Liquid discharge head, head module, liquid discharge device, and method of manufacturing liquid discharge head

A hydrophilic film and plating film on screw holes in liquid ejection heads address rust issues, ensuring reliable attachment and preventing corrosion, thus improving manufacturing efficiency and device durability.

JP2025118036APending Publication Date: 2025-08-13RICOH CO LTD
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Patent Information

Application Number
JP2024013096
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-01-31
Publication Date
2025-08-13

AI Technical Summary

Technical Problem

Existing liquid ejection heads face issues with rust formation in screw holes due to ink or moisture ingress, which complicates the plating process and leads to air bubble retention during manufacturing.

Method used

The liquid ejection head incorporates a hydrophilic film on the inner surface and bottom of screw holes, followed by a plating film to prevent rust, facilitating easier plating and air bubble removal.

Benefits of technology

The solution effectively prevents rust in screw holes and ensures reliable attachment and detachment of the liquid ejection head, enhancing manufacturing efficiency and device longevity.

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Abstract

To provide a liquid discharge head capable of preventing the occurrence of rust in a threaded hole into which a screw for fixing to a head mount is inserted.SOLUTION: A liquid discharge head 10 comprising a head 3 that discharges liquid and a base member 1 that holds the head 3. The liquid discharge head 10 is fixed to a head mount 2 by a screw 4 inserted from the side of the head mount 2. The base member 1 has a bottomed threaded hole 11 into which the screw 4 is inserted. The threaded hole 11 has a hydrophilic film on its inner circumferential surface and its bottom surface.SELECTED DRAWING: Figure 2
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Description

[Technical Field]

[0001] The present invention relates to a liquid ejection head, a head module, a device for ejecting liquid, and a method for manufacturing a liquid ejection head. [Background technology]

[0002] Liquid ejection heads are used in devices that eject liquids in a wide range of fields, ejecting ink or other liquids from nozzles to print images, characters, etc. Because they can eject a variety of liquids, they have also been used in industrial applications in recent years, such as in the manufacture of electrodes and electrochemical elements.

[0003] The droplet ejection head is fixed to a head mount (e.g., a carriage) of a device that ejects liquid via a base member that mounts an actuator die having a nozzle row, etc. In an embodiment in which screws are used as a fixing means, screw holes are provided in the base member.

[0004] The screw holes provided in the base member are blind (bottomed) holes to prevent ink or other liquid from entering the droplet ejection head when the head is attached or detached. However, if ink or other liquid does enter the screw holes, it may cause rust.

[0005] Furthermore, blind screw holes have the problem that it is difficult for air bubbles to escape during the plating process during manufacturing, and it is difficult for plating liquid to fill them in. Furthermore, there is a risk that rust will form in the screw holes due to residual cleaning liquid (moisture) used in the cleaning process.

[0006] BACKGROUND ART In devices that eject liquid, techniques have been proposed to prevent rust and corrosion of members that come into contact with the ejected liquid and surrounding members (see, for example, Patent Document 1). Patent Document 1 discloses an embodiment in which the dustproof cabinet is made of either a rust-proof material or a material whose surface has been treated for rust prevention. The rust-proof material is, for example, stainless steel (SUS), and the rust-proofing treatment is a surface treatment such as plating. Summary of the Invention [Problem to be solved by the invention]

[0007] However, no technology has been disclosed for preventing rust caused by structural issues in the components that make up the liquid ejection head and issues in the manufacturing process, specifically, no technology for preventing rust from occurring in screw holes.

[0008] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a liquid ejection head that can prevent rust from forming in screw holes into which screws for fixing to a head mount are inserted. [Means for solving the problem]

[0009] In order to solve the above problems, the liquid ejection head of the present invention is a liquid ejection head comprising a head that ejects liquid and a base member that holds the head, wherein the liquid ejection head is fixed to a head mount by a screw inserted from the side of the head mount, the base member has a bottomed screw hole into which the screw is inserted, and the screw hole has a hydrophilic film on its inner surface and bottom surface. [Effects of the Invention]

