Light-emitting device, display device, photoelectric conversion device, and electronic apparatus

Abstract

To provide a technique which is advantageous for both suppression of light emission crosstalk and improvement of light extraction efficiency.SOLUTION: A light-emitting device comprises a light-emitting element including: a first electrode disposed on a principal surface of a substrate; a bank which is disposed to cover an outer edge of the first electrode and in which an opening is provided which exposes the inside of the outer edge of the first electrode; an organic layer disposed on the first electrode; and a second electrode which is disposed to cover the organic layer. The organic layer includes a light-emitting layer and is connected to the first electrode in the opening, and a side face of the bank facing the opening includes: a first face which consists of a first portion consisting of a first material; and a second face which is disposed between the first face and the first electrode and consists of a second face consisting of a second material that is different from the first material. The first portion reflects light, which is emitted by the light-emitting layer, more than the second portion and the second portion has an insulation property and absorbs light, which is emitted by the light-emitting layer, more than the first portion.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a light-emitting device, a display device, a photoelectric conversion device, and an electronic device. [Background technology]

[0002] Light-emitting devices including light-emitting elements using organic electroluminescence (EL) elements are known. The light-emitting elements are separated into individual pixels by banks made of insulating materials, allowing each pixel to be driven to emit light independently. In such light-emitting devices, if light-emission crosstalk occurs, in which light emitted from one pixel penetrates into an adjacent pixel, the display quality deteriorates. Patent Document 1 discloses that, in order to suppress light-emission crosstalk between pixels, a light-absorbing light-blocking layer is provided to cover the top and side surfaces of the bank. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] US Patent Application Publication No. 2019 / 0027547 Summary of the Invention [Problem to be solved by the invention]

[0004] The structure disclosed in Patent Document 1 can suppress light emission crosstalk. On the other hand, if a light blocking layer is not provided, light emitted from the light emitting layer is reflected by the bank in the light extraction direction and is absorbed by the light blocking layer, which may reduce the light extraction efficiency.

[0005] An object of the present invention is to provide a technique that is advantageous in achieving both suppression of light emission crosstalk and improvement of light extraction efficiency. [Means for solving the problem]

[0006] In view of the above problems, a light-emitting device according to an embodiment of the present invention is a light-emitting device comprising a light-emitting element including a first electrode arranged on a main surface of a substrate, a bank arranged to cover the outer edge of the first electrode and having an opening that exposes the inside of the outer edge of the first electrode, an organic layer arranged on the first electrode, and a second electrode arranged to cover the organic layer, wherein the organic layer includes a light-emitting layer and is connected to the first electrode at the opening, and the side of the bank facing the opening includes a first surface formed by a first portion made of a first material, and a second surface arranged between the first surface and the first electrode and formed by a second portion made of a second material different from the first material, and the first portion reflects light emitted from the light-emitting layer more than the second portion, and the second portion has insulating properties and absorbs light emitted from the light-emitting layer more than the first portion. [Effects of the Invention]

[0007] According to the present invention, it is possible to provide a technique that is advantageous in achieving both suppression of light emission crosstalk and improvement of light extraction efficiency. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a cross-sectional view showing an example of the configuration of a light-emitting element arranged in the light-emitting device of the present embodiment. [Figure 2] FIG. 2 is a plan view showing an example of the configuration of the light-emitting element in FIG. [Figure 3] FIG. 2 is an enlarged view of the light-emitting element of FIG. 1. [Figure 4] 2A to 2C are diagrams illustrating the effect of the light-emitting element in FIG. [Figure 5] 2A to 2C are diagrams illustrating the effect of the light-emitting element in FIG. [Figure 6] 2A to 2C are diagrams showing an example of a manufacturing process for the light-emitting element of FIG. [Figure 7] 2A to 2C are diagrams showing an example of a manufacturing process for the light-emitting element of FIG. [Figure 8] 2A to 2C are diagrams showing an example of a manufacturing process for the light-emitting element of FIG. [Figure 9] 1. FIG. 3 is a diagram showing a modified example of the light-emitting element of FIG. 1 and an example of a manufacturing process thereof. [Figure 10]1. FIG. 3 is a diagram showing a modified example of the light-emitting element of FIG. 1 and an example of a manufacturing process thereof. [Figure 11] 1. FIG. 3 is a diagram showing a modified example of the light-emitting element of FIG. 1 and an example of a manufacturing process thereof. [Figure 12] 1. FIG. 4 is a diagram showing a modified example of the light-emitting element in FIG. [Figure 13] 2 is a cross-sectional view showing a configuration example of a pixel of the light-emitting device of FIG. [Figure 14] FIG. 1 is a diagram showing an example of an image forming apparatus using a light emitting device according to an embodiment of the present invention. [Figure 15] 1A and 1B are diagrams illustrating an example of a display device using the light-emitting device of this embodiment. [Figure 16] 1 is a diagram showing an example of a photoelectric conversion device using a light emitting device according to an embodiment of the present invention. [Figure 17] 1A to 1C are diagrams illustrating examples of electronic devices using the light-emitting device of this embodiment. [Figure 18] 1A and 1B are diagrams illustrating an example of a display device using the light-emitting device of this embodiment. [Figure 19] 1 is a diagram showing an example of a lighting device using the light-emitting device of this embodiment. [Figure 20] 1A and 1B are diagrams showing an example of a moving object using the light emitting device of the present embodiment. [Figure 21] FIG. 1 is a diagram showing an example of a wearable device using the light-emitting device of the present embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the scope of the invention claimed. Although multiple features are described in the embodiments, not all of these multiple features are necessarily essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same reference numerals are used to designate the same or similar components, and redundant explanations will be omitted.

[0010] A light-emitting device according to an embodiment of the present disclosure will be described with reference to FIGS. 1 to 12. FIG. 1 is a cross-sectional view showing an example of the configuration of a light-emitting device 600 according to this embodiment. The light-emitting device 600 includes a plurality of light-emitting elements 610. The light-emitting element 610 includes an electrode 110 disposed on a major surface 106 of a substrate 100, a bank 190 disposed so as to cover the outer edge of the electrode 110 and having an opening 400 that exposes the inner side of the outer edge of the electrode 110, an organic layer 140 disposed on the electrode 110, and an electrode 150 disposed so as to cover the organic layer 140. Hereinafter, the electrode 110 will be described as functioning as an anode and the electrode 150 as a cathode; however, the electrode 110 may function as a cathode and the electrode 150 as an anode.

[0011] The light-emitting element 610 may also include a moisture-proof layer 160 arranged to cover the electrode 150. The moisture-proof layer 160 protects components such as the organic layer 140 from moisture in the air. The light-emitting element 610 may also include a planarization layer 170 arranged to cover the moisture-proof layer 160, a color filter 180 arranged on the planarization layer 170, and the like. Insulating layers 101 and 102 are arranged between the substrate 100 and the light-emitting element 610. The transistor of the drive circuit 105 arranged on the substrate 100 and the light-emitting element 610 are connected via a plug 103 and a wiring pattern 104 arranged in the insulating layers 101 and 102.

[0012] FIG. 2 is a plan view showing an example of the arrangement of light-emitting elements 610 in a light-emitting device 600. To clarify the positional relationship, FIG. 2 depicts the electrode 110, the plug 103 in contact with the electrode 110, and the opening 400 provided in the bank 190, but omits other components. In orthogonal projection onto the main surface 106 of the substrate 100, the electrode 110 may be hexagonal as shown in FIG. 2 or may have another polygonal shape. Furthermore, for example, the electrode 110 may be circular. In orthogonal projection onto the main surface 106 of the substrate 100, the opening 400 may be circular as shown in FIG. 2 or may have a polygonal shape such as a hexagon.

[0013] Fig. 3 is an enlarged view of a portion of Fig. 1. The organic layer 140 includes an organic layer 141 including at least one of a hole injection layer and a hole transport layer, an organic layer 142 functioning as a light-emitting layer, and an organic layer 143 including at least one of an electron injection layer and an electron transport layer. The organic layer 140 is connected to the electrode 110 at an opening 400. The organic layer 141 is disposed on the electrode 110 and the bank 190, the organic layer 142 is disposed so as to cover the organic layer 141, and the organic layer 143 is disposed so as to cover the organic layer 142. The film thicknesses of the organic layers 141 to 143 can each be, for example, 1 nm to 500 nm.

[0014] As shown in FIGS. 1 and 3, the organic layers 141-143 may be shared by multiple light-emitting elements 610. In other words, the organic layers 141-143 may be formed as a common layer in a light-emitting region where multiple light-emitting elements 610 are arranged, without being patterned for each light-emitting element 610. In addition, in the configuration shown in FIG. 3, the organic layers 141-143 are shown as single layers, but each may have a stacked structure composed of two or more layers. For example, the organic layer 142 functioning as the light-emitting layer may be configured to emit white light by stacking organic layers of multiple light-emitting colors. In this case, white light passes through the color filter 180, and light of a predetermined wavelength, such as red, green, or blue, is emitted.

[0015] As shown in FIGS. 1 and 3, the bank 190 has a laminated structure of a layer 120 made of a first material and a layer 130 made of a second material. The layer 120 is disposed between the layer 130 and the electrode 110. The layer 120 has insulating properties and absorbs more light emitted from the light-emitting layer (organic layer 142) than the layer 130. Hereinafter, the layer 120 may be referred to as having light absorption ability. The layer 130 reflects more light emitted from the light-emitting layer (organic layer 142) than the layer 120. Hereinafter, the layer 130 may be referred to as having light reflectivity.

[0016] Next, a comparative light-emitting element 610' having a bank 300 made of a transparent material and the problems of the light-emitting element described in Patent Document 1 will be described, followed by a description of the effects of the bank 190 of the light-emitting element 610 of this embodiment. Figures 4(a), 5(a), and 5(b) are diagrams illustrating the bank 190 of this embodiment, and Figures 4(b), 5(c), and 5(d) are diagrams illustrating the bank 300 of the comparative example.

[0017] In the light-emitting element 610′ of the comparative example, the side surface 305 of the bank 300 facing the opening 400 includes a surface 303 disposed on the lower portion 301 of the bank 300 and a surface 304 disposed on the upper portion 302 of the bank 300. Here, the boundary between the lower portion 301 (surface 303) and the upper portion 302 (surface 304) of the bank 300 is set as follows: An imaginary line 306 passing through the boundary between the surfaces 303 and 304 and parallel to the main surface 106 of the substrate 100 passes between the lower surface 144 and the upper surface 145 of the organic layer 142 functioning as the light-emitting layer, which portion overlaps with the center of the electrode 110 in orthogonal projection onto the main surface 106 of the substrate 100. Here, the center of the electrode 110 may be the geometric center of gravity of the electrode 110 in orthogonal projection onto the main surface 106 of the substrate 100.

