Processing condition management unit and processing apparatus

Abstract

To facilitate management of processing conditions.SOLUTION: A use date storage part 52 stores the last use date in each of the processing conditions. Then, the deletion controlling section 55 detects a processing condition under which the elapsed time from the use date and time stored in the use date and time storing section 52 to the present becomes larger than the first threshold value (that is, a processing condition which has not been used for a certain period of time), and deletes such a processing condition from the first processing condition storing section 51. Therefore, it is possible to prevent the processing condition that is no longer used at present from remaining stored in the first processing condition storage section 51. Therefore, the operator can easily manage the processing conditions.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a processing condition management unit and a processing apparatus. [Background technology]

[0002] In the manufacturing process of semiconductor devices and electronic components, plate-shaped workpieces made of various materials such as semiconductor wafers and ceramic substrates are ground to a predetermined thickness using a grinding wheel attached to the spindle of a grinding machine (see Patent Document 1).The workpiece is then divided into individual device chips using a cutting machine with a spindle equipped with a cutting blade or a laser irradiation mechanism. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2003-236736 Summary of the Invention [Problem to be solved by the invention]

[0004] In processing devices such as the grinding device and cutting device described above, processing conditions (processing conditions) are set according to the type of each product in order to process multiple types of workpieces (products). These processing conditions include not only the type of product but also more detailed conditions such as the thickness of the product.

[0005] Therefore, new processing conditions are set in the processing equipment every time a new product is developed, which sometimes results in many processing conditions that are no longer used remaining set in the processing equipment, making management of the processing conditions cumbersome.

[0006] SUMMARY OF THE INVENTION Therefore, an object of the present invention is to facilitate the management of processing conditions in a processing apparatus. [Means for solving the problem]

[0007] The first processing condition management unit of the present invention is a processing condition management unit that manages processing conditions used in processing of a workpiece in a processing device, and includes a first processing condition memory unit that stores a plurality of processing conditions, a usage date and time memory unit that stores the last usage date and time for each of the processing conditions, a time calculation unit that calculates the elapsed time from the last usage date and time for each processing condition stored in the usage date and time memory unit to the present, a first threshold value memory unit that stores a first threshold value related to the elapsed time, and a deletion control unit that deletes from the first processing condition memory unit any processing condition for which the elapsed time is greater than the first threshold value.

[0008] The first processing condition management unit may further include a notification section for notifying the worker of information, and the deletion control section may notify the worker via the notification section whether or not the processing condition needs to be deleted when there is a processing condition for which the elapsed time is greater than the first threshold value, and may delete the processing condition from the first processing condition storage section when the worker selects "delete" in the notification section.

[0009] The second processing condition management unit of the present invention is a processing condition management unit that manages processing conditions used in processing equipment for processing workpieces, and includes a first processing condition memory unit that stores a plurality of processing conditions, a usage date and time memory unit that stores the last usage date and time for each of the processing conditions, a time calculation unit that calculates the elapsed time from the last usage date and time for each processing condition stored in the usage date and time memory unit to the present, a first threshold value memory unit that stores a first threshold value related to the elapsed time, a second threshold value memory unit that stores a second threshold value that is smaller than the first threshold value, a second processing condition memory unit for storing processing conditions, a movement control unit that moves processing conditions whose elapsed time is greater than the second threshold value from the first processing condition memory unit to the second processing condition memory unit, and a deletion control unit that deletes processing conditions whose elapsed time is greater than the first threshold value from the second processing condition memory unit.

[0010] The second processing condition management unit may further include a notification section for notifying the worker of information, and the deletion control section may notify the worker via the notification section whether or not the processing condition needs to be deleted when there is a processing condition for which the elapsed time is greater than the first threshold value, and may delete the processing condition from the second processing condition storage section when the worker selects "delete" in the notification section.

[0011] The processing apparatus of the present invention is a processing apparatus for processing a workpiece, and comprises a chuck table for holding the workpiece, a processing unit for processing the workpiece held on the chuck table in accordance with processing conditions, and a controller, wherein the controller includes either a first processing condition management unit or a second processing condition management unit. [Effects of the Invention]

[0012] In the present invention, the use date and time storage unit stores the last use date and time for each processing condition, and the deletion control unit detects a processing condition for which the elapsed time from the use date and time stored in the use date and time storage unit to the present is greater than a first threshold value (i.e., a processing condition that has not been used for a certain period of time), and deletes such a processing condition from the first processing condition storage unit or the second processing condition storage unit.

