Coreless current sensor module, current sensor module and power module

Abstract

The coreless current sensor module comprises a support member, a first current sensor mounted on a first surface of the support member and having at least one magnetoelectric conversion element that outputs a signal according to the magnitude of a magnetic field, an insulator that at least surrounds the first current sensor with a gap when viewed from a first direction intersecting the first surface and at least partially overlaps the first current sensor when viewed from a second direction along the first surface, and a first bus bar through which a current flows that generates a magnetic field detected by the first current sensor, and at least one of the insulator or the support member is present between the first current sensor and the first bus bar.

Description

[Technical Field]

[0001] The present invention relates to a coreless current sensor module, a current sensor module, and a power module. [Background technology]

[0002] Patent Document 1 describes providing a sensor element at a position facing a housing in which a bus bar is embedded. Patent Document 2 describes arranging a current sensor above or below a printed circuit board in which a conductor is embedded. Patent Document 3 describes arranging a bus bar between two shield plates filled with molding resin, and a magnetic detection element at the through hole of the bus bar. [Prior art document] [Patent Documents] [Patent Document 1] JP 2019-70563 A [Patent Document 2] International Publication No. 2023 / 038725 [Patent Document 3] JP 2017-187300 A Summary of the Invention [Problem to be solved by the invention]

[0003] It is desirable to ensure insulation between the current sensor and the bus bar while shortening the distance between the current sensor and the bus bar. [Means for solving the problem]

[0004] A coreless current sensor module according to one aspect of the present invention may include a support member and a first current sensor mounted on a first surface of the support member and having at least one magnetoelectric transducer that outputs a signal corresponding to the magnitude of a magnetic field. The coreless current sensor module may include an insulator that at least surrounds the first current sensor with a gap therebetween when viewed from a first direction intersecting the first surface and at least partially overlaps the first current sensor when viewed from a second direction along the first surface. The coreless current sensor module may include a first bus bar through which a current flows that generates a magnetic field detected by the first current sensor. At least one of the insulator and the support member may be present between the first current sensor and the first bus bar.

[0005] The support member may be a substrate, the first bus bar may be disposed with a gap between the support member and the substrate, and the insulator may be present between the first current sensor and the first bus bar.

[0006] In the coreless current sensor module, a direction along the substrate that intersects the second direction is defined as a third direction, and the first bus bar may at least partially overlap with the first current sensor when viewed from the first direction or the third direction.

[0007] In any of the coreless current sensor modules, the first bus bar may include a pair of first conductor portions extending in the second direction and arranged opposite to each other across the first current sensor in a third direction along the substrate that intersects with the second direction. The insulator may be arranged at least between each of the pair of first conductor portions and the first current sensor, with a gap between them and the first current sensor.

[0008] In any of the coreless current sensor modules, the first bus bar may include a pair of first connecting portions connected to both ends of the pair of first conductor portions, respectively. The first current sensor may be surrounded by the pair of first conductor portions and the pair of first connecting portions when viewed from the first direction.

[0009] In any of the coreless current sensor modules, the insulator may further be disposed between the substrate and each of the pair of first conductor portions.

[0010] In any of the coreless current sensor modules, the first bus bar and the insulator may be in contact with each other.

[0011] In any of the coreless current sensor modules, the insulator may be further arranged to cover a surface of the first current sensor opposite to the surface mounted on the substrate, with a gap between the insulator and the first current sensor in the first direction.

[0012] In any of the coreless current sensor modules, the insulator may have an opening that exposes a surface of the first current sensor opposite to a surface that is mounted on the substrate.

[0013] In any of the coreless current sensor modules, the first bus bar may include a pair of first conductor portions extending along the substrate in a third direction intersecting the second direction and arranged opposite to each other in the first direction with the first current sensor therebetween. The insulator may further be arranged between one of the pair of first conductor portions and the first current sensor with a gap therebetween.

[0014] In any of the coreless current sensor modules, the first bus bar may include a pair of first connecting portions connected to both ends of the pair of first conductor portions, respectively. The first current sensor may be surrounded by the pair of first conductor portions and the pair of first connecting portions when viewed from the second direction.

[0015] Any of the coreless current sensor modules may include a second current sensor mounted on the first surface of the substrate and having at least one magnetoelectric transducer that outputs a signal corresponding to the magnitude of a magnetic field. The coreless current sensor module may include a second bus bar spaced apart from the substrate and through which a current flows that generates a magnetic field detected by the second current sensor. The insulator may further surround the second current sensor with a space therebetween when viewed from the first direction and at least partially overlap the second current sensor when viewed from the second direction.

[0016] In any of the coreless current sensor modules, the first bus bar may include a pair of first conductor portions extending in the second direction and arranged opposite each other across the first current sensor in a third direction intersecting the second direction along the first surface. The second bus bar may include a pair of second conductor portions extending in the second direction and arranged opposite each other across the second current sensor in the third direction. The insulator may be arranged at least between each of the pair of first conductor portions and the first current sensor, with a gap between them, and between each of the pair of second conductor portions and the second current sensor, with a gap between them.

[0017] In any of the coreless current sensor modules, the first bus bar may include a pair of first connecting portions connected to both ends of the pair of first conductor portions, respectively. The second bus bar may include a pair of second connecting portions connected to both ends of the pair of second conductor portions, respectively. The first current sensor may be surrounded by the pair of first conductor portions and the pair of first connecting portions when viewed from the first direction. The second current sensor may be surrounded by the pair of second conductor portions and the pair of second connecting portions when viewed from the first direction.

[0018] In any of the coreless current sensor modules, the first current sensor and the second current sensor may be arranged side by side in a third direction that intersects with the second direction along the substrate.

[0019] In any of the coreless current sensor modules, the portion of the insulator positioned between the first bus bar and the second bus bar may include a portion having a first thickness from the first surface of the substrate and a portion having a second thickness from the first surface of the substrate that is different from the first thickness.

[0020] In any of the coreless current sensor modules, the insulator may include a first insulator surrounding the first current sensor with a gap when viewed from the first direction and at least partially overlapping with the first current sensor when viewed from the second direction, and a second insulator surrounding the second current sensor with a gap when viewed from the first direction and at least partially overlapping with the second current sensor when viewed from the second direction. There may be at least a partial gap between the first insulator and the second insulator when viewed from the first direction.

[0021] In any of the coreless current sensor modules, the distance between the first current sensor and the first bus bar may be greater than 0 mm and less than or equal to 5 mm.

