Light-emitting device

Abstract

To reduce a sense of separation in display, of a display device, and to reduce the power consumption of the display device.SOLUTION: A light-emitting device includes a flexible display part, and the display part includes a bent part and the bent part is in an area other than the center of the display part. When the display part is bent at the bent part, a first area of the display part cannot be visually recognized from outside, and a second area thereof can be visually recognized. A translucent area may be also provided, and when the display part is bent at the bent part, portion of the display part may be visually recognized from outside.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an article, a method, or a manufacturing method. Alternatively, the present invention relates to a process, a machine, relating to the manufacture or composition of matter, especially The present invention relates to, for example, a semiconductor device, a display device, a light-emitting device, a lighting device, a power storage device, and In particular, one aspect of the present invention relates to a display device, an electric In particular, one embodiment of the present invention relates to an electroluminescent device, Electroluminescence (hereinafter referred to as EL) phenomenon The present invention relates to a display device, an electronic device, or a manufacturing method thereof. [Background technology]

[0002] In recent years, display devices are expected to be used in a variety of applications, and diversification is required. For example, in the case of a display device for a portable device, it is important that the display device is small, thin, and lightweight. On the other hand, it is desirable for the display device to have a large screen (wide display area). In rare cases, there is also a demand for reducing the area other than the display area of ​​a display device (so-called narrow frame). There are.

[0003] In addition, light-emitting elements that utilize the EL phenomenon (also referred to as EL elements) can be easily made thin and lightweight. Features include high-speed response to input signals and the ability to be driven using a low-voltage DC power supply. Its application to display devices is being considered.

[0004] For example, Patent Document 1 discloses a front panel and a main body that are foldably connected together. The present invention discloses a portable communication device having a display on the side. When unfolded, one side of each display is in contact with the other, It is a portable communication device that combines a large screen for playing games with a compact and lightweight device. do. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2000-184026 Summary of the Invention [Problem to be solved by the invention]

[0006] However, since each display has a non-display area surrounding the display area, In this configuration, there is a non-display area at the seam between the two displays and in its vicinity. The larger the display area, the greater the visual impact of a single image displayed using multiple displays. The display appears to be separated to the viewer (this is also referred to as the display having a sense of separation).

[0007] Therefore, one aspect of the present invention provides a display device or electronic device in which the sense of separation of the display is suppressed. Another object of one embodiment of the present invention is to provide a display device or an electronic device that is small in size. Another object of the present invention is to provide a lightweight display device or Another object of the present invention is to provide an electronic device having a narrow frame. Another object of the present invention is to provide a display device or an electronic device. Another object of the present invention is to provide a display device or electronic device that is less susceptible to damage. An object of the present invention is to provide a display device or electronic device with reduced power consumption. Another object of one embodiment of the present invention is to provide a novel display device or electronic device. .

[0008] The description of these problems does not preclude the existence of other problems. The embodiment does not necessarily have to solve all of these problems. The above will be made clear from the description, drawings, claims, etc. It is possible to extract other issues from the descriptions in the patent, claims, etc. [Means for solving the problem]

[0009] One embodiment of the present invention includes a flexible display portion. The display portion has a bent portion. is located in a region other than the center of the display unit. The display unit may have a plurality of bent portions. When there are multiple bent portions, at least one of the bent portions is located in an area other than the center of the display portion. do.

[0010] Another embodiment of the present invention includes a flexible display portion and a light-transmitting region. When the display unit is bent, the display unit is illuminated through the light-transmitting region. A part of the transparent region is visible from the outside. It is sufficient that the configuration has a component having the functions described above, and it may have other functions. It may also have functions such as a panel and keyboard.

[0011] Another embodiment of the present invention includes a housing, a flexible display portion, and a winding portion. The display unit is connected to the winding unit, and the winding unit winds up and stores a part of the display unit. It has a function.

[0012] Another embodiment of the present invention includes a flexible display portion. The display portion has a first region and a second region. Even when the first area is stored so that it cannot be seen from the outside, The second area can be seen from the outside. Therefore, the second area can be used as a sub-display. It is possible to do this.

[0013] In the above configuration, the method of storing the first area of ​​the display unit so that it cannot be seen from the outside is as follows: The first region may be wound up or folded. It may also be a method of storing it inside the body.

[0014] In each of the above configurations, the second area of ​​the display unit has functions other than that of a sub-display. For example, the device may have a touch panel, keyboard, or other functions. That's fine.

[0015] In each of the above configurations, the second region has a surface exposed by a light-transmitting member. may be protected from

[0016] The display unit may be flexible and may include, for example, an electroluminescence element. The semiconductor device may also be configured to include a transistor. The transistor may be a silicon The transistor may be a transistor using a silicon or a transistor using an oxide semiconductor. The oxide semiconductor may be an oxide containing any one of indium, gallium, and zinc. can be used. [Effects of the Invention]

[0017] According to one embodiment of the present invention, a display device or an electronic device in which the sense of separation of the display is suppressed can be provided. Alternatively, in one embodiment of the present invention, a small-sized display device or electronic device can be provided. According to one embodiment of the present invention, a lightweight display device or electronic device can be provided. In one embodiment, a display device or electronic device having a narrow frame can be provided. In one embodiment of the present invention, a display device or electronic device that is less likely to be damaged can be provided. A display device or an electronic device with reduced power consumption can be provided. Thus, a novel display device or electronic device can be provided.

[0018] The description of these effects does not preclude the existence of other effects. The embodiment does not necessarily have to have all of these effects. , the specification, drawings, claims, etc., and It is possible to extract other effects from the claims and other descriptions. [Brief explanation of the drawings]

[0019] [Figure 1] 1A and 1B are diagrams illustrating examples of electronic devices. [Figure 2] 1A and 1B are diagrams illustrating examples of electronic devices. [Figure 3] 1A and 1B are diagrams illustrating examples of electronic devices. [Figure 4] 1A and 1B are diagrams illustrating examples of electronic devices. [Figure 5] 1A and 1B are diagrams illustrating examples of electronic devices. [Figure 6] 1A and 1B are diagrams illustrating examples of electronic devices. [Figure 7] 1A and 1B are diagrams illustrating examples of electronic devices. [Figure 8] 1A and 1B are diagrams illustrating examples of electronic devices. [Figure 9] FIG. 1 illustrates an example of a display device. [Figure 10] FIG. 1 illustrates an example of a display device. [Figure 11] FIG. 1 illustrates an example of a display device. [Figure 12] FIG. 1 illustrates an example of a display device. [Figure 13] FIG. 1 illustrates an example of a display device. [Figure 14] FIG. 1 illustrates an example of a display device. [Figure 15] FIG. 1 illustrates an example of a display device. [Figure 16] FIG. 1 illustrates an example of a display device. [Figure 17] FIG. 1 illustrates an example of a display device. [Figure 18] 1A and 1B are diagrams illustrating examples of electronic devices. [Figure 19] 1A and 1B are diagrams illustrating examples of electronic devices. [Figure 20] 1A and 1B are diagrams illustrating examples of electronic devices. DETAILED DESCRIPTION OF THE INVENTION

[0020] The embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. The present invention is not limited to the above embodiments, and various changes and modifications may be made in the form and details thereof without departing from the spirit and scope of the present invention. It will be readily understood by those skilled in the art that the present invention can be achieved by the following embodiments. It should not be construed as being limited to the contents described.

[0021] In the configuration of the invention described below, the same parts or parts having similar functions are designated by the same reference numerals. The same reference numerals are used in common among different drawings, and the repeated explanations thereof will be omitted. When referring to a function, the hatch pattern may be the same and no particular symbol may be added.

[0022] In addition, the position, size, range, etc. of each component shown in the drawings are not necessarily the same as those in the actual device for ease of understanding. Therefore, the disclosed invention may not necessarily represent the actual position, size, range, etc. The position, size, range, etc. are not necessarily limited to those disclosed in the drawings, etc.

[0023] (Embodiment 1) In this embodiment, an electronic device to which one embodiment of the present invention is applied will be described with reference to FIGS. 1 and 2. I will explain.

[0024] Examples of electronic devices include television sets (also known as televisions or television receivers). (c), computers, digital cameras, digital video cameras, digital photo frames , mobile phones (also called mobile phones or mobile phone devices), portable game consoles, personal digital assistants, sound Examples include sound reproduction devices and large gaming machines such as pachinko machines.

[0025] These electronic devices have operation buttons, external connection ports, speakers, and other components in addition to the display shown below. The display unit may be provided with a touch panel or a sensor. This allows you to input information by touching the display or holding your finger over it. By operating the buttons, you can turn the power on and off, change the type of image displayed on the display, and change the volume. It is also possible to switch between the following.

[0026] The electronic device of this embodiment has a highly flexible display portion. The electronic device of this embodiment can be folded by bending the highly flexible display portion. The foldable design offers excellent portability and a seamless, large viewing area when unfolded. This provides excellent visibility of the display.

[0027] When the electronic device of the present embodiment is not in use, the display surface of the display unit can be bent inward. By doing so, scratches and dirt on the display surface can be prevented.

[0028] In the following, a foldable electronic device having a highly flexible region and a less flexible region will be described. The highly flexible area can be folded and bent. This is the bending portion (hereinafter also referred to as the bending portion).

[0029] In the electronic device of this embodiment, the highly flexible region can be folded either inward or outward. It can be bent.

[0030] In this specification, the term "inward bending" refers to bending the display surface of the display unit inward, and "inward bending" refers to bending the display surface of the display unit inward. When the display surface of the display is bent outward, it is called "outward bending." The display surface of the device refers to the surface on which the user views the display unit.

[0031] 1(A) and 2(A) are plan views of the electronic device when the display unit is unfolded. FIG. 1(B) is a plan view of the electronic device when the display unit is folded. (B) is an example of a side view of an electronic device when the display unit is folded, as seen from the direction of the arrow. 2(B) and 2(C) are views of the electronic device shown in FIG. 2(A) as seen from the direction of the arrow. FIG. 2(D) is a cross-sectional view taken along the dashed line AB in FIG. 2(A). This is an example.

[0032] The electronic device shown in FIG. 1A has a highly flexible region E1, a less flexible region E2, and a flexible The flexible region E3 has a low flexibility region, and the flexible region and the low flexibility region are each strip-shaped (striped). In this embodiment, a plurality of highly flexible regions and a plurality of less flexible regions are provided. Although an example is shown in which the regions are parallel to each other, the regions do not have to be arranged parallel.

[0033] In the electronic device shown in FIG. 1, the highly flexible region E1 is located in a region other than the center of the display unit. That is, the width of the less flexible region E2 is smaller than the width of the less flexible region E3 (E3 The configuration is not limited to that shown in FIG. 1, and the width of the low flexibility region E2 may be It may be configured such that the width is larger than the width of the less flexible region E3 (E2>E3).

[0034] In the electronic device shown in FIG. 1, the portion included in the highly flexible region E1 of the display unit is a bending portion. The electronic device shown in FIG. 1(A) can be folded at the highly flexible region E1. When the display device is bent, as shown in FIG. 1B, a part of the display located in the less flexible area E3 is bent. Some of the flexible regions overlap with the less flexible region E2, but some of the flexible regions do not overlap with the less flexible region E2 and are exposed. In other words, when the device is folded, part of the display cannot be seen from the outside, and the other part is visible. Therefore, even when the device is folded, the display is visible. A part of the display can be used as a sub-display. It is also possible to provide a function to display incoming emails, phone calls, etc.

[0035] By using part of the display as a sub-display, you can set up a separate sub-display. Therefore, the manufacturing process can be simplified and costs can be reduced.

[0036] In addition, by using part of the display as a sub-display, some information can be obtained. Therefore, it is not necessary to use the entire display area. This reduces the power consumption of the display, i.e., when folded and not visible to the user. By making the non-display area non-displayable, the power consumption of the electronic device can be reduced.

[0037] In the case of a display device having a main display and a sub-display independently, From the viewpoint of simplifying the process and reducing costs, the sub-display is On the other hand, in one aspect of the present invention, a part of the main display is used as a sub display. Therefore, when using a sub-display, You can also view the display with the same resolution as the main display.

[0038] Therefore, in one embodiment of the present invention, a high-definition display device is preferably used for the display portion. By applying one embodiment of the present invention, a main body configured with this high-definition display device can be Part of the display area can be used as a sub-display. You can get a high-definition sub-display without any hassle.

