases, the configuration of the head body, the components for cooling the heat generating element, and the components for holding the substrate become more complex. Therefore, there is a demand for technology that can easily hold the heat generating element and the substrate without increasing the size of the head. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2023-103780 Summary of the Invention [Problem to be solved by the invention]

[0004] The present invention provides a liquid ejection head that can easily hold a heat generating portion and a substrate without increasing the size. [Means for solving the problem]

[0005] The liquid ejection head of the embodiment includes a liquid ejection unit, a heating element, a substrate, and a leaf spring. The liquid ejection unit has a nozzle row. The heating element corresponds to the nozzle row. The substrate is connected to the heating element. A temperature adjustment unit abuts against the substrate and also against the heating element. The leaf spring holds the substrate and the heating element. [Brief explanation of the drawings]

[0006] [Figure 1] FIG. 1 is a perspective view showing a configuration of a liquid ejection head according to an embodiment. [Figure 2] FIG. 1 is an exploded perspective view showing the configuration of a liquid ejection head according to an embodiment. [Figure 3] FIG. 1 is a side view showing a schematic cross section of a configuration of a liquid ejection head according to an embodiment. [Figure 4] FIG. 1 is a cross-sectional view showing the configuration of a liquid ejection head according to an embodiment. [Figure 5] FIG. 2 is a diagram showing the configuration of a liquid ejection head according to an embodiment, viewed from the nozzle plate side. [Figure 6] FIG. 2 is a perspective view showing, in partial cross section, the configuration of a head main body and a manifold unit of the liquid ejection head according to the embodiment. [Figure 7] FIG. 2 is a cross-sectional view showing the configuration of a head main body and a manifold unit according to the embodiment. [Figure 8] FIG. 2 is a cross-sectional view showing the configuration of a head main body and a manifold unit according to the embodiment. [Figure 9] FIG. 2 is a diagram illustrating the configuration of a head main body according to the embodiment, with some parts omitted. [Figure 10] FIG. 2 is an exploded perspective view showing the configuration of a cooling channel unit according to the embodiment. [Figure 11] FIG. 2 is a cross-sectional view showing the configuration of a holding member used in the liquid ejection head according to the embodiment. [Figure 12] FIG. 1 is an explanatory diagram showing the configuration of a liquid ejection device according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0007] A liquid ejection head 1 according to an embodiment and a liquid ejection device 2 using the liquid ejection head 1 will be described below with reference to Figs. 1 to 12. Fig. 1 is a perspective view showing the configuration of the liquid ejection head 1 according to an embodiment, with the cover 15 omitted. Fig. 2 is an exploded perspective view showing the configuration of the liquid ejection head 1, with the cover 15 omitted. Fig. 3 is a side view showing a schematic, partial cross-section of the configuration of the liquid ejection head 1. Fig. 4 is a cross-sectional view showing the configuration of the liquid ejection head 1, with the cover 15 omitted.

[0008] Fig. 5 is a diagram showing the configuration of the liquid ejection head 1 from the nozzle plate 114 side. Fig. 6 is a perspective view showing, in partial cross section, the configuration of the head main body 11 and manifold unit 12 of the liquid ejection head 1, Fig. 7 is a cross-sectional view showing the configuration of the head main body 11 and manifold unit 12, and Fig. 8 is an enlarged cross-sectional view showing the configuration of the head main body 11 and manifold unit 12.

[0009] Fig. 9 is a diagram showing the configuration of the head main body 11 with some parts omitted. Fig. 10 is an exploded perspective view showing the configuration of the cooling channel unit 13. Fig. 11 is a cross-sectional view showing the configuration of a holding member 16 that holds the driver IC 142 and the printed wiring board 143 together with the cooling channel unit 13. Fig. 12 is an explanatory diagram showing the configuration of a liquid ejection device 2 according to an embodiment. In Fig. 2, an example of the flow of cooling water is indicated by dashed arrows.

[0010] 1 to 11 also show an X-axis, a Y-axis, and a Z-axis that are orthogonal to each other. In the following explanation, the direction along the X-axis will be referred to as the first direction X, the direction along the Y-axis as the second direction Y, and the direction along the Z-axis as the third direction Z. For ease of explanation, the configurations in each figure will be enlarged, reduced, or omitted as appropriate.

[0011] The liquid ejection head 1 is an inkjet head provided in a liquid ejection device 2 such as the inkjet recording device shown in Fig. 12. The liquid ejection head 1 is provided in a head unit 2130 that includes a supply tank 2132 as a liquid storage section provided in the liquid ejection device 2.

[0012] The liquid ejection head 1 is supplied with ink as a liquid stored in a supply tank 2132. The liquid ejection head 1 may be a non-circulation type head that does not circulate ink, or a circulation type head that circulates ink. In this embodiment, the liquid ejection head 1 will be described using an example of a non-circulation type head. The liquid ejection head 1 is connected to a temperature adjustment device 2116 that adjusts temperature by cooling and / or heating, and is provided in the liquid ejection device 2, and is supplied with a temperature adjustment liquid that controls the temperature of the heat generating element and the ink. In this embodiment, the temperature adjustment device 2116 controls the temperature of the ink using the temperature adjustment liquid. The liquid ejection head 1, together with the temperature adjustment device 2116, constitutes a temperature adjustment liquid circulation structure.

[0013] 1 to 4, the liquid ejection head 1 includes a head main body 11, a manifold unit 12, a temperature control flow path unit 13, a circuit board 14, a cover 15, and a holding member 16. For example, the liquid ejection head 1 is a side shooter type four-row integrated structure head that includes two sets of head main bodies 11, each having a pair of actuators 113.

[0014] The head body 11 ejects liquid. As shown in Figures 3 to 9, the head body 11 includes a base plate 111, a frame 112, an actuator 113, a nozzle plate 114, and a mask plate 115. The head body 11 also includes a common liquid chamber 116. In this embodiment, an example will be described in which one head body 11 includes two actuators 113.

[0015] 7 to 9, the base plate 111 is formed in the shape of a rectangular plate from, for example, a ceramic material. The base plate 111 is formed in the shape of a rectangle that is long in one direction (first direction X). As shown in FIG. 9, the base plate 111 has a single supply port 1111 and one or more discharge ports 1112. The base plate 111 is provided with a pair of actuators 113, and a wiring pattern for driving the actuators 113 is formed on it. The supply port 1111 and the discharge port 1112 are through holes that penetrate between both main surfaces of the base plate 111.

[0016] The supply port 1111 is provided singly, for example, at a position facing a first common liquid chamber 1161 (described later) of the common liquid chamber 116. The supply port 1111 is, for example, an elongated hole that is long in one direction along the longitudinal direction (first direction X) of the first common liquid chamber 1161. The supply port 1111 is, for example, a rectangular shape that is long in one direction, or an elongated hole with semicircular ends and a uniform width. The longitudinal width of the supply port 1111 is, for example, set to be equal to or greater than the longitudinal width (length) of the actuator 113, or smaller than the length of the actuator 113, and to a length that is approximately the same as the range (all nozzle range) in which pressure chambers 1131 formed in the actuator 113 that are driven during normal ink ejection are provided.