[0010] According to the present invention, it is possible to provide a liquid ejection head that can prevent rust from occurring in the screw holes into which the screws for fixing to the head mount are inserted. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a perspective view showing an external appearance of an example of a liquid ejection head according to the present invention. [Figure 2] FIG. 2 is an explanatory diagram showing an example of a head module according to the present invention. [Figure 3] FIG. 1 is an exploded perspective view illustrating an example of a liquid ejection head. [Figure 4] FIG. 1 is an exploded perspective view illustrating an example of a liquid ejection head. [Figure 5] FIG. 2 is an external perspective view showing an example of a base member. [Figure 6] FIG. 2 is an explanatory diagram illustrating an example of a base member. [Figure 7] 3A and 3B are an explanatory plan view and an explanatory cross-sectional view of a base member; [Figure 8] 3A and 3B are an explanatory plan view and an explanatory cross-sectional view of a base member; [Figure 9] 1 is a schematic explanatory diagram of a printing apparatus as an example of an apparatus for ejecting liquid according to the present invention; [Figure 10] FIG. 2 is an explanatory diagram of a main part of a device for discharging liquid. [Figure 11] 1 is an explanatory diagram showing the configuration of a main part of an electrode manufacturing apparatus as an example of an apparatus for discharging a liquid according to the present invention; DETAILED DESCRIPTION OF THE INVENTION

[0012] Hereinafter, a liquid ejection head, a head module, a liquid ejection device, and a method for manufacturing a liquid ejection head according to the present invention will be described with reference to the drawings. Note that the present invention is not limited to the following embodiments, and other modifications, additions, corrections, deletions, and other changes can be made within the scope of what a person skilled in the art can conceive. Any aspect is within the scope of the present invention as long as it achieves the functions and effects of the present invention.

[0013] Fig. 1 is an external perspective view showing an example of a liquid ejection head according to the present invention, Fig. 2 is an explanatory diagram showing an example of a head module according to the present invention, Fig. 3 and Fig. 4 are exploded perspective explanatory diagrams showing an example of a liquid ejection head, and Fig. 4 is a view from the nozzle surface side of the head. The number and arrangement of heads mounted on the liquid ejection head are not limited to the examples shown in FIGS.

[0014] A liquid ejection head 10 according to the present invention includes a head 3 that ejects liquid and a base member 1 that holds the head 3. The liquid ejection head 10 is fixed to a head mount 2 by screws 4 that are inserted from the head mount 2 side. The base member 1 has a screw hole 11 with a bottom into which a screw 4 is inserted, and the screw hole 11 has a hydrophilic film on the inner peripheral surface and the bottom surface.

[0015] The head module 100 according to the present invention has a configuration in which a liquid ejection head 10 is fixed to a head mount 2 with screws 4 . The head mount 2 is a functional part or mechanism of the device to which the liquid ejection head 10 is attached, and examples thereof include a moving mechanism such as a carriage and an attachment mechanism such as a plate.

[0016] The liquid ejection head 10 includes a plurality of heads 3, which are liquid ejection heads that eject liquid, a base member 1, a nozzle cover member 103, a heat dissipation member 104, a manifold 105, a printed circuit board (PCB) 106, a case member 7, and a supply port 8.

[0017] The liquid ejection head also includes a heat dissipation member 104, a manifold 105 that forms a flow path for supplying liquid to the plurality of heads 3, and a printed circuit board (PCB) 106 that connects to the flexible wiring member 90. A driver IC (drive circuit) 91 is mounted on the flexible wiring member 90. The driver IC 102 is thermally coupled to a heat dissipation member 104.

[0018] The base member 1 is provided with a flange 5. The flange 5 is provided with through holes through which screws or the like can be inserted, thereby enabling the liquid ejection head 10 to be attached to other members or the like. In contrast to this, the screw holes 11 provided in the base member 1 of the liquid ejection head 10 of this embodiment are non-through holes and are provided on a different surface from the flange 5 .

[0019] FIG. 5 is an external perspective view showing an example of the base member 1 constituting the liquid ejection head 10 of this embodiment, and FIG. 6 is an explanatory plan view. 7 and 8 are schematic diagrams showing an example of the base member 1, with FIGS. 7(A) and 8(A) being explanatory plan views and FIGS. 7(B) and 8(B) being explanatory cross-sectional views.

[0020] The base member 1 has an opening 14 for holding the head 3, and has a screw hole 11 on a surface different from the opening 14. Although an example having three screw holes 11a, 11b, and 11c is shown in FIGS. 5 to 8, the number of screw holes is not limited to this. Hereinafter, when there is no need to distinguish between the screw holes 11a, 11b, and 11c, they will simply be referred to as "screw holes 11."