[0018] As shown in FIG. 5(c), light L1 emitted from the organic layer 142 and reaching the bank 300 travels upward. The light L1 reaches the surface 304 of the upper portion 302 of the bank 300. The light L1 is divided into two types: light L11, which is reflected from the surface 304, and light L12, which enters the bank 300 from the surface 304 and transmits through the bank 300. As shown in FIG. 4(b), the direction of emission of light L11 is at a large angle with respect to the main surface 106 of the substrate 100, so most of the light component is emitted toward the color filter 180a of the light-emitting element 610 that emitted the light. As a result, light L11 passes through the color filter 180a, contributing to improved light extraction efficiency without causing light emission crosstalk. Meanwhile, light L12 is transmitted or guided through the bank 300, and is emitted toward the adjacent light-emitting element 610′. In this case, if the light L12 passes through the color filter 180b of the adjacent light emitting element 610', light emitting crosstalk occurs.

[0019] As shown in FIG. 5(d), downward light L2 emitted from the organic layer 142 and reaching the bank 300 reaches the surface 303 of the lower portion 301 of the bank 300. Light L2 is divided into two types: light L21 reflected from the surface 303 and light L22 entering the bank 300 from the surface 303 and transmitting through the bank 300. As shown in FIG. 4(b), the angle of the emission direction of light L21 with respect to the main surface 106 of the substrate 100 is small, so most of the light component is emitted toward the color filter 180b of the adjacent light-emitting element 610′. As a result, light L21 passes through the color filter 180b, resulting in luminescence crosstalk. Light L22 is transmitted or guided through the bank 300 and is emitted toward the adjacent light-emitting element 610′. In this case, light L22 passing through the color filter 180 of the adjacent light-emitting element 610′ results in luminescence crosstalk.

[0020] Thus, in the comparative light emitting element 610' having the bank 300 made of a transparent material, light L11 that contributes to improving the light extraction efficiency and light L12, L21, and L22 that cause luminescence crosstalk are generated from the light L1 and L2 that reach the bank 300. In other words, light L12, L21, and L22 cause degradation of image quality of the light emitting device.

[0021] Next, we consider the light-emitting device disclosed in Patent Document 1. The light-emitting device disclosed in Patent Document 1 has a light-blocking layer that absorbs light provided on the entire side surface of the bank. In this structure, the above-mentioned light L1 and L2 that reach the bank are absorbed without being reflected, thereby suppressing luminescence crosstalk. However, the above-mentioned light L11, which does not cause luminescence crosstalk and contributes to improving light extraction efficiency, is not generated because light L1 is absorbed. This may result in a decrease in light extraction efficiency.

[0022] Next, the effect of the bank 190 of the light-emitting element 610 of this embodiment will be described. In this embodiment, as shown in FIGS. 5(a) and 5(b), the side surface 192 of the bank 190 facing the opening 400 includes a surface 132 constituted by a portion 131 of the layer 130 made of the second material, and a surface 122 disposed between the surface 132 and the electrode 110 and constituted by a portion 121 of the layer 120 made of the second material different from the first material. As described above, the layer 130 is a layer that reflects light emitted from the light-emitting layer (organic layer 142) more than the layer 120. Therefore, the portion 131 reflects light emitted from the light-emitting layer (organic layer 142) more than the portion 121. Furthermore, the layer 120 is an insulating layer that absorbs light emitted from the light-emitting layer (organic layer 142) more than the layer 130. Therefore, the portion 131 is an insulating layer that absorbs light emitted from the light-emitting layer (organic layer 142) more than the portion 121.

[0023] 5(a) and 5(b), layer 120 may include portion 121 that constitutes surface 122, and layer 130 may include portion 131 that constitutes surface 132. Alternatively, for example, layers that function as portions 121 and 131 may be formed on the side surfaces of a bank made of a transparent material.

[0024] As described above, a virtual line 191 parallel to the main surface 106 of the substrate 100 passes through the boundary between the surface 122 and the surface 132 of the side surface 192 of the bank 190 and passes between the lower surface 144 and the upper surface 145 of the portion of the light-emitting layer (organic layer 142) that overlaps the center of the electrode 110 in orthogonal projection onto the main surface 106. In this case, as shown in FIG. 5( a), of the light emitted from the organic layer 142 and reaching the bank 190, upward light L1 reaches the surface 132 of the side surface 192 of the bank 190. Because the layer 130 has optical reflectivity, the light L1 is reflected without passing through the portion 131 of the bank 190 and becomes light L11. As shown in FIG. 4( b), the emission direction of the light L11 is at a large angle with respect to the main surface 106 of the substrate 100, and therefore most of the light component is emitted in the direction of the color filter 180a of the light-emitting element 610 that emitted the light. As a result, the light L11 passes through the color filter 180a, contributing to an improvement in light extraction efficiency without causing light emission crosstalk.

[0025] 5(b), of the light emitted from the organic layer 142 and reaching the bank 190, downward light L2 reaches the surface 122 of the side surface 192 of the bank 190. Since the layer 120 has light absorption ability, the light L2 is absorbed by the layer 120 (portion 121) of the bank 190, and the generation of light L21 and L22 that cause luminescence crosstalk can be suppressed.

[0026] As described above, in the case of a light-emitting element 610' having a bank 300 made of a transparent material, light L1 and L2 that reach the bank 300 are divided into light L11 that contributes to improving light extraction efficiency and light L12, L21, and L22 that cause luminescence crosstalk. Moreover, in the light-emitting element shown in Patent Document 1, light L1 and L2 that reach the bank are absorbed, and neither light L11 that contributes to improving light extraction efficiency nor light L12, L21, and L22 that cause luminescence crosstalk are generated.

[0027] On the other hand, in the light-emitting element 610 including the bank 190 of this embodiment, the generation of light L12, L21, and L22, which cause light emission crosstalk, is suppressed. Furthermore, since the layer 130 has light reflectivity, many components of the light L1 are reflected as light L11. The bank 190, in which the layers 120 and 130 are stacked, suppresses light emission crosstalk and selectively generates light L11, which contributes to improving light extraction efficiency, with a stronger intensity than the light-emitting element 610 of the comparative example including the bank 300 made of a transparent material. In other words, the light-emitting device 600 including the light-emitting element 610 to which the bank 190 of this embodiment is applied, can achieve both suppression of light emission crosstalk and improvement of light extraction efficiency.

[0028] The position of the boundary between the surface 122 and the surface 132 of the side surface 192 of the bank 190 facing the opening 400 may be changed as appropriate to suit various circumstances. For example, as described above, the imaginary line 191, which is parallel to the main surface 106 of the substrate 100 and passes through the boundary between the surface 122 and the surface 132, may pass between the surface where the organic layer 142 contacts the organic layer 141 (the lower surface 144 of the organic layer 142 functioning as the light-emitting layer) and the surface where the organic layer 142 contacts the organic layer 143 (the upper surface 145 of the organic layer 142 functioning as the light-emitting layer) at a position overlapping the center of the electrode 110. Upward light L1 that reaches the side surface 192 of the bank 190 can be reflected to the maximum extent as light L11, which contributes to improving the light extraction efficiency.

[0029] Furthermore, for example, an imaginary line 191 parallel to the main surface 106 of the substrate 100, which passes through the boundary between the surface 122 and the surface 132, may pass between the electrode 110 and the lower surface 144 of the organic layer 142 (the organic layer 141) at a position overlapping the center of the electrode 110. This increases the reflected component of the light that reaches the side surface 192 of the bank 190, further improving the light extraction efficiency. Furthermore, for example, an imaginary line 191 parallel to the main surface 106 of the substrate 100, which passes through the boundary between the surface 122 and the surface 132, may pass through the organic layer 143 at a position overlapping the center of the electrode 110. This increases the absorbed component of the light that reaches the side surface 192 of the bank 190, further suppressing luminescence crosstalk.

[0030] The angle between the side surface 192 of the bank 190 and the surface of the electrode 110 may be appropriately set depending on various circumstances. Here, the surface of the electrode 110 may be the surface of the electrode 110 that contacts the organic layer 140. The surface of the electrode 110 may also be the surface of the electrode 110 opposite to the surface facing the substrate 100. For example, the side surface 192 of the bank 190 may have an interior angle of 60 degrees or more and 90 degrees or less with respect to the surface of the electrode 110. That is, the surface 122 formed by the layer 120 and the surface 132 formed by the layer 130 may have an interior angle of 60 degrees or more and 90 degrees or less with respect to the surface of the electrode 110. This increases the aperture ratio of the light-emitting element 610, thereby contributing to improved luminous efficiency. Furthermore, the organic layer 141 can be locally thinned and stepped, thereby suppressing current leakage between adjacent light-emitting elements 610. For example, the side surface 192 of the bank 190 may have an interior angle of less than 60 degrees with respect to the surface of the substrate 100. This can prevent the electrode 150 from becoming locally high in resistance and even from being broken.

[0031] Furthermore, for example, the angle between the surface of electrode 110 and surface 122 formed by layer 120 and surface 132 formed by layer 130 may be different. For example, surface 132 may have a smaller interior angle with respect to the surface of electrode 110 than surface 122. For example, surface 132 may have an interior angle with respect to the surface of electrode 110 that is smaller than 60 degrees, and surface 122 may have an interior angle with respect to the surface of electrode 110 that is greater than or equal to 60 degrees and less than or equal to 90 degrees. This makes it possible to increase the aperture ratio of light-emitting element 610 and prevent electrode 150 from becoming locally high in resistance and even from being broken.

[0032] Next, a manufacturing method of a light-emitting device 600 including the light-emitting element 610 of this embodiment will be described with reference to FIGS. 6(a) to 8(c). First, a substrate 100 is prepared, which includes a driving circuit 105 including transistors formed using a known MOS process. An insulating layer 101 is formed on the substrate 100. Next, an insulating film such as silicon oxide or silicon oxynitride is formed using, for example, a plasma CVD method to form an insulating layer 102. The surface of the insulating layer 102, including the light-emitting region where the multiple light-emitting elements 610 are arranged, may be planarized using a CMP method or the like. After forming the insulating layer 102, multiple vias are formed at predetermined positions in the insulating layer 102 using a photolithography method, a dry etching method, or the like. Next, a conductive material such as tungsten is formed, and excess conductive material is removed using a CMP method, an etch-back method, or the like to form plugs 103, as shown in FIG. 6(a).