[0017] For example, two outlets 1112 are provided at positions facing at least one of two third common liquid chambers 1163 (described later) of the common liquid chamber 116. For example, as shown in Fig. 9, the outlet 1112 is provided in the base plate 111 so as to be located adjacent to one end of the pair of actuators 113 in the longitudinal direction and in one of the third common liquid chambers 1163. Note that a configuration may also be adopted in which two outlets 1112 are provided in each of the two third common liquid chambers 1163 of the common liquid chamber 116.

[0018] 9, the frame 112 is fixed to one main surface of the base plate 111 with an adhesive or the like. The frame 112 surrounds a supply port 1111, a plurality of discharge ports 1112, and an actuator 113, which are provided in the base plate 111.

[0019] For example, the frame 112 is formed in a rectangular frame shape that is long in one direction (first direction X), thereby forming an opening that is long in one direction along the longitudinal direction of the frame 112. In the opening of the frame 112, a pair of actuators 113, a supply port 1111, and two discharge ports 1112 are arranged.

[0020] The actuators 113 are formed in the shape of plates that are long in one direction (first direction X). A pair of actuators 113 are bonded to the mounting surface of the base plate 111. As shown in FIG. 9, the pair of actuators 113 are provided on the base plate 111 in two rows in the short direction (second direction Y) perpendicular to the longitudinal direction of the actuators 113, sandwiching a supply port 1111 therebetween. The actuators 113 are arranged in an opening of the frame 112 and bonded to the main surface of the base plate 111. As a specific example, the actuators 113 are formed by bonding two rectangular plates of piezoelectric material that are long in one direction facing each other so that their polarization directions are opposite to each other. Here, the piezoelectric material is, for example, PZT (lead zirconate titanate). The actuators 113 are bonded to the mounting surface of the base plate 111 with, for example, a thermosetting epoxy adhesive.

[0021] The actuator 113 has, for example, a plurality of pressure chambers 1131 arranged at equal intervals in the longitudinal direction (first direction X). A plurality of grooves are formed in the longitudinal direction of the actuator 113 on the main surface opposite the base plate 111 side of the actuator 113, and these grooves form the pressure chambers 1131. In other words, the actuator 113 has a plurality of walls 1133 arranged at equal intervals in the longitudinal direction and forming grooves therebetween. The plurality of walls 1133 form a plurality of pressure chambers 1131 between adjacent walls. In other words, the plurality of walls 1133 are partition walls that separate the plurality of pressure chambers 1131. Furthermore, the walls 1133 are piezoelectric elements that function as drive elements that change the volume of the pressure chambers 1131 when a drive voltage is applied.

[0022] The surface of the actuator 113 opposite to the base plate 111 in the third direction Z is bonded to the nozzle plate 114. In addition, the actuator 113 has a wiring pattern formed thereon for driving the plurality of pressure chambers 1131.

[0023] The pressure chambers 1131 are pressure chambers for ejecting ink from the nozzles 1141 during operations such as printing by the liquid ejection head 1. Note that, in the present embodiment, an example has been described in which the actuator 113 has a plurality of pressure chambers 1131, but, for example, a configuration may be adopted in which the actuator 113 has air chambers that do not eject ink and are arranged alternately with the plurality of pressure chambers 1131.

[0024] As shown in FIGS. 4, 5, 7, and 8, the nozzle plate 114 is formed in a plate shape. The nozzle plate 114 is fixed by adhesive or the like to the main surface of the frame 112 on the side opposite the base plate 111 in the opposing direction of the base plate 111 and the nozzle plate 114 (third direction Z). The nozzle plate 114 has a plurality of nozzles 1141 formed in positions opposing the plurality of pressure chambers 1131. In this embodiment, the nozzle plate 114 has two nozzle rows 1142 in which the plurality of nozzles 1141 are aligned in one direction (first direction X). In this embodiment, the liquid ejection head 1 has two head main bodies 11, and therefore, as shown in FIG. 5, the liquid ejection head 1 has four nozzle rows 1142.

[0025] The plurality of nozzles 1141 facing the plurality of pressure chambers 1131 are holes that eject ink when the liquid ejection head 1 performs an operation such as printing.

[0026] The mask plate 115 covers, for example, the main surface on the outer surface side of the nozzle plate 114, the outer periphery of the nozzle plate 114, the outer periphery surface of the frame body 112, and the outer periphery surface of the base plate 111. In addition, the mask plate 115 covers a first manifold 1214 of the manifold unit 12, which will be described later.

[0027] As shown in FIG. 5, the mask plate 115 has a pair of windows 1151 that expose nozzle rows 1142 each consisting of a plurality of nozzles 1141 that eject liquid from a pair of nozzle plates 114 .

[0028] 9, the common liquid chamber 116 communicates with a supply port 1111. The common liquid chamber 116 is provided around the pair of actuators 113. Specifically, the common liquid chamber 116 communicates with the primary side and secondary side of the multiple pressure chambers 1131 of each actuator 113. The common liquid chamber 116 also communicates with a discharge port 1112.

[0029] 9, the common liquid chamber 116 has a first common liquid chamber 1161 that is long in one direction (first direction X), two second common liquid chambers 1162 that are long in one direction (first direction X), and a third common liquid chamber 1163 that connects both ends of the first common liquid chamber 1161 to both ends of the two second common liquid chambers 1162. Furthermore, the common liquid chamber 116 communicates the supply port 1111 with one opening of the multiple pressure chambers 1131 of the actuator 113 via the first common liquid chamber 1161, and communicates the third common liquid chamber 1163 with the other opening of the multiple pressure chambers 1131 via the second common liquid chamber 1162.

[0030] The first common liquid chamber 1161 is formed between a pair of actuators 113. The first common liquid chamber 1161 constitutes an ink flow path from the supply port 1111 to one opening of the plurality of pressure chambers 1131 of each actuator 113. The first common liquid chamber 1161 also constitutes an ink flow path from the supply port 1111 to two third common liquid chambers 1163 on both end sides in the longitudinal direction (first direction X) of the first common liquid chamber 1161 (actuator 113).

[0031] The second common liquid chamber 1162 is formed between each actuator 113 and the frame 112. The second common liquid chamber 1162 forms an ink flow path from the third common liquid chamber 1163 to the other opening of the plurality of pressure chambers 1131.

[0032] The third common liquid chamber 1163 is adjacent to, for example, both ends in the longitudinal direction of the actuator 113. The third common liquid chamber 1163 communicates with the first common liquid chamber 1161 and the two second common liquid chambers 1162 at both ends in the longitudinal direction of the pair of actuators 113. The third common liquid chamber 1163 forms a flow path for part of the ink that leads from the first common liquid chamber 1161 to the second common liquid chamber 1162 without passing through the multiple pressure chambers 1131 of each actuator 113. The third common liquid chamber 1163 also forms a flow path for ink from the first common liquid chamber 1161 and the two second common liquid chambers 1162 to the discharge port 1112.

