Method and device for producing a contact metallization

The method and apparatus automate wafer handling and metallization by using sensor units and statistical models to optimize processing sequences, addressing the complexity and cost issues in existing production methods, ensuring high-quality and efficient contact metallization.

JP2026015236APending Publication Date: 2026-01-29PAC TECH PACKAGING TECH
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Patent Information

Application Number
JP2025112094
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-07-18
Filing Date
2025-07-02
Publication Date
2026-01-29

AI Technical Summary

Technical Problem

The production of contact metallization on the edge of a wafer requires significant structural and operational effort, leading to high costs and variability in quality due to the complexity of handling wafers and determining process parameters under cleanroom conditions.

Method used

A method and apparatus utilizing a manipulator unit and multiple workstations with sensor units and statistical models to detect and prioritize wafer handling based on object characteristics, optimizing residence times and sequence through data banks and machine learning to automate and simplify the production process.

Benefits of technology

Ensures high-quality, consistent contact metallization by minimizing operator dependency and optimizing handling sequences, reducing costs and improving process efficiency.

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Abstract

To provide a method and an apparatus for manufacturing a contact metallization on an end face of a wafer.SOLUTION: In the apparatus 10, the plurality of workstations 50-54 comprises a deposition station 52 for receiving a solution of a contact metal to be deposited on the end face of the wafer, and the method further comprises a step a. in which the sensor unit 20 detects a measured value (M) of an object property of the wafer and / or of the workstation using the sensor; The method includes a step (b) including prioritization for equipping a processing space and / or determination of residence time of a wafer in the processing space, a step (c) of generating a control data set (S) for a manipulator unit 15, and a step (d) of handling the wafer according to the control data set (S).SELECTED DRAWING: Figure 1
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Citation Information

Patent Citations

  • Equipment used for producing UBM on terminal surface of wafer

    CN203760439U

  • Deposition station and device for producing contact metallizations

    DE202022105493U1

  • Model-based parameter adjustments for deposition processes

    US20230411222A1