Protective sheet for work processing and method for producing individualized work pieces
A protective sheet with a substrate, intermediate layer, and adhesive layer addresses the issues of static charge and surface conformity in workpiece processing, ensuring effective protection and precision during grinding of high-bump wafers.
Patent Information
- Application Number
- JP2024046589
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-03-22
- Publication Date
- 2025-10-03
AI Technical Summary
Existing protective sheets for workpiece processing, such as semiconductor wafers with irregularities, fail to adequately conform to the wafer's surface, leading to issues like water penetration and chip shift during grinding, and do not effectively suppress static charge, which can cause damage and electrostatic discharge.
A protective sheet with a substrate, an intermediate layer containing an antistatic agent, and an adhesive layer, designed to maintain antistatic properties even with thick intermediate layers, ensuring effective discharge of static electricity and conforming to uneven surfaces.
The protective sheet effectively suppresses static charge and protects the workpiece surface, preventing damage and ensuring precise grinding of high-bump wafers by maintaining antistatic properties and conforming to surface irregularities.