[0033] 1 to 8, the manifold unit 12 includes a manifold 121, a top plate 122, an ink supply pipe 123, an ink discharge pipe 124, a first temperature regulating liquid supply pipe 125, a first temperature regulating liquid discharge pipe 126, a damper 127, and a bypass flow path 128. The numbers of ink supply pipes 123 and ink discharge pipes 124 can be set as appropriate. The numbers of ink supply pipes 123, ink discharge pipes 124, first temperature regulating liquid supply pipes 125, and first temperature regulating liquid discharge pipes 126 can be set as appropriate.

[0034] 6 to 8, the manifold 121 includes a supply channel 1211 that is continuous with the supply port 1111 of the base plate 111 and forms a liquid supply channel, a discharge channel 1212 that is continuous with the discharge port 1112 of the base plate 111 and forms a liquid discharge channel, and a first temperature adjustment channel 1213 that forms a channel for a temperature adjustment fluid (temperature adjustment liquid). Note that the manifold 121 is connected to a pair of head bodies 11, and therefore includes a pair of supply channels 1211 and a pair of discharge channels 1212.

[0035] One main surface of the manifold 121 is fixed to the main surface of the base plate 111. A top plate 122 is fixed to the main surface of the manifold 121 opposite to the main surface to which the base plate 111 is fixed. The ink supply pipe 123, the ink discharge pipe 124, the first temperature adjustment liquid supply pipe 125, and the first temperature adjustment liquid discharge pipe 126 are fixed to the manifold 121 via the top plate 122, for example.

[0036] The manifold 121 includes, for example, a first manifold 1214 and a second manifold 1215. The manifold 121 is formed by assembling the first manifold 1214 and the second manifold 1215 together.

[0037] The supply channel 1211 is a rectangular liquid chamber that is long in one direction (first direction X) and is formed by holes or grooves in the manifold 121. The supply channel 1211 fluidly connects the ink supply pipe 123 and the supply port 1111 of the base plate 111.

[0038] For example, the supply path 1211 is a rectangular liquid chamber that extends along the longitudinal direction of the actuator 113 and the longitudinal direction of the supply port 1111. The supply path 1211 is a liquid flow path between the ink supply pipe 123 and the supply port 1111. The supply port 1111 is continuous with one side of the supply path 1211, and a damper 127 is provided on the ceiling portion 12111 on the other side of the supply path 1211.

[0039] The discharge channel 1212 is a flow path formed by a hole or a groove in the manifold 121. The discharge channel 1212 fluidly connects the ink discharge tube 124 and the two discharge ports 1112 of the base plate 111, for example.

[0040] The first temperature adjustment flow path 1213 is a flow path formed by holes or grooves in the manifold 121. The first temperature adjustment flow path 1213 fluidly connects the first temperature adjustment liquid supply pipe 125 and the first temperature adjustment liquid discharge pipe 126. The first temperature adjustment liquid flow path 1213 adjusts the temperature of the head main body 11, which is the liquid ejection part.

[0041] Both ends of the primary side and secondary side of the first temperature adjustment flow path 1213 are openings connected to a first temperature adjustment liquid supply pipe 125 and a first temperature adjustment liquid discharge pipe 126 provided on one main surface of the manifold 121. In addition, the first temperature adjustment flow path 1213 is formed so as to be able to exchange heat with the base plate 111 fixed to the manifold 121.

[0042] The first manifold 1214 is formed in a rectangular plate shape. The first manifold 1214 has grooves and openings formed therein that constitute, for example, a portion of the pair of supply channels 1211, a portion of the pair of discharge channels 1212, and a portion of the first temperature adjustment channel 1213. The arrangement, size, etc. of the grooves and openings that constitute a portion of the supply channels 1211 and the discharge channels 1212 are set appropriately based on the shapes of the supply channels 1211 and the discharge channels 1212 and the shapes of the other fluid channels.

[0043] The second manifold 1215 is formed in a rectangular plate shape. The second manifold 1215 has grooves and openings formed therein that constitute, for example, a portion of the pair of supply channels 1211, a portion of the pair of discharge channels 1212, and a portion of the first temperature adjustment channel 1213. The arrangement, size, etc. of the grooves and openings that constitute a portion of the supply channels 1211 and the discharge channels 1212 are set appropriately based on the shapes of the supply channels 1211 and the discharge channels 1212 and the shapes of the other fluid channels.

[0044] The first manifold 1214 and the second manifold 1215 are joined together to form a supply channel 1211, a discharge channel 1212, and a first temperature adjustment channel 1213.

[0045] The top plate 122 is provided on the surface of the manifold 121 opposite to the surface on which the base plate 111 is provided. The top plate 122 has openings that connect the ink supply pipe 123, the ink discharge pipe 124, the first temperature adjustment liquid supply pipe 125, and the first temperature adjustment liquid discharge pipe 126 to the supply path 1211, the discharge path 1212, and the first temperature adjustment flow path 1213 of the manifold 121. For example, the top plate 122 is formed of two plate-shaped members. One of the ink supply pipe 123 and the ink discharge pipe 124, and one of the first temperature adjustment liquid supply pipe 125 and the first temperature adjustment liquid discharge pipe 126 are provided on one of the plate-shaped members. The other of the ink supply pipe 123 and the ink discharge pipe 124, and the other of the first temperature adjustment liquid supply pipe 125 and the first temperature adjustment liquid discharge pipe 126 are provided on the other plate-shaped member.

[0046] The ink supply pipe 123 is connected to the supply path 1211. The ink discharge pipe 124 is connected to the discharge path 1212. In this embodiment, the liquid ejection head 1 includes a pair of head bodies 11, and therefore a pair of ink supply pipes 123 and a pair of ink discharge pipes 124 are provided. The first temperature adjustment liquid supply pipe 125 and the first temperature adjustment liquid discharge pipe 126 are connected to the primary side and secondary side of the first temperature adjustment flow path 1213.

[0047] In this embodiment, a pair of ink supply pipes 123 and a first temperature control liquid discharge pipe 126 are arranged at one end of the manifold 121 in the longitudinal direction, and a pair of ink discharge pipes 124 and a first temperature control liquid supply pipe 125 are arranged at the other end of the manifold 121 in the longitudinal direction.

[0048] 6 to 8, the damper 127 is formed in the shape of an elastically deformable thin film or sheet. As shown in Fig. 7, the damper 127 covers the ceiling portion 12111 of the supply path 1211 formed in the second manifold 1215. The damper 127 elastically deforms in response to pressure fluctuations in the supply path 1211. One surface of the damper 127 faces the supply path 1211.

[0049] As a specific example, damper 127 is formed of a polyimide film. Damper 127 is formed in a rectangular shape that is long in the same direction (first direction X) as the longitudinal direction of the opening of ceiling portion 12111 of supply path 1211 that is long in one direction (first direction X).