[0022] A coreless current sensor module according to one aspect of the present invention may include a substrate and a first current sensor mounted on a first surface of the substrate and having at least one magnetoelectric transducer that outputs a signal corresponding to the magnitude of a magnetic field. The coreless current sensor module may include a pair of first conductor portions extending in a second direction along the substrate or a third direction along the substrate intersecting the second direction and arranged opposite each other across the first current sensor when viewed in a first direction intersecting the substrate or from the second direction. The coreless current sensor module may also include a first bus bar spaced apart from the substrate and through which a current flows that generates a magnetic field detected by the first current sensor. The coreless current sensor module may also include an insulator spaced apart from the first current sensor between the pair of first conductor portions and the first current sensor when viewed from the first direction or the second direction.

[0023] In the coreless current sensor module, the first bus bar may include a pair of first connecting portions connected to both ends of the pair of first conductor portions, respectively. The first current sensor may be surrounded by the pair of first conductor portions and the pair of first connecting portions when viewed from the first direction or the second direction.

[0024] In any of the coreless current sensor modules, the pair of first conductor portions and the first current sensor may at least partially overlap when viewed from the third direction.

[0025] In any of the coreless current sensor modules, the insulator may surround at least the first current sensor in the first direction or when viewed from the first direction with a gap therebetween.

[0026] In any of the coreless current sensor modules, the support member may have a first portion integral with the insulator.

[0027] In any of the coreless current sensor modules, the support member may further have a second portion including a substrate on which the first current sensor is mounted.

[0028] In any of the coreless current sensor modules, the second portion of the support member may be fixed to the first portion of the support member via an adhesive layer.

[0029] In any of the coreless current sensor modules, the insulator may be arranged on the first surface of the support member so as to surround the substrate and the first current sensor while being spaced apart from the first current sensor when viewed from the first direction.

[0030] In any of the coreless current sensor modules, the first bus bar may include a pair of first conductor portions extending in the second direction and arranged along the first surface to face each other across the first current sensor in a third direction intersecting the second direction, and a pair of first connecting portions connected to both ends of the pair of first conductor portions, respectively. At least a portion of the support member and the insulator may be disposed in a through hole of the first bus bar surrounded by the pair of first conductor portions and the pair of first connecting portions.

[0031] In any of the coreless current sensor modules, the first current sensor may be positioned at a position intersected by a plane passing through the centers of the pair of first conductor portions and the pair of first connecting portions in the first direction.

[0032] In any of the coreless current sensor modules, the support member and the insulator may be made of resin.

[0033] A power module according to one aspect of the present invention may include the coreless current sensor module, an input terminal unit, an output terminal unit including the first bus bar, and a plurality of power semiconductors that convert direct current input from the input terminal unit into alternating current and output the alternating current to the output terminal unit.

[0034] A current sensor module according to one aspect of the present invention may include a substrate and a first current sensor mounted on a first surface of the substrate and having at least one magnetoelectric transducer that outputs a signal corresponding to the magnitude of a magnetic field. The current sensor module may include an insulator that at least surrounds the first current sensor with a gap when viewed from a first direction intersecting the first surface and at least partially overlaps the first current sensor when viewed from a second direction along the first surface. The current sensor module may include a first bus bar that is spaced apart from the substrate and through which a current flows that generates a magnetic field detected by the first current sensor. The current sensor module may include a magnetic flux collector that is spaced apart from the first current sensor in the first direction and faces the surface of the first current sensor opposite the surface that is mounted on the substrate. The insulator may be present between the first current sensor and the first bus bar.

[0035] A current sensor module according to one aspect of the present invention may include a substrate and a first current sensor mounted on a first surface of the substrate and having at least one magnetoelectric transducer that outputs a signal corresponding to the magnitude of a magnetic field. The current sensor module may include an insulator that at least surrounds the first current sensor with a gap when viewed from a first direction intersecting the first surface and at least partially overlaps the first current sensor when viewed from a second direction along the first surface. The current sensor module may include a first bus bar spaced apart from the substrate and through which a current flows that generates a magnetic field detected by the first current sensor. The current sensor module may include a second current sensor mounted on the first surface of the substrate and having at least one magnetoelectric transducer that outputs a signal corresponding to the magnitude of the magnetic field. The current sensor module may include a second bus bar spaced apart from the substrate and through which a current flows that generates a magnetic field detected by the second current sensor. The current sensor module may include a wall portion including a magnetic material protruding from the first surface of the substrate between the first bus bar and the second bus bar. The insulator may be present between the first current sensor and the first bus bar, and may further surround the second current sensor with a gap therebetween when viewed from the first direction, and may at least partially overlap the second current sensor when viewed from the second direction.

[0036] The above summary of the invention does not list all of the features of the present invention, and subcombinations of these features may also be inventions. [Brief explanation of the drawings]

[0037] [Figure 1] 1 is an external perspective view of a power module according to a first embodiment. FIG. [Figure 2] FIG. 2 is an external perspective view of the power module according to the first embodiment with the substrate removed. [Figure 3] FIG. 3 is an enlarged view of a current sensor portion shown in FIG. 2. [Figure 4]1 is an external perspective view of the power module according to the first embodiment with the substrate and the insulator removed. FIG. [Figure 5] 5 is a plan view of the power module shown in FIG. 4 with the substrate and insulator removed, viewed from the positive side in the z-axis direction. [Figure 6] 3 is a schematic cross-sectional view of a portion including a current sensor when the current sensor module according to the first embodiment is viewed from the y-axis direction. FIG. [Figure 7] 10 is a schematic cross-sectional view of a portion including a current sensor 140 of a current sensor module according to a first modified example, as viewed from the y-axis direction. FIG. [Figure 8] 10 is a schematic cross-sectional view of a portion including a current sensor 140 of a current sensor module according to a second modified example, as viewed from the y-axis direction. FIG. [Figure 9] 11 is a schematic cross-sectional view of a portion including a current sensor 140 of a current sensor module according to a third modified example, as viewed from the y-axis direction. FIG. [Figure 10] FIG. 10 is an external perspective view of a power module according to a second embodiment. [Figure 11] FIG. 11 is an external perspective view of the power module shown in FIG. 10 with an insulator removed. [Figure 12] FIG. 10 is a side view of the current sensor module according to the second embodiment, as viewed from the positive y-axis direction. [Figure 13] FIG. 10 is an external perspective view of a power module according to a third embodiment. [Figure 14] FIG. 14 is an external perspective view showing a part of the internal structure of the power module shown in FIG. 13. [Figure 15] FIG. 14 is an external perspective view of the power module shown in FIG. 13 with the substrate removed. [Figure 16] FIG. 16 is an enlarged view of a current sensor portion of FIG. 15. [Figure 17] FIG. 10 is a diagram showing a state in which a substrate on which a current sensor is mounted is placed on an insulator. [Figure 18A] FIG. 10 is a plan view of a current sensor module according to a fourth embodiment. [Figure 18B] 18C is a cross-sectional view taken along the line AA in FIG. 18B. [Figure 19] 18B is a diagram showing another board electrically connected to the board included in the current sensor module shown in FIG. 18A, which is arranged above the bus bar. FIG. [Figure 20] FIG. 13 is a cross-sectional view of a current sensor module according to a first modified example of the fourth embodiment. [Figure 21] FIG. 13 is a cross-sectional view of a current sensor module according to a second modified example of the fourth embodiment. [Figure 22] FIG. 13 is a cross-sectional view of a current sensor module according to a third modified example of the fourth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0038] The present invention will be described below through embodiments of the invention, but the following embodiments do not limit the scope of the invention according to the claims. Furthermore, not all of the combinations of features described in the embodiments are necessarily essential to the solution of the invention.