[0039] The electronic device of this embodiment has a flexible display portion. The display device may be, for example, an EL element (organic EL elements including organic and inorganic materials, organic EL elements, inorganic EL elements), LEDs (white LEDs, red color LED, green LED, blue LED, etc.), transistor (transistor that emits light according to the current Electron emitter, liquid crystal element, electronic ink, electrophoretic element, grating light Valve (GLV), Plasma Display (PDP), MEMS (Micro Electro Mechanical Systems) Display element using a digital micromirror device (DMD) ), DMS (Digital Micro Shutter), Interferometric Modulation (IMOD) element, shutter -type MEMS display element, optical interference type MEMS display element, electrowetting display elements, piezoelectric ceramic displays, carbon nanotube-based display elements, etc. In addition to these, there are also other types of contrast that can be produced by electrical or magnetic effects. The display medium may have a variable brightness, reflectance, transmittance, etc. Examples of display devices that have been used include field emission displays (FED) and SEDs. Flat panel display (SED: Surface conduction electro In addition, displays using liquid crystal elements are also available. Examples of devices include liquid crystal displays (transmissive liquid crystal displays, semi-transmissive liquid crystal displays, etc.). (i) reflective LCD displays, direct-view LCD displays, projection LCD displays, etc. In addition, there are also other methods using electronic ink, electronically operated liquid powder, or electrophoretic elements. An example of a display device is electronic paper. In order to realize a reflective LCD or a reflective type LCD, some or all of the pixel electrodes must be reflective. For example, a part or all of the pixel electrodes may be The reflective electrode may have aluminum, silver, or the like. It is also possible to provide a memory circuit such as an SRAM below the The force can be reduced.

[0040] In particular, display devices using organic EL elements have high flexibility and impact resistance, and are thin and lightweight. It is preferable to use a display device using an organic EL element as the display unit. This allows bending with a radius of curvature between 1mm and 100mm, for example. The device can be suitably used in electronic devices that are folded one or more times by bending inward or outward.

[0041] In this embodiment, the highly flexible region E1 in the electronic device is at least In FIG. 1, the highly flexible region E1 is a display device. The display device 11 has a display area 11a and a The display device 11 may have a non-display area 11b. The use of such a display device is preferred because it can be made thin and lightweight in addition to being highly flexible and impact resistant. It's nice.

[0042] The less flexible regions E2 and E3 in the electronic device are at least flexible display The display device has a support that is less flexible than the display device superposed thereon.

[0043] The electronic device shown in FIGS. 1 and 2(A), (B), and (D) includes a support 15a and a support 15b. The supports 15a and 15b have lower flexibility than the display device 11. 5a and 15b are spaced apart from each other.

[0044] The support is provided on at least one of the display surface side and the opposite side of the display surface of the display device. 1 and 2, the support 15a is attached to the display surface side of the display device 11, and the display When the support 15b is provided on the opposite side of the surface, the display device can be sandwiched between the pair of supports. This is preferable because it increases the mechanical strength of the less flexible area and makes the electronic device less susceptible to damage.

[0045] In addition, instead of the supports 15a and 15b, the support 15 shown in FIG. 2(C) is used. A display device 11 may be disposed between the display device 11 and the display device 5.

[0046] The display device 11 has a support only on either the display surface side or the opposite side to the display surface. This is preferable because it allows the electronic device to be made thinner or lighter. Alternatively, the electronic device may have only the support 15b.

[0047] The highly flexible region E1 and the less flexible regions E2 and E3 are arranged to be more flexible than the display device and the support. It is preferable that a highly flexible protective layer is provided on the electronic device. The region E1 with high flexibility is a region with high mechanical strength, and the electronic device is more resistant to damage. Even in highly flexible areas, electronic devices can be prevented from deformation due to external forces, etc. The shape can be made to be less likely to break.

[0048] In FIG. 1, the display device 11 has a surface opposite to the display surface protected by a protective layer 13. There are.

[0049] The thickness of each of the display device 11, the supports 15a and 15b, and the protective layer 13 may be, for example, For example, it is preferable that the support is the thickest and the display device is the thinnest. The flexibility of the body 15a and the protective layer 13 can be determined by, for example, the flexibility of the supports 15a and 15b. The structure in which the resistance is the lowest and the flexibility of the display device 11 is the highest is preferable. As a result, the difference in flexibility between the highly flexible region E1 and the less flexible regions E2 and E3 is large. This allows the structure to be reliably folded in the highly flexible region. This makes it possible to prevent bending in the less flexible region E2 or E3, thereby improving the reliability of the electronic device. In addition, it is possible to prevent the deterioration of the design of the electronic device when it is folded. It can be controlled.

[0050] When the display device 11 has a protective layer on both the display surface side and the opposite side to the display surface, the pair of protective layers Therefore, the display device can be sandwiched, which increases the mechanical strength of the electronic device and makes it less likely to be damaged. This is preferable as it makes it less likely to occur.

[0051] For example, as shown in FIG. 2B, in the low flexibility regions E2 and E3, a pair of protective layers 13a, 13b are positioned between a pair of supports 15a, 15b, and the display device 11 is supported by a pair of protective It is preferably located between layers 13a and 13b.

[0052] Alternatively, as shown in FIG. 2(C), in the less flexible regions E2 and E3, a pair of protective layers 13a, 13b are positioned between the support 15, and the display device 11 is It is preferable that it is located between

[0053] If a protective layer is provided only on either the display surface side or the opposite side of the display surface of the display device, This is preferable because it allows the sub-device to be thinner or lighter. Alternatively, the electronic device may have only the protective layer 13b.

[0054] Furthermore, if the protective layer 13a on the display surface side of the display device is a light-shielding film, the external light may be projected onto the non-display area of ​​the display device. This can prevent the driver circuit included in the non-display area from being irradiated with light. This is preferable because it can suppress light deterioration of transistors and the like.

[0055] As shown in FIG. 2(D), the opening of the protective layer 13a provided on the display surface side of the display device 11 is The display area 11a of the display device is overlapped with the non-display area 11a. The protective layer 13a is provided on the opposite side of the display surface of the display device 11. The provided protective layer 13b overlaps the display area 11a and the non-display area 11b. The layer 13b is wider than the protective layer 13a and is in contact with the surface of the display device 11 opposite to the display surface. In particular, it is preferable to provide the display device 11 so as to be in contact with the entire surface opposite to the display surface. This makes it possible to more reliably protect the display device and improve the reliability of the electronic device. do.

[0056] The protective layer and the support can be formed using plastic, metal, alloy, rubber, etc. By using materials such as plastic and rubber, it is possible to obtain a protective layer and support that is lightweight and resistant to damage. For example, a protective layer made of silicone rubber and a support made of stainless steel or aluminum are preferable. Just use the .

[0057] It is also preferable to use a highly tough material for the protective layer and the support. For example, organic resins and thin metal materials can be used to realize electronic devices that are highly durable and resistant to damage. By using aluminum or alloy materials, it is possible to realize electronic devices that are lightweight and resistant to breakage. For the same reason, it is preferable to use a highly tough material for the substrate that constitutes the display device. .

[0058] The protective layer and the support positioned on the display surface side are transparent when they do not overlap the display area of ​​the display device. The protective layer or support located on the display surface side overlaps at least a part of the display area. In this case, it is preferable to use a material that transmits the display from the display device. The light-transmitting properties of the protective layer and the support located on the opposite side to the surface are not important.

[0059] When bonding any two of the protective layer, support, and display device together, various adhesives should be used. For example, curable resins that harden at room temperature, such as two-component resins, photo-curable resins, and heat-curable resins can be used. Resins such as curable resins can be used. Alternatively, a sheet-like adhesive can be used. In addition, screws that penetrate two or more of the protective layer, support, and display device, and pins that clamp Each component of the electronic device may be fixed using a clip or the like.

[0060] The electronic device of the present embodiment has a function to determine whether the highly flexible region is bent. For example, a switch, a MEMS pressure sensor or a pressure-sensitive sensor. It can be configured using the following:

[0061] The protective layer 13 may be provided in a plurality of places. 18(B) shows an example in which two protective layers 13 are provided. By folding it in this way, the display device 11 can be seen. By folding it as shown in (C), the display device 11 can be hidden. This allows the display device 11 to be protected. This allows multiple functions to be realized.

[0062] In addition, if the display device is completely fixed with a protective layer or support, when bending the electronic device, The display may be pulled and damaged. In this case, a force is applied in the direction in which the display device shrinks, and the display device may be damaged. It is preferable that the display device of the child device is not completely fixed by a protective layer or a support. This allows the display device to slide when folding or unfolding the electronic device, providing protection. The position of the display device relative to the protective layer and the support changes. This can prevent damage to the display device.

[0063] This embodiment mode can be combined with other embodiment modes as appropriate.

[0064] (Embodiment 2) In this embodiment, an electronic device of one embodiment of the present invention will be described with reference to FIGS.

[0065] The electronic device shown in Fig. 3 is an electronic device provided with a light-transmitting region 17. The transparent region is formed using a light-transmitting material.

[0066] The electronic device shown in FIG. 3 has a highly flexible region E1, a less flexible region E2, and a less flexible region E3. and a region E4 including a region E3 and a region 17 having light transmission properties. The flexible film has a region E1, which is the width of the region E2 having low flexibility and a region 17 having light transmission. The total width of the region E4 is approximately the same as the width of the less flexible region E3.

[0067] In the electronic device shown in FIG. 3, the part of the display device 11 included in the highly flexible region E1 is flexible. The electronic device shown in FIG. 3(A) can be formed in the highly flexible region E1. When folded, as shown in FIG. 3(B), the light-transmitting region 17 and the display region of the display unit are separated. Therefore, the user can see part of the display area 11a of the display unit through a transparent material. Therefore, the electronic device can be seen through the area 17 in the folded state. Even if there is a part of the display part visible through the light-transmitting region 17, it is a sub-display. It can be used as.

[0068] As shown in FIG. 3B, when the electronic device is folded, the display portion has a light-transmitting property. Therefore, the display surface is protected by a protective material. This reduces external impacts on the display surface and prevents scratches and dirt from forming.

[0069] The light-transmitting region 17 has an opening or a light-transmitting member. In the case of a configuration including a light-transmitting member, the surface of the display unit should not be exposed. In addition, the light-transmitting region 17 may have other functions. For example, it may have the functions of a touch panel, a keyboard, etc. If area 17 has a function such as a touch panel or keyboard, it can be used as a sub-display. Buttons, keyboards, etc. can also be displayed on part of the functional display.

[0070] The shape of the light-transmitting region 17 is not particularly limited. However, the shape may be a circle or a polygon. The flexible member is formed from a light-transmitting material so that the entire region with low flexibility is light-transmitting. It may be done.

[0071] The light-transmitting region 17 can be arranged in various sizes. FIG. 1 shows an example of an electronic device in which the area of ​​the light-transmitting region 17 is smaller than that in the case of FIG. 19(A), 19(B), and 19(C). Therefore, for example, the operation button 31 and the image are not provided in the area E4 including the light-transmitting area 17. A sensor 32 or the like can be placed.

[0072] Alternatively, a configuration shown in one drawing may be combined with a configuration shown in another drawing to form a new configuration. For example, an example of a combination of FIG. 1 and FIG. 3 is shown in FIG. 20 (A ), as shown in Figures 20(B) and 20(C).

[0073] This embodiment mode can be combined with other embodiment modes as appropriate.

[0074] (Embodiment 3) In this embodiment, electronic devices of one embodiment of the present invention will be described with reference to FIGS. In this embodiment mode, an electronic device provided with a plurality of highly flexible regions will be described.

[0075] By providing multiple highly flexible regions, it becomes possible to fold the film multiple times. For a display of the same size, it is better to have a display that can be folded multiple times than one that can only be folded once. The more easily adjustable it is, the more compact it becomes when folded, making it more portable. In addition, if the electronic device is the same size when folded, it will be more compact. A display that can be folded more times will have a larger display when unfolded. Since the display portion is a display portion, an electronic device with better visibility can be obtained.

[0076] 4 to 6 show an example of an electronic device having multiple highly flexible regions. An example in which four highly flexible regions E1 are provided is shown. The electronic device shown in FIG. 4(A) is As shown in FIG. 1, by bending the highly flexible region E1, the sheet is folded into a folding screen shape. At this time, as shown in FIG. 4(B), the user can see only a part of the display. In the electronic device shown in FIG. 4(A), the width of the less flexible region E2 is approximately Since the width is the same (almost equal), by folding it, it can be made almost equal to the width of E2. , it can be made approximately one-fifth the width of its unfolded state.

[0077] 5A shows an example in which three highly flexible regions E1 are provided. By bending the highly flexible region E1, the folding screen is formed as shown in FIG. As a result, in the state shown in FIG. 5(B), the transparent film has a light-transmitting property. A part of the display unit can be seen through the area 17 .

[0078] The number of highly flexible regions is not particularly limited, and may be two, or five or more.

[0079] In addition, although the examples of folding into a folding screen are shown in Figures 4 and 5, the folding method may also be changed to a folding screen. The folding method is not limited to the above. Various folding methods may be used.