[0050] 6, the bypass flow path 128 connects the ceiling portion 12111 of the supply path 1211 to the common liquid chamber 116 or the secondary side of the common liquid chamber 116. The common liquid chamber 116 or the secondary side of the common liquid chamber 116 to which the bypass flow path 128 connects is, for example, the second common liquid chamber 1162 or the third common liquid chamber 1163 of the common liquid chamber 116, the discharge path 1212, or the ink discharge pipe 124. The fluid resistance of the bypass flow path 128 is greater than the fluid resistance of the supply path 1211 and the fluid resistance of the common liquid chamber 116.

[0051] The bypass flow path 128 bypasses the supply path 1211 and the common liquid chamber 116, thereby discharging air bubbles from the supply path 1211 during maintenance or ink filling. The bypass flow path 128 has a cross section that is rectangular or circular. The bypass flow path 128 may be shaped, for example, linear or partially bent.

[0052] 2, 4, and 10, the temperature control flow path unit 13 that controls the temperature includes, for example, a temperature control flow path section 131, a flow path top plate 132, a second temperature control liquid supply pipe 133, and a second temperature control liquid discharge pipe 134. The temperature control flow path unit 13 is connected to the temperature control device 2116 of the liquid ejection device 2. The temperature control flow path unit 13 has a temperature control structure that cools the driver IC 142, which is a heat generating element, with a temperature control liquid. Note that the temperature control flow path unit 13 only needs to be configured to control the temperature, and may be configured to heat the driver IC 142 in addition to or instead of cooling. In other words, the temperature control flow path unit 13 is a temperature control flow path unit (temperature control section) through which a temperature control liquid for cooling and / or heating flows, and may have a temperature control structure that can control the driver IC 142, which is a heat generating element, to a desired temperature.

[0053] The temperature adjustment flow path section 131 is connected to a second temperature adjustment liquid supply pipe 133 and a second temperature adjustment liquid discharge pipe 134 via a flow path top plate 132. The temperature adjustment flow path section 131 includes a branch flow path 1311 connected to the second temperature adjustment liquid supply pipe 133, a second temperature adjustment flow path 1312 that adjusts the temperature of a plurality of driver ICs (described later) that are heat generating parts, and a junction flow path 1313.

[0054] The branch flow path 1311 branches the temperature control liquid supplied from the second temperature control liquid supply pipe 133 into two directions. One of the paths branched by the branch flow path 1311 is connected to the first temperature control flow path 1213, and the other path branched by the branch flow path 1311 is connected to the second temperature control flow path 1312.

[0055] The second temperature control flow path 1312 is connected to one of the flow paths branched by the branch flow path 1311. The number of the second temperature control flow paths 1312 is less than the number of driver ICs on the primary side, and the second temperature control flow paths 1312 branch into multiple flow paths, forming a flow path where the multiple flow paths merge into one on the secondary side. The second temperature control flow path 1312 controls the temperature of the driver IC 142.

[0056] As a specific example, in this embodiment, there are four nozzle rows 1142, four actuators 113 (four rows), and four driver ICs 142 (four rows). Therefore, as shown in Figures 2, 4, and 10, the temperature control flow path section 131 has three flow path sections 13121 that constitute the second temperature control flow path 1312. These three flow path sections 13121 are long in one direction (first direction X) and are arranged side by side in a direction (second direction Y) perpendicular to the longitudinal direction of the flow path section 13121.

[0057] The three flow path sections 13121 are composed of a pair (two) single-row temperature control flow path sections 13122 and one multi-row temperature control flow path section 13123. A driver IC 142, which is a heating element, is in contact with the outer surface of each flow path section 13121, and each constitutes a temperature control block that controls the temperature of the driver IC 142. The pair of single-row temperature control flow path sections 13122 are arranged on both end sides (outside) in the arrangement direction of the three flow path sections 13121 (second direction Y). Each of the pair of single-row temperature control flow path sections 13122 controls the temperature of one driver IC 142 that drives the actuator 113 that ejects ink from the single nozzle row 1142. The corresponding driver IC 142 is in contact with the outer surface of the single-row temperature control flow path section 13122.

[0058] The multi-row temperature control flow path section 13123 is disposed on the inside in the arrangement direction (second direction Y) of the three flow path sections 13121. That is, the multi-row temperature control flow path section 13123 is disposed between a pair of single-row temperature control flow path sections 13122 in the arrangement direction (second direction Y) of the three flow path sections 13121. The multi-row temperature control flow path section 13123 controls the temperatures of two driver ICs 142 that respectively drive two actuators 113 that eject ink from two adjacent nozzle rows 1142 of two sets of head bodies 11. The two corresponding driver ICs 142 abut on different outer surfaces of the multi-row temperature control flow path section 13123.

[0059] 4, the width WA of the flow path 131221 formed by the single-row temperature control flow path section 13122 is narrower than the width WB of the flow path 131231 formed by the multi-row temperature control flow path section 13123. The width WA of the flow path 131221 and the width WB of the flow path 131231 are widths in the second direction Y. Furthermore, the cross-sectional area of the flow path 131221 formed by the single-row temperature control flow path section 13122 is smaller than the cross-sectional area of the flow path of the multi-row temperature control flow path section 13123. This is because the single-row temperature control flow path section 13122 controls the temperature of one driver IC 142, while the multi-row temperature control flow path section 13123 controls the temperature of two driver ICs 142. Therefore, in order to make the temperature control capacity of the multi-row temperature control flow path section 13123 higher than that of the single-row temperature control flow path section 13122, the width WB of the flow path 131231 of the multi-row temperature control flow path section 13123 is larger than the width WA of the flow path 131221 of the single-row temperature control flow path section 13122.

[0060] The confluence channel 1313 joins the first temperature adjustment channel 1213 and the second temperature adjustment channel 1312 and connects them to the second temperature adjustment liquid discharge pipe 134 .

[0061] Such a temperature control flow path section 131 includes, for example, a temperature control manifold 1314, a cover 1315 that covers the temperature control manifold 1314, and a pair of flow path blocks 1316 provided on the cover 1315.

[0062] The second temperature control flow path 1312 is a flow path formed by holes and grooves formed in a temperature control manifold 1314 , a cover 1315 , and a pair of flow path blocks 1316 .

[0063] The temperature control manifold 1314 is formed in a plate or block shape. The temperature control manifold 1314 is fixed to, for example, the manifold 121. Two openings 13141 are formed in the temperature control manifold 1314, through which a portion of the wiring film 141 on which a driver IC 142 (described later) of the circuit board 14 is mounted and a printed wiring board (substrate) 143 are disposed. The openings 13141 are aligned along the longitudinal direction (first direction X) of the flow path section 13121.

[0064] The temperature control manifold 1314 has three portions adjacent to the two openings 13141 that respectively form part of the three flow path sections 13121. The temperature control manifold 1314 is formed with, for example, a groove 13142. The groove 13142 is shaped so that one flow path branches into three flow paths: flow paths 131231 formed by two single-row temperature control flow path sections 13122 and a flow path 131231 formed by one multi-row temperature control flow path section 13123, and the three flow paths then merge together.