[0039] FIG. 1 is an external perspective view of a power module 10 according to a first embodiment. The power module 10 includes a current sensor module 100 and a power semiconductor unit 200. The power module 10 may be a three-phase inverter that converts direct current into three-phase alternating current. The three-phase alternating current output from the power module 10 may be supplied to a motor that is a three-phase alternating current motor. The motor may be a power source for a mobile object. The power module 10 may be mounted on a mobile object such as a hybrid vehicle or an electric vehicle. The power module 10 may also be a single-phase inverter that converts direct current into alternating current, depending on the application.

[0040] 1, the coordinates are defined as the x-axis direction parallel to the paper surface and diagonally downward to the right, the y-axis direction parallel to the paper surface and diagonally upward to the right, and the z-axis direction parallel to the paper surface and diagonally upward from the bottom. The z-axis direction is an example of the first direction, the y-axis direction is an example of the second direction, and the x-axis direction is an example of the third direction.

[0041] The power semiconductor unit 200 includes a plurality of power semiconductors housed in an insulating housing 202, an input terminal section 220 electrically connected to each of the plurality of power semiconductors and including a plurality of input terminals exposed from the housing 202, and a plurality of bus bars 120a, 120b, and 120c electrically connected to each of the plurality of power semiconductors. The power semiconductor unit 200 includes, for example, six power semiconductors, an input terminal section 220 including six input terminals electrically connected to each of the six power semiconductors, and three bus bars 120a, 120b, and 120c. The power semiconductors may be, for example, MOSFETs or IGBTs. Hereinafter, the plurality of bus bars 120a, 120b, and 120c may be collectively referred to as bus bars 120. The bus bars 120 are an example of a first bus bar and a second bus bar. The input terminal section 220 is an example of an input terminal section of the power module 10. The bus bars 120 are an example of an output terminal section of the power module 10.

[0042] The current sensor module 100 includes a substrate 150 on which a plurality of current sensors are mounted to measure the currents flowing through the plurality of bus bars 120a, 120b, and 120c, respectively.

[0043] 2 is an external perspective view of the power module 10 with the substrate 150 removed. The current sensor module 100 has multiple current sensors 140a, 140b, and 140c. The multiple current sensors 140a, 140b, and 140c output signals according to the magnitude of the magnetic field. Hereinafter, the multiple current sensors 140a, 140b, and 140c may be collectively referred to as current sensor 140. The multiple current sensors 140a, 140b, and 140c are mounted on the surface of the substrate 150 facing the bus bar 120.

[0044] The current sensor 140 has at least one magnetoelectric transducer that outputs a signal corresponding to the magnitude of a magnetic field. The current sensor 140 may be a coreless current sensor, and the current sensor module 100 may be a coreless current sensor module. In this specification, a coreless current sensor is a sensor that has at least one magnetoelectric transducer that outputs a signal corresponding to the magnitude of a magnetic field flowing through a conductor, and does not have a magnetic core arranged around the magnetoelectric transducer or surrounding the current conductor. The magnetic core serves to amplify the magnetic flux density penetrating the magnetoelectric transducer.

[0045] The current sensor 140 may have, for example, two magnetoelectric conversion elements. The current sensor module 100 has a signal processing circuit. For example, the signal processing circuit reduces noise components contained in the output signals of the two magnetoelectric conversion elements based on the difference between the output signals of the two magnetoelectric conversion elements, cancels out noise components due to a common external magnetic field, amplifies the output signals of the two magnetoelectric conversion elements with reduced noise components, calculates the current value of the current flowing through the busbar 12- based on the amplified output signals, and outputs an output signal indicating the current value. The magnetoelectric conversion elements may be, for example, Hall elements utilizing the Hall effect with a sensitivity axis in a direction intersecting the magnetic sensing surface.

[0046] Current sensor 140 detects a magnetic field generated by a current flowing through bus bar 120. Therefore, current sensor 140 is preferably placed adjacent to bus bar 120 in order to accurately measure the current flowing through bus bar 120. However, because a high voltage of several hundred volts or more may be applied to bus bar 120, if current sensor 140 is placed too close to bus bar 120, insulation between bus bar 120 and current sensor 140 may not be ensured.

[0047] Therefore, the power module 10 according to this embodiment includes an insulator 130 disposed at least between the bus bar 120 and the current sensor 140. This ensures insulation between the bus bar 120 and the current sensor 140 while reducing the distance between the current sensor 140 and the bus bar 120.

[0048] Here, the insulator 130 may be, for example, an epoxy-based thermosetting resin with silica added, or a thermoplastic resin such as a liquid crystal polymer. An insulator 130 made of such a material may expand and contract due to temperature changes. Therefore, if the insulator 130 and the current sensor 140 are closely attached, stress associated with the expansion and contraction of the insulator 130 due to temperature changes may be applied to the current sensor 140, which may affect the current measurement by the current sensor 140. The application of such stress may, for example, result in a measurement error in the output value of the current sensor 140.

[0049] Therefore, in order to prevent stress from being applied to the current sensor 140 due to expansion and contraction of the insulator 130 caused by temperature changes, the insulator 130 is arranged with a gap 132 between it and the current sensor 140 (current sensor 140b), as shown in Fig. 3. The insulator 130 at least surrounds the current sensor 140 with the gap 132 in place, and at least a portion of the insulator 130 overlaps with the current sensor 140 when viewed from the x-axis direction or the y-axis direction.