[0080] The number of times of folding is also not particularly limited. In the container, it is not necessary to fold the electronic device using all of the highly flexible region E1. For example, the electronic device shown in FIG. 6A has seven highly flexible regions E1. (B) is an example of bending once in an arbitrary highly flexible region E1, and FIG. 6(C) 6(B) shows an example in which the display device 11 is folded once to hide it, and FIG. 6(C) shows an example in which the display device 11 is folded four times. Here is an example.

[0081] By providing a plurality of highly flexible regions E1 in the electronic device, any highly flexible region E In this case, the electronic device can be folded. It is possible to make the shape of the electronic device as desired. In other words, you can adjust the size and shape of the bag or pocket you want to store it in. This makes it possible to fold electronic devices to fit the shape.

[0082] By providing a plurality of highly flexible regions E1, when the electronic device is in a folded state, The size of the display exposed to the outside and the position where the display is exposed can be adjusted. Therefore, it is possible to set the sub-display to the size desired by the user. By providing a plurality of highly flexible areas E1, it is possible to set the sub-display in a desired arrangement. For example, it is possible to select a sub-display that is easier to use for right-handed and left-handed people. Although the arrangement is different, by providing multiple highly flexible areas E1, it is easy to use for right-handed people. We can also meet requests for easy placement and placement that is easy for left-handed people to use.

[0083] By providing multiple highly flexible regions E1, the bending location can be changed. This allows damage caused by bending to be dispersed, improving the reliability of electronic devices. It can be done.

[0084] 4 to 6, when the widths of the multiple low flexibility regions are approximately the same (approximately uniform), However, the widths of the less flexible regions may be different as shown in FIG. Although FIG. 6 shows an example in which no light-transmitting region is provided, a light-transmitting region may be provided. That's fine.

[0085] This embodiment mode can be combined with other embodiment modes as appropriate.

[0086] (Fourth embodiment) In this embodiment, an electronic device of one embodiment of the present invention will be described with reference to FIGS. In this embodiment, an electronic device having a wide highly flexible region will be described. By providing a wide area, it is possible to bend the flexible member at a desired position in the highly flexible region. It is possible.

[0087] FIG. 7 shows the electronic device when the width of the highly flexible region E1 is set wider than the less flexible region E2. Indicates the vessel.

[0088] FIG. 7(A) is a plan view of the electronic device in an unfolded state, and FIG. 7(B) is a plan view of the electronic device in a folded state. 7(C) shows the state where the sheet is folded multiple times, but the state where the sheet is folded multiple times is the same as that shown in FIG. 7(B). 7(D) is a plan view of the state where the number of foldings is less than that shown in FIG. 7(A), and FIG. 7(B) is a plan view of the state where the number of foldings is less than that shown in FIG. FIG.

[0089] As described above, the electronic device shown in FIG. 7 has a wide highly flexible region E1. It can be bent at any position of E1. You can freely set the number of times to fold. You can freely set the folding position and number of times to fold. By doing so, the size and position of the part of the display that can be seen by the user can be adjusted when the device is folded. You can freely set the shape and size of the folded state. This can be done.

[0090] Furthermore, by providing a wide flexible region E1, the bending location can be changed. This allows the damage caused to electronic devices by bending to be dispersed. This can improve the reliability of electronic devices.

[0091] Although an example without a light-transmitting region is shown in FIG. 7, a light-transmitting region may be provided. stomach.

[0092] This embodiment mode can be combined with other embodiment modes as appropriate.

[0093] (Embodiment 5) In this embodiment, an electronic device of one embodiment of the present invention will be described with reference to FIGS. In the first to fourth embodiments, the display unit is folded. Now, the manner in which the display unit is wound up will be described.

[0094] The electronic device described in this embodiment mode has a display portion and a winding portion. The winding section rolls up a part of the display section (first area 11c). , reel), and has the function of storage.

[0095] The electronic device shown in FIG. 8 has a housing 10, a display device 11, a winding section 16, and a fixing section 19. Furthermore, an operation button 21 may be provided. The display device 11 has a first area 11c and a second area 11d. The second area 11d has a first area 11d. A member 20 is provided at the end of the second area 11d. A member 18 may be provided at the boundary between the first region 11c and the second region 11d.

[0096] FIG. 8(A) is a perspective view of the display unit in an unfolded state, and FIG. 8(B) is a perspective view of a part of the display unit (first 8(C) is a perspective view of the second area 11d of the display unit when the first area 11c of the display unit is wound up. FIG. 10 is a side view of the state in which the cable is wrapped around the outside of the housing.

[0097] When storing the display unit, as shown in FIG. 8(B), the display unit is wound around the winding portion 16. A part of the film (first region 11c) is wound up and stored. A part of the film (second region 11) is not stored. 8(C), the cable d) is wound around the outside of the housing 10 and fixed with the fixing part 19. Even when the display unit is stored and made highly portable, the display unit located outside the housing 10 A part of the display (second area 11d) is visible to the user. It can be used.

[0098] As shown in FIG. 8, the boundary separating the first area 11c and the second area 11d of the display section is The member 18 may be provided such that the second region 11d is wound around the winding portion 16. It is not necessary to provide the member 18. In this case, there is no boundary between the first area 11c and the second area 11d, so the display has excellent visibility. This makes it possible to provide a display unit in which the sense of separation between the displays is suppressed.

[0099] 8, the fixing portion 19 is wound around the second region 11d on the outside of the housing 10. When the second region 11d is inserted, it is sufficient that the second region 11d has a function of fixing the second region 11d. The fixing length can be adjusted according to the size of the housing. For example, the electronic device shown in this embodiment may be attached to a pocket or the like. The fixing portion 19 may have a function of fixing the same to the fixing portion 19.

[0100] It is preferable to provide the member 20 at the end of the display section (the end of the second region 11d). By providing this, fixing by the fixing portion 19 can be facilitated.

[0101] As shown in this embodiment, by providing a winding portion, the display portion can be bent. This also prevents the display from being bent at an acute angle. This provides the effect of improving the reliability of the display unit.

[0102] This embodiment mode can be combined with other embodiment modes as appropriate.

[0103] (Sixth embodiment) In this embodiment, a display panel that can be used as a display portion of a display device of one embodiment of the present invention will be described. In this embodiment, a flexible display panel using an organic EL element is used as an example of the display panel. However, one embodiment of the present invention is not limited to this.

[0104] <Configuration Example 1-1> FIG. 9(A) shows a plan view of the light emitting device, and FIG. 9(B) shows a cross section of the dashed line X1-Y1 in FIG. The light-emitting device shown in FIG. 9(B) is a top-emitting device using a color-coded method. It is a light-emitting device.

[0105] The light emitting device shown in FIG. 9(A) includes a light emitting portion 491, a driving circuit portion 493, and an FPC (Flexible Printed Circuit). The light emitting unit 491 and the driving circuit unit (LED Printed Circuit) 495 are included. The organic EL element and the transistor included in 493 are mounted on the flexible substrate 420, the flexible substrate 428, and sealed by adhesive layer 407.

[0106] The light emitting device shown in FIG. 9(B) includes a flexible substrate 420, an adhesive layer 422, an insulating layer 424, a transistor, and a light emitting device. resistor 455, insulating layer 463, insulating layer 465, insulating layer 405, organic EL element 450 (lower electrode 401, EL layer 402, and upper electrode 403), adhesive layer 407, flexible substrate 428, and a conductive layer 457. The flexible substrate 428, the adhesive layer 407, and the upper electrode 403 are Transmits visible light.

[0107] In the light-emitting section 491 of the light-emitting device shown in FIG. 9(B), the adhesive layer 422 and the insulating layer 424 are A transistor 455 and an organic EL element 450 are provided on a flexible substrate 420. The organic EL element 450 includes a lower electrode 401 on an insulating layer 465 and an EL layer 404 on the lower electrode 401. 402 and an upper electrode 403 on the EL layer 402. The lower electrode 401 is a transistor The lower electrode 401 is electrically connected to the source electrode or drain electrode 455. The edge of the lower electrode 401 is covered with an insulating layer 405.

[0108] The driver circuit portion 493 includes a plurality of transistors. One of the transistors is shown.

[0109] The conductive layer 457 transmits signals (video signals, clock signals, start signals, etc.) from the outside to the driving circuit section 493. It is electrically connected to an external input terminal that transmits a signal (such as a start signal or a reset signal) or a potential. Here, an example is shown in which an FPC495 is provided as an external input terminal.

[0110] In order to prevent an increase in the number of processes, the conductive layer 457 is formed on the same substrate as the electrodes and wiring used in the light-emitting section and the driving circuit section. It is preferable to form the conductive layer 457 using the same material and in the same process. This example shows a case where the source electrode and drain electrode of the MOSFET are fabricated using the same material and process as those of the MOSFET.

[0111] The insulating layer 463 has the effect of suppressing the diffusion of impurities into the semiconductor that constitutes the transistor. The insulating layer 465 also has a planarizing function to reduce surface irregularities caused by the transistor. It is preferable to select an insulating film having such a structure.

[0112] <Configuration example 1-2> FIG. 9(A) shows a plan view of the light emitting device, and FIG. 9(C) shows a cross section of the dashed line X1-Y1 in FIG. The light emitting device shown in FIG. 9(C) is a bottom emitter using a color filter method. It is a cushion-type light-emitting device.

[0113] The light emitting device shown in FIG. 9(C) includes a flexible substrate 420, an adhesive layer 422, an insulating layer 424, a transistor, and a light emitting device. a resistor 454, a transistor 455, an insulating layer 463, a coloring layer 432, an insulating layer 465, a conductive layer 435, insulating layer 467, insulating layer 405, organic EL element 450 (lower electrode 401, EL layer 402, and top electrode 403), adhesive layer 407, flexible substrate 428, and conductive layer 457. The flexible substrate 420, the adhesive layer 422, the insulating layer 424, the insulating layer 463, and the insulating layer 465 , the insulating layer 467, and the lower electrode 401 are transparent to visible light.

[0114] In the light-emitting section 491 of the light-emitting device shown in FIG. 9(C), the adhesive layer 422 and the insulating layer 424 are On the flexible substrate 420, a switching transistor 454 and a current control transistor are formed. The organic EL element 450 is provided between the insulating layer 46 and the insulating layer 46. 7, a lower electrode 401 on the lower electrode 401, an EL layer 402 on the EL layer 402, and an upper electrode 403 on the EL layer 402. The lower electrode 401 is connected to the source of the transistor 455 via the conductive layer 435. The end of the lower electrode 401 is electrically connected to the insulating layer 40. The upper electrode 403 is preferably reflective to visible light. The display device has a colored layer 432 on an insulating layer 463 that overlaps with an organic EL element 450 .

[0115] The driver circuit portion 493 includes a plurality of transistors. Two of the transistors are shown.

[0116] The conductive layer 457 is connected to an external input terminal for transmitting signals and potentials from the outside to the driver circuit portion 493. Here, an example is shown in which an FPC495 is used as the external input terminal. In this example, the conductive layer 457 is formed using the same material and process as the conductive layer 435. Shows.

[0117] The insulating layer 463 has the effect of suppressing the diffusion of impurities into the semiconductor that constitutes the transistor. The insulating layers 465 and 467 reduce surface irregularities caused by transistors and wirings. Therefore, it is preferable to select an insulating film having a planarizing function.

[0118] <Configuration Example 1-3> FIG. 9A shows a plan view of the light emitting device, and FIG. 10A shows a cross section of the dashed line X1-Y in FIG. The light-emitting device shown in FIG. 10(A) is a top view using a color filter method. It is an emission type light emitting device.

[0119] The light emitting device shown in FIG. 10(A) includes a flexible substrate 420, an adhesive layer 422, an insulating layer 424, a transistor, and a light emitting device. Transistor 455, insulating layer 463, insulating layer 465, insulating layer 405, insulating layer 496, organic EL The element 450 (the lower electrode 401, the EL layer 402, and the upper electrode 403), the adhesive layer 407, the shielding layer 408, and the like are Optical layer 431, color layer 432, overcoat 453, insulating layer 226, adhesive layer 426, flexible The flexible substrate 428, the adhesive layer 426, the insulating layer 2, and the conductive layer 457 are connected to each other. 26, adhesive layer 407, and top electrode 403 are transparent to visible light.

[0120] In the light-emitting section 491 of the light-emitting device shown in FIG. 10(A), the adhesive layer 422 and the insulating layer 424 are interposed therebetween. A transistor 455 and an organic EL element 450 are provided on a flexible substrate 420 . The organic EL element 450 includes a lower electrode 401 on an insulating layer 465 and an EL layer 402 on the lower electrode 401. The lower electrode 401 is a transistor. The end of the lower electrode 401 is electrically connected to the source electrode or the drain electrode of the lower electrode 455. The insulating layer 405 is covered with an insulating layer 496. By providing 96, the distance between the flexible substrate 420 and the flexible substrate 428 can be adjusted. The lower electrode 401 preferably reflects visible light. The organic EL element 450 has a colored layer 432 that overlaps the organic EL element 450 via an adhesive layer 407. It has a light blocking layer 431 that overlaps the layer 405 .