[0013] Therefore, the present invention can prevent processing conditions that are no longer in use from remaining, making it easier for the operator to manage the processing conditions. [Brief explanation of the drawings]

[0014] [Figure 1] FIG. 2 is a perspective view showing the configuration of a grinding device. [Figure 2] FIG. 2(a) is a diagram showing an example of processing conditions in a grinding device, and FIG. 2(b) is a diagram showing an example of processing conditions in a cutting device. [Figure 3] 3(a) and 3(b) are block diagrams showing the configuration of the processing condition management unit. [Figure 4] FIG. 10 is an explanatory diagram showing a display example of a touch panel. [Figure 5] FIG. 2 is a perspective view showing the configuration of a cutting device. DETAILED DESCRIPTION OF THE INVENTION

[0015] 1 is an example of a processing device for processing a workpiece. The grinding device 1 includes a rough grinding mechanism 25 and a finish grinding mechanism 26, and grinds a wafer 100 held on a chuck table 4 by the rough grinding mechanism 25 and the finish grinding mechanism 26.

[0016] Wafer 100 is an example of a workpiece, such as a circular semiconductor wafer. In FIG. 1, front surface 101 of wafer 100, which faces downward, is the surface on which devices are formed and is protected by the attachment of protective tape 105. Back surface 102 of wafer 100 is the surface to be processed, on which the grinding process is performed.

[0017] The grinding apparatus 1 has an apparatus base 10. A first cassette 14 and a second cassette 15, each containing a plurality of wafers 100, are arranged on the front side (-Y direction side) of the apparatus base 10. The unprocessed wafers 100 in the first cassette 14 and the second cassette 15 are taken out by a robot 13 and placed on a temporary placement mechanism 16.

[0018] The temporary placement mechanism 16 aligns (centers) the wafer 100 at a predetermined position. The wafer 100 aligned in the temporary placement mechanism 16 is placed by the carry-in mechanism 17 on the holding surface 40 of the chuck table 4 located at a transfer position 41 near the temporary placement mechanism 16. The transfer position 41 is the position of the chuck table 4 when the wafer 100 is carried in and out of the chuck table 4.

[0019] The chuck table 4 holds the wafer 100, which is the workpiece. That is, the upper surface of the chuck table 4 serves as a holding surface 40 that is connected to a suction source (not shown) and that suction-holds the wafer 100. The chuck table 4 uses the holding surface 40 to suction-hold the wafer 100 via the protective tape 105.

[0020] In this embodiment, three chuck tables 4 are arranged on the upper surface of a turntable 6 disposed on an apparatus base 10. The three chuck tables 4 are arranged at equal intervals on a circle centered on the center of the turntable 6.

[0021] The turntable 6 is configured to rotate about a central axis that passes through the center of the turntable 6 and extends in the Z-axis direction. The rotation of the turntable 6 causes the three chuck tables 4 to revolve. As a result, the turntable 6 can move the chuck tables 4 in the horizontal direction and position the chuck tables 4 at a transfer position 41 near the temporary placement mechanism 16, a rough grinding position 42 below the rough grinding mechanism 25, and a finish grinding position 43 below the finish grinding mechanism 26.

[0022] A first column 11 is erected at the rear (+Y direction side) of the equipment base 10. A rough grinding mechanism 25 that rough grinds the wafer 100 and a rough grinding feed mechanism 20 that feeds the rough grinding mechanism 25 for grinding are disposed in front of the first column 11. The rough grinding feed mechanism 20 feeds the rough grinding mechanism 25 along the Z-axis direction for grinding.

[0023] The rough grinding mechanism 25 is an example of a processing unit that processes the wafer 100 held on the chuck table 4 according to processing conditions. The rough grinding mechanism 25 includes a spindle housing 31, a spindle 30 rotatably held in the spindle housing 31, a spindle motor 32 that rotates and drives the spindle 30, and a rough grinding wheel 34 attached to the tip of the spindle 30.