[0050] 4 is an external perspective view of the power module 10 with the substrate 150 and insulator 130 removed. The support plate 110 supports the bus bars 120a, 120b, and 120c. The bus bars 120a, 120b, and 120c have through holes 125a, 125b, and 125c, respectively, and current sensors 140a, 140b, and 140c are disposed in the through holes 125a, 125b, and 125c, respectively. The distance between the current sensors 140a, 140b, and 140c and the bus bars 120a, 120b, and 120c may be greater than 0 mm and equal to or less than 5 mm.

[0051] 5 is a plan view of the power module 10 shown in FIG. 4 with the substrate 150 and the insulator 130 removed, viewed from the positive side in the z-axis direction. The bus bars 120a, 120b, and 120c extend in the y-axis direction and include a pair of conductor portions 121a, 121b, and 121c that are arranged opposite each other in the x-axis direction, sandwiching the current sensors 140a, 140b, and 140c therebetween, and a pair of connecting portions 122a, 122b, and 122c that are connected to both ends of the pair of conductor portions 121a, 121b, and 121c, respectively. The pair of conductor portions 121a, 121b, and 121c are examples of a pair of first conductor portions and a pair of second conductor portions. The pair of connecting portions 122a, 122b, and 122c are examples of a pair of first connecting portions and a pair of second connecting portions. When viewed from the z-axis direction, the current sensors 140a, 140b, and 140c are surrounded by pairs of conductor portions 121a, 121b, and 121c and pairs of connecting portions 122a, 122b, and 122c.

[0052] FIG. 6 is a schematic cross-sectional view of a portion including the current sensor 140 when the current sensor module 100 is viewed from the y-axis direction.

[0053] Current sensors 140a, 140b, and 140c are arranged at intervals in the x-axis direction on surface 150a of substrate 150 facing support plate 110. Surface 150a is an example of a first surface. Support plate 110 is arranged facing surface 150a of substrate 150 at an interval in the z-axis direction. Bus bars 120a, 120b, and 120c extending in the y-axis direction are arranged on surface 110a of support plate 110 facing substrate 150 so as to surround current sensors 140a, 140b, and 140c when viewed from the z-axis direction. Bus bars 120a, 120b, and 120c at least partially overlap with current sensors 140a, 140b, and 140c when viewed from the x-axis or y-axis direction. Bus bars 120a, 120b, and 120c are spaced apart from substrate 150 in the z-axis direction, and currents flow through them to generate magnetic fields that are detected by current sensors 140a, 140b, and 140c.

[0054] Between the substrate 150 and the support plate 110, the insulator 130 is disposed with a gap 132 between it and the current sensors 140a, 140b, and 140c. The insulator 130 is in contact with the bus bars 120a, 120b, and 120c. On the other hand, the insulator 130 is not in contact with the current sensors 140a, 140b, and 140c. The insulator 130 is disposed at least between each of the pairs of conductor portions 121a, 121b, and 121c and the current sensors 140a, 140b, and 140c with a gap 132 between them. When viewed from the z-axis direction, the insulator 130 at least surrounds the current sensors 140a, 140b, and 140c with a gap 132 therebetween, and when viewed from the x-axis direction or the y-axis direction, the insulator 130 at least partially overlaps the current sensors 140a, 140b, and 140c. The insulator 130 is further disposed in the space between the substrate 150 and each of the pair of conductor portions 121a, 121b, and 121c. The insulator is further disposed to cover the surfaces 141a, 141b, and 141c of the current sensors 140a, 140b, and 140c opposite the surface 150a that is mounted on the substrate 150, with a gap between the insulator 130 and the current sensors 140a, 140b, and 140c in the z-axis direction.

[0055] The bus bars 120 are arranged at intervals in the x-axis direction on the support plate 110, and furthermore, an insulator 130 having an opening or groove formed in a portion where the current sensor 140 will be arranged is arranged on the bus bars 120 and the support plate 110. Thereafter, the substrate 150 on which the current sensor 140 is mounted is arranged on the insulator 130 so that the current sensor 140 fits into the opening or groove. In this way, the current sensor module 100 may be configured.

[0056] As described above, according to the current sensor module 100 of the first embodiment, by providing the insulator 130 between the current sensor 140 and the bus bar 120, it is possible to shorten the distance between the current sensor 140 and the bus bar 120 while ensuring insulation between the bus bar 120 and the current sensor 140. Furthermore, since there is a gap between the insulator 130 and the current sensor 140, it is possible to prevent stress caused by expansion or contraction of the insulator 130 due to temperature changes caused by changes in the environment around the power module 10 or the application of a large current to the bus bar from being transmitted to the current sensor 140, and it is possible to prevent the stress from affecting the measurements of the current sensor 140.

[0057] FIG. 7 is a schematic cross-sectional view of a portion of the current sensor module 100 according to the first modification, including the current sensor 140, as viewed from the y-axis direction. The current sensor module 100 shown in FIG. 7 differs from the current sensor module 100 shown in FIG. 6 in that the insulator 130 is not disposed to cover the surfaces 141a, 141b, and 141c of the current sensors 140a, 140b, and 140c opposite the surface 150a of the current sensors 140a, 140b, and 140c mounted on the substrate 150, with a gap between the insulator 130 and the current sensors 140a, 140b, and 140c in the z-axis direction. That is, the insulator 130 has openings that expose the surfaces 141a, 141b, and 141c of the current sensors 140a, 140b, and 140c opposite the surface of the current sensors 140a, 140b, and 140c mounted on the substrate 150. The insulator 130 may have gaps between the bus bars 120. That is, the insulator 130 may include a first insulator that surrounds the current sensor 120a with a gap when viewed from the z-axis direction and at least partially overlaps with the current sensor 120a when viewed from the x-axis direction; a second insulator that surrounds the current sensor 120b with a gap when viewed from the z-axis direction and at least partially overlaps with the current sensor 120b when viewed from the x-axis direction; and a third insulator that surrounds the current sensor 120c with a gap when viewed from the z-axis direction and at least partially overlaps with the current sensor 120c when viewed from the x-axis direction. When viewed from the z-axis direction, there may be at least partial gaps between the first insulator and the second insulator, and between the second insulator and the third insulator. The first insulator and the second insulator, and the second insulator and the third insulator may be spaced apart. The first insulator, the second insulator, and the third insulator may be separate insulators. At least a portion of the first insulator, the second insulator, and the third insulator may be connected to each other. The first insulator, the second insulator, and the third insulator may be integrally formed.