[0021] The screw hole 11 is formed in a direction (side surface) perpendicular to the liquid ejection direction of the head 3. As shown in Figure 2, when the head mount 2 has a vertically elongated shape that extends in the vertical direction of the figure (the direction of gravity), by fixing it on the side, it is possible to prevent the head mount 2 from warping due to weight, even when the liquid ejection head 10 has multiple heads 3. The screw hole 11 may be threaded to allow the screw 4 to be fastened thereto.

[0022] In the liquid ejection head 10 of this embodiment, the screw holes 11 are blind (bottomed) holes to prevent liquid such as ink from seeping into the head 3 through the screw holes 11 in the base member 1. This prevents liquid from entering the head 3 and coming into contact with it when the liquid ejection head 10 is attached or detached, preventing malfunctions.

[0023] On the other hand, the non-through (bottomed) screw hole 11 has a problem in that air bubbles are difficult to remove during the plating process during manufacturing, and the hole is difficult to fill with plating solution. Furthermore, there is a risk that the screw holes 11 may become rusted due to cleaning liquid remaining in the manufacturing process or liquid that enters when the liquid ejection head 10 is attached or detached.

[0024] In contrast, as shown in FIG. 7, the screw hole 11 of the base member 1 of the liquid ejection head 10 of this embodiment is provided with a hydrophilic film 12 on the inner circumferential surface 111 and bottom surface 112 (see FIG. 6). 7, the hydrophilic film on the inner circumferential surface is designated by 12a, and the hydrophilic film on the bottom surface is designated by 12b. Hereinafter, when there is no need to distinguish between them, they will simply be referred to as "hydrophilic film 12."

[0025] With regard to the hydrophilic film 12, "hydrophilic" refers to the property of having a high affinity for water. It refers to something that is easily dissolved or mixed in water, but particularly when it comes to the surface state of a substance, it is easily wetted by water. A surface is said to be highly hydrophilic when water on it does not form droplets but spreads thinly to form a water film, i.e., when the contact angle of the water droplets is close to 0 degrees.

[0026] The hydrophilicity of the hydrophilic film 12 is formed to be higher than that of the base member 1. The hydrophilic film 12 preferably contains hydrophilic metal oxide particles such as aluminum oxide (alumina: Al2O3) and / or silicon dioxide (SiO2) as a main component.

[0027] A method for forming the hydrophilic film 12 includes, for example, preparing a coating agent containing at least aluminum oxide and / or silicon dioxide, coating the screw hole 11 with the coating agent to form a coating film, and heat-treating the coating film as needed.

[0028] The thickness of the hydrophilic film 12 is about 1 μm. Because the hydrophilic film 12 is thin, there is a risk that the effect of preventing rust generation will not be obtained if the hydrophilic film 12 peels off when fastening with the screw 4. For this reason, it is preferable to form a plating film 13 on the hydrophilic film 12 in the screw hole 11.

[0029] By forming the hydrophilic film 12 (hydrophilic treatment), when the base member 1 is immersed in a plating solution in the subsequent formation of the plating film 13 (plating treatment), air bubbles in the screw hole 11 are easily removed, making it easier to form the plating film.

[0030] FIG. 8 is an explanatory diagram showing an example in which a plating film 13 is formed on a hydrophilic film 12. As shown in FIG. The screw hole 11 of the base member 1 of the liquid ejection head 10 of this embodiment is provided with a hydrophilic film 12 and a plating film 13 on the inner circumferential surface 111 and the bottom surface 112 (see FIG. 6). 8, the hydrophilic film on the inner circumferential surface is indicated as 12a, the hydrophilic film on the bottom surface as 12b, the plating film on the inner circumferential surface as 13a, and the plating film on the bottom surface as 13b. Hereinafter, when there is no need to distinguish between these, they will simply be referred to as "hydrophilic film 12" and "plating film 13."

[0031] An example of a method for forming the plating film 13 is electroless nickel plating. In forming the plating film 13 (plating process), the entire base member 1 is immersed in a plating solution, so that the plating film is also formed on portions other than the screw holes 11. By providing the plating film 13, it is possible to more reliably prevent the occurrence of rust caused by the attachment and detachment of the liquid ejection head 10 to and from the head mount 2.