[0121] The driver circuit portion 493 includes a plurality of transistors. 1 shows one of the transistors included in the semiconductor memory device.

[0122] The conductive layer 457 is connected to an external input terminal for transmitting signals and potentials from the outside to the driver circuit portion 493. Here, an example is shown in which an FPC495 is used as the external input terminal. Here, the conductive layer 457 serves as a source electrode and a drain electrode of the transistor 455. This shows an example of fabrication using the same material and the same process. 226, the overcoat 453, the adhesive layer 407, the insulating layer 465, and the insulating layer 463. The connector 497 is connected to the conductive layer 457 through the opening. The FPC 495 and the conductive layer 457 are electrically connected via the connector 497.

[0123] <Configuration Example 1-4> FIG. 11A shows a plan view of the light emitting device, and the area between the dashed dotted lines G1 and G2 in FIG. A cross-sectional view is shown in FIG. 11(B). As a modification, a cross-sectional view of a light-emitting device is shown in FIG. 10(B). show.

[0124] The light emitting device shown in FIG. 10(B) and FIG. 11(B) includes an element layer 1301, an adhesive layer 1305, a flexible substrate 1306, and a flexible substrate 1308. The element layer 1301 includes a flexible substrate 1401, an adhesive layer 1403, an insulating layer 1404, and a Edge layer 1405, multiple transistors, conductive layer 1357, insulating layer 1407, insulating layer 1409 , a plurality of light-emitting elements, an insulating layer 1411, an adhesive layer 1413, an overcoat 1461, and a light-shielding layer 1457 and an insulating layer 1455.

[0125] FIG. 11B shows an example in which a colored layer 1459 is provided so as to overlap with each light-emitting element. A colored layer 1459 is provided at a position overlapping the element 1430, and a colored layer 1459 is provided at a position overlapping the insulating layer 1411. A light-shielding layer 1457 is provided on the colored layer 1459. The colored layer 1459 and the light-shielding layer 1457 are overcoated. The light emitting element 1430 is covered with an overcoat 1461. An adhesive layer 1 is provided between the light emitting element 1430 and the overcoat 1461. It should be noted that a colored layer may be provided over all the light emitting elements. Alternatively, as shown in FIG. 10(B), a colored layer may be provided so as to overlap a part of the light emitting elements. For example, if one pixel is made up of four sub-pixels, red, blue, green, and white, the white In the color sub-pixels, the color layer does not need to be provided. This reduces the amount of light absorption by the color layer. Since the difference in the power consumption of the light emitting device is reduced, the power consumption of the light emitting device can be reduced. It is also possible to fabricate a light-emitting element that emits a different color for each sub-pixel. In this case, the colored layer does not need to be provided.

[0126] The conductive layer 1357 is electrically connected to the FPC 1308 via the connector 1415. As shown in (B), a conductive layer 1357 is provided between the flexible substrate 1401 and the flexible substrate 1303. If provided, the connector 14 is inserted into an opening provided in the flexible substrate 1303, adhesive layer 1305, etc. As shown in FIG. 10(B), the flexible substrate 1303 and the conductive layer 135 When the insulating layer 1407 and the insulating layer 1409 on the flexible substrate 1401 do not overlap, Connector 1415 can be placed in the opening of the beam.

[0127] The light-emitting element 1430 includes a lower electrode 1431, an EL layer 1433, and an upper electrode 1435. The lower electrode 1431 is electrically connected to the source electrode or the drain electrode of the transistor 1440. The end of the lower electrode 1431 is covered with an insulating layer 1411. The upper electrode 1435 is transparent, and the EL layer 143 It transmits the light emitted by 3.

[0128] The light emitting device has a plurality of transistors in the light extraction section 1304 and the drive circuit section 1306. The transistor 1440 is provided over the insulating layer 1405. The flexible substrate 1401 is bonded by an adhesive layer 1403. The insulating layer 145 5 and the flexible substrate 1303 are bonded together by an adhesive layer 1305. When an insulating film with a high gas barrier property is used for the insulating layer 1455, the light emitting element 1430 and the transistor This prevents impurities such as moisture and oxygen from entering the sintered body 1440, improving the reliability of the light-emitting device. This is preferable because it reduces the

[0129] In the configuration example 1-4, the insulating layer 1405, the transistor 1440, and the The light emitting element 1430 is fabricated, the fabrication substrate is peeled off, and the flexible substrate 1 is attached using the adhesive layer 1403. By transferring the insulating layer 1405, the transistor 1440, and the light-emitting element 1430 onto the In addition, in the configuration example 1-4, a light-emitting device can be fabricated on a highly heat-resistant fabrication substrate. The insulating layer 1455, the colored layer 1459 and the light-shielding layer 1457 are formed, and the formed substrate is peeled off and bonded. An insulating layer 1455, a coloring layer 1459 and a light-shielding layer are formed on the flexible substrate 1303 using the adhesive layer 1305. A light-emitting device that can be fabricated by transposing layer 1457 is shown.

[0130] When using a material with high moisture permeability and low heat resistance (such as resin) for the substrate, Since it is not possible to apply heat, there are limitations on the conditions for fabricating transistors and insulating films on the substrate. In a method for manufacturing a light-emitting device according to one embodiment of the present invention, a transistor is formed on a formation substrate having high heat resistance. This allows the fabrication of highly reliable transistors and insulating materials with sufficient gas barrier properties. Then, by transferring them to a flexible substrate, highly reliable Thus, in one embodiment of the present invention, a light-emitting device that is lightweight or thin and A highly reliable light-emitting device can be realized. The manufacturing method will be described in detail later.

[0131] The flexible substrate 1303 and the flexible substrate 1401 are each made of a highly tough material. This makes it possible to realize a display device that is highly impact resistant and less susceptible to breakage. For example, the flexible substrate 1303 is an organic resin substrate, and the flexible substrate 1401 is a thin metal substrate. By using a substrate made of copper or alloy material, it is possible to reduce the weight compared to when a glass substrate is used. This makes it possible to realize a light emitting device that is less susceptible to damage.

[0132] Metallic and alloy materials have high thermal conductivity and can easily conduct heat across the entire substrate, making them ideal for light-emitting devices. This is preferable because it can suppress a local temperature rise in the substrate. The thickness is preferably 10 μm or more and 200 μm or less, and more preferably 20 μm or more and 50 μm or less. is more preferable.

[0133] Furthermore, if a material with high thermal emissivity is used for the flexible substrate 1401, the surface temperature of the light emitting device will be high. This can prevent the light emitting device from being damaged or the reliability from being reduced. 1401 is a metal substrate and a layer with high thermal emissivity (for example, a metal oxide or ceramic material) The laminated structure may be a laminated structure of the above materials.

[0134] <Example of materials> Next, materials that can be used for the light-emitting device will be described. The explanation of the configuration will be omitted.

[0135] The element layer 1301 has at least a light-emitting element. The category includes elements whose brightness is controlled by current or voltage. For example, light-emitting diodes (LEDs), organic EL elements, inorganic EL elements, etc. can be done.

[0136] The element layer 1301 further includes transistors for driving light-emitting elements, touch sensors, etc. It may have.

[0137] The structure of the transistor included in the light-emitting device is not particularly limited. The transistor may be a top gate type or an inverted stagger type. The semiconductor used in the transistor may have any of the following transistor structures: The material of the substrate is not particularly limited, and for example, silicon, germanium, oxide semiconductor, etc. may be used. good.

[0138] The state of the semiconductor material used in the transistor is not particularly limited, and may be an amorphous semiconductor, a crystalline semiconductor, or the like. Semiconductors having a crystalline structure (microcrystalline semiconductors, polycrystalline semiconductors, single-crystal semiconductors, or semiconductors having a crystalline structure in part) In particular, when a semiconductor having crystallinity is used, the This is preferable because it can suppress deterioration of the resistor characteristics.

[0139] Here, it is preferable to use a polycrystalline semiconductor for the transistor. For example, polycrystalline silicon It is preferable to use polycrystalline silicon, etc. Polycrystalline silicon is formed at a lower temperature than single-crystal silicon. It has high field effect mobility and high reliability compared to amorphous silicon. By applying such a polycrystalline semiconductor to a pixel, the aperture ratio of the pixel can be improved. Even when the pixels are extremely fine, the gate drive circuit and the source drive circuit It is possible to form the display on the same substrate as the pixels, reducing the number of components that make up electronic devices. This can be done.

[0140] Alternatively, it is preferable to use an oxide semiconductor for the transistor. It is preferable to use an oxide semiconductor with a larger band gap than silicon. By using semiconductor materials with a wide band gap and low carrier density, This is preferable because it can reduce the current in the OFF state.

[0141] For example, the oxide semiconductor contains at least indium (In) or zinc (Zn). More preferably, an In-M-Zn oxide (wherein M is Al, Ti, Ga, The oxides of metals such as Ge, Y, Zr, Sn, La, Ce or Hf are included.

[0142] For example, oxide semiconductors include indium oxide, tin oxide, zinc oxide, and In-Zn oxide. substances, Sn-Zn oxides, Al-Zn oxides, Zn-Mg oxides, Sn-Mg oxides In-Mg oxides, In-Ga oxides, In-Ga-Zn oxides (IGZO and (also written as In-Al-Zn oxide, In-Sn-Zn oxide, Sn-Ga-Z n-based oxides, Al-Ga-Zn-based oxides, Sn-Al-Zn-based oxides, In-Hf-Zn In-Zr-Zn oxide, In-Ti-Zn oxide, In-Sc-Zn oxide Oxide, In-Y-Zn oxide, In-La-Zn oxide, In-Ce-Zn oxide In-Pr-Zn oxides, In-Nd-Zn oxides, In-Sm-Zn oxides , In-Eu-Zn oxide, In-Gd-Zn oxide, In-Tb-Zn oxide, In-Dy-Zn oxide, In-Ho-Zn oxide, In-Er-Zn oxide, I n-Tm-Zn oxide, In-Yb-Zn oxide, In-Lu-Zn ​​oxide, In -Sn-Ga-Zn oxide, In-Hf-Ga-Zn oxide, In-Al-Ga-Z n-based oxides, In-Sn-Al-Zn-based oxides, In-Sn-Hf-Zn-based oxides, In -Hf-Al-Zn oxides can be used.

[0143] Here, the In-Ga-Zn oxide is an oxide having In, Ga, and Zn as its main components. The ratio of In, Ga, and Zn is not important. Metal elements may also be included.

[0144] Oxide semiconductor films are classified into single-crystal oxide semiconductor films and other non-single-crystal oxide semiconductor films. The non-single-crystal oxide semiconductor film is called CAAC-OS (C Axis Alignment d Crystalline Oxide Semiconductor) membrane, polycrystalline acid These include oxide semiconductor films, microcrystalline oxide semiconductor films, and amorphous oxide semiconductor films. The C-OS film is one of oxide semiconductor films having a plurality of crystal parts aligned along the c-axis. CAAC-OS membrane is CANC(C-Axis Alingned nanocrysta) The oxide semiconductor film may also be referred to as an oxide semiconductor film having a conductivity type (is).

[0145] In particular, the semiconductor layer has a plurality of crystal portions, and the c-axes of the crystal portions are aligned with the surface on which the semiconductor layer is formed, Or, oxides oriented perpendicular to the upper surface of the semiconductor layer and having no grain boundaries between adjacent crystal portions. It is preferable to use an oxide semiconductor film. When a flexible device formed by applying one embodiment of the present invention is bent, stress is applied to the device. Therefore, the occurrence of cracks in the oxide semiconductor film is suppressed. Such oxide semiconductors can be suitably used in devices such as display devices that are used in a curved state. can be done.

[0146] Furthermore, by using such materials for the semiconductor layer, fluctuations in electrical characteristics are suppressed, resulting in high reliability. This makes it possible to realize a highly efficient transistor.

[0147] In addition, due to its low off-state current, the charge stored in the capacitor can be released over a long period of time via the transistor. By applying such a transistor to the pixel, It is also possible to stop the driving circuit while maintaining the brightness of the image displayed in the display area. As a result, electronic devices with extremely reduced power consumption can be realized.

[0148] The light-emitting element of the light-emitting device has a pair of electrodes (a lower electrode 1431 and an upper electrode 1435) and The light emitting device has an EL layer 1433 provided between the pair of electrodes. One of the pair of electrodes is an anode. one acts as a cathode and the other acts as a cathode.

[0149] The light-emitting element is available in top emission structure, bottom emission structure, and dual emission structure. The electrode on the light extraction side uses a conductive film that transmits visible light. In addition, it is preferable to use a conductive film that reflects visible light for the electrode on the side from which light is not extracted. I wish.