[0058] 8 is a schematic cross-sectional view of a portion of current sensor module 100 according to the second modification, including current sensor 140, as viewed from the y-axis direction. Current sensor module 100 according to the second modification differs from current sensor module 100 shown in FIG. 6 in that steps 131 are provided in insulator 130 between busbar 120a and busbar 120b and between busbar 120b and busbar 120c. That is, in current sensor module 100 according to the second modification, the portions of insulator 130 disposed between busbar 120a and busbar 120b and between busbar 120b and busbar 120c include a portion h1 having a first thickness from surface 150a of substrate 150 and a portion h2 having a second thickness from surface 150a of substrate 150 that is different from the first thickness h1. This allows the creepage distance between busbar 120a and busbar 120b, and between busbar 120b and busbar 120c to be increased, thereby ensuring better insulation between busbar 120a and busbar 120b, and between busbar 120b and busbar 120c.

[0059] Furthermore, the current sensor module 100 according to the second modification differs from the current sensor module 100 shown in FIG. 6 in that it further includes wall portions 160, each including a magnetic material protruding from the surface 150a of the substrate 150, between the busbars 120a and 120b and between the busbars 120b and 120c. The wall portions 160 may be formed of a magnetic shield plate including a soft magnetic material containing an iron-group element such as Fe, Co, or Ni. That is, in this specification, the current sensor module 100 according to the second modification is not a coreless current sensor module, and the current sensor 140 in the current sensor module 100 is not a coreless current sensor. This configuration makes the current sensor 140 less susceptible to the influence of magnetic fields generated by currents flowing through busbars 120 other than the busbar 120 through which the current to be measured flows.

[0060] 9 is a schematic cross-sectional view of a portion of the current sensor module 100 according to the third modification, including the current sensor 140, as viewed from the y-axis direction. The current sensor module 100 according to the third modification differs from the current sensor module 100 shown in FIG. 6 in that magnetic flux collectors 170a, 170b, and 170c are provided at intervals in the z-axis direction from the current sensors 140a, 140b, and 140c, at positions facing surfaces 141a, 141b, and 141c opposite to surface 150a mounted on substrate 150 of the current sensors 140a, 140b, and 140c. That is, in this specification, the current sensor module 100 according to the second modification is not a coreless current sensor module, and the current sensor 140 in the current sensor module 100 is not a coreless current sensor. The magnetic flux collectors 170a, 170b, and 170c may be made of a ferrite substrate, a sheet in which magnetic powder such as ferrite powder is mixed with resin, or a magnetic alloy such as an Fe-Si alloy, an Fe-based or Co-based amorphous alloy, or an ultrafine-crystalline soft magnetic alloy. The provision of the magnetic flux collectors 170a, 170b, and 170c allows the current sensors 140a, 140b, and 140c to more easily detect the magnetic field generated by current flowing through the bus bars 120a, 120b, and 120c. The magnetic flux collectors 170a, 170b, and 170c may be built into the insulator 130 or may be provided between the insulator 130 and the support plate 110. As shown in FIG. 7, when the insulator 130 has openings exposing the surfaces 141a, 141b, 141c opposite to the surfaces of the current sensors 140a, 140b, 140c mounted on the substrate 150, magnetic collecting plates 170a, 170b, 170c may be provided at positions on the support plate 110 facing the surfaces 141a, 141b, 141c of the current sensors 140a, 140b, 140c.

[0061] 10 is an external perspective view of the power module 10 according to the second embodiment. In the power module 10 according to the second embodiment, the shapes of the bus bars 120a, 120b, and 120c are different from the shapes of the bus bars 120a, 120b, and 120c of the power module 10 according to the first embodiment. Furthermore, in the power module 10 according to the second embodiment, the positional relationship between the bus bars 120a, 120b, and 120c and the current sensors 140a, 140b, and 140c is different from the positional relationship between the bus bars 120a, 120b, and 120c and the current sensors 140a, 140b, and 140c of the power module 10 according to the first embodiment.

[0062] In the power module 10 according to the second embodiment, insulators 130a, 130b, and 130c are provided on a substrate 150 so as to cover current sensors 140a, 140b, and 140c (not shown in FIG. 10).

[0063] The current sensor module 100 and the power semiconductor unit 200 are housed within an outer frame 20 .

[0064] Fig. 11 is an external perspective view of the power module 10 with the insulators 130a, 130b, and 130c shown in Fig. 10 removed. That is, it is an external perspective view of the power module 10 with the current sensors 140a, 140b, and 140c arranged at intervals along the x-axis direction on the substrate 150 exposed.

[0065] 12 is a side view of the current sensor module 100 according to the second embodiment as viewed from the positive y-axis direction. The bus bars 120a, 120b, and 120c extend in the z-axis direction and include pairs of conductor portions 121a, 121b, and 121c that face each other in the x-axis direction, sandwiching the current sensors 140a, 140b, and 140c therebetween. Furthermore, the bus bars 120a, 120b, and 120c each include a pair of connecting portions 122a, 122b, and 122c that are connected to both ends of the pair of conductor portions 121a, 121b, and 121c, respectively. When viewed from the y-axis direction, the current sensors 140a, 140b, and 140c are surrounded by the pair of conductor portions 121a, 121b, and 121c and the pair of connecting portions 122a, 122b, and 122c. When viewed from the x-axis direction, the pairs of conductor portions 121a, 121b, and 121c at least partially overlap with the current sensors 140a, 140b, and 140c. The distance between the current sensors 140a, 140b, and 140c and the bus bars 120a, 120b, and 120c may be greater than 0 mm and equal to or less than 5 mm.

[0066] When viewed from the z-axis direction, the insulators 130a, 130b, and 130c at least surround the current sensors 140a, 140b, and 140c with gaps 132a, 132b, and 132c left therebetween, and when viewed from the x-axis or y-axis direction, they at least partially overlap the current sensors 140a, 140b, and 140c.

[0067] The insulators 130a, 130b, and 130c are not in contact with the current sensors 140a, 140b, and 140c. The insulators 130a, 130b, and 130c are disposed between the pairs of conductor portions 121a, 121b, and 121c and the current sensors 140a, 140b, and 140c, with at least gaps 132a, 132b, and 132c between the insulators and the current sensors 140a, 140b, and 140c.

[0068] As described above, according to the current sensor module 100 of the second embodiment, by providing the insulator 130 between the current sensor 140 and the bus bar 120, it is possible to shorten the distance between the current sensor 140 and the bus bar 120 while ensuring insulation between the bus bar 120 and the current sensor 140. Furthermore, since there is a gap between the insulator 130 and the current sensor 140, it is possible to prevent stress caused by expansion or contraction of the insulator 130 due to temperature changes caused by changes in the environment around the power module 10 from being transmitted to the current sensor 140, and it is possible to prevent the stress from affecting the measurement by the current sensor 140.