[0033] Next, a conductive film for forming the electrode 110 is formed on the insulating layer 102, for example, by sputtering. For example, the conductive film may be a metal film formed by laminating titanium, titanium nitride, an aluminum alloy, and titanium in this order. Alternatively, the conductive film may be a transparent conductive film such as indium tin oxide. Next, the conductive film is patterned into a predetermined shape using photolithography or, depending on the material, dry etching or wet etching, to form the electrode 110 connected to the plug 103, as shown in FIG. 6(b).

[0034] After the electrode 110 is formed, as shown in FIG. 6(c), a layer 120 constituting a bank 190 is formed so as to cover the insulating layer 102 and the electrode 110. Various materials having light absorption properties are used for the layer 120. For example, a material that absorbs part or all of the wavelengths in the visible light range (360 nm to 830 nm) is used for the layer 120. For example, chromium oxide (Cr x O yAlternatively, metal oxides such as tantalum nitride (TaN) and manganese nitride (MnN) may be used. Alternatively, black pigments such as carbon black or various resins containing black dyes may be used as the material for layer 120. Layer 120 can be formed by a method suitable for the material used, such as vacuum deposition, sputtering, spin coating, or slit coating.

[0035] Next, as shown in FIG. 7( a), layer 130, which constitutes bank 190, is formed to cover layer 120. Various materials having optical reflectivity are used for layer 130. For example, a material having a reflectance of 80% or more in the visible light region may be used as the material for layer 130. Specifically, examples of the material for layer 130 include highly reflective materials such as aluminum, silver, and platinum, and alloys containing these highly reflective materials (e.g., AlCu). Layer 130 can be formed by a method suitable for the material to be used, such as vacuum deposition or sputtering.

[0036] After the layers 120 and 130 are formed, the layers 120 and 130 are patterned into a predetermined shape using photolithography, dry etching, or the like, to form an opening 400 above the electrode 110, thereby forming the bank 190, as shown in FIG.

[0037] Next, as shown in FIG. 7( c), the organic layer 140 is formed by, for example, vacuum deposition. The organic layer 140 may include, for example, an organic layer 141 having a lower resistance than the light-emitting layer, such as a hole injection layer or a hole transport layer, an organic layer 142 functioning as the light-emitting layer, and an organic layer 143 such as an electron transport layer, which are sequentially deposited. Examples of the vacuum deposition method that may be used include rotary deposition, line deposition, and transfer deposition. Alternatively, the organic layer 140 may include, for example, a hole injection layer, a hole transport layer, a light-emitting layer, a charge generation layer, a light-emitting layer, and an electron transport layer stacked from the electrode 110 side.

[0038] After the organic layer 140 is formed, the electrode 150 is formed as shown in Fig. 8(a). For example, a transparent conductive film such as indium tin oxide may be formed as the electrode 150 using a vacuum deposition method. After the organic layer 140 is formed, the electrode 150 may be formed without exposing the organic layer 140 to the atmosphere from the reduced pressure atmosphere used for forming the organic layer 140.

[0039] 8(b), a moisture-proof layer 160 is formed by, for example, plasma CVD, sputtering, or ALD so as to cover the electrode 150. The deposition temperature of the moisture-proof layer 160 may be equal to or lower than the decomposition temperature of the organic material constituting the organic layer 140, for example, 120°C or lower.

[0040] After the moisture-proof layer 160 is formed, as shown in FIG. 8(c), a color filter material that transmits, for example, red is applied to the moisture-proof layer 160 and patterned using photolithography to form a color filter that transmits red. Next, a color filter that transmits green and a color filter that transmits blue are formed in the same manner as the color filter that transmits red. This forms the color filter 180.

[0041] 8(c), a transparent planarization layer 170 may be provided between the color filter 180 and the moisture-proof layer 160 to improve adhesion between the color filter 180 and the moisture-proof layer 160. Thereafter, although not shown, terminals for transmitting and receiving signals between the light-emitting device 600 and the outside are formed into a predetermined shape using photolithography, dry etching, or the like. Through the above steps, the light-emitting device 600 is formed, which includes the light-emitting element 610 including the bank 190 of this embodiment.

[0042] 9(a) to 9(c) are diagrams illustrating a modified example of the light-emitting element 610 described above and a method for manufacturing the same. The following description will focus on configurations that are different from the above-described embodiment, and descriptions of configurations that may be similar will be omitted as appropriate. Similar to FIG. 3, FIGS. 9(a) to 9(c) omit illustration of configurations that are disposed closer to the substrate 100 than the insulating layer 102. As shown in FIG. 9(c), the light-emitting element 610 of this embodiment further includes an insulating layer 200 that covers the bank 190.

[0043] In a comparative example light-emitting element 610′ shown in FIG. 4(b), the light-emitting elements 610′ are electrically separated by insulating banks 300. Therefore, each light-emitting element 610′ can be independently driven to emit light. The same applies to the light-emitting element 610 of this embodiment shown in FIG. 3. However, the organic layer 141, which includes at least one of a hole transport layer and a hole transport layer, has lower resistance than the organic layer 142, which functions as a light-emitting layer. Therefore, charges may transfer between light-emitting elements 610 via the organic layer 141. Furthermore, in the light-emitting element 610 shown in FIG. 3, the layer 130 has optical reflectivity, but many materials with optical reflectivity are also electrically conductive. Therefore, if charges transferred via the organic layer 141 reach the layer 130, current leakage to an adjacent light-emitting element 610 via the layer 130 may occur.

[0044] 9(c), an insulating layer 200 is provided to cover the side surfaces of the layer 120 constituting the bank 190 and the side surfaces and top surface of the layer 130. This prevents the charges that have migrated via the organic layer 141 from reaching the layer 130.

[0045] The insulating layer 200 can be made of a transparent material. When the insulating layer 200 is made of a transparent material, light that reaches the surface of the insulating layer 200 reaches the layers 120 and 130, thereby achieving the above-mentioned effects.

[0046] The refractive index of the insulating layer 200 may be close to the refractive index of the organic layer 141. If the difference between the refractive index of the insulating layer 200 and the refractive index of the organic layer 141 becomes too large, light may be reflected at the interface between the organic layer 141 and the insulating layer 200, and the above-mentioned effects may not be fully achieved. Examples of materials for the insulating layer 200 include insulating materials such as silicon oxide, silicon oxynitride, and silicon nitride. However, the insulating layer 200 is not limited to these, and any appropriate insulating material may be used depending on the refractive index of the material of the organic layer 141, etc.

[0047] The end of the insulating layer 200 may have an interior angle of 90 degrees or less with respect to the surface of the electrode 110. Furthermore, the side of the end of the insulating layer 200 may have an acute angle with respect to the surface of the electrode 110. This can prevent the electrode 150, which is disposed on the insulating layer 200 via the organic layer 140, from locally increasing in resistance or even becoming disconnected.

[0048] Next, a manufacturing flow of a light-emitting device 610 including an insulating layer 200 will be described. First, a bank 190 having an opening 400 is formed on the electrode 110 using the same steps as those shown in FIGS. 6(a) to 7(b) above. Next, as shown in FIG. 9(a), an insulating layer 200 is formed using, for example, a plasma CVD method. Furthermore, as shown in FIG. 9(b), the insulating layer 200 is patterned into a predetermined shape using photolithography and dry etching, and a corresponding opening 410 is formed on the electrode 110. The subsequent steps are the same as those described using FIGS. 7(c) to 8(c) above. By including the above steps, a light-emitting device 610 including an insulating layer 200 covering the bank 190 is formed as shown in FIG. 9(c).

[0049] In the light-emitting element 610 of this embodiment, the bank 190 including the layer 120 and the layer 130 can also suppress light emission crosstalk and improve light extraction efficiency. Furthermore, the bank 190 is covered with the insulating layer 200, thereby suppressing current leakage between the light-emitting elements 610. As a result, unintended light emission and unintended changes in luminance due to current leakage between the light-emitting elements 610 are suppressed, and the image quality of the light-emitting device 600 can be improved.

[0050] 10(a) to 10(c) are diagrams illustrating a modified example of the light-emitting element 610 described above and a manufacturing method thereof. The following description focuses on configurations different from those described in the above embodiment, and similar configurations will be omitted as appropriate. Similar to FIGS. 3 and 9(a) to 9(c), FIGS. 10(a) to 10(c) omit illustrations of configurations arranged closer to the substrate 100 than the insulating layer 102. As shown in FIG. 10(c), in the light-emitting element 610 of this embodiment, the bank 190 has a layered structure including layers 120 and 130, as well as a layer 210 on the layer 130. The side surface 192 of the bank 190 facing the opening 400 can be said to further include a surface 212 formed of a portion made of a third material different from the first material constituting the layer 120, in addition to the surfaces 122 and 132 described above. The surface 132 is disposed between the surface 212 and the surface 122.

[0051] The portion constituting the surface 132 of the light-reflecting layer 130 reflects the light emitted by the light-emitting layer (organic layer 142) more than the portion constituting the surface 212 of the layer 210 made of the third material. On the other hand, the portion constituting the surface 212 of the layer 210 absorbs the light emitted by the light-emitting layer (organic layer 142) more than the portion constituting the surface 132 of the layer 130. For this reason, the layer 210 may be expressed as having light absorption ability similar to the layer 120. For example, the layer 210 may be made of the same material as the layer 120.

[0052] In a light-emitting device 600 including a light-emitting element 610, internal reflection of external light may cause degradation of image quality of the light-emitting device 600. In the configuration of the light-emitting element 610 shown in FIG. 3, the layer 130 has optical reflectivity. Therefore, external light may be reflected on the upper surface of the layer 130, potentially causing degradation of image quality of the light-emitting device 600. Therefore, as in the light-emitting element 610 shown in FIG. 10(c), a layer 210 having optical absorption ability is disposed on the layer 130. This makes it possible to suppress reflection of external light at the bank 190. As a result, the image quality of the light-emitting device 600 may be improved.