[0065] The cover 1315 is formed in a plate shape. Two openings 13151 are formed in the cover 1315 along the longitudinal direction (first direction X) of the flow path portion 13121, and a part of the wiring film 141 and the printed wiring board 143 are disposed therein. The cover 1315 covers a groove 13142 formed in the temperature control manifold 1314, and is fixed to the temperature control manifold 1314 in a liquid-tight manner. The cover 1315, together with the temperature control manifold 1314, constitutes the second temperature control flow path 1312. When the cover 1315 is integrally assembled with the temperature control manifold 1314, the two openings 13151 of the cover 1315 face the opening 13141 of the temperature control manifold 1314. The cover 1315 is formed with a plurality of openings that connect the second temperature control flow path 1312 to the branch flow paths 1311 and the merging flow path 1313, for example.

[0066] The flow path block 1316 has grooves and openings formed therein that form the branch flow paths 1311 or the junction flow path 1313. That is, of the pair of flow path blocks 1316, one flow path block 1316 forms the branch flow path 1311, and the other flow path block 1316 forms the junction flow path 1313. The pair of flow path blocks 1316 are fixed to a cover 1315. The pair of flow path blocks 1316 face each other in the first direction X at a distance that allows the wiring film 141 of the circuit board 14 and a printed wiring board 143 (described later) to be arranged therebetween. The flow path block 1316 has, for example, a pipe section 13161 that connects the branch flow path 1311 or the junction flow path 1313 to the first temperature control liquid supply pipe 125 or the first temperature control liquid discharge pipe 126. In addition, the flow path block 1316 is formed with, for example, a plurality of ribs 13162 for arranging printed wiring boards 143 (described later) of four circuit boards 14, supporting one main surface of the printed wiring boards 143, and a plurality of grooves 13163 for holding the leaf spring portion 162 of the holding member 16 together with the flow path top plate 132.

[0067] The ribs 13162 are provided in the same number as the printed wiring boards 143. For example, a pair of corresponding ribs 13162 formed on a pair of flow path blocks 1316 abut against one main surface of one printed wiring board 143. The ribs 13162 are guides that determine the position of the printed wiring board 143 by the printed wiring board 143 abutting against them and holding the printed wiring board 143 together with the holding member 16.

[0068] The grooves 13163 are provided in each flow path block 1316 in the same number as the printed wiring boards 143, in other words, in the same number as the total number of leaf spring portions 162 provided in the holding member 16. The grooves 13163 are formed so that the leaf spring portions 162 of the holding member 16, which will be described later, can be placed therein.

[0069] The channel top plate 132 is provided on the surface opposite to the surface on which the cover 1315 of the pair of channel blocks 1316 is provided. For example, a pair of channel top plates 132 are provided. Each channel top plate 132 has an opening that connects the second temperature control liquid supply pipe 133 or the second temperature control liquid discharge pipe 134 to the branch channel 1311 or the junction channel 1313 of the channel block 1316. The channel top plate 132 has, for example, a plurality of grooves 1321 formed therein that accommodate and support the leaf spring portion 162 of the holding member 16, and the portion between two adjacent grooves 1321 holds a base portion 161 (described later) of the holding member 16.

[0070] The grooves 1321 are provided in each flow path top plate 132 in the same number as the printed wiring boards 143, in other words, in the same number as the total number of leaf spring portions 162 provided in the holding member 16. The grooves 1321 of the flow path top plate 132 face grooves 13163 formed in the flow path block 1316 in the opposing direction (third direction Z) of the flow path block 1316 and the flow path top plate 132, and the leaf spring portions 162 are arranged in the opposing grooves 13163, 1321 that are continuous in the third direction Z.

[0071] 1 to 4, one end of circuit board 14 is connected to the wiring pattern of actuator 113 via the wiring pattern of base plate 111. Circuit board 14 includes, for example, wiring film 141, driver IC 142 mounted on the wiring film, and printed wiring board 143 mounted on the wiring film.

[0072] The circuit board 14 drives the actuator 113 by applying a drive voltage to the actuator 113 via the wiring pattern of the base plate 111 using the driver IC 142 , thereby increasing or decreasing the volume of the pressure chamber 1131 and causing droplets to be ejected from the nozzle 1141 .

[0073] The wiring film 141 is a film substrate formed in a film shape and on which a wiring pattern is formed. For example, a plurality of wiring films 141 are provided. The wiring film 141 is, for example, a COF (Chip on Film) on which a driver IC 142 is mounted. For example, the number of wiring films 141 is the same as the number of actuators 113 provided in one head main body 11, that is, the same number as the number of nozzle rows 1142. One wiring film 141 is connected to one actuator 113.

[0074] Note that a plurality of wiring films 141 may be connected to one actuator 113, in which case the number of wiring film rows and driver IC rows, each consisting of a plurality of wiring films 141 and driver ICs 142 mounted on the wiring films 141, will be the same as the number of actuators 113. An example of such a case in which a plurality of wiring films 141 are connected to one actuator 113 is a liquid ejection head 1 having a total of eight wiring films 141, in which two wiring films 141, each with one driver IC 142 mounted thereon, are connected to four actuators 113, respectively.

[0075] In this embodiment, the head main body 11 is configured to have two nozzle rows 1142 (two actuators 113), and therefore two wiring films 141 are provided on one head main body 11. A liquid ejection head 1 having two sets of head main bodies 11 has four wiring films 141. The four wiring films 141 are arranged, for example, to extend in the third direction Z, and in this position, are arranged side by side in the second direction Y. Also, in this embodiment, an example will be described in which one driver IC 142 is mounted on each wiring film 141, but two or more driver ICs 142 may be mounted on one wiring film 141.

[0076] The driver IC 142 is electrically connected to the wiring pattern formed in the pressure chamber 1131 via the wiring film 141. The driver IC 142 is a heat-generating part that generates heat. The driver IC 142 is mounted on the outer surface side of the wiring film 141. Here, the outer surface side of the wiring film 141 refers to the surface opposite to the surface (inner surface) on which the two wiring films 141 of one head main body 11 face each other when the wiring film 141 is disposed so as to extend in the third direction Z. In other words, the outer surface of the wiring film 141 refers to the outer side in the second direction Y of the head main body 11 when the center side of the head main body 11 in the second direction Y is defined as the inner side. Therefore, the outer surfaces of the inner two wiring films 141 of the four wiring films 141 of the two sets of head main bodies 11 face each other.

[0077] The surface of the driver IC 142 opposite to the mounting surface mounted on the wiring film 141 abuts against the outer surface of the flow path portion 13121. For example, the surface of the driver IC 142 directly contacts the outer surface of the flow path portion 13121. One driver IC 142 is provided for one wiring film 141. When multiple driver ICs 142 are provided to drive one actuator 113, these multiple driver ICs 142 are mounted on one or more wiring films 141 to form driver IC rows in the same number as the actuators 113, and multiple driver ICs 142 in the same driver IC row abut against the corresponding flow path portion 13121.