[0024] The spindle housing 31 is held by the rough grinding feed mechanism 20 so as to extend in the Z-axis direction. The spindle 30 extends in the Z-axis direction so as to be perpendicular to the holding surface 40 of the chuck table 4, and is rotatably supported by the spindle housing 31.

[0025] The spindle motor 32 is connected to the upper end side of the spindle 30. The spindle motor 32 rotates the spindle 30 around a rotation axis extending in the Z-axis direction.

[0026] The rough grinding wheel 34 is attached to the lower end of the spindle 30. The rough grinding wheel 34 includes an annular wheel base 35 made of a metal material. A plurality of roughly rectangular parallelepiped rough grinding stones 36 are arranged and fixed in an annular shape around the entire circumference of the underside of the wheel base 35. The rough grinding stones 36 are rotated by the rotation of the spindle 30, and grind the back surface 102 of the wafer 100 held on the chuck table 4. The rough grinding stones 36 are grinding stones containing relatively large abrasive grains.

[0027] During grinding, grinding water is supplied to the contact area between the rough grinding wheel 36 and the back surface 102 of the wafer 100 through an internal nozzle (not shown) or through a water channel and the rough grinding wheel 34 provided inside the spindle 30.

[0028] A first thickness measuring device 28 is disposed adjacent to the chuck table 4 disposed below the rough grinding mechanism 25. The first thickness measuring device 28 calculates the thickness of the wafer 100 being rough ground.

[0029] Furthermore, a second column 12 is erected at the rear of the apparatus base 10 so as to be adjacent to the first column 11 along the X-axis direction. A finish grinding mechanism 26 that finish-grinds the wafers 100, and a finish grinding feed mechanism 21 that feeds the finish grinding mechanism 26 for grinding are disposed in front of the second column 12. The finish grinding feed mechanism 21 feeds the finish grinding mechanism 26 along the Z-axis direction for grinding.

[0030] The finish grinding mechanism 26 has a configuration similar to that of the rough grinding mechanism 25, except that it is equipped with a finish grinding wheel 38 instead of the rough grinding wheel 34. The finish grinding wheel 38 is an example of a grinding wheel, and has a wheel base 35 and a finish grinding wheel 37. The finish grinding wheel 37 is a grinding wheel containing relatively small abrasive grains.

[0031] A second thickness measuring device 29 for measuring the thickness of the wafer 100 is disposed adjacent to the chuck table 4 disposed below the finish grinding mechanism 26. The second thickness measuring device 29 measures the thickness of the wafer 100 being finish ground.

[0032] After finish grinding, the wafer 100 is transported by the unloading mechanism 18 to the spinner cleaning mechanism 19 and cleaned. The cleaned wafer 100 is then loaded by the robot 13 into the first cassette 14 or the second cassette 15 (the cassette from which the wafer 100 was removed).

[0033] The grinding device 1 also includes a housing 8 that covers the device base 10. A touch panel 9 is provided on the side of the housing 8 as an example of a notification unit for notifying the operator of the grinding device 1 of information.

[0034] The touch panel 9 displays various information such as processing conditions related to the grinding device 1. The touch panel 9 is also used to set various information. In this way, the touch panel 9 functions as an input member for inputting information and also as a display member for displaying information.

[0035] The grinding apparatus 1 also includes a controller 5 therein for controlling the grinding apparatus 1. The controller 5 includes a CPU that performs calculations according to a control program, and a storage medium such as a memory. The controller 5 executes various processes and comprehensively controls each component of the grinding apparatus 1. For example, the controller 5 controls each of the above-mentioned members of the grinding apparatus 1 to grind the wafer 100.

[0036] The controller 5 also includes a processing condition management unit 50. The processing condition management unit 50 manages the processing conditions used in processing in the grinding apparatus 1, which is a processing apparatus for processing the workpiece.

[0037] The processing conditions (processing conditions) in the grinding apparatus 1 specify, for example, the details of grinding processing for the workpiece, that is, the wafer 100. The processing conditions are determined, for example, according to the type (material, etc.) of the workpiece, that is, the wafer 100.