[0053] The length of the surface 212 of the layer 210 in the normal direction to the main surface 106 of the substrate 100 (i.e., the film thickness of the layer 210) may be smaller than the length of the surface 132 of the layer 130 in the normal direction to the main surface 106 (i.e., the film thickness of the layer 130). This suppresses a decrease in the amount of upward light L1 that reaches the side surface 192 of the bank 190 and is reflected as light L11, which contributes to improving the light extraction efficiency. For example, the film thickness of the layer 210 may be ½ or less, ⅓ or less, or even ⅕ or less of the film thickness of the layer 130. The thickness of the layer 210 can be set appropriately depending on the degree of absorption of external light.

[0054] Next, a manufacturing flow of a light-emitting element 610 including a bank 190 including layers 120, 130, and 210 will be described. First, the same steps as those shown in FIGS. 6(a) to 7(a) are used to form the layer 130. Next, as shown in FIG. 10(a), the layer 210 is formed by a method suitable for the material used for the layer 210, such as vacuum deposition, sputtering, spin coating, or slit coating. Furthermore, as shown in FIG. 10(b), the layers 120, 130, and 210 are patterned into a predetermined shape using photolithography, dry etching, or the like. As a result, a bank 190 having a stacked structure including the layers 120, 130, and 210 and having an opening 400 provided above the electrode 110 is formed. Next, as shown in Fig. 7(c), an organic layer 140, an electrode 150, a moisture-proof layer 160, a planarizing layer 170, and a color filter 180 are formed by the method described in embodiment 1. The subsequent steps are the same as those described above with reference to Figs. 7(c) to 8(c). By including the above steps, a light-emitting element 610 is formed, as shown in Fig. 10(c). The light-emitting element 610 includes a bank 190 including layers 120, 130, and 210.

[0055] In the light-emitting element 610 of this embodiment, the bank 190 can also suppress light emission crosstalk and improve light extraction efficiency. Furthermore, the bank 190 includes a layer 210 having light absorption ability disposed on the layer 130, thereby suppressing degradation of image quality due to external light entering the light-emitting element 610. Although not shown in FIG. 10(c), an insulating layer 200 covering the bank 190 may be disposed similarly to the configuration shown in FIG. 9(c). This suppresses current leakage between the light-emitting elements 610, and the image quality of the light-emitting device 600 can be further improved.

[0056] 11(a) to 11(e) are diagrams illustrating a modified example of the light-emitting element 610 described above and a method for manufacturing the same. The following description will focus on configurations that are different from the above-described embodiment, and descriptions of configurations that may be similar will be omitted as appropriate. Similar to FIG. 3, FIGS. 9(a) to 9(c), and FIGS. 10(a) to 10(c), FIGS. 11(a) to 11(e) omit illustrations of configurations that are arranged closer to the substrate 100 than the insulating layer 102. As shown in FIG. 11(e), in the light-emitting element 610 of this embodiment, the organic layer 140 is arranged independently for each of the multiple light-emitting elements 610.

[0057] 11(e), in the light-emitting element 610 of this embodiment, the organic layer 140 is disposed so as to be embedded in the opening 400. Furthermore, similar to the configuration shown in FIG. 9(c), an insulating layer 200 is provided so as to cover the bank 190. By disposing the organic layer 140 only within the opening 400 as in this embodiment, current leakage between adjacent light-emitting elements 610 via the organic layer 141, which has a lower resistance than the organic layer 142 that functions as a light-emitting layer, is suppressed.

[0058] In the structure shown in FIG. 11( e), if the insulating layer 200 is not provided, the layer 130 may come into contact with the electrode 150. The layer 130 has optical reflectivity, and many materials with optical reflectivity are also electrically conductive. Therefore, when the layer 130 and the electrode 150 come into contact with each other, charge may be transferred from the electrode 150 to the layer 130. In this case, charge may not be efficiently injected into the organic layer 142, which functions as the light-emitting layer, which may result in a decrease in the performance of the light-emitting element 610, such as an increase in driving voltage. Therefore, as in this embodiment, the insulating layer 200 is provided to cover the bank 190. This suppresses the transfer of charge from the electrode 150 to the layer 130.

[0059] Next, a manufacturing flow of the light-emitting element 610 shown in Fig. 11(e) will be described. First, a bank 190 having an opening 400 formed therein is formed on the electrode 110 using the same steps as those shown in Figs. 6(a) to 7(b) above. Next, as shown in Fig. 11(a), an insulating layer 200 is formed using, for example, a plasma CVD method. Furthermore, as shown in Fig. 11(b), the insulating layer 200 is patterned into a predetermined shape using photolithography and dry etching, and a corresponding opening 410 is formed on the electrode 110.

[0060] After the bank 190 and the insulating layer 200 are formed, as shown in FIG. 11(c), organic layers 141, 142, and 143 are formed as the organic layer 140 in the opening 400 by, for example, a vacuum deposition method using a mask. Next, as shown in FIG. 11(d), the electrode 150 is formed. After the organic layer 140 is formed, the electrode 150 may be formed without exposing the organic layer 140 to the atmosphere from the reduced pressure atmosphere used when forming the organic layer 140. The subsequent steps are the same as those described above with reference to FIGS. 8(b) and 8(c). By including the above steps, a light-emitting element 610 as shown in FIG. 11(e) is formed.

[0061] In the light-emitting element 610 of this embodiment, it is also possible to suppress light emission crosstalk and improve light extraction efficiency at the same time by using the bank 190. Furthermore, since the organic layer 140 is disposed for each light-emitting element 610, current leakage between the light-emitting elements 610 is suppressed, and the image quality of the light-emitting device 600 can be improved.

[0062] 11(e) in which the organic layer 140 is provided for each light-emitting element 610, the bank 190 may also have a configuration including a layer 210 in addition to the layers 120 and 130, as shown in FIG. 10(c). In this case, if the layer 210 has insulating properties and the layer 130 (the surface 132 formed by the layer 130) is not in contact with the electrode 150, the insulating layer 200 may not be provided. This is because the layer 210 included in the bank 190 has the same effect as the insulating layer 200 provided between the electrode 150 and the layer 130 described above.

[0063] FIG. 12 is a diagram showing a modified example of the light-emitting element 610 described above. The following description will focus on configurations that are different from the above-described embodiment, and descriptions of configurations that may be similar will be omitted as appropriate. In FIG. 12, similar to FIG. 3, FIGS. 9(a) to 9(c), FIGS. 10(a) to 10(c), and FIGS. 11(a) to 11(e), configurations arranged closer to the substrate 100 than the insulating layer 102 are omitted. As shown in FIG. 12, the light-emitting element 610 of this embodiment has an optical resonator structure.

[0064] 12 includes a reflective layer 230 between the electrode 110 and the main surface 106 of the substrate 100, which reflects light emitted from the light-emitting layer (organic layer 142), and the electrode 110 transmits the light emitted from the light-emitting layer (organic layer 142). The light emitted from the light-emitting layer (organic layer 142) passes through the transparent electrode 110, and the transmitted light is reflected by the reflective layer 230. The light emitted from the light-emitting layer (organic layer 142) and the reflected light interfere with each other and constructively reinforce each other, thereby improving the luminous efficiency of the light-emitting element 610.

[0065] 12, a reflective layer 230 is provided on the insulating layer 102. An insulating layer 240 is provided so as to cover the insulating layer 102 and the reflective layer 230. The reflective layer 230 and the electrode 110 are electrically connected via a plug 103. In some of the light-emitting elements 610 arranged in the light-emitting device 600, the reflective layer 230 and the electrode 110 may be in direct contact with each other.

[0066] In the light-emitting element 610, the thickness of the insulating layer 240 disposed between the electrode 110 and the reflective layer 230, more specifically, the thickness of the insulating layer 240 disposed in the region overlapping the opening 400 in orthogonal projection onto the main surface 106 of the substrate 100, is also referred to as the optical adjustment thickness. For example, the optical adjustment thickness is adjusted so that light emitted from the light-emitting layer (organic layer 142) and light reflected by the reflective layer 230 constructively interfere with each other. When the light-emitting device 600 includes multiple light-emitting elements 610 that emit different colors, the optical adjustment thickness of the insulating layer 240 may differ depending on the color of light emitted by the light-emitting element 610. As shown in FIG. 12 , the length between the electrode 110 and the reflective layer 230 in the light-emitting element 610a (the optical adjustment thickness of the insulating layer 240) may be different from the length between the electrode 110 and the reflective layer 230 in the light-emitting element 610b (the optical adjustment thickness of the insulating layer 240).

[0067] Even in the light-emitting element 610 using an optical resonator structure, the bank 190 can suppress light emission crosstalk and improve light extraction efficiency at the same time. There is also a possibility that light may travel toward an adjacent light-emitting element 610 via the insulating layer 240. Even in such a case, when the light reaches the lower surface of the layer 120, the light is absorbed by the layer 120, and light emission crosstalk is suppressed.

[0068] The light-emitting element 610 having the optical resonator structure shown in Fig. 12 can be manufactured by using the above-described manufacturing method and a known method for manufacturing a light-emitting element and a light-emitting device having an optical resonator structure. In addition, the above-described configurations such as the insulating layer 200 and layer 210, and the organic layer 140 independent for each light-emitting element 610 may be applied to the light-emitting element 610 having the optical resonator structure shown in Fig. 12.

[0069] Here, application examples in which the light emitting device 600 of this embodiment is applied to an image forming device, a display device, a photoelectric conversion device, an electronic device, a lighting device, a mobile object, and a wearable device will be described with reference to Figs. 13(a) and 13(b) to 21(a) and 21(b). The description will be made assuming that the above-mentioned light emitting element 610, such as an organic EL element using an organic light emitting material, is arranged in a pixel arranged in the light emitting device 600. First, details of each component arranged in the pixel of the above-mentioned light emitting device 600 will be shown, and then application examples will be described.

[0070] Structure of organic light-emitting element The organic light-emitting element is provided by forming an insulating layer, a first electrode, an organic compound layer, and a second electrode on a substrate. A protective layer, a color filter, a microlens, etc. may be provided on the cathode. When a color filter is provided, a planarizing layer may be provided between the protective layer and the color filter. The planarizing layer may be made of an acrylic resin, etc. The same applies when a planarizing layer is provided between the color filter and the microlens.

[0071] substrate Examples of the substrate include quartz, glass, silicon wafer, resin, and metal. Furthermore, the substrate may be provided with a switching element such as a transistor, a wiring pattern, and the like, and an insulating layer thereon. The insulating layer may be made of any material as long as it allows contact holes to be formed so that a wiring pattern can be formed between the first electrode and the substrate, and insulation from unconnected wiring patterns is ensured. For example, the insulating layer may be made of a resin such as polyimide, silicon oxide, silicon nitride, or the like.