[0032] The manufacturing method of the liquid ejection head of this embodiment includes the steps of forming a bottomed screw hole 11 in a base member 1 into which a screw 4 is inserted, forming a hydrophilic film 12 on the inner surface 111 and bottom surface 112 of the screw hole 11, and forming a plating film 13 on the hydrophilic film 12.

[0033] Next, an example of a liquid ejecting device according to the present invention will be described with reference to Figures 9 to 11. Figure 9 is a schematic explanatory diagram of a printing device as an example of a liquid ejecting device, and Figure 10 is an explanatory side view of the main parts. Figure 11 is an explanatory diagram showing the main configuration of an electrode manufacturing device as an example of a liquid ejecting device.

[0034] The liquid ejection device according to the present invention includes a head module 100 in which a liquid ejection head 10 is fixed to a head mount 2 with screws 4 .

[0035] 9 is a serial type printer as an example of a device for ejecting liquid. The printer 200 includes a carriage 201 as an example of a head mount 2, and a head module 100 in which a liquid ejection head 10 is fixed to the carriage 201 with screws 4.

[0036] The carriage 201 is moved back and forth in the main scanning direction by a main scanning movement mechanism 493. The main scanning movement mechanism 493 includes a guide member 401, a main scanning motor 405, a timing belt 408, etc. The guide member 401 is hung between left and right side plates 491A and 491B to movably hold the carriage 201. The main scanning motor 405 then moves the carriage 201 back and forth in the main scanning direction via a timing belt 408 hung between a drive pulley 406 and a driven pulley 407.

[0037] The carriage 201 is equipped with a liquid ejection head 10 according to the present invention and a head tank 441. These are collectively called a liquid ejection unit. The liquid ejection head 10 ejects liquid of each color, for example, yellow (Y), cyan (C), magenta (M), and black (K). The liquid ejection head 10 is mounted with a nozzle row consisting of a plurality of nozzles arranged in a sub-scanning direction perpendicular to the main scanning direction, and the ejection direction facing downward. are.

[0038] The printing apparatus 200 includes a transport mechanism 495 for transporting paper 410. The transport mechanism 495 includes a transport belt 412, which is a transport means, and a sub-scanning motor 416 for driving the transport belt 412.

[0039] The conveyor belt 412 attracts the paper 410 and conveys it at a position facing the liquid ejection head 10. The conveyor belt 412 is an endless belt that is stretched between a conveyor roller 413 and a tension roller 414. The paper can be attracted by electrostatic attraction or air suction.

[0040] The conveyor belt 412 moves in a circular motion in the sub-scanning direction when the conveyor roller 413 is rotationally driven by a sub-scanning motor 416 via a timing belt 417 and a timing pulley 418 .

[0041] Furthermore, a maintenance and recovery mechanism 420 for performing maintenance and recovery of the liquid ejection head 10 is disposed on one side of the conveyor belt 412 on one side of the carriage 201 in the main scanning direction.

[0042] The maintenance and recovery mechanism 420 is made up of, for example, a cap member 421 that caps the nozzle surface (the surface on which the nozzles are formed) of the liquid ejection head 10, a wiper member 422 that wipes the nozzle surface, and the like.

[0043] The main scanning movement mechanism 493, the maintenance and recovery mechanism 420, and the transport mechanism 495 are attached to a housing including side plates 491A and 491B and a back plate 491C.

[0044] In the printing device 200 configured in this manner, the paper 410 is fed onto the conveyor belt 412 and adsorbed thereon, and the paper 410 is conveyed in the sub-scanning direction by the circular movement of the conveyor belt 412. Therefore, by driving the liquid ejection head 10 in accordance with an image signal while moving the carriage 201 in the main scanning direction, liquid is ejected onto the stationary paper 410 to form an image.

[0045] The "liquid ejection device" according to the present invention also includes an electrode and electrochemical device manufacturing device. The electrode manufacturing device is, for example, a device that manufactures an electrode including a layer having an electrode material by ejecting a liquid composition using a head module 100 including a liquid ejection head 10.