[0038] 2(a) shows an example of processing conditions in the grinding device 1. In the example shown in this figure, the processing conditions include the rotation speed of the spindle 30, the feed rate, the rotation speed of the chuck table 4, and the flow rate of the grinding water during grinding. The feed speed is the moving speed (grinding feed speed) of the rough grinding mechanism 25 (finish grinding mechanism 26) by the rough grinding feed mechanism 20 (finish grinding feed mechanism 21) during grinding. The flow rate of the grinding water is the flow rate of the grinding water supplied to the contact area between the rough grinding wheel 36 (finish grinding wheel 37) and the back surface 102 of the wafer 100 via an internal nozzle or the rough grinding wheel 34 (finish grinding wheel 38) during the grinding process.

[0039] 3(a), the processing condition management unit 50 has a first processing condition storage unit 51 that stores a plurality of processing conditions used in the grinding apparatus 1. In this embodiment, the first processing condition storage unit 51 stores all processing conditions used in the grinding apparatus 1. When processing the wafer 100, the controller 5 reads out appropriate processing conditions from the first processing condition storage unit 51 and controls each component of the grinding apparatus 1 in accordance with these processing conditions to grind the wafer 100.

[0040] The processing condition management unit 50 further includes a usage date and time memory unit 52, a time calculation unit 53, a first threshold memory unit 54, and a deletion control unit 55, which are configured to manage multiple processing conditions stored in the first processing condition memory unit 51.

[0041] The method of managing the processing conditions by the processing condition management unit 50 will be described below.

[0042] The use date and time storage unit 52 of the processing condition management unit 50 stores the date and time of last use for each processing condition stored in the first processing condition storage unit 51. The date and time of last use for a processing condition is, for example, the date and time when the processing condition was last used for processing or the date and time when the processing condition was last changed (edited), whichever is more recent. Therefore, the date and time of last use for a processing condition stored in the use date and time storage unit 52 is updated whenever the processing condition is used for processing or changed.

[0043] At a predetermined timing, the time calculation unit 53 calculates the elapsed time from the last use date and time to the present under each processing condition stored in the use date and time storage unit 52. The calculation of the elapsed time by the time calculation unit 53 is performed, for example, at a predetermined time every day.

[0044] The first threshold value storage unit 54 stores a first threshold value related to this elapsed time. Then, the deletion control unit 55 deletes from the first processing condition storage unit 51 any processing condition for which the elapsed time calculated by the time calculation unit 53 is greater than the first threshold value.

[0045] That is, the deletion control unit 55 determines whether the elapsed time calculated by the time calculation unit 53 for each processing condition is greater than the first threshold value. Then, when the deletion control unit 55 detects a processing condition whose elapsed time exceeds the first threshold value, that is, a processing condition that has not been used for a certain period of time, the deletion control unit 55 deletes this processing condition from the first processing condition storage unit 51.

[0046] As described above, in this embodiment, the use date and time storage unit 52 stores the last use date and time for each processing condition. The deletion control unit 55 then detects a processing condition for which the elapsed time from the use date and time stored in the use date and time storage unit 52 to the present is greater than the first threshold value, and deletes such a processing condition from the first processing condition storage unit 51.

[0047] Therefore, in this embodiment, it is possible to prevent processing conditions that are no longer in use from remaining stored in the first processing condition storage unit 51. This makes it easier for the operator to manage the processing conditions stored in the grinding device 1.

[0048] The processing condition management unit 50 may have a configuration as shown in Fig. 3(b) , in which the processing condition management unit 50 has a second threshold value storage unit 56, a second processing condition storage unit 57, and a movement control unit 58 in addition to the first processing condition storage unit 51, the use date and time storage unit 52, the time calculation unit 53, the first threshold value storage unit 54, and the deletion control unit 55 described above.

[0049] The second threshold value storage unit 56 stores the second threshold value related to the elapsed time calculated by the time calculation unit 53. This second threshold value is smaller than the first threshold value. The second processing condition storage unit 57 is a storage member separate from the first processing condition storage unit 51 for storing processing conditions.

[0050] In this configuration, the time calculation unit 53 also calculates the elapsed time from the last date and time of use to the present for each processing condition stored in the usage date and time storage unit 52. Then, in this configuration, the movement control unit 58 moves a processing condition for which the elapsed time calculated by the time calculation unit 53 is greater than the second threshold value from the first processing condition storage unit 51 to the second processing condition storage unit 57. In other words, the movement control unit 58 deletes the corresponding processing condition from the first processing condition storage unit 51 and copies it to the second processing condition storage unit 57.