[0069] Fig. 13 is an external perspective view of a power module 10 according to a third embodiment. Fig. 14 is an external perspective view that visualizes a part of the internal structure of the power module 10 shown in Fig. 13. The power module 10 according to the third embodiment differs from the power module 10 according to the first embodiment in that the substrate 150 on which the current sensors 140a, 140b, and 140c are mounted also serves as the substrate on which the power semiconductors that constitute the power semiconductor unit 200 are mounted.

[0070] FIG. 15 is an external perspective view of the power module 10 with the substrate 150 shown in FIG. 13 removed. FIG. 16 is an enlarged view of the current sensor 140b portion of FIG. 15. The insulator 130 may be part of a sealing portion made of a mold resin that seals each circuit constituting the power module 10, including circuits such as power semiconductors that constitute the power semiconductor unit 200. Grooves larger than the width of the current sensors 140a, 140b, and 140c are formed in the insulator 130 at positions where the current sensors 140a, 140b, and 140c are to be disposed. As a result, gaps 132a, 132b, and 132c are formed between the insulator 130 and the current sensors 140a, 140b, and 140c.

[0071] 17 shows how a substrate 150 with current sensors 140a, 140b, and 140c mounted thereon is placed on an insulator 130. Openings 134a, 134b, and 134c that are larger than the current sensors 140a, 140b, and 140c are provided in the insulator 130 at the positions where the current sensors 140a, 140b, and 140c will be disposed. Then, the substrate 150 with the current sensors 140a, 140b, and 140c mounted thereon is placed and fixed on the insulator 130 so that the current sensors 140a, 140b, and 140c fit within the openings 134a, 134b, and 134c.

[0072] In the third embodiment, an example has been described in which the control board constituting the current sensor module 100 and the control board constituting the power semiconductor unit 200 are configured on a single substrate 150 within the insulator 130 constituting the sealing portion. However, separate substrates may be disposed within the insulator 130 for the control board constituting the current sensor module 100 and the control board constituting the power semiconductor unit 200.

[0073] Fig. 18A shows a plan view of the current sensor module 100 according to the fourth embodiment. Fig. 18B is a cross-sectional view taken along line AA shown in Fig. 18B. For example, the power module 10 shown in Fig. 1 may include the current sensor module 100 according to the fourth embodiment.

[0074] The current sensor module 100 includes a bus bar 120 and a current sensor 140 that measures the current flowing through the bus bar 120. The current sensor 140 may be a coreless current sensor, and the current sensor module 100 may be a coreless current sensor module. The current sensor module 100 may include multiple bus bars 120 and current sensors 140 that measure the current flowing through the multiple bus bars 120.

[0075] The busbar 120 extends in the y-axis direction and includes a pair of conductor portions 121 arranged opposite each other in the x-axis direction with the current sensor 140 sandwiched therebetween, and a pair of connecting portions 122 connected to both ends of the pair of conductor portions 121. The pair of conductor portions 121 are an example of a pair of first conductor portions. The pair of connecting portions 122 are an example of a pair of first connecting portions. The current sensor 140 has a through hole 125 surrounded by the pair of conductor portions 121 and the pair of connecting portions 122 when viewed from the z-axis direction.

[0076] The current sensor module 100 further includes a support member 180 that supports the current sensor 140. The support member 180 has a base 182 and an enclosure wall 184 that is arranged to surround a surface 180a of the base 182. The base 182 and the enclosure wall 184 may be integrally formed. The support member 180 may be made of an insulator. The insulator may be a resin, for example, an epoxy-based thermosetting resin with silica added, or a thermoplastic resin such as a liquid crystal polymer. The enclosure wall 184 is an example of a first portion of the support member 180.

[0077] The substrate 155 is provided on the surface 180a of the base 182 via an adhesive layer 158, and the current sensor 140 is provided on the substrate 155. The adhesive layer 158 may be a die attach film. The surrounding wall 184 is provided on the surface 180a of the base 182 so as to surround the substrate 155 and the current sensor 140. The base 180 may be fixed to an outer frame 20 that houses the current sensor module 100 as shown in FIG. 11 . The base 182 and the substrate 155 are an example of a second part of the support member 180.

[0078] The base 182 may be used to adjust the height of the current sensor 140. To accurately measure the current flowing through the busbar 140, the current sensor 140 is preferably disposed at a position intersecting a plane passing through the centers of the pair of first conductor portions 121 and the pair of first connecting portions 122 in the z-axis direction. The magnetically sensitive surface of the current sensor 140 may be located on a plane passing through the centers of the pair of first conductor portions 121 and the pair of first connecting portions 122 in the z-axis direction. To more accurately measure the current flowing through the busbar 140, the magnetically sensitive surface of the current sensor 140 is more preferably disposed in a central portion of the through hole 125 of the busbar 120. For example, when the current sensor 140 has a Hall element, which is a vertical magnetic field detection element, as a magnetoelectric conversion element, the magnetic flux density in the z-axis direction generated by the current flowing through the pair of conductor portions 121 is higher in the central portion of the through hole 125 of the busbar 120. Therefore, it is preferable that the magnetic sensing surface of current sensor 120 be disposed in the center of through-hole 125 of busbar 120 .

[0079] Surrounding wall 184 is disposed on surface 180a of base 182, as viewed in the z-axis direction, so as to surround substrate 155 and current sensor 140, with a gap between current sensor 140. The presence of surrounding wall 184, which is an insulator, between bus bar 120 and current sensor 140 ensures insulation between bus bar 120 and current sensor 140. The presence of surrounding wall 184 ensures insulation between bus bar 120 and current sensor 140 while reducing the distance between current sensor 140 and bus bar 120.

[0080] 19 shows a state in which a board 150 electrically connected to a board 155 included in the current sensor module 100 shown in Fig. 18A is disposed above the bus bar 120. The board 155 may be electrically connected via a wire harness 152 to the board 150, which is a main board on which a control circuit for controlling the power module 10 is mounted.

[0081] 20 is a cross-sectional view of a current sensor module 100 according to a first modified example of the fourth embodiment. The current sensor module 100 according to the first modified example differs from the current sensor module 100 shown in FIG. 18B in that the base 182 has a protruding portion 182a for supporting the bus bar 120.

[0082] 21 is a cross-sectional view of a current sensor module 100 according to a second modified example of the fourth embodiment. The current sensor module 100 according to the first modified example differs from the current sensor module 100 of the fourth embodiment in the structure of the support member 180.

