Electronic apparatus

The electronic device design addresses the challenges of adhesion and workability in liquid heat dissipation materials by using a flexible member and positioning means to ensure thermal conductivity and easy disassembly, facilitating efficient repairs.

JP2025134248APending Publication Date: 2025-09-17CANON KK
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Patent Information

Application Number
JP2024032030
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-03-04
Publication Date
2025-09-17

AI Technical Summary

Technical Problem

Existing cooling structures using liquid heat dissipation materials like grease and gap fillers cause issues such as leakage, adhesion, and reduced workability during assembly and disassembly due to their strong adhesive properties, making it difficult to disassemble electronic devices for repairs.

Method used

An electronic device design featuring a circuit board with heat-generating elements, a cooling duct, a flexible member, and positioning means to prevent direct contact between the circuit board and a heat-dissipating filler, ensuring thermal conductivity while facilitating easy disassembly.

Benefits of technology

The design maintains effective heat transfer while enhancing disassembly ease, allowing for efficient repairs by preventing adhesion and simplifying the removal of heat-dissipating materials.

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Abstract

To provide an electronic apparatus that is easy to disassemble, for example, for repair, while ensuring sufficient thermal conductivity for transferring heat from a heating element to a cooling duct.SOLUTION: An imaging apparatus 100, which is an electronic apparatus, includes a control circuit board 501 having at least one heating element 610 that generates heat through energization, a forced air-cooling duct 505 that is arranged opposite the control circuit board 501 and through which air passes to cool the heating element 610, a heat-dissipating gap filler 504 that is provided on the surface of the forced air-cooling duct 505 which faces the control circuit board 501 and that transfers heat from the heating element 610 to the forced air-cooling duct 505, a film 503 that is provided between the control circuit board 501 and the heat-dissipating gap filler 504, and positioning means 800 that positions the film 503 at a position where contact between the control circuit board 501 and the heat-dissipating gap filler 504 can be prevented.SELECTED DRAWING: Figure 6
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