[0072] electrode A pair of electrodes can be used as the electrodes. The pair of electrodes may be an anode and a cathode. When an electric field is applied in the direction in which the organic light-emitting element emits light, the electrode with a higher potential is the anode, and the other is the cathode. It can also be said that the electrode that supplies holes to the light-emitting layer is the anode, and the electrode that supplies electrons is the cathode.

[0073] The anode may be made of a material with a high work function. For example, simple metals such as gold, platinum, silver, copper, nickel, palladium, cobalt, selenium, vanadium, and tungsten, mixtures containing these metals, alloys of these metals, and metal oxides such as tin oxide, zinc oxide, indium oxide, indium tin oxide (ITO), and zinc indium oxide can be used. Conductive polymers such as polyaniline, polypyrrole, and polythiophene can also be used as the anode.

[0074] These electrode materials may be used alone or in combination of two or more. The anode may be composed of one layer or multiple layers.

[0075] When the electrode is used as a reflective electrode, for example, chromium, aluminum, silver, titanium, tungsten, molybdenum, or alloys thereof, or laminates thereof can be used. The above materials can also function as a reflective film without functioning as an electrode. Furthermore, when a transparent electrode is used as the electrode, a transparent conductive oxide layer such as indium tin oxide (ITO) or indium zinc oxide can be used, but is not limited to these. Photolithography technology can be used to form the electrode.

[0076] On the other hand, a material with a low work function may be selected as the cathode material. Examples include simple metals such as alkali metals (e.g., lithium), alkaline earth metals (e.g., calcium), aluminum, titanium, manganese, silver, lead, and chromium, as well as mixtures containing these metals. Alternatively, alloys combining these simple metals may be used. For example, magnesium-silver, aluminum-lithium, aluminum-magnesium, silver-copper, and zinc-silver may be used. Metal oxides such as indium tin oxide (ITO) may also be used. These electrode materials may be used alone or in combination. The cathode may have a single-layer or multi-layer structure. Silver may be used as the cathode, and a silver alloy may be used to reduce silver aggregation. The alloy ratio is not important as long as silver aggregation is reduced. For example, the silver:other metal ratio may be 1:1 or 3:1.

[0077] The cathode may be a top-emission element using an oxide conductive layer such as ITO, or a bottom-emission element using a reflective electrode such as aluminum (Al), and is not particularly limited. The method for forming the cathode is not particularly limited, but using a DC or AC sputtering method, for example, can provide good coverage of the formed film and reduce the resistance of the cathode.

[0078] Pixel isolation layer The pixel separation layer may be formed of silicon oxides such as silicon nitride (SiN), silicon oxynitride (SiON), or silicon oxide (SiO) formed using a chemical vapor deposition (CVD) method. To increase the in-plane resistance of the organic compound layer, the thickness of the organic compound layer, particularly the hole transport layer, may be thinned on the sidewalls of the pixel separation layer. Specifically, the thickness of the organic compound layer on the sidewalls can be thinned by increasing the taper angle of the sidewalls of the pixel separation layer or the thickness of the pixel separation layer, thereby increasing vignetting during deposition.

[0079] On the other hand, the sidewall taper angle and film thickness of the pixel separation layer can be adjusted to the extent that voids are not formed in the protective layer formed thereon. By preventing voids from being formed in the protective layer, the occurrence of defects in the protective layer can be reduced. Since the occurrence of defects in the protective layer is reduced, deterioration of reliability such as the occurrence of dark spots and poor conduction of the second electrode can be reduced.

[0080] According to this embodiment, charge leakage to adjacent pixels can be effectively suppressed even if the taper angle of the sidewall of the pixel separation layer is not steep. As a result of this study, it was found that charge leakage can be sufficiently reduced if the taper angle is between 60 degrees and 90 degrees. The thickness of the pixel separation layer may be between 10 nm and 150 nm. Similar effects can also be achieved even if the pixel separation layer is composed only of pixel electrodes without a pixel separation layer. However, in this case, short circuits in organic light-emitting elements can be reduced by making the thickness of the pixel electrode less than half that of the organic layer or by making the edge of the pixel electrode forward tapered at less than 60 degrees.

[0081] Furthermore, even when the first electrode is a cathode and the second electrode is an anode, a wide color gamut and low-voltage operation are possible by forming an electron transport material and a charge transport layer, and an emitting layer on the charge transport layer.

[0082] organic compound layer The organic compound layer may be formed as a single layer or as multiple layers. When multiple layers are present, they may be called hole injection layer, hole transport layer, electron blocking layer, light-emitting layer, hole blocking layer, electron transport layer, electron injection layer, etc., depending on their functions. The organic compound layer is mainly composed of organic compounds but may also contain inorganic atoms or inorganic compounds. The organic compound layer may contain, for example, copper, lithium, magnesium, aluminum, iridium, platinum, molybdenum, zinc, etc. The organic compound layer may be disposed between the first electrode and the second electrode, or may be disposed in contact with the first electrode and the second electrode.

[0083] protective layer A protective layer may be provided on the cathode. For example, by adhering glass with a moisture absorbent on the cathode, the penetration of moisture and other contaminants into the organic compound layer can be reduced, thereby reducing the occurrence of display defects. In another embodiment, a passivation layer such as silicon nitride may be provided on the cathode to reduce the penetration of moisture and other contaminants into the organic compound layer. For example, after forming the cathode, the cathode may be transferred to another chamber without breaking the vacuum, and a 2 μm-thick silicon nitride may be formed by CVD to serve as a protective layer. After forming the protective layer by CVD, a protective layer may be formed by atomic layer deposition (ALD). The material of the protective layer formed by ALD is not limited, and may be silicon nitride, silicon oxide, aluminum oxide, or the like. Silicon nitride may be further formed by CVD on the protective layer formed by ALD. The protective layer formed by ALD may have a thickness smaller than that of the protective layer formed by CVD. Specifically, the thickness of the protective layer formed by ALD may be 50% or less, or even 10% or less, of the protective layer formed by CVD.

[0084] Color filters A color filter may be provided on the protective layer. For example, a color filter taking into consideration the size of the organic light-emitting element may be provided on another substrate, and the substrate on which the color filter is formed may be bonded to the substrate on which the organic light-emitting element is provided. Alternatively, for example, a color filter may be patterned on the above-mentioned protective layer using photolithography technology. The color filter may be made of a polymer.

[0085] planarization layer A planarization layer may be disposed between the color filter and the protective layer. The planarization layer is provided for the purpose of reducing the unevenness of the layers below the planarization layer. It may also be called a material resin layer without limiting the purpose. The planarization layer may be composed of an organic compound, and may be a low molecular weight or a high molecular weight. In consideration of reducing the unevenness, a high molecular weight organic compound may be used for the planarization layer.

[0086] The planarization layers may be provided above and below the color filter. In this case, the constituent materials of the planarization layers may be the same or different. Specific examples of the material for the planarization layer include polyvinyl carbazole resin, polycarbonate resin, polyester resin, ABS resin, acrylic resin, polyimide resin, phenol resin, epoxy resin, silicone resin, and urea resin.

[0087] Microlenses The organic light-emitting device may have an optical component such as a microlens on its light-emitting side. The microlens may be made of acrylic resin, epoxy resin, or the like. The microlens may be intended to increase the amount of light extracted from the organic light-emitting device or to control the direction of the extracted light. The microlens may have a hemispherical shape. When the microlens has a hemispherical shape, among the tangents to the hemisphere, there is a tangent that is parallel to the insulating layer, and the point of contact between this tangent and the hemisphere is the vertex of the microlens. The vertex of the microlens can be determined in the same way in any cross-sectional view. In other words, among the tangents to the semicircle of the microlens in the cross-sectional view, there is a tangent that is parallel to the insulating layer, and the point of contact between this tangent and the semicircle is the vertex of the microlens.

[0088] It is also possible to define the midpoint of a microlens. In the cross section of the microlens, a line segment is imagined from the point where an arc shape ends to the point where another arc shape ends, and the midpoint of this line segment can be called the midpoint of the microlens. The cross section for determining the vertex and midpoint may be a cross section perpendicular to the insulating layer.

[0089] The microlens has a first surface having a convex portion and a second surface opposite the first surface. The second surface can be disposed closer to the functional layer (light-emitting layer) than the first surface. To achieve this configuration, it is necessary to form the microlens on the light-emitting device. If the functional layer is an organic layer, high-temperature processes can be avoided in the microlens manufacturing process. Furthermore, if the second surface is disposed closer to the functional layer than the first surface, the glass transition temperatures of the organic compounds constituting the organic layer may all be 100°C or higher, and are preferably, for example, 130°C or higher.

[0090] Counter substrate An opposing substrate may be disposed on the planarization layer. The opposing substrate is called an opposing substrate because it is provided at a position corresponding to the aforementioned substrate. The opposing substrate may be made of the same material as the aforementioned substrate. When the aforementioned substrate is defined as a first substrate, the opposing substrate may be a second substrate.

[0091] organic layer The organic compound layers (hole injection layer, hole transport layer, electron blocking layer, light-emitting layer, hole blocking layer, electron transport layer, electron injection layer, etc.) constituting the organic light-emitting element according to an embodiment of the present disclosure may be formed by the following method.

[0092] The organic compound layer constituting the organic light-emitting device according to the embodiment of the present disclosure can be formed by dry processes such as vacuum deposition, ionization deposition, sputtering, plasma, etc. Alternatively to the dry process, a wet process can be used in which the compound is dissolved in an appropriate solvent and a layer is formed by a known coating method (e.g., spin coating, dipping, casting, LB method, inkjet method, etc.).

[0093] Here, when a layer is formed by a vacuum deposition method or a solution coating method, crystallization is unlikely to occur and the layer has excellent stability over time. When a film is formed by a coating method, the film can be formed by combining it with an appropriate binder resin.

[0094] Examples of the binder resin include, but are not limited to, polyvinylcarbazole resin, polycarbonate resin, polyester resin, ABS resin, acrylic resin, polyimide resin, phenol resin, epoxy resin, silicone resin, and urea resin.

[0095] These binder resins may be used singly or in combination as homopolymers or copolymers, and may further contain known additives such as plasticizers, antioxidants, and ultraviolet absorbers, as needed.