[0078] The printed wiring board 143 is, for example, a PWA (Printing Wiring Assembly) on which various electronic components and connectors are mounted. The printed wiring board 143 is connected to a corresponding driver IC 142 via a wiring film 141. The number of printed wiring boards 143 provided is the same as the number of actuators 113. Therefore, a liquid ejection head 1 having two sets of head bodies 11 has four printed wiring boards 143. The four printed wiring boards 143 are arranged so that their surfaces are aligned with the first direction X and the third direction Z, and in this orientation, are arranged side by side in the second direction Y. The printed wiring board 143 has mounted components such as various electronic components and connectors on one main surface. Note that the printed wiring board 143 may have mounted components on both sides, but on the main surface facing the leaf spring portion 162 described below, the mounted components are mounted so as to avoid the area where the leaf spring portion 162 is arranged.

[0079] The cover 15 covers or houses a part of the head body 11 , a part of the manifold unit 12 and the circuit board 14 .

[0080] The holding member 16 is a leaf spring that abuts against the driver IC 142 and the printed wiring board 143 and presses them to hold the driver IC 142 and the printed wiring board 143 together with other members other than the holding member 16 that abut against the driver IC 142 and the printed wiring board 143.

[0081] The number of holding members 16 provided is, for example, half the number of actuators 113 (nozzle rows 1142), i.e., the same number as the paired actuators 113 (nozzle rows 1142). In other words, half the number of printed wiring boards 143 corresponding to the plurality of actuators 113 are provided, and the holding members 16 press the driver ICs 142 and printed wiring boards 143 adjacent to each other in the arrangement direction. In this embodiment, since four printed wiring boards 143 are provided, two holding members 16 are provided. The holding member 16 includes, for example, a base 161 and a pair of leaf spring portions 162 integrally provided with the base 161. For example, the holding member 16 is formed by bending a flat plate formed of, for example, a metal material, which is shaped into the shape of the base 161 and the pair of leaf spring portions 162 as a blank.

[0082] The base 161 is formed in the shape of a flat plate that is long in one direction. The length of the base 161 in the longitudinal direction is formed to be longer than the distance between the opposing surfaces of the pair of flow path top plates 132 that face each other in the first direction X. The length of the base 161 in the lateral direction is formed to be the same as the width of adjacent grooves 1321 formed in the flow path top plates 132. In other words, the base 161 is formed so that both ends in the longitudinal direction can abut against the upper surfaces of the opposing surfaces of the pair of flow path top plates 132, and so that the pair of leaf springs 162 formed integrally with the ends in the lateral direction of the base 161 can be positioned in the grooves 13163, 1321.

[0083] The leaf spring portion 162 extends from an end portion in the short-side direction of the base portion 161 in a direction (third direction Z) perpendicular to both the long-side and short-side directions of the base portion 161, or in a direction slightly inclined with respect to the third direction Z. For example, the pair of leaf spring portions 162 extend from the base portion 161 at a slight incline with respect to the third direction Z so that the distance between the pair of leaf spring portions 162 in the opposing direction gradually increases as the pair of leaf spring portions 162 moves away from the base portion 161. The leaf spring portion 162 includes a first holding portion 1621 that presses and holds the driver IC 142, and a pair of second holding portions 1622 that presses and holds the printed wiring board 143.

[0084] The first holding portion 1621 extends from the base 161 to a position facing the driver IC in the third direction Z, and a portion facing the driver IC 142 is bent to form a convex shape so as to protrude outward. As a specific example, the portion of the first holding portion 1621 facing the driver IC 142 gradually extends outward from the base 161 side and then gradually extends inward toward the end opposite the base 161 side, thereby protruding outward in a mountain-like shape. Also, for example, if driver ICs 142 adjacent in the arrangement direction (second direction Y) are at different height positions in the third direction Z perpendicular to the arrangement direction, the first holding portions 1621 of the pair of leaf spring portions 162 will be at different height positions in the third direction Z.

[0085] In the arrangement direction of the pair of first holding portions 1621 (the arrangement direction of the driver ICs 142, the second direction Y), the distance between the outwardly protruding apexes of the pair of first holding portions 1621 is formed to be greater than the distance between adjacent driver ICs 142. Therefore, the first holding portion 1621 abuts against the driver IC 142 and presses the driver IC 142 toward the abutting flow path portion 13121. As a result, each driver IC 142 is sandwiched and held between the outer surface of the flow path portion 13121 and the apex (tips) of the first holding portion 1621.

[0086] The pair of second holding portions 1622 are provided at different positions in the longitudinal direction (first direction X) of the base portion 161 and press the printed wiring board 143 at different positions in the first direction X. That is, one holding member 16 is provided with two pairs of second holding portions 1622 on a pair of leaf spring portions 162 that face each other in the arrangement direction of the pair of leaf spring portions 162.

[0087] The second holding portion 1622 extends from the base 161 in the third direction Z to a predetermined portion of the printed wiring board 143, and is partially bent into a convex shape so as to protrude outward at a position facing the printed wiring board 143. As a specific example, the portion of the second holding portion 1622 facing the printed wiring board 143 gradually extends outward from the base 161 side, and then gradually extends inward toward the end opposite the base 161 side, thereby protruding outward in a mountain-like shape.

[0088] In the arrangement direction of the two pairs of second holding portions 1622 (the arrangement direction of the printed wiring boards 143, the second direction Y), the distance between the outwardly protruding apexes (tips) of the corresponding pairs of first holding portions 1621, i.e., the two second holding portions 1622 provided on different leaf spring portions 162 and facing each other in the second direction Y, is formed to be greater than the distance between adjacent printed wiring boards 143. Therefore, each pair of second holding portions 1622 abuts against the printed wiring board 143 at different positions in the first direction X, and presses the printed wiring board 143 toward the pair of ribs 13162 it abuts against. As a result, each printed wiring board 143 is sandwiched and held between the outer surfaces of the pair of ribs 13162 and the apexes (tips) of the second holding portions 1622.

[0089] An example of assembling such a holding member 16 will be described. For example, first, after assembling the head main body 11, the manifold unit 12, the temperature control flow path unit 13, and the circuit board 14 integrally, a pair of leaf spring portions 162 are inserted between adjacent corresponding printed wiring boards 143 from the end side opposite the base portion 161. Then, both ends in the longitudinal direction (first direction X) of the pair of leaf spring portions 162 are inserted into two pairs of adjacent grooves 13163, 1321 formed in the pair of flow path blocks 1316 and the pair of flow path top plates 132, and both ends in the longitudinal direction (first direction X) of the base portion 161 are brought into contact with the upper surfaces of the pair of flow path top plates 132. This positions the holding member 16.

[0090] At this time, the first holding portion 1621 and the pair of second holding portions 1622 of each leaf spring portion 162 are respectively positioned at the same position as the driver IC 142 and the printed wiring board 143 in the insertion direction (third direction Z) of the holding member 16. As a result, the first holding portion 1621 and the pair of second holding portions 1622 press the driver IC 142 and the printed wiring board 143, respectively, thereby holding the driver IC 142 and the printed wiring board 143. The first holding portion 1621 sandwiches the driver IC 142 between itself and the flow path portion 13121, and the pair of second holding portions 1622 sandwich the printed wiring board 143 between itself and the pair of ribs 13162.