[0046] An electrode manufacturing apparatus 300 shown in FIG. 11, which is an example of an apparatus for discharging a liquid, is an apparatus for manufacturing an electrode by forming an electrode material layer on an object. 11 is a head module 100 according to an embodiment of the present invention. The liquid composition is applied to an object by being ejected from a liquid ejection head 10 included in the head module 100, thereby forming a liquid composition layer.

[0047] <Means for forming layer containing electrode material, and process for forming layer containing electrode material> The target object (hereinafter sometimes referred to as "discharge target object") is not particularly limited as long as it is an object on which a layer containing an electrode material is to be formed, and can be appropriately selected depending on the purpose. Examples of the target object include an electrode substrate (current collector), an active material layer, and a layer containing a solid electrode material. The target object may also be an electrode mixture layer containing an active material on an electrode substrate (current collector). The discharge means and discharge step may also be a means and step for forming a layer containing an electrode material by directly discharging a liquid composition, as long as it is possible to form a layer containing an electrode material on the discharge target object. The discharge means and discharge step may also be a means and step for forming a layer containing an electrode material by indirectly discharging a liquid composition.

[0048] <Other components and processes> Other components included in the manufacturing apparatus for an electrode mixture layer are not particularly limited as long as they do not impair the effects of the present invention, and can be selected appropriately depending on the purpose. Furthermore, other steps included in the manufacturing method for an electrode mixture layer are also not particularly limited as long as they do not impair the effects of the present invention, and can be selected appropriately depending on the purpose. For example, components and steps included in the manufacturing apparatus and manufacturing method for an electrode mixture layer include a heating means and a heating step.

[0049] <Heating means, heating process> The heating means included in the manufacturing device for the electrode mixture layer is a means for heating the liquid composition ejected by the ejection means. Also, the heating step included in the manufacturing method for the electrode mixture layer is a step of heating the liquid composition ejected in the ejection step. By heating the liquid composition, the liquid composition layer can be dried.

[0050] <Configuration for forming a layer containing an electrode material by directly ejecting a liquid composition> Here, as an example of an electrode manufacturing apparatus, an electrode manufacturing apparatus that forms an electrode mixture layer containing an active material on an electrode substrate (current collector) will be described. As shown in FIG. 11, the electrode manufacturing apparatus 300 includes a discharge process section 310 that includes a process of applying a liquid composition onto a printing substrate 304 having an object to be discharged to form a liquid composition layer, and a heating process section 330 that includes a heating process of heating the liquid composition layer to obtain an electrode mixture layer.

[0051] The electrode manufacturing apparatus 300 includes a conveying section 305 that conveys the printing substrate 304. The conveying section 305 conveys the printing substrate 304 at a preset speed through the discharge process section 310 and the heating process section 330 in that order. There are no particular limitations on the method for manufacturing the printing substrate 304 having a discharge target such as an active material layer, and any known method can be appropriately selected.

[0052] The ejection process section 310 includes a head module 100 equipped with a liquid ejection head 10 that performs an application process of applying a liquid composition onto a printing substrate 304, a storage container 302 that stores the liquid composition 307, and a supply tube 301 that supplies the liquid composition 307 stored in the storage container 302 to the liquid ejection head 10 of the head module 100.

[0053] In the ejection process unit 310, liquid composition 307 is ejected from the liquid ejection head 10 and applied to the printing substrate 304, thereby forming a thin film of the liquid composition layer. Note that storage container 302 may be configured as an integral part of the manufacturing apparatus for the electrode mixture layer, or may be configured as a removable part from the manufacturing apparatus for the electrode mixture layer. Furthermore, storage container 302 may be a container used for adding the liquid to a storage container integrated with the manufacturing apparatus for the electrode mixture layer, or a storage container removable from the manufacturing apparatus for the electrode mixture layer.

[0054] The storage container 302 and the supply tube 301 can be arbitrarily selected as long as they can stably store and supply the liquid composition 307 .

[0055] In the heating process section 330, a solvent removal step is carried out in which the solvent remaining in the liquid composition layer is heated and removed. Specifically, the solvent remaining in the liquid composition layer is heated and dried by the heating device 303 in the heating process section 330, thereby removing the solvent from the liquid composition layer. This results in the formation of an electrode mixture layer. The solvent removal step in the heating process section 330 may also be carried out under reduced pressure.