[0150] The conductive film that transmits visible light is made of, for example, indium oxide or indium tin oxide (ITO). Indium Tin Oxide, Indium Zinc Oxide, Zinc Oxide, Gallium Doped It can be formed using zinc oxide, etc. Also, gold, silver, platinum, magnesium, Nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, or is a metal material such as titanium, an alloy containing these metal materials, or a nitride of these metal materials (e.g. For example, titanium nitride or the like can also be used by forming it thin enough to have light-transmitting properties. A laminated film of the above materials can also be used as the conductive layer. For example, a laminated film of silver and magnesium It is preferable to use a laminated film of an alloy of ITO and the like, as this can increase the conductivity. Graphene or the like may also be used.

[0151] The conductive film that reflects visible light is made of, for example, aluminum, gold, platinum, silver, nickel, or tungsten. Metallic materials such as zinc, chromium, molybdenum, iron, cobalt, copper, or palladium, or Alloys containing these metal materials can be used. In addition, aluminum and titanium may be added. Aluminum alloys such as aluminum alloys, aluminum-nickel alloys, and aluminum-neodymium alloys Alloys containing palladium (aluminum alloys), silver and copper alloys, silver, palladium and copper alloys, silver The electrode can be formed using an alloy containing silver, such as an alloy of silver and magnesium. Gold is preferred because of its high heat resistance. By laminating an oxide film, oxidation of the aluminum alloy film can be suppressed. Examples of materials for the film and metal oxide film include titanium and titanium oxide. A conductive film that transmits visible light and a film made of a metal material may be laminated. For example, a film made of silver and ITO may be laminated. A laminated film, a laminated film of an alloy of silver and magnesium and ITO, etc. can be used.

[0152] The electrodes may be formed by vapor deposition or sputtering. Formed using a discharge method such as the ink jet method, a printing method such as the screen printing method, or a plating method It is possible.

[0153] When a voltage higher than the threshold voltage of the light-emitting element is applied between the lower electrode and the upper electrode, Holes are injected from the anode side and electrons are injected from the cathode side. The injected electrons and holes are The electrons recombine in the layer, causing the light-emitting material contained in the EL layer to emit light.

[0154] The EL layer has at least a light-emitting layer. The EL layer has a layer other than the light-emitting layer that has a high hole injection property. materials with high hole transporting properties, hole blocking materials, materials with high electron transporting properties, and electron injecting properties or bipolar substances (substances with high electron transport and hole transport properties), etc. It may have further layers.

[0155] The EL layer can be made of either a low molecular weight compound or a high molecular weight compound. The layers constituting the EL layer 1433 may each be formed by evaporation (vacuum evaporation). The layer can be formed by a method such as a transfer method, a printing method, an ink jet method, or a coating method.

[0156] The light emitting element is preferably provided between a pair of insulating films having high gas barrier properties. This makes it possible to prevent impurities such as water from entering the light emitting element, and to prevent a decrease in the reliability of the light emitting device. can be suppressed.

[0157] Insulating films with high gas barrier properties include films containing nitrogen and silicon, such as silicon nitride films and silicon nitride oxide films. Examples of the film include a film containing nitrogen and aluminum, and a film containing nitrogen and aluminum, such as an aluminum nitride film. Alternatively, a silicon oxide film, a silicon oxynitride film, an aluminum oxide film, or the like may be used.

[0158] For example, the water vapor permeability of an insulating film with high gas barrier properties is 1×10 -5 [g / m 2 ·day ] or less, preferably 1 × 10 -6 [g / m 2 ·day] or less, preferably 1×10 - 7 [g / m 2 ·day] or less, more preferably 1 × 10 -8 [g / m 2 ·day] or less Let's say.

[0159] The flexible substrate is made of a flexible material, such as an organic resin or a flexible material. Furthermore, the substrate on the side from which light is extracted in the light-emitting device can be used. The plate is made of a material that transmits visible light. If the flexible substrate does not need to transmit visible light, Alternatively, a metal substrate or the like can be used.

[0160] Since organic resin has a smaller specific gravity than glass, if organic resin is used as a flexible substrate, This is preferable because it allows the light-emitting device to be made lighter than when glass is used.

[0161] Examples of materials that are flexible and transparent include polyethylene terephthalate (PET). ), polyester resins such as polyethylene naphthalate (PEN), polyacrylonitrile Resin, polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin , polyethersulfone (PES) resin, polyamide resin, cycloolefin resin, poly Examples include styrene resin, polyamide-imide resin, and polyvinyl chloride resin. It is preferable to use a material with a low modulus of elasticity, for example, polyamide-imide resin, polyimide resin, etc. The substrate may be a fibrous body impregnated with resin (prepared with polyethylene terephthalate (PET)). The use of substrates with a reduced thermal expansion coefficient by mixing inorganic fillers into organic resins is also It can also be done as follows.

[0162] When a fibrous body is contained in a flexible and light-transmitting material, the fibrous body is made of an organic compound or High-strength fibers made of inorganic compounds are used. Specifically, high-strength fibers have a tensile modulus or Young's modulus of Typical examples are polyvinyl alcohol fibers and polyester fibers. Fibers, polyamide fibers, polyethylene fibers, aramid fibers, polyparaphenylene Examples of the fiber include benzobisoxazole fiber, glass fiber, and carbon fiber. Examples of the glass fiber include E glass, S glass, D glass, Q glass, etc. These are used in the form of woven or nonwoven fabric, and the fiber body is impregnated with resin and the resin is hardened. A structure made of a fiber and a resin may be used as the flexible substrate. is preferably used because it improves reliability against breakage due to bending or local pressure.

[0163] In order to improve the light extraction efficiency, it is preferable that the refractive index of the flexible and light-transmitting material is high. For example, by dispersing an inorganic filler having a high refractive index in an organic resin, the organic resin This allows the realization of a substrate with a higher refractive index than a substrate made solely of SiO2. The use of such an inorganic filler is preferable because it does not impair optical transparency.

[0164] The thickness of the metal substrate is preferably 10 μm or more and 200 μm or less in order to obtain flexibility and bendability. The thickness is preferably 20 μm or more and 50 μm or less. The heat generated by the light emitting element when it emits light can be effectively dissipated.

[0165] The material for forming the metal substrate is not particularly limited, but examples thereof include aluminum, copper, and nickel. It is preferable to use a metal alloy such as aluminum alloy or stainless steel. This can be done.

[0166] As for the flexible substrate, a layer using the above material is used as a hard cover to protect the surface of the device from scratches. A layer of a material that can disperse pressure (e.g., a layer of silicon nitride) or a layer of a material that can disperse pressure (e.g., a layer of aramid) The functional element (particularly the functional element itself) may be laminated with a layer of a resin layer or the like. In order to prevent the deterioration of the lifespan of the organic EL element, etc., the insulating film with low water permeability described below is provided. It's fine.

[0167] The flexible substrate may be formed by stacking a plurality of layers. This improves the barrier properties against water and oxygen, making it possible to provide a highly reliable light-emitting device. do.

[0168] For example, a flexible substrate in which a glass layer, an adhesive layer, and an organic resin layer are laminated from the side closest to the organic EL element is used. The thickness of the glass layer is 20 μm or more and 200 μm or less. The thickness is preferably 25 μm or more and 100 μm or less. A glass layer having such a thickness is resistant to water and oxygen. The thickness of the organic resin layer can be set as follows: The thickness is set to 10 μm or more and 200 μm or less, preferably 20 μm or more and 50 μm or less. By placing the organic resin layer on the outside of the glass layer, breakage and cracks in the glass layer are suppressed. The composite material of such glass material and organic resin can improve the mechanical strength. By applying this to the substrate, it is possible to create a highly reliable and flexible light-emitting device. can.

[0169] The adhesive layer can be made of a variety of adhesives, including UV-curable and other light-curable adhesives, reactive-curable adhesives, heat-curable adhesives, and adhesives containing Various curing adhesives such as epoxy adhesives can be used. Resin, acrylic resin, silicone resin, phenolic resin, polyimide resin, imide resin , PVC (Polyvinyl chloride) resin, PVB (Polyvinyl butyral) resin, EVA ( Ethylene vinyl acetate resins are examples. In particular, epoxy resins have low moisture permeability. A two-component resin may also be used. Good too.

[0170] The resin may also contain a desiccant. For example, an alkaline earth metal oxide (oxide Use a substance that absorbs water by chemical adsorption, such as calcium or barium oxide. Alternatively, materials such as zeolite and silica gel can absorb moisture by physical adsorption. If a desiccant is included, impurities such as moisture may penetrate into the functional elements. This is preferable because it can suppress the penetration of foreign matter, thereby improving the reliability of the light emitting device.

[0171] Furthermore, by mixing a filler with a high refractive index or a light scattering material into the resin, it is possible to For example, titanium oxide, barium oxide, and zeolite can improve the light extraction efficiency. For example, oolites, zirconium, etc. can be used.

[0172] The insulating layer 424, the insulating layer 226, the insulating layer 1405, and the insulating layer 1455 are made of an inorganic insulating material. In particular, when the insulating film with high gas barrier properties described above is used, highly reliable generation can be achieved. In addition, a high gas barrier property is preferably formed between the adhesive layer and the upper electrode. An insulating film may be formed.

[0173] The insulating layer 463 and the insulating layer 1407 prevent impurities from diffusing into the semiconductor that constitutes the transistor. The insulating layer 463 and the insulating layer 1407 may be formed of a silicon oxide film, a nitride oxide film, or the like. For example, an inorganic insulating film such as a silicon oxide film or an aluminum oxide film can be used.

[0174] The insulating layer 465, the insulating layer 467, and the insulating layer 1409 are each formed of a material such as a transistor-derived material. It is preferable to select an insulating film having a planarizing function in order to reduce the surface irregularities. For example, organic materials such as polyimide, acrylic, and benzocyclobutene resins can be used. In addition to the above organic materials, low-dielectric-constant materials (low-k materials) can also be used. It is also possible to laminate a plurality of insulating films or inorganic insulating films made of these materials.

[0175] The insulating layer 405 and the insulating layer 1411 are provided to cover the end portions of the lower electrode. 5. The insulating layer 496 and the insulating layer 1411 are made of resin or inorganic insulating material. Examples of resins include polyimide resin, polyamide resin, acrylic resin, and silicone resin. The insulating material may be a fluororesin, an epoxy resin, a phenolic resin, or the like. The layer 405, the insulating layer 496, and the insulating layer 1411 are easily fabricated using a negative photosensitive resin. Alternatively, it is preferable to use a positive photosensitive resin.

[0176] The method for forming the insulating layer 405, the insulating layer 496, and the insulating layer 1411 is not particularly limited. Trisography, sputtering, vapor deposition, droplet ejection (inkjet method, etc.), printing method ( Screen printing, offset printing, etc.) may be used.

[0177] The conductive layers of the transistor electrodes and wiring are made of molybdenum, titanium, chromium, and titanium, respectively. Metallic materials such as aluminum, tungsten, aluminum, copper, neodymium, scandium, etc. The layer can be formed by using an alloy material containing these elements in a single layer or a multilayer structure. Each of the conductive layers may be formed using a conductive metal oxide. The materials include indium oxide (In2O3, etc.), tin oxide (SnO2, etc.), zinc oxide (Zn O), ITO, indium zinc oxide (In2O3-ZnO, etc.) or these metal oxides A material containing silicon oxide can be used.

[0178] The connector is a paste or sheet material made by mixing metal particles with thermosetting resin. It is possible to use a material that exhibits anisotropic conductivity by thermocompression bonding. For example, nickel particles coated with gold are used, which are layers of two or more metals. It is preferred to use particles.

[0179] The colored layer is a colored layer that transmits light in a specific wavelength band. For example, A red (R) color filter transmits light in the green wavelength band, and a green (G) color filter transmits light in the green wavelength band. Use a blue (B) color filter that transmits light in the blue wavelength band. Each color layer can be made using various materials by printing, inkjet printing, photolithography, etc. The electrodes are formed at desired positions by etching using a roughing method or the like.

[0180] The light-shielding layer is provided between adjacent colored layers. The colored layer is formed on the edge of the organic EL element. By providing the light-shielding layer so as to overlap the light-shielding layer, it is possible to suppress light leakage. For example, a material that blocks light emitted from the organic EL element can be used. The black matrix may be formed using a resin material containing a pigment or a dye. If the light emitting element is provided in an area other than the light emitting element, such as the drive circuit, unintended light leakage due to guided light may occur. This is preferable because it can suppress the above.