[0083] In the current sensor module 100 according to the second modification, the base 182 is hollow. The support member 180 forms a box-shaped structure by the base 182 and a surrounding wall 184. The support member 180 has a shelf portion 185 on the inner wall portion for supporting the substrate 155. The substrate 155 is fixed to the shelf portion 185 via an adhesive layer 158.

[0084] 22 is a cross-sectional view of a current sensor module 100 according to a third modified example of the fourth embodiment. The current sensor module 100 according to the third modified example differs from the current sensor module 100 of the fourth embodiment in the structure of the support member 180.

[0085] In the third modified example, the support member 180 is fixed via an adhesive layer 23 onto a protruding portion 22 on the bottom surface of the outer frame 20, which is a housing that houses the power module 10. The protruding portion 22 protrudes into the through-hole 125 of the bus bar 100. The adhesive layer 23 may be a die attach film. The support member 180 has a base 182 and a surrounding wall 184, similar to the power module 10 of the fourth embodiment. However, due to the presence of the protruding portion 22, the thickness of the base 182 may be thinner than that of the base 182 of the fourth embodiment. The substrate 155 on which the current sensor 140 is mounted may be fixed to the base 182 via an adhesive layer 158. The support member 180 may be provided on a heat sink instead of the outer frame 20. The support member 180 may be integrally formed with the heat sink. If the support member 180 is provided on the heat sink, an insulating member may be provided between the heat sink and the bus bar 120.

[0086] As described above, according to the current sensor modules 100 according to the first to third modifications of the fourth embodiment, similarly to the current sensor module 100 of the fourth embodiment, the presence of the surrounding wall 184, which is an insulator, between the bus bar 120 and the current sensor 140 ensures insulation between the bus bar 120 and the current sensor 140. The presence of the surrounding wall 184 ensures insulation between the bus bar 120 and the current sensor 140 while reducing the distance between the bus bar 120 and the current sensor 140.

[0087] Although the present invention has been described above using embodiments, the technical scope of the present invention is not limited to the scope described in the above embodiments. It will be apparent to those skilled in the art that various modifications and improvements can be made to the above embodiments. It is clear from the claims that such modifications and improvements can also be included within the technical scope of the present invention.

[0088] It should be noted that the execution order of each process, such as operations, procedures, steps, and stages, in the devices, systems, programs, and methods shown in the claims, specifications, and drawings is not specifically stated as "before," "prior to," etc., and that the processes can be performed in any order unless the output of a previous process is used in a subsequent process. Even if the operational flow in the claims, specifications, and drawings is described using "first," "next," etc. for convenience, this does not mean that the processes must be performed in this order. [Explanation of symbols]

[0089] 10 Power Module 20 Outer Frame 100 Current Sensor Module 110 Support plate 110a side 120, 120a, 120b, 120c busbars 121a, 121b, 121c conductor parts 122a, 122b, 122c connection part 125a, 125b, 125c through hole 130, 130a, 130b, 130c Insulator 132, 132a, 132b, 132c gap 134a, 134b, 134c opening 140, 140a, 140b, 140c current sensors 150 boards 150a side 160 Wall 170a, 170b, 170c magnetic collector plate 180 Support member 182 Pedestal 184 Enclosure Wall 200 Power Semiconductor Unit 202 Case 220 Input terminal section

Claims

1. A support member; a first current sensor mounted on a first surface of the support member and having at least one magnetoelectric conversion element that outputs a signal according to the magnitude of a magnetic field; an insulator that at least surrounds the first current sensor with a gap therebetween when viewed from a first direction intersecting the first surface and that at least partially overlaps with the first current sensor when viewed from a second direction along the first surface; a first bus bar through which a current flows that generates a magnetic field detected by the first current sensor; Equipped with The coreless current sensor module, wherein at least one of the insulator and the support member is present between the first current sensor and the first bus bar.

2. the support member is a substrate; the first bus bar is disposed with a gap between it and the substrate, The coreless current sensor module of claim 1 , wherein the insulator is present between the first current sensor and the first bus bar.

3. a direction along the substrate that intersects with the second direction is a third direction; The coreless current sensor module according to claim 2 , wherein the first bus bar at least partially overlaps with the first current sensor when viewed from the first direction or the third direction.

4. the first bus bar extends in the second direction and includes a pair of first conductor portions disposed opposite to each other across the first current sensor in a third direction that intersects with the second direction along the substrate, The coreless current sensor module according to claim 2 , wherein the insulator is disposed at least between each of the pair of first conductor portions and the first current sensor with a gap therebetween.

5. the first bus bar includes a pair of first connecting portions connected to both ends of the pair of first conductor portions, respectively; The coreless current sensor module according to claim 4 , wherein the first current sensor is surrounded by the pair of first conductor portions and the pair of first connecting portions when viewed from the first direction.

6. The coreless current sensor module of claim 4 , wherein the insulator is further disposed between the substrate and each of the pair of first conductor portions.

7. The coreless current sensor module according to claim 2 , wherein the first bus bar and the insulator are in contact with each other.

8. 6. The coreless current sensor module according to claim 5, wherein the insulator is further arranged to cover a surface of the first current sensor opposite to a surface of the first current sensor that is mounted on the substrate, with a gap between the insulator and the first current sensor in the first direction.

9. The coreless current sensor module according to claim 5 , wherein the insulator has an opening exposing a surface of the first current sensor opposite to a surface mounted on the substrate.

10. the first bus bar extends along the substrate in a third direction intersecting the second direction and includes a pair of first conductor portions disposed opposite to each other in the first direction with the first current sensor therebetween; The coreless current sensor module according to claim 2 , wherein the insulator is further disposed between one of the pair of first conductor portions and the first current sensor with a gap therebetween.

11. the first bus bar includes a pair of first connecting portions connected to both ends of the pair of first conductor portions, respectively; 11. The coreless current sensor module according to claim 10, wherein the first current sensor is surrounded by the pair of first conductor portions and the pair of first connecting portions when viewed from the second direction.

12. a second current sensor mounted on the first surface of the substrate and having at least one magnetoelectric conversion element that outputs a signal according to the magnitude of a magnetic field; a second bus bar disposed with a gap between it and the substrate, through which a current flows that generates a magnetic field detected by the second current sensor; Furthermore, 3. The coreless current sensor module of claim 2, wherein the insulator further surrounds the second current sensor with a gap therebetween when viewed from the first direction, and at least partially overlaps the second current sensor when viewed from the second direction.