[0091] The holding member 16 is a leaf spring, and the first holding portion 1621 sandwiches the driver IC 142 between itself and the flow path portion 13121, and the pair of second holding portions 1622 elastically deform when sandwiching the printed wiring board 143 between itself and the pair of ribs 13162. Therefore, the holding member 16 is sandwiched and held by the pair of leaf spring portions 162 between the driver ICs 142 and the printed wiring boards 143 that are adjacent in the arranging direction. In this way, when the holding member 16 is positioned and holds the two driver ICs 142 and the two printed wiring boards 143 that are adjacent in the arranging direction, the holding member 16 is held by the two driver ICs 142 and the two printed wiring boards 143 that are adjacent in the arranging direction due to its own restoring force, so no member for fixing the holding member 16 is required.

[0092] The liquid ejection head 1 configured in this manner has a first temperature adjustment flow path 1213 that adjusts the temperature of the head main body 11, which is a liquid ejection unit, and a second temperature adjustment flow path 1312 that adjusts the temperature of the driver IC 142, which is a heat generating unit, by the manifold unit 12 and the temperature adjustment flow path unit 13. The temperature adjustment liquid supplied from the second temperature adjustment liquid supply pipe 133 passes through the first temperature adjustment flow path 1213 and the second temperature adjustment flow path 1312, and is discharged from the second temperature adjustment liquid discharge pipe 134. The temperature adjustment liquid flowing through the first temperature adjustment flow path 1213 adjusts the temperature of the head main body 11, and the temperature adjustment liquid flowing through the second temperature adjustment flow path 1312 adjusts the temperature of the driver IC 142.

[0093] The second temperature control flow path 1312 may have a simple configuration in which the driver IC 142 is in contact with the outer surfaces of a plurality of flow path portions 13121 through which the temperature control liquid passes.

[0094] Furthermore, by inserting the holding member 16 between adjacent driver ICs 142 and adjacent printed wiring boards 143 in the arrangement direction (second direction Y), the driver IC 142 can be held by being sandwiched between the first holding portion 1621 and the flow path portion 13121, and the printed wiring board 143 can be held by being sandwiched between a pair of second holding portions and a pair of ribs 13162.

[0095] The holding member 16 is inserted into a space formed between the driver IC 142 and the adjacent printed wiring board 143, which are arranged at a predetermined interval in the arrangement direction (second direction Y). Therefore, the holding member 16 does not require a separate space for holding the driver IC 142 and the printed wiring board 143, thereby preventing the liquid ejection head 1 from becoming large. The holding member 16 is positioned in the third direction Z by the temperature control flow path unit 13, and elastically deforms to hold the driver IC 142 and the printed wiring board 143 with spring force, thereby easily holding the driver IC 142 and the printed wiring board 143. By forming the first holding portion 1621 and the second holding portion 1622 of the holding member 16 into a convex shape, the width of the end portion between the paired holding portions 1621 and 1622 is smaller than the width of the top portion, making it easy to insert the holding member 16 between the adjacent printed wiring boards 143.

[0096] 12, a liquid ejection device 2 having a liquid ejection head 1 will be described. The liquid ejection device 2 includes a housing 2111, a medium supply unit 2112, an image forming unit 2113, a medium ejection unit 2114, a conveying device 2115 which is a supporting device, a temperature adjusting device 2116, a maintenance device 2117, and a control unit 2118.

[0097] The liquid ejection device 2 is an inkjet printer that performs an image formation process on paper P by ejecting liquid such as ink while transporting the paper P as a recording medium, which is the object of ejection, along a predetermined transport path 2001 that runs from a medium supply section 2112 through an image forming section 2113 to a medium ejection section 2114.

[0098] The medium supply unit 2112 includes a plurality of paper feed cassettes 21121. The image forming unit 2113 includes a support unit 2120 that supports paper, and a plurality of head units 2130 that are arranged above and facing the support unit 2120. The medium discharge unit 2114 includes a paper discharge tray 21141.

[0099] The support section 2120 includes a conveyor belt 21201 that is looped in a predetermined area where image formation is performed, a support plate 21202 that supports the conveyor belt 21201 from the back side, and a plurality of belt rollers 21203 that are provided on the back side of the conveyor belt 21201.

[0100] The head unit 2130 includes liquid ejection heads 1 which are multiple inkjet heads, multiple supply tanks 2132 as liquid tanks mounted on each liquid ejection head 1, a pump 2134 which supplies ink, and a connection flow path 2135 which connects the liquid ejection heads 1 and the supply tanks 2132.

[0101] In this embodiment, the liquid ejection heads 1 are provided with four colors of liquid ejection heads 1 (cyan, magenta, yellow, and black), and four color supply tanks 2132 that respectively store ink of each color. The supply tanks 2132 are connected to the liquid ejection heads 1 by connection flow paths 2135.

[0102] The pump 2134 is a liquid-transfer pump that is configured, for example, as a piezoelectric pump. The pump 2134 is connected to the control unit 2118, and is controlled by the control unit 2118.

[0103] The connection flow path 2135 includes a supply flow path connected to the ink supply pipe 123 of the liquid ejection head 1. The connection flow path 2135 also includes a recovery flow path connected to the ink discharge pipe 124 of the liquid ejection head 1. For example, since the liquid ejection head 1 is of a non-circulation type, the recovery circuit is connected to a maintenance device 2117. Note that, for example, if the liquid ejection head 1 is of a circulation type, the recovery flow path is connected to a supply tank 2132.

[0104] The transport device 2115 transports the paper P along a transport path 2001 that runs from a paper feed cassette 21121 in the medium supply unit 2112, through the image forming unit 2113, to a paper discharge tray 21141 in the medium discharge unit 2114. The transport device 2115 includes a plurality of guide plate pairs 21211-21218 and a plurality of transport rollers 21221-21228 that are arranged along the transport path 2001. The transport device 2115 supports the paper P so that it can move relative to the liquid ejection head 1.

[0105] The temperature adjustment device 2116 includes a temperature adjustment liquid tank 21161, a temperature adjustment circuit 21162 such as piping or tubes for supplying the temperature adjustment liquid, a pump for supplying the temperature adjustment liquid, and a temperature adjuster for adjusting the temperature of the temperature adjustment liquid. The temperature adjustment device 2116 supplies the temperature adjustment liquid in the temperature adjustment liquid tank 21161, which has been adjusted to a predetermined temperature by the temperature adjuster, to the second temperature adjustment liquid supply pipe 133 via the temperature adjustment circuit 21162 by using the pump to send water. The temperature adjustment device 2116 also recovers water that has passed through the first temperature adjustment flow path 1213 and the second temperature adjustment flow path 1312 and been discharged from the second temperature adjustment liquid discharge pipe 134, back into the temperature adjustment liquid tank 21161 via the temperature adjustment circuit 21162. The temperature adjuster is, for example, a cooler.