[0056] The heating device 303 is not particularly limited and can be appropriately selected depending on the purpose. For example, the heating device 303 can be a substrate heater, an IR heater, a hot air heater, or the like. The heating device 303 may also be a combination of at least two of the substrate heater, the IR heater, and the hot air heater. The heating temperature and heating time can be appropriately selected depending on the boiling point of the solvent contained in the liquid composition 307 or the thickness of the formed film.

[0057] By using such an electrode manufacturing apparatus 300, it is possible to eject a liquid composition at a targeted location on an object to be ejected. The electrode mixture layer can be suitably used, for example, as part of the configuration of an electrochemical element. There are no particular restrictions on the components other than the electrode mixture layer in the electrochemical element, and known components can be appropriately selected. For example, components other than the electrode mixture layer include a positive electrode, a negative electrode, a separator, etc.

[0058] The liquid ejection head 10 according to the present invention can prevent rust from forming in the screw holes 11 into which the screws 4 for fixing to the head mount 2 are inserted. The head module 100 in which the liquid ejection head 10 according to the present invention is fixed to the head mount 2, and a device for ejecting liquid that includes the head module, can prevent the spread of rust that has formed in the screw holes 11 and the occurrence of corrosion.

[0059] In the present application, the liquid to be ejected may have a viscosity and surface tension that allows it to be ejected from the head, and is not particularly limited, but preferably has a viscosity of 30 mPa·s or less at room temperature and normal pressure, or upon heating or cooling. More specifically, the liquid may be a solution, suspension, emulsion, or the like containing a solvent such as water or an organic solvent, a colorant such as a dye or pigment, a polymerizable compound, a resin, a surfactant, or the like, a biocompatible material such as DNA, amino acids, proteins, or calcium, or an edible material such as a natural colorant, and the like. These liquids can be used, for example, as inkjet inks, surface treatment liquids, liquids for forming components of electronic devices or light-emitting elements, or electronic circuit resist patterns, and material liquids for 3D modeling.

[0060] Energy sources for ejecting liquid include piezoelectric actuators (laminated piezoelectric elements and thin-film piezoelectric elements), thermal actuators that use electrothermal conversion elements such as heating resistors, and electrostatic actuators consisting of a vibration plate and an opposing electrode.

[0061] A head module (liquid ejection unit) is a liquid ejection head integrated with functional parts and mechanisms, and includes a collection of parts related to liquid ejection. For example, a head module (liquid ejection unit) may include a combination of a liquid ejection head and at least one of the following components: a head tank, a carriage, a supply mechanism, a maintenance and recovery mechanism, a main scanning movement mechanism, and a liquid circulation device.

[0062] "Liquid ejection devices" include devices that have a liquid ejection head or a liquid ejection unit and eject liquid by driving the liquid ejection head. Liquid ejection devices include not only devices that can eject liquid onto objects to which the liquid can adhere, but also devices that eject liquid into air or liquid.

[0063] This "liquid ejecting device" can also include means for feeding, transporting, and discharging items onto which liquid can be attached, as well as pre-processing devices and post-processing devices.

[0064] For example, examples of "liquid ejecting devices" include image forming devices that eject ink to form images on paper, and three-dimensional modeling devices (three-dimensional modeling devices) that eject modeling liquid onto a powder layer formed from layers of powder in order to create a three-dimensional object (a three-dimensional model).

[0065] Furthermore, the term "liquid ejection device" is not limited to devices that use ejected liquid to visualize meaningful images such as letters and figures. For example, it also includes devices that form patterns that have no meaning in themselves, and devices that create three-dimensional images.

[0066] The above-mentioned "object onto which a liquid can adhere" means an object onto which a liquid can adhere at least temporarily, an object onto which the liquid can adhere and stick, an object onto which the liquid can penetrate, etc. Specific examples include media such as paper, recording paper, film, and cloth, electronic circuit boards, electronic components such as piezoelectric elements, powder layers, organ models, and test cells, and unless otherwise specified, includes all objects onto which a liquid can adhere.

[0067] The material of the "substance to which a liquid can adhere" may be any material to which a liquid can adhere, even temporarily, such as paper, thread, fiber, fabric, leather, metal, plastic, glass, wood, or ceramics.