13. the first bus bar includes a pair of first conductor portions extending in the second direction and arranged opposite to each other across the first current sensor in a third direction intersecting the second direction along the first surface, the second bus bar includes a pair of second conductor portions extending in the second direction and arranged opposite to each other with the second current sensor interposed therebetween in the third direction; Including, 13. The coreless current sensor module of claim 12, wherein the insulator is at least disposed between each of the pair of first conductor portions and the first current sensor with a gap therebetween, and between each of the pair of second conductor portions and the second current sensor with a gap therebetween.

14. the first bus bar includes a pair of first connecting portions connected to both ends of the pair of first conductor portions, respectively; the second bus bar includes a pair of second connecting portions connected to both ends of the pair of second conductor portions, respectively; the first current sensor is surrounded by the pair of first conductor portions and the pair of first connecting portions when viewed from the first direction; The coreless current sensor module according to claim 13 , wherein the second current sensor is surrounded by the pair of second conductor portions and the pair of second connecting portions when viewed from the first direction.

15. The coreless current sensor module of claim 12 , wherein the first current sensor and the second current sensor are arranged side by side in a third direction that intersects with the second direction along the substrate.

16. 13. The coreless current sensor module of claim 12, wherein a portion of the insulator disposed between the first bus bar and the second bus bar includes a portion having a first thickness from the first surface of the substrate and a portion having a second thickness from the first surface of the substrate that is different from the first thickness.

17. The insulator is a first insulator that surrounds the first current sensor with a gap therebetween when viewed from the first direction and at least partially overlaps with the first current sensor when viewed from the second direction; a second insulator that surrounds the second current sensor with a gap therebetween when viewed from the first direction and at least partially overlaps with the second current sensor when viewed from the second direction; and The coreless current sensor module according to claim 12 , wherein a gap is at least partially present between the first insulator and the second insulator when viewed from the first direction.

18. 3. The coreless current sensor module of claim 2, wherein a distance between the first current sensor and the first bus bar is greater than 0 mm and less than or equal to 5 mm.

19. A substrate; a first current sensor mounted on a first surface of the substrate and having at least one magnetoelectric conversion element that outputs a signal according to the magnitude of a magnetic field; a first bus bar extending in a second direction along the substrate or in a third direction along the substrate intersecting the second direction, the first bus bar including a pair of first conductor portions disposed opposite to each other with the first current sensor interposed therebetween when viewed in the first direction intersecting the substrate or from the second direction, the first bus bar being spaced apart from the substrate, and through which a current flows that generates a magnetic field detected by the first current sensor; an insulator disposed between the pair of first conductor portions and the first current sensor with a gap therebetween when viewed from the first direction or the second direction; A coreless current sensor module comprising:

20. the first bus bar includes a pair of first connecting portions connected to both ends of the pair of first conductor portions, respectively; 20. The coreless current sensor module of claim 19, wherein the first current sensor is surrounded by the pair of first conductor portions and the pair of first connecting portions when viewed from the first direction or the second direction.

21. 20. The coreless current sensor module according to claim 19, wherein the pair of first conductor portions and the first current sensor at least partially overlap when viewed from the first direction or the third direction.

22. The coreless current sensor module of claim 19 , wherein the insulator surrounds at least the first current sensor with a gap therebetween when viewed from the first direction.

23. The coreless current sensor module according to claim 1 , wherein the support member has a first portion integrally formed with the insulator.

24. 24. The coreless current sensor module of claim 23, wherein the support member further comprises a second portion including a substrate on which the first current sensor is mounted.

25. 25. The coreless current sensor module of claim 24, wherein the second portion of the support member is fixed to the first portion of the support member via an adhesive layer.

26. a surface of the second portion of the support member that is part of the first surface of the support member; 25. The coreless current sensor module of claim 24, wherein the insulator is disposed on the first surface of the support member so as to surround the second portion and the first current sensor while being spaced apart from the first current sensor when viewed from the first direction.

27. The first bus bar is a pair of first conductor portions extending in the second direction and arranged opposite to each other across the first current sensor in a third direction intersecting the second direction along the first surface; a pair of first connecting portions connected to both ends of the pair of first conductor portions, respectively; 27. The coreless current sensor module of claim 26, wherein at least a portion of the support member and the insulator are disposed within a through hole of the first bus bar surrounded by the pair of first conductor portions and the pair of first connecting portions.

28. 28. The coreless current sensor module of claim 27, wherein the first current sensor is positioned at a position intersected by a plane passing through the centers of the pair of first conductor portions and the pair of first connecting portions in the first direction.

29. The coreless current sensor module according to claim 23 , wherein the support member and the insulator are made of resin.

30. A coreless current sensor module according to any one of claims 1 to 29; an input terminal section; an output terminal portion including the first bus bar; a plurality of power semiconductors that convert a direct current input from the input terminal unit into an alternating current and output the converted alternating current to the output terminal unit; A power module comprising:

31. A substrate; a first current sensor mounted on a first surface of the substrate and having at least one magnetoelectric conversion element that outputs a signal according to the magnitude of a magnetic field; an insulator that at least surrounds the first current sensor with a gap therebetween when viewed from a first direction intersecting the first surface and that at least partially overlaps with the first current sensor when viewed from a second direction along the first surface; a first bus bar disposed with a gap between it and the substrate, through which a current flows that generates a magnetic field detected by the first current sensor; a magnetic flux collector provided at a position facing a surface of the first current sensor opposite to a surface of the first current sensor mounted on the substrate, the magnetic flux collector being spaced apart from the first current sensor in the first direction; Equipped with The current sensor module, wherein the insulator is present between the first current sensor and the first bus bar.

32. A substrate; a first current sensor mounted on a first surface of the substrate and having at least one magnetoelectric conversion element that outputs a signal according to the magnitude of a magnetic field; an insulator that at least surrounds the first current sensor with a gap therebetween when viewed from a first direction intersecting the first surface and that at least partially overlaps with the first current sensor when viewed from a second direction along the first surface; a first bus bar disposed with a gap between it and the substrate, through which a current flows that generates a magnetic field detected by the first current sensor; a second current sensor mounted on the first surface of the substrate and having at least one magnetoelectric conversion element that outputs a signal according to the magnitude of a magnetic field; a second bus bar disposed with a gap between it and the substrate, through which a current flows that generates a magnetic field detected by the second current sensor; a wall portion including a magnetic body protruding from the first surface of the substrate between the first bus bar and the second bus bar; Equipped with the insulator is present between the first current sensor and the first bus bar; A current sensor module in which the insulator further surrounds the second current sensor with a gap when viewed from the first direction, and at least partially overlaps the second current sensor when viewed from the second direction.

Images