[0181] An overcoat may be provided to cover the colored layer and the light-shielding layer. This makes it possible to prevent impurities contained in the colored layer from diffusing into the organic EL element. The overcoat is made of a material that transmits light emitted from the organic EL element, such as silicon nitride. Inorganic insulating films such as silicon film and silicon oxide film, and organic insulating films such as acrylic film and polyimide film It may be a laminated structure of an organic insulating film and an inorganic insulating film.

[0182] In addition, when the material for the adhesive layer is applied onto the colored layer and the light-shielding layer, the material for the overcoat is It is preferable to use a material that has high wettability with respect to the material of the adhesive layer. As the substrate 453 (FIG. 10(A)), an oxide conductive film such as an ITO film or a film having a degree of transparency is used. It is preferable to use a very thin metal film such as an Ag film.

[0183] <Example of manufacturing method> Next, a method for manufacturing a light-emitting device will be illustrated with reference to FIGS. 12 and 13. The light emitting device having the configuration of No. 4 (FIG. 11(B)) will be described as an example.

[0184] First, a separation layer 1503 is formed on a fabrication substrate 1501, and an insulating layer 140 is formed on the separation layer 1503. Next, a plurality of transistors, a conductive layer 1357, an insulating layer 1405, and a 1407, an insulating layer 1409, a plurality of light-emitting elements, and an insulating layer 1411 are formed. The insulating layer 1409 and the insulating layer 1407 are opened so that the conductive layer 1357 is exposed (FIG. 1). 2(A)).

[0185] In addition, a peeling layer 1507 is formed on the formation substrate 1505, and an insulating layer 145 is formed on the peeling layer 1507. Next, a light-shielding layer 1457, a colored layer 1459, and an overcoat 1458 are formed on the insulating layer 1455. A coating 1461 is formed (FIG. 12(B)).

[0186] The substrates 1501 and 1505 are made of glass, quartz, and silicon, respectively. Substrates such as a ceramic substrate, a metal substrate, etc. can be used.

[0187] The glass substrate may be, for example, aluminosilicate glass or aluminoborosilicate glass. Glass materials such as glass and barium borosilicate glass can be used. If the temperature is high, it is advisable to use glass with a strain point of 730°C or higher. A sachet or the like can be used.

[0188] When a glass substrate is used as the substrate for preparation, a silicon oxide film, When an insulating film such as a silicon oxynitride film, a silicon nitride film, or a silicon nitride oxide film is formed, This is preferable because it can prevent contamination from the glass substrate.

[0189] The peeling layers 1503 and 1507 are made of tungsten, molybdenum, and titanium, respectively. Tantalum, Niobium, Nickel, Cobalt, Zirconium, Zinc, Ruthenium, an element selected from the group consisting of sulphur, palladium, osmium, iridium and silicon, It is made of an alloy material containing the element or a compound material containing the element, and is a single layer or a laminated layer. The crystal structure of the layer containing silicon may be amorphous, microcrystalline, or polycrystalline.

[0190] The release layer can be formed by a sputtering method, a plasma CVD method, a coating method, a printing method, or the like. The coating method includes a spin coating method, a droplet discharging method, and a dispensing method.

[0191] When the release layer has a single layer structure, it is made up of a tungsten layer, a molybdenum layer, or a combination of tungsten and molybdenum. It is preferable to form a layer containing a mixture of tungsten oxide or oxide. a layer containing an oxynitride, a layer containing an oxide or oxynitride of molybdenum, or a layer containing tungsten Alternatively, a layer containing an oxide or oxynitride of a mixture of tantalum and molybdenum may be formed. The mixture of tungsten and molybdenum corresponds to, for example, an alloy of tungsten and molybdenum. do.

[0192] In addition, a layer including a tungsten layer and a layer including a tungsten oxide layer may be used as the peeling layer. When forming the insulating film, a layer containing tungsten is formed, and an insulating film made of oxide is formed on the layer containing tungsten. By forming the insulating film, a layer containing tungsten oxide is formed at the interface between the tungsten layer and the insulating film. The surface of the tungsten-containing layer may be subjected to a thermal oxidation treatment. , oxygen plasma treatment, nitrous oxide (N2O) plasma treatment, ozone water, and other highly oxidizing solvents A layer containing tungsten oxide may be formed by treating with a liquid or the like. The treatment and heating process may be carried out using oxygen, nitrogen, or nitrous oxide, either alone or in combination with other gases. The plasma treatment or heat treatment may be performed under a gas atmosphere. By changing the temperature, it is possible to control the adhesion between the release layer and the insulating film to be formed later. do.

[0193] Each insulating layer is formed using a method such as sputtering, plasma CVD, coating, or printing. For example, the film formation temperature can be increased to 250°C or higher, up to 400°C, using the plasma CVD method. By forming the film as described below, it is possible to obtain a dense film with extremely high gas barrier properties.

[0194] Thereafter, the surface of the production substrate 1505 on which the colored layer 1459 and the like are provided or the surface of the production substrate 1501 on which the colored layer 1459 and the like are provided is A material for the adhesive layer 1413 is applied to the surface on which the optical element 1430 and the like are provided. The surfaces are then bonded together via a metal plate (FIG. 12(C)).

[0195] Then, the manufacturing substrate 1501 is peeled off, and the exposed insulating layer 1405 and the flexible substrate 1401 are The substrate is attached using an adhesive layer 1403. The substrate 1505 is peeled off, and the exposed insulating film is The layer 1455 and the flexible substrate 1303 are bonded together using an adhesive layer 1305. ) the flexible substrate 1303 does not overlap with the conductive layer 1357. 7 and the flexible substrate 1303 may overlap.

[0196] Note that in one embodiment of the present invention, various separation methods can be applied to the formation substrate. When a layer containing a metal oxide film is formed on the side in contact with the layer to be peeled as a peeling layer, the metal oxide The film is weakened by crystallization, and the layer to be peeled off can be peeled off from the substrate. An amorphous silicon film containing hydrogen was formed as a peeling layer between the highly thermally sensitive substrate and the peeled layer. In this case, the amorphous silicon film is removed by irradiation with laser light or etching. The layer can be peeled off from the substrate. A layer containing a metal oxide film is formed, the metal oxide film is weakened by crystallization, and one of the peeling layers is further formed. After removing the part by etching using a solution or fluoride gas such as NF3, BrF3, or ClF3, The weakened metal oxide film can be peeled off. , a film containing oxygen or hydrogen (for example, an amorphous silicon film containing hydrogen, a hydrogen-containing alloy film, an oxygen-containing The peeling layer is irradiated with laser light to remove nitrogen, oxygen, and hydrogen contained in the peeling layer. Alternatively, a method may be used in which the layer to be peeled is released as a gas to promote peeling between the layer to be peeled and the substrate. The substrate on which the peeling layer is formed is mechanically removed or decomposed by a solution such as NF3, BrF3, or ClF3. The peeling layer can be removed by etching with a fluoride gas. It is not necessary to set

[0197] Furthermore, by combining a plurality of the above peeling methods, the peeling step can be carried out more easily. That is, irradiation of laser light, etching of the peeling layer with gas or solution, or using a sharp knife or knife Mechanical removal is performed using a tool such as a brush to make the peeling layer and the peeled layer easier to peel off, and then Peeling can also be achieved by physical force (mechanically, etc.).

[0198] In addition, the layer to be peeled can be peeled off from the substrate by infiltrating a liquid into the interface between the peeling layer and the layer to be peeled. It is also possible to apply liquid during the peeling process. The functional elements contained in the peeled layer may be adversely affected (e.g., the semiconductor elements may be destroyed by static electricity). The liquid may be sprayed in the form of mist or vapor. Pure water or organic solvents can be used for the solution, and neutral, alkaline, or acidic aqueous solutions can be used. Alternatively, a liquid or an aqueous solution containing dissolved salt may be used.

[0199] Another peeling method is to use ammonia water and peroxide when the peeling layer is made of tungsten. The peeling layer may be etched with a mixed solution of hydrogen chloride and water to perform the peeling.

[0200] Note that if separation can be achieved at the interface between the formation substrate and the layer to be peeled, a peeling layer does not have to be provided. For example, glass is used as the substrate, and polyimide, polyester, or polyimide is placed in contact with the glass. Form an organic resin such as olefin, polyamide, polycarbonate, or acrylic. In addition, laser irradiation or heat treatment is performed to improve the adhesion between the formation substrate and the organic resin. Then, insulating films and transistors are formed on the organic resin. Laser irradiation with high energy density or heat treatment at a higher temperature than the previous heat treatment By carrying out the above steps, it is possible to separate the organic resin from the substrate at the interface. Alternatively, separation may be achieved by allowing a liquid to penetrate into the interface between the substrate and the organic resin.

[0201] In this method, insulating films and transistors are formed on organic resins with low heat resistance. The substrate cannot be exposed to high temperatures during the manufacturing process. Since a high-temperature manufacturing process is not required, the film can be suitably formed on an organic resin.

[0202] The organic resin may be used as a substrate for forming a light-emitting device, or the organic resin may be removed. Alternatively, another substrate may be attached to the exposed surface of the peeled layer using an adhesive.

[0203] Alternatively, a metal layer is provided between the substrate and the organic resin, and a current is passed through the metal layer. The metal layer may be heated to separate the organic resin at the interface between the metal layer and the organic resin.

[0204] Finally, the insulating layer 1455 and the adhesive layer 1413 are opened to expose the conductive layer 1357. (FIG. 13B) In the case where the flexible substrate 1303 overlaps with the conductive layer 1357, The flexible substrate 1303 and the adhesive layer 1305 are also opened (FIG. 13(C)). There is no particular limitation, and examples thereof include laser ablation, etching, and ion beam sputtering. Alternatively, the film on the conductive layer 1357 may be cut using a sharp blade or the like. Alternatively, a part of the film may be peeled off by applying a physical force.

[0205] In this manner, a light-emitting device can be manufactured.

[0206] In this specification and the like, an active element (active element, non-linear element) in a pixel is referred to as an active element. The active matrix method or the passive matrix method that does not have active elements in the pixels is used. It is possible.

[0207] In the active matrix system, various active elements, not just transistors, are used. Active elements can be used. For example, MIM (Metal Insulator Metal etal) or TFD (Thin Film Diode) can also be used. These elements have fewer manufacturing steps, which reduces manufacturing costs and improves yields. In addition, these elements have a small size, which improves the aperture ratio. This allows for lower power consumption and higher brightness.

[0208] The passive matrix method does not use active elements, so there are fewer manufacturing processes and manufacturing costs are lower. In addition, since no active elements are used, the aperture ratio can be reduced. This can improve the light emission efficiency, thereby enabling lower power consumption or higher brightness.

[0209] This embodiment mode can be combined with other embodiment modes as appropriate.

[0210] (Embodiment 7) In this embodiment, the configuration of a bendable touch panel will be described with reference to FIGS. 14 to 17. The materials of each layer can be referred to in the sixth embodiment. In this embodiment, a touch panel using an organic EL element is exemplified, but the present invention is not limited to this. In one aspect of the present invention, for example, a touch panel using another element exemplified in the sixth embodiment is provided. It is possible to create a

[0211] <Configuration Example 2-1> 14(A) is a top view of the touch panel. 14(C) is a cross-sectional view taken along the dashed line E in FIG. -F cross-sectional view.

[0212] As shown in FIG. 14A, the touch panel 390 includes a display unit 301 .

[0213] The display unit 301 includes a plurality of pixels 302 and a plurality of imaging pixels 308. The imaging pixels 308 are It is possible to detect a finger or the like touching the display unit 301. A touch sensor can be configured using the above.

[0214] The pixel 302 includes a plurality of sub-pixels (e.g., sub-pixel 302R), each of which includes a light-emitting element and a light-emitting element. The pixel circuit is capable of supplying power to drive the photoelement.

[0215] The pixel circuit includes wiring that can supply a selection signal and wiring that can supply an image signal. It is electrically connected to the wiring.

[0216] The touch panel 390 also includes a scan line driver circuit that can supply selection signals to the pixels 302. a signal line driver circuit 303g(1) capable of supplying an image signal to the pixel 302; Equipped with 303s(1).

[0217] The imaging pixel 308 includes a photoelectric conversion element and an imaging pixel circuit that drives the photoelectric conversion element.

[0218] The imaging pixel circuit has wiring that can supply a control signal and a power supply potential. The wiring is electrically connected to the wiring.

[0219] The control signal may be, for example, a pixel circuit for reading out a recorded image signal. a signal that can initialize the imaging pixel circuit, and a signal that can detect light by the imaging pixel circuit. Examples of such signals include a signal that can determine the time to

[0220] The touch panel 390 includes an imaging pixel drive circuit that can provide control signals to the imaging pixels 308. The image pickup circuit 303 includes a line 303g(2) and an image pickup signal line drive circuit 303s(2) that reads out image pickup signals.

[0221] As shown in FIG. 14(B), the touch panel 390 includes a substrate 510 and a substrate facing the substrate 510. The substrate 570 is a substrate for the semiconductor device.