[0051] In this configuration, the use date and time storage unit 52 stores the last use date and time for the processing conditions stored in the second processing condition storage unit 57, in addition to the processing conditions stored in the first processing condition storage unit 51. Therefore, the time calculation unit 53 calculates the elapsed time from the last use date and time to the present for the processing conditions stored in the second processing condition storage unit 57, in addition to the processing conditions stored in the first processing condition storage unit 51.

[0052] In this configuration, the deletion control unit 55 deletes from the second processing condition storage unit 57 any processing condition for which the elapsed time is greater than the first threshold value.

[0053] In this configuration, processing conditions that are still in use (processing conditions whose elapsed time is equal to or less than the second threshold) are stored in the first processing condition storage unit 51. Also, processing conditions that have not been used for a while (processing conditions whose elapsed time is greater than the second threshold and equal to or less than the first threshold) are moved from the first processing condition storage unit 51 to the second processing condition storage unit 57 and stored there. Furthermore, processing conditions that are no longer in use (processing conditions whose elapsed time is greater than the first threshold) are deleted from the second processing condition storage unit 57. This allows the worker to manage processing conditions even more easily.

[0054] In addition, in the processing condition management unit 50 having the configuration shown in Figures 3(a) and 3(b), if there is a processing condition for which the above-mentioned elapsed time is greater than the first threshold value, the deletion control unit 55 may notify the operator whether or not this processing condition needs to be deleted using the touch panel 9 (see Figure 1) as an alarm unit.

[0055] In this case, for example, as shown in FIG. 4, a selection screen 9a including a YES button and a NO button for selecting whether or not to delete the processing condition is displayed on the touch panel 9.

[0056] Then, when the worker selects the NO button on the touch panel 9, the deletion control unit 55 cancels the deletion of this processing condition. On the other hand, when the worker selects the YES button on the touch panel 9 (i.e., when the worker selects deletion required), the deletion control unit 55 deletes this processing condition from the first processing condition storage unit 51 or the second processing condition storage unit 57.

[0057] With this configuration, if there is a processing condition that has not been used for a certain period of time, the worker can recognize this fact. Furthermore, the worker can decide whether or not to delete such a processing condition from the first processing condition storage unit 51 or the second processing condition storage unit 57. This makes it possible to prevent processing conditions that the worker needs from being deleted.

[0058] In this embodiment, the grinding device 1 is shown as an example of a processing device for processing a workpiece. In this regard, the processing device according to this embodiment may be a cutting device 2 as shown in FIG.

[0059] This cutting device 2 is what is called a dual dicer, and is used to divide a wafer 100 ground by a grinding device 1 (see Figure 1) into chips using a first cutting unit 81 and a second cutting unit 85, for example.

[0060] 5, devices 104 and a plurality of planned dividing lines 103 are formed on a surface 101 of the wafer 100. The cutting device 2 cuts the wafer 100 along the planned dividing lines 103 to divide the wafer 100 into a plurality of chips.

[0061] The cutting device 2 includes a base 60, a gate-type column 61 erected on the base 60, and a controller 7 that controls each component of the cutting device 2. An X-axis direction movement mechanism 62 is disposed on the base 60. The X-axis direction movement mechanism 62 moves a holding unit 70 including a chuck table 71 along the cutting feed direction (X-axis direction).

[0062] The holder 70 includes a chuck table 71 that holds the wafer 100 and a θ table 75 that supports the chuck table 71 . The upper surface of the chuck table 71 is a holding surface 72 that suction-holds the wafer 100. The holding surface 72 of the chuck table 71 is connected to a suction source (not shown), so that the holding surface 72 can suction-hold the wafer 100. The θ table 75 supports the chuck table 71 and can rotate the chuck table 71 within the XY plane.

[0063] A gate-shaped column 61 is erected on the rear side (−X direction side) of the base 60 so as to straddle the X-axis direction moving mechanism 62 . A movement mechanism 91 that moves the first cutting unit 81 and the second cutting unit 85 is provided on the front surface (the surface on the +X direction side) of the gate-type column 61. The movement mechanism 91 indexes the first cutting unit 81 and the second cutting unit 85 in the Y-axis direction and cuts them in the Z-axis direction.