[0068] Furthermore, the "liquid ejection device" may be a device in which a liquid ejection head and an object onto which liquid can be attached move relatively, but is not limited to this. Specific examples include a serial type device in which a liquid ejection head moves, and a line type device in which a liquid ejection head does not move.

[0069] Other examples of "liquid ejecting devices" include a treatment liquid application device that ejects a treatment liquid onto paper to apply the treatment liquid to the surface of the paper for purposes such as modifying the surface of the paper, and an injection granulation device that ejects a composition liquid in which raw materials are dispersed through a nozzle to granulate fine particles of the raw materials.

[0070] In the present application, the terms image formation, recording, printing, copying, printing, modeling, etc. are all synonymous.

[0071] For example, aspects of the present invention are as follows. <1> A liquid ejection head including a head for ejecting liquid and a base member for holding the head, the liquid ejection head is fixed to the head mount by a screw inserted from the head mount side; the base member has a bottomed screw hole into which the screw is inserted, The liquid ejection head is characterized in that the screw hole has a hydrophilic film on the inner peripheral surface and bottom surface. <2> The hydrophilic film is characterized in that it contains aluminum oxide and / or silicon dioxide. <1> 1. The liquid ejection head according to claim 1. <3> The base member has an opening for holding the head, and the screw hole is on a surface different from the opening. <1> or <2> 1. The liquid ejection head according to claim 1. <4> The screw hole has a plated film on a hydrophilic film. <1> from <3> 1. The liquid ejection head according to claim 1, wherein the liquid ejection head is a liquid ejection head having a diameter of 100 mm or less. <5> The aforementioned <1> from <4> The liquid ejection head according to any one of the above items is fixed to the head mount by the screws. <6> The aforementioned <5> A liquid ejection device is characterized by comprising the head module described above. <7> The aforementioned <5> and a liquid ejection device including the head module according to claim 1, wherein the liquid ejection device manufactures an electrode by forming an electrode material layer on an object. <8> A method for manufacturing a liquid ejection head, which includes a head that ejects liquid and a base member that holds the head, and which is fixed to a head mount by a screw that is inserted from the head mount side, comprising: This is a method for manufacturing a liquid ejection head, characterized by including the steps of: forming a bottomed screw hole in the base member into which the screw is inserted; forming a hydrophilic film on the inner surface and bottom surface of the screw hole; and forming a plating film on the hydrophilic film. [Explanation of symbols]

[0072] 1 Base material 2 Head Mount 3 heads 4 screws 5 flange 6 Cover member 10 Liquid ejection head 11 screw holes 12 Hydrophilic membrane 13 Plating film 14 Openings 100 Head module (liquid ejection unit) 111 Inner surface of screw hole 112 Bottom of screw hole 200 Liquid ejection device (printing device) 201 Carriage 300 Liquid ejection device (electrode manufacturing device) [Prior art documents] [Patent documents]

[0073] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-237124

Claims

1. A liquid ejection head including a head for ejecting liquid and a base member for holding the head, the liquid ejection head is fixed to the head mount by a screw inserted from the head mount side; the base member has a bottomed screw hole into which the screw is inserted, The liquid ejection head is characterized in that the screw hole has a hydrophilic film on the inner peripheral surface and bottom surface.

2. 2. The liquid ejection head according to claim 1, wherein the hydrophilic film contains aluminum oxide and / or silicon dioxide.

3. 2. The liquid ejection head according to claim 1, wherein the base member has an opening for holding the head, and the screw hole is on a surface different from the opening.

4. 2. The liquid ejection head according to claim 1, wherein the screw hole has a plated film on a hydrophilic film.

5. A head module in which the liquid ejection head according to any one of claims 1 to 4 is fixed to the head mount by the screws.

6. A liquid ejection device comprising the head module according to claim 5.

7. A liquid ejection device comprising the head module according to claim 5, wherein an electrode is manufactured by forming an electrode material layer on an object.

8. A method for manufacturing a liquid ejection head, which includes a head that ejects liquid and a base member that holds the head, and which is fixed to a head mount by a screw that is inserted from the head mount side, comprising: A method for manufacturing a liquid ejection head, comprising the steps of: forming a bottomed screw hole in the base member into which the screw is inserted; forming a hydrophilic film on the inner surface and bottom surface of the screw hole; and forming a plating film on the hydrophilic film.

Citation Information

Patent Citations

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