[0096] Pixel circuit The light-emitting device may have a pixel circuit connected to the light-emitting element. The pixel circuit may be an active matrix type that controls the emission of the first light-emitting element and the second light-emitting element independently. The active matrix type circuit may be voltage-programmed or current-programmed. The drive circuit has a pixel circuit for each pixel. The pixel circuit may have a light-emitting element, a transistor that controls the emission brightness of the light-emitting element, a transistor that controls the emission timing, a capacitor that holds the gate voltage of the transistor that controls the emission brightness, and a transistor for connecting to GND without going through the light-emitting element.

[0097] The light-emitting device has a display region and a peripheral region arranged around the display region. The display region has pixel circuits, and the peripheral region has a display control circuit. The mobility of a transistor constituting the pixel circuit may be lower than the mobility of a transistor constituting the display control circuit.

[0098] The slope of the current-voltage characteristics of the transistors that make up the pixel circuit may be smaller than the slope of the current-voltage characteristics of the transistors that make up the display control circuit. The slope of the current-voltage characteristics can be measured using the so-called Vg-Ig characteristics.

[0099] The transistors that make up the pixel circuit are transistors connected to the light-emitting elements, such as the first light-emitting element.

[0100] pixel An organic light emitting device includes a plurality of pixels, each of which includes sub-pixels that emit different colors, for example, RGB colors.

[0101] A pixel has an area called a pixel aperture that emits light. The pixel aperture may be 15 μm or less, or 5 μm or more. More specifically, it may be 11 μm, 9.5 μm, 7.4 μm, 6.4 μm, etc.

[0102] The spacing between the subpixels may be 10 μm or less, and specifically may be 8 μm, 7.4 μm, or 6.4 μm.

[0103] The pixels may be arranged in a known manner in a plan view. For example, they may be in a stripe arrangement, a delta arrangement, a pentile arrangement, or a Bayer arrangement. The shape of the subpixels in a plan view may be any known shape. For example, they may be rectangular, quadrilaterals such as diamonds, or hexagons. Of course, a shape that is close to a rectangle, rather than an exact shape, is included in the rectangle. The shape of the subpixels and the pixel arrangement may be used in combination.

[0104] Uses of the organic light-emitting device according to embodiments of the present disclosure The organic light-emitting device according to the embodiment of the present disclosure can be used as a component of a display device or a lighting device, and can also be used as an exposure light source for an electrophotographic image forming device, a backlight for a liquid crystal display device, or a light-emitting device having a white light source and a color filter.

[0105] The display device may be an image information processing device that has an image input unit that inputs image information from an area CCD, linear CCD, memory card, etc., has an information processing unit that processes the input information, and displays the input image on the display unit.

[0106] The display unit of the imaging device or inkjet printer may have a touch panel function. The driving method of this touch panel function may be an infrared method, a capacitance method, a resistive film method, or an electromagnetic induction method, and is not particularly limited. The display device may also be used in the display unit of a multifunction printer.

[0107] Next, further explanation will be given with reference to the drawings. Fig. 13(a) shows an example of a pixel arranged in a light-emitting device 600. The pixel has sub-pixels 810 (corresponding to the light-emitting element 610 described above). The sub-pixels are divided into 810R, 810G, and 810B based on their light emission. The emitted colors may be distinguished by the wavelength of light emitted from the light-emitting layer, or the light emitted from the sub-pixels may be selectively transmitted or color-converted using a color filter or the like. Each sub-pixel has a reflective electrode 802 as a first electrode on an interlayer insulating layer 801, an insulating layer 803 covering the edge of the reflective electrode 802, an organic compound layer 804 covering the first electrode and the insulating layer, a transparent electrode 805 as a second electrode, a protective layer 806, and a color filter 807.

[0108] A transistor and a capacitor may be disposed below or inside the interlayer insulating layer 801. The transistor and the first electrode may be electrically connected via a contact hole (not shown) or the like.

[0109] The insulating layer 803 may also be called a bank or a pixel separation film. The insulating layer 803 covers the edges of the first electrodes and is disposed to surround the first electrodes. The portions of the first electrodes not covered by the insulating layer 803 come into contact with the organic compound layer 804 and become light-emitting regions.

[0110] The organic compound layer 804 includes a hole injection layer 841 , a hole transport layer 842 , a first light-emitting layer 843 , a second light-emitting layer 844 , and an electron transport layer 845 .

[0111] The second electrode may be a transparent electrode, a reflective electrode, or a semi-transparent electrode.

[0112] The protective layer 806 reduces the penetration of moisture into the organic compound layer. Although the protective layer is illustrated as a single layer, it may be a multi-layer structure. Each layer may be an inorganic compound layer and an organic compound layer.

[0113] The color filters 807 are divided into 807R, 807G, and 807B depending on their colors. The color filters may be formed on a planarization film (not shown). A resin protective layer (not shown) may be disposed on the color filters. The color filters may be formed on a protective layer 806. The color filters may be provided on an opposing substrate such as a glass substrate and then bonded thereto.

[0114] A display device 800 in FIG. 13(b) (corresponding to the light-emitting device 600 described above) includes an organic light-emitting element 826 and a TFT 818 as an example of a transistor. A substrate 811 made of glass, silicon, or the like is provided with an insulating layer 812 on top of it. An active element such as the TFT 818 is disposed on the insulating layer, and a gate electrode 813, a gate insulating film 814, and a semiconductor layer 815 of the active element are disposed on top of it. The TFT 818 also includes the semiconductor layer 815, a drain electrode 816, and a source electrode 817. An insulating film 819 is provided on top of the TFT 818. An anode 821 constituting the organic light-emitting element 826 and the source electrode 817 are connected via a contact hole 820 provided in the insulating film.

[0115] The method of electrical connection between the electrodes (anode, cathode) included in the organic light-emitting element 826 and the electrodes (source electrode, drain electrode) included in the TFT is not limited to the mode shown in FIG. 13(b). That is, it is sufficient that either one of the anode or the cathode is electrically connected to either one of the TFT source electrode or the drain electrode. TFT refers to a thin-film transistor.

[0116] In the display device 800 of FIG. 13(b), the organic compound layer is illustrated as if it were a single layer, but the organic compound layer 822 may be a plurality of layers. On the cathode 823, a first protective layer 824 and a second protective layer 825 for reducing the deterioration of the organic light-emitting element are provided.

[0117] In the display device 800 of FIG. 13(b), a transistor is used as the switching element, but other switching elements may be used instead.

[0118] Further, the transistor used in the display device 800 of FIG. 13(b) is not limited to a transistor using a single-crystalline silicon wafer, and may also be a thin-film transistor having an active layer on an insulating surface of a substrate. Examples of the active layer include non-single-crystalline silicon such as single-crystalline silicon, amorphous silicon, and microcrystalline silicon, and non-single-crystalline oxide semiconductors such as indium zinc oxide and indium gallium zinc oxide. Note that the thin-film transistor is also called a TFT element.

[0119] The transistor included in the display device 800 of FIG. 13(b) may be formed in a substrate such as a silicon substrate. Here, being formed in the substrate means manufacturing a transistor by processing the substrate itself such as a silicon substrate. That is, having a transistor in the substrate can also be regarded as the substrate and the transistor being integrally formed.

[0120] The organic light-emitting element according to this embodiment has its light emission brightness controlled by a TFT, which is an example of a switching element. By providing multiple organic light-emitting elements on a surface, an image can be displayed based on the respective light emission brightnesses. Here, the switching element according to this embodiment is not limited to a TFT, but may also be a transistor formed from low-temperature polysilicon or an active matrix driver formed on a substrate such as a silicon substrate. "On the substrate" can also be referred to as "inside the substrate." Whether to provide a transistor in the substrate or to use a TFT is determined by the size of the display unit. For example, if the size is about 0.5 inches, the organic light-emitting element may be provided on a silicon substrate.

[0121] 14(a) to 14(c) are schematic diagrams showing an example of an image forming apparatus using the light emitting device 600 of this embodiment. The image forming apparatus 926 shown in Fig. 14(a) includes a photoconductor 927, an exposure light source 928, a developing unit 931, a charging unit 930, a transfer unit 932, a transport unit 933 (the transport roller in the configuration of Fig. 14(a)), and a fixing unit 935.

[0122] Light 929 is emitted from an exposure light source 928, and an electrostatic latent image is formed on the surface of the photoconductor 927. The light emitting device 600 can be used as this exposure light source 928. The developing unit 931 contains toner or the like as a developer and can function as a developing device that applies the developer to the exposed photoconductor 927. The charging unit 930 charges the photoconductor 927. The transfer unit 932 transfers the developed image to a recording medium 934. The transport unit 933 transports the recording medium 934. The recording medium 934 can be, for example, paper or film. The fixing unit 935 fixes the image formed on the recording medium.

[0123] 14(b) and 14(c) are schematic diagrams showing an exposure light source 928 in which a plurality of light-emitting sections 936 are arranged along the longitudinal direction of a long substrate. The light-emitting device 600 can be applied to these light-emitting sections 936. In other words, a plurality of pixels are arranged along the longitudinal direction of the substrate. A direction 937 is parallel to the axis of the photosensitive member 927. This column direction is the same as the axial direction of the photosensitive member 927 when it rotates. This direction 937 can also be called the long axis direction of the photosensitive member 927.

[0124] FIG. 14(b) shows a configuration in which the light-emitting units 936 are arranged along the longitudinal direction of the photoconductor 927. FIG. 14(c) shows a modified configuration of the arrangement of the light-emitting units 936 shown in FIG. 14(b), in which the light-emitting units 936 are arranged alternately in the column direction in the first and second columns. The light-emitting units 936 are arranged at different positions in the row direction in the first and second columns. In the first column, multiple light-emitting units 936 are arranged at intervals, and in the second column, light-emitting units 936 are arranged at positions corresponding to the gaps between the light-emitting units 936 in the first column. Multiple light-emitting units 936 are also arranged at intervals in the row direction. The arrangement of the light-emitting units 936 shown in FIG. 14(c) can be described as, for example, a grid-like arrangement, a houndstooth arrangement, or a checkerboard pattern.