[0064] The moving mechanism 91 includes a first Z-axis moving mechanism 92 that moves the first cutting unit 81 on the +Y-axis side in the Z-axis direction, a second Z-axis moving mechanism 93 that moves the second cutting unit 85 on the -Y-axis side in the Z-axis direction, and a Y-axis moving mechanism 94 that moves the first cutting unit 81 and the second cutting unit 85 in the Y-axis direction.

[0065] The first cutting unit 81 and the second cutting unit 85 are examples of processing units that perform a cutting process (cutting processing) according to processing conditions on a wafer 100 as a workpiece held on the chuck table 71. The first cutting unit 81 and the second cutting unit 85 are equipped with a cutting blade 82 and a spindle (not shown) that rotates the cutting blade 82, and cut the wafer 100 held on the chuck table 71 with the rotating cutting blade 82.

[0066] During cutting, cutting water is supplied from a blade cooler 83 to the cutting blade 82, and also from a shower nozzle 84 to the contact portion between the cutting blade 82 and the wafer 100.

[0067] The cutting device 2 also includes a touch panel 65 attached to a housing (not shown). The touch panel 65 is an example of a notification unit for notifying the operator of the cutting device 2 of information, and displays various information related to the cutting device 2. The touch panel 65 is also used to set various information. In this way, the touch panel 65 functions as a display member for displaying information, and also as an input member for inputting information.

[0068] The cutting device 2 is also provided with a controller 7. The controller 7 includes a CPU that performs arithmetic processing according to a control program, a storage medium such as a memory, etc. The controller 7 executes various processes and controls each component of the cutting device 2.

[0069] The controller 7 also includes a processing condition management unit 50 shown in FIG. 3(a) or 3(b), which is similar to the one included in the grinding device 1 described above. As described above, the processing condition management unit 50 manages the processing conditions used in processing in the cutting device 2, which is a processing device that processes the workpiece.

[0070] The processing conditions (processing conditions) in the cutting device 2 specify, for example, the details of cutting processing for the workpiece, the wafer 100. The processing conditions are determined, for example, according to the type (material, etc.) of the workpiece, the wafer 100.

[0071] 2(b) shows an example of processing conditions in the cutting device 2. In the example shown in this figure, the processing conditions include the rotation speed of the spindle that rotates the cutting blade 82, the feed rate, and the flow rate of the grinding water. The feed speed is the moving speed of the chuck table 71 (cutting feed speed) by the X-axis direction moving mechanism 62 during cutting. The flow rate of grinding water is the flow rate of cutting water supplied from the blade cooler 83 and the shower nozzle 84 during cutting.

[0072] 3(a), also in the cutting device 2, the deletion control unit 55 detects a processing condition for which the elapsed time from the date and time of use stored in the date and time of use storage unit 52 to the present is greater than a first threshold value, and deletes such a processing condition from the first processing condition storage unit 51. Therefore, also in the cutting device 2, it is possible to prevent processing conditions that are no longer used from remaining stored in the first processing condition storage unit 51. This makes it easier for the operator to manage the processing conditions stored in the cutting device 2.

[0073] 3(b), even in the cutting device 2, processing conditions that are currently being used (processing conditions for which the elapsed time is equal to or less than the second threshold) are stored in the first processing condition storage unit 51. Processing conditions that have not been used for a while (processing conditions for which the elapsed time is greater than the second threshold and equal to or less than the first threshold) are moved from the first processing condition storage unit 51 to the second processing condition storage unit 57 and stored there. Furthermore, processing conditions that are no longer being used (processing conditions for which the elapsed time is greater than the first threshold) are deleted from the second processing condition storage unit 57. This allows the operator to manage processing conditions even more easily.

[0074] Also, in the cutting device 2, when there is a processing condition for which the above-mentioned elapsed time is greater than the first threshold value, the deletion control unit 55 may notify the operator via the touch panel 65 (see Figure 5) as a notification unit whether or not this processing condition needs to be deleted, and if the operator selects deletion, this processing condition may be deleted from the first processing condition memory unit 51 or the second processing condition memory unit 57.