[0222] A flexible material can be suitably used for the substrate 510 and the substrate 570 .

[0223] Materials that suppress impurity permeation can be suitably used for the substrates 510 and 570. For example, if the water vapor permeability is 10 -5 g / m 2 ·day or less, preferably 10 -6 g / m 2 Materials with a shelf life of 10 days or less can be suitably used.

[0224] Materials having approximately the same coefficient of linear expansion can be suitably used for the substrates 510 and 570 . For example, the linear expansion coefficient is 1×10 -3 / K or less, preferably 5×10 -5 / K or less, more preferred Or 1 x 10 -5 A material having a solubility of 0.1 kJ / K or less can be suitably used.

[0225] The substrate 510 includes a flexible substrate 510b, an insulating layer 510a that prevents impurities from diffusing into the light-emitting element, and an adhesive layer 510c that bonds the flexible substrate 510b and the insulating layer 510a. It is a layered body.

[0226] The substrate 570 includes a flexible substrate 570b, an insulating layer 570a that prevents impurities from diffusing into the light-emitting element, and an adhesive layer 570c that bonds the flexible substrate 570b and the insulating layer 570a. .

[0227] For example, polyester, polyolefin, polyamide (nylon, aramid, etc.), polyimide Amide, polycarbonate or acrylic, urethane, epoxy or siloxane bonded A material containing a resin having such a property can be used for the adhesive layer.

[0228] The sealing layer 560 bonds the substrate 570 to the substrate 510. The sealing layer 560 is larger than air. The pixel circuit and the light emitting element (for example, the first light emitting element 350R) are mounted on the substrate 5. 10 and the substrate 570.

[0229] The pixel 302 includes a subpixel 302R, a subpixel 302G, and a subpixel 302B (FIG. 14( C)). The subpixel 302R includes a light-emitting module 380R, and the subpixel 302G includes a light-emitting Subpixel 302B comprises light-emitting module 380G, and subpixel 302B comprises light-emitting module 380B.

[0230] For example, the subpixel 302R supplies power to the first light-emitting element 350R and the second light-emitting element 350R. The pixel circuit includes a transistor 302t that can supply a voltage (FIG. 14B). The light emitting module 380R includes a first light emitting element 350R and an optical element (for example, a colored layer 3 67R).

[0231] The light emitting element 350R includes a first lower electrode 351R, an upper electrode 352, and a lower electrode 351R and an upper The device has an EL layer 353 between the bottom electrodes 352 (FIG. 14(C)).

[0232] The EL layer 353 includes a light-emitting unit 353a, a light-emitting unit 353b, and a light-emitting unit 353c. There is an intermediate layer 354 between the light-emitting unit 353a and the light-emitting unit 353b.

[0233] The light emitting module 380R has a first color layer 367R on the substrate 570. It is sufficient if it transmits light having a wavelength of, for example, red, green, or blue. Alternatively, the light emitted by the light emitting element can be directly transmitted through the transparent electrode. A transparent region may be provided. Also, each light emitting element may emit a different color. In this case, the colored layer may or may not be provided.

[0234] For example, the light emitting module 380R includes a sealing layer in contact with the light emitting element 350R and the colored layer 367R. It has 560.

[0235] The colored layer 367R is located so as to overlap the light emitting element 350R. A part of the light emitted from the sealing layer 560 passes through the colored layer 367R and the colored layer 367R, and is reflected by the sealing layer 560 as shown by the arrows in the figure. The light is emitted to the outside of the light emitting module 380R as shown.

[0236] The touch panel 390 has a light-shielding layer 367BM on a substrate 570. The light-shielding layer 367BM is It is provided so as to surround the colored layer (for example, the colored layer 367R).

[0237] The touch panel 390 includes an anti-reflection layer 367p at a position overlapping the display unit 301. The blocking layer 367p may be, for example, a circular polarizer.

[0238] The touch panel 390 includes an insulating layer 321. The insulating layer 321 is formed by insulating the transistor 302t. The insulating layer 321 serves as a layer for flattening unevenness caused by the pixel circuit. In addition, it is possible to suppress the diffusion of impurities into the transistor 302t, etc. A laminated insulating layer of layers can be applied to the insulating layer 321.

[0239] The touch panel 390 has a light-emitting element (for example, a light-emitting element 350R) on an insulating layer 321. .

[0240] The touch panel 390 has a partition wall 328 on an insulating layer 321, the partition wall 328 overlapping the end of the lower electrode 351R. In addition, a spacer 329 for controlling the distance between the substrate 510 and the substrate 570 is provided between the partition wall 328. It has above.

[0241] The image signal line driver circuit 303s(1) includes a transistor 303t and a capacitor 303c. The driver circuit can be formed on the same substrate as the pixel circuit in the same process. As shown in B), the transistor 303t has a second gate 304 on the insulating layer 321. The second gate 304 is electrically connected to the gate of the transistor 303t. Alternatively, different potentials may be applied to the first and second electrodes. The second gate 304 may be provided to the transistor 308t, the transistor 302t, and so on.

[0242] The imaging pixel 308 detects the light irradiated to the photoelectric conversion element 308p and the photoelectric conversion element 308p. The imaging pixel circuit includes a transistor 308t. nothing.

[0243] For example, a pin-type photodiode can be used as the photoelectric conversion element 308p.

[0244] The touch panel 390 includes wiring 311 through which signals can be supplied, and terminals 319 are disposed. The signal line 311 can be used to supply signals such as image signals and synchronization signals. The FPC 309(1) is electrically connected to the terminal 319. ) may have a printed wiring board (PWB) attached to it.

[0245] The transistors formed in the same process are referred to as transistors 302t and 303t. , and transistors such as transistor 308t.

[0246] In addition to the gate, source and drain of the transistor, various components that make up the touch panel Materials that can be used for wiring and electrodes include aluminum, titanium, chromium, and nickel. Kel, copper, yttrium, zirconium, molybdenum, silver, tantalum, or tungsten These metals or alloys containing these metals as the main component are used in a single layer structure or a laminated structure. , a single layer structure of aluminum film containing silicon, and a two-layer structure of aluminum film stacked on titanium film. Layer structure, two-layer structure with aluminum film laminated on tungsten film, copper-magnesium-aluminum Two-layer structure with copper film laminated on aluminum alloy film, two-layer structure with copper film laminated on titanium film, Two-layer structure in which a copper film is laminated on a tungsten film, a titanium film or titanium nitride film, and the titanium An aluminum film or a copper film is laminated on the titanium nitride film, and a titanium film is further laminated on the aluminum film or the copper film. a three-layer structure forming a film or titanium nitride film, a molybdenum film or molybdenum nitride film, and An aluminum film or a copper film is laminated on the molybdenum film or the molybdenum nitride film, and then There are three-layer structures in which a molybdenum film or a molybdenum nitride film is formed on top of the oxide film. Transparent conductive materials containing zinc oxide, tin oxide, or zinc oxide may also be used. Copper is preferred because it allows for better control of the shape by etching.

[0247] <Configuration Example 2-2> 15(A) and (B) are perspective views of the touch panel 505. For clarity, only a representative 16(A) is a cross section taken along the dashed line G3-G4 in FIG. 15(A). Figure.

[0248] The touch panel 505 includes a display unit 501 and a touch sensor 595 (FIG. 15(B)). The touch panel 505 also includes a substrate 510, a substrate 570, and a substrate 590. The substrate 510, the substrate 570 and the substrate 590 are all flexible.

[0249] The display unit 501 includes a substrate 510, a plurality of pixels on the substrate 510, and a display panel for supplying signals to the pixels. The plurality of wirings 511 are arranged on the periphery of the substrate 510. The wire is routed through the FPC 509(1), and a part of it constitutes the terminal 519. The terminal 519 is and electrically connect it.

[0250] The substrate 590 includes a touch sensor 595 and a plurality of electrodes electrically connected to the touch sensor 595. The wiring 598 is arranged around the periphery of the substrate 590, and some of the wiring 598 is This terminal is electrically connected to the FPC 509(2). In FIG. 15(B), for clarity, the substrate 590 is provided on the rear surface side (the surface side facing the substrate 510). The electrodes and wiring of the touch sensor 595 are shown by solid lines.

[0251] As the touch sensor 595, for example, a capacitance type touch sensor can be applied. The methods include a surface capacitance method and a projected capacitance method.

[0252] Projected capacitive touch panels are classified into self-capacitance and mutual-capacitance types, which differ mainly in their drive methods. The mutual capacitance method is preferable because it allows simultaneous multi-point detection.

[0253] In the following, when a projected capacitive touch sensor is applied, Fig. 15(B) is used. This will be used to explain.

[0254] In addition, various sensors that can detect the proximity or contact of a detection target such as a finger are applied. It is possible.

[0255] The projected capacitive touch sensor 595 has a first electrode 591 and a second electrode 592. The first electrode 591 is electrically connected to one of the plurality of wirings 598, and the second electrode 5 92 electrically connects to any other of the plurality of wires 598 .

[0256] The second electrodes 592 are arranged repeatedly in one direction as shown in FIGS. It has a shape in which a plurality of quadrilaterals are connected at their corners.

[0257] The first electrode 591 is quadrilateral and is repeated in a direction intersecting the direction in which the second electrode 592 extends. They are arranged repeatedly.

[0258] The wiring 594 electrically connects two first electrodes 591 that sandwich one of the second electrodes 592. At this time, the area of ​​the intersection between the second electrode 592 and the wiring 594 is minimized. This makes it possible to reduce the area of ​​the region where no electrodes are provided, and the transmittance can be improved. As a result, unevenness in the brightness of the light passing through the touch sensor 595 can be reduced. can be done.

[0259] The shapes of the first electrode 591 and the second electrode 592 are not limited to this, and various shapes may be used. For example, a plurality of strip-shaped first electrodes may be arranged with as few gaps as possible, and the insulating A plurality of strip-shaped second electrodes are arranged so as to intersect with the first electrodes through the layers. Two adjacent second electrodes may be provided at a distance from each other. If a dummy electrode electrically isolated from the two electrodes is provided between them, the transmittance of the two electrodes will be different. This is preferable because the area of ​​the region can be reduced.

[0260] The touch sensor 595 includes a substrate 590 and first electrodes 59 arranged in a staggered pattern on the substrate 590. The first and second electrodes 592, the insulating layer 593 covering the first electrode 591 and the second electrode 592, and The first electrodes 591 are electrically connected to each other by wiring 594 .

[0261] The adhesive layer 597 is formed on the surface of the touch sensor 595 that overlaps the display unit 501 as shown in FIG. As shown, the substrate 590 is bonded to the substrate 570.

[0262] The first electrode 591 and the second electrode 592 are formed using a light-transmitting conductive material. Examples of the conductive material having light-transmitting properties include indium oxide, indium tin oxide, and indium Conductive oxides such as zinc oxide, zinc oxide, and zinc oxide doped with gallium can be used. It is also possible to use a film containing graphene. The film containing graphene can be, for example, For example, the graphene oxide film can be formed by reducing a film containing the graphene oxide. As a method for this, a method of applying heat can be mentioned.

[0263] After forming a film of a light-transmitting conductive material on a substrate 590 by a sputtering method, By using various patterning techniques such as lithography, unnecessary parts are removed to form the first electrode. 591 and a second electrode 592 can be formed.

[0264] The insulating layer 593 may be made of a resin such as acrylic or epoxy, or a silicon dioxide film. In addition to resins with oxane bonds, silicon oxide, silicon oxynitride, aluminum oxide, etc. Any inorganic insulating material can be used.

[0265] An opening reaching the first electrode 591 is provided in the insulating layer 593, and a wiring 594 is provided adjacent to the opening. The first electrode 591 is electrically connected to the light-transmitting conductive material. Therefore, it can be suitably used for the wiring 594. A material having higher conductivity than the first electrode 591 and the second electrode 592 can reduce electrical resistance. 4 can be suitably used.

[0266] Each of the second electrodes 592 extends in one direction, and the plurality of second electrodes 592 are arranged in a stripe pattern. It is set up in.

[0267] The wiring 594 is provided so as to intersect with one of the second electrodes 592 .

[0268] A pair of first electrodes 591 are provided with one second electrode 592 sandwiched therebetween, and a pair of wirings 594 are provided. The first electrodes 591 are electrically connected.

[0269] The plurality of first electrodes 591 are not necessarily arranged in a direction perpendicular to one of the second electrodes 592. It doesn't need to be placed.

[0270] The first wiring 598 is electrically connected to the first electrode 591 or the second electrode 592. A part of 598 functions as a terminal. The wiring 598 is made of, for example, aluminum or gold. , platinum, silver, nickel, titanium, tungsten, chromium, molybdenum, iron, cobalt, copper Alternatively, a metal material such as palladium or an alloy material containing such a metal material can be used.