[0125] FIG. 15 is a schematic diagram illustrating an example of a display device using a light-emitting device 600 according to this embodiment. The display device 1000 may include a touch panel 1003, a display panel 1005, a frame 1006, a circuit board 1007, and a battery 1008 between an upper cover 1001 and a lower cover 1009. Flexible printed circuits FPCs 1002 and 1004 are connected to the touch panel 1003 and the display panel 1005. An active element such as a transistor is disposed on the circuit board 1007. The battery 1008 may not be disposed if the display device 1000 is not a portable device, and even if it is a portable device, it does not need to be disposed in this position. The light-emitting device 600 can be applied to the display panel 1005. Pixels including light-emitting elements 610 disposed in the light-emitting device 600 functioning as the display panel 1005 are connected to active elements such as transistors disposed on the circuit board 1007 and operate.

[0126] The display device 1000 shown in FIG. 15 may be used as a display unit of a photoelectric conversion device (which may also be called an imaging device) that has an optical unit with multiple lenses and an imaging element that receives light that has passed through the optical unit and photoelectrically converts it into an electrical signal. The photoelectric conversion device may have a display unit that displays information acquired by the imaging element. The display unit may be a display unit exposed to the outside of the photoelectric conversion device or a display unit located within a viewfinder. The photoelectric conversion device may be a digital camera or a digital video camera.

[0127] FIG. 16 is a schematic diagram illustrating an example of a photoelectric conversion device using the light-emitting device 600 of this embodiment. The photoelectric conversion device 1100 may include a viewfinder 1101, a rear display 1102, an operation unit 1103, and a housing 1104. The photoelectric conversion device 1100 may also be called an imaging device. The light-emitting device 600 of this embodiment can be applied to the viewfinder 1101 or the rear display 1102, which are display units. In this case, the light-emitting device 600 may display not only an image to be captured, but also environmental information, imaging instructions, and the like. The environmental information may include the intensity of external light, the direction of external light, the moving speed of the subject, the possibility that the subject will be blocked by an obstruction, and the like.

[0128] Since the timing suitable for capturing an image is often very short, it is better to display information as soon as possible. Therefore, a light emitting device 600 in which pixels including light emitting elements 610 using an organic light emitting material such as an organic EL element are arranged may be used in a viewfinder 1101 or a rear display 1102. This is because organic light emitting materials have a fast response speed. A light emitting device 600 using an organic light emitting material is more suitable than a liquid crystal display device for these devices, which require a high display speed.

[0129] The photoelectric conversion device 1100 has an optical section (not shown). The optical section has multiple lenses, which form an image on a photoelectric conversion element (not shown) housed in a housing 1104 that receives light that has passed through the optical section. The focus of the multiple lenses can be adjusted by adjusting their relative positions. This operation can also be performed automatically.

[0130] The light emitting device 600 may be applied to a display unit of an electronic device. In this case, the light emitting device 600 may have both a display function and an operation function. Examples of the portable terminal include a mobile phone such as a smartphone, a tablet, and a head-mounted display.

[0131] FIG. 17 is a schematic diagram showing an example of an electronic device using the light-emitting device 600 of this embodiment. The electronic device 1200 has a display unit 1201, an operation unit 1202, and a housing 1203. The housing 1203 may have a circuit, a printed circuit board having the circuit, a battery, and a communication unit. The operation unit 1202 may be a button or a touch panel type reaction unit. The operation unit 1202 may be a biometric recognition unit that recognizes a fingerprint to perform unlocking or the like. A portable device having a communication unit can also be called a communication device. The light-emitting device 600 of this embodiment can be applied to the display unit 1201.

[0132] 18(a) and 18(b) are schematic diagrams illustrating an example of a display device using the light-emitting device 600 of this embodiment. FIG. 18(a) illustrates a display device such as a television monitor or a PC monitor. The display device 1300 has a frame 1301 and a display unit 1302. The light-emitting device 600 of this embodiment can be applied to the display unit 1302. The display device 1300 may have a base 1303 that supports the frame 1301 and the display unit 1302. The base 1303 is not limited to the form shown in FIG. 18(a). For example, the bottom edge of the frame 1301 may also serve as the base 1303. The frame 1301 and the display unit 1302 may be curved. The radius of curvature may be 5000 mm or more and 6000 mm or less.

[0133] FIG. 18(b) is a schematic diagram illustrating another example of a display device using the light-emitting device 600 of this embodiment. The display device 1310 of FIG. 18(b) is configured to be bendable and is a so-called foldable display device. The display device 1310 has a first display unit 1311, a second display unit 1312, a housing 1313, and a bending point 1314. The light-emitting device 600 of this embodiment can be applied to the first display unit 1311 and the second display unit 1312. The first display unit 1311 and the second display unit 1312 may be a single display unit without any joints. The first display unit 1311 and the second display unit 1312 can be separated by the bending point. The first display unit 1311 and the second display unit 1312 may display different images, or the first display unit and the second display unit 1312 may display a single image.

[0134] FIG. 19 is a schematic diagram illustrating an example of a lighting device using the light-emitting device 600 of this embodiment. The lighting device 1400 may include a housing 1401, a light source 1402, a circuit board 1403, an optical film 1404, and a light diffusion unit 1405. The light-emitting device 600 of this embodiment can be applied to the light source 1402. The optical film 1404 may be a filter that improves the color rendering of the light source. The light diffusion unit 1405 can effectively diffuse light from the light source, such as for lighting up, and deliver the light over a wide area. If necessary, a cover may be provided on the outermost part. The lighting device 1400 may include both the optical film 1404 and the light diffusion unit 1405, or only one of them.

[0135] The lighting device 1400 is, for example, a device that illuminates a room. The lighting device 1400 may emit white, daylight white, or any other color from blue to red. It may have a dimming circuit that adjusts the light intensity. The lighting device 1400 may have a power supply circuit connected to the light-emitting device 600 that functions as the light source 1402. The power supply circuit is a circuit that converts AC voltage into DC voltage. White has a color temperature of 4200K, and daylight white has a color temperature of 5000K. The lighting device 1400 may also have a color filter. The lighting device 1400 may also have a heat sink. The heat sink dissipates heat from within the device to the outside, and examples of the heat sink include metal with a high specific heat, liquid silicon, etc.

[0136] FIG. 20 is a schematic diagram of an automobile having a tail lamp, which is an example of a vehicle lamp using the light-emitting device 600 of this embodiment. The automobile 1500 may have a tail lamp 1501, and may be configured to turn on the tail lamp 1501 when braking or the like is performed. The light-emitting device 600 of this embodiment may be used as a headlamp as a vehicle lamp. An automobile is an example of a mobile body, and the mobile body may be a ship, a drone, an aircraft, a railcar, an industrial robot, or the like. The mobile body may have a body and a lamp provided thereon. The lamp may indicate the current location of the body.

[0137] The light emitting device 600 of this embodiment can be applied to a tail lamp 1501. The tail lamp 1501 may have a protective member that protects the light emitting device 600 functioning as the tail lamp 1501. The protective member may be made of any material as long as it has a certain degree of strength and is transparent, but may be made of polycarbonate or the like. The protective member may also be made by mixing a furandicarboxylic acid derivative, an acrylonitrile derivative, or the like with polycarbonate.

[0138] The automobile 1500 may have a body 1503 and a window 1502 attached thereto. The window may be a window for checking the front and rear of the automobile, or may be a transparent display such as a head-up display. The light-emitting device 600 of this embodiment may be used in the transparent display. In this case, the constituent materials of the electrodes and the like of the light-emitting device 600 are made of transparent materials.

[0139] 21(a) and 21(b), a further application example of the light emitting device 600 of this embodiment will be described. The light emitting device 600 can be applied to systems that can be worn as a wearable device, such as smart glasses, a head-mounted display (HMD), or smart contact lenses. An image capturing and displaying device used in such an application example has an image capturing device capable of photoelectrically converting visible light and a light emitting device capable of emitting visible light.

[0140] 21(a) illustrates glasses 1600 (smart glasses) according to one application example. An imaging device 1602 such as a CMOS sensor or a SPAD is provided on the front side of a lens 1601 of the glasses 1600. In addition, a light-emitting device 600 according to this embodiment is provided on the back side of the lens 1601.

[0141] The glasses 1600 further include a control device 1603. The control device 1603 functions as a power source that supplies power to the image capture device 1602 and the light emitting device 600 according to each embodiment. The control device 1603 also controls the operations of the image capture device 1602 and the light emitting device 600. The lens 1601 is formed with an optical system for focusing light onto the image capture device 1602.

[0142] FIG. 21(b) illustrates glasses 1610 (smart glasses) according to one application example. The glasses 1610 include a control device 1612, which is equipped with an imaging device corresponding to the imaging device 1602 and a light-emitting device 600. A lens 1611 includes an optical system for projecting light emitted from the imaging device in the control device 1612 and the light-emitting device 600, and an image is projected onto the lens 1611. The control device 1612 functions as a power source for supplying power to the imaging device and the light-emitting device 600 and controls the operation of the imaging device and the light-emitting device 600. The control device 1612 may also include a gaze detection unit that detects the gaze of the wearer. Infrared light may be used for gaze detection. The infrared light-emitting unit emits infrared light toward the eyeball of a user gazing at a displayed image. An imaging unit having a light-receiving element detects the emitted infrared light reflected from the eyeball, thereby obtaining an image of the eyeball. By providing a reduction means for reducing the amount of light from the infrared light emitting section to the display section in a plan view, degradation of image quality is reduced.

[0143] The gaze of the user relative to the displayed image is detected from an image of the eyeball obtained by capturing infrared light. Any known method can be used for gaze detection using the image of the eyeball. As an example, a gaze detection method based on the Purkinje image formed by reflection of irradiated light on the cornea can be used.

[0144] More specifically, gaze detection processing is performed based on the pupil-corneal reflex method, which calculates a gaze vector representing the direction (rotation angle) of the eyeball based on the pupil image and Purkinje image included in the captured image of the eyeball, thereby detecting the user's gaze.

[0145] The light emitting device 600 according to the embodiment of the present disclosure may include an imaging device having a light receiving element, and may control the display image based on user line of sight information from the imaging device.

[0146] Specifically, the light emitting device 600 determines a first field of view area where the user gazes and a second field of view area other than the first field of view area based on the line-of-sight information. The first field of view area and the second field of view area may be determined by a control device of the light emitting device 600, or may be determined by an external control device and received. In the display area of ​​the light emitting device 600, the display resolution of the first field of view area may be controlled to be higher than the display resolution of the second field of view area. In other words, the resolution of the second field of view area may be lower than that of the first field of view area.

