Semiconductor apparatus and electronic equipment

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The semiconductor device design with through holes and internal wiring improves heat dissipation by utilizing solder balls and connection terminals, addressing the limitations of existing heat transfer methods.

JP2025139641APending Publication Date: 2025-09-29NEC PLATFROMS LTD

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Patent Information

Application Number: JP2024038584
Authority / Receiving Office: JP · JP
Patent Type: Applications
Current Assignee / Owner
Filing Date: 2024-03-13
Publication Date: 2025-09-29

Application Information

Patent Timeline

13 Mar 2024

Application

JP2024038584

29 Sep 2025

Publication

JP2025139641A

IPC: H01L23/34; H01L23/12; H05K1/02; H05K3/34

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Application Domain

Printed circuit assembling Printed circuit details

Technology Topics

Device material Solder ball

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AI Technical Summary

Technical Problem

The heat dissipation performance of semiconductor devices is limited by the number of solder balls used to transfer heat to the printed circuit board, hindering effective temperature management.

Method used

A semiconductor device configuration with through holes and internal wiring, where the semiconductor is attached to a printed circuit board via solder balls and connection terminals, allowing heat to be efficiently transferred through both paths.

Benefits of technology

Enhances heat dissipation by creating multiple pathways for heat transfer, effectively suppressing temperature rise in semiconductor devices.

✦ Generated by Eureka AI based on patent content.

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Abstract

To more efficiently dissipate heat generated by a semiconductor device and suppress temperature rise of a semiconductor apparatus.SOLUTION: A semiconductor apparatus 10 comprises a semiconductor device 1, a circuit board 3, and a printed circuit board 7. A through-hole 5 is provided in the circuit board, internal wiring 6 is disposed in the circuit board 3, the circuit board 3 is bonded to the printed circuit board 7 by a solder ball 2 in the through-hole 5, the internal wiring 6 is connected to a connection terminal 4, and the connection terminal 4 is in contact with the printed circuit board 7. Since the semiconductor device 1 is in contact not only with the printed circuit board 7 via the solder ball 2 but also with the connection terminal 4 connected to the internal wiring 6 of the circuit board 3, heat generated by the semiconductor device 1 is efficiently transferred to the printed circuit board 7. Thereby, heat generated by the semiconductor device 1 can be more efficiently dissipated.SELECTED DRAWING: Figure 1

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