[0271] Note that an insulating layer is provided to cover the insulating layer 593 and the wiring 594 to protect the touch sensor 595. It is possible.

[0272] Furthermore, the connection layer 599 electrically connects the wiring 598 and the FPC 509(2).

[0273] The connection layer 599 may be made of various anisotropic conductive films (ACFs). Conductive Film) and Anisotropic Conductive Paste (ACP) Pic Conductive Paste) can be used.

[0274] The adhesive layer 597 is transparent. For example, a thermosetting resin or an ultraviolet curing resin may be used. Specifically, resins having acrylic, urethane, epoxy, or siloxane bonds can be used. Resins such as fats can be used.

[0275] The display unit 501 includes a plurality of pixels arranged in a matrix. It includes a pixel circuit that drives the element.

[0276] In this embodiment, an organic EL element that emits white light is used as a display element. However, the display element is not limited to this.

[0277] For example, organic EL elements with different luminescent colors can be used as sub-pixels so that the color of light emitted from each sub-pixel is different. It may be applied to each element, in which case the colored layer does not need to be provided.

[0278] The substrate 510, the substrate 570, and the sealing layer 560 can have the same configuration as in Configuration Example 2-1. .

[0279] The pixel includes a sub-pixel 502R, which comprises a light-emitting module 580R.

[0280] The sub-pixel 502R supplies power to the first light-emitting element 550R and the second light-emitting element 550R. The light-emitting module 502 includes a pixel circuit including a transistor 502t. 80R includes a first light emitting element 550R and an optical element (eg, a colored layer 567R).

[0281] The light emitting element 550R has a lower electrode, an upper electrode, and an EL layer between the lower electrode and the upper electrode.

[0282] The light emitting module 580R has a first colored layer 567R in the light extraction direction.

[0283] In addition, when the sealing layer 560 is provided on the light extraction side, the sealing layer 560 It contacts the optical element 550R and the first colored layer 567R.

[0284] The first colored layer 567R is located so as to overlap the first light emitting element 550R. A part of the light emitted by the element 550R passes through the first colored layer 567R and travels in the direction of the arrow shown in the figure. The light is emitted to the outside of light emitting module 580R in the opposite direction.

[0285] The display unit 501 has a light-shielding layer 567BM in the light-emitting direction. It is provided so as to surround the colored layer (for example, the first colored layer 567R).

[0286] The display unit 501 includes an anti-reflection layer 567p at a position overlapping the pixels. As the polarizer, for example, a circular polarizer can be used.

[0287] The display portion 501 includes an insulating film 521. The insulating film 521 covers the transistor 502t. The insulating film 521 is used as a layer for flattening unevenness caused by the pixel circuit. In addition, a laminated film including a layer capable of suppressing the diffusion of impurities can be applied to the insulating film 521. This prevents the reliability of the transistor 502t and the like from being affected by impurity diffusion. The decline can be suppressed.

[0288] The display unit 501 has a light-emitting element (for example, a first light-emitting element 550R) on an insulating film 521. .

[0289] The display portion 501 has a partition wall 528 on the insulating film 521 that overlaps with an end portion of the first lower electrode. In addition, a spacer for controlling the distance between the substrate 510 and the substrate 570 is provided on the partition wall 528 .

[0290] The scanning line driver circuit 503g(1) includes a transistor 503t and a capacitor 503c. The driver circuit can be formed on the same substrate as the pixel circuit in the same process.

[0291] The display unit 501 includes a wiring 511 capable of supplying a signal, and a terminal 519 is connected to the wiring 511. 1. In addition, the FP 1 can supply signals such as image signals and synchronization signals. C509(1) is electrically connected to terminal 519.

[0292] In addition, a printed wiring board (PWB) may be attached to the FPC509(1). .

[0293] The display portion 501 has wiring such as scanning lines, signal lines, and power supply lines. It can be used for wiring.

[0294] Note that various transistors can be applied to the display portion 501. The configuration when the above is applied to the display unit 501 is shown in FIGS.

[0295] For example, a semiconductor layer containing an oxide semiconductor, amorphous silicon, or the like is formed as shown in FIG. The present invention can be applied to the transistors 502t and 503t.

[0296] For example, a semiconductor layer containing polycrystalline silicon crystallized by a process such as laser annealing. is applied to the transistor 502t and the transistor 503t shown in FIG. It is possible.

[0297] Also, a configuration in which a top gate type transistor is applied to the display section 501 is shown in FIG. C) is shown in the figure.

[0298] For example, polycrystalline silicon or a single crystal silicon film transferred from a single crystal silicon substrate, etc. The semiconductor layer including the transistor 502t and the transistor 50 Can be applied to 3T.

[0299] <Configuration example 2-3> 17 is a cross-sectional view of touch panel 505B. 505B is a display unit 505 that displays the supplied image information on the side where the transistor is provided. 01 and the touch sensor is provided on the substrate 510 side of the display unit. This is different from the touch panel 505 of 2-2. The above description is applicable to parts where similar configurations can be used.

[0300] The first colored layer 567R is located so as to overlap the first light emitting element 550R. The light-emitting element 550R shown in FIG. 1 emits light toward the side where the transistor 502t is provided. As a result, a part of the light emitted by the light emitting element 550R passes through the first colored layer 567R, The light is emitted to the outside of light emitting module 580R in the direction of the arrow shown in the figure.

[0301] The display unit 501 has a light-shielding layer 567BM in the light-emitting direction. It is provided so as to surround the colored layer (for example, the first colored layer 567R).

[0302] The touch sensor 595 is provided on the substrate 510 side of the display unit 501 (FIG. 17(A)). .

[0303] The adhesive layer 597 is located between the substrate 510 and the substrate 590, and connects the display unit 501 and the touch sensor 59 Glue 5 together.

[0304] Note that various transistors can be applied to the display portion 501. The configuration when the above is applied to the display unit 501 is shown in FIGS.

[0305] For example, a semiconductor layer containing an oxide semiconductor, amorphous silicon, or the like is formed as shown in FIG. The present invention can be applied to the transistors 502t and 503t.

[0306] For example, a semiconductor layer containing polycrystalline silicon or the like is formed into a transistor 50 shown in FIG. 2t and transistor 503t.

[0307] Also, a configuration in which a top gate type transistor is applied to the display unit 501 is shown in FIG. C) is shown in the figure.

[0308] For example, a semiconductor layer including polycrystalline silicon or a transferred single-crystal silicon film is formed as shown in FIG. C) can be applied to the transistor 502t and the transistor 503t shown in .

[0309] This embodiment mode can be combined with other embodiment modes as appropriate. [Explanation of symbols]

[0310] 10. Cabinet 11 Display device 11a Display area 11b Hidden area 11c The First Zone 11d. The Second Region 13 Protective layer 13a Protective layer 13b Protective layer 15 Support 15a Support 15b Support 16 Winding section 17 Translucent area 18 Components 19 Fixed part 20 Components 21 Operation buttons 31 Operation buttons 32 Image Sensor 226 Insulating Layer 301 Display section 302 pixels 302B subpixel 302G subpixel 302R subpixel 302t transistor 303c capacity 303g(1) Scanning line driver circuit 303g(2) Imaging pixel drive circuit 303s(1) Image signal line driver circuit 303s(2) Image signal line driver circuit 303t transistor Gate 304 308 imaging pixels 308p photoelectric conversion element 308t transistor 309 FPC 311 Wiring 319 terminal 321 Insulating Layer 328 Bulkhead 329 Spacer 350R light emitting element 351R lower electrode 352 Upper electrode 353 EL layer 353a Light Emitting Unit 353b Lighting unit 354 Middle Class 367BM light shielding layer 367p anti-reflection layer 367R colored layer 380B Light Emitting Module 380G light emitting module 380R Light Emitting Module 390 Touch Panel 401 Lower electrode 402 EL layer 403 Upper electrode 405 Insulation Layer 407 Adhesive layer 420 Flexible substrate 422 Adhesive layer 424 Insulating Layer 426 Adhesive layer 428 Flexible substrate 431 Light blocking layer 432 Colored layer 435 Conductive Layer 450 Organic EL element 453 Overcoat 454 transistor 455 transistor 457 Conductive Layer 463 Insulating Layer 465 Insulation Layer 467 Insulating Layer 491 Light-emitting part 493 Drive circuit section 495 FPC 496 Insulating Layer 497 Connections 501 Display section 502R subpixel 502t transistor 503c capacity 503g Scanning line driver circuit 503t transistor 505 touch panel 505B Touch Panel 509 FPC 510 board 510a Insulating layer 510b flexible substrate 510c adhesive layer 511 Wiring 519 terminal 521 Insulating film 528 Bulkhead 550R light emitting element 560 Sealing Layer 567BM light shielding layer 567p anti-reflection layer 567R colored layer 570 PCB 570a Insulating layer 570b flexible substrate 570c ​​adhesive layer 580R Light Emitting Module 590 PCB 591 First Electrode 592 Second Electrode 593 Insulating Layer 594 Wiring 595 Touch Sensor 597 Adhesive layer 598 Wiring 599 Connection Layer 1301 Device Layer 1303 Flexible substrate 1304 copies 1305 Adhesive layer 1306 Drive circuit section 1308 FPC 1357 Conductive layer 1401 Flexible substrate 1403 Adhesive layer 1405 Insulation layer 1407 Insulation layer 1409 Insulation layer 1411 Insulating layer 1413 Adhesive layer 1415 Connector 1430 Light-emitting element 1431 Lower electrode 1433 EL layer 1435 Upper electrode 1440 transistor 1455 Insulation layer 1457 Light blocking layer 1459 Colored layer 1461 Overcoat 1501 Fabrication board 1503 Peeling layer 1505 Fabrication board 1507 Peeling layer

Claims

1. a display panel having a display area and a non-display area surrounding the display area provided on a display surface thereof; a light-emitting device that can be bent with the display surface of the display panel facing inward, a first support and a second support disposed opposite to the display surface of the display panel and spaced apart from each other; a third support and a fourth support disposed opposite the non-display area on the display surface of the display panel and spaced apart from each other; a protective layer having a region disposed between the display panel and the third support and a region disposed between the display panel and the fourth support, the display panel has a first portion overlapping with the first support, a second portion overlapping with the second support, and a third portion positioned between the first portion and the second portion and capable of being bent; the first support overlaps with the third support via the first portion; the second support overlaps with the fourth support via the second portion; the third portion has a region that does not overlap with either the third support or the fourth support, the protective layer overlaps with the non-display area present in the third portion but does not overlap with the display area; the protective layer has an area that does not overlap with the third support and the fourth support; Light-emitting device.

2. In claim 1, The protective layer comprises rubber. Light-emitting device.

3. In claim 1 or claim 2, the protective layer is more flexible than the third support and the fourth support; Light-emitting device.

4. a display panel having a display area and a non-display area surrounding the display area provided on a display surface thereof; a light-emitting device that can be bent with the display surface of the display panel facing inward, a first support and a second support disposed opposite to the display surface of the display panel and spaced apart from each other; a first protective layer having a region disposed between the display panel and the first support and a region disposed between the display panel and the second support; a third support and a fourth support disposed opposite the non-display area on the display surface of the display panel and spaced apart from each other; a second protective layer having a region disposed between the display panel and the third support and a region disposed between the display panel and the fourth support, the display panel has a first portion overlapping with the first support, a second portion overlapping with the second support, and a third portion positioned between the first portion and the second portion and capable of being bent; the first support overlaps with the third support via the first portion; the second support overlaps with the fourth support via the second portion; the third portion has a region that does not overlap with either the third support or the fourth support, the first protective layer overlaps with each of the first portion, the second portion, and the third portion; the second protective layer overlaps with the non-display area present in the third portion but does not overlap with the display area; the second protective layer has an area that does not overlap with the third support and the fourth support; Light-emitting device.

5. In claim 4, the first protective layer comprises a metal; Light-emitting device.

6. In claim 4 or claim 5, the second protective layer comprises rubber; Light-emitting device.

7. In any one of claims 4 to 6, the second protective layer is more flexible than the third support and the fourth support; Light-emitting device.

8. In any one of claims 4 to 7, the first support has a region fixed to the first portion via the first protective layer; the second support has a region fixed to the second portion via the first protective layer; Light-emitting device.

9. In any one of claims 1 to 8, When the light-emitting device is bent, the radius of curvature of the third portion is 1 mm or more and 100 mm or less. Light-emitting device.

10. In any one of claims 1 to 9, the first support and the second support comprise a metal; Light-emitting device.

11. In any one of claims 1 to 10, The substrate of the display panel is made of polyamide-imide resin, polyimide resin, or PET. Light-emitting device.

12. In any one of claims 1 to 11, the third support and the fourth support do not overlap with the display area of ​​the display panel. Light-emitting device.

Images