[0147] The display area includes a first display area and a second display area different from the first display area, and a high-priority area is determined from the first display area and the second display area based on line-of-sight information. The first display area and the second display area may be determined by a control device of the light-emitting device 600, or may be determined by an external control device and received. The resolution of the high-priority area may be controlled to be higher than the resolution of areas other than the high-priority area. In other words, the resolution of an area with a relatively low priority may be lowered.

[0148] Note that AI may be used to determine the first field of view area and areas with high priority. The AI ​​may be a model configured to estimate the angle of gaze and the distance to an object in the line of sight from the image of the eyeball, using as training data an image of the eyeball and the direction in which the eyeball in the image was actually looking. The AI ​​program may be included in the light-emitting device 600, the imaging device, or an external device. If included in an external device, it is transmitted to the light-emitting device 600 via communication.

[0149] When display control is performed based on visual recognition detection, the smart glasses can be applied to smart glasses that further include an imaging device for capturing images of the outside world. The smart glasses can display captured outside information in real time.

[0150] The disclosure of this specification includes the following light-emitting device, display device, photoelectric conversion device, and electronic device.

[0151] (Item 1) A light emitting device comprising a light emitting element including: a first electrode arranged on a main surface of a substrate; a bank arranged to cover an outer edge of the first electrode and having an opening that exposes a portion of the first electrode that is further inward than the outer edge; an organic layer arranged on the first electrode; and a second electrode arranged to cover the organic layer, the organic layer includes a light-emitting layer and is connected to the first electrode at the opening; a side surface of the bank facing the opening includes a first surface constituted by a first portion made of a first material, and a second surface disposed between the first surface and the first electrode and constituted by a second portion made of a second material different from the first material; the first portion reflects more light emitted from the light-emitting layer than the second portion; The light emitting device is characterized in that the second portion has insulating properties and absorbs more light emitted from the light emitting layer than the first portion.

[0152] (Item 2) The light-emitting device described in item 1, characterized in that the bank has a laminated structure of a first layer containing the first portion and made of the first material, and a second layer containing the second portion and made of the second material.

[0153] (Item 3) 3. The light-emitting device according to item 1 or 2, characterized in that a virtual line parallel to the main surface passing through the boundary between the first surface and the second surface passes between the lower surface and the upper surface of a portion of the light-emitting layer that overlaps with the center of the first electrode in an orthogonal projection onto the main surface.

[0154] (Item 4) 4. The light emitting device according to any one of items 1 to 3, wherein the first surface has a smaller interior angle with respect to the surface of the first electrode than the second surface.

[0155] (Item 5) the first surface has an interior angle with the surface of the first electrode that is less than 60 degrees; 5. The light emitting device according to any one of items 1 to 4, wherein the second surface has an interior angle of 60 degrees or more and 90 degrees or less with respect to the front surface.

[0156] (Item 6) 5. The light emitting device according to any one of items 1 to 4, wherein the side surface has an interior angle of 60 degrees or more and 90 degrees or less with respect to the surface of the first electrode.

[0157] (Item 7) 7. The light-emitting device according to any one of items 1 to 6, further comprising an insulating layer disposed between the bank and the organic layer to cover the bank.

[0158] (Item 8) the side surface further includes a third surface configured by a third portion made of a third material different from the first material; the first surface is disposed between the third surface and the second surface, the first portion reflects more light emitted from the light-emitting layer than the third portion; 8. The light emitting device according to any one of items 1 to 7, wherein the third portion absorbs more light emitted from the light emitting layer than the first portion.

[0159] (Item 9) Item 9. The light-emitting device of item 8, characterized in that the bank has a laminated structure of a first layer containing the first portion and made of the first material, a second layer containing the second portion and made of the second material, and a third layer containing the third portion and made of the third material.

[0160] (Item 10) 10. The light emitting device according to item 8 or 9, wherein the second material and the third material are the same material.

[0161] (Item 11) 11. The light emitting device according to any one of items 8 to 10, wherein the length of the third surface in the normal direction of the main surface is smaller than the length of the first surface in the normal direction.

[0162] (Item 12) a reflective layer between the first electrode and the main surface that reflects light emitted by the light-emitting layer, 12. The light emitting device according to any one of items 1 to 11, wherein the first electrode transmits light emitted from the light emitting layer.

[0163] (Item 13) 13. The light emitting device according to any one of items 1 to 12, comprising a plurality of light emitting elements including the light emitting element.

[0164] (Item 14) a plurality of light-emitting elements including the light-emitting element, the plurality of light-emitting elements include a first light-emitting element and a second light-emitting element, Item 13. The light-emitting device according to item 12, characterized in that the length between the first electrode and the reflective layer in the first light-emitting element and the length between the first electrode and the reflective layer in the second light-emitting element are different from each other.

[0165] (Item 15) 15. The light-emitting device according to item 13 or 14, wherein the organic layer is shared by the plurality of light-emitting elements.

[0166] (Item 16) 15. The light-emitting device according to item 13 or 14, wherein the organic layer is disposed independently for each of the plurality of light-emitting elements.

[0167] (Item 17) 17. The light emitting device according to any one of items 1 to 16, wherein the first material includes at least one of aluminum, silver, and platinum.

[0168] (Item 18) The light-emitting device described in any one of items 1 to 17, characterized in that the second material includes at least one of chromium oxide, tantalum nitride, manganese nitride, a resin to which a black pigment has been added, and a resin to which a black dye has been added.

[0169] (Item 19) 19. A display device comprising: the light-emitting device according to any one of items 1 to 18; and an active element connected to the light-emitting device.

[0170] (Item 20) an optical unit having a plurality of lenses, an image sensor that receives light that has passed through the optical unit, and a display unit that displays an image; 19. A photoelectric conversion device, wherein the display unit displays an image captured by the imaging element, and the photoelectric conversion device comprises the light-emitting device according to any one of items 1 to 18.

[0171] (Item 21) A display unit is provided in the housing, and a communication unit is provided in the housing and communicates with an external device. 19. An electronic device, wherein the display unit comprises the light-emitting device according to any one of items 1 to 18.

[0172] The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0173] 100: substrate, 106: main surface, 110, 150: electrodes, 140 to 143: organic layers, 190: bank, 121, 131: parts, 122, 132: surfaces, 192: side surfaces, 400: openings, 600: light-emitting device

Claims

1. A light-emitting device comprising a light-emitting element including: a first electrode disposed on a main surface of a substrate; a bank disposed so as to cover an outer edge of the first electrode and having an opening provided therein to expose a portion of the first electrode that is further inward than the outer edge; an organic layer disposed on the first electrode; and a second electrode disposed so as to cover the organic layer, the organic layer includes a light-emitting layer and is connected to the first electrode at the opening; a side surface of the bank facing the opening includes a first surface constituted by a first portion made of a first material, and a second surface disposed between the first surface and the first electrode and constituted by a second portion made of a second material different from the first material; the first portion reflects more light emitted from the light-emitting layer than the second portion; The light emitting device, wherein the second portion has insulating properties and absorbs more light emitted from the light emitting layer than the first portion.

2. 2. The light-emitting device according to claim 1, wherein the bank has a laminated structure of a first layer including the first portion and made of the first material, and a second layer including the second portion and made of the second material.

3. 2. The light-emitting device according to claim 1, wherein a virtual line parallel to the main surface passing through the boundary between the first surface and the second surface passes between the lower surface and the upper surface of a portion of the light-emitting layer that overlaps with the center of the first electrode in an orthogonal projection onto the main surface.

4. The light emitting device according to claim 1 , wherein the first surface has a smaller internal angle with respect to the surface of the first electrode than the second surface.

5. the first surface has an interior angle with respect to a surface of the first electrode that is less than 60 degrees; The light emitting device according to claim 1 , wherein the second surface has an interior angle of 60 degrees or more and 90 degrees or less with respect to the surface.

6. 2. The light emitting device according to claim 1, wherein the side surface has an interior angle of 60 degrees or more and 90 degrees or less with respect to the surface of the first electrode.

7. 2. The light-emitting device according to claim 1, further comprising an insulating layer covering the bank, the insulating layer being disposed between the bank and the organic layer.

8. the side surface further includes a third surface configured by a third portion made of a third material different from the first material; the first surface is disposed between the third surface and the second surface, the first portion reflects more light emitted from the light-emitting layer than the third portion; The light emitting device according to claim 1 , wherein the third portion absorbs more light emitted by the light emitting layer than the first portion.

9. 9. The light-emitting device according to claim 8, wherein the bank has a laminated structure including a first layer including the first portion and made of the first material, a second layer including the second portion and made of the second material, and a third layer including the third portion and made of the third material.

10. 9. The light emitting device according to claim 8, wherein the second material and the third material are the same material.

11. 9. The light emitting device according to claim 8, wherein the length of the third surface in the normal direction to the main surface is smaller than the length of the first surface in the normal direction.

12. a reflective layer between the first electrode and the main surface that reflects light emitted by the light-emitting layer, The light emitting device according to claim 1 , wherein the first electrode transmits light emitted from the light emitting layer.

13. The light emitting device according to claim 1 , comprising a plurality of light emitting elements including the light emitting element.

14. a plurality of light-emitting elements including the light-emitting element, the plurality of light-emitting elements include a first light-emitting element and a second light-emitting element, 13. The light-emitting device according to claim 12, wherein the length between the first electrode and the reflective layer in the first light-emitting element and the length between the first electrode and the reflective layer in the second light-emitting element are different from each other.

15. The light-emitting device according to claim 13 , wherein the organic layer is shared by the plurality of light-emitting elements.

16. 14. The light-emitting device according to claim 13, wherein the organic layer is disposed independently for each of the plurality of light-emitting elements.

17. 2. The light emitting device according to claim 1, wherein the first material includes at least one of aluminum, silver, and platinum.

18. 2. The light emitting device according to claim 1, wherein the second material includes at least one of chromium oxide, tantalum nitride, manganese nitride, a resin to which a black pigment has been added, and a resin to which a black dye has been added.

19. A display device comprising: a light-emitting device according to claim 1; and an active element connected to the light-emitting device.

20. an optical unit having a plurality of lenses, an image sensor that receives light that has passed through the optical unit, and a display unit that displays an image; A photoelectric conversion device, wherein the display section displays an image captured by the imaging element, and the photoelectric conversion device comprises the light-emitting device according to claim 1 .

21. A display unit is provided in the housing, and a communication unit is provided in the housing and communicates with an external device.

19. An electronic device, wherein the display unit comprises the light-emitting device according to claim 1.

Images