[0075] Furthermore, the processing device according to this embodiment may be not only the grinding device 1 or the cutting device 2, but also a laser processing device and a plasma processing device that cut the wafer 100, a polishing device that polishes the wafer 100, a tape applicator that applies tape to the wafer 100, a measuring instrument that performs measurements on the wafer 100, and a cleaning machine that cleans the wafer 100. [Explanation of symbols]

[0076] 1: Grinding device, 2: Cutting device, 4: Chuck table, 5: Controller, 6: Turntable, 7: Controller, 8: Housing, 9: Touch panel, 9a: Selection screen, 10: device base, 11: first column, 12: second column, 13: robot, 14: first cassette, 15: second cassette, 16: temporary placement mechanism, 17: loading mechanism, 18: Unloading mechanism, 19: Spinner cleaning mechanism, 20: Rough grinding feed mechanism, 21: finish grinding feed mechanism, 25: rough grinding mechanism, 26: finish grinding mechanism, 28: First thickness measuring device, 29: Second thickness measuring device, 30: spindle, 31: spindle housing, 32: spindle motor, 34: Rough grinding wheel, 35: Wheel base, 36: Rough grinding stone, 37: Finish grinding stone, 38: Finish grinding wheel, 40: Holding surface, 41: Transfer position, 42: Rough grinding position, 43: Finish grinding position, 50: Processing condition management unit, 51: First processing condition storage unit, 52: Usage date and time storage unit, 53: time calculation unit, 54: first threshold value storage unit, 55: deletion control unit, 56: Second threshold value storage unit, 57: Second processing condition storage unit, 58: Movement control unit, 60: base, 61: gate-type column, 62: X-axis direction movement mechanism, 65: touch panel, 70: Holding portion, 71: Chuck table, 72: Holding surface, 75: θ table, 81: First cutting unit, 82: Cutting blade, 85: Second cutting unit, 91: Movement mechanism, 92: First Z-axis direction movement mechanism, 93: Second Z-axis direction movement mechanism, 94: Y-axis direction movement mechanism, 100: wafer, 101: front surface, 102: back surface, 103: planned division line, 104: Device, 105: Protective tape

Claims

1. In a processing device for processing a workpiece, a processing condition management unit for managing processing conditions used in the processing, a first processing condition storage unit that stores a plurality of processing conditions; a usage date and time storage unit that stores the last usage date and time for each of the processing conditions; a time calculation unit that calculates the elapsed time from the last use date and time under each processing condition stored in the use date and time storage unit to the present; a first threshold value storage unit that stores a first threshold value related to the elapsed time; a deletion control unit that deletes, from the first processing condition storage unit, a processing condition for which the elapsed time is greater than the first threshold value; A processing condition management unit comprising:

2. further comprising a notification unit for notifying an operator of information; The deletion control unit If there is a processing condition for which the elapsed time is greater than the first threshold value, the notification unit notifies the operator whether or not the processing condition needs to be deleted; When the operator selects "delete" in the notification unit, the processing condition is deleted from the first processing condition storage unit. The processing condition management unit according to claim 1 .

3. In a processing device for processing a workpiece, a processing condition management unit for managing processing conditions used in the processing, a first processing condition storage unit that stores a plurality of processing conditions; a usage date and time storage unit that stores the last usage date and time for each of the processing conditions; a time calculation unit that calculates the elapsed time from the last use date and time under each processing condition stored in the use date and time storage unit to the present; a first threshold value storage unit that stores a first threshold value related to the elapsed time; a second threshold value storage unit that stores a second threshold value that is smaller than the first threshold value; a second processing condition storage unit for storing processing conditions; a transfer control unit that transfers a processing condition for which the elapsed time is greater than the second threshold value from the first processing condition storage unit to the second processing condition storage unit; a deletion control unit that deletes a processing condition for which the elapsed time is greater than a first threshold value from the second processing condition storage unit; A processing condition management unit comprising:

4. further comprising a notification unit for notifying an operator of information; The deletion control unit If there is a processing condition for which the elapsed time is greater than the first threshold value, the notification unit notifies the operator whether or not the processing condition needs to be deleted; When the operator selects "delete" in the notification unit, the processing condition is deleted from the second processing condition storage unit. The processing condition management unit according to claim 3 .

5. A processing apparatus for processing a workpiece, a chuck table for holding the workpiece; a processing unit that processes the workpiece held on the chuck table in accordance with processing conditions; a controller; The controller includes a processing condition management unit according to any one of claims 1 to 4. Processing equipment.

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