[0106] The maintenance device 2117, for example, during maintenance, sucks and recovers ink remaining on the outer surface of the nozzle plate 114. Furthermore, if the liquid ejection head 1 is of a non-circulation type, the maintenance device 2117 recovers ink from inside the head body 11 through the nozzles 1141 during maintenance. Such a maintenance device 2117 has a tray, tank, or the like for storing the recovered ink.

[0107] The control unit 2118 includes a CPU 21181 as an example of a processor, a ROM (Read Only Memory) for storing various programs, a RAM (Random Access Memory) for temporarily storing various variable data and image data, and other memories, and an interface unit for inputting data from the outside and outputting data to the outside.

[0108] The liquid ejection head 1 and liquid ejection device 2 according to the above-described embodiment sandwich and hold the driver IC 142 and printed wiring board 143, which are heat generating parts, between the other components using the holding member 16, which is a leaf spring, so that the driver IC 142 and printed wiring board 143 can be easily held without increasing the size.

[0109] It should be noted that the embodiments of the present invention are not limited to the above-described configuration. For example, in the above example, the head main body 11 is of a non-circulating type, but it may be of a circulating type.

[0110] In the above example, the liquid ejection head 1 has been described as having four nozzle rows, but is not limited to this. For example, the liquid ejection head 1 may have one head body 11, or may have three sets of head bodies 11 and six nozzle rows.

[0111] In the above example, the holding member 16 has been described as having a pair of second holding portions 1622 provided for each of the leaf spring portions 162, but the present invention is not limited to this. The number of second holding portions 1622 provided for the leaf spring portion 162 may be one, or three or more.

[0112] In addition, there may be two or more driver ICs 142 for one actuator 113, and in such a case, each leaf spring portion 162 may be configured to have the same number of first holding portions 1621 as the number of driver ICs 142, or multiple driver ICs 142 may be held by fewer first holding portions 1621 than the number of driver ICs 142.

[0113] In the above example, the driver IC 142 is in contact with the outer surface of the flow path portion 13121, but the present invention is not limited to this. That is, the heating element is not limited to the driver IC 142, and the component that regulates the temperature of the heating element is not limited to the flow path portion 13121. The component that regulates the temperature of the heating element may be a temperature regulation member such as a heat sink or heater. In this configuration, the holding member 16 only needs to hold the temperature regulation member and the heating element.

[0114] In the above example, the leaf spring portion 162 has been described as having a first holding portion 1621 that holds the heating element and a second holding portion 1622 that holds the substrate, but is not limited to this and may have a third holding portion that holds components other than the heating element and the substrate by sandwiching them between itself and another member. That is, the number of components that the holding member 16 holds by sandwiching them between itself and another member can be set as appropriate.

[0115] In the above embodiment, the liquid ejection head 1 and the liquid ejection device 2 are used in a recording device that ejects ink as a liquid, but the present invention is not limited to this. That is, the liquid ejection head 1 and the liquid ejection device 2 can also be used in, for example, 3D printers, industrial manufacturing machines, and medical applications.

[0116] According to at least one of the embodiments described above, the liquid ejection head can easily hold the heat generating portion and the circuit board without increasing in size.

[0117] Although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be embodied in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, and are also included in the scope of the invention and its equivalents as defined in the claims. [Explanation of symbols]

[0118] 1...liquid ejection head, 2...liquid ejection device, 11...head body, 12...manifold unit, 13...temperature control flow path unit (temperature control section), 14...circuit board, 15...cover, 16...holding member (plate spring), 111...base plate, 112...frame body, 113...actuator, 114...nozzle plate, 115...mask plate, 116...common liquid chamber, 121...manifold, 122...top plate, 123...ink supply pipe, 124...ink discharge pipe, 125...first temperature control liquid supply pipe, 126...first temperature control liquid discharge pipe, 127...damper, 128...bypass flow path, 131...temperature control flow path section, 132...flow path top plate, 133...second temperature control liquid supply pipe, 134...second temperature control liquid discharge pipe, 141...wiring film, 142...driver IC (heating element), 143...printed wiring board (substrate), 161...base, 162...plate spring part, 1111...supply port, 1112...discharge port, 1131...pressure chamber, 1133...wall, 1141...nozzle, 1142...nozzle row, 1151...window, 1161...first common liquid chamber, 1162...second common liquid chamber, 1163...third common liquid chamber, 1211...supply path, 1212...discharge path, 1213...first temperature control flow path, 1214...first manifold, 1215...second manifold fold, 1311...branch flow path, 1312...second temperature control flow path, 1313...merging flow path, 1314...temperature control manifold, 1315...cover, 1316...flow path block, 1321...groove, 1621...first holding portion, 1622...second holding portion, 2001...transport path, 2111...casing, 2112...medium supply portion, 2113...image forming portion, 2114...medium discharge portion, 2115...transport device, 2116...temperature control device, 2117...maintenance device, 2118...control portion, 2120...support portion, 2130...head unit, 2132...supply tank, 2134...pump, 2135...connecting flow path, 12 111...ceiling portion, 13121...flow path portion, 13122...single-row temperature control flow path portion, 13123...multiple-row temperature control flow path portion, 13141...opening, 13142...groove, 13151...opening, 13161...pipe portion, 13162...rib, 13163...groove, 21121...paper feed cassette, 21141...output tray, 21161...temperature control liquid tank, 21162...temperature control circuit, 21181...CPU, 21201...conveyor belt, 21202...support plate, 21203...belt roller, 21211 to 21218...guide plate pair, 21221 to 21228...conveyor roller, 131221...flow path,131231...flow path.

Claims

1. a liquid ejection unit having a nozzle row; a heating element corresponding to the nozzle row; a substrate connected to the heating element; a temperature control unit that contacts the substrate and the heating element; a leaf spring for holding the substrate and the heating element; A liquid ejection head comprising:

2. The liquid ejection head according to claim 1 , wherein the leaf spring integrally includes a first holding portion that holds the heat generating element and a second holding portion that holds the substrate.

3. the liquid ejection unit has a plurality of the nozzle rows, the heating elements and the substrates are arranged in a direction in which the nozzle rows are aligned, and the number of the heating elements and the substrates is at least the same as the number of the nozzle rows; 3. The liquid ejection head according to claim 2, wherein the leaf spring has two first holding portions and two second holding portions that hold two of the plurality of heating elements and two of the plurality of substrates that are adjacent in the arrangement direction.

4. The nozzle rows are four rows, Four heating elements and four substrates are provided in the arrangement direction, The liquid ejection head according to claim 3 , wherein two leaf springs are provided.

5. The first holding portion and the second holding portion are formed in a convex shape, the heating element is sandwiched between the tip of the convex shape of the first holding part and the outer surface of the temperature adjustment part, 5. The liquid ejection head according to claim 2, wherein the substrate is sandwiched between the tip of the convex shape of the second holding portion and an outer surface of the temperature adjustment portion.

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